Device comprising a seal and a plastic filling, and method for forming a plastic filling

Abstract

The invention relates to a device (100) comprising: (a) a first component (110); (b) a second component (120); (c) a seal (130) arranged between the first component (110) and the second component (120); and (d) a plastic filling (140). The first component (110), the second component (120) and the seal (130) at least partially delimit a cavity (141) in which the plastic filling (140) is arranged, and the seal (130) is designed to at least partially seal the cavity (141) when the plastic filling (140) is formed. The invention also relates to a corresponding method for forming a plastic filling (140).

Description

[0001] DESCRIPTION

[0002] Device with seal and plastic filling and method for forming a plastic filling

[0003] TECHNICAL FIELD

[0004] The present disclosure relates to plastic-filled devices and methods for forming such plastic fills.

[0005] BACKGROUND OF THE INVENTION

[0006] Plastic fillings, such as those made of thermosets or thermoplastics, are used in many areas to protect or insulate components, including the automotive industry. For example, circuit boards are overmolded with plastic, which often eliminates the need for expensive and complex housings.

[0007] Particular difficulties arise when overmolding two or more components arranged side by side. The interfaces between the components must be sealed. This is typically ensured by keeping the gap so small that only venting occurs, but no plastic can escape. In some cases, it is even possible to have no gap at all between the components, preventing either air or plastic from escaping.

[0008] The problem with this approach is that it only covers limited tolerance and deformation bridging. For example, deformation of the components can occur due to injection pressure, causing plastic to escape between the components during the injection molding process. SUMMARY AND EMBODIMENTS

[0009] It is therefore an object of the present disclosure to provide a method for forming a plastic filling and a corresponding device with a plastic filling, wherein a transition is ensured between different components of the device, which seals off the injected plastic during the injection process.

[0010] This object is achieved by a device with a plastic filling and a method for forming plastic fillings according to the independent patent claims. Advantageous embodiments and further developments emerge from the respective dependent claims, the following description, and the drawings.

[0011] Thus, according to a first aspect, a device is provided which comprises: (a) a first component; (b) a second component; (c) a seal arranged between the first component and the second component; and (d) a plastic filling. The first component, the second component, and the seal at least partially define a cavity in which the plastic filling is arranged, and the seal is configured to at least partially seal the cavity upon formation of the plastic filling.

[0012] According to a further aspect, a method for forming a plastic filling is provided, comprising the following steps: (a) providing a first component and a second component; (b) arranging a seal between the first component and the second component; (c) forming the plastic filling in a cavity which is at least partially delimited by the first component, the second component and the seal, wherein, during the formation of the plastic filling, the seal at least partially seals the cavity.

[0013] In the context of the present disclosure, a seal is, for example, an element that is designed and arranged to prevent or at least limit the escape of a substance from a spatial area, for example from the cavity. The seal can seal against one or more substances, but be permeable to other substances. In particular, it can seal against a plastic, such as a thermoset and / or a thermoplastic. According to one embodiment, the seal is elastic. For this purpose, the seal can comprise an elastomer or consist of an elastomer. The seal can consist of or comprise a soft component.

[0014] The fact that the seal at least partially seals the cavity can mean that the seal seals a gap or space between the first component and the second component, in particular completely seals it. The seal can completely seal the cavity.

[0015] According to one embodiment, the seal is designed to limit the flow of plastic during the formation of the plastic filling. It can therefore have a temporary function to reliably seal the sealing partners during an overmolding process.

[0016] In the context of the present disclosure, a plastic filling is defined, for example, as an element comprising plastic or consisting of plastic. The element is preferably formed integrally or in one piece. The plastic filling can fill the cavity completely or only partially. A portion of the plastic filling can be arranged outside the cavity, for example, at least partially encasing the first component with plastic.

[0017] The plastic filling can be produced by an injection, transfer, or casting process, for example by injection molding or transfer pressing. The plastic filling can be introduced into the cavity through an opening in the cavity. The opening can be formed in the first component and / or in the second component. The plastic filling can comprise a thermoset and / or a thermoplastic. It can consist of a thermoset or a thermoplastic. The device and / or method described above can be advantageous for providing plastic fillings for devices composed of at least two components in a simple and cost-effective manner.

[0018] Conventional processes require small tolerance deviations for the gap between the two components, which can only be ensured with considerable effort, especially for large components. For example, the adjoining surfaces of the two components must have only slight unevenness to limit the gap width. Positional deviations between the two components can also lead to a wider gap. Finally, deformation of the components can occur during the formation of the plastic filling, which may increase the distance between the components.

[0019] A seal arranged between the components can at least partially compensate for such deviations. Accordingly, the requirements for the surface finish of the components or the precision of their mutual alignment can be relaxed. Therefore, the entire device can be manufactured more cost-effectively, even taking into account the additional seal required.

[0020] In summary, the seal can increase the sealing effect when forming the plastic filling and enable a greater variety of components, as larger tolerances are covered.

[0021] According to one embodiment, the first component is plate-shaped. It can have two main surfaces, which in particular are opposite one another. The second component can be arranged on or at one of the two main surfaces.

[0022] According to one embodiment, the plastic filling comprises or consists of a thermoset. Such an embodiment can be advantageous because a thermoset can be molded under comparatively low pressures and / or low temperatures, in particular lower pressures and / or lower temperatures than those required for molding thermoplastics. Furthermore, a thermoset can be particularly suitable for media-tight packaging of sensitive areas of the two components.

[0023] According to one embodiment, the seal comprises an elastomer configured to ensure a sealing function at temperatures of at least up to 150°C, in particular at least up to 175°C. The elastomer can be or comprise EAM, for example. Such an embodiment can be advantageous because temperatures of up to 175°C, in particular up to 150°C, can occur in typical processes for forming the plastic filling. Such temperatures can be required, for example, for molding thermosets. Higher temperatures may be required for molding thermoplastics.

[0024] According to one embodiment, the seal is configured to compensate for positional deviations of the second component relative to the first component and / or surface deviations of an interface of the second component relative to an adjacent interface of the first component, in particular with a view to sealing a gap between the two components. The positional deviation can be a deviation along a main surface of the first component. Such compensation of positional and / or surface deviations can be ensured if the seal is elastic, for example, because it comprises an elastomer.

[0025] According to one embodiment, an interface of the second component has a diameter of more than 25 mm, in particular more than 40 mm. The interface can be arranged adjacent to a corresponding interface of the first component. In the context of the present disclosure, the diameter of the second component is defined, for example, based on the contact surface of the second component on the first component and / or on the seal. The diameter can be defined as the greatest possible distance between two points of the contact surface. Such an embodiment can be advantageous because larger tolerance deviations occur with larger components, which can be suitably compensated by means of a seal.

[0026] According to one embodiment, the first component comprises a base plate, for example a metal plate, in particular an aluminum plate, and / or a printed circuit board. The printed circuit board can be attached directly to the base plate.

[0027] According to one embodiment, the circuit board and the second component are arranged on opposite sides of the base plate, in particular on opposite main surfaces of the base plate, or the circuit board is arranged between the second component and the base plate. Such an embodiment can be advantageous for enabling a stable and robust arrangement of both the circuit board and the second component.

[0028] According to one embodiment, the plastic filling extends over at least one surface region of the circuit board, in particular at least part of a main surface of the circuit board. This can enable media-tight packaging of at least regions of the circuit board, for example, to protect sensitive components on the circuit board. Such an embodiment can therefore be advantageous for at least mitigating mechanical, electrical and / or thermal effects. In particular, if the plastic filling is formed as a single piece on the surface region of the circuit board and in the cavity, for example, if it is produced in a common casting, transfer or injection process, the plastic filling can also contribute to the mechanical stabilization of the two components relative to one another.

[0029] According to one embodiment, the second component has a plastic housing, in particular a plug and / or sensor housing. The plastic housing can in particular comprise or consist of a thermoplastic. It can comprise or consist of a thermoset. Accordingly, the second component can be a plug, which is configured to provide an electrical interface to the first component, in particular to a circuit board of the first component. Alternatively or additionally, the second component can comprise a sensor, wherein sensor signals are forwarded to the first component, in particular to a circuit board of the first component.Especially if the plastic housing is made of a thermoplastic, deformations of the plastic housing can occur during the formation of the plastic filling, which, without the use of a suitable seal, can cause or at least promote the leakage of plastic between the two components.

[0030] According to one embodiment, the second component has at least one electrical conductor, in particular a stamped grid conductor, wherein the electrical conductor is at least partially encased by the plastic filling of the cavity. The electrical conductor, in particular the stamped grid conductor, can be at least partially encased by another plastic, in particular a thermoplastic. The at least one electrical conductor can be passed through a respective recess in the base plate and / or the circuit board. The recesses can be partially, in particular completely, filled with the plastic filling. The at least one electrical conductor can be, for example, the pin of a connector.

[0031] According to one embodiment, the first component has an electrical interface, in particular a soldering interface, a welding interface, or a press-fit interface, which connects the electrical conductor of the second component to an electrical connection of the first component, wherein the plastic filling fixes the interface. The interface can be arranged within or on a circuit board of the first component. According to one embodiment, the electrical interface is encased by the plastic filling and / or a region of the circuit board having the interface is encased by the plastic filling. The electrical connection is, for example, a conductor track on a circuit board of the first component.

[0032] Such an embodiment can be advantageous for stabilizing the electrical interface of the first component. For example, if the entire device is exposed to temperature fluctuations and corresponding thermal expansion, the interface can be damaged by relative movements of the connector. The plastic filling can protect the electrical interface and the at least one electrical conductor of the second component against such movements and stabilize it, particularly if the plastic filling is formed as a single piece and / or as a thermoset. The electrical interface is effectively frozen in the plastic, particularly together with the electrical conductor.

[0033] According to one embodiment, the seal forms a collar in the cavity. In other words, the seal has a greater thickness inside the cavity than in the gap between the components. The smaller thickness in the gap can result from compression of the seal and / or from an actually smaller thickness of the part of the seal arranged in the gap. Such an embodiment can be advantageous to counteract slippage of the seal, for example, due to the injection pressure, during the formation of the plastic filling.

[0034] Additionally or alternatively, the seal can form an additional collar on an outer surface of the first and / or second component opposite the cavity. This additional collar can also counteract the seal's slippage.

[0035] According to one embodiment, the seal is arranged such that pressure during the formation of the plastic filling presses the seal against a surface of the first component and / or the second component facing the cavity. Like the previous embodiment, such an embodiment can also be advantageous for counteracting the seal from slipping in the gap during the formation of the plastic filling. At the aforementioned surfaces, the seal can be particularly reliable due to the pressure exerted by the plastic filling.

[0036] According to one embodiment, before and / or during the formation of the plastic filling, the first and second components are pressed against each other at a predetermined pressure, compressing the seal. The predetermined pressure is at least as high as a pressure during the formation of the plastic filling, in particular an injection or pressing pressure. The predetermined pressure can be generated, for example, by a mechanical connection between the first and second components, such as a screw connection, and / or by a pressing tool that is only temporarily attached during the formation of the plastic filling.

[0037] Such an embodiment can be advantageous because the compressed seal ensures a better seal. Furthermore, the collar and / or the additional collar can be created by pressing together. The additional mechanical connection, such as a screw connection, can be advantageous if, due to the dimensions of the second component, the pressing tool cannot exert uniform and / or sufficiently strong pressure on the interfaces between the first and second components.

[0038] According to one embodiment, the seal and plastic filling are in contact with each other, in particular along a contact surface. In other words, the seal and plastic filling touch each other at this contact surface.

[0039] According to one embodiment, the first component and the second component remain in the final device, in particular the first component, the second component, and the seal. The seal can thus be configured to seal against the plastic compound between the two components of the final device during the formation of the plastic filling.

[0040] BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Further advantages and advantageous embodiments and further developments of the method and of the control device emerge from the following exemplary embodiments shown in conjunction with the figures.

[0042] Figures 1 to 6 each show a device with a first component, a second component, a seal and a plastic filling according to various embodiments of the present disclosure.

[0043] Identical, similar, or functionally identical elements are provided with the same reference symbols in the figures. In some figures, individual reference symbols have been omitted for clarity. The figures and the relative sizes of the elements depicted in the figures are not to scale. Rather, individual elements may be exaggerated for clarity and / or clarity.

[0044] DETAILED DESCRIPTION OF EMBODIMENTS

[0045] Figures 1, 2 and 3 each show a device 100 comprising: (i) a first component 110, (ii) a second component 120, (iii) a seal 130 arranged in a gap between the first component 110 and the second component 120, and (iv) a plastic filling 140, here a thermoset filling. The first component 110, the second component 120 and the seal 130 at least partially define a cavity 141 in which the plastic filling 140 is arranged. The seal 130 is configured to at least partially seal the cavity 141, in particular completely, when the plastic filling 140 is formed.

[0046] The cavity 141 has an opening on the side opposite the second component 120. This opening consists of a recess or a hole formed in the first component 110. The plastic filling 140 extends through the opening and completely covers a main surface of the first component 110, which is opposite another main surface of the first component 110, on which the second component 120 is arranged. Two electrical conductors 124 arranged parallel to one another are routed through the second component 120, the cavity 141, and the previously described opening. The electrical conductors 124 are encased by the plastic filling 140 in the region of the cavity 141 and the opening.

[0047] The first component 110 has an interface 111 adjacent to the seal 130. The second component 120 also has an interface 121 adjacent to the seal 130. The seal 130 is designed to at least partially compensate for positional and surface deviations of the two interfaces 111, 121. A maximum distance between two points of the interface

[0048] 121 of the second component 120 determines the diameter 122. This diameter

[0049] 122 is a measure of the size of the second component 120 and accordingly of the largest possible deviations.

[0050] The second component 120 is connected to the first component 110, for example by screws (not shown), whereby the seal 130 is compressed. The overmold or the plastic filling 140 rises through the first component 110 and is prevented by the seal 130 from escaping from the cavity or hollow space 141. In the case of the flat seal 130 shown in Figure 1, gap extrusion can occur under certain circumstances, i.e. the seal 130 is at least partially pressed out of the gap. To counteract such gap extrusion, the seal 130 in Figure 2 has a raised inner collar 131. In Figure 3, the seal 130 has, in addition to the raised inner collar 131, a raised outer collar 132. This prevents the seal from slipping even more reliably.

[0051] Figures 4, 5 and 6 show embodiments that are similar in many respects to the embodiments of Figures 1 to 3. They show various shapes of a collar 131 of a seal 130 arranged between a first and a second component 110, 120. The collar 131, which is widened compared to the gap between the components 110, 120, extends over surfaces 133 of the first and second component 110, 120 adjacent to the gap. The collar 131 is pressed against the surfaces 133 by the injection or pressing pressure during the formation of the plastic filling 140. In the area of ​​these sealing surfaces 133, the injection or pressing pressure results in an additional, reinforced seal against the plastic during the formation of the plastic filling 140. In the embodiment of Figure 4, a collar 131 with corresponding sealing surfaces 133 extends both in the direction of the first component 110 and in the direction of the second component 120.In contrast, in the embodiments of Figures 5 and 6, the collar 131 with sealing surface 133 is formed only in the direction of the second component 120.

[0052] In the embodiments shown in Figures 4 to 6, the second component 120 has a plastic housing 123 and two electrical conductors 124, here two connector pins. The first component 110 has a base plate 112 and a printed circuit board 113 arranged on a main surface of the base plate 112. In the embodiments of Figures 4 and 5, the plastic housing 123 is arranged on an opposite main surface of the base plate 112. The seal 130 is arranged in a gap between the plastic housing 123 and the base plate 112. In the embodiment of Figure 6, however, the printed circuit board 113 is arranged between the base plate 112 and the plastic housing 123. The seal 130 is located in a gap between the printed circuit board 113 and the plastic housing 123.

[0053] In the embodiments of Figures 4 to 6, both the circuit board 113 and the base plate 112 have respective recesses or openings through which the plastic filling 140, here a thermosetting plastic filling, can be inserted into the cavity

[0054] 141 can be introduced. The plastic filling 140 fixes the electrical conductor 124 in the cavity 141 as well as an electrical interface 114, here a soldering interface, via which the electrical conductor 124 is electrically connected to conductor tracks on the circuit board 140. By fixing it with the thermoset filling, damage to the interface 114 can be avoided, particularly when the various components 110, 120 expand in different ways under the influence of strong temperatures. The invention is not limited to the exemplary embodiments by the description based on these. Rather, the invention encompasses any new feature and any combination of features, which in particular includes any combination of features in the exemplary embodiments and patent claims.

[0055] Reference symbol

[0056] 100 device

[0057] 110 first component

[0058] 111 Interface of the first component

[0059] 112 Base plate

[0060] 113 circuit board

[0061] 114 electrical interface

[0062] 120 second component

[0063] 121 Interface of the second component

[0064] 122 Diameter of the interface

[0065] 123 plastic housings

[0066] 124 electrical conductor

[0067] 130 Seal

[0068] 131 collar

[0069] 132 additional collars

[0070] 133 Sealing surface

[0071] 140 plastic filling

[0072] 141 cavity

Claims

PATENT CLAIMS 1. Device (100) comprising: - a first component (110); - a second component (120); - a seal (130) arranged between the first component (110) and the second component (120); and - a plastic filling (140); wherein the first component (110), the second component (120) and the seal (130) at least partially delimit a cavity (141) in which the plastic filling (140) is arranged, and wherein the seal (130) is configured to at least partially seal the cavity (141) when the plastic filling (140) is formed.

2. Device (100) according to the preceding claim, wherein the plastic filling consists of a thermoset.

3. Device (100) according to one of the preceding claims, wherein the seal (130) comprises an elastomer which is designed to ensure a sealing function at temperatures of at least up to 150 °C, in particular at least up to 175 °C.

4. Device (100) according to one of the preceding claims, wherein the seal (130) is configured to compensate for positional deviations of the second component (120) with respect to the first component (110) and / or surface deviations of an interface (121) of the second component (120) with respect to an adjacently arranged interface (111) of the first component (110).

5. Device (100) according to the preceding claim, wherein the interface (121) of the second component (120) has a diameter (122) of more than 25 mm, in particular more than 40 mm.

6. Device (100) according to one of the preceding claims, wherein the first component (110) comprises a base plate (112), in particular an aluminum plate, and / or a printed circuit board (113).

7. Device (100) according to the preceding claim, wherein the circuit board (113) and the second component (120) are arranged on opposite sides of the base plate (112) or the circuit board (113) is arranged between the second component (120) and the base plate (112).

8. Device (100) according to one of claims 6 or 7, wherein the plastic filling (140) extends over at least one surface area of ​​the circuit board (113).

9. Device (100) according to one of the preceding claims, wherein the second component (120) has a plastic housing (123) made of a thermoplastic and / or a thermoset, in particular a plug and / or sensor housing.

10. Device according to one of the preceding claims, wherein the second component (120) has at least one electrical conductor (124), in particular a punched grid conductor, wherein the electrical conductor (124) is at least partially encased by the plastic filling (140) of the cavity (141).

11. Device (100) according to the preceding claim, wherein the first component (110) has an electrical interface (114), in particular a soldering interface, a welding interface or a press-fit interface, which connects the electrical conductor (124) of the second component (120) to an electrical connection of the first component (110), and wherein the plastic filling (140) fixes the electrical interface (114).

12. Device (100) according to one of the preceding claims, wherein the seal (130) forms a collar (131) in the cavity (141).

13. Device (100) according to one of the preceding claims, wherein the seal (130) is arranged such that a pressure during formation of the plastic filling (140) presses the seal (130) against a surface of the first component (110) and / or the second component (120) facing the cavity (141).

14. A method for forming a plastic filling (140), comprising the following steps: - Providing a first component (110) and a second component (120); - arranging a seal (130) between the first component (110) and the second component (120); - forming the plastic filling (140) in a cavity (141) which is at least partially delimited by the first component (110), the second component (120) and the seal (130), wherein during the formation of the plastic filling (140) the seal (130) at least partially seals the cavity (141).

15. Method according to the preceding claim, wherein before and / or during the formation of the plastic filling (140), the first and second components (110, 120) are pressed against one another with a predetermined pressure while compressing the seal (130), wherein the predetermined pressure is at least as high as a pressure (142) during the formation of the plastic filling (140), in particular an injection or pressing pressure.

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