Processing system, control device, control method, computer program, and recording medium

Abstract

A processing system according to the present invention comprises: a computation device that reads and executes a computer program stored in a storage device; an output device that can output the result of execution of the program by the computation device; and a processing device that, on the basis of the output from the output device, performs additive processing for fusing a build material to an object and building a built-up article on the object. The computation device generates display control information in which respective setting values are inputted to a plurality of types of condition parameters as processing conditions of the processing device, and in which setting coordinate points corresponding to the setting values are indicated in a multi-dimensional coordinate system with the plurality of types of condition parameters as axes.

Description

Machining system, control device, control method, computer program, and recording medium

[0001] The present invention relates to the technical field of, for example, a processing system including a processing device capable of processing an object, as well as a control device, a control method, a computer program, and a recording medium capable of controlling the processing device.

[0002] An example of a processing system for processing an object is described in Patent Document 1. One of the technical challenges of such a processing system is to appropriately set processing conditions for a processing device.

[0003] US Patent Application Publication No. 2016 / 0311059

[0004] According to a first aspect, there is provided a processing system comprising an arithmetic unit that reads and executes a computer program stored in a storage device, an output device that can output the results of the arithmetic unit executing the computer program, and a processing device that performs additional processing based on the output of the output device, by melting a modeling material into an object and forming a model from the object, wherein the arithmetic unit receives setting values ​​for multiple types of condition parameters as processing conditions for the processing device, and generates display control information that shows setting coordinate points corresponding to the setting values ​​in a multidimensional coordinate system whose axes are the multiple types of condition parameters.

[0005] According to a second aspect, there is provided a control device having an arithmetic unit which receives input of a plurality of setting values ​​which are respectively set for a plurality of types of condition parameters as processing conditions of a processing device, and which reads and executes a computer program stored in a storage device to generate and output display control information which shows setting coordinate points corresponding to the setting values ​​in a multidimensional coordinate system whose axes are the plurality of types of condition parameters.

[0006] According to a third aspect, there is provided a control method for controlling a processing device capable of processing an object, the control method including: acquiring setting values ​​for a plurality of types of condition parameters corresponding to processing conditions of the processing device; and generating display control information indicating setting coordinate points corresponding to the setting values ​​in a multidimensional coordinate system whose axes are the plurality of types of condition parameters.

[0007] According to a fourth aspect, there is provided a computer program that causes a computer that controls a processing device capable of processing an object to acquire setting values ​​for multiple types of condition parameters corresponding to the processing conditions of the processing device, and generates display control information that indicates setting coordinate points corresponding to the setting values ​​in a multidimensional coordinate system whose axes are the multiple types of condition parameters.

[0008] According to a fifth aspect, there is provided a recording medium on which the computer program provided by the fourth aspect is recorded.

[0009] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments.

[0010] FIG. 1 is a cross-sectional view showing the configuration of a processing system of this embodiment. FIG. 2 is a block diagram showing the configuration of the processing system of this embodiment. FIG. 3 is a plan view showing an end face of a material nozzle. FIG. 4 is a cross-sectional view showing the configuration of an irradiation device. FIGS. 5( a) to 5(c) are cross-sectional views showing a process of modeling a three-dimensional structure. FIGS. 6( a) to 6(b) are cross-sectional views showing a process of modeling a structure layer by the first modeling operation. FIGS. 7( a) to 11(d) are cross-sectional views showing a process of modeling a structure layer by the second modeling operation. FIG. 8 is a flowchart showing the flow of a condition display operation. FIG. 9 shows an example of a material selection screen. FIG. 10 shows an example of a condition selection screen. FIG. 11 shows an example of a condition selection screen. FIG. 12 shows an example of a condition display screen. FIG. 13 shows an example of a material property display screen. FIG. 14 shows an example of a condition display screen. FIG. 15 shows an example of a condition display screen. FIG. 16 shows an example of a condition display screen. FIG. 17 shows an example of a condition display screen. FIG. 18 shows an example of a condition display screen. FIG. 19 shows an example of a condition display screen. FIG. 20 shows an example of a condition display screen. FIG. 21 shows an example of a condition display screen. FIG. 22 shows an example of a condition display screen. FIG. 23 shows an example of a condition display screen. FIG. 24 shows an example of a condition display screen. FIG. 25 shows an updated recommended condition range. FIG. 26 shows a coordinate point display screen in a first modified example. FIG. 27 shows a coordinate point display screen in a second modified example. FIGS. 28(a) and 28(b) each show a coordinate point display screen in a third modified example. FIG. 29(a) shows a list display screen in a fourth modified example, and FIG. 29(b) shows a quality display screen in the fourth modified example.

[0011] Hereinafter, a processing system SYS that performs additive processing (additive modeling) based on laser metal deposition (LMD) will be described with reference to the drawings. The additive processing based on laser metal deposition is additive processing that forms a three-dimensional structure ST (modeled object) that is integrated with the workpiece W or that can be separated from the workpiece W by melting a modeling material M supplied to the workpiece W with processing light EL (an energy beam in the form of light).

[0012] In other words, the processing system SYS can be said to be a 3D printer that processes an object using additive manufacturing technology. The additive manufacturing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing. The laser build-up welding (LMD) method may also be called directed energy deposition (DED).

[0013] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For ease of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (predetermined directions within a horizontal plane), and the Z-axis direction is assumed to be vertical (a direction perpendicular to the horizontal plane, essentially the up-down direction). The rotation directions (tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. The XY plane may also be assumed to be horizontal.

[0014] (1) Configuration of the machining system SYS (1-1) Overall configuration of the machining system SYS First, the configuration of the machining system SYS of this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a cross-sectional view that schematically shows the configuration of the machining system SYS of this embodiment. Figure 2 is a block diagram that shows the configuration of the machining system SYS of this embodiment.

[0015] The processing system SYS comprises a stage unit 3 on which a workpiece (object to be processed) W is placed, a processing unit 2 that performs additional processing on the workpiece W, and a control unit 7 (control device) that controls the stage unit 3 and the processing unit 2.

[0016] (1-2) Configuration of Stage Unit 3 The stage unit 3 includes a stage 31 and a stage drive mechanism 32. The stage 31 is disposed in a fabrication space inside the chamber 8 of the processing system SYS, and the workpiece W is placed thereon. For this reason, the stage 31 may be referred to as a mounting device. Specifically, the workpiece W is placed on a stage mounting surface 311, which is one surface of the stage 31 (e.g., the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed thereon. The stage 31 may be capable of holding the workpiece W placed thereon. In this case, the stage 31 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed thereon. In this case, the stage 31 may be clamp-less. Furthermore, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The holder may also be called a jig, a holder, a holding member, a mounting member, or a clamp.

[0017] The machining system SYS according to this embodiment performs additional machining on the workpiece W to form a three-dimensional structure ST (modeled object) integrated with the workpiece W. The workpiece W is an object, i.e., a three-dimensional structure, and may be another three-dimensional structure modeled by the machining system SYS, i.e., an existing model. Furthermore, the three-dimensional structure ST modeled integrally with the workpiece W may be separable from the workpiece W after modeling. In addition, in the machining system SYS according to this embodiment, additional machining is performed on the workpiece W (object, ST) placed on the stage 31, but this is not limiting, and additional machining may be performed on the stage 31 as the workpiece W.

[0018] The workpiece W may be made of a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher, similar to the shaping material M described below, and may be the same as or different from the shaping material M. For example, at least one of a metallic material and a resinous material can be used as the material of the workpiece W. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, other materials different from metallic materials and resinous materials may also be used as the material of the workpiece W.

[0019] The stage driving mechanism 32 is a driving mechanism including a motor and the like that can move the stage 31. When the stage driving mechanism 32 moves the stage 31, the relative positional relationship between the processing head 22 (the condensing optical system 50 provided in the processing head 22) and the stage 31 (the workpiece W placed on the stage 31) changes. Therefore, the stage driving mechanism 32 functions as a position changing device (driving device) that can change the relative positional relationship between the stage 31 and the condensing optical system 50, respectively, and the workpiece W. The stage driving mechanism 32 is capable of moving the stage 31, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction.

[0020] (1-3) Configuration of the processing unit 2 The processing unit 2 includes an irradiation unit 4 that irradiates the workpiece W with processing light EL, a material supply unit 6 that supplies molding material for additional processing on the workpiece W, and a head drive mechanism 23.

[0021] (1-3-1) Configuration of the Material Supply Unit 6 The material supply unit 6 includes a material supply device 61, a gas supply device 62, a mixer 63, and a material nozzle 64. The material supply device 61 is a device capable of supplying a powder modeling material M. The modeling material M is not limited to a powder, and a wire-like modeling material or a gaseous modeling material may also be used. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the modeling material M.

[0022] The gas supply device 62 is a device capable of supplying gas (gas). The mixer 63 is connected to the material supply device 61 and the gas supply device 62 and mixes the powdered modeling material M supplied from the material supply device 61 with the gas supplied from the gas supply device 62. That is, the gas supply device 62 supplies a conveying gas (pressurized gas) for conveying the powdered modeling material M supplied from the material supply device 61 and mixed in the mixer 63. The conveying gas may be, for example, a purge gas made of an inert gas such as nitrogen or argon, injected to replace the gas in the chamber 8. The gas supply device 62 may be a cylinder containing an inert gas. If the inert gas is nitrogen gas, the gas supply device 62 may be a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material. However, the conveying gas may be gas supplied from a gas supply device other than the gas supply device 62.

[0023] The material nozzle 64 is disposed in the modeling space inside the chamber 8 of the processing system SYS and is capable of supplying the modeling material M. More specifically, the material nozzle 64 is connected to the mixer 63 and ejects (sprays, ejects, or sprays) the modeling material M transported by the pressurized gas onto the workpiece W. In other words, the material nozzle 64 supplies the modeling material M together with the transport gas. For this reason, the material nozzle 64 may also be referred to as a material supply member or a supply device (material supply device).

[0024] The material nozzle 64 has a material supply port 641 formed therein. For example, as shown in FIG. 3 , which is a plan view showing the end face 640 of the material nozzle 64, the end face 640 of the material nozzle 64 may have an annular material supply port 641 formed therein. In the example shown in FIG. 3 , the shape of the outer edge of the material supply port 641 in a plane intersecting the Z axis is circular, but it may have a shape other than circular. For example, the shape of the outer edge of the material supply port 641 in a plane intersecting the Z axis may be elliptical or polygonal. In the example shown in FIG. 3 , the end face 640 of the material nozzle 64 has a material supply port 641 that is a continuous opening in an annular or ring-shaped configuration. However, the end face 640 of the material nozzle 64 may have a plurality of material supply ports 641 that are circular, elliptical, rectangular, or other annular openings, or arc-shaped openings.

[0025] (1-3-2) Configuration of Irradiation Unit 4 The irradiation unit 4 includes a light source unit 40 and an irradiation device 21. The light source unit 40 includes two light sources 49, which are energy beam sources. The light source 49 is an energy beam source that emits, for example, at least one of infrared light, visible light, and ultraviolet light as processing light EL. However, other types of light may be used as processing light EL. The processing light EL may include multiple pulsed lights (multiple pulse beams). The processing light EL may be laser light. In this case, the light source 49 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). Examples of laser light sources include fiber lasers, CO ２At least one of a laser, a YAG laser, an excimer laser, etc. may be used. However, the processing light EL does not have to be laser light. The light source 49 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0026] The characteristics of the processing light EL#1 emitted by light source 49#1 and the characteristics of the processing light EL#2 emitted by light source 49#2 may be the same. For example, the wavelength of processing light EL#1 (typically, the peak wavelength, which is the wavelength at which the intensity is greatest in the wavelength band of processing light EL#1) and the wavelength of processing light EL#2 (typically, the peak wavelength) may be the same. For example, the wavelength band of processing light EL#1 (typically, the range of wavelengths at which the intensity is equal to or greater than a certain value) and the wavelength band of processing light EL#2 may be the same. For example, the intensity of processing light EL#1 and the intensity of processing light EL#2 may be the same. For example, the absorptivity of the workpiece W for processing light EL#1 (or the object whose surface MS is the surface, the same applies below) may be the same as the absorptivity of the workpiece W for processing light EL#2. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 and the peak wavelength of processing light EL#2 may be the same. Alternatively, the characteristics of the processing light EL#1 emitted by light source 49#1 may be different from the characteristics of the processing light EL#2 emitted by light source 49#2. For example, the wavelength (typically, peak wavelength) of processing light EL#1 may be different from the wavelength (typically, peak wavelength) of processing light EL#2. For example, the wavelength band of processing light EL#1 may be different from the wavelength band of processing light EL#2. For example, the intensity of processing light EL#1 may be different from the intensity of processing light EL#2. For example, the absorptivity of the workpiece W for processing light EL#1 may be different from the absorptivity of the workpiece W for processing light EL#2. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 may be different from the absorptivity of the workpiece W for the peak wavelength of processing light EL#2.

[0027] In the present embodiment, the processing system SYS (light source unit 40) is described as having a plurality of light sources 49#1 and 42#2. However, the present invention is not limited to this. The processing system SYS (light source unit 40) may have two or more light sources, or may have a single light source. For example, when a single light source 49#1 that emits (supplies) light of a wide wavelength band or multiple wavelengths is used, the emitted light may be wavelength-divided to generate processing light EL#1 and processing light EL#2 of different wavelengths, or the emitted light may be amplitude-divided or polarization-divided.

[0028] The irradiation device 21 is a device for emitting processing light EL. To emit the processing light EL, the irradiation device 21 includes an irradiation optical system 41 and a focusing optical system 50. The irradiation optical system 41 is an optical system for emitting the processing light EL. Specifically, the irradiation optical system 41 is optically connected to a light source 49 that emits (generates) the processing light EL via an optical transmission member such as an optical fiber or a light pipe.

[0029] The processing system SYS, and thus the light source unit 40, has two light sources 49#1 and 42#2, which are optically connected via optical transmission members so that the light sources 49#1 and 42#2 are incident on the irradiation device 21, and thus the irradiation optical system 41. In the following description, when there is no need to distinguish between the "processed light EL#1" generated by the light source 49#1 and the "processed light EL#2" generated by the light source 49#2, they will be referred to as "processed light EL."

[0030] <1> Configuration of the Irradiation Device 21 Next, the configuration of the irradiation device 21 will be described with reference to Fig. 4. Fig. 4 is a diagram showing the configuration of the irradiation device 21.

[0031] The irradiation device 21 includes a focusing optical system 50 that focuses light and irradiates the workpiece W (printing surface MS), and an irradiation optical system 41 that causes processing light EL#1 incident from light source 49#1 and processing light EL#2 incident from light source 49#2 to enter the focusing optical system 50. The irradiation optical system 41 includes a first optical system 41#1 onto which processing light EL#1 emitted from light source 49#1 is incident, and a second optical system 41#2 onto which processing light EL#2 emitted from light source 49#2 is incident. Below, the first optical system 41#1 and the second optical system 41#2 will be described in order.

[0032] <2> Configuration of the First Optical System 41#1 The first optical system 41#1 includes a collimator lens 42#1, a beam splitter 43#1, a power meter 47#1, and a galvanometer scanner 44#1.

[0033] The processing light EL#1 emitted from the light source 49#1 is incident on the collimator lens 42#1. The collimator lens 42#1 converts the processing light EL#1 incident on the collimator lens 42#1 into parallel light. The processing light EL#1 converted into parallel light by the collimator lens 42#1 is incident on the beam splitter 43#1. In this embodiment, the beam splitter 43#1 uses a parallel plane substrate made of a light-transmitting material such as glass. The beam splitter 43#1 is disposed obliquely with respect to the optical path of the processing light EL#1 incident on the beam splitter 43#1. A portion of the processing light EL#1 incident on the beam splitter 43#1 passes through the beam splitter 43#1. The other portion of the processing light EL#1 incident on the beam splitter 43#1 is reflected by the beam splitter 43#1. In this way, the beam splitter 43#1 may be any device that can branch the incident processing light EL#1, and may be a plane-parallel substrate or a prism that reflects part of the incident processing light EL#1 and transmits part of it.

[0034] The power meter 47#1 is a device capable of detecting the intensity of the processing light EL#1 incident on the power meter 47#1. The processing light EL#1 reflected by the beam splitter 43#1 is incident on the power meter 47#1. Therefore, the power meter 47#1 detects the intensity of the processing light EL#1 reflected by the beam splitter 43#1. Because the beam splitter 43#1 is disposed on the optical path of the processing light EL#1 between the light source 49#1 and the galvanometer scanner 44#1, the power meter 47#1 detects the intensity of the processing light EL#1 traveling along the optical path between the light source 49#1 and the galvanometer scanner 44#1. In this case, the power meter 47#1 can stably detect the intensity of the processing light EL#1 without being affected by the deflection of the processing light EL#1 by the galvanometer scanner 44#1. However, the location of the power meter 47#1 is not limited to the example shown in FIG. 4 . For example, the power meter 47#1 may detect the intensity of the processing light EL#1 traveling along the optical path between the galvanometer scanner 44#1 and the printing surface MS. The power meter 47#1 may detect the intensity of the processing light EL#1 traveling along the optical path within the galvanometer scanner 44#1. The detection result of the power meter 47#1 is output to the control unit 7, which will be described later.

[0035] The power meter 47#1 may include, for example, a light-receiving element that detects the processing light EL#1 as light. Alternatively, the higher the intensity of the processing light EL#1, the greater the amount of energy generated by the processing light EL#1. As a result, the amount of heat generated by the processing light EL#1 increases. Therefore, the power meter 47#1 may detect the intensity of the processing light EL#1 by detecting the processing light EL#1 as heat. In this case, the power meter 47#1 may include a heat-detecting element that detects the heat of the processing light EL#1.

[0036] On the other hand, the processing light EL#1 that passes through the beam splitter 43#1 is incident on the galvanometer scanner 44#1. The galvanometer scanner 44#1 includes a focus control optical system 45#1 and a galvanometer mirror 46#1. Specifically, the processing light EL#1 that passes through the beam splitter 43#1 is incident on the focus control optical system 45#1.

[0037] The focus control optical system 45#1 is an optical element that can change the focus position CP of the processing light EL#1 (hereinafter referred to as "focus position CP#1"). In this embodiment, the focus position CP#1 of the processing light EL#1 may refer to the focus position where the processing light EL#1 is focused. The focus position CP#1 of the processing light EL#1 may refer to the convergence position where the processing light EL#1 is most convergent in the irradiation direction (travel direction) of the processing light EL#1.

[0038] Specifically, the focus control optical system 45#1 can change the focus position CP#1 of the processing light EL#1 along the irradiation direction of the processing light EL#1 emitted from the irradiation device 21. In the example shown in FIG. 4, the irradiation direction of the processing light EL#1 emitted from the irradiation device 21 is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 45#1 can change the focus position CP#1 of the processing light EL#1 along the Z-axis direction. Furthermore, because the irradiation device 21 irradiates the processing light EL onto the printing surface MS from above the workpiece W, the irradiation direction of the processing light EL#1 is a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). Therefore, the focus control optical system 45#1 can change the focus position CP#1 of the processing light EL#1 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 45#1 can change the focus position CP#1 of the processing light EL#1 along the direction of the optical axis AX of the irradiation device 21 (more specifically, the focusing optical system 50 described later).

[0039] The focus control optical system 45#1 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL#1. That is, the focus control optical system 45#1 may include, for example, multiple refractive optical elements aligned along the irradiation direction of the processing light EL#1. In this case, the focus control optical system 45#1 may change the focus position CP#1 of the processing light EL#1 by moving at least one of the multiple optical elements (refractive optical elements) along its optical axis direction. However, the focus control optical system 45#1 may also include a reflective optical element such as a mirror, and the focus position CP#1 of the processing light EL#1 may be changed by moving the reflective optical element.

[0040] When the focus control optical system 45#1 changes the focus position CP#1 of the processing light EL#1, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS changes. In particular, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction (Z-axis direction) of the processing light EL#1 changes. Therefore, by changing the focus position CP#1 of the processing light EL#1, the focus control optical system 45#1 changes the positional relationship (positional relationship in the Z-axis direction) between the focus position CP#1 of the processing light EL#1 and the printing surface MS. By changing the focus position CP#1 of the processing light EL#1, the focus control optical system 45#1 changes the distance (distance in the Z-axis direction) between the focus position CP#1 of the processing light EL#1 and the printing surface MS.

[0041] As described above, the galvanometer scanner 44#1 does not necessarily have to include the focus control optical system 45#1. Even in this case, if the positional relationship between the irradiation optical system 41 and the printing surface MS in the irradiation direction of the processing light EL#1 changes, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 changes. Therefore, even if the galvanometer scanner 44#1 does not include the focus control optical system 45#1, the processing system SYS can change the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1. For example, the processing system SYS may use the stage drive mechanism 32 or the head drive mechanism 23 (described later) to change the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1.

[0042] The processing light EL#1 emitted from the focus control optical system 45#1 is incident on the galvanometer mirror 46#1. The galvanometer mirror 46#1 deflects the processing light EL#1 to change the emission direction of the processing light EL#1 emitted from the galvanometer mirror 46#1. For this reason, the galvanometer mirror 46#1 may also be referred to as a deflection optical system.

[0043] The galvanometer mirror 46#1 includes, for example, an X-scan mirror 46MX#1, an X-scan motor 46AX#1, a Y-scan mirror 46MY#1, and a Y-scan motor 46AY#1. The processing light EL#1 emitted from the focus control optical system 45#1 is incident on the X-scan mirror 46MX#1. The X-scan mirror 46MX#1 reflects the processing light EL#1 incident on the X-scan mirror 46MX#1 toward the Y-scan mirror 46MY#1. The Y-scan mirror 46MY#1 reflects the processing light EL#1 incident on the Y-scan mirror 46MY#1 toward the deflection optical system 216. Note that each of the X-scan mirror 46MX#1 and the Y-scan mirror 46MY#1 may be referred to as a galvanometer mirror.

[0044] The X-scan motor 46AX#1 can swing or rotate the X-scan mirror 46MX#1 around a rotation axis along the Y-axis. In other words, the angle of the X-scan mirror 46MX#1 can be changed by the X-scan motor 46AX#1 relative to the optical path of the processing light EL#1 incident on the X-scan mirror 46MX#1, thereby changing the deflection angle of the processing light EL#1. For this reason, the X-scan mirror 46MX#1 may also be referred to as a deflection member. In this case, the swing or rotation of the X-scan mirror 46MX#1 allows the processing light EL#1 to scan the printing surface MS in a direction perpendicular to the Y-axis (the X-axis direction).

[0045] The Y-scan motor 46AY#1 can swing or rotate the Y-scan mirror 46MY#1 around a rotation axis along the X-axis. In other words, the angle of the Y-scan mirror 46MY#1 can be changed relative to the optical path of the processing light EL#1 incident on the Y-scan mirror 46MY#1, thereby changing the deflection angle of the processing light EL#1. For this reason, the Y-scan mirror 46MY#1 may also be referred to as a deflecting member. In this case, the swing or rotation of the Y-scan mirror 46MY#1 allows the processing light EL#1 to scan the printing surface MS in a direction perpendicular to the X-axis (the Y-axis direction).

[0046] The area on the printing surface MS over which the galvanometer mirror 46#1 can move the irradiation area EA#1 while the positional relationship between the irradiation device 21 and the printing surface MS is fixed (without changing) is referred to as the processing unit area PUA#1. In other words, the processing unit area PUA#1 indicates the area (range) over which additional processing can be performed by the processing head 22 scanning the processing light EL#1 and moving the irradiation area EA#1 while the positional relationship between the irradiation device 21 and the printing surface MS is fixed. In other words, the processing unit area PUA#1 is the maximum area over which the galvanometer mirror 46#1 can move the irradiation area EA#1 on the printing surface MS while the positional relationship between the irradiation device 21 and the printing surface MS is fixed. The processing unit area PUA#1 is a virtual area on the printing surface MS located at a position determined based on the processing head 22 (irradiation device 21).

[0047] <3> Configuration of the second optical system 41#2 The second optical system 41#2 has the same configuration as the first optical system 41#1 described above. The second optical system 41#2 includes a collimator lens 42#2, a beam splitter 43#2, a power meter 47#2, and a galvanometer scanner 44#2.

[0048] The processing light EL#2 emitted from the light source 49#2 is incident on the collimator lens 42#2. The collimator lens 42#2 converts the processing light EL#2 incident on the collimator lens 42#2 into parallel light. The processing light EL#2 converted into parallel light by the collimator lens 42#2 is incident on the beam splitter 43#2. In this embodiment, the beam splitter 43#2 uses a parallel plane substrate made of a light-transmitting material such as glass. The beam splitter 43#2 is disposed obliquely with respect to the optical path of the processing light EL#2 incident on the beam splitter 43#2. A portion of the processing light EL#2 incident on the beam splitter 43#2 passes through the beam splitter 43#2. The other portion of the processing light EL#2 incident on the beam splitter 43#2 is reflected by the beam splitter 43#2. In this way, the beam splitter 43#2 may be any device that can branch the incident processing light EL#2, and may be a plane-parallel substrate or a prism that reflects part of the incident processing light EL#2 and transmits part of it.

[0049] The power meter 47#2 is a device capable of detecting the intensity of the processing light EL#2 incident on the power meter 47#2. The processing light EL#2 reflected by the beam splitter 43#2 is incident on the power meter 47#2. Therefore, the power meter 47#2 detects the intensity of the processing light EL#2 reflected by the beam splitter 43#2. Because the beam splitter 43#2 is disposed on the optical path of the processing light EL#2 between the light source 49#2 and the galvanometer scanner 44#2, the power meter 47#2 detects the intensity of the processing light EL#2 traveling along the optical path between the light source 49#2 and the galvanometer scanner 44#2. In this case, the power meter 47#2 can stably detect the intensity of the processing light EL#2 without being affected by the deflection of the processing light EL#2 by the galvanometer scanner 44#2. However, the location of the power meter 47#2 is not limited to the example shown in FIG. 4 . For example, the power meter 47#2 may detect the intensity of the processing light EL#2 traveling along the optical path between the galvanometer scanner 44#2 and the printing surface MS. The power meter 47#2 may detect the intensity of the processing light EL#2 traveling along the optical path within the galvanometer scanner 44#2. The detection result of the power meter 47#2 is output to the control unit 7, which will be described later.

[0050] The power meter 47#2 may include, for example, a light-receiving element that detects the processing light EL#2 as light. Alternatively, the higher the intensity of the processing light EL#2, the greater the amount of energy generated by the processing light EL#2. As a result, the amount of heat generated by the processing light EL#2 increases. Therefore, the power meter 47#2 may detect the intensity of the processing light EL#2 by detecting the processing light EL#2 as heat. In this case, the power meter 47#2 may include a heat-detecting element that detects the heat of the processing light EL#2.

[0051] On the other hand, the processing light EL#2 that passes through the beam splitter 43#2 is incident on the galvanometer scanner 44#2. The galvanometer scanner 44#2 includes a focus control optical system 45#2 and a galvanometer mirror 46#2. Specifically, the processing light EL#2 that passes through the beam splitter 43#2 is incident on the focus control optical system 45#2.

[0052] The focus control optical system 45#2 is an optical element that can change the focus position CP of the processing light EL#2 (hereinafter referred to as "focus position CP#2"). In this embodiment, the focus position CP#2 of the processing light EL#2 may refer to the focus position where the processing light EL#2 is focused. The focus position CP#2 of the processing light EL#2 may refer to the convergence position where the processing light EL#2 is most convergent in the irradiation direction (travel direction) of the processing light EL#2.

[0053] Specifically, the focus control optical system 45#2 can change the focus position CP#2 of the processing light EL#2 along the irradiation direction of the processing light EL#2 emitted from the irradiation device 21. In the example shown in FIG. 4, the irradiation direction of the processing light EL#2 emitted from the irradiation device 21 is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 45#2 can change the focus position CP#2 of the processing light EL#2 along the Z-axis direction. Furthermore, because the irradiation device 21 irradiates the processing light EL onto the printing surface MS from above the workpiece W, the irradiation direction of the processing light EL#2 is a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). Therefore, the focus control optical system 45#2 can change the focus position CP#2 of the processing light EL#2 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 45#2 can change the focus position CP#2 of the processing light EL#2 along the direction of the optical axis AX of the irradiation device 21 (more specifically, the focusing optical system 50 described later).

[0054] The focus control optical system 45#2 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL#2. That is, the focus control optical system 45#2 may include, for example, multiple refractive optical elements aligned along the irradiation direction of the processing light EL#2. In this case, the focus control optical system 45#2 may change the focus position CP#2 of the processing light EL#2 by moving at least one of the multiple optical elements (refractive optical elements) along its optical axis direction. However, the focus control optical system 45#2 may also include a reflective optical element such as a mirror, and the focus position CP#2 of the processing light EL#2 may be changed by moving the reflective optical element.

[0055] When the focus control optical system 45#2 changes the focus position CP#2 of the processing light EL#2, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS changes. In particular, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction (Z-axis direction) of the processing light EL#2 changes. Therefore, by changing the focus position CP#2 of the processing light EL#2, the focus control optical system 45#2 changes the positional relationship (positional relationship in the Z-axis direction) between the focus position CP#2 of the processing light EL#2 and the printing surface MS. By changing the focus position CP#2 of the processing light EL#2, the focus control optical system 45#2 changes the distance (distance in the Z-axis direction) between the focus position CP#2 of the processing light EL#2 and the printing surface MS.

[0056] As described above, the galvanometer scanner 44#2 does not necessarily have to include the focus control optical system 45#2. Even in this case, if the positional relationship between the irradiation optical system 41 and the printing surface MS in the irradiation direction of the processing light EL#2 changes, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 changes. Therefore, even if the galvanometer scanner 44#2 does not include the focus control optical system 45#2, the processing system SYS can change the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2. For example, the processing system SYS may use the stage drive mechanism 32 or the head drive mechanism 23 (described later) to change the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2.

[0057] The processing light EL#2 emitted from the focus control optical system 45#2 is incident on the galvanometer mirror 46#2. The galvanometer mirror 46#2 deflects the processing light EL#2 to change the emission direction of the processing light EL#2 emitted from the galvanometer mirror 46#2. For this reason, the galvanometer mirror 46#2 may also be referred to as a deflection optical system.

[0058] The galvanometer mirror 46#2 includes, for example, an X-scan mirror 46MX#2, an X-scan motor 46AX#2, a Y-scan mirror 46MY#2, and a Y-scan motor 46AY#2. The processing light EL#2 emitted from the focus control optical system 45#2 is incident on the X-scan mirror 46MX#2. The X-scan mirror 46MX#2 reflects the processing light EL#2 incident on the X-scan mirror 46MX#2 toward the Y-scan mirror 46MY#2. The Y-scan mirror 46MY#2 reflects the processing light EL#2 incident on the Y-scan mirror 46MY#2 toward the deflection optical system 216. Note that each of the X-scan mirror 46MX#2 and the Y-scan mirror 46MY#2 may be referred to as a galvanometer mirror.

[0059] The X-scan motor 46AX#2 can swing or rotate the X-scan mirror 46MX#2 around a rotation axis along the Y-axis. In other words, the angle of the X-scan mirror 46MX#2 can be changed by the X-scan motor 46AX#2 relative to the optical path of the processing light EL#2 incident on the X-scan mirror 46MX#2, thereby changing the deflection angle of the processing light EL#2. For this reason, the X-scan mirror 46MX#2 may also be referred to as a deflection member. In this case, the swing or rotation of the X-scan mirror 46MX#2 allows the processing light EL#2 to scan the printing surface MS in a direction perpendicular to the Y-axis (the X-axis direction).

[0060] The Y-scan motor 46AY#2 can swing or rotate the Y-scan mirror 46MY#2 around a rotation axis along the X-axis. In other words, the angle of the Y-scan mirror 46MY#2 can be changed relative to the optical path of the processing light EL#2 incident on the Y-scan mirror 46MY#2, thereby changing the deflection angle of the processing light EL#2. For this reason, the Y-scan mirror 46MY#2 may also be referred to as a deflecting member. In this case, the swing or rotation of the Y-scan mirror 46MY#2 allows the processing light EL#2 to scan the printing surface MS in a direction perpendicular to the X-axis (the Y-axis direction).

[0061] The area on the printing surface MS over which the galvanometer mirror 46#2 can move the irradiation area EA#2 while the positional relationship between the irradiation device 21 and the printing surface MS is fixed (without changing) is referred to as the processing unit area PUA#2. In other words, the processing unit area PUA#2 indicates the area (range) over which additional processing can be performed by the processing head 22 scanning the processing light EL#2 and moving the irradiation area EA#2 while the positional relationship between the irradiation device 21 and the printing surface MS is fixed. In other words, the processing unit area PUA#2 is the maximum area over which the galvanometer mirror 46#2 can move the irradiation area EA#2 on the printing surface MS while the positional relationship between the irradiation device 21 and the printing surface MS is fixed. The processing unit area PUA#2 is a virtual area on the printing surface MS located at a position determined based on the processing head 22 (irradiation device 21).

[0062] <4> Configuration of the focusing optical system 50 The focusing optical system 50 includes a prism mirror 51 and an fθ lens 52. In other words, the prism mirror 51 and the fθ lens 52 are integrated as the focusing optical system 50 (deflection optical system) so that their relative positions do not change. The processing light EL#1 emitted from the first optical system 41#1 and the processing light EL#2 emitted from the second optical system 41#2 are each incident on the prism mirror 51. The prism mirror 51 reflects each of the processing light EL#1 and EL#2 toward the fθ lens 52. The prism mirror 51 reflects the processing light EL#1 and EL#2, which are incident on the prism mirror 51 from different directions, toward approximately the same direction (the fθ lens 52).

[0063] The fθ lens 52 is an optical system for emitting each of the processing lights EL#1 and EL#2 reflected by the prism mirror 51 toward the printing surface MS. In other words, the fθ lens 52 is an optical system for irradiating each of the processing lights EL#1 and EL#2 reflected by the prism mirror 51 onto the printing surface MS. As a result, the processing lights EL#1 and EL#2 that have passed through the fθ lens 52 are irradiated onto the printing surface MS.

[0064] The fθ lens 52 may be an optical element capable of focusing each of the processing lights EL#1 and EL#2 on a focusing surface. In this case, the fθ lens 52 may be referred to as a focusing optical system. The focusing surface of the fθ lens 52 may be set, for example, on the printing surface MS. In this case, the focusing optical system 50 includes a focusing optical system whose projection characteristic is fθ. However, the focusing optical system 50 may also include a focusing optical system whose projection characteristic is different from fθ. For example, the focusing optical system 50 may include a focusing optical system whose projection characteristic is f tan θ. For example, the focusing optical system 50 may include a focusing optical system whose projection characteristic is f sin θ.

[0065] The optical axis AX of the fθ lens 52 is an axis along the Z-axis. Therefore, the fθ lens 52 emits each of the processing lights EL#1 and EL#2 approximately along the Z-axis direction. In this case, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be the Z-axis direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be directions along the optical axis AX of the fθ lens 52. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 do not have to be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be mutually different directions.

[0066] (1-4) Configuration of head unit 20 As shown in FIG. 2, the head unit 20 includes a processing head 22 having the focusing optical system 50 of the irradiation unit 4 and the material nozzle 64 of the material supply unit 6, and a head drive mechanism 23 that enables the processing head 22 to move within the forming space inside the chamber 8 of the processing system SYS.

[0067] In the processing head 22, the condensing optical system 50 and the material nozzle 64 are positioned integrally or at least within a predetermined distance range. Therefore, the processing head 22 is capable of supplying the modeling material M through the material nozzle 64 to the position irradiated with the processing light EL by the condensing optical system 50.

[0068] The head driving mechanism 23 is capable of moving the machining head 22, i.e., the irradiation optical system 41 and the material nozzle 64, under the control of the control unit 7, which will be described later. When the head driving mechanism 23 moves the machining head 22, the relative positional relationship between the machining head 22 (the condensing optical system 50 provided in the machining head 22) and the stage 31 (the workpiece W placed on the stage 31) changes, just as when the stage driving mechanism 32 moves the stage 31. Therefore, the head driving mechanism 23 functions as a position changing device (driving device) that can change the relative positional relationship between the condensing optical system 50 and each of the stage 31 and the workpiece W. The head driving mechanism 23 is capable of moving the machining head 22, for example, along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction.

[0069] (1-5) Configuration of Control Unit 7 The control unit 7 controls the operation of the machining system SYS. For example, the control unit 7 may control the machining unit 2 (e.g., at least one of the machining head 22 and the head driving mechanism 23) included in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the stage unit 3 (e.g., the stage driving mechanism 32) included in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the material supply device 61 included in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the light source 49 included in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the gas supply device 62 included in the machining system SYS to perform additional machining on the workpiece W.

[0070] The control unit 7 may control the emission mode of the processing light EL by the irradiation optical system 41. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. If the processing light EL includes multiple pulsed lights, the emission mode may include, for example, at least one of the emission duration of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission duration of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control unit 7 may control the movement mode of the processing head 22 by the head driving mechanism 23. The control unit 7 may control the movement mode of the stage 31 by the stage driving mechanism 32. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control unit 7 may control the supply mode of the modeling material M by the material nozzle 64. The supply mode may include, for example, at least one of the supply amount (supply amount per unit time) and supply timing (supply time).

[0071] For example, the detection results of the power meters 47#1 and 47#2 (detection results of the intensities of the processing beams EL#1 and EL#2) may be input to the control unit 7, and the control unit 7 may control (change) the intensities of the processing beams EL#1 and EL#2 based on the detection results of the power meters 47#1 and 47#2. More specifically, the control unit 7 may control the intensities of the processing beams EL#1 and EL#2 so that the intensities of the processing beams EL#1 and EL#2 at the printing surface MS are desired intensities. Alternatively, the control unit 7 may control the intensities of the processing beams EL#1 and EL#2 so that the intensities of the processing beams EL#1 and EL#2 at a virtual material supply plane PL between the printing surface MS and the material nozzle 64 are desired intensities. To control the intensities of the processing beams EL#1 and EL#2, the control unit 7 may, for example, control the light sources 49#1 and 49#2 based on the detection results of the power meters 47#1 and 47#2 to change the intensity of the processing beam EL#1 emitted from the light source 49#1 and the intensity of the processing beam EL#2 emitted from the light source 49#2. This allows the processing system SYS to appropriately form a model on the printing surface MS by irradiating the printing surface MS with processing beams EL#1 and EL#2 having appropriate intensities.

[0072] 2 , the control unit 7 includes a calculation device 71 and a storage device 72. The control unit 7 may further include an output device 73, an input device 74, and a display device 75. However, this is not limiting, and the output device 73, input device 74, and display device 75 may be externally connected to the control unit 7. The calculation device 71, storage device 72, output device 73, input device 74, and display device 75 may be connected to one another via a data bus 36.

[0073] The arithmetic device 71 is hardware that includes at least a circuit (for example, at least one of a logic circuit, an electronic circuit, and an electric circuit). For this reason, the arithmetic device 71 may be referred to as a group of circuits.

[0074] The arithmetic device 71 includes at least one processor (one processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. The processor conforming to the von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. The processor conforming to the non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Circuit). The processor may be realized by a group of circuits (for example, at least one of an electronic circuit and an electric circuit).

[0075] The arithmetic device 71 reads a computer program 721 including at least one of computer program code and computer program instructions. For example, the arithmetic device 71 may read the computer program 721 stored in the storage device 72. For example, the arithmetic device 71 may read the computer program 721 stored in a computer-readable, non-transitory storage medium using a storage medium reading device (not shown) included in the control unit 7. The computer program 721 read from the storage medium may be stored in the storage device 72. The arithmetic device 71 may obtain (download or read) the computer program 721 from a device (not shown) located outside the control unit 7 via a communication device. The downloaded computer program 721 may be stored in the storage device 72.

[0076] The arithmetic device 71 executes the loaded computer program 721. As a result, logical functional blocks for executing processing to be performed by the control unit 7 (e.g., processing for controlling the operation of the machining system SYS) are realized within the arithmetic device 71. In other words, the arithmetic device 71, together with the storage device 72 or the like in which the computer program 721 is recorded (together with the storage device 72 and the computer program 721 recorded in the storage device 72 or the like), can function as a controller or a computer for realizing the logical functional blocks for executing processing to be performed by the control unit 7. In other words, the at least one processor included in the arithmetic device 71, the memory (recording medium) included in the storage device 72 or the like, and the computer program 721 are configured to cause the control unit 7 to perform processing to be performed by the control unit 7 (e.g., processing for controlling the operation of the machining system SYS).

[0077] The arithmetic device 71 may include a single processor. In this case, the arithmetic device 71 may perform the following operations (e.g., processing for controlling the operation of the machining system SYS) using the single processor. For example, if the arithmetic device 71 performs a first operation (e.g., a first processing for controlling the operation of the machining system SYS) and a second operation (e.g., a second processing for controlling the operation of the machining system SYS), the arithmetic device 71 may perform both the first and second operations using a single processor. Alternatively, the arithmetic device 71 may include multiple processors. In this case, the arithmetic device 71 may perform each of the following operations using any one of the multiple processors. For example, if the arithmetic device 71 includes first and second processors and performs the first and second operations, the arithmetic device 71 may perform each of the first and second operations using any one of the first and second processors. For example, the computing device 71 may perform a first operation using a first processor, may perform a second operation using the first processor, may perform the first operation using a second processor, or may perform the second operation using the second processor.

[0078] The arithmetic device 71 may generate a control signal for controlling the operation of the machining system SYS as a result of executing the computer program 721 using logical functional blocks realized within the arithmetic device 71. The arithmetic device 71 may output the generated control signal to at least one of the material supply device 61, the machining unit 2, the stage unit 3, the light source 49, and the gas supply device 62 via the output device 73 described below. At least one of the material supply device 61, the machining unit 2, the stage unit 3, the light source 49, and the gas supply device 62 may operate based on the control signal output (generated) by the arithmetic device 71. In other words, the machining system SYS may machine the workpiece W based on the control signal output (generated) by the arithmetic device 71.

[0079] A computational model that can be constructed by machine learning may be implemented in the computational device 71 by the computational device 71 executing the computer program 721. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The computational device 71 may control the operation of the machining system SYS using the computational model. In other words, the operation of controlling the operation of the machining system SYS may include the operation of controlling the operation of the machining system SYS using the computational model. Note that a computational model that has been constructed by offline machine learning using training data may be implemented in the computational device 71. Furthermore, the computational model implemented in the computational device 71 may be updated by online machine learning on the computational device 71. Alternatively, the calculation device 71 may control the operation of the machining system SYS using a calculation model implemented in a device external to the calculation device 71 (a device provided outside the control unit 7) in addition to or instead of the calculation model implemented in the calculation device 71.

[0080] The recording medium for recording the computer program 721 executed by the arithmetic device 71 may be at least one of a CD-ROM, CD-R, CD-RW, flexible disk, MO, optical disk such as DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), a magnetic medium such as magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may include a device capable of recording the computer program 721 (for example, a general-purpose device or a dedicated device in which the computer program 721 is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program 721 may be realized by a logical processing block realized within the arithmetic device 71 when the arithmetic device 71 (processor) executes the computer program 721, or may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit)) provided in the arithmetic device 71, or may be realized in a form that mixes logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0081] The storage device 72 includes at least one memory capable of storing desired data. In other words, the storage device 72 includes at least one memory containing desired data. The memory may be realized by a group of circuits (e.g., at least one of electronic circuits and electric circuits). For example, the storage device 72 may store a computer program 721 executed by the arithmetic device 71. In this case, the storage device 72 (memory) may be used as the above-mentioned recording medium for recording the computer program 721 executed by the arithmetic device 71. The storage device 72 may temporarily store data used by the arithmetic device 71 when the arithmetic device 71 is executing the computer program 721. The storage device 72 may store data that the control unit 7 stores long-term. The storage device 72 may include at least one of a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and a disk array device. That is, the storage device 72 may include a non-transitory recording medium.

[0082] The output device 73 is a device that outputs arbitrary information to the outside of the control unit 7. For example, the output device 73 may output a signal indicating arbitrary information (e.g., the above-mentioned control signal) via a data bus connecting the control unit 7 and a device external to the control unit 7 (e.g., at least one of the material supply device 61, the processing unit 2, the stage unit 3, the light source 49, and the gas supply device 62). For example, the output device 73 may output a signal as arbitrary information via a communication network connecting the control unit 7 and a device external to the control unit 7 (e.g., at least one of the material supply device 61, the processing unit 2, the stage unit 3, the light source 49, and the gas supply device 62). In this case, the output device 73 includes a communication device.

[0083] The output device 73 may output any information to the outside of the control unit 7 using a medium other than a signal. For example, the output device 73 may output information as sound. In this case, the output device 73 includes an audio device (a so-called speaker) capable of outputting sound. For example, the output device 73 may output information on paper. In this case, the output device 73 includes a printing device (a so-called printer) capable of printing desired information on paper.

[0084] The input device 74 is a device that accepts information input to the control unit 7 from outside the control unit 7. For example, the input device 74 may include an operation device (e.g., at least one of a keyboard, a mouse, and a touch panel) that can be operated by a user of the control unit 7. In this case, the input device 74 functions as a device that allows the user to input information. For example, the input device 74 may include a recording medium reading device that can read information recorded as data on a recording medium that can be externally attached to the control unit 7.

[0085] The information input to the input device 74 may be input to the arithmetic device 71. That is, the arithmetic device 71 may acquire the information input to the input device 74. The arithmetic device 71 may control the operation of the machining system SYS based on the information input to the input device 74. For example, the arithmetic device 71 may generate a control signal for controlling the operation of the machining system SYS based on the information input to the input device 74.

[0086] As described above, when the output device 73 includes a communication device, the communication device included in the output device 73 may acquire (receive) information via the data bus or communication network in addition to or instead of outputting (transmitting) information via the data bus or communication network. In this case, the communication device included in the output device 73 may be able to function as an input device to which information is input via the data bus or communication network.

[0087] The display device 75 is a display capable of displaying an image. The display device 75 may display the image under the control of the arithmetic device 71. In this case, the arithmetic device 71 may generate display control information for controlling the display device 75 to display a desired image. The arithmetic device 71 may output the generated display control information to the display device 75 via the data bus 76. The display device 75 may receive the display control information generated by the arithmetic device 71 via the data bus 76. The display device 75 may display the desired image based on the display control information generated by the arithmetic device 71. In this way, the arithmetic device 71 may control the display device 75 to display the desired image by outputting the generated display control information to the display device 75.

[0088] (2) Modeling Operation Performed by the Machining System SYS Next, the operation performed by the machining system SYS will be described.

[0089] First, a description will be given of the manufacturing operation (additional processing operation for performing additional processing on the workpiece W) performed by the processing system SYS. As described above, the processing system SYS manufactures a three-dimensional structure ST by performing additional processing based on the laser build-up welding method. Therefore, the processing system SYS may manufacture a three-dimensional structure ST by performing a manufacturing operation in accordance with the laser build-up welding method.

[0090] The processing system SYS forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (three-dimensional model information) of the three-dimensional structure ST to be formed. As the three-dimensional model data, measurement data of a three-dimensional object measured by at least one of a measuring device provided within the processing system SYS and a three-dimensional shape measuring device provided separately from the processing system SYS may be used. To form the three-dimensional structure ST, the processing system SYS sequentially forms, for example, multiple structural layers SL arranged along the Z-axis direction.

[0091] The machining system SYS repeatedly performs operations for forming such a structural layer SL based on the three-dimensional model data of the three-dimensional structure ST under the control of the control unit 7. Specifically, before performing operations for forming the structural layer SL, the control unit 7 first slices the three-dimensional model data at the layer pitch to create slice data. The machining system SYS performs operations for forming the first structural layer SL-1 on the building surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structural layer SL-1. Specifically, the control unit 7 acquires path information for forming the first structural layer SL-1, which is generated based on the slice data corresponding to the structural layer SL-1. Then, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to form the first structural layer SL-1. As a result, the structural layer SL-1 is formed on the building surface MS as shown in FIG. 5( a). Thereafter, the machining system SYS sets the surface (upper surface) of the structural layer SL-1 as a new printing surface MS, and then prints a second structural layer SL-2 on the new printing surface MS. To print the structural layer SL-2, the control unit 7 first controls at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the machining head 22 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head driving mechanism 23 and the stage driving mechanism 32 to move the machining head 22 toward the +Z side and / or move the stage 31 toward the −Z side so that the machining unit areas PUA#1 and PUA#2 are set on the surface of the structural layer SL-1 (the new printing surface MS). Thereafter, under the control of the control unit 7, the machining system SYS prints the structural layer SL-2 on the structural layer SL-1 based on the slice data corresponding to the structural layer SL-2, using operations similar to those used to print the structural layer SL-1. As a result, a structural layer SL-2 is formed as shown in Fig. 5(b). Thereafter, the same operation is repeated until all structural layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, as shown in Fig. 5(c), the three-dimensional structure ST is formed by a layered structure in which multiple structural layers SL are stacked.

[0092] The processing system SYS (mainly, the processing unit 2) selectively performs (i) a first-modeling operation in which a three-dimensional structure ST is formed by supplying a modeling material M to a molten pool MP formed by irradiating a modeling surface MS with a processing light EL, and (ii) a second-modeling operation in which a three-dimensional structure ST is formed by supplying a melted modeling material M to the modeling surface MS by irradiating the modeling surface MS with the processing light EL. The first and second modeling operations will be described in order below.

[0093] (2-1-1) First Modeling Operation The first modeling operation is a modeling operation in which a molten pool MP is formed on the modeling surface MS by irradiating the modeling surface MS with the processing light EL, and a modeling material M is supplied to the formed molten pool MP (the position irradiated with the processing light EL), thereby forming a model on the modeling surface MS. In other words, the first modeling operation is a modeling operation in which, in order to form a model on the modeling surface MS, a molten pool MP is formed on the modeling surface MS by irradiating the modeling surface MS with the processing light EL, and a modeling material M is supplied to the formed molten pool MP.

[0094] First, the operation of forming each structure layer SL by performing the first forming operation will be described with reference to FIGS. 6A and 6B. Under the control of the control unit 7, the processing system SYS moves at least one of the processing head 22 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 are set in desired areas on the forming surface MS corresponding to the surface of the workpiece W or the surface of the formed structure layer SL. Then, the irradiation device 21 irradiates the processing unit areas PUA#1 and PUA#2 with processing light EL#1 and EL#2, respectively. At this time, the focus position CP#1 of the processing light EL#1 and the focus position CP#2 of the processing light EL#2 in the Z-axis direction may coincide with the forming surface MS. Alternatively, the focus position CP#1 of the processing light EL#1 and the focus position CP#2 of the processing light EL#2 in the Z-axis direction may be spaced apart from the forming surface MS. As a result, as shown in Fig. 6(a), molten pools MP#1 and MP#2 are formed on the building surface MS irradiated with the processing beams EL#1 and EL#2, respectively. Furthermore, as shown in Fig. 6(a), the processing system SYS supplies the building material M from the material nozzle 64 under the control of the control unit 7. As a result, the building material M is supplied to each of the molten pools MP#1 and MP#2.

[0095] The shaping material M supplied to the molten pool MP#1 is melted by the energy from the processing light EL#1 irradiating the molten pool MP#1. Alternatively, the shaping material M supplied to the molten pool MP#1 is melted by the heat from the molten material that constitutes the molten pool MP#1. Even when the shaping material M is melted by the heat from the molten material that constitutes the molten pool MP#1, since the molten pool MP#1 is formed by the energy of the processing light EL#1, the shaping material M is melted by the energy of the processing light EL#1 that formed the molten pool MP#1. In other words, the shaping material M is melted indirectly by the processing light EL#1 via the molten pool MP#1 formed by the processing light EL#1. In either case, the shaping material M is melted by the energy of the processing light EL#1.

[0096] Similarly, the shaping material M supplied to the molten pool MP#2 is melted by the energy from the processing light EL#2 irradiating the molten pool MP#2. Alternatively, the shaping material M supplied to the molten pool MP#2 is melted by the heat from the molten material that constitutes the molten pool MP#2. Even when the shaping material M is melted by the heat from the molten material that constitutes the molten pool MP#2, because the molten pool MP#2 is formed by the energy of the processing light EL#2, the shaping material M is melted by the energy of the processing light EL#2 that formed the molten pool MP#2. In other words, the shaping material M is melted indirectly by the processing light EL#2 via the molten pool MP#2 formed by the processing light EL#2. In either case, the shaping material M is melted by the energy of the processing light EL#2.

[0097] Furthermore, the irradiation device 21 uses the galvanometer mirror 46#1 to move the irradiation area EA#1 within the machining unit area PUA#1, and uses the galvanometer mirror 46#2 to move the irradiation area EA#2 within the machining unit area PUA#2. That is, the irradiation device 21 uses the galvanometer mirror 46#1 to scan the machining unit area PUA#1 with the processing light EL#1, and uses the galvanometer mirror 46#2 to scan the machining unit area PUA#2 with the processing light EL#2. As the irradiation area EA#1 moves and the processing light EL#1 ceases to be irradiated, the molten build material M cools and solidifies (solidifies). Similarly, as the irradiation area EA#2 moves and the processing light EL#2 ceases to be irradiated, the build material M cools and solidifies (solidifies). That is, as the irradiation areas EA#1 and EA#2 move, the positions where the molten pools MP#1 and MP#2 are formed also move. As a result, within the processing unit areas PUA#1 and PUA#2, as the irradiation areas EA#1 and EA#2 move, a model made of the solidified modeling material M is deposited on the modeling surface MS. After the modeling surface MS is irradiated with the processing light EL to form a molten pool MP (narrowly defined), the modeling material M is supplied to the molten pool MP (narrowly defined), and the molten pool MP (broadly defined) protrudes from the modeling surface MS. The molten pool (broadly defined) is then cooled and solidified, depositing a structure (structural layer SL) on the modeling surface MS.

[0098] 6A, for convenience of explanation, the object formed from the solidified shaping material M in the processing unit area PUA#1 is physically separated from the object formed from the solidified shaping material M in the processing unit area PUA#2. However, the object formed from the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object formed from the solidified shaping material M in the processing unit area PUA#2. In particular, when the processing unit areas PUA#1 and PUA#2 coincide (or partially overlap), the object formed from the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object formed from the solidified shaping material M in the processing unit area PUA#2.

[0099] During the period when the irradiation areas EA#1 and EA#2 are moving within the machining unit areas PUA#1 and PUA#2, respectively, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the manufacturing surface MS. In other words, the machining system SYS may move the irradiation area EA# within the machining unit area PUA#1 and the irradiation area EA#2 within the machining unit area PUA#2, respectively, and move the machining unit areas PUA#1 and PUA#2 on the manufacturing surface MS in parallel.

[0100] Alternatively, during the period when the irradiation area EA#1 within the machining unit area PUA#1 and the irradiation area EA#2 within the machining unit area PUA#2 are moving, the machining system SYS does not need to move the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 do not move on the manufacturing surface MS. In other words, during the period when the irradiation area EA#1 within the machining unit area PUA#1 and the irradiation area EA#2 within the machining unit area PUA#2 are moving, the machining head 22 and the stage 31 may be stopped. In this case, after the additional machining (manufacturing) within the machining unit areas PUA#1 and PUA#2 is completed, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 are set in another area on the manufacturing surface MS. In other words, after the additional machining (shaping) in the machining unit areas PUA#1 and PUA#2 is completed, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the printing surface MS. In this case, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set (the area where the additional machining has already been performed) and the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set (the area where the additional machining will now be performed) are adjacent to each other. In particular, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set does not overlap with an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set. However, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set partially overlaps with an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set.

[0101] 6( b), the machining system SYS repeats a series of molding processes, including forming a molten pool MP#1 by irradiating the machining unit area PUA#1 with the machining light EL#1, forming a molten pool MP#2 by irradiating the machining unit area PUA#2 with the machining light EL#2, supplying the molding material M to the molten pools MP#1 and MP#2, melting the supplied molding material M, and solidifying the molten molding material M, while moving the machining unit areas PUA#1 and PUA#2 along desired movement trajectories on the molding surface MS. In this case, as the machining unit areas PUA#1 and PUA#2 move, a molded object having a width along a direction intersecting the desired movement trajectory is molded on the molding surface MS.

[0102] As a result, a structure layer SL is formed on the manufacturing surface MS, which corresponds to a structure that is an aggregate of the melted and then solidified manufacturing material M. That is, a structure layer SL is formed on the manufacturing surface MS, which corresponds to an aggregate of the structures that have been manufactured in a pattern according to the movement trajectories of the processing unit areas PUA#1 and PUA#2. That is, a structure layer SL having a shape according to the movement trajectories of the processing unit areas PUA#1 and PUA#2 in plan view is formed.

[0103] Note that when the irradiation area EA#1 is set in an area where it is not desired to form an object, the processing system SYS does not have to irradiate the irradiation area EA#1 with the processing light EL#1. Alternatively, the processing system SYS may irradiate the irradiation area EA#1 with the processing light EL#1 and stop the supply of the building material M. Alternatively, the processing system SYS may supply the building material M to the irradiation area EA#1 and irradiate the irradiation area EA#1 with the processing light EL#1 at an intensity that does not cause the formation of a molten pool MP. The same applies when the irradiation area EA#2 is set in an area where it is not desired to form an object.

[0104] The movement trajectories of the machining unit areas PUA#1 and PUA#2 may be referred to as machining paths (tool paths). In this case, the control unit 7 may move at least one of the machining head 22 and the stage 31 based on path information indicating the movement trajectories (path information indicating the machining paths) so that the machining unit areas PUA#1 and PUA#2 move on the build surface MS.

[0105] (2-1-2) Second Modeling Operation In the first modeling operation described above, the processing system SYS melts the modeling material M on the modeling surface MS. On the other hand, in the second modeling operation, the processing system SYS melts the modeling material M in the space between the material nozzle 64 and the modeling surface MS before the modeling material M reaches the modeling surface MS. That is, in the second modeling operation, the processing system SYS melts the modeling material M in the space between the material nozzle 64 and the modeling surface MS by irradiating the modeling material M with the processing light EL in the space between the material nozzle 64 and the modeling surface MS. In other words, in the second modeling operation, the modeling material M is melted by the energy of the processing light EL in the space between the material nozzle 64 and the modeling surface MS. The molten modeling material M is supplied to the modeling surface MS in the space between the material nozzle 64 and the modeling surface MS to model a model on the modeling surface MS. Therefore, the processing system SYS supplies the molten building material M to the building surface MS in the space between the material nozzle 64 and the building surface MS. Therefore, in the second building operation, the processing system SYS does not necessarily have to perform the operation of forming a molten pool MP by irradiating the building surface MS with the processing light EL.

[0106] To form each structure layer SL by performing the second modeling operation, the processing system SYS, under the control of the control unit 7, moves at least one of the processing head 22 and the stage 31 so that the molten modeling material M is supplied to a desired area on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the modeled structure layer SL. Thereafter, as shown in FIG. 7A, the processing system SYS, under the control of the control unit 7, emits processing light EL#1 and EL#2 from the irradiation device 21. Furthermore, as shown in FIG. 7A, the processing system SYS, under the control of the control unit 7, supplies the modeling material M from the material nozzle 64.

[0107] As a result, at least one of the processing lights EL#1 and EL#2 is irradiated onto the modeling material M in the space between the material nozzle 64 and the modeling surface MS. In the following description, for convenience of explanation, a surface in the space between the material nozzle 64 and the modeling surface MS that intersects (is perpendicular to) the direction in which the material nozzle 64 and the modeling surface MS face each other (the Z-axis direction) is referred to as a material supply surface PL. Furthermore, of the multiple material supply surfaces PL between the material nozzle 64 and the modeling surface MS, a surface on which at least one of the processing lights EL#1 and EL#2 is irradiated onto the modeling material M is referred to as a material irradiation surface ES. In this case, as shown in FIG. 7A, the processing system SYS irradiates the material irradiation surface ES with the processing lights EL#1 and EL#2 and supplies the modeling material M to the material irradiation surface ES. However, because the material irradiation surface ES is not a physical surface, the processing lights EL#1 and EL#2 irradiated onto the material irradiation surface ES pass through the material irradiation surface ES, and the modeling material M supplied to the material irradiation surface ES also passes through the material irradiation surface ES. Therefore, the processing system SYS emits the processing lights EL#1 and EL#2 so that the processing lights EL#1 and EL#2 pass through the material irradiation surface ES, and supplies the modeling material M so that the modeling material M passes through the material irradiation surface ES. Note that because the modeling material M passes through the material supply surface PL, the material supply surface PL may also be referred to as a material passing surface.

[0108] When at least one of the processing lights EL#1 and EL#2 is irradiated onto the building material M on the material-irradiated surface ES, the building material M melts on the material-irradiated surface ES, as shown in FIG. 7A. The building material M melted on the material-irradiated surface ES is supplied from the material-irradiated surface ES to the building surface MS. As a result, the building material M melted on the material-irradiated surface ES adheres to the building surface MS. The building material M supplied to the building surface MS is then cooled and solidified (coagulated). As a result, as shown in FIG. 7B, a built object made of the solidified building material M is deposited on the building surface MS.

[0109] The processing system SYS repeats a series of modeling processes, including melting the modeling material M on the material irradiation surface ES by irradiating it with the processing lights EL#1 and EL#2, supplying the molten modeling material M to the modeling surface MS, and solidifying the molten modeling material M on the modeling surface MS, while moving the processing head 22 relative to the modeling surface MS, as shown in FIG. 7B . In particular, the processing system SYS repeats the series of modeling processes while moving the processing head 22 relative to the modeling surface MS along at least one of the X-axis direction and the Y-axis direction. In this case, as the processing head 22 moves, a modeled object having a width along a direction intersecting the movement direction of the processing head 22 is formed on the modeling surface MS. As a result, a structure layer SL corresponding to a modeled object that is an aggregate of the melted and then solidified modeling material M is formed on the modeling surface MS. The structure layer SL corresponding to a aggregate of the models formed on the modeling surface MS is formed in a pattern according to the movement trajectory of the processing head 22. That is, a structure layer SL having a shape corresponding to the movement trajectory of the processing head 22 in a plan view is formed.

[0110] When such a second-modeling operation is performed, the object (e.g., the workpiece W or the structure layer SL) having the modeling surface MS on its surface is rarely directly melted by the processing light EL. Therefore, the time required for the molten modeling material M to cool and solidify is shorter. Therefore, the time required for the second-modeling operation to model the three-dimensional structure ST is shorter than that for the first-modeling operation, which is performed by forming a molten pool MP. In other words, the modeling speed of the second-modeling operation is faster than that of the first-modeling operation. In other words, the second-modeling operation allows the processing system SYS to model the three-dimensional structure ST at higher speeds than the first-modeling operation.

[0111] In this way, the second-modeling operation can form the three-dimensional structure ST at high speed, and therefore the second-modeling operation may be referred to as a modeling operation conforming to the extreme high speed application (EHLA). The second-modeling operation is a modeling operation conforming to the extreme high speed application (EHLA).

[0112] When the second modeling operation is performed, as in the case of the first modeling operation, the processing system SYS may deflect the processing light EL#1 and EL#2 using the galvanometer mirrors 46#1 and 46#2, respectively. In this case, the processing system SYS may deflect the processing light EL#1 using the galvanometer mirror 46#1 to move the beam passing region through which the processing light EL#1 passes within the virtual material irradiation surface ES that intersects with the Z-axis between the material nozzle 64 and the modeling surface MS. Similarly, as shown in FIG. 11 , which shows the processing light EL#2 passing through the material irradiation surface ES, the processing system SYS may deflect the processing light EL#2 using the galvanometer mirror 46#2 to move the beam passing region through which the processing light EL#2 passes within the virtual material irradiation surface ES that intersects with the Z-axis between the material nozzle 64 and the modeling surface MS.

[0113] The irradiation direction of processing light EL#1 may refer to the irradiation direction of processing light EL#1 emitted from the focusing optical system 50. In this case, the irradiation direction of processing light EL#1 may be the same as the direction along the optical axis AX of the focusing optical system 50. The irradiation direction of processing light EL#1 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the focusing optical system 50. The final optical element may be an fθ lens 52. Furthermore, if the fθ lens 52 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 52.

[0114] The irradiation device 21 does not necessarily have to include the focusing optical system 50. When the irradiation device 21 does not have the focusing optical system 50, the final optical member may be the optical member (Y-scanning mirror 46MY#1) that is arranged closest to the printing surface MS among the plurality of optical members that make up the first optical system 41#1. When the irradiation optical system 41 does not have the focusing optical system 50, the final optical member may be the optical member (Y-scanning mirror 46MY#2) that is arranged closest to the printing surface MS among the plurality of optical members that make up the second optical system 41#2.

[0115] When the emission direction of the processing light EL#1 emitted from the galvanometer mirror 46#1 is changed, the position at which the processing light EL#1 is emitted from the processing head 22 is changed. When the emission position of the processing light EL#1 from the processing head 22 is changed, the irradiation area EA#1 on the printing surface MS where the processing light EL#1 is irradiated moves. In other words, the irradiation position on the printing surface MS where the processing light EL#1 is irradiated moves. As a result, the printing surface MS is scanned by the processing light EL#1. Therefore, the galvanometer mirror 46#1 functions as a position changing device (irradiation position moving device) that can move the irradiation position of the processing light EL#1 on the printing surface MS. The galvanometer mirror 46#1 functions as a scanning optical system (deflection scanning optical system) that scans the processing light EL#1 so as to move the irradiation area EA#1 within the printing surface MS.

[0116] Furthermore, when the position from which processing light EL#1 is emitted from the processing head 22 is changed, the beam passing area through which processing light EL#1 passes moves within a virtual material supply plane PL that intersects the Z-axis between the material nozzle 64 and the build surface MS. In other words, the passing position through which processing light EL#1 passes within the material supply plane PL moves. As a result, the material supply plane PL is essentially scanned by processing light EL#1. Therefore, the galvanometer mirror 46#1 functions as a passing position moving device that can move the passing position of processing light EL#1 within the material supply plane PL. The galvanometer mirror 46#1 functions as a scanning optical system (deflection scanning optical system) that essentially scans processing light EL#1 within the material supply plane PL.

[0117] As an example of an operation for moving the irradiation area EA#1 within the processing unit area PUA#1, the galvanometer mirror 46#1 may deflect the processing light EL#1 so that the irradiation area EA#1 moves along a single scanning direction along the printing surface MS within the processing unit area PUA#1, assuming that the processing unit area PUA#1 is stationary (not moving) on ​​the printing surface MS. In other words, the galvanometer mirror 46#1 may deflect the processing light EL#1 so that the irradiation area EA#1 moves along a single scanning direction within a coordinate system defined based on the processing unit area PUA#1. In particular, the galvanometer mirror 46#1 may deflect the processing light EL#1 so that the irradiation area EA#1 periodically moves back and forth along the single scanning direction within the processing unit area PUA#1. In other words, the galvanometer mirror 46#1 may deflect the processing light EL#1 so that the irradiation area EA#1 moves back and forth periodically on an axis along a single scanning direction within the processing unit area PUA#1. In this case, the shape of the processing unit area PUA#1 along which the irradiation area EA#1 moves may be a rectangle whose longitudinal direction is the movement direction of the irradiation area EA#1.

[0118] As another example of an operation for moving the irradiation area EA#1 within the processing unit area PUA#1, the galvanometer mirror 46#1 may deflect the processing light EL#1 so that the irradiation area EA#1 moves along multiple scanning directions along the processing unit area MS, assuming that the processing unit area PUA#1 is stationary (not moving) on ​​the printing surface MS. In other words, the galvanometer mirror 46#1 may deflect the processing light EL#1 so that the irradiation area EA#1 moves along multiple scanning directions within a coordinate system defined based on the processing unit area PUA#1. In particular, the galvanometer mirror 46#1 may deflect the processing light EL#1 so that the irradiation area EA#1 periodically moves back and forth along each of the multiple scanning directions within the processing unit area PUA#1. That is, the galvanometer mirror 46#1 may deflect the processing light EL#1 so that the irradiation area EA#1 periodically moves back and forth on axes along each of the multiple scanning directions within the processing unit area PUA#1. For example, the irradiation area EA#1 may move back and forth along each of the X-axis and Y-axis directions within the processing unit area PUA#1 so that the movement trajectory of the irradiation area EA#1 within the processing unit area PUA#1 is circular. In this case, the shape of the processing unit area PUA#1 through which the irradiation area EA#1 moves may be circular. For example, the irradiation area EA#1 may move back and forth along each of the X-axis and Y-axis directions within the processing unit area PUA#1 so that the movement trajectory of the irradiation area EA#1 within the processing unit area PUA#1 is mesh-shaped. In this case, the shape of the processing unit area PUA#1 through which the irradiation area EA#1 moves may be rectangular.

[0119] The operation of periodically moving the irradiation area EA#1 on the printing surface MS may also be referred to as a wobbling operation. In other words, the operation of periodically moving (deflecting) the processing light EL#1 so that the irradiation area EA#1 moves periodically on the printing surface MS may also be referred to as a wobbling operation. However, the processing system SYS does not necessarily have to periodically move the processing light EL#1 so that the irradiation area EA#1 moves periodically on the printing surface MS. In other words, the processing system SYS does not necessarily have to perform a wobbling operation.

[0120] The control unit 7 may move at least one of the machining head 22 and the stage 31 so that the machining unit area PUA#1 moves on the manufacturing surface MS during a period in which the irradiation area EA#1 is being moved within the machining unit area PUA#1 using the galvanometer mirror 46#1. In other words, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the machining unit area PUA#1 moves on the manufacturing surface MS during a period in which the irradiation area EA#1 is being moved within the machining unit area PUA#1 using the galvanometer mirror 46#1.

[0121] For example, when the irradiation area EA#1 within the processing unit area PUA#1 moves along a single scanning direction along the printing surface MS, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the processing unit area PUA#1 moves along a movement trajectory that intersects (or, in some cases, is perpendicular to) the movement direction (scanning direction) of the irradiation area EA#1 within the processing unit area PUA#1. Conversely, the control unit 7 may control the galvanometer mirror 46#1 so that the irradiation area EA#1 periodically moves along a scanning direction that intersects (or, in some cases, is perpendicular to) the movement trajectory of the processing unit area PUA#1 on the printing surface MS. As a result, the irradiation area EA#1 may move along the movement trajectory of the processing unit area PUA#1 while also moving along a scanning direction that intersects the movement trajectory. In other words, the irradiation area EA#1 may move along a wave-shaped (e.g., sinusoidal) movement trajectory that oscillates around the movement trajectory.

[0122] For example, when the irradiation area EA#1 within the processing unit area PUA#1 moves along multiple scanning directions along the manufacturing surface MS, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the processing unit area PUA#1 moves along a movement trajectory that extends along at least one of the directions along the movement direction (scanning direction) of the irradiation area EA#1 within the processing unit area PUA#1 and the direction that intersects (or, in some cases, is perpendicular to) the movement direction of the irradiation area EA#1 within the processing unit area PUA#1. Conversely, the control unit 7 may control the galvanometer mirror 46#1 so that the irradiation area EA#1 periodically moves along a scanning direction that follows the movement trajectory of the machining unit area PUA#1 on the build surface MS and along a scanning direction that intersects with (or is perpendicular to) the movement trajectory. When the machining light EL#1 is irradiated onto the build surface MS in units of the machining unit area PUA#1, a molten pool MP#1 is formed in at least a portion of the machining unit area PUA#1. As a result, a molded object is molded within the machining unit area PUA#1. As described above, the machining unit area PUA#1 is an area having a width in a direction that intersects with the movement direction of the machining unit area PUA#1 on the build surface MS (the direction in which the movement trajectory extends). In this case, a molded object having a width along a direction that intersects with the movement trajectory of the machining unit area PUA#1 is molded on the build surface MS.

[0123] When the processing light EL#1 is irradiated onto the printing surface MS in units of processing unit areas PUA#1, the processing unit areas PUA#1 are scanned with the processing light EL#1 by the galvanometer mirror 46#1. Therefore, compared to when the processing light EL#1 is irradiated onto the printing surface MS without using the galvanometer mirror 46#1, the amount of energy transmitted from the processing light EL#1 to the processing unit areas PUA#1 is less likely to vary within the processing unit areas PUA#1. In other words, the distribution of the amount of energy transmitted from the processing light EL#1 to the processing unit areas PUA#1 can be made uniform. As a result, the processing system SYS can form a shaped object on the printing surface MS with relatively high printing accuracy.

[0124] Furthermore, when the processing unit area PUA#1 is scanned with the processing light EL#1 by the galvanometer mirror 46#1, the amount of energy transferred from the processing light EL#1 to the processing unit area PUA#1 per unit time and / or per unit area is smaller than when the processing light EL#1 is irradiated onto the printing surface MS without using the galvanometer mirror 46#1. Therefore, there is room to increase the intensity of the processing light EL#1 compared to when the processing light EL#1 is irradiated onto the printing surface MS without using the galvanometer mirror 46#1.

[0125] However, the processing system SYS does not have to irradiate the printing surface MS with the processing light EL#1 in units of processing unit areas PUA#1. The processing system SYS may irradiate the printing surface MS with the processing light EL#1 without using the galvanometer mirror 46#1. The processing system SYS does not necessarily have to perform a wobbling operation. In this case, the irradiation area EA#1 may move on the printing surface MS in conjunction with the movement of at least one of the processing head 22 and the stage 31.

[0126] The machining system SYS may non-periodically move the irradiation area EA#1 on the manufacturing surface MS.

[0127] The above-mentioned description of the processing light EL#1, the irradiation area EA#1, and the processing unit area PUA#1 can be used as the description of the processing light EL#2, the irradiation area EA#2, and the processing unit area PUA#2 by replacing the word "#1" with the word "#2." Therefore, in order to avoid redundant explanations, the description of the processing light EL#2, the irradiation area EA#2, and the processing unit area PUA#2 will be omitted.

[0128] (2-2) Condition Display Operation The machining system SYS may perform a condition display operation in addition to or instead of the above-described modeling operation. The condition display operation is an operation of displaying information about machining conditions on the display device 75. In particular, the condition display operation is an operation of displaying information about machining conditions selected by a user (or an operator, the same applies hereinafter) of the machining system SYS on the display device 75. However, the condition display operation may also be an operation of displaying information about machining conditions selected by the control unit 7 using desired selection criteria on the display device 75.

[0129] The processing conditions may refer to the processing conditions of the processing system SYS. The processing conditions of the processing system SYS may refer to the processing conditions of a processing apparatus including the processing unit 2. The processing conditions of the processing system SYS may refer to the processing conditions of a processing apparatus including the processing unit 2 and at least one of the material supply device 61, the stage unit 3, the light source 49, and the gas supply device 62. For example, the processing conditions may refer to the processing conditions available for the processing system SYS (processing apparatus) to form a molded object. For example, the processing conditions may refer to the processing conditions that determine the operation details of the processing system SYS (processing apparatus) that forms a molded object.

[0130] As a first example of the processing conditions, the processing conditions may include processing conditions related to the processing light EL. The processing conditions related to the processing light EL may include processing conditions related to the intensity of the processing light EL. The processing conditions related to the processing light EL may include processing conditions related to the focus position CP of the processing light EL. The processing conditions related to the focus position CP of the processing light EL may include processing conditions related to the relative positional relationship between at least one of the printing surface MS and the material irradiation surface ES and the focus position CP of the processing light EL in the traveling direction of the processing light EL (Z-axis direction). Note that the relative positional relationship between at least one of the printing surface MS and the material irradiation surface ES and the focus position CP of the processing light EL in the traveling direction of the processing light EL may refer to the distance between at least one of the printing surface MS and the material irradiation surface ES and the focus position CP of the processing light EL in the traveling direction of the processing light EL.

[0131] As a second example of the processing conditions, the processing conditions may include processing conditions related to at least one of the galvanometer mirrors 46#1 and 46#2 included in the processing system SYS. Here, as described above, the galvanometer mirror 46#1 moves (changes) the irradiation position (irradiation area EA#1) of the processing light EL#1 on the printing surface MS, and the galvanometer mirror 46#2 moves (changes) the irradiation position (irradiation area EA#2) of the processing light EL#2 on the printing surface MS. In this case, the processing conditions related to at least one of the galvanometer mirrors 46#1 and 46#2 may include processing conditions related to at least one of the change in the position of the irradiation area EA#1 by the galvanometer mirror 46#1 and the change in the position of the irradiation area EA#2 by the galvanometer mirror 46#2. Furthermore, changing the position of irradiation area EA#1 by galvanometer mirror 46#1 and changing the position of irradiation area EA#2 by galvanometer mirror 46#2 are equivalent to moving irradiation area EA#1 by galvanometer mirror 46#1 and moving irradiation area EA#2 by galvanometer mirror 46#2, respectively.

[0132] The processing conditions for at least one of the galvanometer mirrors 46#1 and 46#2 may include processing conditions for at least one of changing the position of the irradiation area EA#1 by the galvanometer mirror 46#1 and changing the position of the irradiation area EA#2 by the galvanometer mirror 46#2, such as processing conditions for at least one of the scanning speed of the processing light EL#1 by the galvanometer mirror 46#1 and the scanning speed of the processing light EL#2 by the galvanometer mirror 46#2. As described above, the scanning speed of the processing light EL#1 by the galvanometer mirror 46#1 and the scanning speed of the processing light EL#2 by the galvanometer mirror 46#2 are equivalent to the processing conditions for the moving speed of the irradiation area EA#1 by the galvanometer mirror 46#1 and the moving speed of the irradiation area EA#2 by the galvanometer mirror 46#2, respectively.

[0133] When the irradiation areas EA#1 and EA#2 are moved periodically by the galvanometer mirrors 46#1 and 46#2, respectively, as described above, the machining conditions for at least one of the galvanometer mirrors 46#1 and 46#2 may include machining conditions for at least one of the movement period of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement period of the irradiation area EA#2 by the galvanometer mirror 46#2. When the irradiation areas EA#1 and EA#2 are moved back and forth by the galvanometer mirrors 46#1 and 46#2, respectively, as described above, the machining conditions for at least one of the galvanometer mirrors 46#1 and 46#2 may include machining conditions for at least one of the movement stroke of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement stroke of the irradiation area EA#2 by the galvanometer mirror 46#2.

[0134] The machining conditions for at least one of the galvanometer mirrors 46#1 and 46#2 may include machining conditions for at least one of the movement pattern of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement pattern of the irradiation area EA#2 by the galvanometer mirror 46#2. Note that the movement pattern may refer to the pattern of the movement locus of the irradiation area EA within the machining unit area PUA.

[0135] As a third example of the machining conditions, the machining conditions may include machining conditions related to the head driving mechanism 23 included in the machining system SYS. Here, as described above, when the head driving mechanism 23 moves the machining head 22, the relative positional relationship between the machining head 22 and the stage 31 and each of the workpieces W placed on the stage 31 changes. In this case, the machining conditions related to the head driving mechanism 23 may include machining conditions related to a change in the relative positional relationship between the machining head 22 and the stage 31 and each of the workpieces W placed on the stage 31. Note that a change in the relative positional relationship between the machining head 22 and each of the stage 31 and the workpieces W by the head driving mechanism 23 is equivalent to movement of the machining head 22 by the head driving mechanism 23. The machining conditions related to the head driving mechanism 23 may include machining conditions related to the relative movement speed between the machining head 22 and each of the stage 31 and the workpieces W by the head driving mechanism 23, as machining conditions related to a change in the relative positional relationship between the machining head 22 and each of the stage 31 and the workpieces W by the head driving mechanism 23. The relative movement speed between the machining head 22 and the stage 31 and the workpiece W caused by the head driving mechanism 23 is equivalent to the movement speed (head speed) of the machining head 22 caused by the head driving mechanism 23 .

[0136] As a fourth example of the machining conditions, the machining conditions may include machining conditions related to the stage driving mechanism 32 included in the machining system SYS. Here, as described above, when the stage driving mechanism 32 moves the stage 31, the relative positional relationship between the machining head 22 and the stage 31 and each of the workpieces W placed on the stage 31 changes. In this case, the machining conditions related to the stage driving mechanism 32 may include machining conditions related to a change in the relative positional relationship between the machining head 22 and the stage 31 and each of the workpieces W placed on the stage 31. Note that a change in the relative positional relationship between the machining head 22 and the stage 31 and each of the workpieces W by the stage driving mechanism 32 is equivalent to movement of the stage 31 by the stage driving mechanism 32. The machining conditions related to the stage driving mechanism 32 may include machining conditions related to the relative movement speed between the machining head 22 and each of the stage 31 and the workpieces W by the stage driving mechanism 32, as machining conditions related to a change in the relative positional relationship between the machining head 22 and each of the stage 31 and the workpieces W by the stage driving mechanism 32. The relative movement speed between the machining head 22 and the stage 31 and the workpiece W by the stage driving mechanism 32 is equivalent to the movement speed (stage speed) of the stage 31 by the stage driving mechanism 32.

[0137] As a fifth example of the processing conditions, the processing conditions may include processing conditions related to the modeling material M. The processing conditions related to the modeling material M may include processing conditions related to the supply of the modeling material M. The processing conditions related to the modeling material M may include processing conditions related to the supply amount of the modeling material M (the amount of modeling material M supplied from the material nozzle 64 per unit time, i.e., the material supply rate), as the processing conditions related to the supply of the modeling material M. The processing conditions related to the supply of the modeling material M may include processing conditions related to the positions of the material control points MCP where the modeling material M is concentrated, as the processing conditions related to the supply of the modeling material M. The processing conditions related to the positions of the material control points MCP may include processing conditions related to the relative positional relationship between the position of the material control points MCP and at least one of the modeling surface MS and the material irradiation surface ES in the traveling direction (Z-axis direction) of the processing light EL. Furthermore, the relative positional relationship between at least one of the forming surface MS and the material irradiation surface ES in the direction of travel of the processing light EL (Z-axis direction) and the position of the material control point MCP may also mean the distance between at least one of the forming surface MS and the material irradiation surface ES in the direction of travel of the processing light EL (Z-axis direction) and the position of the material control point MCP.

[0138] As a sixth example of the processing conditions, the processing conditions may include processing conditions related to the structure layer SL to be formed. The processing conditions related to the structure layer SL may include processing conditions related to the thickness of the structure layer SL (the stacking pitch of the multiple structure layers SL).

[0139] As a seventh example of the processing conditions, the processing conditions may include processing conditions related to the processing unit area PUA.

[0140] The machining conditions for the machining unit area PUA may include machining conditions for an overlap rate of the machining unit area PUA. The overlap rate of the machining unit area PUA may mean an overlap rate between a machining unit area PUA that moves along one movement locus extending in one direction at one timing and a machining unit area PUA that moves along another movement locus extending in the one direction adjacent to the one movement locus at another timing different from the one timing.

[0141] The machining conditions related to the machining unit area PUA may include machining conditions related to the bead width. Here, the bead width may refer to the width of a shaped object extending in one direction (the size in a direction intersecting the one direction) formed by moving the machining unit area PUA in that direction. The larger the width of the machining unit area PUA (the size of the machining unit area PUA in a direction intersecting the direction of movement of the machining unit area PUA), the larger the bead width. In other words, the bead width depends on the machining unit area PUA. Therefore, it can be said that the machining conditions related to the bead width are machining conditions related to the machining unit area PUA. In particular, the machining conditions related to the bead width are equivalent to the machining conditions related to the width of the machining unit area PUA.

[0142] As an eighth example of the processing conditions, the processing conditions may include processing conditions related to a purge gas. The processing conditions related to the purge gas may include processing conditions related to the supply of the purge gas. The processing conditions related to the purge gas may include processing conditions related to the supply amount of the purge gas (the amount of purge gas supplied to the chamber space 63 IN per unit time, i.e., gas flow rate).

[0143] The condition display operation for displaying such machining conditions may be mainly performed by the control unit 7. That is, the control unit 7 may perform the condition display operation as at least a part of the operation for controlling the operation of the machining system SYS. The control unit 7 may perform the condition display operation before the machining system SYS starts a modeling operation. The control unit 7 may perform the condition display operation while the machining system SYS is performing a modeling operation. The control unit 7 may perform the condition display operation after the machining system SYS has finished the modeling operation.

[0144] The condition display operation performed by the control unit 7 will be described below with reference to Fig. 8. Fig. 8 is a flowchart showing the flow of the condition display operation performed by the control unit 7.

[0145] (2-2-1) Acquisition of Material Selection Information (Selection of Modeling Material M): Step S11 As shown in FIG. 8 , the arithmetic device 71 of the control unit 7 acquires material selection information (step S11). The material selection information includes information related to the user's selection of the type of modeling material M corresponding to the processing conditions to be displayed by the condition display operation. The reason for acquiring the material selection information in order to display the processing conditions is as follows. The processing conditions of the processing system SYS generally vary depending on the type of modeling material M used by the processing system SYS to form a model. For example, the processing conditions of the processing system SYS for forming a certain modeling object using a first type of modeling material M may generally differ from the processing conditions of the processing system SYS for forming the same modeling object using a second type of modeling material M that is different from the first type of modeling material M. For this reason, the processing conditions of the processing system SYS are generally set for each type of modeling material M used to form the model. For example, the processing conditions of the processing system SYS are separately set as first processing conditions for forming an object using a first type of modeling material M and second processing conditions for forming an object using a second type of modeling material M. Therefore, in this embodiment, in order to display the processing conditions, the arithmetic device 71 first acquires material selection information related to the selection result of the type of modeling material M that corresponds to the processing conditions to be displayed. In this case, the control unit 7 displays the processing conditions that can be used to form an object using the selected type of modeling material M.

[0146] However, it is also possible to set processing conditions common to a plurality of types of modeling materials M. When displaying such processing conditions common to a plurality of types of modeling materials M, the calculation device 71 does not necessarily need to acquire material selection information.

[0147] To acquire the material selection information, the arithmetic device 71 may control the display device 75 to display the material selection screen 91 (step S11). Specifically, the arithmetic device 71 may generate display control information for controlling the display device 75 to display the material selection screen 91, and output the generated display control information to the display device 75. As a result, the display device 75 may display the material selection screen 91.

[0148] The material selection screen 91 may be a display screen operable by the user to select the type of the building material M. For example, the material selection screen 91 may be a display screen including a GUI (Graphical User Interface) operable by the user to select the type of the building material M. The user may select the type of the building material M using the input device 74 via the material selection screen 91 displayed on the display device 75. In other words, material selection information related to the user's selection of the type of the building material M via the material selection screen 91 displayed on the display device 75 may be input to the input device 74. In other words, the arithmetic device 71 may acquire, via the input device 74, material selection information related to the user's selection of the type of the building material M via the material selection screen 91 displayed on the display device 75.

[0149] An example of the material selection screen 91 is shown in Fig. 9. The material selection screen 91 may be a display screen including a plurality of buttons corresponding to the main component elements of the building material M, allowing the user to select the main component elements of the building material M. In the example shown in Fig. 9, the material selection screen 91 includes a button 911 that the user can select to select a building material M mainly composed of nickel, a button 912 that the user can select to select a building material M mainly composed of iron, a button 913 that the user can select to select a building material M mainly composed of aluminum, a button 914 that the user can select to select a building material M mainly composed of titanium, and a button 915 that the user can select to select a building material M mainly composed of copper.

[0150] 9 merely shows one example of the material selection screen 91. Therefore, as long as the user can select the type of modeling material M using the material selection screen 91, the material selection screen 91 is not limited to the display screen shown in Fig. 9. As long as the user can select the type of modeling material M using the material selection screen 91, a material selection screen 91 including a display screen different from the display screen shown in Fig. 9 may be used.

[0151] For example, the material selection screen 91 may include multiple buttons that the user can select to select multiple types of building materials M containing the same type of element as a primary component. As an example, the material selection screen 91 may include a button that the user can select to select a first type of alloy M containing nickel as a primary component (e.g., Inconel 625: NI625), a button that the user can select to select a second type of alloy M containing nickel as a primary component and different from the first type of alloy (e.g., Inconel 718: NI718), and a button that the user can select to select a third type of alloy M containing nickel as a primary component and different from the first and second types of alloy (e.g., Inconel 738: NI738). These buttons are user-selectable buttons to indirectly specify the ratios of multiple types of metals contained in the alloys that make up the building material M.

[0152] Alternatively, for example, the material selection screen 91 may include a button that the user can select to select a metal building material M and a button that the user can select to select a resin building material M. For example, the material selection screen 91 may include a text box that the user can use to directly input the type of building material M. For example, the material selection screen 91 may include a text box that the user can use to directly input the type of element that is the main component of the building material M. For example, the material selection screen 91 may include a text box that the user can use to directly input the type of element that is contained as the main component of the alloy that constitutes the building material M. For example, the material selection screen 91 may include a text box that the user can use to directly input the ratio of elements contained in the alloy that constitutes the building material M.

[0153] (2-2-2) Acquisition of Condition Selection Information (Selection of Machining Conditions): Step S12 Referring back to FIG. 8 , the arithmetic device 71 of the control unit 7 then acquires condition selection information (step S12). The condition selection information includes information regarding the user's selection of machining conditions to be displayed by the condition display operation. To acquire the condition selection information, the arithmetic device 71 may control the display device 75 to display a condition selection screen 92 (step S12). Specifically, the arithmetic device 71 may generate display control information for controlling the display device 75 to display the condition selection screen 92. The arithmetic device 71 may output the generated display control information to the display device 75. As a result, the display device 75 may display the condition selection screen 92.

[0154] The condition selection screen 92 may be a display screen operable by the user to select the machining conditions to be displayed. For example, the condition selection screen 92 may be a display screen including a GUI (Graphical User Interface) operable by the user to select the machining conditions to be displayed. The user may select the machining conditions to be displayed using the input device 74 via the condition selection screen 92 displayed on the display device 75. That is, condition selection information relating to the results of the user's selection of the machining conditions via the condition selection screen 92 displayed on the display device 75 may be input to the input device 74. In other words, the calculation device 71 may acquire, via the input device 74, condition selection information relating to the results of the user's selection of the machining conditions via the condition selection screen 92 displayed on the display device 75.

[0155] The machining conditions selectable by the user using the condition selection screen 92 include machining conditions that have already been set. Information regarding the machining conditions that have already been set may be stored in the storage device 72. Therefore, the machining conditions selectable by the user using the condition selection screen 92 may include the machining conditions stored in the storage device 72. In this case, the condition selection screen 92 may be a display screen that can be operated by the user to select the machining conditions that have already been set (the machining conditions stored in the storage device 72) as the machining conditions to be displayed by the condition display operation. For example, if multiple machining conditions have already been set, the condition selection screen 92 may be a display screen that can be operated by the user to select one of the multiple machining conditions that have already been set as the machining condition to be displayed by the condition display operation.

[0156] The machining conditions (already set machining conditions) stored in the storage device 72 may include machining conditions (basic machining conditions) that are set in advance as default machining conditions (basic machining conditions or initial machining conditions). In this case, the condition selection screen 92 may be a display screen that the user can operate to select the preset basic machining conditions as the machining conditions to be displayed by the condition display operation. When multiple basic machining conditions are set in advance, the condition selection screen 92 may be a display screen that the user can operate to select one basic machining condition from the multiple preset basic machining conditions as the machining condition to be displayed by the condition display operation.

[0157] The machining conditions (already set machining conditions) stored in the storage device 72 may include machining conditions (custom machining conditions) set by the user in addition to or instead of the basic machining conditions. For example, the machining conditions stored in the storage device 72 may include custom machining conditions newly set by the user customizing already set basic machining conditions. For example, the machining conditions stored in the storage device 72 may include custom machining conditions newly set by the user further customizing already set custom machining conditions. For example, the machining conditions stored in the storage device 72 may include custom machining conditions set from scratch by the user. In this case, the condition selection screen 92 may be a display screen operable by the user to select the custom machining conditions set by the user as the machining conditions to be displayed by the condition display operation. When multiple custom machining conditions are set in advance, the condition selection screen 92 may be a display screen operable by the user to select one of the multiple custom machining conditions set by the user as the machining condition to be displayed by the condition display operation.

[0158] The condition selection screen 92 may be a display screen operable by the user to select, as processing conditions to be displayed by the condition display operation, processing conditions available for forming a model using the modeling material M indicated by the material selection information acquired in step S11 (the modeling material M selected by the user in step S11). Therefore, the computing device 71 may generate display control information for controlling the display device 75 to display the condition selection screen 92, based on the material selection information acquired in step S11. For example, if a single processing condition (e.g., a single basic processing condition) is preset as a processing condition available for forming a model using the modeling material M indicated by the material selection information, the condition selection screen 92 may be a display screen operable by the user to select the single processing condition as a processing condition to be displayed by the condition display operation. For example, if multiple processing conditions (e.g., multiple processing conditions including one or more basic processing conditions and / or one or more custom processing conditions) are pre-set as processing conditions that can be used to form a model using the forming material M indicated by the material selection information, the condition selection screen 92 may be a display screen that can be operated by the user to select one of the multiple processing conditions as the processing condition to be displayed by the condition display operation.

[0159] An example of the condition selection screen 92 is shown in Fig. 10. As shown in Fig. 10, the condition selection screen 92 may include a label 921 indicating the building material M indicated by the material selection information (the building material M selected by the user in step S11). Fig. 10 shows an example of the condition selection screen 92 that is displayed after Inconel 625 (NI625) is selected as the building material M in step S11 of Fig. 8. In this case, as shown in Fig. 10, the condition selection screen 92 may include a label 921#1 indicating Inconel 625 as the label 921.

[0160] 10 , the condition selection screen 92 may include a button 922 that the user can select to select processing conditions that can be used to form an object using the building material M indicated by the material selection information. In the example shown in FIG. 10 , the condition selection screen 92 may include a button 922 that the user can select to select processing conditions that can be used to form an object using Inconel 625 as the building material M. 10 , the condition selection screen 92 includes, as buttons 922, a button 922#1 that the user can select to select basic processing conditions (processing conditions #1) that can be used to form an object using Inconel 625 as the building material M, a button 922#2 that the user can select to select first custom processing conditions (processing conditions #2) that can be used to form an object using Inconel 625 as the building material M, and a button 922#3 that the user can select to select second custom processing conditions (processing conditions #3) that can be used to form an object using Inconel 625 as the building material M. In this way, Fig. 10 shows an example in which at least three different processing conditions are preset as processing conditions that can be used to form an object using Inconel 625 as the building material M.

[0161] 10 shows an example in which the user has selected button 922#2, which is selectable by the user to select first custom processing conditions (processing conditions #2) that can be used to form an object using Inconel 625 as the forming material M. In this case, in step S13 described below, the computing device 71 controls the display device 75 to display the first custom processing conditions (processing conditions #2) that can be used to form an object using Inconel 625 as the forming material M.

[0162] 10 , the condition selection screen 92 may further include a label 921 indicating a different type of building material M (a different type of building material M from the building material M selected by the user in step S11) in addition to the label 921 indicating the building material M indicated by the material selection information. In the example shown in FIG. 10 , the condition selection screen 92 includes, as the label 921 indicating a different type of building material M from the building material M indicated by the material selection information, a label 921#2 indicating Inconel 718, which is different from Inconel 625, and a label 921#3 indicating Inconel 738, which is different from Inconel 625. In this case, as shown in FIG. 10 , the display mode of the label 921 indicating the building material M indicated by the material selection information may be different from the display mode of the label 921 indicating the different type of building material M from the building material M indicated by the material selection information. As a result, even if the condition selection screen 92 includes both a label 921 indicating the molding material M indicated by the material selection information and a label 921 indicating a different type of molding material M from the molding material M indicated by the material selection information, the user can properly recognize the molding material M indicated by the material selection information (the molding material M selected by the user).

[0163] Furthermore, if the condition selection screen 92 includes a label 921 indicating a type of building material M different from the building material M indicated by the material selection information, the user may change (update or newly select) the type of building material M corresponding to the processing conditions to be displayed by selecting the label 921 indicating the type of building material M different from the building material M indicated by the material selection information on the condition selection screen 92. In this case, the computing device 71 may control the display device 75 to display the condition selection screen 92 including buttons 922 that the user can select to select processing conditions available for building an object using the building material M newly selected by the user selecting the label 921. For example, if the label 921#2 indicating Inconel 718 is selected by the user, the calculation device 71 may control the display device 75 to display a condition selection screen 92 including a button 922 that the user can select to select processing conditions that can be used to form an object using the newly selected Inconel 718 as the forming material M, instead of the condition selection screen 92 including a button 922 that the user can select to select processing conditions that can be used to form an object using Inconel 625 as the forming material M. As an example, as shown in FIG. 11 , the arithmetic device 71 may control the display device 75 to display a condition selection screen 92 including buttons 922#4 to 922#6 that the user can select to select processing conditions #4 to #6 that can be used to form an object using the newly selected Inconel 718 as the building material M, instead of the condition selection screen 92 (see FIG. 10 ) including buttons 922#1 to 922#3 that the user can select to select processing conditions #1 to #3 that can be used to form an object using Inconel 625 as the building material M. In other words, the arithmetic device 71 may control the display device 75 to update the condition selection screen 92. In this case, the arithmetic device 71 does not need to display the material selection screen 91 shown in FIG. 9 in order to reselect the building material M (acquire new material selection information). In other words, the arithmetic device 71 does not need to perform the process of step S11 in FIG. 8 again.

[0164] (2-2-3) Displaying Selected Machining Conditions: Step S13 Referring again to FIG. 8, the calculation device 71 may then control the display device 75 to display the machining conditions selected in step S12 (the machining conditions indicated by the condition selection information acquired in step S12) (step S13).

[0165] The machining conditions may include multiple types of condition parameters. In this case, the arithmetic unit 71 may control the display device 75 to display the set values ​​of the multiple types of condition parameters as machining conditions. That is, the arithmetic unit 71 may control the display device 75 to display the set values ​​of the multiple types of condition parameters corresponding to the machining conditions selected in step S12. For example, the arithmetic unit 71 may control the display device 75 to display, as machining conditions, the set values ​​of a first type of condition parameter, a second type of condition parameter different from the first type of condition parameter, and a third type of condition parameter different from the first type to the second type of condition parameter.

[0166] As described above, the processing conditions may include processing conditions related to the processing light EL. In this case, the processing conditions may include condition parameters related to the processing light EL as condition parameters. The calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the processing light EL" included in the processing conditions selected in step S12.

[0167] As described above, the processing conditions related to the processing light EL may include processing conditions related to the intensity of the processing light EL. In this case, the condition parameters related to the processing light EL may include condition parameters related to the intensity of the processing light EL. In other words, the condition parameters related to the processing light EL may include the intensity of the processing light EL. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the intensity of the processing light EL (setting value of the intensity of the processing light EL)" included in the processing conditions selected in step S12.

[0168] As described above, the processing conditions related to the processing light EL may include processing conditions related to the focus position CP of the processing light EL. In this case, the condition parameters related to the processing light EL may include condition parameters related to the focus position CP of the processing light EL. In other words, the condition parameters related to the processing light EL may include the focus position CP of the processing light EL. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the focus position CP of the processing light EL (setting value of the focus position CP of the processing light EL)" included in the processing conditions selected in step S12.

[0169] As described above, the processing conditions related to the focus position CP of the processing light EL may include processing conditions related to the relative positional relationship between the focus position CP of the processing light EL and at least one of the printing surface MS and the material irradiation surface ES in the traveling direction of the processing light EL (Z-axis direction). In this case, the condition parameters related to the processing light EL may include, as the condition parameters related to the focus position CP of the processing light EL, condition parameters related to the relative positional relationship between the focus position CP of the processing light EL and at least one of the printing surface MS and the material irradiation surface ES in the traveling direction of the processing light EL. In other words, the condition parameters related to the processing light EL may include, as the condition parameters related to the focus position CP of the processing light EL, the relative positional relationship between the focus position CP of the processing light EL and at least one of the printing surface MS and the material irradiation surface ES in the traveling direction of the processing light EL. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter regarding the relative positional relationship between at least one of the forming surface MS and the material irradiation surface ES in the direction of travel of the processing light EL and the focus position CP of the processing light EL (setting value of the relative positional relationship between at least one of the forming surface MS and the material irradiation surface ES in the direction of travel of the processing light EL and the focus position CP of the processing light EL)" included in the processing conditions selected in step S12.

[0170] As described above, the machining conditions may include machining conditions for at least one of the galvanometer mirrors 46#1 and 46#2 included in the machining system SYS. In this case, the machining conditions may include, as condition parameters, condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2. The calculation device 71 may control the display device 75 to display "setting values ​​of condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2" included in the machining conditions selected in step S12.

[0171] As described above, the processing conditions for at least one of the galvanometer mirrors 46#1 and 46#2 may include processing conditions for at least one of changing the position of the irradiation area EA#1 by the galvanometer mirror 46#1 and changing the position of the irradiation area EA#2 by the galvanometer mirror 46#2. In this case, the condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2 may include condition parameters for at least one of changing the position of the irradiation area EA#1 by the galvanometer mirror 46#1 and changing the position of the irradiation area EA#2 by the galvanometer mirror 46#2.

[0172] As described above, the processing conditions for at least one of the galvanometer mirrors 46#1 and 46#2 may include processing conditions related to at least one of the scanning speed of the processing light EL#1 by the galvanometer mirror 46#1 and the scanning speed of the processing light EL#2 by the galvanometer mirror 46#2. In this case, the condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2 may include condition parameters related to at least one of the scanning speed of the processing light EL#1 by the galvanometer mirror 46#1 and the scanning speed of the processing light EL#2 by the galvanometer mirror 46#2. In other words, the condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2 may include at least one of the scanning speed of the processing light EL#1 by the galvanometer mirror 46#1 and the scanning speed of the processing light EL#2 by the galvanometer mirror 46#2. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to at least one of the scanning speed of the processing light EL#1 by the galvanometer mirror 46#1 and the scanning speed of the processing light EL#2 by the galvanometer mirror 46#2 (setting value of at least one of the scanning speed of the processing light EL#1 by the galvanometer mirror 46#1 and the scanning speed of the processing light EL#2 by the galvanometer mirror 46#2)" included in the processing conditions selected in step S12.

[0173] As described above, the processing conditions for at least one of the galvanometer mirrors 46#1 and 46#2 may include processing conditions for at least one of the movement period of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement period of the irradiation area EA#2 by the galvanometer mirror 46#2. In this case, the condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2 may include condition parameters for at least one of the movement period of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement period of the irradiation area EA#2 by the galvanometer mirror 46#2. In other words, the condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2 may include at least one of the movement period of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement period of the irradiation area EA#2 by the galvanometer mirror 46#2. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to at least one of the movement period of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement period of the irradiation area EA#2 by the galvanometer mirror 46#2 (setting value of at least one of the movement period of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement period of the irradiation area EA#2 by the galvanometer mirror 46#2)" included in the processing conditions selected in step S12.

[0174] As described above, the machining conditions for at least one of the galvanometer mirrors 46#1 and 46#2 may include machining conditions for at least one of the stroke of movement of the irradiation area EA#1 by the galvanometer mirror 46#1 and the stroke of movement of the irradiation area EA#2 by the galvanometer mirror 46#2. In this case, the condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2 may include condition parameters for at least one of the stroke of movement of the irradiation area EA#1 by the galvanometer mirror 46#1 and the stroke of movement of the irradiation area EA#2 by the galvanometer mirror 46#2. In other words, the condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2 may include at least one of the stroke of movement of the irradiation area EA#1 by the galvanometer mirror 46#1 and the stroke of movement of the irradiation area EA#2 by the galvanometer mirror 46#2. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to at least one of the movement stroke of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement stroke of the irradiation area EA#2 by the galvanometer mirror 46#2 (setting value of at least one of the movement stroke of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement stroke of the irradiation area EA#2 by the galvanometer mirror 46#2)" included in the processing conditions selected in step S12.

[0175] As described above, the processing conditions for at least one of the galvanometer mirrors 46#1 and 46#2 may include processing conditions for at least one of the movement pattern of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement pattern of the irradiation area EA#2 by the galvanometer mirror 46#2. In this case, the condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2 may include condition parameters for at least one of the movement pattern of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement pattern of the irradiation area EA#2 by the galvanometer mirror 46#2. In other words, the condition parameters for at least one of the galvanometer mirrors 46#1 and 46#2 may include at least one of the movement pattern of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement pattern of the irradiation area EA#2 by the galvanometer mirror 46#2. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter for at least one of the movement pattern of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement pattern of the irradiation area EA#2 by the galvanometer mirror 46#2 (setting value of at least one of the movement pattern of the irradiation area EA#1 by the galvanometer mirror 46#1 and the movement pattern of the irradiation area EA#2 by the galvanometer mirror 46#2)" included in the processing conditions selected in step S12.

[0176] As described above, the machining conditions may include machining conditions related to the head driving mechanism 23 included in the machining system SYS. In this case, the machining conditions may include, as condition parameters, condition parameters related to the head driving mechanism 23. The calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the head driving mechanism 23" included in the machining conditions selected in step S12.

[0177] As described above, the machining conditions related to the head driving mechanism 23 may include machining conditions related to changes in the relative positional relationships between the machining head 22 and the stage 31 and .... In this case, the condition parameters related to the head driving mechanism 23 may include condition parameters related to changes in the relative positional relationships between the head driving mechanism 23 between the head driving mechanism 23 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31.

[0178] As described above, the machining conditions related to the head driving mechanism 23 may include machining conditions related to the relative movement speed (head speed) between the machining head 22 and each of the stage 31 and the workpiece W by the head driving mechanism 23. In this case, the condition parameters related to the head driving mechanism 23 may include condition parameters related to the relative movement speed between the machining head 22 and each of the stage 31 and the workpiece W by the head driving mechanism 23. In other words, the condition parameters related to the head driving mechanism 23 may include the relative movement speed between the machining head 22 and each of the stage 31 and the workpiece W by the head driving mechanism 23. In this case, the calculation device 71 may control the display device 75 to display the "set value of the condition parameter related to the relative movement speed between the machining head 22 and each of the stage 31 and the workpiece W by the head driving mechanism 23 (set value of the relative movement speed between the machining head 22 and each of the stage 31 and the workpiece W by the head driving mechanism 23)" included in the machining conditions selected in step S12.

[0179] As described above, the processing conditions may include processing conditions related to the stage driving mechanism 32 included in the processing system SYS. In this case, the processing conditions may include, as condition parameters, condition parameters related to the stage driving mechanism 32. The calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the stage driving mechanism 32" included in the processing conditions selected in step S12.

[0180] As described above, the machining conditions for the stage driving mechanism 32 may include machining conditions related to changes in the relative positional relationships between the machining head 22 and the stage 31 and .... In this case, the condition parameters for the stage driving mechanism 32 may include condition parameters related to changes in the relative positional relationships between the stage driving mechanism 32 between the stage driving mechanism 32 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31 and between the machining head 22 and the stage 31.

[0181] As described above, the machining conditions for the stage driving mechanism 32 may include machining conditions related to the relative movement speed (stage speed) between the machining head 22 and each of the stage 31 and the workpiece W by the stage driving mechanism 32. In this case, the condition parameters for the stage driving mechanism 32 may include condition parameters related to the relative movement speed between the machining head 22 and each of the stage 31 and the workpiece W by the stage driving mechanism 32. In other words, the condition parameters for the stage driving mechanism 32 may include the relative movement speed between the machining head 22 and each of the stage 31 and the workpiece W by the stage driving mechanism 32. In this case, the calculation device 71 may control the display device 75 to display the "set value of the condition parameter related to the relative movement speed between the machining head 22 and each of the stage 31 and the workpiece W by the stage driving mechanism 32 (set value of the relative movement speed between the machining head 22 and each of the stage 31 and the workpiece W by the stage driving mechanism 32)" included in the machining conditions selected in step S12.

[0182] As described above, the processing conditions may include processing conditions related to the modeling material M. In this case, the processing conditions may include, as condition parameters, condition parameters related to the modeling material M. The calculation device 71 may control the display device 75 to display the “setting values ​​of the condition parameters related to the modeling material M” included in the processing conditions selected in step S12.

[0183] As described above, the processing conditions related to the modeling material M may include processing conditions related to the supply of the modeling material M. In this case, the processing conditions related to the modeling material M may include, as condition parameters, condition parameters related to the supply of the modeling material M. The calculation device 71 may control the display device 75 to display the “setting value of the condition parameter related to the supply of the modeling material M” included in the processing conditions selected in step S12.

[0184] As described above, the processing conditions related to the modeling material M may include processing conditions related to the supply amount of the modeling material M (the amount of modeling material M supplied from the material nozzle 64 per unit time, i.e., the material supply rate). In this case, the condition parameters related to the modeling material M may include condition parameters related to the supply amount of the modeling material M. In other words, the condition parameters related to the modeling material M may include the supply amount of the modeling material M. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the supply amount of the modeling material M (setting value of the supply amount of the modeling material M)" included in the processing conditions selected in step S12.

[0185] As described above, the processing conditions for the modeling material M may include processing conditions related to the positions of the material control points MCP where the modeling material M is densely concentrated. In this case, the condition parameters for the modeling material M may include condition parameters related to the positions of the material control points MCP. In other words, the condition parameters for the modeling material M may include the positions of the material control points MCP. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the positions of the material control points MCP (setting value of the positions of the material control points MCP)" included in the processing conditions selected in step S12.

[0186] As described above, the processing conditions related to the positions of the material control points MCP may include processing conditions related to the relative positional relationship between the position of the material control points MCP and at least one of the printing surface MS and the material irradiation surface ES in the traveling direction of the processing light EL (Z-axis direction). In this case, the condition parameters related to the printing material M may include, as the condition parameters related to the positions of the material control points MCP, condition parameters related to the relative positional relationship between the position of the material control points MCP and at least one of the printing surface MS and the material irradiation surface ES in the traveling direction of the processing light EL. In other words, the condition parameters related to the printing material M may include, as the condition parameters related to the positions of the material control points MCP, the relative positional relationship between the position of the material control points MCP and at least one of the printing surface MS and the material irradiation surface ES in the traveling direction of the processing light EL. In this case, the calculation device 71 may control the display device 75 to display the "setting value of the condition parameter regarding the relative positional relationship between at least one of the forming surface MS and the material irradiation surface ES in the direction of travel of the processing light EL and the position of the material control point MCP (setting value of the relative positional relationship between at least one of the forming surface MS and the material irradiation surface ES in the direction of travel of the processing light EL and the position of the material control point MCP)" included in the processing conditions selected in step S12.

[0187] As described above, the processing conditions may include processing conditions related to the structure layer SL to be formed. In this case, the processing conditions may include, as condition parameters, condition parameters related to the structure layer SL. The calculation device 71 may control the display device 75 to display the "setting values ​​of the condition parameters related to the structure layer SL" included in the processing conditions selected in step S12.

[0188] As described above, the processing conditions for the structural layer SL may include processing conditions for the thickness of the structural layer SL (the stacking pitch of the multiple structural layers SL). In this case, the processing conditions for the structural layer SL may include, as a condition parameter, a condition parameter for the thickness of the structural layer SL. The processing conditions for the structural layer SL may include, as a condition parameter, the thickness of the structural layer SL. The calculation device 71 may control the display device 75 to display the "setting value of the condition parameter for the thickness of the structural layer SL (setting value of the thickness of the structural layer SL)" included in the processing conditions selected in step S12.

[0189] As described above, the machining conditions may include machining conditions related to the machining unit area PUA. In this case, the machining conditions may include condition parameters related to the machining unit area PUA as condition parameters. The calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the machining unit area PUA" included in the machining conditions selected in step S12.

[0190] As described above, the machining conditions for the machining unit area PUA may include machining conditions related to the overlap rate of the machining unit area PUA. In this case, the machining conditions for the machining unit area PUA may include, as a condition parameter, a condition parameter related to the overlap rate of the machining unit area PUA. The machining conditions for the machining unit area PUA may include, as a condition parameter, the overlap rate of the machining unit area PUA. The calculation device 71 may control the display device 75 to display the "set value of the condition parameter related to the overlap rate of the machining unit area PUA (set value of the overlap rate)" included in the machining conditions selected in step S12.

[0191] As described above, the machining conditions for the machining unit area PUA may include machining conditions related to the bead width. In this case, the machining conditions for the machining unit area PUA may include a condition parameter related to the bead width as a condition parameter. The machining conditions for the machining unit area PUA may include the bead width as a condition parameter. The calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the bead width (setting value of the bead width)" included in the machining conditions selected in step S12.

[0192] As described above, the processing conditions may include processing conditions related to the purge gas. In this case, the processing conditions may include the condition parameters related to the purge gas as condition parameters. The calculation device 71 may control the display device 75 to display the "setting value of the condition parameter related to the purge gas" included in the processing conditions selected in step S12.

[0193] As described above, the processing conditions related to the purge gas may include processing conditions related to the supply of the purge gas. In this case, the processing conditions related to the purge gas may include, as condition parameters, condition parameters related to the supply of the purge gas. The calculation device 71 may control the display device 75 to display the "set value of the condition parameter related to the supply of the purge gas" included in the processing conditions selected in step S12.

[0194] As described above, the processing conditions related to the purge gas may include processing conditions related to the supply amount of the purge gas (the amount of purge gas supplied to the chamber space 63IN per unit time, i.e., gas flow rate). In this case, the condition parameters related to the purge gas may include condition parameters related to the supply amount of the purge gas. In other words, the condition parameters related to the purge gas may include the supply amount of the purge gas. In this case, the calculation device 71 may control the display device 75 to display the "set value of the condition parameter related to the supply amount of the purge gas (set value of the supply amount of the purge gas)" included in the processing conditions selected in step S12.

[0195] The set values ​​of the multiple types of condition parameters may be stored in the storage device 72 as already set machining conditions. In this case, the arithmetic device 71 may read (acquire) the set values ​​of the multiple types of condition parameters from the storage device 72. In other words, the set values ​​of the multiple types of condition parameters may be input to the arithmetic device 71 from the storage device 72. The arithmetic device 71 may control the display device 75 to display the read (acquired or input) set values.

[0196] To display the machining conditions, the arithmetic device 71 may control the display device 75 to display a condition display screen 93 (step S13). Specifically, the arithmetic device 71 may generate display control information for controlling the display device 75 to display the condition display screen 93. The arithmetic device 71 may output the generated display control information to the display device 75. As a result, the display device 75 may display the condition display screen 93.

[0197] The condition display screen 93 may be a display screen capable of displaying the machining conditions selected in step S12 (the machining conditions indicated by the condition selection information acquired in step S12). For example, the condition display screen 93 may be a display screen capable of displaying setting values ​​of a plurality of types of condition parameters corresponding to the machining conditions selected in step S12.

[0198] An example of the condition display screen 93 is shown in Fig. 12. As shown in Fig. 12, the condition display screen 93 may include a list display screen 930 that displays a list of setting values ​​of multiple types of condition parameters as numerical values. In the example shown in Figure 12, the list display screen 930 lists the setting values ​​of multiple types of condition parameters, including the setting value of a condition parameter related to the intensity of processing light EL#1, the setting value of a condition parameter related to the intensity of processing light EL#2, the setting value of a condition parameter related to the scanning speed of processing light EL#1, the setting value of a condition parameter related to the scanning speed of processing light EL#2, the setting value of a condition parameter related to the stage speed (the relative movement speed between the processing head 22 and the stage 31 and the workpiece W by the stage drive mechanism 32), the setting value of a condition parameter related to the layer pitch (the thickness of the structural layer SL), the setting value of a condition parameter related to the overlap rate of the processing unit area PUA, the setting value of a condition parameter related to the material supply rate (the amount of modeling material M supplied from the material nozzle 64 per unit time), and the setting value of a condition parameter related to the gas flow rate (the amount of purge gas supplied to the chamber space 63IN per unit time).

[0199] 12, the condition display screen 93 may include a quality display screen 931 capable of displaying information on the processing quality when the processing conditions displayed on the list display screen 930 (the processing conditions selected in step S12 of FIG. 8) are used. The information on the processing quality may be stored in the storage device 72 in association with information on the processing conditions (setting values ​​of multiple types of condition parameters). In this case, the arithmetic device 71 may read (acquire) the information on the processing quality from the storage device 72. In other words, the information on the processing quality may be input to the arithmetic device 71 from the storage device 72. The arithmetic device 71 may control the display device 75 to display the condition display screen 93 including the quality display screen 931 displaying the read (acquired or input) processing quality.

[0200] The information on the processing quality may be generated in advance by actually performing a modeling operation to form a modeled object using preset processing conditions. Specifically, the information on the processing quality may be generated in advance based on the results of an actually performed modeling operation. Alternatively, the information on the processing quality may be generated in advance by performing a simulation that simulates a modeling operation to form a modeled object using preset processing conditions, in addition to or instead of actually performing the modeling operation. Specifically, the information on the processing quality may be generated in advance based on the results of the simulation. In either case, the information on the processing quality is information that can be used to evaluate the processing conditions.

[0201] The information on the processing quality may be generated by the control unit 7. In this case, the information on the processing quality generated by the control unit 7 may be stored in the storage device 72. The information on the processing quality may be generated by an information generating device different from the control unit 7. In this case, the control unit 7 may acquire the information on the processing quality generated by the information generating device from the information generating device. The information on the processing quality acquired by the control unit 7 from the information generating device may be stored in the storage device 72.

[0202] As shown in Fig. 12, the processing quality may include processing accuracy. The processing accuracy may refer to a parameter capable of evaluating a processing error (dimensional error), which is the difference between the shape of an object formed using processing conditions and a target shape of the object. In the example shown in Fig. 12, the processing quality is classified into four quality levels, including "excellent," "good," "fair," and "poor." For example, if the processing error is below a first threshold, the processing quality is classified as “excellent”; if the processing error is above the first threshold and below a second threshold (however, the second threshold is greater than the first threshold), the processing quality is classified as “good”; if the processing error is above the second threshold and below a third threshold (however, the third threshold is greater than the second threshold), the processing quality is classified as “fair”; and if the processing error is above the third threshold, the processing quality is classified as “poor”; it should be noted that the “third threshold” may be set to a desired value that enables a distinction, from the processing error, between a state in which the processing error is so large that it cannot be recommended as a processing condition to be used for forming a molded object and a state in which the processing error is small enough that it can be recommended as a processing condition to be used for forming a molded object.

[0203] As shown in Fig. 12, the processing quality may include throughput. The throughput may refer to a parameter that can evaluate the time required to form an object using processing conditions. The throughput is expressed as the volume of an object that can be formed per unit time (per hour in the example shown in Fig. 12).

[0204] Although not shown in FIG. 12 for the sake of simplicity, the processing quality may include the build density. The build density may refer to the density of an object formed using the processing conditions. The density of the object depends on voids (e.g., keyholes or cavities) that occur inside the object. The fewer voids that occur inside the object, the better the processing quality. Therefore, the build density can be used as an example of processing quality.

[0205] Furthermore, the condition display screen 93 may include a coordinate point display screen 932 that displays, in a multidimensional coordinate system around the axes of at least two condition parameters, the set values ​​of at least some of the condition parameters included in the machining conditions selected in step S12. In other words, the condition display screen 93 may include a coordinate point display screen 932 that displays, in a multidimensional coordinate system around the axes of the second condition parameters, the set values ​​of at least some of the first condition parameters included in the machining conditions selected in step S12. Specifically, the coordinate point display screen 932 may display, in the multidimensional coordinate system, the set values ​​of the at least two condition parameters using coordinate points corresponding to the set values ​​of the at least two condition parameters. In the following description, the coordinate points corresponding to the set values ​​of at least two condition parameters included in the machining conditions not selected in step S12 will be referred to as "set coordinate points 9321."

[0206] As a multidimensional coordinate system, a three-dimensional coordinate system is used in which the intensities of the processing beams EL#1 and EL#2 are assigned to a first axis, the scanning speeds of the processing beams EL#1 and EL#2 are assigned to a second axis perpendicular to the first axis, and the stage speed is assigned to a third axis perpendicular to the first and second axes. In this case, the coordinate point display screen 932 displays set coordinate points 9321 that indicate the set values ​​of the intensities of the processing beams EL#1 and EL#2, the set values ​​of the scanning speeds of the processing beams EL#1 and EL#2, and the set values ​​of the stage speed within the three-dimensional coordinate system. In other words, the coordinate point display screen 932 displays set coordinate points 9321 that correspond to the set values ​​of the intensities of the processing beams EL#1 and EL#2, the set values ​​of the scanning speeds of the processing beams EL#1 and EL#2, and the set values ​​of the stage speed within the multidimensional coordinate system.

[0207] For the sake of convenience, the following description will be given assuming that the intensity of the processing light EL#1 and the intensity of the processing light EL#2 are the same, and that the scanning speed of the processing light EL#1 and the scanning speed of the processing light EL#2 are the same. However, the intensity of the processing light EL#1 and the intensities of the processing light EL#2 may be different. In this case, a multidimensional coordinate system including two axes to which the intensity of the processing light EL#1 and the intensities of the processing light EL#2 are assigned may be used. Similarly, the scanning speed of the processing light EL#1 and the scanning speed of the processing light EL#2 may be different. In this case, a multidimensional coordinate system including two axes to which the scanning speed of the processing light EL#1 and the scanning speed of the processing light EL#2 are assigned may be used.

[0208] Furthermore, for convenience of explanation, the following description will be directed to an example of a coordinate point display screen 932 that shows a set coordinate point 9321 corresponding to the set value of the intensity of the processing light EL, the set value of the scanning speed of the processing light EL, and the set value of the stage speed in a three-dimensional coordinate system including three axes to which the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed are respectively assigned, as shown in Fig. 12. However, as will be described later in a fourth modified example, the coordinate point display screen 932 may show a set coordinate point 9321 corresponding to the set value of another type of condition parameter other than the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed in a multidimensional coordinate system including axes to which other types of condition parameters other than the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed are assigned.

[0209] In addition to or instead of the set coordinate points 9321, the coordinate point display screen 932 may display a recommended condition range 9322, which indicates, within a multidimensional coordinate system, a range of processing conditions that are recommended to be used for printing the object. In the example shown in Fig. 12 , a three-dimensional coordinate system is used as the multidimensional coordinate system, and therefore the recommended condition range 9322 may indicate, within the three-dimensional coordinate system, a three-dimensional space that indicates a range of processing conditions that are recommended to be used for printing the object. More specifically, the recommended condition range 9322 may indicate, within the three-dimensional coordinate system, a three-dimensional space that indicates a range of setting values ​​for the intensity of the processing light EL that are recommended to be used for printing the object, a range of setting values ​​for the scanning speed of the processing light EL that are recommended to be used for printing the object, and a range of setting values ​​for the stage speed that are recommended to be used for printing the object.

[0210] The recommended condition range 9322 may be generated based on at least one of the processing quality when a modeling operation is performed using processing conditions included in the recommended condition range 9322 and the processing quality when a modeling operation is performed using processing conditions not included in the recommended condition range 9322 (outside the recommended condition range 9322). For example, the recommended condition range 9322 may be generated such that the processing quality when a modeling operation is performed using processing conditions included in the recommended condition range 9322 satisfies a predetermined quality standard. For example, the recommended condition range 9322 may be generated such that the processing quality when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is higher than the processing quality when a modeling operation is performed using processing conditions not included in the recommended condition range 9322. For example, the recommended condition range 9322 may be generated such that the probability that the processing quality when a modeling operation is performed using processing conditions included in the recommended condition range 9322 satisfies the predetermined quality standard is equal to or greater than a predetermined first probability threshold. For example, the recommended condition range 9322 may be generated so that the probability that the processing quality satisfies a predetermined quality standard when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is higher than the probability that the processing quality satisfies the predetermined quality standard when a modeling operation is performed using processing conditions that are not included in the recommended condition range 9322. In other words, the recommended condition range 9322 may be generated so that, when a modeling operation is performed using processing conditions included in the recommended condition range 9322, the processing quality does not necessarily satisfy the predetermined quality standard, but the processing quality satisfies the predetermined quality standard with a certain probability or higher.

[0211] Note that the state in which the processing quality satisfies the predetermined quality standard may include a state in which the processing accuracy, which is an example of processing quality, is not "unacceptable." The state in which the processing quality satisfies the predetermined quality standard may include a state in which the processing accuracy, which is an example of processing quality, is "excellent," "good," or "acceptable." The state in which the processing quality satisfies the predetermined quality standard may include a state in which the throughput, which is an example of processing quality, is equal to or greater than a predetermined throughput threshold. The state in which the processing quality satisfies the predetermined quality standard may include a state in which the modeling density, which is an example of processing quality, is equal to or greater than a predetermined modeling density threshold. The state in which the processing quality satisfies the predetermined quality standard may include a state in which the processing system SYS is able to model a model.

[0212] The recommended condition range 9322 may be generated based on at least one of the machining accuracy when a modeling operation is performed using processing conditions included in the recommended condition range 9322 and the machining accuracy when a modeling operation is performed using processing conditions not included in the recommended condition range 9322. For example, the recommended condition range 9322 may be generated such that the machining accuracy when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is “excellent,” “good,” or “fair.” For example, the recommended condition range 9322 may be generated such that the machining accuracy when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is higher than the machining accuracy when a modeling operation is performed using processing conditions not included in the recommended condition range 9322. For example, the recommended condition range 9322 may be generated such that the probability that the machining accuracy when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is “excellent,” “good,” or “fair” is equal to or greater than a predetermined second probability threshold. For example, the recommended condition range 9322 may be generated such that the probability that the machining accuracy will be “excellent,” “good,” or “passable” when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is higher than the probability that the machining accuracy will be “excellent,” “good,” or “passable” when a modeling operation is performed using processing conditions not included in the recommended condition range 9322. For example, the recommended condition range 9322 may be generated such that the probability that the machining accuracy will be “unacceptable” when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is equal to or lower than a predetermined third probability threshold. For example, the recommended condition range 9322 may be generated such that the probability that the machining accuracy will be “unacceptable” when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is lower than the probability that the machining accuracy will be “unacceptable” when a modeling operation is performed using processing conditions not included in the recommended condition range 9322. In other words, the recommended condition range 9322 may be generated so that when a molding operation is performed using processing conditions included in the recommended condition range 9322, the processing accuracy will not necessarily be ``excellent,'' ``good,'' or ``passable,'' but the processing accuracy will be ``excellent,'' ``good,'' or ``passable'' with a certain probability or higher.

[0213] The recommended condition range 9322 may be generated based on at least one of the throughput when a modeling operation is performed using processing conditions included in the recommended condition range 9322 and the throughput when a modeling operation is performed using processing conditions not included in the recommended condition range 9322. For example, the recommended condition range 9322 may be generated such that the throughput when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is equal to or greater than a predetermined throughput threshold. For example, the recommended condition range 9322 may be generated such that the throughput when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is higher than the throughput when a modeling operation is performed using processing conditions not included in the recommended condition range 9322. For example, the recommended condition range 9322 may be generated such that the probability that the throughput when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is equal to or greater than a predetermined fourth probability threshold is equal to or greater than a predetermined fourth probability threshold. For example, the recommended condition range 9322 may be generated so that the probability that the throughput will be equal to or greater than the predetermined throughput threshold when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is higher than the probability that the throughput will be equal to or greater than the predetermined throughput threshold when a modeling operation is performed using processing conditions that are not included in the recommended condition range 9322. In other words, the recommended condition range 9322 may be generated so that, when a modeling operation is performed using processing conditions included in the recommended condition range 9322, the throughput will not necessarily be equal to or greater than the predetermined throughput threshold, but the throughput will be equal to or greater than the predetermined throughput threshold with a certain probability or higher.

[0214] The recommended condition range 9322 may be generated based on at least one of the build density when a printing operation is performed using processing conditions included in the recommended condition range 9322 and the build density when a printing operation is performed using processing conditions not included in the recommended condition range 9322. For example, the recommended condition range 9322 may be generated such that the build density when a printing operation is performed using processing conditions included in the recommended condition range 9322 is equal to or greater than a predetermined build density threshold. For example, the recommended condition range 9322 may be generated such that the build density when a printing operation is performed using processing conditions included in the recommended condition range 9322 is higher than the build density when a printing operation is performed using processing conditions not included in the recommended condition range 9322. For example, the recommended condition range 9322 may be generated such that the probability that the build density when a printing operation is performed using processing conditions included in the recommended condition range 9322 is equal to or greater than a predetermined fifth probability threshold. For example, the recommended condition range 9322 may be generated so that the probability that the build density will be equal to or greater than the predetermined build density threshold when a modeling operation is performed using processing conditions included in the recommended condition range 9322 is higher than the probability that the build density will be equal to or greater than the predetermined build density threshold when a modeling operation is performed using processing conditions that are not included in the recommended condition range 9322. In other words, the recommended condition range 9322 may be generated so that, when a modeling operation is performed using processing conditions included in the recommended condition range 9322, the build density will not necessarily be equal to or greater than the predetermined build density threshold, but the build density will be equal to or greater than the predetermined build density threshold with a certain probability or higher.

[0215] The recommended condition range 9322 may be generated in advance based on the results of an actual modeling operation in which a modeling object is formed using desired processing conditions. For example, if the actual modeling operation in which a modeling object is formed using desired processing conditions results in processing quality that satisfies a predetermined quality standard, the recommended condition range 9322 may be generated such that the desired processing conditions are included in the recommended condition range 9322 (the desired processing conditions are used as recommended processing conditions). On the other hand, if the actual modeling operation in which a modeling object is formed using desired processing conditions results in processing quality that does not satisfy the predetermined quality standard, the recommended condition range 9322 may be generated such that the desired processing conditions are not included in the recommended condition range 9322 (the desired processing conditions are not used as recommended processing conditions).

[0216] The recommended condition range 9322 may be generated in advance based on the results of a simulation of a modeling operation for modeling a model using desired processing conditions. For example, if the simulation of a modeling operation for modeling a model using desired processing conditions estimates that the processing quality satisfies a predetermined quality standard, the recommended condition range 9322 may be generated such that the desired processing conditions are included in the recommended condition range 9322 (the desired processing conditions are used as recommended processing conditions). On the other hand, if the simulation of a modeling operation for modeling a model using desired processing conditions estimates that the processing quality does not satisfy a predetermined quality standard, the recommended condition range 9322 may be generated such that the desired processing conditions are not included in the recommended condition range 9322 (the desired processing conditions are not used as recommended processing conditions).

[0217] The recommended condition range 9322 may be generated by the control unit 7. In this case, information related to the recommended condition range 9322 generated by the control unit 7 may be stored in the storage device 72. The recommended condition range 9322 may be generated by an information generating device different from the control unit 7. In this case, the control unit 7 may acquire information related to the recommended condition range 9322 generated by the information generating device from the information generating device. Information related to the recommended condition range 9322 acquired by the control unit 7 from the information generating device may be stored in the storage device 72.

[0218] The recommended condition range 9322 may be set based on at least three machining conditions whose machining quality satisfies a predetermined quality standard. For example, at least three coordinate points indicating at least three machining conditions whose machining quality satisfies a predetermined quality standard may be plotted in the above-described multidimensional coordinate system, and the range enclosed by lines connecting the plotted at least three coordinate points may be set as the recommended condition range 9322. In this case, at least three coordinate points may be selected so that the recommended condition range 9322 is as large as possible.

[0219] In order to identify at least three processing conditions whose processing quality satisfies a predetermined quality standard, at least one of the above-described modeling operations and simulations may be repeated while changing the processing conditions. In particular, at least one of the above-described modeling operations and simulations may be repeated while changing the condition parameters assigned to the axes of the multidimensional coordinate system shown on the coordinate point display screen 932. In the example shown in FIG. 12 , the coordinate point display screen 932 displays the set coordinate point 9321 in a three-dimensional coordinate system including three axes to which the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed are respectively assigned. Therefore, at least one of the above-described modeling operations and simulations may be repeated while changing at least one of the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed. As a result, at least three coordinate points each representing at least three processing conditions are plotted in the three-dimensional coordinate system including three axes to which the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed are respectively assigned.

[0220] On the other hand, in order to identify at least three processing conditions whose processing quality satisfies a predetermined quality standard, at least one of the above-described modeling operations and simulations may be repeated while fixing condition parameters that are not assigned to axes of the multidimensional coordinate system shown on the coordinate point display screen 932. At least one of the above-described modeling operations and simulations may be repeated while fixing condition parameters other than at least one of the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed. As a result, a recommended condition range 9322 may be generated, which indicates a range of values ​​recommended for the setting values ​​of the condition parameters assigned to the axes of the multidimensional coordinate system when the condition parameters not assigned to the axes of the multidimensional coordinate system are set to specific setting values. For example, if at least one of the above-described modeling operations and simulations is repeated while fixing the material supply rate at a certain rate, a recommended condition range 9322 may be generated, which indicates a range of values ​​recommended for the setting values ​​of at least one of the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed when the material supply rate is set to a certain rate.

[0221] However, at least one of the above-described modeling operations and simulations may be repeated while changing a condition parameter not assigned to an axis of the multidimensional coordinate system shown on the coordinate point display screen 932. The above-described modeling operations and simulations may be repeated while changing a condition parameter other than at least one of the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed. As a result, a recommended condition range 9322 indicating a range of values ​​recommended as the setting value of the condition parameter assigned to an axis of the multidimensional coordinate system may be generated for each setting value of the condition parameter not assigned to an axis of the multidimensional coordinate system. For example, at least one of the above-described modeling operations and simulations may be repeated while changing the material supply rate between one rate and another rate. More specifically, at least one of the above-described modeling operations and simulations may be repeated while keeping the material supply rate fixed at one rate, then the material supply rate may be changed from one rate to another rate, and then at least one of the above-described modeling operations and simulations may be repeated while keeping the material supply rate fixed at the other rate. As a result, a recommended condition range 9322 indicating a range of values ​​recommended as setting values ​​for at least one of the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed when the material supply rate is set to one rate, and a recommended condition range 9322 indicating a range of values ​​recommended as setting values ​​for at least one of the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed when the material supply rate is set to another rate may be generated separately.

[0222] The generated information on the recommended condition range 9322 may be stored in the storage device 72. In this case, the calculation device 71 may read (acquire) information on the recommended condition range 9322 corresponding to the machining conditions selected in step S12 (the machining conditions indicated by the condition selection information acquired in step S12) from the storage device 72. In other words, the calculation device 71 may receive input of information on the recommended condition range 9322 from the storage device 72. The calculation device 71 may control the display device 75 to display a condition display screen 93 including a coordinate point display screen 932 that displays the recommended condition range 9322 indicated by the read (acquired or input) information.

[0223] The recommended condition range 9322 may be generated for each type of building material M. For example, one recommended condition range 9322 indicating a range of processing conditions recommended for use in forming a model using one type of building material M may be generated separately from another recommended condition range 9322 indicating a range of processing conditions recommended for use in forming a model using another type of building material M different from the one type of building material M. In this case, the arithmetic unit 71 may read (acquire) from the storage unit 72 information related to the recommended condition range 9322 corresponding to the building material M indicated in the material selection information acquired in step S11 (the building material M selected by the user in step S11).

[0224] The coordinate point display screen 932 may display machining conditions that are stored in the storage device 72 but not selected in step S12, in addition to or instead of at least one of the set coordinate point 9321 and the recommended condition range 9322. For example, the coordinate point display screen 932 may display coordinate points corresponding to the setting values ​​of at least two condition parameters that are at least a part of the multiple types of condition parameters included in the machining conditions that are stored in the storage device 72 but not selected in step S12, in addition to or instead of at least one of the set coordinate point 9321 and the recommended condition range 9322. In the following description, coordinate points corresponding to the setting values ​​of at least two condition parameters included in the machining conditions that are stored in the storage device 72 but not selected in step S12 will be referred to as "non-selected coordinate points 9323."

[0225] The coordinate point display screen 932 may display a single non-selected coordinate point 9323. Alternatively, the coordinate point display screen 932 may display a plurality of non-selected coordinate points 9323 each indicating a plurality of different machining conditions. Furthermore, the machining conditions indicated by the non-selected coordinate point 9323 are different from the machining conditions indicated by the set coordinate point 9321. For this reason, the coordinate point display screen 932 may display the set coordinate point 9321 and the non-selected coordinate point 9323 as a plurality of coordinate points each indicating a plurality of different machining conditions within a multidimensional coordinate system.

[0226] When a non-selected coordinate point 9323 is displayed on the coordinate point display screen 932, the user may change (update or newly select) the machining conditions displayed on the condition display screen 93 by selecting the non-selected coordinate point 9323. In this case, the arithmetic unit 71 may control the display device 75 to display the condition display screen 93 displaying the machining conditions corresponding to the non-selected coordinate point 9323 selected by the user. That is, the arithmetic unit 71 may control the display device 75 to display the condition display screen 93 displaying the machining conditions corresponding to the non-selected coordinate point 9323 selected by the user, instead of the condition display screen 93 displaying the machining conditions selected in step S12 (the machining conditions indicated by the condition selection information acquired in step S12). For example, the arithmetic unit 71 may control the display device 75 to display the condition display screen 93 including the coordinate point display screen 932 displaying the non-selected coordinate point 9323 selected by the user as a new set coordinate point 9321. That is, the arithmetic device 71 may control the display device 75 to display a condition display screen 93 including a coordinate point display screen 932 that displays a non-selected coordinate point 9323 selected by the user as a new set coordinate point 9321, instead of the condition display screen 93 including a coordinate point display screen 932 that displays a previous set coordinate point 9321 corresponding to the machining condition selected in step S12. For example, the arithmetic device 71 may control the display device 75 to display a condition display screen 93 including a list display screen 930 that numerically displays the set values ​​of multiple types of condition parameters included in the machining condition corresponding to the non-selected coordinate point 9323 selected by the user. That is, the arithmetic device 71 may control the display device 75 to display a condition display screen 93 including a list display screen 930 that numerically displays the set values ​​of multiple types of condition parameters included in the machining condition corresponding to the non-selected coordinate point 9323 selected by the user, instead of the condition display screen 93 including the list display screen 930 that numerically displays the set values ​​of multiple types of condition parameters included in the machining condition selected in step S12. In other words, the calculation device 71 may control the display device 75 to update the condition display screen 93 based on the selection result of the non-selected coordinate point 9323 by the user.In this case, the arithmetic device 71 does not need to display the condition selection screen 92 shown in Fig. 10 in order to reselect the machining conditions (acquire new condition selection information). In other words, the arithmetic device 71 does not need to perform the process of step S12 in Fig. 8 again.

[0227] As described above, when information on processing conditions is associated with information on processing quality, the coordinate point display screen 932 may display recommended coordinate points 9324 corresponding to processing conditions whose processing quality satisfies a predetermined quality standard as non-selected coordinate points 9323. In addition to or instead of the recommended coordinate points 9324, the coordinate point display screen 932 may display non-recommended coordinate points 9325 corresponding to processing conditions whose processing quality does not satisfy a predetermined quality standard as the non-selected coordinate points 9323.

[0228] The coordinate point display screen 932 may display non-selected coordinate points 9323 included in the recommended condition range 9322 as recommended coordinate points 9324. However, in some cases, the coordinate point display screen 932 may display non-selected coordinate points 9323 not included in the recommended condition range 9322 as recommended coordinate points 9324. The coordinate point display screen 932 may display non-selected coordinate points 9323 not included in the recommended condition range 9322 as non-recommended coordinate points 9325. However, in some cases, the coordinate point display screen 932 may display non-selected coordinate points 9323 included in the recommended condition range 9322 as non-recommended coordinate points 9325. In either case, the number of recommended coordinate points 9324 included in the recommended condition range 9322 may be greater than the number of non-recommended coordinate points 9325 included in the recommended condition range 9322. The number of recommended coordinate points 9324 that are not included in the recommended condition range 9322 may be less than the number of non-recommended coordinate points 9325 that are not included in the recommended condition range 9322 .

[0229] The coordinate point display screen 932 may display the recommended coordinate points 9324 and the non-recommended coordinate points 9325 so that the display manner of the recommended coordinate points 9324 and the non-recommended coordinate points 9325 differs from that of the non-recommended coordinate points 9325. The display manner may include, for example, at least one of the shape of the coordinate points, the display pattern of the coordinate points, the display color, and the brightness. In this case, the coordinate point display screen 932 essentially displays the non-selected coordinate points 9323 (in this case, the recommended coordinate points 9324 and the non-recommended coordinate points 9325) in a display manner that allows the user to recognize the processing quality when a model is formed using the processing conditions indicated by the non-selected coordinate points 9323 (evaluation of the model formed using the processing conditions indicated by the non-selected coordinate points 9323). As a result, the user can appropriately distinguish between the recommended coordinate points 9324 and the non-recommended coordinate points 9325.

[0230] 12 , the condition display screen 93 may include, in addition to the coordinate point display screen 932, a coordinate point display screen 933 that displays, in a multidimensional coordinate system with axes of at least two condition parameters, the setting values ​​of which are included in the machining conditions selected in step S12 but whose setting values ​​are not displayed on the coordinate point display screen 932. The coordinate point display screen 933 differs from the coordinate point display screen 932 in that the condition parameters whose setting values ​​are displayed are different. Other features of the coordinate point display screen 933 may be the same as other features of the coordinate point display screen 932. For this reason, the above-mentioned description of the coordinate point display screen 932 can be used as a description of the coordinate point display screen 933 by replacing the terms "set coordinate point 9321," "recommended condition range 9322," "non-selected coordinate point 9323," "recommended coordinate point 9324," and "non-recommended coordinate point 9325" with "set coordinate point 9331," "recommended condition range 9332," "non-selected coordinate point 9333," "recommended coordinate point 9334," and "non-recommended coordinate point 9335," respectively. For this reason, a detailed description of the coordinate point display screen 933 will be omitted.

[0231] 12 , a two-dimensional coordinate system in which the layer pitch is assigned to a first axis and the bead width is assigned to a second axis perpendicular to the first axis is used as the multidimensional coordinate system on the coordinate point display screen 933. In this case, set coordinate points 9331 indicating the set values ​​of the layer pitch and the bead width within the two-dimensional coordinate system are displayed on the coordinate point display screen 933. Furthermore, the coordinate point display screen 933 may display, as a recommended condition range 9332, a two-dimensional region indicating, within the two-dimensional coordinate system, the range of set values ​​of the layer pitch recommended to be used for forming the object and the range of set values ​​of the bead width recommended to be used for forming the object.

[0232] Furthermore, the condition display screen 93 may include a quality display screen 934 that displays information related to processing quality in a multidimensional coordinate system including axes to which the processing quality is assigned. Specifically, the quality display screen 934 may display the processing quality using coordinate points 9341 corresponding to the processing quality in the multidimensional coordinate system. As the multidimensional coordinate system, a two-dimensional coordinate system is used in which processing accuracy is assigned to a first axis and throughput is assigned to a second axis orthogonal to the first axis. In this case, the quality display screen 934 displays coordinate points 9341 that indicate processing accuracy and throughput in the two-dimensional coordinate system.

[0233] The quality display screen 934 may display a recommended condition range 9342 that corresponds to the above-described recommended condition range 9322. The recommended condition range 9342 may indicate a range that includes the processing quality when an object is formed using processing conditions included in the above-described recommended condition range 9322.

[0234] Furthermore, the condition display screen 93 may include buttons 935 that the user can select to display the material properties of the object to be formed using the processing conditions selected in step S12. The condition display screen 93 includes a button 935 that the user can select to display the tensile strength of the object, a button 935 that the user can select to display the hardness of the object, a button 935 that the user can select to display the metal fatigue degree of the object, and a button 935 that the user can select to display the creep of the object.

[0235] When the user selects button 935, the computing device 71 may control the display device 75 to display a material property display screen 94 for displaying the material property corresponding to the button 935 selected by the user. Specifically, the computing device 71 may generate display control information for controlling the display device 75 to display the material property display screen 94. The computing device 71 may output the generated display control information to the display device 75. As a result, the display device 75 may display the material property display screen 94. An example of the material property display screen 94 is shown in FIG. 13. FIG. 13 shows the material property display screen 94 that displays tensile strength, which is an example of a material property.

[0236] Similar to the information on processing quality, the information on material properties may be generated in advance by actually performing a modeling operation to form a model using preset processing conditions. Similar to the information on processing quality, the information on material properties may be generated in advance by performing a simulation that imitates a modeling operation to form a model using preset processing conditions.

[0237] The information on material properties may be generated by the control unit 7. In this case, the information on material properties generated by the control unit 7 may be stored in the storage device 72. The information on material properties may be generated by an information generating device different from the control unit 7. In this case, the control unit 7 may acquire the information on material properties generated by the information generating device from the information generating device. The information on material properties acquired by the control unit 7 from the information generating device may be stored in the storage device 72.

[0238] The information on the material properties may be stored in the storage device 72 in association with information on the processing conditions (setting values ​​of multiple types of condition parameters). In this case, the calculation device 71 may read (acquire) the information on the material properties from the storage device 72. In other words, the information on the material properties may be input to the calculation device 71 from the storage device 72. The calculation device 71 may control the display device 75 to display the read (acquired or input) material properties.

[0239] (2-3) Condition Setting Operation As described above, the user may set the processing conditions. In the present embodiment, the user may set the processing conditions via the condition display screen 93. Specifically, the user may set new processing conditions by customizing the processing conditions displayed on the condition display screen 93 using the input device 74. More specifically, the user may set new processing conditions in which the setting value of at least one condition parameter has been changed by the user by using the input device 74 to change (update or input) the setting value of at least one condition parameter included in the processing conditions displayed on the condition display screen 93. In this case, the user can set the processing conditions relatively easily and in a short time compared to when the user sets the processing conditions from scratch.

[0240] In this case, the arithmetic device 71 may acquire information regarding the user's operation (input content) on the condition display screen 93 via the input device 74 as information indicating the setting value of at least one condition parameter changed by the user. That is, information indicating the setting value of at least one condition parameter changed by the user may be input to the arithmetic device 71. The arithmetic device 71 may then generate new machining conditions in which the setting value of at least one condition parameter has been changed by the user and store the generated machining conditions in the storage device 72 as machining conditions newly set by the user. Alternatively, the arithmetic device 71 may overwrite existing machining conditions stored in the storage device 72 with new machining conditions in which the setting value of at least one condition parameter has been changed by the user. The arithmetic device 71 may overwrite, in the storage device 72, the machining conditions before customization by the user with the machining conditions customized by the user.

[0241] As shown in FIG. 14 , the user may customize the machining conditions via a list display screen 930 included in the condition display screen 93. For example, in the list display screen 930, a user-editable text box may be used as a display object for displaying the setting values ​​of the condition parameters. In this case, the user may change the setting values ​​of the condition parameters displayed in the text box using the input device 74. In this case, the arithmetic unit 71 may acquire information regarding the setting values ​​of the condition parameters changed by the user as information indicating the setting values ​​of the condition parameters. Thereafter, the arithmetic unit 71 may generate new machining conditions in which the setting values ​​of at least one condition parameter have been changed by the user based on the acquired information. In this case, the user can directly specify the setting values ​​of the condition parameters.

[0242] As shown in FIG. 15 , the user may customize machining conditions via a coordinate point display screen 932 included in the condition display screen 93. For example, the user may use the input device 74 to move a set coordinate point 9321 displayed in the coordinate point display screen 932 within a multidimensional coordinate system. That is, the user may use the input device 74 to change the position of the set coordinate point 9321 displayed in the coordinate point display screen 932 within the multidimensional coordinate system. Because the set coordinate point 9321 indicates the setting values ​​of at least two condition parameters, an input to move the set coordinate point 9321 is equivalent to an input to change the setting values ​​of at least two condition parameters. In this case, the calculation device 71 may acquire information regarding the position of the set coordinate point 9321 moved by the user as information indicating the setting values ​​of the condition parameters. Then, the calculation device 71 may generate new machining conditions in which the setting values ​​of at least one condition parameter have been changed by the user by calculating the setting values ​​of the condition parameters corresponding to the moved set coordinate point 9321 based on the acquired information. In this case, the user can intuitively specify the setting values ​​of the condition parameters.

[0243] As shown in FIG. 16 , in addition to or instead of moving the set coordinate point 9321 using the input device 74, the user may directly specify the position of the set coordinate point 9321 within the multidimensional coordinate system. That is, the user may directly specify a desired position within the multidimensional coordinate system as the position of the set coordinate point 9321 using the input device 74. In other words, the user may directly place the set coordinate point 9321 within the multidimensional coordinate system using the input device 74. In this case, too, the input specifying the position of the set coordinate point 9321 (the input placing the set coordinate point 9321) is equivalent to the input changing the setting values ​​of at least two condition parameters. In this case, the calculation device 71 may acquire information about the position of the set coordinate point 9321 designated by the user (the position where the user places the set coordinate point 9321) as information indicating the setting values ​​of the condition parameters. Then, the calculation device 71 may generate new machining conditions in which the setting values ​​of at least one condition parameter have been changed by the user by calculating the setting values ​​of the condition parameters corresponding to the position of the set coordinate point 9321 designated by the user based on the acquired information. In this case, too, the user can intuitively specify the setting values ​​of the condition parameters.

[0244] 14 to 16 , when the user changes the setting value of a condition parameter, the arithmetic device 71 may control the display device 75 so that the setting value of the condition parameter changed by the user is displayed on the list display screen 930. In other words, the arithmetic device 71 may control the display device 75 so that the list display screen 930 is updated based on the setting value of the condition parameter changed by the user.

[0245] When the user changes the setting value of a condition parameter, as shown in FIGS. 14 to 16 , the arithmetic device 71 may control the display device 75 so that a set coordinate point 9321 indicating the setting value of the condition parameter changed by the user is displayed on the coordinate point display screen 932. That is, the arithmetic device 71 may control the display device 75 so that the set coordinate point 9321 (the coordinate point display screen 932) is updated based on the setting value of the condition parameter changed by the user. In this case, the user can intuitively recognize whether the processing conditions changed by the user are included in the recommended condition range 9322 based on the positional relationship between the updated set coordinate point 9321 and the recommended condition range 9322. This allows the user to relatively easily change (set) the processing conditions so that the processing conditions changed by the user are included in the recommended condition range 9322. In other words, the user can relatively easily change (set) the processing conditions so that the processing conditions changed by the user become the processing conditions recommended for use in forming a model.

[0246] Detailed explanation will be omitted to avoid duplication, but similar to the coordinate point display screen 932, the calculation device 71 may control the display device 75 to update the coordinate point display screen 933 based on the setting value of the condition parameter changed by the user.

[0247] 14 to 16 show an example in which the user changes the setting values ​​of the condition parameters (intensity of the processing light EL, scanning speed of the processing light EL, and stage speed) assigned to the axes of the multidimensional coordinate system on the coordinate point display screen 932. However, as shown in Fig. 17, the user may change the setting values ​​of condition parameters that are not assigned to the axes of the multidimensional coordinate system on the coordinate point display screen 932. For example, Fig. 17 shows an example in which the user changes the setting value of the material supply rate via the list display screen 930.

[0248] As shown in FIG. 17 , the condition display screen 93 may include a button 936 that the user can select to set the set value of the material feed rate to a predetermined fixed value. In the example shown in FIG. 17 , the condition display screen 93 includes a button 936 that the user can select to set the set value of the material feed rate to 5 g / min, a button 936 that the user can select to set the set value of the material feed rate to 10 g / min, and a button 936 that the user can select to set the set value of the material feed rate to 15 g / min. In this case, the user can easily set the set value of the material feed rate by selecting the button 936. Note that the condition display screen 93 may also include a button 936 that the user can select to set the set value of a condition parameter other than the material feed rate to a predetermined value.

[0249] In this way, when the setting value of a condition parameter that is not assigned to an axis of the multidimensional coordinate system on the coordinate point display screen 932 is changed, the arithmetic device 71 does not need to update the set coordinate point 9321 based on the setting value of the condition parameter changed by the user. Specifically, even when the setting value of a condition parameter that is not assigned to an axis of the multidimensional coordinate system on the coordinate point display screen 932 is changed, if the setting value of a condition parameter that is assigned to an axis of the multidimensional coordinate system is not changed, the arithmetic device 71 does not need to update the set coordinate point 9321 based on the setting value of the condition parameter changed by the user.

[0250] When the setting value of a condition parameter not assigned to an axis of the multidimensional coordinate system on the coordinate point display screen 932 is changed, the arithmetic unit 71 may control the display device 75 to update the recommended condition range 9322 displayed on the coordinate point display screen 932 based on the setting value of the condition parameter changed by the user, as shown in FIG. 17 . Specifically, as described above, the recommended condition range 9322 may indicate a range of values ​​recommended as the setting value of the condition parameter assigned to an axis of the multidimensional coordinate system when the condition parameter not assigned to an axis of the multidimensional coordinate system is set to a specific setting value. In the following description, for convenience of explanation, an example will be described in which the material supply rate is used as the condition parameter not assigned to an axis of the multidimensional coordinate system. That is, in the following description, for convenience of explanation, an example will be described in which the recommended condition range 9322 indicates the range of values ​​recommended as the setting values ​​of the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed when the material supply rate is set to a specific setting value. In this case, as described above, a first recommended condition range 9322 indicating a range of values ​​recommended for at least one of the setting values ​​of the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed when the material supply rate is set to one rate, and another recommended condition range 9322 indicating a range of values ​​recommended for at least one of the setting values ​​of the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed when the material supply rate is set to another rate, may be generated separately. In this case, when the user changes the material supply rate from one rate to another rate, the calculation device 71 may control the display device 75 to change the recommended condition range 9322 displayed on the coordinate point display screen 932 from the first recommended condition range 9322 corresponding to the first rate before the change to the second recommended condition range 9322 corresponding to the second rate after the change.

[0251] For the same reason, when the setting value of a condition parameter that is not assigned to an axis of the multidimensional coordinate system on the coordinate point display screen 932 is changed, the calculation device 71 may control the display device 75 to update the recommended condition range 9332 displayed on the coordinate point display screen 933 based on the setting value of the condition parameter changed by the user, as shown in Fig. 17. Similarly, the calculation device 71 may control the display device 75 to update the recommended condition range 9342 displayed on the quality display screen 934 based on the setting value of the condition parameter changed by the user, as shown in Fig. 17.

[0252] 18 , when the user changes the setting values ​​of the condition parameters, the arithmetic device 71 may automatically change (update or customize) the setting values ​​of the condition parameters that the user has not changed based on the setting values ​​of the condition parameters that the user has changed. For example, when the user changes at least one setting value of the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed, the arithmetic device 71 may automatically change at least one other setting value of the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed based on the setting values ​​of the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed that the user has changed. For example, when the user changes at least one setting value of the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed, the arithmetic device 71 may automatically change the setting values ​​of the condition parameters other than the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed based on the setting values ​​of the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed that the user has changed. For example, if the user changes the setting values ​​of condition parameters other than the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed, the arithmetic device 71 may automatically change at least one of the setting values ​​of the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed, which have not been changed by the user, based on the setting values ​​of the condition parameters other than the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed, which have been changed by the user. For example, if the user changes the setting value of a type of condition parameter other than the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed, the arithmetic device 71 may automatically change the setting value of another type of condition parameter other than the intensity of the processed light EL, the scanning speed of the processed light EL, and the stage speed, and which is different from the one type of condition parameter, based on the setting value of the one type of condition parameter changed by the user. Figure 18 shows an example in which, when the user changes the setting value of the intensity of the processed light EL, the arithmetic device 71 automatically changes the setting value of the stage speed, which has not been changed by the user, based on the setting value of the intensity of the processed light EL changed by the user.

[0253] In this case, the arithmetic device 71 may automatically change the setting values ​​of the condition parameters that the user has not changed, based on the setting values ​​of the condition parameters that the user has changed, so that the set coordinate point 9321 is located within the recommended condition range 9322. The arithmetic device 71 may automatically change the setting values ​​of the condition parameters that the user has not changed, based on the setting values ​​of the condition parameters that the user has changed, so that the set coordinate point 9321 approaches the center of the recommended condition range 9322. The center of the recommended condition range 9322 may mean the center of gravity of the recommended condition range 9322.

[0254] Even when the arithmetic device 71 automatically changes the setting value of at least one condition parameter, the arithmetic device 71 may control the display device 75 to update the condition display screen 93, just as when a user automatically changes the setting value of at least one condition parameter. For example, the arithmetic device 71 may control the display device 75 so that the setting value of the condition parameter changed by the arithmetic device 71 is displayed on the list display screen 930. For example, the arithmetic device 71 may control the display device 75 so that a setting coordinate point 9321 indicating the setting value of the condition parameter changed by the arithmetic device 71 is displayed on the coordinate point display screen 932. For example, the arithmetic device 71 may control the display device 75 to update the coordinate point display screen 933 based on the setting value of the condition parameter changed by the arithmetic device 71.

[0255] When the user changes the setting values ​​of the condition parameters, and as a result the new processing conditions in which the setting value of at least one of the condition parameters has been changed by the user fall outside the recommended condition range 9322, the arithmetic device 71 may notify the user that the processing conditions changed by the user fall outside the recommended condition range 9322. In other words, the arithmetic device 71 may notify the user that the processing conditions changed by the user are not processing conditions that are recommended to be used for forming a model.

[0256] 19 , the arithmetic unit 71 may control the display device 75 to display a display object 937 on the condition display screen 93 to notify the user that the machining conditions changed by the user are outside the recommended condition range 9322. As another example, as shown in FIG. 20 , the arithmetic unit 71 may control the display device 75 so that the display mode of the set coordinate point 9321 on the coordinate point display screen 932 (see FIG. 19 ) when the machining conditions changed by the user are outside the recommended condition range 9322 is different from the display mode of the set coordinate point 9321 (see FIG. 14 ) when the machining conditions changed by the user are within the recommended condition range 9322. The display mode may include at least one of the shape of the coordinate point, the display pattern of the coordinate point, the display color, and the brightness.

[0257] 19 , the arithmetic unit 71 may control the output device 73, which can function as a speaker, to output (emit) a sound (alarm sound) to notify the user that the machining conditions changed by the user are outside the recommended condition range 9322. Specifically, the arithmetic unit 71 may generate a control signal to control the speaker to output an alarm sound to notify the user that the machining conditions changed by the user are outside the recommended condition range 9322. The arithmetic unit 71 may output the generated control signal to the output device 73 via the data bus 76. The output device 73 may output the alarm sound based on the control signal generated by the arithmetic unit 71.

[0258] If the machining conditions changed by the user fall outside the recommended condition range 9322 , the user may change the machining conditions again so that the machining conditions are within the recommended condition range 9322 .

[0259] Alternatively, if the machining conditions changed by the user fall outside the recommended condition range 9322, in addition to or instead of the user changing the machining conditions again, the arithmetic device 71 may automatically change the machining conditions so that the machining conditions fall within the recommended condition range 9322. In this case, the arithmetic device 71 may automatically change the setting values ​​of condition parameters that have not been changed by the user so that the machining conditions fall within the recommended condition range 9322, without changing the setting values ​​of condition parameters that have been changed by the user. In this case, the setting values ​​of condition parameters that have been changed by the user are included in the machining conditions that the arithmetic device 71 automatically changed. In other words, the machining conditions automatically changed by the arithmetic device 71 reflect the wishes of the user who changed the setting values ​​of the condition parameters. However, the arithmetic device 71 may also automatically change the setting values ​​of condition parameters that have been changed by the user. Alternatively, in addition to or instead of automatically changing the setting values ​​of condition parameters that have been changed by the user, the arithmetic device 71 may automatically change the setting values ​​of condition parameters that have not been changed by the user and that are not assigned to axes of the multidimensional coordinate system on the coordinate point display screen 932. 19 and 20 , the arithmetic device 71 may automatically change the setting values ​​of condition parameters that have not been changed by the user and that are different from the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed. As described above, when the setting values ​​of condition parameters that are not assigned to the axes of the multidimensional coordinate system of the coordinate point display screen 932 are changed, the recommended condition range 9322 may be changed (updated). In this case, the arithmetic device 71 may change the recommended condition range 9322 by changing the setting values ​​of condition parameters that are not assigned to the axes of the multidimensional coordinate system of the coordinate point display screen 932 so that the processing conditions are located within the changed recommended condition range 9322.

[0260] When the user changes the setting values ​​of the condition parameters (when the user changes the processing conditions), the arithmetic device 71 may calculate the processing quality when a model is formed using the processing conditions changed by the user. For example, the arithmetic device 71 may calculate (in this case, estimate) the processing quality by performing a simulation that simulates a modeling operation for forming a model using the processing conditions changed by the user. In this case, the arithmetic device 71 may calculate the processing quality based on the results of the simulation.

[0261] Alternatively, in addition to or instead of performing a simulation by the arithmetic device 71, a modeling operation may actually be performed to model a model using the processing conditions changed by the user. In this case, the arithmetic device 71 may calculate the processing quality based on the result of the actually performed modeling operation.

[0262] Alternatively, in addition to or instead of the arithmetic device 71 calculating the processing quality based on at least one of the result of the simulation and the result of the modeling operation, the user may use the input device 74 to input information about the processing quality when a model is modeled using the processing conditions changed by the user to the arithmetic device 71. In this case, the arithmetic device 71 may use the processing quality input by the user as the calculation result of the processing quality by the arithmetic device 71.

[0263] Thereafter, when the processing quality is calculated, the arithmetic device 71 may control the display device 75 to display the processing quality calculated by the arithmetic device 71 on the condition display screen 93. That is, the arithmetic device 71 may control the display device 75 to update the condition display screen 93 based on the processing quality calculated by the arithmetic device 71. For example, FIG. 21 shows an example in which the user changes the intensity of the processing light EL. In this case, the arithmetic device 71 may control the display device 75 to display the processing quality calculated by the arithmetic device 71 on the quality display screen 931 as the processing quality that would be obtained if a model were formed using the processing conditions changed by the user. Furthermore, the arithmetic device 71 may control the display device 75 to display a coordinate point 9341 corresponding to the processing quality calculated by the arithmetic device 71 on the quality display screen 934 as the coordinate point 9341 that would be obtained if a model were formed using the processing conditions changed by the user. That is, the arithmetic device 71 may control the display device 75 to update at least one of the quality display screens 931 and 934, on which information about the processing quality is displayed.

[0264] In the above description, the user sets the machining conditions by directly changing the machining conditions. However, in addition to or instead of directly changing the machining conditions, the user may set the machining conditions by specifying the machining quality desired by the user. In this case, the user may use the input device 74 to input information regarding the machining quality desired by the user to the arithmetic device 71 via the condition display screen 93.

[0265] 22, a user-editable text box may be used as a display object for displaying the processing quality on the quality display screen 931. In this case, the user may use the input device 74 to change the processing quality displayed in the text box, and input information about the changed processing quality to the calculation device 71 as information about the processing quality desired by the user.

[0266] 23 , the user may use the input device 74 to move a coordinate point 9341 displayed on the quality display screen 934 within the multidimensional coordinate system. That is, the user may use the input device 74 to change the position of the coordinate point 9341 displayed on the quality display screen 934 within the multidimensional coordinate system. Because the coordinate point 9341 indicates the processing quality, an input to move the coordinate point 9341 is equivalent to an input specifying the processing quality desired by the user. Note that, in addition to or instead of moving the coordinate point 9341 using the input device 74, the user may also directly specify the position of the coordinate point 9341 within the multidimensional coordinate system.

[0267] Thereafter, the arithmetic device 71 may calculate processing conditions that can realize the processing quality desired by the user based on the information regarding the processing quality desired by the user. Thereafter, the arithmetic device 71 may store the processing conditions that can realize the processing quality desired by the user in the storage device 72 as processing conditions newly set by the user.

[0268] Furthermore, the arithmetic device 71 may control the display device 75 to update the condition display screen 93 based on the processing conditions calculated by the arithmetic device 71 and the processing quality desired by the user. For example, the arithmetic device 71 may control the display device 75 so that the processing conditions calculated by the arithmetic device 71 are reflected in the list display screen 930, the coordinate point display screen 932, and the coordinate point display screen 933 of the condition display screen 93. For example, the arithmetic device 71 may control the display device 75 so that the processing quality desired by the user is reflected in the quality display screen 931 and the quality display screen 934 of the condition display screen 93.

[0269] 24, the arithmetic unit 71 may control the display device 75 to display a blank condition display screen 93 in which setting values ​​for the multiple types of condition parameters included in the machining conditions have not been input. In this case, the user may set new machining conditions from scratch via the blank condition display screen 93.

[0270] For example, the user may use the input device 74 to input setting values ​​into input boxes (text boxes) for inputting setting values ​​of multiple types of condition parameters in the list display screen 930 displayed on the blank condition display screen 93, thereby setting new machining conditions from scratch. In this case, the arithmetic unit 71 may acquire the setting values ​​of the multiple types of condition parameters input by the user. In other words, information directly indicating the setting values ​​of the multiple types of condition parameters may be input to the arithmetic unit 71. Thereafter, the arithmetic unit 71 may generate new machining conditions in which the setting values ​​of the multiple types of condition parameters have been input by the user.

[0271] For example, the user may use the input device 74 to specify a desired position in the multidimensional coordinate system in the coordinate point display screen 932 displayed on the blank condition display screen 93, or to move an object placed in the multidimensional coordinate system in the coordinate point display screen 932 displayed on the condition display screen 93 and specify a new position, thereby newly setting machining conditions corresponding to the coordinate point of the specified position. Note that the operation of specifying a desired position in the multidimensional coordinate system is equivalent to the operation of placing a set coordinate point 9321 in the multidimensional coordinate system. In this case, the arithmetic unit 71 may acquire information about the position specified by the user in the multidimensional coordinate system (the position where the user placed the set coordinate point 9321 in the multidimensional coordinate system). In other words, information about the position specified by the user in the multidimensional coordinate system may be input to the arithmetic unit 71 as information indirectly indicating the set values ​​of multiple types of condition parameters. More specifically, by specifying a position in the multidimensional coordinate system displayed on the coordinate point display screen 932 with the input device 74, the numerical values ​​of the condition parameters assigned to each axis of the multidimensional coordinate system corresponding to this position may be input to the arithmetic device 71. Thereafter, the arithmetic device 71 may identify the coordinate point of the position specified by the user and generate machining conditions corresponding to the identified coordinate point.

[0272] (2-4) Recommended Condition Range Updating Operation When new processing conditions are set by the above-described condition setting operation, the arithmetic device 71 may update, based on the newly set processing conditions, the recommended condition range 9322. Specifically, when new processing conditions that can be used to form a model using a certain type of modeling material M are set in a situation in which condition parameters different from the condition parameters assigned to the axes of the multidimensional coordinate system on the coordinate point display screen 932 are set to a certain setting value, the arithmetic device 71 may update the recommended condition range 9322, which indicates a range of values ​​recommended as setting values ​​for the condition parameters assigned to the axes of the multidimensional coordinate system on the coordinate point display screen 932 in a situation in which the condition parameters different from the condition parameters assigned to the axes of the multidimensional coordinate system on the coordinate point display screen 932 are set to the same setting value, and which corresponds to the same type of modeling material M. As an example, when new processing conditions are set that can be used to form a model using Inconel 625 as the forming material M in a situation where condition parameters other than the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed are set to a single set value, the calculation device 71 may update the recommended condition range 9322, which indicates the range of values ​​recommended as the setting values ​​for the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed when forming a model using the same Inconel 625 as the forming material M in a situation where condition parameters other than the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed are set to the same single set value.

[0273] The arithmetic device 71 may calculate the processing quality when a model is formed using the newly set processing conditions in order to update the recommended condition range 9322. Note that the operation of calculating the processing quality when a model is formed using the newly set processing conditions has already been explained in the above-mentioned condition operation setting operation, and therefore will not be explained here.

[0274] Thereafter, the calculation device 71 may update the recommended condition range 9322 based on the newly set machining conditions and the machining quality of the newly set machining conditions. For example, if the newly set machining conditions are machining conditions whose machining quality satisfies a desired quality standard, the calculation device 71 may update the recommended condition range 9322 so that the newly set machining conditions are included in the updated recommended condition range 9322. For example, if the newly set machining conditions are machining conditions whose machining quality does not satisfy a desired quality standard, the calculation device 71 may update the recommended condition range 9322 so that the newly set machining conditions are not included in the updated recommended condition range 9322.

[0275] In order to update the recommended condition range 9322, the arithmetic unit 71 may plot coordinate points corresponding to newly set machining conditions in the multidimensional coordinate system of the coordinate point display screen 932, as shown in FIG. 25 . In particular, when the newly set machining conditions are machining conditions whose machining quality satisfies the desired quality standard, the arithmetic unit 71 may plot coordinate points corresponding to the newly set machining conditions as recommended coordinate points 9324 in the multidimensional coordinate system of the coordinate point display screen 932. Note that even when the newly set machining conditions are machining conditions whose machining quality does not satisfy the desired quality standard, the arithmetic unit 71 may plot coordinate points corresponding to the newly set machining conditions as non-recommended coordinate points 9325 in the multidimensional coordinate system of the coordinate point display screen 932. Furthermore, the arithmetic unit 71 may plot coordinate points corresponding to machining conditions that have already been set in the multidimensional coordinate system of the coordinate point display screen 932. In particular, the computing device 71 may plot recommended coordinate points 9234 that have already been set and that correspond to machining conditions whose machining quality satisfies a desired quality standard, within the multidimensional coordinate system of the coordinate point display screen 932. In this case, the computing device 71 does not need to control the display device 75 to display the multidimensional coordinate system on which the additional coordinate points 9326 are plotted. In other words, the computing device 71 may perform a process of plotting the additional coordinate points 9326, etc., within the multidimensional coordinate system within the computing device 71. Thereafter, the computing device 71 may set the range enclosed by lines connecting at least three recommended coordinate points 9324 as the updated recommended condition range 9322.

[0276] (3) Technical Effects As described above, in this embodiment, the control unit 7 can display the condition display screen 93 including the machining conditions selected by the user (or the machining conditions set by the user) by performing a condition display operation. In particular, in this embodiment, the control unit 7 can display the condition display screen 93 including the setting coordinate points 9321 that indicate the setting values ​​of at least two condition parameters that are at least some of the multiple types of condition parameters included in the machining conditions within a multidimensional coordinate system. This allows the user to intuitively or visually recognize the machining conditions.

[0277] Furthermore, the control unit 7 can display a condition display screen 93 that includes a recommended condition range 9322 together with the set coordinate point 9321. This allows the user to intuitively or visually recognize whether or not the processing conditions selected by the user are recommended for use in forming a model.

[0278] Furthermore, the user can set (change, update, customize, or set new machining conditions from scratch) machining conditions via the condition display screen 93 including the setting coordinate point 9321. This allows the user to intuitively or visually check the machining conditions set by the user and set appropriate machining conditions.

[0279] Here, the multiple types of condition parameters set by the user to set machining conditions are not necessarily all independent variables. In this case, when the user changes a first type of condition parameter, the user may need to change a second type of condition parameter that is different from the first type of condition parameter in accordance with the change in the first type of condition parameter. However, it is not easy for the user to individually set all of such multiple types of condition parameters that are correlated with each other. In particular, as the number of condition parameters increases, it is not easy for the user to individually set all of the multiple types of condition parameters that are correlated with each other. However, in this embodiment, the user can set multiple types of condition parameters while visually recognizing the setting coordinate points 9321 that indicate the multiple types of condition parameters set by the user in a multidimensional coordinate system. Therefore, the user can easily set multiple types of condition parameters compared to individually setting multiple types of condition parameters without recognizing the setting coordinate points 9321.

[0280] In particular, when the recommended condition range 9322 is displayed in a multidimensional coordinate system together with the set coordinate point 9321, the user can intuitively or visually recognize whether or not the processing conditions including the multiple types of condition parameters set by the user are recommended for forming a model, by recognizing the position of the set coordinate point 9321 relative to the recommended condition range 9322. Therefore, the user can easily set the multiple types of condition parameters so that the processing conditions including the multiple types of condition parameters become the recommended processing conditions.

[0281] In the technical field of semiconductor manufacturing, a process window indicating a range of optimal process conditions is sometimes used. However, the process window used in the technical field of semiconductor manufacturing is merely used to visually grasp the range of optimal process conditions. In other words, the process window used in the technical field of semiconductor manufacturing is not displayed with coordinate points indicating the process conditions currently set by the user for the purpose of setting the process conditions by the user. In other words, the process window used in the technical field of semiconductor manufacturing is not displayed with coordinate points indicating the process conditions currently set by the user for the purpose of setting process conditions whose optimal conditions change depending on the semiconductor manufacturing environment, etc. For this reason, the technical concept of displaying the setting coordinate points 9321 together with the recommended condition range 9322, as described in this embodiment, is significantly different from the technical concept of conventional process windows.

[0282] Furthermore, in this embodiment, since the processing unit areas PUA#1 and PUA#2 are scanned by the processing beams EL#1 and EL#2, respectively, using the galvanometer mirrors 46#1 and 46#2, the amount of energy transmitted from the processing beams EL#1 and EL#2 to the processing unit areas PUA#1 and PUA#2 per unit time and / or per unit area is reduced, as described above. Therefore, as described above, there is room for increasing the intensity of the processing beams EL#1 and EL#2. In this case, since the upper limit of the intensity of the processing beams EL#1 and EL#2 is increased, there is also room for the recommended condition range 9322, which indicates the range of values ​​recommended as the setting value of the intensity of the processing beams EL#1 and EL#2, to be increased (widened). This makes it easier for the user to set processing conditions within the recommended condition range 9322.

[0283] (4) Modifications Next, modifications of the machining system SYS will be described.

[0284] (4-1) First Modification In a first modification, as shown in Fig. 26 which shows a coordinate point display screen 932 in the first modification, the calculation device 71 may control the display device 75 so that a recommended condition range 9322 displayed on the coordinate point display screen 932 is subdivided into a plurality of different partial condition ranges 9327. Fig. 26 shows an example in which the recommended condition range 9322 is subdivided into two partial condition ranges 9327 (partial condition ranges 9327#1 and 9327#2).

[0285] The recommended condition range 9322 may be subdivided into a plurality of partial condition ranges 9327 so as to satisfy the subdivision criterion that "the processing quality when a modeling operation is performed using processing conditions included in one partial condition range 9327 among the plurality of partial condition ranges 9327 is different from the processing quality when a modeling operation is performed using processing conditions included in another partial condition range 9327 different from the one partial condition range 9327 among the plurality of partial condition ranges 9327." In particular, the recommended condition range 9322 may be subdivided into a plurality of partial condition ranges 9327 so as to satisfy the subdivision criterion that "the processing quality when a modeling operation is performed using processing conditions included in one partial condition range 9327 is better than the processing quality when a modeling operation is performed using processing conditions included in the other partial condition ranges 9327."

[0286] Note that the better the processing quality when a modeling operation is performed using a processing condition, the more recommended that processing condition is for performing the modeling operation. Therefore, the subdivision criterion that "the processing quality when a modeling operation is performed using a processing condition included in one partial condition range 9327 is better than the processing quality when a modeling operation is performed using a processing condition included in another partial condition range 9327" is equivalent to the subdivision criterion that "the processing condition included in one partial condition range 9327 is more recommended as a processing condition to be used for performing a modeling operation than the processing condition included in the other partial condition range 9327."

[0287] 26 , the recommended condition range 9322 may be subdivided into partial condition ranges 9327#1 and 9327#2 so as to satisfy the subdivision criterion that “the processing quality when a modeling operation is performed using processing conditions included in a partial condition range 9327#1, which is an example of one partial condition range 9327, is different from the processing quality when a modeling operation is performed using processing conditions included in a partial condition range 9327#2, which is an example of another partial condition range 9327” In particular, the recommended condition range 9322 may be subdivided into partial condition ranges 9327#1 and 9327#2 so as to satisfy the subdivision criterion that “the processing quality when a modeling operation is performed using processing conditions included in the partial condition range 9327#1 is better than the processing quality when a modeling operation is performed using processing conditions included in the partial condition range 9327#2” The recommended condition range 9322 may be subdivided into partial condition ranges 9327#1 and 9327#2 so as to satisfy the subdivision criterion that "the processing conditions included in the partial condition range 9327#1 are more recommended as processing conditions to be used for performing a modeling operation than the processing conditions included in the partial condition range 9327#2."

[0288] The subdivision criteria may include a first subdivision criterion related to processing accuracy, which is an example of processing quality. The subdivision criteria may include a second subdivision criterion related to throughput, which is an example of processing quality. The subdivision criteria may include a third subdivision criterion related to build density, which is an example of processing quality. In this case, the recommended condition range 9322 may be subdivided into multiple sub-condition ranges 9327 so that at least one of the first to third subdivision criteria is satisfied. Below, the first to third subdivision criteria will be further described using an example in which the recommended condition range 9322 is subdivided into two sub-condition ranges 9327#1 and 9327#2.

[0289] The first subdivision criterion regarding the machining accuracy may include a criterion that the machining accuracy (first machining accuracy) when a modeling operation is performed using machining conditions included in the partial condition range 9327#1 is better than the machining accuracy (second machining accuracy) when a modeling operation is performed using machining conditions included in the partial condition range 9327#2. Note that the state in which “the first machining accuracy is better than the second machining accuracy” may include a state in which “the machining error (modeling error) when a modeling operation is performed using machining conditions included in the partial condition range 9327#1 is smaller than the machining error (modeling error) when a modeling operation is performed using machining conditions included in the partial condition range 9327#2.” The first subdivision criterion may include a criterion that the probability that the first machining accuracy is “excellent,” “good,” or “fair” is higher than the probability that the second machining accuracy is “excellent,” “good,” or “fair.” The first subdivision criterion may include a criterion that the probability that the first machining accuracy is "unacceptable" is lower than the probability that the second machining accuracy is "unacceptable."

[0290] The second subdivision criterion for throughput may include a criterion that the throughput (first throughput) when a modeling operation is performed using processing conditions included in the partial condition range 9327#1 exceeds the throughput (second throughput) when a modeling operation is performed using processing conditions included in the partial condition range 9327#2. The second subdivision criterion may include a criterion that the probability that the first throughput is equal to or greater than a predetermined throughput threshold is equal to or greater than the probability that the second throughput is equal to or greater than a predetermined throughput threshold.

[0291] The third subdivision criterion for the build density may include a criterion that the build density (first build density) obtained when a build operation is performed using processing conditions included in the partial condition range 9327#1 exceeds the build density (second build density) obtained when a build operation is performed using processing conditions included in the partial condition range 9327#2. The third subdivision criterion may include a criterion that the probability that the first build density is equal to or greater than a predetermined build density threshold is equal to or greater than the probability that the second build density is equal to or greater than a predetermined build density threshold. As described above, the build density depends on voids (e.g., keyholes or cavities) that occur inside the object. In this case, the third subdivision criterion may include a criterion that the amount of voids (e.g., at least one of the total number and the total volume) generated in an object formed by a build operation using processing conditions included in the partial condition range 9327#1 is smaller than the amount of voids generated in an object formed by a build operation using processing conditions included in the partial condition range 9327#2. The third subdivision criterion may include a criterion that the probability that the amount of voids generated in an object formed by a modeling operation using processing conditions included in partial condition range 9327#1 will be equal to or less than a predetermined void threshold is higher than the probability that the amount of voids generated in an object formed by a modeling operation using processing conditions included in partial condition range 9327#2 will be equal to or less than a predetermined void threshold.

[0292] In this way, when the recommended condition range 9322 is subdivided into multiple different partial condition ranges 9327, the user may set the processing conditions so that the processing conditions (set coordinate point 9321) set by the user are included in one of the multiple partial condition ranges 9327. For example, the user may set the processing conditions so that the processing conditions set by the user are included in the partial condition range 9327 indicating the range of processing conditions that can achieve the processing quality desired by the user. For example, if the user requires better processing quality, the user may set the processing conditions so that the processing conditions set by the user are included in the partial condition range 9327 indicating the range of processing conditions that can achieve the better processing quality (e.g., partial condition range 9327#1 in FIG. 26). On the other hand, if the user does not require a particularly high processing quality, the user may set the processing conditions so that the processing conditions set by the user are included in the partial condition range 9327 indicating the range of processing conditions that can achieve a compromise processing quality (e.g., partial condition range 9327#2 in FIG. 26).

[0293] The display modes of the multiple partial condition ranges 9327 may be different from each other. In the example shown in FIG. 26 , the display mode of the partial condition range 9327#1 may be different from the display mode of the partial condition range 9327#2. The display mode may include at least one of the display color and brightness. In this case, the user can relatively easily distinguish between the multiple partial condition ranges 9327.

[0294] (4-2) Second Modification In the second modification, as shown in FIG. 26 which shows the coordinate point display screen 932 in the first modification, the calculation device 71 may control the display device 75 to display the coordinate point display screen 932 which does not include the recommended condition range 9322.

[0295] On the other hand, in the second modified example, the calculation device 71 may control the display device 75 to display the coordinate point display screen 932 including the above-mentioned recommended coordinate points 9324 corresponding to machining conditions whose machining quality satisfies the predetermined quality standard. In this case, the range in which the recommended coordinate points 9324 are distributed is the range in which machining conditions whose machining quality satisfies the predetermined quality standard are distributed. In particular, the range in which a relatively large number of recommended coordinate points 9324 are distributed is the range in which machining conditions whose machining quality satisfies the predetermined quality standard are distributed. The range in which the recommended coordinate points 9324 are distributed relatively densely is the range in which machining conditions whose machining quality satisfies the predetermined quality standard are distributed. This is because, in a range in which only a small number of recommended coordinate points 9324 are distributed, it is possible that the machining conditions indicated by a small number of recommended coordinate points 9324 are machining conditions whose machining quality satisfies the predetermined quality standard by chance, whereas in a range in which a large number of recommended coordinate points 9324 are distributed, it is extremely unlikely that the machining conditions indicated by a large number of recommended coordinate points 9324 are machining conditions whose machining quality satisfies the predetermined quality standard by chance. Therefore, the distribution of the recommended coordinate points 9324 substantially indicates the recommended condition range 9322. Therefore, even when the recommended condition range 9322 is not displayed, the user can substantially recognize the recommended condition range 9322 by recognizing the distribution of the recommended coordinate points 9324. Therefore, the user may set processing conditions based on the distribution of the recommended coordinate points 9324. Furthermore, even when the calculation device 71 sets processing conditions (for example, changes the setting value of a condition parameter), the calculation device 71 may set the processing conditions based on the distribution of the recommended coordinate points 9324. Alternatively, the calculation device 71 may specify the recommended condition range 9322 based on the distribution of the recommended coordinate points 9324 and control the display device 75 to display the specified recommended condition range 9322.

[0296] Furthermore, in the second modified example, the calculation device 71 may control the display device 75 to display the coordinate point display screen 932 including the above-mentioned non-recommended coordinate points 9325 corresponding to machining conditions whose machining quality does not satisfy a predetermined quality standard, in addition to or instead of the recommended coordinate points 9324. In this case, the range in which the non-recommended coordinate points 9325 are distributed is the range in which machining conditions whose machining quality does not satisfy the predetermined quality standard are distributed. In particular, the range in which the non-recommended coordinate points 9325 are distributed relatively frequently is the range in which machining conditions whose machining quality does not satisfy the predetermined quality standard are distributed. The range in which the non-recommended coordinate points 9325 are distributed relatively densely is the range in which machining conditions whose machining quality does not satisfy the predetermined quality standard are distributed. This is because, in a range where only a small number of non-recommended coordinate points 9325 are distributed, the machining conditions indicated by the small number of non-recommended coordinate points 9325 may coincidentally be machining conditions whose machining quality does not satisfy a predetermined quality standard, whereas in a range where a large number of non-recommended coordinate points 9325 are distributed, the machining conditions indicated by the large number of non-recommended coordinate points 9325 are extremely unlikely to coincidentally be machining conditions whose machining quality does not satisfy a predetermined quality standard. Therefore, the distribution of the non-recommended coordinate points 9325 essentially indicates the recommended condition range 9322. Therefore, even if the recommended condition range 9322 is not displayed, the user can essentially recognize the recommended condition range 9322 by recognizing the distribution of the non-recommended coordinate points 9325. Therefore, the user may set machining conditions based on the distribution of the non-recommended coordinate points 9325. Furthermore, even when the calculation device 71 sets machining conditions (e.g., changes the setting value of a condition parameter), the calculation device 71 may set the machining conditions based on the distribution of the non-recommended coordinate points 9325. Alternatively, the calculation device 71 may specify the recommended condition range 9322 based on the distribution of the non-recommended coordinate points 9325 and control the display device 75 to display the specified recommended condition range 9322 .

[0297] (4-3) Third Modification In the above description, the condition display screen 93 (coordinate point display screen 932) used to display the processing conditions shows a set coordinate point 9321 corresponding to the set value of the intensity of the processing light EL, the set value of the scanning speed of the processing light EL, and the set value of the stage speed in a three-dimensional coordinate system including three axes to which the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed are respectively assigned. In the third modification, the coordinate point display screen 932 may show a set coordinate point 9321 corresponding to the set value of another type of condition parameter other than the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed in a multidimensional coordinate system including axes to which other types of condition parameters other than the intensity of the processing light EL, the scanning speed of the processing light EL, and the stage speed are assigned.

[0298] For example, as shown in Fig. 28(a), the coordinate point display screen 932 may display a set coordinate point 9321 corresponding to at least the set value of the focus position CP of the processing light EL within a multidimensional coordinate system including at least an axis to which the focus position CP of the processing light EL is assigned. For example, as shown in Fig. 28(b), the coordinate point display screen 932 may display a set coordinate point 9321 corresponding to at least the set value of the material supply rate within a multidimensional coordinate system including at least an axis to which the material supply rate is assigned. For example, although not shown, the coordinate point display screen 932 may display a set coordinate point 9321 corresponding to at least the set value of a desired condition parameter within a multidimensional coordinate system including at least an axis to which the desired condition parameter is assigned.

[0299] (4-4) Fourth Modification In the fourth modification, as shown in FIG. 29( a) showing a list display screen 930 in the fourth modification, the list display screen 930 may include a slider (slider bar) 9301 that the user can operate to change the setting value of the condition parameter. In this case, the user may change the setting value of the condition parameter by operating the slider 9301 using the input device 74. As a result, the user can intuitively or visually change the setting value of the condition parameter. Furthermore, because the slider 9301 essentially quantitatively indicates the setting value of the condition parameter, the user can intuitively or visually recognize the setting value of the condition parameter.

[0300] Furthermore, in the fourth modified example, as shown in FIG. 29( b ) illustrating a quality display screen 931 in the fourth modified example, the quality display screen 931 may include a slider (slider bar) 9311 that the user can operate to change the processing quality. In this case, the user may change the processing quality by operating the slider 9311 using the input device 74. As a result, the user can intuitively or visually change the processing quality. Furthermore, because the slider 9311 essentially quantitatively indicates the processing quality, the user can intuitively or visually recognize the processing quality.

[0301] (4-5) Other Modifications In the above description, the machining unit 2 changes the emission direction of the processing light EL using the galvanometer mirrors 46#1 and 46#2. However, the machining unit 2 may change the emission direction of the processing light EL using an optical system (optical component) different from the galvanometer mirrors 46#1 and 46#2. For example, the machining unit 2 may change the emission direction of the processing light EL using at least one of a polygon mirror and a resonant mirror. For example, the machining unit 2 may change the emission direction of the processing light EL using a resonant scanner that resonates a mirror supported at both ends by a pair of torsion bars. For example, the machining unit 2 may change the emission direction of the processing light EL using an acousto-optic deflector (AOD).

[0302] In the above description, the processing unit 2 includes multiple galvanometer mirrors (galvanometer mirrors 46#1 and 46#2) to change the emission directions of the multiple processing lights EL, respectively. However, the processing unit 2 may use a single galvanometer mirror to change the emission directions of the multiple processing lights EL collectively. In other words, multiple processing lights EL may be incident on a single galvanometer mirror.

[0303] In the above description, the machining unit 2 irradiates the workpiece W with multiple machining light beams EL (machining light beams EL#1 and EL#2). However, the machining unit 2 may irradiate the workpiece W with a single machining light beam EL. In this case, the irradiation optical system 41 of the machining unit 2 may include a single galvanometer mirror (e.g., one X-scanning mirror and one Y-scanning mirror) to change the emission direction of the single machining light beam EL (and thereby change the irradiation position of the single machining light beam EL). In other words, the irradiation optical system 41 of the machining unit 2 may not include the second optical system 41#2. Alternatively, the irradiation optical system 41 of the machining unit 2 may not include the second optical system 41#2 and the focusing optical system 50. Note that the irradiation optical system 41 of the machining unit 2 may include either one of one X-scanning mirror and one Y-scanning mirror to change the emission direction of the single machining light beam EL, but may not include either one X-scanning mirror and one Y-scanning mirror.

[0304] In the above description, the control unit 7 controls at least one of the galvanometer mirrors 46#1 and 46#2 so that the irradiation area EA moves within the processing unit area PUA set on the processing surface MS, while controlling at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the processing unit area PUA moves on the processing surface MS, thereby forming an object on the processing surface MS that extends along the movement direction of the processing unit area PUA on the processing surface MS. However, the control unit 7 may also control the processing unit 2 so that an object having a desired shape pattern is formed within the processing unit area PUA.

[0305] In the above description, the processing unit 2 melts the shaping material M by irradiating the shaping material M with the processing light EL. However, the processing unit 2 may melt the shaping material M by irradiating the shaping material M with any energy beam. Examples of the any energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of the charged particle beam include at least one of an electron beam and an ion beam.

[0306] In the above description, the processing system SYS performs additive processing. However, the processing system SYS may perform remover processing in addition to or instead of additive processing. The remover processing may include removing a portion of the workpiece W by irradiating the workpiece W with the processing light EL. As an example, the processing system SYS may perform additive processing on the workpiece W using at least one of the processing lights EL#1 and EL#2, and then perform remover processing on the workpiece W that has undergone additive processing using at least one of the processing lights EL#1 and EL#2. As another example, the processing system SYS may perform additive processing on a first portion of the workpiece W using one of the processing lights EL#1 and EL#2, while performing remover processing on a second portion of the workpiece W that is different from the first portion using the other of the processing lights EL#1 and EL#2. In other words, the processing system SYS may perform additive processing and remover processing simultaneously. In addition, when the processing system SYS does not need to perform the additive processing and the removal processing simultaneously, the processing system SYS may perform the additive processing and the removal processing using the same processing light EL.

[0307] The processing system SYS may perform a remelt process in addition to at least one of an additive process and a subtractive process. The remelt process may include a process for reducing the flatness of the surface of the workpiece W (reducing the surface roughness, bringing the surface closer to a flat surface). The remelt process may include a process for reducing the flatness of the surface of the workpiece W (or a shaped object formed on the workpiece W) that has been processed by an additive process or a subtractive process (reducing the surface roughness, bringing the surface closer to a flat surface). As an example, the processing system SYS may perform at least one of an additive process and a subtractive process on the workpiece W using at least one of the processing beams EL#1 and EL#2, and then perform a remelt process on the workpiece W (or a shaped object formed on the workpiece W by the additive process) that has been subjected to at least one of the additive process and the subtractive process using at least one of the processing beams EL#1 and EL#2. As another example, the processing system SYS may use either one of the processing lights EL#1 and EL#2 to perform at least one of additional processing and removal processing on a first portion of the workpiece W, while using the other of the processing lights EL#1 and EL#2 to perform remelt processing on a second portion of the workpiece W that is different from the first portion. In other words, the processing system SYS may perform at least one of the additional processing and removal processing and remelt processing simultaneously. Note that if the processing system SYS does not need to perform at least one of the additional processing and removal processing and remelt processing simultaneously, the processing system SYS may perform at least one of the additional processing and removal processing and remelt processing using the same processing light EL.

[0308] The above-described processing unit 2 (processing head 22) may be attached to a robot (typically, an articulated robot). When the processing head 22 is moved by a robot, the head drive mechanism 23 may be the robot. For example, the processing unit 2 (processing head 22) may be attached to a welding robot for welding. For example, the processing unit 2 (processing head 22) may be attached to a self-propelled mobile robot. The self-propelled mobile robot may include, for example, a self-propelled device such as an AGV (Automatic Guided Vehicle) or an AMR (Autonomous Mobile Robot), and a robot arm provided on the self-propelled device.

[0309] At least some of the constituent elements of each of the above-described embodiments can be appropriately combined with at least some of the other constituent elements of each of the above-described embodiments. Some of the constituent elements of each of the above-described embodiments may not be used. Furthermore, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-described embodiments are incorporated herein by reference.

[0310] The present invention is not limited to the above-described embodiments, but can be modified as appropriate within the scope of the claims and the gist or idea of ​​the invention as can be read from the entire specification, and processing systems, control devices, control methods, computer programs and recording media that involve such modifications are also included in the technical scope of the present invention.

[0311] SYS Machining system 2 Machining unit 3 Stage unit 7 Control unit 71 Arithmetic unit 72 Storage device 73 Output device 74 Input device 75 Display device 91 Material selection screen 92 Condition selection screen 93 Condition display screen 930 List display screen 931 Quality display screen 932 Coordinate point display screen 9321 Set coordinate point 9322 Recommended condition range 9323 Non-selected coordinate point 9324 Recommended coordinate point 9325 Non-recommended coordinate point 933 Coordinate point display screen 934 Quality display screen W Workpiece M Modeling material MS Modeling surface EL Processing light

Claims

1. A processing system comprising: an arithmetic unit that reads and executes a computer program stored in a storage device; an output unit that can output the results of the arithmetic unit executing the computer program; and a processing device that performs additional processing to melt a modeling material into an object and form a model on the object based on the output of the output device, wherein the arithmetic unit receives setting values ​​for multiple types of condition parameters as processing conditions for the processing device, and generates display control information that shows setting coordinate points corresponding to the setting values ​​in a multidimensional coordinate system with the multiple types of condition parameters as axes.

2. The machining system according to claim 1, wherein the arithmetic device generates the display control information that displays a range of recommended conditions recommended as machining conditions for the machining device to machine the object in the multidimensional coordinate system.

3. The processing system described in claim 2, wherein the calculation device generates the display control information such that the display mode of a first range of the recommended condition range is different from the display mode of a second range of the recommended condition range that is different from the first range.

4. The machining system according to claim 3, wherein the machining conditions included in the first range are more recommended than the machining conditions included in the second range.

5. The processing system according to claim 3 or 4, wherein the arithmetic device generates the display control information in which the display colors are different between the display mode of the first range and the display mode of the second range.

6. The processing system according to any one of claims 2 to 5, wherein the plurality of types of condition parameters include one condition parameter and another condition parameter, and when the setting value of the one condition parameter is changed, the arithmetic device changes the other condition parameter to generate the display control information in which the recommended condition range is changed.

7. The processing system according to claim 6, wherein the one condition parameter is a condition parameter relating to the supply amount of the modeling material.

8. A processing system according to any one of claims 1 to 7, wherein the processing device comprises: an energy beam source that generates an energy beam; an irradiation optical system that irradiates the energy beam from the energy beam source as a processing beam onto the object; and a supply device that supplies the modeling material to a position where the irradiation optical system irradiates the processing beam onto the object.

9. A processing system described in any one of claims 2 to 7, wherein the calculation device generates the display control information to display a first range and a second range different from the first range as the recommended condition range depending on the type of the modeling material.

10. The processing system according to claim 1, wherein the arithmetic device generates the display control information for displaying a plurality of coordinate points indicating a plurality of processing conditions in the multidimensional coordinate system in a manner that allows a user to recognize an evaluation of the object processed by the processing device under each of the processing conditions.

11. The processing system according to claim 10, wherein the arithmetic device generates the display control information in which the display color of the coordinate points is changed depending on whether the object can be processed by the processing device.

12. The processing system according to claim 11, wherein the display control information indicating a range of processing conditions recommended as processing conditions for the processing device to process the object is generated from the distribution of the plurality of coordinate points.

13. A processing system as described in any one of claims 1 to 12, further comprising an input device that allows a user to input at least one of the multiple types of condition parameters as a setting value of a processing condition, wherein the arithmetic device receives information corresponding to the user's input from the input device, reads and executes a computer program stored in the storage device, and generates display control information that shows a setting coordinate point corresponding to the setting value input by the user in a multidimensional coordinate system with the multiple types of condition parameters as axes.

14. The processing system described in claim 13, wherein when processing conditions including the setting values ​​input by the user fall outside the range of recommended conditions recommended as processing conditions for the processing device to process the object, the calculation device generates the display control information to notify the user that the processing conditions fall outside the recommended range of conditions.

15. The processing system described in claim 14, wherein the calculation device generates the display control information in such a way that the display mode of the set coordinate point differs when the set coordinate point is within the recommended condition range and when the set coordinate point is outside the recommended condition range.

16. The processing system described in claim 15, wherein the calculation device generates the display control information in which the display color of the set coordinate point is different when the set coordinate point is within the recommended condition range and when the set coordinate point is outside the recommended condition range.

17. A processing system according to any one of claims 14 to 16, wherein the arithmetic unit outputs a signal to an audio output device to emit an alarm sound when the set coordinate point is outside the range of the recommended conditions.

18. A machining system according to any one of claims 1 to 17, wherein the arithmetic device generates the display control information for displaying a plurality of coordinate points in the multidimensional coordinate system, each of which indicates a plurality of different machining conditions.

19. The processing system according to claim 18, wherein the calculation device generates the display control information in which a range surrounded by lines connecting at least three of the plurality of coordinate points is set as the recommended condition range.

20. The processing system according to claim 19, wherein the calculation device generates the display control information in which some of the plurality of coordinate points are outside the recommended condition range of the multidimensional coordinate system.

21. A processing system as described in any one of claims 1 to 20, further comprising an input device that allows a user to move the position of the set coordinate point in the multidimensional coordinate system, wherein the arithmetic device receives an input from the input device corresponding to the position in the multidimensional coordinate system of the set coordinate point moved by the user, and generates the display control information by reading and executing a computer program stored in the storage device.

22. A processing system as described in any one of claims 1 to 21, further comprising an input device with which a user places a point that will become the set coordinate point in the multidimensional coordinate system, wherein the arithmetic device receives input from the input device corresponding to the position in the multidimensional coordinate system of the set coordinate point placed by the user, and generates the display control information by reading and executing a computer program stored in the storage device.

23. The processing system according to claim 8, further comprising a position changing device, wherein the processing device includes a processing head, and the position changing device is capable of changing the relative positional relationship between the object and the processing head.

24. The processing system according to claim 23, further comprising a placement device on which the object can be placed, wherein the position change device is capable of changing the relative positional relationship between the placement device and the processing head.

25. The processing system according to claim 23 or 24, wherein the position changing device is a first position changing device, and further comprising a second position changing device that moves the irradiation position of the processing beam on the surface of the object.

26. The processing system according to claim 25, wherein the second position changing device includes a deflection member that changes the deflection angle of the processing beam, and the irradiation position of the processing beam is changed by changing the deflection angle using the deflection member.

27. The processing system of claim 26, wherein the position change stroke of the first position change device is greater than the position change stroke of the second position change device, or the movement speed of the processing beam by the second position change device is faster than the movement speed of the processing beam by the first position change device.

28. A processing system according to any one of claims 25 to 27, wherein the plurality of types of parameters include a first type of condition parameter related to the position change of the first position change device and a second type of condition parameter related to the position change of the second position change device.

29. A processing system according to any one of claims 25 to 28, wherein the plurality of types of parameters include a first type of condition parameter relating to the relative movement speed between the object and the processing head, and a second type of condition parameter relating to at least one of the movement speed, movement period, movement stroke, and movement pattern of the irradiation position of the processing beam on the surface of the object.

30. A processing system according to any one of claims 8 and 23 to 29, wherein the plurality of types of parameters includes a third type of parameter relating to the intensity of the processing beam.

31. A processing system as described in any one of claims 1 to 30, wherein the processing device has an energy beam source that generates an energy beam, an irradiation optical system that irradiates the object with the energy beam from the energy beam source as a processing beam, and a scanning optical system that scans the processing beam irradiated from the irradiation optical system onto the object, and the arithmetic device generates display control information that shows the set coordinate point in the multidimensional coordinate system, one axis of which is the scanning speed of the processing beam by the scanning optical system.

32. A processing system as described in any one of claims 1 to 31, wherein the processing device has an energy beam source that generates an energy beam and an irradiation optical system that irradiates the object with the energy beam from the energy beam source as a processing beam, and the arithmetic device generates display control information that shows the set coordinate point in the multidimensional coordinate system, with the intensity of the processing beam as one axis.

33. A processing system as described in any one of claims 1 to 32, wherein the processing device has an energy beam source that generates an energy beam, an irradiation optical system that irradiates the object with the energy beam from the energy beam source as a processing beam, and a drive device that changes the relative position of the irradiation optical system and the object, and the calculation device generates display control information that shows the set coordinate point in the multidimensional coordinate system, one axis of which is a condition parameter related to the movement speed at which the drive device changes the relative position of the irradiation optical system and the object.

34. A processing system as described in any one of claims 1 to 33, wherein the processing device has an energy beam source that generates an energy beam and an irradiation optical system that irradiates the object with the energy beam from the energy beam source as a processing beam, and the calculation device generates display control information that shows the set coordinate point in the multidimensional coordinate system, one axis of which is a condition parameter related to the focus position of the processing beam irradiated by the irradiation optical system.

35. A processing system described in any one of claims 1 to 34, wherein the processing device has an energy beam source that generates an energy beam, an irradiation optical system that irradiates the energy beam from the energy beam source as a processing beam onto the object, and a supply device that supplies powder that will be the modeling material to a position where the irradiation optical system irradiates the processing beam onto the object, and the calculation device generates display control information that shows the set coordinate point in the multidimensional coordinate system, one axis of which is a condition parameter related to material supply by the supply device.

36. The processing system according to claim 35, wherein the condition parameters relating to material supply include condition parameters relating to dense positions of the building material.

37. A processing system as described in any one of claims 1 to 36, further comprising an input device that allows the value of a first condition parameter to be input from among the multiple types of condition parameters, wherein the arithmetic device generates the display control information by taking the value of the first condition parameter input from the input device as the setting value set for the first condition parameter and updating the setting value of a second condition parameter different from the first condition parameter from among the multiple types of condition parameters based on the value of the first condition parameter input from the input device.

38. The processing system described in claim 37, wherein the arithmetic device generates the display control information by updating the setting value of the second condition parameter based on the value of the first condition parameter input by the input device so that the set coordinate point is located within a recommended condition range recommended as a processing condition for the processing device to process the object.

39. The processing system described in claim 38, wherein the calculation device generates the display control information by updating the setting value of the second condition parameter based on the value of the first condition parameter input by the input device so that the setting coordinate point approaches the center of the recommended condition range.

40. A processing system as described in any one of claims 1 to 39, further comprising a display device that allows a user to view information, and the display control information generated by the arithmetic unit is input to the display device via the output device.

41. A control device having an arithmetic unit that receives input of multiple setting values ​​set for multiple types of condition parameters as processing conditions for a processing device, reads and executes a computer program stored in a storage device, and generates and outputs display control information that shows setting coordinate points corresponding to the setting values ​​in a multidimensional coordinate system with the multiple types of condition parameters as axes.

42. A control method for controlling a processing device capable of processing an object, comprising: acquiring setting values ​​for each of a plurality of types of condition parameters corresponding to the processing conditions of the processing device; and generating display control information indicating setting coordinate points corresponding to the setting values ​​in a multidimensional coordinate system with the plurality of types of condition parameters as axes.

43. A computer program that causes a computer that controls a processing device capable of processing an object to acquire setting values ​​for multiple types of condition parameters corresponding to the processing conditions of the processing device, and generates display control information that indicates setting coordinate points corresponding to the setting values ​​in a multidimensional coordinate system whose axes are the multiple types of condition parameters.

44. A recording medium on which the computer program according to claim 43 is recorded.

Images