Substrate processing system with intermediate unit

Abstract

The present invention relates to a technology for enhancing the scalability of a substrate processing system. This substrate processing system comprises a plurality of processing modules (11, 12) configured to process a substrate W, and an intermediate unit (20) disposed between the plurality of processing modules (11, 12). The intermediate unit (20) comprises cleaning modules (71, 72) for cleaning the substrate W, and a substrate station (75) on which the substrate W is temporarily placed. The cleaning modules (71, 72) and the substrate station (75) are vertically arranged.

Description

Substrate processing system with intermediate unit

[0001] The present invention relates to a substrate processing system having a plurality of processing modules, and more particularly to a technique for improving the expandability of the substrate processing system.

[0002] In the manufacture of semiconductor devices, various processes are performed on substrates, such as grinding, CMP (chemical mechanical polishing), and partial polishing. Typically, these processes are performed by separate substrate processing equipment. For example, a grinding apparatus is used to grind a substrate, and a CMP apparatus is used to CMP a substrate.

[0003] On the other hand, there have been attempts to realize a composite substrate processing apparatus capable of performing various processes on a substrate. Specifically, a composite substrate processing apparatus equipped with multiple processing modules for performing various processes has been proposed. Such a composite substrate processing apparatus is expected to improve throughput because it can complete multiple processes on a substrate within a single apparatus.

[0004] JP 2014-37009 A JP 2023-76852 A JP 10-50640 A

[0005] However, the cleanliness level within each process module varies depending on the process. For example, a grinding process for roughly polishing a substrate generates a larger amount of polishing debris than a CMP process. Therefore, the cleanliness level of a grinding module for performing a grinding process is lower than the cleanliness level of a CMP module for performing CMP. When process modules with different cleanliness levels are combined, there is a risk of contamination spreading from one process module to another. For this reason, it is necessary to combine only process modules with the same or similar cleanliness levels, resulting in low scalability of integrated substrate processing apparatuses.

[0006] Therefore, the present invention provides a substrate processing system that can improve expandability by enabling various processing modules to be combined.

[0007] In one aspect, a substrate processing system for processing a substrate is provided, comprising: a plurality of processing modules configured to process the substrate; and an intermediate unit arranged between the plurality of processing modules, the intermediate unit comprising a cleaning module for cleaning the substrate; and a substrate station in which the substrate is temporarily placed, the cleaning module and the substrate station being arranged along a vertical direction.

[0008] In one aspect, the cleaning module includes a post-cleaning module that cleans the substrate processed by any one of the plurality of processing modules. In one aspect, the post-cleaning module is configured to clean both sides of the substrate. In one aspect, the cleaning module includes a pre-cleaning module that cleans the substrate before it is processed by the plurality of processing modules. In one aspect, the pre-cleaning module is configured to clean a back side of the substrate, which is the side opposite to the side of the substrate that is processed by the plurality of processing modules. In one aspect, the intermediate unit further includes a fan filter unit disposed above the substrate station and the cleaning module. In one aspect, the intermediate unit further includes a module cover wall that covers the cleaning module and the substrate station, the module cover wall having a maintenance door. In one aspect, the maintenance door is located on the back side of the cleaning module.

[0009] The intermediate unit not only functions as a relay device between the multiple processing modules but also prevents the diffusion of contamination between the multiple processing modules. That is, the cleaning module of the intermediate unit can clean the substrate before or after processing in each processing module to remove substances such as polishing debris and abrasive grains from the substrate. Therefore, multiple processing modules with different cleanliness levels can be combined, resulting in improved scalability of the substrate processing system.

[0010] Fig. 3 is a plan view showing an embodiment of a substrate processing system; Fig. 4 is a view showing an embodiment of an intermediate unit; Fig. 5 is a schematic view showing an embodiment of a pre-cleaning module; Fig. 6 is a schematic view showing an embodiment of a post-cleaning module; Fig. 7 is a rear view of the intermediate unit shown in Fig. 2; Fig. 8 is a view showing another embodiment of the intermediate unit; Fig. 9 is a schematic view showing an example of a substrate transport route in the substrate processing system shown in Fig. 1; Fig. 10 is a schematic view showing another example of a substrate transport route in the substrate processing system shown in Fig. 1.

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing one embodiment of a substrate processing system. As shown in FIG. 1, the substrate processing system includes a first processing module 11 and a second processing module 12 for processing substrates W. Examples of processing of substrates W include grinding, chemical mechanical polishing, unevenness corrective polishing, and finish polishing. Specific examples of substrates W include wafers used in semiconductor devices, circular substrates, square substrates, and panels. In the embodiment described below, a circular wafer is used as the substrate W.

[0012] The types of the first processing module 11 and the second processing module 12 are not particularly limited as long as they are configured to process substrates W. The first processing module 11 and the second processing module 12 may be the same type of processing module or different types of processing modules. If the first processing module 11 and the second processing module 12 are the same type of processing module, the throughput of substrate processing can be improved. If the first processing module 11 and the second processing module 12 are different types of processing modules, different processes can be performed on a single substrate.

[0013] In one embodiment, the first processing module 11 is a grinding module that grinds (or roughly polishes) the substrate W. For example, the first processing module 11 is a thinning module that thins a laminated substrate formed by bonding multiple substrates together by grinding silicon from the laminated substrate. The thinning module as a grinding module is configured to grind the substrate W by rotating the substrate W and bringing a grinder into sliding contact with the substrate W.

[0014] In one embodiment, the second processing module 12 is an asymmetry correcting module that removes localized protrusions in the surface of the substrate W ground by the first processing module 11. The asymmetry correcting module is configured to remove localized protrusions in the surface of the substrate W by a polishing head.

[0015] In another embodiment, one or both of the first processing module 11 and the second processing module 12 is a CMP (chemical mechanical polishing) module that chemically and mechanically polishes the substrate W. The CMP module is configured to chemically and mechanically polish the substrate W by bringing the substrate W into sliding contact with a polishing pad using a polishing head while supplying slurry onto the polishing pad.

[0016] The first processing module 11 and the second processing module 12 may have a configuration other than the grinding module (thinning module), the irregularity correction module, and the CMP module described above.

[0017] The first processing module 11 includes a first transfer robot 15 and a first processing stage 16, and the second processing module 12 includes a second transfer robot 17 and a second processing stage 18. Each of the first processing module 11 and the second processing module 12 is a unitized assembly that is detachably connected to the substrate processing system. One or both of the first processing module 11 and the second processing module 12 can be removed, and another type of processing module can be connected to the substrate processing system.

[0018] The substrate processing system includes an intermediate unit 20 disposed between a first processing module 11 and a second processing module 12. The intermediate unit 20 is adjacent to both the first processing module 11 and the second processing module 12. The first processing module 11, the second processing module 12, and the intermediate unit 20 are arranged on one side of the substrate processing system.

[0019] The intermediate unit 20 is arranged within the reach of the first transport robot 15 of the first treatment module 11 and the second transport robot 17 of the second treatment module 12. Substrates W are transported between the intermediate unit 20 and the first treatment module 11 by the first transport robot 15, and between the intermediate unit 20 and the second treatment module 12 by the second transport robot 17. As will be described later, the intermediate unit 20 not only functions as a relay device between the multiple treatment modules 11, 12, but also has the function of cleaning the substrates W before or after treatment of the substrates W in the multiple treatment modules 11, 12.

[0020] The substrate processing system includes a loading / unloading section 25, a substrate transfer stage 27, and an intermediary transfer device 31. The loading / unloading section 25 further includes a plurality of cassette loaders 35 on which cassette storages 34 storing a plurality of substrates W are placed, and a transfer robot 36 that removes one substrate W to be polished from the cassette storage 34 and transfers it to the substrate transfer stage 27.

[0021] The transfer robot 36 is disposed between the cassette loader 35 and the substrate transfer stage 27. The substrate processing system further includes a horizontal movement mechanism 39 that moves the transfer robot 36 horizontally along the arrangement direction of the plurality of cassette loaders 35. The transfer robot 36 is moved to one of the plurality of cassette loaders 35 by the horizontal movement mechanism 39, and removes a substrate W from the cassette storage 34 on that cassette loader 35.

[0022] The substrate transport stage 27 includes a movable stage 28 on which the substrate W is placed, and a stage moving mechanism 29 that moves the movable stage 28 between the transport robot 36 and the intermediary transport device 31. The cassette loader 35 places the substrate W taken out from the cassette storage 34 on the movable stage 28, and the stage moving mechanism 29 transports the substrate W together with the movable stage 28 to the intermediary transport device 31. The intermediary transport device 31 has a hand 32 for transporting the substrate W. The intermediary transport device 31 is configured to take the substrate W out of the movable stage 28 and transport it to the intermediate unit 20.

[0023] The substrate processing system further includes a substrate mounting stage 40 on which the substrate W is temporarily placed, a first cleaning module 41 and a second cleaning module 42 that clean the substrate W processed by the processing modules 11 and 12, a drying module 43 that dries the cleaned substrate W, and a post-processing transport device 50 that transports the substrate W between the substrate mounting stage 40, the first cleaning module 41, the second cleaning module 42, and the drying module 43.

[0024] The substrate mounting stage 40 is disposed adjacent to the intermediary transport device 31 and the first cleaning module 41. The intermediary transport device 31 takes the substrate W, which has been processed by the processing modules 11 and 12, out of the intermediate unit 20 and places the substrate W on the substrate mounting stage 40. The post-processing transport device 50 has a transport arm 51, and transports the substrate W from the substrate mounting stage 40 to the first cleaning module 41 by the transport arm 51. The substrate W is cleaned by the first cleaning module 41.

[0025] The substrate W cleaned by the first cleaning module 41 is transported by the post-processing transport device 50 to the second cleaning module 42, where it is further cleaned. The types of the first cleaning module 41 and the second cleaning module 42 are not particularly limited. For example, the first cleaning module 41 is a buff cleaning device or a sponge scrubbing cleaning device, and the second cleaning module 42 is a sponge scrubbing cleaning device. In addition to the first cleaning module 41 and the second cleaning module 42, further cleaning modules may be provided.

[0026] The substrate W cleaned by the second cleaning module 42 is transported by the post-processing transport device 50 to the drying module 43, and dried by the drying module 43. The type of the drying module 43 is not particularly limited. For example, the drying module 43 may be an IPA drying device that dries the substrate W by spraying isopropyl alcohol vapor onto the substrate W, or may be a spin drying device that removes liquid from the substrate W by rotating the substrate W at high speed. The substrate W dried by the drying module 43 is taken out of the drying module 43 by the transport robot 36 and returned to the cassette storage 34 by the transport robot 36.

[0027] The substrate processing system further includes an operation control unit 60 for controlling the operation thereof. The components of the substrate processing system, including the processing modules 11 and 12, the intermediate unit 20, the transfer robot 36, the substrate transfer stage 27, the relay transfer device 31, the horizontal movement mechanism 39, the first cleaning module 41, the second cleaning module 42, the drying module 43, and the post-processing transfer device 50, are controlled by the operation control unit 60.

[0028] The operation control unit 60 includes a storage device 60a that stores a program and a processor 60b that executes calculations according to instructions included in the program. The operation control unit 60 is composed of at least one computer. The storage device 60a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the processor 60b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 60 is not limited to these examples.

[0029] Next, the intermediate unit 20 will be described. Fig. 2 is a diagram showing one embodiment of the intermediate unit 20. The intermediate unit 20 includes a pre-cleaning module 71 that cleans a substrate W before it is processed by the processing modules 11, 12, a post-cleaning module 72 that cleans a substrate W that has been processed by either one of the processing modules 11, 12, and a substrate station 75 on which the substrate W is temporarily placed.

[0030] The substrate station 75, the post-cleaning module 72, and the pre-cleaning module 71 are arranged vertically. This arrangement allows for a small footprint of the intermediate unit 20. In the embodiment shown in FIG. 2, the substrate station 75 is located above the post-cleaning module 72, and the pre-cleaning module 71 is located below the post-cleaning module 72.

[0031] The intermediate unit 20 further includes a fan filter unit 77 disposed above the substrate station 75, the pre-cleaning module 71, and the post-cleaning module 72. In the embodiment shown in FIG. 2 , the fan filter unit 77 is located above the substrate station 75. The fan filter unit 77 is configured to remove foreign matter such as dust from the air surrounding the intermediate unit 20 and supply clean air to the interior of the intermediate unit 20. Because the fan filter unit 77 is disposed above the substrate station 75, the pre-cleaning module 71, and the post-cleaning module 72, the fan filter unit 77 creates a downward flow of clean air within the intermediate unit 20 and creates a positive pressure within the intermediate unit 20. The positive pressure within the intermediate unit 20 can prevent relatively dirty air from the adjacent processing modules 11 and 12 from flowing into the intermediate unit 20.

[0032] The intermediate unit 20 further includes a module cover wall 79 that covers the fan filter unit 77, the substrate station 75, the pre-cleaning module 71, and the post-cleaning module 72. The module cover wall 79 separates the interior and exterior of the intermediate unit 20.

[0033] The pre-cleaning module 71 is configured to clean at least the back surface of the substrate W before it is processed by the processing modules 11 and 12. The back surface of the substrate W is the surface of the substrate W opposite to the surface that is processed by the processing modules 11 and 12. If foreign matter such as particles adheres to the back surface of the substrate W, the substrate W may partially rise when the back surface of the substrate W is held on the processing stages 16 and 18 (see FIG. 1 ). Therefore, in order to remove foreign matter from the back surface of the substrate W, the back surface of the substrate W is cleaned by the pre-cleaning module 71 before the substrate W is processed by the processing modules 11 and 12.

[0034] Fig. 3 is a schematic diagram showing one embodiment of the pre-cleaning module 71. The pre-cleaning module 71 of the embodiment shown in Fig. 3 includes a plurality of holding rollers 81 as substrate holders that rotate the substrate W while holding the peripheral edge of the substrate W, a scrubbing tool 82 that comes into sliding contact with the underside of the substrate W, an upper rinse nozzle 84 that supplies a rinse liquid to the upper surface of the substrate W, and a lower rinse nozzle 85 that supplies a rinse liquid to the underside of the substrate W. In the embodiment shown in Fig. 3, the underside of the substrate W is the backside of the substrate W, which is opposite to the surface that is processed by the processing modules 11 and 12.

[0035] The plurality of holding rollers 81 rotate about their own axes to rotate the substrate W. The scrubbing tool 82 is, for example, a roll sponge that is longer than the diameter of the substrate W. The scrubbing tool 82 scrubs the lower surface (rear surface) of the substrate W by sliding against the lower surface of the substrate W while rotating. During scrubbing of the substrate W, a rinse liquid (e.g., pure water) is supplied to the upper and lower surfaces of the substrate W from an upper rinse nozzle 84 and a lower rinse nozzle 85.

[0036] The pre-cleaning module 71 further includes a housing 86 that encloses the plurality of holding rollers 81, the scrubbing tool 82, the upper rinse nozzle 84, and the lower rinse nozzle 85. A cleaning chamber 87 is formed inside the housing 86. The housing 86 prevents the rinse liquid from splashing outside the housing 86.

[0037] The pre-cleaning module 71 is not limited to the embodiment shown in Fig. 3. For example, the pre-cleaning module 71 may be configured to direct a two-fluid jet consisting of a mixed fluid of liquid and gas onto the lower surface (rear surface) of the substrate W. In that case, the substrate W may be rotated by a rotary chuck instead of the holding rollers 81. In another example, the pre-cleaning module 71 may be configured to direct the two-fluid jet onto the upper and lower surfaces of the substrate W.

[0038] Fig. 4 is a schematic diagram showing an embodiment of the post-cleaning module 72. The post-cleaning module 72 of the embodiment shown in Fig. 4 includes a plurality of holding rollers 91 as a substrate holder that rotates the substrate W while holding the peripheral edge of the substrate W, a two-fluid nozzle 92 that directs a two-fluid jet onto the upper surface of the substrate W, a scrubbing tool 93 that comes into sliding contact with the lower surface of the substrate W, an upper rinse nozzle 94 that supplies a rinse liquid to the upper surface of the substrate W, and a lower rinse nozzle 95 that supplies a rinse liquid to the lower surface of the substrate W.

[0039] The plurality of holding rollers 91 rotate about their own axes to rotate the substrate W. The two-fluid nozzle 92 is configured to form a two-fluid jet consisting of a mixed fluid of liquid and gas. The scrubbing tool 93 is, for example, a roll sponge longer than the diameter of the substrate W. The scrubbing tool 93 scrubs the lower surface of the substrate W by sliding against the lower surface of the substrate W while rotating. During scrubbing of the substrate W, a rinse liquid (e.g., pure water) is supplied to the upper and lower surfaces of the substrate W from an upper rinse nozzle 94 and a lower rinse nozzle 95.

[0040] The post-cleaning module 72 further includes a housing 97 that encloses the plurality of holding rollers 91, the two-fluid nozzle 92, the scrub cleaning tool 93, the upper rinse nozzle 94, and the lower rinse nozzle 95. A cleaning chamber 98 is formed inside the housing 97. The housing 97 prevents the rinse liquid containing polishing debris and the like from scattering outside the housing 97.

[0041] The post-cleaning module 72 is not limited to the embodiment shown in Figure 4. For example, the post-cleaning module 72 may be configured to direct two-fluid jets onto the upper and lower surfaces of the substrate W. In another example, the post-cleaning module 72 may be configured to scrub the upper and lower surfaces of the substrate W with two scrubbing tools.

[0042] The intermediate unit 20 not only functions as a relay device between the processing modules 11 and 12, but also has the function of preventing the diffusion of contamination between the processing modules 11 and 12. That is, the pre-cleaning module 71 and the post-cleaning module 72 of the intermediate unit 20 can clean the substrate W before or after processing in each processing module, thereby removing substances such as polishing debris and abrasive grains from the substrate W. Therefore, multiple processing modules with different cleanliness levels can be combined, resulting in improved expandability of the substrate processing system.

[0043] Fig. 5 is a rear view of the intermediate unit 20 shown in Fig. 2. As shown in Fig. 5, the module cover wall 79 has a maintenance door 100. The maintenance door 100 is provided on the rear surface 79a of the module cover wall 79. More specifically, the maintenance door 100 is located on the rear side of the pre-cleaning module 71 and the post-cleaning module 72.

[0044] The pre-cleaning module 71 and the post-cleaning module 72 require periodic maintenance because polishing debris and the like may accumulate inside them or to replace scrubbing tools. The maintenance door 100 is closed when the substrate processing system is in operation. When maintenance is required for either or both of the pre-cleaning module 71 and the post-cleaning module 72, the operation of the substrate processing system is stopped and the maintenance door 100 is opened. In this embodiment, the maintenance door 100 is a manual door, but it may also be an actuator-driven door. When the maintenance door 100 is opened, an operator can access the pre-cleaning module 71 and the post-cleaning module 72.

[0045] 2, the intermediate unit 20 includes both a pre-cleaning module 71 and a post-cleaning module 72, although in one embodiment, the pre-cleaning module 71 may not be provided. In other embodiments, the intermediate unit 20 may further include other types of cleaning modules in addition to the pre-cleaning module 71 and the post-cleaning module 72.

[0046] 2, the substrate station 75, post-cleaning module 72, and pre-cleaning module 71 are arranged vertically in this order: substrate station 75, post-cleaning module 72, pre-cleaning module 71. However, the arrangement of the substrate station 75, post-cleaning module 72, and pre-cleaning module 71 is not limited to the embodiment shown in Fig. 2. For example, as shown in Fig. 6, the post-cleaning module 72 may be arranged below the pre-cleaning module 71. The arrangement shown in Fig. 6 is advantageous over the arrangement shown in Fig. 2 in that liquid containing polishing debris leaking from the post-cleaning module 72 does not fall onto the pre-cleaning module 71.

[0047] Substrate station 75 is located above post-cleaning module 72 and pre-cleaning module 71, although in one embodiment substrate station 75 may be located between post-cleaning module 72 and pre-cleaning module 71. Additionally, multiple substrate stations 75 may be provided to increase throughput.

[0048] Fig. 7 is a schematic diagram showing an example of a substrate transfer route in the substrate processing system shown in Fig. 1. The substrate transfer and substrate processing operations described below are performed by processing modules 11 and 12, intermediate unit 20, transfer robot 36, substrate transfer stage 27, relay transfer device 31, horizontal movement mechanism 39, first cleaning module 41, second cleaning module 42, drying module 43, and post-processing transfer device 50 in accordance with commands given from operation control unit 60.

[0049] A substrate to be processed is transported from the cassette storage 34 to a pre-cleaning module 71 in the intermediate unit 20 via the transport robot 36, the substrate transport stage 27, and the relay transport device 31. The substrate is cleaned in the pre-cleaning module 71 before being processed in the processing modules 11 and 12. The cleaned substrate is transported from the pre-cleaning module 71 by the first transport robot 15 to the first processing module 11, where a first processing (e.g., grinding or thinning) is performed on the substrate.

[0050] The substrate processed by the first processing module 11 is transferred from the first processing module 11 to the post-cleaning module 72 by the first transfer robot 15, and is cleaned by the post-cleaning module 72. The cleaned substrate is transferred from the post-cleaning module 72 by the second transfer robot 17 to the second processing module 12, and the second processing module 12 performs a second processing (e.g., an asymmetrical correction processing) on ​​the substrate.

[0051] The substrate processed by the second processing module 12 is transferred to the substrate station 75 by the second transfer robot 17. The substrate is transferred from the substrate station 75 to the substrate mounting stage 40 by the relay transfer device 31 and placed on the substrate mounting stage 40. The substrate is transferred from the substrate mounting stage 40 to the first cleaning module 41 by the post-processing transfer device 50 and cleaned by the first cleaning module 41. The cleaned substrate is transferred from the first cleaning module 41 to the second cleaning module 42 by the post-processing transfer device 50 and further cleaned by the second cleaning module 42. The cleaned substrate is transferred to the drying module 43 by the post-processing transfer device 50 and dried by the drying module 43. The dried substrate is returned to the cassette storage 34.

[0052] Figure 8 is a schematic diagram showing another example of a substrate transport route in the substrate processing system shown in Figure 1. The example shown in Figure 8 differs from the example shown in Figure 7 in that the substrate processed by the second processing module 12 is transported to the post-cleaning module 72 by the second transport robot 17. That is, the substrate processed by the second processing module 12 is transported to the post-cleaning module 72 by the second transport robot 17 and cleaned by the post-cleaning module 72. The cleaned substrate is transported from the post-cleaning module 72 to the substrate station 75 by the second transport robot 17. The other operations are the same as those in the example shown in Figure 7, so redundant explanations will be omitted.

[0053] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims.

[0054] The present invention can be used as a technique for increasing the scalability of a substrate processing system having a plurality of processing modules.

[0055] REFERENCE SIGNS LIST W substrate 11 first processing module 12 second processing module 15 first transfer robot 16 first processing stage 17 second transfer robot 18 second processing stage 20 intermediate unit 25 load / unload unit 27 substrate transfer stage 28 movable stage 29 stage movement mechanism 31 relay transfer device 32 hand 34 cassette storage 35 cassette loader 36 transfer robot 39 horizontal movement mechanism 40 substrate placement stage 41 first cleaning module 42 second cleaning module 43 drying module 50 post-processing transfer device 51 transfer arm 60 operation control unit 71 pre-cleaning module 72 post-cleaning module 75 substrate station 77 fan filter unit 79 module cover wall 81 holding roller 82 scrub cleaning tool 84 upper rinse nozzle 85 lower rinse nozzle 86 housing 87 cleaning chamber 91 Holding roller 92 Two-fluid nozzle 93 Scrub cleaning tool 94 Upper rinse nozzle 95 Lower rinse nozzle 97 Housing 98 Cleaning chamber 100 Maintenance door

Claims

1. A substrate processing system for processing substrates, comprising: a plurality of processing modules configured to process the substrates; and an intermediate unit arranged between the plurality of processing modules, the intermediate unit comprising a cleaning module for cleaning the substrates and a substrate station in which the substrates are temporarily placed, the cleaning module and the substrate station being arranged along a vertical direction.

2. The substrate processing system of claim 1, wherein the cleaning module includes a post-cleaning module that cleans the substrate that has been processed by any one of the plurality of processing modules.

3. The substrate processing system of claim 2, wherein the post-cleaning module is configured to clean both sides of the substrate.

4. The substrate processing system of claim 1, wherein the cleaning module includes a pre-cleaning module that cleans the substrate before it is processed by the plurality of processing modules.

5. The substrate processing system of claim 4, wherein the pre-cleaning module is configured to clean a backside of the substrate opposite to the surface of the substrate that is processed by the plurality of processing modules.

6. The substrate processing system of claim 1, wherein the intermediate unit further comprises a fan filter unit disposed above the substrate station and the cleaning module.

7. The substrate processing system of claim 1, wherein the intermediate unit further comprises a module cover wall that covers the cleaning module and the substrate station, the module cover wall having a maintenance door.

8. The substrate processing system according to claim 7, wherein the maintenance door is located on the rear side of the cleaning module.

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