Apparatus for manufacturing secondary battery

Abstract

Provided according to exemplary embodiments is an apparatus for manufacturing a secondary battery. The apparatus comprises: a first masking jig that presses on a first surface of a lead-tab assembly of a battery cell, and comprises a first opening exposing the first surface; a first spatter adsorption device attached to the first masking jig; and a scanner head for irradiating the lead-tab assembly with laser beams to fuse the former.

Description

Device for manufacturing secondary batteries

[0001] The present invention relates to a device for manufacturing a secondary battery.

[0002] This application claims the benefit of priority from Republic of Korea Patent Application No. 10-2024-0032305, filed on March 7, 2024, and all contents of the document in that Republic of Korea Patent Application are incorporated herein by reference.

[0003] Unlike primary batteries, secondary batteries can be charged and discharged multiple times. They are widely used as a power source for various wireless devices, including handsets, laptops, and cordless vacuum cleaners. Recently, improved energy density and economies of scale have dramatically reduced the per-unit manufacturing cost of secondary batteries. Furthermore, as the range of battery electric vehicles (BEVs) has increased to match that of fuel-powered vehicles, the primary use of secondary batteries is shifting from mobile devices to mobility.

[0004] To meet the rapidly growing demand for secondary batteries for mobility, cell manufacturers are undertaking massive capital expenditures. Each company is increasing per-line productivity to maximize return on invested capital, and various research efforts are ongoing to improve yield and productivity.

[0005] The technical problem to be solved by the present invention is to provide a device for manufacturing a secondary battery with high productivity.

[0006] According to exemplary embodiments of the present invention for solving the above-described problem, an apparatus for manufacturing a secondary battery is provided. The apparatus includes a first masking jig that presses a first surface of a lead-tab assembly of a battery cell and includes a first opening that exposes the first surface; a first spatter adsorption device coupled to the first masking jig; and a scanner head configured to irradiate a laser beam to the lead-tab assembly so that the lead-tab assembly is melted.

[0007] The first spatter adsorption device is configured to apply a first magnetic field to the first opening.

[0008] The intensity of the first magnetic field at the center portion of the first opening is different from the intensity of the first magnetic field at the edge portion of the first opening.

[0009] The intensity of the first magnetic field at the center portion of the first opening is smaller than the intensity of the first magnetic field at the edge portion of the first opening.

[0010] The first spatter adsorption device comprises first and second magnetic field generating rods configured to generate the first magnetic field.

[0011] The direction of the first current applied to the first magnetic field generating rod is opposite to the direction of the second current applied to the second magnetic field generating rod.

[0012] At the center of the first opening, the magnetic field generated by the first magnetic field generating rod cancels out the magnetic field generated by the second magnetic field generating rod.

[0013] The device further comprises a second masking jig including a second opening for pressing a second surface of the lead-tab assembly against the first surface of the lead-tab assembly and exposing the second surface; and a second spatter adsorption device coupled to the second masking jig.

[0014] The second spatter adsorption device is configured to apply a second magnetic field to the second opening.

[0015] The intensity of the second magnetic field at the center portion of the second opening is different from the intensity of the second magnetic field at the edge portion of the second opening.

[0016] The intensity of the second magnetic field at the center portion of the second opening is smaller than the intensity of the second magnetic field at the edge portion of the second opening.

[0017] The second spatter adsorption device comprises third and fourth magnetic field generating rods configured to generate the second magnetic field.

[0018] The direction of the third current applied to the third magnetic field generating rod is opposite to the direction of the fourth current applied to the fourth magnetic field generating rod.

[0019] At the center of the second opening, the magnetic field generated by the third magnetic field generating rod cancels out the magnetic field generated by the fourth magnetic field generating rod.

[0020] According to exemplary embodiments, a secondary battery manufacturing apparatus is provided. The apparatus includes a first masking jig configured to press a first surface of a lead-tab assembly of a battery cell and include a first opening exposing the first surface; a second masking jig configured to press a second surface of the lead-tab assembly opposite the first surface of the lead-tab assembly and include a second opening exposing the second surface; and a second spatter adsorption device coupled to the second masking jig; and a scanner head configured to irradiate a laser beam onto the first surface of the lead-tab assembly so as to melt the lead-tab assembly.

[0021] The second spatter adsorption device is configured to apply a second magnetic field to the second opening.

[0022] The intensity of the second magnetic field at the center portion of the second opening is different from the intensity of the second magnetic field at the edge portion of the second opening.

[0023] The intensity of the second magnetic field at the center portion of the second opening is smaller than the intensity of the second magnetic field at the edge portion of the second opening.

[0024] The second spatter adsorption device comprises third and fourth magnetic field generating rods configured to generate the second magnetic field.

[0025] The direction of the third current applied to the third magnetic field generating rod is opposite to the direction of the fourth current applied to the fourth magnetic field generating rod.

[0026] At the center of the second opening, the magnetic field generated by the third magnetic field generating rod cancels out the magnetic field generated by the fourth magnetic field generating rod.

[0027] A secondary battery manufacturing device according to exemplary embodiments of the present invention includes a spatter adsorption device configured to adsorb spatter generated during welding of an electrode-tab assembly. Accordingly, the maintenance cycle of the secondary battery manufacturing device, such as a cleaning cycle, can be extended, and throughput can be increased.

[0028] The effects that can be obtained from the exemplary embodiments of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure pertain from the following description. In other words, unintended effects resulting from practicing the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0029] FIG. 1 is a drawing showing a secondary battery manufacturing device according to exemplary embodiments.

[0030] FIG. 2 is a drawing showing the effect of a secondary battery manufacturing device according to exemplary embodiments.

[0031] FIG. 3 is a drawing showing a secondary battery manufacturing device according to other exemplary embodiments.

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Prior to this, it should be noted that the terms and words used in this specification and claims should not be construed as limited to their conventional or dictionary meanings. Based on the principle that the inventor can appropriately define the concepts of terms to best explain his or her invention, they should be interpreted in a way that aligns with the technical spirit of the present invention.

[0033] Accordingly, the embodiments described in this specification and the configurations illustrated in the drawings are merely the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention. Therefore, it should be understood that there may be various equivalents and modified examples that can replace them at the time of filing this application.

[0034] In addition, when describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description is omitted.

[0035] Since the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art, the shapes and sizes of components in the drawings may be exaggerated, omitted, or schematically illustrated for clearer explanation. Accordingly, the sizes and proportions of each component do not fully reflect the actual sizes or proportions.

[0036]

[0037] (Example 1)

[0038] FIG. 1 is a drawing showing a secondary battery manufacturing device according to exemplary embodiments.

[0039] Referring to FIG. 1, a secondary battery manufacturing device (100) may include a scanner head (110), a first masking jig (120), a second masking jig (130), and a first spatter adsorption device (140).

[0040] A secondary battery manufacturing device (100) may be configured to process an electrode-tab assembly (LTC) of a battery cell (BC). The secondary battery manufacturing device (100) may be configured to perform laser welding. The secondary battery manufacturing device (100) may be configured to weld an electrode tab (ET) and an electrode lead (EL) of an electrode-tab assembly (LTC) of a battery cell (BC). Welding by a welding beam (WB) may be keyhole welding. Welding of the electrode tab (ET) and the electrode lead (EL) may include irradiating the welding beam (WB) along a weld line having a spiral shape.

[0041] An electrode lead (EL) may be an output terminal of a battery cell (BC). The battery cell (BC) may include a case, an electrode assembly, an electrolyte, and an electrode lead (EL). An electrode tab (ET) may be connected to the electrode assembly. The case may be any one of a pouch case, a cylindrical case, and a square case. The electrode assembly may be any one of a jelly-roll type and a stack type. A jelly-roll type electrode assembly may include a winding structure of a positive electrode, a negative electrode, and a separator interposed therebetween. A stack type electrode assembly may include a plurality of sequentially stacked positive electrodes, a plurality of negative electrodes, and a plurality of separators interposed therebetween.

[0042] As the energy density of battery cells (BC) increases, electrode leads (EL) and electrode tabs (ET) can be joined through pre-welding using ultrasonic waves and main welding using laser beams. Accordingly, before the electrode-tab assembly (LTC) is processed by the secondary battery manufacturing device (100), the electrode leads (EL) and electrode tabs (ET) can be joined by a method such as ultrasonic welding. However, the present invention is not limited thereto, and the electrode leads (EL) and electrode tabs (ET) of the electrode-tab assembly (LTC) may not be processed by the pre-welding process and may form a laminated structure that is not welded to each other.

[0043] The scanner head (110) may be connected to a beam source or may include a beam source. The beam source may be a laser (Light Amplification by Stimulated Emission of Radiation) device. The beam source may be configured to generate a welding beam (WB). The welding beam (WB) may be a laser beam. In exemplary embodiments, the welding beam (WB) may be near infrared. In exemplary embodiments, the wavelength of the welding beam (WB) may be in a range of about 750 nm to about 2500 nm. In exemplary embodiments, the wavelength of the welding beam (WB) may be about 1070 nm.

[0044] For example, the beam source may be a solid-state laser device, such as a semiconductor laser device, an Nd:YAG laser device, a titanium-sapphire laser device, or a fiber optic laser device. As another example, the beam source may be a liquid laser device, such as a dye laser device. As another example, the beam source may be a gaseous laser device, such as a helium-neon laser, a carbon dioxide laser, or an excimer laser.

[0045] A welding beam (WB) generated by a beam source can be coupled to a scanner head (110). According to exemplary embodiments, the welding beam (WB) can be delivered to the scanner head (110) via any one of a free space optics system, an optical integrated circuit (OIC), and a fiber optics system.

[0046] The first masking jig (120) may be configured to pressurize a first surface (S1) of the electrode-tab assembly (LTC). The first masking jig (120) may include a first opening (120OP) that exposes the first surface (S1) of the electrode-tab assembly (LTC).

[0047] The second masking jig (130) may be configured to press the second surface (S2) of the electrode-tab assembly (LTC). The second masking jig (130) may include a second opening (130OP) that exposes the second surface (S2) of the electrode-tab assembly (LTC).

[0048] While the electrode-tab assembly (LTC) is pressed by the first and second masking jigs (120, 130), the contact between the electrode lead (EL) and the electrode tab (ET) is maintained while the electrode-tab assembly (LTC) is processed by the welding beam (WB), and the lifting between the electrode lead (EL) and the electrode tab (ET) can be prevented, and the reliability of secondary battery manufacturing can be improved.

[0049] As a non-limiting example, the first and second openings (120OP, 130OP) may have a rectangular planar shape. The first opening (120OP) may expose a welding area of ​​a first surface (S1) of the electrode-tab assembly (LTC), and the second opening (130OP) may expose a welding area of ​​a second surface (S2) of the electrode-tab assembly (LTC).

[0050] According to exemplary embodiments, the first spatter adsorption device (140) may be coupled to the first masking jig (120). According to exemplary embodiments, the first spatter adsorption device (140) may be within the first opening (120OP) of the first masking jig (120).

[0051] The first spatter adsorption device (140) may include a first magnetic field generating rod (141) and a second magnetic field generating rod (143). The first spatter adsorption device (140) may be configured to apply a magnetic field to the first opening (120OP). The magnetic field applied to the first opening (120OP) by the first spatter adsorption device (140) may also be referred to as a first magnetic field.

[0052] Here, horizontal and vertical are defined with respect to the welding beam (WB). The direction substantially parallel to the direction in which the welding beam (WB) advances toward the lead-tab assembly (LTC) is referred to as the vertical direction, and the direction substantially perpendicular to the direction in which the welding beam (WB) advances toward the lead-tab assembly (LTC) is referred to as the horizontal direction.

[0053] According to exemplary embodiments, a first current may be applied to the first magnetic field generating rod (141), and a second current may be applied to the second magnetic field generating rod (143). Accordingly, the first and second magnetic field generating rods (141, 143) may be configured to apply a magnetic field induced by the first and second currents to the first opening (120OP).

[0054] At this time, in the central portion of the first opening (120OP), the magnetic field generated by the first magnetic field generating rod (141) may be opposite to the magnetic field generated by the second magnetic field generating rod (143). In the central portion of the first opening (120OP), the intensity of the magnetic field generated by the first magnetic field generating rod (141) may be substantially the same as the intensity of the magnetic field generated by the second magnetic field generating rod (143).

[0055] According to exemplary embodiments, the intensity of the first magnetic field in the central portion (more specifically, the horizontal central portion) of the first opening (120OP) may be different from the intensity of the first magnetic field in the edge portion of the first opening (120OP). According to exemplary embodiments, the intensity of the first magnetic field in the central portion (more specifically, the horizontal central portion) of the first opening (120OP) may be smaller than the intensity of the first magnetic field in the edge portion of the first opening (120OP). According to exemplary embodiments, in the central portion of the first opening (120OP), the magnetic field generated by the first magnetic field generating rod (141) may be offset from the magnetic field generated by the second magnetic field generating rod (143).

[0056] Here, the edge portion of the first opening (120OP) may be a portion spaced horizontally from the center portion of the first opening (120OP). More specifically, here, the edge portion of the first opening (120OP) may be a portion spaced from the center portion of the first opening (120OP) in the separation direction of the first and second magnetic field generating rods (141, 143).

[0057] According to exemplary embodiments, a non-zero first magnetic field at the center of the first opening (120OP) may deflect the welding beam (WB), thereby reducing the straightness of the welding beam (WB). When the straightness of the welding beam (WB) is reduced, the welding beam (WB) may be irradiated to a part other than the pre-designed welding line, which may reduce the reliability of secondary battery manufacturing. According to exemplary embodiments, even though the first magnetic field is applied to the first opening (120OP) by the first spatter adsorption device (140), at the center of the first opening (120OP), the magnetic field generated by the first magnetic field generating rod (141) and the magnetic field generated by the second magnetic field generating rod (143) cancel each other out, or the intensity of the first magnetic field is relatively reduced, which may improve the reliability of secondary battery manufacturing.

[0058]

[0059] FIG. 2 is a drawing for explaining the effect of a secondary battery manufacturing device (100) according to exemplary embodiments.

[0060] Referring to Fig. 2, welding by a welding beam (WB) may be keyhole welding, and a keyhole (KH) may be formed in a lead tab assembly (LTC) by irradiation of the welding beam (WB). Spatter (SPT) may be generated from the keyhole (KH).

[0061] When spatters (SPT) are attached to the first masking jig (120), the reliability of processing by the welding beam (WB) may be reduced, and when the contamination level of the first masking jig (120) exceeds a critical condition, cleaning of the first masking jig (120) is required. Generally, the cleaning cycle of the first masking jig (120) is relatively short compared to the maintenance cycle of other elements (e.g., the replacement cycle of the generator), which becomes a factor that reduces the throughput of secondary battery manufacturing.

[0062] According to exemplary embodiments, the first spatter adsorption device (140) may be configured to adsorb spatters (SPT). The first spatter adsorption device (140) may prevent or mitigate spatters (SPT) from adhering to the masking jig (120). Accordingly, the cleaning cycle of the first masking jig (120) may be extended, and the throughput of secondary battery manufacturing may be improved.

[0063]

[0064] (Example 2)

[0065] FIG. 3 is a drawing for explaining a secondary battery manufacturing device (101) according to exemplary embodiments.

[0066] Referring to FIG. 3, the secondary battery manufacturing device (101) may include a scanner head (110), a first masking jig (120), a second masking jig (130), a first spatter adsorption device (140), and a second spatter adsorption device (150).

[0067] The scanner head (110), the first masking jig (120), the second masking jig (130), and the first spatter adsorption device (140) are substantially the same as those described with reference to FIG. 1, so a duplicate description thereof is omitted.

[0068] According to exemplary embodiments, the second spatter adsorption device (150) may be coupled to the second masking jig (130). According to exemplary embodiments, the second spatter adsorption device (150) may be within the second opening (130OP) of the second masking jig (130).

[0069] The second spatter adsorption device (150) may include a third magnetic field generating rod (151) and a fourth magnetic field generating rod (153). The second spatter adsorption device (150) may be configured to apply a magnetic field to the second opening (130OP). The magnetic field applied to the second opening (130OP) by the second spatter adsorption device (150) may also be referred to as a second magnetic field.

[0070] According to exemplary embodiments, a third current may be applied to the third magnetic field generating rod (151), and a fourth current may be applied to the fourth magnetic field generating rod (153). Accordingly, the third and fourth magnetic field generating rods (151, 153) may be configured to apply a magnetic field induced by the third and fourth currents to the second opening (130OP).

[0071] At this time, in the central portion of the second opening (130OP), the magnetic field generated by the third magnetic field generating rod (151) may be opposite to the magnetic field generated by the fourth magnetic field generating rod (153). In the central portion of the second opening (130OP), the intensity of the magnetic field generated by the third magnetic field generating rod (151) may be substantially the same as the intensity of the magnetic field generated by the fourth magnetic field generating rod (153).

[0072] According to exemplary embodiments, the intensity of the second magnetic field at the center portion of the second opening (130OP) may be different from the intensity of the second magnetic field at the edge portion of the second opening (130OP). According to exemplary embodiments, the intensity of the second magnetic field at the center portion of the second opening (130OP) may be smaller than the intensity of the second magnetic field at the edge portion of the second opening (130OP). According to exemplary embodiments, in the center portion of the second opening (130OP), the magnetic field generated by the third magnetic field generating rod (151) may be canceled out by the magnetic field generated by the fourth magnetic field generating rod (153). The definitions of the center portion and the edge portion of the second opening (130OP) are substantially the same as those of the first opening (120OP), and therefore, a duplicate description thereof will be omitted.

[0073] According to exemplary embodiments, a non-zero second magnetic field at the center of the second opening (130OP) may deflect the welding beam (WB), thereby reducing the straightness of the welding beam (WB). If the straightness of the welding beam (WB) is reduced, the welding beam (WB) may be irradiated to a part other than the pre-designed welding line, which may reduce the reliability of secondary battery manufacturing.

[0074] According to exemplary embodiments, even though a second magnetic field is applied to the second opening (130OP) by the second spatter adsorption device (150), at the center of the second opening (130OP), the magnetic field generated by the third magnetic field generating rod (151) and the magnetic field generated by the fourth magnetic field generating rod (153) cancel each other out or the intensity of the second magnetic field is relatively reduced, thereby improving the reliability of secondary battery manufacturing.

[0075]

[0076] The present invention has been described in more detail through drawings and examples. However, the configurations described in the drawings or examples described in this specification are merely embodiments of the present invention and do not represent all of the technical ideas of the present invention. Therefore, it should be understood that various equivalents and modified examples may exist as of the time of this application.

Claims

1. A first masking jig for pressing a first surface of a lead-tab assembly of a battery cell and including a first opening exposing the first surface; A first spatter adsorption device coupled to the first masking jig; and A secondary battery manufacturing device comprising a scanner head configured to irradiate a laser beam onto the lead-tab assembly so that the lead-tab assembly is melted.

2. In paragraph 1, A secondary battery manufacturing device, characterized in that the first spatter adsorption device is configured to apply a first magnetic field to the first opening.

3. In paragraph 2, A secondary battery manufacturing device, characterized in that the intensity of the first magnetic field at the center portion of the first opening is different from the intensity of the first magnetic field at the edge portion of the first opening.

4. In paragraph 2, A secondary battery manufacturing device, characterized in that the intensity of the first magnetic field at the center portion of the first opening is smaller than the intensity of the first magnetic field at the edge portion of the first opening.

5. In paragraph 2, A secondary battery manufacturing device, characterized in that the first spatter adsorption device includes first and second magnetic field generating rods configured to generate the first magnetic field.

6. In paragraph 5, A secondary battery manufacturing device, characterized in that the direction of the first current applied to the first magnetic field generating rod is opposite to the direction of the second current applied to the second magnetic field generating rod.

7. In paragraph 5, A secondary battery manufacturing device, characterized in that, at the center of the first opening, the magnetic field generated by the first magnetic field generating rod is offset from the magnetic field generated by the second magnetic field generating rod.

8. In paragraph 1, A second masking jig including a second opening for pressing a second surface of the lead-tab assembly opposite the first surface of the lead-tab assembly and exposing the second surface; and A secondary battery manufacturing device further comprising a second spatter adsorption device coupled to the second masking jig.

9. In paragraph 8, A secondary battery manufacturing device characterized in that the second spatter adsorption device is configured to apply a second magnetic field to the second opening.

10. In paragraph 9, A secondary battery manufacturing device, characterized in that the intensity of the second magnetic field at the center portion of the second opening is different from the intensity of the second magnetic field at the edge portion of the second opening.

11. In paragraph 9, A secondary battery manufacturing device, characterized in that the intensity of the second magnetic field at the center portion of the second opening is smaller than the intensity of the second magnetic field at the edge portion of the second opening.

12. In paragraph 9, A secondary battery manufacturing apparatus characterized in that the second spatter adsorption device includes third and fourth magnetic field generating rods configured to generate the second magnetic field.

13. In paragraph 12, A secondary battery manufacturing device, characterized in that the direction of the third current applied to the third magnetic field generating rod is opposite to the direction of the fourth current applied to the fourth magnetic field generating rod.

14. In paragraph 12, A secondary battery manufacturing device, characterized in that, at the center of the second opening, the magnetic field generated by the third magnetic field generating rod is offset from the magnetic field generated by the fourth magnetic field generating rod.

15. A first masking jig for pressing a first surface of a lead-tab assembly of a battery cell and including a first opening exposing the first surface; A second masking jig including a second opening for pressing a second surface of the lead-tab assembly opposite the first surface of the lead-tab assembly and exposing the second surface; A second spatter adsorption device coupled to the second masking jig; and A secondary battery manufacturing apparatus including a scanner head configured to irradiate a laser beam onto the first surface of the lead-tab assembly so that the lead-tab assembly is melted.

16. In paragraph 15, A secondary battery manufacturing device characterized in that the second spatter adsorption device is configured to apply a second magnetic field to the second opening.

17. In paragraph 16, A secondary battery manufacturing device, characterized in that the intensity of the second magnetic field at the center portion of the second opening is different from the intensity of the second magnetic field at the edge portion of the second opening.

18. In paragraph 16, A secondary battery manufacturing device, characterized in that the intensity of the second magnetic field at the center portion of the second opening is smaller than the intensity of the second magnetic field at the edge portion of the second opening.

19. In paragraph 16, A secondary battery manufacturing apparatus characterized in that the second spatter adsorption device includes third and fourth magnetic field generating rods configured to generate the second magnetic field.

20. In paragraph 19, A secondary battery manufacturing device, characterized in that the direction of the third current applied to the third magnetic field generating rod is opposite to the direction of the fourth current applied to the fourth magnetic field generating rod.

21. In paragraph 19, A secondary battery manufacturing device, characterized in that, at the center of the second opening, the magnetic field generated by the third magnetic field generating rod is offset from the magnetic field generated by the fourth magnetic field generating rod.

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