Foldable electronic device comprising rotatable antenna modules

Abstract

This electronic device may comprise: a first housing part; a second housing part rotatably coupled to the first housing part; a first antenna module positioned in the first housing part; a first wireless communication circuit disposed in the first housing part; a second antenna module positioned in the second housing part; and a second wireless communication circuit disposed in the second housing part. While the first housing part is rotating with respect to the second housing part, the radiation direction of the first antenna module and the radiation direction of the second antenna module may face each other. The first wireless communication circuit may be configured to transmit or receive a radio frequency (RF) signal through the first antenna module. The second wireless communication circuit may be configured to receive or transmit the RF signal through the second antenna module.

Description

Foldable electronic device including a rotatable antenna module

[0001] The descriptions below relate to a foldable electronic device including a rotatable antenna module.

[0002] With the advancement of mobile technology, foldable electronic devices are being developed that combine the wide display of a tablet with the compact form factor of a smartphone. These foldable electronic devices may include housing parts that can be folded or unfolded by rotating relative to each other around a hinge assembly, and may include a flexible printed circuit board extending across the hinge assembly for signal transmission between the housing parts.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] In one embodiment, an electronic device may include a first housing part, a second housing part rotatably coupled to the first housing part, a first antenna module positioned within the first housing part, a first wireless communication circuit positioned within the first housing part and electrically connected to the first antenna module, a second antenna module positioned within the second housing part, a second wireless communication circuit positioned within the second housing part and electrically connected to the second antenna module, a first link assembly configured to rotate the first antenna module, and a second link assembly configured to rotate the second antenna module. While the first housing part rotates relative to the second housing part, a radiation direction of the first antenna module and a radiation direction of the second antenna module may face each other. The first wireless communication circuit may be configured to transmit or receive a radio frequency (RF) signal through the first antenna module. The second wireless communication circuit may be configured to receive or transmit the RF signal through the second antenna module.

[0005] In one embodiment, an electronic device may include a first housing part, a second housing part rotatably coupled to the first housing part, a first antenna module positioned within the first housing part and including a surface on which a first antenna array is arranged, a first wireless communication circuit positioned within the first housing part and electrically connected to the first antenna module, a second antenna module positioned within the second housing part and including a surface on which a second antenna array is arranged, a second wireless communication circuit positioned within the second housing part and electrically connected to the second antenna module, a first link assembly configured to rotate the first antenna module such that the surface on which the first antenna array of the first antenna module is arranged faces the second antenna module while the first housing part rotates with respect to the second housing part, and a second link assembly configured to rotate the second antenna module such that the surface on which the second antenna array of the second antenna module is arranged faces the first antenna module while the second housing part rotates with respect to the first housing part. There is. The first wireless communication circuit may be configured to transmit an RF (radio frequency) signal through the first antenna module. The second wireless communication circuit may be configured to receive the RF signal through the second antenna module.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2A is a front perspective view of an electronic device according to one embodiment.

[0008] FIG. 2b is a plan view of the rear side of an electronic device according to one embodiment.

[0009] FIG. 2c is an exploded perspective view of a portion of the electronic device of FIGS. 2a and 2b including a hinge device according to one embodiment.

[0010] FIG. 3A is a plan view of the front of an electronic device according to one embodiment.

[0011] FIG. 3b is a plan view of the rear side of the electronic device according to one embodiment.

[0012] FIG. 4A is a drawing showing a first antenna assembly and a first link assembly according to one embodiment.

[0013] FIG. 4b is a drawing showing a first antenna assembly, a first link assembly, and a hinge assembly according to one embodiment.

[0014] FIG. 4c is an exploded view of a first antenna assembly, a first link assembly, a hinge assembly, and a first housing, according to one embodiment.

[0015] FIG. 4d is a drawing showing a first antenna assembly, a first link assembly, a hinge assembly, and a first housing according to one embodiment.

[0016] FIG. 4e is a drawing showing a first antenna assembly, a first link assembly, a hinge assembly, and a first housing according to one embodiment.

[0017] FIG. 4F is a drawing showing a first antenna assembly and a first link assembly according to one embodiment.

[0018] FIG. 5 is a drawing for explaining the operation of an antenna assembly and a link mechanism according to one embodiment.

[0019] FIG. 6A illustrates an electronic device in a first state, according to one embodiment.

[0020] FIG. 6b illustrates an electronic device in a third state, according to one embodiment.

[0021] FIG. 6c illustrates an electronic device in a second state, according to one embodiment.

[0022] FIG. 7A is a drawing showing the upper surface of an antenna module according to one embodiment.

[0023] FIG. 7b is a drawing showing the rear side of an antenna module according to one embodiment.

[0024] FIG. 7c is a drawing showing a cross-section of an antenna module according to one embodiment.

[0025] Fig. 8 shows a cross-section along line B-B' of the antenna module (700) of Fig. 7a.

[0026] FIG. 9 is a drawing showing a first antenna assembly, a first link assembly, a hinge assembly, and a first housing according to one embodiment.

[0027] FIG. 10A is a drawing showing an electronic device including a connecting member of an antenna module according to one embodiment.

[0028] FIG. 10b is a drawing showing an electronic device including a connecting member of an antenna module according to one embodiment.

[0029] FIG. 11A is a diagram illustrating an electronic device in a fully unfolded first state according to one embodiment.

[0030] FIG. 11b is a diagram illustrating an electronic device in a fully unfolded first state according to one embodiment.

[0031] FIG. 11c is a drawing showing a hinge cover of a hinge assembly according to one embodiment.

[0032] FIG. 11d is a drawing showing a hinge cover of a hinge assembly according to one embodiment.

[0033] FIG. 12A illustrates an electronic device in a fully unfolded first state, according to one embodiment.

[0034] FIG. 12b illustrates the back of the display according to one embodiment.

[0035] FIG. 12c illustrates an electronic device in a third state, which is an intermediate state, according to one embodiment.

[0036] FIG. 12d illustrates an electronic device in a fully folded second state, according to one embodiment.

[0037] FIG. 13 is a block diagram of an electronic device according to one embodiment.

[0038] FIG. 14 is a block diagram of an electronic device according to one embodiment.

[0039] FIG. 15 is a graph showing the voltage standing wave ratio (VSWR) of an antenna module according to one embodiment.

[0040] FIG. 16a is a graph showing the S parameter (S21) of the antenna module of the electronic device in a folded state according to one embodiment.

[0041] FIG. 16b is a graph showing the voltage standing wave ratio of the antenna module of the electronic device in a folded state according to one embodiment.

[0042] FIG. 17a is a graph showing the S parameter (S21) of the antenna module of the electronic device in an unfolded state according to one embodiment.

[0043] FIG. 17b is a graph showing the voltage standing wave ratio of the antenna module of the electronic device in an unfolded state according to one embodiment.

[0044] FIG. 18A illustrates an electronic device in an unfolded state, according to one embodiment.

[0045] FIG. 18b illustrates an electronic device in a folded state, according to one embodiment.

[0046] FIG. 19A illustrates an electronic device in an unfolded state, according to one embodiment.

[0047] FIG. 19b illustrates an electronic device in a folded state, according to one embodiment.

[0048] FIG. 20A illustrates an electronic device in an unfolded state, according to one embodiment.

[0049] FIG. 20b illustrates an electronic device in a folded state, according to one embodiment.

[0050] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0051] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0052] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0053] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0054] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0055] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0056] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0057] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0058] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0059] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0061] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0062] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0063] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0064] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0065] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0066] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0067] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0068] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0069] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0070] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0071] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0072] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment. FIG. 2B is a plan view of the rear of the electronic device according to one embodiment.

[0073] Referring to FIGS. 2A and 2B , the electronic device (200) may include a first housing (210) (e.g., a first housing member, a first housing part, or a first housing structure) and a second housing (220) (e.g., a second housing member, a second housing part, or a second housing structure). The first housing (210) and the second housing (220) may be rotatably or foldably coupled to each other via at least one hinge device (240, 240-1) (e.g., a hinge structure or a hinge module). For example, the first housing (210) and the second housing (220) may be folded or unfolded relative to each other with respect to a folding axis (F). For example, the first housing (210) can rotate about the folding axis (F) and / or about at least one first axis substantially parallel to the folding axis (F) with respect to the second housing (220) via at least one hinge device (240, 240-1). For example, the second housing (220) can rotate about the folding axis (F) and / or about at least one second axis substantially parallel to the folding axis (F) with respect to the first housing (210) via at least one hinge device (240, 240-1).

[0074] In one embodiment, the first housing (210) may include a first face (211) and a second face (212) facing in an opposite direction (e.g., in the -z-axis direction) of the first face (211). For example, the second housing (220) may include a first face (221) and a second face (222) facing in an opposite direction (e.g., in the -z-axis direction) of the first face (221).

[0075] In one embodiment, the first housing (210) and the second housing (220) may be configured as a foldable housing (e.g., a housing structure). For example, the electronic device (200) may include a first state (e.g., an unfolded state) in which the first housing (210) and the second housing (220) are fully unfolded, a second state (e.g., a folded state) in which the first housing (210) and the second housing (220) are fully folded, and a third state (e.g., an intermediate state) between the first state and the second state. For example, in the first state, the first housing (210) and the second housing (220) of the electronic device (200) may lie on a plane. For example, in the first state, the electronic device (200) (or the foldable housing) may be operated so that the first surface (211) of the first housing (210) and the first surface (221) of the second housing (220) face substantially the same direction (e.g., z-axis direction). For example, in the second state, at least a portion of the first housing (210) of the electronic device (200) may be placed on the second housing (220). For example, in the second state, the electronic device (200) (or the foldable housing) may be operated so that the first surface (211) of the first housing (210) and the first surface (221) of the second housing (220) face each other or face opposite directions.

[0076] In one embodiment, the first housing (210) may include a first side member (213) (e.g., a side bezel) and a first rear cover (214) coupled with the first side member (213). For example, the second housing (220) may include a second side member (223) (e.g., a side bezel) and a second rear cover (224) coupled with the second side member (223).

[0077] In one embodiment, the electronic device (200) may include a first display (230) (e.g., a flexible display, a foldable display, or a main display) arranged to be supported by a first housing (210) and a second housing (220). The first display (230) may be visible through a first surface (211) of the first housing (210) and a first surface (221) of the second housing (220). For example, the electronic device (200) may include a window (not shown) arranged on the first display (230) to at least partially form the first surface (211) of the first housing (210) and the first surface (221) of the second housing (220). At least a portion of the window may include a substantially transparent area, and the first display (230) may be visible through the transparent area of ​​the window. The window may be formed from a flexible plastic and / or glass. The window may be attached to the first display (230), and in this respect, the window may be understood to be included in the first display (230). In that the window forms the first surface (211) of the first housing (210) and the first surface (221) of the second housing (220), the window or the first display (230) including the window may be understood to be included in the foldable housing of the electronic device (200).

[0078] According to one embodiment, the electronic device (200) may include a first receiver (201), at least one first sensor module (204) (e.g., an ambient light sensor) and / or at least one first camera module (205) (e.g., a UDC, under display camera) disposed on a first side (211) of the first housing (210). For example, the electronic device (200) may include at least one key (206) disposed on a first side member (213). For example, the electronic device (200) may include at least one second camera module (208) and / or a flash (209) disposed on a second side (212) of the first housing (210) (e.g., a first rear cover (214)). For example, the electronic device (200) may include a second display (231) disposed on a second surface (222) of a second housing (220), at least one third camera module (225) (e.g., UDC, under display camera), at least one second sensor module (226), and / or a second receiver (227). For example, the second display (231) may be disposed to be visible from the outside through at least a portion of the second rear cover (224). For example, the electronic device (200) may include a speaker (202) disposed on a second side member (223), a microphone (203) disposed on a first side member (213), and / or a connector port (207). At least some of the components described above may be disposed in the first housing (210) and / or the second housing (220).

[0079] According to one embodiment, the first display (230) may include a first area (230a) (e.g., a first planar portion) corresponding to at least a portion of a first surface (211) of the first housing (210), a second area (230b) (e.g., a second planar portion) corresponding to at least a portion of a first surface (221) of the second housing (220), and a third area (230c) (e.g., a flexible portion) connecting the first area (230a) and the second area (230b) and deforming depending on a state of the electronic device (200) (e.g., the first state, the second state, or the third state). For example, the third area (230c) may be positioned at a position at least partially overlapping at least one hinge device (240, 240-1) when the first display (230) is viewed from above (e.g., in the z-axis direction). For example, the first display (230) may be arranged so as not to be visible from the outside in the second state by having the first surface (211) of the first housing (210) and the first surface (221) of the second housing (220) face each other (e.g., inward-fold type or in-folding type). For example, the first display (230) may be arranged so as to be visible from the outside in the second state by having the first surfaces (211) and the first surfaces (221) face each other in opposite directions (e.g., outward-fold type or out-folding type).

[0080] FIG. 2c is an exploded perspective view of a portion of the electronic device of FIGS. 2a and 2b including a hinge device according to one embodiment.

[0081] Referring to FIG. 2C, the first housing (210) may include a first side member (213) and a first support member (2131) extending inwardly of the first housing (210) from the first side member (213). The first support member (2131) may be at least partially enclosed by the first side member (213). The second housing (220) may include a second side member (213) and a second support member (2231) extending inwardly of the second housing (220) from the second side member (223). The second support member (2231) may be at least partially enclosed by the second side member (223).

[0082] In one embodiment, the first side member (213) and the first support member (2131) of the first housing (210) may form a space in which various components of the electronic device (200) may be arranged, such as a first space (2101) (e.g., a first internal space or a first internal volume) of the first housing (210). The second side member (223) and the second support member (2231) of the second housing (220) may form a space in which various components of the electronic device (200) may be arranged, such as a second space (2201) (e.g., a second internal space or a second internal volume) of the second housing (220).

[0083] In one embodiment, the electronic device (200) may include at least one hinge device (240, 240-1) connecting the first housing (210) and the second housing (220) under the first display (230) (e.g., in the -z-axis direction). For example, the at least one hinge device (240, 240-1) may include the first hinge device (240) and a second hinge device (240-1) spaced apart from the first hinge device (240) in a direction parallel to the folding axis (F) (e.g., in the ±y-axis direction). For example, the at least one hinge device (240, 240-1) may be supported by the first support member (2131) and the second support member (2231). In one embodiment, at least one hinge device (240, 240-1) may be positioned within a hinge cover (250) (e.g., a hinge housing). For example, at least one hinge device (240, 240-1) may be positioned between a first housing (210) and a second housing (220) so as to be invisible from the outside through the hinge cover (250) (e.g., a hinge housing).

[0084] In one embodiment, the first hinge device (240) may include a first rotation member (241) (e.g., a first arm or a first rotator) coupled to a first support member (2131) of the first housing (210), a second rotation member (242) (e.g., a second arm or a second rotator) coupled to a second support member (2231) of the second housing (220), and a gear assembly (243) coupled to the first rotation member (241) and the second rotation member (242) such that the first housing (210) and the second housing (220) rotate symmetrically with respect to each other. For example, the gear assembly (243) may include a plurality of gears (e.g., spur gears and / or worm gears) that are gear-coupled with respect to one another. For example, the gear assembly (243) may include a cam coupling structure that urges the first housing (210) and the second housing (220) in a direction in which the first state is to be transitioned to the second state or in a direction in which the second state is to be transitioned to the first state, based on a predetermined angle, and provides a free stop at various folding angles (e.g., to maintain the third state). For example, the second hinge device (240-1) may have substantially the same configuration as the first hinge device (240).

[0085] According to one embodiment, the electronic device (200) may include a first hinge plate (261) connected to a first support member (2131) and / or a first rotation member (241). The electronic device (200) may include a second hinge plate (262) connected to a second support member (2231) and / or a second rotation member (242). For example, at least one hinge device (240, 240-1), the first rotation member (241), the second rotation member (242), the first hinge plate (261), and the second hinge plate (262) may form substantially the same plane as the first support member (2131) and the second support member (2231) when the electronic device (200) is in the first state. For example, the second hinge device (240-1) may be substantially symmetrical with the first hinge device (240) or may have a substantially identical configuration. The first hinge device (240), the second hinge device (240-1), and / or the hinge cover (250) may be referred to as a hinge assembly of the electronic device (200).

[0086] FIG. 3A is a plan view of a front side of an electronic device according to an embodiment. FIG. 3B is a plan view of a rear side of an electronic device according to an embodiment. FIG. 3A may be a drawing in which the first display (230), the first hinge plate (261), and the second hinge plate (262) of FIG. 2C are omitted. FIG. 3B may be a drawing in which the second display (231), the first rear cover (214), and the second rear cover (224) of FIG. 2B are omitted.

[0087] Referring to FIGS. 3A and 3B, an electronic device (200) according to an embodiment may include a hinge assembly (340), a first antenna assembly (362), a first link assembly (382), a second antenna assembly (364), and a second link assembly (384). Referring to FIG. 3B, an electronic device (200) according to an embodiment may include a first substrate (352), a second substrate (354), a first wireless communication circuit (322), a second wireless communication circuit (324), a first battery (392), and a second battery (394). The first wireless communication circuit (322) and the second wireless communication circuit (324) may be examples of the wireless communication module (192) of FIG. 1. The first wireless communication circuit (322) may include the first modem (1320) of FIG. 13, and optionally or additionally may include a first SerDes (serializer / deserializer) (1330). The first battery (392) and the second battery (394) may be examples of the battery (182) of FIG. 1. The second wireless communication circuit (324) may include the second modem (1322) of FIG. 13, and optionally or additionally may include a second SerDes (1332).

[0088] Referring to FIGS. 3A and 3B, the first antenna assembly (362) may be disposed within the first housing (210). For example, the first antenna assembly (362) may be disposed within an internal space of the first housing (210) (e.g., the first space (2101) of FIG. 2C). For example, the first antenna assembly (362) may be disposed on a first surface (210a) of a first support member (2131). With reference to FIG. 3A, the first surface (210a) of the first support member (2131) may face, for example, in the +z direction. The second antenna assembly (364) may be disposed within the second housing (220). For example, the second antenna assembly (364) may be disposed within an internal space of the second housing (220) (e.g., the second space (2201) of FIG. 2C). For example, the second antenna assembly (364) may be disposed on a first surface (220a) of a second support member (2231). With reference to FIG. 3A, the first surface (220a) of the second support member (2231) may face, for example, in the +z direction.

[0089] The first substrate (352) may be disposed within the first housing (210). For example, the first substrate (352) may be disposed on the second surface (210b) of the first support member (2131) opposite the first surface (210a). Referring to FIG. 3B, the second surface (210b) of the first support member (2131) may be oriented, for example, in the -z direction. The second substrate (354) may be disposed within the second housing (220). For example, the second substrate (354) may be disposed on the second surface (220b) of the second support member (2231) opposite the first surface (220a). Referring to FIG. 3B, the second surface (220b) of the second support member (2231) may be oriented, for example, in the -z direction. The first substrate (352) and the second substrate (354) may include printed circuit boards.

[0090] The first wireless communication circuit (322) may be disposed on the first substrate (352), and the second wireless communication circuit (324) may be disposed on the second substrate (354). Although not shown, the first antenna assembly (362) may include a first antenna module (e.g., the first antenna module (463) of FIGS. 4A and 4B) that is electrically connected to the first wireless communication circuit (322) and used to transmit and receive RF (radio frequency signal) signals. In addition, the second antenna assembly (364) may include a second antenna module (e.g., the second dksxpsk module (563) of FIG. 5) that is electrically connected to the second wireless communication circuit (324) and used to transmit and receive RF signals.

[0091] The first wireless communication circuit (322) can transmit an RF signal to the second wireless communication circuit (324) and / or receive an RF signal from the second wireless communication circuit (324) using the first antenna assembly (362) (or the first antenna module). The second wireless communication circuit (324) can transmit an RF signal to the first wireless communication circuit (322) and / or receive an RF signal from the first wireless communication circuit (322) using the second antenna assembly (364) (or the second antenna module). The RF signal transmitted and received between the first wireless communication circuit (322) and the second wireless communication circuit (324) using the first antenna assembly (362) and the second antenna assembly (364) can operate within a 60 GHz frequency band. For example, the frequency (e.g., carrier frequency) of the RF signal transmitted and received between the first antenna module of the first antenna assembly (362) and the second antenna module of the second antenna assembly (364) may be included within a 60 GHz frequency band. However, the frequency of the RF signal is not limited by the above-described example. For example, the 60 GHz frequency band may include frequencies from about 57 GHz (preferably 57.00 GHz) to 71 GHz (preferably 71.00 GHz, more preferably 66 GHz, most preferably 66.00 GHz).

[0092] In one embodiment, the first link assembly (382) may be positioned within the first housing (210) and the second link assembly (384) may be positioned within the second housing (220). A hinge assembly (340) (e.g., a hinge cover (250)) may be at least partially positioned between the first link assembly (382) and the second link assembly (384).

[0093] The hinge assembly (340) may include at least one hinge device (240, 240-1) and a hinge cover (250). The hinge assembly (340) (e.g., the hinge cover (250)) may be positioned between the first antenna assembly (362) and the second antenna assembly (364). In one embodiment, the first housing (210) and the second housing (220) may rotate relative to each other via the hinge assembly (340). While the first housing (210) rotates relative to the second housing (220), the first antenna assembly (362) disposed within the first housing (210) may move together with the first housing (210). Additionally, while the second housing (220) rotates relative to the first housing (210), the second antenna assembly (364) disposed within the second housing (220) can move together with the second housing (220).

[0094] Accordingly, the alignment between the first antenna module of the first antenna assembly (362) and the second antenna module of the second antenna assembly (364) may change, and the wireless communication performance using the first antenna assembly (362) and the second antenna assembly (364) may change. In particular, when a signal with strong straightness, such as a signal within the 60 GHz frequency band, is used, or when the antenna module is configured as a directional antenna in a specific direction, the influence of the change in the alignment between the first antenna module and the second antenna module on the wireless communication performance therebetween may increase. In other words, the relative angle between the first antenna assembly (362) and the second antenna assembly (364) during rotation may not be constant, which may affect the strength of the signal transmitted between the antenna assemblies. When a directional antenna is used and / or when the strength of the signal has a relatively high angular dependence, this influence on the strength of the signal may be relatively large.

[0095] To prevent this, in one embodiment, the first link assembly (382) may be configured to rotate the first antenna assembly (362) and / or the first antenna module of the first antenna assembly (362) such that the first antenna module of the first antenna assembly (362) faces the second antenna module of the second antenna assembly (364) while the first housing (210) rotates relative to the second housing (220). In one embodiment, the second link assembly (384) may be configured to rotate the second antenna assembly (364) and / or the second antenna module of the second antenna assembly (364) such that the second antenna module of the second antenna assembly (364) faces the first antenna module of the first antenna assembly (362) while the second housing (220) rotates relative to the first housing (210). In this way, the relative angle between the antenna modules does not change during rotation, which allows the signal strength of signals transmitted between the antenna modules to remain similar regardless of the position of the hinge assembly (340).

[0096] FIG. 4A is a diagram illustrating a first antenna assembly and a first link assembly according to an embodiment. FIG. 4B is a diagram illustrating a first antenna assembly, a first link assembly, and a hinge assembly according to an embodiment. FIG. 4C is an exploded view of the first antenna assembly, the first link assembly, the hinge assembly, and the first housing according to an embodiment. FIGS. 4D and 4E are diagrams illustrating the first antenna assembly, the first link assembly, the hinge assembly, and the first housing according to an embodiment. FIG. 4F is a diagram illustrating the first antenna assembly and the first link assembly according to an embodiment.

[0097] Referring to FIGS. 4A and 4B, according to one embodiment, a first antenna assembly (362) may include a first antenna housing (461), a first antenna module (463), and a first shaft (465). In one embodiment, a first link assembly (382) may include a first link (481), a first rack gear (483), a first pinion gear (485), a second pinion gear (487), and a first bracket (489).

[0098] The first antenna module (463) may be positioned within the first antenna housing (461). A first shaft (465) may be fixedly coupled to the first antenna module (463). The first antenna module (463) may be rotatably coupled to the first antenna housing (461). For example, the first antenna module (463) and / or the first shaft (465) may be coupled to the first antenna housing (461) via a mechanical element, such as a bearing, that supports the first antenna module (463) and / or the first shaft (465) while reducing friction of relative motion with the first antenna housing (461). However, the mechanism for rotatably coupling the first antenna module (463) to the first antenna housing (461) is not limited to the above-described example.

[0099] The first antenna housing (461) may be configured so as not to impede radio wave radiation of the first antenna module (463). For example, at least a portion of the first antenna housing (461) may be formed of a material that is transparent to RF signals. For example, at least a portion of the first antenna housing (461) may be formed to be non-conductive and / or have a low permittivity. For example, the at least a portion of the first antenna housing (461) may include a material (e.g., plastic) that is non-conductive and / or has a low permittivity. As another example, the first antenna housing (461) may be formed with an opening (467) that is aligned with or at least partially overlaps a radiating surface of the first antenna module (463) (e.g., the first surface (710a) of FIG. 7A).

[0100] The first shaft (465) may extend from the first antenna module (463) inside the first antenna housing (461) through the first antenna housing (461) to the outside of the first antenna housing (461). A first pinion gear (485) may be coupled to the first shaft (465). For example, the first pinion gear (485) may be coupled to an end of the first shaft (465) outside the first antenna housing (461). The rotation of the first pinion gear (485) may be coupled with the rotation of the first antenna module (463) through the first shaft (465).

[0101] The first link (481) can be coupled with the hinge assembly (340) and the first rack gear (483). For example, a first end of the first link (481) can be rotatably coupled to the hinge cover (250), and a second end opposite the first end can be rotatably coupled to the first rack gear (483).

[0102] The first rack gear (483) may be coupled with the second pinion gear (487). By linear movement of the first rack gear (483), the second pinion gear (487) may rotate. The second pinion gear (487) may be coupled with the first pinion gear (485). By rotation of the second pinion gear (487), the first pinion gear (485) may rotate in the opposite direction to the second pinion gear (487). Movement of the first rack gear (483) may cause rotation of the first antenna module (463). For example, when the first rack gear (483) moves in the first direction (1) (e.g., +x direction), the first antenna module (463) can rotate in the second direction (2) via the second pinion gear (487), the first pinion gear (485), and the first shaft (465). The second direction (2) can be clockwise when viewed in the -y direction.

[0103] A first pinion gear (485) and a second pinion gear (487) may be positioned inside the first bracket (489). The second pinion gear (487) may be supported by the first bracket (489).

[0104] Referring to FIGS. 4C and 4E, the first antenna assembly (362) and the first link assembly (382) may be disposed in the first housing (210). For example, the first antenna assembly (362) and the first link assembly (382) may be disposed on the first surface (210a) of the first housing (210). For example, the first antenna assembly (362) and the first link assembly (382) may be at least partially accommodated within a recess (412) formed in the first surface (210a) of the first housing (210).

[0105] The first antenna housing (461) of the first antenna assembly (362) may be coupled to the first housing (210). For example, the first antenna assembly (362) may be coupled to the first housing (210) through coupling portions (472, 474) connected to the outer surface of the first antenna housing (461). For example, the first antenna housing (461) may be fixedly disposed to the first housing (210) through members such as screws that penetrate the coupling portions (472, 474) and are fastened to the first housing (210). However, the present invention is not limited thereto, and the first antenna housing (461) may be spaced apart from the first housing (210) or may be rotatably coupled to the first housing (210). In this case, the first antenna module (463) may be configured to rotate together with the first antenna housing (461). This will be described later with reference to Fig. 9.

[0106] Referring to FIGS. 4C, 4D, and 4E, the first rack gear (483) of the first link assembly (382) can be slidably coupled to the first housing (210). For example, the first rack gear (483) can include a feature such as a protrusion (494) formed on a side surface of the first rack gear (483), and the first housing (210) can include a feature such as a groove (496) extending along a movement path of the first rack gear (483) to guide movement of the first rack gear (483) by accommodating the protrusion (494), but is not limited thereto. The first rack gear (483) can slide on the first housing (210) or within a recess (412) of the first housing (210). For example, the first rack gear (483) can move along the folding axis of the electronic device (200) (e.g., the folding axis (F) of FIG. 2A) or a direction perpendicular to the y-axis (e.g., the x-axis direction).

[0107] Referring to FIG. 4c, the first rack gear (483) may be arranged so that its teeth face the first housing (210). For example, the teeth of the first rack gear (483) may be positioned between the teeth root of the first rack gear (483) and the first housing (210). In this case, referring to FIG. 4b, in order for the first antenna module (463) to rotate in the second direction (2) when the first rack gear (483) moves in the first direction (1), one or more gears of the first link assembly (382) coupled between the first rack gear (483) and the first antenna module (463) may be configured with an even number of gears, such as the first pinion gear (485) and the second pinion gear (487). Alternatively, referring to FIG. 4F, the first rack gear (483) may be arranged such that its tooth root faces the first housing (210). For example, the tooth root of the first rack gear (483) may be positioned between the teeth of the first rack gear (483) and the first housing (210). In this case, in order for the first antenna module (463) to rotate in the second direction (2) when the first rack gear (483) moves in the first direction (1), one or more gears of the first link assembly (382) coupled between the first rack gear (483) and the first antenna module (463) may be configured in an odd number, such as the first pinion gear (485).

[0108] FIG. 5 is a diagram illustrating the operation of an antenna assembly and a link mechanism according to one embodiment. FIG. 5 illustrates a third state between the first state in which the electronic device (200) is fully unfolded and the second state in which it is fully folded.

[0109] Referring to FIG. 5, in one embodiment, the first housing (210) may rotate relative to the second housing (220) so that the electronic device (200) changes from the first state to the second state. For example, the first housing (210) may rotate counterclockwise (C1) about at least one first axis parallel to the y-axis.

[0110] By the rotation of the first housing (210), the first link (481) can rotate with respect to the hinge cover (250). For example, the first link (481) can rotate counterclockwise (C1) about an axis parallel to the y-axis. The rotational path (e.g., rotational axis and / or rotational radius) of the first link (481) with respect to the hinge cover (250) can be different from the rotational path of the first housing (210) with respect to the second housing (220). While the first housing (210) rotates, the first link (481) can rotate in a different path from the first housing (210), thereby causing sliding movement of the first rack gear (483). For example, while the first housing (210) rotates counterclockwise (C1), the first rack gear (483) can move in a direction (B1) perpendicular to the rotational axis of the first housing (210) or the first link (481) and toward the hinge cover (250).

[0111] As the first rack gear (483) moves in the direction (B1), the second pinion gear (487) coupled to the first rack gear (483) can rotate counterclockwise, and the first pinion gear (485) coupled to the second pinion gear (487) can rotate clockwise. Accordingly, the first antenna module (463) coupled to the first pinion gear (485) via the first shaft (465) can rotate in the clockwise direction (R1).

[0112] According to one embodiment, the second antenna assembly (364) may include a second antenna housing (561), a second antenna module (563), and a second shaft (565). According to one embodiment, the second link assembly (384) may include a second link (581), a second rack gear (583), a third pinion gear (585), a fourth pinion gear (587), and a second bracket (589).

[0113] The description of the first antenna assembly (362) and the first link assembly (382) described above can be applied to the second antenna assembly (364) and the second link assembly (384) of FIG. 3A in a substantially identical and / or corresponding manner. For example, the second antenna assembly (364) and the second link assembly (384) can be configured symmetrically with respect to the first antenna assembly (362) and the first link assembly (382) with respect to the hinge cover (250).

[0114] For example, the second antenna assembly (364) and the second link assembly (384) may be disposed in the second housing (220). For example, the second antenna assembly (364) and the first link assembly (382) may be at least partially accommodated within a recess (e.g., recess (412) of FIG. 4E) of the second housing (220). For example, the second antenna housing (561) of the second antenna assembly (364) may be fixedly coupled to the second housing (220) or rotatably coupled to the second housing (220).

[0115] For example, the second antenna module (563) may be positioned within the second antenna housing (561). The second antenna module (563) may be configured to rotate together with the second antenna housing (561) or to rotate within the second antenna housing (561).

[0116] For example, the second link (581) may be rotatably coupled to the hinge cover (250) on the opposite side of the first link (481) of the first link assembly (382). For example, the second rack gear (583) may be slidably coupled to the second housing (220). For example, the second rack gear (583) may slide on the second housing (220) or within the recess of the second housing (220).

[0117] In one embodiment, the second housing (220) may rotate relative to the first housing (210) so that the electronic device (200) changes from the first state to the second state. For example, the second housing (220) may rotate clockwise (C2) about at least one second axis parallel to the y-axis.

[0118] By the rotation of the second housing (220), the second link (581) can rotate with respect to the hinge cover (250). For example, the second link (581) can rotate clockwise (C2) about an axis parallel to the y-axis. The rotational path (e.g., rotational axis and / or rotational radius) of the second link (581) with respect to the hinge cover (250) can be different from the rotational path of the second housing (220) with respect to the first housing (210). While the second housing (220) rotates, the second link (581) can rotate in a different path from the second housing (220), thereby causing sliding movement of the second rack gear (583). For example, while the second housing (220) rotates clockwise (C2), the second rack gear (583) can move in a direction (B2) perpendicular to the rotational axis of the second housing (220) or the second link (581) and toward the hinge cover (250).

[0119] As the second rack gear (583) moves in the direction (B2), the fourth pinion gear (587) coupled to the second rack gear (583) can rotate clockwise, and the third pinion gear (585) coupled to the fourth pinion gear (587) can rotate counterclockwise. Accordingly, the second antenna module (563) coupled to the third pinion gear (585) via the second shaft (565) can rotate counterclockwise (R2).

[0120] FIG. 6A illustrates an electronic device in a first state, according to one embodiment. FIG. 6B illustrates an electronic device in a third state, according to one embodiment. FIG. 6C illustrates an electronic device in a second state, according to one embodiment.

[0121] Referring to FIGS. 6A, 6B, and 6C, in one embodiment, the first link assembly (382) can rotate the first antenna module (463) so that the first antenna module (463) faces the second antenna module (563) while the first housing (210) rotates relative to the second housing (220). Accordingly, the first antenna module (463) can face the second antenna module (563) regardless of the state of the electronic device (200) or the arrangement of the first housing (210) and the second housing (220) accordingly. For example, the radiating surface (463a) of the first antenna module (463) (e.g., the first surface (710a) of FIG. 7A) can face the second antenna module (563) regardless of the state of the electronic device (200). For example, regardless of the state of the electronic device (200), the radiation pattern or main beam of the first antenna module (463) may be directed toward the second antenna module (563).

[0122] According to one embodiment, the second link assembly (384) can rotate the second antenna module (563) so that the second antenna module (563) faces the first antenna module (463) while the second housing (220) rotates relative to the first housing (210). Accordingly, the second antenna module (563) can face the first antenna module (463) regardless of the state of the electronic device (200) or the arrangement of the first housing (210) and the second housing (220) accordingly. For example, the radiating surface (563a) of the second antenna module (563) (e.g., the first surface (710a) of FIG. 7A) can face the first antenna module (463) regardless of the state of the electronic device (200). For example, regardless of the state of the electronic device (200), the radiation pattern or main beam of the second antenna module (563) may be directed toward the first antenna module (463).

[0123] While the state of the electronic device (200) changes, the alignment relationship between the first antenna module (463) and the second antenna module (563) can be maintained substantially the same by the first link assembly (382) and the second link assembly (384). Accordingly, it is possible to prevent the wireless communication environment between the first antenna module (463) and the second antenna module (563) from changing due to the state change of the electronic device (200).

[0124] The first link assembly (382) and / or the second link assembly (384) may be referred to as a rotating assembly, a rotating device, a link device, a connecting assembly, a connecting device, or a connecting mechanism.

[0125] Fig. 7a is a drawing showing a top surface of an antenna module according to one embodiment, Fig. 7b is a drawing showing a rear surface of an antenna module according to one embodiment, and Fig. 7c is a drawing showing a cross-section of an antenna module according to one embodiment. Fig. 7c shows a cross-section of the antenna module (700) of Fig. 7a taken along line A-A'.

[0126] Referring to FIGS. 7A, 7B, and 7C, in one embodiment, the antenna module (700) may include a printed circuit board (710), an antenna array (730), a radio frequency integrate circuit (RFIC) (752), a power manage integrate circuit (PMIC) (754), or a module interface (not shown). Optionally, the antenna module (700) may further include a shielding member (790). In one embodiment, at least one of the components included in the antenna module (700) may be omitted, or at least two of the components included in the antenna module (700) may be formed integrally. In one embodiment, the antenna module (700) may be identical to the first antenna module (463) and / or the second antenna module (563 / ).

[0127] A printed circuit board (710) may include a plurality of conductive layers and a plurality of non-conductive layers alternately laminated with the conductive layers. The printed circuit board (710) may provide electrical connections between various electronic components arranged on the printed circuit board (710) and / or externally using wires and conductive vias formed on the conductive layers.

[0128] The antenna array (730) may include a plurality of antenna elements (732, 734, 736, or 738) arranged to form a directional beam. The antenna elements may be formed on a first surface (710a) of a printed circuit board (710), as illustrated. In another embodiment, the antenna array (730) may be formed within the printed circuit board (710). In embodiments, the antenna array (730) may include a plurality of antenna arrays of the same or different shapes and / or the same or different types (e.g., a dipole antenna array and / or a patch antenna array).

[0129] The RFIC (752) may be disposed on another area of ​​the printed circuit board (710) spaced apart from the antenna array (e.g., a second side (710b) opposite the first side (710a)). The RFIC may be configured to process a signal of a selected frequency band transmitted and / or received through the antenna array (730). According to one embodiment, the RFIC (752) may, upon transmission, convert a baseband signal obtained from a communication processor into an RF signal of a designated frequency band. Upon reception, the RFIC (752) may convert an RF signal received through the antenna array (730) into a baseband signal and transmit the converted signal to the communication processor.

[0130] According to another embodiment, the RFIC (752) may, upon transmission, convert an IF signal (e.g., about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrated circuitry (IFIC) into an RF signal of a selected frequency band. Upon reception, the RFIC (752) may convert an RF signal obtained through an antenna array (730) into an IF signal and transmit the converted signal to the IFIC. The IFIC may be included in a wireless communication circuit of an electronic device (e.g., a wireless communication module (192) of FIG. 1).

[0131] The PMIC (754) may be placed on another area (e.g., the second side (710b)) of the printed circuit board (710) that is spaced apart from the antenna array (730). The PMIC (754) may receive voltage from the main PCB (not shown) and provide power required for various components (e.g., RFIC (752)) on the antenna module.

[0132] A shielding member (790) may be disposed on a portion of the printed circuit board (710) (e.g., the second side (710b)) to electromagnetically shield at least one of the RFIC (752) or the PMIC (754). In one embodiment, the shielding member (790) may include a shield can.

[0133] Although not shown, in various embodiments, the antenna module (700) may be electrically connected to another printed circuit board (e.g., a main PCB) via a module interface (e.g., a connecting member (1050) of FIG. 10A). The module interface may include a connecting member, for example, a coaxial cable connector, a board to board connector, an interposer, and / or a flexible printed circuit board (FPCB). Through the connecting member, the RFIC (752) and / or PMIC (754) of the antenna module (700) may be electrically connected to the other printed circuit board.

[0134] Fig. 8 illustrates a cross-section of the antenna module (700) of Fig. 7a along line B-B'. The printed circuit board (710) of the illustrated embodiment may include an antenna layer (811) and a network layer (813).

[0135] The antenna layer (811) may include at least one dielectric layer (837-1), and an antenna element (736) and / or a feed portion (825) formed on or inside an outer surface of the dielectric layer (837-1). The feed portion (825) may include, for example, a feed point (827) and / or a feed line (829). At least one dielectric layer (837-1) may be a non-conductive layer. In FIG. 8, the antenna element (736) is described as being disposed inside the printed circuit board (710), but is not limited thereto. The antenna element (736) may be formed to be disposed on an outer surface of the dielectric layer (837-1) and to protrude at least a portion thereof from the printed circuit board (710).

[0136] The network layer (813) may include at least one dielectric layer (837-2), at least one ground layer (833) formed on or within an outer surface of the dielectric layer (837-2), at least one conductive via (835), a transmission line (823), and / or a signal line (828). At least one dielectric layer (837-2) may be a non-conductive layer.

[0137] Additionally, in the illustrated embodiment, the RFIC (752) may be electrically connected to the network layer (813) via, for example, a first connection (e.g., a solder bump) (840-1) and a second connection (e.g., a solder bump) (840-2). In other embodiments, various connection structures (e.g., solder or BGA) may be used instead of the connection. The RFIC (752) may be electrically connected to the antenna element (736) via the first connection (840-1), the transmission line (823), and the feeder (825). The RFIC (752) may also be electrically connected to the ground layer (833) via the second connection (840-2) and the conductive via (835). Although not shown, the RFIC (752) may also be electrically connected to the above-mentioned module interface via the signal line (829). In FIG. 8, the ground layer (833) is described as being positioned below the antenna layer (811) while forming a portion of the surface of the network layer (813), but the position of the ground layer (833) is not limited thereto, and the ground layer (833) may be positioned on another layer within the printed circuit board (710).

[0138] FIG. 9 is a drawing showing a first antenna assembly, a first link assembly, a hinge assembly, and a first housing according to one embodiment.

[0139] Referring to FIG. 9, the first antenna housing (461) of the first antenna assembly (362) can be spaced apart from the first support member (2131) of the first housing (210). The first antenna housing (461) can rotate together with the first antenna module (463) via the first link assembly (382). For example, the first antenna housing (461) can be fixedly coupled to the first antenna module (463) and / or the first shaft (465) so as to be linked to the rotation of the first pinion gear (485).

[0140] In one embodiment, the first antenna assembly (362) may further include a support bracket (969) disposed on the first housing (210). The support bracket (969) may be fixedly disposed on the first support member (2131) of the first housing (210). For example, the support bracket (969) may be coupled to the first support member (2131) via a fastening member, such as a screw.

[0141] The support bracket (969) may be spaced apart from the first antenna housing (461), and the first link assembly (382) may be at least partially positioned therebetween. For example, the first rack gear (483) and the first pinion gear (485) of the first link assembly (382) may be positioned between the support bracket (969) and the first antenna housing (461).

[0142] The first shaft (465) may extend from the first antenna module (463) through the first pinion gear (485) to the interior of the support bracket (969). A first end (4651) of the first shaft (465) may be fixedly coupled to the first antenna module (463), and a second end (4652) may be rotatably coupled to the support bracket (969). The first antenna housing (461) may be supported by the support bracket (969) and the first shaft (465) coupled thereto, even if spaced apart from the first housing (210).

[0143] The description of the first antenna assembly (362) and the first link assembly (382) provided with reference to FIG. 9 may be applied in a substantially identical and / or corresponding manner to the second antenna assembly (364) and the second link assembly (384) of FIG. 3A. For example, the second antenna assembly (364) and the second link assembly (384) may be configured symmetrically with respect to the first antenna assembly (362) and the first link assembly (382) with respect to the hinge cover (250).

[0144] FIGS. 10A and 10B are drawings showing an electronic device including a connecting member of an antenna module according to one embodiment.

[0145] Referring to FIGS. 10A and 10B, an electronic device (200) according to an embodiment may include a first connecting member (1050). The first connecting member (1050) may extend from a first substrate (352) through a first antenna housing (461) to a first antenna module (463). Through the first connecting member (1050), a wireless communication circuit (e.g., the first wireless communication circuit (322) of FIG. 3B) disposed on the first substrate (352) and the first antenna module (463) may be electrically connected.

[0146] The first connecting member (1050) may include, for example, a flexible printed circuit board or a cable (e.g., a coaxial cable or a flexible RF cable (FRC)). It may be configured to accommodate a change in length due to rotation of the first antenna module (463). For example, the first connecting member (1050) may include a first portion (1052) connected to the first substrate (352), a second portion (1054) connected to the first antenna module (463), and a third portion (1056) extending from the first portion (1052) to the second portion (1054) and configured to deform in accordance with rotation of the first antenna module (463). The third portion (1056) may be positioned within a recess (1010) formed within the first housing (210). The third portion (1056) may extend along the periphery of the first antenna housing (461). The third portion (1056) may optionally, but is not limited to, contact the first antenna housing (461) during rotation of the first antenna module (463).

[0147] Although not shown, the electronic device (200) may include a second connecting member for electrically connecting the second antenna module (563) and the second substrate (354). The description of the first connecting member (1050) described above may be applied to the second connecting member in a substantially identical or corresponding manner.

[0148] FIGS. 11A and 11B are drawings showing an electronic device in a fully unfolded first state according to one embodiment. FIGS. 11C and 11D are drawings showing a hinge cover of a hinge assembly according to one embodiment.

[0149] Referring to FIGS. 11A and 11B, in the first state where the electronic device (200) is fully unfolded, the first housing (210) may include a portion (1112) that overlaps the first antenna module (463) and the second antenna module (563). For example, in the first state, the portion (1112) of the first housing (210) may overlap the first antenna module (463) and the second antenna module (563) with respect to one direction (e.g., the x-axis). For example, a virtual path (A) passing through the first antenna module (463) and the second antenna module (563) may pass through the portion (1112) of the first housing (210).

[0150] In the first state, the second housing (220) may include a portion (1122) that overlaps the first antenna module (463) and the second antenna module (563). For example, in the first state, the portion (1122) of the second housing (220) may overlap the first antenna module (463) and the second antenna module (563) with respect to one direction (e.g., the x-axis). For example, a virtual path (A) passing through the first antenna module (463) and the second antenna module (563) may pass through the portion (1122) of the second housing (220).

[0151] In the first state, the hinge cover (250) of the hinge assembly (340) may include a portion (1152) that overlaps the first antenna module (463) and the second antenna module (563). For example, in the first state, the portion (1152) of the hinge cover (250) may overlap the first antenna module (463) and the second antenna module (563) with respect to one direction (e.g., the x-axis). For example, a virtual path (A) passing through the first antenna module (463) and the second antenna module (563) may pass through the portion (1152) of the hinge cover (250).

[0152] Portions (1112) of the first housing (210), (1122) of the second housing (220), and (1152) of the hinge cover (250) may be formed to be non-conductive and / or have a low permittivity so that RF signals transmitted from the first antenna module (463) and the second antenna module (563) may be transmitted therethrough. Portions (1112) of the first housing (210), (1122) of the second housing (220), and (1152) of the hinge cover (250) may be formed of a material (e.g., plastic) that is non-conductive and / or has a low permittivity.

[0153] Referring to FIGS. 11c and 11d, the hinge cover (250) may include an inner surface (250a) facing the inside of the electronic device (200) and an outer surface (250b) opposite the inner surface (250a) facing the outside of the electronic device (200).

[0154] A portion (1152) of a hinge cover (250) may include a first section (1161), a second section (1162), and a third section (1163) between the first section (1161) and the second section (1162), arranged along a virtual path (A) (e.g., the x-axis). The third section (1163) may partially form an inner surface (250a) of the hinge cover (250), and the first section (1161) and the second section (1162) may partially form an outer surface (250b) of the hinge cover (250).

[0155] FIG. 12A illustrates an electronic device in a first, fully unfolded state, according to one embodiment. FIG. 12B illustrates a back surface of a display, according to one embodiment. FIG. 12C illustrates an electronic device in a third, intermediate state, according to one embodiment. FIG. 12D illustrates an electronic device in a second, fully folded state, according to one embodiment.

[0156] Referring to FIGS. 12A and 12B , an electronic device (200) according to an embodiment may include a display (1230) (e.g., the display (230) of FIG. 2A ). The display (1230) may include a display panel (1231) and layers (1232) disposed under the display panel (1231). The front surface (1230a) of the display (1230) may be formed by the display panel (1231), and the back surface (1230b) may be formed by at least some of the second layers (1230). The display panel (1231) may include pixels configured to emit light.

[0157] The layers (1232) may include one or more layers formed of resin, metal, composite material, or a combination thereof. For example, the layers (1232) may include a first protective layer disposed under the display panel (1231), a support layer disposed under the first protective layer, a second protective layer disposed under the support layer, and a shielding layer disposed under the second protective layer. For example, the first protective layer may include a resin such as polyimide. For example, the support layer may include a plate formed of a metal such as stainless steel or a plastic such as carbon fiber reinforced plastic to have rigidity capable of supporting the display panel (1231). In addition, the support layer may include a region in which a plurality of openings or slits corresponding to a flexible section of the display (1230) (e.g., the third region (230c) of FIG. 2A) are formed to facilitate folding of the flexible display panel (1231) according to a change in the state of the electronic device (200). For example, the second protective layer may be formed from a resin material such as thermoplastic polyurethane (TPU). The shielding layer may include a plate formed of a metal such as copper or a copper alloy to shield electromagnetic interference (EMI) with the display (1230) and / or disperse heat of the display (1230). However, the configuration of the layers (1232) is not limited to the above-described example.

[0158] In one embodiment, the display (1230) may include an area (1235) that includes a portion (1234) of the display panel (1231) and / or a portion (1233) of the layers (1232).

[0159] In one embodiment, a portion (1234) of the display panel (1231) may have a lower pixel density and / or wiring density than a peripheral portion (1236) of the portion (1234).

[0160] In one embodiment, portions (1233) of layers (1232) may be formed of a material that is transparent to RF signals. For example, portions (1233) of layers (1232) may be formed to be non-conductive and / or have a low permittivity. Alternatively or optionally, at least a portion of portions (1233) may be opened through the back surface (1230b) of display (1230), or a hole may be formed within portions (1233) that partially penetrate the display (1230).

[0161] While the electronic device (200) is in the first state in which it is fully unfolded, an area (1235) of the display (1230) may at least partially overlap the first antenna assembly (362) and at least partially overlap the second antenna assembly (364). For example, within the first state, with respect to a direction perpendicular to the display (1230) (e.g., the z-axis direction), the area (1235) of the display (1230) may partially overlap the first antenna assembly (362) and may partially overlap the second antenna assembly (364).

[0162] For example, an area (1235) of a display (1230) may include a first section (1241) overlapping a first antenna assembly (362), a second section (1242) overlapping a second antenna assembly (364), and a third section (1243) extending from the first section (1241) to the second section (1242).

[0163] Referring to FIG. 12C, while the electronic device (200) is in the third state, an area (1235) of the display (1230) may overlap the first antenna module (463) and the second antenna module (563) (e.g., based on the x-axis direction). For example, in the third state, a virtual path (A1) passing through the first antenna module (463) and the second antenna module (563) may pass through the area (1235) of the display (1230). Accordingly, in the third state, the influence of the layers (1232) on the wireless communication performance of the first antenna module (463) and the second antenna module (563) may be reduced.

[0164] Referring to FIG. 12D, while the electronic device (200) is in the second state, an area (1235) of the display (1230) may overlap the first antenna module (463) and the second antenna module (563) (e.g., based on the x-axis direction). For example, in the second state, a virtual path (A2) passing through the first antenna module (463) and the second antenna module (563) may pass through the area (1235) of the display (1230). Accordingly, in the second state, the influence of the layers (1232) on the wireless communication performance of the first antenna module (463) and the second antenna module (563) may be reduced.

[0165] FIGS. 13 and 14 are block diagrams of an electronic device according to one embodiment.

[0166] Referring to FIG. 13, an electronic device (200) according to an embodiment may include a processor (1310), a first SerDes (1330), and a first modem (1320) disposed on a first substrate (352) within a first housing (210). In an embodiment, the electronic device (200) may include a second modem (1322), a second SerDes (1332), a display (1340), a touch sensor (1350), a camera (1360), a sensor (1370), and a speaker (1380) disposed within a second housing (220). The second modem (1322) and the second SerDes (1332) may be disposed on a second substrate (354) within the second housing (220).

[0167] The processor (1310) may be an example of the processor (120) of FIG. 1. The processor (1310) may be operatively coupled or communicatively coupled with a first SerDes (1330), a first modem (1320), a second modem (1322), a second SerDes (1332), a display (1340), a touch sensor (1350), a camera (1360), a sensor (1370), and a speaker (1380).

[0168] The first SerDes (1330) and the second SerDes (1332) may include circuits for aggregating and disaggregating input signals. For example, the first SerDes (1330) and the second SerDes (1332) may convert a plurality of signals (e.g., a parallel signal) into a single signal (e.g., a serial signal) or convert a single signal into a plurality of signals. The first SerDes (1330) or the second SerDes (1332) may be referred to as a SerDes integrated circuitry (IC) or an aggregation / disaggregation IC.

[0169] Each of the first modem (1320) and the second modem (1322) may be an example of the wireless communication module (192) of FIG. 1. The first modem (1320) and the second modem (1322) may be configured to enable wireless communication with each other.

[0170] For example, the first modem (1320) may include a first communication processor. The first communication processor may establish a wireless communication channel with the second modem (1322) through the first antenna module (463) and support wireless communication through the established communication channel. The first modem (1320) may further include a first IFIC. In this case, the first IFIC may convert a baseband signal generated by the first communication processor into an RF signal (hereinafter, referred to as an IF signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the converted signal to the first antenna module (463). For example, the first IFIC may transmit the IF signal to the RFIC (e.g., the RFIC (752) of FIG. 8) of the first antenna module (463). The first modem (1320) may transmit an RF signal through the first antenna module (463). An RF signal received from the second modem (1322) via the first antenna module (463) may be converted into an IF signal by the RFIC of the first antenna module (463). The IFIC of the first modem (1320) may convert the IF signal into a baseband signal so that the first communication processor can process it. Alternatively or selectively, the IFIC of the first modem (1320) may be omitted or may be included in the RFIC of the first antenna module (463) as a part of the RFIC.

[0171] For example, the second modem (1322) may include a second communication processor. The second communication processor may establish a wireless communication channel with the first modem (1320) through the second antenna module (563) and support wireless communication through the established communication channel. The second modem (1322) may further include a second IFIC. In this case, the second IFIC may convert a baseband signal generated by the second communication processor into an IF signal and then transmit the converted signal to the second antenna module (563). For example, the second IFIC may transmit the IF signal to the RFIC of the second antenna module (563) (e.g., the RFIC (752) of FIG. 8). The second modem (1322) may transmit an RF signal through the second antenna module (563). An RF signal received from the first modem (1320) via the second antenna module (563) may be converted into an IF signal by the RFIC of the second antenna module (563). The IFIC of the second modem (1322) may convert the IF signal into a baseband signal so that the second communication processor can process it. Alternatively or optionally, the IFIC of the second modem (1322) may be omitted or may be included in the RFIC of the second antenna module (563) as a part of the RFIC.

[0172] For wireless communication between the first modem (1320) and the second modem (1322), RF signals of the 60 GHz band (e.g., 57 GHz to 66 GHz) may be used, but are not limited thereto.

[0173] Optionally, at least two of the first processor (1310), the first modem (1320), and the first SerDes (1330) may be integrated with each other. For example, at least two of the first processor (1310), the first modem (1320), and the first SerDes (1330) may be implemented as a single chip or at least a portion of a single package. Optionally, the second modem (1322) and the second SerDes (1332) may be integrated with each other. For example, the second modem (1322) and the second SerDes (1332) may be implemented as a single chip or at least a portion of a single package.

[0174] In one embodiment, the processor (1310) may transmit and receive signals related to at least one of a plurality of components disposed within the second housing (220), such as a display (1340), a touch sensor (1350), a camera (1360), a sensor (1370), and a speaker (1380), using the first modem (1320) and the second modem (1322). For example, the processor (1310) may transmit and receive signals related to the plurality of components disposed within the second housing (220) through the first antenna module (463) and the second antenna module (563). For example, the signals related to the plurality of components may include various signals such as a control signal, a driving signal, data (or a signal including data), and a timing signal.

[0175] For example, the processor (1310) may transmit signals related to the plurality of components to the first SerDes (1330). The first SerDes (1330) may convert baseband signals related to the plurality of components into a single signal and transmit the converted signal to the first modem (1320). The first modem (1320) may transmit an RF signal modulated based on the signal transmitted from the first SerDes (1330) through the first antenna module (463). The second modem (1322) may receive the RF signal from the first modem (1320) using the second antenna module (563). The second modem (1322) may demodulate the received RF signal and transmit it to the second SerDes (1332). The second SerDes (1332) can convert a signal transmitted from the second modem (1322) into a plurality of signals and transmit the converted signals to the plurality of components.

[0176] For example, the second SerDes (1332) can receive signals related to the plurality of components and convert them into a single signal. The second SerDes (1332) can transmit the converted single signal to the second modem (1322). The second modem (1322) can transmit an RF signal modulated based on the single signal transmitted from the second SerDes (1332) through the second antenna module (563). The first modem (1320) can receive the RF signal from the second modem (1322) using the first antenna module (463). The first modem (1320) can demodulate the received RF signal and transmit it to the first SerDes (1330). The first SerDes (1330) can convert the single signal transmitted from the first modem (1320) into a plurality of signals and transmit them to the processor (1310).

[0177] A skilled artisan understands that the various components shown as part of the electronic device (200) in FIG. 13 are merely one embodiment. Other components may be present, and some components may be absent. A skilled person will appreciate that in FIG. 13, one housing (210) may include a processor (1310) and a first wireless communication function (e.g., a first modem (1320), a first SerDes (1330), and a first antenna module (463)), and another housing (220) may include a second wireless communication function (e.g., a second modem (1322), a second SerDes (1332), and a second antenna module (563)) and one or more components (e.g., a display (1340), a touch sensor (1350), a camera (1360), a sensor (1370), and / or a speaker (1380)), which one or more components may be controlled by the processor (1310) and / or may provide data to the processor (1310).

[0178] Accordingly, the processor (1310) may be configured to communicate with the component via wireless communication signal exchange between the first and second wireless communication functions. For example, the processor (1310) may send a signal to the component via the first wireless communication function and the second wireless communication function. The first wireless communication function transmits a signal, and the second wireless communication function receives a signal. In another example, the component may send a signal to the processor via the second wireless communication function and the first wireless communication function. The first wireless communication function receives a signal transmitted by the second wireless communication function.

[0179] Referring to FIG. 14, an electronic device (200) according to an embodiment may further include a first PMIC (1410), a first battery (1420), and a third antenna module (1463) disposed within a first housing (210), compared to FIG. 13. The electronic device (200) may further include a second PMIC (1412), a second battery (1422), and a fourth antenna module (1473) disposed within a second housing (220). Each of the first PMIC (1410) and the second PMIC (1412) may be an example of the power management module (188) of FIG. 1. Each of the first battery (1420) and the second battery (1422) may be an example of the battery (189) of FIG. 1. The first battery (1420) may be an example of the first battery (392) of FIG. 3B. The second battery (1422) may be an example of the second battery (394) of FIG. 3B.

[0180] The processor (1310) may be operatively coupled or communicatively coupled with a first PMIC (1410), a first battery (1420), a third antenna module (1463), a second PMIC (1412), a second battery (1422), and a fourth antenna module (1473).

[0181] Although not shown, the electronic device (200) may further include a third antenna assembly (e.g., the first antenna assembly (362) of FIG. 3A) including a third antenna module (1463) and a third link assembly (e.g., the first link assembly (382) of FIG. 3A) configured to rotate the third antenna module (1463) while the first housing (210) rotates.

[0182] Although not shown, the electronic device (200) may further include a fourth antenna assembly (e.g., the second antenna assembly (364) of FIG. 3A) including a fourth antenna module (1473) and a fourth link assembly (e.g., the second link assembly (384) of FIG. 3A) configured to rotate the fourth antenna module (1473) while the second housing (220) rotates.

[0183] In one embodiment, the third antenna module (1463) and the fourth antenna module (1473) may be configured to enable wireless power transmission. For example, each of the third antenna module (1463) and the fourth antenna module (1473) may include an antenna element for transmitting or receiving wireless power according to a magnetic induction method or a magnetic resonance method.

[0184] The third link assembly can rotate the third antenna module (1463) such that the antenna element of the third antenna module (1463) faces the fourth antenna module (1473) while the first housing (210) rotates relative to the second housing (220). The fourth link assembly can rotate the fourth antenna module (1473) such that the antenna element of the fourth antenna module (1473) faces the third antenna module (1463) while the second housing (220) rotates relative to the first housing (210).

[0185] The first PMIC (1410) can convert power stored in the first battery (1420) to provide power required for the operation of various components (e.g., processor (1310)) within the first housing (210). The second PMIC (1412) can convert power stored in the second battery (1422) to provide power required for the operation of various components (e.g., display (1340), touch sensor (1350), camera (1360), sensor (1370), and speaker (1380)) within the second housing (220).

[0186] In one embodiment, the processor (1310) can transmit and receive power signals between components within the first housing (210) and components within the second housing (220) using the third antenna module (1463) and the fourth antenna module (1473).

[0187] For example, the first PMIC (1410) can convert power stored in the first battery (1420) and transmit it to the third antenna module (1463). The third antenna module (1463) can transmit the power signal transmitted from the first PMIC (1410) to the fourth antenna module (1473). The fourth antenna module (1473) can transmit the power signal received from the third antenna module (1463) to the second PMIC (1412). The second PMIC (1412) can transmit the power signal received from the fourth antenna module (1473) to various components within the second housing (220). For example, the second PMIC (1412) may provide power required for the operation of the display (1340), the touch sensor (1350), the camera (1360), the sensor (1370), and the speaker (1380) based on a power signal received from the fourth antenna module (1473). For example, the second PMIC (1412) may convert a power signal received from the fourth antenna module (1473) and provide it to the second battery (1422) for charging the second battery (1422).

[0188] For example, the second PMIC (1412) can convert power stored in the second battery (1422) and transmit it to the fourth antenna module (1473). The fourth antenna module (1473) can transmit the power signal transmitted from the second PMIC (1412) to the third antenna module (1463). The third antenna module (1463) can transmit the power signal received from the fourth antenna module (1473) to the first PMIC (1410). The first PMIC (1410) can transmit the power signal received from the third antenna module (1463) to various components within the first housing (210). For example, the first PMIC (1410) can provide power required for the operation of the processor (1310) based on the power signal received from the third antenna module (1463). For example, the first PMIC (1410) may convert a power signal received from the third antenna module (1463) and provide it to the first battery (1420) for charging the first battery (1420).

[0189] In a comparative example, signals may be transmitted between components of the first housing (210) and components of the second housing (220) by using connecting members (e.g., a flexible circuit board) that extend from the first housing (210) across the hinge assembly (e.g., the hinge assembly (340) of FIG. 3A) to the second housing (220). However, mounting such connecting members within the electronic device (200) may require a complex structure and may make assembly and disassembly difficult. Furthermore, the connecting members between the first housing (210) and the second housing (220) may be damaged due to external impacts to the electronic device (200), etc. Furthermore, requirements for the connecting members may limit how components are distributed between the first housing (210) and the second housing (220). An electronic device (200) according to one embodiment may not include a connecting member extending across the hinge assembly, as in the comparative example. The electronic device (200) may transmit signals between components within the first housing (210) and components within the second housing (220) via wireless communication using the first antenna module (463) and the second antenna module (563). Accordingly, the problem of the comparative example described above may be solved.

[0190] In addition, by rotating the first antenna module (463) and the second antenna module (563) to face each other even when the electronic device (200) is folded or unfolded, the change in communication performance between the first antenna module (463) and the second antenna module (563) depending on the state of the electronic device (200) can be reduced. That is, regardless of whether the device is folded or not, the first antenna module (463) and the second antenna module (563) can be oriented in the same way with respect to each other, thereby enabling consistent communication performance between the housings.

[0191] In addition, by rotating the third antenna module (1463) and the fourth antenna module (1473) to face each other even when the electronic device (200) is folded or unfolded, the change in communication performance between the third antenna module (1463) and the fourth antenna module (1473) depending on the state of the electronic device (200) can be reduced. That is, regardless of whether the device is folded or not, the third antenna module (1463) and the fourth antenna module (1473) can be oriented in the same way with respect to each other, enabling efficient power transmission between the housings in the folded or unfolded state.

[0192] Fig. 15 is a graph showing the voltage standing wave ratio (VSWR) of an antenna module according to one embodiment. Fig. 15 shows the VSWR of an antenna module (e.g., the first antenna module (463) and the second antenna module (563) of Fig. 5) whose resonant frequency is set to 60 GHz. Referring to Fig. 15, the VSWR of the antenna module may be about 1.2:1 at 60 GHz. Although not shown, the peak radiation efficiency of the antenna module may be about -3 dB.

[0193] Fig. 16a is a graph showing the S parameter (S21) of the antenna module of the electronic device in a folded state according to one embodiment. Fig. 16b is a graph showing the voltage standing wave ratio (VSW) of the antenna module of the electronic device in a folded state according to one embodiment. Figs. 16a and 16b show the S parameter (S21) and VSW when the antenna module of Fig. 15 is applied to the first antenna module (463) and the second antenna module (563) of the electronic device (200) in the second state of Fig. 6c.

[0194] Referring to FIG. 16a, within the second state, the S parameter (S21) of the antenna module of the electronic device (200) may be approximately -14 dB. Referring to FIG. 16b, within the second state, the voltage standing wave ratio of the antenna module of the electronic device (200) may be approximately 1.7:1.

[0195] Fig. 17a is a graph showing the S parameter (S21) of the antenna module of the electronic device in an unfolded state according to one embodiment. Fig. 17b is a graph showing the voltage standing wave ratio of the antenna module of the electronic device in an unfolded state according to one embodiment. Figs. 17a and 17b show the S parameter (S21) and the voltage standing wave ratio when the antenna module of Fig. 15 is applied to the first antenna module (463) and the second antenna module (563) of the electronic device (200) in the first state of Fig. 6a.

[0196] Referring to FIG. 17a, within the first state, the S parameter (S21) of the antenna module of the electronic device (200) may be approximately -17 dB. Referring to FIG. 17b, within the first state, the voltage standing wave ratio of the antenna module of the electronic device (200) may be approximately 2.1:1.

[0197] For a wireless communication module in the 60 GHz band, the required reception sensitivity (Rx sensitivity) may be about -25 dBm, and the output power may be about 0 dBm. As illustrated in FIGS. 16A, 16B, 17A, and 17B, in the first state and the second state of the electronic device (200), the characteristics of the antenna module may be maintained to be substantially the same or similar. In addition, even in the first state where the distance between the antenna modules is the farthest, the S parameter (S21) value of the antenna module may be -17 dB, which may be a level that does not cause any difficulty in restoring a signal at the receiving end.

[0198] FIG. 18A illustrates an electronic device in an unfolded state according to one embodiment. FIG. 18B illustrates an electronic device in a folded state according to one embodiment.

[0199] Referring to FIGS. 18A and 18B , an electronic device (1800) according to an embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 13 ) may include a first housing (1810) (e.g., the first housing (210) of FIG. 3A ), a second housing (1820) (e.g., the second housing (220) of FIG. 3A ), and a third housing (1830) (e.g., the second housing (220) of FIG. 3A ), a first hinge assembly (1850) (e.g., the hinge assembly (340) of FIG. 3A ), and a second hinge assembly (1860) (e.g., the hinge assembly (340) of FIG. 3A ). In one embodiment, the electronic device (1800) may include a camera module (1870) (e.g., the second camera module (208) of FIG. 2B) disposed within a first housing (1810) and exposed through one surface of the first housing (1810) and a display (1880) (e.g., the second display (231) of FIG. 2B) disposed within a second housing (1820) so as to be visible from the outside.

[0200] In one embodiment, the electronic device (1800) may include a first antenna module (1812) and a second antenna module (1814) disposed within a first housing (1810), a third antenna module (1822) disposed within a second housing (1820), and a fourth antenna module (1832) disposed within a third housing (1830). The first antenna module (1812) may be positioned adjacent to the second housing (1820), and the third antenna module (1822) may be positioned adjacent to the first housing (1810). The first antenna module (1812) and the third antenna module (1822) may be positioned to face each other. The second antenna module (1814) may be positioned adjacent to the third housing (1830), and the fourth antenna module (1832) may be positioned adjacent to the first housing (1810). The second antenna module (1814) and the fourth antenna module (1832) may be positioned to face each other.

[0201] Referring to FIG. 18A, when the electronic device (1800) is in an unfolded state (e.g., the first state), the first housing (1810) may be disposed between the second housing (1820) and the third housing (1830). The second housing (1820) may be rotatably coupled to one side of the first housing (1810) via a first hinge assembly (1850), and the third housing (1830) may be rotatably coupled to the other side of the first housing (1810) via a second hinge assembly (1860).

[0202] Referring to FIG. 18b, when the electronic device (1800) is in a folded state (e.g., the second state), the second housing (1820) can be placed over the first housing (1810), and the third housing (1830) can be placed over the second housing (1820).

[0203] Although not shown, the electronic device (1800) may include link assemblies (e.g., the first link assembly (382) or the second link assembly (384) of FIG. 3A) configured to rotate the antenna modules (1812, 1814, 1822, 1832), respectively. Accordingly, while the first housing (1810) rotates relative to the second housing (1820), the first antenna module (1812) may rotate toward the third antenna module (1822). While the first housing (1810) rotates relative to the third housing (1830), the second antenna module (1814) may rotate toward the fourth antenna module (1832). While the second housing (1820) rotates relative to the first housing (1810), the third antenna module (1822) can rotate toward the first antenna module (1812). While the third housing (1830) rotates relative to the first housing (1810), the fourth antenna module (1832) can rotate toward the second antenna module (1814).

[0204] FIG. 19A illustrates an electronic device in an unfolded state according to one embodiment. FIG. 19B illustrates an electronic device in a folded state according to one embodiment.

[0205] Referring to FIGS. 19A and 19B , an electronic device (1900) according to an embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 13 ) may include a first housing (1910) (e.g., the first housing (210) of FIG. 3A ), a second housing (1920) (e.g., the second housing (220) of FIG. 3A ), and a third housing (1930) (e.g., the second housing (220) of FIG. 3A ), a first hinge assembly (1950) (e.g., the hinge assembly (340) of FIG. 3A ), and a second hinge assembly (1960) (e.g., the hinge assembly (340) of FIG. 3A ). In one embodiment, the electronic device (1900) may include a camera module (1970) (e.g., the second camera module (208) of FIG. 2B) disposed within a first housing (1910) and exposed through the first housing (1910) and a display (1980) (e.g., the second display (231) of FIG. 2B) disposed within a second housing (1920) so as to be visible from the outside.

[0206] In one embodiment, the electronic device (1900) may include a first antenna module (1912) disposed within a first housing (1910), a second antenna module (1922) and a third antenna module (1924) disposed within a second housing (1920), and a fourth antenna module (1932) disposed within a third housing (1930). The first antenna module (1912) may be positioned adjacent to the second housing (1920), and the second antenna module (1922) may be positioned adjacent to the first housing (1910). The first antenna module (1912) and the second antenna module (1922) may be positioned to face each other. The third antenna module (1924) may be positioned adjacent to the third housing (1930), and the fourth antenna module (1932) may be positioned adjacent to the second housing (1920). The third antenna module (1924) and the fourth antenna module (1932) may be positioned to face each other.

[0207] Referring to FIG. 19A, when the electronic device (1900) is in an unfolded state (e.g., the first state), the second housing (1920) can be positioned between the first housing (1910) and the third housing (1930). The first housing (1910) can be rotatably coupled to one side of the second housing (1920) via a first hinge assembly (1950), and the third housing (1930) can be rotatably coupled to the other side of the second housing (1920) via a second hinge assembly (1960).

[0208] Referring to FIG. 19b, when the electronic device (1900) is in a folded state (e.g., the second state), the third housing (1930) can be placed over the second housing (1920), and the first housing (1910) can be placed over the third housing (1930).

[0209] Although not shown, the electronic device (1900) may include link assemblies (e.g., the first link assembly (382) or the second link assembly (384) of FIG. 3A) configured to rotate the antenna modules (1912, 1914, 1922, 1932), respectively. Accordingly, while the first housing (1910) rotates relative to the second housing (1920), the first antenna module (1912) may rotate toward the second antenna module (1922). While the second housing (1920) rotates relative to the first housing (1910), the second antenna module (1922) may rotate toward the first antenna module (1912). While the second housing (1920) rotates relative to the third housing (1930), the third antenna module (1924) can rotate to face the fourth antenna module (1932). While the third housing (1930) rotates relative to the second housing (1920), the fourth antenna module (1932) can rotate to face the third antenna module (1924).

[0210] FIG. 20A illustrates an electronic device in an unfolded state according to one embodiment. FIG. 20B illustrates an electronic device in a folded state according to one embodiment.

[0211] Referring to FIGS. 20A and 20B , an electronic device (2000) according to an embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 13 ) may include a first housing (2010) (e.g., the first housing (210) of FIG. 3A ), a second housing (2020) (e.g., the second housing (220) of FIG. 3A ), and a third housing (2030) (e.g., the second housing (220) of FIG. 3A ), a first hinge assembly (2050) (e.g., the hinge assembly (340) of FIG. 3A ), and a second hinge assembly (2060) (e.g., the hinge assembly (340) of FIG. 3A ). In one embodiment, the electronic device (2000) may include a camera module (2070) (e.g., the second camera module (208) of FIG. 2B) positioned inside the first housing (2010) so as to be exposed through the first housing (2010) and a display (2080) (e.g., the second display (231) of FIG. 2B) positioned inside the second housing (2020) so as to be visible from the outside.

[0212] In one embodiment, the electronic device (2000) may include a first antenna module (2012) disposed within a first housing (2010), a second antenna module (2022) and a third antenna module (2024) disposed within a second housing (2020), and a fourth antenna module (2032) disposed within a third housing (2030). The first antenna module (2012) may be positioned adjacent to the second housing (2020), and the second antenna module (2022) may be positioned adjacent to the first housing (2010). The first antenna module (2012) and the second antenna module (2022) may be positioned to face each other. The third antenna module (2024) may be positioned adjacent to the third housing (2030), and the fourth antenna module (2032) may be positioned adjacent to the second housing (2020). The third antenna module (2024) and the fourth antenna module (2032) may be positioned to face each other.

[0213] Referring to FIG. 20A, when the electronic device (2000) is in an unfolded state (e.g., the first state), the second housing (2020) may be positioned between the first housing (2010) and the third housing (2030). The first housing (2010) may be rotatably coupled to one side of the second housing (2020) via a first hinge assembly (2050), and the third housing (2030) may be rotatably coupled to the other side of the second housing (2020) via a second hinge assembly (2060).

[0214] Referring to FIG. 20b, when the electronic device (2000) is in a folded state (e.g., the second state), the second housing (2020) can be placed over the third housing (2030), and the first housing (2010) can be placed over the second housing (2020).

[0215] Although not shown, the electronic device (2000) may include link assemblies (e.g., the first link assembly (382) or the second link assembly (384) of FIG. 3A) configured to rotate the antenna modules (2012, 2014, 2022, 2032), respectively. Accordingly, while the first housing (2010) rotates relative to the second housing (2020), the first antenna module (2012) may rotate toward the second antenna module (2022). While the second housing (2020) rotates relative to the first housing (2010), the second antenna module (2022) may rotate toward the first antenna module (2012). While the second housing (2020) rotates relative to the third housing (2030), the third antenna module (2024) can rotate to face the fourth antenna module (2032). While the third housing (2030) rotates relative to the second housing (2020), the fourth antenna module (2032) can rotate to face the third antenna module (2024).

[0216] According to one embodiment, an electronic device (e.g., an electronic device (200) of FIG. 5) comprises a first housing part (e.g., a first housing (210) of FIG. 5), a second housing part (e.g., a second housing (220) of FIG. 5) rotatably coupled to the first housing part, a first antenna module (e.g., a first antenna module (463) of FIG. 5) positioned within the first housing part, a first wireless communication circuit (e.g., a first wireless communication circuit (322) of FIG. 3b) positioned within the first housing part and electrically connected to the first antenna module, a second antenna module (e.g., a second antenna module (563) of FIG. 5) positioned within the second housing part, a second wireless communication circuit (e.g., a second wireless communication circuit (324) of FIG. 3b) positioned within the second housing part, and electrically connected to the second antenna module, wherein the first antenna module rotates relative to the second housing part while the first housing part rotates relative to the second housing part. The first link assembly (e.g., the first link assembly (382) of FIG. 5) configured to rotate the first antenna module toward the antenna module, and the second link assembly (e.g., the second link assembly (384) of FIG. 5) configured to rotate the second antenna module toward the first antenna module while the second housing part rotates relative to the first housing part. The first wireless communication circuit may be configured to transmit a radio frequency (RF) signal through the first antenna module. The second wireless communication circuit may be configured to receive the RF signal through the second antenna module.

[0217] According to one embodiment, an electronic device (e.g., an electronic device (200) of FIG. 5) comprises a first housing part (e.g., a first housing (210) of FIG. 5), a second housing part (e.g., a second housing (220) of FIG. 5) rotatably coupled to the first housing part, a first antenna module (e.g., a first antenna module (463) of FIG. 5) positioned within the first housing part, a first wireless communication circuit (e.g., a first wireless communication circuit (322) of FIG. 3b) positioned within the first housing part and electrically connected to the first antenna module, a second antenna module (e.g., a second antenna module (563) of FIG. 5) positioned within the second housing part, a second wireless communication circuit (e.g., a second wireless communication circuit (324) of FIG. 3b) positioned within the second housing part and electrically connected to the second antenna module, and a first link assembly (e.g., a first link assembly (e.g., a first link assembly (563) of FIG. 5) configured to rotate the first antenna module) The first housing part may include a link assembly (382)), and a second link assembly (e.g., the second link assembly (384) of FIG. 5) configured to rotate the second antenna module. While the first housing part rotates with respect to the second housing part, the radiation direction of the first antenna module and the radiation direction of the second antenna module may face each other. The first wireless communication circuit may be configured to transmit or receive a radio frequency (RF) signal through the first antenna module. The second wireless communication circuit may be configured to receive or transmit the RF signal through the second antenna module.

[0218] According to one embodiment, the electronic device may include a first antenna housing (e.g., the first antenna housing (461) of FIG. 5) disposed within the first housing part and accommodating the first antenna module, a first flexible printed circuit board (e.g., the connecting member (1050) of FIG. 10a) including a portion extending around the first antenna housing, a second antenna housing (e.g., the second antenna housing (561) of FIG. 5) disposed within the second housing part and accommodating the second antenna module, and a second flexible printed circuit board including a portion extending around the second antenna housing. The first wireless communication circuit may be electrically connected to the first antenna module through the first flexible printed circuit board. The second wireless communication circuit may be electrically connected to the second antenna module through the second flexible printed circuit board.

[0219] In one embodiment, the first housing part and the second housing part may include an unfolded state in which the first housing part and the second housing part are placed on a plane, and a folded state in which the first housing part and the second housing part are at least partially facing each other. The alignment relationship between the first antenna module and the second antenna module in the unfolded state may be substantially the same as the alignment relationship between the first antenna module and the second antenna module in the folded state.

[0220] In one embodiment, the electronic device may include one or more electronic components disposed within the second housing part. The first wireless communication circuit may be configured to obtain a first signal that integrates the first plurality of control signals based on a first plurality of control signals related to the one or more electronic components. The first wireless communication circuit may be configured to transmit the RF signal based on the first signal.

[0221] In one embodiment, the second wireless communication circuit may be configured to obtain a second plurality of control signals related to the one or more electronic components by decomposing the RF signal received through the second antenna module. The second wireless communication circuit may be configured to transmit the second plurality of control signals to the one or more electronic components.

[0222] In one embodiment, the electronic device may include at least one processor (e.g., processor (120) of FIG. 1) disposed in the first housing part. The first wireless communication circuit may be configured to receive the first plurality of control signals from the at least one processor.

[0223] In one embodiment, the first link assembly may include a first rack gear (e.g., the first rack gear (483) of FIG. 5) slidably coupled to the first housing part, one or more first pinion gears (e.g., the pinion gears (485, 487) of FIG. 5) configured to rotate in accordance with sliding of the first rack gear, and a first shaft (e.g., the first shaft (465) of FIG. 5) configured to rotate in conjunction with rotation of the one or more first pinion gears. The first antenna module may be coupled to the first shaft so as to rotate in conjunction with rotation of the first shaft. The second link assembly may include a second rack gear (e.g., the second rack gear (565) of FIG. 5) slidably coupled to the second housing part, one or more second pinion gears (e.g., pinion gears (585, 587) of FIG. 5) configured to rotate in accordance with the sliding of the second rack gear, and a second shaft (e.g., the second shaft (565) of FIG. 5) configured to rotate in conjunction with the rotation of the one or more second pinion gears. The second antenna module may be coupled to the second shaft so as to rotate in conjunction with the rotation of the second shaft.

[0224] In one embodiment, the electronic device may include a hinge assembly (e.g., hinge assembly (340) of FIG. 5) coupled with the first housing part and the second housing part. The first link assembly may include a first link (e.g., first link (481) of FIG. 5). A first end of the first link may be rotatably coupled to the hinge assembly. A second end of the first link may be rotatably coupled to the first rack gear. The second link assembly may include a second link (e.g., second link (581) of FIG. 5). A first end of the second link may be rotatably coupled to the hinge assembly at an opposite end of the first link. A second end of the second link may be rotatably coupled to the second rack gear.

[0225] In one embodiment, the first link assembly may include a first bracket (e.g., the first bracket (489) of FIG. 5) that supports the one or more first pinion gears. The second link assembly may include a second bracket (e.g., the second bracket (589) of FIG. 5) that supports the one or more second pinion gears.

[0226] In one embodiment, the first housing part and the second housing part can be folded or unfolded about one or more first axes. The first antenna module can rotate about a second axis that is substantially parallel to the one or more first axes. The second antenna module can rotate about a third axis that is substantially parallel to the one or more first axes.

[0227] In one embodiment, the electronic device may include a first antenna housing (e.g., the first antenna housing (461) of FIG. 5) fixedly disposed on the first housing part, and a second antenna housing (e.g., the second antenna housing (561) of FIG. 5) fixedly disposed on the second housing part. The first antenna module may be rotatably disposed within the first antenna housing. The second antenna module may be rotatably disposed within the second antenna housing.

[0228] In one embodiment, the electronic device may include a first antenna housing (e.g., the first antenna housing (461) of FIG. 5) rotatably disposed on the first housing part and a second antenna housing (e.g., the second antenna housing (561) of FIG. 5) rotatably disposed on the second housing part. The first antenna module may be fixedly disposed within the first antenna housing and may rotate together with the first antenna housing. The second antenna module may be fixedly disposed within the second antenna housing and may rotate together with the second antenna housing.

[0229] In one embodiment, the electronic device may include a first support member (e.g., a support bracket (969) of FIG. 9) fixedly disposed on the first housing part, and a second support member fixedly disposed on the second housing part. The first pinion gear may be positioned between a first end and a second end of the first shaft of the first link assembly. The first end of the first shaft may be fixedly coupled to the first antenna housing. The second end of the first shaft may be rotatably coupled to the first support member. The second pinion gear may be positioned between the first end and the second end of the second shaft of the second link assembly. The first end of the second shaft may be fixedly coupled to the second antenna housing. The second end of the second shaft may be rotatably coupled to the second support member.

[0230] In one embodiment, the electronic device may include a third antenna module positioned within the first housing part (e.g., the third antenna module 1463 of FIG. 14), a fourth antenna module positioned within the second housing part (e.g., the fourth antenna module 1473 of FIG. 14), a third link assembly configured to rotate the third antenna module so that the third antenna module faces the fourth antenna module while the first housing part rotates relative to the second housing part, and a fourth link assembly configured to rotate the fourth antenna module so that the fourth antenna module faces the third antenna module while the second housing part rotates relative to the first housing part. The third antenna module may be configured to transmit power to the second antenna module. The fourth antenna module may be configured to receive power from the first antenna module.

[0231] In one embodiment, the RF signal may have a frequency of 57 GHz to 66 GHz.

[0232] According to one embodiment, an electronic device (e.g., an electronic device (200) of FIG. 5) comprises a first housing part (e.g., a first housing (210) of FIG. 5), a second housing part (e.g., a second housing (220) of FIG. 5) rotatably coupled to the first housing part, a first antenna module (e.g., a first antenna module (463) of FIG. 5) positioned within the first housing part and including a surface on which a first antenna array is arranged, a first wireless communication circuit (e.g., a first wireless communication circuit (322) of FIG. 3b) positioned within the first housing part and electrically connected to the first antenna module, a second antenna module (e.g., a second antenna module (563) of FIG. 5) positioned within the second housing part and including a surface on which a second antenna array is arranged, a second wireless communication circuit (e.g., a second wireless communication circuit (324) of FIG. 3b) positioned within the second housing part and electrically connected to the second antenna module, and the first The first link assembly (e.g., the first link assembly (382) of FIG. 5) configured to rotate the first antenna module such that a side of the first antenna array of the first antenna module faces the second antenna module while the housing part rotates with respect to the second housing part, and the second link assembly (e.g., the second link assembly (384) of FIG. 5) configured to rotate the second antenna module such that a side of the second antenna array of the second antenna module faces the first antenna module while the second housing part rotates with respect to the first housing part. The first wireless communication circuit may be configured to transmit a radio frequency (RF) signal through the first antenna module. The second wireless communication circuit may be configured to receive the RF signal through the second antenna module.

[0233] In one embodiment, the electronic device may include an electronic component disposed within the second housing. The first wireless communication circuit may be configured to transmit a control signal related to the electronic component using the first antenna module. The second wireless communication circuit may be configured to receive the control signal related to the electronic component using the second antenna module.

[0234] In one embodiment, the first link assembly may include a first rack gear (e.g., the first rack gear (483) of FIG. 5) slidably coupled to the first housing part, one or more first pinion gears (e.g., the pinion gears (485, 487) of FIG. 5) configured to rotate in accordance with sliding of the first rack gear, and a first shaft (e.g., the first shaft (465) of FIG. 5) configured to rotate in conjunction with rotation of the one or more first pinion gears. The first antenna module may be coupled to the first shaft so as to rotate in conjunction with rotation of the first shaft. The second link assembly may include a second rack gear (e.g., the second rack gear (583) of FIG. 5) slidably coupled to the second housing part, one or more second pinion gears (e.g., pinion gears (585, 587) of FIG. 5) configured to rotate in accordance with the sliding of the second rack gear, and a second shaft (e.g., the second shaft (565) of FIG. 5) configured to rotate in conjunction with the rotation of the one or more second pinion gears. The second antenna module may be coupled to the second shaft so as to rotate in conjunction with the rotation of the second shaft.

[0235] In one embodiment, the electronic device may include a hinge device coupled to the first housing part and the second housing part (e.g., hinge devices (240, 240-1) of FIG. 2c), and a hinge cover having opposing sides and accommodating the hinge device (e.g., hinge cover (250) of FIG. 5). The first link assembly includes a first link (e.g., a first link (481) of FIG. 5), a first end of the first link is rotatably coupled to the first side of the hinge cover, a second end of the first link is rotatably coupled to the first rack gear, and the second link assembly includes a second link (e.g., a second link (581) of FIG. 5), a first end of the second link is rotatably coupled to the second side of the hinge cover, and a second end of the second link can be rotatably coupled to the second rack gear.

[0236] In one embodiment, the rotational path of the first link with respect to the first side of the hinge cover may be different from the rotational path of the first housing part with respect to the second housing part. The rotational path of the second link with respect to the second side of the hinge cover may be different from the rotational path of the second housing part with respect to the first housing part.

[0237] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0238] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0239] Various drawings may show coordinate axes. These axes may be referred to as the x-axis, y-axis, and / or z-axis. It is important to understand that these axes define a Cartesian coordinate system. The x-axis is perpendicular to the y-axis and the z-axis. The y-axis is perpendicular to the x-axis and the z-axis. The z-axis is perpendicular to the x-axis and the y-axis.

[0240] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0241] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0242] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0243] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (200), First housing part (210); A second housing part (220) rotatably coupled to the first housing part (210); A first antenna module (463) located within the first housing part (210); A first wireless communication circuit (322) disposed within the first housing part (210) and electrically connected to the first antenna module (463); A second antenna module (563) located within the second housing part (220); A second wireless communication circuit (324) disposed within the second housing part (220) and electrically connected to the second antenna module (563); A first link assembly (382) configured to rotate the first antenna module (363); and A second link assembly (384) configured to rotate the second antenna module (563), While the first housing part (210) rotates relative to the second housing part (220), the radiation direction of the first antenna module (463) and the radiation direction of the second antenna module (563) face each other, The first wireless communication circuit (322) is configured to transmit or receive an RF (radio frequency) signal through the first antenna module (463). The second wireless communication circuit (324) is configured to receive or transmit the RF signal through the second antenna module (563). Electronic device (200).

2. In claim 1, A first antenna housing (461) disposed within the first housing part (210) and accommodating the first antenna module (463); A first flexible printed circuit board (1050) including an extended portion around the first antenna housing (461); A second antenna housing (561) disposed within the second housing part (220) and accommodating the second antenna module (563); and Further comprising a second flexible printed circuit board including an extended portion around the second antenna housing (561), The first wireless communication circuit (322) is electrically connected to the first antenna module (463) through the first flexible printed circuit board (1050), The second wireless communication circuit (324) is electrically connected to the second antenna module (563) through the second flexible printed circuit board. Electronic device (200).

3. In claim 1 or claim 2, Further comprising an unfolded state in which the first housing part (210) and the second housing part (220) are placed on a plane and a folded state in which the first housing part (210) and the second housing part (220) are at least partially facing each other, The alignment of the first antenna module (463) with respect to the second antenna module (563) within the unfolded state is substantially the same as the alignment of the first antenna module (463) with respect to the second antenna module (563) within the folded state. Electronic device (200).

4. In any one of claims 1 to 3, Further comprising one or more electronic components arranged within the second housing part (220), The above first wireless communication circuit (322): Based on a first plurality of control signals related to one or more of the electronic components, a first signal is obtained by integrating the first plurality of control signals, and Based on the first signal, configured to transmit the RF signal, Electronic device (200).

5. In claim 4, The above second wireless communication circuit (324): By decomposing the RF signal received through the second antenna module (563), a second plurality of control signals related to the one or more electronic components are obtained; and configured to transmit the second plurality of control signals to the one or more electronic components, Electronic device (200).

6. In claim 4 or claim 5, At least one processor (120) disposed in the first housing part (210), The first wireless communication circuit (322) is configured to receive the first plurality of control signals from the at least one processor (120). Electronic device (200).

7. In any one of claims 1 to 6, The above first link assembly (382): A first rack gear (483) slidably coupled to the first housing part (210); One or more first pinion gears (485; 487) configured to rotate in accordance with the sliding of the first rack gear (483); and A first shaft (465) configured to rotate in conjunction with the rotation of one or more of the first pinion gears (485; 487), The first antenna module (463) is coupled to the first shaft (465) so as to rotate in conjunction with the rotation of the first shaft (465), The above second link assembly (384): A second rack gear (583) slidably coupled to the second housing part (220); One or more second pinion gears (585; 587) configured to rotate in accordance with the sliding of the second rack gear (583); and A second shaft (565) configured to rotate in conjunction with the rotation of one or more of the second pinion gears (585; 587), The second antenna module (563) is coupled to the second shaft (565) so as to rotate in conjunction with the rotation of the second shaft (565). Electronic device (200).

8. In claim 7, Further comprising a hinge assembly (340) coupled with the first housing part (210) and the second housing part (220), The first link assembly (382) includes a first link (481), a first end of the first link (481) is rotatably coupled to the hinge assembly (340), and a second end of the first link (481) is rotatably coupled to the first rack gear (483). The second link assembly (384) includes a second link (581), a first end of the second link (581) is rotatably coupled to the hinge assembly (340) on the opposite side of the first link (481), and a second end of the second link (581) is rotatably coupled to the second rack gear (583). Electronic device (200).

9. In claim 7 or claim 8, The first link assembly (382) includes a first bracket (489) that supports one or more first pinion gears (485; 487), The second link assembly (384) includes a second bracket (589) that supports one or more second pinion gears (585; 587). Electronic device (200).

10. In any one of claims 7 to 9, The first housing part (210) and the second housing part (220) are configured to be folded or unfolded around one or more first axes, The first antenna module (463) is configured to rotate around a second axis that is substantially parallel to the one or more first axes, The second antenna module (563) is configured to rotate around a third axis that is substantially parallel to the one or more first axes. Electronic device (200).

11. In any one of claims 7 to 10, A first antenna housing (461) fixedly positioned on the first housing part (210); and Further comprising a second antenna housing (561) fixedly arranged on the second housing part (220), The first antenna module (463) is rotatably positioned within the first antenna housing (461), The second antenna module (563) is positioned rotatably within the second antenna housing (561). Electronic device (200).

12. In any one of claims 7 to 10, A first antenna housing (461) rotatably arranged on the first housing part (210); and Further comprising a second antenna housing (561) rotatably arranged on the second housing part (220), The first antenna module (463) is fixedly positioned within the first antenna housing (461) and is configured to rotate together with the first antenna housing (461). The second antenna module (563) is fixedly positioned within the second antenna housing (561) and is configured to rotate together with the second antenna housing (561). Electronic device (200).

13. In claim 12, A first support member (969) fixedly arranged on the first housing part (210); and It further includes a second support member fixedly arranged on the second housing part (220), The first pinion gear is positioned between the first end and the second end of the first shaft (465) of the first link assembly (382), The first end of the first shaft (465) is fixedly connected to the first antenna housing (461), The second end of the first shaft (465) is rotatably coupled to the first support member (969), The second pinion gear is positioned between the first end and the second end of the second shaft (565) of the second link assembly (384), The first end of the second shaft (565) is fixedly connected to the second antenna housing (561), The second end of the second shaft (565) is rotatably coupled to the second support member. Electronic device (200).

14. In any one of claims 1 to 13, A third antenna module (1463) located within the first housing part (210); and Further comprising a fourth antenna module (1473) positioned within the second housing part (220), The third antenna module (1463) is configured to transmit power to the second antenna module (563), The fourth antenna module (1473) is configured to receive power from the first antenna module (463). Electronic device (200).

15. In any one of claims 1 to 14, The above RF signal has a frequency of 57.00 GHz to 66.00 GHz, Electronic device (200).

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