Shielded cable solution for miniaturized cables

Abstract

Disclosed herein is a miniaturized shielded cable comprising a shield layer with an improved robustness and flexibility.

Description

[0001] Shielded cable solution for miniaturized cables

[0002] The invention relates to a miniaturized shielded cable with an improve robustness and flexibility.

[0003] Background

[0004] Electrical cable that has an additional conductive layer around the tube containing the inner conducting wires. The additional conductive layer provides for electromagnetic shielding, and such cables are thus often referred to as shielded cables. The shield layer acts as a Faraday cage by being a surface, which reflects electromagnetic radiation. The shield layer thereby reduces the interference from outside noise onto the signals being transferred through the inner conducting wires, and reduces the radiating out from the signals being transferred through the inner conducting wires, which may disturb other devices in its vicinity.

[0005] Known types of cable shielding suitable for use as the additional conductive layer includes foil shielding, where often a metallised film is used as the shield layer, spiralling wire strands shielding, where a braided shield layer is positioned around the tube containing the inner conducting wires, and spiral tape shielding, where a tape layer is wound around the tube containing the inner conducting wires with overlapping parts along the spiral.

[0006] When working with the braided shielding cables, multiple layers of braided material is often needed in order to obtain a shielding layer, which fully covers the tube containing the inner conducting wires. However, adding additional braided layers increases the thickness of the cable thereby reducing the flexibility of the cable. This is an unwanted effect when working with miniaturized shielded cables, which often have a thickness below 2 mm.

[0007] Spiral tape shielding can be used as a thinner alternative to braided shielding. However, often the tape is wound tightly around the tube containing the inner conducting wires in order to obtain a thin and close-fitting construction. This has the unfortunate effect that it limits the flexibility of the electrical cable. The foil shielding may be used as an alternative to the spiral tape shielding and often ensures an improved flexibility of the electrical cable compared to a tightly wound spiral tape shielding.

[0008] However, common for the known types of shielding is over time, a constant bending of the cable, introduces cracks in the shielding layer, which results in breakage points along the electrical cable. There is therefore a need for an improved type of shielding, which maintains cable flexibility at the same time as it ensures a high degree of cable stability. Summary

[0009] Disclosed herein in a first aspect is a miniaturized shielded cable comprising:

[0010] • an inner non-conducting insulation tube containing a number of inner wires;

[0011] • the plurality of inner wires extending inside the inner non-conducting insulation tube;

[0012] • an outer non-conducting jacket having a maximum outer diameter being at the most 2 mm; and

[0013] • a shield layer positioned between the inner non-conducting insulation tube and the outer non-conducting jacket.

[0014] The shield layer is a conductive layer comprising a multiple of overlapping sub-layers comprising nanoscale or microscale structures.

[0015] Disclosed herein in a second aspect is a method for producing a miniaturized shielded cable. The miniaturized shielded cable comprises:

[0016] • an inner non-conducting insulation tube containing a number of inner wires, wherein the plurality of inner wires is extending inside the inner non-conducting insulation tube;

[0017] • an outer non-conducting jacket having a maximum outer diameter being at the most 2 mm; and

[0018] • a shield layer positioned between the inner non-conducting insulation tube and the outer non-conducting jacket, the shield layer being a conductive layer comprising a multiple of overlapping sub-layers comprising nanoscale or microscale structures.

[0019] The method of the second aspect comprises the steps of: o proving the inner non-conducting insulation tube containing the number of inner wires; o applying a liquid layer of shield layer material onto the inner non-conducting insulation tube; o curing the liquid layer of shield layer material around the inner non-conducting insulation tube thereby obtaining a cured shield layer; o applying a liquid outer non-conducting layer around the cured shield layer; o curing the liquid outer non-conducting layer thereby obtaining the miniaturized shielded cable with the outer non-conducting jacket.

[0020] By the miniaturized shielded cable according to the above, an improved cable is obtained displaying an increased robustness and flexibility compared to known shield cables. Previously known problems with too thick cables as a consequence of aiming for a shield with an even coverage, tape shields wound either too tightly around the tube containing the inner conducting wires thereby limiting the flexibility of the electrical cable, or foil experiencing breakage points along the electrical cable is therefore greatly reduced if not prevented completely. The use of the conductive layer comprising a multiple of overlapping sub-layers comprising nanoscale or microscale structures further provides for an improved Faraday cage effect by the shield layer, since the sub-layers comprising nanoscale or microscale structures provides a shield capable of shield protection up to much higher frequencies than the known types of cable shielding including metallised film shielding, spiralling wire strands shielding, and spiral tape shielding.

[0021] The shield layer may form a stretchable conducting material. In one or more examples, the stretchable conducting material may be stretched by more than 50%, such as more than 100%, such as more than 200% without breaking.

[0022] The shield layer is made from a conductive material. As conducting material forming the nanoscale / microscale structures shield layer, conducting materials such as metals or carbonbased materials are normally used. The conducting nanoscale / microscale structures shield layer may in an example be silver-based structures. By silver-based in meant that the majority of the material is silver. Liquid carriers, such as organic solvents, may be use when applying the conductive material in a liquid form to the inner tube. Conducting flakes comprising silver may be in the form of ACI SE1109 silver from ACI materials. Thus, in one or more examples, the shield layer is a silver-based stretchable conducting material.

[0023] As an alternative to a silver-based shield layer material, a conductive material based on copper, gold, aluminium, graphene or graphite may be used for the nanoscale / microscale structures shield layer. Further, combinations of these material may also be used. Examples of conducting materials comprising more than one metal include CuAg, and copper cladded aluminium. Thus, in one or more examples, the shield layer comprises one or more of the following materials:

[0024] • silver (Ag);

[0025] • copper (Cu);

[0026] • aluminium (Al);

[0027] • gold (Au)

[0028] • graphene;

[0029] • graphite.

[0030] In one or more examples, the nanoscale or microscale structures in the shield layer each has an average length and / or an average width of 3 nm - 30 pm, such as 3 nm - 3 pm, such as 3 nm - 1 pm, such as 3-800 nm, such as 5-750 nm, such as 10-500 nm, such as 30-200 nm. The nanoscale or microscale structures may be nanoparticles, such as nanowlres. Also, the nanoscale or microscale structures In the shield layer may be flakes, the nanoscale or microscale structures thereby forming a flake-structured layer comprising a multiple of conducting flakes arranged in an overlapping manner in the multiple of sub-layers. The conducting flakes may each have an average thickness being less than 10% of the average length and / or average width of the nanoscale or microscale structures being flake structures.

[0031] In the context of the present invention, nano- or microscale is to be construed as structures having dimensions in the range 1nm up to 100 pm.

[0032] In an advantageous embodiment, the nanoscale or microscale structures are nanoparticles.

[0033] In another advantageous embodiment the nanoscale or microscale structures are nanowlres.

[0034] In one or more examples, the inner non-conducting insulation tube is a polymer-based tube comprising one or more polymers selected from the list of:

[0035] • Polyethylene (PE);

[0036] • Cross-linked polyethylene (PEX);

[0037] • Chlorinated polyethylene (CPE);

[0038] • Polyvinylchloride (PVC);

[0039] • Polyurethane (PUR);

[0040] • Ethylene propylene rubber (EPR);

[0041] • Neoprene;

[0042] • Polyamide (PA);

[0043] • Polyether block amide (PEBA).

[0044] The choice of polymer may depend on requirements to flexibility of the shielded cable or requirements to the production of the same.

[0045] In one or more examples, the inner non-conducting insulation tube has an outer inner tube diameter being between 0,1-1 , 5 mm, such as between 0,2-1 ,3 mm, such as between 0,4-1 ,0 mm, such as between 0,5-0, 8 mm. The outer inner tube diameter will also be smaller than the diameter of the outer jacket and the shield layer, as the inner tube is positioned inside those tube layers. In one or more examples, the inner non-conducting insulation tube has an inner tube thickness being between 0,1-0, 7 mm, such as between 0,2-0, 6 mm, such as between 0,3-0, 5 mm, such as between 0, 3-0,4 mm.

[0046] In one or more examples, the shield layer is coated onto inner non-conducting insulation tube.

[0047] In one or more examples, the shield layer has an outer shield layer diameter being between 0,3-1 , 8 mm, such as between 0,4-1 ,3 mm, such as between 0,5-1 ,0 mm, such as between 0,6-0, 8 mm.

[0048] The shield layer is normally a rather thin layer. In one or more examples, the shield layer has a shield layer thickness being between 0,01-0,15 mm, such as between 0,02-0,14 mm, such as between 0,02-0,13 mm, such as between 0,02-0,12 mm, such as between 0,02-0,10 mm, such as between 0,02-0,09 mm, such as between 0,02-0,08 mm, such as between 0,02-0,07 mm, such as between 0,03-0,06 mm, such as between 0,04-0,05 mm.

[0049] The shield layer may in a preferred embodiment be made from a composite material comprising a plurality of overlapping nano- or microscale structures made from an electrically conductive material nested in a flexible polymer matrix. By nano- or microscale is meant structures having dimensions in the range 1nm up to 100 pm.

[0050] Examples of a flexible polymer material includes dimethylsuccinate, silicone and natural rubber. By use of any such material, a flexible yet conductive layer is achieved. Therefore, the cable can undergo multiple bending cycles or similar deformation processes without breaking or losing conductivity due to remodelling of the materials structure, such as deformation hardening or microcrack propagation.

[0051] Preferably the polymer material has a glass transition temperature below ambient temperature, so that the nano- or microscale structures can easily move within the matrix without breaking. This enhances the above-mentioned benefits of the material, since intermolecular forces will then act to reestablish the electrical contact between the nano- or microscale structures within the matrix.

[0052] In one or more examples, the outer non-conducting jacket has an outer jacket diameter being between 0, 5-2,0 mm, such as between 0,6-1 ,7 mm, such as between 0,7-1 ,5 mm, such as between 0,8-1 ,2 mm, such as between 0, 9-1 ,1 mm. The cable is preferably between 35-65 mm in length when used with a hearing aid and has a diameter of up to 3 mm, preferably less than 2 mm. The cable is however manufactured in much longer lengths that are later cut to fit the intended application, such as a hearing aid. Longer and shorter lengths than the preferred length of 35-65 mm, are therefore highly plausible without modifying the invention, such as between 10-2000mm, such as 20-1900 mm, such as 25-1800 mm, such as 30-1700 mm. Such as 35-1600 mm, such as 40-1500 mm, such as 45-1400 mm, such as 50-1300 mm, such as 55-1200 mm, such as 60-1100 mm, such as 65-1000 mm, such as 70-900 mm, such as 75-800 mm, such as 80-700 mm, such as 85-600 mm, such as 90-550 mm, such as 100-500 mm, such as 110-450 mm, such as 120-400 mm, such as 130-350 mm, such as 140-300 mm, such as 150-250 mm, such as 160-200 mm.

[0053] Thus, it should be appreciated by those skilled in the art, that the conception and specific embodiments disclosed may be readily utilized as a basis for modifying or designing other lengths or diameters of such cable, for carrying out the same purposes of the present invention. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the teaching of the following description nor the scope of the invention, as set forth in the appended claims. Examples of different use cases where a longer or shorter cable is used includes in-ear monitors. For this application the cable must at least be long enough to reach from a sound source in the user’s pocket and to the ear, or from a stationary sound source. When used with a stationary sound source the cable must be long enough to allow relatively unrestricted movement of the user relative to the stationary sound source. Short cables may be used for wireless in-ear headphones, where the cable is used for connecting different components inside the headphones.

[0054] In one or more examples, the outer non-conducting jacket is a polymer-based jacket comprising one or more polymers selected from the list of:

[0055] • Polyethylene (PE);

[0056] • Cross-linked polyethylene (PEX);

[0057] • Chlorinated polyethylene (CPE);

[0058] • Polyvinylchloride (PVC);

[0059] • Polyurethane (PUR);

[0060] • Ethylene propylene rubber (EPR);

[0061] • Neoprene;

[0062] • Polyamide (PA);

[0063] • Polyether block amide (PEBA). In one or more examples, the miniaturized shielded cable further comprises a lacquer layer positioned on an outer surface of the shield layer between the shield layer and the outer nonconducting jacket for protection of the shield layer. The thin lacquer layer may be found around the shield layer for protecting the shield layer such that the outer jacket can be easily removed without harming the shield layer.

[0064] In one or more examples, the miniaturized shielded cable further comprises one or more fibres contained inside the inner non-conducting insulation tube. The one or more fibres is normally providing structural stability to the miniaturized shielded cable. The one or more fibres may also ensure an improved pull strain of the miniaturized shielded cable in the longitudinal direction.

[0065] The one or more fibres may be included when it is necessary to increase the cable’s ability to withstand tensile stress. Conversely the fibre is omitted in cases where the cable is only intended to sustain minor tensile stresses, as it may make the handling of the cable more difficult

[0066] In one or more examples, the miniaturized shielded cable comprises a first end and a second end between which the miniaturized shielded cable is extending, wherein the miniaturized shielded cable is terminated at the first end and / or at the second end by means of conducting glue, or a soldering material, or similar.

[0067] In one or more examples, the miniaturized shielded cable at the first end and / or at the second end further comprises:

[0068] • a conducting spring part electrically connected to the shield layer and

[0069] • an outer conductive bushing positioned around and connected to the spring part, wherein the outer conductive bushing is configured for providing electrical connection of the shield layer to a receivable part, such as e.g. a print circuit board.

[0070] The conducting spring part may comprise a ring part from where a number of flexible fingers extend, wherein the flexible fingers provide an electrical connection to the shield layer and the ring part provides an electrical connection to the outer conductive bushing.

[0071] As an alternative to the above termination construction using a conducting spring part and an outer conductive bushing, a conductive layer may be used for adhering the shield layer directly to e.g. a print circuit board. It is an additional advantage of the invention that the cable may be thermoformed to retain a desired shape, such as a coil or a shape fitting a contour of an ear, so as to improve the ergonomics of the cable and / or a device used with the cable. The cable may also be thermoformed to shapes like a coil, that allows long length of cables to be conveniently handled like a shorter length of cable unless actively stretched.

[0072] In a third aspect of the invention, the cable according to the first aspect or a cable manufactured according to the second aspect is part of a device, such as audiological equipment, such as receiver in canal hearing aids, receiver in ear hearing aid, behind the ear hearing aids, in-ear monitors, and in-ear headphones, including wireless variants of these, such as in ear headphones for consumer use.

[0073] For hearing aids, the cable is used for connecting the body of the hearing aid which may comprise the power source, processors and possibly the microphone with the receiver which comprises at least the speaker.

[0074] For in-ear monitors and in-ear headphones, the cable is used for connecting the device to an external sound source, possibly with intermediary equipment such as an amplifier in between the device and the sound source. The sound source may either be for relaying prerecorded sound or for live transmitted sound. These types of devices may include a pair, or a single speaker placed in the ear of a user.

[0075] In a fourth aspect, the present invention relates to a hearing aid comprising the cable according to the first aspect of the invention.

[0076] Such hearing aid may be comprised of a body and a receiver being connected by the miniaturized shielded cable with the body comprising at least a power source, and the receiver comprising at least a speaker of the hearing aid.

[0077] In a fifth aspect, the present invention relates to an in-ear monitor or in-ear headphone comprising the miniaturized shielded cable according to the first aspect of the invention.

[0078] The cable may be adapted for connecting the in-ear monitor or in-ear headphones to an external sound source for relaying prerecorded and / or live transmitted sound.

[0079] In a sixth aspect, the present invention relates to use of the cable according to the first aspect of the invention, for providing a hearing aid or in ear monitor. In a seventh aspect, the present invention relates to a method of alleviating hearing loss, by providing the hearing aid according to the fourth aspect of the invention, to a user. It is to be understood, that such method may further comprise the steps of aiding the user in use of the hearing aid, tuning the hearing aid to the specific user etc.

[0080] In an eighth aspect, the present invention relates to use of the cable according to the first aspect of the invention for connecting an in-ear monitor and / or headphones to an external sound source.

[0081] It is to be understood, that any of the first, second, third, fourth, fifth, sixth, seventh and eighth aspect may be combined.

[0082] Brief description of the drawings

[0083] Various examples are described hereinafter with reference to the figures. Like reference numerals refer to like elements throughout. Like elements will, thus, not be described in detail with respect to the description of each figure. It should also be noted that the figures are only intended to facilitate the description of the examples. They are not intended as an exhaustive description of the claimed invention or as a limitation on the scope of the claimed invention. In addition, an illustrated example needs not have all the aspects or advantages shown. An aspect or an advantage described in conjunction with a particular example is not necessarily limited to that example and can be practiced in any other examples even if not so illustrated, or if not so explicitly described.

[0084] Figures 1A-B show a miniaturized shielded cable from two different directions with figure 1A being a partly cut-out side view and figure 1 B being a cut-through view showing the layers in the miniaturized shielded cable.

[0085] Figure 2 shows an illustration of the flake structure of the shield layer.

[0086] Figure 3 shows bending test results.

[0087] Figures 4A-D show a first example of a termination of a miniaturized shielded cable at a first end.

[0088] Figures 4E-F show a second example of a termination of a miniaturized shielded cable at a first end. Figure 5 illustrates a method for producing a miniaturized shielded cable.

[0089] Description of examples

[0090] Exemplary examples will now be described more fully hereinafter with reference to the accompanying drawings. In this regard, the present examples may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the examples are merely described below, by referring to the figures, to explain aspects. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of," when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.

[0091] In the drawings, thicknesses of a plurality of layers and areas are illustrated in an enlarged manner for clarity and ease of description thereof. When a layer, area, element, or plate is referred to as being “on” another layer, area, element, or plate, it may be directly on the other layer, area, element, or plate, or intervening layers, areas, elements, or plates may be present therebetween. Conversely, when a layer, area, element, or plate is referred to as being “directly on” another layer, area, element, or plate, there are no intervening layers, areas, elements, or plates therebetween. Further when a layer, area, element, or plate is referred to as being “below” another layer, area, element, or plate, it may be directly below the other layer, area, element, or plate, or intervening layers, areas, elements, or plates may be present therebetween. Conversely, when a layer, area, element, or plate is referred to as being “directly below” another layer, area, element, or plate, there are no intervening layers, areas, elements, or plates therebetween.

[0092] The spatially relative terms “lower” or “bottom” and “upper” or “top”, "below", "beneath", "less", "above", and the like, may be used herein for ease of description to describe the relationship between one element or component and another element or component as illustrated in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the drawings. For example, in the case where a device illustrated in the drawings is turned over, elements described as being on the “lower” side of other elements, or "below" or "beneath" another element would then be oriented on “upper” sides of the other elements, or "above" another element. Accordingly, the illustrative term "below" or “beneath” may include both the “lower” and “upper” orientation positions, depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as “below” or “beneath” other elements would then be oriented ’’above” the other elements. The exemplary terms “below” or “beneath” can, therefore, encompass both an orientation of above and below, and thus the spatially relative terms may be interpreted differently depending on the orientations described.

[0093] Throughout the specification, when an element is referred to as being “connected” to another element, the element is “directly connected” to the other element, or “electrically connected” to the other element with one or more intervening elements interposed therebetween.

[0094] The terminology used herein is for the purpose of describing particular examples only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms, including “at least one,” unless the content clearly indicates otherwise. “At least one” is not to be construed as limiting “a" or “an.” It will be further understood that the terms “comprises," "comprising," "includes" and / or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0095] It will be understood that, although the terms “first,” “second,” “third,” and the like may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Thus, “a first element” discussed below could be termed “a second element" or “a third element,” and “a second element” and “a third element” may be termed likewise without departing from the teachings herein.

[0096] "About" or "approximately" as used herein is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations, or within ± 30%, 20%, 10%, 5% of the stated value.

[0097] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this invention pertains. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined in the present specification. Exemplary examples are described herein with reference to cross section illustrations that are schematic illustrations of idealized examples, wherein like reference numerals refer to like elements throughout the specification. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, examples described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region illustrated or described as flat may have rough and / or nonlinear features. Moreover, sharp angles that are illustrated may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the present claims. Some of the parts which are not associated with the description may not be provided in order to specifically describe exemplary examples of the present disclosure.

[0098] Figures 1A-B show a miniaturized shielded cable 100 from two different directions. Figure 1A shows the miniaturized shielded cable 100 in a partly cut-out side view and figure 1 B shows the miniaturized shielded cable 100 in a cut-through view, where the layers in the miniaturized shielded cable 100 can be clearly seen.

[0099] The miniaturized shielded cable 100 comprises a number of inner wires 102 contained inside an inner non-conducting insulation tube 104. The inner wires 102 may be litz wires, where each wire 102 comprises a multiple of strands 103 insulated electrically from each other. This is illustrated in figure 1 B. The strands 103 may be straight, twisted or woven.

[0100] The inner non-conducting insulation tube 104 is normally a polymer-based jacket comprising one or more polymers. The one or more polymers will normally be selected from the list of:

[0101] • Polyethylene (PE);

[0102] • Cross-linked polyethylene (PEX);

[0103] • Chlorinated polyethylene (CPE);

[0104] • Polyvinylchloride (PVC);

[0105] • Polyurethane (PUR);

[0106] • Ethylene propylene rubber (EPR);

[0107] • Neoprene;

[0108] • Polyamide (PA);

[0109] • Polyether block amide (PEBA). The inner non-conducting insulation tube 104 normally has an outer inner tube diameter D(inner tube) being between 0,1-1 ,5 mm, such as between 0,2-1 ,3 mm, such as between 0,4- 1 ,0 mm, such as between 0,5-0, 8 mm. The outer inner tube diameter D(innertube) is illustrated in figure 1 B. In figure 1B is likewise illustrated the inner tube thickness (T(inner tube)) of the inner non-conducting insulation tube 104. The inner tube thickness (T(inner tube)) is normally between 0, 1-0,7 mm, such as between 0,2-0, 6 mm, such as between 0,3-0, 5 mm, such as between 0,3-0, 4 mm.

[0110] Around the inner non-conducting insulation tube 104 is a conducting shield layer 106. The shield layer 106 may be coated onto the inner non-conducting insulation tube 104. The shield layer 106 normally has an outer shield layer diameter D(shield) being between 0,3-1 ,8 mm, such as between 0,4-1 ,3 mm, such as between 0,5-1 ,0 mm, such as between 0,6-0, 8 mm. The shield layer diameter D(shield) is illustrated in figure 1B. In figure 1B is likewise illustrated the shield layer thickness T(shield) of the shield layer 106. The shield layer thickness T(shield) is normally between 0,01-0,15 mm, such as between 0,02-0,14 mm, such as between 0,02- 0,13 mm, such as between 0,02-0,12 mm, such as between 0,02-0,10 mm, such as between 0,02-0,09 mm, such as between 0,02-0,08 mm, such as between 0,02-0,07 mm, such as between 0,03-0,06 mm, such as between 0,04-0,05 mm. An example of a structure of the shield layer 106 is shown in further details in figure 2.

[0111] The miniaturized shielded cable 100 also comprises an outer non-conducting jacket 110. The outer non-conducting jacket 110 will normally be a polymer-based jacket. The polymer-based jacket may comprise one or more polymers selected from the list of:

[0112] • Polyethylene (PE);

[0113] • Cross-linked polyethylene (PEX);

[0114] • Chlorinated polyethylene (CPE);

[0115] • Polyvinylchloride (PVC);

[0116] • Polyurethane (PUR);

[0117] • Ethylene propylene rubber (EPR);

[0118] • Neoprene;

[0119] • Polyamide (PA);

[0120] • Polyether block amide (PEBA).

[0121] In figure 1B, the outer jacket diameter D(jacket) is marked. The outer jacket diameter D(jacket) is normally between 0, 5-2,0 mm, such as between 0,6-1 ,7 mm, such as between 0,7-1 ,5 mm, such as between 0,8-1 ,2 mm, such as between 0, 9-1 ,1 mm. As a protection of the shield layer 106, a lacquer layer 109 may be positioned on an outer surface of the shield layer 106 between the shield layer 106 and the outer non-conducting jacket 110. The lacquer layer 109 protects the shield layer 106 if the outer jacket 110 is removed for connecting the shield layer 106 to e.g. a print circuit board as discussed in connection with figures 4A-D.

[0122] The miniaturized shielded cable 100 may contain fibres 112 for providing structural stability to the miniaturized shielded cable 100. The fibres 112 also provides an improved pull strain of the miniaturized shielded cable 100 in the longitudinal direction by the strengthening fibres 112. The fibres 112 are included inside the inner non-conducting insulation tube 104 together with the inner wires 102 as shown in figures 1A-B.

[0123] The shield layer 106 may be a layer comprising nanoscale / microscale structures arranged in an overlapping manner in the multiple of sub-layers. The nanoscale or microscale structures may for example be nanoparticles, such as nanowires, or flakes. The nanoscale or microscale structures in the shield layer 106 each normally has an average length and / or an average width of 3 nm - 30 pm, such as 3 nm - 3 pm, such as 3 nm - 1 pm, such as 3-800 nm, such as 5-750 nm, such as 10-500 nm, such as 30-200 nm. The individual size of the nanoscale or microscale structures may vary in size of more than 50%, such as more than 100%, such as more than 200%, such as more than 500%. By “average” length and width is therefore included variations in size of more than 50%, such as more than 100%, such as more than 200%, such as more than 500%.

[0124] The shield layer (106) may be a conductive flake-structured layer comprising a multiple of conducting flakes 108 as shown in figure 2. As seen from figure 2, the size of the individual flake varies a lot from flake to flake. The definition of when one flake ends and the next begins may also vary. Production differences may also influence the individual flake sizes. By “average” length and width is therefore included variations in size of more than 50%, such as more than 100%, such as more than 200%, such as more than 500%. The conducting flakes 108 are somewhat flat, and therefore has an average thickness, which is much less than the average length / width. The average thickness is normally less than 10%, such as less than 10%, such as less than 5%, such as less than even 1% of the average length and / or average width of the nanoscale or microscale structures being flake structures 108. A multiple of conducting flakes 108 are arranged in an overlapping manner in a multiple of sub-layers.

[0125] Though each flake 108 is comparatively flat, each flake 108 has bends and turns such that an uneven surface is formed. Each flake 108 therefore forms several bonds with neighbouring flakes, but are not bonded evenly over entire neighbouring surfaces. The flakes 108 may therefore be seen as forming a molecular uneven matrix. Since the flakes 108 are not bond to the neighbouring flakes along the entire surfaces, due to the lack of completely even and flat surfaces, each flake 108 is able to move relatively the neighbouring flakes to which it is bonded at different locations over the flake surface. This provides for a highly stretchable and flexible conducting flake-structured material. The conducting flake-structured material may be stretched by more than 50%, such as more than 100%, such as more than 200% without breaking. Even if one bond between two neighbouring flakes breaks, these two flakes are still connected in a multiple of positions ensuring that the conducting flake-structured material can maintain / resume its flexibility after repeated bending of the flake-structured material.

[0126] Due to the flakes having uneven surfaces their bonding to neighbouring flakes across their surface form an uneven bonding, resulting in neighbouring flakes being bonded in several places but not across the entirety of their surfaces, thereby the flakes are able to move relative to each other and even if one bond between flakes break, the flakes are still connected in several places ensuring electrical conductivity, thereby mediating the stretchability of the material.

[0127] After bending of the shield layer 106, the conductive flake-structured layer is able to return completely or nearly completely to its original structure. The same is true for nanoparticle structures such as nanowires. The conductive properties and the flexibility properties are thereby maintained during use of the cable. This may for example be seen in figure 3 showing the resistance in Ohm as a function of the number of bending cycles. The bending test results shown in figure 3 have been obtained by repeatedly bending a shielded cable with an outer jacket diameter of 1,4 mm. The shielded cable is bended ±90 degrees in each bending cycle. Two sets of measurements are shown in figure 3; one for a shielded cable with a shrinked outer jacket tube 202 and one for a regular outer jacket tube 204. The inner non-conducting insulation tube has an outer diameter of 0,9 mm. Adding the shield layer brings this outer diameter to a total of 0,93 mm. The outer diameter of the jacket is 1 ,4 mm for both the cable with and without shrink outer jacket tube.

[0128] In a preferred embodiment the composite material used for the electrically conductive layer is comprised of at least 50% silver by weight. The flexible matrix may in the preferred embodiment be dimethylsuccinat or another polymer capable of large elastic deformations and with a glass transition temperature below ambient temperature. The polymer may by way of example be a thermosetting, thermoplastic or elastomeric polymer / elastomer. In a preferred embodiment the polymer is cured on the cable 100, such as by exposure to heat, UV-radiation and / or a curing agent.

[0129] The composite material is therefore oversaturated with metal particles and since the matrix is highly ductile, due to being above its glass transition temperature, intermolecular forces between the silver particles cause them to reassemble after the cable 100 has been deformed thereby reestablishing the electrical contact between the silver flakes once the cable 100 is unstressed. This creates a highly flexible cable 100 which is able to retain the conductivity of the electrically conductive (shield) layer 106, even after a large number of deformations. As an additional benefit the cable 100 remains flexible as it does not undergo deformation hardening.

[0130] After performing 5000 bending cycles, the cables 202, 204 were allowed to relax for 18 hours before resuming the test of the resistance during bending cycles once more. As seen in figure 3, a rise in resistance from 4 Ohm to 7-10 Ohm followed by a slight decrease is observed for both cables 202, 204 during the first 5000 bending cycles. However, when the cables 202, 204 are allowed to relax for 18 hours, the resistance is recovered nearly to the level when starting the bending test, i.e. the level of 4 Ohm at 0 cycles, as a resistance of approximately 4,5 Ohm is observed after relaxation for both cables 202, 204. When testing the resistance during bending is resumed again, a slow raise in resistance to 5, 5-6, 5 Ohm is again seen during the following 1000 bending cycles (bending cycles 5000 to 6000).

[0131] As conducting material forming the nanoscale / microscale structures shield layer, conducting materials such as metals or carbon-based materials are normally used. The conducting nanoscale / microscale structures shield layer may in an example be silver-based structures. By silver-based in meant that the majority of the material is silver. Liquid carriers, such as organic solvents, may be use when applying the conductive material in a liquid form to the inner tube. Conducting flakes comprising silver may be in the form of ACI SE1109 silver from ACI materials.

[0132] As an alternative to a silver-based shield layer material, a conductive material based on copper, gold, aluminium, graphene or graphite may be used for the nanoscale / microscale structures shield layer. Further, combinations of these material may also be used. Examples of conducting materials comprising more than one metal include CuAg, and copper cladded aluminium.

[0133] The miniaturized shielded cable 100 comprises a first end 114 and a second end 116, the miniaturized shielded cable 100 extending between the first end 114 and the second end 116. The miniaturized shielded cable 100 may be terminated at the first end 114 and / or at the second end 116 by means of conducting glue, or a soldering material.

[0134] Figures 4A-F show examples of a miniaturized shielded cable 100, which is terminated at the first end 114 and connected to a print circuit board 126. The individual parts possibly included in the termination solution are shown in figure 4A.

[0135] In a first example, a mechanical termination construction may be used, which is shown in figures 4A-D. A conducting spring part 120 comprising a ring part 121 from where a number of flexible fingers 122 extend (see figures 4A-B) is attached to the miniaturized shielded cable 100 where it forms an electrical connection with the shield layer 106. The flexible fingers 122 flex inwardly thereby providing an optimum electrical connection with the shield layer 106. Four flexible fingers 122 are shown in figures 4A-D, but fewer or more could also be imagined. The outer jacket 110 has been removed to allow for positioning of the conducting spring part 120 directly around and in contact with the shield layer 106. A thin lacquer layer may be found around the shield layer 106 for protecting the shield layer 106 when the outer jacket 110 is removed.

[0136] In figure 4C, the different parts in the terminated miniaturized shielded cable 100 is seen at the first end 114. To provide an electrical connection with sets of solder pads 127 on a print circuit board (PCB) 126, an outer conductive bushing 124 is positioned around the conducting spring part 120 as shown in figures 4C-D. The outer conductive bushing 124 is directly connected to the ring part 121 , which is directly connected to the shield layer 106 through the flexible fingers 122 extending from the ring part 121. In the opening between the outer conductive bushing 124 and the shield layer 106, conductive adhesive, such a conductive glue, may be added.

[0137] As shown in figures 4C-D, an adhesive layer 130 is attached to the solder pads 127 on PCB 126 for providing an improved first electrical connection between the solder pads 127 on PCB 126 and the outer conductive bushing 124 connected to the shield layer 106. The adhesive layer 130 may be a solder material for soldering the shield layer 106 to the solder pads 127. This first electrical connection may be a ground connection.

[0138] The inner wires 102 are connected to sets of connecting points 128 on a print circuit board 126 as shown in figure 4D. This second electrical connection may also be obtained by soldering. Thus, the connecting points 128 may be second solder pads. In a second example, a termination construction based on conducting adhesive may be used, which is shown in figures 4E-F. Compared to the mechanical termination construction shown in figures 4A-D, the conducting spring part 120 and the outer conductive bushing 124 has been omitted and an adhesive layer 130, which is conducting, is instead used.

[0139] As yet an alternative to the above described termination constructions, soldering may also be used. However, using soldering requires that the material constituting the inner tube 104 can withstand the higher temperatures often required during a soldering process. Alternatively, or in addition, a solder material with a melting below that of the inner tube material thereby preventing melting of the inner tube, may be used.

[0140] As mentioned above, the shield layer 106 as shown in figures 1A-B is normally coated onto inner non-conducting insulation tube 104. A method for producing a miniaturized shielded cable 100 may therefore include the following steps of: o proving an inner non-conducting insulation tube 104 containing a number of inner wires 102; o applying a liquid layer of shield layer material onto the inner non-conducting insulation tube 104; o curing the liquid layer of shield layer material around the inner non-conducting insulation tube 104 thereby obtaining a cured shield layer 106; o applying a liquid non-conducting outer layer around the cured shield layer 106; o curing the liquid non-conducting outer layer thereby obtaining the miniaturized shielded cable 100 with the outer non-conducting jacket 110.

[0141] Such method 300 is illustrated in figure 5. In figure 5, an inner non-conducting insulation tube containing a number of inner wires is illustrated as the cable dereeler 302. The inner nonconducting insulation tube containing a number of inner wires is provided from the cable dereeler 302 to a shield layer coating station 304, where a liquid layer of shield layer material is applied onto the inner non-conducting insulation tube. The cable is transferred to a first heating unit 306, where the liquid layer of shield layer material is cured to obtain a cured shield layer. A liquid non-conducting outer layer is applied around the cured shield layer in a jacket coating station 308, and the non-conducting outer layer is cured in a second heating unit 310 as illustrated in figure 5. This provides for a miniaturized shielded cable as described above. The miniaturized shielded cable may after production be wound onto a coil as shown at the coiling station 312. Before applying the jacket layer at the jacket coating station 308, a protective layer of lacquer may be applied over the cured shield layer.

[0142] In all embodiments, the cable 100 may be thermoformed to hold a desired shape by bending it into the desired shape in a fixture and heating it to 120-130 degrees Celsius for 15-25 minutes, preferably 20 minutes, while in the fixture. Afterwards the cable 100 is allowed to cool to room temperature before removing it from the fixture. In order to reach the desired shape, it may be necessary to thermoform the cable 100 iteratively. The cable 100 may also be held for longer time periods with departing from this teaching. Notably the holding time may be decreased by increasing the temperature and vice versa.

[0143] The following is an itemized list of embodiments according to the invention(ltem 1 A - 23A).

[0144] Item 1A: A miniaturized shielded cable (100) comprising:

[0145] • an inner non-conducting insulation tube (104) containing a number of inner wires (102);

[0146] • the plurality of inner wires (102) extending inside the inner non-conducting insulation tube (104);

[0147] • an outer non-conducting jacket (110) having a maximum outer diameter being at the most 2 mm; and

[0148] • a shield layer (106) positioned between the inner non-conducting insulation tube (104) and the outer non-conducting jacket (110); wherein the shield layer (106) is a conductive layer comprising a multiple of overlapping sub-layers comprising nanoscale or microscale structures.

[0149] Item 2A: The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) comprises one or more of the following materials:

[0150] • silver (Ag);

[0151] • copper (Cu);

[0152] • aluminium (Al);

[0153] • gold (Au)

[0154] • graphene;

[0155] • graphite.

[0156] Item 3A: The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) forms a stretchable conducting material. Item 4A: The miniaturized shielded cable (100) according to item 3A, wherein the stretchable conducting material may be stretched by more than 50%, such as more than 100%, such as more than 200% without breaking.

[0157] Item 5A: The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) is a silver-based stretchable conducting material.

[0158] Item 6A.: The miniaturized shielded cable (100) according to any preceding item, wherein the nanoscale or microscale structures in the shield layer (106) each has an average length and / or an average width of 3 nm - 30 pm, such as 3 nm - 3 pm, such as 3 nm - 1 pm, such as 3- 800 nm, such as 5-750 nm, such as 10-500 nm, such as 30-200 nm.

[0159] Item 7A: The miniaturized shielded cable (100) according to any preceding item, wherein the nanoscale or microscale structures in the shield layer (106) are flakes, the nanoscale or microscale structures thereby forming a flake-structured layer comprising a multiple of conducting flakes (108) arranged in an overlapping manner in the multiple of sub-layers.

[0160] Item 8A: The miniaturized shielded cable (100) according to item 6A or 7A, wherein the conducting flakes (108) each has an average thickness being less than 10% of the average length and / or average width of the nanoscale or microscale structures being flake structures (108).

[0161] Item 9A: The miniaturized shielded cable (100) according to item 6A, wherein the nanoscale or microscale structures are nanoparticles, such as nanowires.

[0162] Item 10A: The miniaturized shielded cable (100) according to any preceding item, wherein the inner non-conducting insulation tube (104) is a polymer-based tube comprising one or more polymers selected from the list of:

[0163] • Polyethylene (PE);

[0164] • Cross-linked polyethylene (PEX);

[0165] • Chlorinated polyethylene (CPE);

[0166] • Polyvinylchloride (PVC);

[0167] • Polyurethane (PUR);

[0168] • Ethylene propylene rubber (EPR);

[0169] • Neoprene;

[0170] • Polyamide (PA);

[0171] • Polyether block amide (PEBA). Item 11A: The miniaturized shielded cable (100) according to any preceding item, wherein the inner non-conducting insulation tube (104) has an outer inner tube diameter (D(inner tube)) being between 0,1-1 , 5 mm, such as between 0,2-1 , 3 mm, such as between 0,4-1 ,0 mm, such as between 0,5-0, 8 mm.

[0172] Item 12A: The miniaturized shielded cable (100) according to any preceding item, wherein the inner non-conducting insulation tube (104) has an inner tube thickness (T(inner tube)) being between 0, 1-0,7 mm, such as between 0,2-0, 6 mm, such as between 0,3-0, 5 mm, such as between 0,3-0, 4 mm.

[0173] Item 13A: The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) is coated onto inner non-conducting insulation tube (104).

[0174] Item 14A: The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) has an outer shield layer diameter (D(shield)) being between 0,3-1 ,8 mm, such as between 0,4-1 ,3 mm, such as between 0,5-1 ,0 mm, such as between 0,6-0, 8 mm.

[0175] Item 15A: The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) has a shield layer thickness (T(shield)) being between 0,01-0,15 mm, such as between 0,02-0,14 mm, such as between 0,02-0,13 mm, such as between 0,02-0,12 mm, such as between 0,02-0,10 mm, such as between 0,02-0,09 mm, such as between 0,02-0,08 mm, such as between 0,02-0,07 mm, such as between 0,03-0,06 mm, such as between 0,04- 0,05 mm.

[0176] Item 16A: The miniaturized shielded cable (100) according to any preceding item, wherein the outer non-conducting jacket (110) has an outer jacket diameter (D(jacket)) being between 0,5- 2,0 mm, such as between 0,6-1 ,7 mm, such as between 0,7-1 , 5 mm, such as between 0,8- 1 ,2 mm, such as between 0, 9-1 ,1 mm.

[0177] Item 17A: The miniaturized shielded cable (100) according to any preceding item, wherein the outer non-conducting jacket (110) is a polymer-based tube comprising one or more polymers selected from the list of:

[0178] • Polyethylene (PE);

[0179] • Cross-linked polyethylene (PEX);

[0180] • Chlorinated polyethylene (CPE);

[0181] • Polyvinylchloride (PVC); • Polyurethane (PUR);

[0182] • Ethylene propylene rubber (EPR);

[0183] • Neoprene;

[0184] • Polyamide (PA);

[0185] • Polyether block amide (PEBA).

[0186] Item 18A: The miniaturized shielded cable (100) according to any preceding item further comprising a lacquer layer (109) positioned on an outer surface of the shield layer (106) between the shield layer (106) and the outer non-conducting jacket (110) for protection of the shield layer (106).

[0187] Item 19A: The miniaturized shielded cable (100) according to any preceding item further comprising one or more fibres (112) contained inside the inner non-conducting insulation tube (104), the one or more fibres (112) providing structural stability to the miniaturized shielded cable (100).

[0188] Item 20A: The miniaturized shielded cable (100) according to any preceding item, wherein the miniaturized shielded cable (100) comprises a first end (114) and a second end (116) between which the miniaturized shielded cable (100) is extending, wherein the miniaturized shielded cable (100) is terminated at the first end (114) and / or at the second end (116) by means of conducting glue, or a soldering material, or similar.

[0189] Item 21 A: The miniaturized shielded cable (100) according to item 20A, wherein the miniaturized shielded cable (100) at the first end (114) and / or at the second end (116) further comprises:

[0190] • a conducting spring part (120) electrically connected to the shield layer (106) and

[0191] • an outer conductive bushing (124) positioned around and connected to the spring part (120), wherein the outer conductive bushing (124) is configured for providing electrical connection of the shield layer (106) to a receivable part, such as e.g. a print circuit board (126).

[0192] Item 22A: The miniaturized shielded cable (100) according to item 21 A, wherein the conducting spring part (120) comprises a ring part (121) from where a number of flexible fingers (122) extend, wherein the flexible fingers (122) provide an electrical connection to the shield layer (106) and the ring part (121) provides an electrical connection to the outer conductive bushing (124).

[0193] Item 23A: A method for producing a miniaturized shielded cable (100) comprising:

[0194] • an inner non-conducting insulation tube (104) containing a number of inner wires (102), wherein the plurality of inner wires (102) is extending inside the inner non-conducting insulation tube (104);

[0195] • an outer non-conducting jacket (110) having a maximum outer diameter being at the most 2 mm; and

[0196] • a shield layer (106) positioned between the inner non-conducting insulation tube (104) and the outer non-conducting jacket (110), the shield layer (106) being a conductive layer comprising a multiple of overlapping sub-layers comprising nanoscale or microscale structures; the method comprising the steps of: o proving the inner non-conducting insulation tube (104) containing the number of inner wires (102); o applying a liquid layer of shield layer material onto the inner non-conducting insulation tube (104); o curing the liquid layer of shield layer material around the inner non-conducting insulation tube (104) thereby obtaining a cured shield layer (106); o applying a liquid outer non-conducting layer around the cured shield layer (106); curing the liquid outer non-conducting layer thereby obtaining the miniaturized shielded cable (100) with the outer non-conducting jacket (110).

[0197] The following is another itemized list of embodiments according to the invention (Items B1 - B33):

[0198] Item B1 : A miniaturized shielded cable (100) comprising:

[0199] • an inner non-conducting insulation tube (104) containing a number of inner wires (102);

[0200] • the plurality of inner wires (102) extending inside the inner non-conducting insulation tube (104);

[0201] • an outer non-conducting jacket (110) and

[0202] • a shield layer (106) positioned between the inner non-conducting insulation tube (104) and the outer non-conducting jacket (110); wherein the shield layer (106) is a conductive layer comprising a multiple of overlapping layers comprising nanoscale or microscale structures the nanoscale or microscale structures in the shield layer (106) are flakes, the nanoscale or microscale structures thereby forming a flake-structured layer comprising a multiple of conducting flakes (108) arranged in an overlapping manner in the multiple of sub-layers, wherein the conducting flakes (108) each has an average thickness being less than 10% of the average length and / or average width of the nanoscale or microscale structures being flake structures (108) characterized in that said flakes have uneven surfaces with an uneven bonding between neighbouring flakes in several places but not across the entirety of their surfaces causing the shield layer (106) to form a stretchable conducting material, such as a silver-based stretchable conducting material and with the outer non-conducting jacket (110) having a maximum outer diameter being at the most 2 mm;,

[0203] Item B2: The miniaturized shielded cable (100) according to item B1 , wherein the shield layer (106) comprises one or more of the following materials:

[0204] • silver (Ag);

[0205] • copper (Cu);

[0206] • aluminium (Al);

[0207] • gold (Au)

[0208] • graphene;

[0209] • graphite.

[0210] Item B3: The miniaturized shielded cable (100) according to item B1 or B2, wherein the shield layer (106) forms a stretchable conducting material.

[0211] Item B4: The miniaturized shielded cable (100) according to any preceding item B, wherein the shield layer (106) forms a stretchable conducting material, such as a silver-based stretchable conducting material, the stretchable conducting material may be stretched by more than 50%, such as more than 100%, such as more than 200% without breaking.

[0212] Item B5: The miniaturized shielded cable (100) according to item B3 and / or B4, wherein the stretchable conducting material may be stretched by more than 50%, such as more than 100%, such as more than 200% without breaking.

[0213] Item B6: The miniaturized shielded cable (100) according to any preceding item B, wherein the shield layer (106) is a silver-based stretchable conducting material. Item B7: The miniaturized shielded cable (100) according to any preceding item B, wherein the nanoscale or microscale structures in the shield layer (106) each has an average length and / or an average width of 3 nm - 30 pm, such as 3 nm - 3 pm, such as 3 nm - 1 pm, such as 3-800 nm, such as 5-750 nm, such as 10-500 nm, such as 30-200 nm.

[0214] Item B8: The miniaturized shielded cable (100) according to any preceding item B, wherein the nanoscale or microscale structures in the shield layer (106) are flakes, the nanoscale or microscale structures thereby forming a flake-structured layer comprising a multiple of conducting flakes (108) arranged in an overlapping manner in the multiple of sub-layers.

[0215] Item B9: The miniaturized shielded cable (100) according to item B7 and / or B8, wherein the conducting flakes (108) each has an average thickness being less than 10% of the average length and / or average width of the nanoscale or microscale structures being flake structures (108).

[0216] Item B10: The miniaturized shielded cable (100) according to item B7, wherein the nanoscale or microscale structures are nanoparticles, such as nanowires.

[0217] Item B11 : The miniaturized shielded cable (100) according to any preceding item B, wherein the inner non-conducting insulation tube (104) is a polymer-based tube comprising one or more polymers selected from the list of:

[0218] • Polyethylene (PE);

[0219] • Cross-linked polyethylene (PEX);

[0220] • Chlorinated polyethylene (CPE);

[0221] • Polyvinylchloride (PVC);

[0222] • Polyurethane (PUR);

[0223] • Ethylene propylene rubber (EPR);

[0224] • Neoprene;

[0225] • Polyamide (PA);

[0226] • Polyether block amide (PEBA).

[0227] Item B12: The miniaturized shielded cable (100) according to any preceding item B, wherein the inner non-conducting insulation tube (104) has an outer inner tube diameter (D(innertube)) being between 0,1-1 , 5 mm, such as between 0,2-1 , 3 mm, such as between 0,4-1 ,0 mm, such as between 0,5-0, 8 mm. Item B13: The miniaturized shielded cable (100) according to any preceding item B, wherein the inner non-conducting insulation tube (104) has an inner tube thickness (T(inner tube)) being between 0,1-0, 7 mm, such as between 0,2-0, 6 mm, such as between 0,3-0, 5 mm, such as between 0, 3-0,4 mm.

[0228] Item B14: The miniaturized shielded cable (100) according to any preceding item B, wherein the shield layer (106) is coated onto inner non-conducting insulation tube (104).

[0229] Item B15: The miniaturized shielded cable (100) according to any preceding item B, wherein the shield layer (106) has an outer shield layer diameter (D(shield)) being between 0,3-1 ,8 mm, such as between 0,4-1 ,3 mm, such as between 0,5-1 ,0 mm, such as between 0,6-0, 8 mm.

[0230] Item B16: The miniaturized shielded cable (100) according to any preceding item B, wherein the shield layer (106) has a shield layer thickness (T(shield)) being between 0,01-0,15 mm, such as between 0,02-0,14 mm, such as between 0,02-0,13 mm, such as between 0,02-0,12 mm, such as between 0,02-0,10 mm, such as between 0,02-0,09 mm, such as between 0,02- 0,08 mm, such as between 0,02-0,07 mm, such as between 0,03-0,06 mm, such as between 0,04-0,05 mm.

[0231] Item B17: The miniaturized shielded cable (100) according to any preceding item B, wherein the outer non-conducting jacket (110) has an outer jacket diameter (D(jacket)) being between 0, 5-2,0 mm, such as between 0,6-1 ,7 mm, such as between 0,7-1 ,5 mm, such as between 0,8-1 ,2 mm, such as between 0, 9-1 ,1 mm.

[0232] Item B18: The miniaturized shielded cable (100) according to any preceding item B, wherein the outer non-conducting jacket (110) is a polymer-based tube comprising one or more polymers selected from the list of:

[0233] • Polyethylene (PE);

[0234] • Cross-linked polyethylene (PEX);

[0235] • Chlorinated polyethylene (CPE);

[0236] • Polyvinylchloride (PVC);

[0237] • Polyurethane (PUR);

[0238] • Ethylene propylene rubber (EPR);

[0239] • Neoprene;

[0240] • Polyamide (PA);

[0241] • Polyether block amide (PEBA). Item B19: The miniaturized shielded cable (100) according to any preceding item B further comprising a lacquer layer (109) positioned on an outer surface of the shield layer (106) between the shield layer (106) and the outer non-conducting jacket (110) for protection of the shield layer (106).

[0242] Item B20: The miniaturized shielded cable (100) according to any preceding item B further comprising one or more fibres (112) contained inside the inner non-conducting insulation tube (104).

[0243] Item B21 : The miniaturized shielded cable (100) according to any preceding item B, wherein the shield layer (106) is comprised of at least 50% metal by weight.

[0244] Item B22: The miniaturized shielded cable (100) according to any preceding item B, wherein the shield layer (106) is comprised of at least 50% silver by weight.

[0245] Item B23: The miniaturized shielded cable (100) according to any preceding item B, wherein the shield layer (106) comprises a polymer matrix with a glass transition temperature below ambient temperature.

[0246] Item B24: The miniaturized shielded cable (100) according to any preceding item B, wherein the miniaturized shielded cable (100) comprises a first end (114) and a second end (116) between which the miniaturized shielded cable (100) is extending, wherein the miniaturized shielded cable (100) is terminated at the first end (114) and / or at the second end (116) by means of conducting glue, or a soldering material, or similar.

[0247] Item B25: The miniaturized shielded cable (100) according to item B21 , wherein the miniaturized shielded cable (100) at the first end (114) and / or at the second end (116) further comprises:

[0248] • a conducting spring part (120) electrically connected to the shield layer (106) and

[0249] • an outer conductive bushing (124) positioned around and connected to the spring part (120), wherein the outer conductive bushing (124) is configured for providing electrical connection of the shield layer (106) to a receivable part, such as e.g. a print circuit board Item B26: The miniaturized shielded cable (100) according to item B22, wherein the conducting spring part (120) comprises a ring part (121) from where a number of flexible fingers (122) extend, wherein the flexible fingers (122) provide an electrical connection to the shield layer (106) and the ring part (121) provides an electrical connection to the outer conductive bushing (124).

[0250] Item B27: A method for producing a miniaturized shielded cable (100) according to any of items B1 to B26 comprising:

[0251] • an inner non-conducting insulation tube (104) containing a number of inner wires (102), wherein the plurality of inner wires (102) is extending inside the inner non-conducting insulation tube (104);

[0252] • an outer non-conducting jacket (110) having a maximum outer diameter being at the most 2 mm; and

[0253] • a shield layer (106) positioned between the inner non-conducting insulation tube (104) and the outer non-conducting jacket (110), the shield layer (106) being a conductive layer comprising a multiple of overlapping sub-layers comprising nanoscale or microscale structures; the method comprising the steps of: o proving the inner non-conducting insulation tube (104) containing the number of inner wires (102); o applying a liquid layer of shield layer material onto the inner non-conducting insulation tube (104); o curing the liquid layer of shield layer material around the inner non-conducting insulation tube (104) thereby obtaining a cured shield layer (106); o applying a liquid outer non-conducting layer around the cured shield layer (106); o curing the liquid outer non-conducting layer thereby obtaining the miniaturized shielded cable (100) with the outer non-conducting jacket (110).

[0254] Item B28: A method for thermoforming the cable (100) according to any of items B1 to B26 comprising the following step:

[0255] - shaping the cable (1) to a predefined shape by:

[0256] - mounting the cable in a fixture, the fixture adapted with said predefined shape,

[0257] -heating the cable above ambient temperature,

[0258] -cooling the cable, and

[0259] -releasing the cable from the fixture, when cooled to ambient temperature. Item B29: A hearing aid comprising a body and a receiver being connected by the miniaturized shielded cable (100), according to any of items B1 to B26, the body comprising at least a power source, and the receiver comprising at least a speaker of the hearing aid.

[0260] Item B30: An in-ear monitor or in-ear headphone comprising the miniaturized shielded cable (100) according to any of items B1 to B26 adapted for connecting the in-ear monitor or in-ear headphones to an external sound source for relaying prerecorded and / or live transmitted sound.

[0261] Item B31 : Use of the cable (100) according to any of items B1 to B26, for providing a hearing aid or in ear monitor.

[0262] Item B32: A method of alleviating hearing loss, by providing the hearing aid according to item B29 to a user.

[0263] Item B33: Use of the cable (100) according to any of items B1 to B26 for connecting an in- ear monitor and / or headphones to an external sound source.

[0264] References

[0265] 100 miniaturized shielded cable

[0266] 102 inner wire

[0267] 103 inner wire strands

[0268] 104 inner non-conducting insulation tube

[0269] 106 shield layer

[0270] 108 conducting flakes

[0271] 109 lacquer

[0272] 110 outer non-conducting jacket

[0273] 112 fibre

[0274] 114 first end of the miniaturized shielded cable

[0275] 116 second end of the miniaturized shielded cable

[0276] 120 conducting spring part

[0277] 121 ring part

[0278] 122 flexible finger

[0279] 124 outer conductive bushing 126 print circuit board

[0280] 127 solder pads

[0281] 128 connecting points

[0282] 130 adhesive layer

[0283] 202 shrinked tube

[0284] 204 tube

[0285] 300 method for producing a miniaturized shielded cable

[0286] 302 cable dereeler

[0287] 304 shield layer coating station

[0288] 306 first heating unit

[0289] 308 jacket coating station

[0290] 310 second heating unit

[0291] 312 coiling station

[0292] D(shield) outer shield layer diameter

[0293] T(shield) shield layer thickness

[0294] D(inner tube) inner tube diameter

[0295] T(inner tube) inner tube thickness

[0296] □(jacket) outer jacket diameter

Claims

Claims1 . A miniaturized shielded cable (100) comprising:• an inner non-conducting insulation tube (104) containing a number of inner wires (102);• the plurality of inner wires (102) extending inside the inner non-conducting insulation tube (104);• an outer non-conducting jacket (110) and• a shield layer (106) positioned between the inner non-conducting insulation tube (104) and the outer non-conducting jacket (110); wherein the shield layer (106) is a conductive layer comprising a multiple of overlapping layers comprising nanoscale or microscale structures the nanoscale or microscale structures in the shield layer (106) are flakes, the nanoscale or microscale structures thereby forming a flake-structured layer comprising a multiple of conducting flakes (108) arranged in an overlapping manner in the multiple of sub-layers, wherein the conducting flakes (108) each has an average thickness being less than 10% of the average length and / or average width of the nanoscale or microscale structures being flake structures (108) characterized in that said flakes have uneven surfaces with an uneven bonding between neighbouring flakes in several places but not across the entirety of their surfaces causing the shield layer (106) to form a stretchable conducting material, such as a silver-based stretchable conducting material and with the outer non-conducting jacket (110) having a maximum outer diameter being at the most 2 mm.

2. The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) comprises one or more of the following materials:• silver (Ag);• copper (Cu);• aluminium (Al);• gold (Au);• graphene;• graphite.

3. The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) forms a stretchable conducting material.

4. The miniaturized shielded cable (100) according to any preceding claim, wherein the shield layer (106) forms a stretchable conducting material, such as a silver-basedstretchable conducting material, the stretchable conducting material may be stretched by more than 50%, such as more than 100%, such as more than 200% without breaking.

5. The miniaturized shielded cable (100) according to claim 3 and / or 4, wherein the stretchable conducting material may be stretched by more than 50%, such as more than 100%, such as more than 200% without breaking.

6. The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) is a silver-based stretchable conducting material.

7. The miniaturized shielded cable (100) according to any preceding item, wherein the nanoscale or microscale structures in the shield layer (106) each has an average length and / or an average width of 3 nm - 30 pm, such as 3 nm - 3 pm, such as 3 nm - 1 pm, such as 3-800 nm, such as 5-750 nm, such as 10-500 nm, such as 30-200 nm.

8. The miniaturized shielded cable (100) according to any preceding item, wherein the nanoscale or microscale structures in the shield layer (106) are flakes, the nanoscale or microscale structures thereby forming a flake-structured layer comprising a multiple of conducting flakes (108) arranged in an overlapping manner in the multiple of sublayers.

9. The miniaturized shielded cable (100) according to claim 7 and / or 8, wherein the conducting flakes (108) each has an average thickness being less than 10% of the average length and / or average width of the nanoscale or microscale structures being flake structures (108).

10. The miniaturized shielded cable (100) according to item 7, wherein the nanoscale or microscale structures are nanoparticles, such as nanowires.

11. The miniaturized shielded cable (100) according to any preceding claim, wherein the inner non-conducting insulation tube (104) is a polymer-based tube comprising one or more polymers selected from the list of:• Polyethylene (PE);• Cross-linked polyethylene (PEX);• Chlorinated polyethylene (CPE);• Polyvinylchloride (PVC);• Polyurethane (PUR);• Ethylene propylene rubber (EPR);• Neoprene;• Polyamide (PA);• Polyether block amide (PEBA).

12. The miniaturized shielded cable (100) according to any preceding claim, wherein the inner non-conducting insulation tube (104) has an outer inner tube diameter (D(inner tube)) being between 0,1-1 , 5 mm, such as between 0,2-1 , 3 mm, such as between 0,4- 1 ,0 mm, such as between 0,5-0, 8 mm.

13. The miniaturized shielded cable (100) according to any preceding item, wherein the inner non-conducting insulation tube (104) has an inner tube thickness (T(inner tube)) being between 0, 1-0,7 mm, such as between 0,2-0, 6 mm, such as between 0,3-0, 5 mm, such as between 0, 3-0,4 mm.

14. The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) is coated onto inner non-conducting insulation tube (104).

15. The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) has an outer shield layer diameter (D(shield)) being between 0,3-1 ,8 mm, such as between 0,4-1 ,3 mm, such as between 0,5-1 ,0 mm, such as between 0,6- 0,8 mm.

16. The miniaturized shielded cable (100) according to any preceding item, wherein the shield layer (106) has a shield layer thickness (T(shield)) being between 0,01-0,15 mm, such as between 0,02-0,14 mm, such as between 0,02-0,13 mm, such as between 0,02- 0,12 mm, such as between 0,02-0,10 mm, such as between 0,02-0,09 mm, such as between 0,02-0,08 mm, such as between 0,02-0,07 mm, such as between 0,03-0,06 mm, such as between 0,04-0,05 mm.

17. The miniaturized shielded cable (100) according to any preceding item, wherein the outer non-conducting jacket (110) has an outer jacket diameter (D(jacket)) being between 0, 5-2,0 mm, such as between 0,6-1 ,7 mm, such as between 0,7-1 , 5 mm, such as between 0,8-1 ,2 mm, such as between 0, 9-1 ,1 mm.

18. The miniaturized shielded cable (100) according to any preceding item, wherein the outer non-conducting jacket (110) is a polymer-based tube comprising one or more polymers selected from the list of:• Polyethylene (PE);• Cross-linked polyethylene (PEX);• Chlorinated polyethylene (CPE);• Polyvinylchloride (PVC);• Polyurethane (PUR);• Ethylene propylene rubber (EPR);• Neoprene;• Polyamide (PA);• Polyether block amide (PEBA).

19. The miniaturized shielded cable (100) according to any preceding claim further comprising a lacquer layer (109) positioned on an outer surface of the shield layer (106) between the shield layer (106) and the outer non-conducting jacket (110) for protection of the shield layer (106).

20. The miniaturized shielded cable (100) according to any preceding claim further comprising one or more fibres (112) contained inside the inner non-conducting insulation tube (104).

21. The miniaturized shielded cable (100) according to any preceding claim, wherein the shield layer (106) is comprised of at least 50% metal by weight.

22. The miniaturized shielded cable (100) according to any preceding claim, wherein the shield layer (106) is comprised of at least 50% silver by weight.

23. The miniaturized shielded cable (100) according to any preceding claim, wherein the shield layer (106) comprises a polymer matrix with a glass transition temperature below ambient temperature.

24. The miniaturized shielded cable (100) according to any preceding claim, wherein the miniaturized shielded cable (100) comprises a first end (114) and a second end (116) between which the miniaturized shielded cable (100) is extending, wherein the miniaturized shielded cable (100) is terminated at the first end (114) and / or at the second end (116) by means of conducting glue, or a soldering material, or similar.

25. The miniaturized shielded cable (100) according to claim 24, wherein the miniaturized shielded cable (100) at the first end (114) and / or at the second end (116) further comprises:• a conducting spring part (120) electrically connected to the shield layer (106) and• an outer conductive bushing (124) positioned around and connected to the spring part (120), wherein the outer conductive bushing (124) is configured for providing electrical connection of the shield layer (106) to a receivable part, such as e.g. a print circuit board (126).

26. The miniaturized shielded cable (100) according to claim 25, wherein the conducting spring part (120) comprises a ring part (121) from where a number of flexible fingers (122) extend, wherein the flexible fingers (122) provide an electrical connection to the shield layer (106) and the ring part (121) provides an electrical connection to the outer conductive bushing (124).

27. A method for producing a miniaturized shielded cable (100) according to any of claims 1 to 26 comprising:• an inner non-conducting insulation tube (104) containing a number of inner wires (102), wherein the plurality of inner wires (102) is extending inside the inner non-conducting insulation tube (104);• an outer non-conducting jacket (110) having a maximum outer diameter being at the most 2 mm; and• a shield layer (106) positioned between the inner non-conducting insulation tube (104) and the outer non-conducting jacket (110), the shield layer (106) being a conductive layer comprising a multiple of overlapping sub-layers comprising nanoscale or microscale structures; the method comprising the steps of: o proving the inner non-conducting insulation tube (104) containing the number of inner wires (102); o applying a liquid layer of shield layer material onto the inner non-conducting insulation tube (104); o curing the liquid layer of shield layer material around the inner non-conducting insulation tube (104) thereby obtaining a cured shield layer (106); o applying a liquid outer non-conducting layer around the cured shield layer (106);o curing the liquid outer non-conducting layer thereby obtaining the miniaturized shielded cable (100) with the outer non-conducting jacket (110).

28. The method according to claim 27 further comprising the following steps:- shaping the cable (1) to a predefined shape by:- mounting the cable in a fixture, the fixture adapted with said predefined shape,-heating the cable above ambient temperature,-cooling the cable, and-releasing the cable from the fixture, when cooled to ambient temperature.

29. A hearing aid comprising a body and a receiver being connected by the miniaturized shielded cable (100) according to any of claims 1 to 26 with the body comprising at least the power source, and the receiver comprising at least the speaker of the hearing aid.

30. An in-ear monitor or in-ear headphone comprising the miniaturized shielded cable(100) according to any of claims 1 to 26 adapted for connecting the in-ear monitor or in-ear headphones to an external sound source for relaying prerecorded and / or live transmitted sound.31 . Use of the cable (100) according to any of claim 1 to 26, for providing a hearing aid or in ear monitor.

32. A method of alleviating hearing loss, by providing the hearing aid according to claim 29 to a user.

33. Use of the cable (100) according to any of claims 1 to 26 for connecting an in-ear monitor and / or headphones to an external sound source.

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