Device for chiplets, comprising a carrier, and manufacturing method for a device

Abstract

The invention relates to a device comprising a carrier for a plurality of chiplets, the carrier having at least one through-opening.

Description

[0001] Description

[0002] Title having a carrier and for

[0003] State of the art

[0004] The disclosure relates to at least one device for chiplets comprising a carrier.

[0005] The disclosure further relates to a manufacturing method for such a device.

[0006] Disclosure of the invention

[0007] Some examples relate to a device for chiplets, comprising a carrier for a plurality of chiplets, wherein the carrier has at least one through-hole. This enables, for example, efficient assembly and / or heat dissipation in some examples.

[0008] In some examples, several through-openings may also be provided in the carrier.

[0009] In some examples, it is provided that the carrier comprises or is at least one of the following elements: a) substrate, or b) interposer.

[0010] In some examples, the carrier is intended to be made of silicon.

[0011] In some examples, the carrier is made of glass. In some examples, the carrier is made of ceramic. In some examples, the at least one through-opening is arranged, for example, at least approximately, centrally, for example, at least approximately in a region of a center of gravity of a surface of the carrier on which the chiplets can be arranged.

[0012] In some examples, it is provided that at least two chiplets are arranged on the carrier.

[0013] In some examples, it is provided that the at least one through-opening is arranged, for example at least approximately, between the at least two chiplets, for example in the region of a connecting line between respective area centers of gravity of the at least two chiplets.

[0014] In some examples, it is provided that a maximum opening width of the at least one through-opening, for example defined as a greatest distance between two opposite points within an opening contour of the at least one through-opening, is between, for example, approximately 2 millimeters and, for example, approximately 18 millimeters, for example between, for example, approximately 3 millimeters and, for example, approximately 8 millimeters.

[0015] In some examples, the opening contour of the at least one through-opening has an elliptical shape, e.g., a circular shape. In some examples, the opening contour of the at least one through-opening has a polygonal shape.

[0016] In some examples, it is provided that the device has a thermal dissipation device, for example for dissipating thermal energy from the device, wherein, for example, at least one component or at least a part of the thermal dissipation device, for example at least partially, can be or is arranged in the at least one through-opening.

[0017] In some examples, it is provided that the thermal dissipation device comprises at least one of the following elements or is designed as at least one of the following elements: a) heat sink, or b) heat pipe (e.g. heat pipe), or c) heat spreader, or d) heat exchanger, for example for fluid cooling.

[0018] In some examples, it is provided that the thermal dissipation device can be guided, for example completely, through the at least one through-opening and can be brought into thermally conductive contact with a surface of the at least one through-opening.

[0019] In some examples, the thermal dissipation device comprises fastening means for positive and / or force-fitting attachment to at least one other component of the device and / or a support for receiving the device. Alternatively or additionally, a material-to-material attachment is possible in some examples.

[0020] In some examples, the thermal dissipation device is provided with at least one external thread.

[0021] In some examples, the thermal dissipation device is provided with at least one flange.

[0022] In some examples, the device is provided with a housing, for example made of a plastic or plastic material.

[0023] In some examples, it is provided that the housing has at least one opening which, together with the at least one through-opening, forms a, for example continuous, through-opening.

[0024] Some examples relate to a system comprising a circuit board and at least one device arranged on the circuit board according to the disclosure.

[0025] Some examples relate to a method of manufacturing a device for chiplets, comprising a carrier for a plurality of chiplets, the method comprising: providing the carrier with at least one through-opening.

[0026] In some examples, the method includes: arranging one or more chiplets on the carrier. In some examples, the method includes: arranging a thermal dissipation device in the region of the at least one through-opening.

[0027] In some examples, it is provided that the provision comprises at least one of the following elements: a) providing a carrier without a through-opening, producing the at least one through-opening in the carrier, or b) producing the carrier together with the at least one through-opening.

[0028] Some examples relate to a use of at least one device according to the disclosure and / or at least one system according to the disclosure / or at least one method according to the disclosure for at least one of the following elements: a) enabling, for example, efficient, mounting of the device, or b) enabling, for example, efficient, cooling of the device, or c) enabling, for example, efficient, alignment, for example, centering, of the device, for example on a circuit board, or d) cooling of multi-chiplet systems, or e) avoiding hotspots in multi-chiplet systems, f) transporting thermal energy from a multi-chiplet system, for example along two or three mutually orthogonal spatial directions.

[0029] Further features, possible applications, and advantages of the invention will become apparent from the following description of examples of the invention, which are illustrated in the figures of the drawing. All described or illustrated features, individually or in any combination, constitute the subject matter of the invention, regardless of their summary in the claims or their references, as well as regardless of their wording or representation in the description or drawing.

[0030] The drawing shows:

[0031] Fig. 1 schematically shows a plan view,

[0032] Fig. 2 schematically shows a side view, Fig. 3 schematically shows a side view,

[0033] Fig. 4 schematically shows a side view in partial cross-section,

[0034] Fig. 5 schematically shows a side view,

[0035] Fig. 6 schematically shows a flow diagram,

[0036] Fig. 7 schematically shows a plan view,

[0037] Fig. 8 schematically shows a side view in partial cross-section,

[0038] Fig. 9 schematically shows a side view in partial cross-section,

[0039] Fig. 10 schematically shows a side view in partial cross-section,

[0040] Fig. 11 schematically shows a side view in partial cross-section,

[0041] Fig. 12 schematic examples of uses.

[0042] Some examples, Fig. 1 , relate to a device 100 for chiplets, comprising a carrier 110 for a plurality of chiplets 120-1, 120-2, ..., wherein the carrier 110 has at least one through-opening 112. In some examples, this enables, for example, efficient, assembly and / or heat dissipation, e.g., for a multi-chiplet system comprising a plurality of chiplets.

[0043] In some examples (not shown), multiple through-openings may also be provided in the carrier 110.

[0044] In some examples, the carrier 110 comprises or is at least one of the following elements: a) substrate, or b) interposer.

[0045] In some examples, the carrier 110 is made of silicon or glass or ceramic.

[0046] In some examples, Fig. 1 , it is provided that the at least one through-opening 112 is arranged, for example at least approximately, centrally, for example at least approximately in a region M of a center of gravity of a surface 110a of the carrier 110, on which the chiplets 120-1, 120-2, ... can be arranged.

[0047] In some examples, Fig. 1 , it is provided that at least two chiplets 120-1, 120-2 are arranged on the carrier 110. In some examples (see, for example, below for Fig. 7), more or fewer than two chiplets may be provided and arranged on the carrier 110.

[0048] In some examples, Fig. 1 , it is provided that the at least one through-opening 112 is arranged, for example at least approximately, between the at least two chiplets 120-1, 120-2, for example in the region of a connecting line between respective area centers of gravity of the at least two chiplets 120-1, 120-2.

[0049] In some examples, Fig. 1 , it is provided that a maximum opening width OWmax of the at least one through-opening 112, for example defined as a greatest distance between two opposite points within an opening contour of the at least one through-opening 112, is between, for example, approximately 2 millimeters and, for example, approximately 18 millimeters, for example between, for example, approximately 3 millimeters and, for example, approximately 8 millimeters.

[0050] In some examples, Fig. 1 , it is provided that the opening contour of the at least one through-opening 112 has an elliptical shape, e.g., a circular shape. In some examples, it is provided that the opening contour of the at least one through-opening has a polygonal shape (not shown).

[0051] Fig. 2 shows a schematic side view of the device 100.

[0052] In some examples, Fig. 3, it is provided that the device 100a has a thermal dissipation device 130, for example for dissipating thermal energy from the device 100a, wherein, for example, at least one component or at least a part of the thermal dissipation device 130 can be or is arranged, for example at least partially, in the at least one through-opening 112. In some examples, it is provided that the thermal dissipation device 130 has at least one of the following elements or is designed as at least one of the following elements: a) heat sink, or b) heat pipe (e.g. heat pipe), or c) heat spreader, or d) heat exchanger, for example for fluid cooling.

[0053] In some examples, Fig. 3, it is provided that the thermal dissipation device 130 can be guided, for example completely, through the at least one through-opening 112 and can be brought into thermally conductive contact with a surface 112a of the at least one through-opening 112.

[0054] In some examples (see Fig. 3), it is provided that the thermal dissipation device 130 has fastening means 132a for positive and / or force-fitting fastening to at least one other component of the device 100a. Alternatively or additionally, a material-to-material fastening is possible in some examples.

[0055] In some examples, the thermal dissipation device 130 is provided with an external thread 134 at least in some areas. For example, in some examples, the external thread 134 can cooperate with the fastening means 132a.

[0056] In some examples, it is provided that the thermal dissipation device has at least one flange, see Fig. 10, 11.

[0057] In some examples, the thermal dissipation device may, for example, have a collar (not shown), e.g., on a first side, and may be, e.g., (a) internally threaded and screwed thereto, or (b) riveted, or (c) secured with a spring clamp ring from a second side.

[0058] In some examples, Fig. 4, it is provided that the device 100b has a housing 140, for example made of a plastic or

[0059] Plastic material.

[0060] In some examples, Fig. 4, it is provided that the housing 140 has at least one opening 142a, 142b, which together with the at least one through-opening 112 forms a, for example continuous, through-opening 142a, 112, 142b, e.g. for receiving the thermal dissipation device 130. In this way, in some examples, thermal energy can be efficiently conducted, for example, from an interior 140a of the housing 140.

[0061] Some examples, Fig. 5, relate to a system 1000 comprising a circuit board 1002, for example printed circuit board, PCB, and at least one device 100, 100', ... arranged on the circuit board 1002 according to the disclosure.

[0062] Some examples, Fig. 6, relate to a method for manufacturing a device 100, 100a, 100b for chiplets, comprising a carrier 110 for a plurality of chiplets, the method comprising: providing 200 the carrier 110 with at least one through-opening 112.

[0063] In some examples, the method is provided to include: arranging 202 one or more chiplets 120 on the carrier 110.

[0064] In some examples, the method comprises: arranging 204 a thermal dissipation device 130 in the region of the at least one through-opening 112.

[0065] In some examples, Fig. 6, it is provided that the provision 200 comprises at least one of the following elements: a) providing 200a a carrier without a through-opening, preparing 200b the at least one through-opening 112 in the carrier, or b) producing 200c the carrier 110 together with the at least one through-opening 112.

[0066] Further aspects and examples are described below, which - in the case of further examples - can each be combined individually or in any combination with at least one of the aspects and / or examples described above.

[0067] Fig. 7 schematically shows a top view of a device according to some examples, in which four chiplets 120-1, 120-2, 120-3, 120-4 are arranged on a carrier 110' made of silicon material, e.g., designed as an interposer. For example, the interposer 110' can, in addition to mechanically holding the chiplets, also implement electrical contacting (not shown) of at least some of the chiplets. Also depicted is a part of the housing 140 and, in the present case, a through-opening 112, e.g., centrally arranged, with an exemplary circular opening contour.

[0068] Fig. 8 schematically shows a side view of the configuration according to Fig. 7, from which it can be seen that in some examples the device can be arranged on a PCB 1002. For example, the openings of interposer 110', housing 140 and PCB 1002 are designed and arranged relative to one another such that they form a continuous through-opening, for example for inserting a heat pipe and / or a fastening element such as a screw or a bolt.

[0069] Fig. 9 schematically shows a side view of a device according to further examples. A heat pipe 130-1 is guided through the continuous through-opening in interposer 110', housing 140, and PCB 1002 and is secured thereto, for example, by means of two nuts 1320a, 1320b. For example, the heat pipe 130-1 can have at least (e.g., axially) an external thread (not shown in Fig. 9) in some areas, which can cooperate with the nuts 1320a, 1320b.

[0070] Optionally, one or more mounting elements, e.g., at least approximately plate-shaped or disc-shaped, e.g., metal plates or, e.g., circular disks, 1320c, 1320d, can be provided, which, in addition to a mechanical clamping effect when screwing the nuts 1320a, 1320b, also effect a heat transport effect, e.g., along their virtual disk plane, e.g., in a radially inner direction toward the heat pipe 130-1, see arrows a1. Arrow a2 symbolizes cooling of the device by means of the heat pipe 130-1.

[0071] In some examples, at least one flange can also be provided on the heat pipe 130-1, which can be realized, for example, by fastening the element 1320c or the elements 1320a, 1320c to the heat pipe 130-1 (e.g., by materially bonding or shrinking or similar). For example, a flange can also be formed directly onto the heat pipe. In some examples, the optional flange offers further degrees of freedom in fastening the thermal dissipation device 130. In some examples, the heat pipe 130-1 can, for example, also be inserted into the through-opening - provided, for example, that sufficiently small tolerances are maintained - without using any nuts or mounting elements.

[0072] Fig. 10 schematically shows a side view of a device according to further examples. Depicted is a heat pipe 130-1, e.g., passable or pushable through the through-opening 112 (Fig. 1), with two plate-shaped fastening elements 1322, 1324, which can be identical parts, for example. The fastening elements 1322, 1324 have, for example, an internal thread (not shown), e.g., in the sense of a screw nut, e.g., for screwing onto an external thread (not shown) of the heat pipe 130-1. Optionally, the fastening elements 1322, 1324 each have an enlarged axial section 1322a, 1324a, which, for example, contacts the heat pipe 130-1 in a thermally conductive manner, whereby the thermal connection of the components 1322, 1324 to the heat pipe 130-1 is further improved.

[0073] In some examples, the flat, e.g. disc-shaped or plate-shaped parts of the fastening elements 1322, 1324 (Fig. 10) or 1320c, 1320d (Fig. 9) can be flat, for example completely planar. In further examples, however, the surfaces in question can also be curved, e.g. comparatively slightly, e.g. such that when installed around the carrier 110, 110' and the chiplets 120 or the housing 140, their radial outer edges lie somewhat closer to a virtual plane, characterized e.g. by the surfaces of the chiplets, than a radially inner region. In some examples, this shaping can cause an elastic force effect during joining or screwing, which can e.g. also improve thermal contact between the components 110, 110', 120.

[0074] The configuration from Fig. 10 can also be used in some examples, for example, for the layer structure 110', 120, 140 from Fig. 9.

[0075] Fig. 11 schematically shows a side view of a device according to further examples. Instead of a heat pipe, a heat sink 130-2 is provided here, which is fastened to the housing 140, for example, by means of a screw 130-2a and a nut 130-2b. The screw 130-2a is passed through the through-opening 112 (Fig. 1) and thus enables a central introduction of force into the arrangement. Optionally, at least one disc-shaped mounting element 130-2c can be provided, for example, between the nut 130-2b and the PCB 1002.

[0076] In some examples, for example, instead of a separate nut 130-2b, a corresponding threaded section may also be provided in the mounting element 130-2c or in the PCB 1002.

[0077] In some examples, a rivet (not shown) may be provided instead of a screw, for example, wherein the device or the chiplet system is or is fastened to a heat sink, for example a heat sink, by means of the rivet through the central through-opening 112, for example.

[0078] In some examples, e.g. instead of a screw or rivet, a e.g. thermally conductive connector (not shown, e.g. similar to a heat pipe) can be passed through the through-hole 112, which connects a heat spreader arranged on one side of the device, e.g. of the chiplet system, in a thermally conductive and, optionally also mechanical manner, to components of the chiplet system and, optionally, to another heat spreader arranged e.g. on an opposite side of the chiplet system. In some examples, the thermally conductive connector and / or at least one of the heat spreaders can each be soldered to one another and / or to a carrier, e.g. a PCB.

[0079] Some examples, Fig. 12, relate to a use 300 of at least one device according to the disclosure and / or at least one system according to the disclosure / or at least one method according to the disclosure for at least one of the following elements: a) enabling 301 an, for example efficient, mounting of the device, or b) enabling 302 an, for example efficient, cooling of the device, or c) enabling 303 an, for example efficient, alignment, for example centering, of the device, for example on a circuit board 1002, or d) cooling 304 of multi-chiplet systems, or e) avoiding 305 hotspots in multi-chiplet systems, f) transporting 306 thermal energy from a multi-chiplet system, for example along two or three mutually orthogonal spatial directions.

[0080] In some examples, the through-hole opening 112 enables one or more mechanical advantages such as direct through-hole mounting of a heat pipe or a heat sink or heat exchanger or the like, e.g. in an area between several chiplets provided or placeable on the carrier 110, 110', and / or central force introduction, which can further increase the thermally effective contacting of the connection partners.

Claims

Claims 1. Device (100; 100a; 100b) for chiplets, comprising a carrier (110) for a plurality of chiplets (120-1, 120-2, ...), wherein the carrier (110) has at least one through-opening (112).

2. Device (100; 100a; 100b) according to claim 1, wherein the carrier (110) comprises or is at least one of the following elements: a) substrate, or b) interposer.

3. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein the carrier (110) consists of silicon or glass or ceramic.

4. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein the at least one through-opening (112) is arranged, for example at least approximately, centrally.

5. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein at least two chiplets (120-1, 120-2, ...) are arranged on the carrier (110).

6. Device (100; 100a; 100b) according to claim 5, wherein the at least one through-opening (112) is arranged, for example at least approximately, between the at least two chiplets (120-1, 120-2, ...).

7. Device (100; 100a; 100b) according to at least one of the preceding claims, wherein a maximum opening width (OWmax) of the at least one through-opening (112), for example defined as a greatest distance between two opposite points within an opening contour of the at least one through-opening (112), is between, for example, approximately 2 millimeters and, for example, approximately 18 millimeters.

8. Device (100; 100a; 100b) according to at least one of the preceding claims, comprising a thermal dissipation device (130), wherein, for example, at least one component or at least a part of the thermal dissipation device (130), for example at least partially, can be or is arranged in the at least one through-opening (112).

9. Device (100; 100a; 100b) according to claim 8, wherein the thermal dissipation device (130) comprises at least one of the following elements or is designed as at least one of the following elements: a) heat sink, or b) heat pipe, or c) heat spreader, or d) heat exchanger, for example for fluid cooling.

10. Device (100; 100a; 100b) according to at least one of claims 8 to 9, wherein the thermal dissipation device (130), for example completely, can be guided through the at least one through-opening (112) and can be brought into thermally conductive contact with a surface (112a) of the at least one through-opening (112). 11 . Device (100; 100a; 100b) according to at least one of claims 8 to 10, wherein the thermal dissipation device (130) has fastening means (132a) for positive and / or non-positive and / or materially bonded fastening to at least one further component of the device (100; 100a; 100b).

12. Device (100; 100a; 100b) according to at least one of claims 8 to 11, wherein the thermal dissipation device (130) has at least one external thread (132a).

13. Device (100; 100a; 100b) according to at least one of claims 8 to 12, wherein the thermal dissipation device (130) has at least one flange.

14. Device (100; 100a; 100b) according to at least one of the preceding claims, comprising a housing (140).

15. Device (100; 100a; 100b) according to claim 14, wherein the housing (140) has at least one opening (142a, 142b) which, together with the at least one through-opening (112), forms a, for example continuous, through-opening (112, 142a, 142b).

16. System (1000) comprising a circuit board (1002) and at least one device (100; 100a; 100b; 100') according to at least one of the preceding claims arranged on the circuit board (1002).

17. A method for producing a device (100; 100a; 100b) for chiplets, comprising a carrier (110) for a plurality of chiplets (120), the method comprising: providing (200) the carrier (110) with at least one through-opening (112).

18. The method of claim 17, comprising: arranging (202) one or more chiplets (120) on the carrier (110).

19. The method according to claim 17 or 18, comprising: arranging (204) a thermal dissipation device (130) in the region of the at least one through-opening (112).

20. The method according to at least one of claims 17 to 19, wherein the providing (200) comprises at least one of the following elements: a) providing (200a) a carrier without a through-opening (112), preparing (200b) the at least one through-opening (112) in the carrier, or b) producing (200c) the carrier (110) together with the at least one through-opening (112).

21. Use (300) of at least one device (100; 100a; 100b) according to at least one of claims 1 to 15 and / or at least one system (1000) according to claim 16 and / or at least one method according to at least one of claims 17 to 20 for at least one of the following elements: a) enabling (301) an, for example efficient, mounting of the device (100; 100a; 100b), or b) enabling (302) an, for example efficient, cooling of the device (100; 100a; 100b), or c) enabling (303) an, for example efficient, alignment, for example centering, of the device (100; 100a; 100b), for example on a circuit board (1002), or d) cooling (304) of multi-chiplet systems, or e) avoiding (305) of hotspots in multi-chiplet systems, f) transporting (306) thermal energy from a multi-chiplet system, for example along two or three mutually orthogonal spatial directions.

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