Light-emitting substrate and display device

Abstract

A light-emitting substrate and a display device. The light-emitting substrate comprises a base (10), a pad group, a light-emitting element (42) and a plurality of connecting portions. The pad group comprises a first pad (21) and a second pad (22), wherein the first pad (21) is arranged spaced apart from the second pad (22) in a first direction. The light-emitting element (42) is provided with a first solder pin (421) and a second solder pin (422), and the plurality of connecting portions include first connecting portions (91) and second connecting portions (92). The first connecting portions (91) are provided on the side of the first pad (21) away from the base (10) and are connected to the first solder pin (421), and the second connecting portions (92) are provided on the side of the second pad (22) away from the base (10) and are connected to the first solder pin (421). One of the first connecting portions (91) and the second connecting portions (92) is at least one in terms of the number, and the other one thereof is at least two in terms of the number. The plurality of connecting portions are not on the same straight line.

Description

Light-emitting substrate and display device Technical Field

[0001] The present disclosure relates to, but is not limited to, the field of display technology, and in particular to a light-emitting substrate and a display device. Background Art

[0002] At present, mini light-emitting diode (Mini LED) display technology is becoming increasingly mature. When used as a panel backlight source, it can achieve more precise dynamic backlight effects and effectively improve screen brightness and contrast.

[0003] Summary of the Invention

[0004] The following is an overview of the subject matter described in detail in this disclosure. This overview is not intended to limit the scope of the claims.

[0005] In one aspect, the present disclosure provides a light-emitting substrate, comprising:

[0006] substrate;

[0007] A pad group is provided on the substrate, the pad group includes a first pad and a second pad, the first pad and the second pad are spaced apart along a first direction and are symmetrical with respect to a center line between the first pad and the second pad;

[0008] A light-emitting element is provided with a first solder leg and a second solder leg, wherein the orthographic projection of the first solder leg on the substrate at least partially overlaps with the orthographic projection of the first solder pad on the substrate, and the orthographic projection of the second solder leg on the substrate at least partially overlaps with the orthographic projection of the second solder pad on the substrate; and

[0009] a plurality of connecting portions, including a first connecting portion and a second connecting portion;

[0010] The first connection portion is provided on a side of the first pad away from the substrate and connected to the first solder leg. The second connection portion is provided on a side of the second pad away from the substrate and connected to the second solder leg. The number of one of the first connection portion and the second connection portion is at least one, and the number of the other is at least two.

[0011] The plurality of connecting portions are not located on the same straight line.

[0012] In some embodiments of the light-emitting substrate, the first connecting portion has a first vertex, the maximum dimension of the first connecting portion in a direction perpendicular to the substrate is the distance from the first vertex to the substrate along a direction perpendicular to the substrate, and the orthographic projection of the first vertex on the substrate is within the range of the orthographic projection of the first solder foot on the substrate.

[0013] In some embodiments of the light-emitting substrate, there are multiple first connecting parts, the orthographic projections of the multiple first vertices on the substrate are mirror-symmetrical with respect to the orthographic projection of the first axis of the first solder foot on the substrate, and the first axis is parallel to the first direction.

[0014] In some embodiments of the light emitting substrate, the plurality of first vertices are arranged along a second direction, and the second direction is perpendicular to the first direction.

[0015] In some embodiments of the light-emitting substrate, a dimension of the first solder foot along the first direction is less than 100 μm;

[0016] The orthographic projections of the plurality of first vertices on the substrate are located on the orthographic projection of the second axis of the first solder foot on the substrate, and the second axis is parallel to the second direction;

[0017] The first solder foot has first edges located on both sides of the first axis, the distance between the orthographic projection of the second axis on the substrate and the orthographic projection of the two first edges on the substrate is a1, and the minimum distance between the orthographic projection of multiple first vertices on the substrate and the orthographic projection of the first edge on the substrate is g1, where 0<g1<1 / 4a1.

[0018] In some embodiments of the light-emitting substrate, the plurality of first vertices are staggered along a second direction, and adjacent first vertices are relatively offset along the first direction, and the second direction is perpendicular to the first direction.

[0019] In some embodiments of the light-emitting substrate, the number of the first connecting portions is three, and the three first vertices are distributed in an isosceles triangle or an equilateral triangle and are located on both sides of the first axis.

[0020] In some embodiments of the light-emitting substrate, a dimension of the first solder foot along the first direction is greater than or equal to 100 μm;

[0021] The first solder leg includes a first solder leg portion and a second solder leg portion located on both sides of a second axis of the first solder leg, a portion of the orthographic projections of the plurality of first vertices on the substrate is located within the range of the orthographic projections of the first solder leg portion on the substrate, and another portion of the orthographic projections of the plurality of first vertices on the substrate is located within the range of the orthographic projections of the second solder leg portion on the substrate;

[0022] The first solder foot has first edges located on both sides of the first axis, the distance between the orthographic projection of the second axis on the substrate and the orthographic projection of the two first edges on the substrate is a1, and the minimum distance between the orthographic projection of multiple first vertices on the substrate and the orthographic projection of the first edge on the substrate is g1, where 0<g1<1 / 6a1.

[0023] In some embodiments of the light-emitting substrate, a size of the first soldering feet along the first direction is greater than or equal to 100 μm and less than or equal to 200 μm, and adjacent first connecting portions are connected.

[0024] In some embodiments of the light-emitting substrate, a dimension of the first solder foot along the first direction is greater than 200 μm, adjacent first connecting portions are spaced apart, and a spacing distance between adjacent first connecting portions along the first direction and the second direction is greater than 80 μm.

[0025] In some embodiments of the light-emitting substrate, connections between adjacent first connection portions have chamfers.

[0026] In some embodiments of the light emitting substrate, the first pad includes a first main portion and at least one first branch portion, and the first main portion and the first branch portion are connected;

[0027] A portion of the orthographic projections of the multiple first vertices on the substrate is located within the range of the orthographic projection of the first main body on the substrate, and another portion of the orthographic projections of the multiple first vertices on the substrate is located within the range of the orthographic projection of the first branch on the substrate.

[0028] In some embodiments of the light emitting substrate, the plurality of first connection portions and the plurality of second connection portions are symmetrical about the center line.

[0029] In some embodiments of the light-emitting substrate, a portion of an orthographic projection of at least one of the plurality of first connecting portions on the substrate is located outside a range of an orthographic projection of the first solder foot on the substrate;

[0030] A portion of an orthographic projection of at least one of the plurality of second connection portions on the substrate is located outside a range of an orthographic projection of the second solder foot on the substrate.

[0031] In some embodiments of the light-emitting substrate, areas of orthographic projections of the plurality of first connection portions and the plurality of second connection portions on the substrate are the same.

[0032] In some embodiments of the light-emitting substrate, the orthographic projections of the plurality of connection portions on the substrate are one or more of a circle, an ellipse, and a polygon.

[0033] In some embodiments of the light-emitting substrate, the light-emitting substrate further comprises a reflective layer disposed on a side of the pad group facing away from the substrate, the reflective layer having an opening, and an orthographic projection of the first pad and the second pad on the substrate at least partially overlaps with an orthographic projection of the opening on the substrate;

[0034] The orthographic projections of the first solder foot and the second solder foot on the substrate at least partially overlap with the orthographic projection of the opening on the substrate.

[0035] In another aspect, the present disclosure further provides a display device, comprising:

[0036] The light-emitting substrate as described above.

[0037] Still other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description.

[0038] Summary of the Figures

[0039] The accompanying drawings are used to provide an understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation to the technical solution of the present disclosure.

[0040] FIG1 is a schematic cross-sectional view of a light-emitting substrate in one embodiment of the present disclosure;

[0041] FIG2 is a schematic diagram of a connection portion formed by screen printing on a light-emitting substrate in an embodiment of the present disclosure;

[0042] FIG3A is a plan view showing the coordinated arrangement of solder pins and solder pads of a light-emitting element in a conventional light-emitting substrate;

[0043] 3B to 3G are cross-sectional schematic diagrams of the coordinated arrangement of solder pins and solder pads of a light-emitting element in a conventional light-emitting substrate;

[0044] FIG3H is a physical picture of a light-emitting element in a conventional light-emitting substrate after being tilted;

[0045] FIG3I is a diagram showing the light pattern of a light-emitting element in a conventional light-emitting substrate after tilting;

[0046] FIG3J is a schematic diagram showing the display effect of a light-emitting element in a conventional light-emitting substrate after tilting;

[0047] 4A is a plan view showing the coordinated arrangement of the first solder pin and the second solder pin of the light-emitting element and the first solder pad and the second solder pad in the light-emitting substrate in one embodiment of the present disclosure;

[0048] 4B to 4E are cross-sectional schematic diagrams of the coordinated arrangement of the first solder leg and the second solder leg of the light-emitting element and the first solder pad and the second solder pad in the light-emitting substrate in one embodiment of the present disclosure;

[0049] 5 is a plan view of the coordinated arrangement of the first solder pin and the second solder pin of the light-emitting element and the first solder pad and the second solder pad in the light-emitting substrate in another embodiment of the present disclosure;

[0050] 6 is a plan view showing the coordinated arrangement of the first solder pin and the second solder pin of the light-emitting element and the first solder pad and the second solder pad in the light-emitting substrate in yet another embodiment of the present disclosure;

[0051] 7A is a plan view showing the coordinated arrangement of the first solder pin and the second solder pin of the light-emitting element and the first solder pad and the second solder pad in the light-emitting substrate in another embodiment of the present disclosure;

[0052] 7B to 7D are cross-sectional schematic diagrams showing the coordinated arrangement of the first solder leg and the second solder leg of the light-emitting element and the first solder pad and the second solder pad in the light-emitting substrate in yet another embodiment;

[0053] FIG8 is a plan view of the coordinated arrangement of the first solder pin and the second solder pin of the light-emitting element and the first solder pad and the second solder pad in the light-emitting substrate in another embodiment of the present disclosure;

[0054] FIG9 is a planar schematic diagram of the coordinated arrangement of the first solder pin and the second solder pin of the light-emitting element and the first solder pad and the second solder pad in the light-emitting substrate in another embodiment of the present disclosure.

[0055] Description of Reference Numerals: 1', solder foot; 2', solder pad; 3', solder; 10, substrate; 20, conductive layer; 21, first solder pad; 211, first main body; 212, first branch; 22, second solder pad; 221, second main body; 222, second branch; 30, reflective layer; 40, chip; 41, control unit; 42, light-emitting element; 421, first solder foot; 4211, first edge; 4212, first weld leg; 4213, second weld leg; 422, second weld leg; 4221, second edge; 4222, third weld leg; 4223, fourth weld leg; 50, protective layer; 60, connector; 70, scraper; 80, steel mesh; 91, first connection part; 911, first vertex; 92, second connection part; 921, second vertex; 100, opening; 200, steel mesh opening; 300, chamfer.

[0056] Details

[0057] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Note that the embodiments can be implemented in a variety of different forms. A person of ordinary skill in the art can easily understand the fact that the methods and contents can be transformed into various forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0058] The scales of the figures in this disclosure can be used as a reference for actual processes, but are not limited to such. For example, the width-to-length ratio of the channel, the thickness and spacing of the various film layers, and the width and spacing of the various signal lines can be adjusted according to actual needs. The number of pixels in the display substrate and the number of sub-pixels in each pixel are not limited to the numbers shown in the figures. The figures described in this disclosure are merely schematic structural diagrams, and one embodiment of this disclosure is not limited to the shapes or values ​​shown in the figures.

[0059] In the present disclosure, ordinal numbers such as “first”, “second” and “third” are provided to avoid confusion among constituent elements, rather than to limit the number.

[0060] In the present disclosure, for the sake of convenience, words and phrases indicating orientation or positional relationships, such as "middle," "upper," "lower," "front," "back," "vertical," "horizontal," "top," "bottom," "inside," and "outside," are used to illustrate the positional relationships of constituent elements with reference to the accompanying drawings. This is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as a limitation on the present disclosure. The positional relationships of the constituent elements are appropriately changed according to the direction in which each constituent element is described. Therefore, the words and phrases are not limited to those described in the specification and can be appropriately replaced according to the circumstances.

[0061] In this disclosure, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct connections, indirect connections through intermediaries, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on the specific circumstances.

[0062] In this disclosure, a transistor refers to an element that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this disclosure, the channel region refers to the region through which current primarily flows.

[0063] In the present disclosure, the first electrode can be a drain electrode and the second electrode can be a source electrode, or vice versa. The functions of the "source electrode" and "drain electrode" may be interchanged when using transistors with opposite polarities or when the direction of current changes during circuit operation. Therefore, in the present disclosure, the terms "source electrode" and "drain electrode" can be interchanged, and the terms "source terminal" and "drain terminal" can be interchanged.

[0064] In this disclosure, "electrically connected" includes components connected together via an element having some electrical function. There are no particular limitations on the "element having some electrical function" as long as it enables the transfer of electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0065] In this disclosure, "parallel" refers to a state where the angle formed by two straight lines is greater than -10° and less than 10°, and thus also includes a state where the angle is greater than -5° and less than 5°. Furthermore, "perpendicular" refers to a state where the angle formed by two straight lines is greater than 80° and less than 100°, and thus also includes a state where the angle is greater than 85° and less than 95°.

[0066] In this disclosure, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced with "conductive film." Similarly, "insulating film" may be replaced with "insulating layer."

[0067] The triangles, rectangles, trapezoids, pentagons or hexagons in the present disclosure are not in the strict sense, but may be approximate triangles, rectangles, trapezoids, pentagons or hexagons, etc. There may be some small deformations caused by tolerances, and there may be chamfers, arc edges and deformations.

[0068] The term "about" in the present disclosure refers to a numerical value that is not strictly defined and allows for process and measurement errors.

[0069] The "patterning process" mentioned in the present disclosure includes processes such as depositing a film layer, coating a photoresist on the film layer, mask exposure, development, etching, and stripping the photoresist for metal materials, inorganic materials, or transparent conductive materials; and includes processes such as coating an organic material, mask exposure, and development for organic materials. Deposition can be achieved by any one or more of sputtering, evaporation, chemical vapor deposition, and electroplating; coating can be achieved by any one or more of spraying, spin coating, and inkjet printing; and etching can be achieved by any one or more of dry etching and wet etching, which are not limited in the present disclosure. "Thin film" refers to a thin film made by depositing, coating, or other processes on a substrate using a certain material. If the "thin film" does not require a patterning process during the entire production process, the "thin film" can also be called a "layer." If the "thin film" requires a patterning process during the entire production process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern." As used in this disclosure, "A and B are disposed in the same layer" means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer refers to the dimension of the film layer in the direction perpendicular to the substrate. In exemplary embodiments of this disclosure, "the orthographic projection of B is within the range of the orthographic projection of A" or "the orthographic projection of A contains the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or that the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0070] Figure 1 is a cross-sectional view of a light-emitting substrate in one embodiment of the present disclosure, wherein the cross section is perpendicular to substrate 10. In a plane perpendicular to substrate 10, the light-emitting substrate includes substrate 10 (which may be, but is not limited to, glass, aluminum, PCB, BT (bismaleimide triazine)), or FPC; a conductive layer 20 disposed on substrate 10; a reflective layer 30 disposed on the side of conductive layer 20 facing away from substrate 10 and having an opening 100; a chip 40 disposed in opening 100 and electrically connected to conductive layer 20; and a protective layer 50 disposed on the side of chip 40 facing away from substrate 10. The light-emitting substrate also includes a connector 60 or an FPC board, configured to transmit signals to and from the outside. For example, signals can be controlled by an external PCB board and transmitted to connector 60, and then transmitted to chip 40 through conductive layer 20. Chip 40 includes a control unit 41 and a light-emitting element 42. For example, control unit 41 can be an IC chip. Light-emitting element 42 can be an LED, such as a Mini LED.

[0071] Figure 3A is a plan view schematically illustrating the arrangement of solder pins 1' and solder pads 2' of a light-emitting element 42 in a conventional light-emitting substrate. The conductive layer 20 includes at least two solder pads 2' spaced apart along a first direction X. The light-emitting element 42 is provided with two solder pins 1' spaced apart along the first direction X. The two solder pins 1' correspond one-to-one with the two solder pads 2' and are connected via solder 3'.

[0072] 3B is a cross-sectional diagram of the coordinated arrangement of the solder foot 1 ′ and the solder pad 2 ′ of the light emitting element 42 in a conventional light emitting substrate, wherein the cross section is perpendicular to the substrate 10 and parallel to the first direction X. FIG.

[0073] FIG3C is a cross-sectional view illustrating the arrangement of the solder pin 1′ and the solder pad 2′ of the light-emitting element 42 in a conventional light-emitting substrate, wherein the cross section is perpendicular to the substrate 10 and parallel to the second direction Y. The second direction Y is perpendicular to the first direction X, and the plane containing the first direction X and the second direction Y is parallel to the substrate 10.

[0074] The reflective layer 30 is configured to reflect light that impinges upon it. For example, the reflective layer 30 can reflect light emitted by the light-emitting element 42 to increase the amount of light emitted from the light-emitting substrate in a third direction Z perpendicular to the plane of the substrate 10, thereby improving the light extraction efficiency of the light-emitting substrate. The color of the reflective layer 30 can be selected to have excellent reflective properties. For example, the color of the reflective layer 30 can be selected to be white. The material of the reflective layer 30 can include white oil, which can include but is not limited to resin (e.g., epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO2), and organic solvent (e.g., dipropylene glycol methyl ether). The material of the reflective layer 30 can also include silicone white glue. For example, when the material of the reflective layer 30 includes white oil or silicone white glue, a screen printing process can be used to print the white oil or silicone white glue to form the reflective layer 30. The thickness of the reflective layer 30 may range from about 10 μm to 300 μm, for example, about 10 μm, 50 μm, 80 μm, 155 μm, 200 μm, or 300 μm. In an exemplary embodiment, the reflective layer 30 may be formed by one or more screen printing processes.

[0075] In an exemplary embodiment, the reflective layer 30 may also be a reflective sheet, for example, a white reflective sheet. In an exemplary embodiment, the reflective layer 30 may also be a reflective coating, etc. The embodiment of the present disclosure does not limit the form of the reflective layer 30.

[0076] In order to prevent the light-emitting elements 42 from being scratched during production and transportation, which may affect the reliability and yield of the product, a protective glue is usually applied on the light-emitting elements 42 to form a protective layer 50. For example, the entire surface can be coated with protective glue to encapsulate and protect all the light-emitting elements 42. Alternatively, a one-by-one protection method can be adopted, that is, a transparent protective structure is formed above each light-emitting element 42, which can simultaneously protect and enhance the light efficiency, forming a protective layer 50 including multiple transparent protective structures. In an exemplary embodiment, a dispensing machine can be used to dispense protective glue on each light-emitting element 42, and then the transparent protective structure is formed by heating and curing. In an exemplary embodiment, the protective glue can be, but is not limited to, lens glue or flat glue.

[0077] The solder foot 1' is soldered to the pad 2' via the solder 3', which is printed onto the pad 2' by stencil printing. As shown in Figure 2, a scraper 70 prints the solder 3' onto the pad 2' through the stencil opening 200, and the shape of the solder 3' is consistent with the stencil opening 200. In the disclosed embodiment, the thickness of the stencil 80 is about 30 μm.

[0078] After the solder 3' is printed, the light-emitting element 42 is placed on the solder 3' by punching. The light-emitting element 42 is typically reflow-soldered to secure the solder leg 1' to the substrate 10 using the solder 3'. During a complete soldering process, the solder 3' undergoes preheating, holding, reflow soldering, and cooling. For example, the preheating stage prevents damage to the component due to rapid high-temperature heating, and the activity of the solder 3' is enhanced during this stage. The main purpose of the holding stage is to stabilize the temperature of each component within the reflow furnace to minimize temperature differences. This stage provides sufficient time for the temperature of larger components within the light-emitting substrate to converge with that of smaller components and ensures that the flux in the solder 3' is fully volatilized. During the reflow process, the temperature rises rapidly, causing the solder 3' to reach a molten state, thereby bonding the solder leg 1' to the pad 2'. Finally, during the cooling stage, the temperature is cooled below the solidus temperature, causing the solder 3' to solidify.

[0079] In an exemplary embodiment, the solder 3' can be solder paste, wherein the alloy solder powder in the solder paste has a particle size of 6-grade powder. Solder paste is a paste formed by mixing solder powder, flux, and other additives. Solder paste has a certain viscosity at room temperature, allowing it to initially bond electronic components to their intended locations. At the soldering temperature, as the solvent and some additives evaporate, the solder paste can bond the component to the printed circuit board pad 2', forming a permanent connection.

[0080] The inventors of the present disclosure have found that in an ideal state, the center of the light emitting element 42 and the center of the solder 3' coincide with each other without deviation. At this time, the gravity F exerted on the light emitting element 42 and the supporting force F exerted by the solder 3' on the light emitting element 42 are equal to each other.支 Balance, the chip 40 remains horizontal and parallel to the substrate 10, as shown in Figures 3B and 3C. When the solder 3' or the light emitting element 42 deviates, the gravity F exerted on the light emitting element 42 and the supporting force F exerted by the solder 3' on the light emitting element 42 are equal. 支 The angular momentum causes the light emitting element 42 to rotate. The gravity F component F1 of the rotated light emitting element 42 and the supporting force F of the solder 3' on the light emitting element 42 支 Balance, the weight F component F2 of the rotated light emitting element 42 and the friction F between the light emitting element 42 and the solder 3 ' 摩 Balance. At this time, the light-emitting element 42 is tilted and the force balance remains stable. Figures 3D and 3E are cross-sectional schematic diagrams of the matching arrangement of the solder foot 1' and the solder pad 2' of the light-emitting element 42 in the existing light-emitting substrate, wherein the solder 3' is offset and the light-emitting element 42 is tilted. Figures 3F and 3G are cross-sectional schematic diagrams of the matching arrangement of the solder foot 1' and the solder pad 2' of the light-emitting element 42 in the existing light-emitting substrate, wherein the light-emitting element 42 is offset and the light-emitting element 42 is tilted. Figure 3H is a physical picture of the light-emitting element 42 in the existing light-emitting substrate after tilting. Figure 3I is a light shape diagram of the light-emitting element 42 in the existing light-emitting substrate after tilting, wherein the protective glue can be a lens glue, and the light intensity angle of the lens glue is 0°. Figure 3J is a schematic diagram of the display effect of the light-emitting element 42 in the existing light-emitting substrate after tilting. It can be seen from Figures 3I and 3J that the side of the light-emitting element 42 facing the back is darker and the other side is brighter; when multiple light-emitting elements 42 are tilted to different degrees at the same time, the light-emitting angles of the light-emitting elements 42 will be different to varying degrees, resulting in different luminous intensities of the light-emitting elements 42 in the third direction Z perpendicular to the substrate 10, causing the light-emitting substrate to have uneven brightness or poor stripes in the backlight state.

[0081] FIG4A is a plan view showing the coordinated arrangement of the first solder leg 421 and the second solder leg 422 of the light emitting element 42 with the first solder pad 21 and the second solder pad 22 in the light emitting substrate in one embodiment of the present disclosure.

[0082] Figure 4B is a cross-sectional schematic diagram of the coordination arrangement of the first solder foot 421 and the second solder foot 422 of the light-emitting element 42 with the first solder pad 21 and the second solder pad 22 in the light-emitting substrate in an embodiment of the present disclosure, wherein the cross section is perpendicular to the substrate 10 and parallel to the first direction X.

[0083] FIG4C is a cross-sectional schematic diagram of the arrangement of the first solder leg 421 and the second solder leg 422 of the light-emitting element 42 in the light-emitting substrate in one embodiment of the present disclosure, in conjunction with the first solder pad 21 and the second solder pad 22. The cross section is perpendicular to the substrate 10 and parallel to the second direction Y. The second direction Y is perpendicular to the first direction X, and the planes containing the first and second directions X and Y are parallel to the substrate 10.

[0084] Figures 4D and 4E are schematic cross-sectional views of the arrangement of the first solder leg 421 and the second solder leg 422 of the light-emitting element 42 in conjunction with the first solder pad 21 and the second solder pad 22 in the light-emitting substrate in one embodiment of the present disclosure. The cross-section is perpendicular to the substrate 10 and parallel to the second direction Y. The second direction Y is perpendicular to the first direction X, and the planes containing the first and second directions X and Y are parallel to the substrate 10. The connection portion is offset.

[0085] Figures 4F and 4G are schematic cross-sectional views of the arrangement of the first solder leg 421 and the second solder leg 422 of the light-emitting element 42 in the light-emitting substrate in one embodiment of the present disclosure, in conjunction with the first solder pad 21 and the second solder pad 22. The cross-section is perpendicular to the substrate 10 and parallel to the second direction Y. The second direction Y is perpendicular to the first direction X, and the planes containing the first and second directions X and Y are parallel to the substrate 10. The light-emitting element 42 is offset.

[0086] 7A is a planar schematic diagram of the coordinated arrangement of the first solder leg 421 and the second solder leg 422 of the light emitting element 42 and the first solder pad 21 and the second solder pad 22 in the light emitting substrate in another embodiment of the present disclosure.

[0087] FIG7B is a cross-sectional view of the arrangement of the first solder leg 421 and the second solder leg 422 of the light-emitting element 42 in conjunction with the first solder pad 21 and the second solder pad 22 in a light-emitting substrate in another embodiment. The cross section is perpendicular to the substrate 10 and parallel to the second direction Y. The second direction Y is perpendicular to the first direction X, and the plane containing the first and second directions X and Y is parallel to the substrate 10.

[0088] Figure 7C is a cross-sectional diagram illustrating the arrangement of the first solder leg 421 and the second solder leg 422 of the light-emitting element 42 in conjunction with the first solder pad 21 and the second solder pad 22 in a light-emitting substrate in another embodiment. The cross section is perpendicular to the substrate 10 and parallel to the second direction Y. The second direction Y is perpendicular to the first direction X, and the planes containing the first and second directions X and Y are parallel to the substrate 10. The connection portion is offset.

[0089] Figure 7D is a cross-sectional diagram illustrating the arrangement of the first solder leg 421 and the second solder leg 422 of the light-emitting element 42 in conjunction with the first solder pad 21 and the second solder pad 22 in a light-emitting substrate in another embodiment. The cross section is perpendicular to the substrate 10 and parallel to the second direction Y. The second direction Y is perpendicular to the first direction X, and the planes containing the first and second directions X and Y are parallel to the substrate 10. The light-emitting element 42 is offset.

[0090] FIG8 is a plan view of the coordinated arrangement of the first solder leg 421 and the second solder leg 422 of the light-emitting element 42 and the first solder pad 21 and the second solder pad 22 in the light-emitting substrate in another embodiment of the present disclosure;

[0091] FIG9 is a plan view showing the coordinated arrangement of the first solder leg 421 and the second solder leg 422 of the light emitting element 42 and the first solder pad 21 and the second solder pad 22 in the light emitting substrate in another embodiment of the present disclosure.

[0092] Referring to Figures 4A to 4C, 7A, 7B, 8, and 9, a light-emitting substrate includes a substrate 10, a pad assembly, a light-emitting element 42, and a plurality of connecting portions. The substrate 10 may be, but is not limited to, a glass substrate, an aluminum substrate, a PCB substrate, a BT (bismaleimide triazine) substrate, or an FPC substrate.

[0093] In an exemplary embodiment, forming the pattern of the conductive layer 20 may include forming a conductive film on the substrate 10 and patterning the conductive film through a patterning process to form a conductive line layer pattern disposed on the substrate 10. The conductive line layer includes at least one pad group.

[0094] The pad group includes a first pad 21 and a second pad 22 . The first pad 21 and the second pad 22 are spaced apart along the first direction X and are symmetrical with respect to a center line OO′ between the first pad 21 and the second pad 22 .

[0095] The light-emitting element 42 is provided with a first solder foot 421 and a second solder foot 422, the orthographic projection of the first solder foot 421 on the substrate 10 at least partially overlaps with the orthographic projection of the first solder pad 21 on the substrate 10, and the orthographic projection of the second solder foot 422 on the substrate 10 at least partially overlaps with the orthographic projection of the second solder pad 22 on the substrate 10.

[0096] The light-emitting substrate further includes a reflective layer 30, which is disposed on a side of the pad group facing away from the substrate 10. The reflective layer 30 has an opening 100. The orthographic projections of the first pad 21 and the second pad 22 on the substrate 10 at least partially overlap with the orthographic projection of the opening 100 on the substrate 10. The orthographic projections of the first solder leg 421 and the second solder leg 422 on the substrate 10 at least partially overlap with the orthographic projection of the opening 100 on the substrate 10.

[0097] The design between the first solder pad 21, the second solder pad 22 and the first solder leg 421 and the second solder leg 422 satisfies the following requirements:

[0098] A=a+window opening tolerance+die bonding tolerance+design margin; B=2b+c+window opening tolerance+die bonding tolerance+0.02mm design margin.

[0099] Wherein, A is the dimension of the first solder pad 21 and the second solder pad 22 along the second direction Y; B is the dimension between the opposite sides of the first solder pad 21 and the second solder pad 22 along the first direction X; a is the dimension of the first solder leg 421 and the second solder leg 422 along the second direction Y; b is the dimension of the first solder leg 421 and the second solder leg 422 along the first direction X; c is the spacing between the first solder pad 21 and the second solder pad 22 along the first direction X; the window tolerance refers to the tolerance of the opening 100 of the reflective layer 30, and the window tolerance can be approximately 20μm to 40μm. In the embodiment of the present disclosure, the material of the reflective layer 30 can be white oil, and the window tolerance can be approximately 30μm. The die bonding tolerance can be approximately 20μm to 40μm. In the embodiment of the present disclosure, the die bonding tolerance can be approximately 30μm. The design margin can be approximately 10μm to 30μm. In the embodiment of the present disclosure, the design margin can be approximately 20μm.

[0100] In the embodiment of the present disclosure, c is also the spacing between the first solder leg 421 and the second solder leg 422 along the first direction X, and is the PN inter-electrode gap of the light-emitting element 42. One of the first solder leg 421 and the second solder leg 422 is electrically connected to the P electrode of the light-emitting element 42, and the other of the first solder leg 421 and the second solder leg 422 is electrically connected to the N electrode of the light-emitting element 42.

[0101] In an exemplary embodiment, the first solder leg 421 and the second solder leg 422 may both be made of a conductive material. For example, one of the first solder leg 421 and the second solder leg 422 may be made of a metal material, such as aluminum, and the other of the first solder leg 421 and the second solder leg 422 may be made of a conductive metal oxide, such as indium tin oxide (ITO).

[0102] The multiple connection portions include a first connection portion 91 and a second connection portion 92. The first connection portion 91 is disposed on a side of the first pad 21 away from the substrate 10 and is connected to the first solder leg 421. The second connection portion 92 is disposed on a side of the second pad 22 away from the substrate 10 and is connected to the second solder leg 422. The area of ​​the first connection portion 91 is approximately 30% to 80% of the area of ​​the first pad 21. The area of ​​the second connection portion 92 is approximately 30% to 80% of the area of ​​the second pad 22.

[0103] In an exemplary embodiment, the connection portion is solder 3'. For example, the connection portion may be solder paste, and a reflow process is used to connect the first solder leg 421 and the second solder leg 422 to the first solder pad 21 and the second solder pad 22, respectively. According to the characteristics of the connection portion, after being heated and liquefied, the connection portion will take on a paste-like state. The light-emitting element 42, the first solder leg 421, and the second solder leg 422 are squeezed by factors such as gravity. As a result, the cooled connection portion can secure the light-emitting element 42 at different tilt angles depending on the direction of the squeeze.

[0104] The number of one of the first connection parts 91 and the second connection parts 92 is at least one, and the number of the other is at least two. The multiple connection parts are not on the same straight line. In this way, at least three fulcrums are formed between the light-emitting element 42 and the first solder pad 21 and the second solder pad 22 through the first connection part 91 and the second connection part 92, and the at least three fulcrums formed are not on the same straight line, so that the gravity exerted on the light-emitting element 42, the first solder leg 421 and the second solder leg 422 and the supporting force provided to the light-emitting element 42 by the multiple connection parts can be balanced, ensuring that the light-emitting element 42 is horizontal and parallel to the substrate 10, avoiding the light-emitting element 42 from tilting, avoiding different degrees of differences in the light-emitting angle of the light-emitting element 42, and ensuring that the light-emitting element 42 has the same luminous intensity in the third direction Z perpendicular to the substrate 10, thereby avoiding the phenomenon of uneven brightness or bad stripes in the light-emitting substrate in the backlight state, thereby improving the uniformity of the picture.

[0105] In the design of mini light-emitting diode (Mini LED) products, the Mini LED is soldered to the substrate 10 via solder 3'. Solder 3' can be pre-applied to the Mini LED's foot 1' or applied to the pad 2' via printing. Due to the high cost of pre-applied solder 3' to the Mini LED's foot 1', stencil printing is currently commonly used to print the solder 3' onto the pad 2'. The Mini LED is then placed on the solder 3' using die bonding equipment. After reflow, the LED is bonded to the pad 2' via the solder 3', completing the Mini LED soldering. Due to limitations in solder 3' application precision and die bonding precision, the center of the Mini LED's foot 1' and the center of the solder 3' often become misaligned, causing the Mini LED to tilt due to gravity. This tilted Mini LED appears dark on one side and bright on the other, creating light and dark stripes on the backlight screen.

[0106] In the embodiment of the present disclosure, at least three supporting points are formed between the light-emitting element 42 and the first and second pads 21 and 22 via the first and second connecting parts 91 and 92. When the connecting parts are offset or the Mini LED is offset, at least three supporting points can still effectively support the Mini LED to keep it level. This eliminates the problem of poor tilting of the Mini LED from a design perspective, improves the light and dark stripes caused by the tilt of the Mini LED, and enhances the uniformity of the picture.

[0107] In an exemplary embodiment, referring to Figures 4A to 4G, 5, 6, 7A to 7D, 8, and 9, the first connecting portion 91 has a first vertex 911. The first vertex 911 is formed by the liquid first connecting portion 91 under tension. The maximum dimension of the first connecting portion 91 perpendicular to the substrate 10 is the distance from the first vertex 911 to the substrate 10 along the direction perpendicular to the substrate 10. The orthographic projection of the first vertex 911 on the substrate 10 is within the orthographic projection of the first solder leg 421 on the substrate 10. This ensures that when the first solder leg 421 is placed on the first connecting portion 91, it first contacts the highest point (first vertex 911) of the first connecting portion 91. Under the action of gravity, the liquid first connecting portion 91 is relatively evenly squeezed in a direction perpendicular to the substrate 10, forming a horizontal connection surface that conforms to the first solder leg 421. This increases the support area of ​​the first connecting portion 91 for the first solder leg 421, ensuring that the light-emitting element 42 is horizontal and parallel to the substrate 10.

[0108] In an exemplary embodiment, referring to Figures 4A to 4G, 5, 6, 7A to 7D, 8, and 9, a plurality of first connecting portions 91 are provided, which can increase the support area for the first solder leg 421 and improve support stability. Furthermore, the increased number of first connecting portions 91 ensures that, by distributing the plurality of first connecting portions 91 on the first solder pad 21, even if the light-emitting element 42 or the first connecting portion 91 deviates significantly, at least one first connecting portion 91 is still able to provide support for the first solder leg 421, thereby ensuring that the light-emitting element 42 is level.

[0109] The light-emitting element 42 is supported by both the first and second connecting portions 91, 92. When the orthographic projection of the center of gravity of the light-emitting element 42 on the substrate 10 lies within the space enclosed by the orthographic projections of the first and second connecting portions 91, 92 on the substrate 10, the light-emitting element 42 achieves force balance, ensuring that the light-emitting element 42 is level. The orthographic projections of the multiple first vertices 911 on the substrate 10 are mirror-symmetrical with respect to the orthographic projection of the first axis L1 of the first solder leg 421 on the substrate 10, with the first axis L1 being parallel to the first direction X. This increases the space enclosed by the orthographic projections of the first and second connecting portions 91, 92 on the substrate 10, thereby widening the range of displacement within which the light-emitting element 42 does not tilt.

[0110] In an exemplary embodiment, referring to Figures 7A to 7D , a plurality of first vertices 911 are arranged along the second direction Y, and the second direction Y is perpendicular to the first direction X. This can reduce the design difficulty of the distribution of the first connecting portions 91 when the dimension b1 of the first solder leg 421 along the first direction X is small. In addition, it can avoid excessive use of the first connecting portions 91 (the first connecting portions 91 arranged deviating from the second direction Y), reduce the use of solder 3', and thus reduce costs.

[0111] In the embodiment of the present disclosure, a dimension b1 of the first solder foot 421 along the first direction X is less than 100 μm.

[0112] The orthographic projections of the plurality of first vertices 911 on the substrate 10 are located on the orthographic projection of the second axis L2 of the first solder leg 421 on the substrate 10 , and the second axis L2 is parallel to the second direction Y. That is, a distance e1 between the orthographic projection of the first vertex 911 on the substrate 10 along the first direction X and the orthographic projection of the first solder leg 421 on the substrate 10 closer to the second solder leg 422 is 1 / 2b1.

[0113] The first solder leg 421 has first edges 4211 located on either side of the first axis L1. The distance between the orthographic projection of the second axis L2 on the substrate 10 and the orthographic projections of the two first edges 4211 on the substrate 10 is a1. The minimum distance between the orthographic projections of the plurality of first vertices 911 on the substrate 10 and the orthographic projections of the first edges 4211 on the substrate 10 is g1, where 0 < g1 < 1 / 4 a1. This ensures that the forward or reverse offset distance of the light-emitting element 42 along the second direction Y is less than 1 / 4 a1, and the first solder leg 421 can still be supported by all first connecting portions 91 disposed on the first solder pad 21. In the disclosed embodiment, there are two first connecting portions 91, located on either side of the first axis L1, and the spacing between the two first connecting portions 91 along the second direction Y is h = 1 / 2 a1. In this manner, after the solder 3' is printed, two first connecting portions 91 are provided on the same first solder pad 21, each having two first vertices 911. The first solder leg 421 is supported by the two first connecting portions 91. Within a range where the light-emitting element 42 is offset in the positive or negative direction along the second direction Y by less than 1 / 4a1, the light-emitting element 42 can be effectively supported, maintaining a balanced and horizontal state. It is understood that in other embodiments, the number of first connecting portions 91 can be three or more, and they can be provided along the second direction Y.

[0114] In an exemplary embodiment, referring to Figures 4A to 4E, 5, 6, 8, and 9, a plurality of first vertices 911 are staggered along the second direction Y, and adjacent first vertices 911 are relatively offset along the first direction X, with the second direction Y being perpendicular to the first direction X. This ensures a sufficient support area for the first solder leg 421 when the dimension b1 of the first solder leg 421 along the first direction X is large, thereby improving the support stability of the first solder leg 421 and ensuring balanced force on the light-emitting element 42, thereby maintaining a horizontal state.

[0115] In the embodiment of the present disclosure, the dimension b1 of the first solder foot 421 along the first direction X is greater than or equal to 100 μm;

[0116] The first weld foot 421 includes a first weld foot portion 4212 and a second weld foot portion 4213 located on both sides of the second axis L2 of the first weld foot 421. A portion of the orthographic projections of the multiple first vertices 911 on the substrate 10 is located within the range of the orthographic projections of the first weld foot portion 4212 on the substrate 10, and another portion of the orthographic projections of the multiple first vertices 911 on the substrate 10 is located within the range of the orthographic projections of the second weld foot portion 4213 on the substrate 10. In this way, the distribution of the first connecting portion 91 is more uniform, and the first weld foot portion 4212 and the second weld foot portion 4213 on both sides of the second axis L2 are supported, thereby ensuring the support stability of the first weld foot 421.

[0117] The first solder leg 421 has first edges 4211 located on either side of the first axis L1. The distance between the orthographic projection of the second axis L2 on the substrate 10 and the orthographic projections of the two first edges 4211 on the substrate 10 is a1. The minimum distance between the orthographic projections of the plurality of first vertices 911 on the substrate 10 and the orthographic projections of the first edges 4211 on the substrate 10 is g1, where 0 < g1 < 1 / 6 a1. This ensures that the positive or negative offset distance of the light-emitting element 42 along the second direction Y is less than 1 / 6 a1, and the first solder leg 421 can still be supported by all first connecting portions 91 disposed on the first solder pad 21. In the disclosed embodiment, there are three first connecting portions 91, and the three first vertices 911 are distributed in an isosceles triangle or an equilateral triangle and located on either side of the first axis L1, including one first vertex 911 located near the second solder pad 22, which is located on the first axis L1. That is, the distance f1 between the orthographic projection of the first vertex 911 on the substrate 10 along the second direction Y and the orthographic projection of the first edge 4211 on the substrate 10 is 1 / 2a1. The distance e1 between the orthographic projection of the first vertex 911 on the substrate 10 along the first direction X and the side of the orthographic projection of the first solder leg 421 on the substrate 10 closer to the second solder leg 422 is, where 0 < e1 < 1 / 2b1. The three first vertices 911 also include two first vertices 911 located away from the second solder pad 22. The minimum distance between the orthographic projections of the two first vertices 911 on the substrate 10 and the orthographic projection of the first edge 4211 on the substrate 10 is g1, where 0 < g1 < 1 / 6a1. The distance h1 between the orthographic projections of the two first vertices 911 on the substrate 10 along the first direction X and the side of the orthographic projection of the first solder leg 421 on the substrate 10 farther from the second solder leg 422 is, where 0 < h1 < 1 / 2b1. In this manner, after the solder 3' is printed, three first connection portions 91 arranged in an isosceles or equilateral triangle shape are provided on the same first solder pad 21, each having three first vertices 911. The first solder leg 421 is supported by the three first connection portions 91. Within a range where the light-emitting element 42 is offset in the forward or reverse direction along the second direction Y by less than 1 / 6a1, the first solder leg 421 can effectively support the light-emitting element 42, maintaining balance and a horizontal position. Furthermore, when the light-emitting element 42 is offset in the forward or reverse direction along the second direction Y by a greater distance, the first solder leg 421 is supported by two of the three first connection portions 91. When the orthographic projection of the center of gravity of the light-emitting element 42 on the substrate 10 lies within the space enclosed by the orthographic projections of the first and second connection portions 91 and 92 on the substrate 10, the light-emitting element 42 can still achieve force balance and maintain a horizontal position. For example, within a range where the light-emitting element 42 is offset in the forward or reverse direction along the second direction Y by less than 1 / 3a1, the first solder leg 421 is supported by two of the three first connection portions 91.

[0118] It can be understood that in other embodiments, the number of the first connection parts 91 can also be four or more.

[0119] In an exemplary embodiment, referring to Figures 4A to 4E, 5, and 6, the first solder fillets 421 have a dimension b1 greater than or equal to 100 μm and less than or equal to 200 μm along the first direction X, connecting adjacent first connecting portions 91. In the disclosed embodiment, the first connecting portions 91 are rectangular, and their dimensions along the first direction X and along the second direction Y are both greater than 55 μm.

[0120] In an exemplary embodiment, referring to Figures 8 and 9 , the dimension b1 of the first solder leg 421 along the first direction X is greater than 200 μm, and adjacent first connecting portions 91 are spaced apart. The multiple first connecting portions 91 are independent of each other, which further facilitates the printing of the solder 3 ′ and the mutual independence of the multiple first vertices 911. This is suitable for situations where the first solder leg 421 has a larger area.

[0121] The spacing distance k1 between adjacent first connection portions 91 along the first direction X and the second direction Y is greater than 80 μm to avoid printing restrictions.

[0122] In an exemplary embodiment, as shown in conjunction with Figures 4A to 4E , 5 , and 6 , the connection between adjacent first connecting portions 91 has a chamfer 300 . The chamfer 300 is recessed toward the connection to reduce the amount of solder 3' used. Furthermore, when the solder 3' reaches its melting point in the reflow oven, it changes from a solid state to a liquid state, expanding the original printed area and diffusing outward. The chamfer 300 provides space for the liquid solder 3' to diffuse, preventing it from diffusing beyond the first pad 21 and causing a short circuit.

[0123] In an exemplary embodiment, as shown in FIG9 , the first pad 21 includes a first main portion 211 and at least one first branch portion 212, wherein the first main portion 211 and the first branch portion 212 are connected. A portion of the orthographic projections of the plurality of first vertices 911 on the substrate 10 are located within the range of the orthographic projections of the first main portion 211 on the substrate 10, and another portion of the orthographic projections of the plurality of first vertices 911 on the substrate 10 are located within the range of the orthographic projections of the first branch portion 212 on the substrate 10. This allows both the first main portion 211 and the first branch portion 212 to be supported by the corresponding first connecting portion 91, enabling the design of first pads 21 with irregular structures (as opposed to first pads 21 with regular shapes) and ensuring the overall support stability of the first pad 21. Adjacent first connecting portions 91 can be connected or spaced apart, and the spacing k1 between adjacent first connecting portions 91 along the first direction X and the second direction Y is greater than 80 μm to avoid printing restrictions.

[0124] In an exemplary embodiment, referring to Figures 4A to 4G, 5, 6, 7A to 7D, 8, and 9, the second connecting portion 92 has a second vertex 921, which is formed by the liquid second connecting portion 92 under tension. The maximum dimension of the second connecting portion 92 perpendicular to the substrate 10 is the distance from the second vertex 921 to the substrate 10 along the direction perpendicular to the substrate 10. The orthographic projection of the second vertex 921 on the substrate 10 is within the orthographic projection of the second solder leg 422 on the substrate 10. This ensures that when the second solder leg 422 is placed on the second connecting portion 92, it first contacts the highest point (second vertex 921) of the second connecting portion 92. Under the action of gravity, the liquid second connecting portion 92 is relatively evenly squeezed in a direction perpendicular to the substrate 10, forming a horizontal connection surface that conforms to the second solder leg 422. This increases the support area of ​​the second connecting portion 92 for the second solder leg 422, ensuring that the light-emitting element 42 is horizontal and parallel to the substrate 10.

[0125] In an exemplary embodiment, referring to Figures 4A to 4G, 5, 6, 7A to 7D, 8, and 9, a plurality of second connecting portions 92 are provided, which can increase the support area for the second solder leg 422 and improve support stability. Furthermore, the increased number of second connecting portions 92 allows for the distribution of the plurality of second connecting portions 92 on the second solder pad 22, ensuring that even if the light-emitting element 42 or the second connecting portion 92 significantly deviates, at least one second connecting portion 92 is still able to provide support for the second solder leg 422, thereby ensuring that the light-emitting element 42 is level.

[0126] The light-emitting element 42 is supported by both the first and second connecting portions 91, 92. When the orthographic projection of the center of gravity of the light-emitting element 42 on the substrate 10 lies within the space enclosed by the orthographic projections of the first and second connecting portions 91, 92 on the substrate 10, the light-emitting element 42 achieves force balance, ensuring that the light-emitting element 42 is level. The orthographic projections of the multiple second vertices 921 on the substrate 10 are mirror-symmetrical with respect to the orthographic projection of the third axis L3 of the second solder leg 422 on the substrate 10, and the third axis L3 is parallel to the first direction X. This increases the space enclosed by the orthographic projections of the first and second connecting portions 91, 92 on the substrate 10, thereby widening the range of displacement within which the light-emitting element 42 does not tilt.

[0127] In an exemplary embodiment, referring to Figures 7A to 7D , a plurality of second vertices 921 are arranged along the second direction Y, and the second direction Y is perpendicular to the first direction X. This can reduce the difficulty of designing the distribution of the second connection portions 92 when the dimension b2 of the second solder legs 422 along the first direction X is small. In addition, it can avoid excessive use of the second connection portions 92 (the second connection portions 92 arranged deviating from the second direction Y), reduce the use of solder 3', and thus reduce costs.

[0128] In the embodiment of the present disclosure, a dimension b2 of the second solder foot 422 along the first direction X is less than 100 μm.

[0129] The orthographic projections of the plurality of second vertices 921 on the substrate 10 are located on the orthographic projection of the fourth axis L4 of the second solder leg 422 on the substrate 10, and the fourth axis L4 is parallel to the second direction Y. That is, a distance e2 between the orthographic projections of the second vertices 921 on the substrate 10 along the first direction X and the orthographic projection of the second solder leg 422 on the substrate 10 closer to the first solder leg 421 is 1 / 2b2.

[0130] The second solder leg 422 has second edges 4221 located on either side of the third axis L3. The distance between the orthographic projection of the fourth axis L4 on the substrate 10 and the orthographic projections of the two second edges 4221 on the substrate 10 is a2. The minimum distance between the orthographic projections of the plurality of second vertices 921 on the substrate 10 and the orthographic projections of the second edges 4221 on the substrate 10 is g2, where 0 < g2 < 1 / 4a2. This ensures that the forward or reverse offset distance of the light-emitting element 42 along the second direction Y is less than 1 / 4a2, and the second solder leg 422 can still be supported by all second connecting portions 92 disposed on the second solder pad 22. In the disclosed embodiment, there are two second connecting portions 92, located on either side of the third axis L3, and the spacing between the two second connecting portions 92 along the second direction Y is h = 1 / 2a2. In this manner, after the solder 3' is printed, two second connecting portions 92 are provided on the same second solder pad 22, each having two second vertices 921. The second solder leg 422 is supported by the two second connecting portions 92. Within a range where the light-emitting element 42 is offset in the positive or negative direction along the second direction Y by less than 1 / 4a2, the light-emitting element 42 can be effectively supported, maintaining a balanced and horizontal state. It is understood that in other embodiments, the number of second connecting portions 92 can be three or more, and they can be provided along the second direction Y.

[0131] In an exemplary embodiment, referring to Figures 4A to 4E, 5, 6, 8, and 9, a plurality of second vertices 921 are staggered along the second direction Y, and adjacent second vertices 921 are relatively offset along the first direction X, with the second direction Y being perpendicular to the first direction X. This ensures a sufficient support area for the second solder leg 422 when the dimension b2 of the second solder leg 422 along the first direction X is large, thereby improving the support stability of the second solder leg 422 and ensuring balanced force on the light-emitting element 42, thereby maintaining a horizontal state.

[0132] In the embodiment of the present disclosure, the dimension b2 of the second solder foot 422 along the first direction X is greater than or equal to 100 μm;

[0133] The second weld leg 422 includes a third weld leg portion 4222 and a fourth weld leg portion 4223 located on both sides of the fourth axis L4 of the second weld leg 422. A portion of the orthographic projections of the multiple second vertices 921 on the substrate 10 is located within the range of the orthographic projection of the third weld leg portion 4222 on the substrate 10, and another portion of the orthographic projections of the multiple second vertices 921 on the substrate 10 is located within the range of the orthographic projection of the fourth weld leg portion 4223 on the substrate 10. In this way, the distribution of the second connection portion 92 is more uniform, and the third weld leg portion 4222 and the fourth weld leg portion 4223 on both sides of the fourth axis L4 are supported, thereby ensuring the support stability of the second weld leg 422.

[0134] The second solder leg 422 has second edges 4221 located on either side of the third axis L3. The distance between the orthographic projection of the fourth axis L4 on the substrate 10 and the orthographic projections of the two second edges 4221 on the substrate 10 is a2. The minimum distance between the orthographic projections of the plurality of second vertices 921 on the substrate 10 and the orthographic projections of the second edges 4221 on the substrate 10 is g2, where 0 < g2 < 1 / 6 a2. This ensures that the forward or reverse offset distance of the light-emitting element 42 along the second direction Y is less than 1 / 6 a2, and the second solder leg 422 can still be supported by all second connecting portions 92 disposed on the second solder pad 22. In the disclosed embodiment, there are three second connecting portions 92, and the three second vertices 921 are arranged in an isosceles triangle or an equilateral triangle and located on either side of the third axis L3, including a second vertex 921 located near the first solder pad 21 and located on the third axis L3. That is, the distance f2 between the orthographic projection of the second vertex 921 on the substrate 10 along the second direction Y and the orthographic projection of the second edge 4221 on the substrate 10 is 1 / 2a2. The distance between the orthographic projection of the second vertex 921 on the substrate 10 along the first direction X and the orthographic projection of the second solder leg 422 on the substrate 10 closer to the first solder leg 421 is e2, where 0 < e2 < 1 / 2b2. The three second vertices 921 also include two second vertices 921 located farther from the first solder pad 21. The minimum distance between the orthographic projections of the two second vertices 921 on the substrate 10 and the orthographic projection of the second edge 4221 on the substrate 10 is g2, where 0 < g2 < 1 / 6a2. The distance between the orthographic projections of the two second vertices 921 on the substrate 10 along the first direction X and the orthographic projection of the second solder leg 422 on the substrate 10 farther from the first solder leg 421 is h2, where 0 < h2 < 1 / 2b2. In this manner, after the solder 3' is printed, three second connection portions 92 arranged in an isosceles or equilateral triangle pattern are provided on the same second solder pad 22, each having three second vertices 921. The second solder leg 422 is supported by the three second connection portions 92. Within a range where the light-emitting element 42 is offset in the forward or reverse direction along the second direction Y by less than 1 / 6a2, the light-emitting element 42 can be effectively supported, maintaining balance and a horizontal position. Furthermore, when the light-emitting element 42 is offset in the forward or reverse direction along the second direction Y by a greater distance, the second solder leg 422 is supported by two of the three second connection portions 92. When the orthographic projection of the center of gravity of the light-emitting element 42 on the substrate 10 lies within the space enclosed by the orthographic projections of the first and second connection portions 91, 92 on the substrate 10, the light-emitting element 42 can still achieve force balance and maintain a horizontal position. For example, within a range where the light-emitting element 42 is offset in the forward or reverse direction along the second direction Y by less than 1 / 3a2, the light-emitting element 42 can still maintain a horizontal position.

[0135] It can be understood that in other embodiments, the number of the second connection parts 92 can also be four or more.

[0136] In an exemplary embodiment, referring to Figures 4A to 4E, 5, and 6, the second solder fillets 422 have a dimension b2 along the first direction X that is greater than or equal to 100 μm and less than or equal to 200 μm, connecting adjacent second connecting portions 92. In the disclosed embodiment, the second connecting portions 92 are rectangular, and their dimensions along the first direction X and along the second direction Y are both greater than 55 μm.

[0137] In an exemplary embodiment, referring to Figures 8 and 9 , the dimension b2 of the second solder leg 422 along the first direction X is greater than 200 μm, and adjacent second connecting portions 92 are spaced apart. The plurality of second connecting portions 92 are independent of each other, which further facilitates the printing of the solder 3 ′ and the independence of the plurality of second vertices 921 . This is suitable for situations where the second solder leg 422 has a larger area.

[0138] The spacing distance k2 between adjacent second connection portions 92 along the first direction X and the second direction Y is greater than 80 μm to avoid printing restrictions.

[0139] In an exemplary embodiment, as shown in conjunction with Figures 4A to 4E , 5 , and 6 , the connection between adjacent second connecting portions 92 has a chamfer 300 . The chamfer 300 is recessed toward the connection to reduce the amount of solder 3' used. Furthermore, when the solder 3' reaches its melting point in the reflow oven, it changes from a solid state to a liquid state, expanding the original printed area and diffusing outward. The chamfer 300 provides space for the liquid solder 3' to diffuse, preventing it from diffusing beyond the second pad 22 and causing a short circuit.

[0140] In an exemplary embodiment, as shown in FIG9 , the second pad 22 includes a second main portion 221 and at least one second branch portion 222, with the second main portion 221 and the second branch portion 222 being connected. A portion of the orthographic projections of the plurality of second vertices 921 on the substrate 10 are located within the orthographic projection of the second main portion 221 on the substrate 10, while another portion of the orthographic projections of the plurality of second vertices 921 on the substrate 10 are located within the orthographic projection of the second branch portion 222 on the substrate 10. This allows both the second main portion 221 and the second branch portion 222 to be supported by their corresponding second connecting portions 92, enabling the design of second pads 22 with irregular structures (currently, second pads 22 with regular shapes) and ensuring overall support stability for the second pad 22. Adjacent second connecting portions 92 can be connected or spaced apart, and the spacing k2 between adjacent second connecting portions 92 along the first direction X and the second direction Y is greater than 80 μm to avoid printing restrictions.

[0141] In an exemplary embodiment, referring to FIG. 4A to FIG. 4C , FIG. 7A , FIG. 7B , FIG. 8 and FIG. 9 , the orthographic projection of the connecting portion on the substrate 10 is one or more of a circle, an ellipse and a polygon.

[0142] The first solder pad 21 and the second solder pad 22 are mirror-symmetrical about the center line OO', so that the structure and size of the first solder pad 21 and the second solder pad 22 are the same. The first solder leg 421 and the second solder leg 422 are mirror-symmetrical about the center line OO', so that the structure and size of the first solder leg 421 and the second solder leg 422 are the same.

[0143] The first connecting portion 91 and the second connecting portion 92 are identical in number and are both plural. The multiple first connecting portions 91 and the multiple second connecting portions 92 are mirror-symmetrical about the centerline OO', such that the first connecting portions 91 and the second connecting portions 92 have the same structure and dimensions, and the multiple first connecting portions 91 and the multiple second connecting portions 92 are also distributed in the same manner. The first axis L1 and the first axis L2 are collinear. The second axis L2 and the fourth axis L4 are parallel to each other.

[0144] It can be understood that in other embodiments, the structures and dimensions of the first and second solder legs 421, 422 may differ, and the structures, dimensions, and distribution of the first and second connecting portions 91, 92 may be designed based on the specific structures and dimensions of the first and second solder legs 421, 422. For example, if the dimension b1 of the first solder leg 421 along the first direction X is greater than or equal to 100 μm and less than or equal to 200 μm, then there are three first connecting portions 91 distributed in an isosceles or equilateral triangle configuration, with adjacent first connecting portions 91 connected. If the dimension b2 of the second solder leg 422 along the first direction X is less than 100 μm, then there are two second connecting portions 92 located on either side of the third axis L3, with adjacent second connecting portions 92 connected. In this way, corresponding printed connecting portion topologies can be designed for different solder leg structures and dimensions, ensuring force balance and preventing tilting of the Mini LED, thereby improving optical image uniformity, reducing repairs for tilted Mini LEDs, and increasing product yield.

[0145] In an exemplary embodiment, referring to Figures 4A, 5, 6, and 8, the orthographic projection of at least one of the plurality of first connection portions 91 onto the substrate 10 is outside the range of the orthographic projection of the first solder leg 421 onto the substrate 10. The orthographic projection of at least one of the plurality of second connection portions 92 onto the substrate 10 is outside the range of the orthographic projection of the second solder leg 422 onto the substrate 10. This allows at least one first connection portion 91 to be connected to the circumferential outer side of the first solder leg 421, and at least one second connection portion 92 to be connected to the circumferential outer side of the second solder leg 422. This arrangement allows the light-emitting element 42 to be limited in position when subjected to a tangential force parallel to the substrate 10, thereby improving the light-emitting element 42's ability to resist tangential forces.

[0146] In an exemplary embodiment, referring to Figures 4A, 5, 6, 7A, 8, and 9, first vertices 911 are formed by tension of the liquid first connection portion 91, and second vertices 921 are formed by tension of the liquid second connection portion 92. The orthographic projections of the plurality of first connection portions 91 and the plurality of second connection portions 92 on the substrate 10 are all the same area. Given the same volume of the first connection portions 91 and the second connection portions 92, each first vertex 911 and each second vertex 921 can be the same distance from the substrate 10 in a direction perpendicular to the substrate 10. This can further improve the parallelism of the light-emitting element 42 relative to the substrate 10 while providing support for the light-emitting element 42, further enhancing image uniformity.

[0147] The present disclosure also provides a display device, including the light-emitting substrate of the aforementioned embodiment. The display device can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0148] While the embodiments disclosed herein are as described above, it should be noted that the embodiments described above are merely illustrative and not restrictive. Therefore, the present disclosure is not limited to what is specifically shown and described herein. Various modifications, substitutions, or omissions may be made to the forms and details of the embodiments without departing from the scope of the present disclosure.

Claims

1. A light-emitting substrate, comprising: substrate; A pad group is provided on the substrate, the pad group includes a first pad and a second pad, the first pad and the second pad are spaced apart along a first direction and are symmetrical with respect to a center line between the first pad and the second pad; A light-emitting element is provided with a first solder leg and a second solder leg, wherein the orthographic projection of the first solder leg on the substrate at least partially overlaps with the orthographic projection of the first solder pad on the substrate, and the orthographic projection of the second solder leg on the substrate at least partially overlaps with the orthographic projection of the second solder pad on the substrate; and a plurality of connecting portions, including a first connecting portion and a second connecting portion; The first connection portion is provided on a side of the first pad away from the substrate and connected to the first solder leg. The second connection portion is provided on a side of the second pad away from the substrate and connected to the second solder leg. The number of one of the first connection portion and the second connection portion is at least one, and the number of the other is at least two. The plurality of connecting portions are not located on the same straight line.

2. The light-emitting substrate according to claim 1, wherein The first connecting portion has a first vertex, the maximum dimension of the first connecting portion in a direction perpendicular to the substrate is the distance from the first vertex to the substrate along the direction perpendicular to the substrate, and the orthographic projection of the first vertex on the substrate is within the range of the orthographic projection of the first solder foot on the substrate.

3. The light-emitting substrate according to claim 2, wherein There are multiple first connection parts, and the orthographic projections of the multiple first vertices on the substrate are mirror-symmetrical with respect to the orthographic projection of the first axis of the first solder foot on the substrate, and the first axis is parallel to the first direction.

4. The light-emitting substrate according to claim 3, wherein The plurality of first vertices are arranged along a second direction, and the second direction is perpendicular to the first direction.

5. The light-emitting substrate according to claim 4, wherein The dimension of the first solder leg along the first direction is less than 100 μm; The orthographic projections of the plurality of first vertices on the substrate are located on the orthographic projection of the second axis of the first solder foot on the substrate, and the second axis is parallel to the second direction; The first solder foot has first edges located on both sides of the first axis, the distance between the orthographic projection of the second axis on the substrate and the orthographic projection of the two first edges on the substrate is a1, and the minimum distance between the orthographic projection of multiple first vertices on the substrate and the orthographic projection of the first edge on the substrate is g1, where 0<g1<1 / 4a1. The light-emitting substrate according to claim 3 , wherein: The plurality of first vertices are staggered along a second direction, and adjacent first vertices are relatively offset along the first direction, and the second direction is perpendicular to the first direction.

7. The light-emitting substrate according to claim 6, wherein The number of the first connecting portions is three, and the three first vertices are distributed in an isosceles triangle or an equilateral triangle and are located on both sides of the first axis.

8. The light-emitting substrate according to claim 6, wherein The dimension of the first solder foot along the first direction is greater than or equal to 100 μm; The first welding foot comprises a first welding foot portion and a second welding foot portion located on both sides of the second axis of the first welding foot. A portion of the orthographic projections of the plurality of first vertices on the substrate are located within the range of the orthographic projection of the first solder foot on the substrate, and another portion of the orthographic projections of the plurality of first vertices on the substrate are located within the range of the orthographic projection of the second solder foot on the substrate; The first solder foot has first edges located on both sides of the first axis, the distance between the orthographic projection of the second axis on the substrate and the orthographic projection of the two first edges on the substrate is a1, and the minimum distance between the orthographic projection of multiple first vertices on the substrate and the orthographic projection of the first edge on the substrate is g1, where 0<g1<1 / 6a1.

9. The light-emitting substrate according to claim 8, wherein The size of the first solder legs along the first direction is greater than or equal to 100 μm and less than or equal to 200 μm, and adjacent first connecting portions are connected.

10. The light emitting substrate according to claim 8, wherein The size of the first solder foot along the first direction is greater than 200 μm, adjacent first connecting portions are spaced apart, and the spacing distances between adjacent first connecting portions along the first direction and the second direction are both greater than 80 μm.

11. The light-emitting substrate according to claim 8, wherein The connection between adjacent first connection parts has a chamfer.

12. The light-emitting substrate according to claim 8, wherein The first pad includes a first main portion and at least one first branch portion, wherein the first main portion and the first branch portion are connected; A portion of the orthographic projections of the multiple first vertices on the substrate is located within the range of the orthographic projection of the first main body on the substrate, and another portion of the orthographic projections of the multiple first vertices on the substrate is located within the range of the orthographic projection of the first branch on the substrate.

13. The light emitting substrate according to any one of claims 3 to 12, wherein: The plurality of first connection portions and the plurality of second connection portions are mirror-symmetrical with respect to the center line. The light-emitting substrate according to claim 13 , wherein: A portion of an orthographic projection of at least one of the plurality of first connecting portions on the substrate is located outside a range of an orthographic projection of the first solder foot on the substrate; A portion of an orthographic projection of at least one of the plurality of second connection portions on the substrate is located outside a range of an orthographic projection of the second solder foot on the substrate.

15. The light-emitting substrate according to claim 13, wherein The orthographic projection areas of the plurality of first connection portions and the plurality of second connection portions on the substrate are the same.

16. The light-emitting substrate according to claim 1, wherein The orthographic projections of the plurality of connection portions on the substrate are one or more of a circle, an ellipse, and a polygon.

17. The light-emitting substrate according to claim 1, wherein The light-emitting substrate further includes a reflective layer, which is disposed on a side of the pad group facing away from the substrate, the reflective layer having an opening, and the orthographic projections of the first pad and the second pad on the substrate at least partially overlap with the orthographic projections of the opening on the substrate; The orthographic projections of the first solder foot and the second solder foot on the substrate at least partially overlap with the orthographic projection of the opening on the substrate.

18. A display device comprising: The light-emitting substrate according to any one of claims 1 to 17.

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