Method for manufacturing element array, method for removing element, method for repairing element array, device for removing element, and device for repairing element array

Abstract

[Problem] To provide a method for manufacturing an element array, the method being capable of manufacturing an element array having excellent durability, a method for removing an element, the method being used in the method for manufacturing the element array, a method for repairing an element array, a device for removing an element, and a device for repairing an element array. [Solution] This method for manufacturing an element array comprises: a step for irradiating a specific element 37a as an object to be removed with a first energy ray according to a first condition; and a step for irradiating a portion where the specific element is removed with a second energy ray according to a second condition. The first condition is the condition that an insulating member 39, which is in contact with a substrate terminal 38a, remains while the specific element 37a is removed from the surface of a substrate 34, and the second condition is different from the first condition and is the condition that the insulating member 39 is removed.

Description

Method for manufacturing element array, method for removing element, method for repairing element array, device for removing element, and device for repairing element array

[0001] The present disclosure relates to a method for manufacturing an element array, a method for removing an element, a method for repairing an element array, an element removal device, and an element array repair device.

[0002] In recent years, there has been active development of displays using micro LEDs with chip sizes of 100 μm or less. For example, Patent Document 1 below discloses a micro LED mounting technology using a laser-decomposable adhesive. Because displays using micro LEDs mount a large number of micro LED elements, light emission defects can occur due to defects in the micro LED elements themselves on a single display substrate or defects during mounting.

[0003] Meanwhile, in the field of surface mounting technology, a technology has been developed that uses a laser to remove elements such as micro LED elements from a substrate (for example, Patent Document 2), and one possible method is to remove a specific element such as a micro LED element mounted in a chip mounting location on a display substrate, and then remount a new element in the removed element mounting location.

[0004] When mounting a device on a substrate, an insulating material such as flux may be placed around the terminals on the substrate to connect the device terminals to the terminals on the substrate. In this case, if a specific device to be removed is irradiated with a laser, the device and the insulating material can be removed simultaneously if the laser output is high, but there is a risk of damaging the substrate itself or its components.

[0005] Furthermore, if the laser output is low, some of the elements remain, making it difficult to remount a new element. Even if only a specific element is removed, insulating materials such as flux used when mounting the element may deteriorate due to heat during laser irradiation, and the deteriorated insulating materials may remain on or near the terminals of the board.

[0006] If the deteriorated insulating material is left on or near the terminals of the substrate, there is a risk that a good bond will not be obtained when a new element is remounted. Even if a new element is not mounted, there is a risk that the durability of the element array (e.g., a display) will be reduced if the deteriorated insulating material is left on or near the terminals of the substrate.

[0007] Patent Document 1: WO2019 / 207920 Patent Document 2: JP2017-17230A

[0008] The present disclosure has been made in consideration of the above-described situation, and its purpose is to provide a method for manufacturing an element array that can manufacture an element array with excellent durability, a method for removing elements used in the manufacturing method, a method for repairing an element array, an element removal device, and an element array repair device.

[0009] In order to achieve the above object, a manufacturing method of an element array according to one aspect of the present disclosure is a method for manufacturing an element array having a plurality of elements electrically connected to a substrate terminal provided on a substrate via the element terminal, the method comprising: a step of irradiating a first energy ray to a specific element to be removed under a first condition; and a step of irradiating a second energy ray to a location from which the specific element has been removed under a second condition, wherein the first condition is a condition under which the specific element is removed from the surface of the substrate while an insulating member in contact with the substrate terminal remains, and the second condition is a condition different from the first condition and under which the insulating member is removed.

[0010] In this method for manufacturing an element array, first, a specific element to be removed is irradiated with a first energy beam under a first condition to remove the specific element from the surface of the substrate. The first condition is an energy irradiation condition that removes only the specific element, and leaves the insulating member, at least partially in contact with the substrate terminal that has been disconnected from the element terminal, together with the substrate terminal. Therefore, there is little risk of the first energy beam damaging the substrate itself or its constituent members.

[0011] The specific element may be removed from its predetermined position on the substrate by irradiating the specific element with a first energy ray to sublimate the specific element, or by irradiating the specific element with a first energy ray to release the connection between the element terminal and the substrate terminal, thereby flicking the element off and removing it from its predetermined position on the substrate.

[0012] Furthermore, by irradiating the insulating member present on the surface of the substrate at the predetermined position from which the specific element has been removed with the second energy ray under second conditions different from the first conditions, the insulating member at the predetermined position can be removed. Therefore, the insulating member deteriorated by heat or the like during irradiation with the first energy ray can be removed by irradiation with the second energy ray.

[0013] If the deteriorated insulating material is left on or near the terminals of the substrate, there is a risk that a good connection between the element terminals of the new element and the substrate element may not be achieved when a new element is mounted. However, by removing the deteriorated insulating material, a new insulating material can be formed in the removed area. Therefore, even if a new element is not mounted, the durability of the element array (e.g., a display) can be improved. Furthermore, by connecting the element terminals of the new element to the substrate terminals of the substrate after installing the new insulating material, the connection state is maintained good, and in this case, the durability of the element array (e.g., a display) can also be improved.

[0014] Preferably, the output of the first energy ray is higher than the output of the second energy ray, for example, the output of the first energy ray may be at least two times, at least five times, or at least ten times the output of the second energy ray.

[0015] Preferably, the number of shots of the second energy ray is greater than the number of shots of the first energy ray. For example, the number of shots of the first energy ray is preferably as small as possible, for example, 3 shots or less, 2 shots or less, 1 shot, etc., although this depends on the output of the first energy ray. It is preferable that only the specific element can be removed with a small number of shots.

[0016] Furthermore, the number of shots of the second energy ray is preferably, for example, two or more, three or more, four or more, etc., and is preferably a number sufficient to sufficiently remove the insulating material located around the substrate terminal on the surface of the substrate corresponding to the position where the specific element was removed.

[0017] Preferably, the first energy beam is irradiated onto the specific element within a first irradiation range that is smaller than the area of ​​the plane of the specific element. By irradiating the first energy beam within such an irradiation range, there is little risk of deterioration of the substrate and its accessories (e.g., a cavity frame) located around the specific element.

[0018] The second energy beam may be irradiated onto the insulating member in a second irradiation range that can remove the insulating member located around the substrate terminal on the surface of the substrate corresponding to the position where the specific element was removed, and the irradiation range is not particularly limited. However, if the specific element and the insulating member are disposed within the cavity of the cavity frame, it is preferable that the second irradiation range is a range that does not irradiate the cavity frame, in order to prevent deterioration of the cavity frame.

[0019] The method for connecting the substrate terminals and the element terminals is not particularly limited, but the above-mentioned method is particularly effective when the substrate terminals and the element terminals are metallically bonded.

[0020] Each of the elements may be disposed within a cavity of a cavity frame provided on the surface of the substrate, and it is preferable that an insulating member be interposed within the cavity around the element terminals and substrate terminals. This configuration facilitates regular element arrangement and also facilitates the removal of specific elements. The cavity frame may be provided on the surface of the substrate by preparing a cavity frame separately from the substrate and attaching the cavity frame to the substrate, or by integrally forming the cavity frame on the surface of the substrate itself.

[0021] The above-mentioned method for manufacturing an element array may further include the steps of: supplying a new insulating material to the surface portion of the substrate from which the insulating material has been removed; and connecting an element terminal of the new element to the substrate terminal located on the surface portion of the substrate from which the new insulating material has been supplied.

[0022] A method for removing an element according to one aspect of the present disclosure includes the steps of: irradiating a first energy ray to a specific element to be removed under first conditions; and irradiating a second energy ray to the area from which the specific element has been removed under second conditions, wherein the first conditions are conditions under which the specific element is removed from the surface of the substrate while leaving an insulating material in contact with the substrate terminal; and the second conditions are different from the first conditions and are conditions under which the insulating material is removed.

[0023] By using this element removal method, the above-mentioned element array manufacturing method can be easily realized.

[0024] A method for repairing an element array according to one aspect of the present disclosure includes the steps of: after removing the specific element and the insulating material by the element removal method described above, supplying a new insulating material to the surface portion of the substrate from which the insulating material has been removed; transporting a new element to the surface portion of the substrate to which the new insulating material has been supplied; and connecting an element terminal of the new element to the substrate terminal located on the surface portion of the substrate to which the new insulating material has been supplied.

[0025] Using this element array repair method, the above-described element array manufacturing method can be easily realized.

[0026] An element removal apparatus according to one aspect of the present disclosure includes: a substrate support portion that holds a substrate; an energy irradiation device that irradiates energy rays; a first control portion that controls the energy irradiation device so that a specific element to be removed among a plurality of elements having element terminals connected to substrate terminals provided on the surface of the substrate is irradiated with the energy rays under a first condition; and a second control portion that controls the energy rays irradiated from the energy irradiation device under a second condition to an insulating member present on the surface of the substrate from which the specific element has been removed, wherein the first condition is a condition under which the insulating member in contact with the substrate terminal remains while the specific element is removed from the surface of the substrate, and the second condition is a condition different from the first condition and under which the insulating member is removed.

[0027] By using this element removal device, the above-described method for manufacturing an element array can be carried out efficiently.

[0028] An element array repair device according to one aspect of the present disclosure includes the element removal device described above, an insulating material supplying device that supplies new insulating material to the surface portion of the substrate from which the insulating material has been removed, a transporting device that transports new elements to the surface portion of the substrate to which the new insulating material has been supplied, and an element connecting device that connects element terminals of the new elements to the substrate terminals located on the surface portion of the substrate to which the new insulating material has been supplied.

[0029] By using this element array repair device, the above-described element array manufacturing method can be carried out efficiently.

[0030] FIG. 1A is a schematic diagram showing the schematic configuration of an energy irradiation device used in a method for manufacturing an element array according to an embodiment of the present disclosure. FIG. 1B is a schematic diagram showing a conveying device used in a method for manufacturing an element array according to an embodiment of the present disclosure. FIG. 1C is a schematic diagram showing a flux printing device used in a method for manufacturing an element array according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view of a main portion of an element array parallel to a plane including the X-axis and Z-axis shown in FIG. 1A. FIG. 3 is an enlarged cross-sectional view of a main portion showing a method for removing specific elements from among the elements shown in FIG. 2. FIG. 4 is an enlarged cross-sectional view of a main portion showing a step subsequent to the step shown in FIG. 3. FIG. 5 is an enlarged cross-sectional view of a main portion showing a step subsequent to the step shown in FIG. 4. FIG. 6 is an enlarged cross-sectional view of a main portion showing a step subsequent to the step shown in FIG. 5. FIG. 7 is an enlarged cross-sectional view of a main portion showing a step subsequent to the step shown in FIG. 6.

[0031] The following describes the embodiments.

[0032] 1A and 2 will be described. The element array 33 of this embodiment is used, for example, as a display device, and has a plurality of elements 37 mounted in a matrix along the X-axis and Y-axis on the surface of a substrate 34. In the figures, the X-axis, Y-axis, and Z-axis are perpendicular to each other, and in this embodiment, the plane of the substrate 34 is parallel to the X-axis and Y-axis.

[0033] The element 37 is not particularly limited, but may be, for example, a display element. Note that the display element is not limited to an element for displaying a screen, but may also be an element for providing illumination, and examples thereof include a light-emitting element (micro LED element), a fluorescent element, etc.

[0034] In this embodiment, the elements 37 are, for example, micro light-emitting elements (micro LED elements) with a planar shape of, for example, 5 μm×5 μm to 200 μm×300 μm. The spacing δ (see FIG. 2 ) between the elements 37 and 37 (or 37 a, hereinafter the same unless otherwise specified) is, for example, about 5 to 500 μm.

[0035] Each element 37 is housed inside each cavity 36a (see Figure 2) formed in a matrix in a cavity frame 36 fixed to the surface of the substrate 34, and the element terminal 38b of the element 37 is electrically connected to the substrate terminal 38a formed on the surface of the substrate 34.

[0036] The substrate 34 is not particularly limited and may be a wiring substrate on which wiring connected to the substrate terminals 38a is formed, and may be transparent or translucent and flexible. The cavity frame 36 is preferably made of, for example, plastic, but may also be made of other insulating materials. The size of each cavity 36a formed in the cavity frame 36 is set to a size that allows the element 37 to fit inside. The cavity frame 36 having the cavity 36a can be formed, for example, by photolithography, and may be made of UV resin or the like.

[0037] Although not particularly limited, the substrate terminal 38a may have a connection layer containing Sn or a Sn alloy (for example, an alloy containing Sn with Ag and / or Cu, or a Sn-In alloy) on the surface that contacts the element terminal 38b. Furthermore, the substrate terminal 38a may have an underlayer, for example, on the side closer to the substrate 34, that is made of a metal (including an alloy) different from the connection layer. Examples of the underlayer include a Ni or Ni alloy layer, but it may also be made of other metals. Furthermore, the connection layer may also be made of a metal other than Sn or a Sn alloy.

[0038] The element terminal 38b is not particularly limited, but is made of, for example, Au or an Au alloy.

[0039] Inside each cavity 36a, flux 39 serving as an insulating material is filled between the element 37 and the substrate 34. The flux 39 functions to prevent oxidation of the surface of the substrate terminal 38a before connection with the element terminal 38b, and also functions to protect the element terminal 38b and the substrate terminal 38a after connection. The flux 39 also functions to temporarily secure the element 37 to the substrate 34 inside the cavity 36a before connection between the element terminal 38b and the substrate terminal 38a. The flux 39 is not particularly limited, but examples include a resin-based flux whose main component is a resin such as rosin or modified rosin, an organic flux, and an inorganic flux.

[0040] Next, a repair apparatus 1 for an element array 33 shown in Fig. 1A will be described. The repair apparatus 1 of this embodiment includes an element removal device 2a shown in Fig. 1A, a control device 2b, a transport device 4 shown in Fig. 1B, a flux supply device serving as an insulating material supply device (for example, a flux printing device 5 shown in Fig. 1C), and an element connection device (not shown).

[0041] The flux supply device may be a flux applicator mounted on the transport head 42 of the transport device 4 instead of mounting the stamp tool 44 on the transport head 42. The transport head 42 equipped with the flux applicator is preferably a separate transport head from the transport head that holds the stamp tool 44. The flux applicator is not particularly limited, but may be, for example, a flux transfer device (such as a pin transfer device) or a flux printing device 5 shown in FIG. 1C.

[0042] As shown in FIG. 1C , the flux printing device 5 includes a metal mask 52 having a predetermined pattern of holes 54, a holder (not shown) for holding the metal mask 52, and a squeegee 56. The metal mask 52 has the predetermined pattern of holes 54 formed therein, and the X-axis and Y-axis positions of the metal mask 52 are controlled so that the holes 54 shown in FIG. 1C are aligned with positions corresponding to specific cavities 36 a shown in FIG. 7 . In this state, the squeegee 56 is moved parallel to the metal mask 52 while pressing against the flux 39 from one end of the top of the metal mask 52 toward the other end. As a result, the flux 39 is deposited through the holes 54 into the specific cavities corresponding to the holes 54.

[0043] 1A, the element removal device 2 has a substrate support 3 that holds a substrate 34. The substrate support 3 has a pedestal 32. A substrate 34 of an element array 33 is detachably fixed to the upper surface of the pedestal 32 along the Z axis. In this embodiment, a cavity frame 36 is installed and fixed (it may be molded integrally with the substrate 34) on the upper surface of the substrate 34 of the element array 33, and elements 37 are arranged in cavities 36a of the cavity frame 36. A method for manufacturing the element array 33 will be described later.

[0044] A laser irradiation device 2a is located above the element array 33 along the Z axis as the element removal device 2. The laser irradiation device 2a is disposed so as to be movable relative to the pedestal 32 along the X axis and Y axis. If necessary, the laser irradiation device 2a may be disposed so as to be movable relative to the pedestal 32 along the Z axis. Specific examples of the laser irradiation device 2a include a YAG laser, a carbon dioxide laser, an excimer laser, and a UV laser. Considering the laser wavelength and the energy required for removal, a YAG laser is preferred.

[0045] The control device 2b has at least a first control unit 2b1 and a second control unit 2b2 for controlling the laser output from the laser emission unit 22 of the laser irradiation device 2a and the number of shots. The control device 2b can control a movement mechanism that moves the laser irradiation device 2a relative to the base 32, as well as a movement mechanism that moves the transport head 42 of the transport device 4 shown in FIG. 1B relative to the base 32. The control device 2b may be provided in the laser irradiation device 2a, or may be located in a position separate from the laser irradiation device 2a, and may be configured to communicate with the laser irradiation device 2a via wire or wirelessly. Furthermore, the laser irradiation device 2a itself may have a laser irradiation condition setting function equivalent to that of the control device 2b, in which case the control device 2b may be omitted.

[0046] The first control unit 2b1 controls the laser irradiation device 2a to irradiate the laser light Lt under first conditions onto a specific element 37a to be removed, among a plurality of elements 37, 37a each having element terminals 38b connected to a plurality of board terminals 38a provided on the surface of the board 34 shown in Fig. 2. The laser light Lt emitted from the laser emission unit 22 of the laser irradiation device 2a is irradiated only onto the specific element 37a, as shown in Fig. 3.

[0047] Preferably, the first controller 2b1 controls the laser beam Lt so that the specific element 37a is irradiated with the laser beam Lt in a first irradiation range (including a spot diameter or a laser scanning range) that is smaller than the entire area of ​​the planar shape of the specific element 37a. Irradiation of the first energy beam in such an irradiation range reduces the risk of deteriorating the substrate 34 and its accessories (such as the cavity frame 36) located around the specific element 37a. Note that the laser irradiation device 2a may have an irradiation mask for directly irradiating only the surface of the specific element 37a with the laser beam Lt in an irradiation range having a rectangular spot shape that matches the planar shape of the specific element 37a.

[0048] The laser irradiation device 2a may also include an imaging device. Alternatively, the device 2 may include an imaging device as a separate device. The imaging device is capable of imaging the elements 37 or 37a of the element array 33. The imaging device may perform a visual inspection of each element 37, 37a, and may control the relative movement of the laser irradiation device 2a or the base 32 so that only specific elements 37a determined to be defective in the visual inspection are irradiated with laser light Lt. The imaging device may be installed in the same drive system as the laser irradiation device 2a to reduce the device configuration. Furthermore, the imaging device may be used not only to determine whether an element 37 is defective but also to determine the presence or absence of the element 37 and its position. Even when used for this purpose, the imaging device may be supported and driven by a support mechanism or drive mechanism separate from the laser irradiation device 2a. The image captured by the imaging device may be processed by the control device 2b shown in FIG. 1A or another control device.

[0049] Further, the second control unit 2b2 controls the laser irradiation device 2a under a second condition different from the first condition so as to irradiate the flux 39 as an insulating member present on the surface of the substrate 34 corresponding to the position where the specific element 37a has been removed with the laser light Lt as the second energy ray, as shown in Fig. 4. Here, the conditions to be controlled include the output of the laser light, the irradiation range (including the spot diameter or the laser scanning range), etc.

[0050] 1A may be configured as dedicated circuits in the control device 2b, or may be configured as programs executed by a computer, etc. Other control units in the control device 2b may also be configured as dedicated circuits, or may be configured as programs executed by a computer, etc.

[0051] 1B has a transport head 42, and a stamp tool 44 is detachably attached to the lower end of the transport head 42. The stamp tool 44 of this embodiment is provided with a stamp convex portion 46, and a new element 37b is detachably attached to the stamp convex portion 46. The new element 37b is an element similar to the element 37, and is an element that is newly attached to the portion from which the specific element 37a has been removed, and is transported to a predetermined position by the transport device 4. A plurality of stamp convex portions may be provided.

[0052] The material of the stamp convex portions 46 is not particularly limited, but examples include viscoelastic elastomers such as polydimethylsiloxane (PDMS), organic silicon compounds, and polyether rubber. The stamp convex portions 46 are formed on the surface (lower surface) of the stamp layer, and the stamp layer may also be made of the same material as the convex portions 46. However, it is preferable that the surface of the stamp layer other than the convex portions 46 does not have adhesive properties. It is preferable that elements are not picked up by adhesive force other than the convex portions 46.

[0053] Next, a method for manufacturing the element array 33, in particular, a method for manufacturing a light-emitting element (micro LED element) array will be described.

[0054] First, an element array (e.g., an arrangement of elements 37 of a single light-emitting color), in which elements 37 of a specific light-emitting color, such as LED elements, are arranged in a matrix, is fabricated on the surface of an element-forming substrate. The element-forming substrate may be a sapphire substrate, a glass substrate, a GaAs substrate, a SiC substrate, or the like, although this may vary depending on the type of elements 37 (e.g., blue light-emitting elements, red light-emitting elements, green light-emitting elements, etc.).

[0055] After forming an array of elements 37 on the surface of the element formation substrate, only the elements 37 are peeled off from the substrate on which the elements 37 are formed by a method such as a laser lift-off method and transferred into cavities 36a of cavity frame 36 of substrate 34 (for mounting) shown in Fig. 1A. These operations are repeated for elements 37 emitting different RGB light colors to produce element array 33 having RGB elements 37.

[0056] 2, each cavity 36a of the cavity frame 36 provided on the substrate 34 is filled in advance with flux 39 using an application nozzle or the like, and the periphery of the substrate terminal 38a of the substrate 34 is filled with flux 39. The connection between the element terminal 38b of the element 37 (37a) and the substrate terminal 38a is not particularly limited, but in this embodiment, they are joined by metal bonding using a bonding device (not shown).

[0057] Once the element array 33 is formed in this manner, the method for manufacturing an element array of this embodiment then performs an appearance inspection or an emission inspection on each of the elements 37 (37a) arranged in the array shown in Figure 1A, for example, to identify specific elements 37a that need to be removed for some reason, such as due to poor appearance or poor emission. Furthermore, the method for manufacturing an element array of this embodiment then performs a method for removing the specific elements 37a, which will be described below, and then performs a method for repairing the element array 33.

[0058] 1A, the control unit 2b controls the relative movement of either or both of the pedestal 32 and the laser irradiation device 2a along the X-axis and Y-axis so that the laser light Lt from the laser irradiation device 2a is irradiated only onto the specific element 37a within a predetermined irradiation range. Furthermore, the control unit 2b controls the relative distance between the pedestal 32 and the laser irradiation device 2a along the Z-axis, as necessary. These controls are performed by the control unit 2b controlling the movement mechanisms of either or both of the pedestal 32 and the laser irradiation device 2a.

[0059] Next, the laser beam Lt is irradiated from the laser emission unit 22 of the laser irradiation device 2a onto the specific element 37a, and the first control unit 2b1 of the control device 2b controls the laser irradiation device 2a so that only the specific element 37a is removed. That is, the first control unit 2b1 of the control device 2b controls the laser beam Lt to a first condition. As shown in FIGS. 3 and 4 , the first condition is a condition under which the specific element 37a is removed together with the element terminal 38b from the surface of the substrate 34 by irradiating a first irradiation range of the specific element 37a with the laser beam Lt as a first energy ray. The first condition is also a condition under which the flux 39, at least a portion of which is in contact with the substrate terminal 38a, remains together with the substrate terminal 38a.

[0060] Specifically, under the first condition, the wavelength of the laser light Lt emitted from the laser emission part 22 is not particularly limited, but is preferably 532 nm or less, and more preferably 266 nm or less. Also, under the first condition, the output of the laser light Lt is preferably an output that can remove the element 37a by sublimation (including ablation) or by flicking it off within three shots, preferably one shot, and although it depends on the size and material of the element 37a, is, for example, 10 to 100 mJ / cm. 2 The fewer the number of shots, the less damage there is to the substrate terminals 38a, and the less likely there is to damage the substrate 34 or the cavity frame 36.

[0061] Furthermore, the irradiation range of the laser beam Lt (including the spot diameter or laser scanning range) is preferably smaller than the size of the element 37a along the X-axis and Y-axis, and the laser beam Lt is preferably not irradiated onto the cavity frame 36. By irradiating the laser beam Lt in this manner, as shown in FIG. 4, it is possible to remove only the specific element 37a from the substrate 34 and leave the flux 39, at least a portion of which is in contact with the substrate terminal 38a, together with the substrate terminal 38a.

[0062] As shown in Fig. 4, after only the specific element 37a is removed from the substrate 34, the second control unit 2b2 of the control device 2b shown in Fig. 1A controls the laser light Lt from the laser emission unit 22 of the laser irradiation device 2a under a second condition different from the first condition. The second condition, as shown in Figs. 4 and 5, is a condition in which the flux 39 is removed from the specific cavity 36a by irradiating the flux present on the surface of the substrate 34 corresponding to the position where the specific element 37a has been removed with the laser light Lt as a second energy beam. Note that the specific cavity 36a is the cavity 36a from which the specific element 37a has been removed.

[0063] Specifically, under the second condition, the wavelength of the laser light Lt emitted from the laser emission part 22 is not particularly limited, but is preferably 532 nm or less, and more preferably 266 nm or less. The wavelength of the laser light Lt under the second condition may be the same as or different from the wavelength of the laser light Lt under the first condition. Furthermore, under the second condition, the output of the laser light Lt is preferably smaller than the output of the laser light Lt under the first condition. Preferably, the output of the laser light Lt under the second condition may be ½ or less, more preferably ⅓ or less, ¼ or less, ⅕ or less, or 1 / 10 or less of the output of the laser light Lt under the first condition.

[0064] The number of shots of the laser light Lt under the second condition is preferably greater than the number of shots of the laser light Lt under the second condition, and may be preferably 4 or more, 5 or more, or 10 or more. The number of shots of the laser light Lt under the second condition is preferably a number that removes most of the flux 39 from the specific cavity 36a, as shown in Fig. 5. Note that it is not necessary to completely remove the flux 39 from the specific cavity 36a, and it is preferable that at least the flux in contact with the board terminals 38a be removed.

[0065] The flux 39 present in the specific cavity 36 a is sublimated and removed by irradiation with the laser beam Lt under the second condition. Also, due to the heat generated during irradiation with the laser beam Lt under the second condition, the surface of the substrate terminal 38 a (for example, the surface of the Sn layer) becomes flat or rounded in a convex shape, eliminating the irregularities (see FIG. 4 ) caused by the connection marks with the element terminal 38 b shown in FIG. 3 , as shown in FIG. 5 .

[0066] Note that the irradiation range of the laser light Lt under the second condition is preferably a range within the specific cavity 36a where the flux 39 shown in Fig. 4 is irradiated with the laser light Lt but the cavity frame 36 is not irradiated with the laser light Lt. Note that the laser light Lt may also be irradiated onto the surface of the board terminal 38a.

[0067] 1C, new flux 39 is injected into the specific cavity 36a as shown in FIG. 6. The new flux 39 is preferably made of the same material as the removed flux 39 before it was degraded by heat such as laser light irradiation, but it does not necessarily have to be the same flux. The new flux 39 removes oxide films and other materials formed on the surfaces of the substrate terminals 38a, facilitating bonding to the element terminals 38b.

[0068] Next, using the stamp tool 44 of the conveying device 4 shown in FIG. 1B, a new element 37b is conveyed to a position corresponding to a specific cavity 36a, as shown in FIG. 7, and the element 37b is mounted inside the cavity 36a so that the element terminals 38b of the new element 37b contact the substrate terminals 38a.

[0069] The element terminals 38b of the elements 37b may be connected to the substrate terminals 38a by an element connecting device (not shown) or by the conveying device 4. In either case, the elements 37b are pressed against the substrate 34 with a predetermined pressure to form at least a partial metal bond between the element terminals 38b and the substrate terminals 38a. At this time, the element terminals 38b may be pressed into the surfaces of the substrate terminals 38a while applying heat (e.g., 40°C or higher) to the substrate terminals 38a. In this manner, the element array 33 is manufactured.

[0070] As described above, in the manufacturing method of the element array 33 of this embodiment (the same applies to the element removal method and the element array repair method), first, as shown in Fig. 3, laser light Lt is irradiated under a first condition onto the specific element 37a to be removed, and the specific element 37a is removed from the surface of the substrate 34 as shown in Fig. 4. The first condition is an energy irradiation condition that removes only the specific element 37a, and allows the flux 39, at least a portion of which is in contact with the substrate terminal 38a that has been disconnected from the element terminal 38b, to remain together with the substrate terminal 38a. Therefore, there is little risk of damaging the substrate 34 itself or the cavity frame 36 provided on the substrate 34.

[0071] Furthermore, in the method of the present embodiment, by irradiating the flux 39 present on the surface of the substrate 34 belonging to a predetermined position from which the specific element 37a has been removed with laser light under second conditions different from the first conditions, it is possible to remove the flux 39 belonging to that predetermined position. Therefore, the flux deteriorated by heat or the like during irradiation with the laser light Lt under the first conditions can be removed by irradiating with the laser light Lt under the second conditions.

[0072] If the deteriorated flux 39 is left on or near the board terminals 38a, there is a risk that a good connection between the element terminals 38b of the new element 37b and the board element 38a may not be achieved when a new element 37b is reinstalled. However, by removing the deteriorated flux 39, new flux 39 can be reinstalled. Therefore, even if a new element 37b is not installed, the durability of the element array (e.g., a display) can be improved. Furthermore, by connecting the element terminals 38b of the new element 37b to the board terminals 38a of the board 34 after reinstalling the new flux mass 39, a good connection state can be maintained, and in this case, the durability of the element array (e.g., a display) 33 can also be improved.

[0073] In this embodiment, each of the elements 37 (including 37a and 37b) is disposed in a respective cavity 36a of a cavity frame 36 provided on the surface of the substrate 34, and flux 39 is disposed around the element terminals 38b and substrate terminals 38a within the cavity 36a. This configuration facilitates the regular arrangement of the elements 37 (including 37a and 37b) and the removal of a specific element 37a.

[0074] In this embodiment, a display device (including a lighting device) having an element array may be formed without replacing a non-defective new element 37b in the position where the specific element 37a was removed. For example, if the size of the elements 37 is small, even if one specific element 37a among two or more arrayed elements 37 is missing, there may be no problem as a whole with the display device (including a lighting device) having the element array.

[0075] Furthermore, with the element removal device 2 of this embodiment, even if the elements 37 arranged in a predetermined array are small, such as 5 μm x 5 μm or less, it is easy to remove only the specific elements 37 a, and an element array from which the specific elements 37 a have been removed can be easily manufactured.

[0076] The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.

[0077] For example, in the above-described embodiment, the cavity frame 36 is provided on the surface of the substrate 34, but the element array 33 does not necessarily need to have the cavity frame 36.

[0078] The specific element 37a to be removed may be an element that is defective, has a misaligned connection position, or is unnecessary in terms of the layout.

[0079] Furthermore, in the above-described embodiment, the method of connecting the substrate terminals 38 a and the element terminals 38 b is not particularly limited, but the method of the above-described embodiment is particularly effective when the substrate terminals 38 a and the element terminals 38 b are directly connected by metal bonding, etc. Other examples of connection methods include connection using an ACF (conductive adhesive), solder bonding, BGA, bonding using a conductive paste, and bonding using a curable insulating resin.

[0080] Furthermore, in the above-described embodiment, the laser irradiation device 2a is used as the energy beam irradiation device, but the energy beam irradiation device is not limited to the laser irradiation device 2a.

[0081] In addition to the flux 39, examples of insulating materials used in the element array 33 include an underfill material, a potting material, and a filler.

[0082] The element 37 is not limited to a display element, but may be any of various electronic component elements such as a ceramic capacitor, a chip inductor, a piezoelectric element, a magnetostrictive element, a chip resistor, a tantalum electrolytic capacitor, an IC, or a semiconductor element.

[0083] Furthermore, the transport device may be a transport device that has a suction transport unit other than a transport device that uses the stamp tool 44.

[0084] DESCRIPTION OF SYMBOLS 1...Element array repair device 2...Element removal device 2a...Laser irradiation device (energy irradiation device) 2b...Control device 2b1...First control unit 2b2...Second control unit 22...Laser emission unit 3...Substrate support unit 32...Pedestal unit 33...Element array 34...Substrate 36...Cavity frame 36a...Cavity 37...Element 37a...Specific element 37b...New element 38a...Substrate terminal 38b...Element terminal 39...Flux (insulating member) 4...Transport device 42...Transport head 44...Stamp tool 46...Stamp convex portion 5...Flux printing device 52...Metal mask 54...Hole 56...Squeegee

Claims

1. A method for manufacturing an element array having a plurality of elements electrically connected via element terminals to substrate terminals provided on a substrate, the method comprising: a step of irradiating specific elements to be removed with a first energy beam under a first condition; and a step of irradiating the area from which the specific elements have been removed with a second energy beam under a second condition, wherein the first condition is a condition under which the specific elements are removed from the surface of the substrate while leaving an insulating material in contact with the substrate terminal, and the second condition is different from the first condition and is a condition under which the insulating material is removed.

2. A method for manufacturing an element array according to claim 1, wherein the output of the first energy beam is higher than the output of the second energy beam.

3. The method for manufacturing an element array according to claim 1, wherein the number of shots of the second energy beam is greater than the number of shots of the first energy beam.

4. A method for manufacturing an element array according to claim 1, wherein the first energy beam is irradiated onto the specific element in a first irradiation range that is smaller than the planar area of ​​the specific element.

5. A method for manufacturing an element array as described in claim 1, wherein the second energy rays are irradiated onto the specific element in a second irradiation range that can remove the insulating material located around the substrate terminal on the surface of the substrate corresponding to the position where the specific element was removed.

6. A method for manufacturing an element array according to any one of claims 1 to 5, wherein each of the elements is disposed within a respective cavity of a cavity frame provided on the surface of the substrate, and the insulating member is interposed around the element terminals and substrate terminals within the cavity.

7. A method for manufacturing an element array according to any one of claims 1 to 5, further comprising the steps of: supplying new insulating material to the surface portion of the substrate from which the insulating material has been removed; and connecting element terminals of new elements to the substrate terminals located on the surface portion of the substrate from which the new insulating material has been supplied.

8. A method for removing an element, comprising: a step of irradiating a specific element to be removed with a first energy ray under a first condition; and a step of irradiating a portion from which the specific element has been removed with a second energy ray under a second condition, wherein the first condition is a condition under which the specific element is removed from the surface of the substrate while an insulating material in contact with the substrate terminal remains; and the second condition is a condition different from the first condition and under which the insulating material is removed.

9. A method for repairing an element array, comprising the steps of: after removing the specific element and the insulating material by the element removal method described in claim 8, supplying new insulating material to the surface portion of the substrate from which the insulating material has been removed; transporting new elements to the surface portion of the substrate to which the new insulating material has been supplied; and connecting element terminals of the new elements to the substrate terminals located on the surface portion of the substrate to which the new insulating material has been supplied.

10. An element removal device comprising: a substrate support part for holding a substrate; an energy irradiation device for irradiating energy rays; a first control part for controlling the energy irradiation device so that the energy rays are irradiated to a specific element to be removed among a plurality of elements having element terminals connected to substrate terminals provided on the surface of the substrate under a first condition; and a second control part for controlling the energy rays irradiated from the energy irradiation device under a second condition to the insulating material present on the surface of the substrate from which the specific element has been removed, wherein the first condition is a condition under which the insulating material in contact with the substrate terminal remains while the specific element is removed from the surface of the substrate, and the second condition is a condition different from the first condition and under which the insulating material is removed.

11. A device for repairing an element array, comprising: an element removal device according to claim 10; an insulating material supplying device that supplies new insulating material to the surface portion of the substrate from which the insulating material has been removed; a transporting device that transports new elements to the surface portion of the substrate to which the new insulating material has been supplied; and an element connecting device that connects element terminals of the new elements to the substrate terminals located on the surface portion of the substrate to which the new insulating material has been supplied.

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