Electronic product assembly

Abstract

The present invention relates to an electronic product assembly comprising: an electrostatic module including a substrate having formed therein a plurality of first holes and including a plurality of bus bars attached to one surface of the substrate, the electrostatic module being formed by stacking the substrate and the bus bars in one direction; a management module disposed to face the substrate in a direction opposite to the plurality of bus bars; and a relay module including a pair of connection terminals inserted into the first holes and a connection portion connected to the management module or the electrostatic module, wherein the plurality of bus bars are spaced apart from each other on one side of the substrate, the bus bars include second holes formed at positions corresponding to the first holes, the relay module includes an insulating member disposed between adjacent bus bars and the pair of connection terminals, and the substrate includes slits into which the connection terminals are inserted between at least one pair of adjacent first holes.

Description

Electronic product assembly

[0001] The present invention relates to an electronic product assembly.

[0002] Unlike the conventional technology that generated power for automobiles through power sources such as gasoline, the use of electric vehicles that secure driving power through electricity is increasing recently.

[0003] Accordingly, electric vehicles are essential to have a battery pack to store electricity, and electric vehicles are equipped with a BMS (Battery Management System) and a junction module that distribute the electricity generated from the battery pack according to the intended use, and can distribute the electricity from the battery pack according to the intended use.

[0004] However, when transmitting high power, for example, power of 500A or more, the size of the busbar transmitting the electricity increases, and the size of the junction box in which the BMS is installed also increases according to the increased busbar, and there is a disadvantage in that multiple wire harnesses are provided to connect the configurations with each other.

[0005] In particular, when utilizing multiple wire harnesses, the robustness of bolt assembly is reduced, and the connection is prone to breakage or the fixation also requires high precision in proportion to the complexity, and the connection problem of the circuit and busbar of an electric vehicle, which can lead to a major accident even with a small problem, is an issue that must be resolved.

[0006] Accordingly, there is a need for a method to increase the density of junction boxes that must transmit high amperes while also resolving and improving the connection structure of complex wire harnesses.

[0007] The present invention is an invention devised to solve the problems of the above-described prior art, and aims to solve the problem of wire harness breakage or complexity due to complex connection through wire harness while transmitting relatively high power.

[0008] The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned herein will be clearly understood by those skilled in the art from the description below.

[0009] According to an embodiment of the present invention for achieving the above-described object, an electronic product assembly includes a substrate having a plurality of first holes formed therein and a plurality of bus bars arranged on one side of the substrate, an electrostatic module formed by stacking the substrate and the bus bars in one direction, a management module arranged to face the substrate in an opposite direction to the plurality of bus bars, and a relay module including a pair of connection terminals inserted into the first holes and a connection portion connected to the management module or the electrostatic module, wherein the plurality of bus bars are arranged to be spaced apart from each other on one side of the substrate, the bus bars include second holes formed at positions corresponding to the first holes, the relay module includes an insulating member arranged between adjacent bus bars and a pair of connection terminals, and the substrate includes a slit into which the connection terminal is inserted between at least one pair of adjacent first holes.

[0010] Here, the relay module may be arranged between the power supply module and the management module, the connection terminal may be arranged toward the power supply module, and the connection portion may be arranged toward the management module.

[0011] In addition, the connecting portion includes a connecting portion protruding toward the management module or the electrostatic module, and the management module or the electrostatic module may be provided with a through hole through which the connecting portion passes.

[0012] In addition, the connection part penetrating the through hole may be disposed on the inside, and a connector may be further included that is disposed between the relay module and the management module or the power supply module.

[0013] Meanwhile, at least some of the plurality of bus bars may be arranged on the same plane.

[0014] Additionally, the bus bar may have at least one region having a different length in a first direction from one side of the substrate toward the opposite side and a second direction from the other side of the substrate toward the opposite side.

[0015] In addition, the plurality of bus bars may be divided into a plurality of first terminal portions including extension portions that do not overlap the substrate in a third direction perpendicular to the first direction and the second direction, and a plurality of second terminal portions that overlap the substrate in the third direction.

[0016] Here, the extension portion extends in a direction away from the substrate, and the different first terminal portions may have at least one different cross-sectional area of ​​the extension portion cut in a direction perpendicular to the extension direction of the extension portion.

[0017] Meanwhile, the plurality of bus bars may have different shapes.

[0018] Additionally, the spacing between adjacent bus bars may be 5 mm to 7 mm.

[0019] Here, the diameter of the first hole may be larger than the diameter of the second hole.

[0020] Meanwhile, the second hole includes a first region arranged adjacent to the first hole and a second region arranged relatively farther from the first hole than the first region, and the diameter of the first region may be smaller than the diameter of the second region.

[0021] In addition, the connection terminal may be provided with an insertion hole into which a screw thread of a bolt member is inserted, the screw thread of the bolt member may penetrate the first region and be inserted into the insertion hole, and the head of the bolt member may be placed in the second region.

[0022] Here, the height of the second region in the third direction toward the management module from the electrostatic module may be greater than the height of the head of the bolt member in the third direction.

[0023] Additionally, the thickness of the substrate in the third direction toward the management module in the electrostatic module may be smaller than the thickness of the bus bar in the third direction.

[0024] Meanwhile, a connection module may be further included that is placed between the electrostatic module and the management module and electrically connects the electrostatic module and the management module.

[0025] In addition, a frame module may be further included, which is arranged between the above-mentioned power supply module and the above-mentioned management module, has a plurality of the above-mentioned relay modules arranged inside, and partitions the plurality of the above-mentioned relay modules.

[0026] A sensor unit is disposed on the other surface of the substrate and includes a plurality of first sensors for sensing a voltage of the bus bar and a plurality of second sensors for sensing a temperature of the bus bar, and a conductive unit connecting the bus bar and the other surface of the substrate, wherein the substrate further includes at least one conductive layer and a third hole connecting the conductive layer and the bus bar, and the first sensor and the bus bar are connected through the conductive unit and a circuit pattern provided on the substrate, and the second sensor and the bus bar can be connected through the third hole.

[0027] The third hole may have one end closed by the bus bar, the other end closed by the second sensor, and a thermally conductive member may be arranged on the inside of the third hole.

[0028] The above conductive part may include a first part disposed on the other surface of the substrate, a second part disposed along the inner surface of the first hole in the first part, and a third part connected to the second part and in contact with the bus bar.

[0029] At least one of the conductive layers may be connected to the bus bar through the third hole or the second part and the third part.

[0030] The substrate may further include a shunt portion arranged on the other side and connecting one of the bus bars to another of the bus bars.

[0031] The shunt portion is electrically connected to the substrate, and one of the second sensors is positioned adjacent to the shunt portion to measure the temperature of the shunt portion.

[0032] The above slit may not overlap the bus bar in a third direction perpendicular to the first direction and the second direction.

[0033] A connection terminal for electrically connecting the adjacent bus bars is inserted into the first hole, and the length of the first hole in a third direction perpendicular to the first direction and the second direction may be less than or equal to the length of the connection terminal.

[0034] The extension portion may be arranged on the same plane as the second terminal portion at least in part, and the area of ​​the first terminal portion that overlaps the substrate in the third direction and the second terminal portion may be arranged on the same plane.

[0035] At least one of the plurality of first holes may have a different shape.

[0036] An electronic product assembly according to an embodiment of the present invention for solving the above problem can be effective in solving problems caused by breakage or complexity of a wire harness by being intricately connected through a wire harness while transmitting relatively high power.

[0037] In addition, there were difficulties in the automation process when connecting high power transmission with a wire harness, but the present invention also has an advantage in the automation of the process.

[0038] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0039] In addition, the effects of the present invention may be described in more detail in the detailed description of the present invention, and may not necessarily be limited to what is presented above.

[0040] The summary set forth above, as well as the detailed description of preferred embodiments of the present application described below, will be better understood when read in conjunction with the accompanying drawings.

[0041] For the purpose of illustrating the present invention, preferred embodiments are shown in the drawings.

[0042] However, it should be understood that the present application is not limited to the precise arrangements and means illustrated.

[0043] FIG. 1 is a drawing illustrating an overall description of an electronic product assembly according to one embodiment of the present invention;

[0044] FIG. 2 is a drawing illustrating a static electricity module of an electronic product assembly according to one embodiment of the present invention;

[0045] FIG. 3 is a drawing illustrating a bus bar of an electronic product assembly according to one embodiment of the present invention;

[0046] FIG. 4 is a drawing illustrating an extension portion of an electronic product assembly according to one embodiment of the present invention;

[0047] FIG. 5 is a drawing illustrating a first hole and a second hole of an electronic product assembly according to one embodiment of the present invention;

[0048] FIG. 6 is a drawing illustrating a bolt head being placed in a second hole of an electronic product assembly according to one embodiment of the present invention;

[0049] FIG. 7 is a drawing illustrating a state in which a relay module of an electronic product assembly according to one embodiment of the present invention is combined;

[0050] FIG. 8 is a drawing illustrating a separation distance of an electronic product assembly according to one embodiment of the present invention;

[0051] FIG. 9 is a drawing illustrating a conductive part and a second sensor of an electronic product assembly according to one embodiment of the present invention;

[0052] FIG. 10 is a drawing illustrating a shunt portion of an electronic product assembly according to one embodiment of the present invention;

[0053] FIG. 11 is a drawing illustrating a circuit pattern and a first sensor of an electronic product assembly according to one embodiment of the present invention;

[0054] FIG. 12 is a drawing illustrating a relay module of an electronic product assembly according to one embodiment of the present invention;

[0055] FIG. 13 is a drawing illustrating a connector module of an electronic product assembly according to one embodiment of the present invention;

[0056] FIG. 14 is a drawing illustrating a connection module of an electronic product assembly according to one embodiment of the present invention;

[0057] FIG. 15 is a drawing illustrating a frame module of an electronic product assembly according to one embodiment of the present invention;

[0058] FIG. 16 is a drawing illustrating the interior of a frame module of an electronic product assembly according to one embodiment of the present invention;

[0059] FIG. 17 is a drawing illustrating a comparison of a first leg and a second leg of an electronic product assembly according to one embodiment of the present invention;

[0060] FIG. 18 is a drawing illustrating a comparison of cross-sectional areas of extensions of an electronic product assembly according to one embodiment of the present invention;

[0061] FIG. 19 is a drawing illustrating a situation in which a second leg is positioned in a mounting portion of an electronic product assembly according to one embodiment of the present invention;

[0062] FIG. 20 is a drawing illustrating the combination of an electronic product assembly and a cooling plate according to one embodiment of the present invention; and

[0063] FIG. 21 is a drawing illustrating a bus bar in a state where an electronic product assembly and a cooling plate are combined according to one embodiment of the present invention.

[0064] The present invention is susceptible to various modifications and embodiments, and specific embodiments are illustrated and described in detail in the drawings. However, this is not intended to limit the present invention to specific embodiments, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention. In describing the present invention, detailed descriptions of related known technologies will be omitted if they are deemed to obscure the gist of the present invention.

[0065] Terms such as first, second, etc. may be used to describe various components, but these components should not be limited by these terms. These terms are used solely to distinguish one component from another.

[0066] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprises" or "has" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0067] Additionally, throughout the specification, when we say "connected," this does not only mean that two or more components are directly connected, but also that two or more components are indirectly connected through other components, that they are electrically connected as well as physically connected, or that they are referred to by different names depending on location or function but are one.

[0068] Additionally, when described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," it can include the meaning of a downward direction as well as an upward direction based on one component.

[0069] Hereinafter, preferred embodiments of the present invention, in which the purpose of the present invention can be specifically realized, will be described with reference to the attached drawings.

[0070] First, in explaining the substrate module and electronic product assembly (10) according to an embodiment of the present invention, an electronic product assembly (10) according to an embodiment in which the present invention can be deployed can be explained.

[0071] Here, an electronic product assembly (10) in which an electronic component module according to an embodiment of the present invention is arranged includes an electronic product module, and the electronic product module may include a substrate module (100) and a relay module (300).

[0072] More specifically, the electronic product assembly (10) may include a substrate module (100), a management module (200), a relay module (300), a connection module (400), a frame module (500), and a housing (600) as illustrated in FIG. 1. At this time, the substrate module (100) is provided in a form in which a plurality of bus bars (120) are attached to one surface of the substrate (110), and the plurality of bus bars (120) are connected through connection terminals (310) provided in the relay module (300) to transmit or branch power from one side to the other side, and this can be branched or transmitted by the management module (200) which is arranged relatively above.

[0073] Specifically, in the electronic product assembly (10) according to the embodiment of the present invention, power transmitted from a battery is transmitted through a substrate module (100), and can be selectively branched by a relay module (300) that connects a plurality of bus bars (120) to each other, and a management module (200) is connected to the substrate module (100) by a relay module (300) or a connection module (400) to control the power flow of the substrate module (100) or the flow of power moving through the substrate module (100). Here, the management module (200) may be a BMS (Battery Management System).

[0074] In addition, in an electronic product assembly (10) according to an embodiment of the present invention, a management module (200), a frame module (500), a relay module (300), and a connection module (400) are arranged inside a housing (600) that opens in one direction, and the opening of the housing (600) can be closed by a cooling plate (20).

[0075] This arrangement can increase spatial utilization because each component is arranged using a minimum of space, and it can also have the advantage of not requiring multiple wire harness structures because the relay module (300) and the management module (200) are directly connected while connecting multiple bus bars (120) through the relay module (300), and the board module (100) and the management module (200) are connected through the connection module (400).

[0076] In addition, due to the connection characteristics of the wire harness, it is common to have a structure in which the ends of the bus bars (120) are fixed with bolts and nuts, but since the electronic product assembly (10) according to the embodiment of the present invention does not utilize multiple wire harnesses, it is possible to solve problems due to the connection structure of the wire harness, and at the same time, it may have the advantage of simplifying the channels of the multiple bus bars (120) that are distinct from each other, thereby allowing the wire harness to be connected with fewer channels.

[0077] In particular, the electronic product assembly (10) according to the embodiment of the present invention can transmit high power, and here, the high power is not the general 0 to 10 A, but rather 300 A or more or 500 A or more, so a high current density is required, and in order to satisfy this, the size of the bus bar (120) increases and the electronic product assembly (10) becomes larger, so that the integration degree can be increased through such arrangement and structure, thereby securing spatial efficiency.

[0078] The above-described features describe an electronic product assembly (10) to which a substrate module (100) according to an embodiment of the present invention is applied, and this is only one embodiment, and may not necessarily be limited to the arrangement, structure, and function mentioned.

[0079] Meanwhile, before a specific description of the present invention, let us define each direction. When one direction is assumed as the first direction from one side toward the opposite side based on the substrate (110) of the substrate module (100), a direction that is perpendicular to the first direction and from the other side toward the opposite side can be defined as the second direction.

[0080] Here, any one edge means any one of a plurality of edges provided along the periphery of the substrate (110), and an edge facing any one edge means an edge opposite to any one edge, and in FIG. 1 of the present invention, it is defined as a direction from the lower left to the upper right and from the upper right to the lower left, but it may also be defined as a direction from the upper left to the lower right and from the lower right to the upper left.

[0081] However, in the detailed description of the present invention, to aid understanding, the first direction is defined as the direction from the lower left to the upper right based on FIG. 1, that is, the direction from one side to the opposite side.

[0082] Additionally, the second direction means a direction toward a side facing another side, excluding a side overlapping the first direction, and the second direction and the first direction may be perpendicular to each other.

[0083] Specifically, the second direction may mean both directions, from the upper left to the lower right and from the lower right to the upper left, based on Fig. 1.

[0084] In addition, the third direction means a direction perpendicular to the first direction and the second direction, and on a three-axis coordinate system, the first direction, the second direction, and the third direction can be perpendicular to each other, and the third direction can mean a direction from the upper side to the lower side and a direction from the lower side to the upper side with respect to FIG. 1.

[0085] At this time, when a specific direction is mentioned in the detailed description of the present invention, it may include both directions unless it is mentioned as a direction from a specific configuration to another configuration based on the direction, and when it is a direction that can be understood based on the illustrated arrangement relationship, it may mean any one direction according to the illustrated direction. Based on the above, reference may be made to FIGS. 2 to 19 to explain a high-power transmission battery electronic component module according to an embodiment of the present invention.

[0086] Specifically, FIG. 2 is a drawing illustrating a static electricity module of an electronic product assembly according to an embodiment of the present invention, FIG. 3 is a drawing illustrating a bus bar of an electronic product assembly according to an embodiment of the present invention, FIG. 4 is a drawing illustrating an extension of an electronic product assembly according to an embodiment of the present invention, FIG. 5 is a drawing illustrating a first hole and a second hole of an electronic product assembly according to an embodiment of the present invention, FIG. 6 is a drawing illustrating a bolt head being arranged in a second hole of an electronic product assembly according to an embodiment of the present invention, FIG. 7 is a drawing illustrating a state in which a relay module of an electronic product assembly is coupled according to an embodiment of the present invention, FIG. 8 is a drawing illustrating a separation distance of an electronic product assembly according to an embodiment of the present invention, FIG. 9 is a drawing illustrating a conductive part and a second sensor of an electronic product assembly according to an embodiment of the present invention, FIG. 10 is a drawing illustrating a shunt part of an electronic product assembly according to an embodiment of the present invention, and FIG. 11 is a drawing illustrating a circuit pattern and a first sensor of an electronic product assembly according to an embodiment of the present invention. Drawings for explanation, FIG. 12 is a drawing for explaining a relay module of an electronic product assembly according to an embodiment of the present invention, FIG. 13 is a drawing for explaining a connector module of an electronic product assembly according to an embodiment of the present invention, FIG. 14 is a drawing for explaining a connection module of an electronic product assembly according to an embodiment of the present invention, FIG. 15 is a drawing for explaining a frame module of an electronic product assembly according to an embodiment of the present invention, FIG. 16 is a drawing for explaining the inside of a frame module of an electronic product assembly according to an embodiment of the present invention, FIG. 17 is a drawing for comparing a first leg and a second leg of an electronic product assembly according to an embodiment of the present invention, FIG. 18 is a drawing for comparing cross-sectional areas of an extension part of an electronic product assembly according to an embodiment of the present invention,FIG. 19 is a drawing illustrating a situation in which a second leg is positioned in a mounting portion of an electronic product assembly according to one embodiment of the present invention.

[0087] First, as illustrated in FIG. 2, an electronic component module according to an embodiment of the present invention may include a substrate (110) including a plurality of first holes (111) and a plurality of bus bars (120) including second holes (121) arranged on one surface of the substrate (110) and formed at positions corresponding to the first holes (111).

[0088] In addition, the electronic component module according to an embodiment of the present invention may further include a sensor unit including a plurality of first sensors (141) that are arranged on the other surface of the substrate (110) and that sense the voltage of the bus bar (120) and a second sensor (142) that senses the temperature of the bus bar (120), and a conductive unit (150) that connects the bus bar (120) and the other surface of the substrate (110). At this time, the sensor unit and the conductive unit (150) will be described in more detail with reference to the drawings to be described later.

[0089] Here, a plurality of bus bars (120) are arranged spaced apart from each other on one side of the substrate (110), and each bus bar (120) may include at least two second holes (121).

[0090] In addition, the substrate (110) is provided with a slit (113) for inserting an insulating member (320) to prevent interference between adjacent bus bars (120), as will be described later with reference to the drawings, and the slit (113) may be provided between at least one pair of adjacent first holes (111). That is, the slit (113) is provided between a pair of adjacent first holes (111), and at least one or more may be provided.

[0091] At this time, the first hole (111) and the second hole (121) are arranged to overlap each other in the third direction, and the slit (113) can be arranged so as not to overlap with the bus bar (120) in the third direction. This may be because the insulating member (320) is inserted into the slit (113), and the insulating member (320) is arranged between the spaced bus bars (120).

[0092] Here, the insulating member (320) may be a part of the relay module (300) and may be a protruding part of the relay module (300). The protruding part of the relay module (300) may be inserted into the slit (113) and guided when placed on the substrate module (100).

[0093] For example, in the process of combining a relay module (300) with a substrate (110), an insulating member (320) can be inserted into a slit (113) to guide the position and combination of the relay module (300) so that the connection terminal (310) can be properly positioned in the adjacent first hole (111).

[0094] In addition, in FIG. 2, the substrate (110) and the bus bar (120) are depicted as being separated, but this is for the purpose of easily explaining each configuration, and the substrate (110) and the bus bar (120) may be provided in the form of a single body laminated in the third direction, and the bus bar (120) and the substrate (110) may be coupled to be electrically connected.

[0095] In addition, a shunt portion (170) is arranged on one side of the other surface of the substrate (110), and both ends of the shunt portion (170) may be arranged to overlap with the first hole (111) and the second hole (121) in the third direction. The shunt portion (170) will be described in more detail with reference to the drawings to be described later.

[0096] Meanwhile, in order to make a specific comparison between the bus bar (120) and the substrate (110) according to the embodiment of the present invention, the substrate (110) is indicated by a dotted line in FIG. 3, and as shown in FIG. 3, the bus bar (120) according to the embodiment of the present invention will be described in detail. The bus bar (120) of the present invention can be divided into a plurality of first terminal portions (122) partially overlapping with the substrate (110) in the third direction and a plurality of second terminal portions (124) overlapping with the substrate (110) in the third direction.

[0097] Here, the first terminal portion (122) includes a body that overlaps the substrate (110) in a third direction and an extension portion (123) that extends from the body to the outside of the substrate (110) and does not overlap the substrate (110) in the third direction, and the second terminal portion (124) does not include the extension portion (123), and the entire area of ​​the second terminal portion (124) can overlap the substrate (110) in the third direction.

[0098] In addition, the substrate (110) and the bus bar (120) according to the embodiment of the present invention are arranged so that one side is in close contact with the other, and the plurality of bus bars (120) may have different shapes.

[0099] In addition, there may be at least one area where the first hole (111) and the second hole (121) overlap in the third direction, specifically, an area where a slit (113) is not formed between adjacent first holes (111), and a shunt unit (170), which is a resistor connected in parallel for the purpose of measuring or classifying current, may be placed in the first hole (111) where the slit (113) is not formed.

[0100] In addition, in the case of the first hole (111) positioned adjacent to the vertex of the substrate (110), a space for coupling with the frame module (500) can be provided, and the frame module (500), the bus bar (120), and the substrate (110) can be coupled through a bolt member.

[0101] In addition, as illustrated in FIG. 3, at least one of the first holes (111) may have a different shape. This may be because the first holes (111) having different shapes do not come into contact with the conductive part (150). To put it differently, at least one of the first holes (111) does not have a conductive part (150) disposed therein, and the first hole (111) may have a conductive part (150) disposed therein except for at least one of the first holes (111) in which the conductive part (150) is not disposed.

[0102] Meanwhile, referring to FIG. 4 for a specific description of the bus bar (120) according to an embodiment of the present invention, as shown in FIG. 4, the first terminal portion (122) includes an extension portion (123), and specifically, may include at least one extension portion (123).

[0103] In addition, since the first hole (111) is formed in the substrate (110) and the second hole (121) is formed in the bus bar (120), the connection terminal (310) of the relay module (300) described above must be in contact with the bus bar (120), and therefore, the first diameter (L1), which is the diameter of the first hole (111), may be larger than the second diameter (L2), which is the diameter of the second hole (121).

[0104] In addition, the power transmitted from the battery is branched and moved by the management module (200) as needed, and the size of the transmitted power may vary depending on the required capacity, i.e., the required current density, so the width of each extension (123) may be different.

[0105] To explain specifically, when one extension (123) is defined as a first extension (123a) and the other extension (123) is defined as a second extension (123b), the first width (A1) of the first extension (123a) in the second direction may be different from the second width (A2) of the second extension (123b) in the second direction.

[0106] As described above, the extension (123) moves the power transmitted from the battery to the inside of the electronic product assembly (10), but can also transmit the power moved to the inside of the electronic product assembly (10) to the necessary elements of the electric vehicle, so a second hole (121) may be provided at each end of the extension (123).

[0107] In addition, the bus bar (120) may be provided with at least one region having a different width in the second direction from the first direction. Specifically, as illustrated in FIG. 8, when the first region (122a) is assumed, it corresponds to a region having a different width in the second direction, and when the second region (122b) is assumed, it corresponds to a region having a different width in the second direction, and since the first region (122a) and the second region (122b) are arranged along the first direction, as described above, the bus bar (120) (120) may be provided with at least one region having a different length in the second direction.

[0108] Meanwhile, the second hole (121) according to the embodiment of the present invention includes a first region (121a) arranged adjacent to the first hole (111) in the third direction and a second region (121b) arranged relatively farther away from the first hole (111) in the third direction than the first region (121a), and the first region (121a) can be arranged between the first hole (111) and the second region (121b).

[0109] Here, the first hole (111) is a space where a connection terminal (310) provided in a relay module (300) is inserted, the first region (121a) is a space where a bolt body of a bolt member inserted from one side of the substrate (110) is positioned, and the second region (121b) may be a space where a bolt head of the bolt member is positioned.

[0110] In addition, the bus bar (120) in the third direction is arranged so that the upper part where the first area (121a) is formed is exposed through the first hole (111), and this can be formed so that the connection terminal (310) of the relay module (300) is exposed through the first hole (111) in the third direction to move power by making contact with the bus bar (120).

[0111] At this time, as shown in FIG. 3, the first thickness (T1) of the substrate (110) in the third direction may be smaller than the second thickness (T2) of the bus bar (120) in the third direction. This is because, in order to increase the current density due to the characteristics of the embodiment of the present invention that transmits high power, the area of ​​the bus bar (120) must be increased, and in order to effectively solve this, the thickness of the bus bar (120) in the third direction may be increased to effectively secure the area of ​​the current density for transmitting high power.

[0112] That is, there is an amount of current that must be transmitted per unit time to drive a moving part that generally performs a specific action and function, and in other words, the flow of current per unit area must meet a minimum unit, so that the current density, which is the flow of current per unit area, can secure a unit area by increasing the second thickness (T2) in the third direction of the bus bar (120) to meet the standard that matches the high power transmission.

[0113] This is because the value of current density, which is the current divided by the unit area, is the current value, which is the product of the current density and the unit area. Therefore, in order to transmit sufficient high power, it is necessary to secure a sufficient cross-sectional area through which the current flows, that is, the cross-sectional area of ​​the bus bar (120). For this purpose, the second thickness (T2) of the bus bar (120) in the third direction may be relatively larger than the first thickness (T1) of the substrate (110).

[0114] Meanwhile, as described above, the second hole (121) includes a first region (121a) and a second region (121b), and in the third direction, the first region (121a) may be relatively adjacent to the first hole (111), and the second region (121b) may be relatively further away from the first hole (111) than the first region (121a).

[0115] In addition, as described above, the first region (121a) is a space into which the bolt body of the bolt member is inserted, and the connection terminal (310) is in contact with the upper part of the bus bar (120) where the first region (121a) is formed, and the bolt body can be inserted into the inside of the connection terminal (310) by penetrating the first region (121a).

[0116] In addition, the first region (121a) is positioned between the first hole (111) and the second region (121b), and since the bolt body is positioned in the first region (121a) and the bolt head is positioned in the second region (121b), the diameter of the first region (121a) may be smaller than the diameter of the second region (121b). Specifically, the first diameter (L1) of the first hole (111) may be larger than the second diameter (L2) of the first region (121a) and the third diameter (L3) of the second region (121b).

[0117] In other words, among the first diameter (L1) of the first hole (111), the second diameter (L2) of the first region (121a), and the third diameter (L3) of the second region (121b), the first diameter (L1) is the largest, the second diameter (L2) is the smallest, and the third diameter (L3) may have a length between the first diameter (L1) and the second diameter (L2).

[0118] As a result, since the second diameter (L2) is smaller than the first diameter (L1), the upper end of the bus bar (120) is exposed in the third direction through the first hole (111), and the exposed upper end can easily come into contact with the connection terminal (310) provided in the relay module (300).

[0119] In addition, as illustrated in FIG. 9, the bolt body is inserted through the first region (121a) and the first hole (111), and the bolt head is arranged in the second hole (121). The height of the bolt head in the third direction may be smaller than the height of the second region (121b) in the third direction, and specifically, the first height (T3) of the second region (121b) in the third direction is larger than the second height (T4) of the bolt head in the third direction, so that the bolt head may not protrude from the inside of the second region (121b) in the third direction.

[0120] This is because, when a substrate (110) is provided on one side of a bus bar (120) and a separate cooling plate (20) is arranged on the other side, the cooling plate (20) and the bus bar (120) must be in direct contact to cool the heat of the bus bar (120). Therefore, if the bolt head protrudes, the bus bar (120) and the cooling plate (20) may not be in proper contact, which may cause a problem due to heat. In the second region (121b) according to the embodiment of the present invention, the first height (T3) is greater than the second height (T4) of the bolt head, so that the bolt head does not protrude, and the bus bar (120) and the cooling plate (20) can be in close contact.

[0121] In other words, one side of the bus bar (120) is in close contact with the substrate (110), and the other side is exposed in a third direction opposite to the substrate (110) without considering the arrangement of the cooling plate (20), so that it can be effectively placed in close contact with the cooling plate (20) or a separate component.

[0122] Meanwhile, as illustrated in FIG. 10, when a relay module (300) is placed on the other side of the substrate (110) and a connection terminal (310) is inserted into the first hole (111), the fourth height (T6) of the connection terminal (310) in the third direction may be greater than the third height (T5) of the first hole (111) in the third direction. This may be because the connection terminal (310) must necessarily contact the bus bar (120) for power to flow.

[0123] That is, the first thickness (T1) of the substrate (110) of the present invention may be the same as the third height (T5) of the first hole (111), and the first thickness (T1) may be smaller than the fourth height (T6) of the connection terminal (310), and the third height (T5) may be smaller than the fourth height (T6) so that the connection terminal (310) may easily penetrate the first hole (111) and come into contact with the bus bar (120).

[0124] In addition, as mentioned above, the second height (T4) in the third direction of the bolt head arranged in the second region (121b) is smaller than the first height (T3) in the third direction of the second region (121b), so it does not protrude outward, and the bolt body can be inserted and fixed into the inside of the connection terminal (310) by penetrating the first region (121a).

[0125] In addition, an insulating member (320) is inserted into the slit (113) to be placed between adjacent bus bars (120) as described above, and the slit (113) may be placed on a space (130).

[0126] As a result, the electronic component module according to the embodiment of the present invention has a plurality of bus bars (120) arranged on the same plane, thereby enabling effective use of space, and since the plurality of bus bars (120) are connected to each other through the connection terminals (310) of the relay module (300), a large number of wire harnesses are not required, thereby reducing the complexity of connecting wire harnesses and simplifying the process.

[0127] Specifically, the plurality of bus bars (120) are divided into a plurality of first terminal portions (122) and a plurality of second terminal portions (124), and the plurality of first terminal portions (122) each include at least one extension portion (123), and at least a portion of the extension portion (123) is arranged on the same plane as the body of the plurality of first terminal portions (122) and the second terminal portion (124), and the second terminal portion (124) can be arranged on the same plane as the first terminal portion (122).

[0128] Meanwhile, as illustrated in FIG. 8, a slit (113) is arranged between adjacent bus bars (120) or between adjacent first holes (111), and the slit (113) is arranged so as not to overlap with the bus bar (120) in the third direction, and the adjacent bus bars (120) can be spaced apart from each other by a distance (L4).

[0129] Here, the spacing (L4) between adjacent bus bars (120) may be 5 mm or more, preferably 6 mm or more, and may be preferably 5 to 7 mm in consideration of the size of the substrate (110).

[0130] In addition, the width of the separation space (130) between adjacent bus bars (120), i.e., the separation distance (L4), may be greater than the width of the slit (113), and specifically, the separation distance (L4) between adjacent bus bars (120) spaced apart in the first direction or the second direction may be greater than the width of the slit (113) in the direction in which the adjacent bus bars (120) are spaced apart.

[0131] This is because if the separation distance (L4) is narrower than 5 mm, it may be affected by the adjacent bus bar (120), and if it is farther than 7 mm, the area of ​​the substrate (110) increases, so the size of the electrostatic module (100) increases, resulting in reduced spatial efficiency. Therefore, the separation distance (L4) is preferably 5 mm to 7 mm, and more preferably 6 mm.

[0132] Meanwhile, referring to FIGS. 9 to 11 to explain the sensor unit according to an embodiment of the present invention, first, the sensor unit includes a first sensor (141) for sensing voltage and a second sensor (142) for sensing temperature as described above, and the conductive unit (150) may include a first part (151), a second part (152), and a third part (153).

[0133] Here, the second sensor (142) for sensing temperature is connected to the bus bar (120) through a third hole (114) formed by penetrating the substrate (110) in a third direction, one end of the third hole (114) is closed by the bus bar (120), and the other end is closed by the second sensor (142), and a thermally conductive member is arranged on the inside of the third hole (114) so ​​that the temperature of the bus bar (120) can be easily transferred to the second sensor (142) by the thermally conductive member.

[0134] That is, since the third hole (114) has one end closed by the second sensor (142) and one end closed by the bus bar (120), the third hole (114) does not take a form exposed to the outside, but takes a form provided on the inside of the substrate (110), which can prevent the heat of the thermally conductive member from escaping to the outside and the temperature value measured by the second sensor (142) from decreasing, thereby causing an error.

[0135] For example, if the third hole (114) takes an exposed form, the heat of the thermally conductive member is transferred to the outside, and the heat transferred by the thermally conductive member becomes significantly lower than the heat transferred from the bus bar (120), and the temperature of the bus bar (120) measured by the second sensor (142) becomes relatively lower, so that control for cooling the heat of the bus bar (120) may not be properly performed.

[0136] Therefore, one end of the third hole (114) is closed by the bus bar (120), the other end is closed by the second sensor (142), and a thermally conductive member is placed inside the third hole (114), so that the bus bar (120) and the second sensor (142) are in contact with each other with the thermally conductive member in between, thereby enabling the temperature of the bus bar (120) to be sensed more effectively.

[0137] Meanwhile, the substrate (110) may be a PCB in which multiple layers are laminated, and the substrate (110) may include at least one conductive layer (112). Here, the conductive layer (112) may be a layer composed of a conductive material, and various materials may be utilized depending on the situation, but the conductive layer (112) according to an embodiment of the present invention may be formed of a copper layer.

[0138] In addition, the conductive layer (112) and the bus bar (120) may be separated in a third direction by a layer composed of an insulating material rather than a conductive material. This may be to prevent power transmitted through the bus bar (120) from being directly transmitted to the conductive layer (112), but may not necessarily be limited thereto.

[0139] Meanwhile, the conductive part (150) may be arranged on the other side of the substrate (110), and may take the form of being arranged on the outer periphery of the first hole (111), more specifically, on the other side of the substrate (110) to a size larger than the diameter of the first hole (111), the second part (152) may be arranged along the inner side of the first hole (111), and the third part (153) may be arranged on the upper end of the bus bar (120).

[0140] Here, the second part (152) is positioned between the first part (151) and the third part (153), and the conductive part (150) may take the shape of a circle with a diameter when looking at the first hole (111) from the third direction and may take the shape of a donut with a hole formed on the inside based on the end of the third part (153). At this time, the third part (153) may come into contact with the connection terminal (310) depending on the situation.

[0141] In addition, the first part (151), the second part (152), and the third part (153) of the conductive part (150) are each formed of a conductive material, and may be formed with a relatively thin coating.

[0142] Here, the inner surface of the first hole (111) of the substrate (110) is open toward the center of the first hole (111) when the second part (152) is not coated, and when the second part (152) is coated, the conductive layer (112) is in contact with the second part (152) and is connected to the bus bar (120) through the second part (152) and the third part (153), so that the power of the bus bar (120) can be transmitted to the conductive layer (112).

[0143] In addition, as will be explained through the drawings to be described later, a circuit pattern (160) for transferring power may be provided on the upper side of the substrate (110) based on FIG. 4 on the other side of the substrate (110) where the first sensor (141) is provided, and the circuit pattern (160) is in contact with the first part (151), and the power of the bus bar (120) is transferred to the circuit pattern (160) through the conductive part (150), so that the voltage of the bus bar (120) can be measured by the first sensor (141).

[0144] Meanwhile, the second part (152) may be disposed on the entire inner surface of the first hole (111), and the third part (153) may be applied to a part or the entire upper surface of the bus bar (120). In addition, the first part (151) may be disposed in an adjacent portion of the first hole (111) in the shape of a circle having a diameter that is a predetermined distance larger than the first diameter (L1) of the first hole (111).

[0145] As described above, the first part (151) of the conductive part (150) allows the power of the bus bar (120) to be transferred to the first sensor (141) through the circuit pattern (160), the second part (152) allows the power of the bus bar (120) to be transferred to the conductive layer (112) of the substrate (110), and the third part (153) can transfer the power of the bus bar (120) to the second part (152) or the connection terminal (310).

[0146] Meanwhile, referring to FIGS. 2 and 10, the shunt portion (170) according to the embodiment of the present invention is disposed on one side of the substrate (110) and may be disposed to overlap in a first direction. Here, since the first direction is selectively defined as one direction in the detailed description of the present invention, a pair may be provided to overlap each other in the first direction or the second direction.

[0147] In addition, the shunt portion (170) may be arranged on the upper surface of the substrate (110), i.e., the other surface of the substrate (110), similar to the sensor portion, and the shunt portion (170) may be provided with a mounting portion (171) that overlaps the first hole (111) in the third direction, and the mounting portion (171) may have a relatively narrow diameter.

[0148] In addition, the shunt portion (170) may take the form of a pair of bodies in which a mounting portion (171) is formed, and a resistance member to which resistance is applied is arranged between the bodies in which the first hole (111) and the mounting portion (171) are overlapped. The resistance member may be formed of a manganese material, but is not necessarily limited thereto.

[0149] In addition, the shunt portion (170) may be provided with at least one solder portion (180) on the periphery so as to be electrically connected to the substrate (110), and the solder portion (180) electrically connects the upper surface of the substrate (110) and the shunt portion (170), and the solder portion (180) may be connected to the first sensor (141) or the second sensor (142) through a separate circuit pattern (160) of the substrate (110).

[0150] Meanwhile, at least one of the second sensors (142) according to the embodiment of the present invention is disposed adjacent to the shunt portion (170), and more specifically, adjacent to the resistance member of the shunt portion (170) so as to sense the temperature generated in the resistance member.

[0151] This is because, due to the nature of the resistance member, when power moves from one end of the shunt section (170) to the other end, it passes through the resistance member, and when the current passes through a path where resistance is applied during the movement of the current, heat is generated. Since heat is generally generated in the resistance member, it may be desirable for the second sensor (142) to be placed adjacent to the resistance member.

[0152] Meanwhile, referring to FIG. 11 to explain the first sensor (141) and circuit pattern (160) described above, as shown in FIG. 11, the first region (121a) of the bus bar (120) takes a form exposed in the third direction through the first hole (111), and the conductive part (150) may have the first part (151) arranged at a predetermined interval along the outer circumference of the first hole (111).

[0153] In addition, in Fig. 11, the conductive part (150) and the bus bar (120) are depicted as being distinguished from each other to help understand the explanation, but the third part (153) may be applied to the upper surface of the bus bar (120), that is, the upper part of the bus bar (120) exposed through the first hole (111) in the third direction, so that when viewed from above, only the conductive part (150) is visible.

[0154] In addition, one end of a circuit pattern (160) may be connected to a part of a conductive part (150), and the other end may be connected to a first sensor (141), and the first sensor (141) may sense the voltage of the bus bar (120) through the circuit pattern (160).

[0155] In addition, the first hole (111) in which the circuit pattern (160) and the first sensor (141) are provided can only be applied to a structure in which a slit (113) is arranged between a pair of adjacent first holes (111), and since the shunt portion (170) is connected in parallel to the ammeter for the purpose of expanding the measurement range of the ammeter, the voltage of the shunt portion (170) can be transmitted through the first sensor (141) through the conductive layer (112) rather than the circuit pattern (160) by being connected through the substrate (110) and the solder portion (180) rather than by measurement through the first sensor (141).

[0156] That is, a conductive part (150) and a circuit pattern (160) provided in one of a pair of adjacent first holes (111) in which an insulating member (320) is arranged and a connection terminal (310) is arranged may be connected, and the conductive part (150) and the first sensor (141) may be connected through the circuit pattern (160).

[0157] However, in describing the shunt portion (170) of the present invention, one of the embodiments of the present invention is described as an example, and it may be transmitted to the first sensor (141) not necessarily through the conductive layer (112) but through the circuit pattern (160), and it may not necessarily be limited to what has been mentioned.

[0158] Meanwhile, as shown in FIGS. 12 and 13, the relay module (300) may include a connection terminal (310), an insulating member (320), and a connection portion (330).

[0159] Here, the connection terminal (310) is inserted into the first hole (111) and comes into contact with the conductive part (150) or comes into contact with the bus bar (120), and the insulating member (320) is inserted into the slit (113) and is placed on the space (130) where the adjacent bus bar (120) is spaced apart, and the insulating member (320) may protrude relatively more than the connection terminal (310).

[0160] This means that the connection terminal (310) is inserted into the first hole (111) and contacts the conductive part (150) or the bus bar (120) to transmit and branch power, but the insulating member (320) is positioned between adjacent bus bars (120) to minimize electrical influence between adjacent bus bars (120). Therefore, the insulating member (320) may be arranged to protrude relatively more than the connection terminal (310) so as to be positioned relatively adjacent to the lower end of the bus bar (120).

[0161] In addition, the connection part (330) is arranged on the periphery of the relay module (300) and is arranged adjacent to either the power module (100) or the management module (200), and the connection part (330) may include a terminal pin (331) that is inserted through either the power module (100) or the management module (200) that is adjacent to the relay module (300).

[0162] That is, the relay module (300) is connected to the power failure module (100) through a connection terminal (310). When connected only to the power failure module (100), the connection portion (330) is arranged adjacent to the power failure module (100), and when combined with the power failure module (100) and the management module (200), it may be arranged in a direction toward the management module (200).

[0163] Specifically, as illustrated in FIG. 13, one of the electrostatic module (100) or the management module (200) that is coupled to the connection part (330) has a through hole through which a terminal pin (331) passes, and the terminal pin (331) passing through the through hole can be connected to the electrostatic module (100) or the management module (200) through the connector module (700).

[0164] At this time, in the detailed description of the present invention, the description is limited to the management module (200) to help understanding of the invention, but this is limited to prevent misunderstanding of the invention by describing both the electrostatic module (100) and the management module (200), and it is not necessarily provided only in the management module (200), and when a through hole is provided in the electrostatic module (100), it is arranged to overlap with the separation space (130) in the third direction similar to the slit (113), and the connector module (700) can be arranged on the separation space (130).

[0165] As described above, when a through hole is formed in the management module (200), the connection part (330) is provided at the upper end of the relay module (300), the connection terminal (310) and the insulating member (320) are provided at the lower end of the relay module (300), and the connection terminal (310), the insulating member (320), and the connection part (330) may be arranged in opposite directions.

[0166] In addition, when the terminal pin (331) is inserted through the through hole of the management module (200), the terminal pin (331) is inserted into the inside of the connector module (700), and the connector module (700) transmits information or power transmitted from the terminal pin (331) to a separate electronic component module through a wire harness, or is electrically connected to the management module (200) that is in contact with both ends of the connector module (700) to directly transmit information and power to the management module (200).

[0167] In addition, the relay module (300) is placed between the management module (200) and the power failure module (100) as shown in FIG. 1, and both ends may be placed toward the management module (200) or the power failure module (100), respectively.

[0168] Meanwhile, as illustrated in FIG. 14, the electronic component module according to the embodiment of the present invention may include a connection module (400), and the connection module (400) may be arranged between the management module (200) and the electrostatic module (100), and may be arranged to overlap with the relay module (300) in the second direction or the first direction, and in the third direction, one end may be in contact with the electrostatic module (100), and the other end may be in contact with the management module (200).

[0169] Here, the connection module (400) includes a connection frame (410), a connection wire (420), and a connection connector (430). The connection frame (410) has a space provided on the inside where the connection wire (420) is arranged, and is formed so that one side is open, but can be closed by the inner wall of the housing (600) when the housing (600) is coupled.

[0170] In addition, a fixing part for fixing a connection wire (420) may be provided at both ends of the connection frame (410), and a plurality of connection wires (420) may be arranged in the first direction or the second direction.

[0171] In addition, a connection connector (430) is provided on each of the outer ends of the connection frame (410), and one end or the other end of a connection wire (420) in a third direction is arranged on the inner side of the connection connector (430), and the connection connector (430) can electrically connect the connection wire (420) and the electrostatic module (100) or the connection wire (420) and the management module (200) to each other.

[0172] That is, the management module (200) and the power module (100) can be electrically connected to each other by the relay module (300) and the connection module (400) when the connection portion (330) is positioned toward the management module (200), and depending on the situation, if the connection module (400) breaks down, the electrical connection can be maintained through the relay module (300).

[0173] Meanwhile, referring to FIGS. 15 and 16 to explain a frame module (500) according to an embodiment of the present invention, as shown in FIGS. 15 and 16, the frame module (500) may include a cover portion (510), a leg portion (520), a partition portion (530), and a terminal home (540).

[0174] Here, the cover part (510) may be in contact with the management module (200) and may be placed between the relay module (300) and the management module (200). In addition, the cover part (510) may have a terminal groove (540) formed therein through which the terminal pin (331) described above may pass, and the terminal groove (540) and the through hole may be placed to overlap in the third direction.

[0175] At this time, the through hole may have a width relatively smaller than the terminal groove (540), which may be because a part of the connection part (330) is inserted into the terminal groove (540), but may not necessarily be limited thereto.

[0176] In addition, a relay module (300) and a connection module (400) are arranged inside the frame module (500), and the relay module (300) may be arranged in a partition space (531) partitioned by a partition section (530) as shown in FIG. 16.

[0177] Here, the partition (530) is formed in the shape of a partition wall that protrudes from the cover (510) toward the electrostatic module (100), and the partition (530) and the relay module (300) can be arranged so that a portion of the partition (530) is in contact with each other. Accordingly, the relay module (300) can be fixed in a state where it is arranged in the partition space (531), thereby preventing the relay module (300) from shaking during the joining process.

[0178] In addition, at least two leg parts (520) are arranged in the frame module (500), and the leg parts (520) have an end into which a first hole (111) or a fixing part (171) can be inserted.

[0179] Specifically, as illustrated in FIG. 17, the leg portion (520) is divided into a first leg (521) and a second leg (522), and the first leg (521) and the second leg (522) may be spaced apart from each other in the first direction or the second direction, and a plurality of relay modules (300) may be arranged between the first leg (521) and the second leg (522).

[0180] At this time, the first leg (521) is inserted into the first hole (111), the second leg (522) is inserted into the mounting portion (171), and the second leg (522) is inserted into the mounting portion (171) provided in the shunt portion (170), so that the length in the third direction can be relatively shorter than that of the first leg (521).

[0181] That is, the first leg (521) and the second leg (522) have a length difference (524) as shown, and the length difference (524) may be a length in the third direction from the bottom surface of the first hole (111) or the top surface of the bus bar (120) to the bottom surface of the mounting portion (171).

[0182] However, since the second leg (522) is not inserted into the first hole (111) but into the mounting portion (171), an insertion portion (523) protruding from the second leg (522) toward the electrostatic module (100) is provided so that it can be inserted into the mounting portion (171) having a relatively narrower diameter than the first hole (111), and the insertion portion (523) can protrude stepwise from the end of the second leg (522).

[0183] Meanwhile, as illustrated in Fig. 18, the cross-sectional areas of each extension (123) may be different from each other.

[0184] To explain specifically, Fig. 18 is a cross-section of the extension (123) viewed from the left in a direction from the upper side to the lower side based on Fig. 4, and as shown in Fig. 18, at least one extension (123) has a different area, which may be because the first width (A1) of the first extension (123a) and the second width (A2) of the second extension (123b) are different from each other.

[0185] More specifically, in order to effectively transmit the power of a battery, the current flow per unit time must be constant, which may be different for each component that consumes power, and the current flow per unit time, or in other words, the current density, must satisfy a certain level or higher.

[0186] Therefore, the second thickness (T2) in the third direction of the bus bar (120) according to the embodiment of the present invention may be greater than the first thickness (T1) in the third direction of the substrate (110), and when the plurality of extension portions (123) are arbitrarily divided into a first extension portion (123a), a second extension portion (123b), and a third extension portion (123c) as illustrated in FIG. 8, the first extension portion (123a) requires a relatively low current density and thus has a relatively smaller cross-sectional area than the second extension portion (123b) and the third extension portion (123c), and the second extension portion (123b) requires a relatively higher current density than the first extension portion (123a) and the third extension portion (123c), thus having a large cross-sectional area.

[0187] As a result, at least one of the plurality of extensions (123) of the present invention may have different cross-sectional areas.

[0188] Meanwhile, when the insertion part (523) is inserted into the mounting part (171) of the shunt part (170) as illustrated in FIG. 19, the bolt body can be inserted into the inside of the second leg (522) and fixed, and screw threads are formed on the outer surface of the bolt body, and screw threads corresponding to the screw threads of the bolt body are formed on the inside of the second leg (522) to fix the insertion part (523).

[0189] At this time, as illustrated in FIG. 19, the shunt portion (170) is positioned with the insertion portion (523) inserted into the mounting portion (171), and the opposite side of the mounting portion (171) on which the insertion portion (523) is mounted may be formed to protrude so as to be inserted into the first hole (111).

[0190] In this way, since a part of the shunt part (170) protrudes and is inserted into the inside of the first hole (111), even if the connection of the bolt member is loose, the shunt part (170) may not be detached from the first hole (111).

[0191] In order to explain the application and examples of the electronic component module of the embodiment of the present invention described above, reference may be made to FIGS. 20 and 21.

[0192] Specifically, FIG. 20 is a drawing illustrating a combination of an electronic product assembly and a cooling plate according to one embodiment of the present invention, and FIG. 21 is a drawing illustrating a bus bar in a state where an electronic product assembly and a cooling plate are combined according to one embodiment of the present invention.

[0193] First, as illustrated in FIG. 20, an electronic product assembly (10) according to an embodiment of the present invention can be combined with a cooling plate (20) that comes into contact with the electrostatic module (100) in a state in which the electrostatic module (100), management module (200), relay module (300), connection module (400), frame module (500), connector module (700), and housing (600) described above are combined.

[0194] Here, the cooling plate (20) may be formed with an inlet and an outlet for introducing and discharging cooling water, and a passage through which the cooling water moves may be formed on the inside of the cooling plate (20).

[0195] In addition, when a cooling plate (20) is provided, terminals to be inserted into the second hole (121) of the extension part (123) may be provided on one side facing the electrostatic module (100), and the number of the second holes (121) of the extension part (123) and the number of terminals may correspond.

[0196] When arranged in this manner, as shown in Fig. 21, the bus bar (120) of the electrostatic module (100) has the bottom surface in the third direction open, so it comes into direct contact with the cooling plate (20), and the cold air of the cooling plate (20) is effectively transferred to the bus bar (120), so that the heat of the bus bar (120) can be effectively reduced.

[0197] In addition, since the bolt head disposed in the second region (121b) is disposed only on the inner side of the second region (121b) as described above and does not protrude from the second region (121b) in the third direction, it does not come into contact with one surface of the cooling plate (20), thereby solving the problem of the bus bar (120) being lifted or being separated from the cooling plate (20) depending on the protrusion height of the bolt head.

[0198] To summarize the above, the electronic component module according to the embodiment of the present invention has a first terminal portion (122) and a second terminal portion (124) arranged on the same plane, an extension portion (123) at least partly arranged on the same plane as the first terminal portion (122) and the second terminal portion (124), and a plurality of bus bars (120) arranged to be spaced apart from each other, but connected by a connection terminal (310) inserted into the first hole (111), so that there may be an advantage that a complicated wire harness connection is unnecessary.

[0199] In addition, since the substrate (110) and the bus bar (120) are laminated in one direction, or in a third direction in the detailed description of the present invention, one side of the bus bar (120) is exposed and is placed facing the cooling plate (20), so that the cold air of the cooling plate (20) can be effectively transferred to the bus bar (120).

[0200] In addition, by arranging the complex wire harness and the structure of the three-dimensionally arranged bus bar (120) on the same plane, the number of wire harnesses is significantly reduced, and there is an advantage of effectively reducing the space requirement wasted due to the structure of the three-dimensional bus bar (120).

[0201] Having described preferred embodiments of the invention, it will be apparent to those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or scope thereof, in addition to the embodiments described above.

[0202] Therefore, the above-described embodiments should be considered as illustrative rather than restrictive, and accordingly, the present invention is not limited to the above description but may be modified within the scope of the appended claims and their equivalents.

Claims

1. An electrostatic module comprising a substrate having a plurality of first holes formed thereon and a plurality of bus bars attached to one surface of the substrate, wherein the substrate and the bus bars are laminated in one direction; A management module arranged to face the substrate in the opposite direction from the plurality of bus bars; A relay module including a pair of connection terminals inserted into the first hole and a connection part connected to the management module or the power supply module, A plurality of the above bus bars are arranged spaced apart from each other on one side of the above substrate, The above bus bar includes a second hole formed at a position corresponding to the first hole, The above relay module includes an insulating member disposed between the adjacent bus bar and a pair of the above connection terminals, An electronic product assembly wherein the substrate includes a slit between at least one pair of adjacent first holes into which the connection terminal is inserted.

2. In paragraph 1, The above relay module is placed between the power failure module and the management module, The above connection terminal is arranged toward the above electrostatic module, An electronic product assembly wherein the above connecting portion is positioned toward the management module.

3. In paragraph 2, The above connecting portion includes a connecting portion protruding toward the management module or the electrostatic module, The above management module or the above electrostatic module is an electronic product assembly in which a through hole through which the connection part passes is provided.

4. In paragraph 3, The connecting portion penetrating the above through hole is placed on the inside, An electronic product assembly further comprising a connector disposed between the relay module and the management module or the electrostatic module.

5. In paragraph 1, An electronic product assembly in which the bus bar has at least one region having a different length in a first direction from one side of the substrate toward the opposite side and a second direction from the other side of the substrate toward the opposite side.

6. In paragraph 5, The above busbars are: A plurality of first terminal portions including extension portions that do not overlap the substrate in a third direction perpendicular to the first direction and the second direction; and An electronic product assembly divided into a plurality of second terminal portions overlapping the substrate in the third direction.

7. In paragraph 6, The above extension extends in a direction away from the substrate, An electronic product assembly in which the first terminal portions are different from each other in at least one cross-sectional area of ​​the extension portion cut in a direction perpendicular to the extension direction of the extension portion.

8. In paragraph 1, The second hole is a first region arranged adjacent to the first hole; and Including a second region that is positioned relatively farther from the first hole than the first region; An electronic product assembly wherein the diameter of the first region is smaller than the diameter of the second region.

9. In paragraph 8, The above connecting terminal is provided with an insertion hole into which the screw thread of the bolt member is inserted, The screw thread of the above bolt member penetrates the first area and is inserted into the insertion hole, An electronic product assembly in which the head of the above bolt member is placed in the second region.

10. In paragraph 1, An electronic product assembly wherein the thickness of the substrate in the third direction toward the management module from the above-mentioned electrostatic module is smaller than the thickness of the bus bar in the third direction.

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