A computer system and a method for calibrating a flow of fluid in a thermal management system, and a thermal management system

Abstract

A computer system (500) comprising processing circuitry (502) configured to calibrate a flow of fluid in a thermal management system (5), the processing circuitry (502) being configured to: - obtain stored fluid flow rate related data (14) and data about a status of the system (5), - determine a required fluid flow rate of at least one pump (10) based on the obtained data about the status, - operate the at least one pump (10) to provide the required fluid flow rate in accordance with the stored fluid flow rate related data (14), - monitor a current fluid flow rate of the at least one pump (10), and - when the monitored current fluid flow rate of the at least one pump (10) is different from the required fluid flow rate, control the at least one pump (10) such that the current fluid flow rate approaches the required fluid flow rate.

Description

[0001] A COMPUTER SYSTEM AND A METHOD FOR CALIBRATING A FLOW OF FLUID IN A THERMAL MANAGEMENT SYSTEM, AND A THERMAL MANAGEMENT SYSTEM

[0002] TECHNICAL FIELD

[0003] [1] The disclosure relates generally to calibration of a thermal management system. In particular aspects, the disclosure relates to a computer system comprising processing circuitry configured to calibrate a flow of fluid in a thermal management system, a computer- implemented method for calibrating a flow of fluid in a thermal management system, a computer program product, a non-transitory computer-readable storage medium, a thermal management system, and a marine vessel or an electric machine. The disclosure can be applied to marine vessels and construction equipment, and to both mobile and stationary electric machines. Although the disclosure may be described with respect to a particular vessel, vehicle or machine, the disclosure is not restricted to any particular vessel, vehicle or machine.

[0004] BACKGROUND

[0005] [2] Thermal management systems, such as found in heavy duty trucks, often have standard, pre-defined configurations for different vehicle models. This allows components to be placed in vehicles with fixed positions for each vehicle model. Thereby, calibration and software testing have already been made and are valid upon completed assembly of the system. Simulations and verifications have been made for the same setup before.

[0006] [3] By way of example, in marine and industrial applications, the number of unique configurations of thermal management systems may be equal to the number of systems and applications. Manual calibration of such thermal management systems requires extensive time and resources.

[0007] SUMMARY

[0008] [4] According to a first aspect of the disclosure, there is provided a computer system comprising processing circuitry configured to calibrate a flow of fluid in a thermal management system, the thermal management system comprising:

[0009] - at least one pump controllable by the processing circuitry, and

[0010] - at least one component requiring thermal management, the processing circuitry being configured to:

[0011] - obtain stored fluid flow rate related data describing fluid flow rates provided by the at least one pump as a function of a predetermined pump parameter and pump speed, wherein the predetermined pump parameter is indicative of pump power consumption,

[0012] - obtain data about a status of the thermal management system,

[0013] - determine a required fluid flow rate of the at least one pump based on the obtained data about the status of the thermal management system,

[0014] - operate the at least one pump to provide the required fluid flow rate in accordance with the stored fluid flow rate related data,

[0015] - monitor a current fluid flow rate of the at least one pump, wherein the current fluid flow rate of the at least one pump is monitored based on the stored fluid flow rate related data, pump speed of the at least one pump, and a measured pump parameter of the at least one pump indicative of pump power consumption, and

[0016] - when the monitored current fluid flow rate of the at least one pump is different from the required fluid flow rate, control the at least one pump such that the current fluid flow rate approaches the required fluid flow rate.

[0017] [5] The first aspect of the disclosure may seek to provide a computer system that automates calibration of a pump, or a plurality of pumps, installed in a thermal management system. The at least one component requiring thermal management and the pump(s) may be interconnected by a fluid conduit network for circulating fluid through the thermal management system. A technical benefit may include a shorter installation time for new pumps in a thermal management system, requiring less resources to correctly calibrate the fluid flow provided by the pump(s). Further, a system supplier does not need to verify fluid flow of the thermal management system at the customer. Energy may be saved due to optimally calibrated pump speed. Also, as another example, the computer system and the at least one pump may be plug-and-play, being adaptable to any configuration of thermal management systems.

[0018] [6] The stored fluid flow rate related data as disclosed herein may in some examples be a stored function describing fluid flow rates provided by the at least one pump as a function of the predetermined pump parameter and pump speed. Additionally, or alternatively, the stored fluid flow rate related data may be in the form of, or illustrated as, a stored map describing fluid flow rates provided by the at least one pump as a function of the predetermined pump parameter and pump speed. The stored fluid flow rate related data may be obtained from a database, e.g., a local and / or a remote database with respect to the processing circuitry. By way of example, the obtained data may be obtained by receiving the data via a wireless or wired network.

[0019] [7] The thermal management system as disclosed herein is preferably a thermal management system in an electrical driveline in a marine vessel or electric machine.

[0020] [8] Optionally in some examples, including in at least one preferred example, the measured pump parameter of the at least one pump indicative of pump power consumption is any one or a combination of the following:

[0021] - an output signal from the at least one pump indicative of pump power consumption,

[0022] - a measured input power or input current to the at least one pump. A technical benefit may include that the measured pump parameter provides a reliable and robust value of pump power consumption in a cost-effective manner. For example, it has been realized that by said configuration any sensor(s) external to the at least one pump is not needed for obtaining a value indicative of the pump power consumption. This is since an output from the pump itself, or an input to the pump, is used for obtaining a value indicative of the pump power consumption.

[0023] [9] Optionally in some examples, including in at least one preferred example, the processing circuitry is further configured to continuously or intermittently monitor the status of the thermal management system and therefrom determine the required fluid flow rate of the at least one pump. A technical benefit may include that a more correct value of the required fluid flow rate is provided. This is since continuous or intermittent monitoring of the status may reveal status changes over time. For example, an operational status of the thermal management system may change over time, such as temperature and power consumption of the at least one component requiring thermal management, ambient temperature, modes imposed on the thermal management system, etc.

[0024]

[0010] Optionally in some examples, including in at least one preferred example, the obtained data about the status of the thermal management system comprises status data of the thermal management system at start-up of the thermal management system. At start-up of the thermal management system may mean the first time the thermal management system is used in operation. A technical benefit may include that the fluid flow rate of the at least one pump is calibrated based on the initial status of the thermal management system.

[0011] Optionally in some examples, including in at least one preferred example, the data about the status of the thermal management system comprises any one or any combination of the following data:

[0025] - type of component of the respective component of the at least one component requiring thermal management,

[0026] - nominal flow requirement of the respective component of the at least one component requiring thermal management,

[0027] - power consumption of the respective component of the at least one component requiring thermal management,

[0028] - operating temperature of the respective component of the at least one component requiring thermal management,

[0029] - ambient temperature, and

[0030] - running mode imposed on the thermal management system.

[0031] A technical benefit may include that a more correct value of the required fluid flow rate is determined.

[0032]

[0012] Optionally in some examples, including in at least one preferred example, the type of component of the respective component of the at least one component requiring thermal management is any one of an energy storage system, an electric charger, an electric power take-off, an electric motor / generator, a heater, an inverter, a converter, a condenser, an evaporator, a heat exchanger, a compressor, and a gearbox. A technical benefit may include that fluid flow requirements of the energy storage system, the electric charger, the electric power take-off, the electric motor / generator, the heater, the inverter, the converter, the condenser, the evaporator, the heat exchanger, the compressor, and / or the gearbox is considered for determining the required fluid flow rate of the at least one pump. Thereby, a more correct value of the required fluid flow rate may be determined.

[0033]

[0013] Optionally in some examples, including in at least one preferred example, the running mode imposed on the thermal management system is any one of an economic mode (e.g. power-saving mode), a standard mode and a performance mode (e.g. promoting higher power consumption). A technical benefit may include that fluid flow requirements of the economic mode, the standard mode and the performance mode are considered for determining the required fluid flow rate of the at least one pump. Thereby, a more correct value of the required fluid flow rate may be determined.

[0014] Optionally in some examples, including in at least one preferred example, the thermal management system comprises a plurality of components requiring thermal management. A technical benefit may include that the fluid flow rate of the at least one pump is adapted to provide fluid flow to all of the plurality of components requiring thermal management.

[0034]

[0015] Optionally in some examples, including in at least one preferred example, the data about the status of the thermal management system comprises the following data:

[0035] - how the respective component of the plurality of components requiring thermal management are fluidly connected and / or arranged in relation to each other. A technical benefit may include that a more correct value of the required fluid flow rate is determined. This is since fluid connections, such as if the respective connection is a parallel connection or a series connection, may affect the required fluid flow rate for achieving the required thermal management of the respective component. The arrangement of the plurality of components in relation to each other, e.g., a distance between components, orientation of the respective component, etc., may additionally or alternatively affect the required fluid flow rate for achieving the required thermal management of the respective component.

[0036]

[0016] Optionally in some examples, including in at least one preferred example, the thermal management system comprises at least one flow controlling member, and wherein the data about the status of the thermal management system comprises number of flow controlling members and / or type of flow controlling members of the thermal management system. A technical benefit may include that the number of flow controlling members and / or type of flow controlling members are considered for determining the required fluid flow rate of the at least one pump. Thereby, a more correct value of the required fluid flow rate may be determined.

[0037]

[0017] Optionally in some examples, including in at least one preferred example, the processing circuitry is configured to:

[0038] - based on the data about the status of the thermal management system, select a thermal management system configuration from a plurality of predetermined thermal management system configurations, wherein the respective predetermined thermal management system configuration is associated with a predetermined required flow rate of the at least one pump, and - determine the required fluid flow rate of the at least one pump based on the obtained data about the status of the thermal management system by selecting the predetermined required flow rate which is associated with the selected thermal management system configuration.

[0039]

[0018] A technical benefit may include that a more correct value of the required fluid flow rate is determined.

[0040]

[0019] Optionally in some examples, including in at least one preferred example, the processing circuitry is configured to:

[0041] - based on the data about the status of the thermal management system, select a thermal management system configuration and associate a required flow rate of the at least one pump thereto by use of a trained machine learning algorithm, and

[0042] - determine the required fluid flow rate of the at least one pump based on the obtained data about the status of the thermal management system by selecting the required flow rate which is associated with the selected thermal management system configuration.

[0043]

[0020] A technical benefit may include that a more correct value of the required fluid flow rate is determined. For example, by selecting a thermal management system configuration and associating a required flow rate by the trained machine learning algorithm, required fluid flow rates for new thermal management system configurations may be determined more accurately. By way of example, the status data may indicate that the configuration of the thermal management system is similar to, but not equal to, two or more known thermal management system configurations. Hence, by use of the trained machine learning algorithm, which may have been trained by data relating to the two or more known thermal management system configurations, a required fluid flow rate may be determined which is close to, but not necessarily equal to, the respective required fluid flow rate of the two or more known thermal management system configurations.

[0044]

[0021] Optionally in some examples, including in at least one preferred example, the thermal management system further comprises a sensor assembly, the processing circuitry further being configured to:

[0045] - obtain fluid flow data from the sensor assembly, and

[0046] - further adjust the current fluid flow rate of the at least one pump based on the obtained fluid flow data such that the current fluid flow rate approaches the required fluid flow rate.

[0047]

[0022] A technical benefit may include measuring at least one property of the fluid flow, such as a temperature, and / or pressure, in at least one location of the thermal management system. Such fluid flow data may be used to further approach the current fluid flow to the required fluid flow. By way of example, by use of the fluid flow data from the sensor assembly it may be determined that a measured property, such as an operational temperature, of at least one component requiring thermal management is different from a corresponding property, e.g. an operational temperature, of the same component as obtained from the status data. Accordingly, the determined discrepancy may be used for further adjusting the current fluid flow rate such that the current fluid flow rate approaches the required fluid flow rate.

[0048]

[0023] Optionally in some examples, including in at least one preferred example, the processing circuitry is further configured to monitor a temperature of the fluid and to adjust the current fluid flow rate of the at least one pump based on a viscosity of the fluid calculated from the monitored temperature. A technical benefit may include a faster calibration process in that the current fluid flow rate is more accurately adjusted towards the required fluid flow rate.

[0049]

[0024] According to a second aspect of the disclosure, there is provided a computer- implemented method for calibrating a flow of fluid in a thermal management system, the thermal management system comprising:

[0050] - at least one pump controllable by the processing circuitry, and

[0051] - at least one component requiring thermal management, the method comprising:

[0052] - obtaining, by processing circuitry of a computer system, stored fluid flow rate related data describing fluid flow rates provided by the at least one pump as a function of a predetermined pump parameter and pump speed, wherein the predetermined pump parameter is indicative of pump power consumption,

[0053] - obtaining, by the processing circuitry, data about a status of the thermal management system,

[0054] - determining, by the processing circuitry, a required fluid flow rate of the at least one pump based on the obtained data about the status of the thermal management system,

[0055] - operating, by the processing circuitry, the at least one pump to provide the required fluid flow rate in accordance with the stored fluid flow rate related data,

[0056] - monitoring, by the processing circuitry, a current fluid flow rate of the at least one pump, wherein the current fluid flow rate of the at least one pump is monitored based on the stored fluid flow rate related data, pump speed of the at least one pump, and a measured pump parameter of the at least one pump indicative of pump power consumption, and

[0057] - when the monitored current fluid flow rate of the at least one pump is different from the required fluid flow rate, controlling, by the processing circuitry, the at least one pump such that the current fluid flow rate approaches the required fluid flow rate.

[0058]

[0025] The second aspect of the disclosure may seek to provide a method that automates calibration of a pump, or a plurality of pumps, installed in a thermal management system. The at least one component requiring thermal management and the pump(s) may be interconnected by a fluid conduit network for circulating fluid through the thermal management system. A technical benefit may include a shorter installation time for new pumps in a thermal management system, requiring less resources to correctly calibrate the fluid flow provided by the pump(s). Further, a system supplier does not need to verify fluid flow of the thermal management system at the customer. Energy may be saved due to optimally calibrated pump speed. Also, as another example, the computer system may be plug-and-play, being adaptable to any configuration of thermal management systems. Advantages and technical benefits of the second aspect of the disclosure are analogous to the advantages and technical benefits of the first aspect of the disclosure, and vice versa. It shall also be noted that features of the second aspect of the disclosure are combinable with features of the first aspect of the disclosure, and vice versa.

[0059]

[0026] Optionally in some examples, including in at least one preferred example, the measured pump parameter of the at least one pump indicative of pump power consumption is any one or a combination of the following:

[0060] - an output signal from the at least one pump indicative of pump power consumption,

[0061] - a measured input power or input current to the at least one pump.

[0062]

[0027] Optionally in some examples, including in at least one preferred example, the method further comprises: continuously or intermittently monitoring, by the processing circuitry, the status of the thermal management system and therefrom determining the required fluid flow rate of the at least one pump.

[0063]

[0028] Optionally in some examples, including in at least one preferred example, the data about the status of the thermal management system comprises any one or any combination of the following data: - type of component of the respective component of the at least one component requiring thermal management,

[0064] - nominal flow requirement of the respective component of the at least one component requiring thermal management,

[0065] - power consumption of the respective component of the at least one component requiring thermal management,

[0066] - operating temperature of the respective component of the at least one component requiring thermal management,

[0067] - ambient temperature, and

[0068] - running mode imposed on the thermal management system.

[0069]

[0029] Optionally in some examples, including in at least one preferred example, the type of component of the respective component of the at least one component requiring thermal management is any one of an energy storage system, an electric charger, an electric power take-off, an electric motor / generator, a heater, an inverter, a converter, a condenser, an evaporator, a heat exchanger, a compressor, and a gearbox.

[0070]

[0030] Optionally in some examples, including in at least one preferred example, the running mode imposed on the thermal management system is any one of an economic mode, a standard mode and a performance mode.

[0071]

[0031] Optionally in some examples, including in at least one preferred example, the thermal management system comprises a plurality of components requiring thermal management.

[0072]

[0032] Optionally in some examples, including in at least one preferred example, the data about the status of the thermal management system comprises the following data:

[0073] - how the respective component of the plurality of components requiring thermal management are fluidly connected and / or arranged in relation to each other.

[0074]

[0033] Optionally in some examples, including in at least one preferred example, the thermal management system comprises at least one flow controlling member, and the data about the status of the thermal management system comprises number of flow controlling members and / or type of flow controlling members of the thermal management system.

[0075]

[0034] Optionally in some examples, including in at least one preferred example, the method comprises: - based on the data about the status of the thermal management system, selecting, by the processing circuitry, a thermal management system configuration from a plurality of predetermined thermal management system configurations, wherein the respective predetermined thermal management system configuration is associated with a predetermined required flow rate of the at least one pump, and

[0076] - determining, by the processing circuitry, the required fluid flow rate of the at least one pump based on the obtained data about the status of the thermal management system by selecting the predetermined required flow rate which is associated with the selected thermal management system configuration.

[0077]

[0035] Optionally in some examples, including in at least one preferred example, the method comprises:

[0078] - based on the data about the status of the thermal management system, selecting, by the processing circuitry, a thermal management system configuration and associating, by the processing circuitry, a required flow rate of the at least one pump thereto by use of a trained machine learning algorithm , and

[0079] - determining, by the processing circuitry, the required fluid flow rate of the at least one pump based on the obtained data about the status of the thermal management system by selecting the required flow rate which is associated with the selected thermal management system configuration.

[0080]

[0036] Optionally in some examples, including in at least one preferred example, the thermal management system further comprises a sensor assembly, the method further comprising:

[0081] - obtaining, by the processing circuitry, fluid flow data from the sensor assembly, and

[0082] - further adjusting, by the processing circuitry, the current fluid flow rate of the at least one pump based on the obtained fluid flow data such that the current fluid flow rate approaches the required fluid flow rate.

[0083]

[0037] Optionally in some examples, including in at least one preferred example, the method further comprises:

[0084] - monitoring, by the processing circuitry, a temperature of the fluid and adjusting, by the processing circuitry, the current fluid flow rate of the at least one pump based on a viscosity of the fluid calculated from the monitored temperature.

[0038] According to a third aspect of the disclosure, there is provided a computer program product comprising program code for performing, when executed by the processing circuitry, the method of any one of the examples of the second aspect of the disclosure.

[0085]

[0039] According to a fourth aspect of the disclosure, there is provided a non-transitory computer-readable storage medium comprising instructions, which when executed by the processing circuitry, cause the processing circuitry to perform the method of any one of the examples of the second aspect of the disclosure.

[0086]

[0040] According to a fifth aspect of the disclosure, there is provided a thermal management system comprising at least one pump, at least one component requiring thermal management, and the computer system of any one of the examples of the first aspect of the disclosure.

[0087]

[0041] Optionally in some examples, including in at least one preferred example, the thermal management system further comprises a sensor assembly.

[0088]

[0042] According to a sixth aspect of the disclosure, there is provided a marine vessel or an electric machine comprising the thermal management system of any one of the examples of the fifth aspect of the disclosure.

[0089]

[0043] The disclosed aspects, examples (including any preferred examples), and / or accompanying claims may be suitably combined with each other as would be apparent to anyone of ordinary skill in the art. Additional features and advantages are disclosed in the following description, claims, and drawings, and in part will be readily apparent therefrom to those skilled in the art or recognized by practicing the disclosure as described herein.

[0090]

[0044] There are also disclosed herein computer systems, control units, code modules, computer-implemented methods, computer readable media, and computer program products associated with the above discussed technical benefits.

[0091] BRIEF DESCRIPTION OF THE DRAWINGS

[0092]

[0045] Examples are described in more detail below with reference to the appended drawings.

[0093]

[0046] Fig. 1 is an exemplary marine vessel according to an example of the sixth aspect of the disclosure, the marine vessel being shown as comprising a thermal management system according to the fifth aspect of the disclosure.

[0047] Fig. 2 is a schematic view of a thermal management system according to an example of the fifth aspect of the disclosure.

[0094]

[0048] Fig. 3 is an example, illustrated as a map, of flow rates of the at least one pump as a function of a predetermined pump parameter, the flow rates being provided at various pump speeds.

[0095]

[0049] Fig. 4 is an exemplary schematic illustration of a plurality of predetermined thermal management system configurations according to an example.

[0096]

[0050] Fig. 5 is an exemplary flow chart of a method according to the second aspect of the disclosure.

[0097]

[0051] Fig. 6 is another view of Fig. 2 according to an example.

[0098]

[0052] Fig. 7 is an exemplary system diagram of a computer system according to the first aspect of the disclosure.

[0099] DETAILED DESCRIPTION

[0100]

[0053] The detailed description set forth below provides information and examples of the disclosed technology with sufficient detail to enable those skilled in the art to practice the disclosure.

[0101]

[0054] The present disclosure provides a computer system and a method that automates calibration of a pump, or a plurality of pumps, installed in a thermal management system. Advantages may include a shorter installation time for new pumps in a thermal management system, requiring less resources to correctly calibrate the fluid flow provided by the pump(s). Further, a pump manufacturer may not need to verify fluid flow of the thermal management system at the customer. Energy may be saved due to optimally calibrated pump speed. Also, the system will be plug-and-play, being adaptable to any thermal management system configurations. This contrasts to conventionally calibrated thermal managements systems, where human resources may require significant manual work to calibrate a system.

[0102]

[0055] Fig. 1 is an exemplary marine vessel 6 according to the sixth aspect of the disclosure. The marine vessel 6 is shown as comprising a thermal management system 5 according to the fifth aspect of the disclosure. Alternatively, but not shown, an electric machine may comprise the thermal management system. Such an electric machine may be a stationary working machine or may be provided with an electric propulsion system. The marine vessel 6 or electric machine may comprise at least one thermal management system 5, or a number of thermal management systems 5. The thermal management systems 5 may be provided for a mechanical drive system, for an electric energy storage system (such as a battery pack) and / or for an electric machine drive unit, etc.

[0103]

[0056] Fig. 2 exemplify aspects of a thermal management system 5 according to an example, in this example represented by a block diagram. Fig. 3 exemplify stored fluid flow rate related data 14 according to an example, in this example represented by a map 14 or graph.

[0104]

[0057] With reference to e.g. Fig. 2, a computer system 500 is depicted comprising processing circuitry 502 configured to calibrate a flow of fluid in a thermal management system 5.

[0105]

[0058] The thermal management system 5 comprises at least one pump 10 controllable by the processing circuitry 502, and at least one component 12 requiring thermal management.

[0106]

[0059] In the shown example, the thermal management system 5 comprises two pumps 10 and five components 12 which are fluidly connected (indicated by arrows) in a fluid conduit network configuration for circulating fluid through the system. The fluid conduit network may comprise fluid series connections and / or fluid parallel connections. The thermal management system 5 may have an arbitrary configuration of pumps and components.

[0107]

[0060] The at least one pump 10 as disclosed herein may be any type of pump for pumping fluid, typically coolant fluid, in a thermal management system. By way of example, the at least one pump may be any one of a centrifugal pump, a positive displacement pump, a membrane pump, or any other pump for pumping fluid.

[0108]

[0061] The processing circuitry 502 is configured to obtain stored fluid flow rate related data 14 (see Fig. 3) describing fluid flow rates provided by the at least one pump 10 as a function of a predetermined pump parameter P and pump speed, wherein the predetermined pump parameter P is indicative of pump power consumption. The stored data may be stored in a local and / or remote database, and therefrom provided to and used by the processing circuitry 502. In the example shown in Fig. 3, the y-axis represents the predetermined pump parameter P and the x-axis represents the fluid flow rate at various pump speeds A-F.

[0109]

[0062] In the exemplary graph, or map, 14 of Fig. 3, the pump speeds are shown for:

[0110] A) 1000 rpm,

[0111] B) 2000 rpm,

[0112] C) 3000 rpm,

[0113] D) 4000 rpm, E) 5000 rpm, and

[0114] F) 5200 rpm.

[0115]

[0063] The processing circuitry 502 is further configured to obtain data about a status of the thermal management system 5, and to determine a required fluid flow rate of the at least one pump 10 based on the obtained data about the status of the thermal management system 5. The data about the status may be obtained by communication between the processing circuitry 502 of the computer system 500 and the components 12 of the thermal management system 5, by accessing a database, and / or from pre-stored information in the computer system 500, and / or by measurements.

[0116]

[0064] The processing circuitry 502 is further configured to operate the at least one pump 10 to provide the required fluid flow rate in accordance with the stored fluid flow rate related data 14. The required fluid flow rate is preferably the flow rate of the fluid required to keep components 12 of the thermal management system 5 at a pre-defined operating temperature. By way of example, the processing circuitry 502 may be configured to operate the at least one pump 10 by controlling pump speed to provide the required fluid flow rate in accordance with the stored fluid flow rate related data 14. In some examples, to operate the at least one pump 10 to provide the required fluid flow rate in accordance with the stored fluid flow rate related data 14 may comprise to operate the at least one pump 10 such that it achieves the required fluid flow rate at the lowest power consumption P. Thereby, energy efficiency may be improved.

[0117]

[0065] The processing circuitry 502 is further configured to monitor a current fluid flow rate of the at least one pump 10, wherein the current fluid flow rate of the at least one pump 10 is monitored based on the stored fluid flow rate related data 14, pump speed of the at least one pump 10, and a measured pump parameter of the at least one pump 10 indicative of pump power consumption P.

[0118]

[0066] The processing circuitry 502 is further configured to, when the monitored current fluid flow rate of the at least one pump 10 is different from the required fluid flow rate, control the at least one pump 10 such that the current fluid flow rate approaches the required fluid flow rate. The control may be arranged as a control loop, e.g., a feedback control loop, which is continuously or intermittently performed.

[0119]

[0067] By the computer system 500, calibration of the pump 10, or a plurality of pumps 10, installed in a thermal management system 5 is automated. Thereby, installation time may be shortened for new pumps 10 in a thermal management system, requiring less resources to correctly calibrate the fluid flow provided by the pump(s) 10.

[0120]

[0068] In some examples, when the current fluid flow rate differs from the required fluid flow rate by a pre-determined maximum acceptable flow difference, the fluid flow in the thermal management system 5 may be deemed calibrated and a calibration process is finished. In other words, when the difference between the current fluid flow rate and the required fluid flow rate falls below the pre-determined maximum acceptable flow difference, the current fluid flow rate may be deemed equal to the required fluid flow rate and the calibration processed is finished.

[0121]

[0069] The measured pump parameter of the at least one pump 10 indicative of pump power consumption is preferably any one or a combination of the following:

[0122] - an output signal from the at least one pump 10 indicative of pump power consumption, e.g., the output signal may be power P,

[0123] - a measured input power P or input current to the at least one pump 10.

[0124]

[0070] By said output signal and / or measured input to the at least one pump 10, the current fluid flow rate may be more quickly adapted to the required fluid flow rate and energy may thereby be saved by dynamically meeting the system flow requirements.

[0125]

[0071] To monitor the current fluid flow rate based on the stored fluid flow rate related data 14, pump speed of the at least one pump 10, and the measured pump parameter of the at least one pump 10 preferably comprises matching the measured pump parameter of the at least one pump 10 with the predetermined pump parameter P in the stored fluid flow rate related data 14, and / or matching the pump speed of the at least one pump 10 with the pump speed in the stored fluid flow rate related data 14.

[0126]

[0072] The processing circuitry 502 may further be configured to continuously or intermittently monitor the status of the thermal management system 5 and therefrom determine the required fluid flow rate of the at least one pump 10. Accordingly, in some examples, the required fluid flow rate may be adjusted, i.e., vary over time, in response to a status change of the thermal management system 5.

[0127]

[0073] The data about the status of the thermal management system 5 may comprises any one or any combination of the following data:

[0128] - type of component of the respective component of the at least one component 12 requiring thermal management, - nominal flow requirement of the respective component of the at least one component 12 requiring thermal management,

[0129] - power consumption of the respective component of the at least one component 12 requiring thermal management,

[0130] - operating temperature of the respective component of the at least one component 12 requiring thermal management,

[0131] - ambient temperature, and

[0132] - running mode imposed on the thermal management system 5.

[0133]

[0074] In some examples, the data about the status of the thermal management system 5 may be categorized into at least two different groups, comprising operational status data and static or fixed status data. The operational status data may be defined as status conditions that may vary over time, such as any one of the above-mentioned ambient temperature, power consumption of the respective component, operating temperature and running mode. The static or fixed status data may be defined as status conditions which are constant over time or at least likely to be constant over time, e.g., during the lifetime of the thermal management system 5. This may comprise the type of component of the respective component of the at least one component 12 requiring thermal management, how the components are fluidly connected, which other components are part of the thermal management system 5, etc.

[0134]

[0075] The type of component of the respective component of the at least one component 12 requiring thermal management may be any one of an energy storage system, an electric charger, an electric power take-off, an electric motor / generator, a heater, an inverter, a converter, a condenser, an evaporator, a heat exchanger, a compressor, and a gearbox.

[0135]

[0076] The running mode imposed on the thermal management system 5 may be any one of an economic mode, a standard mode and a performance mode. Accordingly, in some examples, the required fluid flow rate may be adjusted according to the current mode, such as an economic mode, and thereby causing the current fluid flow rate, provided by the at least one pump, to adapt to the applied mode.

[0136]

[0077] Typically, as depicted in Fig. 2, the thermal management system 5 comprises a plurality of components 12 requiring thermal management. The data about the status of the thermal management system 5 may hence comprise how the respective component of the plurality of components 12 requiring thermal management are fluidly connected and / or arranged in relation to each other.

[0078] The thermal management system 5 may further comprise at least one flow controlling member 13, such as a valve or a flow restrictor. The data about the status of the thermal management system 5 may hence comprise number of flow controlling members and / or type of flow controlling members of the thermal management system 5.

[0137]

[0079] Fig. 4 depicts a schematic illustration of a plurality of predetermined thermal management configurations 5'-5"" according to an example.

[0138]

[0080] With reference to e.g. Fig. 4, the processing circuitry 502 may be configured to:

[0139] - based on the data about the status of the thermal management system 5, select a thermal management system configuration from a plurality of predetermined thermal management system configurations 5'-5"", wherein the respective predetermined thermal management system configuration 5'-5"" is associated with a predetermined required flow rate of the at least one pump 10. The predetermined thermal management system configuration 5'-5"" and their associated predetermined required flow rates may be stored in a memory, e.g., in a database, which is local and / or remote. In some examples, the selection may be performed by matching the status data with the predetermined thermal management system configurations 5'-5"", e.g., by selecting a thermal management system configuration which corresponds to, or which most closely corresponds to, the obtained status data.

[0140]

[0081] In the example shown in Fig. 4, four different predetermined thermal management configurations 5'-5"" are shown. The difference between the system configurations 5'-5"" may for example relate to the number of components, type of components, how the components are fluidly connected, etc.

[0141]

[0082] The predetermined required flow rate of the at least one pump 10 for the respective predetermined thermal management system configuration 5'-5"" may have been obtained by empirical tests, simulations, calculations, etc.

[0142]

[0083] The processing circuitry 502 may further be configured to determine the required fluid flow rate of the at least one pump 10 based on the obtained data about the status of the thermal management system 5 by selecting the predetermined required flow rate which is associated with the selected thermal management system configuration 5'-5"".

[0143]

[0084] The processing circuitry 502 may be configured to:

[0144] - based on the data about the status of the thermal management system 5, select a thermal management system configuration and associate a required flow rate of the at least one pump 10 thereto by use of a trained machine learning algorithm. By way of example, the trained machine learning algorithm may be trained based on status data of different thermal management system configurations, such as trained based on any one or a combination of the predetermined thermal management configurations 5'-5"" shown in Fig. 4, operational data obtained during operation of the thermal management system 5, and operational data obtained during operation of other thermal management systems. Accordingly, in some examples, by continuously training the machine learning algorithm, improved and more accurate values for a required fluid flow rate may be obtained.

[0145]

[0085] The processing circuitry 502 may be configured to determine the required fluid flow rate of the at least one pump 10 based on the obtained data about the status of the thermal management system 5 by selecting the required flow rate which is associated with the selected thermal management system configuration. Accordingly, the required fluid flow rate for the thermal management system 5 may be determined based on the trained machine learning algorithm.

[0146]

[0086] The trained machine learning algorithm may be any type of machine learning algorithm, such as but not limited to a linear regression model, K-Nearest Neighbors (KNN) algorithm, Learning Vector Quantization, Support Vector Machines (SVM), Neural networks, etc.

[0147]

[0087] In some examples, as depicted in Fig. 2, the thermal management system 5 may further comprises a sensor assembly 16. At least one property of a fluid flow may be measured by the sensor assembly 16, such as a temperature, and / or pressure, in at least one location of the thermal management system 5. The processing circuitry 502 may further be configured to:

[0148] - obtain fluid flow data from the sensor assembly 16, and

[0149] - further adjust the current fluid flow rate of the at least one pump 10 based on the obtained fluid flow data such that the current fluid flow rate approaches the required fluid flow rate.

[0150]

[0088] The processing circuitry 502 may further be configured to monitor a temperature of the fluid and to adjust the current fluid flow rate of the at least one pump 10 based on a viscosity of the fluid calculated from the monitored temperature. The calibration process may thereby be faster because the current fluid flow rate is more accurately adjusted towards the required fluid flow rate.

[0151]

[0089] Fig. 5 depicts an exemplary flowchart of a computer-implemented method 2 for calibrating a flow of fluid in a thermal management system 5 according to an example of the present disclosure. The thermal management system 5 may for example be the system shown in Fig. 2.

[0152]

[0090] The method comprises:

[0153] SI: obtaining, by processing circuitry 502 of a computer system 500, stored fluid flow rate related data 14 describing fluid flow rates provided by the at least one pump 10 as a function of a predetermined pump parameter P and pump speed, wherein the predetermined pump parameter P is indicative of pump power consumption,

[0154] S2: obtaining, by the processing circuitry 502, data about a status of the thermal management system 5,

[0155] S3: determining, by the processing circuitry 502, a required fluid flow rate of the at least one pump 10 based on the obtained data about the status of the thermal management system 5, S4: operating, by the processing circuitry 502, the at least one pump 10 to provide the required fluid flow rate in accordance with the stored fluid flow rate related data 14, S5: monitoring, by the processing circuitry 502, a current fluid flow rate of the at least one pump 10, wherein the current fluid flow rate of the at least one pump 10 is monitored based on the stored fluid flow rate related data 14, pump speed of the at least one pump 10, and a measured pump parameter of the at least one pump 10 indicative of pump power consumption, and

[0156] S6: when the monitored current fluid flow rate of the at least one pump 10 is different from the required fluid flow rate, controlling, by the processing circuitry 502, the at least one pump 10 such that the current fluid flow rate approaches the required fluid flow rate.

[0157]

[0091] The method may further comprise continuously or intermittently monitoring, by the processing circuitry 502, the status of the thermal management system 5 and therefrom determining S3 the required fluid flow rate of the at least one pump 10.

[0158]

[0092] In some examples, the method may comprise (indicated by a box with dashed lines in Fig. 5):

[0159] - based on the data about the status of the thermal management system 5, selecting S30, by the processing circuitry 502, a thermal management system configuration from a plurality of predetermined thermal management system configurations 5'-5"", wherein the respective predetermined thermal management system configuration 5'-5"" is associated with a predetermined required flow rate of the at least one pump 10, and - determining S3, by the processing circuitry 502, the required fluid flow rate of the at least one pump 10 based on the obtained data about the status of the thermal management system 5 by selecting the predetermined required flow rate which is associated with the selected thermal management system configuration.

[0160]

[0093] In some examples, the method may comprise (indicated by a box with dashed lines in Fig. 5):

[0161] - based on the data about the status of the thermal management system 5, selecting S3 O', by the processing circuitry 502, a thermal management system configuration and associating S30', by the processing circuitry 502, a required flow rate of the at least one pump 10 thereto by use of a trained machine learning algorithm, and

[0162] - determining S3, by the processing circuitry 502, the required fluid flow rate of the at least one pump 10 based on the obtained data about the status of the thermal management system 5 by selecting the required flow rate which is associated with the selected thermal management system configuration.

[0163]

[0094] With respect to the example when the thermal management system 5 further comprises a sensor assembly 16 as disclosed herein, the method may further comprise:

[0164] - obtaining, by the processing circuitry 502, fluid flow data from the sensor assembly 16, and

[0165] - further adjusting S7, by the processing circuitry 502, the current fluid flow rate of the at least one pump 10 based on the obtained fluid flow data such that the current fluid flow rate approaches the required fluid flow rate.

[0166]

[0095] In some examples, the method may further comprise:

[0167] - monitoring, by the processing circuitry 502, a temperature of the fluid and adjusting S7', by the processing circuitry 502, the current fluid flow rate of the at least one pump 10 based on a viscosity of the fluid calculated from the monitored temperature.

[0168]

[0096] Fig. 6 is another view of Fig. 2 according to an example. The computer system 500 comprising processing circuitry 502 configured to calibrate a flow of fluid in a thermal management system 5, the thermal management system 5 comprising:

[0169] - at least one pump 10 controllable by the processing circuitry 502, and

[0170] - at least one component 12 requiring thermal management, the processing circuitry 502 being configured to: - obtain stored fluid flow rate related data 14 describing fluid flow rates provided by the at least one pump 10 as a function of a predetermined pump parameter P and pump speed, wherein the predetermined pump parameter P is indicative of pump power consumption,

[0171] - obtain data about a status of the thermal management system 5,

[0172] - determine a required fluid flow rate of the at least one pump 10 based on the obtained data about the status of the thermal management system 5,

[0173] - operate the at least one pump 10 to provide the required fluid flow rate in accordance with the stored fluid flow rate related data 14,

[0174] - monitor a current fluid flow rate of the at least one pump 10, wherein the current fluid flow rate of the at least one pump 10 is monitored based on the stored fluid flow rate related data 14, pump speed of the at least one pump 10, and a measured pump parameter of the at least one pump 10 indicative of pump power consumption, and

[0175] - when the monitored current fluid flow rate of the at least one pump 10 is different from the required fluid flow rate, control the at least one pump 10 such that the current fluid flow rate approaches the required fluid flow rate.

[0176]

[0097] Fig. 7 is an exemplary system diagram of a computer system 500 according to the first aspect of the disclosure. The computer system 500 is described more in detail below. However, according to the third aspect of the disclosure, there is also provided a computer program product 520 comprising program code for performing, when executed by the processing circuitry 502, the method 2 of any one of the examples of the second aspect of the disclosure. The third aspect of the disclosure may seek to control the at least one pump 10 of the thermal management system 5 to control the current fluid flow rate to approach the required fluid flow rate in a quick and robust manner.

[0177]

[0098] According to the fourth aspect of the disclosure, there is also provided a non- transitory computer-readable storage medium 514 comprising instructions, which when executed by the processing circuitry, cause the processing circuitry 502 to perform the method 2 of any one of the examples of the second embodiment of the disclosure.

[0178]

[0099] FIG. 7 is a schematic diagram of a computer system 500 for implementing examples disclosed herein. The computer system 500 is adapted to execute instructions from a computer-readable medium to perform these and / or any of the functions or processing described herein. The computer system 500 may be connected (e.g., networked) to other machines in a LAN (Local Area Network), LIN (Local Interconnect Network), automotive network communication protocol (e.g., FlexRay), an intranet, an extranet, or the Internet. While only a single device is illustrated, the computer system 500 may include any collection of devices that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein. Accordingly, any reference in the disclosure and / or claims to a computer system, computing system, computer device, computing device, control system, control unit, electronic control unit (ECU), processor device, processing circuitry, etc., includes reference to one or more such devices to individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein. For example, control system may include a single control unit or a plurality of control units connected or otherwise communicatively coupled to each other, such that any performed function may be distributed between the control units as desired. Further, such devices may communicate with each other or other devices by various system architectures, such as directly or via a Controller Area Network (CAN) bus, etc.

[0179]

[0100] The computer system 500 may comprise at least one computing device or electronic device capable of including firmware, hardware, and / or executing software instructions to implement the functionality described herein. The computer system 500 may include processing circuitry 502 (e.g., processing circuitry including one or more processor devices or control units), a memory 504, and a system bus 506. The computer system 500 may include at least one computing device having the processing circuitry 502. The system bus 506 provides an interface for system components including, but not limited to, the memory 504 and the processing circuitry 502. The processing circuitry 502 may include any number of hardware components for conducting data or signal processing or for executing computer code stored in memory 504. The processing circuitry 502 may, for example, include a general-purpose processor, an application specific processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA), a circuit containing processing components, a group of distributed processing components, a group of distributed computers configured for processing, or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. The processing circuitry 502 may further include computer executable code that controls operation of the programmable device.

[0101] The system bus 506 may be any of several types of bus structures that may further interconnect to a memory bus (with or without a memory controller), a peripheral bus, and / or a local bus using any of a variety of bus architectures. The memory 504 may be one or more devices for storing data and / or computer code for completing or facilitating methods described herein. The memory 504 may include database components, object code components, script components, or other types of information structure for supporting the various activities herein. Any distributed or local memory device may be utilized with the systems and methods of this description. The memory 504 may be communicably connected to the processing circuitry 502 (e.g., via a circuit or any other wired, wireless, or network connection) and may include computer code for executing one or more processes described herein. The memory 504 may include non-volatile memory 508 (e.g., read-only memory (ROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), etc.), and volatile memory 510 (e.g., randomaccess memory (RAM)), or any other medium which can be used to carry or store desired program code in the form of machine-executable instructions or data structures and which can be accessed by a computer or other machine with processing circuitry 502. A basic input / output system (BIOS) 512 may be stored in the non-volatile memory 508 and can include the basic routines that help to transfer information between elements within the computer system 500.

[0180]

[0102] The computer system 500 may further include or be coupled to a non-transitory computer-readable storage medium such as the storage device 514, which may comprise, for example, an internal or external hard disk drive (HDD) (e.g., enhanced integrated drive electronics (EIDE) or serial advanced technology attachment (SATA)), HDD (e.g., EIDE or SATA) for storage, flash memory, or the like. The storage device 514 and other drives associated with computer-readable media and computer-usable media may provide nonvolatile storage of data, data structures, computer-executable instructions, and the like.

[0181]

[0103] Computer-code which is hard or soft coded may be provided in the form of one or more modules. The module(s) can be implemented as software and / or hard-coded in circuitry to implement the functionality described herein in whole or in part. The modules may be stored in the storage device 514 and / or in the volatile memory 510, which may include an operating system 516 and / or one or more program modules 518. All or a portion of the examples disclosed herein may be implemented as a computer program 520 stored on a transitory or non-transitory computer-usable or computer-readable storage medium (e.g., single medium or multiple media), such as the storage device 514, which includes complex programming instructions (e.g., complex computer-readable program code) to cause the processing circuitry 502 to carry out actions described herein. Thus, the computer-readable program code of the computer program 520 can comprise software instructions for implementing the functionality of the examples described herein when executed by the processing circuitry 502. In some examples, the storage device 514 may be a computer program product (e.g., readable storage medium) storing the computer program 520 thereon, where at least a portion of a computer program 520 may be loadable (e.g., into a processor) for implementing the functionality of the examples described herein when executed by the processing circuitry 502. The processing circuitry 502 may serve as a controller or control system for the computer system 500 that is to implement the functionality described herein.

[0182]

[0104] The computer system 500 may include an input device interface 522 configured to receive input and selections to be communicated to the computer system 500 when executing instructions, such as from a keyboard, mouse, touch-sensitive surface, etc. Such input devices may be connected to the processing circuitry 502 through the input device interface 522 coupled to the system bus 506 but can be connected through other interfaces, such as a parallel port, an Institute of Electrical and Electronic Engineers (IEEE) 1394 serial port, a Universal Serial Bus (USB) port, an IR interface, and the like. The computer system 500 may include an output device interface 524 configured to forward output, such as to a display, a video display unit (e.g., a liquid crystal display (LCD) or a cathode ray tube (CRT)). The computer system 500 may include a communications interface 526 suitable for communicating with a network as appropriate or desired.

[0183]

[0105] The operational actions described in any of the exemplary aspects herein are described to provide examples and discussion. The actions may be performed by hardware components, may be embodied in machine-executable instructions to cause a processor to perform the actions, or may be performed by a combination of hardware and software. Although a specific order of method actions may be shown or described, the order of the actions may differ. In addition, two or more actions may be performed concurrently or with partial concurrence.

[0184]

[0106] In the below possible features and feature combinations of the present disclosure are presented as a list of Examples.

[0107] Example 1 : A computer system (500) comprising processing circuitry (502) configured to calibrate a flow of fluid in a thermal management system (5), the thermal management system (5) comprising:

[0185] - at least one pump (10) controllable by the processing circuitry (502), and

[0186] - at least one component (12) requiring thermal management, the processing circuitry (502) being configured to:

[0187] - obtain stored fluid flow rate related data (14) describing fluid flow rates provided by the at least one pump (10) as a function of a predetermined pump parameter (P) and pump speed, wherein the predetermined pump parameter (P) is indicative of pump power consumption,

[0188] - obtain data about a status of the thermal management system (5),

[0189] - determine a required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5),

[0190] - operate the at least one pump (10) to provide the required fluid flow rate in accordance with the stored fluid flow rate related data (14),

[0191] - monitor a current fluid flow rate of the at least one pump (10), wherein the current fluid flow rate of the at least one pump (10) is monitored based on the stored fluid flow rate related data (14), pump speed of the at least one pump (10), and a measured pump parameter of the at least one pump (10) indicative of pump power consumption, and

[0192] - when the monitored current fluid flow rate of the at least one pump (10) is different from the required fluid flow rate, control the at least one pump (10) such that the current fluid flow rate approaches the required fluid flow rate.

[0193]

[0108] Example 2: The computer system (500) according to Example 1, wherein the measured pump parameter of the at least one pump (10) indicative of pump power consumption is any one or a combination of the following:

[0194] - an output signal from the at least one pump (10) indicative of pump power consumption,

[0195] - a measured input power or input current to the at least one pump (10).

[0196]

[0109] Example 3: The computer system (500) according to any one of the preceding Examples, wherein the processing circuitry (502) is further configured to continuously or intermittently monitor the status of the thermal management system (5) and therefrom determine the required fluid flow rate of the at least one pump (10).

[0110] Example 4: The computer system (500) according to any one of the preceding Examples, wherein the data about the status of the thermal management system (5) comprises any one or any combination of the following data:

[0197] - type of component of the respective component of the at least one component (12) requiring thermal management,

[0198] - nominal flow requirement of the respective component of the at least one component (12) requiring thermal management,

[0199] - power consumption of the respective component of the at least one component (12) requiring thermal management,

[0200] - operating temperature of the respective component of the at least one component (12) requiring thermal management,

[0201] - ambient temperature, and

[0202] - running mode imposed on the thermal management system (5).

[0203]

[0111] Example 5: The computer system (500) according to Example 4, wherein the type of component of the respective component of the at least one component (12) requiring thermal management is any one of an energy storage system, an electric charger, an electric power take-off, an electric motor / generator, a heater, an inverter, a converter, a condenser, an evaporator, a heat exchanger, a compressor, and a gearbox.

[0204]

[0112] Example 6: The computer system (500) according to Example 4 or 5, wherein the running mode imposed on the thermal management system (5) is any one of an economic mode, a standard mode and a performance mode.

[0205]

[0113] Example 7: The computer system (500) according to any one of the preceding Examples, wherein the thermal management system (5) comprises a plurality of components (12) requiring thermal management.

[0206]

[0114] Example 8: The computer system (500) according to Example 7, wherein the data about the status of the thermal management system (5) comprises the following data:

[0207] - how the respective component of the plurality of components (12) requiring thermal management are fluidly connected and / or arranged in relation to each other.

[0208]

[0115] Example 9: The computer system (500) according to any one of the preceding Examples, wherein the thermal management system (5) comprises at least one flow controlling member (13), and wherein the data about the status of the thermal management system (5) comprises number of flow controlling members and / or type of flow controlling members of the thermal management system (5).

[0209]

[0116] Example 10: The computer system (500) according to any one of the preceding Examples, wherein the processing circuitry (502) is configured to:

[0210] - based on the data about the status of the thermal management system (5), select a thermal management system configuration from a plurality of predetermined thermal management system configurations, wherein the respective predetermined thermal management system configuration is associated with a predetermined required flow rate of the at least one pump (10), and

[0211] - determine the required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5) by selecting the predetermined required flow rate which is associated with the selected thermal management system configuration.

[0212]

[0117] Example 11 : The computer system (500) according to any one of the preceding Examples, wherein the processing circuitry (502) is configured to:

[0213] - based on the data about the status of the thermal management system (5), select a thermal management system configuration and associate a required flow rate of the at least one pump (10) thereto by use of a trained machine learning algorithm, and

[0214] - determine the required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5) by selecting the required flow rate which is associated with the selected thermal management system configuration.

[0215]

[0118] Example 12: The computer system (500) according to any one of the preceding Examples, wherein the thermal management system (5) further comprises a sensor assembly (16), the processing circuitry (502) further being configured to:

[0216] - obtain fluid flow data from the sensor assembly (16), and

[0217] - further adjust the current fluid flow rate of the at least one pump (10) based on the obtained fluid flow data such that the current fluid flow rate approaches the required fluid flow rate.

[0218]

[0119] Example 13: The computer system (500) according to any one of the preceding Examples, wherein the processing circuitry (502) is further configured to monitor a temperature of the fluid and to adjust the current fluid flow rate of the at least one pump (10) based on a viscosity of the fluid calculated from the monitored temperature.

[0120] Example 14: A computer-implemented method for calibrating a flow of fluid in a thermal management system (5), the thermal management system (5) comprising:

[0219] - at least one pump (10) controllable by the processing circuitry (502), and

[0220] - at least one component (12) requiring thermal management, the method comprising:

[0221] - obtaining (SI), by processing circuitry (502) of a computer system (500), stored fluid flow rate related data (14) describing fluid flow rates provided by the at least one pump (10) as a function of a predetermined pump parameter (P) and pump speed, wherein the predetermined pump parameter (P) is indicative of pump power consumption,

[0222] - obtaining (S2), by the processing circuitry (502), data about a status of the thermal management system (5),

[0223] - determining (S3), by the processing circuitry (502), a required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5),

[0224] - operating (S4), by the processing circuitry (502), the at least one pump (10) to provide the required fluid flow rate in accordance with the stored fluid flow rate related data (14),

[0225] - monitoring (S5), by the processing circuitry (502), a current fluid flow rate of the at least one pump (10), wherein the current fluid flow rate of the at least one pump (10) is monitored based on the stored fluid flow rate related data (14), pump speed of the at least one pump (10), and a measured pump parameter of the at least one pump (10) indicative of pump power consumption, and

[0226] - when the monitored current fluid flow rate of the at least one pump (10) is different from the required fluid flow rate, controlling, by the processing circuitry (502), the at least one pump (10) such that the current fluid flow rate approaches the required fluid flow rate.

[0227]

[0121] Example 15: The method according to Example 14, wherein the measured pump parameter of the at least one pump (10) indicative of pump power consumption is any one or a combination of the following:

[0228] - an output signal from the at least one pump (10) indicative of pump power consumption,

[0229] - a measured input power or input current to the at least one pump (10).

[0230]

[0122] Example 16: The method according to any one of Examples 14-15, wherein the method further comprises: continuously or intermittently monitoring, by the processing circuitry (502), the status of the thermal management system (5) and therefrom determining the required fluid flow rate of the at least one pump (10).

[0231]

[0123] Example 17: The method according to any one of Examples 14-16, wherein the data about the status of the thermal management system (5) comprises any one or any combination of the following data:

[0232] - type of component of the respective component of the at least one component (12) requiring thermal management,

[0233] - nominal flow requirement of the respective component of the at least one component (12) requiring thermal management,

[0234] - power consumption of the respective component of the at least one component (12) requiring thermal management,

[0235] - operating temperature of the respective component of the at least one component (12) requiring thermal management,

[0236] - ambient temperature, and

[0237] - running mode imposed on the thermal management system (5).

[0238]

[0124] Example 18: The method according to Example 17, wherein the type of component of the respective component of the at least one component (12) requiring thermal management is any one of an energy storage system, an electric charger, an electric power take-off, an electric motor / generator, a heater, an inverter, a converter, a condenser, an evaporator, a heat exchanger, a compressor, and a gearbox.

[0239]

[0125] Example 19: The method according to Example 17 or 18, wherein the running mode imposed on the thermal management system (5) is any one of an economic mode, a standard mode and a performance mode.

[0240]

[0126] Example 20: The method according to any one of Examples 14-19, wherein the thermal management system (5) comprises a plurality of components (12) requiring thermal management.

[0241]

[0127] Example 21 : The method according to Example 20, wherein the data about the status of the thermal management system (5) comprises the following data:

[0242] - how the respective component of the plurality of components (12) requiring thermal management are fluidly connected and / or arranged in relation to each other.

[0243]

[0128] Example 22: The method according to any one of Examples 14-21, wherein the thermal management system (5) comprises at least one flow controlling member (13), and wherein the data about the status of the thermal management system (5) comprises number of flow controlling members and / or type of flow controlling members of the thermal management system (5).

[0244]

[0129] Example 23: The method according to any one of Examples 14-22, wherein the method comprises:

[0245] - based on the data about the status of the thermal management system (5), selecting, by the processing circuitry (502), a thermal management system configuration from a plurality of predetermined thermal management system configurations, wherein the respective predetermined thermal management system configuration is associated with a predetermined required flow rate of the at least one pump (10), and

[0246] - determining, by the processing circuitry (502), the required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5) by selecting the predetermined required flow rate which is associated with the selected thermal management system configuration.

[0247]

[0130] Example 24: The method according to any one of Examples 14-23, wherein the method comprises:

[0248] - based on the data about the status of the thermal management system (5), selecting, by the processing circuitry (502), a thermal management system configuration and associating, by the processing circuitry (502), a required flow rate of the at least one pump (10) thereto by use of a trained machine learning algorithm, and

[0249] - determining, by the processing circuitry (502), the required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5) by selecting the required flow rate which is associated with the selected thermal management system configuration.

[0250]

[0131] Example 25: The method according to any one of Examples 14-24, wherein the thermal management system (5) further comprises a sensor assembly (16), the method further comprising:

[0251] - obtaining, by the processing circuitry (502), fluid flow data from the sensor assembly (16), and

[0252] - further adjusting, by the processing circuitry (502), the current fluid flow rate of the at least one pump (10) based on the obtained fluid flow data such that the current fluid flow rate approaches the required fluid flow rate.

[0132] Example 26: The method according to any one of Examples 14-25, wherein the method further comprises:

[0253] - monitoring, by the processing circuitry (502), a temperature of the fluid and adjusting, by the processing circuitry (502), the current fluid flow rate of the at least one pump (10) based on a viscosity of the fluid calculated from the monitored temperature.

[0254]

[0133] Example 27: A computer program product (520) comprising program code for performing, when executed by the processing circuitry (502), the method (2) of any one of Examples 14-26.

[0255]

[0134] Example 28: A non-transitory computer-readable storage medium (514) comprising instructions, which when executed by the processing circuitry (502), cause the processing circuitry (502) to perform the method (2) of any one of Examples 14-26.

[0256]

[0135] Example 29: A thermal management system (5) comprising at least one pump (10), at least one component (12) requiring thermal management, and the computer system (500) of any one of Examples 1-13.

[0257]

[0136] Example 30: The thermal management system (5) of Example 29, further comprising a sensor assembly (16).

[0258]

[0137] Example 31 : A marine vessel (6) or an electric machine (6) comprising the thermal management system (5) of any one of Examples 29-30.

[0259]

[0138] The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprises," "comprising," "includes," and / or "including" when used herein specify the presence of stated features, integers, actions, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, actions, steps, operations, elements, components, and / or groups thereof.

[0260]

[0139] It will be understood that, although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element without departing from the scope of the present disclosure.

[0140] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe a relationship of one element to another element as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

[0261]

[0141] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0262]

[0142] It is to be understood that the present disclosure is not limited to the aspects described above and illustrated in the drawings; rather, the skilled person will recognize that many changes and modifications may be made within the scope of the present disclosure and appended claims. In the drawings and specification, there have been disclosed aspects for purposes of illustration only and not for purposes of limitation, the scope of the disclosure being set forth in the following claims.

Claims

ClaimsWhat is claimed is:

1. A computer system (500) comprising processing circuitry (502) configured to calibrate a flow of fluid in a thermal management system (5), the thermal management system (5) comprising:- at least one pump (10) controllable by the processing circuitry (502), and- at least one component (12) requiring thermal management, the processing circuitry (502) being configured to:- obtain stored fluid flow rate related data (14) describing fluid flow rates provided by the at least one pump (10) as a function of a predetermined pump parameter (P) and pump speed, wherein the predetermined pump parameter (P) is indicative of pump power consumption,- obtain data about a status of the thermal management system (5),- determine a required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5),- operate the at least one pump (10) to provide the required fluid flow rate in accordance with the stored fluid flow rate related data (14),- monitor a current fluid flow rate of the at least one pump (10), wherein the current fluid flow rate of the at least one pump (10) is monitored based on the stored fluid flow rate related data (14), pump speed of the at least one pump (10), and a measured pump parameter of the at least one pump (10) indicative of pump power consumption, and- when the monitored current fluid flow rate of the at least one pump (10) is different from the required fluid flow rate, control the at least one pump (10) such that the current fluid flow rate approaches the required fluid flow rate.

2. The computer system (500) according to claim 1, wherein the measured pump parameter of the at least one pump (10) indicative of pump power consumption is any one or a combination of the following:- an output signal from the at least one pump (10) indicative of pump power consumption,- a measured input power or input current to the at least one pump (10).

3. The computer system (500) according to any one of the preceding claims, wherein the processing circuitry (502) is further configured to continuously or intermittently monitor the status of the thermal management system (5) and therefrom determine the required fluid flow rate of the at least one pump (10).

4. The computer system (500) according to any one of the preceding claims, wherein the data about the status of the thermal management system (5) comprises any one or any combination of the following data:- type of component of the respective component of the at least one component (12) requiring thermal management,- nominal flow requirement of the respective component of the at least one component (12) requiring thermal management,- power consumption of the respective component of the at least one component (12) requiring thermal management,- operating temperature of the respective component of the at least one component (12) requiring thermal management,- ambient temperature, and- running mode imposed on the thermal management system (5).

5. The computer system (500) according to any one of the preceding claims, wherein the thermal management system (5) comprises a plurality of components (12) requiring thermal management, and wherein the data about the status of the thermal management system (5) comprises the following data:- how the respective component of the plurality of components (12) requiring thermal management are fluidly connected and / or arranged in relation to each other.

6. The computer system (500) according to any one of the preceding claims, wherein the thermal management system (5) comprises at least one flow controlling member (13), and wherein the data about the status of the thermal management system (5)comprises number of flow controlling members and / or type of flow controlling members of the thermal management system (5).

7. The computer system (500) according to any one of the preceding claims, wherein the processing circuitry (502) is configured to:- based on the data about the status of the thermal management system (5), select a thermal management system configuration from a plurality of predetermined thermal management system configurations, wherein the respective predetermined thermal management system configuration is associated with a predetermined required flow rate of the at least one pump (10), and- determine the required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5) by selecting the predetermined required flow rate which is associated with the selected thermal management system configuration.

8. The computer system (500) according to any one of the preceding claims, wherein the processing circuitry (502) is configured to:- based on the data about the status of the thermal management system (5), select a thermal management system configuration and associate a required flow rate of the at least one pump (10) thereto by use of a trained machine learning algorithm, and- determine the required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5) by selecting the required flow rate which is associated with the selected thermal management system configuration.

9. The computer system (500) according to any one of the preceding claims, wherein the thermal management system (5) further comprises a sensor assembly (16), the processing circuitry (502) further being configured to:- obtain fluid flow data from the sensor assembly (16), and- further adjust the current fluid flow rate of the at least one pump (10) based on the obtained fluid flow data such that the current fluid flow rate approaches the required fluid flow rate.

10. The computer system (500) according to any one of the preceding claims, wherein the processing circuitry (502) is further configured to monitor a temperature of the fluid and to adjust the current fluid flow rate of the at least one pump (10) based on a viscosity of the fluid calculated from the monitored temperature.

11. A computer-implemented method for calibrating a flow of fluid in a thermal management system (5), the thermal management system (5) comprising:- at least one pump (10) controllable by the processing circuitry (502), and- at least one component (12) requiring thermal management, the method comprising:- obtaining (SI), by processing circuitry (502) of a computer system (500), stored fluid flow rate related data (14) describing fluid flow rates provided by the at least one pump (10) as a function of a predetermined pump parameter (P) and pump speed, wherein the predetermined pump parameter (P) is indicative of pump power consumption,- obtaining (S2), by the processing circuitry (502), data about a status of the thermal management system (5),- determining (S3), by the processing circuitry (502), a required fluid flow rate of the at least one pump (10) based on the obtained data about the status of the thermal management system (5),- operating (S4), by the processing circuitry (502), the at least one pump (10) to provide the required fluid flow rate in accordance with the stored fluid flow rate related data (14),- monitoring (S5), by the processing circuitry (502), a current fluid flow rate of the at least one pump (10), wherein the current fluid flow rate of the at least one pump (10) is monitored based on the stored fluid flow rate related data (14), pump speed of the at least one pump (10), and a measured pump parameter of the at least one pump (10) indicative of pump power consumption, and- when the monitored current fluid flow rate of the at least one pump (10) is different from the required fluid flow rate, controlling (S6), by the processing circuitry (502),the at least one pump (10) such that the current fluid flow rate approaches the required fluid flow rate.

12. A computer program product (520) comprising program code for performing, when executed by the processing circuitry (502), the method (2) of claim 11.

13. A non-transitory computer-readable storage medium (514) comprising instructions, which when executed by the processing circuitry (502), cause the processing circuitry (502) to perform the method (2) of claim 11.

14. A thermal management system (5) comprising at least one pump (10), at least one component (12) requiring thermal management, and the computer system (500) of any one of claims 1-10.

15. A marine vessel (6) or an electric machine (6) comprising the thermal management system (5) of claim 14.

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