Cosmetic for nails and cosmetic film for nails

Abstract

A cosmetic for nails which contains infrared ray-absorbing particles and a film-forming agent.

Description

Nail cosmetics, nail cosmetic films

[0001] The present invention relates to a nail cosmetic and a nail cosmetic film.

[0002] Nail cosmetics can form a nail cosmetic film by being applied to nails. Nail cosmetics are used for the purposes of protecting nails and imparting color or the like to nails to make them look beautiful, by the nail cosmetic film formed by application to nails.

[0003] Nail cosmetics often have a composition comprising a mixture of a film-forming resin such as nitrocellulose or acrylic, a solvent, a pigment component such as an organic pigment, etc. For example, Patent Document 1 discloses a nail cosmetic containing a pearlescent agent such as titanium mica.

[0004] Japanese Patent Application Publication No. 2009-179573

[0005] Conventionally known nail cosmetics are used to protect nails and achieve a beautiful appearance. For nail cosmetics, protecting nails and achieving a beautiful appearance are important issues. However, there is also a demand for nail cosmetics with functions different from those of conventional cosmetics.

[0006] Therefore, one object of the present invention is to provide a nail cosmetic having a new function.

[0007] In one aspect of the present invention, there is provided a nail cosmetic comprising infrared absorbing particles and a film-forming agent.

[0008] According to one aspect of the present invention, a nail cosmetic having a new function can be provided.

[0009] Fig. 1 is a schematic diagram of a nail cosmetic, and Fig. 2 is a schematic diagram of a nail cosmetic film.

[0010] Specific examples of nail cosmetics and nail cosmetic films according to one embodiment of the present disclosure (hereinafter referred to as "the present embodiment") will be described below with reference to the drawings. The present invention is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims. [Nail Cosmetic] The inventors of the present invention conducted research into nail cosmetics with new functions. They discovered that nail cosmetics containing infrared-absorbing particles can generate heat when exposed to sunlight, thereby relieving cold fingertips in winter and other seasons without the need to wear gloves or other cold protection gear, and thus completed the present invention.

[0011] The nail cosmetic according to this embodiment contains infrared absorbing particles and a film-forming agent.

[0012] 1 , a nail cosmetic 10 of this embodiment may contain infrared absorbing particles 11 and a film-forming agent 12. The infrared absorbing particles 11 may be dispersed in the film-forming agent 12.

[0013] 1 is a schematic diagram, and the nail cosmetic of this embodiment is not limited to this form. For example, in FIG. 1, the infrared absorbing particles 11 are represented by circles and are depicted as spherical particles, but the shape of the infrared absorbing particles 11 is not limited to this form and can have any shape. The nail cosmetic 10 can also contain other components as needed in addition to the infrared absorbing particles 11 and the film-forming agent 12.

[0014] The components contained in the nail cosmetic of this embodiment will be described. (1) Infrared absorbing particles The nail cosmetic of this embodiment contains infrared absorbing particles. The infrared absorbing particles may be any material that can absorb infrared rays in sunlight and convert them into heat. Examples of the infrared absorbing particles include those represented by the general formula W ａ O ｂ Tungsten oxide represented by the general formula XB ｍ boride compounds represented by the general formula M ｘ W ｙ O ｚ(1-1) Infrared absorbing particles (Tungsten oxide) Tungsten oxide is a composite tungsten oxide represented by the general formula W ａ O ｂ It is expressed as:

[0015] In the above general formula, the ratio b / a of the amount of oxygen to the amount of tungsten is preferably less than 3, and more preferably 2.2≦b / a≦2.999. If the value of b / a is 2.2 or more, the amount of undesired WO in the tungsten oxide is small. ２ This can prevent the appearance of the crystalline phase and can also improve the chemical stability of the material.

[0016] Furthermore, if b / a is less than 3, the required number of free electrons are generated in the tungsten oxide, making it an efficient infrared absorbing material.

[0017] Examples of tungsten oxide include W １８ O ４９ , W ２０ O ５８ , W ４ O １１ In the above general formula, the composition ratio of oxygen to tungsten, b / a, may be, for example, 2.45 or more and 2.999 or less, that is, 2.45≦b / a≦2.999. If the value of x is 2.45 or more, the undesired WO ２ This completely avoids the appearance of the crystalline phase, and increases the chemical stability of the material. Furthermore, if the value of x is 2.999 or less, a sufficient number of free electrons are generated, resulting in an efficient infrared absorbing material.

[0018] When the ratio b / a is in the range of 2.45≦b / a≦2.95, the tungsten oxide is included in the compound called the Magneli phase. (Boride-based Compound) The boride-based compound is represented by the general formula XB ｍ It is expressed as:

[0019] In the above general formula, X is one or more metal elements selected from Y (yttrium), La (lanthanum), Ce (cerium), Pr (praseodymium), Nd (neodymium), Sm (samarium), Eu (europium), Gd (gadolinium), Tb (terbium), Dy (dysprosium), Ho (holmium), Er (erbium), Tm (thulium), Yb (ytterbium), Lu (lutetium), Sr (strontium), and Ca (calcium). Also, B is boron, and m is a number indicating the amount of boron in the general formula.

[0020] General formula XB ｍ In the formula (I), the value of m indicating the molar ratio of B (boron) to the element X is not particularly limited, but is preferably 3≦m≦20, more preferably 4.0≦m≦6.2, and even more preferably 5.8≦m≦6.2.

[0021] General formula XB ｍ The value of m in the formula (1) can be, for example, the atomic ratio of boron (B) to element X (1 atom) when a powder containing a boride-based compound is chemically analyzed by ICP atomic emission spectroscopy (inductively coupled plasma atomic emission spectroscopy) or the like.

[0022] Lanthanum hexaboride, which is a hexaboride of lanthanum, has particularly high near-infrared absorption ability. Therefore, it is preferable that the boride-based compound contains lanthanum hexaboride. (Composite tungsten oxide) The composite tungsten oxide is a compound represented by the general formula M ｘ W ｙ O ｚ It is expressed as:

[0023] In the above general formula, the element M is H (hydrogen), He (helium), an alkali metal element, an alkaline earth metal element, a rare earth element, Mg (magnesium), Zr (zirconium), Cr (chromium), Mn (manganese), Fe (iron), Ru (ruthenium), Co (cobalt), Rh (rhodium), Ir (iridium), Ni (nickel), Pd (palladium), Pt (platinum), Cu (copper), Ag (silver), Au (gold), Zn (zinc), Cd (cadmium), Al (aluminum), Ga (gallium), In (indium), The element may be one or more elements selected from the group consisting of Tl (thallium), Si (silicon), Ge (germanium), Sn (tin), Pb (lead), Sb (antimony), B (boron), F (fluorine), P (phosphorus), S (sulfur), Se (selenium), Br (bromine), Te (tellurium), Ti (titanium), Nb (niobium), V (vanadium), Mo (molybdenum), Ta (tantalum), Re (rhenium), Be (beryllium), Hf (hafnium), Os (osmium), Bi (bismuth), and I (iodine). W represents tungsten, O represents oxygen, and x, y, and z preferably satisfy the following conditions: 0.001≦x / y≦1, 2.0≦z / y<4.0.

[0024] Examples of alkali metal elements include Li (lithium), Na (sodium), K (potassium), Rb (rubidium), Cs (cesium), and Fr (francium).

[0025] Examples of alkaline earth metal elements include Ca (calcium), Sr (strontium), Ba (barium), and Ra (radium).

[0026] Examples of rare earth elements include Sc (scandium), Y (yttrium), La (lanthanum), Ce (cerium), Pr (praseodymium), Nd (neodymium), Pm (promethium), Sm (samarium), Eu (europium), Gd (gadolinium), Tb (terbium), Dy (dysprosium), Ho (holmium), Er (erbium), Tm (thulium), Yb (ytterbium), and Lu (lutetium).

[0027] The crystalline structure of the composite tungsten oxide is not particularly limited, and can have one or more crystalline structures selected from, for example, tetragonal, cubic, and hexagonal. In particular, the composite tungsten oxide can have a hexagonal crystalline structure because of its excellent visible light transparency and infrared absorption properties.

[0028] For this reason, it is preferable that element M contains an element that easily causes the composite tungsten oxide to have a hexagonal crystal structure, and for example, it is preferable that element M contains one or more elements selected from Cs, Rb, K, Tl, In, Ba, Li, Ca, Sr, Fe, and Sn. However, the hexagonal crystal structure of the composite tungsten oxide is not limited to when element M is one of the above elements.

[0029] When the infrared absorbing particles contain a composite tungsten oxide, the composite tungsten oxide has a hexagonal crystal structure, and in particular when the element M contains one or more selected from K, Rb, and Cs, the infrared absorption ability in the wavelength range of 780 nm or more is particularly high. Therefore, a nail cosmetic film obtained by using infrared absorbing particles containing a composite tungsten oxide having a hexagonal crystal structure and containing one or more elements M selected from K, Rb, and Cs can be warmed particularly effectively from the fingertips onwards by heat generated by infrared absorption.

[0030] The general formula of composite tungsten oxide is M ｘ W ｙ O ｚ In the formula, x / y preferably satisfies 0.001≦x / y≦1, more preferably 0.20≦x / y≦0.37, and even more preferably about 0.33. This is because the value of x / y theoretically calculated from the hexagonal crystal structure is 0.33, and particularly favorable optical properties can be obtained with an amount added around this range.

[0031] A typical example of a composite tungsten oxide is Cs ０．３３ WO ３ , Rb ０．３３ WO ３ , K. ０．３３ WO ３ , Ba ０．３３ WO ３As long as x, y, and z fall within the above ranges, useful infrared absorption properties can be obtained.

[0032] The infrared absorbing particles may contain a plurality of types of compounds, but may also be composed of only one type of compound, for example, the infrared absorbing particles may be composed of only a composite tungsten oxide.

[0033] Although tungsten oxide, boride-based compounds, and composite tungsten oxide have been described as examples of compounds for the infrared absorbing particles, the infrared absorbing particles may be compounds other than the above. However, the infrared absorbing particles preferably contain composite tungsten oxide, and may be composed of composite tungsten oxide. However, even in this case, the infrared absorbing particles may contain inevitable impurities.

[0034] A dispersion in which infrared-absorbing particles containing composite tungsten oxide are dispersed in a resinous film-forming agent or the like transmits visible light, absorbs infrared light, and is transparent. Therefore, the aesthetic beauty of the pearlescent agent or glitter added to the nail cosmetic is not impaired, and the color development of the pigment or dye color is not hindered. Therefore, by containing composite tungsten oxide in the infrared-absorbing particles of the nail cosmetic of this embodiment, the nail cosmetic of this embodiment is endowed with a heat-generating function, which is a new function not previously available, and can also enhance the aesthetic beauty of the nail cosmetic.

[0035] (1-2) Particle Size of Infrared Absorbing Particles The particle size of the infrared absorbing particles is preferably 200 nm or less from the viewpoint of enhancing near-infrared absorbing properties.

[0036] It is preferable that the infrared absorbing particles efficiently absorb infrared rays while maintaining visible light transparency when dispersed in a resinous film-forming agent or the like, as described below. It is preferable that the infrared absorbing particles transmit light in the visible light range (wavelengths of 380 nm to 780 nm) and significantly absorb light in the near-infrared range, particularly light with wavelengths of 780 nm to 2200 nm. Therefore, the transmitted color tone of the infrared absorbing particles may be blue to green. In order to particularly suppress coloration of the infrared absorbing particles and absorb infrared rays while maintaining transparency, it is sufficient to reduce the particle size (number average particle size) of the infrared absorbing particles, preferably 200 nm or less, for example. When greater emphasis is placed on transparency, the particle size of the infrared absorbing particles may be 100 nm or less.

[0037] On the other hand, if the particle size is 1 nm or more, industrial production is easy, so the particle size of the infrared absorbing particles can be, for example, 1 nm or more and 200 nm or less, or may be 1 nm or more and 100 nm or less.

[0038] The number average particle size of the infrared absorbing particles preferably also satisfies the above range.

[0039] The particle size of the infrared absorbing particle can be determined by observing the infrared absorbing particle with, for example, an SEM or TEM and determining the diameter of the smallest encompassing circle drawn around the infrared absorbing particle.

[0040] The infrared rays absorbed by the infrared-absorbing particles are converted into heat. Therefore, the infrared-absorbing particles contained in the nails irradiated with sunlight or the like and in the nail cosmetic film formed by applying the nail cosmetic generate heat, allowing efficient warming from the fingertips onwards. (1-3) Method for Producing Infrared-Absorbing Particles The method for producing infrared-absorbing particles is not particularly limited and can be selected depending on the compound contained in the infrared-absorbing particles.

[0041] Here, an example will be described in which the infrared absorbing particles are composite tungsten oxide particles.

[0042] General formula M ｘ W ｙ O ｚcan be produced by heat treating a mixture containing tungsten and element M. That is, the method for producing the composite tungsten oxide particles can include, for example, the following raw material preparation step and heat treatment step.

[0043] In the raw material preparation step, a mixture containing tungsten and element M can be prepared.

[0044] In the heat treatment step, the mixture obtained in the raw material preparation step can be heat treated.

[0045] Each step will be described below. (Mixture Preparation Step) In the mixture preparation step, a mixture containing tungsten and element M (hereinafter also referred to as "raw material mixture") can be prepared.

[0046] General formula M mentioned above ｘ W ｙ O ｚ The starting material for obtaining the composite tungsten oxide particles represented by the formula (I) can be, for example, a mixture of a tungsten source containing tungsten and an element M source containing element M. Therefore, the mixture preparation step can be a step of mixing the tungsten source and the element M source.

[0047] The tungsten source may be tungsten alone or a compound containing tungsten, and the element M source may be element M alone or a compound containing element M.

[0048] In the mixture preparation step, for example, a tungsten-containing powder serving as a tungsten source and an element M-containing powder serving as an element M source can be mixed to prepare a raw material mixture powder serving as a mixture.

[0049] The tungsten source can be one or more selected from the group consisting of tungsten trioxide powder, tungsten dioxide powder, tungsten oxide hydrate, tungsten hexachloride powder, ammonium tungstate powder, tungsten oxide hydrate powder obtained by dissolving tungsten hexachloride in alcohol and then drying, tungsten oxide hydrate powder obtained by dissolving tungsten hexachloride in alcohol and then adding water to precipitate and then drying the precipitate, tungsten compound powder obtained by drying an aqueous solution of ammonium tungstate, and metallic tungsten powder.

[0050] Here, an example in which a mixed powder is used as the starting material has been described, but the present invention is not limited to this form. For example, a tungsten-containing solution or dispersion can also be used as the tungsten source, which is the starting material for obtaining a composite tungsten oxide. When the tungsten source is a tungsten-containing solution or dispersion, the elements contained in the resulting mixture can be particularly easily mixed uniformly.

[0051] Examples of tungsten-containing solutions or dispersions that serve as tungsten sources include alcohol solutions of tungsten hexachloride, aqueous solutions of ammonium tungstate, and dispersions in which tungsten hexachloride is dissolved in alcohol and then water is added to form a precipitate.

[0052] When a tungsten-containing solution or dispersion is used as the tungsten source, either a powder containing element M or a solution containing element M can be used as the source of element M. For this reason, for example, the above-mentioned tungsten-containing solution or dispersion and the powder containing element M or the solution containing element M can be mixed, and the dried mixed powder can be used as a raw material mixture to be subjected to the heat treatment step.

[0053] Alternatively, a solution containing element M may be used as the starting material source of element M, and a tungsten-containing powder may be used as the tungsten source. In this case, for example, the tungsten-containing powder and the solution containing element M may be mixed, and the dried mixed powder may be used as a raw material mixture to be subjected to the heat treatment step.

[0054] The source of element M is not particularly limited, and examples thereof include one or more types selected from a simple substance of element M, and tungstates, chlorides, nitrates, sulfates, oxalates, oxides, carbonates, hydroxides, etc. of element M. When the source of element M is made into a solution as described above, an element M source that becomes a solution when a solvent such as water is added can be used.

[0055] When producing composite tungsten oxide particles industrially, it is preferable to use raw materials that are less likely to generate toxic gases, etc. For this reason, for example, it is preferable to use a tungsten oxide hydrate powder or tungsten trioxide powder as the tungsten source and a carbonate or hydroxide of element M as the element M source, since no toxic gases, etc. are generated during the heat treatment stage, etc.

[0056] The molar ratio x / y, which represents the molar ratio of the amount of substance x of element M to the amount of substance y of tungsten contained in the mixture of the tungsten source and the element M source, preferably has a value corresponding to the composition ratio of the target composite tungsten oxide. Specifically, as already described in the description of the composition of the composite tungsten oxide, x / y is preferably 0.001≦x / y≦1.0, and more preferably 0.20≦x / y≦0.37. (Heat Treatment Step) In the heat treatment step, the raw material mixture prepared in the mixture preparation step can be heat-treated.

[0057] The atmosphere during the heat treatment in the heat treatment step is not particularly limited, but the heat treatment can be carried out in, for example, a reducing gas atmosphere, a mixed gas atmosphere of a reducing gas and an inert gas, or an inert gas atmosphere.

[0058] Here, the heat treatment conditions in the heat treatment step are not particularly limited, but can be selected depending on, for example, the atmosphere in the heat treatment.

[0059] When the raw material mixture used in the heat treatment step is heat-treated in a reducing gas atmosphere or a mixed gas atmosphere of a reducing gas and an inert gas, the heat treatment temperature is preferably higher than the temperature at which the composite tungsten oxide contained in the composite tungsten oxide particles crystallizes.

[0060] When the raw material mixture used in the heat treatment step is heat-treated in a reducing gas atmosphere or a mixed gas atmosphere of a reducing gas and an inert gas, the heat treatment temperature is preferably 500°C or higher and 1000°C or lower, and more preferably 500°C or higher and 800°C or lower.

[0061] After the heat treatment in the reducing gas atmosphere or the mixed gas atmosphere of the reducing gas and the inert gas, if desired, the heat treatment may be further carried out in the inert gas atmosphere at a temperature of 500° C. or more and 1200° C. or less.

[0062] When a reducing gas is used as described above, the reducing gas is not particularly limited, but may be H ２ In addition, when a mixed gas of a reducing gas and an inert gas is used, the types of the reducing gas and the inert gas are not particularly limited. For example, H ２ As an inert gas, Ar (argon) or N ２ (nitrogen), and the like can be used.

[0063] When a mixed gas of a reducing gas and an inert gas is used, the concentration of the reducing gas may be appropriately selected depending on the firing temperature, the amount of the mixture as the starting material, the type of reducing gas, and the like, and is not particularly limited.

[0064] For example, in a mixed gas of a reducing gas and an inert gas, H ２ When using H 2 O 3 , the concentration is preferably 0.1% by volume or more, more preferably 2% by volume or more, for example. ２ By setting the gas concentration to 0.1% by volume or more, reduction can be carried out efficiently, and the ratio of oxygen to tungsten in the resulting composite tungsten oxide can be easily adjusted to fall within a desired range.

[0065] In addition, in the mixed gas of reducing gas and inert gas, H ２ When using H ２The concentration is preferably 20% by volume or less, more preferably 10% by volume or less, and even more preferably 7% by volume or less. When the concentration of the reducing gas is 20% by volume or less, WO 2 which does not have infrared absorption ability due to rapid reduction can be obtained. ２ This is because the generation of

[0066] When the raw material mixture used in the heat treatment step is heat-treated in an inert gas atmosphere, the heat treatment temperature is preferably 650° C. or higher and 1000° C. or lower. A mixture heat-treated at 650° C. or higher and 1000° C. or lower has sufficient infrared absorption ability and is efficient as infrared absorbing particles.

[0067] The inert gas may be, for example, Ar or N ２ It is preferable to use one or more inert gases selected from the above.

[0068] It is preferable to adjust the heat treatment temperature, heat treatment time, etc., as described above so that z / y, which indicates the substance amount ratio (molar ratio) of tungsten to oxygen in the composite tungsten oxide contained in the obtained composite tungsten oxide particles, satisfies the above-mentioned relationship: 2.0≦z / y<4.0.

[0069] Up to this point, an example of a solid-phase reaction method has been shown in which composite tungsten oxide particles are prepared by heat-treating the raw material mixture prepared in the mixture preparation step in the heat treatment step, but the method for producing composite tungsten-containing particles is not limited to this method. Composite tungsten oxide particles can also be produced, for example, by a thermal plasma method. When producing composite tungsten oxide particles using a thermal plasma method, composite tungsten oxide particles with a desired composition can be obtained by adjusting the production conditions. Examples of production conditions that can be adjusted include the feed rate when feeding raw materials into the thermal plasma, the flow rate of the carrier gas used to feed raw materials, the flow rate of the plasma gas that maintains the plasma region, and the flow rate of the sheath gas that flows just outside the plasma region.

[0070] The method for producing composite tungsten oxide particles is not limited to the above-mentioned mixture preparation step and heat treatment step, but may include any other steps.

[0071] The method for producing composite tungsten oxide particles can also include, for example, a heat treatment step followed by a pulverization step in which the obtained composite tungsten oxide particles are pulverized to a predetermined particle size by a pulverization process or the like. The pulverization means used in the pulverization step is not particularly limited, and pulverization can be performed by dry pulverization means using, for example, a jet mill.

[0072] The method for producing composite tungsten oxide particles may also include a heat treatment step and a coating step of coating the surfaces of the composite tungsten oxide particles obtained in the pulverization step with an oxide containing one or more metals selected from Si, Ti, Zr, and Al.

[0073] By carrying out a coating step and coating the surfaces of the composite tungsten oxide particles, weather resistance can be improved, which is preferable. The coating method is not particularly limited, but an example is a method in which an alkoxide of one or more metals selected from Si, Ti, Zr, and Al is added to a solution in which the composite tungsten oxide particles are dispersed. (1-4) Content of Infrared-Absorbing Particles The content (amount) of infrared-absorbing particles in the nail cosmetic of this embodiment is not particularly limited, and can be selected depending on the type of infrared-absorbing particles, the required heating characteristics, etc.

[0074] For example, the nail cosmetic of this embodiment may contain infrared-absorbing particles in an amount of 0.05% by mass or more and 10% by mass or less, or 0.1% by mass or more and 5% by mass or less. By ensuring that the content of infrared-absorbing particles in the nail cosmetic is 0.05% by mass or more, the infrared absorption characteristics can be sufficiently enhanced. However, even if the content of infrared-absorbing particles in the nail cosmetic exceeds 10% by mass, no significant change in the heat-generating effect is observed. Therefore, the content of infrared-absorbing particles in the nail cosmetic may be 10% by mass or less. (2) Film-Forming Agent The film-forming agent is a material for forming a film after the nail cosmetic of this embodiment is applied to the nail, and may contain infrared-absorbing particles, etc., therein. In the nail cosmetic of this embodiment, the infrared-absorbing particles may be dispersed in the film-forming agent. (2-1) Types of Film-Forming Agents The film-forming agent may be one or more selected from a resinous film-forming agent and a photocurable film-forming agent. Film-forming agents are described below.

[0075] The resinous film-forming agent is a film-forming agent that can be used by dissolving or dispersing it in a solvent such as an organic solvent, and refers to a resinous film-forming agent that becomes a film when dried and the organic solvent or other solvent is removed.

[0076] The photocurable film-forming agent refers to a resinous film-forming agent that is photopolymerized by irradiation with light such as ultraviolet light to form a film. (Resinous Film-Forming Agent) Examples of the resinous film-forming agent include one or more types selected from nitrocellulose, alkyd resin, acrylic resin, sulfonamide resin, sucrose benzoate resin, toluenesulfonamide resin, etc.

[0077] Nitrocellulose is graded according to viscosity, and examples thereof include one or more types selected from nitrocellulose RS 1 / 2 sec, nitrocellulose LIG 1 / 2 sec, nitrocellulose HIG 1 / 2 sec, nitrocellulose SS 1 / 2 sec, nitrocellulose HIG 1 sec, nitrocellulose HIG 2 sec, nitrocellulose HIG 7 sec, nitrocellulose HIG 20 sec, nitrocellulose LIG 1 / 4 sec, nitrocellulose HIG 1 / 4 sec, nitrocellulose LIG 1 / 8 sec, nitrocellulose HIG 1 / 8 sec, and nitrocellulose HIG 1 / 16 sec.

[0078] When a resinous film-forming agent is used as the film-forming agent, the nail cosmetic film of this embodiment can contain a resinous film-forming agent that is a resin and infrared-absorbing particles. (Photo-curable film-forming agent) Examples of the photo-curable film-forming agent include one or more selected from monomers and oligomers having an ethylenically unsaturated bond. The monomer or oligomer having an ethylenically unsaturated bond may have an unsaturated group having an ethylenically unsaturated bond.

[0079] When a photocurable film-forming material is irradiated with ultraviolet light in the presence of a photopolymerization initiator, it undergoes photopolymerization to become a cured resin film-forming agent. Nail cosmetics containing a photocurable film-forming material include gel nails.

[0080] When a photocurable film-forming agent is used as the film-forming agent, the nail cosmetic film produced using the nail cosmetic can contain a cured product of the film-forming agent, which is a resin, and infrared absorbing particles.

[0081] Examples of the unsaturated group having an ethylenically unsaturated bond (ethylenically unsaturated group) include functional groups having one or more unsaturated bonds selected from the group consisting of a (meth)acrylate group, a (meth)acrylamide group, a vinyl group, a vinyl ether group, a methyl vinyl ether group, an allyl group, a (meth)allyl ether group, and a maleimide group. Examples of monomers having an ethylenically unsaturated group include (meth)acrylic acid, alkyl (meth)acrylates having a linear, branched or cyclic alkyl group having 1 to 22 carbon atoms introduced therein, hydroxyalkyl (meth)acrylates having a linear, branched or cyclic hydroxyalkyl group having 1 to 18 carbon atoms introduced therein, (meth)acrylic acid alkyl carboxylic acids such as ethyl (meth)acrylate carboxylic acid, ethyl (meth)acrylate succinic acid, ethyl (meth)acrylate phthalic acid, and ethyl (meth)acrylate hexahydrophthalic acid, which are composed of (meth)acrylic acid and hydroxyalkyl carboxylic acids, (meth)acrylic acid alkyl sulfonic acids having a linear, branched or cyclic alkyl sulfonic acid group having 1 to 18 carbon atoms introduced therein, (meth)acrylic acid alkyl phosphates having a linear, branched or cyclic alkyl phosphate group having 1 to 18 carbon atoms introduced therein, and alkoxyalkylene glycol (meth)acrylates having a functional group consisting of an alkyl group having 1 to 18 carbon atoms and an alkylene glycol group having 1 to 4 carbon atoms introduced therein. acrylates, alkoxydialkylene glycol (meth)acrylates, alkoxytrialkylene glycol (meth)acrylates, alkoxypolyalkylene glycol (meth)acrylates; phenoxyalkylene glycol (meth)acrylates, phenoxydialkylene glycol (meth)acrylates, phenoxytrialkylene glycol (meth)acrylates, phenoxypolyalkylene glycol (meth)acrylates into which a functional group consisting of a phenoxy group and an alkylene glycol group having 1 to 4 carbon atoms has been introduced; N-alkylamino(meth)acrylates into which an aminoalkyl group having 1 to 6 carbon atoms has been introduced; N-alkylaminoalkyl(meth)acrylates into which an N-alkylaminoalkyl group consisting of an aminoalkyl group having 1 to 6 carbon atoms and an alkyl group having 1 to 6 carbon atoms has been introduced; N,N-dialkylaminoalkyl(meth)acrylates into which an aminoalkyl group having 1 to 6 carbon atoms and an alkyl group having 1 to 6 carbon atoms has been introduced;Examples of the acrylate include N-dialkylaminoalkyl (meth)acrylates, (meth)acrylates having a cyclic structure introduced therein, such as benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, bornyl (meth)acrylate, isobornyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, and 2-methyl-2-adamantyl (meth)acrylate, and (meth)acrylates having an epoxy group introduced therein, such as glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether.

[0082] Furthermore, the use of a monomer or oligomer containing two or more ethylenically unsaturated bonds in the molecule makes it easier to adjust the viscosity of the prepared nail cosmetic. This improves both the application properties and adhesion of the nail cosmetic to the nail surface. Furthermore, the nail cosmetic film, which is a photocured coating such as a gel nail film obtained from the nail cosmetic, has excellent flexibility, is less prone to cracking, and is sufficiently durable.

[0083] Monomers and oligomers having two or more ethylenically unsaturated bonds in the molecule include (di)ethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, (tri)propylene glycol di(meth)acrylate, ditetraethylene glycol di(meth)acrylate, polyalkylene (having 1 to 4 carbon atoms) glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, 1,3 (or 1,4)-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, cyclohexanedimethanol di(meth)acrylate, acrylate ester (dioxane glycol diacrylate), alkoxylated (cyclo)hexanediol di(meth)acrylate, epoxy di(meth)acrylate, dicyclopentanyl di(meth)acrylate, caprolactone-modified dicyclopentenyl di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, polyester di(meth)acrylate, ethylene oxide-modified bisphenol A di(meth)acrylate, propylene oxide-modified bisphenol A di(meth)acrylate, polyurethane di(meth)acrylate, allyl (meth)acrylate, methylene bis(meth)acrylamide, ethylene bis(meth)acrylamide, polyurethane di(meth)acrylamide, allyl (meth)acrylamide, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, trimethylolethane Tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tri(meth)acryloyloxyethoxytrimethylolpropane, glycerin polyglycidyl ether poly(meth)acrylate , isocyanuric acid ethylene oxide modified tri(meth)acrylate, ethylene oxide modified dipentaerythritol penta(meth)acrylate, ethylene oxide modified dipentaerythritol hexa(meth)acrylate, ethylene oxide modified pentaerythritol tri(meth)acrylate, ethylene oxide modified pentaerythritol tetra(meth)acrylate, succinic acid modified pentaerythritol tri(meth)acrylate, etc. These polyfunctional unsaturated compounds may be used alone or in combination of two or more.

[0084] The term "(meth)acrylate" is meant to include both the terms "acrylate" and "methacrylate."

[0085] The term "(meth)acrylic" is meant to include both the terms "acrylic" and "methacrylic."

[0086] The term "(meth)acryloyl" is meant to include both the terms "acryloyl" and "methacryloyl."

[0087] The word "(ji)" means that both the words "ji" and "mono" are included, and the word "(tori)" means that both the words "tori" and "mono" are included.

[0088] These monomers and oligomers having an ethylenically unsaturated bond in the molecule have fluidity unless they are photopolymerized, and provide fluidity to the nail cosmetic. Therefore, when a photocurable film-forming agent, such as a monomer or oligomer having an ethylenically unsaturated bond in the molecule, is used as the film-forming agent, the film-forming agent does not need to contain a separate component for adjusting fluidity, such as an organic solvent.

[0089] When a photocurable film-forming agent is used as the film-forming agent, the nail cosmetic may also contain a photopolymerization initiator in addition to the film-forming agent and infrared absorbing particles.

[0090] The photopolymerization initiator may be appropriately selected from common photopolymerization initiators such as acetophenone-based, benzoin-based, benzophenone-based, α-aminoketone-based, xanthone-based, anthraquinone-based, acylphosphine oxide-based, and polymeric photopolymerization initiator-based. Examples of acylphosphine oxides include 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide. (2-2) Amount of Film-Forming Agent The nail cosmetic of this embodiment may contain one type of film-forming agent or may contain two or more types of film-forming agents.

[0091] The blending amount (content) of the resinous film-forming agent in the nail cosmetic of this embodiment is not particularly limited, and can be selected depending on the type of film-forming agent, the required properties, and the like.

[0092] When the nail cosmetic of this embodiment contains a resinous film-forming agent, the nail cosmetic of this embodiment may contain, for example, 5% by mass or more and 30% by mass or less of the resinous film-forming agent, or 7% by mass or more and 25% by mass or less of the resinous film-forming agent, relative to the total amount of the nail cosmetic.

[0093] By setting the blending amount of the resinous film-forming agent to 5% by mass or more of the total amount of the nail cosmetic, the drying speed of the nail cosmetic can be increased and further, a decrease in the gloss of the formed nail cosmetic film due to changes over time can be prevented.Furthermore, by setting the blending amount of the resinous film-forming agent to 30% by mass or less of the total amount of the nail cosmetic, an increase in viscosity of the nail cosmetic can be prevented, resulting in a nail cosmetic that can be easily applied.

[0094] When the nail cosmetic of this embodiment contains a photocurable film-forming agent, the nail cosmetic of this embodiment may contain, for example, 5% by mass or more and 99.5% by mass or less of the photocurable film-forming agent, more preferably 50% by mass or more and 95% by mass or less, and even more preferably 70% by mass or more and 95% by mass or less, based on the total amount of the nail cosmetic. (3) Other Components The nail cosmetic of this embodiment may further contain any component other than the infrared-absorbing particles and the film-forming agent. (Organic Solvent) The nail cosmetic of this embodiment may also contain, for example, an organic solvent. By containing an organic solvent in the nail cosmetic, the viscosity of the nail cosmetic can be adjusted, and the workability and applicability when applying it to nails can be improved.

[0095] The organic solvent is not particularly limited, and known solvents such as esters, alcohols, and hydrocarbons that have been conventionally used in nail cosmetics can be used. For example, one or more non-aromatic organic solvents selected from methyl acetate, ethyl acetate, butyl acetate, amyl acetate, ethyl lactate, butyl lactate, ethyl alcohol, isopropyl alcohol, butyl alcohol, isobutyl acetate, propyl acetate, isopropyl acetate, and propyl alcohol can be suitably used. One type of organic solvent may be used alone, or two or more types may be used in combination.

[0096] The amount of the organic solvent to be added is not particularly limited, and can be selected depending on the viscosity required for the nail cosmetic and other ingredients contained in the nail cosmetic.

[0097] When the nail cosmetic of this embodiment contains a resinous film-forming agent as a film-forming agent, the nail cosmetic of this embodiment may contain an organic solvent in a proportion of 25% by mass or more and 85% by mass or less, based on the total amount of the nail cosmetic.

[0098] When the nail cosmetic of this embodiment contains a photocurable film-forming agent as a film-forming agent and the fluidity of the nail cosmetic can be increased to an extent that the nail cosmetic can be easily applied by a monomer or oligomer having an ethylenically unsaturated bond, the nail cosmetic of this embodiment does not need to contain an organic solvent. Also, when the nail cosmetic of this embodiment contains a photocurable film-forming agent as a film-forming agent and an organic solvent, the above-mentioned organic solvent can be used.

[0099] The nail cosmetic of this embodiment does not need to use organic solvents that are typically blended as diluents, such as toluene and xylene. That is, the nail cosmetic of this embodiment can be configured to not contain diluents such as toluene and xylene. (Coloring Component) The nail cosmetic of this embodiment may contain a coloring component as needed to enhance the appearance of the nail cosmetic film formed.

[0100] Examples of coloring components that can be used in the nail cosmetic of this embodiment include one or more selected from pearling agents, glittering agents, pigments, dyes, coloring materials, and the like, and known pearling agents, glittering agents, pigments, dyes, and coloring materials can be used.

[0101] Examples of pearlescent agents include mica titanium, red iron oxide-coated mica, red iron oxide-coated mica titanium, carmine-coated mica titanium, Prussian blue-coated mica titanium, titanium oxide-coated synthetic phlogopite, red iron oxide-coated synthetic phlogopite, titanium oxide-coated glass flakes, titanium oxide-coated alumina flakes, titanium oxide-coated silica flakes, iron oxide-coated aluminum, and iron oxide-coated iron oxide.

[0102] Examples of glittering agents include polyethylene terephthalate-polymethyl methacrylate laminated film powder, polyethylene terephthalate-polyolefin laminated film powder, epoxy resin-coated aluminum-deposited polyethylene terephthalate, aluminum-deposited polyethylene terephthalate, urethane resin-coated aluminum-deposited polyethylene terephthalate, and acrylic resin-coated aluminum powder.

[0103] When the nail cosmetic of this embodiment contains a coloring component, the blending amount is not particularly limited, but the nail cosmetic of this embodiment may contain the coloring component in an amount of 0.01% by mass or more and 20% by mass or less, 0.05% by mass or more and 20% by mass or less, or 0.5% by mass or more and 7% by mass or less, relative to the total amount of the nail cosmetic.

[0104] (Other Components) The nail cosmetic of this embodiment may further contain other components as long as the effects of the present invention are not impaired. Examples of other components that can be used include resins other than those mentioned above, plasticizers such as acetyl tributyl citrate, fragrances, drugs, moisturizers, UV absorbers, matting agents, fillers, surfactants, dispersants, and metal soaps, all of which are generally incorporated into nail cosmetics. (4) Regarding the Manufacturing Method of the Nail Cosmetic The manufacturing method of the nail cosmetic of this embodiment may include a mixing step of mixing infrared-absorbing particles and a film-forming agent. In the mixing step, the infrared-absorbing particles may be dispersed in the film-forming agent.

[0105] The method for mixing the infrared absorbing particles and the coating agent is not particularly limited, and one or more types of mixing / dispersing device selected from, for example, a bead mill, a sand mill, a ball mill, a paint shaker, an ultrasonic homogenizer, etc. In particular, as the mixing / dispersing device, it is preferable to use a media agitation mill such as a bead mill, a ball mill, a sand mill, or a paint shaker that uses a medium such as beads, balls, or sand. This is because the use of a media agitation mill makes it possible to obtain the desired dispersed particle size for the infrared absorbing particles in a particularly short time, and is preferable from the viewpoints of productivity and suppressing the inclusion of impurities.

[0106] The materials of the media such as beads, sand, and balls used in the media agitation mill are not particularly limited, but examples include glass, alumina, zirconia, titanium, steel, etc. The size of the media is also not particularly limited, but for example, media with a diameter of 0.1 mm to 2.0 mm can be used.

[0107] In the mixing step, other additive components such as a coloring component may be added, and the infrared absorbing particles, the coating agent, and the other additive components may be mixed together. Alternatively, the other additive components may be added and mixed after the infrared absorbing particles and the coating agent are mixed together.

[0108] Prior to the mixing step, a dispersion preparation step may be carried out in which infrared absorbing particles are dispersed in an organic solvent to prepare an infrared absorbing particle dispersion.

[0109] In this case, the infrared absorbing particle dispersion and the film-forming agent may be mixed in the mixing step, and the infrared absorbing particles and the film-forming agent may be mixed together. Alternatively, other additive components such as a coloring component may be added in the mixing step, and the infrared absorbing particle dispersion, the film-forming agent, and the other additive components may be mixed together.

[0110] Alternatively, the organic solvent may be removed by drying from the infrared absorbing particle dispersion liquid obtained in the dispersion liquid preparation step, and the recovered infrared absorbing particles may then be used in the mixing step.

[0111] In this case, in the dispersion preparation step, the infrared absorbing particles, the dispersant, and an organic solvent having a boiling point of 120° C. or less may be mixed together. As the dispersant, for example, a dispersant having one or more functional groups selected from an amine-containing group, a hydroxyl group, a carboxyl group, a carboxylic acid ester, a phosphoric acid group, a phosphoric acid ester, a sulfonic acid group, a sulfonic acid ester, a thiol group, and an epoxy group can be used.

[0112] The organic solvent is then removed by drying from the resulting infrared-absorbing particle dispersion liquid to obtain an infrared-absorbing particle dispersion powder. In this case, the dispersant is disposed on the surfaces of the infrared-absorbing particles in the infrared-absorbing particle dispersion powder, thereby improving the dispersibility of the infrared-absorbing particles in the nail cosmetic obtained after the mixing step.

[0113] In the mixing step, the infrared absorbing particle dispersion powder and the film-forming agent, etc. may be mixed using, in addition to the above-mentioned mixer / disperser, one or more types selected from a propeller mixer, a planetary mixer, a three-roller mill, a kneader mill, etc. (5) Uses of the Nail Cosmetic The nail cosmetic of this embodiment can be used as a manicure, nail enamel, nail coat, pedicure, gel nails, etc.

[0114] The nail cosmetic of this embodiment can be used in one or more layers selected from the primer layer, base layer, color layer, and top layer of an artificial nail, and can be suitably used in any of them.

[0115] The method for applying the nail cosmetic of this embodiment is not particularly limited, and may be any known method. Examples of methods for applying the nail cosmetic of this embodiment include application using a brush or paintbrush, spray application, inkjet application, bar coater application, spin application, curtain application, dip application, air knife application, blade application, and roll application. [Nail Cosmetic Film] The nail cosmetic film of this embodiment has infrared-absorbing particles and a coating containing at least some of the infrared-absorbing particles therein. The infrared-absorbing particles contained in the nail cosmetic film of this embodiment may all be disposed within the coating, or some may be exposed from the coating.

[0116] For example, as schematically shown in FIG. 2 , the nail cosmetic film 20 can include infrared absorbing particles 21 and a coating 22, and at least a portion of the infrared absorbing particles 21 can be disposed in the coating 22. The infrared absorbing particles 21 can be dispersed in the coating 22. Note that FIG. 2 is a schematic view, and the nail cosmetic film 20 of this embodiment is not limited to this form. For example, in FIG. 2 , the infrared absorbing particles 21 are represented by circles and depicted as spherical particles, but the shape of the infrared absorbing particles 21 is not limited to this form and can have any shape. The nail cosmetic film 20 can also include other components as needed, in addition to the infrared absorbing particles 21 and the coating 22.

[0117] The nail cosmetic film of this embodiment can be produced by applying the nail cosmetic according to one aspect of the present disclosure to nails and drying or curing it. Therefore, the coating possessed by the nail cosmetic film of this embodiment is derived from the film-forming agent and is formed by drying or curing the film-forming agent. The nail cosmetic film of this embodiment can also contain additives such as color components contained in the nail cosmetic of this embodiment.

[0118] The nail cosmetic film of this embodiment can contain infrared absorbing particles. The infrared absorbing particles can contain, for example, a material that can absorb infrared rays in sunlight and convert them into heat. The infrared absorbing particles can be, for example, a material represented by the general formula W ａ O ｂ Tungsten oxide represented by the general formula XB ｍ boride compounds represented by the general formula M ｘ W ｙ O ｚ The tungsten oxide composition may contain one or more compounds selected from the group consisting of composite tungsten oxides represented by the following formula:

[0119] In particular, the infrared absorbing particles preferably contain a composite tungsten oxide, and may be composed of a composite tungsten oxide. However, even in this case, the infrared absorbing particles may contain unavoidable impurities. The composite tungsten oxide is represented by the general formula M ｘ W ｙ O ｚ The details have been explained in the nail cosmetic, so a detailed explanation will be omitted. The infrared absorbing particles have already been explained, so a detailed explanation will be omitted.

[0120] Although it varies depending on the application of the nail cosmetic film of this embodiment, the thickness of the nail cosmetic film of this embodiment may be, for example, 1 μm or more and 1.2 mm or less, or 10 μm or more and 1.0 mm or less.

[0121] When the nail cosmetic of this embodiment is used for manicure, nail enamel, nail coating, or pedicure, the thickness of the nail cosmetic film may be from 10 μm to 500 μm, from 10 μm to 400 μm, or from 10 μm to 100 μm. When the nail cosmetic of this embodiment is used for gel nails, the thickness of the nail cosmetic film may be from 10 μm to 1 mm, or from 100 μm to 1 mm.

[0122] The content of the infrared absorbing particles per unit area of ​​the nail cosmetic film of this embodiment is not particularly limited, but may be, for example, 0.05 g / m ２ 1g / m or more ２ It may be 0.05 g / m or less, ２ 0.5g / m or more ２ It may be 0.1 g / m or less, ２ 0.3g / m or more ２ The content of the infrared absorbing particles per unit area may be 0.05 g / m or less. ２ If the content of infrared absorbing particles per unit area is 0.1 g / m or more, the average transmittance of the film at wavelengths of 800 nm to 1,300 nm is reduced by 5% or more compared to a film that does not contain infrared absorbing particles. ２ If this is the case, the average transmittance in the wavelength range of 800 nm to 1300 nm decreases by 10% or more compared to a film that does not contain infrared absorbing particles.

[0123] The infrared rays absorbed by the nail cosmetic film without passing through the nail cosmetic film are converted into heat. The more infrared rays are absorbed, the more heat the nail cosmetic film generates. However, under natural light, the heat of the nail cosmetic film is diffused into the surrounding environment, so it does not generate heat that exceeds 10°C above the surroundings. Therefore, when the content of infrared-absorbing particles per unit area of ​​the nail cosmetic film is 1 g / m, ２ Even if the content of infrared absorbing particles per unit area of ​​the nail cosmetic film exceeds 1 g / m, there is no significant difference in the heat generating effect. ２ It may be the following:

[0124] Specific examples are provided below for explanation, but the present invention is not limited to these examples. (1) Evaluation Method (1-1) Number-Average Particle Size of Infrared-Absorbing Particles To calculate the number-average particle size of the infrared-absorbing particles used in each Example and Comparative Example, 100 composite tungsten oxide particles contained in the nail cosmetic film produced in each Example and Comparative Example were observed using a transmission electron microscope. The diameter of the smallest encompassing circle of the observed composite tungsten oxide particles was measured as the particle size. The number-average particle size of the measured 100 composite tungsten oxide particles was then calculated. (1-2) Pot Life The pot life was evaluated by placing the nail cosmetics produced in each Example and Comparative Example in a glass bottle, storing them in a thermostatic chamber set at 40°C for one month, and then visually observing the appearance. The evaluation criteria were as follows: no change = ⊚, very slight sediment = ◯, and the presence of sediment = ×. The pot life characteristics were evaluated as excellent, with ⊚ being the best, followed by ◯ and ×, in descending order. (1-3) Coatability Coatability was evaluated by applying the nail cosmetics produced in each Example and Comparative Example to an artificial nail (nail tip) using a nail brush and judging the ease of application. The evaluation results were rated as follows: ⊚ (very clean application), ◯ (clean application), and × (difficult application). The evaluation of coatability was best with ⊚ being the best, followed by ◯ and ×, which indicated decreasing ratings. (1-4) Drying Speed ​​Drying speed was evaluated based on the time it took for a finger to no longer leave fingerprints after application of the nail cosmetics of each Example and Comparative Example to the point where fingerprints were no longer visible when touched with a finger. A rating of ⊚ was given for a time from application of the nail cosmetics to the point where fingerprints were no longer visible when touched with a finger, while a rating of ◯ was given for a time from application of the nail cosmetics to the point where fingerprints were no longer visible when touched with a finger, and × was given for a time from application of the nail cosmetics to the point where fingerprints were no longer visible when touched with a finger. A rating of ⊚ was given for a time from application of the nail cosmetics to the point where fingerprints were no longer visible when touched with a finger, followed by ◯, which indicated a time from application of the nail cosmetics to the point where fingerprints were no longer visible when touched with a finger, and ×, which indicated a time from application of the nail cosmetics to the point where fingerprints were no longer visible when touched with a finger, respectively. A rating of ⊚ was given for a time from application of the nail cosmetics to the point where fingerprints were no longer visible when touched with a finger, followed by ◯, which indicated a time from application of the nail cosmetics to the point where fingerprints were no longer visible when touched with a finger, respectively. A rating of ◯ ...

[0125] The nail cosmetics according to each Example and Comparative Example were applied to a PET film with an applicator so that the film thickness after drying would be 50 μm. After application to the PET film, the organic solvent was removed in a thermostatic box at 100° C. to obtain a dried film.

[0126] A test piece measuring 70 mm x 70 mm was cut from this dried film to prepare a light-irradiated test piece, which was a nail cosmetic film according to each Example and Comparative Example. The light-irradiated test piece according to each Example and Comparative Example was irradiated for 5 minutes from a photographic lighting lamp (Iwasaki Electric Eye Lamp PFR250 250W) as a light source for simulated sunlight, which was installed 30 cm away from the dried film side. The temperature of the back surface of the light-irradiated test piece (the surface opposite the dried film) was then measured and recorded as the "temperature of the light-irradiated test piece after light irradiation." The temperature of the back surface of the light-irradiated test piece before light irradiation was also measured and recorded as the "temperature of the light-irradiated test piece before light irradiation." The temperature change, which is the difference between the "temperature of the light-irradiated test piece after light irradiation" and the "temperature of the light-irradiated test piece before light irradiation," was also calculated. Furthermore, the difference from the temperature change of 9°C in Comparative Example 1 is shown in the "Difference in temperature change from Comparative Example 1" column.

[0127] Example 1 Nail cosmetics were prepared and evaluated according to the following procedure.

[0128] The infrared absorbing particles are hexagonal cesium tungsten bronze (Cs) with a molar ratio of cesium (Cs) to tungsten (W) of Cs / W=0.33. ０．３３ WO ｚ , 2.0≦z<4.0). In Tables 1 and 3, the oxygen content of the composite tungsten oxide is set to 3 for convenience, and Cs ０．３３ WO ３ It is written as follows.

[0129] The mixed solution of the composition shown in Table 1 was ２ The mixture was loaded into a paint shaker containing beads, and subjected to pulverization, dispersion, and mixing processes to obtain the nail cosmetic of Example 1 (mixing step). The number average particle size of the composite tungsten oxide particles contained in the nail cosmetic after pulverization was 25 nm.

[0130] The evaluation results are shown in Table 2. [Examples 2 to 4, Comparative Example 1] Nail cosmetics according to each example and comparative example were obtained under the same conditions as in Example 1, except that the compositions shown in Table 1 were used, and evaluated according to the same procedures as in Example 1.

[0131] In Examples 3 and 4, the infrared absorbing particles were hexagonal tungsten bronze (Rb) particles having a molar ratio of rubidium (Rb) to tungsten (W) of Rb / W=0.33. ０．３３ WO ｚ , 2.0≦z<4.0).

[0132] The evaluation results are shown in Table 2.

[0133]

[0134] [Example 5] 20 parts by mass of the composite tungsten oxide coarse powder used in Example 1, 10 parts by mass of a dispersant having an amine-containing functional group and an acrylic main chain (amine value 48 mg KOH / g, decomposition temperature 250°C) (sometimes referred to as "dispersant a" in the present invention), and 70 parts by mass of ethyl acetate (boiling point 77.1°C) as an organic solvent were weighed out. These raw materials were mixed in a 0.3 mmφ ZrO ２ The mixture was loaded into a paint shaker containing beads, and subjected to a pulverization and dispersion treatment for 10 hours to obtain a dispersion liquid according to Example 5.

[0135] The dispersion was applied to a PET film and dried to obtain a dried film of Example 5, and the number average particle size of the composite tungsten oxide particles was calculated and shown in the column of "Number average particle size of infrared absorbing particles" in Table 3.

[0136] Furthermore, an aliquot of the dispersion according to Example 5 was diluted 10 times with ethyl acetate, and the resulting diluted dispersion was visually confirmed to be colorless, which means that the diluted dispersion remains colorless even when a colorless film-forming agent is added.

[0137] Next, dispersant a was added to the dispersion of Example 5 so that the mass ratio of dispersant a to the composite tungsten oxide particles, which are infrared absorbing particles in the dispersion, was [composite tungsten oxide particles] / [dispersant]=100 / 200, and the mixture was thoroughly mixed to prepare a mixed liquid.

[0138] The resulting mixture was loaded into an agitation type vacuum dryer, and dried under reduced pressure at room temperature in the agitation type vacuum dryer to remove ethyl acetate, thereby obtaining a dispersed powder according to Example 5.

[0139] The infrared absorbing particles, film-forming agent, photopolymerization initiator, and coloring component shown in Table 3 were mixed using a planetary mixer to obtain the composition shown in Table 3, thereby obtaining a nail cosmetic according to Example 5. During mixing, the mixture was shielded from light so as not to be exposed to light.

[0140] In Table 3, the monomer having an ethylenically unsaturated group refers to 2-hydroxyethyl methacrylate, and the monomer having two or more ethylenically unsaturated bonds in the molecule refers to triethylene glycol dimethacrylate. 1-Hydroxycyclohexyl phenyl ketone was used as the photopolymerization initiator.

[0141] The nail cosmetic composition according to Example 5 was applied to a PET film so that the film thickness after curing would be 100 μm, and the film was irradiated with a 36 W ultraviolet lamp for 2 minutes to form a nail cosmetic composition film according to Example 5.

[0142] A square of 70 mm x 70 mm was cut out from the nail cosmetic film of Example 5 to prepare a light irradiation test piece of Example 5, which was evaluated in the same manner as in Example 1. The results are shown in Table 3.

[0143] [Summary] It can be seen that the temperature rise of the light-irradiated test pieces according to Examples 1 to 5, which contain infrared absorbing particles, due to irradiation with simulated sunlight is higher than that of the light-irradiated test piece according to Comparative Example 1, which does not contain infrared absorbing particles.

[0144] These results demonstrate that the nail cosmetic according to one embodiment of the present disclosure has a new and unprecedented function in that the nail cosmetic film obtained upon application generates heat when exposed to sunlight, thereby relieving cold fingertips in winter.

[0145] This application claims priority based on Japanese Patent Application No. 2024-028823, filed with the Japan Patent Office on February 28, 2024, the entire contents of which are incorporated herein by reference.

[0146] REFERENCE SIGNS LIST 10 Nail cosmetic 11 Infrared absorbing particles 12 Film-forming agent 20 Nail cosmetic film 21 Infrared absorbing particles 22 Film

Claims

1. A nail cosmetic comprising infrared absorbing particles and a film-forming agent.

2. The infrared absorbing particles are represented by the general formula M ｘ W ｙ O ｚ 2. The nail cosmetic according to claim 1, comprising a composite tungsten oxide represented by the formula: (wherein the element M is one or more elements selected from H, He, alkali metal elements, alkaline earth metal elements, rare earth elements, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, and I, and satisfying 0.001≦x / y≦1 and 2.0≦z / y<4.0).

3. A nail cosmetic according to claim 1 or 2, wherein the content of the infrared absorbing particles is 0.05% by mass or more and 10% by mass or less.

4. A nail cosmetic film having infrared absorbing particles and a coating containing at least a portion of the infrared absorbing particles therein.

5. The infrared absorbing particles are represented by the general formula M ｘ W ｙ O ｚ 5. The nail cosmetic film according to claim 4, comprising a composite tungsten oxide represented by the formula: (wherein the element M is one or more elements selected from H, He, alkali metal elements, alkaline earth metal elements, rare earth elements, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, and I, and satisfying 0.001≦x / y≦1 and 2.0≦z / y<4.0).

6. The content of the infrared absorbing particles per unit area is 0.05 g / m ２ 1g / m or more ２ The nail cosmetic film according to claim 4 or claim 5, wherein:

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