Photosensitive resin composition, cured product, partition wall, organic electroluminescent element, and image display device

Abstract

Provided is a photosensitive resin composition with which both high ink repellency and inkjet coatability can be achieved. The photosensitive resin composition of the present invention contains a photopolymerization initiator (A), an alkali-soluble resin (B), a photopolymerizable compound (C), a compound (D), and a compound (E), and is characterized by the compound (D) having a C2 or C3 cyclic ether group and an aromatic ring and / or heterocyclic ring, the compound (E) having a crosslinking group and a fluorine atom and / or siloxane chain, and the content ratio of the compound (E) to 100 parts by mass of the compound (D) being 2-8 parts by mass.

Description

Photosensitive resin composition, cured product, partition wall, organic electroluminescent device, and image display device

[0001] The present invention relates to a photosensitive resin composition, a cured product, a partition wall, an organic electroluminescent device, and an image display device. This application claims priority based on Japanese Patent Application No. 2024-031833, filed on March 4, 2024, the contents of which are incorporated herein by reference.

[0002] Conventionally, organic electroluminescent elements included in organic electroluminescent displays and the like have been manufactured by forming partition walls (banks) on a substrate and then laminating various functional layers within the region surrounded by the partition walls. A known method for easily forming such partition walls is a photolithography method using a photosensitive resin composition. Another known method for laminating various functional layers within the region surrounded by the partition walls is a method in which ink containing materials constituting the functional layers is first prepared and then the prepared ink is injected into the region surrounded by the partition walls. Among these methods, the inkjet method is often adopted because it is easy to accurately inject a predetermined amount of ink into a predetermined location.

[0003] Furthermore, when forming a functional layer using ink, it may be necessary to impart ink repellency (liquid repellency) to the partition walls in order to prevent adhesion of the ink to the partition walls, prevent mixing of inks injected between adjacent regions, etc. In recent years, various properties other than ink repellency have been required for the partition walls, and various photosensitive resin compositions have been developed.

[0004] Patent Document 1 describes that by using an initiator with a specific structure and a fluorine atom-containing resin having a crosslinking group, it is possible to achieve both control of the step difference between partition walls of different heights (the difference in height between the first partition wall and the second partition wall) and inkjet coating properties. Patent Document 2 describes that by using a photoacid generator and an acid curing agent and a photosensitive composition containing an ink repellent agent having an ethylenic double bond, it is possible to form a resin cured film with good ink repellency and a fine, highly accurate pattern.

[0005] International Publication No. 2021 / 125160 Japanese Patent No. 6536578

[0006] In recent years, the practical application of element devices using inkjet printing has progressed, and there is a demand for higher inkjet coating accuracy while maintaining high ink repellency. In particular, when inkjet coating is performed over a large area, if there are a large number of pixels to which the ink does not spread, the yield may decrease. The inventors have conducted studies and found that the photosensitive composition described in Patent Document 1 does not sufficiently achieve both high ink repellency and inkjet coating ability. On the other hand, Patent Document 2 describes the photosensitive resin composition as having the effect of reducing residues in the central portions of pixel openings, but does not describe its suitability for spreading over the entire pixel when inkjet coating a large pixel area.

[0007] As a result of extensive investigations, the present inventors have found that the above-mentioned problems can be solved by further combining a compound having a specific structure in a specific blending ratio in a photosensitive resin composition containing a photopolymerization initiator, an alkali-soluble resin, and a photopolymerizable compound, and have thus completed the present invention. That is, the present invention is a photosensitive resin composition containing (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, a specific (D) compound, and a specific (E) compound, wherein the content of the (E) compound per 100 parts by mass of the (D) compound is 2 parts by mass or more and 8 parts by mass or less.

[0008] That is, the gist of the present invention is as follows. [1] A photosensitive resin composition containing (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, a (D) compound, and an (E) compound, wherein the (D) compound is a compound having a cyclic ether group having 2 to 3 carbon atoms and an aromatic ring and / or a heterocycle, and the (E) compound is a compound having a crosslinking group and a fluorine atom and / or a siloxane chain, and wherein the content of the (E) compound is 2 parts by mass or more and 8 parts by mass or less per 100 parts by mass of the (D) compound. [2] The photosensitive resin composition of [1], wherein the content of the (D) compound is 10 parts by mass or more per 100 parts by mass of the (B) alkali-soluble resin. [3] The photosensitive resin composition of [1] or [2], wherein the (D) compound has a structural unit represented by the following formula (1):

[0009]

[0010] (In formula (1), R ｄ１１ Each represents a divalent aliphatic hydrocarbon group. n represents an integer of 1 or 2. The benzene ring in formula (1) may be further substituted with any substituent. * represents a bond.) [4] The photosensitive resin composition of any of [1] to [3], wherein the acid value of the (D) compound is 1 mgKOH / g or less. [5] The photosensitive resin composition of any of [1] to [4], wherein the (B) alkali-soluble resin contains an epoxy (meth)acrylate having an aromatic ring in the main chain. [6] The photosensitive resin composition of any of [1] to [5], wherein the (C) photopolymerizable compound contains a reaction product of pentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid, or a reaction product of dipentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid. [7] The photosensitive resin composition of any of [1] to [6], further containing an aliphatic mercapto compound. [8] The photosensitive resin composition of any one of [1] to [7], which does not contain a colorant or the content of the colorant relative to the total solid mass of the photosensitive resin composition is 5 mass % or less. [9] A cured product obtained by curing the photosensitive resin composition of any one of [1] to [8].

[10] A partition wall composed of the cured product of [9].

[11] An organic electroluminescent device having the partition wall of

[10] .

[12] An image display device comprising the organic electroluminescent device of

[11] .

[0011] The present invention can provide a photosensitive resin composition that can achieve both high ink repellency and ink jet coating properties.

[0012] The present invention will be described in detail below. The following description is an example of an embodiment of the present invention, and the present invention is not limited to these unless it exceeds the gist of the present invention. In the present invention, "(meth)acrylic" means "acrylic and / or methacrylic." In the present invention, "total solid content" means all components other than the solvent in the photosensitive resin composition. Even if a component other than the solvent is liquid at room temperature, that component is not included in the solvent, but is included in the total solid content.

[0013] In the present invention, a numerical range expressed using "to" means a range that includes the numerical values ​​written before and after "to" as the lower and upper limits. In the present invention, "A and / or B" means one or both of A and B, and specifically means A, B, or A and B. In the present invention, "(co)polymer" means both a single polymer (homopolymer) and a copolymer, and "polybasic acid (anhydride)" means "polybasic acid and / or polybasic acid anhydride."

[0014] In the present invention, the weight average molecular weight refers to the weight average molecular weight (Mw) calculated in terms of polystyrene by gel permeation chromatography (GPC). In the present invention, the acid value refers to the acid value calculated in terms of effective solid content, and is calculated by neutralization titration. In the present invention, the partition wall material refers to a bank material, a wall material, or a wall material, and similarly, the partition wall refers to a bank, a wall, or a wall.

[0015] The partition wall is used to separate a functional layer (organic layer, light-emitting portion) in, for example, an active-drive organic electroluminescent element, and is used to form pixels including the functional layer and the partition wall by, for example, ejecting ink, which is a material for forming the functional layer, into the separated region (pixel region) and drying it.

[0016] [1] Photosensitive Resin Composition [1-1] Components and Composition of Photosensitive Resin Composition The components constituting the photosensitive resin composition of the present invention and their composition will be described. The photosensitive resin composition of the present invention contains (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, (D) a compound, and (E) a compound. The photosensitive resin composition of the present invention may further contain other components as needed, such as a chain transfer agent, an ultraviolet absorber, a polymerization inhibitor, etc.

[0017] [1-1-1] Component (A): Photopolymerization Initiator The photosensitive resin composition of the present invention contains (A) a photopolymerization initiator. The photopolymerization initiator is a compound that polymerizes the ethylenically unsaturated bond of (C) the photopolymerizable compound by the application of actinic rays. In the photosensitive resin composition of the present invention, a photopolymerization initiator commonly used in this field can be used as (A) the photopolymerization initiator. Examples of such photopolymerization initiators include metallocene compounds including titanocene compounds described in JP-A-59-152396 and JP-A-61-151197; hexaarylbiimidazole derivatives described in JP-A-2000-56118; halomethylated oxadiazole derivatives, halomethyl-s-triazine derivatives, N-aryl-α-amino acids such as N-phenylglycine, N-aryl-α-amino acid salts, N-aryl-α-amino acid esters and other radical activators, α-aminoalkylphenone derivatives; and oxime ester compounds described below.

[0018] Examples of the metallocene compound include dicyclopentadienyltitanium dichloride, dicyclopentadienyltitanium bisphenyl, dicyclopentadienyltitanium bis(2,3,4,5,6-pentafluorophenyl), dicyclopentadienyltitanium bis(2,3,5,6-tetrafluorophenyl), dicyclopentadienyltitanium bis(2,4,6-trifluorophenyl), dicyclopentadienyltitanium di(2,6-difluorophenyl), dicyclopentadienyltitanium di(2,4-difluorophenyl), di(methylcyclopentadienyl)titanium bis(2,3,4,5,6-pentafluorophenyl), di(methylcyclopentadienyl)titanium bis(2,6-difluorophenyl), and dicyclopentadienyltitanium[2,6-difluoro-3-(pyrrol-1-yl)phenyl].

[0019] Examples of biimidazole derivatives include 2-(2'-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-chlorophenyl)-4,5-bis(3'-methoxyphenyl)imidazole dimer, 2-(2'-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-methoxyphenyl)-4,5-diphenylimidazole dimer, and (4'-methoxyphenyl)-4,5-diphenylimidazole dimer.

[0020] Examples of halomethylated oxadiazole derivatives include 2-trichloromethyl-5-(2'-benzofuryl)-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-benzofuryl)vinyl]-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-(6''-benzofuryl)vinyl)]-1,3,4-oxadiazole, and 2-trichloromethyl-5-furyl-1,3,4-oxadiazole.

[0021] Examples of halomethyl-s-triazine derivatives include 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-ethoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(4-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine.

[0022] Examples of α-aminoalkylphenone derivatives include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one, and 3,6-bis(2-methyl-2-morpholinopropionyl)-9-octylcarbazole.

[0023] As the (A) photopolymerization initiator, an oxime ester-based compound is preferred from the viewpoints of sensitivity and plate-making properties. In particular, when an alkali-soluble resin containing a phenolic hydroxyl group is used in the photosensitive resin composition, an oxime ester-based compound is more effective. Oxime ester-based compounds have a high quantum yield of photoreaction and the radicals they generate are highly active, so that even a small amount of the compound provides high sensitivity and is stable against thermal reactions, making it possible to obtain a highly sensitive photosensitive resin composition with a small amount of the compound.

[0024] Examples of the oxime ester compound include compounds represented by the following general formula (A1).

[0025]

[0026] In formula (A1), R e21a represents a hydrogen atom, an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent. e21b represents any functional group containing an aromatic ring. e22a represents an alkanoyl group which may have a substituent, or an aroyl group which may have a substituent.

[0027] n represents an integer of 0 or 1. e21a In the formula, the number of carbon atoms in the alkyl group is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is preferably 1 or more, more preferably 2 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a cyclopentylmethyl group, a cyclopentylethyl group, and a cyclohexylmethyl group.

[0028] Examples of the substituent that the alkyl group may have include an aromatic ring group, a hydroxyl group, a carboxy group, a halogen atom, an amino group, an amide group, a 4-(2-methoxy-1-methyl)ethoxy-2-methylphenyl group, an N-acetyl-N-acetoxyamino group, a methoxycarbonyl group, and an ethoxycarbonyl group. From the viewpoint of ease of synthesis, the alkyl group is preferably unsubstituted, and from the viewpoints of sensitivity and ink repellency, a methoxycarbonyl group or an ethoxycarbonyl group is preferred.

[0029] R e21a Examples of the aromatic ring group in include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is not particularly limited, but is preferably 5 or more from the viewpoint of solubility in the photosensitive resin composition. Furthermore, from the viewpoint of developability, the number of carbon atoms is preferably 30 or less, more preferably 20 or less, and even more preferably 12 or less. For example, 5 to 30 is preferred, more preferably 5 to 20, and even more preferably 5 to 12.

[0030] Examples of the aromatic ring group include a phenyl group, a naphthyl group, a pyridyl group, and a furyl group. From the viewpoint of developability, a phenyl group and a naphthyl group are preferred, and a phenyl group is more preferred. Examples of the substituent that the aromatic ring group may have include a hydroxyl group, a carboxyl group, a halogen atom, an amino group, an amide group, an alkyl group, an alkoxy group, and a group in which these substituents are linked, and from the viewpoint of developability, an alkyl group, an alkoxy group, and a group in which these are linked are preferred, and a linked alkoxy group is more preferred.

[0031] From the viewpoint of sensitivity, R e21a is preferably an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent. e21b As the alkyl group, an optionally substituted carbazolyl group, an optionally substituted thioxanthonyl group, an optionally substituted diphenyl sulfide group, an optionally substituted fluorenyl group, or an optionally substituted indolyl group is preferred. From the viewpoint of sensitivity, an optionally substituted carbazolyl group is more preferred, and from the viewpoints of development solubility and inkjet coating properties, a diphenyl sulfide group is more preferred.

[0032] R e22a The number of carbon atoms in the alkanoyl group is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is preferably 2 or more, and preferably 20 or less, more preferably 15 or less, even more preferably 10 or less, and still more preferably 5 or less. For example, 2 to 20 is preferred, 2 to 15 is more preferred, 2 to 10 is even more preferred, and 2 to 5 is even more preferred.

[0033] Examples of the alkanoyl group include an acetyl group, a propanoyl group, and a butanoyl group. Examples of the substituent that the alkanoyl group may have include an aromatic ring group, a hydroxyl group, a carboxyl group, a halogen atom, an amino group, and an amide group. From the viewpoint of ease of synthesis, it is preferable that the alkanoyl group is unsubstituted.

[0034] R e22a The number of carbon atoms in the aroyl group is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is preferably 7 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. For example, it is preferably 7 to 20, more preferably 7 to 15, and even more preferably 7 to 10. Examples of the aroyl group include a benzoyl group and a naphthoyl group.

[0035] Examples of the substituent that the aroyl group may have include a hydroxyl group, a carboxyl group, a halogen atom, an amino group, an amide group, and an alkyl group. From the viewpoint of ease of synthesis, it is preferable that the aroyl group is unsubstituted. From the viewpoint of sensitivity, R e22a is preferably an alkanoyl group which may have a substituent, more preferably an unsubstituted alkanoyl group, and even more preferably an acetyl group.

[0036] For example, Japanese Patent No. 4454067, International Publication No. 2002 / 100903, International Publication No. 2012 / 45736, International Publication No. 2015 / 36910, International Publication No. 2006 / 18973, International Publication No. 2008 / 78678, Japanese Patent No. 4818458, International Publication No. 2005 / 80338, International Publication No. Photopolymerization initiators described in WO 2008 / 75564, WO 2009 / 131189, WO 2010 / 133077, WO 2010 / 102502, WO 2012 / 68879, WO 2021 / 175855, and JP 2016-133574 can be used.

[0037] As the oxime ester compound, the following oxime ester compounds (A1-1) to (A1-6) are more preferred, (A1-3) and (A1-6) are even more preferred, and (A1-6) is particularly preferred.

[0038]

[0039] The (A) photopolymerization initiator may be used alone or in combination of two or more. If necessary, a sensitizing dye and a polymerization accelerator may be blended with the (A) photopolymerization initiator in accordance with the wavelength of the imagewise exposure light source in order to increase sensitivity. Examples of sensitizing dyes include xanthene dyes described in JP-A-4-221958 and JP-A-4-219756; coumarin dyes having a heterocycle described in JP-A-3-239703 and JP-A-5-289335; 3-ketocoumarin compounds described in JP-A-3-239703 and JP-A-5-289335; pyrromethene dyes described in JP-A-6-19240; and the like. Examples of dyes having a dialkylaminobenzene skeleton include those described in JP-B No. 45-37377, JP-A No. 48-84183, JP-A No. 52-112681, JP-A No. 58-15503, JP-A No. 60-88005, JP-A No. 59-56403, JP-A No. 2-69, JP-A No. 57-168088, JP-A No. 5-107761, JP-A No. 5-210240, and JP-A No. 4-288818.

[0040] The sensitizing dye is preferably an amino group-containing sensitizing dye, and more preferably a compound having an amino group and a phenyl group in the same molecule. Examples thereof include benzophenone compounds such as 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 2-aminobenzophenone, 4-aminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, and 3,4-diaminobenzophenone; 2-(p-dimethylaminophenyl)benzoxazole, 2-(p-diethylaminophenyl)benzoxazole, 2-(p-dimethylaminophenyl)benzo[4,5]benzoxazole, 2-(p-dimethylaminophenyl)benzo[6,7]benzoxazole, 2,5-bis(p-diethylaminophenyl)-1,3,4-oxazole, and 2-(p-dimethylaminophenyl)benzo[4,5]benzoxazole. More preferred are p-dialkylaminophenyl group-containing compounds such as (p-dimethylaminophenyl)benzothiazole, 2-(p-diethylaminophenyl)benzothiazole, 2-(p-dimethylaminophenyl)benzimidazole, 2-(p-diethylaminophenyl)benzimidazole, 2,5-bis(p-diethylaminophenyl)-1,3,4-thiadiazole, (p-dimethylaminophenyl)pyridine, (p-diethylaminophenyl)pyridine, (p-dimethylaminophenyl)quinoline, (p-diethylaminophenyl)quinoline, (p-dimethylaminophenyl)pyrimidine, and (p-diethylaminophenyl)pyrimidine, with 4,4'-dialkylaminobenzophenone being particularly preferred. One type of sensitizing dye may be used alone, or two or more types may be used in combination.

[0041] Examples of the polymerization accelerator that can be used include aromatic amines such as ethyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 4-dimethylaminoacetophenone, and 4-dimethylaminopropiophenone, and aliphatic amines such as n-butylamine, N-methyldiethanolamine, and 2-dimethylaminoethyl benzoate.

[0042] The polymerization accelerator may be used alone or in combination of two or more. The content of the (A) photopolymerization initiator in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 1% by mass or more, even more preferably 2% by mass or more, and particularly preferably 3% by mass or more, relative to the total solids content of the photosensitive resin composition. It is also preferably 25% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, even more preferably 12% by mass or less, particularly preferably 10% by mass or less, and most preferably 8% by mass or less. The above upper and lower limits can be arbitrarily combined. For example, 0.01 to 25% by mass is preferred, 0.01 to 20% by mass is more preferred, 0.1 to 15% by mass is even more preferred, 1 to 10% by mass is even more preferred, 2 to 8% by mass is particularly preferred, and 3 to 8% by mass is particularly preferred. By using a content equal to or greater than the above lower limit, ink repellency tends to be improved. By adjusting the amount to the upper limit or less, the amount of residue tends to be reduced.

[0043] The blending ratio of the (A) photopolymerization initiator to the (C) photopolymerizable compound in the photosensitive resin composition is preferably 1 part by mass or more, more preferably 2 parts by mass or more, even more preferably 4 parts by mass or more, even more preferably 6 parts by mass or more, and particularly preferably 10 parts by mass or more, per 100 parts by mass of the (C) photopolymerizable compound. It is also preferably 200 parts by mass or less, more preferably 100 parts by mass or less, even more preferably 50 parts by mass or less, and particularly preferably 30 parts by mass or less. The above upper and lower limits can be arbitrarily combined. For example, 1 to 200 parts by mass is preferred, 2 to 200 parts by mass is more preferred, 4 to 100 parts by mass is even more preferred, 6 to 50 parts by mass is even more preferred, and 10 to 30 parts by mass is particularly preferred. By adjusting the blending ratio to be equal to or greater than the lower limit, ink repellency tends to be improved. By adjusting the blending ratio to be equal to or less than the upper limit, residue tends to be reduced.

[0044] [1-1-2] Component (B): Alkali-Soluble Resin The photosensitive resin composition of the present invention contains (B) an alkali-soluble resin. The alkali-soluble resin is not particularly limited as long as it is a resin that can be developed with an alkaline developer. Examples of the alkali-soluble resin include various resins containing a carboxy group and / or a hydroxyl group. Among these, a resin having a carboxy group is preferred from the viewpoints of obtaining partition walls with an appropriate taper angle, suppressing outflow of the liquid repellent agent due to thermal melting of the partition wall surface during post-baking, and maintaining ink repellency.

[0045] [Alkali-soluble resin (b) having an ethylenic double bond] In the photosensitive resin composition of the present invention, the alkali-soluble resin (B) preferably contains an alkali-soluble resin (b) having an ethylenic double bond (hereinafter, may be abbreviated as "alkali-soluble resin (b)"). By containing the alkali-soluble resin (b) having an ethylenic double bond, sensitivity increases and outflow of the liquid repellent agent during development is suppressed, which tends to improve the ink repellency of the resulting partition walls.

[0046] The specific structure of the alkali-soluble resin (b) having an ethylenic double bond is not particularly limited, but from the viewpoint of solubility in development, an epoxy(meth)acrylate resin (B1) and / or an acrylic copolymer resin (B2) is preferred, and from the viewpoint of reducing outgassing, an epoxy(meth)acrylate resin (B1) is more preferred. The epoxy(meth)acrylate resin (B1) is described in detail below.

[0047] [Epoxy (meth)acrylate resin (B1)] The epoxy (meth)acrylate resin (B1) is a resin obtained by adding an acid or ester compound having an ethylenically unsaturated bond (ethylenic double bond) to an epoxy resin, and then adding a polybasic acid or its anhydride. For example, a resin obtained by ring-opening addition of a carboxy group of an acid having an ethylenically unsaturated bond to the epoxy group of the epoxy resin, thereby adding an ethylenically unsaturated bond to the epoxy resin via an ester bond (—COO—), and adding one carboxy group of a polybasic acid anhydride to the hydroxyl group generated during this process. Another example is a resin obtained by simultaneously adding a polyhydric alcohol when adding the polybasic acid anhydride. Furthermore, resins obtained by reacting a compound having a further reactive functional group with the carboxy group of the resin obtained by the above reaction are also included in the epoxy (meth)acrylate resin (B1).

[0048] It should be noted that resins corresponding to the resin (B3) containing an isocyanuric skeleton described below are not included in the epoxy (meth)acrylate resin (B1). As described above, epoxy (meth)acrylate resins have substantially no epoxy groups in their chemical structure and are not limited to "(meth)acrylates." However, since epoxy compounds (epoxy resins) are used as raw materials and "(meth)acrylates" are a representative example, they are named as such according to convention.

[0049] Furthermore, from the viewpoint of outgassing, an epoxy (meth)acrylate resin having an aromatic ring in the main chain is more preferably used as the epoxy (meth)acrylate resin (B1). Here, the term "epoxy resin" refers to the raw material compound before it is thermoset to form a resin, and the epoxy resin can be appropriately selected from known epoxy resins. Furthermore, the epoxy resin can be a compound obtained by reacting a phenolic compound with an epihalohydrin. The phenolic compound is preferably a compound having a divalent or more divalent phenolic hydroxyl group, and may be a monomer or a polymer.

[0050] Specific examples include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, biphenyl novolac epoxy resins, trisphenol epoxy resins, epoxidized products of polymers of phenol and dicyclopentadiene, dihydroxylfluorene type epoxy resins, dihydroxylalkyleneoxylfluorene type epoxy resins, diglycidyl ethers of 9,9-bis(4'-hydroxyphenyl)fluorene, and diglycidyl ethers of 1,1-bis(4'-hydroxyphenyl)adamantane, and those having an aromatic ring in the main chain can be preferably used.

[0051] Among these, from the viewpoint of cured film strength, bisphenol A type epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, epoxidized products of polymers of phenol and dicyclopentadiene, and epoxidized products of 9,9-bis(4'-hydroxyphenyl)fluorene are preferred, with bisphenol A type epoxy resins being more preferred. Examples of acids having an ethylenically unsaturated bond include (meth)acrylic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, pentaerythritol tri(meth)acrylate succinic anhydride adduct, pentaerythritol tri(meth)acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta(meth)acrylate succinic anhydride adduct, dipentaerythritol penta(meth)acrylate phthalic anhydride adduct, dipentaerythritol penta(meth)acrylate tetrahydrophthalic anhydride adduct, and reaction products of (meth)acrylic acid and ε-caprolactone. Among these, (meth)acrylic acid is preferred from the viewpoint of sensitivity.

[0052] Examples of polybasic acids (anhydrides) include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, and anhydrides thereof. These may be used alone or in combination of two or more. Among these, from the viewpoint of reducing residues in pixel areas after development, succinic anhydride, maleic anhydride, and itaconic anhydride are preferred, and succinic anhydride is more preferred.

[0053] The use of a polyhydric alcohol increases the molecular weight of the epoxy (meth)acrylate resin (B1), allows for the introduction of branches into the molecule, and tends to balance the molecular weight and viscosity. Furthermore, the introduction rate of acid groups into the molecule can be increased, which tends to make it easier to balance sensitivity, adhesion, and the like. Examples of polyhydric alcohols include trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol. These may be used alone or in combination of two or more.

[0054] The acid value of the epoxy (meth)acrylate resin (B1) is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, even more preferably 40 mgKOH / g or more, even more preferably 60 mgKOH / g or more, and is preferably 200 mgKOH / g or less, more preferably 180 mgKOH / g or less, even more preferably 150 mgKOH / g or less, even more preferably 120 mgKOH / g or less, and particularly preferably 100 mgKOH / g or less. The upper and lower limits can be arbitrarily combined, for example, 10 to 200 mgKOH / g is preferred, 10 to 180 mgKOH / g is more preferred, 20 to 150 mgKOH / g is even more preferred, 40 to 120 mgKOH / g is even more preferred, and 60 to 100 mgKOH / g is particularly preferred. By setting the acid value at or above the lower limit, residue is likely to be reduced. Furthermore, by setting the content to the upper limit or less, outgassing during light emission from the device tends to be reduced.

[0055] The weight average molecular weight (Mw) of the epoxy (meth)acrylate resin (B1) is not particularly limited, but is preferably 1,000 or more, more preferably 2,000 or more, even more preferably 3,000 or more, even more preferably 4,000 or more, particularly preferably 5,000 or more, particularly preferably 6,000 or more, and most preferably 7,000 or more, and is preferably 30,000 or less, more preferably 20,000 or less, even more preferably 15,000 or less, and particularly preferably 10,000 or less. The upper and lower limits can be arbitrarily combined, and are preferably 1,000 to 30,000, more preferably 2,000 to 30,000, even more preferably 3,000 to 20,000, even more preferably 4,000 to 20,000, particularly preferably 5,000 to 15,000, particularly preferably 6,000 to 15,000, and most preferably 7,000 to 10,000. By setting the Mw at or above the lower limit, outgassing during device light emission tends to be reduced. Furthermore, by making the content equal to or less than the upper limit, there is a tendency for residue to be reduced.

[0056] The epoxy (meth)acrylate resin (B1) can be synthesized by a conventional method. Specifically, a method can be used in which the epoxy resin is dissolved in an organic solvent, and the acid or ester compound having an ethylenically unsaturated bond is added in the presence of a catalyst and a thermal polymerization inhibitor to cause an addition reaction. A polybasic acid or its anhydride is then added to continue the reaction. Examples of organic solvents include methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate. Examples of catalysts include tertiary amines such as triethylamine, benzyldimethylamine, and tribenzylamine; quaternary ammonium salts such as tetramethylammonium chloride, methyltriethylammonium chloride, tetraethylammonium chloride, tetrabutylammonium chloride, and trimethylbenzylammonium chloride; phosphorus compounds such as triphenylphosphine; and stibines such as triphenylstibine. Examples of thermal polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, and methylhydroquinone.

[0057] These may be used alone or in combination of two or more. The acid or ester compound having an ethylenically unsaturated bond can be used in an amount that is preferably 0.7 to 1.3 chemical equivalents, more preferably 0.9 to 1.1 chemical equivalents, per chemical equivalent of the epoxy group of the epoxy resin. The temperature during the addition reaction is preferably 60 to 150°C, more preferably 80 to 120°C. The polybasic acid (anhydride) can be used in an amount that is preferably 0.1 to 1.2 chemical equivalents, more preferably 0.2 to 1.1 chemical equivalents, per chemical equivalent of the hydroxyl group generated by the addition reaction.

[0058] From the viewpoint of outgassing during device light emission, the epoxy (meth)acrylate resin (B1) preferably contains at least one selected from the group consisting of an epoxy (meth)acrylate resin (B1-1) containing a partial structure represented by the following general formula (i) (hereinafter may be referred to as "epoxy (meth)acrylate resin (B1-1)"), an epoxy (meth)acrylate resin (B1-2) containing a partial structure represented by the following general formula (ii) (hereinafter may be referred to as "epoxy (meth)acrylate resin (B1-2)"), and an epoxy (meth)acrylate resin (B1-3) containing a partial structure represented by the following general formula (iii) (hereinafter may be referred to as "epoxy (meth)acrylate resin (B1-3)").

[0059] Among these, from the viewpoint of reducing outgassing during device light emission, the epoxy (meth)acrylate resin (B1) preferably contains an epoxy (meth)acrylate resin (B1-1) containing a partial structure represented by the following general formula (i), and more preferably an epoxy (meth)acrylate resin (B1-1) containing a partial structure represented by the following general formula (i): One of the reasons for this is presumed to be that the resin has a rigid main skeleton and is therefore less susceptible to thermal decomposition.

[0060]

[0061] In formula (i), R ｂ１１ represents a hydrogen atom or a methyl group, R b１２ represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) may be further substituted with an arbitrary substituent. k represents an integer of 1 or 2. * represents a bond.

[0062] (R b１２ In formula (i), R b１２represents a divalent hydrocarbon group which may have a substituent. Examples of divalent hydrocarbon groups include divalent aliphatic groups, divalent aromatic cyclic groups, and groups in which one or more divalent aliphatic groups are linked to one or more divalent aromatic cyclic groups. Examples of divalent aliphatic groups include linear, branched, and cyclic aliphatic groups. From the viewpoint of development solubility, linear aliphatic groups are preferred, while cyclic aliphatic groups are preferred from the viewpoint of reducing penetration of a developer into exposed areas. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 20 is preferred, 3 to 15 is more preferred, and 6 to 10 is even more preferred. By setting the number of carbon atoms at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number of carbon atoms at or below the upper limit, residue tends to be reduced.

[0063] Examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group, and an n-heptylene group. From the viewpoint of reducing residue, a methylene group is preferred. Examples of the divalent branched aliphatic group include a structure in which the above-mentioned divalent linear aliphatic group has a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, or a tert-butyl group as a side chain.

[0064] The number of rings in the divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 5 is even more preferred. By setting the number at or above the lower limit, the film residual rate tends to be improved. Furthermore, by setting the number at or below the upper limit, the residue tends to be reduced. Examples of divalent cyclic aliphatic groups include groups in which two hydrogen atoms have been removed from a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. From the viewpoint of development adhesion, groups in which two hydrogen atoms have been removed from an adamantane ring are preferred.

[0065] Examples of substituents that the divalent aliphatic group may have include alkoxy groups having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred. Examples of divalent aromatic ring groups include divalent aromatic hydrocarbon ring groups and divalent aromatic heterocyclic groups. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The upper and lower limits can be arbitrarily combined; for example, 4 to 20 is preferred, 5 to 15 is more preferred, and 6 to 10 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0066] The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring, each of which has two free valences.

[0067] The aromatic heterocycle in the divalent aromatic heterocyclic group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, an indole ring, a carbazole ring, a pyrroloimidazole ring, a pyrrolopyrazole ring, a pyrrolopyrrole ring, a thienopyrrole ring, a thienothiophene ring, a furopyrrole ring, a furofuran ring, a thienofuran ring, a benzisoxazole ring, a benzisothiazole ring, a benzimidazole ring, a pyridine ring, a pyrazine ring, a pyridazine ring, a pyrimidine ring, a triazine ring, a quinoline ring, an isoquinoline ring, a cinnoline ring, a quinoxaline ring, a phenanthridine ring, a perimidine ring, a quinazoline ring, a quinazolinone ring, and an azulene ring, each of which has two free valences. From the viewpoint of photocurability, a benzene ring or a naphthalene ring having two free valences is preferred, and a benzene ring having two free valences is more preferred.

[0068] As the substituent that the divalent aromatic ring group may have, for example, hydroxyl group, methyl group, methoxy group, ethyl group, ethoxy group, propyl group, propoxy group, glycidyl ether group can be mentioned.Among these, from the viewpoint of curability, unsubstituted is preferred.As the group that one or more divalent aliphatic groups and one or more divalent aromatic ring groups are linked, one or more of the above-mentioned divalent aliphatic groups and one or more of the above-mentioned divalent aromatic ring groups can be mentioned.

[0069] The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0070] The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0071] Examples of the group formed by linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include groups represented by the following formulae (i-A) to (i-F). From the viewpoint of improving outgassing due to the rigidity of the skeleton, the group represented by the following formula (i-A) is preferred. * in the chemical formula represents a bond.

[0072]

[0073] The benzene ring in formula (i) may be further substituted with any substituent. Examples of the substituent on the benzene ring in formula (i) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more as long as it is chemically acceptable. From the viewpoint of curability, non-substitution is preferred.

[0074] (k) When k=2, curability tends to be improved, which is preferable. In addition, a partial structure where k=1 and a partial structure where k=2 may coexist in the same molecule. From the viewpoint of development solubility, the partial structure represented by formula (i) is preferably a partial structure represented by the following formula (i-1):

[0075]

[0076] In formula (i-1), R ｂ１１ , R b１２ , and k have the same meanings as in formula (i). Ｘ represents a hydrogen atom or a polybasic acid residue. * represents a bond. The benzene ring in formula (i-1) may be further substituted with any substituent. R ｘThe polybasic acid residue in the formula (I) means a monovalent or divalent group obtained by removing one or two OH groups from a polybasic acid. Examples of polybasic acids include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, benzophenonetetracarboxylic acid, methylhexahydrophthalic acid, endomethylenetetrahydrophthalic acid, chlorendic acid, methyltetrahydrophthalic acid, and biphenyltetracarboxylic acid.

[0077] From the viewpoint of patterning properties, preferred are maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, and biphenyltetracarboxylic acid, and more preferred are tetrahydrophthalic acid and biphenyltetracarboxylic acid. The benzene ring in formula (i-1) may be further substituted with any substituent. As the substituent, the substituents exemplified for the benzene ring in formula (i) can be preferably used.

[0078] The partial structure represented by formula (B1-1) contained in one molecule of the epoxy (meth)acrylate resin (B1) may be one type or two or more types. For example, X is a partial structure of a hydrogen atom, and R X However, partial structures of polybasic acid residues may be present in the mixture. The number of partial structures represented by formula (i-1) contained in one molecule of the epoxy (meth)acrylate resin (B1) is not particularly limited, but is preferably 1 or more, more preferably 3 or more. It is also preferably 20 or less, and even more preferably 15 or less. The above upper and lower limits can be arbitrarily combined. 1 to 20 is preferred, 1 to 15 is more preferred, and 3 to 15 is even more preferred. By making the number equal to or greater than the lower limit, outgassing tends to be reduced. By making the number equal to or less than the upper limit, developability tends to be improved.

[0079] The partial structure represented by formula (i-1) contained in one molecule of the epoxy (meth)acrylate resin (B1-1) may be one type or two or more types. The number of partial structures represented by formula (i) contained in one molecule of the epoxy (meth)acrylate resin (B1-1) is not particularly limited, but is preferably one or more, more preferably two or more, even more preferably three or more, and is preferably 10 or less, even more preferably eight or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 8 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced. Specific examples of the epoxy (meth)acrylate resin (B1-1) are listed below.

[0080]

[0081]

[0082]

[0083]

[0084]

[0085]

[0086]

[0087]

[0088]

[0089] In another embodiment, the epoxy (meth)acrylate resin (B1) is preferably an epoxy (meth)acrylate resin (B1-2) containing a partial structure represented by the following formula (ii) from the viewpoint of development adhesion.

[0090]

[0091] In formula (ii), R ｂ１３ R each independently represents a hydrogen atom or a methyl group. ｂ１４ represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. * represents a bond.

[0092] (R ｂ１４ In formula (ii), R ｂ１４ represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. Examples of the cyclic hydrocarbon group include an aliphatic cyclic group and an aromatic cyclic group. The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0093] The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 4 to 30 is more preferred, 6 to 20 is even more preferred, and 8 to 15 is particularly preferred. By setting the carbon number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the carbon number at or below the upper limit, residue tends to be reduced.

[0094] Examples of the aliphatic ring in the aliphatic cyclic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, an adamantane ring is preferred from the viewpoint of development adhesion. The number of rings in the aromatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 4 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 5 is more preferred, and 3 to 4 is even more preferred. By setting the number at or above the lower limit, residue tends to be reduced. Furthermore, by setting the number at or below the upper limit, development adhesion tends to be improved.

[0095] Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, even more preferably 10 or more, and particularly preferably 12 or more. It is also preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 4 to 40 is preferred, 6 to 40 is more preferred, 8 to 30 is more preferred, even more preferably 10 to 20, and particularly preferably 12 to 15. Setting the carbon number at or above the lower limit tends to reduce residue. Setting the carbon number at or below the upper limit tends to improve development adhesion.

[0096] Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. From the viewpoint of patterning properties, a fluorene ring is preferred. The divalent hydrocarbon group in the divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is not particularly limited, and examples thereof include a divalent aliphatic group, a divalent aromatic ring group, and a group in which one or more divalent aliphatic groups are linked to one or more divalent aromatic ring groups.

[0097] Examples of the divalent aliphatic group include linear, branched, and cyclic aliphatic groups. From the viewpoint of development solubility, linear aliphatic groups are preferred, while cyclic aliphatic groups are preferred from the viewpoint of reducing penetration of the developer into the exposed area. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, and preferably 25 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 25 is preferred, 3 to 20 is more preferred, and 6 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0098] Examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group, and an n-heptylene group. From the viewpoint of residues, a methylene group is preferred. Examples of the divalent branched aliphatic group include a structure in which the above-mentioned divalent linear aliphatic group has a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, or a tert-butyl group as a side chain.

[0099] The number of rings in the divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0100] Examples of the divalent cyclic aliphatic group include groups in which two hydrogen atoms have been removed from a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, or an adamantane ring. From the viewpoint of development adhesion, a group in which two hydrogen atoms have been removed from an adamantane ring is preferred. Examples of the substituent that the divalent aliphatic group may have include alkoxy groups having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0101] Examples of divalent aromatic ring groups include divalent aromatic hydrocarbon ring groups and divalent aromatic heterocyclic groups. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, and preferably 30 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 6 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0102] The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring, each of which has two free valences.

[0103] The aromatic heterocycle in the divalent aromatic heterocyclic group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, an indole ring, a carbazole ring, a pyrroloimidazole ring, a pyrrolopyrazole ring, a pyrrolopyrrole ring, a thienopyrrole ring, a thienothiophene ring, a furopyrrole ring, a furofuran ring, a thienofuran ring, a benzisoxazole ring, a benzisothiazole ring, a benzimidazole ring, a pyridine ring, a pyrazine ring, a pyridazine ring, a pyrimidine ring, a triazine ring, a quinoline ring, an isoquinoline ring, a cinnoline ring, a quinoxaline ring, a phenanthridine ring, a perimidine ring, a quinazoline ring, a quinazolinone ring, and an azulene ring, each of which has two free valences. From the viewpoint of photocurability, a benzene ring or a naphthalene ring having two free valences is preferred, and a benzene ring having two free valences is more preferred.

[0104] Examples of the substituent that the divalent aromatic ring group may have include, for example, a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group.Among these, from the viewpoint of curability, unsubstituted is preferred.As the group that one or more divalent aliphatic groups and one or more divalent aromatic ring groups are linked, examples include the group that one or more of the above-mentioned divalent aliphatic groups are linked with one or more of the above-mentioned divalent aromatic ring groups.

[0105] The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0106] The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0107] Examples of the group linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include groups represented by formulae (i-A) to (i-F). From the viewpoint of reducing residue, a group represented by formula (i-C) is preferred. The bonding mode of the cyclic hydrocarbon group serving as a side chain to these divalent hydrocarbon groups is not particularly limited, but examples include a mode in which one hydrogen atom of the aliphatic group or aromatic ring group is substituted with the side chain, and a mode in which one carbon atom of the aliphatic group is included to form the cyclic hydrocarbon group serving as a side chain.

[0108] From the viewpoint of development adhesion, the partial structure represented by formula (ii) is preferably a partial structure represented by the following formula (ii-1):

[0109]

[0110] In formula (ii-1), R ｂ１３ has the same meaning as in formula (ii). α represents a monovalent cyclic hydrocarbon group which may have a substituent. p is an integer of 1 or more. The benzene ring in formula (ii-1) may be further substituted with an arbitrary substituent. * represents a bond.

[0111] (R αIn formula (ii-1), R α represents a monovalent cyclic hydrocarbon group which may have a substituent. Examples of the cyclic hydrocarbon group include an aliphatic cyclic group and an aromatic cyclic group. The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 6 are preferred, 1 to 4 are more preferred, and 2 to 3 are even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0112] The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 4 to 30 is more preferred, 6 to 20 is even more preferred, and 8 to 15 is particularly preferred. By setting the carbon number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the carbon number at or below the upper limit, residue tends to be reduced.

[0113] Examples of the aliphatic ring in the aliphatic cyclic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. From the viewpoint of development adhesion, an adamantane ring is preferred. The number of rings in the aromatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0114] Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 5 or more, more preferably 6 or more, and preferably 30 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 6 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. By setting the number at or below the upper limit, residue tends to be reduced.

[0115] Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. From the viewpoint of development adhesion, a fluorene ring is preferred. Examples of the substituent that the cyclic hydrocarbon group may have include an alkyl group having 1 to 5 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, an amyl group, and an isoamyl group; an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0116] p represents an integer of 1 or more, preferably 2 or more, and more preferably 3 or less. For example, 1 to 3 is preferred, and 1 to 2 is more preferred. By making p equal to or greater than the lower limit, there is a tendency for development adhesion to be improved. On the other hand, by making p equal to or less than the upper limit, there is a tendency for residue to be reduced. From the viewpoint of strong film hardness and electrical properties, R α is preferably a monovalent aliphatic cyclic group, more preferably an adamantyl group.

[0117] The benzene ring in formula (ii-1) may be further substituted with any substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, unsubstituted groups are preferred. Specific examples of the partial structure represented by formula (ii-1) are listed below.

[0118]

[0119]

[0120]

[0121]

[0122]

[0123] The partial structure represented by formula (ii) is preferably a partial structure represented by the following formula (ii-2) from the viewpoint of development adhesion.

[0124]

[0125] In formula (ii-2), R ｂ１３ has the same meaning as in formula (ii). β represents a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (ii-2) may be further substituted with any substituent. * represents a bond.

[0126] (R β In formula (ii-2), R β represents a divalent cyclic hydrocarbon group which may have a substituent. Examples of the cyclic hydrocarbon group include an aliphatic cyclic group and an aromatic cyclic group. The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, and 2 to 5 is more preferred. By setting the number to be equal to or greater than the lower limit, development adhesion tends to be improved. Furthermore, by setting the number to be equal to or less than the upper limit, residue tends to be reduced.

[0127] The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 35 or less, and even more preferably 30 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 35 is more preferred, and 8 to 30 is even more preferred. By setting the carbon number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the carbon number at or below the upper limit, residue tends to be reduced.

[0128] Examples of the aliphatic ring in the aliphatic cyclic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. From the viewpoint of development adhesion, an adamantane ring is preferred. The number of rings in the aromatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, and more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0129] Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and even more preferably 10 or more. It is also preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 30 is more preferred, 8 to 20 is even more preferred, and 10 to 15 is particularly preferred. By setting the carbon number at or above the lower limit, development adhesion tends to be improved. By setting the carbon number at or below the upper limit, residue tends to be reduced.

[0130] Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. From the viewpoint of development adhesion, a fluorene ring is preferred. Examples of the substituent that the cyclic hydrocarbon group may have include an alkyl group having 1 to 5 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, an amyl group, and an isoamyl group; an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, an unsubstituted group is preferred.

[0131] From the viewpoint of curability, R βis preferably a divalent aliphatic ring group, and more preferably a divalent adamantane ring group. β is preferably a divalent aromatic ring group, and more preferably a divalent fluorene ring group. The benzene ring in formula (ii-2) may be further substituted with any substituent. Examples of the substituent on the benzene ring in formula (ii-2) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, unsubstituted groups are preferred. Specific examples of the partial structure represented by formula (ii-2) are listed below.

[0132]

[0133]

[0134]

[0135]

[0136] From the viewpoint of curability, the partial structure represented by formula (ii) is preferably a partial structure represented by the following formula (ii-3):

[0137]

[0138] In formula (ii-3), R ｂ１３ and R ｂ１４ has the same meaning as in formula (ii). Y１ , R Y２ are each independently, and R in formula (i-1) ｘ The symbol * represents a bond. The partial structure represented by formula (ii-3) contained in one molecule of the epoxy (meth)acrylate resin (B1-2) may be of one type or of two or more types.

[0139] The number of partial structures represented by formula (ii) contained in one molecule of the epoxy (meth)acrylate resin (B1-2) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 20 is preferred, 1 to 15 is more preferred, and 3 to 10 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Furthermore, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0140] In yet another embodiment, the epoxy (meth)acrylate resin (B1) is preferably an epoxy (meth)acrylate resin (B1-3) containing a partial structure represented by the following formula (iii), from the viewpoint of reducing outgassing during device light emission:

[0141]

[0142] In formula (iii), R ｂ１５ represents a hydrogen atom or a methyl group, and γ represents a single bond, —CO—, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (iii) may be further substituted with an arbitrary substituent. * represents a bond.

[0143] (γ) In formula (iii), γ represents a single bond, —CO—, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent. The alkylene group may be linear or branched, but is preferably linear from the viewpoint of developer solubility, and is preferably branched from the viewpoint of developer adhesion. The number of carbon atoms is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 6 or less, more preferably 4 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 6 is preferred, and 2 to 4 is more preferred. By setting the number at or above the lower limit, developer adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0144] Examples of alkylene groups include methylene, ethylene, propylene, butylene, hexylene, and heptylene groups. From the viewpoint of achieving both excellent developer adhesion and excellent developer solubility, methylene, ethylene, and propylene groups are preferred, and dimethylmethylene (2,2-propylene) is more preferred. Examples of substituents that the alkylene group may have include alkoxy groups having 1 to 5 carbon atoms, such as methoxy and ethoxy groups; hydroxyl groups; nitro groups; cyano groups; and carboxy groups. From the viewpoint of achieving both excellent developer adhesion and excellent developer solubility, unsubstituted groups are preferred.

[0145] Examples of the divalent cyclic hydrocarbon group include a divalent aliphatic cyclic group or a divalent aromatic cyclic group. The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, and 2 to 5 is more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0146] The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 35 or less, and even more preferably 30 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 35 is more preferred, and 8 to 30 is even more preferred. By setting the carbon atom number at or above the lower limit, development adhesion tends to be improved. By setting the carbon atom number at or below the upper limit, residue tends to be reduced.

[0147] Examples of the aliphatic ring in the aliphatic cyclic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. From the viewpoint of development adhesion, an adamantane ring is preferred. The number of rings in the aromatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0148] Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and even more preferably 10 or more, and is preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 30 is more preferred, 8 to 20 is even more preferred, and 10 to 15 is particularly preferred. By setting the carbon number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the carbon number at or below the upper limit, residue tends to be reduced.

[0149] Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. From the viewpoint of development adhesion, a fluorene ring is preferred. Examples of the substituent that the cyclic hydrocarbon group may have include an alkyl group having 1 to 5 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, an amyl group, and an isoamyl group; an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0150] From the viewpoint of reducing residues, γ is preferably an alkylene group which may have a substituent, and more preferably dimethylmethylene. The benzene ring in formula (iii) may be further substituted with any substituent. Examples of the substituent on the benzene ring in formula (iii) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, unsubstituted groups are preferred.

[0151] From the viewpoint of development solubility, the partial structure represented by formula (iii) is preferably a partial structure represented by the following formula (iii-1):

[0152]

[0153] In formula (iii-1), R ｂ１５ , γ has the same meaning as in formula (iii). ｚ is R in formula (i-1) ｘ is synonymous with the above. * represents a bond. The benzene ring in formula (iii-1) may be further substituted with any substituent. The number of partial structures represented by formula (iii) contained in one molecule of epoxy (meth)acrylate resin (B1-3) is not particularly limited, but is preferably 1 or more, more preferably 5 or more, even more preferably 10 or more, and is preferably 18 or less, even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 18 is preferred, 5 to 18 is more preferred, and 10 to 15 is even more preferred. By setting the number to be equal to or greater than the lower limit, development adhesion tends to be improved. Furthermore, by setting the number to be equal to or less than the upper limit, residue tends to be reduced.

[0154] The number of partial structures represented by formula (iii-1) contained in one molecule of epoxy (meth)acrylate resin (B1-3) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, and is preferably 18 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 18 is preferred, 3 to 18 is more preferred, and 5 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced. Specific examples of epoxy (meth)acrylate resin (B1-3) are listed below.

[0155]

[0156]

[0157]

[0158] <Acrylic Copolymer Resin (B2)> From the viewpoint of compatibility with pigments, dispersants, etc., it is preferable to use an acrylic copolymer resin (B2) as the alkali-soluble resin (B), and the acrylic copolymer resins described in JP 2014-137466 A can be preferably used. Examples of the acrylic copolymer resin (B2) include copolymers of an ethylenically unsaturated monomer having one or more carboxy groups (hereinafter referred to as "unsaturated monomer (B2-1)") and another copolymerizable ethylenically unsaturated monomer (hereinafter referred to as "unsaturated monomer (B2-2)").

[0159] Examples of the unsaturated monomer (B2-1) include unsaturated monocarboxylic acids such as (meth)acrylic acid, crotonic acid, α-chloroacrylic acid, and cinnamic acid; unsaturated dicarboxylic acids or anhydrides thereof such as maleic acid, maleic anhydride, fumaric acid, citraconic acid, citraconic anhydride, and mesaconic acid; mono[(meth)acryloyloxyalkyl] esters of divalent or higher polyvalent carboxylic acids such as mono[2-(meth)acryloyloxyethyl] succinate and mono[2-(meth)acryloyloxyethyl] phthalate; mono(meth)acrylates of polymers having a carboxy group and a hydroxyl group at both ends, such as ω-carboxypolycaprolactone mono(meth)acrylate; and p-vinylbenzoic acid.

[0160] These unsaturated monomers (B2-1) can be used alone or in combination of two or more thereof. Examples of the unsaturated monomer (B2-2) include N-substituted maleimides such as N-phenylmaleimide and N-cyclohexylmaleimide; aromatic vinyl compounds such as styrene, α-methylstyrene, p-hydroxystyrene, p-hydroxy-α-methylstyrene, p-vinylbenzyl glycidyl ether, and acenaphthylene; Methyl (meth)acrylate, n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, polyethylene glycol (degree of polymerization 2-10) methyl ether (meth)acrylate, polypropylene glycol (degree of polymerization 2-10) methyl ether (meth)acrylate, polyethylene glycol (degree of polymerization 2-10) mono(meth)acrylate, polypropylene glycol (degree of polymerization 2-10) mono(meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, tricyclo[5.2.1.0] 2,6] (meth)acrylic acid esters such as decan-8-yl (meth)acrylate, dicyclopentenyl (meth)acrylate, glycerol mono(meth)acrylate, 4-hydroxyphenyl (meth)acrylate, ethylene oxide-modified (meth)acrylate of para-cumylphenol, glycidyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, 3-[(meth)acryloyloxymethyl]oxetane, and 3-[(meth)acryloyloxymethyl]-3-ethyloxetane; cyclohexyl vinyl ether, isobornyl vinyl ether, tricyclo[5.2.1.0 2,6 vinyl ethers such as decan-8-yl vinyl ether, pentacyclopentadecanyl vinyl ether, and 3-(vinyloxymethyl)-3-ethyloxetane; and macromonomers having a mono(meth)acryloyl group at the end of the polymer molecular chain, such as polystyrene, polymethyl(meth)acrylate, poly-n-butyl(meth)acrylate, and polysiloxane.

[0161] These unsaturated monomers (B2-2) can be used alone or in combination of two or more. In the copolymer of the unsaturated monomer (B2-1) and the unsaturated monomer (B2-2), the copolymerization ratio of the unsaturated monomer (B2-1) is preferably 5 to 50% by mass, and more preferably 10 to 40% by mass, relative to 100% by mass of the total of the unsaturated monomers (B2-1) and (B2-2). Copolymerizing the unsaturated monomer (B2-1) within such a range tends to make it possible to obtain a photosensitive composition that is excellent in alkali developability and storage stability.

[0162] Examples of the copolymer of the unsaturated monomer (B2-1) and the unsaturated monomer (B2-2) include the copolymers disclosed in Japanese Patent Application Laid-Open Nos. 7-140654, 8-259876, 10-31308, 10-300922, 11-174224, 11-258415, 2000-56118, and 2004-101728.

[0163] The copolymer of the unsaturated monomer (B2-1) and the unsaturated monomer (B2-2) can be produced by known methods, but for example, the structure, Mw, and Mw / Mn (Mn is the number average molecular weight) can also be controlled by the methods disclosed in JP 2003-222717 A, JP 2006-259680 A, and WO 2007 / 029871 A. In addition, as the acrylic copolymer resin (B2), resins described in WO 2016 / 194619 A and WO 2017 / 154439 A may also be used.

[0164] <Resin (B3) containing an isocyanuric skeleton> As the alkali-soluble resin (B), from the viewpoint of gas barrier properties, a resin (B3) containing an isocyanuric skeleton may be contained. Here, as the resin (B3), resins containing an isocyanuric skeleton described in International Publication No. 2022 / 215712, JP 2020-75994 A, and JP 2023-55623 A can be preferably used.

[0165] The alkali-soluble resin (B) may contain any one of the epoxy (meth)acrylate resin (B1), the acrylic copolymer resin (B2), and the resin (B3) containing an isocyanuric skeleton, either alone or in combination. Furthermore, other alkali-soluble resins may also be contained. The content of the alkali-soluble resin (B) in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, based on the total solids content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 70% by mass is even more preferred, 30 to 60% by mass is even more preferred, and 40 to 50% by mass is particularly preferred. By ensuring that the content is equal to or greater than the lower limit, developability tends to be improved. Furthermore, by making the amount equal to or less than the upper limit, outgassing during light emission from the device tends to be reduced.

[0166] When the photosensitive resin composition of the present invention contains an epoxy (meth)acrylate resin (B1), the content of the epoxy (meth)acrylate resin (B1) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 70% by mass is even more preferred, 30 to 60% by mass is even more preferred, and 40 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, developability tends to be improved. Furthermore, by setting the content at or below the upper limit, outgassing during device light emission tends to be reduced.

[0167] When the alkali-soluble resin (B) contains an epoxy (meth)acrylate resin (B1), the content of the epoxy (meth)acrylate resin (B1) contained in the alkali-soluble resin (B) is not particularly limited, but is preferably 30% by mass or more, more preferably 50% by mass or more, even more preferably 70% by mass or more, even more preferably 80% by mass or more, particularly preferably 90% by mass or more, and most preferably 95% by mass or more. Furthermore, it is typically 100% by mass or less. The upper and lower limits can be arbitrarily combined. For example, 30 to 100% by mass is preferred, 50 to 100% by mass is more preferred, 70 to 100% by mass is even more preferred, 80 to 100% by mass is even more preferred, and 90 to 100% by mass is particularly preferred. Setting the content at or above the lower limit tends to reduce outgassing.

[0168] The total content of the alkali-soluble resin (B) and the photopolymerizable compound (C) in the total solids content of the photosensitive resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, even more preferably 50% by mass or more, particularly preferably 70% by mass or more, even more particularly preferably 80% by mass or more, and most preferably 90% by mass or more, and is preferably 99% by mass or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less. The upper and lower limits can be arbitrarily combined; for example, 5 to 99% by mass is preferred, 10 to 99% by mass is more preferred, 30 to 99% by mass is even more preferred, 50 to 97% by mass is even more preferred, 70 to 97% by mass is particularly preferred, 80 to 95% by mass is particularly preferred, and 90 to 95% by mass is most preferred. Setting the content at or above the lower limit tends to improve curability. Setting the content at or below the upper limit tends to reduce outgassing during device light emission.

[0169] The blending ratio of the alkali-soluble resin (B) to the photopolymerizable compound (C) in the photosensitive resin composition is preferably 50 parts by mass or more, more preferably 60 parts by mass or more, even more preferably 70 parts by mass or more, and particularly preferably 80 parts by mass or more, per 100 parts by mass of the photopolymerizable compound (C). It is also preferably 400 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, and particularly preferably 120 parts by mass or less. The upper and lower limits can be arbitrarily combined. For example, 50 to 400 parts by mass is preferred, more preferably 60 to 300 parts by mass, even more preferably 70 to 200 parts by mass, and particularly preferably 80 to 120 parts by mass. By adjusting the blending ratio to be equal to or greater than the lower limit, development adhesion tends to be improved. Furthermore, by adjusting the blending ratio to be equal to or less than the upper limit, curability tends to be improved.

[0170] [1-1-3] Component (C): Photopolymerizable Compound The photosensitive resin composition of the present invention contains a photopolymerizable compound (C). It is believed that the inclusion of the photopolymerizable compound (C) results in high sensitivity. The photopolymerizable compound refers to a compound having one or more ethylenically unsaturated bonds (ethylenic double bonds) in the molecule. From the viewpoints of polymerizability, crosslinkability, and the associated ability to increase the difference in developer solubility between exposed and unexposed areas, a compound having two or more ethylenically unsaturated bonds in the molecule is preferred. It is even more preferred that the unsaturated bond is derived from a (meth)acryloyloxy group, i.e., a (meth)acrylate compound.

[0171] In the photosensitive resin composition of the present invention, it is particularly desirable to use a polyfunctional ethylenic monomer having two or more ethylenically unsaturated bonds per molecule. The number of ethylenically unsaturated groups in the polyfunctional ethylenic monomer is not particularly limited, but is preferably two or more, more preferably three or more, even more preferably four or more, and particularly preferably five or more, and is preferably 15 or less, more preferably 10 or less, even more preferably eight or less, and particularly preferably seven or less. The upper and lower limits can be arbitrarily combined; for example, 2 to 15 is preferred, 3 to 10 is more preferred, 4 to 8 is even more preferred, and 5 to 7 is particularly preferred. Setting the number at or above the lower limit tends to improve polymerizability and result in high sensitivity. Setting the number at or below the upper limit tends to result in better developability.

[0172] Examples of the photopolymerizable compound include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids; esters obtained by an esterification reaction between a polyvalent hydroxy compound such as an aliphatic polyhydroxy compound or an aromatic polyhydroxy compound and an unsaturated carboxylic acid and a polybasic carboxylic acid; compounds obtained by a reaction between a polyvalent hydroxy compound such as an aliphatic polyhydroxy compound or an aromatic polyhydroxy compound, a lactone compound, and an unsaturated carboxylic acid; and compounds obtained by a reaction between a polyvalent hydroxy compound such as an aliphatic polyhydroxy compound or an aromatic polyhydroxy compound, a (poly)ethylene glycol compound, and an unsaturated carboxylic acid.

[0173] Examples of the esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters of aliphatic polyhydroxy compounds such as ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and glycerol acrylate; methacrylic acid esters in which the acrylate of these compounds is replaced with methacrylate; itaconic acid esters in which the acrylate of these compounds is replaced with itaconate; crotonate esters in which the acrylate of these compounds is replaced with crotonate; maleic acid esters in which the acrylate of these compounds is replaced with maleate; reaction products of pentaerythritol, caprolactone, and (meth)acrylic acid, reaction products of dipentaerythritol, caprolactone, and (meth)acrylic acid, reaction products of pentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid, and reaction products of dipentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid.

[0174] Examples of esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters and methacrylic acid esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethacrylate, pyrogallol triacrylate, etc. Esters obtained by esterification of polyhydric hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds with unsaturated carboxylic acids and polybasic carboxylic acids are not necessarily single compounds, but include, for example, condensates of acrylic acid, phthalic acid, and ethylene glycol; condensates of acrylic acid, maleic acid, and diethylene glycol; condensates of methacrylic acid, terephthalic acid, and pentaerythritol; and condensates of acrylic acid, adipic acid, butanediol, and glycerin.

[0175] Other useful examples of the photopolymerizable compound that can be used in the photosensitive resin composition of the present invention include urethane (meth)acrylates such as those obtained by reacting a polyisocyanate compound with a hydroxyl group-containing (meth)acrylic acid ester or a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth)acrylic acid ester; epoxy acrylates such as addition reaction products of a polyfunctional epoxy compound with a hydroxyl group-containing (meth)acrylic acid ester or (meth)acrylic acid; acrylamides such as ethylenebisacrylamide; allyl esters such as diallyl phthalate; and vinyl group-containing compounds such as divinyl phthalate.

[0176] Examples of urethane (meth)acrylates include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, and UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U-10PA, U-33H, UA-53H, UA-32P, and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-306H, UA-510H, and UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.), and UV-1700B, UV-7600B, UV-7605B, UV-7630B, and UV7640B (manufactured by Nippon Synthetic Chemical Industry Co., Ltd.).

[0177] From the viewpoint of an appropriate taper angle, sensitivity, and inkjet coating properties, it is preferable to use, as the photopolymerizable compound (C), a compound obtained by reacting a polyvalent hydroxy compound, such as an ester of an aliphatic polyhydroxy compound with an unsaturated carboxylic acid, an aliphatic polyhydroxy compound, or an aromatic polyhydroxy compound, with a (poly)ethylene glycol compound and an unsaturated carboxylic acid; it is more preferable to use dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, 2-tris(meth)acryloyloxymethylethyl phthalate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, a reaction product of pentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid, or a reaction product of dipentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid; and it is even more preferable to use a reaction product of pentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid, or a reaction product of dipentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid.

[0178] As the reaction product of pentaerythritol, (poly)ethylene glycol and (meth)acrylic acid, and the reaction product of dipentaerythritol, (poly)ethylene glycol and (meth)acrylic acid, it is more preferable to use the following.

[0179]

[0180] In formula (C-1), m represents 1 to 3. In formula (C-2), n represents 1 to 3. It is more preferable to contain a photopolymerizable compound (C) of formula (C-1). These may be used alone or in combination of two or more. In the photosensitive resin composition of the present invention, the molecular weight of the photopolymerizable compound (C) is not particularly limited, but from the viewpoints of sensitivity, taper angle, and inkjet coating properties, it is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, even more preferably 300 or more, especially preferably 400 or more, and particularly preferably 500 or more, and is preferably 1000 or less, more preferably 700 or less. The upper and lower limits can be arbitrarily combined; for example, 100 to 1000 is preferred, 150 to 1000 is more preferred, 200 to 1000 is even more preferred, 300 to 700 is even more preferred, 400 to 700 is especially preferred, and 500 to 700 is particularly preferred.

[0181] The number of carbon atoms in the photopolymerizable compound (C) is not particularly limited, but from the viewpoints of sensitivity, taper angle, and inkjet coating properties, it is preferably 7 or more, more preferably 10 or more, even more preferably 15 or more, still more preferably 20 or more, and particularly preferably 25 or more, and is preferably 50 or less, more preferably 40 or less, even more preferably 35 or less, and particularly preferably 30 or less. The upper and lower limits can be arbitrarily combined; for example, 7 to 50 is preferred, 10 to 50 is more preferred, 15 to 40 is even more preferred, 20 to 35 is even more preferred, and 25 to 30 is particularly preferred.

[0182] The content of the (C) photopolymerizable compound in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 80% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, even more preferably 55% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 5 to 80% by mass is preferred, 10 to 70% by mass is more preferred, 20 to 60% by mass is even more preferred, 30 to 55% by mass or less is even more preferred, and 40 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, appropriate internal curing properties tend to be achieved. By setting the content at or below the upper limit, developability tends to be good.

[0183] [1-1-4] Compound (D) Compound (D) is a compound having a cyclic ether group having 2 to 3 carbon atoms and an aromatic ring and / or a heterocyclic ring. Examples of the cyclic ether group having 2 to 3 carbon atoms include an oxetanyl group and an epoxy group. Examples of compounds having an oxetanyl group and an aromatic ring include compounds having a phenylene group, a biphenylene group, or a fluorene group. Specific examples include "ETERNACOLL OXBP" and "ETERNACOLL OXIPA" manufactured by UBE, "OXT-121" manufactured by Toagosei Co., Ltd., and compounds described in Japanese Patent Application Laid-Open Nos. 2000-336082 and 2014-131969.

[0184] Examples of the compound having an epoxy group and an aromatic ring and / or a heterocyclic ring include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, biphenyl group-containing novolac epoxy resins, polymerized epoxy resins of phenol and dicyclopentadiene, naphthalene type epoxy resins, trisphenolmethane type epoxy resins, fluorene bisphenol type epoxy resins, diglycidyl ethers of 9,9-bis(4'-hydroxyphenyl)fluorene, glycidyl esters such as diglycidyl tetrahydrophthalate and diglycidyl phthalate; glycidyl amines such as tetraglycidyldiaminodiphenylmethane and triglycidyl paraaminophenol; and heterocyclic epoxy resins such as triglycidyl isocyanurate.

[0185] As the (D) compound, compounds having an aromatic ring in the main chain can be suitably used. From the viewpoint of reducing outgassing, bisphenol A epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, polymerized epoxy resin of phenol and dicyclopentadiene, biphenyl group-containing novolac epoxy resin, and diglycidyl ether of 9,9-bis(4'-hydroxyphenyl)fluorene are preferred, bisphenol A epoxy resin and biphenyl group-containing novolac epoxy resin are more preferred, and biphenyl group-containing novolac epoxy resin is even more preferred.

[0186] Examples of epoxy resins include bisphenol A type epoxy resins (e.g., "jER (registered trademark, the same applies hereinafter) 828," "jER1001," "jER1002," and "jER1004" manufactured by Mitsubishi Chemical Corporation, and "NER-1302" (epoxy equivalent: 323, softening point: 76°C) manufactured by Nippon Kayaku Co., Ltd.), RE-310S (epoxy equivalent: 183) manufactured by Nippon Kayaku Co., Ltd., and bisphenol F type resins (e.g., "jER807," "jER4004P," and "jER 4005P," "jER4007P," Nippon Kayaku's "NER-7406" (epoxy equivalent 350, softening point 66°C), etc.), bisphenol S type epoxy resin, biphenyl glycidyl ether (for example, Mitsubishi Chemical's "jERYX-4000"), phenol novolac type epoxy resin (for example, Nippon Kayaku's "EPPN-201," Mitsubishi Chemical's "jER152," "jER154," Dow Chemical's "DEN-438"), (o, m, p- ) cresol novolac type epoxy resins (for example, "EOCN (registered trademark, the same applies hereinafter)-102S," "EOCN-1020," and "EOCN-104S" manufactured by Nippon Kayaku Co., Ltd.), triglycidyl isocyanurate (for example, "TEPIC (registered trademark)" manufactured by Nissan Chemical Industries, Ltd.), trisphenolmethane type epoxy resins (for example, "EPPN (registered trademark, the same applies hereinafter)-501," "EPPN-502," and "EPPN-503" manufactured by Nippon Kayaku Co., Ltd.), alicyclic epoxy resins ( Suitable examples of epoxy resins that can be used include "Celloxide (registered trademark, the same applies hereinafter) 2021P" and "Celloxide EHPE" manufactured by Daicel Corporation, epoxy resins obtained by glycidylating phenolic resins obtained by reacting dicyclopentadiene with phenol (for example, "EXA-7200" manufactured by DIC Corporation, "NC-7300" and "XD-1000" manufactured by Nippon Kayaku Co., Ltd.), biphenyl-type epoxy resins (for example, "NC-7000" manufactured by Nippon Kayaku Co., Ltd.), and "E-201" manufactured by Osaka Organic Chemical Industry Ltd.

[0187] Biphenyl group-containing novolac epoxy resins are more preferred, and compounds (D1) having a structural unit represented by the following formula (1) are even more preferred.

[0188]

[0189] In formula (1), Rｄ１１ Each represents a divalent aliphatic hydrocarbon group. n represents an integer of 1 or 2. The benzene ring in formula (1) may be further substituted with any substituent. Each * represents a bond. When the photosensitive resin composition contains compound (D1), inkjet coating properties tend to be good. This is presumably because compound (D1) contains many aromatic rings in its main chain, so it tends to be less susceptible to thermal decomposition during heat treatment, and also contains aliphatic hydrocarbon groups in its main chain, so it has flexibility that can increase reactivity with alkali-soluble resins, allowing it to form a strong crosslinked structure.

[0190] (R ｄ１１ In formula (1), R ｄ１１ represents a divalent aliphatic hydrocarbon group. Examples of the divalent aliphatic hydrocarbon group include linear and branched aliphatic hydrocarbon groups. The number of carbon atoms is preferably 1 or more, and is preferably 6 or less, more preferably 3 or less, and even more preferably 2 or less. For example, 1 to 6 is preferred, 1 to 3 is more preferred, and 1 to 2 is even more preferred. By setting the number of carbon atoms at or above the lower limit, reactivity tends to be high. By setting the number of carbon atoms at or below the upper limit, outgassing tends to be reduced.

[0191] Examples of divalent aliphatic hydrocarbon groups include methylene, ethylene, n-propylene, isopropylene, n-butylene, isobutylene, and n-hexylene. From the viewpoint of inkjet coating properties, a methylene group is preferred. The benzene ring in formula (1) may be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxy group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoints of ink repellency, inkjet coating properties, and ease of synthesis, it is preferable that the benzene ring in formula (1) is unsubstituted.

[0192] (n) In formula (1), n ​​represents an integer of 1 or 2. From the viewpoint of ink repellency and inkjet coating properties, n is preferably 2. Furthermore, compound (D1) more preferably contains a structural unit represented by the following general formula (2):

[0193]

[0194] In formula (2), R ｄ１１ has the same meaning as in formula (1). m1:m2 is 2:8 to 5:5. The benzene ring in formula (2) may be further substituted with any substituent. * represents a bond. Specific examples of compound (D1) are listed below.

[0195]

[0196] From the viewpoint of ink repellency and inkjet coatability, the weight-average molecular weight of the (D) compound is usually 1,000 or more, preferably 1,500 or more, and preferably 20,000 or less, more preferably 10,000 or less, even more preferably 7,000 or less, still more preferably 5,000 or less, especially preferably 4,000 or less, and particularly preferably 3,000 or less. The upper and lower limits can be arbitrarily combined, and for example, 1,000 to 20,000 is preferred, 1,000 to 10,000 is more preferred, 1,000 to 7,000 is even more preferred, 1,000 to 5,000 is even more preferred, 1,000 to 4,000 is especially preferred, and 1,500 to 3,000 is particularly preferred. By setting the weight-average molecular weight at or above the lower limit, inkjet coatability tends to be improved. By setting the weight-average molecular weight at or below the upper limit, developability tends to be improved.

[0197] The acid value of the (D) compound is preferably 1 mgKOH / g or less, more preferably 0.1 mgKOH / g or less, and more preferably 0.01 mgKOH / g or less. By setting it to the upper limit or less, the storage stability of the photosensitive resin composition tends to be good.

[0198] The epoxy equivalent of the (D) compound is not particularly limited, but is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, and is preferably 1000 or less, more preferably 500 or less, and even more preferably 300 or less. The upper and lower limits can be arbitrarily combined, and for example, 100 to 1000 is preferred, 150 to 500 is more preferred, 200 to 300 is even more preferred, and 200 to 250 is even more preferred. By setting it to be equal to or greater than the lower limit, storage stability tends to be improved. By setting it to be equal to or less than the upper limit, inkjet coatability tends to be improved.

[0199] The content of the (D) compound in the photosensitive resin composition of the present invention is preferably 1% by mass or more, more preferably 2% by mass or more, even more preferably 3% by mass or more, even more preferably 5% by mass or more, particularly preferably 6% by mass or more, and preferably 50% by mass or less, more preferably 30% by mass or less, even more preferably 20% by mass or less, even more preferably 15% by mass or less, and particularly preferably 10% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 1 to 50% by mass is preferred, 2 to 30% by mass is more preferred, 3 to 20% by mass is even more preferred, 5 to 15% by mass or more is even more preferred, and 6 to 10% by mass is particularly preferred. By setting the content at or above the lower limit, inkjet coatability tends to be improved. By setting the content at or below the upper limit, developability tends to be improved.

[0200] The compounding ratio of the (D) compound to the (B) alkali-soluble resin in the photosensitive resin composition is preferably 10 parts by mass or more, more preferably 12 parts by mass or more, even more preferably 15 parts by mass or more, and particularly preferably 17 parts by mass or more, per 100 parts by mass of the (B) alkali-soluble resin. It is also preferably 100 parts by mass or less, more preferably 80 parts by mass or less, even more preferably 50 parts by mass or less, and particularly preferably 25 parts by mass or less. The total upper and lower limits can be arbitrarily combined; for example, 10 to 100 parts by mass is preferred, 12 to 80 parts by mass is more preferred, 15 to 50 parts by mass is even more preferred, and 17 to 25 parts by mass is particularly preferred. By setting the content at or above the lower limit, inkjet coating properties tend to be improved. Furthermore, by setting the content at or below the upper limit, storage stability tends to be improved.

[0201] In the present invention, the ratio of the (D) compound to the (E) compound described below is preferably appropriate. This is thought to be because the (D) compound has a cyclic ether group, and therefore can react with the (E) compound and the acid moiety of the alkali-soluble resin to form a rigid crosslinked structure, which can prevent the liquid repellent agent from leaking out from the crosslinked structure to the pixels during heating when forming the partition walls, thereby improving inkjet coating properties.

[0202] In the photosensitive resin composition of the present invention, the content of the (E) compound relative to 100 parts by mass of the (D) compound is 2 parts by mass or more, preferably 3 parts by mass or more, more preferably 4 parts by mass or more, and 8 parts by mass or less, preferably 6 parts by mass or less. The upper and lower limits can be arbitrarily combined. For example, it may be 2 to 6 parts by mass, 3 to 6 parts by mass, 3 to 8 parts by mass, 4 to 8 parts by mass, or 4 to 6 parts by mass. By setting the content at or above the lower limit, liquid repellency tends to be improved. Furthermore, by setting the content at or below the upper limit, inkjet coating properties tend to be improved.

[0203] In another embodiment, in the photosensitive resin composition of the present invention, the content ratio of the (E) compound relative to 100 parts by mass of the (D) compound is 2.0 parts by mass or more, more preferably 2.1 parts by mass or more, even more preferably 2.3 parts by mass or more, particularly preferably 3.0 parts by mass or more, particularly preferably 4.0 parts by mass or more, and 8.0 parts by mass or less, preferably 6.0 parts by mass or less. The above upper and lower limits can be arbitrarily combined. For example, it may be 2.0 to 6.0 parts by mass, 3.0 to 6.0 parts by mass, 3.0 to 8.0 parts by mass, 4.0 to 8.0 parts by mass, or 4.0 to 6.0 parts by mass. By setting the content at or above the lower limit, liquid repellency tends to be improved. Furthermore, by setting the content at or below the upper limit, inkjet coatability tends to be improved.

[0204] [1-1-5] (E) Compound The photosensitive resin composition of the present invention contains, as the (E) compound, a compound having a crosslinking group and a fluorine atom and / or a siloxane chain. By including the (E) compound in the photosensitive resin composition, ink repellency can be imparted to the upper surface of the resulting partition wall, thereby preventing color mixing between pixels in the resulting partition wall. The (E) compound is not included in the (B) alkali-soluble resin. That is, in the present invention, if a compound can be classified as an (E) compound, even if that compound can also be classified as an (B) alkali-soluble resin, that compound is treated as an (E) compound. In the present invention, the (E) compound may be referred to as a "liquid repellent."

[0205] Examples of the (E) compound include compound (E1) and compound (E2). Compound (E1): a fluorine atom-containing resin having a crosslinking group. Compound (E2): a resin containing a crosslinking group and a siloxane chain.

[0206] <Compound (E1)> Examples of the crosslinking group include an epoxy group, an ethylenically unsaturated group, or an active group that generates radicals upon irradiation with active energy rays. Examples of the active group that generates radicals upon irradiation with active energy rays include a benzophenone group, an acetophenone group, an α-hydroxyketone group, an α-aminoketone group, an α-diketone group, and an α-diketone dialkyl acetal group. From the viewpoint of overlap between the wavelength distribution of the light source used for exposure and the absorbance spectrum of the active group, an α-hydroxyketone group is preferred. From the viewpoint of suppressing outflow of compound (E1) into a developer, an ethylenically unsaturated group is preferred as the crosslinking group.

[0207] It is believed that by using the compound (E1), the crosslinking reaction on the surface of the formed coating film can be accelerated when the film is exposed to light, and the liquid repellent agent is less likely to flow out during development treatment, and as a result, the resulting partition walls can exhibit high ink repellency.

[0208] The compound (E1) tends to be oriented on the surface of the partition wall and function to prevent ink bleeding and color mixing. More specifically, the group having a fluorine atom tends to repel ink and function to prevent ink bleeding and color mixing that would otherwise occur if the ink crossed the partition wall and entered an adjacent region. Furthermore, from the viewpoints of residue and inkjet coating properties, the compound (E1) preferably has an acidic group, and more preferably contains a carboxyl group.

[0209] The compound (E1) preferably has any one or two or more of a fluoroalkyl group, a fluoroalkylene group, a fluoroalkylene ether chain, and a fluoroaromatic group. Among these, it is more preferable that the compound (E1) has a perfluoroalkyl group, a perfluoroalkylene group, a perfluoroalkylene ether chain, or a perfluoroaromatic group in terms of ink repellency. By having any one or two or more of a fluoroalkyl group, a fluoroalkylene group, a fluoroalkylene ether chain, and a fluoroaromatic group, the fluorine atom-containing resin is more likely to be oriented on the surface of the partition wall, exhibiting higher ink repellency and further tending to prevent ink bleeding and color mixing.

[0210] Examples of fluoroalkyl groups include a fluoromethyl group, a fluoroethyl group, a fluoropropyl group, a fluorobutyl group, and a fluorohexyl group. Examples of perfluoroalkyl groups include a perfluoromethyl group, a perfluoroethyl group, a perfluoropropyl group, a perfluorobutyl group, and a perfluorohexyl group. Examples of fluoroalkylene chains include a fluoromethylene chain, a fluoroethylene chain, a fluoropropylene chain, a fluorobutylene group, and a fluorohexylene chain. Examples of perfluoroalkylene chains include a perfluoromethylene chain, a perfluoroethylene chain, a perfluoropropylene chain, a perfluorobutylene group, and a perfluorohexylene chain.

[0211] Examples of perfluoroalkylene ether chains include -CF2-O-, -(CF2)2-O-, -(CF2)3-O-, and -CF2-C(CF3). ２ O-, -C(CF3) ２ Examples of the fluoroalkylene ether chain include a perfluoroalkylene ether chain in which some but not all of the F groups in the perfluoroalkylene ether chain have been replaced with H.

[0212] Examples of perfluoroaromatic groups include perfluorophenyl groups, perfluoronaphthyl groups, and perfluoroanthracyl groups. Examples of fluoroaromatic groups include fluoroaromatic groups in which not all but some of the F in the perfluoroaromatic group are replaced with H. Examples of compound (E1) include acrylic copolymer resins having epoxy groups and perfluoroalkyl groups, acrylic copolymer resins having epoxy groups and perfluoroalkylene ether chains, acrylic copolymer resins having ethylenically unsaturated groups and perfluoroalkyl groups, acrylic copolymer resins having ethylenically unsaturated groups and perfluoroalkylene ether chains, epoxy (meth)acrylate resins having epoxy groups and perfluoroalkyl groups, epoxy (meth)acrylate resins having epoxy groups and perfluoroalkylene ether chains, epoxy (meth)acrylate resins having ethylenically unsaturated groups and perfluoroalkyl groups, and epoxy (meth)acrylate resins having ethylenically unsaturated groups and perfluoroalkyl groups. From the viewpoint of ink repellency, an acrylic copolymer resin having an ethylenically unsaturated group and a perfluoroalkyl group, or an acrylic copolymer resin having an ethylenically unsaturated group and a perfluoroalkylene ether chain is preferred, and an acrylic copolymer resin having an ethylenically unsaturated group and a perfluoroalkylene ether chain is more preferred.

[0213] Examples of the compound (E1) include "Megafac (registered trademark, the same applies hereinafter) F116," "Megafac F120," "Megafac F142D," "Megafac F144D," "Megafac F150," "Megafac F160," "Megafac F171," "Megafac F172," "Megafac F173," "Megafac F177," "Megafac F178A," "Megafac F178K," "Megafac F179," "Megafac F183," "Megafac F184," "Megafac F191," "Megafac F812," and "Megafac F193." Fluorine-containing organic compounds commercially available under the trade names "Megafac F815", "Megafac F824", "Megafac F833", "Megafac RS101", "Megafac RS102", "Megafac RS105", "Megafac RS201", "Megafac RS202", "Megafac RS301", "Megafac RS303", "Megafac RS304", "Megafac RS401", "Megafac RS402", "Megafac RS501", "Megafac RS502", "Megafac RS-72-K", "Megafac RS-78", "Megafac RS-90", "DEFENSA (registered trademark, the same applies hereinafter) MCF300", "DEFENSA MCF310", "DEFENSA MCF312", and "DEFENSA MCF323" can be used.

[0214] Examples of suitable acrylic copolymer resins having an ethylenically unsaturated group and a perfluoroalkylene group include "Megafac RS-72-K," "Megafac RS-78," and "Megafac RS-90." The fluorine atom content in compound (E1) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and even more preferably 18% by mass or more, relative to the fluorine atom-containing resin having a crosslinking group. Furthermore, it is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less, and the above upper and lower limits can be arbitrarily combined. For example, 5 to 50% by mass is preferred, 10 to 40% by mass is more preferred, 15 to 40% by mass is even more preferred, and 18 to 30% by mass is particularly preferred. Setting the content at or above the lower limit tends to result in a high contact angle. Setting the content at or below the upper limit tends to suppress outflow of compound (E) into pixel areas, resulting in better inkjet coating properties.

[0215] The molecular weight of compound (E1) is not particularly limited, and may be a low-molecular-weight compound or a high-molecular-weight compound. High-molecular-weight compounds are preferred because they suppress bleeding during development and fluidity due to post-baking, thereby preventing leakage from the partition walls. When compound (E1) is a high-molecular-weight compound, the number-average molecular weight of the fluorine-containing resin having a crosslinking group is preferably 100 or more, more preferably 500 or more, and even more preferably 1,000 or more. It is also preferably 150,000 or less, more preferably 130,000 or less, and even more preferably 100,000 or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 100 to 150,000, more preferably 500 to 130,000, and even more preferably 1,000 to 100,000.

[0216] The weight-average molecular weight of compound (E1) is preferably 1,000 or more, more preferably 5,000 or more, and even more preferably 10,000 or more. It is also preferably 150,000 or less, and more preferably 130,000 or less. The above upper and lower limits can be combined arbitrarily. For example, it is preferably 1,000 to 150,000, more preferably 5,000 to 130,000, and even more preferably 10,000 to 130,000.

[0217] <Compound (E2)> The compound (E2) is a resin containing a crosslinking group and a siloxane chain. Examples of the compound (E2) include the compound (E2-1) and the compound (E2-2).

[0218] <Compound (E2-1)> Compound (E2-1) has a structure represented by the following general formula (e2-1): ６１ R ６２ R ６３ Si—O—(SiR ６４ R ６５ -O) ｎ -SiR ６６ R ６７ R ６８ ...(e2-1) In formula (e2-1), R ６１ , R ６２ , R ６３ , R ６４ , R ６５ , R ６６ , R ６７ , R ６８ each independently represents a monovalent organic group or a hydrogen atom, and n represents an integer of 0 or greater.

[0219] The monovalent organic group is preferably a hydrocarbon group having 1 to 10 carbon atoms, and examples thereof include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl; alkenyl groups such as vinyl, allyl, butenyl, pentenyl, and hexenyl; aryl groups such as phenyl, tolyl, and xylyl; aralkyl groups such as benzyl and phenethyl; and substituted alkyl groups such as chloromethyl, 3-chloropropyl, 3,3,3-trifluoropropyl, and nonafluorobutylethyl. These organic groups may have an ester bond. Furthermore, R ６１ , R ６２ , R ６３ , R ６４ , R ６５ , R ６６ , R ６７ , R ６８ The compound (E1) preferably has a crosslinking group in one or more of the following groups:

[0220] In formula (e2-1), n ​​is an integer of 0 or greater, preferably 5 or greater, more preferably 10 or greater, and preferably 2000 or less, more preferably 1500 or less, even more preferably 1000 or less, still more preferably 500 or less, and particularly preferably 300 or less. The upper and lower limits above can be combined arbitrarily. For example, the range is preferably 5 to 2000, more preferably 5 to 1500, even more preferably 5 to 1000, still more preferably 10 to 500, and particularly preferably 10 to 300. By setting the value at or above the lower limit, the ink repellency tends to be enhanced. By setting the value at or below the upper limit, the uniformity of the coating film tends to be enhanced.

[0221] From the viewpoint of residue and inkjet coating properties, the compound (E2-1) preferably has an acidic group, and more preferably has a carboxy group. Examples of commercially available resins containing a crosslinking group and a siloxane chain include compounds available under the trade names "BYK-UV3500 series" manufactured by BYK-Chemie and "8SS" series manufactured by Taisei Fine Chemical Co., Ltd.

[0222] Examples of compounds having a crosslinking group and also having a fluorine atom and a siloxane chain include compounds commercially available under the trade names "8FS" series manufactured by Taisei Fine Chemical Co., Ltd. and "KP series" manufactured by Shin-Etsu Chemical Co., Ltd. The (E) compound may be a compound containing both a fluorine atom and a siloxane chain in one molecule, or a mixture of multiple (E) compounds may be used.

[0223] <Compound (E2-2)> The compound (E2-2) is a copolymer resin having at least: (E2-2-1): a repeating unit represented by the following general formula (e2-2-1); and (E2-2-2): a repeating unit containing an ethylenically unsaturated group.

[0224]

[0225] R ７１ , R ７２ , R ７３ are each independently an alkyl group having 1 to 3 carbon atoms. ７４ is a hydrogen atom or a methyl group. ７１represents a divalent organic group. * represents a bond.

[0226] <(E2-2-1) Repeating Unit> R in formula (e2-2-1) ７１ ~R ７３ Examples of the alkyl group having 1 to 3 carbon atoms in the compound include a methyl group, an ethyl group, a propyl group, and an isopropyl group. From the viewpoints of liquid repellency and inkjet wetting and spreading properties, a methyl group and an ethyl group are preferred, and a methyl group is more preferred.

[0227] L ７１ The divalent organic group is preferably a single bond, an alkylene group having 1 to 50 carbon atoms, or an alkyleneoxy group having 1 to 50 carbon atoms.

[0228] L ７１ Examples of the alkylene group having 1 to 50 carbon atoms include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-pentylene group, an n-hexylene group, an n-heptylene group, an n-octylene group, an n-nonylene group, an n-decylene group, an n-dodecylene group, an isopropylene group, a 2-methylpropylene group, a 2-methylhexylene group, and a tetramethylethylene group.

[0229] L ７１ The alkylene group having 1 to 50 carbon atoms is preferably an alkylene group having 1 to 15 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and even more preferably a methylene group, an ethylene group, an n-propylene group, or an isopropylene group.

[0230] L ７１ The alkyleneoxy group having 1 to 50 carbon atoms is, for example, one of the alkylene groups -CH ２ - is a group in which - is substituted with -O-. ７１ The alkyleneoxy group having 1 to 50 carbon atoms is preferably an alkyleneoxy group having 1 to 15 carbon atoms, more preferably an alkyleneoxy group having 1 to 8 carbon atoms, and even more preferably a methyleneoxy group, an ethyleneoxy group, a propyleneoxy group, an oxytrimethylene group, a butyleneoxy group, an oxytetramethylene group, a pentyleneoxy group, a heptyleneoxy group, or an octyleneoxy group.

[0231] L ７１ When the divalent organic group is an alkylene group having 1 to 50 carbon atoms or an alkyleneoxy group having 1 to 50 carbon atoms, these divalent organic groups are -CH ２ A part of the - may be replaced by a carbonyl group (-C(=O)-), a phenylene group, an amide bond or a urethane bond, and further, a hydroxyl group or the like may be substituted on the carbon atom. ７１ is more preferably an alkylene group having 1 to 5 carbon atoms.

[0232] Specific examples of the repeating unit (E2-2-1) are as follows: wherein * represents a bond.

[0233]

[0234] From the viewpoint of liquid repellency and ink jet wetting and spreading properties, (e2-2-12) is preferred. One or more types of repeating units (e2-2-1) may be contained in the compound (E2-2).

[0235] <Repeating Unit (E2-2-2)> The structure of the repeating unit (E2-2-2) is not particularly limited as long as it contains an ethylenically unsaturated group in a side chain. As the ethylenically unsaturated group, for example, a vinyl group, an allyl group, a (meth)acryloyl group, or a (meth)acryloyloxy group is preferred, and a (meth)acryloyl group or a (meth)acryloyloxy group is more preferred.

[0236] Examples of the repeating unit (E2-2-2) include the following structures.

[0237]

[0238] From the viewpoint of inkjet wetting and spreading properties, (e2-2-23) and (e2-2-24) are preferred, and (e2-2-23) is more preferred. One or more types of repeating units (e2-2-2) may be contained in the compound (E2-2).

[0239] The molar ratio of the repeating units (E2-2-1) and (E2-2-2) in the compound (E2-2) is not particularly limited. For example, the repeating unit (E2-2-1) preferably accounts for 5 mol% or more, more preferably 10 mol% or more, and even more preferably 15 mol% or more, relative to 100 mol% of the total number of moles of the repeating units (E2-2-1) and (E2-2-2). The ratio is preferably 95 mol% or less, more preferably 70 mol% or less, even more preferably 50 mol% or less, even more preferably 30 mol% or less, and particularly preferably 24 mol% or less. The above upper and lower limits can be arbitrarily combined. For example, the ratio may be 5 to 95 mol%, 5 to 70 mol%, 10 to 50 mol%, 10 to 30 mol%, or 15 to 24 mol%. By setting the ratio at or above the lower limit, liquid repellency tends to be enhanced. Furthermore, by setting the ratio at or below the upper limit, inkjet wetting and spreading properties tend to be improved. The silicon atom content in compound (E2-2) is not particularly limited, but is, for example, preferably 1% by weight or more, more preferably 5% by weight or more, and even more preferably 7% by weight or more, relative to the weight of compound (E2-2). It is also preferably 50% by weight or less, more preferably 20% by weight or less, and even more preferably 10% by weight or less. The above upper and lower limits can be arbitrarily combined. For example, it is preferably 1 to 50% by weight, more preferably 5 to 20% by weight, and even more preferably 7 to 10% by weight. By making the content equal to or greater than the lower limit, liquid repellency tends to be enhanced. Furthermore, by making the content equal to or less than the upper limit, inkjet wetting and spreading properties tend to be improved.

[0240] The compound (E2-2) may have a repeating unit other than the repeating unit (E2-2-1) and the repeating unit (E2-2-2). Examples of the other repeating unit include a repeating unit having a carboxy group and a repeating unit having an ester bond other than the repeating unit (E2-2-1) and the repeating unit (E2-2-2). It is preferable that the compound (E2-2) does not contain a fluorine atom. By not containing a fluorine atom, the compound is less likely to accumulate in the environment, and the environmental burden can be reduced.

[0241] The number-average molecular weight (Mn) of compound (E2-2) is preferably 1,000 or more, more preferably 2,000 or more, and even more preferably 2,500 or more. It is also preferably 20,000 or less, more preferably 10,000 or less, and even more preferably 5,000 or less. The above upper and lower limits can be combined arbitrarily. For example, it is preferably 1,000 to 20,000, more preferably 2,000 to 10,000, and even more preferably 2,500 to 5,000. By setting it to the lower limit or more, inkjet wetting and spreading properties tend to be good. By setting it to the upper limit or less, gelation and the like are less likely to occur, synthesis is easier, and inkjet wetting and spreading properties tend to be good. The weight-average molecular weight (Mw) of compound (E2-2) is preferably 3,000 or more, more preferably 5,000 or more, even more preferably 8,000 or more, even more preferably 10,000 or more, and particularly preferably 13,000 or more. Furthermore, it is preferably 100,000 or less, more preferably 50,000 or less, and even more preferably 20,000 or less. The above upper and lower limits can be combined in any manner. For example, it is preferably 3,000 to 100,000, more preferably 5,000 to 100,000, even more preferably 8,000 to 50,000, even more preferably 10,000 to 50,000, and particularly preferably 13,000 to 20,000. By setting it to the lower limit or more, inkjet wetting and spreading properties tend to be good. By setting it to the upper limit or less, gelation and the like are less likely to occur, synthesis is easier, and inkjet wetting and spreading properties tend to be good.

[0242] The compound (E2-2) can be synthesized by any known synthesis method, for example, the method described in JP-A-2023-169574.

[0243] The content of the compound (E) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 2% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined. For example, 0.01 to 5% by mass is preferred, 0.05 to 3% by mass is more preferred, and 0.1 to 2% by mass is even more preferred. By ensuring that the content is equal to or greater than the lower limit, ink repellency tends to be improved. By ensuring that the content is equal to or less than the upper limit, a uniform coating film tends to be obtained more easily when applying ink to pixel portions after partition wall formation.

[0244] When the photosensitive resin composition of the present invention contains compound (E1), the content of compound (E1) is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 2% by mass or less, relative to the total solid content of the photosensitive resin composition. The above upper and lower limits can be arbitrarily combined. For example, 0.01 to 5% by mass is preferred, 0.05 to 3% by mass is more preferred, and 0.1 to 2% by mass is even more preferred. By setting the content at or above the lower limit, ink repellency tends to be improved. By setting the content at or below the upper limit, a uniform coating film tends to be obtained more easily when applying ink to pixel portions after partition wall formation.

[0245] When the photosensitive resin composition of the present invention contains compound (E2), the content of compound (E2) is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, even more preferably 0.3% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 2% by mass or less, relative to the total solids content of the photosensitive resin composition. The above upper and lower limits can be arbitrarily combined. For example, 0.1 to 5% by mass is preferred, 0.2 to 3% by mass is more preferred, and 0.3 to 2% by mass is even more preferred. By setting the content at or above the lower limit, ink repellency tends to be improved. By setting the content at or below the upper limit, a uniform coating film tends to be obtained more easily when applying ink to pixel portions after partition wall formation.

[0246] In the photosensitive resin composition of the present invention, a surfactant may be used together with the compound (E). The surfactant can be used, for example, for the purpose of improving the coatability of the photosensitive resin composition as a coating liquid and the developability of the coating film, and examples thereof include fluorine-based surfactants having no crosslinking groups and silicone-based surfactants having no crosslinking groups. In particular, silicone-based surfactants are preferred, and polyether-modified silicone-based surfactants are more preferred, because they have the effect of removing residues of the photosensitive resin composition from unexposed areas during development and also have the function of exhibiting wettability.

[0247] As the fluorosurfactant having no crosslinking group, a compound having a fluoroalkyl or fluoroalkylene group at least at any one of the terminal, main chain, and side chain is suitable. Examples of commercially available fluorosurfactants having no crosslinking group include BM Examples of such a cleaning agent include "BM-1000" and "BM-1100" manufactured by Chemie Co., Ltd.; "Megafac F142D," "Megafac F172," "Megafac F173," "Megafac F183," "Megafac F470," "Megafac F475," "Megafac F554," and "Megafac F559" manufactured by DIC Corporation; "DFX-18" manufactured by Neos Corporation; "Fluorad FC430," "Fluorad FC431," "FC-4430," and "FC4432" manufactured by 3M Japan Ltd.; and "Asahiguard (registered trademark) AG710," "Surflon (registered trademark, the same applies hereinafter) S-382," "Surflon SC-101," "Surflon SC-102," "Surflon SC-103," "Surflon SC-104," "Surflon SC-105," and "Surflon SC-106" manufactured by AGC.

[0248] Examples of commercially available silicone surfactants include "DC3PA," "SH7PA," "DC11PA," "SH21PA," "SH28PA," "SH29PA," "8032 Additive," and "SH8400" manufactured by Dow Corning Toray Co., Ltd., and "BYK (registered trademark, the same applies hereinafter) 323" and "BYK330" manufactured by BYK-Chemie.

[0249] The surfactant may contain a surfactant other than a fluorine-based surfactant and a silicone-based surfactant. Examples of the surfactant include nonionic, anionic, cationic, and amphoteric surfactants. Examples of the nonionic surfactant include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, polyoxyethylene alkyl esters, polyoxyethylene fatty acid esters, glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythritol fatty acid esters, polyoxyethylene pentaerythritol fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, sorbitol fatty acid esters, and polyoxyethylene sorbitol fatty acid esters.

[0250] Examples of commercially available products include polyoxyethylene surfactants such as "Emulgen (registered trademark, hereinafter the same) 104P" and "Emulgen A60" manufactured by Kao Corporation. Examples of anionic surfactants include alkyl sulfonates, alkyl benzene sulfonates, alkyl naphthalene sulfonates, polyoxyethylene alkyl ether sulfonates, alkyl sulfates, alkyl sulfate ester salts, higher alcohol sulfate ester salts, aliphatic alcohol sulfate ester salts, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkyl phosphate ester salts, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphates, and special polymer surfactants. Special polymer surfactants are preferred, and special polycarboxylic acid type polymer surfactants are more preferred.

[0251] Examples of commercially available alkyl sulfate ester salts include "EMAL (registered trademark, hereinafter the same) 10" manufactured by Kao Corporation; examples of alkyl naphthalene sulfonates include "PELEX (registered trademark) NB-L" manufactured by Kao Corporation; and examples of special polymer surfactants include "HOMOGENOL (registered trademark, hereinafter the same) L-18" and "HOMOGENOL L-100" manufactured by Kao Corporation.

[0252] Examples of cationic surfactants include quaternary ammonium salts, imidazoline derivatives, and alkylamine salts. Among these, quaternary ammonium salts are preferred, and stearyltrimethylammonium salts are more preferred. Commercially available alkylamine salts include "Acetamine (registered trademark) 24" manufactured by Kao Corporation, and quaternary ammonium salts include "Quatamine (registered trademark, hereinafter the same) 24P" and "Quatamine 86W" manufactured by Kao Corporation.

[0253] Examples of amphoteric surfactants include betaine compounds, imidazolium salts, imidazolines, and amino acids. One surfactant may be used alone, or two or more surfactants may be used in combination. Examples include a combination of a silicone surfactant and a fluorine surfactant, a combination of a silicone surfactant and a special polymer surfactant, and a combination of a fluorine surfactant and a special polymer surfactant, and a combination of a silicone surfactant and a fluorine surfactant is preferred.

[0254] Examples of combinations of silicone surfactants and fluorine surfactants include combinations of "DFX-18" manufactured by Neos Corporation, or "BYK-300" or "BYK-330" manufactured by BYK-Chemie Corporation with "S-393" manufactured by AGC Seimi Chemical Co., Ltd.; combinations of "KP340" manufactured by Shin-Etsu Silicones Co., Ltd. with "F-554" or "F-559" manufactured by DIC Corporation; combinations of "SH7PA" manufactured by Dow Corning Toray Co., Ltd. with "DS-401" manufactured by Daikin Corporation; and combinations of "L-77" manufactured by NUC Corporation with "FC4430" manufactured by 3M Japan Ltd.

[0255] [1-1-6] Solvent The photosensitive resin composition of the present invention usually contains a solvent, and is used in a state in which the above-mentioned components are dissolved or dispersed in the solvent. The solvent is not particularly limited, and examples thereof include the organic solvents described below. Glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol tert-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethyl pentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, and tripropylene glycol methyl ether; glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, and dipropylene glycol dimethyl ether;Glycol alkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, 3-methyl-3-methoxybutyl acetate, and 3-methoxy-1-butyl acetate; glycol alkyl ether acetates such as ethylene glycol diacetate, 1,3-butylene glycol diacetate, and 1,6-hexanol diacetate; Alkyl diacetates; alkyl acetates such as cyclohexanol acetate; ethers such as amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, diamyl ether, ethyl isobutyl ether, and dihexyl ether; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methyl hexyl ketones such as methyl ketone, methyl nonyl ketone, and methoxymethyl pentanone; monohydric or polyhydric alcohols such as methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, methoxymethyl pentanol, glycerin, and benzyl alcohol; aliphatic hydrocarbons such as n-pentane, n-octane, diisobutylene, n-hexane, hexene, isoprene, dipentene, and dodecane;Alicyclic hydrocarbons such as cyclohexane, methylcyclohexane, methylcyclohexene, and bicyclohexyl; aromatic hydrocarbons such as benzene, toluene, xylene, and cumene; amyl formate, ethyl formate, ethyl acetate, butyl acetate, propyl acetate, amyl acetate, methyl isobutyrate, ethylene glycol acetate, ethyl propionate, propyl propionate, butyl butyrate, isobutyl butyrate, methyl isobutyrate, ethyl caprylate, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, 3- Chain or cyclic esters such as methyl methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, and γ-butyrolactone; alkoxycarboxylic acids such as 3-methoxypropionic acid and 3-ethoxypropionic acid; halogenated hydrocarbons such as butyl chloride and amyl chloride; ether ketones such as methoxymethylpentanone; nitriles such as acetonitrile and benzonitrile; and tetrahydrofurans such as tetrahydrofuran, dimethyltetrahydrofuran, and dimethoxytetrahydrofuran.

[0256] Examples of commercially available solvents that fall into this category include mineral spirits, Balsol #2, Apco #18 Solvent, Apco Thinner, Socal Solvent No. 1 and No. 2, Solvesso #150, Shell TS28 Solvent, Carbitol, ethyl carbitol, butyl carbitol, methyl cellosolve, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve acetate, and diglyme (all of which are trade names).

[0257] The solvent can dissolve or disperse each component in the photosensitive resin composition and is selected depending on the method of use of the photosensitive resin composition of the present invention, but from the viewpoint of coatability, a solvent having a boiling point at atmospheric pressure (1013.25 hPa) of preferably 60 to 280° C., more preferably 70 to 260° C. For example, propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate are preferred.

[0258] The solvent may be used alone or in combination of two or more. The solvent is preferably used so that the total solids content in the photosensitive resin composition is preferably 10% by mass or more, more preferably 15% by mass or more, even more preferably 18% by mass or more, and preferably 90% by mass or less, more preferably 50% by mass or less, even more preferably 40% by mass or less, and particularly preferably 30% by mass or less. The upper and lower limits can be arbitrarily combined; for example, 10 to 90% by mass is preferred, 10 to 50% by mass is more preferred, 15 to 40% by mass is even more preferred, and 18 to 30% by mass is particularly preferred. By setting the solvent content at or above the lower limit, a coating film tends to be obtained even with a high film thickness. Furthermore, by setting the solvent content at or below the upper limit, a moderate coating uniformity tends to be obtained.

[0259] [1-1-7] UV absorber The photosensitive resin composition of the present invention may contain a UV absorber. The UV absorber is added for the purpose of controlling the photocuring distribution by absorbing specific wavelengths of the light source used for exposure. The inclusion of a UV absorber tends to provide effects such as improving the taper angle shape after development and reducing residues remaining in unexposed areas after development. As the UV absorber, from the viewpoint of inhibiting light absorption by the photopolymerization initiator, for example, a compound having an absorption maximum in the wavelength range of 250 nm to 400 nm can be used.

[0260] Examples of ultraviolet absorbers include benzotriazole compounds, triazine compounds, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and its derivatives, dinaphthalene compounds, phenanthroline compounds, and dyes. One type of ultraviolet absorber may be used alone, or two or more types may be used in combination.

[0261] From the viewpoint of increasing the taper angle, benzotriazole compounds and / or hydroxyphenyltriazine compounds are preferred, and benzotriazole compounds are particularly preferred. From the viewpoint of the tapered shape, benzotriazole compounds represented by the following general formula (Z1) are preferred.

[0262]

[0263] In formula (Z1), R 1e and R 2e R each independently represents a hydrogen atom, an alkyl group which may have a substituent, a group represented by the following general formula (Z2), or a group represented by the following general formula (Z3). 3e represents a hydrogen atom or a halogen atom.

[0264]

[0265] In formula (Z2), R 4e represents an alkylene group which may have a substituent, R 5e represents an alkyl group which may have a substituent.

[0266]

[0267] In formula (Z3), R 6e represents an alkylene group which may have a substituent, R 7e represents a hydrogen atom or a methyl group.

[0268] (R 1e and R 2e In formula (Z1), R 1e and R 2e each independently represents a hydrogen atom, an alkyl group which may have a substituent, a group represented by formula (Z2), or a group represented by formula (Z3). Examples of the alkyl group include linear, branched, and cyclic alkyl groups. The number of carbon atoms is preferably 1 or more, more preferably 2 or more, and even more preferably 4 or more, and is preferably 10 or less, more preferably 6 or less, and even more preferably 4 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 10 is preferred, 2 to 6 is more preferred, and 4 to 6 is even more preferred.

[0269] Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, and a tert-butyl group, with a tert-butyl group being preferred. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group.

[0270] (R 3e In formula (Z1), R 3e represents a hydrogen atom or a halogen atom. Examples of halogen atoms include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. From the viewpoint of synthesis, R 3e is preferably a hydrogen atom.

[0271] (R 4e In formula (Z2), R 4e represents an alkylene group which may have a substituent. Examples of the alkylene group include linear, branched, and cyclic alkylene groups. The number of carbon atoms is usually 1 or more, preferably 2 or more, and preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 6 is preferred, 1 to 4 is more preferred, and 2 to 3 is even more preferred. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group, with an ethylene group being preferred.

[0272] Examples of the substituent that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. 4e is preferably an ethylene group.

[0273] (R 5eIn formula (Z2), represents an alkyl group which may have a substituent. Examples of the alkyl group include linear, branched, and cyclic alkyl groups. The number of carbon atoms is preferably 4 or more, more preferably 5 or more, and even more preferably 7 or more, and is preferably 15 or less, more preferably 10 or less, and even more preferably 9 or less. The upper and lower limits can be arbitrarily combined; for example, 5 to 15 is preferred, 5 to 10 is more preferred, and 7 to 9 is even more preferred.

[0274] Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, and a nonyl group. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of the tapered shape, R 5e is preferably a heptyl group, an octyl group, or a nonyl group.

[0275] (R 6e In formula (Z3), R 6e represents an alkylene group which may have a substituent. Examples of the alkylene group include linear, branched, and cyclic alkylene groups. The number of carbon atoms is usually 1 or more, preferably 2 or more, and is preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The above upper and lower limits can be arbitrarily combined; for example, 1 to 6 is preferred, 1 to 4 is more preferred, and 2 to 3 is even more preferred.

[0276] Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. Among these, an ethylene group is preferred. Examples of the substituent that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group.

[0277] From the viewpoint of tapered shape, R 1e is a tert-butyl group, R 2e is a group represented by formula (Z2) (where R 4e is an ethylene group, and R 5e is an alkyl group having 7 to 9 carbon atoms), R 3e is a hydrogen atom, or 1e is a hydrogen atom, R 2e is a group represented by formula (Z3) (where R 6e is an ethylene group, and R 7e is a methyl group), R 3e is a hydrogen atom, and R 1e is a tert-butyl group, R 2e is a group represented by formula (Z2) (where R 4e is an ethylene group, and R 5e is an alkyl group having 7 to 9 carbon atoms), R 3e is a hydrogen atom is more preferred.

[0278] Examples of benzotriazole compounds include 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole, octyl 3-[3-tert-butyl-5-(5-chloro-2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, and octyl 3-[3-tert-butyl-5-(5-chloro-2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate. Ethylhexyl, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxy 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate heptyl, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate octyl, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate nonyl, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)phenol

[0033] Examples of suitable 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionates include 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionates, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionates, and 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionates.Among these, from the viewpoints of taper angle and exposure sensitivity, heptyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, octyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, nonyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, and mixtures thereof are preferred.

[0279] Commercially available benzotriazole compounds include, for example, Sumisorb (registered trademark, the same applies hereinafter) 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical Co., Ltd.), JF77, JF78, JF79, JF80, JF83 (manufactured by Johoku Chemical Industry Co., Ltd.), TINUVIN (registered trademark, the same applies hereinafter) PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 384-2, TINUVIN 326, TINUVIN 900, TINUVIN 928, TINUVIN 1130 (manufactured by BASF), EVERSORB 70, EVERSORB 71, EVERSORB 72, EVERSORB 80, EVERSORB 81, EVERSORB 82, EVERSORB 83, EVERSORB 84, EVERSORB 85, ​​EVERSORB 86, EVERSORB 87, EVERSORB 88, EVERSORB 89, EVERSORB 90, EVERSORB 91, EVERSORB 92, EVERSORB 93, EVERSORB 94, EVERSORB 95, EVERSORB 96, EVERSORB 97, EVERSORB 98, EVERSORB 99, EVERSORB 100, EVERSORB 111, EVERSORB 112, EVERSORB 113, EVERSORB 114, EVERSORB 115, EVERSORB 116, EVERSORB 117, EVERSORB 118, EVERSORB 119, EVERSORB 120, EVERSORB 123, E Examples of such a surfactant include RSORB73, EVERSORB74, EVERSORB75, EVERSORB76, EVERSORB234, EVERSORB77, EVERSORB78, EVERSORB80, EVERSORB81 (manufactured by Taiwan Yong Guang Chemical Industry Co., Ltd.), TOMISORB (registered trademark, the same applies hereinafter) 100, TOMISORB 600 (manufactured by API Corporation), SEESORB (registered trademark, the same applies hereinafter) 701, SEESORB702, SEESORB703, SEESORB704, SEESORB706, SEESORB707, SEESORB709 (manufactured by Shipro Chemical Co., Ltd.), and RUVA-93 (manufactured by Otsuka Chemical Co., Ltd.).

[0280] Examples of triazine compounds include 2-[4,6-di(2,4-xylyl)-1,3,5-triazin-2-yl]-5-octyloxyphenol, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, a reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and 2-ethylhexyl glycidyl ether, and 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine. Among these, hydroxyphenyltriazine compounds are preferred from the viewpoints of taper angle and exposure sensitivity.

[0281] Commercially available triazine compounds include, for example, TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, and TINUVIN 479 (manufactured by BASF). Other ultraviolet absorbers include, for example, Sumisorb 130 (manufactured by Sumitomo Chemical Co., Ltd.), EVERSORB 10, EVERSORB 11, and EVERSORB 12 (manufactured by Taiwan Yong Guang Chemical Industry Co., Ltd.), Tomisorb 800 (manufactured by API Corporation), SEESORB 100, SEESORB 101, SEESORB 101S, SEESORB 102, SEESORB 103, and SEESORB 104. Benzophenone compounds such as SEESORB 05, SEESORB 106, SEESORB 107, and SEESORB 151 (manufactured by Shipro Chemical Co., Ltd.); benzoate compounds such as Sumisorb 400 (manufactured by Sumitomo Chemical Co., Ltd.) and phenyl salicylate; cinnamic acid derivatives such as 2-ethylhexyl cinnamate, 2-ethylhexyl paramethoxycinnamate, isopropyl methoxycinnamate, and isoamyl methoxycinnamate; α-naphthol , β-naphthol, α-naphthol methyl ether, α-naphthol ethyl ether, naphthalene derivatives such as 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene; anthracene and derivatives thereof such as anthracene and 9,10-dihydroxyanthracene; and dyes such as azo dyes, benzophenone dyes, aminoketone dyes, quinoline dyes, anthraquinone dyes, diphenylcyanoacrylate dyes, triazine dyes, and p-aminobenzoic acid dyes. From the viewpoint of exposure sensitivity, cinnamic acid derivatives and naphthalene derivatives are preferably used, and cinnamic acid derivatives are particularly preferred.

[0282] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the content of the ultraviolet absorber in the photosensitive resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, based on the total solid content of the photosensitive resin composition, and is preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. The upper and lower limits can be arbitrarily combined; for example, 0.01 to 15% by mass is preferred, 0.05 to 15% by mass is more preferred, 0.1 to 10% by mass is even more preferred, 0.5 to 5% by mass is even more preferred, and 1 to 3% by mass is particularly preferred. Setting the content at or above the lower limit tends to increase the taper angle. Setting the content at or below the upper limit tends to increase sensitivity.

[0283] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the blending ratio relative to the (D) photopolymerization initiator is preferably 1 part by mass or more, more preferably 5 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 20 parts by mass or more, particularly preferably 30 parts by mass or more, per 100 parts by mass of the (D) photopolymerization initiator, and is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, even more preferably 100 parts by mass or less, particularly preferably 50 parts by mass or less. The upper and lower limits can be arbitrarily combined; for example, 5 to 500 parts by mass is preferred, 10 to 300 parts by mass is more preferred, 20 to 100 parts by mass is even more preferred, and 30 to 50 parts by mass is particularly preferred. By setting the blending ratio at or above the lower limit, the taper angle tends to be larger. On the other hand, by setting the blending ratio at or below the upper limit, high sensitivity tends to be achieved.

[0284] [1-1-8] Polymerization Inhibitor The photosensitive resin composition of the present invention may contain a polymerization inhibitor. It is believed that the inclusion of a polymerization inhibitor inhibits radical polymerization, thereby increasing the taper angle of the resulting partition walls. Examples of polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, and 2,6-di-tert-butyl-4-cresol (BHT). From the viewpoint of the tapered shape, methylhydroquinone and methoxyphenol are preferred, and methylhydroquinone is more preferred.

[0285] The polymerization inhibitor may be used alone or in combination of two or more. Usually, when the alkali-soluble resin (B) is produced, a polymerization inhibitor may be contained in the resin, and this may be used as the polymerization inhibitor contained in the photosensitive resin composition of the present invention. Alternatively, in addition to the polymerization inhibitor contained in the resin, a polymerization inhibitor identical to or different from the polymerization inhibitor may be added during the production of the photosensitive resin composition.

[0286] When the photosensitive resin composition of the present invention contains a polymerization inhibitor, the content of the polymerization inhibitor in the photosensitive resin composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.3% by mass or more, and preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 0.01 to 5% by mass is preferred, 0.1 to 0.3% by mass is more preferred, and 0.3 to 1% by mass is even more preferred. By setting the content at or above the lower limit, the taper angle tends to be higher. Furthermore, by setting the content at or below the upper limit, high sensitivity tends to be maintained.

[0287] [1-1-9] Silane Coupling Agent The photosensitive resin composition of the present invention may contain a silane coupling agent to improve adhesion to the substrate. Examples of the silane coupling agent that can be used include epoxy-based, methacrylic-based, amino-based, and imidazole-based silane coupling agents. From the viewpoint of improving adhesion, epoxy-based and imidazole-based silane coupling agents are particularly preferred.

[0288] [1-1-10] Phosphate Compound The photosensitive resin composition of the present invention may contain a phosphoric acid compound to improve adhesion to a substrate. As the phosphoric acid compound, (meth)acryloyloxy group-containing phosphates are preferred, and among them, those represented by the following general formulas (Va), (Vb), and (Vc) are preferred.

[0289]

[0290] In the above general formulae (Va), (Vb), and (Vc), R 8 represents a hydrogen atom or a methyl group, r and r' are integers of 1 to 10, and s is 1, 2, or 3. When the photosensitive resin composition of the present invention contains a phosphoric acid compound, its content is not particularly limited, but is preferably 0.1 mass% or more, more preferably 0.2 mass% or more, and even more preferably 0.3 mass% or more, and is preferably 5 mass% or less, more preferably 3 mass% or less, and even more preferably 1 mass% or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 0.1 to 5 mass% is preferred, 0.2 to 3 mass% is more preferred, and 0.3 to 1 mass% is even more preferred. By setting the content at or above the lower limit, adhesion to the substrate tends to be improved. Furthermore, by setting the content at or below the upper limit, surface curability tends to be improved.

[0291] [1-1-11] Chain Transfer Agent The photosensitive resin composition of the present invention may contain a chain transfer agent. Examples of chain transfer agents include mercapto group-containing compounds and carbon tetrachloride, with mercapto group-containing compounds being more preferred because they tend to have a high chain transfer effect. Mercapto group-containing compounds have low S—H bond energy, which makes them more susceptible to bond cleavage and chain transfer reactions, and therefore tend to be able to enhance surface curability.

[0292] Among chain transfer agents, from the viewpoints of taper angle and surface curability, mercapto group-containing compounds having an aromatic ring and aliphatic mercapto group-containing compounds are preferred, and aliphatic mercapto compounds are more preferred. Examples of mercapto group-containing compounds having an aromatic ring include mercapto group-containing compounds having an aromatic ring such as 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 3-mercapto-1,2,4-triazole, 2-mercapto-4(3H)-quinazoline, β-mercaptonaphthalene, and 1,4-dimethylmercaptobenzene, and from the viewpoint of taper angle, 2-mercaptobenzothiazole and 2-mercaptobenzimidazole are preferred.

[0293] The aliphatic mercapto group-containing compound is preferably an aliphatic polyfunctional mercapto group-containing compound. Examples thereof include butanediol bis(3-mercaptopropionate), butanediol bisthioglycolate, ethylene glycol bis(3-mercaptopropionate), ethylene glycol bisthioglycolate, trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tristhioglycolate, trishydroxyethyl tristhiopropionate, pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tris( 3-mercaptopropionate), butanediol bis(3-mercaptobutyrate), ethylene glycol bis(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione.

[0294] Among these, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), and 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione are preferred, and pentaerythritol tetrakis(3-mercaptopropionate) and pentaerythritol tetrakis(3-mercaptobutyrate) are more preferred. These may be used alone or in combination of two or more.

[0295] [1-1-12] Colorant The photosensitive resin composition of the present invention may contain a colorant for the purpose of coloring the partition walls. Known colorants such as pigments and dyes can be used as the colorant, but from the viewpoint of heat resistance, it is preferable to use a pigment. When the photosensitive resin composition contains a colorant, it may contain one type of colorant or two or more types of colorants. From the viewpoint of uniform light blocking in the visible range, it is preferable to use two or more types. Examples of pigments include organic pigments and inorganic pigments. When used for partition walls, organic pigments are preferred from the viewpoint of electrical insulation. Examples of organic pigments include organic color pigments and organic black pigments. Here, organic color pigments refer to organic pigments that exhibit colors other than black, and examples include red pigments, orange pigments, blue pigments, purple pigments, green pigments, yellow pigments, and white pigments.

[0296] In the photosensitive resin composition of the present invention, the content of the colorant in the photosensitive resin composition is not particularly limited, but is, for example, preferably 25% by mass or less, more preferably 20% by mass or less, even more preferably 10% by mass or less, particularly preferably 5% by mass or less, particularly preferably 1% by mass or less, and most preferably 0% by mass, relative to the total solid content of the photosensitive resin composition. By setting the content within the above range, the curability and ink repellency of the partition walls can be improved.

[0297] [1-1-13] Dispersant When the photosensitive resin composition of the present invention contains a colorant, it preferably contains a dispersant in order to finely disperse the colorant and stabilize the dispersed state. As the dispersant, a polymer dispersant having a functional group is preferred, and from the viewpoint of dispersion stability, polymer dispersants having functional groups such as a carboxy group; a phosphate group; a sulfonic acid group; or a base thereof; a primary, secondary, or tertiary amino group; a quaternary ammonium base; or a group derived from a nitrogen-containing heterocycle such as pyridine, pyrimidine, or pyrazine are preferred. In particular, polymer dispersants having a tertiary amino group or a quaternary ammonium base are particularly preferred from the viewpoint that the colorant can be dispersed with a small amount of dispersant.

[0298] Examples of polymeric dispersants include urethane-based dispersants, acrylic-based dispersants, polyethyleneimine-based dispersants, polyallylamine-based dispersants, dispersants consisting of a monomer and a macromonomer having an amino group, polyoxyethylene alkyl ether-based dispersants, polyoxyethylene diester-based dispersants, polyether phosphate-based dispersants, polyester phosphate-based dispersants, sorbitan aliphatic ester-based dispersants, and aliphatic-modified polyester-based dispersants.

[0299] Examples of polymer dispersants include, by trade name, EFKA (registered trademark, manufactured by BASF), DISPERBYK (registered trademark, manufactured by BYK-Chemie), DISPARLON (registered trademark, manufactured by Kusumoto Chemicals), SOLSPERSE (registered trademark, manufactured by Lubrizol), KP (manufactured by Shin-Etsu Chemical Co., Ltd.), POLYFLOW (manufactured by Kyoeisha Chemical Co., Ltd.), and AJISPER (registered trademark, manufactured by Ajinomoto Co., Inc.).

[0300] The weight-average molecular weight (Mw) of the polymer dispersant is preferably 700 or more, more preferably 1,000 or more. It is also preferably 100,000 or less, more preferably 50,000 or less. The above upper and lower limits can be combined arbitrarily. For example, the weight-average molecular weight (Mw) of the polymer dispersant is preferably 700 to 100,000, more preferably 1,000 to 50,000. From the viewpoint of dispersion stability of the (E) colorant, the (E) colorant preferably contains an acrylic polymer dispersant having a functional group. From the viewpoints of dispersibility and storage stability, a polymer dispersant having a basic functional group and either or both of a polyester bond and a polyether bond is preferred. One type of polymer dispersant may be used alone, or two or more types may be used in combination. From the viewpoint of dispersibility, the dispersant content is preferably 1% by mass or more, more preferably 1.5% by mass or more, and even more preferably 2% by mass or more, relative to the total solids content of the photosensitive resin composition. It is also preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 5% by mass or less.

[0301] [1-1-14] Photoacid Generator The photosensitive resin composition of the present invention may contain a photoacid generator. However, from the viewpoint of storage stability, the amount of a photoacid generator is preferably 1% by mass or less, more preferably 0.1% by mass or less, and even more preferably 0.01% by mass or less, based on the total solid content of the photosensitive resin composition. It is particularly preferable that the photoacid generator is not contained at all.

[0302] [1-2] Method for preparing photosensitive resin composition The photosensitive resin composition of the present invention is prepared by mixing the above-mentioned components with a mixer. The prepared photosensitive resin composition may be filtered using a membrane filter or the like to make it homogeneous.

[0303] [2] Partition Wall and Method for Forming the Same The photosensitive resin composition of the present invention can be suitably used to form partition walls, particularly partition walls for partitioning the organic layer (light-emitting portion) of an organic electroluminescent device. The partition walls of the present invention are obtained by curing the photosensitive resin composition of the present invention. The method for forming partition walls using the photosensitive resin composition of the present invention is not particularly limited, and conventionally known methods can be used. Examples of methods for forming partition walls include a method including a coating step of applying the photosensitive resin composition to a substrate to form a photosensitive resin composition layer, and an exposure step of exposing the photosensitive resin composition layer to light. A specific example of a method for forming such partition walls is photolithography.

[0304] In photolithography, a photosensitive resin composition is applied to the entire surface of a region of a substrate where partition walls are to be formed, thereby forming a photosensitive resin composition layer. The formed photosensitive resin composition layer is exposed to light according to a predetermined partition wall pattern, and then the exposed photosensitive resin composition layer is developed to form partition walls on the substrate. In the application step of photolithography, the photosensitive resin composition is applied to a substrate on which partition walls are to be formed using a contact transfer type application device such as a roll coater, reverse coater, or bar coater, or a non-contact type application device such as a spinner (rotary application device) or curtain flow coater, and the solvent is removed by drying as necessary to form a photosensitive resin composition layer.

[0305] Next, in the exposure step, the photosensitive resin composition is irradiated with active energy rays such as ultraviolet rays and excimer laser light using a negative mask, and the photosensitive resin composition layer is partially exposed according to the pattern of the partition walls. For exposure, a light source that emits ultraviolet rays, such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, or a carbon arc lamp, can be used. The exposure dose varies depending on the composition of the photosensitive resin composition, but is, for example, 10 to 400 mJ / cm. 2 The degree is preferable.

[0306] Next, in the development step, the photosensitive resin composition layer exposed according to the partition wall pattern is developed with a developer to form a partition wall pattern. The development method is not particularly limited, and an immersion method, a spray method, or the like can be used. Specific examples of developers include organic developers such as dimethylbenzylamine, monoethanolamine, diethanolamine, and triethanolamine, as well as aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. An antifoaming agent or a surfactant can also be added to the developer.

[0307] The developed partition wall pattern is then post-baked and heat-cured to obtain the partition walls. Post-baking is preferably performed at 150 to 250°C for 15 to 60 minutes. After the partition wall formation, a cleaning treatment can be performed to clean the unexposed areas. The cleaning method is not particularly limited, and examples include plasma irradiation, excimer light irradiation, and UV irradiation. In the case of excimer light irradiation or UV irradiation, active oxygen caused by light irradiation can decompose and remove organic matter attached to the pixel areas.

[0308] The substrate used for forming the partition wall is not particularly limited and may be appropriately selected depending on the type of organic electroluminescent device to be manufactured using the substrate on which the partition wall is formed. Suitable substrate materials include glass and various resin materials. Specific examples of resin materials include polyesters such as polyethylene terephthalate; polyolefins such as polyethylene and polypropylene; polycarbonates; poly(meth)methacrylic resins; polysulfones; and polyimides.

[0309] Among these substrate materials, glass and polyimide are preferred because of their excellent heat resistance. Depending on the type of organic electroluminescent device to be manufactured, a transparent electrode layer such as ITO or ZnO may be previously provided on the surface of the substrate on which the partition walls are to be formed. The thickness (height) of the partition walls is usually 0.5 to 10 μm.

[0310] [3] Organic electroluminescent element The organic electroluminescent element of the present invention comprises the partition wall of the present invention. Various organic electroluminescent elements are manufactured using a substrate having a partition wall pattern manufactured by the method described above. The method for forming the organic electroluminescent element is not particularly limited, but preferably, the organic electroluminescent element is manufactured by forming a partition wall pattern on the substrate by the method described above, and then injecting ink into the areas on the substrate surrounded by the partition walls to form organic layers such as pixels.

[0311] Examples of organic electroluminescent device types include bottom-emission and top-emission types. A bottom-emission device is fabricated, for example, by forming a partition wall on a glass substrate on which a transparent electrode is laminated, and then laminating a hole transport layer, a light-emitting layer, an electron transport layer, and a metal electrode layer in an opening surrounded by the partition wall. A top-emission device is fabricated, for example, by forming a partition wall on a glass substrate on which a metal electrode layer is laminated, and then laminating an electron transport layer, a light-emitting layer, a hole transport layer, and a transparent electrode layer in an opening surrounded by the partition wall.

[0312] Examples of the light-emitting layer include organic electroluminescent layers such as those described in Japanese Patent Publication No. 2009-146691 and Japanese Patent No. 5734681. Quantum dots such as those described in Japanese Patent Publication No. 5653387 and Japanese Patent Publication No. 5653101 may also be used. The solvent used to form the ink for forming the organic layer may be water, an organic solvent, or a mixture thereof. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Examples of organic solvents include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, and 3-phenoxytoluene. The ink may also contain, for example, a surfactant, an antioxidant, a viscosity modifier, or an ultraviolet absorber.

[0313] The inkjet method is preferred as a method for injecting ink into the region surrounded by the partition wall, as it allows for easy injection of a small amount of ink into a predetermined location. The ink used to form the organic layer is selected appropriately depending on the type of organic electroluminescent device to be manufactured. When injecting ink by the inkjet method, the viscosity of the ink is not particularly limited as long as the ink can be ejected satisfactorily from the inkjet head, but is preferably 4 to 20 mPa·s, and more preferably 5 to 10 mPa·s. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, etc.

[0314] [4] Image Display Device The image display device of the present invention includes the organic electroluminescent element of the present invention. There are no particular limitations on the type or structure of the image display device, as long as it includes the organic electroluminescent element of the present invention. For example, the image display device of the present invention can be assembled according to a conventional method using an active-drive organic electroluminescent element. For example, the image display device of the present invention can be formed by a method such as that described in "Organic EL Display" (Ohmsha, published August 20, 2004, by Shizuo Tokito, Chinaya Adachi, and Hideyuki Murata). For example, an organic electroluminescent element that emits white light may be combined with a color filter to display an image, or organic electroluminescent elements that emit different colors of light, such as RGB, may be combined to display an image.

[0315] The present invention will be described below with reference to specific examples, but the present invention is not limited to the following examples as long as the gist of the invention is not exceeded. The components of the photosensitive resin composition used in the following examples and comparative examples are as follows.

[0316] <Alkali-soluble resin> b-1: Alkali-soluble resin having the following structural unit (epoxy (meth)acrylate resin (solid acid value: 80 mg KOH / g, polystyrene-equivalent weight average molecular weight (Mw) measured by GPC: 8,000, mixture of compounds having the following structure in which m and n are 1 to 20)

[0317]

[0318] In the above formula, * represents a monovalent group represented by the following formula or a bond to a hydrogen atom.

[0319]

[0320] b-2: Alkali-soluble resin having the following structural unit (epoxy (meth)acrylate resin ("ZCR-8055H" manufactured by Nippon Kayaku Co., Ltd. (weight average molecular weight Mw = 7000, acid value = 64 mgKOH / g)). Has a partial structure represented by the following formula.)

[0321]

[0322] (wherein m:n = 4:6 to 3:7. In the above formula, * represents a bond between structural units. In the above formula, ** represents a bond to a hydrogen atom or a monovalent group represented by the following formula.)

[0323]

[0324] b-3: Alkali-soluble resin-VIII described in paragraph

[0449] of WO 2024 / 034637.

[0325] <Photopolymerizable Compound> c-1: "KAYARAD DPEA-12" manufactured by Nippon Kayaku Co., Ltd. (a reaction product of dipentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid). c-2: "KAYARAD DPHA" manufactured by Nippon Kayaku Co., Ltd. (a mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate).

[0326] <Photopolymerization initiator> a-1: A compound having the following structure: This compound can be produced by the method described in WO 2009 / 131189.

[0327]

[0328] (D) Compound d-1: NC-3500 (epoxy equivalent 207, weight average molecular weight 1900) manufactured by Nippon Kayaku Co., Ltd.; d-1 has structural units where n = 1 and 2 in formula (1). d-2: NC-3000 (epoxy equivalent 277, weight average molecular weight 1400) manufactured by Nippon Kayaku Co., Ltd.; d-2 has a structural unit where n = 1 in formula (1). d-3: RE-310S (epoxy equivalent 183, weight average molecular weight 410) manufactured by Nippon Kayaku Co., Ltd.; d-3 corresponds to a bisphenol A type epoxy resin. d-4: XD-1000 (epoxy equivalent 245 to 260, weight average molecular weight 920 to 930) manufactured by Nippon Kayaku Co., Ltd.; d-4 is an epoxy resin having a dicyclopentane skeleton.

[0329] (E) Compound e-1: An acrylic copolymer resin having a structural unit having a perfluoroalkyl group, a structural unit having an ethylenic double bond, and a structural unit having a carboxy group. Weight-average molecular weight: 90,000, fluorine atom content: 20% by mass. e-2: A Si-based liquid repellent (a copolymer resin having a structural unit of the following formula. Weight-average molecular weight: 14,000, (molar number of e2-2-1X): (molar number of e2-2-2X) = 22:78. * indicates a bond.): e-2 corresponds to compound (E2-2). It can be produced by the method described in JP 2023-169574 A.

[0330]

[0331] Surfactant: DIC Megafac F554

[0332] <Additives> f-1: KAYAMER PM-21 (phosphate compound) manufactured by Nippon Kayaku Co., Ltd. f-2: methylhydroquinone (polymerization inhibitor)

[0333]

[0334] f-3: TINUVIN 384-2 (ultraviolet absorber) manufactured by BASF; contains a compound of the following structural formula.

[0335]

[0336] Dispersant-1: A high molecular weight acrylic A-B block copolymer consisting of an A block having a quaternary ammonium base and a tertiary amino group in the side chain and a B block having no quaternary ammonium base or tertiary amino group. The amine value is 70 mg KOH / g. The acid value is 1 mg KOH / g or less.

[0337] Solvent 1: Propylene glycol monomethyl ether acetate Solvent 2: 3-methoxy-1-butanol

[0338] [Preparation of Pigment Dispersion] <Pigment Dispersion 1> A mixture was obtained by mixing the pigment, dispersant, alkali-soluble resin, and solvent listed in Table 1 in the mass ratio listed in Table 1. The resulting mixture was subjected to a dispersion treatment using a paint shaker at a temperature range of 25 to 45°C for 3 hours. Zirconia beads with a diameter of 0.5 mm were added in an amount 2.5 times the mass of the dispersion. After dispersion was completed, the beads and the dispersion were separated using a filter to prepare Pigment Dispersion 1. The amount of solvent in Table 1 includes the amount of solvent derived from the dispersant and alkali-soluble resin. A blank cell in Table 1 indicates that the component was not blended (amount blended: 0 parts by mass).

[0339]

[0340] <Preparation of Photosensitive Resin Compositions> The photosensitive resin compositions of Examples 1 to 8 and Comparative Examples 1 to 5 were prepared by using the components in the blending ratios shown in Tables 2 and 3, and stirring the components until homogeneous using propylene glycol monomethyl ether acetate so that the total solid content of the photosensitive resin composition was 15% by mass. The blending ratio (% by mass) of each component in Tables 2 and 3 means the value of the solid content of each component in the total solid content of the photosensitive resin composition.

[0341] The photosensitive resin compositions of Examples 1 to 8 and Comparative Examples 1 to 5 were used to evaluate their performance by the methods described below.

[0342] <Preparation and Evaluation of Substrates for Contact Angle Measurement> Each photosensitive resin composition was applied to a glass substrate using a spinner so that the film thickness would be 1.0 μm after heat curing. The composition was then dried by heating on a hot plate at 114° C. for 2 minutes to obtain a coated substrate. Next, the resulting coating was exposed to light at an illuminance of 500 mW / cm using a Canon mirror projection exposure machine (MPA-600FA) without using a photomask. ２ , exposure dose 100 mJ / cm ２ The entire surface was exposed to light at 1000 K. Then, the substrate was spray-developed with a 2.38% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) at 24°C for 60 seconds, and then washed with pure water for 20 seconds. The substrate was then heat-cured in an oven at 230°C for 60 minutes to obtain a substrate for contact angle measurement with a cured product applied to the entire surface.

[0343] The contact angle was measured using a contact angle measuring device, Drop Master 500, manufactured by Kyowa Interface Science Co., Ltd., under conditions of 23°C and 50% humidity. 1.0 μL of propylene glycol methyl ether acetate was dropped onto a substrate for contact angle measurement, and the contact angle was measured after 1 second. The measurement results are shown in Tables 2 and 3. A larger contact angle indicates higher ink repellency. A: Contact angle 40 degrees or more B: Contact angle less than 40 degrees Using each photosensitive resin composition, partition walls were formed and their performance was evaluated by the methods described below.

[0344] (Formation of Partition Walls) Each photosensitive resin composition was applied onto an ITO film formed on a glass substrate using a spinner so that the film would have a thickness of 1.0 μm after heat curing. The composition was then dried by heating on a hot plate at 114°C for 2 minutes to obtain a coated substrate. The resulting coating film was exposed to light using a Canon mirror projection exposure machine (MPA-600FA) at an illuminance of 500 mW / cm using a mask with lattice-shaped openings (a mask having multiple 60 μm x 240 μm coated areas spaced 20 μm apart). ２ , exposure dose 100 mJ / cm ２The substrate was then exposed to light at 230°C for 60 minutes. The substrate was then spray-developed with a 2.38% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) at 24°C for 60 seconds, and then washed with pure water for 1 minute. The substrate, on which the unexposed areas had been removed and a pattern had been formed by these operations, was then heated and cured in an oven at 230°C for 60 minutes to obtain a partition wall substrate.

[0345] (Evaluation of Inkjet Coatability) In the substrate having the above-described grid-shaped partition walls, inkjet coating was performed on the pixel opening regions using a DMP-2831 manufactured by Fujifilm Corporation. A solvent (isoamyl benzoate) was used alone as the ink, and 40 pL per pixel was applied to 24 pixels to evaluate wetting and spreading properties. The greater the number of pixels that were sufficiently wetted and spread among the 24 pixels, the better the inkjet coatability.

[0346] A: The number of pixels where ink spreads within 24 pixels is more than 20. B: The number of pixels where ink spreads within 24 pixels is more than 12, but less than 20. C: The number of pixels where ink spreads within 24 pixels is 12 or less.

[0347]

[0348]

[0349] Examples 1 to 8 exhibited good inkjet coating properties and a sufficient contact angle. This is presumably because the (D) compound having a cyclic ether group contained in the photosensitive resin composition of Examples 1 to 8 reacts with the ink repellent agent and the acid moiety of the alkali-soluble resin to form a rigid crosslinked structure. Furthermore, adjusting the content ratio of the (D) compound and the (E) compound tends to be advantageous in suppressing outflow of the liquid repellent agent.

[0350] In Comparative Example 1, since the compound (D) was not contained, the liquid repellent agent decomposed during heating when forming the partition walls, leaking into the pixels and deteriorating the inkjet coatability. In Comparative Example 2, since the content ratio of the compound (E) relative to the compound (D) was high, it is thought that the liquid repellent agent was not sufficiently prevented from leaking, resulting in the deterioration of the inkjet coatability.

[0351] Examples 1 and 2 tend to have better inkjet coatability than Comparative Examples 3 and 4. This is presumably because the compound (D) contained in Examples 1 and 2 contains many aromatic rings in the main chain, making it less susceptible to thermal decomposition during heat treatment, improving the heat resistance of the entire coating film, and preventing the outflow of the liquid repellent agent.

[0352] In Example 8, even when a colorant was contained, the content ratio of the (E) compound relative to 100 parts by mass of the (D) compound was 2 parts by mass or more and 8 parts by mass or less, so that both liquid repellency and inkjet coatability could be ensured.

[0353] In order to ensure the ink repellency of the partition wall surface, it is also important to contain, as a liquid repellent agent, compound (E) having a crosslinking group and a fluorine atom and / or a siloxane chain. The liquid repellent agent used in Comparative Example 5 (a compound corresponding to compound (E)) does not have a crosslinking group, and therefore the liquid repellent agent is difficult to fix to the surface of the coating film after exposure to ultraviolet light and flows into the developer in the development treatment, which is expected to deteriorate the ink repellency of the partition wall surface and also deteriorate the inkjet coatability.

Claims

1. A photosensitive resin composition containing (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, (D) a compound, and (E) a compound, wherein the (D) compound is a compound having a cyclic ether group having 2 to 3 carbon atoms and having an aromatic ring and / or a heterocycle, and the (E) compound is a compound having a crosslinking group and having a fluorine atom and / or a siloxane chain, and the content of the (E) compound per 100 parts by mass of the (D) compound is 2 parts by mass or more and 8 parts by mass or less.

2. The photosensitive resin composition according to claim 1, wherein the content of the compound (D) is 10 parts by mass or more per 100 parts by mass of the alkali-soluble resin (B).

3. The photosensitive resin composition according to claim 1 or 2, wherein the compound (D) has a structural unit represented by the following formula (1): (In formula (1), R ｄ１１ represents a divalent aliphatic hydrocarbon group. n represents an integer of 1 or 2. The benzene ring in formula (1) may be further substituted with any substituent. * represents a bond.

4. The photosensitive resin composition according to claim 1 or 2, wherein the acid value of the compound (D) is 1 mgKOH / g or less.

5. The photosensitive resin composition according to claim 1 or 2, wherein the alkali-soluble resin (B) contains an epoxy (meth)acrylate having an aromatic ring in the main chain.

6. The photosensitive resin composition according to claim 1 or 2, wherein the (C) photopolymerizable compound comprises a reaction product of pentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid, or a reaction product of dipentaerythritol, (poly)ethylene glycol, and (meth)acrylic acid.

7. The photosensitive resin composition according to claim 1 or 2, further comprising an aliphatic mercapto compound.

8. The photosensitive resin composition according to claim 1 or 2, which does not contain a colorant or which contains a colorant in an amount of 5 mass % or less relative to the total solid mass of the photosensitive resin composition.

9. A cured product obtained by curing the photosensitive resin composition according to claim 1 or 2.

10. A partition wall made from the cured product according to claim 9.

11. An organic electroluminescent device having the partition wall according to claim 10.

12. An image display device comprising the organic electroluminescent device according to claim 11.