Adhesive-free laminating process for environmentally-friendly and moisture-proof pure solid wood floor for underfloor heating

Abstract

Disclosed in the present invention is an adhesive-free laminating process for an environmentally-friendly and moisture-proof pure solid wood floor for underfloor heating, comprising the following steps: S1, selecting a hot melt film having release paper on the back; S2, placing the hot melt film on the back of a floor, the hot melt film side being in contact with the floor, and the release paper side being in contact with a press plate of a hot press; S3, controlling the temperature of the press plate of the hot press to maintain at 125-135°C, and performing hot pressing on the hot melt film for 20-30 s, such that the hot melt film is in a semi-molten state; S4, cooling for 8-12 min, such that the hot melt film in the semi-molten state is cooled and solidified and is then adhered to the back of the floor; and S5, tearing off the release paper, and cutting off the excess back film to obtain a laminated solid wood floor for underfloor heating. The present invention not only has the advantages of being environmentally friendly and odorless, but also has good moisture-proof performance, and can also effectively improve the adhesion firmness of a back film.

Description

A glue-free laminating process for environmentally friendly and moisture-proof pure solid wood floor heating floor Technical Field

[0001] The invention relates to a solid wood floor heating floor, in particular to a glue-free laminating process for a pure solid wood floor heating floor which is both environmentally friendly and moisture-proof. Background Art

[0002] Solid wood floor heating floors are usually covered with a backing film on the back for reasons such as moisture-proofing, quietness, and aesthetics. There are generally two types of backing films used on the market: PP film and PE film, which are adhered with glue (usually acrylic water-based pressure-sensitive adhesive). However, this method (hereinafter referred to as adhesive lamination) has the following problems: 1. Although the acrylic water-based pressure-sensitive adhesive used in adhesive lamination is more environmentally friendly than other glues, it still releases a certain amount of VOCs, which poses a health hazard in floor heating (high temperature) environments. 2. Acrylic water-based pressure-sensitive adhesive has a slight odor. If the floor is laid over a large area, it may cause discomfort to people who are sensitive to odors. 3. With adhesive lamination, water vapor can easily enter the floor through the gaps in the glue, affecting its moisture-proof performance. 4. Acrylic water-based pressure-sensitive adhesive has poor water resistance. If the floor is exposed to a humid environment for a long time, the backing film is likely to fall off. 5. The PP film is brittle and the PE film is highly adhesive. When the backing film is cut, it is easy to cause uneven fractures, affecting the appearance.

[0003] Therefore, it is urgent to develop a new laminating process to overcome the problems existing in the laminating process of traditional solid wood floor heating floors.

[0004] Summary of the Invention

[0005] The purpose of the present invention is to provide an environmentally friendly and moisture-proof pure solid wood floor heating flooring glue-free laminating process. The present invention is not only environmentally friendly and odorless, but also has good moisture-proof performance and can effectively improve the adhesion strength of the backing film.

[0006] The technical solution of the present invention is a glue-free laminating process for a pure solid wood floor heating floor that is both environmentally friendly and moisture-proof, comprising the following steps:

[0007] S1. Select a hot melt film with release paper on the back;

[0008] S2. Place the hot melt film on the back of the floor, with the hot melt film side in contact with the floor and the release paper side in contact with the hot press platen;

[0009] S3, controlling the temperature of the hot press plate to maintain at 125-135 ° C, hot pressing the hot melt film for 20-30 seconds, so that the hot melt film is in a semi-molten state;

[0010] S4, cooling for 8-12 minutes, so that the semi-molten hot melt film is cooled and solidified and adhered to the back of the floor;

[0011] S5. Tear off the release paper and cut off the excess backing film to obtain the finished laminated solid wood floor heating floor.

[0012] In the aforementioned glue-free laminating process for pure solid wood floor heating floors that is both environmentally friendly and moisture-proof, the hot-melt film is a PES hot-melt film.

[0013] In the aforementioned glue-free laminating process for the environmentally friendly and moisture-proof pure solid wood floor heating floor, the thickness of the hot-melt film is 0.08-0.2 mm.

[0014] In the aforementioned glue-free laminating process for the environmentally friendly and moisture-proof pure solid wood floor heating floor, the thickness of the hot-melt film is 0.1 mm.

[0015] In the aforementioned environmentally friendly and moisture-proof glue-free laminating process for pure solid wood floor heating, in step S3, the temperature of the hot press plate is 130° C., and the hot pressing time is 25 seconds.

[0016] Compared with the existing technology, the present invention applies hot-melt film as the backing film to solid wood floor heating floors and adopts a rationally designed and optimized construction process, thereby achieving glue-free lamination. Compared with traditional PP film and PE film, the present invention has the following advantages:

[0017] 1) Improved environmental performance. After testing, the formaldehyde emission of PES hot-melt film laminated floor is only 31% of that of PE film glue laminated floor.

[0018] 2) No glue is added during the PES hot melt film lamination process, and the PES film itself is odorless, so no odor is generated;

[0019] 3) Improved moisture resistance;

[0020] 4) The adhesion strength of the back film is also enhanced, which can effectively prevent the back film from falling off. DETAILED DESCRIPTION

[0021] The present invention will be further described below with reference to the examples, but they are not intended to limit the present invention.

[0022] Example 1. A glue-free laminating process for a pure solid wood floor heating floor that is both environmentally friendly and moisture-proof, comprising the following steps:

[0023] S1. Select a hot melt film with release paper on the back;

[0024] S2. Place the hot melt film on the back of the floor, with the hot melt film side in contact with the floor and the release paper side in contact with the hot press platen;

[0025] S3, controlling the temperature of the hot press plate to maintain at 125-135 ° C, hot pressing the hot melt film for 20-30 seconds, so that the hot melt film is in a semi-molten state;

[0026] S4. Cool for 8-12 minutes to allow the semi-molten hot melt film to cool and solidify and adhere to the back of the floor. On the side in contact with the pressing plate, there is a layer of release paper to ensure that the hot melt film will not adhere to the hot pressing plate.

[0027] S5. Tear off the release paper and cut off the excess backing film to obtain the finished laminated solid wood floor heating floor.

[0028] After tearing off the release paper, use automatic film cutting equipment to cut off the excess backing film.

[0029] The hot melt film is a PES hot melt film.

[0030] The thickness of the hot melt film is 0.08-0.2 mm.

[0031] Example 2: As a specific technical solution, the difference from Example 1 is that the thickness of the hot melt film is 0.1 mm.

[0032] In step S3, the heat press platen temperature is set at 130°C for 25 seconds. Note: The melting point of PES hot-melt film is 120°C. Setting the heat press temperature to 130°C ensures that the film melts. After 25 seconds of hot-pressing, the film is semi-molten.

[0033] In step S4, cooling is performed for 10 minutes.

[0034] The following experiments were conducted using the specific lamination process of Example 2.

[0035] 1) Environmental protection: The formaldehyde emission of the finished product coated with PES hot melt film is 31% of that of the finished product adhered with PE film glue.

[0036] Experiment: 15 pieces each of mangosteen, red oak, and oak (specifications: 900*150*18, moisture content: 12-13) were taken. Among them, 5 pieces were coated with a PES hot melt film lamination process (the specific process of Example 2), 5 pieces were coated with a TPU hot melt film lamination process (the specific process of Example 2), and 5 pieces were coated with a PE adhesive. The formaldehyde emission was tested using the desiccant method ("GB / T 17657-2022 Test methods for physical and chemical properties of wood-based panels and veneered wood-based panels"), and the following results were obtained.

[0037] Appendix 1

[0038] Conclusion: The average formaldehyde emission from PES hot-melt film coatings was 0.010 mg / L, the average formaldehyde emission from TPU hot-melt film coatings was 0.012 mg / L, and the average formaldehyde emission from PE film adhesive coatings was 0.032 mg / L. The formaldehyde emission from PES hot-melt film coatings was 31% of that from PE adhesive coatings.

[0039] 2. Improved moisture-proof performance (moisture-proof performance PES hot melt film > TPU hot melt film coating > PE adhesive coating)

[0040] Take 15 pieces of red oak (specification: 900*150*22, moisture content: 10-11, PES hot melt film coating 5 pieces (using the coating process of Example 2), TPU hot melt film coating (the coating process of Example 2, the difference is the film material) 5 pieces, PE film coating (the coating process of Example 2, the difference is the film material) 5 pieces), place them horizontally in a constant temperature and humidity environment (35°C, 70RH%) for 15 days, and compare the changes in the floor moisture expansion coefficient.

[0041] Appendix 2

[0042] Moisture-proof performance: PES hot-melt film > TPU hot-melt film coating > PE adhesive coating.

[0043] 3. Enhanced back film firmness

[0044] Take 15 pieces of red oak (specification: 900*150*22, moisture content: 10-11, PES hot melt film coating (prepared by the coating process of Example 2) 5 pieces, TPU hot melt film coating (prepared by the coating process of Example 2, the difference is that TPU hot melt film is selected as the back film material) 5 pieces, PE film coating (prepared by the coating process of Example 2, the difference is that PE film is selected as the back film material) 5 pieces), place them horizontally in a constant temperature and humidity environment (35°C, 70RH%) for 30 days, and compare the shedding of the back film.

[0045] Schedule 3

[0046] Example 3. The difference from Example 2 is that in step S5, an automatic tearing device is used to tear off the release paper; the automatic tearing device includes a frame, a screw mechanism is provided on the upper portion of the frame, a slide is provided below the screw mechanism, a lifting cylinder is provided below the slide, a bracket is provided below the lifting cylinder, a winding drum is provided on the bracket, and a drive motor is provided at one end of the bracket for driving the winding drum to rotate.

[0047] A paper clamping mechanism with a rotating function is also provided at the rear end of the frame.

[0048] The surface of the winding drum is provided with an adhesive layer for adhering release paper.

[0049] The working process is as follows: the components fixed on the slide (including the lifting cylinder, bracket, winding drum, etc.) are driven to one end of the solid wood floor by the screw mechanism, and then the lifting cylinder drives the winding drum down so that the surface of the winding drum contacts the release paper at the end. Then the transverse screw mechanism moves along the length of the floor to tear off the release paper. In this process, the winding drum rotates at a certain speed to rewind the torn release paper until the entire release paper is torn off. As for the release paper wound on the winding drum, the screw mechanism and the lifting cylinder work together to drive the winding drum to the position corresponding to the paper clamping mechanism. Then the motor reverses to make the release paper exit the winding drum. The paper clamping mechanism clamps the upper end of the release paper. The lifting cylinder retracts again and brings the winding drum to its original height. In this way, the release paper will overcome the adhesion force on the winding drum under the action of force, and the release paper and the winding drum will be completely separated. The paper clamping mechanism rotates to remove the release paper.

[0050] The present application adopts automatic tearing equipment to replace the traditional manual tearing method, thereby avoiding the phenomenon that the back film layer is easily damaged during the manual tearing process and reducing the labor intensity of workers.

[0051] Example 4. An environmentally friendly, moisture-proof, pure solid wood floor heating floor comprises a solid wood floor, the back of which is flat and provided with a PES hot-melt film; the thickness of the PES hot-melt film is 0.1 mm.

Claims

1. A glue-free laminating process for pure solid wood floor heating floor that is both environmentally friendly and moisture-proof, characterized in that: The following steps are involved: S1. Select a hot melt film with release paper on the back; S2. Place the hot melt film on the back of the floor, with the hot melt film side in contact with the floor and the release paper side in contact with the hot press platen; S3, controlling the temperature of the hot press plate to maintain at 125-135 ° C, hot pressing the hot melt film for 20-30 seconds, so that the hot melt film is in a semi-molten state; S4, cooling for 8-12 minutes, so that the semi-molten hot melt film is cooled and solidified and adhered to the back of the floor; S5. Tear off the release paper and cut off the excess backing film to obtain the finished laminated solid wood floor heating floor.

2. The environmentally friendly and moisture-proof glue-free laminating process for pure solid wood floor heating according to claim 1, characterized in that: The hot melt film is a PES hot melt film.

3. The environmentally friendly and moisture-proof glue-free laminating process for pure solid wood floor heating according to claim 1 is characterized by: The thickness of the hot melt film is 0.08-0.2 mm.

4. The environmentally friendly and moisture-proof glue-free laminating process for pure solid wood floor heating according to claim 1 is characterized by: The thickness of the hot melt film is 0.1 mm.

5. The environmentally friendly and moisture-proof glue-free laminating process for pure solid wood floor heating according to claim 1 is characterized by: In step S3, the temperature of the hot press plate is 130° C., and the hot pressing time is 25 seconds.

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