Method of producing an optoelectronic component and optoelectronic component

Abstract

A method of producing an optoelectronic component (10) comprises the following method steps. A first foil (2) comprising a top side (3) and a bottom side (4) is provided, wherein at least one optoelectronic semiconductor chip (5) designed to emit electromagnetic radiation is arranged at the top side (3) of the first foil (2). An encapsulation film (9) which is at least partially cured is arranged at the top side (3) of the first foil (2), wherein the optoelectronic semiconductor chip (5) is embedded into the encapsulation film (9).

Description

[0001] METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT

[0002] DESCRIPTION

[0003] The present invention refers to a method of producing an optoelectronic component and an optoelectronic component .

[0004] This patent application claims the priority of German patent application 10 2024 105 961 . 3 , the disclosure content of which is hereby incorporated by reference .

[0005] From the state of the art , optoelectronic components comprising light emitting diodes ( LEDs ) arranged on a foil are known . So far, only very special materials like e . g . polyvinyl butyral ( PVB ) , ethylene-vinyl acetate (EVA) or Sentry Glass are suitable for an encapsulation of the foil . However, these materials comprise disadvantages in terms of robustness and compatibility with customer systems .

[0006] An obj ective of the present invention is to speci fy an improved method of producing an optoelectronic component and to provide an improved optoelectronic component . This obj ective is solved by a method of producing an optoelectronic component and an optoelectronic component with the features of the independent claims , respectively . Advantageous embodiments are speci fied in the dependent claims .

[0007] A method of producing an optoelectronic component comprises the following method steps . A first foil comprising a top side and a bottom side is provided, wherein at least one optoelectronic semiconductor chip designed to emit electromagnetic radiation is arranged at the top side of the first foil . An encapsulation film which is at least partially cured is arranged at the top side of the first foil , wherein the optoelectronic semiconductor chip is embedded into the encapsulation film . The encapsulation film comprises a cross-linked structure as it is at least partially cured . A partial curing can e . g . comprise exposing a material of the encapsulation f ilm to ambient conditions for a few minutes . However, a partial curing can also include heating the material of the encapsulation film . A partial curing can also be performed for di f ferent time spans and for example in inert atmospheres . Advantageously, the encapsulation film can be easily applied without using liquid encapsulation materials . The encapsulation film also acts as a barrier and protects the optoelectronic semiconductor chip . Thus , a robust optoelectronic component can be provided . A compatibility of the optoelectronic component with further systems can be improved by a choice of the materials of the encapsulation film and the first foil .

[0008] In an embodiment the encapsulation film is cured at least partially by addition curing before arranging the encapsulation film at the top side of the first foil . Addition curing is performed by blending two components , a base and a catalyst , in order to induce the curing process . In contrast to condensation curing, addition curing advantageously does not lead to liquid by products and shrinkage . Also , addition curing can be performed without forming water or alcohol which can af fect the optoelectronic component .

[0009] In an embodiment the encapsulation film is cured completely after arranging the encapsulation film at the top s ide of the first foil and embedding the optoelectronic semiconductor chip into the encapsulation film . This additional curing step may be necessary i f the encapsulation film is only partially cured initially .

[0010] In an embodiment the encapsulation film is a bi-stage material . A bi-stage material comprises two di f ferent curing mechanisms of cross-linking or two di f ferent critical curing temperatures for the same cross-linking mechanism . Advantageously, the two di f ferent curing mechanisms or critical curing temperatures can be used in order to cure the encapsulation film partially by means of a first curing mechanism or a first curing temperature , arranging the encapsulation film at the top side of the first foil and curing the encapsulation film completely by means of a second curing mechani sm or a second curing temperature .

[0011] In an embodiment a second foil or a cover is arranged at the encapsulation film such that the encapsulation film is arranged between the first foil and the second foil or between the first foil and the cover . Advantageously, the optoelectronic semiconductor chip embedded in the encapsulation film is additionally covered by the second foil or the cover and therefore mechanically protected .

[0012] In an embodiment a plasma treatment and / or a corona treatment of the top side of the first foil and / or a further bottom side of the second foil or the cover facing the encapsulation film is performed before arranging the encapsulation film at the top side of the first foil and / or arranging the second foil or the cover at the encapsulation film . Advantageously, a plasma treatment and / or a corona treatment of the first foil and / or the second foil or the cover can enhance an adhesion between the encapsulation film and the first foil and / or the second foil or the cover . A corona treatment is a technique where a corona discharge plasma, typically in air, is used to modi fy a surface by irradiation . Alternatively, any plasma can be used to modi fy the top side of the first foil or the further bottom side of the second foil or the cover which faces the encapsulation film in order to enhance sticking of the foils or the cover to the encapsulation film . Prior to the plasma and / or the corona treatment a dehydration or drying process of the first foil and / or the second foil or the cover can be performed to increase the ef ficiency of the surface modi fication . However, a drying process as well as a plasma and / or corona treatment can be omitted .

[0013] In an embodiment the encapsulation film comprises a silicone and the first foil and / or the second foil or the cover com- prises polyethylene terephthalate ( PET ) , glass , polymethyl methacrylate ( PMMA) or polycarbonate ( PC ) . The encapsulation film, the first foil and the second foil or the cover can also comprise other polymers , respectively . The materials of the encapsulation film, the first foil and the second foil or the cover can be chosen independently .

[0014] Advantageously, embedding the optoelectronic semiconductor chip in a silicone ensures a stable ageing behaviour as silicones are usually thermally and photochemically much more stable then e . g . PVB, EVA, PMMA, PC or other polymers . Apart from this , easy customer integration with other materials is possible due to the well-known properties of silicone and PET . The optoelectronic component comprises a bottom interface built by the bottom side of the first foil and a top interface built by a top side of the second foil or the cover facing away the encapsulation film . I f the first foil and / or the second foil or the cover comprises PET , a high compatibility with many customer integration methods is possible due to well-known interfaces . It is proven by temperature , humidity and bias tests , that an optoelectronic component comprising a top and a bottom PET foil is robust . I f the second foil or the cover is omitted the top interface is built by a surface of the encapsulation film facing away the top side of the first foil , e . g . a silicone surface .

[0015] In an embodiment the encapsulation film is arranged by a j oining process at the top side of the first foil and / or the second foil or the cover is arranged by a j oining process at the encapsulation film, in particular by printing, dispensing or laminating . For example , a vacuum or a roll lamination process can be employed in order to j oin the first foil and the encapsulation film such that the optoelectronic semiconductor chip is embedded in encapsulation film . The cover can be produced by molding, e . g . by inj ection molding .

[0016] In an embodiment the first foil comprising the optoelectronic semiconductor chip, the encapsulation film and the second foil or the cover are j oint together simultaneously . Advantageously, the first foil , the encapsulation film and the second foil or the cover are j oint together in only one method step .

[0017] In another embodiment the encapsulation film and the second foil or the cover are j oint together before the first foil comprising the optoelectronic semiconductor chip and the second foil or the cover comprising the encapsulation film are j oint together . Advantageously, a pre- formed encapsulation film on the second foil or the cover is used which can simpli fy the handling of the encapsulation film .

[0018] In another embodiment the encapsulation film and the first foil are j oint together before the second foil or the cover and the first foil comprising the optoelectronic semiconductor chip and the encapsulation film are j oint together . The optoelectronic semiconductor chip is embedded into the encapsulation material when the first foil and the encapsulation film are j oint together .

[0019] In an embodiment the first foil and / or the second foil or the cover comprises a non-stick coating, an optical coating, optical elements , a structured surface , an adhesion layer or a touch sensitive unit . Advantageously, the first foi l and / or the second foil or the cover comprises additional functionality such as an anti- fingerprint functionality, a de-glaring functionality or a touch functionality . The first foil and / or the second foil or the cover, or in general the interfaces of the optoelectronic component , can be structured to provide optical functionality . E . g . , the second foil or the cover can comprise micro-prisms or micro-lenses which can be created by modi fying a topography of the top interface by structuring it and / or arranging such elements at the top interface . The adhesion layer increases an adhesion between the encapsulation film and the first foil and / or the second foil or the cover . In another embodiment the first foil is bonded to a printed circuit board ( PCB ) , particularly by means of an anisotropic conductive film . The PCB can be designed flexible . The anisotropic conductive film comprises dispersed conductive spheres in an adhesive binder . The first foil is bonded to the PCB by using temperature and pressure to trap the conductive spheres between surfaces of conductive tracks or bond pads arranged on the first foil and the PCB . This ensures electrical conduction in a direction vertical to the top side of the first foil , but the spheres are suf ficiently isolated from each other to prevent an in-plane conductivity . The first foil can also be bonded to the PCB by means of another method . The first foil can also be bonded to the PCB such that the PCB is arranged at the top side of the first foil .

[0020] An optoelectronic component comprises a first foil with a top side and a bottom side opposite the top side . At least one optoelectronic semiconductor chip designed to emit electromagnetic radiation is arranged at the top side of the first foil . An encapsulation film is arranged at the top side of the first foil . The optoelectronic semiconductor chip is embedded into the encapsulation film .

[0021] In an embodiment a second foil or a cover is arranged at the encapsulation film such that the encapsulation film is arranged between the first foil and the second foil or between the first foil and the cover .

[0022] In an embodiment the encapsulation film has been cured at least partially before the optoelectronic semiconductor chip has been embedded into the encapsulation film . This means that the encapsulation film comprises an at least partially cross-linked structure before it is arranged at the top side of the first foil and the optoelectronic semiconductor chip is embedded in the encapsulation film .

[0023] In an embodiment the encapsulation film comprises a silicone . The first foil and / or the second foil or the cover comprises polyethylene terephthalate ( PET ) , glass , polymethyl methacrylate ( PMMA) or polycarbonate ( PC ) . In other embodiments the first foil , the second foil or the cover and the encapsulation film can comprise other materials which can be chosen independently thereby providing the possibility to use di fferent material combinations with preferred properties .

[0024] The above-described properties , features and advantages of this invention and the way in which they are achieved will become clearer and more clearly understood in association with the following description of the exemplary embodiments which are explained in greater detail in association with the drawings . Here in schematic illustration in each case :

[0025] Fig . 1 : an optoelectronic component according to the state of the art in a cross-sectional side view;

[0026] Fig . 2 : an improved optoelectronic component in a cross- sectional side view;

[0027] Fig . 3 : an improved method of producing the optoelectronic component of Fig . 2 in a cross-sectional side view;

[0028] Fig . 4 : an alternative method of producing the optoelectronic component of Fig . 2 in a cross-sectional side view;

[0029] Fig . 5 : another alternative method of producing the optoelectronic component of Fig . 2 in a cross-sectional side view;

[0030] Fig . 1 schematically shows an optoelectronic component 1 according to the state of the art in a cross-sectional side view .

[0031] The optoelectronic component 1 comprises a foil 2 with a top side 3 and a bottom side 4 opposite the top side 3 . Furthermore , optoelectronic semiconductor chips 5 are arranged at the top side 3 of the foil 2 . The optoelectronic semiconduc- tor chips 5 are designed to emit electromagnetic radiation at their light emitting surfaces 6 which are facing away and parallel to the top side 3 of the foil 2 . The optoelectronic semiconductor chips 5 can additionally be designed to emit electromagnetic radiation at their side faces extending perpendicular to the top side 3 of the foil 2 . Exemplarily, the optoelectronic semiconductor chips 5 are designed as light emitting diodes ( LEDs ) . However, the optoelectronic semiconductor chips 5 can also be designed as laser diodes . Also , four optoelectronic semiconductor chips 5 are arranged at the top side 3 of the foil 2 exemplarily but any other number of optoelectronic semiconductor chips 5 can be arranged at the top side 3 of the foil 2 .

[0032] An encapsulant 7 is arranged at the top side 3 and at the bottom side 4 of the foil 2 . The optoelectronic semiconductor chips 5 are embedded in the encapsulant 7 . The encapsulant 7 comprises polyvinyl butyral ( PVB ) , ethylene-vinyl acetate (EVA) or Sentry Glass . These materials constitute safety glass and are rather special .

[0033] The optoelectronic component 1 according to Fig . 1 comprises the disadvantage that the stack of the foil 2 and the encapsulant 7 is not robust . E . g . , humidity can cause corrosion and migration . Also , the encapsulant 7 . is rather l imited in view of an integration with further components or elements due to the special nature of the encapsulant 7 . E . g . , the encapsulant 7 is mostly compatible only with glass . For this reason, a top covering 8 and bottom covering 8 comprising glass are arranged at surfaces of the encapsulant 7 facing away from the top side 3 and the bottom side 4 of the foil 2 such the encapsulant 7 embedding the foil 2 is arranged between the top and the bottom covering 8 . Such a stack can be rather thick and comprise a thickness of more than 2mm. Therefore , a primary surface for customer integration with known properties is required . Fig . 2 schematically shows an improved optoelectronic component 10 in a cross-sectional side view .

[0034] The optoelectronic component 10 of Fig . 2 comprises similarities in that at least one optoelectronic semiconductor chip 5 designed to emit electromagnetic radiation is arranged at the top side 3 of a foil 2 which is called first foil 2 in the following description . Again, any number of optoelectronic semiconductor chips 5 can be arranged at the top side 3 of the first foil 2 . E . g . , the optoelectronic component 10 of Fig . 2 can comprise an array of optoelectronic semiconductor chips 5 . The optoelectronic component 10 can e . g . be designed as a rear light of an automobile .

[0035] Instead of the encapsulation 7 of Fig . 1 , an encapsulation film 9 is arranged at the top side 3 of the first foil 2 . The optoelectronic semiconductor chips 5 are embedded into the encapsulation film 9 . The optoelectronic semiconductor chips 5 are embedded in the encapsulation film 9 such that their light emitting faces 6 are covered completely by the encapsulation film 9 . The encapsulation film 9 exemplarily comprises silicone . However, the encapsulation film 9 can also comprise other polymers and materials .

[0036] Exemplarily, the encapsulation film 9 has been cured at least partially by addition curing before arranging it at the top side of the first foil and embedding the at least one optoelectronic semiconductor chip 5 in the encapsulation film 9 during a method of producing the optoelectronic component 10 . This allows a production of the optoelectronic component 10 without using liquid encapsulation materials . Furthermore , addition curing comprises the advantage that no liquid byproducts are formed which can cause corrosion of parts of the optoelectronic component 10 . In general , a handling of an at least pre-cured encapsulation film 9 is simpli fied .

[0037] Other curing mechanisms can also be used to pre-cure the encapsulation film 9 . The encapsulation film 9 can e . g . com- prise a bi-stage material which can be partially cured by using a first curing mechanism or a first curing temperature . After the encapsulation film 9 has been arranged at the top side 3 of the first foil 2 the encapsulation film 9 can be cured completely, e . g . by using a second curing mechanism or a second curing temperature . However, the encapsulation film 9 has to be at least partially cured before arranging it at the top side 3 of the first foil 2 and embedding the optoelectronic semiconductor chip 5 in the encapsulation film 9 . E . g . , it can be suf ficient to leave a silicone for ten minutes at ambient conditions to prepare an at least partially cured encapsulation film 9 . Depending on the material chosen, the curing methods and parameters can be di f ferent .

[0038] The optoelectronic component 10 also comprises a second foil 11 . The second foil 11 is arranged at a surface 12 of the encapsulation film 9 . Instead of the second foil 11 , the optoelectronic component 10 can comprise a cover 11 which is arranged at the surface 12 of the encapsulation film . The cover 11 can be produced by means of a molding technique , in particular by inj ection molding . In the following description, for the sake of simplicity, only features associated with the second foil 11 are described . However, all described embodiments comprising the second foil 11 can comprise a cover 11 alternatively . Also , the cover 11 can comprise all described features of the second foil 11 as such . The second foil 11 or the cover 11 can be omitted .

[0039] The second foil 11 comprises a further top side 13 and a further bottom side 14 opposite the further top side 13 . The second foil 11 is arranged with its further bottom side 14 at the surface 12 of the encapsulation film 9 . Thus , the encapsulation film 9 is arranged between the fist foil 2 and the second foil 11 . The further top side 13 of the second foil 11 forms a top interface of the optoelectronic component 10 . The first foil 2 and / or the second foil 11 comprises polyethylene terephthalate ( PET ) , polymethyl methacrylate ( PMMA) or poly- carbonate ( PC ) . PET comprises the advantage of a good adhesion to an encapsulation film 9 comprising silicone .

[0040] The bottom side 4 of the first foil 2 forms a bottom interface of the optoelectronic component 10 . However, the second foil 11 can be omitted . In this case , the surface 12 of the encapsulation film 9 forms the top interface of the optoelectronic component 10 . In both cases , the top and the bottom interfaces can be well-known and compatible with many other material systems . In sum, the optoelectronic component 10 of Fig . 2 is more robust and compatible with other materials than the optoelectronic component 1 of Fig . 1 .

[0041] The first foil 2 and / or the second foil 11 can optionally comprise a non-stick coating, an optical coating, optical elements , a structured surface or a touch sensitive unit for additional functionality which is not shown for the sake of simplicity in Fig . 2 . Such elements , coatings and structures can be formed at the bottom side 4 of the first foi l 2 and / or the further top side 13 of the second foil 11 . Also , the first foil 2 and / or the second foil 11 can optional ly comprise an adhesion layer formed at the top side 3 of the first foil 2 and / or the further bottom side 14 of the second foil 11 in order to enhance an adhesion to the encapsulation film 9 and the first foil 2 and / or the second foil 11 .

[0042] In Fig . 2 , the first foil 2 is bonded to a printed circuit board ( PCB ) 15 by means of an anisotropic conductive film . The first foil 2 is bonded to the PCB 15 such that the PCB 15 is partially arranged at the top side 3 of the first foil 2 . The first foil 2 comprises conductive paths and contact pads connecting the optoelectronic semiconductor chips 4 electrically which are arranged at the top side 3 of the f irst foil 2 . The PCB 15 comprises further conductive paths and further contact pads , wherein the further contact pads are arranged at a bottom side of the PCB 15 facing the top side 3 of the first foil 2 . The anisotropic conductive film is arranged between the first foil 2 and the bottom side of the PCB 15 and between the contact pads and the further contact pads which are arranged above another . The anisotropic conductive film connects the contact pads and the further contact pads electrically . The anisotropic conductive film is not shown in Fig . 2 .

[0043] The first foil 2 can also be bonded by means of another method to the PCB 15 . The PCB 15 can be formed flexible which is however not necessary but might be convenient due to the first foil 2 and the optional second foil 11 being flexible . The PCB 15 can also be omitted .

[0044] Fig . 3 schematically shows a method of producing the optoelectronic component 10 according to Fig . 2 . Again, elements of the optoelectronic component 10 are shown in a cross- sectional side view . The reference numerals of Fig . 2 are maintained .

[0045] The method comprises a step of providing the first foil 2 comprising, wherein at least one optoelectronic semiconductor chip 5 is arranged at the top side 3 of the first foil 2 . The first foil 2 can be bonded to the PCB 15 as shown in Fig . 3 exemplarily .

[0046] In a further method step the encapsulation film 9 which is at least partially cured is arranged at the top side 3 of the first foil 2 , wherein the optoelectronic semiconductor chips 5 are embedded into the encapsulation film 9 . The encapsulation film 9 is cured at least partially before arranging it at the top side 3 of the first foil 2 . This means that the encapsulation film 9 comprises a structure which is at least partially cross-linked, e . g . by addition curing .

[0047] The encapsulation film 9 can be arranged by a j oining process at the top side 3 of the first foil 2 , e . g . by laminating or printing . The second foil 11 also can be arranged by a j oining process at the encapsulation film 9 , in particular by printing or laminating . Fig . 3 shows a variant of the method, wherein the first foil 2, the encapsulation film 9 and the second foil 11 are joint together simultaneously, e.g. by vacuum or by roll lamination.

[0048] Fig. 4 shows another variant of the method. The method of Fig. 4 comprises similarities to the method of Fig. 3. In the following description only differences between the method of Fig. 4 and the method of Fig. 3 are described. The reference numerals of Fi. 3 are maintained.

[0049] In this case, the encapsulation film 9 and the second foil 11 are joint together before the first foil 2 comprising the optoelectronic semiconductor chips 5 and the second foil 11 comprising the encapsulation film 9 are joint together, e.g. by vacuum or roll lamination.

[0050] Fig. 5 shows another variant of the method. The method of Fig. 5 comprises similarities to the method of Fig. 3. In the following description only differences between the method of Fig. 5 and the method of Fig. 3 are described. The reference numerals of Fi. 3 are maintained.

[0051] In this variant of the method the encapsulation film 9 and the first foil 2 are joint together before the second foil 11 and the first foil 2 comprising the optoelectronic semiconductor chips 5 and the encapsulation film 9 are joint together. In all described cases of Fig. 3, Fig. 4 and Fig. 5 the first foil 2 exemplarily has been bonded to the PCB 15 before arranging the encapsulation film 9 and the second foil 11. In every case, the second foil 11 can be omitted.

[0052] The invention has been illustrated and described in detail with the aid of the preferred exemplary embodiments. Nevertheless, the invention is not restricted to the examples disclosed. Rather, other variants may be derived therefrom by a person skilled in the art without departing from the protective scope of the invention. REFERENCE SYMBOLS

[0053] 1 optoelectronic component according to the state of the art

[0054] 2 foil / first foil

[0055] 3 top side of the first foil

[0056] 4 bottom side of the first foil

[0057] 5 optoelectronic semiconductor chip

[0058] 6 light-emitting face of an optoelectronic semiconductor chip

[0059] 7 encapsulant

[0060] 8 covering

[0061] 9 encapsulation film

[0062] 10 optoelectronic component according to the present invention

[0063] 11 second foil / cover

[0064] 12 surface of the encapsulating film

[0065] 13 further top side of the second foil

[0066] 14 further bottom side of the second foil

[0067] 15 printed circuit board ( PCB )

Claims

CLAIMS1. Method of producing an optoelectronic component (10) comprising the following method steps:- providing a first foil (2) comprising a top side (3) and a bottom side (4) opposite the top side (3) , wherein at least one optoelectronic semiconductor chip (5) designed to emit electromagnetic radiation is arranged at the top side (3) of the first foil (2) ,- arranging an encapsulation film (9) which is at least partially cured at the top side (3) of the first foil (2) , wherein the optoelectronic semiconductor chip (5) is embedded into the encapsulation film (9) .

2. The method according to claim 1, wherein the encapsulation film (9) comprises a bi-stage material .

3. The method according to one of the previous claims, wherein the encapsulation film (9) is cured at least partially by addition curing before arranging the encapsulation film (9) at the top side (3) of the first foil (2) .

4. The method according to one of the previous claims, wherein a second foil (11) or a cover (11) is arranged at the encapsulation film (9) such that the encapsulation film (9) is arranged between the first foil (2) and the second foil (11) or between the first foil (2) and the cover (11) .

5. The method according to one of the previous claims, wherein a plasma treatment and / or a corona treatment of the top side (3) of the first foil (2) and / or a further bottom side (14) of the second foil (11) or the cover (11) facing the encapsulation film (9) is performed before arranging the encapsulation film (9) at the top side (3) of the first foil (2) and / or arranging the second foil (11) or the cover (11) at the encapsulation film (9) .

6. The method according to one of the previous claims, wherein the encapsulation film (9) comprises a silicone and the first foil (2) and / or the second foil (11) or the cover (11) comprises polyethylene terephthalate, glass, polymethyl methacrylate or polycarbonate.

7. The method according to one of the previous claims, wherein the encapsulation film (9) is arranged by a joining process at the top side (3) of the first foil (2) and / or the second foil (11) or the cover (11) is arranged by a joining process at the encapsulation film (9) , in particular by printing, dispensing or laminating.

8. The method according to claim 7, wherein the encapsulation film (9) and the first foil (2) are joint together before the second foil (11) or the cover (11) and the first foil (2) comprising the optoelectronic semiconductor chip 5 and the encapsulation film (9) are joint together .

9. The method according to claim 7, wherein the first foil (2) comprising the optoelectronic semiconductor chip (5) , the encapsulation film (9) and the second foil (11) or the cover (11) are joint together simultaneously.

10. The method according to claim 7, wherein the encapsulation film (9) and the second foil (11) or the cover (11) are joint together before the first foil (2) comprising the optoelectronic semiconductor chip (5) and the second foil (11) or the cover (11) comprising the encapsulation film (9) are joint together.

11. The method according to one of the previous claims, wherein the first foil (2) and / or the second foil (11) or the cover (11) comprises a non-stick coating, an optical coating,optical elements, a structured surface, an adhesion layer or a touch sensitive unit.

12. The method according to one of the previous claims, wherein the first foil (2) is bonded to a printed circuit board (15) , particularly by means of an anisotropic conductive film.

13. Optoelectronic component (10) comprising a first foil (2) with a top side (3) and a bottom side (3) opposite the top side (2) , wherein at least one optoelectronic semiconductor chip (5) designed to emit electromagnetic radiation is arranged at the top side (3) of the first foil (2) , wherein an encapsulation film (9) is arranged at the top side (3) of the first foil, wherein the optoelectronic semiconductor chip (5) is embedded into the encapsulation film (9) .

14. Optoelectronic (10) component according to claim 11, wherein a second foil (11) is arranged at the encapsulation film (9) such that the encapsulation film (9) is arranged between the first foil (2) and the second foil (11) .

15. Optoelectronic (10) component according to claim 11 or 12, wherein the encapsulation film (9) has been cured at least partially before the optoelectronic semiconductor chip (5) has been embedded into the encapsulation film (9) .

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