Device and method for nail correction

Abstract

The invention relates to a device for nail correction (10) having a base element (12), comprising a first adhesion element (16), a second adhesion element (16) and a tensioning element (14, 32) connecting the two adhesion elements (16) arranged at a distance from each other. The tensioning element (14, 32) applies a tensile force, which can be adjusted on the tensioning element (14, 32), to the adhesion elements (16) in such a manner that the adhesion elements (16) are pulled towards each other. The adhesion elements (16) are each fixed to a region of a nail plate (17) by way of an adhesive bond. The base element (12) has at least one recess (18, 20) which is filled with a curable gel (30). The invention is characterised in that the curable gel (30) is designed for attachment to the nail plate and in that the curable gel (30) forms at least one gel strip, in particular the gel strip extends from one adhesion element (16) to the other adhesion element (16).

Description

[0001] Device and method for nail correction

[0002] The invention relates to a device for nail correction according to the type given in the preamble of claim 1 and to a method for handling a nail correction device according to the preamble of claim 18.

[0003] For the treatment of ingrown or curled nails, especially big toenails, various nail correction braces have been developed as an alternative to painful and long-recovery surgery (Emmert plastic surgery). These orthonyxia braces reduce the curvature of the nail plate, thereby relieving pressure on the often inflamed nail fold. Pain is significantly reduced and healing is facilitated. To achieve lasting therapeutic success, the orthonyxia braces remain on the nail plate for a period of several weeks to several months, supporting its straight growth.

[0004] The effect of these nail correction braces is based on restoring forces and tensile forces acting outside the center of the nail, or on a combination of these two mechanisms. Restoring forces act essentially perpendicular to the nail plate. Tensile forces, which act essentially parallel to the nail plate, generate torques in the areas of the nail plate that need to be lifted.

[0005] In addition to wire braces, nail correction braces include adhesive braces made of plastic and metal. Gel braces are also common.

[0006] It is known that braces containing wire elements use a gel to seal the wire ends and protect the wearer from injury. This gel has a relatively soft consistency and only weak adhesion to the nail plate. In EP°3 O 244 O 847 OB1 discloses an adhesive brace which actively applies a tensile force to the nail plate. The adhesive brace comprises a base element having two spaced-apart adhesive elements connected by a tensile element, and a holding element. The holding element is connected to the base element. The tensile element is elastic. The nail correction brace is applied to a nail plate via the adhesive elements. The tensile element is tensioned, and the nail plate can be connected to it via an adhesive connection on each of the two adhesive elements. This tensioning actively creates a tensile force on the nail plate. The holding element and the base element are formed as a single piece. This solution has the disadvantage that under greater loads, the adhesive connections on the adhesive elements can weaken or, in the worst case, be completely destroyed.

[0007] Further adhesive braces are available in the KR° 102o 596 o 246 o B1 and W0 0 2022 / 181884°A1 disclosed.

[0008] Another well-known solution for nail correction is to stabilize the nail plate using curable gels. A gel strip is applied to the nail plate from one side of the nail to the other. This applied gel is then cured using an energy source, usually UV light. The cured gel does not actively lift the nail edges; instead, it fixes the nail root and prevents curling during nail growth. The pulling effect of the gel strip on the nail plate is thus passive, i.e., caused by nail growth. This solution has the disadvantage that no active forces act on the nail edges.

[0009] The KR°102 o 380 o 567 oB1 discloses a gel / adhesive brace that is cured by UV light. During the curing process, the cured material contracts, exerting tensile stress and a bending moment on the nail bed or nail edges. The gel or adhesive is either applied directly to the nail bed, or a coating strip is applied between the gel and the nail bed, firmly bonded to the nail bed.

[0010] DE 10 2007 035 031 A1 discloses a nail correction brace, wherein the nail correction brace is applied via adhesive bonds in the edge areas, and the tensile force on the edge areas of the nail can be adjusted by continuously shortening the tension element. The tension element is designed as a wire arranged between the adhesive elements. The pointed ends of the tension element are arranged in a recess and are filled with a curable compound to protect the user. The curable compound remains elastic and flexible after curing.

[0011] The object of the invention is to further develop a device for nail correction in such a way that, while avoiding the disadvantages mentioned, an active force application is combined with a permanently stabilizing effect and a reliable connection with the nail plate is achieved.

[0012] The invention is based on the finding that by combining an adhesive brace with the effects of a gel strip, the problems mentioned can be easily overcome and a flat nail brace can still be guaranteed.

[0013] In a known manner, the base element has at least one recess. The recess is filled with a curable gel.

[0014] According to the invention, the curable gel is designed to bond to the nail plate. Furthermore, the curable gel forms at least one gel strip. In particular, the gel strip extends from one adhesive element to the other adhesive element. The at least one recess defines the shape of the curable gel, which is defined by the shape of the recess. The connection of the adhesive elements of the base element and the connection of the gel to the nail plate ensure a better and more permanent connection of the device to the nail plate using two different media. Due to the formation of the gel strip, almost the entire width of the nail plate is spanned by the gel strip, thus acting on the nail plate during growth.

[0015] The traction element actively acts on the two lateral areas of the nail plate to which the adhesive elements are applied. An active tensile stress acts between the adhesive elements. By applying the curable gel, the traction element or base element is passively fixed in this state and also bonds even more effectively to the nail plate. The cured gel is then solid and rigid, allowing forces to be transmitted more effectively through the cured gel. It is also brittle.

[0016] Preferably, the at least one recess in the base element is formed centrally; in particular, the gel strip extends from one adhesive element to the other. The recess can completely encompass the gel strip laterally. The central design of the recess in the base element between the adhesive elements with the inserted gel strip enables a connection of the device to the nail plate that is evenly distributed across the width of the nail plate.

[0017] According to a further advantageous embodiment of the invention, differently sized and / or shaped recesses are provided. The recesses are separated from each other by a flat bar on the underside of the base element, but the gel strip extends over the bar. The bar provides the base body with additional stability and increases the surface area for bonding the base element to the nail plate.

[0018] In order to ensure a positive connection between the cured gel and the base element, at least one recess in the area of ​​the adhesive elements has undercuts formed on the sides.

[0019] According to a further advantageous embodiment of the invention, the undercuts have a triangular shape. This triangular shape allows for easy insertion of the gel into the undercuts. Furthermore, an optimal contact surface is created for the positive connection between the cured gel and the base body.

[0020] The gel is preferably made of plastic. This allows for cost-effective molding.

[0021] Preferably, the gel is curable by exposure to a UV lamp. This method ensures fast and efficient curing of the gel.

[0022] According to a further advantageous embodiment of the invention, the gel is cured by exposure to a blue light lamp.

[0023] According to a further advantageous embodiment of the invention, the gel can be cured by combining two gel components, in particular based on acrylate.

[0024] Preferably, the tension element is designed as two spaced-apart, longitudinally parallel expansion flanks. The two expansion flanks create an elastic and stable tension element. According to a further advantageous embodiment of the invention, at least the tension element is made of thermoplastic elastomer, PVC, or rubber. This creates a resilient and durable tension element.

[0025] The tension element is preferably made of wire. The wire can be adjusted in length by twisting it, allowing a precisely defined tension to be applied to the adhesive elements and thus to the lateral areas of the nail plate. The position adjusted by shortening the wire is passively fixed by the gel. Furthermore, this allows the device to be adapted to nail plates of different sizes.

[0026] The adhesive elements are preferably coated with adhesive. This allows the adhesive element to be bonded directly to the nail plate during use, eliminating the need for subsequent application of adhesive.

[0027] Preferably, the adhesive elements and the tension element are made of the same material. This allows the base element to be manufactured in one piece using a simple manufacturing process, thus making it cost-effective.

[0028] According to a further advantageous embodiment of the invention, the height and transverse extent of the adhesive elements and the tension element are of the same size, which further simplifies production.

[0029] The device preferably comprises a holding element. The holding element is connected to the base element. The holding element enables simple and tool-free application of the base element to the nail plate.

[0030] Preferably, the holding element comprises a grip tab with a central recess. The grip tab allows the user to securely hold the holding element and apply it to the nail plate.

[0031] According to the invention, a method for handling a nail correction device is provided, wherein the method, after providing a device for nail correction with a base element which has adhesive elements, comprises at least the following steps: 51 Adhering the adhesive elements to a respective lateral region of a nail plate with simultaneous or subsequent application of a tensile stress;

[0032] 52 Filling a gel into at least one recess of the base element;

[0033] 53 Curing of the gel by a UV lamp or blue light lamp or by chemical reaction after combining several components.

[0034] According to a further advantageous embodiment of the invention, the device for the method for handling a nail correction device is designed as described above.

[0035] Preferably, a process step S0 is performed prior to process step S1, in which an adhesion promoter is applied to the nail plate and, if necessary, cured. The adhesion promoter ensures a longer-lasting and more uniform adhesive bond between the adhesive elements and the nail plate, as well as between the gel and the nail plate.

[0036] Further advantages, features and possible applications of the present invention will become apparent from the following description in conjunction with the embodiments shown in the drawings.

[0037] In the description, claims, and drawings, the terms and associated reference symbols used in the list of reference symbols below are used. In the drawings, the following definitions apply:

[0038] Fig. 1 is a perspective view obliquely from above of a first embodiment of the basic element of a nail correction device;

[0039] Fig. 2a is a perspective view obliquely from above of the first embodiment of the nail correction device on a nail plate in method step S1, wherein the first adhesive element is glued to the nail plate;

[0040] Fig. 2b is a perspective view obliquely from above of the first embodiment of the nail correction device on a nail plate in method step S1, wherein the tension element is stretched and both adhesive elements are glued to the nail plate; Fig. 2c is a perspective view obliquely from above of the first embodiment of the device according to the invention on a nail plate, wherein the holding element is separated;

[0041] Fig. 2d is a perspective view obliquely from above of the first embodiment of the nail correction device on a nail plate in method steps S2 and S3;

[0042] Fig. 3 is a perspective view obliquely from above of a second embodiment of the basic element of the nail correction device;

[0043] Fig. 4 is a perspective view obliquely from above of a third embodiment of the basic element of the nail correction device;

[0044] Fig. 5a is a perspective view obliquely from above of the third embodiment of the nail correction device on a nail plate in method step S1;

[0045] Fig. 5b is a perspective view obliquely from above of the second embodiment of the nail correction device on a nail plate in method step S1, wherein the wire element is twisted;

[0046] Fig. 5c is a perspective view obliquely from above of the second embodiment of the nail correction device on a nail plate, wherein the wire element has been severed;

[0047] Fig. 5d is a perspective view obliquely from above of a third embodiment of the nail correction device in method steps S2 and S3;

[0048] Fig. 6a is a perspective view obliquely from above of a nail plate in process step SO;

[0049] Fig. 6b is a perspective view obliquely from above of the first embodiment of the nail correction device in method step S1, wherein the first adhesive element is glued to the nail plate;

[0050] Fig. 6c is a perspective view obliquely from above of the first embodiment of the nail correction device, wherein a tensile stress is applied to the tension element by means of the holding element and the second element is glued to the nail plate; Fig. 6d is a perspective view obliquely from above of the first embodiment of the nail correction device in method step S2, and

[0051] Fig. 6e is a perspective view obliquely from above of the first embodiment of the nail correction device in method step S3.

[0052] Figs. 1 to 5d each show different embodiments of a nail correction device 10 with a base element 12. The base element 12 has a substantially rectangular basic shape with rounded corners.

[0053] Furthermore, the base element 12 comprises an adhesive element 16 in the region of each of the two ends formed in the longitudinal direction. The adhesive elements 16 are connected to an upper side of a nail plate 17 via an adhesive connection on an underside of the adhesive elements 16.

[0054] Fig. 1 shows a perspective view obliquely from above of a first embodiment of the base element 12 of the nail correction device 10.

[0055] The base element 12 has a tension element 14 and a first recess 18. The first recess 18 is formed centrally in the base element 12 and extends in the longitudinal direction.

[0056] The first recess 18 is rectangular in shape with rounded corners. In the longitudinal direction, a flat web 22 on the underside of the base element 12 adjoins the first recess 18.

[0057] On the other side of the web 22, a second recess 20 is provided. This recess has a substantially rectangular basic shape with rounded corners. In the transverse direction, an undercut 24 is formed at each end of the second recess 20. This undercut has a triangular basic shape, with an engagement surface 24a arranged oriented in the direction of the first recess 18.

[0058] The adhesive elements 16 are provided at the two longitudinal ends of the base element 12. The base element 12 can be bonded to the side areas of the nail plate 17 via the adhesive elements 16 (see, among others, Figs. 2a and 2b). For this purpose, the adhesive elements 16 are coated on the side facing the nail plate 17. The two webs 22 serve to enlarge the respective adhesive surfaces.

[0059] The tension element 14 is arranged between the adhesive elements 16. The tension element 14 has two parallel flanks 14a, 14b. The two flanks 14a, 14b delimit the first recess 18 in the transverse direction.

[0060] The tension element 14 is made of a thermoplastic elastomer.

[0061] After being applied to the nail plate 17, a gel 30 can be introduced into the first and second recesses 18, 20 and the undercuts 24 and cured using a UV lamp. Due to the recesses 18, 20, the gel 30 can bond to the upper side of the nail plate 17 and simultaneously form a continuous gel strip 30 that extends over the webs 22.

[0062] The base element 12 is formed in one piece. The adhesive elements 16 and the tension element 14 are made of the same material and have the same height and transverse extension. The base element 12 is made of a thermoplastic elastomer.

[0063] The height of the base element 12 is 1 mm and the width is 5 mm. The webs 22 have a thickness of 0.2 mm.

[0064] The base element 12 is connected at one end to a holding element 26 via a connecting region 26a. The holding element 26 is arranged at an angle obliquely upwards with respect to the base element 12. The holding element 26 has a gripping tab 28 provided with a central recess 28a. The holding element 26 is made of a thermoplastic elastomer. The holding element 26 is used to apply and tension the base element 12 on the nail plate 17. Once the base element 12 has been applied to the nail plate 17 and the adhesive elements 16 have been connected to the nail plate 17 via an adhesive connection 17, the holding element 26 is separated or cut off from the base element 12 in the connecting region 26a.

[0065] 2a to 2d show the method according to the invention for applying the first embodiment of the nail correction device 10 to the nail plate 17. FIGS. 2a and 2b show the second method step S1 of the first embodiment of the nail correction device 10. In the second method step S1, the nail correction device 10 is glued to the nail plate 17 with the adhesive elements 16, whereby first one adhesive element 16 is glued to one side region of the nail plate 17 (Fig. 2a) and then, by applying a tensile force in the longitudinal direction to the base element 12 so that the elastic tensile element 14 stretches, the second adhesive element 16 is glued under tensile stress to the other side region of the nail plate 17 (Fig. 2b).

[0066] The force on the base element 12 and finally on the tension element 14 is applied manually by the user via the holding element 26.

[0067] Fig. 2c shows the first embodiment of the nail correction device 10, with the holding element 26 separated. The holding element 26 has a tapered cross-section in the connecting region 26a, which allows for easy separation of the holding element 26 from the base element 12.

[0068] Fig. 2d shows the third and fourth method steps S2, S3 of the first embodiment of the nail correction device 10 according to the invention. In the third method step S2, the gel 30 is introduced into the first recess 18, the second recesses 20, and the undercuts 24, forming a gel strip 30. The gel 30 is introduced using a spatula (see Fig. 6d). Alternatively, a dosing syringe can also be used. The base element 12 completely encompasses the gel strip 30 laterally.

[0069] In the fourth process step S3, the gel 30 is cured using a UV lamp.

[0070] The gel 30 is made of plastic. The gel 30 is bonded to the upper side of the nail plate 17 in the recesses 18, 20 and forms a gel strip 30 that extends over the webs 22. The tension element 14, which is applied to the nail plate 17 under tensile stress, pulls the ends of the base element 12 and thus the side regions of the nail plate 17 upward. Furthermore, the curing of the gel 30 fixes the base element 12 in this state to the nail plate 17, and also fixes the nail plate 17.

[0071] Figure 3 shows a perspective view obliquely from above of a second embodiment of the base element 12 of the nail correction device 10. The second embodiment of the base element 12 of the nail correction device 10 largely corresponds to the first embodiment.

[0072] In contrast to the first embodiment, the second embodiment additionally includes a wire element 32. The wire element 32 is designed as a tension element 14. The tensile force is thus generated by the wire element 32 and transmitted essentially via the adhesive elements 16 to the nail plate 17. In contrast to the first embodiment, the flanks of the base element 12 are designed only to connect the adhesive elements 16 and to enlarge the adhesive surface.

[0073] The wire element 32 is arranged between the two adhesive elements 16 and connected to them in a connecting region 32b. Between the two adhesive elements 16, the wire element 32 has a twisting region 32a. In the twisting region 32a, the wire element 32 has a loop-like shape extending upwards or forwards from the nail plate 17.

[0074] The wire element 32 is designed to be plastically deformable.

[0075] Fig. 4 shows a perspective view obliquely from above of a third embodiment of the base element 12 of the nail correction device 10.

[0076] In contrast to the second embodiment, the adhesive elements 16 are connected to each other only by the wire element 32. The wire element 32 also serves as the tension element 14.

[0077] The adhesive elements 16 are each provided with a plurality of undercuts 24 in their recess 20. The undercuts 24 each form a triangular shape, with an engagement surface 24a oriented toward the other adhesive element 16. The recesses 20 are each U-shaped, open to one another. The adhesive elements 16 are connected to one another solely via the wire element 32. At the outwardly oriented end of the recess 20, the wire element 32 is connected to the adhesive element 16 via the connecting regions 32b.

[0078] Figs. 5a to 5d illustrate the method according to the invention for applying the third embodiment of the nail correction device 10 to the nail plate 17. Fig. 5a shows a perspective view obliquely from above of the third embodiment of the nail correction device 10 on a nail plate 17 in the second method step S1.

[0079] The third embodiment of the nail correction device 10 is, like the first and second embodiments, applied to the side regions of the nail plate 17 via the adhesive elements 16 and glued thereto.

[0080] Fig. 5b shows the second method step S1 of the third embodiment of the nail correction device 10.

[0081] Furthermore, the wire element 32 is twisted in the twisting region 32a in such a way that a tensile stress is applied to the adhesive elements 16 and the lateral regions of the nail plate 17 are pulled upwards.

[0082] Fig. 5c shows a perspective view obliquely from above of the third embodiment of the nail correction device 10, wherein the wire element 32 is cut off in the twisting region 32a.

[0083] Fig. 5d shows the third and fourth method steps S2, S3 of the third embodiment of the nail correction device 10.

[0084] The gel 30 is applied in the second recesses 20, the undercuts 24 and the area between the two adhesive elements 16 and has been cured by a UV lamp, forming a gel strip 30. The cured gel strip 30 fixes the nail correction device 10 in the tensile state of the adhesive elements 16 according to Fig. 5b, as well as the nail plate 17.

[0085] The method according to the invention is illustrated in Figs. 6a to 6e. This method is shown by way of example with the first embodiment of the nail correction device 10. Of course, the method can be carried out with all embodiments of the nail correction device 10.

[0086] The process runs from the first process step SO to the fourth process step S3.

[0087] Fig. 6a shows a perspective view obliquely from above of a nail plate 17 in process step 50. In the first process step 50, an adhesion promoter is applied to the nail plate 17 with a brush 34 and cured by exposure to light.

[0088] Figs. 6b and 6c show a perspective view obliquely from above of the first embodiment of the nail correction device 10 in method step S1.

[0089] In the second process step S1, the adhesive elements 16 are each glued to a lateral region of a nail plate 17. Fig. 6b shows the gluing of the first adhesive element 16 to a lateral region of the nail plate 17.

[0090] In Fig. 6c it is shown that the second adhesive element 16 is subsequently glued to the base body 12 in the other lateral region of the nail plate 17 by applying a longitudinal tensile stress.

[0091] Fig. 6d shows a perspective view obliquely from above of the first embodiment of the nail correction device 10 in method step S2.

[0092] In the third method step S2, the gel 30 is filled into at least the recesses 18, 20 of the base element 12 with a spatula 36 so that it forms a gel strip 30.

[0093] Fig. 6e shows a perspective view obliquely from above of the first embodiment of the nail correction device 10 in method step S3.

[0094] In the fourth process step S3, the gel 30 is cured by a UV lamp 38 or blue light lamp or by chemical reaction after combining several components.

[0095] The design of the nail correction device 10 and the method S0, S1, S2, S3, S4 ensure flexible and reliable nail correction. Firstly, the effect of the nail correction device 10 is improved by the combination of the cured gel 30 with the base element 12 through the actively applied tensile force. Secondly, the gel 30 increases the service life of the connection between the nail correction device 10 and the nail plate 17. This provides greater resistance to lateral curling of the nail plate 17. Reference numerals list

[0096] 10 nail correction device

[0097] 12 Basic element

[0098] 14 Tension element

[0099] 14a first flank of the tension element 14

[0100] 14b second flank of the tension element 14

[0101] 16 Adhesive element

[0102] 17 Nail plate

[0103] 18 first recess

[0104] 20 second recess

[0105] 22 jetty

[0106] 24 undercut

[0107] 24a Attack surface of the undercut 24

[0108] 26 Holding element

[0109] 26a Connection area of ​​the holding element 26

[0110] 28 Grip tab

[0111] 28a Recess of the grip tab 28

[0112] 30 gel, gel strips

[0113] 32 wire element

[0114] 32a Twisting area of ​​the wire element 32

[0115] 32b Connection area of ​​the wire element 32

[0116] 34 brushes 36 spatulas

[0117] 38 UV lamp

[0118] SO first process step S1 second process step

[0119] 52 third procedural step

[0120] 53 fourth procedural step

Claims

Patent claims 1. A device for nail correction (10) with a base element (12) comprising a first adhesive element (16), a second adhesive element (16) and a pulling element (14, 32) connecting the two adhesive elements (16) arranged at a distance from one another, which pulling element applies a pulling force, which can be adjusted on the pulling element (14, 32), to the adhesive elements (16) such that the adhesive elements (16) are pulled towards one another, wherein the adhesive elements (16) are each fixed to a region of a nail plate (17) via an adhesive connection, wherein the base element (12) has at least one recess (18, 20) which is filled with a curable gel (30), characterized in that the curable gel (30) is designed for connection to the nail plate and in that the curable gel (30) forms at least one gel strip, in particular the gel strip extends from one adhesive element (16) to the other adhesive element (16).

2. Device for nail correction according to claim 1, characterized in that the at least one recess (18, 20) of the base element (12) is formed centrally and in particular extends from one adhesive element (16) to the other adhesive element (16).

3. Device for nail correction according to one of the preceding claims, characterized in that the recess (18, 20) completely surrounds a gel strip laterally.

4. Device for nail correction according to one of the preceding claims, characterized in that differently dimensioned recesses (18, 20) are provided, wherein the recesses (18, 20) are separated from one another by a flat web (22) on the underside of the base element (12), but the gel strip runs over the web (22).

5. Device for nail correction according to one of the preceding claims, characterized in that the at least one recess (18, 20) is rectangular with rounded corners.

6. Device for nail correction according to one of the preceding claims, characterized in that the at least one recess (18, 20) has laterally formed, pointed undercuts (24) in the region of the adhesive elements (16).

7. Device for nail correction according to claim 6, characterized in that the undercuts (24) have a triangular shape.

8. Device for nail correction according to one of the preceding claims, characterized in that the base element (12) is formed in one piece.

9. Device for nail correction according to one of the preceding claims, characterized in that the curable gel (30) can be cured by exposure to a UV lamp (38).

10. Device for nail correction according to one of the preceding claims, characterized in that the tension element (14) is designed as two expansion flanks (14a, 14b) spaced apart from one another and running parallel in the longitudinal direction. 11 . Device for nail correction according to one of the preceding claims, characterized in that at least the pulling element (14) consists of thermoplastic elastomer, PVC or rubber.

12. Device for nail correction according to one of claims 1 to 10, characterized in that the pulling element (14) is designed as a wire element (32).

13. Device for nail correction according to one of the preceding claims, characterized in that the adhesive elements (16) are coated with adhesive.

14. Device for nail correction according to one of the preceding claims, characterized in that the adhesive elements (16) and the pulling element (14) are made of the same material are trained.

15. Device for nail correction according to one of the preceding claims, characterized in that the height and transverse extent of the adhesive elements (16) and the pulling element (14) are of the same size.

16. Device for nail correction according to one of the preceding claims, characterized by a holding element (26) which is connected to the base element (12).

17. Device for nail correction according to one of the preceding claims, characterized in that the holding element (26) comprises a gripping tab (28) which has a central recess (28a).

18. A method for handling a nail correction device, wherein the method comprises, after providing a nail correction device (10) with a base element (12) having adhesive elements (16), at least the following steps: (51) Adhering the adhesive elements (16) to a respective lateral region of a nail plate (17) while simultaneously or subsequently applying a tensile stress; (52) filling a gel (30) into at least one recess (18,20) of the base element (12); (53) Curing of the gel (30) by a UV lamp (38) or blue light lamp or by chemical reaction after combining several components.

19. A method for handling a nail correction device according to claim 18, characterized in that the nail correction device (10) is designed according to one of claims 1 to 18.

20. Method for handling a nail correction device according to one of the preceding claims, characterized in that before the method step S1 a method step S0 is carried out in which an adhesion promoter is applied to the nail plate (17) and optionally cured.

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