Bonding device and bonding method

Abstract

A bonding device (60) separates a plurality of dies (D) from a carrier (E) and bonds the same to a target substrate (W). The carrier (E) has a carrier substrate (E1), and a resin film (E2) that is provided on a die (D)-facing surface of the carrier substrate (E1). The dies (D) each have a first surface (Da) that faces the resin film (E2), and a second surface (Db) that faces the opposite way from the first surface (Da). The bonding device (60) comprises: a carrier retention unit (61) that retains the carrier substrate (E1) from the opposite side from the resin film (E2); a substrate retention unit (62) that retains the target substrate (W); and a conveyance unit (63) that conveys the dies (D) from the carrier (E) to the target substrate (W). The conveyance unit (63) has a suction head (64a) that uses suction to grab a die (D) from the opposite side from the carrier (E), and a pressing head (64c) that presses the resin film (E2) toward the carrier substrate (E1) at the periphery of the first surface (Da) of the die (D) which the suction head (64a) grabs using suction.

Description

Joining device and joining method

[0001] The present disclosure relates to a joining device and a joining method.

[0002] The chip mounting system described in Patent Document 1 includes a chip supply device, a bonding device, a surface treatment device, a carry-in / out unit, and a transport unit (paragraph

[0225] of Patent Document 1). The chip supply device supplies multiple chips individually. The chips are attached to tape covering an opening of a frame, and are pushed up one by one and turned upside down (paragraph

[0251] of Patent Document 1). The bonding device attaches the chips supplied from the chip supply device to a substrate.

[0003] Japanese Patent No. 6337400

[0004] One aspect of the present disclosure provides a technique for smoothly separating multiple dies individually from a carrier.

[0005] A bonding apparatus according to one aspect of the present disclosure separates multiple dies from a carrier and bonds them to a target substrate. The carrier includes a carrier substrate and a resin film provided on a surface of the carrier substrate facing the die. The die has a first surface facing the resin film and a second surface facing opposite the first surface. The bonding apparatus includes a carrier holding unit that holds the carrier substrate from the side opposite the resin film, a substrate holding unit that holds the target substrate, and a transport unit that transports the die from the carrier to the target substrate. The transport unit includes a suction head that suctions the die from the side opposite the carrier, and a pressing head that presses the resin film toward the carrier substrate around the first surface of the die suctioned by the suction head.

[0006] According to one aspect of the present disclosure, multiple dies can be smoothly separated individually from the carrier.

[0007] FIG. 1 is a plan view showing a bonding system according to an embodiment. FIG. 2 is a cross-sectional view showing an example of a target substrate. FIG. 3 is a cross-sectional view showing an example of a die bonded to a target substrate. FIG. 4 is a cross-sectional view showing an example of a plurality of dies mounted on a carrier. FIG. 5 is a flowchart showing a bonding method according to an embodiment. FIG. 6 is a cross-sectional view showing an example of the operation of the bonding apparatus according to an embodiment. FIG. 7 is a cross-sectional view showing an example of the operation of the bonding apparatus subsequent to FIG. 6. FIG. 8 is a cross-sectional view showing an example of the operation of the pickup unit. FIG. 9 is a cross-sectional view showing an example of the operation of the pickup unit subsequent to FIG. 8. FIG. 10 is a cross-sectional view showing an example of the operation of the pickup unit subsequent to FIG. 9. FIG. 11 is a cross-sectional view showing a pickup unit according to a first modified example. FIG. 12 is a cross-sectional view showing a pickup unit according to a second modified example. FIG. 13 is a plan view showing an example of a pressing head. FIG. 14 is a plan view showing another example of a pressing head.

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that in each drawing, the same or similar components are denoted by the same reference numerals, and descriptions thereof may be omitted. In this specification, the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other. The X-axis direction and Y-axis direction are horizontal directions, and the Z-axis direction is vertical. The X-axis direction includes the positive X-axis direction and the negative X-axis direction that is opposite to the positive X-axis direction. The Y-axis direction includes the positive Y-axis direction and the negative Y-axis direction that is opposite to the positive Y-axis direction. The Z-axis direction includes the positive Z-axis direction and the negative Z-axis direction that is opposite to the positive Z-axis direction.

[0009] A bonding system 1 according to one embodiment will be described with reference to FIGS. 1 to 4. The bonding system 1 individually separates multiple dies from a carrier and bonds them to a target substrate W. As shown in FIG. 2, the target substrate W has a semiconductor substrate W1, such as a silicon wafer, and multiple devices W2 formed on the semiconductor substrate W1. The multiple devices W2 are partitioned by multiple streets that intersect with each other at right angles. Each device W2 includes an electronic circuit. As shown in FIG. 3, a die D is electrically connected to each device W2. The target substrate W is then cut along the streets to separate each device W2, thereby obtaining a semiconductor device. The semiconductor device includes the device W2 and the die D.

[0010] The die D is formed by dividing a semiconductor substrate on which a plurality of devices other than the device W2 are formed into individual devices. The electronic circuit of the die D is electrically connected to the electronic circuit of the device W2 on the target substrate W. Note that the type and number of dies electrically connected to one device W2 are not particularly limited. Although not shown, multiple dies may be electrically connected to one device W2.

[0011] As shown in Figure 4, the carrier E holds a plurality of dies D. Each die D has a first surface Da facing the carrier E and a second surface Db facing opposite the first surface Da. Preferably, the first surface Da is the lower surface and the second surface Db is the upper surface. The bonding surface of the die D with the target substrate W is preferably the second surface Db. If the second surface Db is the bonding surface, the bonding surface of each die D can be activated and hydrophilized. The carrier E has a carrier substrate E1 and a resin film E2 provided on the surface of the carrier substrate E1 facing the die D.

[0012] The carrier E holds a plurality of dies D on the resin film E2. The carrier E electrostatically attracts the dies D. By pressing the dies D against the resin film E2, the resin film E2 can be deformed so as to remove gas from between the dies D and the resin film E2, and the dies D can also be vacuum-attached to the resin film E2.

[0013] The carrier substrate E1 may be conductive or insulating. The carrier substrate E1 is preferably made of a rigid material. For example, the carrier substrate E1 is preferably made of silicon (Si), ceramic, aluminum, an aluminum alloy, stainless steel, zirconia, silicon carbide (SiC), titanium, or glass. The carrier substrate E1 may have a diameter approximately equal to that of the target substrate W. The carrier substrate E1 may also have a thickness approximately equal to that of the target substrate W.

[0014] The resin film E2 is preferably made of a flexible material, specifically a material with an elastic modulus of 2 GPa or less, more preferably 0.5 GPa or less. From the viewpoint of durability during modification of the bonding surface of the die D, the resin film E2 is preferably made of, for example, polyimide or EVA (ethylene-vinyl acetate copolymer). The thickness of the resin film E2 is, for example, 10 μm. While the resin film E2 is a single layer in this embodiment, it may be made of multiple layers. For example, the resin film E2 may have a polyolefin layer and an acrylic adhesive layer.

[0015] 1 , the bonding system 1 includes a loading / unloading station 2, a first processing station 3, a second processing station 5, and a control circuit 9. The loading / unloading station 2, the first processing station 3, and the second processing station 5 are arranged in a line from the negative side of the X-axis to the positive side of the X-axis, in that order. Although not shown, a plurality of second processing stations 5 may be provided, and a plurality of second processing stations 5 may be arranged in a line from the negative side of the X-axis to the positive side of the X-axis.

[0016] The carry-in / out station 2 includes a mounting table 20. Cassettes C1 to C4 are mounted on the mounting table 20. Cassette C1 accommodates a target substrate W before a die D is bonded thereto. Cassette C2 accommodates a target substrate W after a die D has been bonded thereto. Cassette C3 accommodates a carrier E before the die D is separated therefrom. Cassette C4 accommodates a carrier E after the die D has been separated therefrom.

[0017] The loading / unloading station 2 includes a first transfer region 21 and a first transfer device 22. The first transfer region 21 is adjacent to the mounting table 20. The first transfer region 21 extends in the Y-axis direction. The first transfer device 22 has a transfer arm. The transfer arm holds and transfers the target substrate W and the carrier E in the first transfer region 21. The number of transfer arms may be one or more. The transfer arm for the target substrate W and the transfer arm for the carrier E may be provided separately. The first transfer device 22 has a drive unit (not shown) that moves or rotates the transfer arm. The transfer arm is capable of moving horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction) and rotating about the vertical axis.

[0018] The first processing station 3 includes a first storage device 30. The first storage device 30 is adjacent to the first transfer region 21. The first storage device 30 is disposed on the opposite side of the first transfer region 21 from the mounting table 20. The first storage device 30 temporarily stores target substrates W and carriers E. The first storage device 30 has multiple stages arranged in the vertical direction. Each stage holds a target substrate W and a carrier E. The stage for the target substrates W and the stage for the carriers E may be provided separately.

[0019] The first processing station 3 includes a second transfer region 31 and a second transfer device 32. The second transfer region 31 is adjacent to the first storage device 30 and extends from the first storage device 30 in the positive direction of the X-axis. The second transfer device 32 has a transfer arm. The transfer arm holds and transfers the target substrate W and the carrier E in the second transfer region 31. The number of transfer arms may be one or more. The transfer arm for the target substrate W and the transfer arm for the carrier E may be provided separately. The second transfer device 32 has a drive unit (not shown) that moves or rotates the transfer arm. The transfer arm is capable of moving horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction) and rotating about the vertical axis.

[0020] The first processing station 3 includes a first activation device 33, a first hydrophilization device 34, a second activation device 35, and a second hydrophilization device 36. The first activation device 33, the first hydrophilization device 34, the second activation device 35, and the second hydrophilization device 36 are adjacent to the second transport region 31 and are provided on the positive Y-axis side or the negative Y-axis side of the second transport region 31.

[0021] The first activation device 33 activates the bonding surface (e.g., the second surface Db) of the die D while the die D is held by the carrier E. The first activation device 33 is, for example, a plasma processing device. In the first activation device 33, oxygen gas, which is a processing gas, is excited under reduced pressure, for example, to form plasma and is ionized. The bonding surface of the die D is activated by irradiating the oxygen ions onto the bonding surface of the die D. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

[0022] The first hydrophilizing device 34 hydrophilizes the bonding surface of the die D while the die D is held by the carrier E. For example, the first hydrophilizing device 34 supplies pure water (e.g., deionized water) onto the die D while rotating the carrier E held by the spin chuck. The pure water imparts OH groups to the bonding surface of the die D, which has been activated in advance. The die D and the target substrate W can be bonded by utilizing hydrogen bonding between the OH groups.

[0023] The second activation device 35 activates the bonding surface Wa of the target substrate W. The second activation device 35 is, for example, a plasma processing device. In the second activation device 35, oxygen gas, which is a processing gas, is excited under reduced pressure, for example, to form plasma and is ionized. The bonding surface Wa of the target substrate W is activated by irradiating the oxygen ions onto the bonding surface Wa of the target substrate W. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

[0024] The second hydrophilizing device 36 hydrophilizes the bonding surface Wa of the target substrate W. For example, the second hydrophilizing device 36 supplies pure water (e.g., deionized water) onto the target substrate W while rotating the target substrate W held by the spin chuck. The pure water provides OH groups to the bonding surface Wa of the target substrate W, which has been activated in advance. The die D and the target substrate W can be bonded using hydrogen bonding between the OH groups.

[0025] The second processing station 5 includes a second storage device 50. The second storage device 50 is adjacent to the second transport region 31. The second storage device 50 is disposed on the opposite side of the second transport region 31 from the first storage device 30. The second storage device 50 temporarily stores target substrates W and carriers E. The second storage device 50 has multiple stages arranged vertically. Each stage holds at least one of the target substrates W and the carriers E. The stage for the target substrates W and the stage for the carriers E may be provided separately.

[0026] The second processing station 5 includes a third transfer region 51 and a third transfer device 52. The third transfer region 51 is adjacent to the second storage device 50 and extends from the second storage device 50 in the positive direction of the X-axis. The third transfer device 52 has a transfer arm. The transfer arm holds and transfers the target substrate W and the carrier E in the third transfer region 51. The number of transfer arms may be one or more. The transfer arm for the target substrate W and the transfer arm for the carrier E may be provided separately. The third transfer device 52 has a drive unit (not shown) that moves or rotates the transfer arm. The transfer arm is capable of moving horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction) and rotating about the vertical axis.

[0027] The second processing station 5 includes a bonding device 60. The bonding device 60 is adjacent to the third transfer region 51 and is provided on the positive Y-axis side or the negative Y-axis side of the third transfer region 51. The bonding device 60 separates the die D from the carrier E and bonds the die D to the target substrate W with the bonding surface (e.g., second surface Db) of the separated die D facing the bonding surface Wa of the target substrate W. Details of the bonding device 60 will be described later.

[0028] The control circuit 9 is, for example, a computer. The control circuit 9 includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs that control various processes executed in the bonding system 1. The control circuit 9 controls the operation of the bonding system 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92. A lower-level control circuit that controls the operation of each device that constitutes the bonding system 1 may be provided, and a higher-level control circuit that controls the overall operation of multiple lower-level control circuits may be provided. The control circuit 9 may be configured with multiple lower-level control circuits and the higher-level control circuit.

[0029] The control circuit 9 includes electronic circuits such as a CPU, a GPU (Graphics Processing Unit), an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), and performs the various control operations described in this specification by executing instruction codes stored in a memory or by being a circuit designed for a specific application.

[0030] Next, a bonding method according to one embodiment will be described with reference to Fig. 5. The process of Fig. 5 is performed under the control of the control circuit 9. First, the first transport device 22 removes the carrier E from the cassette C3 and transports it to the first storage device 30. Next, the second transport device 32 removes the carrier E from the first storage device 30 and transports it to the first activation device 33.

[0031] Next, the first activation device 33 activates the bonding surface (e.g., the second surface Db) of the die D while holding the die D on the carrier E (step S101). Thereafter, the second transport device 32 removes the carrier E from the first activation device 33 and transports it to the first hydrophilization device 34.

[0032] Next, the first hydrophilization device 34 hydrophilizes the bonding surface of the die D while the die D is held by the carrier E (step S102). Thereafter, the second transport device 32 removes the carrier E from the first hydrophilization device 34 and transports it to the second storage device 50. Subsequently, the third transport device 52 removes the carrier E from the second storage device 50 and transports it to the bonding device 60.

[0033] In parallel with the above steps S101 and S102, the following steps S103 and S104 are performed. First, the first transfer device 22 removes the target substrate W from the cassette C1 and transfers it to the first storage device 30. Next, the second transfer device 32 removes the target substrate W from the first storage device 30 and transfers it to the second activation device 35.

[0034] Next, the second activation device 35 activates the bonding surface Wa of the target substrate W (step S103), after which the second transport device 32 removes the target substrate W from the second activation device 35 and transports it to the second hydrophilization device 36.

[0035] Next, the second hydrophilizing device 36 hydrophilizes the bonding surface Wa of the target substrate W (step S104). Thereafter, the second transfer device 32 removes the target substrate W from the second hydrophilizing device 36 and transfers it to the second storage device 50. Subsequently, the third transfer device 52 removes the target substrate W from the second storage device 50 and transfers it to the bonding device 60.

[0036] Next, the bonding device 60 separates the die D from the carrier E, and bonds the die D to the target substrate W by orienting the bonding surface of the separated die D toward the bonding surface Wa of the target substrate W (step S105). Note that when multiple dies D are electrically connected to one device W2, bonding of the die D to the target substrate W is performed for each type of die D.

[0037] The target substrate W after the die D has been bonded is transported to the cassette C2. First, the third transport device 52 removes the target substrate W with the bonded die D from the bonding device 60 and transports it to the second storage device 50. Next, the second transport device 32 removes the target substrate W with the bonded die D from the second storage device 50 and transports it to the first storage device 30. Finally, the first transport device 22 removes the target substrate W with the bonded die D from the first storage device 30 and stores it in the cassette C2.

[0038] The carrier E from which the die D has been separated is stored in the cassette C4. First, the third conveying device 52 takes out the carrier E from which the die D has been separated from the bonding device 60 and conveys it to the second storage device 50. Next, the second conveying device 32 takes out the carrier E from which the die D has been separated from the second storage device 50 and conveys it to the first storage device 30. Finally, the first conveying device 22 takes out the carrier E from which the die D has been separated from the first storage device 30 and stores it in the cassette C4.

[0039] Next, an example of a bonding device 60 will be described with reference to Figures 6 and 7. The bonding device 60 individually separates multiple dies D from a carrier E and bonds them to a target substrate W. The bonding device 60 includes, for example, a carrier holding unit 61, a substrate holding unit 62, a transport unit 63, and a control circuit 93. The carrier holding unit 61 holds the carrier substrate E1 from the side opposite to the resin film E2 (e.g., the lower side). The substrate holding unit 62 holds the target substrate W. The transport unit 63 transports the dies D from the carrier E held by the carrier holding unit 61 to the target substrate W held by the substrate holding unit 62. The control circuit 93 may be part of the control circuit 9.

[0040] Next, an example of the transfer unit 63 will be described with reference to Figures 6 and 7. The transfer unit 63 includes, for example, a pickup unit 64 and a mount unit 65. The pickup unit 64 separates the die D from the carrier E held by the carrier holding unit 61 and transfers it. The pickup unit 64 may turn the die D upside down while transferring the die D. The bonding surface (e.g., the second surface Db) of the die D can face downward. The mount unit 65 receives the die D from the pickup unit 64 and bonds the received die D to the target substrate W held by the substrate holding unit 62.

[0041] The pickup unit 64 has, for example, a suction head 64a and a first moving mechanism 64b. The suction head 64a suctions the die D from the side opposite to the carrier E (for example, from the upper side). The suction head 64a suctions the bonding surface (for example, the second surface Db) of the die D, and may perform suction without contact to avoid contaminating the bonding surface. The first moving mechanism 64b moves the suction head 64a in the X-axis direction, the Y-axis direction, and the Z-axis direction. The first moving mechanism 64b may also invert the suction head 64a upside down, thereby inverting the die D upside down. The bonding surface of the die D can be inverted upside down. Details of the pickup unit 64 will be described later.

[0042] The mount unit 65 has, for example, a suction head 65a and a moving mechanism 65b. The suction head 65a suctions the die D from the side opposite to the suction head 64a (for example, the upper side). The suction head 65a suctions the non-bonding surface (for example, the first surface Da) opposite to the bonding surface of the die D. Since it does not matter if the non-bonding surface becomes dirty, the suction head 65a may come into contact with the die D. This can improve the suction force and suppress misalignment.

[0043] The movement mechanism 65b moves the suction head 65a in the Z-axis direction to bond the die D to the target substrate W. To improve the accuracy of the bonding position, the movement mechanism 65b may move the suction head 65a in the X-axis direction and the Y-axis direction, or may rotate the suction head 65a about the vertical axis. The amount of movement or rotation required to improve the accuracy of the bonding position is small, and the suction head 65a does not need to move much when viewed from above.

[0044] The bonding device 60 may include a carrier moving unit 68. The carrier moving unit 68 moves the carrier E together with the carrier holding unit 61. The carrier moving unit 68 moves the carrier E, for example, in the X-axis direction and the Y-axis direction. This allows the pickup unit 64 to receive the die D at the same receiving position every time. This simplifies the operation of the pickup unit 64. The carrier moving unit 68 may also move the carrier E in the Z-axis direction.

[0045] The bonding device 60 does not necessarily have to include the carrier moving unit 68. That is, the carrier holding unit 61 may be fixed. In this case, the receiving position at which the pickup unit 64 receives the die D changes for each die D.

[0046] The bonding apparatus 60 may include a substrate moving unit 69. The substrate moving unit 69 moves the target substrate W together with the substrate holder 62. The substrate moving unit 69 moves the target substrate W, for example, in the X-axis direction and the Y-axis direction. This makes it possible to change the bonding position of the die D relative to the target substrate W. As a result, the pickup unit 64 can deliver the die D to the mount unit 65 at the same delivery position every time. This simplifies the operation of the pickup unit 64. The substrate moving unit 69 may also move the target substrate W in the Z-axis direction.

[0047] The bonding device 60 may include at least one of a first imaging unit 71, a second imaging unit 72, and a third imaging unit 73 in order to improve the accuracy of the bonding position of the die D relative to the target substrate W. Note that the first imaging unit 71, the second imaging unit 72, and the third imaging unit 73 do not have to capture an image every time the die D and the target substrate W are bonded, and may capture images periodically.

[0048] The first imaging unit 71 captures an image of the alignment marks on the joining surface (e.g., the second surface Db) of the die D held by the suction head 65a. The number of alignment marks to be captured is, for example, two, but is not particularly limited. The alignment marks may be dedicated marks or may be part of the electronic circuit of the die D.

[0049] The first imaging unit 71 is disposed, for example, below the suction head 65a. The first imaging unit 71 transmits the captured image to the control circuit 93. The control circuit 93 processes the image captured by the first imaging unit 71 to detect the position of the die D in the first coordinate system set for the suction head 65a.

[0050] The second imaging unit 72 captures an image of the alignment marks on the bonding surface Wa of the target substrate W held by the substrate holding unit 62. The number of alignment marks to be captured is, for example, two, but is not particularly limited. The alignment marks may be dedicated marks or may be part of the electronic circuit of the device W2 on the target substrate W.

[0051] The second imaging unit 72 is disposed, for example, above the board holding unit 62 and is provided, for example, on the suction head 65a. The second imaging unit 72 transmits the captured image to the control circuit 93. The control circuit 93 processes the image captured by the second imaging unit 72 to detect the position of the device W2 in the second coordinate system set in the board holding unit 62.

[0052] The control circuit 93 aligns the die D held by the suction head 65a with the device W2 on the target substrate W held by the substrate holder 62, using an image captured by at least one of the first imaging unit 71 and the second imaging unit 72. The alignment is performed by controlling at least one of the movement mechanism 65b and the substrate moving unit 69. Before bonding the die D and the target substrate W, the position of the die D or the device W2 can be corrected, thereby improving the accuracy of the bonding position.

[0053] After the die D and the device W2 are bonded, the third imaging unit 73 simultaneously captures images of both the alignment mark on the bonding surface (e.g., the second surface Db) of the die D and the alignment mark on the bonding surface Wa of the target substrate W. The third imaging unit 73 captures images of the alignment marks of the die D and the target substrate W, for example, by transmitting light through the die D. The third imaging unit 73 is configured, for example, by an infrared camera.

[0054] When the third imaging unit 73 captures an image of the alignment marks of the die D and the target substrate W through the die D, it is disposed, for example, above the substrate holding unit 62 and is provided, for example, on the suction head 65a. The third imaging unit 73 transmits the captured image to the control circuit 93. The control circuit 93 processes the image captured by the third imaging unit 73 to detect a deviation between the actual bonding position and the target bonding position.

[0055] The control circuit 93 uses the image captured by the third imaging unit 73 to align the die D held by the suction head 65a with the target substrate W held by the substrate holder 62 in the next and subsequent bonding of the die D and the target substrate W. The position of the die D or the target substrate W can be corrected taking into account the behavior of the bonding device 60, and the accuracy of the bonding position can be improved.

[0056] Next, an example of the configuration of the pickup unit 64 will be described with reference to Figures 8 to 10. The pickup unit 64 separates and transports the die D from the carrier E held by the carrier holding unit 61. The die D has a first surface Da facing the resin film E2 and a second surface Db facing opposite to the first surface Da. It is preferable that the first surface Da is the lower surface and the second surface Db is the upper surface. It is preferable that the bonding surface of the die D with the target substrate W is the second surface Db.

[0057] The pickup unit 64 includes a pressing head 64c. As shown in Fig. 9, the pressing head 64c presses the resin film E2 toward the carrier substrate E1 around the first surface Da of the die D that is held by the suction head 64a. This allows a wedge-shaped gap S to be formed between the die D and the resin film E2 around the periphery of the first surface Da of the die D that is held by the suction head 64a. The die D and the resin film E2 can be smoothly separated from each other starting from the wedge-shaped gap S.

[0058] 9, the pressing head 64c may press the second surface Db of a die D other than the die D that is being sucked by the suction head 64a, thereby pressing the resin film E2 toward the carrier substrate E1. When the distance between adjacent dies D is narrow and the pressing head 64c cannot come into contact with the resin film E2, it is possible to press the resin film E2.

[0059] The die D pressed by the pressing head 64c and the die D sucked by the suction head 64a are adjacent to each other. The first surface Da of the die D pressed by the pressing head 64c is closer to the carrier substrate E1 than the first surface Da of the die D sucked by the suction head 64a. This causes elastic deformation of the resin film E2, and a wedge-shaped gap S is formed between the die D and the resin film E2. Note that the first surface Da of the die D pressed by the pressing head 64c is closer to the carrier substrate E1 but does not come into contact with the carrier substrate E1.

[0060] 9, the pickup unit 64 may include a second moving mechanism 64d. The second moving mechanism 64d moves the pressing head 64c relative to the suction head 64a. The second moving mechanism 64d is, for example, a pneumatic cylinder. The driving force of the second moving mechanism 64d causes the pressing head 64c to press the resin film E2.

[0061] The pickup unit 64 may include a holder 64e. The holder 64e is equipped with, for example, a suction head 64a, a pressure head 64c, a second moving mechanism 64d, and a third moving mechanism 64f (described later). The first moving mechanism 64b moves the holder 64e, thereby moving the pressure head 64c together with the suction head 64a.

[0062] The second moving mechanism 64d moves the pressing head 64c relative to the holder 64e, while the third moving mechanism 64f moves the suction head 64a relative to the holder 64e. As a result, as shown in Fig. 10, the pressing head 64c presses the resin film E2 toward the carrier substrate E1, and the die D can be separated from the carrier E together with the suction head 64a.

[0063] Incidentally, if the first moving mechanism 64b and the second moving mechanism 64d are present, even without the third moving mechanism 64f, it is possible to separate the die D from the carrier E together with the suction head 64a while the pressing head 64c presses the resin film E2 toward the carrier substrate E1. However, if the third moving mechanism 64f is present, control is easier.

[0064] 8 to 10, an example of the operation of the pickup unit 64 will be described. The operation of the pickup unit 64 is performed under the control of the control circuit 93.

[0065] 8, the first moving mechanism 64b moves the suction head 64a to a receiving position where the die D is received. The suction head 64a suctions one die D from the side opposite to the carrier E (e.g., the upper side). As shown in Fig. 8, the pressing head 64c does not need to press the resin film E2 around the first surface Da of the die D that is suctioned by the suction head 64a.

[0066] 9, the second moving mechanism 64d lowers the pressing head 64c relative to the holder 64e, and the pressing head 64c presses the resin film E2 downward. Meanwhile, the first moving mechanism 64b stops the holder 64e. As a result, a wedge-shaped gap S is formed between the die D and the resin film E2 at the periphery of the first surface Da of the die D that is adsorbed by the suction head 64a.

[0067] 10, the third moving mechanism 64f raises the suction head 64a relative to the holder 64e, and moves the die D together with the suction head 64a away from the resin film E2. Meanwhile, the first moving mechanism 64b stops the holder 64e. Since the pressing head 64c presses the resin film E2 downward, the die D can be easily separated from the resin film E2.

[0068] 9, the first moving mechanism 64b may raise the holder 64e to separate the die D together with the suction head 64a from the resin film E2. In this case, the pressing head 64c is raised together with the suction head 64a, and the resin film E2 elastically recovers.

[0069] As described above, according to this embodiment, the pressing head 64c presses the resin film E2, thereby forming a wedge-shaped gap S between the die D and the resin film E2 at the periphery of the first surface Da of the die D that is adsorbed by the suction head 64a. The die D and the resin film E2 can be smoothly separated from each other starting from the wedge-shaped gap S.

[0070] As another technique for forming the wedge-shaped gap S, it is conceivable to provide a plurality of through-holes penetrating the carrier substrate E1 in the thickness direction (the vertical direction in FIGS. 8 to 10 ) and locally push up the resin film E2 by supplying gas to a specific through-hole or inserting a pin into the specific through-hole. One or more through-holes are provided for each die D.

[0071] According to this embodiment, the pressing head 64c presses the resin film E2 from the side opposite to the carrier substrate E1, so that a through-hole penetrating the carrier substrate E1 in the thickness direction is not necessary. If the carrier substrate E1 does not have a through-hole, there is no need to bother cleaning the through-hole. Furthermore, if the carrier substrate E1 does not have a through-hole, there is no risk of particles adhering to the through-hole contaminating the die D.

[0072] When a through-hole is formed in the carrier substrate E1, a nozzle or a pin is disposed below the through-hole, and therefore the carrier holding portion 61 is provided in a ring shape so as not to interfere with the nozzle or the pin. The carrier holding portion 61 holds only the peripheral portion of the surface (e.g., the lower surface) of the carrier substrate E1 opposite to the resin film E2.

[0073] According to this embodiment, since the carrier substrate E1 does not have a through-hole, the carrier holding portion 61 can hold the entire surface of the carrier substrate E1 opposite the resin film E2 (for example, the lower surface). This prevents the carrier substrate E1 and the resin film E2 from gradually bending as shown by the dashed dotted line in Fig. 9 when the pressing head 64c presses the resin film E2. Because the carrier holding portion 61 holds the entire carrier substrate E1 flat, the resin film E2 can be locally deformed, forming a wedge-shaped gap S.

[0074] The carrier holding part 61 has an adsorption surface facing the carrier substrate E1. The adsorption surface is preferably larger than the surface of the carrier substrate E1 opposite the resin film E2 (for example, the lower surface). A porous body, for example, is provided on the adsorption surface. By sucking gas from the porous body, the pressure in the porous body can be made lower than atmospheric pressure, allowing the carrier substrate E1 to be adsorbed. Note that the carrier holding part 61 may have a groove instead of a porous body. A plurality of grooves may be provided, for example, in a concentric circle arrangement. The grooves may also be provided radially.

[0075] Next, a pickup unit 64 according to a first modified example will be described with reference to Fig. 11. As shown in Fig. 11, if the interval between adjacent dies D is wide enough that the pressing head 64c can contact the resin film E2, the pressing head 64c may directly press the resin film E2. In this case, too, a wedge-shaped gap S can be formed between the die D and the resin film E2 at the periphery of the first surface Da of the die D that is adsorbed by the suction head 64a.

[0076] 11, the pressing head 64c presses the resin film E2 between two adjacent dies D. The surface of the pressing head 64c facing the resin film E2 (e.g., the lower surface) is closer to the carrier substrate E1 than the first surface Da of the die D that is adsorbed by the suction head 64a. This causes elastic deformation of the resin film E2, and a wedge-shaped gap S is formed between the die D and the resin film E2. Note that the lower surface of the pressing head 64c approaches the carrier substrate E1 but does not come into contact with the carrier substrate E1.

[0077] Next, a pickup unit 64 according to a second modified example will be described with reference to FIG. 12 . The pickup unit 64 may have a nozzle 64g. The nozzle 64g injects gas into the wedge-shaped gap S. The injected gas is not particularly limited, but may be, for example, air, nitrogen gas, or a rare gas. The pressure of the gas can widen the wedge-shaped gap S, allowing the die D and the resin film E2 to be smoothly separated from each other starting from the wedge-shaped gap S. The nozzle 64g is provided inside the pressing head 64c, but may also be provided outside the pressing head 64c.

[0078] 12 directly presses the resin film E2, but as described above, the press head 64c may also press the resin film E2 by pressing the second surface Db of the die D, which is separate from the suction head 64a. In the latter case, a wedge-shaped gap S is also formed, and the nozzle 64g may inject gas into the wedge-shaped gap S. In either case, the wedge-shaped gap S can be widened by the pressure of the gas, and the die D and the resin film E2 can be smoothly separated from each other starting from the wedge-shaped gap S.

[0079] Next, an example of the pressing head 64c will be described with reference to Fig. 13. The first surface Da of the die D may be rectangular. In this case, the pressing head 64c is preferably provided in the shape of a square frame so as to surround the four sides of the first surface Da of the die D that is sucked by the suction head 64a. A wedge-shaped gap S can be formed over the entire four sides of the first surface Da of the die D that is sucked by the suction head 64a.

[0080] The pressing head 64c does not have to press all of the dies D surrounding the die D that is sucked by the suction head 64a, but may press only some of them (see FIG. 14). The wedge-shaped gap S does not have to be formed along the entire four sides of the first surface Da of the die D that is sucked by the suction head 64a.

[0081] However, it is preferable that the wedge-shaped gap S is formed at at least one corner of the first surface Da of the die D that is adsorbed by the suction head 64a. This is because it is easy to separate the die D from the resin film E2. Therefore, it is preferable that the pressing head 64c presses the resin film E2 toward the carrier substrate E1 around at least one corner of the first surface Da of the die D that is adsorbed by the suction head 64a.

[0082] When the pressing head 64c presses the second surface Db of a die D other than the suction head 64a, it is preferable that the pressing head 64c presses the entire second surface Db of the die D, as shown in Figures 13 and 14. This allows the load to be distributed over the entire second surface Db of the die D, thereby preventing damage to the die D. Furthermore, the more dies D that the pressing head 64c presses, the more the load can be distributed.

[0083] Although the embodiments of the joining device and joining method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0084] This application claims priority based on Japanese Patent Application No. 2024-030347 filed with the Japan Patent Office on February 29, 2024, the entire contents of which are incorporated herein by reference.

[0085] 60 Bonding device 61 Carrier holding section 62 Substrate holding section 63 Transport section 64a Suction head 64c Pressing head W Target substrate D Die E Carrier E1 Carrier substrate E2 Resin film

Claims

1. A bonding device that separates multiple dies from a carrier and bonds them to a target substrate, wherein the carrier has a carrier substrate and a resin film provided on a surface of the carrier substrate facing the die, and the die has a first surface facing the resin film and a second surface facing opposite the first surface, the bonding device comprising: a carrier holding unit that holds the carrier substrate from the side opposite the resin film, a substrate holding unit that holds the target substrate, and a transport unit that transports the die from the carrier to the target substrate, and the transport unit has a suction head that adsorbs the die from the side opposite the carrier, and a pressing head that presses the resin film toward the carrier substrate around the first surface of the die adsorbed by the suction head.

2. The bonding device according to claim 1, wherein the pressing head presses the second surface of the die separate from the suction head to press the resin film toward the carrier substrate.

3. The joining device according to claim 2, wherein the pressing head presses the entire second surface of the die separate from the suction head.

4. A bonding device according to any one of claims 1 to 3, wherein the first surface of the die is rectangular, and the pressing head presses the resin film toward the carrier substrate around the corner of the first surface of the die that is adsorbed by the suction head.

5. A bonding device according to any one of claims 1 to 3, wherein the first surface of the die is rectangular, and the pressing head is provided in the shape of a square frame so as to surround the four sides of the first surface of the die that is adsorbed by the suction head.

6. A joining device according to any one of claims 1 to 3, wherein the transport section has a first movement mechanism that moves the suction head, and a second movement mechanism that moves the pressure head relative to the suction head.

7. A bonding device as described in claim 6, comprising a control circuit which performs the following in this order: control of the suction head to suction the die; control of the pressure head to press the resin film toward the carrier substrate around the die that is suctioned by the suction head; and control of the die, together with the suction head, to separate from the carrier while the pressure head presses the resin film toward the carrier substrate.

8. A bonding device according to any one of claims 1 to 3, wherein the pressing head presses the resin film toward the carrier substrate, forming a wedge-shaped gap between the die and the resin film at the periphery of the first surface of the die that is adsorbed by the suction head, and the transport unit has a nozzle that injects gas into the wedge-shaped gap.

9. The bonding device according to any one of claims 1 to 3, wherein the carrier holding section holds the entire surface of the carrier substrate opposite to the resin film.

10. A bonding method using the bonding apparatus according to any one of claims 1 to 3 to separate a plurality of dies from the carrier and bond them to the target substrate.

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