Battery module, electronic device, charging method, and discharging method

Abstract

The present invention provides a flexible electronic device. The present invention also provides methods for charging and discharging a battery included in an electronic device. The electronic device includes a plurality of battery units, a plurality of control circuit units, a flexible substrate unit, and a display unit. The flexible substrate unit has the plurality of control circuit unit on one surface thereof, with a respective battery unit on each of the control circuit units. The display unit has an area overlapping the plurality of battery units, the plurality of control circuit units, and the flexible substrate unit, and at least one of the plurality of battery units is flexible. A sensor unit is provided between the other surface of the flexible substrate unit or the control circuit units and the flexible battery units, and charging / discharging of the battery units can be controlled according to a detection signal from said sensor unit.

Description

Battery module, electronic device, charging method and discharging method

[0001] The invention disclosed in this specification (hereinafter, sometimes referred to as "the present invention" in this specification) relates to an electricity storage device, a secondary battery, etc., and in particular to a lithium ion battery.

[0002] Alternatively, the present invention relates to an object, a method, or a manufacturing method, or to a process, a machine, a manufacture, or a composition of matter, or to a semiconductor device, a display device, a light-emitting device, a power storage device, a lighting device, an electronic device, a vehicle, or a manufacturing method thereof.

[0003] In recent years, various types of power storage devices have been actively developed, such as lithium-ion batteries, lithium-ion capacitors, and air batteries. In particular, demand for high-power, high-energy-density lithium-ion batteries has rapidly expanded in conjunction with the development of the semiconductor industry, and they are now indispensable in the modern information society as a rechargeable energy source, as they are used in portable information terminals such as mobile phones, smartphones, and notebook computers, portable music players, digital cameras, medical devices, and electrically powered vehicles such as hybrid vehicles (HVs), electric vehicles (EVs), and plug-in hybrid vehicles (PHVs).

[0004] Bendable electronic devices have been proposed for use in electronic devices such as mobile information terminals (Patent Document 1). Bendable batteries (which can also be called flexible batteries) have also been proposed for incorporation into bendable electronic devices (Patent Documents 2, 3, and 4).

[0005] 2. Description of the Related Art In electronic devices such as portable information terminals, the housings are becoming smaller and thinner, and it is therefore desirable for the volume occupied by the battery to be small and for the battery to have a large capacity.

[0006] Batteries may generate heat due to an internal short circuit or overcharging, and it is known that the heat generated can cause thermal runaway, leading to smoke, fire, or explosion.

[0007] Conventionally, to ensure the safety of batteries, a battery control circuit (sometimes referred to as a protection circuit) that prevents overcharging or overdischarging is mounted on a protection circuit board. Furthermore, IC (Integrated Circuit) chips such as a CPU (Central Processing Unit) and memory, which are necessary for operating electronic devices, are mounted on the control circuit board. The protection circuit board and the control circuit board are often rigid boards (hard printed circuit boards), and are fabricated separately and connected by a connector or the like.

[0008] U.S. Patent Application Publication No. 2015 / 0062840, Japanese Patent Application Publication No. 2016-027532, Japanese Patent Application Publication No. 2016-136508, and Japanese Patent Application Publication No. 2017-117776

[0009] An object of one embodiment of the present invention is to realize a structure of an electronic device that can be bent, includes a circuit for safely controlling a battery, and can accommodate space saving due to miniaturization of the housing.

[0010] When a flexible battery is bent, the battery voltage may fluctuate during the bending operation. This is due to changes in the positional relationship between the internal components of the battery, particularly the positive and negative electrodes. Therefore, one object of one embodiment of the present invention is to realize an electronic device that can detect changes in the shape of the battery and control the battery in accordance with the changes.

[0011] In electronic devices having multiple batteries, such as two batteries connected in parallel, when a restriction is imposed, such as stopping the charging and discharging of one battery, charge and discharge control when the restriction is lifted is important. For example, if there is a large voltage difference between one battery whose charging and discharging is restricted and the other battery whose charging and discharging is not restricted, a large current flows to eliminate the voltage difference when the restriction is lifted, which may cause noise and adversely affect the electronic device. Therefore, one object of one embodiment of the present invention is to realize a configuration of an electronic device having multiple batteries connected in parallel that can suppress a large current flow when the restriction on charging and discharging of at least one of the batteries is lifted. Another object of one embodiment of the present invention is to provide a charging and discharging method for an electronic device having multiple batteries connected in parallel that can suppress a large current flow when the restriction on charging and discharging of at least one of the batteries is lifted.

[0012] Another object of one embodiment of the present invention is to provide a battery module configuration that can suppress a large current flow when the charging / discharging of at least one battery in a battery module having a plurality of batteries connected in parallel is restricted and the restriction is lifted.Another object of one embodiment of the present invention is to provide a charging / discharging method that can suppress a large current flow when the charging / discharging of at least one battery in a battery module having a plurality of batteries connected in parallel is restricted and the restriction is lifted.

[0013] Another object of one embodiment of the present invention is to provide a control circuit board with a novel structure. Specifically, an object of one embodiment of the present invention is to provide a control circuit board with a novel flexible structure. Another object of one embodiment of the present invention is to provide a novel control circuit board or an electronic device including the novel control circuit board.

[0014] Another object of one embodiment of the present invention is to provide a battery with a novel structure. Specifically, an object of one embodiment of the present invention is to provide a battery with a novel flexible structure. Another object of one embodiment of the present invention is to provide a novel power storage device or an electronic device equipped with the novel battery.

[0015] Note that the description of these problems does not preclude the existence of other problems. One embodiment of the present invention does not necessarily have to solve all of these problems. Problems other than these can be extracted from the description in the specification, drawings, and claims.

[0016] (A1) One embodiment of the present invention includes a first battery unit, a second battery unit, a first control circuit unit, a second control circuit unit, a flexible substrate unit, and a display unit. The flexible substrate unit has a first region, a second region, and a third region that is more flexible than the first region and the second region. In a cross-sectional view, the third region is located between the first region and the second region. The first control circuit unit is provided on a top surface of the first region, and the second control circuit unit is provided on a top surface of the second region. is provided on the upper surface of the first control circuit portion, the second battery portion is provided on the upper surface of the second control circuit portion, the flexible substrate portion has a wiring layer extending to the first region, the second region and the third region, the first battery of the first battery portion and the second battery of the second battery portion are connected via the wiring layer, and the display portion has a region overlapping with the first battery portion, the second battery portion, the first control circuit portion, the second control circuit portion, the first region, the second region and the third region.

[0017] (A2) Alternatively, one embodiment of the present invention includes a first battery unit, a second battery unit, a first sensor unit, a second sensor unit, a first control circuit unit, a second control circuit unit, a flexible substrate unit, and a display unit. The flexible substrate unit has a first region, a second region, and a third region that is more flexible than the first region and the second region. In a cross-sectional view, the third region is located between the first region and the second region. The first control circuit unit is provided on a top surface of the first region, the second control circuit unit is provided on a top surface of the second region, the first sensor unit is provided on a top surface of the first control circuit unit, and the second region is provided on a top surface of the second region. the sensor unit is provided on the upper surface of the second control circuit unit, the first battery unit is provided on the upper surface of the first sensor unit, the second battery unit is provided on the upper surface of the second sensor unit, the flexible substrate unit has a wiring layer extending to the first region, the second region and the third region, the first battery of the first battery unit and the second battery of the second battery unit are connected via the wiring layer, and the display unit has a region overlapping with the first battery unit, the second battery unit, the first sensor unit, the second sensor unit, the first control circuit unit, the second control circuit unit, the first region, the second region and the third region.

[0018] (A3) In the above (A2), it is preferable that the sensor section has a strain sensor.

[0019] (A4) In the above (A1), (A2), or (A3), the first battery and the second battery preferably have flexibility.

[0020] (A5) In the above (A4), it is preferable that the display section is flexible.

[0021] (A6) Alternatively, one embodiment of the present invention is a charging method for a battery included in an electronic device. The electronic device includes a battery, a strain sensor, and a control circuit. The strain sensor is provided between the battery and the control circuit. The strain sensor has a function of detecting deformation of the battery. The control circuit has a function of controlling start and stop of charging of the battery. The control circuit has a function of receiving a signal from the strain sensor and determining whether the battery is being deformed. During charging, the charging method restricts charging when deformation of the battery starts and releases the charging restriction when deformation ends.

[0022] (A7) In the above (A6), the charging limit can be set by reducing the charging current or by cutting off the charging current.

[0023] (B1) Alternatively, one embodiment of the present invention is a battery module including a first battery unit, a second battery unit, a sensor unit, and a flexible substrate unit, in which the first battery unit and the second battery unit are provided over the flexible substrate unit, the first battery unit has flexibility, the sensor unit is provided between the flexible substrate unit and the first battery unit, and the first battery unit and the second battery unit are electrically connected.

[0024] (B2) Alternatively, one embodiment of the present invention is a battery module including a first battery unit, a second battery unit, a sensor unit, and a flexible substrate unit. The flexible substrate unit has a first region, a second region, and a third region that is more flexible than the first region and the second region. In a cross-sectional view, the third region is located between the first region and the second region. The first battery unit is provided in the first region, and the second battery unit is provided in the second region. The first battery unit is flexible. The sensor unit is provided between the first battery unit and the flexible substrate unit. The flexible substrate unit has a wiring layer that extends to the first region, the second region, and the third region. The first battery unit and the second battery unit are connected via the wiring layer.

[0025] (B3) Alternatively, one embodiment of the present invention includes a first battery unit, a second battery unit, a sensor unit, a first control circuit unit, a second control circuit unit, and a flexible substrate unit. The flexible substrate unit has a first region, a second region, and a third region that is more flexible than the first region and the second region. In a cross-sectional view, the third region is located between the first region and the second region. The first control circuit unit is provided on an upper surface of the first region. The circuit unit is provided on the upper surface of the second region, the sensor unit is provided on the upper surface of the first control circuit unit, the first battery unit is provided on the upper surface of the sensor unit, and the second battery unit is provided on the upper surface of the second control circuit unit, the first battery unit is flexible, the flexible substrate unit has a wiring layer extending to the first region, the second region, and the third region, and the first battery unit and the second battery unit are connected via the wiring layer, which is a battery module.

[0026] (B4) Alternatively, one embodiment of the present invention includes a first battery unit, a second battery unit, a sensor unit, a first switch, a second switch, a third switch, a first DC-DC converter, a second DC-DC converter, a charging circuit, a first terminal, and a second terminal. The first battery unit is flexible. The sensor unit is provided in contact with the first battery unit. The first terminal is connected to a negative terminal of the first battery unit and a negative terminal of the second battery unit. The positive terminal of the first battery unit is connected to one terminal of the first switch and the first DC-DC converter. the positive terminal of the second battery unit is connected to one terminal of the second switch and one terminal of the second DC-DC converter, the other terminal of the first switch and the other terminal of the second switch are connected to one terminal of the charging circuit, the other terminal of the charging circuit is connected to one terminal of the third switch, and the other terminal of the first DC-DC converter, the other terminal of the second DC-DC converter, and the other terminal of the third switch are connected to the second terminal.

[0027] (B5) In one aspect of the present invention, the sensor units (B1) to (B4) preferably have a strain sensor.

[0028] (B6) One embodiment of the present invention is an electronic device including the battery module described in (B1) to (B5).

[0029] (B7) Alternatively, one embodiment of the present invention includes a first battery unit, a second battery unit, a sensor unit, a first control circuit unit, a second control circuit unit, a flexible substrate unit, and a display unit. The flexible substrate unit has a first region, a second region, and a third region that is more flexible than the first region and the second region. In a cross-sectional view, the third region is located between the first region and the second region. The first control circuit unit is provided on a top surface of the first region, and the second control circuit unit is provided on a top surface of the second region. The sensor unit is provided on a top surface of the first region. An electronic device in which a display unit is provided on the upper surface of a control circuit unit, a first battery unit is provided on the upper surface of a sensor unit, a second battery unit is provided on the upper surface of a second control circuit unit, the first battery unit is flexible, the flexible substrate unit has a wiring layer extending to a first region, a second region and a third region, the first battery unit and the second battery unit are connected via the wiring layer, and the display unit has a region overlapping with the first battery unit, the second battery unit, the first control circuit unit, the second control circuit unit, the first region, the second region and the third region.

[0030] (B8) Alternatively, one embodiment of the present invention is a discharging method in an electronic device including a first battery unit and a second battery unit connected in parallel, a strain sensor, and a control circuit, in which, when the value of the strain sensor changes, the control circuit stops discharging the first battery unit, and when the value of the strain sensor stops changing, the control circuit controls the supply of current to the first battery unit in accordance with the voltage difference between the first battery unit and the second battery unit.

[0031] (B9) Alternatively, one embodiment of the present invention is a method for discharging a first battery unit and a second battery unit included in an electronic device. The electronic device includes the first battery unit, the second battery unit, a strain sensor, and a control circuit. The strain sensor has a function of detecting deformation of the first battery unit. The first battery unit and the second battery unit are connected in parallel. The control circuit has a function of controlling start and stop of discharge of the first battery unit and the second battery unit, respectively. When deformation of the first battery unit is detected by a change in the value of the strain sensor while the first battery unit and the second battery unit are discharging, the discharging method stops discharging of the first battery unit.

[0032] (B10) As a discharging method of one embodiment of the present invention, in (B9), it is preferable that the control circuit has a function of detecting the voltage of the first battery unit and the voltage of the second battery unit, and stops discharging the first battery unit when it detects a change in the value of the strain sensor, and then starts discharging the first battery unit when the value of the strain sensor no longer changes and the difference between the voltage of the first battery unit and the voltage of the second battery unit is less than 10 mV.

[0033] (B11) As a discharging method of one embodiment of the present invention, in (B10), the electronic device has a first DC-DC converter connected to a first battery unit and a second DC-DC converter connected to a second battery unit, and when the value of the strain sensor no longer changes, if the difference between the voltage of the first battery unit and the voltage of the second battery unit is 10 mV or more and less than 500 mV, it is preferable that the first battery unit is discharged via the first DC-DC converter and the second battery unit is discharged via the second DC-DC converter.

[0034] (B12) Alternatively, one embodiment of the present invention is a charging method for a first battery unit and a second battery unit included in an electronic device. The electronic device includes the first battery unit, the second battery unit, a strain sensor, and a control circuit. The strain sensor has a function of detecting deformation of the first battery unit. The first battery unit and the second battery unit are connected in parallel. The control circuit has a function of controlling start and stop of charging of the first battery unit and the second battery unit. When deformation of the first battery unit is detected by the strain sensor while the first battery unit and the second battery unit are being charged, the charging method stops the charging of the first battery unit.

[0035] (B13) As a charging method of one embodiment of the present invention, in (B12), it is preferable that the control circuit has a function of detecting the voltage of the first battery unit and the voltage of the second battery unit, and stops charging the first battery unit when it detects a change in the value of the strain sensor, and then starts charging the first battery unit when the value of the strain sensor no longer changes and the difference between the voltage of the first battery unit and the voltage of the second battery unit is less than 10 mV.

[0036] (B12) As a charging method of one embodiment of the present invention, in (B13), the electronic device has a first DC-DC converter connected to a first battery unit and a second DC-DC converter connected to a second battery unit, and when the value of the strain sensor no longer changes, if the difference between the voltage of the first battery unit and the voltage of the second battery unit is 10 mV or more and less than 500 mV, it is preferable that the first battery unit is charged via the first DC-DC converter and the second battery unit is charged via the second DC-DC converter.

[0037] According to one embodiment of the present invention, it is possible to realize a structure of an electronic device that can be bent, includes a circuit for safely controlling a battery, and can accommodate space saving due to a miniaturized housing.

[0038] According to one embodiment of the present invention, an electronic device can be configured in which a change in the shape of a battery can be detected and battery control can be performed in accordance with the state.

[0039] According to one embodiment of the present invention, a control circuit board having a novel structure can be provided. Specifically, a control circuit board having a novel flexible structure can be provided. According to one embodiment of the present invention, a novel control circuit board and an electronic device including the novel control circuit board can be provided.

[0040] According to one embodiment of the present invention, an electronic device having a plurality of batteries connected in parallel can be configured to suppress a large current flow when the charging / discharging restriction on at least one of the batteries is lifted. Alternatively, according to one embodiment of the present invention, an electronic device having a plurality of batteries connected in parallel can be configured to suppress a large current flow when the charging / discharging restriction on at least one of the batteries is lifted.

[0041] According to one embodiment of the present invention, in a battery module having a plurality of batteries connected in parallel, when charging / discharging of at least one battery among the plurality of batteries is restricted, a battery module configuration can be realized that can suppress a large current flow when the restriction is lifted. Alternatively, according to one embodiment of the present invention, in a battery module having a plurality of batteries connected in parallel, when charging / discharging of at least one battery among the plurality of batteries is restricted, a charging / discharging method can be provided that can suppress a large current flow when the restriction is lifted.

[0042] According to one embodiment of the present invention, a battery with a novel structure can be provided. Specifically, a battery with a novel flexible structure can be provided. Alternatively, according to one embodiment of the present invention, a novel power storage device or an electronic device including the novel battery can be provided.

[0043] Note that the description of these effects does not preclude the existence of other effects. One embodiment of the present invention does not necessarily have all of these effects. Effects other than these can be extracted from the description in the specification, drawings, and claims.

[0044] FIG. 1A is a top view showing an example of the configuration of an electronic device, FIG. 1B is a cross-sectional view showing an example of the configuration of an electronic device, and FIG. 1C is a perspective view showing an example of the configuration of an electronic device. FIG. 2A is a cross-sectional view showing an example of the configuration of an electronic device, FIG. 2B is a cross-sectional view showing an example of the configuration of an integrated substrate, and FIG. 2C is a perspective view showing an example of the configuration of an integrated substrate. FIG. 3A is a cross-sectional view showing an example of the configuration of an integrated substrate, and FIG. 3B is a perspective view showing an example of the configuration of an integrated substrate. FIG. 4A is a perspective view showing an example of the configuration of a control circuit section, FIG. 4B is a perspective view showing an example of the configuration of a battery section, and FIGS. 4C and 4D are perspective views showing an example of the configuration of a battery. FIG. 5A is a cross-sectional view showing an example of the configuration of an integrated substrate, and FIG. 5B is a perspective view showing an example of the configuration of an integrated substrate. FIGS. 6A to 6C are block diagrams showing an example of the configuration of an electronic device. FIGS. 7A and 7B are circuit diagrams showing an example of the configuration of an electronic device. FIGS. 8A and 8B are circuit diagrams showing an example of the configuration of an electronic device. FIG. 9 is a flow chart illustrating a charging method. FIG. 10 is a flow chart illustrating a charging method. FIG. 11 is a flow diagram illustrating a discharging method. FIG. 12 is a flow diagram illustrating a discharging method. FIG. 13A is a cross-sectional view illustrating an example of the configuration of an integrated substrate. FIG. 13B is a perspective view illustrating an example of the configuration of an integrated substrate. FIG. 13C is a cross-sectional view illustrating an example of the configuration of an integrated substrate. FIG. 14A is a cross-sectional view illustrating an example of the configuration of an integrated substrate. FIG. 14B is a perspective view illustrating an example of the configuration of an integrated substrate. FIG. 14C is a cross-sectional view illustrating an example of the configuration of an integrated substrate. FIG. 15A is a cross-sectional view illustrating an example of the configuration of an integrated substrate. FIG. 15B is a perspective view illustrating an example of the configuration of an integrated substrate. FIG. 15C is a cross-sectional view illustrating an example of the configuration of an integrated substrate. FIG. 16 is a circuit diagram illustrating an example of the configuration of an integrated substrate. FIG. 17 is a flow diagram illustrating a charging method. FIG. 18 is a flow diagram illustrating a charging method. FIG. 19 is a flow diagram illustrating a charging method. FIGS. 20A and 20B are circuit diagrams illustrating a charging method. FIGS. 21A and 21B are circuit diagrams illustrating a charging method. Fig. 22 is a flow diagram explaining a charging method. Fig. 23 is a flow diagram explaining a charging method. Figs. 24A and 24B are circuit diagrams explaining a charging method. Fig. 25 is a circuit diagram explaining a charging method. Figs. 26A to 26E are diagrams showing examples of battery configurations.

[0073] Figs. 27A to 27C are diagrams showing an example of the configuration of a battery. Figs. 28A to 28C are diagrams showing an example of the configuration of a battery. Figs. 29A to 29C are diagrams showing an example of the configuration of a battery. Fig. 30 is a diagram explaining a method for processing a film. Figs. 31A to 31E are diagrams explaining a method for processing a film. Figs. 32A and 32B are diagrams explaining a method for processing a film. Fig. 32C is a perspective view of a curved battery. Figs. 33A and 33B are diagrams explaining a method for processing a film. Fig. 33C is a perspective view of a curved battery. Figs. 34A to 34C are diagrams showing an example of the configuration of a display device. Figs. 35A to 35F are diagrams showing an example of the configuration of a pixel. Fig. 36 is a diagram showing an example of the configuration of a display device. Figs. 37A and 37B are diagrams showing an example of the configuration of a display device. Figs. 38A to 38F are diagrams showing an example of the configuration of a light-emitting device. Figs. 39A and 39B are diagrams showing an example of the configuration of a light-receiving device. 39C to 39E are diagrams showing configuration examples of the display device.

[0045] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be readily understood by those skilled in the art that various changes can be made in form and detail without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below.

[0046] In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and repeated explanations thereof will be omitted. Furthermore, when referring to similar functions, the same hatching pattern may be used and no particular reference numeral may be assigned.

[0047] Furthermore, for ease of understanding, the position, size, range, etc. of each component shown in the drawings may not represent the actual position, size, range, etc. Therefore, the disclosed invention is not necessarily limited to the position, size, range, etc. disclosed in the drawings.

[0048] In this specification, the ordinal numbers such as "first" and "second" are used for convenience and do not limit the number of components or the order of the components (for example, the order of processes or the order of stacking). Furthermore, an ordinal number assigned to a component in one part of this specification may not match an ordinal number assigned to the same component in another part of this specification or in the claims.

[0049] It should be noted that the terms "film" and "layer" can be interchangeable depending on the circumstances. For example, the term "conductive layer" can be changed to the term "conductive film." Or, for example, the term "insulating film" can be changed to the term "insulating layer."

[0050] In this specification, terms indicating position, such as "above," "below," "upward," or "below" may be used for convenience in describing the positional relationship between components with reference to the drawings. Furthermore, the positional relationship between components changes as appropriate depending on the direction in which each configuration is depicted. Therefore, the terms are not limited to those described in this specification, and can be rephrased appropriately depending on the situation. For example, the expression "insulator located above a conductor" can be rephrased as "insulator located below a conductor" by rotating the orientation of the drawing 180 degrees.

[0051] In this specification and the like, the terms "above" and "below" do not limit the positional relationship of components to "directly above" or "directly below." For example, the expression "gate electrode on a gate insulating film" does not exclude other components between the gate insulating film and the gate electrode.

[0052] Furthermore, the terms "electrode" and "wiring" used in this specification and the like do not limit the functionality of these components. For example, an "electrode" may be used as part of a "wiring," and vice versa. Furthermore, the terms "electrode" and "wiring" also include cases where multiple "electrodes" and "wirings" are integrally formed.

[0053] Furthermore, the functions of "source" and "drain" may be interchanged when transistors of different polarities are used, or when the direction of current flow changes during circuit operation, etc. For this reason, the terms "source" and "drain" may be used interchangeably in this specification.

[0054] In this specification, "connection" includes, as an example, "electrical connection." Note that the term "electrical connection" is sometimes used to define the connection relationship between circuit elements as a physical entity. Furthermore, "electrical connection" includes "direct connection" and "indirect connection." "A and B are directly connected" means that A and B are connected without the intervention of a circuit element (e.g., a transistor, a switch, etc.; wiring is not considered a circuit element). On the other hand, "A and B are indirectly connected" means that A and B are connected via one or more circuit elements.

[0055] For example, assuming that a circuit including A and B is operating, if there is a time during the operation of the circuit when an electrical signal is exchanged or an interaction of electrical potential occurs between A and B, then it can be defined that "A and B are indirectly connected" as objects. Note that even if there is a time during the operation of the circuit when no electrical signal is exchanged or an interaction of electrical potential occurs between A and B, it can still be defined that "A and B are indirectly connected" as long as there is a time during the operation of the circuit when an electrical signal is exchanged or an interaction of electrical potential occurs between A and B.

[0056] An example of a case where "A and B are indirectly connected" is when A and B are connected via the source and drain of one or more transistors. On the other hand, an example of a case where it cannot be said that "A and B are indirectly connected" is when an insulator is present in the path from A to B. Specifically, there are cases where a capacitive element is connected between A and B, and cases where a gate insulating film of a transistor is present between A and B. Therefore, it cannot be said that "the gate (A) of a transistor and the source or drain (B) of the transistor are indirectly connected."

[0057] Another example of a case where it cannot be said that "A and B are indirectly connected" is when multiple transistors are connected via their sources and drains to the path from A to B, and a constant potential V is supplied to a node between one transistor and another transistor from a power supply, GND, etc.

[0058] In this specification and elsewhere, flexibility refers to the property of an object being soft and bendable, i.e., the property of an object being able to deform in response to an external force applied to the object, regardless of whether or not the object has elasticity or the ability to return to its original shape before deformation.

[0059] For example, a flexible electronic device can deform in response to an external force. A flexible electronic device can be used while fixed in a deformed state, or can be used after repeatedly deforming. A flexible display device (also referred to as a flexible display device, flexible display device, flexible display, etc.) can deform in response to an external force. A flexible display device can be used while fixed in a deformed state, or can be used after repeatedly deforming, or can be used in an undeformed state. A flexible battery (also referred to as a flexible battery, flexible battery, flexible battery, etc.) can deform in response to an external force. A flexible battery can be used while fixed in a deformed state, or can be used after repeatedly deforming, or can be used in an undeformed state. A flexible substrate (also referred to as a flexible substrate, flexible substrate, etc.) can deform in response to an external force. A flexible substrate can be used while fixed in a deformed state, or can be used after repeatedly deforming, or can be used in an undeformed state. Note that the above phrase "deform in response to an external force" refers to deformation by an average adult's hand without requiring excessive force. Flexibility can be quantified as deformation of an object due to an external force using a testing machine (such as a tensile testing machine or a compression testing machine) capable of measuring stress-strain.

[0060] Furthermore, in this specification, when an object is described as being flexible, it means that at least a part of the object is flexible. In other words, a flexible object may have an inflexible part (also called a hard part).

[0061] In this specification, "high flexibility" means that when two objects are deformed by the same external force, the object that deforms more is said to be the object with high flexibility. Also, when a first part and a second part of an object are deformed by the same external force, the part that deforms more is said to be the part with high flexibility.

[0062] In this specification and the like, "near a certain value" means a value between 0.9 times and 1.1 times the value.

[0063] Embodiment 1 In this embodiment, a configuration example of an electronic device according to one embodiment of the present invention will be described.

[0064] An electronic device of one embodiment of the present invention includes a plurality of battery units, a plurality of control circuit units, a flexible substrate unit, and a display unit. The plurality of battery units may include, for example, a first battery unit and a second battery unit. The plurality of control circuit units may include, for example, a first control circuit unit and a second control circuit unit.

[0065] The flexible substrate unit has a first region, a second region, and a third region that is more flexible than the first and second regions. In a cross-sectional view, the third region is located between the first and second regions. The flexible substrate unit also has a wiring layer that extends through the first, second, and third regions within the flexible substrate unit.

[0066] The first control circuit unit is provided on the upper surface of the first region, and the second control circuit unit is provided on the upper surface of the second region. The first battery unit is provided on the upper surface of the first control circuit unit, and the second battery unit is provided on the upper surface of the second control circuit unit. The first battery of the first battery unit and the second battery of the second battery unit are connected via a wiring layer.

[0067] In the above, the electronic device of one embodiment of the present invention can include a sensor portion. For example, the sensor portion can include a control circuit portion on one surface of a flexible substrate portion and a sensor portion on the other surface of the flexible substrate portion. Alternatively, the sensor portion can be provided between the control circuit portion and the battery portion. The sensor portion can include a strain sensor that can detect deformation of the electronic device, deformation of the flexible substrate portion, deformation of the battery portion, or deformation of the battery included in the battery portion.

[0068] When charging a battery included in an electronic device of one embodiment of the present invention, the state of charging can be controlled based on the detection result of the strain sensor. For example, charging can be limited when the battery is being deformed. Similarly, the state of discharging can be controlled based on the detection result of the strain sensor. For example, discharging can be limited when the battery is being deformed.

[0069] The display portion includes a region overlapping with the first battery portion, the second battery portion, the first control circuit portion, the second control circuit portion, the first region, the second region, and the third region. The display portion is flexible and can be deformed when the electronic device of one embodiment of the present invention is deformed.

[0070] An electronic device 10 of one embodiment of the present invention will be described with reference to FIGS. 1A to 8B.

[0071] 1A to 1C are schematic diagrams illustrating an electronic device 10. Fig. 1A is a top view of the electronic device 10. Fig. 1B is a cross-sectional view showing the cross-sectional structure taken along dashed dotted line A1-A2 in Fig. 1A. Fig. 1C is a perspective view of the electronic device 10 in a bent state.

[0072] The electronic device 10 includes a display unit 11, a battery unit 12, a control circuit unit 13, and a flexible substrate unit 14. Details of the battery included in the battery unit 12 will be described in Embodiment 3. Details of a display device that can be used as the display unit 11 will be described in Embodiments 4 to 7.

[0073] 1B shows an example in which electronic device 10 has multiple battery units 12 (battery unit 12A, battery unit 12B, battery unit 12C, battery unit 12D, battery unit 12E, battery unit 12F, battery unit 12G, and battery unit 12H). Also, as shown in FIG. 1B, electronic device 10 has multiple control circuit units 13 (control circuit unit 13A, control circuit unit 13B, control circuit unit 13C, control circuit unit 13D, control circuit unit 13E, control circuit unit 13F, control circuit unit 13G, and control circuit unit 13H).

[0074] 1B , the plurality of control circuit units 13 are connected to one surface of the flexible substrate unit 14. The plurality of battery units 12 are connected to the flexible substrate unit 14 via the plurality of control circuit units 13.

[0075] Although not shown, the flexible substrate unit 14 has a sensor unit on the other surface of the flexible substrate unit 14. In other words, the battery unit 12, the control circuit unit 13, the flexible substrate unit 14, and the sensor unit are integrated together. These are collectively called an integrated substrate.

[0076] [Configuration Example 1 of Integrated Substrate] Fig. 2A is a cross-sectional view of the electronic device 10 having the shape shown in Fig. 1C at the cross-sectional position A1-A2. Fig. 2B is a cross-sectional view showing the integrated substrate 20 extracted from Fig. 2A. As shown in Fig. 2B, the sensor unit 15 is provided at a position where it contacts the flexible substrate unit 14. Fig. 2C is a perspective view of the integrated substrate 20 when viewed from the same angle as Fig. 1C.

[0077] 2A to 2C, as the electronic device 10 deforms, the integrated substrate 20 housed inside the electronic device 10 deforms (bends). As shown in Fig. 2B, the integrated substrate 20 can deform at a position (the position indicated by the arrow in the figure) of the flexible substrate unit 14 that is not in contact with the control circuit unit 13.

[0078] Fig. 3A is a schematic cross-sectional view of the integrated substrate 20 in an undeformed (unbent) state, and Fig. 3B is a perspective view showing the layered relationship of the battery unit 12, the control circuit unit 13, the flexible substrate unit 14, and the sensor unit 15 of the integrated substrate 20.

[0079] 3B, the flexible substrate unit 14 has a first region 14a and a second region 14b. The second region 14b has higher flexibility than the first region 14a. In other words, when an external force is applied to the flexible substrate unit 14, the second region 14b is more likely to deform.

[0080] 3B , the plurality of control circuit units 13 are connected to one surface of the flexible substrate unit 14. The plurality of battery units 12 are connected to the flexible substrate unit 14 via the plurality of control circuit units 13. The sensor unit 15 is connected to the other surface of the flexible substrate unit 14.

[0081] Specifically, battery unit 12A is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13A. Battery unit 12B is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13B. Battery unit 12C is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13C. Battery unit 12D is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13D. Battery unit 12E is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13E. Battery unit 12F is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13F. Battery unit 12G is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13G. The battery section 12H is connected to the first region 14a of the flexible substrate section 14 via the control circuit section 13H.

[0082] [Sensor Unit] The sensor unit 15 preferably includes a strain sensor. The sensor unit 15 may also include a temperature sensor, an acceleration sensor, a pressure sensor, or the like.

[0083] As shown in Figure 3B, the strain sensor may be, for example, a strain gauge 15a that forms a wiring pattern on a thin insulator and detects resistance changes due to strain. The strain gauge 15a can convert resistance changes due to deformation of the strain gauge 15a into voltage changes by using a Wheatstone bridge. The voltage that changes in response to the resistance of the strain gauge is called the strain sensor signal or strain sensor value.

[0084] 4A to 4D, an example of the configuration of the battery section 12 and the control circuit section 13 included in the integrated substrate 20 will be described.

[0085] [Control Circuit Unit] Fig. 4A is a perspective view illustrating the inside of the control circuit unit 13. As shown in Fig. 4A, a plurality of IC chips 16 are provided inside the control circuit unit 13 on the flexible substrate unit 14. Furthermore, passive elements such as resistors, capacitors, and coils may be provided inside the control circuit unit 13.

[0086] The IC chip 16, passive elements, etc. are not only connected by wiring inside the control circuit unit 13, but can also be connected to another control circuit unit 13 by a wiring layer inside the flexible substrate unit 14. For example, an IC chip inside the control circuit unit 13A and an IC chip inside the control circuit unit 13B can be connected by a wiring layer inside the flexible substrate unit 14. In other words, the multiple control circuit units 13 (control circuit unit 13A, control circuit unit 13B, control circuit unit 13C, control circuit unit 13D, control circuit unit 13E, control circuit unit 13F, control circuit unit 13G, and control circuit unit 13H) can be connected to each other by a wiring layer extending inside the flexible substrate unit 14.

[0087] The number of control circuit units 13 described above is an example for the purpose of explanation, and the number of control circuit units 13 included in the integrated substrate 20 is not limited to the above number. For example, the integrated substrate 20 may be configured to have two control circuit units 13, or three or more control circuit units 13.

[0088] [Battery Unit] Figure 4B is a perspective view illustrating the interior of the battery unit 12. As shown in Figure 4B, a battery 110 is provided inside the battery unit 12 on the control circuit unit 13. In other words, the battery unit 12 is a unit for providing the battery 110, and includes a portion for fixing the battery 110, a portion for connecting the lead terminals of the battery 110, and wiring portions (not shown). The battery 110 can be connected to a wiring layer extending inside the flexible substrate unit 14 via the control circuit unit 13. In other words, the battery 110 can be connected to another battery unit 12 by a wiring layer inside the flexible substrate unit 14. For example, the battery inside battery unit 12A and the battery inside battery unit 12B can be connected by a wiring layer inside the flexible substrate unit 14. In other words, multiple battery units 12 (battery unit 12A, battery unit 12B, battery unit 12C, battery unit 12D, battery unit 12E, battery unit 12F, battery unit 12G and battery unit 12H) can be connected to each other by a wiring layer inside the flexible substrate unit 14.

[0089] Therefore, the batteries of the multiple battery units 12 of the integrated substrate 20 can be connected in series or in parallel for use, or can be connected in any combination of series and parallel for use.

[0090] For example, it is possible to supply power to the display unit 11, which may require a relatively high voltage (for example, about 10 V), by connecting the battery unit 12 in series, and at the same time, to supply power to an IC chip or the like that does not require a high voltage by connecting the battery unit 12 in parallel or in a single connection, thereby making it possible to efficiently use the power of the battery unit 12 and to use the electronic device for a long period of time.

[0091] The battery section 12 may be provided over the entire control circuit section 13, but may not be provided in a position overlapping an IC chip that generates a large amount of heat, such as a CPU.

[0092] 4C, a battery 110 (also called a prismatic battery) having a metal exterior body 111 can be used as the battery 110. The exterior body 111 can be made of a metal such as aluminum or stainless steel.

[0093] Furthermore, as shown in FIG. 4D , a battery 110A (also referred to as a laminated battery or laminated cell) having an exterior body 111A made of a laminated film can be used. FIG. 4D shows an example in which a laminated film having an uneven surface is used as the exterior body 111A of the battery 110A, and in this case, the battery 110A can be bent. Note that a flat laminated film may also be used for the battery 110A. A detailed description of a configuration example of a bendable battery will be given in Embodiment 3. For configurations not described in Configuration Example 1 of the integrated substrate, the descriptions of Configuration Example 2 and subsequent configurations of the integrated substrate can be referenced.

[0094] [Configuration Example 2 of Integrated Substrate] When a bendable battery 110A as shown in Fig. 4D is used for the battery section 12, it is preferable to provide a sensor section for detecting deformation of the battery. Figs. 5A and 5B are diagrams illustrating a configuration example of an integrated substrate 20A having a sensor section 17 for detecting deformation of the battery.

[0095] 5A and 5B are diagrams illustrating an integrated substrate 20A, which is a modified example of the integrated substrate 20 shown in Fig. 3A and 3B. Fig. 5A is a cross-sectional view of the integrated substrate 20A, and Fig. 5B is a perspective view showing the layered relationship of the battery unit 12, the control circuit unit 13, the flexible substrate unit 14, and the sensor unit 17 of the integrated substrate 20A.

[0096] As shown in Figures 5A and 5B, the integrated substrate 20A differs from the integrated substrate 20 shown in Figures 3A and 3B in that it has a sensor unit 17 (sensor unit 17A, sensor unit 17B, sensor unit 17C, sensor unit 17D, sensor unit 17E, sensor unit 17F, sensor unit 17G and sensor unit 17H) between the battery unit 12 and the control circuit unit 13.

[0097] 5B , the plurality of control circuit units 13 are connected to one surface of the flexible substrate unit 14. The plurality of battery units 12 are connected to the flexible substrate unit 14 via the plurality of control circuit units 13, and the plurality of sensor units 17 are located between the plurality of battery units 12 and the plurality of control circuit units 13. The plurality of sensor units 17 are also connected to the flexible substrate unit 14 via the plurality of control circuit units 13. The sensor unit 17 may be configured to have a strain sensor similar to that of the sensor unit 15.

[0098] Specifically, battery unit 12A is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13A, and sensor unit 17A is located between battery unit 12A and control circuit unit 13A. Battery unit 12B is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13B, and sensor unit 17B is located between battery unit 12B and control circuit unit 13B. Battery unit 12C is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13C, and sensor unit 17C is located between battery unit 12C and control circuit unit 13C. Battery unit 12D is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13D, and sensor unit 17D is located between battery unit 12D and control circuit unit 13D. Furthermore, battery unit 12E is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13E, and sensor unit 17E is located between battery unit 12E and control circuit unit 13E. Battery unit 12F is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13F, and sensor unit 17F is located between battery unit 12F and control circuit unit 13F. Battery unit 12G is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13G, and sensor unit 17G is located between battery unit 12G and control circuit unit 13G. Battery unit 12H is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13H, and sensor unit 17H is located between battery unit 12H and control circuit unit 13H.

[0099] Sensor unit 17A is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13A. Sensor unit 17B is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13B. Sensor unit 17C is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13C. Sensor unit 17D is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13D. Sensor unit 17E is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13E. Sensor unit 17F is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13F. Sensor unit 17G is connected to first region 14a of flexible substrate unit 14 via control circuit unit 13G. The sensor unit 17H is connected to the first region 14a of the flexible substrate unit 14 via the control circuit unit 13H.

[0100] Although not shown in FIGS. 5A and 5B, the sensor unit 15 may be provided on the other surface of the flexible substrate unit 14 as shown in FIGS. 3A and 3B.

[0101] For other configurations than those described above, the description of the above-mentioned configuration example 1 of the integrated substrate can be referred to.

[0102] [Block Diagram, Circuit Diagram] Figures 6A to 6C are block diagrams including the configuration examples described in Figures 5A and 5B. Figures 6A to 6C are illustrated taking into account the positional relationship, and are shown in a positional relationship corresponding to the cross-sectional view of Figure 1B, for example.

[0103] 6A is a block diagram of electronic device 10A having display unit 11, battery unit 12, control circuit unit 13, flexible substrate unit 14, and sensor unit 17. Note that display unit 11, battery unit 12, control circuit unit 13, flexible substrate unit 14, and sensor unit 17 of electronic device 10A are also referred to as integrated substrate 20A.

[0104] The battery unit 12 includes a battery unit 12A, a battery unit 12B, a battery unit 12C, a battery unit 12D, a battery unit 12E, a battery unit 12F, a battery unit 12G, and a battery unit 12H, and FIG. 6A illustrates the battery units 12A, 12B, and 12H. The control circuit unit 13 includes a control circuit unit 13A, a control circuit unit 13B, a control circuit unit 13C, a control circuit unit 13D, a control circuit unit 13E, a control circuit unit 13F, a control circuit unit 13G, and a control circuit unit 13H, and FIG. 6A illustrates the control circuit units 13A, 13B, and 13H. The sensor unit 17 includes a sensor unit 17A, a sensor unit 17B, a sensor unit 17C, a sensor unit 17D, a sensor unit 17E, a sensor unit 17F, a sensor unit 17G, and a sensor unit 17H, and FIG. 6A illustrates the sensor units 17A, 17B, and 17H.

[0105] 6A shows an example of the configuration of electronic device 10A, in which control circuit unit 13A includes battery control IC 16A, control circuit unit 13B includes CPU 16B, and control circuit unit 13H includes driver IC 16H. Driver IC 16H includes a driver circuit for outputting video to display unit 11.

[0106] As shown in Fig. 6A, battery unit 12A is connected to battery control IC 16A included in control circuit unit 13A. Battery unit 12B is connected to battery control IC 16A included in control circuit unit 13A via control circuit unit 13B and flexible substrate unit 14. Similarly, battery unit 12H is connected to battery control IC 16A included in control circuit unit 13A via control circuit unit 13H and flexible substrate unit 14. Like battery unit 12A shown in Fig. 6A, battery unit 12H may be connected to battery control IC 16A without going through flexible substrate unit 14.

[0107] 6A, the sensor unit 17A is connected to the battery control IC 16A included in the control circuit unit 13A. The sensor unit 17B is connected to the battery control IC 16A included in the control circuit unit 13A via the control circuit unit 13B and the flexible substrate unit 14. Similarly, the sensor unit 17H is connected to the battery control IC 16A included in the control circuit unit 13A via the control circuit unit 13H and the flexible substrate unit 14. As in the sensor unit 17A shown in FIG. 6A, the sensor unit 17H may be connected to the battery control IC 16A without going through the flexible substrate unit 14.

[0108] The battery control IC 16A can be configured to receive not only signals from the sensor unit 17 (sensor units 17A to 17H) but also signals from another sensor unit that measures the temperature, current, voltage, etc. of the battery unit 12 (battery units 12A to 12H). The battery control IC 16A can determine the status of the battery in the battery unit 12 based on signals from the sensor unit 17 and other sensors, and control the charging and discharging of the battery (charge and discharge control). Details of charge and discharge control using the sensor unit 17 will be described later.

[0109] 6B and 6C are block diagrams illustrating a configuration in which a plurality of battery units 12 (battery units 12A to 12H) are connected via a flexible substrate unit 14. FIG.

[0110] As shown in Fig. 6B, the battery units 12A to 12H can be connected in series via a wiring layer included in the flexible substrate unit 14. Alternatively, as shown in Fig. 6C, the battery units 12A to 12H can be connected in parallel via a wiring layer included inside the flexible substrate unit 14. Alternatively, although not shown, the battery units 12A to 12H can be connected in any combination of series and parallel via a wiring layer included in the flexible substrate unit 14.

[0111] Figures 7A to 8B are circuit diagrams corresponding to the block diagrams shown in Figures 6A and 6C. In Figures 7A to 8B, power supply system connections are shown with solid lines, and signal system connections are shown with dashed dotted lines. Note that the power supply system connections and signal system connections can both be considered electrical connections. Figures 7A and 7B are connected at connection terminal M+ and connection terminal M-. Note that the configuration ranging from connection terminal M+ to connection terminal M- shown in Figure 7A is sometimes referred to as a battery module.

[0112] The configuration example shown in FIG. 7A includes a current sensor 18A, a voltage sensor 18B, a switch 19A, and a switch 19B in addition to the configuration described in FIG. 6A.

[0113] 7A, the plurality of sensor units 17 (sensor units 17A to 17H), current sensor 18A, voltage sensor 18B, switch 19A, and switch 19B are each connected to battery control IC 16A. The VCC terminal of battery control IC 16A is connected to the power supply system on the positive side of battery unit 12, and the GND terminal is connected to the power supply system on the negative side of battery unit 12.

[0114] The configuration example shown in FIG. 7B includes, in addition to the configuration described in FIG. 6A, a memory 16C, a DCDC converter 16D, a charging control IC 16E, a wireless charging power receiving unit 21A, and a wired charging power receiving unit 21B.

[0115] 7B , DCDC converter 16D has a function of converting the voltage of direct current supplied from battery module 12 and supplying the converted voltage to display module 11, drive IC 16H, CPU 16B, and memory 16C. Charging control IC 16E is connected to wireless charging power receiving module 21A and wired charging power receiving module 21B. Charging control IC 16E has a function of supplying power supplied from wireless charging power receiving module 21A or wired charging power receiving module 21B to battery module 12.

[0116] 8A is a circuit diagram showing an example of the configuration of the switch 19A shown in FIG. 7A, and FIG. 8B is a circuit diagram showing an example of the configuration of the switch 19B shown in FIG. 7A.

[0117] As shown in FIG. 8A , the switch 19A includes a transistor 202A, a diode 203A, a terminal 204A, a terminal 205A, and a terminal 206A. The terminal 204A is connected to the battery module 12, the terminal 205A is connected to the connection terminal M+, and the terminal 206A is connected to the battery control IC 16A. The terminal 204A is connected to the drain (D) of the transistor 202A and the anode of the diode 203A. Note that the source and drain of a transistor may be interchanged depending on the applied voltage. However, to facilitate understanding of the circuit configuration, in a p-channel transistor, the terminal with a higher potential during charging is referred to as the source, and the terminal with a lower potential is referred to as the drain. In an n-channel transistor, the terminal with a higher potential is referred to as the drain, and the terminal with a lower potential is referred to as the source.

[0118] When the switch 19A has the configuration described in FIG. 8A, the switch 19A has the function of passing and cutting off the charging current of the battery module 12, and the function of passing the discharging current of the battery module 12.

[0119] 8B, the switch 19B has a transistor 202B, a diode 203B, a terminal 204B, a terminal 205B, and a terminal 206B. The terminal 204B is connected to the battery module 12, the terminal 205B is connected to the connection terminal M+, and the terminal 206B is connected to the battery control IC 16A. The terminal 204B is connected to the drain (D) of the transistor 202B and the cathode of the diode 203B.

[0120] When the switch 19B has the configuration described in FIG. 8B, the switch 19B has the function of passing and cutting off the discharge current of the battery module 12, and the function of passing the charge current of the battery module 12.

[0121] When the integrated substrate 20 has a strain sensor (sensor unit 15 or sensor unit 17), as in the example of the integrated substrate 20 described above, it is possible to detect a change in shape of the integrated substrate 20. In this configuration, it is possible to control the battery unit 12 in accordance with the change in shape of the integrated substrate 20. An example of the control of the battery unit 12 in accordance with the change in shape of the integrated substrate 20 will be described using the flow charts shown in Figures 9 to 12.

[0122] [Charging Control] A method for charging the battery of the electronic device 10 will be described. As shown in the configuration example above, the strain sensor in the sensor unit 17 has the function of detecting deformation of the battery (e.g., battery 110A) in the battery unit 12, and transmits a signal corresponding to the deformation of the battery to a control circuit that controls charging. The control circuit has the function of receiving a signal from the strain sensor and determining whether the battery is being deformed. In this charging method, charging is restricted when battery deformation begins, and the charging restriction is lifted when the deformation ends. The charging method will be described in detail using the flow charts shown in Figures 9 and 10.

[0123] When the charging flow is started, in step S101, state determination 1 is performed based on the value of the strain sensor included in sensor unit 15 or sensor unit 17.

[0124] If the value of the strain sensor is changing in state determination 1, that is, the shape of the integrated substrate 20 is changing (during bending or stretching), the process returns to step S101. Alternatively, if the value of the strain sensor is not changing or the change in the signal is equal to or less than the threshold value in state determination 1, that is, the shape of the integrated substrate 20 is not changing, the process proceeds from step S102 to step S103, and charging of the battery module 12 is started.

[0125] After charging has started, in step S104, state determination 2 is performed based on the voltage of the battery unit 12, the current of the battery unit 12, and the value of the strain sensor. If the condition for terminating charging is met in state determination 2, the process proceeds from step S105 to step S108, charging is stopped, and the charging flow ends.

[0126] The charging termination condition is determined to be met when any one of the following conditions is met: the voltage of the battery unit 12 is equal to or higher than the upper charging voltage limit; in the case of constant voltage charging, the charging current of the battery unit 12 is equal to or lower than the termination current value; or the elapsed time from the start of charging is equal to or longer than the termination time.

[0127] Alternatively, if the charging termination condition is not met and the shape of the integrated substrate 20 is not changing in the second state determination, normal charging continues and the process returns from step S106 to step S104. At this time, a waiting time may be set before the second state determination in step S104 is performed again. The waiting time can be set to any time, such as 1 second, 10 seconds, 1 minute, or 10 minutes.

[0128] Alternatively, if the condition for terminating charging is not met and the shape of the integrated substrate 20 is changing in the state determination 2, the process proceeds from step S106 to step S107, and charging restriction is initiated. The charging restriction may be implemented by reducing the charging current, cutting off the charging current, or the like.

[0129] After the charging restriction is started, the process proceeds from step S107 to step S111 in Fig. 10. Note that connector A in Fig. 9 is a symbol for proceeding to connector A in Fig. 10. In step S111 in Fig. 10, state determination 3 is performed based on the voltage of the battery module 12, the current of the battery module 12, and the value of the strain sensor.

[0130] If the charging termination condition is met in the state determination 3, the process proceeds from step S112 to step S108 in Fig. 9, where charging is stopped and the charging flow ends. Note that the connector B in Fig. 10 is a symbol that proceeds to the connector B in Fig. 9.

[0131] Alternatively, if the charging termination condition is not met and the shape of the integrated substrate 20 is not changing in state determination 3, the process proceeds from step S113 to step S114. In step S114, the charging restriction is released and the process transitions to a normal charging state. After step S114, the process proceeds to step S104 in FIG. 9. At this time, a waiting time may be set before performing state determination 2 of step S104 again. Note that connector C in FIG. 10 is a symbol for proceeding to connector C in FIG. 9.

[0132] Alternatively, if the charging termination condition is not satisfied and the shape of the integrated substrate 20 is changing in the state determination 3, the process returns from step S113 to step S111. At this time, a waiting time may be set before performing the state determination 3 in step S111 again.

[0133] The above is an example of a method for charging the battery module 12 in response to a change in the shape of the integrated substrate 20.

[0134] [Discharge Control] A method for discharging the battery of the electronic device 10 will be described. As shown in the configuration example above, the strain sensor of the sensor unit 17 has the function of detecting deformation of the battery (e.g., battery 110A) of the battery unit 12 and transmitting a signal corresponding to the deformation of the battery to a control circuit that controls charging. The control circuit has the function of receiving a signal from the strain sensor and determining whether the battery is being deformed. In this discharge method, discharge restriction is performed when battery deformation begins, and the discharge restriction is released when the deformation ends. The discharge method will be described in detail using the flow charts shown in Figures 11 and 12.

[0135] When the discharge flow is started, in step S201, state determination 4 is performed based on the value of the strain sensor included in sensor unit 15 or sensor unit 17.

[0136] If the value of the strain sensor is changing in state determination 4, that is, the shape of the integrated substrate 20 is changing (during bending or stretching), the process returns to step S201. Alternatively, if the value of the strain sensor is not changing or the change in the signal is equal to or less than the threshold value in state determination 4, that is, the shape of the integrated substrate 20 is not changing, the process proceeds from step S102 to step S203, and discharging of the battery module 12 is started.

[0137] After the discharge starts, in step S204, a fifth state determination is performed based on the voltage of the battery module 12, the current of the battery module 12, and the value of the strain sensor. If the discharge termination condition is met in the fifth state determination, the process proceeds from step S205 to step S208, where the discharge is terminated and the discharge flow ends. Note that before the discharge is terminated, a shutdown process can be performed to stop the electronic device.

[0138] For example, when the voltage of the battery module 12 is equal to or lower than the lower limit voltage of discharge, it is determined that the discharge termination condition is met.

[0139] Alternatively, if the discharge termination condition is not satisfied and the shape of the integrated substrate 20 is not changing in the state determination 5, normal discharge continues and the process returns from step S206 to step S204. At this time, a waiting time may be set before performing the state determination 5 of step S204 again. The waiting time can be set to any time, such as 1 second, 10 seconds, 1 minute, or 10 minutes.

[0140] Alternatively, if the discharge termination condition is not satisfied and the shape of the integrated substrate 20 is changing in state determination 5, the process proceeds from step S206 to step S207, and discharge restriction is initiated. Discharge restriction can be implemented by temporarily restricting the operation of elements that consume large current among the elements of the electronic device. Operational restrictions can include, for example, restricting communication with the outside of the electronic device, restricting the light intensity of the display, or restricting the CPU operating rate.

[0141] After the discharge restriction is started, the process proceeds from step S207 to step S211 in Fig. 12. Note that connector D in Fig. 11 is a symbol for proceeding to connector D in Fig. 12. In step S211 in Fig. 12, state determination 6 is performed based on the voltage of the battery module 12, the current of the battery module 12, and the value of the strain sensor.

[0142] If the discharge termination condition is met in the state determination 6, the process proceeds from step S212 to step S208 in Fig. 11, where the discharge is stopped and the discharge flow ends. Note that the connector E in Fig. 12 is a symbol that proceeds to the connector E in Fig. 11.

[0143] Alternatively, if the discharge termination condition is not satisfied and the shape of the integrated substrate 20 is not changing in state determination 6, the process proceeds from step S213 to step S214. In step S214, the discharge restriction is released and the process transitions to a normal discharge state. After step S214, the process proceeds to step S204 in FIG. 11. At this time, a waiting time may be set before performing state determination 5 in step S204 again. Note that connector F in FIG. 12 is a symbol for proceeding to connector F in FIG. 11.

[0144] Alternatively, if the discharge termination condition is not satisfied and the shape of the integrated substrate 20 is changing in the state determination 6, the process returns from step S213 to step S211. At this time, a waiting time may be set before the state determination 6 in step S211 is performed again.

[0145] The above is an example of a method for discharging the battery module 12 in response to a change in the shape of the integrated substrate 20 .

[0146] [Configuration Example 3 of Integrated Substrate] Figures 13A to 13C are diagrams illustrating an integrated substrate 20B, which is a modified example of the integrated substrate 20A shown in Figures 5A and 5B. Figure 13A is a cross-sectional view of the integrated substrate 20B, and Figure 13B is a perspective view showing the layered relationship of the battery unit 12, control circuit unit 13, flexible substrate unit 14, and sensor unit 17 of the integrated substrate 20B. Figure 13C is a cross-sectional view of the integrated substrate 20B in a bent state.

[0147] In the integrated substrate 20 and the integrated substrate 20A, examples have been shown in which the number of battery units 12 and the number of control circuit units 13 are the same, but this is not limited to this, and as shown in Figures 13A to 13C, the number of battery units 12 possessed by the integrated substrate 20B may be fewer than the number of control circuit units 13.

[0148] As shown in Figures 13A to 13C, the battery section 12 of the integrated substrate 20B has a battery section 12A at a position overlapping with multiple control circuit sections 13 (control circuit section 13A, control circuit section 13B, control circuit section 13C and control circuit section 13D), and has a battery section 12B at a position overlapping with multiple control circuit sections 13 (control circuit section 13E, control circuit section 13F, control circuit section 13G and control circuit section 13H).

[0149] 13A and 13B, the integrated substrate 20B may have a plurality of sensor units 17 (sensor unit 17A, sensor unit 17B, sensor unit 17C, sensor unit 17D, sensor unit 17E, sensor unit 17F, sensor unit 17G, and sensor unit 17H) between the battery unit 12 and the control circuit unit 13. The number of sensor units 17 may be the same as the number of battery units 12, or a configuration in which only one sensor unit 17 is provided may be used.

[0150] When the number of battery units 12 is smaller than the control circuit unit 13, as in the integrated substrate 20B shown in this configuration example, it is preferable to use a bendable battery for the battery unit 12. Furthermore, the battery unit 12 can be fixed at a position overlapping a portion of the control circuit unit 13. For example, as shown by the dashed-dotted line in FIG. 13C, it is preferable to fix the battery unit 12A at a position overlapping the control circuit unit 13D. Similarly, it is preferable to fix the battery unit 12B at a position overlapping the control circuit unit 13E. When the battery units 12A and 12B are fixed at the positions shown in FIG. 13C, it is preferable to provide the connection terminals (positive and negative terminals) of the battery units 12A and 12B in the fixed portions indicated by the dashed-dotted lines.

[0151] For other configurations than those described above, the descriptions of the above-mentioned configuration example 1 of the integrated substrate and configuration example 2 of the integrated substrate can be referred to.

[0152] 14A to 14C are diagrams illustrating an integrated substrate 20C, which is a modified example of the integrated substrate 20B shown in Fig. 14A and Fig. 14B. Fig. 14A is a cross-sectional view of the integrated substrate 20C, and Fig. 14B is a perspective view showing the layered relationship of the battery unit 12, the control circuit unit 13, the flexible substrate unit 14, and the sensor unit 17 of the integrated substrate 20C. Fig. 14C is a cross-sectional view of the integrated substrate 20C in a bent state.

[0153] As shown in FIGS. 14A to 14C, the integrated substrate 20C differs from the integrated substrate 20B in that it has one battery section 12.

[0154] The battery unit 12 can be fixed at a position overlapping a part of the control circuit unit 13. For example, as shown by the dashed line in Fig. 14C, it is preferable to fix the battery unit 12 at a position overlapping the control circuit unit 13A. When fixing the battery unit 12 at the position shown in Fig. 14C, it is preferable to provide the connection terminals (positive terminal, negative terminal) of the battery unit 12 at the fixed part shown by the dashed line.

[0155] For other configurations than those described above, reference can be made to the descriptions of the above-mentioned configuration examples 1 to 3 of the integrated substrate.

[0156] The structure, method, and the like described in this embodiment can be used in appropriate combination with the structure, method, and the like described in other embodiments.

[0157] Second Embodiment In this embodiment, a modification of the electronic device 10 and the integrated substrate 20 described in the first embodiment will be described.

[0158] In the first embodiment, as configuration examples of the integrated substrate 20, an example of an integrated substrate 20A including a non-flexible battery unit, an example of an integrated substrate 20B including multiple flexible battery units, and an example of an integrated substrate 20C including one flexible battery unit have been described. In this embodiment, a configuration example in which the integrated substrate 20 includes both a flexible battery unit and a non-flexible battery unit will be described using Figures 15 and 16. Furthermore, a method of controlling charging and a method of controlling discharging in an electronic device 10 including the integrated substrate 20 of this configuration example will be described using Figures 17 to 25.

[0159] [Integrated Substrate Configuration Example 5] Figures 15A to 15C are diagrams illustrating an integrated substrate 20D, which is a modified example of the integrated substrate 20A shown in Figures 5A and 5B. Figure 15A is a cross-sectional view of the integrated substrate 20D, and Figure 15B is a perspective view showing the layered relationship of the battery unit 12, control circuit unit 13, flexible substrate unit 14, and sensor unit 17 included in the integrated substrate 20D. Figure 15C is a cross-sectional view of the integrated substrate 20D in a bent state. The battery unit 12 includes a flexible battery unit 12J and a non-flexible battery unit 12K. The battery unit 12J includes a flexible battery, such as the battery 110A shown in Figure 4D, and the battery unit 12K includes a non-flexible battery, such as the battery 110 shown in Figure 4C.

[0160] As shown in Figures 15A to 15C, the number of battery units 12 (battery unit 12J and battery unit 12K) that the integrated substrate 20D has may be smaller than the number of control circuit units 13 (control circuit units 13A to 13H).

[0161] As shown in Figures 15A to 15C, the battery section 12 of the integrated substrate 20D has a battery section 12J at a position overlapping with multiple control circuit sections 13 (control circuit section 13A, control circuit section 13B, control circuit section 13C, control circuit section 13D, control circuit section 13E, control circuit section 13F and control circuit section 13G), and has a battery section 12K at a position overlapping with control circuit section 13H.

[0162] 15A and 15B, the integrated substrate 20D may have a sensor unit 17, and may have a plurality of sensor units 17 (sensor unit 17A, sensor unit 17B, sensor unit 17C, sensor unit 17D, sensor unit 17E, sensor unit 17F, sensor unit 17G, and sensor unit 17H) between the battery unit 12 and the control circuit unit 13. The number of sensor units 17 may be the same as or greater than the number of battery units 12, but it is preferable to have at least one sensor unit 17 in a position overlapping with the flexible battery unit 12J. For example, in FIG. 15A, it is preferable to have at least one of sensor units 17A to 17G.

[0163] In the integrated substrate 20D shown in this configuration example, the battery unit 12J can be fixed at a position overlapping a part of the control circuit unit 13. For example, as shown by the dashed line in Figure 15C, it is preferable to fix the battery unit 12J at a position overlapping the control circuit unit 13A. When fixing the battery unit 12J at the position shown in Figure 15C, it is preferable to provide the connection terminals (positive terminal, negative terminal) of the battery unit 12J in the fixed part shown by the dashed line.

[0164] FIG. 16 shows a circuit diagram including the configuration example described in FIG. 15A to FIG. 15C. In FIG. 16, power supply connections are indicated by solid lines, and signal connections are indicated by dashed lines. Furthermore, the connection terminals M+ and M- in FIG. 16 can be configured to be connected to the connection terminals M+ and M- in FIG. 7B. The configuration ranging from the connection terminals M+ to M- in FIG. 16 may be referred to as a battery module.

[0165] 16 shows a part of the circuit configuration of the integrated substrate 20D. The integrated substrate 20D has a battery unit 12J, a battery unit 12K, a battery control IC 16A, a sensor unit 17J, a current sensor 18A, a voltage sensor 18C, a switch 19A, a switch 19B, a switch 19C, a switch 19D, a switch 19E, a DCDC converter 22A, a DCDC converter 22B, and a charging circuit 23.

[0166] 16 , on the integrated circuit board 20D, the sensor unit 17J, the current sensor 18A, the voltage sensor 18C, the switches 19A, 19B, 19C, 19D, and 19E, the DCDC converter 22A, the DCDC converter 22B, and the charging circuit 23 are each connected to the battery control IC 16A. Also, on the integrated circuit board 20D, the VCC terminal of the battery control IC 16A is connected to the power supply system on the positive side of the battery module 12, and the GND terminal of the battery control IC 16A is connected to the power supply system on the negative side of the battery module 12.

[0167] Battery control IC 16A has a function of receiving signals from sensor unit 17J, current sensor 18A, and voltage sensor 18C. Battery control IC 16A also has a function of controlling switches 19A, 19B, 19C, 19D, and 19E, DCDC converter 22A, DCDC converter 22B, and charging circuit 23. Sensor unit 17J has a strain sensor and is provided in contact with flexible battery unit 12J, so that battery control IC 16A can detect whether battery unit 12J is bent based on the signal received from sensor unit 17J.

[0168] In the integrated substrate 20D, the flexible battery module 12J and the non-flexible battery module 12K are connected in parallel. In FIG. 16 , the negative terminal of the battery module 12J is connected to the negative terminal of the battery module 12K. The negative terminals of the battery module 12J and the battery module 12K are connected to the connection terminal M−. The voltage sensor 18C is connected to the positive and negative terminals of the battery module 12J and also to the positive and negative terminals of the battery module 12K. In other words, the voltage sensor 18C can detect the voltage of both the battery module 12J and the battery module 12K.

[0169] 16 , the positive terminal of battery module 12J is connected to one side of switch 19C and one side of DCDC converter 22A. The positive terminal of battery module 12K is connected to one side of switch 19D and one side of DCDC converter 22B. The other side of switch 19C is connected to the other side of switch 19D and one side of charging circuit 23. The other side of charging circuit 23 is connected to one side of switch 19E. The other side of switch 19E is connected to the other side of DCDC converter 22A and the other side of DCDC converter 22B.

[0170] As shown in FIG. 16 , the other side of switch 19E, the other side of DCDC converter 22A, and the other side of DCDC converter 22B are connected to one side of current sensor 18A. The other side of current sensor 18A is connected to one side of switch 19A, and the other side of switch 19A is connected to one side of switch 19B. The other side of switch 19B is connected to connection terminal M+. That is, switch 19E, DCDC converter 22A, and DCDC converter 22B are connected to connection terminal M+ via current sensor 18A, switch 19A, and switch 19B. Note that in the configuration example shown in FIG. 16 , current sensor 18A, switch 19A, and switch 19B are provided on the positive terminal side of battery module 12J and battery module 12K, but they may also be provided on the negative terminal side of battery module 12J and battery module 12K. For details of elements such as switches, see the descriptions of FIGS. 7A to 8B .

[0171] When the integrated substrate 20D described above has a strain sensor (e.g., sensor unit 17J) connected to the battery control IC 16A, the strain sensor can detect changes in the shape of the flexible battery unit 12J of the integrated substrate 20D. In this configuration, it is possible to control the charging and discharging of the battery unit 12 in accordance with changes in the shape of the integrated substrate 20D.

[0172] [Discharge Control] The discharge method described in this embodiment restricts discharge of the flexible battery unit 12J when deformation of the battery unit 12J begins, and lifts the restriction on discharge of the battery unit 12J when deformation of the battery unit 12J ends. The restriction on discharge refers to stopping discharge of the battery unit or reducing the discharge current of the battery unit. Because the non-flexible battery unit 12K does not deform, discharge to the battery unit 12K continues even while the restriction on discharge to the battery unit 12J is in effect. Furthermore, in this discharge method, when lifting the restriction on discharge of the battery unit 12J, if the difference between the voltages of the battery unit 12J and the battery unit 12K is small, the restriction is lifted immediately. If the voltage difference is large, the restriction on discharge can be lifted after a process to reduce the voltage difference is performed.

[0173] An example of discharge control of the battery module 12J and the battery module 12K in response to a change in the shape of the integrated substrate 20D will be described using Figures 17 to 21B. Figures 17 to 19 are flow diagrams illustrating a discharge control method, and Figures 20A to 21B are circuit diagrams illustrating the circuit operation at each step of the flow diagram. Note that Figures 20A to 21B have the same configuration as the circuit diagram shown in Figure 16, but some parts have been omitted for clarity. Also, in Figures 20A to 21B, an x ​​mark superimposed on an element such as a switch indicates that the element is in an off state or stopped state, blocking the flow of electricity.

[0174] 17 starts, discharging starts in step S301. At this time, as shown in Fig. 20A, switches 19A, 19B, 19C, 19D, and DCDC converter 22B are turned on, and switch 19E, DCDC converter 22A, and charging circuit 23 are turned off.

[0175] Next, in step S302 of FIG. 17 , the battery control IC 16A determines whether the shape of the battery unit 12J is changing based on the value of the strain sensor included in the sensor unit 17J. If the value of the strain sensor has changed in step S302, the process proceeds to step S303. If the value of the strain sensor is changing in step S302, this indicates that the shape of the battery unit 12J is changing (bending or stretching). If the value of the strain sensor determines that the shape of the battery unit 12J is not changing, the discharge state is not changed and the determination in step S302 is repeated.

[0176] Next, in step S303 of FIG. 17 , the discharge of the flexible battery module 12J is stopped and the battery module 12J is placed in a discharge-limited state. At this time, as shown in FIG. 20B , switch 19C is placed in an OFF state. That is, in the discharge-limited state of the battery module 12J, switches 19A, 19B, 19D, and DCDC converter 22B are in an ON state, while switches 19C, 19E, DCDC converter 22A, and charging circuit 23 are in an OFF state. Note that, in the exemplary embodiment, the discharge-limited state is described as a case in which discharge is stopped, but the discharge-limited state is not limited to this. For example, the discharge-limited state may be a state in which the maximum discharge current is reduced to 50%, 40%, 30%, 20%, 10%, 5%, or 1%.

[0177] 17, the battery control IC 16A determines whether the shape of the battery unit 12J is changing, similar to step S302. If the value of the strain sensor is no longer changing as determined in step S304, the process proceeds to step S305. In other words, if the deformation of the battery unit 12J has stopped, the process proceeds to step S305. If the shape of the battery unit 12J is changing, that is, if the deformation of the battery unit 12J continues, the discharge limit state is not changed and the determination in step S304 is repeated.

[0178] Next, in step S305 of FIG. 17 , it is determined whether the difference between the voltages of the battery units 12J and 12K is equal to or greater than a first specified value. If the difference between the voltages of the battery units 12J and 12K is equal to or greater than the first specified value, the process proceeds to connector G. Alternatively, if the difference between the voltages of the battery units 12J and 12K is less than the first specified value, the process proceeds to step S306. Here, the first specified value can be, for example, 20 mV, preferably 10 mV, and more preferably 5 mV. By setting such a specified value, the current flowing due to the voltage difference when the voltages of the battery units 12J and 12K are connected in parallel can be kept low, thereby suppressing noise and heat generation due to the current. The voltages of the battery units 12J and 12K are measured by the voltage sensor 18C, and the voltage difference can be calculated by the battery control IC 16A.

[0179] For example, if the first specified value is set to 10 mV, in step S305 of Fig. 17, if the difference between the voltage of battery module 12J and the voltage of battery module 12K is 10 mV or more, the process proceeds to connector G. Alternatively, if the difference between the voltage of battery module 12J and the voltage of battery module 12K is less than 10 mV, the process proceeds to step S306.

[0180] Next, in step S306 of Fig. 17, the discharge restriction state of the battery module 12J is released, and discharging of the battery module 12J is resumed. At this time, as shown in Fig. 20A, switch 19C is turned on. In other words, when the discharge restriction of the battery module 12J is released, switches 19A, 19B, 19C, 19D, and DCDC converter 22B are on, and switch 19E, DCDC converter 22A, and charging circuit 23 are off, similar to the state of step S301.

[0181] 17, whether or not a discharge end instruction has been received is confirmed, and if no discharge end instruction has been received, the process returns to step S302. If a discharge end instruction has been received in step S307, the process proceeds to step S308, where the discharge of battery unit 12J and battery unit 12K is stopped, and the series of discharge processes is terminated. The discharge end instruction may be issued when the device containing battery unit 12J or battery unit 12K is turned off, or when the battery protection function is activated, such as when battery unit 12J or battery unit 12K reaches a lower limit discharge voltage or when current sensor 18A detects an excessive discharge current.

[0182] 18, a description will be given of the process to be performed when the difference between the voltage of the battery module 12J and the voltage of the battery module 12K is equal to or greater than the first specified value in step S305 and the process proceeds to connector G. Connector G is connected to step S311 shown in FIG.

[0183] Next, in step S311 of Fig. 18, it is determined whether the difference between the voltages of battery module 12J and battery module 12K is equal to or greater than a second specified value. If the difference between the voltages of battery module 12J and battery module 12K is equal to or greater than the second specified value, the process proceeds to connector H. Alternatively, if the difference between the voltages of battery module 12J and battery module 12K is less than the second specified value, the process proceeds to step S312. Here, the second specified value can be, for example, 700 mV, preferably 500 mV, and more preferably 300 mV.

[0184] For example, if the second specified value is set to 500 mV, in step S311 of Fig. 18, if the difference between the voltage of battery module 12J and the voltage of battery module 12K is 500 mV or more, the process proceeds to connector H. Alternatively, if the difference between the voltage of battery module 12J and the voltage of battery module 12K is less than 500 mV, the process proceeds to step S312.

[0185] Next, in step S312 of Fig. 18, the discharge restriction on the flexible battery module 12J is partially released. Specifically, as shown in Fig. 21A, switch 19C remains off and DCDC converter 22A is turned on. In other words, with the discharge restriction on the battery module 12J partially released, switches 19A, 19B, 19D, DCDC converter 22A, and DCDC converter 22B are on, and switches 19C, 19E, and charging circuit 23 are off.

[0186] 21A , battery module 12J is discharged via DCDC converter 22A, and battery module 12K is discharged via DCDC converter 22B. In other words, the use of two DCDC converters reduces the effect of the voltage difference between battery module 12J and battery module 12K, and allows discharging to be performed using both battery module 12J and battery module 12K.

[0187] Next, in step S313 of Fig. 18, it is determined whether the difference between the voltage of battery module 12J and the voltage of battery module 12K is equal to or greater than a first specified value. If the difference between the voltage of battery module 12J and the voltage of battery module 12K is equal to or greater than the first specified value, the discharge state shown in Fig. 21A is continued, and the process of step S313 is repeated. Alternatively, if the difference between the voltage of battery module 12J and the voltage of battery module 12K is less than the first specified value, the process proceeds to step S314. Note that the first specified value is the same as that described in step S305 of Fig. 17.

[0188] Next, in step S314 of Fig. 18, the discharge limit state of the battery module 12J is released. At this time, as shown in Fig. 20A, switch 19C is turned on and DCDC converter 22A is turned off. In other words, when the discharge limit state is released in step S314, similar to the state in step S301, switches 19A, 19B, 19C, 19D, and DCDC converter 22B are on, and switch 19E, DCDC converter 22A, and charging circuit 23 are off.

[0189] In step S314 of Fig. 18, after the discharge limit state of the battery module 12J is released, the process proceeds to connector I. Connector I is connected to step S307 of Fig. 17. The process from step S307 onwards is the same as that described in Fig. 17.

[0190] 19, a description will be given of the process to be performed when the difference between the voltage of the battery module 12J and the voltage of the battery module 12K is equal to or greater than the second specified value in step S311 and the process proceeds to connector H. Connector H is connected to step S321 shown in FIG.

[0191] In step S321 of FIG. 19 , cell balancing between battery module 12J and battery module 12K is started. At this time, as shown in FIG. 21B , DCDC converter 22B is turned off, and switch 19E, DCDC converter 22A, and charging circuit 23 are turned on. This allows battery module 12J to be charged using the power of battery module 12K. That is, in the cell balancing state in which battery module 12J is charged using the power of battery module 12K, switches 19A, 19B, 19D, 19E, DCDC converter 22A, and charging circuit 23 are on, and switch 19C and DCDC converter 22B are off. Note that charging circuit 23 has a function of performing charging control to charge battery module 12J using the power of battery module 12K.

[0192] Next, in step S322 of Fig. 19, it is determined whether the difference between the voltage of battery module 12J and the voltage of battery module 12K is equal to or greater than a second specified value. If the difference between the voltage of battery module 12J and the voltage of battery module 12K is equal to or greater than the second specified value, the cell balance processing state shown in Fig. 21B is continued, and the processing of step S322 is repeated. Alternatively, if the difference between the voltage of battery module 12J and the voltage of battery module 12K is less than the second specified value, the processing proceeds to step S323. Note that the second specified value is the same as that described in step S311 of Fig. 18.

[0193] Next, in step S323 of Fig. 19, the discharge process is changed. Specifically, the cell balancing process is ended, and the discharge restriction on the battery module 12J is partially lifted. Specifically, as shown in Fig. 21A, switch 19C remains off, and switch 19E and the charging circuit 23 are turned on. In other words, switch 19A, switch 19B, switch 19D, DCDC converter 22A, and DCDC converter 22B are on, and switch 19C, switch 19E, and the charging circuit 23 are off.

[0194] Next, in step S324 of Fig. 19, it is determined whether the difference between the voltage of battery module 12J and the voltage of battery module 12K is equal to or greater than a first specified value. If the difference between the voltage of battery module 12J and the voltage of battery module 12K is equal to or greater than the first specified value, the discharge state shown in Fig. 21A is continued, and the process of step S324 is repeated. Alternatively, if the difference between the voltage of battery module 12J and the voltage of battery module 12K is less than the first specified value, the process proceeds to step S325. Note that the first specified value is the same as that described in step S305 of Fig. 17.

[0195] Next, in step S325 of Fig. 19, the discharge limit state of the battery module 12J is released. At this time, as shown in Fig. 20A, switch 19C is turned on and DCDC converter 22A is turned off. In other words, when the discharge limit state is released in step S325, similar to the state in step S301, switches 19A, 19B, 19C, 19D, and DCDC converter 22B are on, and switch 19E, DCDC converter 22A, and charging circuit 23 are off.

[0196] In step S325 of Fig. 19, after the discharge restriction state of the battery module 12J is released, the process proceeds to connector I. Connector I is connected to step S307 of Fig. 17. The process from step S307 onwards is the same as that described in Fig. 17.

[0197] [Charging Control] The charging method described in this embodiment restricts charging of the battery unit 12J when the flexible battery unit 12J begins to deform, and lifts the restriction when the deformation of the battery unit 12J ends. The restriction on charging refers to stopping charging of the battery unit or reducing the charging current of the battery unit. Because the non-flexible battery unit 12K does not deform, charging of the battery unit 12K continues even during the restriction on charging. Furthermore, when lifting the restriction on charging of the battery unit 12J, this charging method lifts the restriction on charging as is if the difference between the voltage of the battery unit 12J and the voltage of the battery unit 12K is small. If the voltage difference is large, the restriction on charging can be lifted after a process to reduce the voltage difference is performed.

[0198] An example of charging control of the battery module 12J and the battery module 12K in response to a change in the shape of the integrated substrate 20D will be described using Figures 22 and 25. Figures 22 and 23 are flow diagrams illustrating a charging control method, and Figures 24A to 25 are circuit diagrams illustrating the circuit operation at each step of the flow diagram. Note that Figures 24A to 25 have the same configuration as the circuit diagram shown in Figure 16, but some parts have been omitted for clarity. Also, as in Figures 20A to 21B, in Figures 24A to 25, an x ​​mark superimposed on an element such as a switch indicates that the element is in an off state or stopped state, blocking the flow of electricity.

[0199] 22 starts, charging starts in step S401. At this time, as shown in FIG. 24A, switches 19A, 19B, 19C, 19D, 19E, and charging circuit 23 are turned on, and DCDC converters 22A and 22B are turned off.

[0200] 22, the battery control IC 16A determines whether the shape of the battery unit 12J is changing based on the value of the strain sensor included in the sensor unit 17J. If the value of the strain sensor has changed in the determination of step S402, the process proceeds to step S403. Alternatively, if the value of the strain sensor determines that the shape of the battery unit 12J is not changing, the discharge state is not changed and the determination of step S402 is repeated.

[0201] Next, in step S403 of FIG. 22 , charging of the flexible battery unit 12J is stopped and the battery unit 12J is placed in a charge-limited state. At this time, as shown in FIG. 24B , switch 19C is turned off. That is, in the charge-limited state in which charging of the battery unit 12J is stopped, switches 19A, 19B, 19D, 19E, and the charging circuit 23 are on, and switch 19C, the DCDC converter 22A, and the DCDC converter 22B are off. Note that, in the exemplary embodiment, the charge-limited state is described as a case in which charging is stopped, but the charge-limited state is not limited to this. For example, the charge-limited state may be a state in which the maximum charging current is reduced to 50%, 40%, 30%, 20%, 10%, 5%, or 1%.

[0202] 22, the battery control IC 16A determines whether the shape of the battery unit 12J is changing, similar to step S402. If the value of the strain sensor is no longer changing as determined in step S404, the process proceeds to step S405. In other words, if the deformation of the battery unit 12J has stopped, the process proceeds to step S405. Alternatively, if the shape of the battery unit 12J is changing, that is, if the deformation of the battery unit 12J continues, the charge restriction state is not changed and the determination in step S404 is repeated.

[0203] Next, in step S405 of Fig. 22, it is determined whether the difference between the voltages of battery module 12J and battery module 12K is equal to or greater than a first specified value. If the difference between the voltages of battery module 12J and battery module 12K is equal to or greater than the first specified value, the process proceeds to connector J. Alternatively, if the difference between the voltages of battery module 12J and battery module 12K is less than the first specified value, the process proceeds to step S406. Note that the first specified value is the same as that described in step S305 of Fig. 17.

[0204] Next, in step S406 of Fig. 22, the charge restriction state of the battery unit 12J is released, and charging of the battery unit 12J is resumed. At this time, as shown in Fig. 22, switch 19C is turned on. That is, when the charge restriction of the battery unit 12J is released, switches 19A, 19B, 19C, 19D, and DCDC converter 22B are on, and switch 19E, DCDC converter 22A, and charging circuit 23 are off, similar to the state of step S401.

[0205] 22, whether or not a charge end instruction has been received is confirmed, and if no charge end instruction has been received, the process returns to step S402. Alternatively, if a charge end instruction has been received in step S407, the process proceeds to step S408, where charging of battery unit 12J and battery unit 12K is stopped, and the series of charging processes ends. The charge end instruction may be issued from the device containing battery unit 12J or battery unit 12K, or may be issued when the battery protection function is activated, such as when battery unit 12J or battery unit 12K reaches an upper limit discharge voltage or when current sensor 18A detects an excessive charging current.

[0206] 23, a description will be given of the process to be performed when the difference between the voltage of the battery module 12J and the voltage of the battery module 12K is equal to or greater than the first specified value in step S405 and the process proceeds to connector J. Connector J is connected to step S411 shown in FIG.

[0207] Next, in step S411 of Fig. 23, charging of battery unit 12K is stopped and charging of battery unit 12J is resumed. Specifically, as shown in Fig. 25, switch 19D is turned off and switch 19C is turned on. In other words, when charging of battery unit 12K is stopped and charging of battery unit 12J is resumed, switches 19A, 19B, 19C, 19E, and charging circuit 23 are on, and switch 19D, DCDC converter 22A, and DCDC converter 22B are off.

[0208] Next, in step S412 of Fig. 23, it is determined whether the difference between the voltage of battery module 12J and the voltage of battery module 12K is equal to or greater than a first specified value. If the difference between the voltage of battery module 12J and the voltage of battery module 12K is equal to or greater than the first specified value, the charging state shown in Fig. 25 is continued, and the process of step S412 is repeated. Alternatively, if the difference between the voltage of battery module 12J and the voltage of battery module 12K is less than the first specified value, the process proceeds to step S413. Note that the first specified value is the same as that described in step S305 of Fig. 17.

[0209] Next, in step S413 of Fig. 23, the charge-restricted state of the battery module 12J is released. At this time, as shown in Fig. 24A, switch 19D is turned on. That is, when the charge-restricted state is released in step S413, switches 19A, 19B, 19C, 19D, 19E, and charging circuit 23 are on, and DCDC converter 22A and DCDC converter 22B are off, similar to the state in step S401.

[0210] In step S413 of Fig. 23, after the charge restriction state of the battery module 12J is released, the process proceeds to connector K. Connector K is connected to step S407 of Fig. 22. The process from step S407 onwards is the same as that described in Fig. 22.

[0211] 17 to 25, when restricting the charging and discharging of at least one battery among a plurality of batteries, it is possible to reduce the voltage difference between the batteries before lifting the restriction, thereby making it possible to prevent a large current from flowing when the restriction is lifted. In other words, when restricting discharging and charging in the configuration of the integrated substrate 20D described in FIGS. 15A to 16, using the charging and discharging methods described in FIGS. 17 to 25 makes it possible to prevent a large current from flowing when the restriction is lifted, thereby making it possible to prevent adverse effects such as noise, heat generation, and degradation caused by the large current.

[0212] Note that the charging and discharging methods described in this embodiment are not limited to application to the case where a flexible battery and a non-flexible battery are included as described in Figures 15A to 16. For example, in the configuration having two flexible batteries as shown in Figures 13A and 13B, if only one battery is deformed, the charging and discharging control described in this embodiment can be used.

[0213] The structure, method, and the like described in this embodiment can be used in appropriate combination with the structure, method, and the like described in other embodiments.

[0214] Third Embodiment This embodiment will describe an example of the battery 110 or the battery 110A included in the battery unit 12. Note that although this embodiment describes elements constituting a lithium ion battery, the battery 110 or the battery 110A may be a battery other than a lithium ion battery, such as a sodium ion battery, a nickel-metal hydride battery, or a lead-acid battery.

[0215] [Lithium Ion Battery] A lithium ion battery has a negative electrode, a positive electrode, an electrolyte, a separator, and an exterior body.

[0216] [Negative Electrode] The negative electrode has a negative electrode active material layer and a negative electrode current collector. The negative electrode active material layer has a negative electrode active material, and may further have a conductive material and a binder.

[0217] The current collector can be, for example, a metal foil. The negative electrode can be formed by applying a slurry to a metal foil and drying it. Pressing may be performed after drying. The negative electrode is formed by forming an active material layer on a current collector.

[0218] The term "slurry" refers to a material liquid used to form an active material layer on a current collector, and contains an active material, a binder, and a solvent, and preferably further contains a conductive material. The slurry is also called an electrode slurry or an active material slurry, and when forming a negative electrode active material layer, it is also called a negative electrode slurry.

[0219] [Negative Electrode Active Material] As the negative electrode active material, for example, a carbon material or an alloy-based material can be used.

[0220] Examples of carbon materials that can be used include graphite (natural graphite, artificial graphite), graphitizable carbon (soft carbon), non-graphitizable carbon (hard carbon), carbon fiber (carbon nanotube), graphene, and carbon black.

[0221] Examples of graphite include artificial graphite and natural graphite. Examples of artificial graphite include mesocarbon microbeads (MCMB), coke-based artificial graphite, and pitch-based artificial graphite. Here, spherical graphite having a spherical shape can be used as the artificial graphite. For example, MCMB may have a spherical shape and is therefore preferred. Furthermore, it is relatively easy to reduce the surface area of ​​MCMB, and this may be preferred. Examples of natural graphite include flake graphite and spherical natural graphite.

[0222] When lithium ions are inserted into graphite (when a lithium-graphite intercalation compound is formed), graphite exhibits a potential as low as that of metallic lithium (0.05 V to 0.3 V vs. Li / Li ＋ This allows lithium-ion batteries using graphite to exhibit high operating voltages. Graphite is also preferred because it has advantages such as a relatively high capacity per unit volume, relatively small volume expansion, low cost, and greater safety compared to lithium metal.

[0223] The non-graphitizable carbon can be obtained by calcining a synthetic resin such as a phenolic resin or a plant-derived organic material. The non-graphitizable carbon contained in the negative electrode active material of the lithium-ion battery according to one embodiment of the present invention preferably has a (002) plane spacing measured by X-ray diffraction (XRD) of 0.34 nm or more and 0.50 nm or less, and more preferably 0.35 nm or more and 0.42 nm or less.

[0224] In addition, the negative electrode active material can be an element capable of undergoing a charge-discharge reaction through alloying and dealloying reactions with lithium. For example, a material containing at least one of silicon, tin, gallium, aluminum, germanium, lead, antimony, bismuth, silver, zinc, cadmium, indium, etc. can be used. These elements have a larger capacity than carbon, and silicon in particular has a high theoretical capacity of 4200 mAh / g. For this reason, it is preferable to use silicon as the negative electrode active material. Alternatively, compounds containing these elements may be used. For example, SiO, Mg ２ Si, Mg ２ Ge, SnO, SnO ２ , Mg ２ Sn, SnS ２ , V ２ Sn ３ , FeSn ２ , CoSn ２ , Ni ３ Sn ２ , Cu ６ Sn ５ , Ag ３ Sn, Ag ３ Sb, Ni ２ MnSb, CeSb ３ , LaSn ３ , La ３ Co ２ Sn ７ , CoSb ３ , InSb, SbSn, etc. Here, elements that can undergo charge-discharge reactions by alloying / dealloying reactions with lithium, and compounds containing such elements, are sometimes referred to as alloy-based materials.

[0225] In this specification, "SiO" refers to, for example, silicon monoxide. ｘHere, x preferably has a value of 1 or close to 1. For example, x is preferably 0.2 or more and 1.5 or less, and more preferably 0.3 or more and 1.2 or less.

[0226] Titanium dioxide (TiO ２ ), lithium titanium oxide (Li ４ Ti ５ O １２ ), lithium-graphite intercalation compound (Li ｘ C ６ ), niobium pentoxide (Nb ２ O ５ ), tungsten dioxide (WO ２ ), molybdenum dioxide (MoO ２ ) and other oxides can be used.

[0227] In addition, as the negative electrode active material, a nitride of lithium and a transition metal, Li ３ Li with N-type structure ３−ｘ M ｘ N (M=Co, Ni, Cu) can be used. For example, Li ２．６ Co ０．４ N has a large discharge capacity (900 mAh / g, 1890 mAh / cm ３ ) and is preferred.

[0228] When a nitride of lithium and a transition metal is used, lithium ions are contained in the negative electrode active material, so V, which does not contain lithium ions, is used as the positive electrode active material. ２ O ５ , Cr ３ O ８ It is preferable that the material can be combined with a material such as the above. Even when a material containing lithium ions is used as the positive electrode active material, it is possible to use a nitride of lithium and a transition metal as the negative electrode active material by first desorbing the lithium ions contained in the positive electrode active material.

[0229] Furthermore, a material that undergoes a conversion reaction can also be used as the negative electrode active material. For example, a transition metal oxide that does not form an alloy with lithium, such as cobalt oxide (CoO), nickel oxide (NiO), or iron oxide (FeO), can be used as the negative electrode active material. Further examples of materials that undergo a conversion reaction include Fe ２ O３ ,CuO,Cu ２ O, RuO ２ , Cr ２ O ３ oxides such as CoS ０．８９ , sulfides such as NiS and CuS, Zn ３ N ２ , Cu ３ N, Ge ３ N ４ Nitrides such as NiP ２ , FeP ２ , CoP ３ Phosphides such as FeF ３ , BiF ３ Fluorides such as:

[0230] Although one type of anode active material from among the above-described anode active materials can be used, a combination of two or more types of anode active materials can also be used, for example, a combination of a carbon material and silicon, or a combination of a carbon material and silicon monoxide.

[0231] The negative electrode active material may be pre-doped with lithium. The pre-doping method for lithium may involve forming a lithium layer on the surface of the negative electrode active material layer by sputtering. Alternatively, the negative electrode active material layer may be pre-doped with lithium by providing a lithium foil on the surface of the negative electrode active material layer. Alternatively, a pre-doping battery may be fabricated using a dummy positive electrode containing lithium, and the negative electrode active material layer may be pre-doped with lithium by charging the battery.

[0232] Alternatively, the negative electrode may be one that does not have a negative electrode active material at the end of the battery fabrication. A negative electrode that does not have a negative electrode active material may be, for example, a negative electrode that has only a negative electrode current collector at the end of the battery fabrication, in which lithium ions released from the positive electrode active material upon charging the battery are deposited as lithium metal on the negative electrode current collector to form a negative electrode active material layer. A battery using such a negative electrode is sometimes called a negative electrode-free (anode-free) battery, a negative electrode-less (anode-less) battery, or the like.

[0233] When a negative electrode without a negative electrode active material is used, a film for uniforming lithium deposition may be provided on the negative electrode current collector. For example, a solid electrolyte having lithium ion conductivity can be used as the film for uniforming lithium deposition. Examples of solid electrolytes that can be used include sulfide-based solid electrolytes, oxide-based solid electrolytes, and polymer-based solid electrolytes. Among these, polymer-based solid electrolytes are suitable as films for uniforming lithium deposition because they are relatively easy to form uniformly on the negative electrode current collector. Furthermore, for example, a metal film that forms an alloy with lithium can be used as the film for uniforming lithium deposition. For example, a magnesium metal film can be used as the metal film that forms an alloy with lithium. Lithium and magnesium form a solid solution over a wide composition range, making them suitable as films for uniforming lithium deposition.

[0234] Furthermore, when a negative electrode that does not have a negative electrode active material is used, a negative electrode current collector having projections and recesses can be used. When a negative electrode current collector having projections and recesses is used, the recesses of the negative electrode current collector become cavities into which lithium contained in the negative electrode current collector can be easily deposited, and therefore, when lithium is deposited, it is possible to prevent it from forming a dendritic shape.

[0235] [Binder] As the binder, it is preferable to use a rubber material such as styrene-butadiene rubber (SBR), styrene-isoprene-styrene rubber, acrylonitrile-butadiene rubber, butadiene rubber, ethylene-propylene-diene copolymer, etc. Furthermore, as the binder, fluororubber can be used.

[0236] Furthermore, it is preferable to use, for example, a water-soluble polymer as the binder. Examples of the water-soluble polymer that can be used include polysaccharides. Examples of the polysaccharide that can be used include cellulose derivatives such as carboxymethyl cellulose (CMC), methyl cellulose, ethyl cellulose, hydroxypropyl cellulose, diacetyl cellulose, and regenerated cellulose, as well as starch. It is even more preferable to use these water-soluble polymers in combination with the above-mentioned rubber material.

[0237] Alternatively, it is preferable to use, as the binder, materials such as polystyrene, polymethyl acrylate, polymethyl methacrylate (polymethyl methacrylate, PMMA), sodium polyacrylate, polyvinyl alcohol (PVA), polyethylene oxide (PEO), polypropylene oxide, polyimide, polyvinyl chloride, polytetrafluoroethylene, polyethylene, polypropylene, polyisobutylene, polyethylene terephthalate, nylon, polyvinylidene fluoride (PVDF), polyacrylonitrile (PAN), ethylene propylene diene polymer, polyvinyl acetate, and nitrocellulose.

[0238] The binder may be used in combination with two or more of the above.

[0239] For example, a material with a particularly excellent viscosity adjusting effect may be used in combination with other materials. For example, while rubber materials have excellent adhesive strength and elasticity, it may be difficult to adjust the viscosity when mixed with a solvent. In such cases, it is preferable to mix them with a material with a particularly excellent viscosity adjusting effect. For example, a water-soluble polymer may be used as a material with a particularly excellent viscosity adjusting effect. Furthermore, as water-soluble polymers with a particularly excellent viscosity adjusting effect, the above-mentioned polysaccharides, for example, carboxymethyl cellulose (CMC), methyl cellulose, ethyl cellulose, hydroxypropyl cellulose, and diacetyl cellulose, cellulose derivatives such as regenerated cellulose, or starch may be used.

[0240] In addition, the solubility of cellulose derivatives such as carboxymethyl cellulose can be increased by converting them into salts such as sodium or ammonium salts of carboxymethyl cellulose, making them more effective as viscosity adjusters. Higher solubility can also improve dispersibility with active materials or other components when preparing electrode slurries. In this specification, the cellulose and cellulose derivatives used as electrode binders also include their salts.

[0241] Water-soluble polymers stabilize viscosity by dissolving in water, allowing active materials and other materials combined as binders, such as styrene-butadiene rubber, to be stably dispersed in aqueous solutions. Furthermore, the presence of functional groups is expected to facilitate stable adsorption to the surface of active materials. Furthermore, many cellulose derivatives, such as carboxymethyl cellulose, contain functional groups such as hydroxyl or carboxyl groups, and the presence of these functional groups is expected to facilitate interactions between polymers, resulting in widespread coverage of the active material surface.

[0242] When the binder covering or contacting the surface of the active material forms a film, it is expected to function as a passive film and have the effect of suppressing decomposition of the electrolyte. Here, the "passive film" refers to a film with no electrical conductivity or a film with extremely low electrical conductivity. For example, when a passive film is formed on the surface of the active material, it can suppress decomposition of the electrolyte at the battery reaction potential. Furthermore, it is more desirable that the passive film suppresses electrical conductivity while still allowing lithium ions to conduct.

[0243] [Conductive Material] The conductive material, also called a conductivity imparting agent or a conductivity aid, is made of a carbon material. By attaching the conductive material between multiple active materials, the multiple active materials are electrically connected to each other, thereby increasing the conductivity. Note that the term "attachment" does not only refer to physical adhesion between the active material and the conductive material, but also includes cases where a covalent bond is formed, bonding due to van der Waals forces, where the conductive material covers part of the surface of the active material, where the conductive material is embedded in the surface irregularities of the active material, and where the materials are electrically connected even when not in contact with each other.

[0244] The active material layers such as the positive electrode active material layer and the negative electrode active material layer preferably contain a conductive material.

[0245] As the conductive material, for example, one or more of carbon black such as acetylene black and furnace black, graphite such as artificial graphite and natural graphite, carbon fibers such as carbon nanofibers and carbon nanotubes, and graphene compounds can be used.

[0246] Examples of carbon fibers that can be used include mesophase pitch-based carbon fibers and isotropic pitch-based carbon fibers. Carbon nanofibers and carbon nanotubes can also be used as carbon fibers. Carbon nanotubes can be produced by vapor phase growth, for example.

[0247] In this specification and the like, graphene compounds include graphene, multilayer graphene, multigraphene, graphene oxide, multilayer graphene oxide, multi-graphene oxide, reduced graphene oxide, reduced multilayer graphene oxide, reduced multi-graphene oxide, graphene quantum dots, etc. Graphene compounds contain carbon, have a shape such as a plate or sheet, and have a two-dimensional structure formed by six-membered carbon rings. The two-dimensional structure formed by six-membered carbon rings may also be called a carbon sheet. Graphene compounds may have functional groups. Furthermore, graphene compounds preferably have a curved shape. Furthermore, graphene compounds may be rolled up to resemble carbon nanofibers.

[0248] The active material layer may also contain, as a conductive material, metal powder or metal fiber such as copper, nickel, aluminum, silver, or gold, or a conductive ceramic material.

[0249] The content of the conductive material relative to the total amount of the active material layer is preferably 1 wt % or more and 10 wt % or less, and more preferably 1 wt % or more and 5 wt % or less.

[0250] Unlike granular conductive materials such as carbon black, which make point contact with the active material, graphene compounds enable surface contact with low contact resistance, and therefore can improve the electrical conductivity between the granular active material and the graphene compound with a smaller amount than that of ordinary conductive materials. This allows the ratio of the active material in the active material layer to be increased, thereby increasing the discharge capacity of the battery.

[0251] Particulate carbon-containing compounds such as carbon black and graphite, or fibrous carbon-containing compounds such as carbon nanotubes, tend to fill microscopic spaces. Microscopic spaces refer to, for example, the spaces between multiple active materials. By combining a carbon-containing compound that easily fills microscopic spaces with a sheet-like carbon-containing compound such as graphene, which can impart conductivity across multiple particles, the density of the electrode can be increased, resulting in the formation of an excellent conductive path. The battery obtained by the manufacturing method of one embodiment of the present invention has a high capacity density per volume and is stable, making it effective as an in-vehicle battery.

[0252] [Current Collector] As the current collector, a material that has high conductivity and does not alloy with carrier ions such as lithium, such as metals such as stainless steel, gold, platinum, zinc, iron, copper, aluminum, and titanium, and alloys thereof, can be used. The current collector can be appropriately shaped, such as a sheet, a mesh, a punched metal, or an expanded metal.

[0253] Furthermore, a resin current collector can be used as the current collector, which includes, for example, a resin such as polyolefin (polypropylene, polyethylene, etc.), nylon (polyamide), polyimide, vinylon, polyester, acrylic, or polyurethane, and a particulate or fibrous conductive material (also called a conductive filler).

[0254] The conductive material contained in the resin current collector can be one or more of a conductive carbon material and a metal material such as aluminum, titanium, stainless steel, gold, platinum, zinc, iron, or copper. Examples of the conductive carbon material include carbon black such as acetylene black and furnace black, graphite such as artificial graphite and natural graphite, carbon fibers such as carbon nanofibers and carbon nanotubes, graphene, and graphene compounds. When the resin current collector is used as a positive electrode current collector, it is preferable that the resin current collector further contains an antioxidant such as a hindered phenol material.

[0255] Examples of carbon fibers that can be used include mesophase pitch-based carbon fibers and isotropic pitch-based carbon fibers. Carbon nanofibers and carbon nanotubes can also be used as carbon fibers. Carbon nanotubes can be produced by vapor phase growth, for example.

[0256] The conductive material contained in the resin current collector may have an average particle size of 10 nm or more and 10 μm or less, and preferably 30 nm or more and 5 μm or less.

[0257] The current collector preferably has a thickness of 5 μm or more and 30 μm or less.

[0258] The negative electrode current collector is preferably made of a material that does not alloy with carrier ions such as lithium.

[0259] Furthermore, a laminated current collector having a structure in which metal layers are provided on both sides of an organic material film can be used as the current collector. Examples of the organic material film include polypropylene, polyethylene, nylon, and polyethylene terephthalate. Examples of the metal layer include highly conductive materials such as stainless steel, gold, platinum, aluminum, and titanium, as well as alloys thereof. The laminated current collector can be fabricated by bonding an organic material film to a metal foil (metal layer). In this case, an adhesive layer is provided between the organic material film and the metal layer. Alternatively, the laminated current collector can be fabricated by forming metal layers on both sides of the organic material film by a sputtering method, a vapor deposition method, or the like. When the laminated current collector is used as a negative electrode current collector, it is preferable to use copper as the metal layer. Alternatively, when the laminated current collector is used as a positive electrode current collector, it is preferable to use aluminum as the metal layer. Another example of the laminated current collector configuration is one in which a graphene layer is provided instead of the metal layer.

[0260] An undercoat layer may also be provided on a portion of the surface of the current collector. The provision of an undercoat layer can reduce the contact resistance between the current collector and the active material layer. Furthermore, the adhesion between the current collector and the active material layer can be improved. The undercoat layer does not have to be formed over the entire surface of the current collector, but may be formed in an island-like (partial) pattern. The undercoat layer may also exhibit capacity as an active material. For example, a carbon material can be used as the undercoat layer. Examples of carbon materials that can be used include graphite, carbon black such as acetylene black, and carbon nanotubes. Furthermore, a metal layer, a layer containing carbon and a polymer, and a layer containing a metal and a polymer can also be used as the undercoat layer. The materials described in the [Binder] section can be used as the binder for the undercoat layer. Having an undercoat layer between the current collector and the active material layer can prevent the active material layer from falling off the current collector when the battery is bent, so having an undercoat layer is preferable for flexible batteries.

[0261] [Positive electrode] The positive electrode has a positive electrode active material layer and a positive electrode current collector. The positive electrode active material layer contains a positive electrode active material and may further contain at least one of a conductive material and a binder. Note that the positive electrode current collector, conductive material, and binder may be those described in [Negative electrode].

[0262] The current collector can be, for example, a metal foil. The positive electrode can be formed by applying a slurry to a metal foil and drying it. Pressing may be performed after drying. The positive electrode is formed by forming an active material layer on a current collector.

[0263] The slurry is a material liquid used to form an active material layer on a current collector, and refers to a material containing an active material, a binder, and a solvent, preferably further mixed with a conductive material. The slurry is also called an electrode slurry or an active material slurry, and when forming a positive electrode active material layer, it is also called a positive electrode slurry.

[0264] [Positive Electrode Active Material] As the positive electrode active material, at least one of a composite oxide having a layered rock salt structure, a composite oxide having an olivine structure, and a composite oxide having a spinel structure can be used.

[0265] As the composite oxide having a layered rock salt structure, any one or more of lithium cobalt oxide, lithium nickel-cobalt-manganese oxide, lithium nickel-cobalt-aluminate, and lithium nickel-manganese-aluminate can be used. ２ (M1 is one or more selected from nickel, cobalt, manganese, and aluminum), but the coefficients of the composition formula are not limited to integers.

[0266] As the lithium cobalt oxide, for example, any one or more of lithium cobalt oxide having magnesium, lithium cobalt oxide having magnesium and aluminum, lithium cobalt oxide having magnesium, aluminum, and titanium, lithium cobalt oxide having magnesium and nickel, lithium cobalt oxide having magnesium, aluminum, and nickel, lithium cobalt oxide having magnesium, aluminum, titanium, and nickel, lithium cobalt oxide having magnesium and fluorine, lithium cobalt oxide having magnesium, fluorine, and titanium, lithium cobalt oxide having magnesium, fluorine, and aluminum, lithium cobalt oxide having magnesium, fluorine, titanium, and aluminum, lithium cobalt oxide having magnesium, fluorine, and nickel, lithium cobalt oxide having magnesium, fluorine, nickel, and aluminum, lithium cobalt oxide having magnesium, fluorine, aluminum, titanium, and nickel, and the like can be used.

[0267] As the lithium nickel-cobalt-manganese oxide, for example, nickel:cobalt:manganese=1:1:1, nickel:cobalt:manganese=6:2:2, nickel:cobalt:manganese=8:1:1, nickel:cobalt:manganese=9:0.5:0.5, etc., or lithium nickel-cobalt-manganese with ratios close to these can be used. Furthermore, as the above-mentioned lithium nickel-cobalt-manganese oxide, it is preferable to use lithium nickel-cobalt-manganese oxide to which one or more of aluminum, calcium, barium, strontium, and gallium have been added.

[0268] As the composite oxide having an olivine structure, any one or more of lithium iron phosphate, lithium manganese phosphate, lithium cobalt phosphate, and lithium iron manganese phosphate can be used. The composition formula is LiM2PO ４ (M2 is one or more elements selected from iron, manganese, and cobalt), but the coefficients of the composition formula are not limited to integers.

[0269] Also, LiMn ２ O ４ A composite oxide having a spinel structure such as the above can be used.

[0270] [Electrolyte] One form of electrolyte can be an electrolytic solution having a solvent and an electrolyte dissolved in the solvent. The electrolytic solution contains a solvent and a lithium salt. The solvent for the electrolytic solution is preferably an aprotic organic solvent, and examples thereof include ethylene carbonate (EC), propylene carbonate (PC), butylene carbonate, chloroethylene carbonate, vinylene carbonate, γ-butyrolactone, γ-valerolactone, dimethyl carbonate (DMC), diethyl carbonate (DEC), ethyl methyl carbonate (EMC), methyl formate, methyl acetate, ethyl acetate, methyl propionate, ethyl propionate, propyl propionate, methyl butyrate, 1,3-dioxane, 1,4-dioxane, dimethoxyethane (DME), dimethyl sulfoxide, diethyl ether, methyl diglyme, acetonitrile, benzonitrile, tetrahydrofuran, sulfolane, and sultone, or any combination and ratio of two or more of these.

[0271] When the electrolytic solution contains ethylene carbonate (EC) and diethyl carbonate (DEC), when the total content of ethylene carbonate and diethyl carbonate is 100 vol %, the volume ratio of ethylene carbonate to diethyl carbonate can be x:100-x (where 20≦x≦40). More specifically, a mixed organic solvent containing EC and DEC in a volume ratio of EC:DEC=30:70 can be used.

[0272] Furthermore, when the electrolyte solution contains ethylene carbonate (EC), ethyl methyl carbonate (EMC), and dimethyl carbonate (DMC), when the total content of ethylene carbonate, ethyl methyl carbonate, and dimethyl carbonate is 100 vol%, the volume ratio of ethylene carbonate, ethyl methyl carbonate, and dimethyl carbonate can be x:y:100-x-y (where 5≦x≦35 and 0<y<65). More specifically, a mixed organic solvent containing EC, EMC, and DMC in a volume ratio of EC:EMC:DMC=30:35:35 can be used.

[0273] Furthermore, a mixed organic solvent containing a fluorinated cyclic carbonate (sometimes referred to as a fluorinated cyclic carbonate) or a fluorinated chain carbonate (sometimes referred to as a fluorinated chain carbonate) can be used as the electrolyte. Furthermore, it is preferable that the mixed organic solvent contains both a fluorinated cyclic carbonate and a fluorinated chain carbonate. Both the fluorinated cyclic carbonate and the fluorinated chain carbonate have electron-withdrawing substituents, which are preferable because they lower the solvation energy of lithium ions. Therefore, both the fluorinated cyclic carbonate and the fluorinated chain carbonate are suitable for the electrolyte, and a mixed organic solvent containing these is also suitable.

[0274] Examples of fluorinated cyclic carbonates that can be used include fluoroethylene carbonate (fluoroethylene carbonate, FEC, F1EC), difluoroethylene carbonate (DFEC, F2EC), trifluoroethylene carbonate (F3EC), and tetrafluoroethylene carbonate (F4EC). DFEC includes isomers such as cis-4,5 and trans-4,5. Since all fluorinated cyclic carbonates have electron-withdrawing substituents, they can be considered to have low solvation energy for lithium ions. The electron-withdrawing substituent in FEC is an F group.

[0275] Methyl 3,3,3-trifluoropropionate is an example of a fluorinated chain carbonate. The abbreviation for methyl 3,3,3-trifluoropropionate is "MTFP." In MTFP, the electron-withdrawing substituent is CF ３ It is the base.

[0276] FEC is a cyclic carbonate with a high dielectric constant, and when used in an organic solvent, it promotes the dissociation of lithium salts. On the other hand, because FEC has electron-withdrawing substituents, it is more likely to desolvate with lithium ions than ethylene carbonate (EC). Specifically, the solvation energy of lithium ions in FEC is lower than that of EC without electron-withdrawing substituents. Therefore, it is easier to separate lithium ions from the surfaces of the positive and negative electrode active materials, thereby reducing the internal resistance of the secondary battery. Furthermore, because FEC has a deep highest occupied molecular orbital (HOMO), it is less susceptible to oxidation and has improved oxidation resistance. On the other hand, there are concerns about the high viscosity of FEC. Therefore, it is recommended to use a mixed organic solvent containing MTFP in addition to FEC alone in the electrolyte. MTFP is a type of chain carbonate, and can have the effect of reducing the viscosity of the electrolyte solution or maintaining the viscosity at room temperature (typically 25° C.) even at low temperatures (typically 0° C.). Furthermore, although MTFP has a lower solvation energy than methyl propionate (abbreviated as "MP"), which does not have an electron-withdrawing substituent, it may form a solvate with lithium ions when used in the electrolyte solution.

[0277] The organic solvent described above is free from granular dust or molecules other than the constituent molecules of the organic solvent (hereinafter simply referred to as "impurities"), and oxygen (O ２ ), water (H ２ It is preferable that the content of HCl, HCl, and HCl is low and highly purified. It is also preferable that the reaction by-products produced during synthesis are suppressed through appropriate purification. Specifically, the impurities in the electrolyte are 100 ppm or less, preferably 50 ppm or less, and more preferably less than 10 ppm. The concentration of water among the impurities can be detected by Karl Fischer titration.

[0278] Furthermore, it is preferable that the above-mentioned organic solvent has almost no peaks due to impurities that can be confirmed by NMR measurement or the like. "Almost no peaks can be confirmed" means that the ratio of the integrated area of ​​the peak due to the impurity to the integrated area of ​​the peak due to the main component (simply referred to as "integral ratio") is 0.005 or less, preferably 0.002 or less. The device used for NMR measurement is not particularly limited, but for example, Bruker's "AVANCE III 400" can be used. Furthermore, among the five peaks of acetonitrile derived from acetonitrile-d3 used as a solvent in 1H-NMR measurement, the central peak can be located at 1.94 ppm.

[0279] For example, in the case of MTFP, it is known that when 1H-NMR is measured using acetonitrile-d3 solvent, four peaks appear at δ between 3.29 ppm and 3.43 ppm. However, if other peaks appear in this vicinity, for example, if a peak appears at δ between 3.24 ppm and 3.29 ppm, the peaks can be considered to be derived from impurities. Therefore, if the ratio (integral ratio) of the peak area between 3.24 ppm and 3.29 ppm to the peak area between 3.29 ppm and 3.43 ppm is 0.005 or less, preferably 0.002 or less, it can be said that peaks due to impurities are almost impossible to confirm.

[0280] The total content of the mixed organic solvent containing FEC and MTFP having such physical properties is taken as 100 vol %, and they are preferably mixed and used in a volume ratio of x:100-x (where 5≦x≦30, preferably 10≦x≦20). In other words, it is preferable to mix MTFP in a larger amount than FEC in the mixed organic solvent.

[0281] Furthermore, by using one or more flame-retardant and non-volatile ionic liquids (room-temperature molten salts) as the solvent for the electrolyte, it is possible to prevent the battery from exploding and / or catching fire even if the internal temperature rises due to an internal short circuit or overcharging of the battery. The ionic liquid is composed of a cation and an anion, and includes an organic cation and an anion. Examples of organic cations used in the electrolyte include aliphatic onium cations such as quaternary ammonium cations, tertiary sulfonium cations, and quaternary phosphonium cations, and aromatic cations such as imidazolium cations and pyridinium cations. Examples of anions used in the electrolyte include monovalent amide anions, monovalent methide anions, fluorosulfonate anions, perfluoroalkylsulfonate anions, tetrafluoroborate anions, perfluoroalkylborate anions, hexafluorophosphate anions, and perfluoroalkylphosphate anions.

[0282] [Lithium Salt] Examples of the lithium salt to be dissolved in the solvent include LiPF ６ , LiClO ４ , LiAsF ６ , LiBF ４ , LiAlCl ４ , LiSCN, LiBr, LiI, Li ２ SO ４ , Li ２ B １０ Cl １０ , Li ２ B １２ Cl １２ , LiCF ３ SO ３ , LiC ４ F ９ SO ３ , LiC(CF ３ SO ２ ) ３ , LiC(C ２ F ５ SO ２ ) ３ , LiN(CF ３ SO ２ ) ２ , LiN(C ４ F ９ SO ２ ) (CF ３SO ２ ), LiN(C ２ F ５ SO ２ ) ２ The lithium salt may be used alone or in any combination and ratio of two or more of these. The lithium salt is preferably used in an amount of 0.5 mol / L or more and 3.0 mol / L or less relative to the solvent. ６ , LiBF ４ The use of these improves the safety of lithium-ion batteries.

[0283] The above-mentioned electrolyte is preferably a highly purified electrolyte with a low content of granular dust or elements other than the constituent elements of the electrolyte (hereinafter simply referred to as "impurities"). Specifically, the weight ratio of impurities to the electrolyte is 1 wt % or less, preferably 0.1 wt % or less, and more preferably 0.01 wt % or less.

[0284] [Additives] The electrolyte may contain additives. The additives can suppress reactive decomposition of the electrolyte that may occur on the positive electrode surface or the negative electrode surface when the battery is operated at high voltage and / or high temperature. Examples of additives that can be used include vinylene carbonate (VC), propane sultone (PS), tert-butylbenzene (TBB), fluoroethylene carbonate (FEC), and lithium bis(oxalate)borate (LiBOB). LiBOB is particularly preferred because it easily forms a good coating. VC or FEC is preferred because it can form a good coating on the negative electrode during battery aging or charging in the early stages of use, improving cycle characteristics.

[0285] The additive may be one or more dinitrile compounds, such as succinonitrile, glutaronitrile, adiponitrile (ADN), or ethylene glycol bis(propionitrile) ether (EGBE).

[0286] Fluorobenzene may also be added to the organic solvent. The concentration of the additive can be, for example, 0.1 wt% or more and 5 wt% or less relative to the total electrolyte. PS or EGBE are preferred because they form a good coating on the positive electrode during charge and discharge, improving cycle characteristics. FB is preferred because it improves the wettability of the organic solvent to the positive and negative electrodes. Dinitrile compounds are preferred because their nitrile groups orient to the positive and negative electrodes, inhibiting oxidative decomposition of the organic solvent and improving high-voltage resistance. Furthermore, dinitrile compounds are preferred because they prevent copper dissolution during overdischarge when a copper-containing current collector is used on the negative electrode. Considering the use of batteries at high voltages, adding a nitrile compound is preferred.

[0287] [Gel Electrolyte] A polymer gel in which a polymer is swollen with an electrolytic solution may be used as the gel electrolyte. By using a polymer gel electrolyte, a semi-solid electrolyte layer can be provided, improving safety against leakage and the like. In addition, it is possible to reduce the thickness and weight of the battery.

[0288] Examples of polymers that can be used to form gels include silicone gel, acrylic gel, acrylonitrile gel, polyethylene oxide gel, polypropylene oxide gel, and fluorine-based polymer gel.

[0289] Examples of polymers that can be used include polymers having a polyalkylene oxide structure such as polyethylene oxide (PEO), PVDF, polyacrylonitrile, and copolymers containing these. For example, PVDF-HFP, which is a copolymer of PVDF and hexafluoropropylene (HFP), can be used. The polymer formed may also have a porous shape.

[0290] [Solid Electrolyte] Instead of an electrolytic solution, a solid electrolyte containing an inorganic material such as a sulfide or oxide, or a solid electrolyte containing a polymer material such as a PEO (polyethylene oxide) can be used. When a solid electrolyte is used, the installation of a separator and / or spacer is unnecessary. Furthermore, since the entire battery can be solidified, there is no risk of leakage, and safety is dramatically improved.

[0291] [Separator] A separator is disposed between the positive electrode and the negative electrode. Examples of separators that can be used include those formed from cellulose fibers such as paper, nonwoven fabrics, glass fibers, ceramics, or porous films made of nylon (polyamide), vinylon (polyvinyl alcohol fiber), polyester, acrylic, polyolefin, polyimide, or polyurethane. The separator is preferably processed into a bag shape and disposed so as to encase either the positive electrode or the negative electrode.

[0292] The separator may have a multilayer structure. For example, an organic film such as polypropylene or polyethylene may be coated with a ceramic material, a fluorine-based material, a polyamide material, or a mixture of these. Examples of ceramic materials include aluminum oxide particles and silicon oxide particles. Examples of fluorine-based materials include PVDF and polytetrafluoroethylene. Examples of polyamide materials include nylon and aramid (meta-aramid, para-aramid).

[0293] Coating with ceramic materials improves oxidation resistance, suppressing separator degradation during high-voltage charging and improving the reliability of secondary batteries. Coating with fluorine-based materials also improves adhesion between the separator and electrodes, improving output characteristics. Coating with polyamide materials, especially aramid, improves heat resistance, improving the safety of secondary batteries.

[0294] For example, both sides of a polypropylene film may be coated with a mixed material of aluminum oxide and aramid, or the surface of the polypropylene film that contacts the positive electrode may be coated with a mixed material of aluminum oxide and aramid, and the surface that contacts the negative electrode may be coated with a fluorine-based material.

[0295] When a separator with a multilayer structure is used, the safety of the secondary battery can be maintained even if the overall thickness of the separator is thin, and therefore the capacity per volume of the secondary battery can be increased.

[0296] [Example of Electrode Stack] Hereinafter, a configuration example of a stack having a plurality of stacked electrodes will be described.

[0297] Fig. 26A shows a top view of the positive electrode current collector 121, Fig. 26B shows the separator 140, Fig. 26C shows the negative electrode current collector 131, Fig. 26D shows the positive electrode lead 123 and the negative electrode lead 133, and Fig. 26E shows a top view of the film-like exterior body 150. The positive electrode lead 123 has a sealing layer 175 and a lead metal 176a, and the negative electrode lead 133 has a sealing layer 175 and a lead metal 176b.

[0298] 26A to 26E have roughly the same dimensions, and the area B surrounded by the dashed line in Fig. 26E has roughly the same dimensions as the separator in Fig. 26B. The areas between the short dashed line and the end in Fig. 26E are sealing portions 151 and 152, respectively.

[0299] The protruding portion of the positive electrode current collector 121 (the portion indicated by the broken line in FIG. 26A) and the protruding portion of the negative electrode current collector 131 (the portion indicated by the broken line in FIG. 26C) are called tab portions.

[0300] 27A shows an example in which positive electrode active material layers 122 are provided on both sides of a positive electrode current collector 121. In more detail, the layers are arranged in the following order: negative electrode current collector 131, negative electrode active material layer 132, separator 140, positive electrode active material layer 122, positive electrode current collector 121, positive electrode active material layer 122, separator 140, negative electrode active material layer 132, and negative electrode current collector 131. A cross-sectional view of this laminated structure cut along plane 170 is shown in FIG.

[0301] 27A shows an example in which two separators are used, it is also possible to use a structure in which one separator is folded and both ends are sealed to form a bag shape, and positive electrode current collector 121 is housed therein. Positive electrode active material layers 122 are formed on both sides of positive electrode current collector 121 housed in the bag-shaped separator.

[0302] It is also possible to provide anode active material layers 132 on both sides of the anode current collector 131. Fig. 27C shows an example of a secondary battery in which three anode current collectors 131 having anode active material layers 132 on both sides, four cathode current collectors 121 having cathode active material layers 122 on both sides, and eight separators 140 are sandwiched between two anode current collectors 131 having anode active material layers 132 on only one side. In this case, four pouch-shaped separators may be used instead of eight separators.

[0303] Increasing the number of layers can increase the capacity of the secondary battery. Furthermore, by providing the positive electrode active material layers 122 on both sides of the positive electrode current collector 121 and the negative electrode active material layers 132 on both sides of the negative electrode current collector 131, the thickness of the secondary battery can be reduced.

[0304] 28A shows a secondary battery formed by providing a positive electrode active material layer 122 on only one surface of a positive electrode current collector 121 and a negative electrode active material layer 132 on only one surface of a negative electrode current collector 131. Specifically, the negative electrode active material layer 132 is provided on one surface of the negative electrode current collector 131, and a separator 140 is laminated so as to be in contact with the negative electrode active material layer 132. The surface of the separator 140 not in contact with the negative electrode active material layer 132 is in contact with the positive electrode active material layer 122 of the positive electrode current collector 121 on one surface of which the positive electrode active material layer 122 is formed. Another positive electrode current collector 121, on one surface of which the positive electrode active material layer 122 is formed, is in contact with the surface of the positive electrode current collector 121. The positive electrode current collectors 121 are arranged so that the surfaces of the positive electrode current collectors 121 on which the positive electrode active material layer 122 is not formed face each other. Then, a separator 140 is further formed, and the negative electrode current collector 131 having the negative electrode active material layer 132 formed on one surface thereof is laminated so that the negative electrode active material layer 132 is in contact with the separator. A cross-sectional view of the laminated structure of Fig. 28A cut along a plane 171 is shown in Fig. 28B.

[0305] Although two separators are used in FIG. 28A, one separator can be folded and sealed at both ends to form a bag, and two positive electrode current collectors 121, each having a positive electrode active material layer 122 disposed on one side thereof, can be sandwiched between the separators.

[0306] Fig. 28C shows a diagram in which a plurality of the laminated structures of Fig. 28A are stacked. In Fig. 28C, the surfaces of the negative electrode current collectors 131 on which the negative electrode active material layers 132 are not formed face each other. Fig. 28C shows a state in which 12 positive electrode current collectors 121, 12 negative electrode current collectors 131, and 12 separators 140 are stacked.

[0307] A stacked structure in which a positive electrode active material layer 122 is provided on only one side of a positive electrode current collector 121 and a negative electrode active material layer 132 is provided on only one side of a negative electrode current collector 131 results in a thicker secondary battery compared to a structure in which a positive electrode active material layer 122 is provided on both sides of a positive electrode current collector 121 and a negative electrode active material layer 132 is provided on both sides of a negative electrode current collector 131. However, the side of the positive electrode current collector 121 on which the positive electrode active material layer 122 is not formed faces the side of another positive electrode current collector 121 on which the positive electrode active material layer 122 is not formed, so that the current collectors come into contact with each other. Similarly, the side of the negative electrode current collector 131 on which the negative electrode active material layer 132 is not formed faces the side of another negative electrode current collector 131 on which the negative electrode active material layer 132 is not formed, so that the current collectors come into contact with each other. For example, when a treatment for enhancing slidability is applied to the surface of the positive electrode current collector 121 on which the positive electrode active material layer 122 is not formed and / or the surface of the negative electrode current collector 131 on which the negative electrode active material layer 132 is not formed, the surfaces where the current collectors are in contact with each other can be made to slide easily without a large frictional force acting on the surfaces where the current collectors are in contact with each other. In other words, when the secondary battery is bent, the current collectors slide inside the secondary battery, making the secondary battery easier to bend. Examples of treatments that can be applied to the current collectors to enhance slidability include coating with a fluororesin (such as polytetrafluoroethylene), coating with graphene, and coating with a graphene compound.

[0308] 27 and 28, the positive electrode current collectors 121 are stacked and all of them are fixed and connected. Similarly, the negative electrode current collectors 131 are all fixed and connected.

[0309] Here, it is preferable to fix and connect the positive electrode lead 123 to the plurality of positive electrode current collectors 121. Similarly, it is preferable to fix and connect the negative electrode lead 133 to the plurality of negative electrode current collectors 131. By connecting the plurality of current collectors to the electrode leads in this way, the production can be carried out efficiently.

[0310] Furthermore, the separator 140 preferably has a shape that makes it difficult for the positive electrode 120 and the negative electrode 130 to electrically short-circuit. For example, as shown in FIG. 29A , it is preferable to make the width of each separator 140 larger than that of the positive electrode 120 and the negative electrode 130, because this makes it difficult for the positive electrode 120 and the negative electrode 130 to come into contact even when the relative positions of the positive electrode 120 and the negative electrode 130 are shifted due to deformation such as bending. Furthermore, it is preferable to make one separator 140 shaped like an accordion as shown in FIG. 29B or to make one separator 140 shaped so that the positive electrode 120 and the negative electrode 130 are alternately wound around the separator 140 as shown in FIG. 29C, because this prevents contact even when the relative positions of the positive electrode 120 and the negative electrode 130 are shifted. Furthermore, FIGS. 29B and 29C show examples in which a portion of the separator 140 is provided so as to cover the side surface of the stacked structure of the positive electrode 120 and the negative electrode 130.

[0311] 29 does not show the details of the positive electrodes 120 and the negative electrodes 130, but the above can be referred to for the method of forming them. Also, here, an example is shown in which the positive electrodes 120 and the negative electrodes 130 are arranged alternately, but a configuration in which two positive electrodes 120 or two negative electrodes 130 are connected to each other as shown in FIG. 28 may also be used.

[0312] In this embodiment, an example of a structure in which a rectangular film is folded in the center and the two edges are overlapped to seal the film is shown, but the shape of the film is not limited to a rectangle. The shape of the film is also not limited to a rectangle and can be any other symmetrical shape such as a triangle, square, pentagon, or other polygon, a circle, or a star.

[0313] A lithium ion battery can be produced by housing the laminate described above with reference to FIGS. 27 to 29 and the electrolyte solution described above in an exterior body and sealing the exterior body.

[0314] [Exterior Body] The exterior body of the battery can be made of a metal material such as aluminum, stainless steel, or titanium, or a resin material. A film-like exterior body can also be used. Examples of films that can be used include a three-layer structure in which a highly flexible metal thin film or metal foil such as aluminum, stainless steel, titanium, copper, or nickel is provided on a film made of a material such as polyethylene, polypropylene, polycarbonate, ionomer, or polyamide, and an insulating synthetic resin film such as a polyamide resin or polyester resin is further provided on the metal thin film as the outer surface of the exterior body. Such a multilayer structure film can be called a laminate film. In this case, the laminate film may be referred to as an aluminum (aluminum) laminate film, a stainless steel laminate film, a titanium laminate film, a copper laminate film, a nickel laminate film, or the like, using the name of the material of the metal layer.

[0315] The material or thickness of the metal layer of the laminate film may affect the flexibility of the battery. For example, an aluminum laminate film having a polypropylene layer, an aluminum layer, and nylon is preferably used as an exterior body for a battery with excellent flexibility (flexibility). Here, the thickness of the aluminum layer is preferably 50 μm or less, more preferably 40 μm or less, more preferably 30 μm or less, and more preferably 20 μm or less. If the aluminum layer is thinner than 10 μm, there is a concern that pinholes in the aluminum layer may reduce the gas barrier properties, so the thickness of the aluminum layer is preferably 10 μm or more.

[0316] Alternatively, a graphene sheet may be used as the laminate film instead of the metal layer. The graphene sheet may be a multilayer graphene sheet having a thickness of 100 nm to 30 μm, preferably 200 nm to 20 μm. The graphene sheet is flexible, has an interlayer distance of 0.34 nm, and has gas barrier properties, making it suitable for use as an exterior body for a secondary battery.

[0317] [Method for Processing a Film Having Concave and Convex Portions] Next, a method for processing a film that can be used for an exterior body will be described. The above-mentioned laminate film can be used as the film.

[0318] For example, a laminate film can be used as the laminate film. For example, a laminate film having a heat seal layer on one or both sides of a metal film can be used as the laminate film. The adhesive layer can be a heat-sealable resin film containing polypropylene, polyethylene, or the like. In this embodiment, an aluminum laminate film is used, which has a nylon resin on one side of an aluminum foil and an acid-resistant polypropylene film and a polypropylene film laminate on the other side of the aluminum foil.

[0319] The film is then embossed, resulting in a film with a concave-convex pattern. The film has a plurality of concave-convex portions, giving it a visible wavy pattern.

[0320] Embossing, which is a type of press working, will be explained below.

[0321] Fig. 30 is a cross-sectional view showing an example of embossing. Embossing is a type of press processing, and refers to a process in which an embossing roll with an uneven surface is pressed against a film to form unevenness in the film corresponding to the unevenness of the embossing roll. The embossing roll is a roll with a pattern engraved on its surface.

[0322] 30 shows an example of embossing on both sides of a film, and a method of forming a film with convex portions having peaks on one side.

[0323] 30 shows a state in which a film 190 is sandwiched between an embossing roll 195 in contact with one side of the film and an embossing roll 196 in contact with the other side, and the film 190 is being fed in a film traveling direction 191. A pattern is formed on the film surface by pressure or heat. Alternatively, a pattern may be formed on the film surface by both pressure and heat.

[0324] As the embossing roll, a metal roll, a ceramic roll, a plastic roll, a rubber roll, a resin roll, a wooden roll, or the like can be used as appropriate.

[0325] In Figure 30, embossing is performed using an embossing roll 196, which is a male-patterned embossing roll, and a female-patterned embossing roll 195. The male-patterned embossing roll 196 has multiple convex portions 196a. These convex portions correspond to the convex portions to be formed on the film to be processed. The female-patterned embossing roll 195 has multiple convex portions 195a. Adjacent convex portions 195a form recesses that fit into the convex portions to be formed on the film by the convex portions 196a provided on the male-patterned embossing roll 196.

[0326] Convex portions and flat portions can be formed continuously by successively performing embossing to raise a portion of film 190 and blank pressing to depression a portion of film 190. As a result, a pattern can be formed on film 190.

[0327] Next, a film having a plurality of convex portions with shapes different from those shown in Fig. 30 will be described with reference to Fig. 31A to Fig. 31E. By changing the convex portion shapes of embossing roll 195 and embossing roll 196 shown in Fig. 30 to shapes different from those shown in Fig. 30, embossing with various cross-sectional shapes shown in Fig. 31A to Fig. 31E can be performed.

[0328] Fig. 31A is a cross-sectional schematic diagram of an embossment having a wavy shape, and Figs. 31B to 31E are modified examples of Fig. 31A. Figs. 31B and 31C are diagrams showing an example in which the wavy shape is formed in a stepped shape, Fig. 31D is a diagram showing an example in which the wavy shape is formed in a rectangular shape, and Fig. 31E is a diagram showing an example in which the wavy shape is formed with acute-angled valley shapes and trapezoidal peak shapes.

[0329] 32A and 32B are bird's-eye views showing the resulting shape when the embossing process shown in FIGS. 30 to 31E is performed twice, changing the direction of film 190. Specifically, film 190 is embossed in a first direction, and then embossed in a second direction rotated 90 degrees from the first direction, thereby obtaining film 181 (181a, 181b, 181c) having the embossed shape (which can be referred to as a cross-wave shape) shown in FIGS. 32A and 32B. Film 181a having the cross-wave shape shown in FIG. 32A shows the outer shape used when fabricating a secondary battery from a single film 181a, and can be folded in half along the dashed line. Furthermore, the multiple films (film 181b, film 181c) having a cross-wave shape shown in Figure 32B indicate the external shape used when fabricating a secondary battery using two films (film 181b, film 181c), and film 181b and film 181c can be used by stacking them.

[0330] As described above, by performing processing using an embossing roll, it is possible to miniaturize the device. Furthermore, since processing can be performed without cutting the film, it is excellent in mass productivity. Note that processing is not limited to using an embossing roll, and for example, the film may be processed by pressing a pair of embossing plates with uneven surfaces against the film. In this case, one of the embossing plates may be flat, and processing may be performed in multiple steps.

[0331] 32C is a perspective view showing a curved state of battery 110B fabricated using a laminate film embossed with a unidirectional wave pattern for exterior body 150A. In this way, using a laminate film embossed with a unidirectional wave pattern for the exterior body makes it possible to produce a battery that is easy to bend in one direction.

[0332] In the above-described configuration example of the secondary battery, the exterior body on one side of the secondary battery and the exterior body on the other side have the same embossed shape. However, the configuration of a secondary battery of one embodiment of the present invention is not limited thereto. For example, as shown in FIGS. 33A to 33C , a secondary battery can be configured in which the exterior body on one side of the secondary battery has an embossed shape and the exterior body on the other side does not have an embossed shape. FIGS. 33A and 33B are diagrams illustrating a configuration example of a battery in which the exterior body on one side of the battery has an embossed shape and the exterior body on the other side does not have an embossed shape, as shown in FIGS. 32A and 32B . Also, FIG. 33C is a diagram illustrating a configuration example of a battery in which the exterior body on one side of the battery has an embossed shape and the exterior body on the other side does not have an embossed shape, as shown in FIG. 32C .

[0333] Furthermore, the exterior body on one side of the secondary battery and the exterior body on the other side may have different embossed shapes.

[0334] The content of this embodiment can be freely combined with the content of other embodiment modes.

[0335] In this embodiment, a structural example of a display device that can be used in an electronic device of one embodiment of the present invention will be described. The display device described below can be applied to the display portion 11 in Embodiment 1.

[0336] One embodiment of the present invention is a display device having a light-emitting element (also referred to as a light-emitting device). The display device has two light-emitting elements that emit different light colors. Each light-emitting element has a pair of electrodes and an EL layer therebetween. The light-emitting element is preferably an organic EL element (organic electroluminescent element). Two or more light-emitting elements that emit different light colors each have an EL layer containing a different light-emitting material. For example, a full-color display device can be realized by having three types of light-emitting elements that emit red (R), green (G), or blue (B) light, respectively.

[0337] When fabricating a display device having multiple light-emitting elements that emit different colors of light, it is necessary to form each layer containing a light-emitting material (light-emitting layer) in an island shape. When partially or entirely forming an EL layer, a method of forming island-shaped organic films by vapor deposition using a shadow mask such as a metal mask is known. However, with this method, deviations in the shape and position of the island-shaped organic films from the design occur due to various factors, such as the accuracy of the metal mask, misalignment between the metal mask and the substrate, deflection of the metal mask, and spreading of the contours of the deposited film due to vapor scattering, making it difficult to achieve high-definition and high-aperture display devices. Furthermore, during vapor deposition, the contours of the layer may become blurred, resulting in thinning of the edge portions. In other words, island-shaped light-emitting layers formed using a metal mask may have thickness variations depending on the location. Furthermore, when fabricating large, high-resolution, or high-definition display devices, there is a concern that low manufacturing yields may be caused by low dimensional accuracy of the metal mask and deformation due to heat, etc. Therefore, measures have been taken to artificially increase the resolution (also called pixel density) by adopting special pixel arrangement methods such as a pentile arrangement.

[0338] In this specification, the term "island-like" refers to a state in which two or more layers formed using the same material in the same process are physically separated. For example, an island-like light-emitting layer refers to a state in which the light-emitting layer is physically separated from an adjacent light-emitting layer.

[0339] In one embodiment of the present invention, an EL layer is processed into a fine pattern by photolithography without using a shadow mask such as a fine metal mask (FMM). This makes it possible to realize a display device with high definition and a large aperture ratio, which have been difficult to achieve until now. Furthermore, since the EL layer can be individually fabricated, a display device with extremely vivid images, high contrast, and high display quality can be realized. Note that, for example, the EL layer may be processed into a fine pattern using both a metal mask and photolithography.

[0340] Furthermore, the EL layer can be partially or entirely separated physically. This can suppress leakage current between adjacent light-emitting elements through a layer shared between the light-emitting elements (also referred to as a common layer). This can prevent crosstalk caused by unintended light emission, thereby realizing a display device with extremely high contrast. In particular, a display device with high current efficiency at low luminance can be realized.

[0341] One embodiment of the present invention can also be a display device that combines a white-emitting light-emitting element and a color filter. In this case, light-emitting elements provided in pixels (subpixels) that emit light of different colors can have the same configuration, and all layers can be common layers. Furthermore, part or all of each EL layer is separated by photolithography. This suppresses leakage current through the common layer, thereby realizing a display device with high contrast. In particular, in an element having a tandem structure in which multiple light-emitting layers are stacked via a highly conductive intermediate layer, leakage current through the intermediate layer can be effectively prevented, thereby realizing a display device that combines high brightness, high definition, and high contrast.

[0342] Furthermore, it is preferable to provide an insulating layer that covers at least the side surfaces of the island-shaped light-emitting layers. The insulating layer may be configured to cover a portion of the top surface of the island-shaped EL layer. The insulating layer is preferably made of a material that has barrier properties against water and oxygen. For example, an inorganic insulating film that is difficult for water or oxygen to diffuse can be used. This suppresses deterioration of the EL layer and realizes a highly reliable display device.

[0343] Furthermore, there is a region (recess) between two adjacent light-emitting elements where the EL layer of either light-emitting element is not provided. When a common electrode, or a common electrode and a common layer, is formed to cover the recess, a phenomenon in which the common electrode is separated by a step at the edge of the EL layer (also called a step discontinuity) may occur, resulting in insulation of the common electrode on the EL layer. Therefore, it is preferable to use a structure in which the local step located between two adjacent light-emitting elements is filled with a resin layer functioning as a planarizing film (also called LFP: Local Filling Planarization). The resin layer functions as a planarizing film. This suppresses step discontinuity in the common layer or common electrode, thereby achieving a highly reliable display device.

[0344] A more specific example of the structure of the display device of one embodiment of the present invention will be described below with reference to the drawings.

[0345] 34A shows a schematic top view of a display device 500 of one embodiment of the present invention. The display device 500 includes a plurality of light-emitting elements 510R that exhibit red light, a plurality of light-emitting elements 510G that exhibit green light, and a plurality of light-emitting elements 510B that exhibit blue light over a substrate 501. In FIG. 34A , the symbols R, G, and B are assigned within the light-emitting regions of the light-emitting elements to easily distinguish the light-emitting elements from one another.

[0346] The light-emitting elements 510R, 510G, and 510B are arranged in a matrix. Fig. 34A shows a so-called stripe arrangement in which light-emitting elements of the same color are arranged in one direction. Note that the arrangement method of the light-emitting elements is not limited to this, and arrangement methods such as an S-stripe arrangement, a delta arrangement, a Bayer arrangement, or a zigzag arrangement may also be used, or a pentile arrangement, a diamond arrangement, or the like may also be used.

[0347] As the light-emitting element 510R, the light-emitting element 510G, and the light-emitting element 510B, for example, an OLED (organic light-emitting diode) or a QLED (quantum-dot light-emitting diode) is preferably used. Examples of the light-emitting substance contained in the EL element include a substance that emits fluorescence (fluorescent material), a substance that emits phosphorescence (phosphorescent material), and a substance that exhibits thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF material). As the light-emitting substance contained in the EL element, not only organic compounds but also inorganic compounds (such as quantum dot materials) can be used.

[0348] 34A also shows a connection electrode 511C that is connected to the common electrode 513. The connection electrode 511C is given a potential (for example, an anode potential or a cathode potential) to be supplied to the common electrode 513. The connection electrode 511C is provided outside the display area where the light-emitting elements 510R and the like are arranged.

[0349] The connection electrode 511C can be provided along the periphery of the display area. For example, it may be provided along one side of the periphery of the display area, or it may be provided over two or more sides of the periphery of the display area. That is, when the top surface shape of the display area is rectangular, the top surface shape of the connection electrode 511C can be a strip shape (rectangle), an L-shape, a U-shape (square bracket shape), a square shape, or the like.

[0350] 34B and 34C are schematic cross-sectional views corresponding to dashed dotted lines A1-A2 and A3-A4 in Fig. 34A, respectively. Fig. 34B shows a schematic cross-sectional view of light-emitting element 510R, light-emitting element 510G, and light-emitting element 510B, and Fig. 34C shows a schematic cross-sectional view of connection portion 540 where connection electrode 511C and common electrode 513 are connected.

[0351] The light-emitting element 510R has a pixel electrode 511R, an organic layer 512R, a common layer 514, and a common electrode 513. The light-emitting element 510G has a pixel electrode 511G, an organic layer 512G, a common layer 514, and a common electrode 513. The light-emitting element 510B has a pixel electrode 511B, an organic layer 512B, a common layer 514, and a common electrode 513. The common layer 514 and the common electrode 513 are provided in common to the light-emitting element 510R, the light-emitting element 510G, and the light-emitting element 510B.

[0352] The organic layer 512R of the light-emitting element 510R contains a light-emitting organic compound that emits at least red light. The organic layer 512G of the light-emitting element 510G contains a light-emitting organic compound that emits at least green light. The organic layer 512B of the light-emitting element 510B contains a light-emitting organic compound that emits at least blue light. The organic layer 512R, the organic layer 512G, and the organic layer 512B can also be referred to as EL layers, and each contains at least a layer containing a light-emitting substance (light-emitting layer).

[0353] Hereinafter, when describing matters common to light-emitting element 510R, light-emitting element 510G, and light-emitting element 510B, they may be referred to as light-emitting element 510. Similarly, when describing matters common to components distinguished by alphabets, such as organic layer 512R, organic layer 512G, and organic layer 512B, they may be described using reference numerals without the alphabets.

[0354] The organic layer 512 and the common layer 514 may each independently include one or more of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer. For example, the organic layer 512 may have a stacked structure of a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer from the pixel electrode 511 side, and the common layer 514 may have an electron injection layer.

[0355] The pixel electrode 511R, the pixel electrode 511G, and the pixel electrode 511B are provided for each light-emitting element. The common electrode 513 and the common layer 514 are provided as a continuous layer common to each light-emitting element. A conductive film that is transparent to visible light is used for either one of the pixel electrodes or the common electrode 513, and a conductive film that is reflective is used for the other. By making each pixel electrode transparent and the common electrode 513 reflective, a bottom-emission display device can be obtained. Conversely, by making each pixel electrode reflective and the common electrode 513 transparent, a top-emission display device can be obtained. Note that by making both the pixel electrodes and the common electrode 513 transparent, a dual-emission display device can also be obtained.

[0356] A protective layer 521 is provided over the common electrode 513 to cover the light-emitting elements 510R, 510G, and 510B. The protective layer 521 has a function of preventing impurities such as water from diffusing from above into each light-emitting element.

[0357] The edge of the pixel electrode 511 (511R, 511G, 511B) preferably has a tapered shape. When the edge of the pixel electrode has a tapered shape, the portion of the organic layer 512 provided along the side surface of the pixel electrode also has a tapered shape. By tapering the side surface of the pixel electrode, the coverage of the EL layer provided along the side surface of the pixel electrode can be improved. Furthermore, by tapering the side surface of the pixel electrode, foreign matter (for example, dust or particles) during the manufacturing process can be easily removed by a process such as cleaning, which is preferable.

[0358] In this specification and the like, the term "tapered shape" refers to a shape in which at least a part of a side surface of a structure is inclined with respect to a substrate surface or a surface on which the structure is to be formed. For example, it is preferable to have a region in which the angle between the inclined side surface and the substrate surface (also referred to as the taper angle) is less than 90°.

[0359] The organic layer 512 is processed into an island shape by photolithography. Therefore, the angle between the top surface and the side surface of the organic layer 512 at its edge is close to 90 degrees. On the other hand, an organic film formed using a fine metal mask (FMM) or the like tends to become gradually thinner closer to the edge. For example, the top surface is formed in a sloped shape over a range of 1 μm to 10 μm, making it difficult to distinguish between the top surface and the side surface.

[0360] An insulating layer 525, a resin layer 526, and a layer 528 are provided between two adjacent light-emitting elements.

[0361] Between two adjacent light-emitting elements, the side surfaces of the organic layers 512 face each other with a resin layer 526 sandwiched therebetween. The resin layer 526 is located between the two adjacent light-emitting elements and is provided so as to fill the ends of each organic layer 512 and the region between the two organic layers 512. The resin layer 526 has a continuously convex upper surface, and a common layer 514 and a common electrode 513 are provided to cover the upper surface of the resin layer 526.

[0362] The resin layer 526 functions as a planarizing film that fills in a step between two adjacent light-emitting elements. By providing the resin layer 526, it is possible to prevent a phenomenon in which the common electrode 513 is divided by a step at the end of the organic layer 512 (also called a step disconnection), which would otherwise occur and cause insulation of the common electrode on the organic layer 512. The resin layer 526 can also be called an LFP.

[0363] An insulating layer containing an organic material can be suitably used as the resin layer 526. For example, acrylic resin, polyimide resin, epoxy resin, imide resin, polyamide resin, polyimideamide resin, silicone resin, siloxane resin, benzocyclobutene resin, phenol resin, precursors of these resins, or the like can be used as the resin layer 526. Alternatively, organic materials such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin can be used as the resin layer 526.

[0364] Furthermore, a photosensitive resin can be used as the resin layer 526. A photoresist can be used as the photosensitive resin. The photosensitive resin can be a positive-type material or a negative-type material.

[0365] The resin layer 526 may contain a material that absorbs visible light. For example, the resin layer 526 itself may be made of a material that absorbs visible light, or the resin layer 526 may contain a pigment that absorbs visible light. The resin layer 526 may be, for example, a resin that can be used as a color filter that transmits red, blue, or green light and absorbs other light, or a resin that contains carbon black as a pigment and functions as a black matrix.

[0366] The insulating layer 525 is provided in contact with the side surface of the organic layer 512. The insulating layer 525 is also provided to cover the upper end portion of the organic layer 512. A portion of the insulating layer 525 is provided in contact with the upper surface of the substrate 501.

[0367] The insulating layer 525 is located between the resin layer 526 and the organic layer 512 and functions as a protective film for preventing the resin layer 526 from contacting the organic layer 512. If the organic layer 512 and the resin layer 526 come into contact with each other, the organic layer 512 may be dissolved by an organic solvent or the like used when forming the resin layer 526. Therefore, as shown in this embodiment, by providing the insulating layer 525 between the organic layer 512 and the resin layer 526, it is possible to protect the side surfaces of the organic layer.

[0368] The insulating layer 525 can be an insulating layer containing an inorganic material. For example, an inorganic insulating film such as an oxide insulating film, a nitride insulating film, an oxynitride insulating film, or a nitride oxide insulating film can be used for the insulating layer 525. The insulating layer 525 may have a single-layer structure or a stacked-layer structure. Examples of oxide insulating films include a silicon oxide film, an aluminum oxide film, a magnesium oxide film, an indium gallium zinc oxide film, a gallium oxide film, a germanium oxide film, an yttrium oxide film, a zirconium oxide film, a lanthanum oxide film, a neodymium oxide film, a hafnium oxide film, and a tantalum oxide film. Examples of nitride insulating films include a silicon nitride film and an aluminum nitride film. Examples of oxynitride insulating films include a silicon oxynitride film and an aluminum oxynitride film. Examples of nitride oxide insulating films include a silicon nitride oxide film and an aluminum nitride oxide film. In particular, by using an inorganic insulating film such as a metal oxide film, such as an aluminum oxide film or a hafnium oxide film, or a silicon oxide film formed by an ALD method as the insulating layer 525, an insulating layer 525 with few pinholes and excellent protection of the EL layer can be formed.

[0369] In this specification and elsewhere, an oxynitride refers to a material having a higher content of oxygen atoms than nitrogen atoms, and a nitride oxide refers to a material having a higher content of nitrogen atoms than oxygen atoms. For example, silicon oxynitride refers to a material having a higher content of oxygen atoms than nitrogen atoms, and silicon nitride oxide refers to a material having a higher content of nitrogen atoms than oxygen atoms.

[0370] The insulating layer 525 can be formed by a sputtering method, a CVD method, a PLD method, an ALD method, or the like. The insulating layer 525 is preferably formed by an ALD method because of its good coverage.

[0371] Furthermore, a reflective film (for example, a metal film containing one or more selected from silver, palladium, copper, titanium, aluminum, and the like) may be provided between the insulating layer 525 and the resin layer 526, so that light emitted from the light-emitting layer is reflected by the reflective film, thereby improving the light extraction efficiency.

[0372] The layer 528 is a remaining portion of a protective layer (also referred to as a mask layer or a sacrificial layer) for protecting the organic layer 512 during etching of the organic layer 512. The layer 528 can be made of a material that can be used for the insulating layer 525. In particular, it is preferable to use the same material for the layer 528 and the insulating layer 525 because a common processing device or the like can be used for both.

[0373] In particular, an inorganic insulating film such as an aluminum oxide film, a metal oxide film such as a hafnium oxide film, or a silicon oxide film formed by the ALD method has few pinholes and therefore has an excellent function of protecting the EL layer, and can be suitably used for the insulating layer 525 and the layer 528.

[0374] A protective layer 521 is provided to cover the common electrode 513 .

[0375] The protective layer 521 may have, for example, a single-layer structure or a stacked structure including at least an inorganic insulating film. Examples of the inorganic insulating film include oxide films or nitride films such as a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, a silicon nitride film, an aluminum oxide film, an aluminum oxynitride film, and a hafnium oxide film. Alternatively, the protective layer 521 may be made of a semiconductor material or a conductive material such as indium gallium oxide, indium zinc oxide, indium tin oxide, or indium gallium zinc oxide.

[0376] The protective layer 521 may also be a laminated film of an inorganic insulating film and an organic insulating film. For example, a configuration in which an organic insulating film is sandwiched between a pair of inorganic insulating films is preferable. Furthermore, it is preferable that the organic insulating film functions as a planarizing film. This allows the upper surface of the organic insulating film to be flat, improving the coverage of the inorganic insulating film thereon and enhancing the barrier properties. Furthermore, since the upper surface of the protective layer 521 is flat, when a structure (e.g., a color filter, a touch sensor electrode, a lens array, etc.) is provided above the protective layer 521, the influence of uneven shapes caused by the structure below can be reduced, which is preferable.

[0377] 34C shows a connection portion 540 where the connection electrode 511C and the common electrode 513 are connected. In the connection portion 540, an opening is provided in the insulating layer 525 and the resin layer 526 above the connection electrode 511C. The connection electrode 511C and the common electrode 513 are connected through the opening.

[0378] 34C shows a connection portion 540 where the connection electrode 511C and the common electrode 513 are connected, but the common electrode 513 may be provided on the connection electrode 511C via the common layer 514. In particular, when a carrier injection layer is used for the common layer 514, the electrical resistivity of the material used for the common layer 514 is sufficiently low and the common layer 514 can be formed thin, so that there is often no problem even if the common layer 514 is located at the connection portion 540. This allows the common electrode 513 and the common layer 514 to be formed using the same masking mask, thereby reducing manufacturing costs.

[0379] The above is a description of an example of the configuration of the display device.

[0380] [Pixel Layout] The following mainly describes pixel layouts that are different from that shown in Fig. 34A. There are no particular limitations on the arrangement of light-emitting elements (sub-pixels), and various methods can be applied.

[0381] Examples of the top surface shape of the sub-pixel include a triangle, a quadrangle (including a rectangle and a square), a polygon such as a pentagon, a polygon with rounded corners, an ellipse, a circle, etc. Here, the top surface shape of the sub-pixel corresponds to the top surface shape of the light-emitting region of the light-emitting element.

[0382] An S-stripe arrangement is applied to pixel 550 shown in Fig. 35A. Pixel 550 shown in Fig. 35A is composed of three sub-pixels: light-emitting elements 510a, 510b, and 510c. For example, light-emitting element 510a may be a blue light-emitting element, light-emitting element 510b may be a red light-emitting element, and light-emitting element 510c may be a green light-emitting element.

[0383] The pixel 550 shown in FIG. 35B includes a light-emitting element 510a having a generally trapezoidal or triangular top surface shape with rounded corners, a light-emitting element 510b having a generally trapezoidal or triangular top surface shape with rounded corners, and a light-emitting element 510c having a generally rectangular or hexagonal top surface shape with rounded corners. Furthermore, the light-emitting element 510a has a larger light-emitting area than the light-emitting element 510b. In this manner, the shape and size of each light-emitting element can be determined independently. For example, the more reliable the light-emitting element, the smaller the size can be. For example, the light-emitting element 510a may be a green light-emitting element, the light-emitting element 510b may be a red light-emitting element, and the light-emitting element 510c may be a blue light-emitting element.

[0384] The pixels 524a and 524b shown in Figure 35C are arranged in a Pentile arrangement. Figure 35C shows an example in which a pixel 524a having a light-emitting element 510a and a light-emitting element 510b and a pixel 524b having a light-emitting element 510b and a light-emitting element 510c are arranged alternately. For example, the light-emitting element 510a may be a red light-emitting element, the light-emitting element 510b may be a green light-emitting element, and the light-emitting element 510c may be a blue light-emitting element.

[0385] Pixels 524a and 524b shown in Figures 35D and 35E are arranged in a delta configuration. Pixel 524a has two light-emitting elements (light-emitting elements 510a and 510b) in the top row (first row) and one light-emitting element (light-emitting element 510c) in the bottom row (second row). Pixel 524b has one light-emitting element (light-emitting element 510c) in the top row (first row) and two light-emitting elements (light-emitting elements 510a and 510b) in the bottom row (second row). For example, light-emitting element 510a may be a red light-emitting element, light-emitting element 510b may be a green light-emitting element, and light-emitting element 510c may be a blue light-emitting element.

[0386] FIG. 35D shows an example in which each light-emitting element has a substantially rectangular top surface shape with rounded corners, and FIG. 35E shows an example in which each light-emitting element has a circular top surface shape.

[0387] 35F shows an example in which light-emitting elements of each color are arranged in a zigzag pattern. Specifically, when viewed from above, the positions of the upper edges of two light-emitting elements arranged in a row (e.g., light-emitting elements 510a and 510b, or light-emitting elements 510b and 510c) are offset. For example, light-emitting element 510a may be a red light-emitting element, light-emitting element 510b may be a green light-emitting element, and light-emitting element 510c may be a blue light-emitting element.

[0388] In photolithography, the finer the pattern to be processed, the more significant the effect of light diffraction becomes. This reduces the fidelity of the photomask pattern when it is transferred by exposure, making it difficult to process the resist mask into the desired shape. Therefore, even if the photomask pattern is rectangular, it is likely to have rounded corners. As a result, the top surface shape of the light-emitting element may be polygonal with rounded corners, elliptical, circular, or the like.

[0389] Furthermore, in a manufacturing method of a display panel according to one embodiment of the present invention, the EL layer is processed into an island shape using a resist mask. The resist film formed on the EL layer needs to be cured at a temperature lower than the heat resistance temperature of the EL layer. Therefore, depending on the heat resistance temperature of the material for the EL layer and the curing temperature of the resist material, the resist film may not be cured sufficiently. A resist film that is not cured sufficiently may have a shape that is different from the desired shape during processing. As a result, the top surface shape of the EL layer may become a polygon with rounded corners, an ellipse, a circle, or the like. For example, when a resist mask with a square top surface shape is formed, a resist mask with a circular top surface shape may be formed, resulting in a circular top surface shape of the EL layer.

[0390] In order to form the top surface of the EL layer into a desired shape, a technique for correcting a mask pattern in advance (OPC (Optical Proximity Correction) technique) may be used so that the design pattern and the transfer pattern coincide with each other. Specifically, the OPC technique adds a correction pattern to the corners of figures on the mask pattern.

[0391] This concludes the description of the pixel layout.

[0392] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0393] Embodiment Mode 5 In this embodiment mode, a structural example of a display device will be described.

[0394] The display device of this embodiment can be used in electronic devices with relatively large screens, such as television sets, desktop or notebook personal computers, computer monitors, digital signage, large game machines such as pachinko machines, as well as display units of digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, smartphones, wristwatch-type terminals, tablet terminals, personal digital assistants, and sound reproduction devices.

[0395] [Display Device 400] FIG. 36 shows a perspective view of display device 400, and FIG. 37A shows a cross-sectional view of display device 400.

[0396] The display device 400 has a structure in which a substrate 452 and a substrate 451 are bonded together. In Fig. 36, the substrate 452 is indicated by a dashed line.

[0397] The display device 400 includes a display portion 462, a circuit 464, wiring 465, and the like. Fig. 36 shows an example in which an IC 473 and an FPC 472 are mounted on the display device 400. Therefore, the structure shown in Fig. 36 can also be considered as a display module including the display device 400, an IC (integrated circuit), and an FPC.

[0398] The circuit 464 can be, for example, a scanning line driver circuit.

[0399] The wiring 465 has a function of supplying signals and power to the display portion 462 and the circuit 464. The signals and power are input to the wiring 465 from the outside via the FPC 472 or input to the wiring 465 from the IC 473.

[0400] 36 shows an example in which an IC 473 is provided on a substrate 451 by a chip-on-glass (COG) method, a chip-on-film (COF) method, or the like. The IC 473 can be, for example, an IC having a scanning line driver circuit or a signal line driver circuit. The display device 400 and the display module may not necessarily include an IC. Alternatively, the IC may be mounted on an FPC by a COF method or the like.

[0401] 37A shows an example of a cross section of the display device 400, which is obtained by cutting a part of a region including the FPC 472, a part of the circuit 464, a part of the display portion 462, and a part of a region including a connecting portion. In FIG. 37A, an example of a cross section of the display portion 462 is shown, in particular, when a region including the light-emitting element 430b that emits green light and the light-emitting element 430c that emits blue light is cut.

[0402] The display device 400 shown in FIG. 37A includes the transistor 202, the transistor 210, the light-emitting element 430b, the light-emitting element 430c, and the like between a substrate 453 and a substrate 454.

[0403] The light-emitting element described as an example in Embodiment 4 can be applied to the light-emitting element 430b and the light-emitting element 430c.

[0404] Here, when a pixel of a display device has three types of sub-pixels having light-emitting elements of different luminescent colors, the three sub-pixels include sub-pixels of three colors of red (R), green (G), and blue (B), or sub-pixels of three colors of yellow (Y), cyan (C), and magenta (M), etc. When a pixel of a display device has four sub-pixels, the four sub-pixels include sub-pixels of four colors of R, G, B, and white (W), or sub-pixels of four colors of R, G, B, and Y, etc.

[0405] The substrate 454 and the protective layer 416 are bonded to each other via an adhesive layer 442. The adhesive layer 442 is provided to overlap the light-emitting element 430b and the light-emitting element 430c, and a solid sealing structure is applied to the display device 400.

[0406] The light-emitting elements 430b and 430c each include a conductive layer 411a, a conductive layer 411b, and a conductive layer 411c as pixel electrodes. The conductive layer 411b is reflective to visible light and functions as a reflective electrode. The conductive layer 411c is transparent to visible light and functions as an optical adjustment layer.

[0407] The conductive layer 411a is connected to a conductive layer 222b of the transistor 210 through an opening provided in the insulating layer 214. The transistor 210 has a function of controlling the driving of a light-emitting element.

[0408] An EL layer 412G or an EL layer 412B is provided to cover the pixel electrode. An insulating layer 421 is provided in contact with the side surfaces of the EL layer 412G and the EL layer 412B, and a resin layer 422 is provided to fill the recesses in the insulating layer 421. A layer 424 is provided between the EL layer 412G and the insulating layer 421, and between the EL layer 412B and the insulating layer 421. A common layer 414, a common electrode 413, and a protective layer 416 are provided to cover the EL layer 412G and the EL layer 412B.

[0409] Light emitted from the light-emitting element is emitted toward the substrate 452. The substrate 452 is preferably made of a material that is highly transparent to visible light.

[0410] The transistor 202 and the transistor 210 are both formed over a substrate 451. These transistors can be manufactured using the same material and through the same process.

[0411] The substrate 453 and the insulating layer 212 are bonded together by an adhesive layer 455 .

[0412] The display device 400 is manufactured by first bonding a substrate 454 provided with the insulating layer 212, the transistors, the light-emitting elements, and the like to the substrate 454 with an adhesive layer 442. The substrate 453 is then attached to the exposed surface of the substrate 454, and the components formed on the substrate 454 are transferred to the substrate 453. The substrate 453 and the substrate 454 are preferably flexible. This can increase the flexibility of the display device 400.

[0413] The insulating layer 212 can be formed using the inorganic insulating film that can be used for the insulating layer 211 and the insulating layer 215 .

[0414] A connection portion 204 is provided in a region of the substrate 453 where the substrate 454 does not overlap. In the connection portion 204, a wiring 465 is connected to an FPC 472 via a conductive layer 466 and a connection layer 242. The conductive layer 466 can be obtained by processing the same conductive film as the pixel electrode. This allows the connection portion 204 and the FPC 472 to be connected via the connection layer 242.

[0415] The transistor 202 and the transistor 210 each include a conductive layer 221 functioning as a gate, an insulating layer 211 functioning as a gate insulating layer, a semiconductor layer 231 including a channel formation region 231i and a pair of low-resistance regions 231n, a conductive layer 222a connected to one of the pair of low-resistance regions 231n, a conductive layer 222b connected to the other of the pair of low-resistance regions 231n, an insulating layer 225 functioning as a gate insulating layer, a conductive layer 223 functioning as a gate, and an insulating layer 215 covering the conductive layer 223. The insulating layer 211 is located between the conductive layer 221 and the channel formation region 231i. The insulating layer 225 is located between the conductive layer 223 and the channel formation region 231i.

[0416] The conductive layer 222a and the conductive layer 222b are each connected to the low-resistance region 231n through an opening provided in the insulating layer 215. One of the conductive layer 222a and the conductive layer 222b functions as a source, and the other functions as a drain.

[0417] 37A shows an example in which the top surface and side surfaces of the semiconductor layer are covered with an insulating layer 225. The conductive layer 222a and the conductive layer 222b are connected to the low-resistance region 231n through openings provided in the insulating layer 225 and the insulating layer 215, respectively.

[0418] 37B , the insulating layer 225 overlaps with the channel formation region 231i of the semiconductor layer 231 but does not overlap with the low-resistance region 231n. For example, the structure shown in FIG. 37B can be manufactured by processing the insulating layer 225 using the conductive layer 223 as a mask. In FIG. 37B , the insulating layer 215 is provided to cover the insulating layer 225 and the conductive layer 223, and the conductive layer 222a and the conductive layer 222b are each connected to the low-resistance region 231n through openings in the insulating layer 215. Furthermore, an insulating layer 218 may be provided to cover the transistor.

[0419] The structure of the transistor included in the display device of this embodiment is not particularly limited. For example, a planar transistor, a staggered transistor, an inverted staggered transistor, or the like can be used. Furthermore, either a top-gate transistor or a bottom-gate transistor structure may be used. Alternatively, gates may be provided above and below a semiconductor layer in which a channel is formed.

[0420] The transistor 202 and the transistor 210 have a structure in which a semiconductor layer in which a channel is formed is sandwiched between two gates. The two gates may be connected and the same signal may be supplied to drive the transistor. Alternatively, the threshold voltage of the transistor may be controlled by applying a potential for controlling the threshold voltage to one of the two gates and a potential for driving to the other.

[0421] The crystallinity of a semiconductor material used for a semiconductor layer of a transistor is not particularly limited, and any of an amorphous semiconductor, a single-crystal semiconductor, and a semiconductor having crystallinity other than single crystal (a microcrystalline semiconductor, a polycrystalline semiconductor, or a semiconductor having a crystalline region in part) may be used. The use of a single-crystal semiconductor or a crystalline semiconductor is preferable because it can suppress deterioration of transistor characteristics.

[0422] The semiconductor layer of the transistor preferably includes a metal oxide (also referred to as an oxide semiconductor). That is, the display device of this embodiment preferably includes a transistor using a metal oxide for a channel formation region (hereinafter referred to as an OS transistor).

[0423] The band gap of the metal oxide used for the semiconductor layer of the transistor is preferably 2 eV or more, more preferably 2.5 eV or more. Use of a metal oxide with a wide band gap can reduce the off-state current of the OS transistor.

[0424] The metal oxide preferably contains at least indium or zinc, and more preferably contains indium and zinc. For example, the metal oxide preferably contains indium, M (wherein M is one or more selected from gallium, aluminum, yttrium, tin, silicon, boron, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, and cobalt), and zinc.

[0425] Alternatively, the semiconductor layer of the transistor may contain silicon, such as amorphous silicon or crystalline silicon (such as low-temperature polysilicon or single-crystal silicon).

[0426] The transistors included in the circuit 464 may have the same structure as or different from the transistors included in the display portion 462. The transistors included in the circuit 464 may all have the same structure or may have two or more types of structures. Similarly, the transistors included in the display portion 462 may all have the same structure or may have two or more types of structures.

[0427] At least one insulating layer covering the transistor is preferably made of a material that is resistant to the diffusion of impurities such as water and hydrogen. This allows the insulating layer to function as a barrier layer. With this structure, it is possible to effectively prevent impurities from diffusing into the transistor from the outside, thereby improving the reliability of the display device.

[0428] It is preferable to use an inorganic insulating film for each of the insulating layers 211, 212, 215, 218, and 225. Examples of the inorganic insulating film that can be used include a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon nitride oxide film, an aluminum oxide film, and an aluminum nitride film. Alternatively, a hafnium oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, and a neodymium oxide film may also be used. Two or more of the above-described inorganic insulating films may be stacked.

[0429] An organic insulating film is suitable for the insulating layer 214 that functions as a planarizing layer. Materials that can be used for the organic insulating film include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins.

[0430] Various optical members can be arranged along the inner or outer surface of substrate 454. Examples of optical members include a light-shielding layer, a polarizing plate, a retardation plate, a light diffusion layer (such as a diffusion film), an anti-reflection layer, a microlens array, and a light-collecting film. In addition, an antistatic film that suppresses the adhesion of dust, a water-repellent film that makes it difficult for dirt to adhere, a hard coat film that suppresses scratches caused by use, an impact absorbing layer, etc. may be arranged on the outer surface of substrate 454.

[0431] By providing the protective layer 416 that covers the light-emitting element, impurities such as water can be prevented from entering the light-emitting element, and the reliability of the light-emitting element can be improved.

[0432] Fig. 37A shows a connection portion 228. The common electrode 413 and the wiring are connected at the connection portion 228. Fig. 37A shows an example in which the same layered structure as that of the pixel electrode is applied to the wiring.

[0433] The substrate 453 and the substrate 454 can each be made of glass, quartz, ceramics, sapphire, resin, metal, alloy, semiconductor, or the like. A material that transmits light is used for the substrate on the side from which light from the light-emitting element is extracted. When a flexible material is used for the substrate 453 and the substrate 454, the flexibility of the display device can be increased, thereby realizing a flexible display. Alternatively, a polarizing plate may be used for the substrate 453 or the substrate 454.

[0434] The substrates 453 and 454 can each be made of a polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), a polyacrylonitrile resin, an acrylic resin, a polyimide resin, a polymethyl methacrylate resin, a polycarbonate (PC) resin, a polyethersulfone (PES) resin, a polyamide resin (nylon, aramid, etc.), a polysiloxane resin, a cycloolefin resin, a polystyrene resin, a polyamideimide resin, a polyurethane resin, a polyvinyl chloride resin, a polyvinylidene chloride resin, a polypropylene resin, a polytetrafluoroethylene (PTFE) resin, an ABS resin, or a cellulose nanofiber. One or both of the substrates 453 and 454 may be made of glass having a thickness sufficient to provide flexibility.

[0435] The adhesive layer can be made of various curable adhesives, such as photo-curable adhesives (e.g., ultraviolet curable), reactive curable adhesives, thermosetting adhesives, and anaerobic adhesives. Examples of such adhesives include epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, and EVA (ethylene vinyl acetate) resin. Materials with low moisture permeability, such as epoxy resin, are particularly preferred. Two-component resins may also be used. Adhesive sheets, etc., may also be used.

[0436] The connection layer 242 may be an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), or the like.

[0437] Materials that can be used for conductive layers such as the gate, source, and drain of a transistor, as well as various wirings and electrodes that constitute a display device include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, and alloys containing these metals as main components, etc. Films containing these materials can be used as a single layer or a stacked layer structure.

[0438] Examples of light-transmitting conductive materials include conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide containing gallium, or graphene. Alternatively, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium, or alloy materials containing such metal materials, can be used. Alternatively, nitrides of such metal materials (e.g., titanium nitride) can be used. When using metal materials or alloy materials (or their nitrides), it is preferable to thin the film thickness to ensure light-transmitting properties. A stacked film of the above materials can also be used as the conductive layer. For example, a stacked film of an alloy of silver and magnesium and indium tin oxide is preferable because it can enhance conductivity. These materials can also be used for conductive layers such as various wirings and electrodes constituting a display device, and for conductive layers (conductive layers functioning as pixel electrodes or common electrodes) of light-emitting elements.

[0439] Examples of insulating materials that can be used for each insulating layer include resins such as acrylic resin and epoxy resin, and inorganic insulating materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide.

[0440] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0441] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0442] Embodiment Mode 6 In this embodiment mode, a light-emitting element (also referred to as a light-emitting device) that can be used for a display device will be described.

[0443] In this specification, etc., a device fabricated using a metal mask or an FMM (fine metal mask, high-resolution metal mask) may be referred to as a device with an MM (metal mask) structure. Also, in this specification, etc., a device fabricated without using a metal mask or an FMM may be referred to as a device with an MML (metal maskless) structure.

[0444] In this specification and the like, a structure in which different light-emitting layers are formed or different light-emitting layers are painted for each color light-emitting device (here, blue (B), green (G), and red (R)) may be referred to as an SBS (Side By Side) structure. In this specification and the like, a light-emitting device that can emit white light may be referred to as a white light-emitting device. In addition, a white light-emitting device can be combined with a colored layer (for example, a color filter) to realize a full-color display device.

[0445] [Light-Emitting Device] Light-emitting devices can be broadly divided into single structures and tandem structures. A single-structure device has one light-emitting unit between a pair of electrodes. The light-emitting unit includes one or more light-emitting layers. To obtain white light emission with a single structure, two light-emitting layers can be selected so that the light emitted from each of the two light-emitting layers has a complementary color relationship. For example, by making the light-emitting color of the first light-emitting layer and the light-emitting color of the second light-emitting layer complementary, a configuration can be obtained in which the light-emitting device as a whole emits white light. Furthermore, in the case of a light-emitting device having three or more light-emitting layers, the light-emitting colors of the three or more light-emitting layers can be combined to form a configuration in which the light-emitting device as a whole emits white light.

[0446] A tandem-structure device has multiple light-emitting units between a pair of electrodes. Each light-emitting unit is configured to include one or more light-emitting layers. By using light-emitting layers that emit light of the same color in each light-emitting unit, the brightness per given current can be increased, and the device can be made more reliable than a single-structure light-emitting device. To obtain white light emission in a tandem structure, the light from the light-emitting layers of multiple light-emitting units can be combined to obtain white light emission. Note that the combination of light-emitting colors that can produce white light emission is the same as in the single-structure configuration. Note that in a tandem-structure device, it is preferable to provide an intermediate layer, such as a charge-generating layer, between the multiple light-emitting units.

[0447] When comparing a white light-emitting device with a light-emitting device having an SBS structure, the light-emitting device with an SBS structure can consume less power than the white light-emitting device, and the manufacturing process of the white light-emitting device is simpler than that of the light-emitting device having an SBS structure, so the manufacturing cost can be lower and the manufacturing yield can be higher.

[0448] <Configuration Example of Light-Emitting Device> As shown in FIG. 38A , the light-emitting device has an EL layer 790 between a pair of electrodes (a lower electrode 791 and an upper electrode 792). The EL layer 790 can be composed of multiple layers, such as a layer 720, a light-emitting layer 711, and a layer 730. The layer 720 can have, for example, a layer containing a substance with high electron injection properties (electron injection layer) and a layer containing a substance with high electron transport properties (electron transport layer). The light-emitting layer 711 contains, for example, a light-emitting compound. The layer 730 can have, for example, a layer containing a substance with high hole injection properties (hole injection layer) and a layer containing a substance with high hole transport properties (hole transport layer).

[0449] A structure having the layer 720, the light-emitting layer 711, and the layer 730 provided between a pair of electrodes can function as a single light-emitting unit, and the structure of FIG. 38A is referred to as a single structure in this specification.

[0450] Specifically, the light-emitting device shown in FIG. 38B has layers 730-1 and 730-2, a light-emitting layer 711, layers 720-1 and 720-2, and an upper electrode 792 on a lower electrode 791. For example, the lower electrode 791 is an anode, and the upper electrode 792 is a cathode. In this case, the layer 730-1 functions as a hole injection layer, the layer 730-2 functions as a hole transport layer, the layer 720-1 functions as an electron transport layer, and the layer 720-2 functions as an electron injection layer. On the other hand, when the lower electrode 791 is a cathode and the upper electrode 792 is an anode, the layer 730-1 functions as an electron injection layer, the layer 730-2 functions as an electron transport layer, the layer 720-1 functions as a hole transport layer, and the layer 720-2 functions as a hole injection layer. This layer structure allows carriers to be efficiently injected into the light-emitting layer 711, thereby increasing the efficiency of carrier recombination within the light-emitting layer 711.

[0451] As shown in FIGS. 38C and 38D, a configuration in which a plurality of light-emitting layers (light-emitting layers 711, 712, 713) are provided between the layer 720 and the layer 730 is also a variation of the single structure.

[0452] As shown in Figures 38E and 38F, a configuration in which a plurality of light-emitting units (EL layers 790a, EL layers 790b) are connected in series via an intermediate layer (charge generating layer) 740 is referred to as a tandem structure in this specification. A tandem structure can also be called a stack structure. Note that the tandem structure makes it possible to obtain a light-emitting device capable of emitting light with high brightness.

[0453] 38C, light-emitting materials that emit light of the same color, or even the same light-emitting material, may be used for the light-emitting layers 711, 712, and 713. Stacking the light-emitting layers can increase the luminance of emitted light.

[0454] Furthermore, different light-emitting materials may be used for the light-emitting layer 711, the light-emitting layer 712, and the light-emitting layer 713. When the light emitted from the light-emitting layer 711, the light-emitting layer 712, and the light-emitting layer 713 has a complementary color relationship, white light can be obtained. Figure 38D shows an example in which a colored layer 795 that functions as a color filter is provided. When white light passes through the color filter, light of a desired color can be obtained.

[0455] 38E, light-emitting layers 711 and 712 may be made of light-emitting materials that emit light of the same color. Alternatively, light-emitting layers 711 and 712 may be made of light-emitting materials that emit different colors. When the light emitted by light-emitting layer 711 and the light emitted by light-emitting layer 712 are complementary colors, white light is obtained. FIG. 38F shows an example in which a colored layer 795 is further provided.

[0456] 38C, 38D, 38E, and 38F, the layer 720 and the layer 730 may have a laminated structure consisting of two or more layers, as shown in FIG. 38B.

[0457] 38D, light-emitting layers 711, 712, and 713 may be made of light-emitting materials that emit light of the same color. Similarly, in FIG. 38F, light-emitting layers 711 and 712 may be made of light-emitting materials that emit light of the same color. In this case, by applying a color conversion layer instead of colored layer 795, light of a desired color different from the light-emitting material can be obtained. For example, by using a blue light-emitting material in each light-emitting layer and transmitting blue light through the color conversion layer, light with a wavelength longer than blue (e.g., red, green, etc.) can be obtained. Fluorescent materials, phosphorescent materials, quantum dots, etc. can be used as the color conversion layer.

[0458] The light-emitting device can emit light of red, green, blue, cyan, magenta, yellow, or white, depending on the material of the EL layer 790. Furthermore, the color purity can be further improved by providing the light-emitting device with a microcavity structure.

[0459] A light-emitting device that emits white light may have a structure in which two or more types of light-emitting materials are contained in the light-emitting layer, or may have two or more stacked light-emitting layers containing different light-emitting materials, in which the light-emitting materials can be selected so that the light emitted from each of the light-emitting materials has a complementary color relationship.

[0460] [Light-Emitting Device] Here, a specific example of the configuration of the light-emitting device will be described.

[0461] The light-emitting device has at least a light-emitting layer. The light-emitting device may further have, as a layer other than the light-emitting layer, a layer containing a substance with high hole-injection properties, a substance with high hole-transport properties, a hole-blocking material, a substance with high electron-transport properties, an electron-blocking material, a substance with high electron-injection properties, a bipolar substance (a substance with high electron-transport properties and high hole-transport properties), or the like.

[0462] The light-emitting device can be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-emitting device can be formed by a method such as vapor deposition (including vacuum vapor deposition), transfer, printing, inkjet printing, or coating.

[0463] For example, the light-emitting device may have, in addition to the light-emitting layer, one or more of a hole-injection layer, a hole-transport layer, a hole-blocking layer, an electron-blocking layer, an electron-transport layer, and an electron-injection layer.

[0464] The hole injection layer is a layer that injects holes from the anode into the hole transport layer and contains a substance with high hole injection properties, such as an aromatic amine compound and a composite material containing a hole transport material and an acceptor material (electron acceptor material).

[0465] The hole transport layer is a layer that transports holes injected from the anode by the hole injection layer to the light emitting layer. The hole transport layer is a layer that contains a hole transport material. The hole transport material is a material having a concentration of 1×10 −６ cm ２ A substance having a hole mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher hole transporting property than electron transporting property. As the hole transporting material, a substance having a high hole transporting property, such as a π-electron-rich heteroaromatic compound (e.g., a carbazole derivative, a thiophene derivative, a furan derivative, etc.) or an aromatic amine (a compound having an aromatic amine skeleton), is preferred.

[0466] The electron transport layer is a layer that transports electrons injected from the cathode by the electron injection layer to the light emitting layer. The electron transport layer is a layer that contains an electron transporting material. The electron transporting material is a material having a molecular weight of 1×10 −６ cm ２ / Vs or more is preferred. Note that other substances can also be used as long as they have a higher electron transporting property than holes. Examples of electron-transporting materials that can be used include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, and metal complexes having a thiazole skeleton, as well as oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives having a quinoline ligand, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other π-electron-deficient heteroaromatic compounds including nitrogen-containing heteroaromatic compounds.

[0467] The electron injection layer is a layer that injects electrons from the cathode to the electron transport layer and contains a substance with high electron injection properties. Examples of the substance with high electron injection properties include alkali metals, alkaline earth metals, and compounds thereof. Examples of the substance with high electron injection properties include a composite material containing an electron transport material and a donor material (electron donor material).

[0468] The electron injection layer may be formed of, for example, lithium, cesium, ytterbium, lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF ２ ), 8-(quinolinolato)lithium (abbreviation: Liq), 2-(2-pyridyl)phenolatolithium (abbreviation: LiPP), 2-(2-pyridyl)-3-pyridinolatolithium (abbreviation: LiPPy), 4-phenyl-2-(2-pyridyl)phenolatolithium (abbreviation: LiPPP), lithium oxide (LiO ｘ ), alkali metals such as cesium carbonate, alkaline earth metals, or compounds thereof can be used. The electron injection layer may have a stacked structure of two or more layers. For example, the stacked structure may have a structure in which lithium fluoride is used in the first layer and ytterbium is provided in the second layer.

[0469] Alternatively, the electron injection layer may be formed using a material having electron transport properties. For example, a compound having an unshared electron pair and an electron-deficient heteroaromatic ring may be used as the material having electron transport properties. Specifically, a compound having at least one of a pyridine ring, a diazine ring (pyrimidine ring, pyrazine ring, pyridazine ring), and a triazine ring may be used.

[0470] The organic compound having an unshared electron pair preferably has a lowest unoccupied molecular orbital (LUMO) level of −3.6 eV to −2.3 eV. Generally, the highest occupied molecular orbital (HOMO) level and the LUMO level of an organic compound can be estimated by CV (cyclic voltammetry), photoelectron spectroscopy, optical absorption spectroscopy, inverse photoelectron spectroscopy, or the like.

[0471] For example, 4,7-diphenyl-1,10-phenanthroline (abbreviation: BPhen), 2,9-di(naphthalen-2-yl)-4,7-diphenyl-1,10-phenanthroline (abbreviation: NBPhen), 2,2′-(1,3-phenylene)bis(9-phenyl-1,10-phenanthroline) (abbreviation: mPPhen2P), diquinoxalino[2,3-a:2′,3′-c]phenazine (abbreviation: HATNA), 2,4,6-tris[3′-(pyridin-3-yl)biphenyl-3-yl]-1,3,5-triazine (abbreviation: TmPPPyTz), etc. can be used as the organic compound having an unshared electron pair. Note that NBPhen has a higher glass transition temperature (Tg) and is superior in heat resistance compared to BPhen.

[0472] The light-emitting layer is a layer containing a light-emitting substance. The light-emitting layer can contain one or more light-emitting substances. As the light-emitting substance, a substance that emits light of a color such as blue, purple, blue-purple, green, yellow-green, yellow, orange, or red is appropriately used. Furthermore, a substance that emits near-infrared light can also be used as the light-emitting substance.

[0473] Examples of the light-emitting material include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials.

[0474] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives.

[0475] Examples of phosphorescent materials include organometallic complexes (particularly iridium complexes) having a 4H-triazole skeleton, a 1H-triazole skeleton, an imidazole skeleton, a pyrimidine skeleton, a pyrazine skeleton, or a pyridine skeleton; organometallic complexes (particularly iridium complexes) having a phenylpyridine derivative having an electron-withdrawing group as a ligand; platinum complexes; and rare earth metal complexes.

[0476] The light-emitting layer may contain one or more organic compounds (host materials, assist materials, etc.) in addition to a light-emitting substance (guest material). As the one or more organic compounds, one or both of a hole-transporting material and an electron-transporting material can be used. Furthermore, as the one or more organic compounds, a bipolar substance or a TADF material can be used.

[0477] The light-emitting layer preferably includes, for example, a phosphorescent material and a hole-transporting material and an electron-transporting material that are a combination that easily forms an exciplex. This configuration allows for efficient emission using Exciplex-Triple Energy Transfer (ExTET), which is energy transfer from the exciplex to the light-emitting material (phosphorescent material). By selecting a combination that forms an exciplex that emits light that overlaps with the wavelength of the lowest-energy absorption band of the light-emitting material, energy transfer becomes smooth, allowing for efficient emission. This configuration simultaneously enables high efficiency, low-voltage operation, and long life of the light-emitting device.

[0478] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0479] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0480] Embodiment Mode 7 In this embodiment mode, a light-receiving device that can be used for a display device and a display device having a light-receiving and light-emitting function will be described.

[0481] The light receiving device may be, for example, a pn-type or pin-type photodiode. The light receiving device functions as a photoelectric conversion device (also called a photoelectric conversion element) that detects light incident on the light receiving device and generates electric charges. The amount of electric charges generated by the light receiving device is determined based on the amount of light incident on the light receiving device.

[0482] In particular, it is preferable to use an organic photodiode having a layer containing an organic compound as the light-receiving device. Organic photodiodes can be easily made thin, lightweight, and large in area, and have a high degree of freedom in shape and design, making them applicable to a variety of display devices.

[0483] 39A, the light-receiving device has a layer 765 between a pair of electrodes (a lower electrode 761 and an upper electrode 762). The layer 765 has at least one active layer and may further have other layers.

[0484] 39B shows a modification of the layer 765 included in the light-receiving device shown in Fig. 39A. Specifically, the light-receiving device shown in Fig. 39B includes a layer 766 on a lower electrode 761, an active layer 767 on the layer 766, a layer 768 on the active layer 767, and an upper electrode 762 on the layer 768.

[0485] The active layer 767 functions as a photoelectric conversion layer.

[0486] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, the layer 766 includes a hole transport layer and / or an electron blocking layer. The layer 768 includes an electron transport layer and / or a hole blocking layer. When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, the layers 766 and 768 have the reversed structures.

[0487] Here, in a display device according to one embodiment of the present invention, a layer shared by the light-receiving device and the light-emitting device (which may also be referred to as a continuous layer shared by the light-receiving device and the light-emitting device) may be present. Such a layer may have different functions in the light-emitting device and the light-receiving device. In this specification, components may be referred to based on their functions in the light-emitting device. For example, a hole injection layer functions as a hole injection layer in the light-emitting device and as a hole transport layer in the light-receiving device. Similarly, an electron injection layer functions as an electron injection layer in the light-emitting device and as an electron transport layer in the light-receiving device. Furthermore, a layer shared by the light-receiving device and the light-emitting device may have the same function in the light-emitting device and in the light-receiving device. For example, a hole transport layer functions as a hole transport layer in both the light-emitting device and the light-receiving device, and an electron transport layer functions as an electron transport layer in both the light-emitting device and the light-receiving device.

[0488] Next, materials that can be used for the light-receiving device will be described.

[0489] The light-receiving device may be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-receiving device may be formed by a method such as vapor deposition (including vacuum deposition), transfer, printing, inkjet printing, or coating.

[0490] The active layer of the light-receiving device includes a semiconductor. Examples of the semiconductor include inorganic semiconductors such as silicon and organic semiconductors containing organic compounds. In this embodiment, an example in which an organic semiconductor is used as the semiconductor of the active layer is shown. Using an organic semiconductor is preferable because the light-emitting layer and the active layer can be formed by the same method (e.g., vacuum deposition), allowing the use of a common manufacturing device.

[0491] The n-type semiconductor material of the active layer is fullerene (e.g., C ６０ , C ７０Examples of the fullerene derivatives include [6,6]-phenyl-C ７１ -butyric acid methyl ester (abbreviation: PC70), [6,6]-Phenyl-C ６１ -butyric acid methyl ester (abbreviation: PC60), 1', 1'', 4', 4''-Tetrahydro-di [1, 4] methanonaphthaleno [1, 2: 2', 3', 56, 60: 2'', 3''] [5, 6] fullerene-C ６０ (abbreviation: ICBA) and others.

[0492] Examples of materials for n-type semiconductors include perylene tetracarboxylic acid derivatives such as N,N′-dimethyl-3,4,9,10-perylene tetracarboxylic acid diimide (abbreviation: Me-PTCDI), and 2,2′-(5,5′-(thieno[3,2-b]thiophene-2,5-diyl)bis(thiophene-5,2-diyl))bis(methane-1-yl-1-ylidene)dimalononitrile (abbreviation: FT2TDMN).

[0493] Examples of n-type semiconductor materials include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene derivatives, coumarin derivatives, rhodamine derivatives, triazine derivatives, and quinone derivatives.

[0494] Examples of p-type semiconductor materials contained in the active layer include electron-donating organic semiconductor materials such as copper(II) phthalocyanine (CuPc), tetraphenyldibenzoperiflanthene (DBP), zinc phthalocyanine (ZnPc), tin phthalocyanine (SnPc), quinacridone, and rubrene.

[0495] Examples of p-type semiconductor materials include carbazole derivatives, thiophene derivatives, furan derivatives, compounds having an aromatic amine skeleton, etc. Examples of p-type semiconductor materials include naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, fluorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, indole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indolocarbazole derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, quinacridone derivatives, rubrene derivatives, tetracene derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyfluorene derivatives, polyvinylcarbazole derivatives, and polythiophene derivatives.

[0496] The HOMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the HOMO level of the electron-accepting organic semiconductor material, and the LUMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the LUMO level of the electron-accepting organic semiconductor material.

[0497] It is preferable to use a spherical fullerene as the electron-accepting organic semiconductor material and a planar organic semiconductor material as the electron-donating organic semiconductor material. Molecules with similar shapes tend to aggregate together, and when molecules of the same type aggregate, the energy levels of their molecular orbitals become close, which can improve carrier transport properties.

[0498] Furthermore, a polymer compound such as Poly[[4,8-bis[5-(2-ethylhexyl)-2-thienyl]benzo[1,2-b:4,5-b']dithiophene-2,6-diyl]-2,5-thiophenediyl[5,7-bis(2-ethylhexyl)-4,8-dioxo-4H,8H-benzo[1,2-c:4,5-c']dithiophene-1,3-diyl]] polymer (abbreviated as PBDB-T) or a PBDB-T derivative, which functions as a donor, can be used in the active layer. For example, a method of dispersing an acceptor material in PBDB-T or a PBDB-T derivative can be used.

[0499] For example, the active layer is preferably formed by co-evaporating an n-type semiconductor and a p-type semiconductor, or may be formed by laminating an n-type semiconductor and a p-type semiconductor.

[0500] The active layer may contain three or more materials. For example, in order to broaden the absorption wavelength range, a third material may be mixed in addition to an n-type semiconductor material and a p-type semiconductor material. In this case, the third material may be a low molecular weight compound or a high molecular weight compound.

[0501] The light-receiving device may further include a layer containing a substance with high hole-transporting properties, a substance with high electron-transporting properties, or a bipolar substance (a substance with high electron-transporting properties and high hole-transporting properties) as a layer other than the active layer. Furthermore, without being limited to the above, the light-receiving device may further include a layer containing a substance with high hole-injecting properties, a hole-blocking material, a substance with high electron-injecting properties, or an electron-blocking material. For the layer other than the active layer of the light-receiving device, for example, the materials that can be used in the above-mentioned light-emitting device can be used.

[0502] For example, a polymer compound such as poly(3,4-ethylenedioxythiophene) / polystyrene sulfonic acid (abbreviated as PEDOT / PSS) or an inorganic compound such as molybdenum oxide or copper iodide (CuI) can be used as a hole transporting material or an electron blocking material. Furthermore, an inorganic compound such as zinc oxide (ZnO) or an organic compound such as polyethyleneimine ethoxylate (PEIE) can be used as an electron transporting material or a hole blocking material. The light-receiving device may have, for example, a mixed film of PEIE and ZnO.

[0503] [Display Device Having Light Detection Function] In a display device according to one embodiment of the present invention, light-emitting devices are arranged in a matrix in a display portion, and an image can be displayed on the display portion. Furthermore, light-receiving devices are arranged in a matrix in the display portion, and the display portion has one or both of an imaging function and a sensing function in addition to an image display function. The display portion can be used as an image sensor or a touch sensor. That is, by detecting light in the display portion, an image can be captured or the proximity or contact of an object (such as a finger, a hand, or a pen) can be detected.

[0504] Furthermore, in the display device of one embodiment of the present invention, the light-emitting device can be used as a light source for a sensor. In the display device of one embodiment of the present invention, when light emitted from the light-emitting device included in the display portion is reflected (or scattered) by an object, the light-receiving device can detect the reflected light (or scattered light), thereby enabling imaging or touch detection even in a dark place.

[0505] Therefore, a light receiving unit and a light source are not required to be provided separately from the display device, and the number of components in the electronic device can be reduced. For example, a biometric authentication device or a capacitive touch panel for scrolling or the like is not required to be provided separately in the electronic device. Therefore, by using the display device of one embodiment of the present invention, an electronic device with reduced manufacturing costs can be provided.

[0506] Specifically, a display device according to one embodiment of the present invention has a light-emitting device and a light-receiving device in each pixel. In the display device according to one embodiment of the present invention, an organic EL device is used as the light-emitting device, and an organic photodiode is used as the light-receiving device. The organic EL device and the organic photodiode can be formed on the same substrate. Therefore, the organic photodiode can be built into a display device using an organic EL device.

[0507] In a display device having a light-emitting device and a light-receiving device in each pixel, the pixel has a light-receiving function, and therefore it is possible to detect contact or proximity of an object while displaying an image. For example, in addition to displaying an image using all of the sub-pixels of the display device, some of the sub-pixels can emit light as a light source, while other sub-pixels can detect light, and the remaining sub-pixels can display an image.

[0508] When the light receiving device is used as an image sensor, the display device can capture an image using the light receiving device. For example, the display device of the present embodiment can be used as a scanner.

[0509] For example, an image sensor can be used to capture images for personal authentication using fingerprints, palm prints, irises, pulse patterns (including vein patterns and arterial patterns), faces, or the like.

[0510] For example, an image sensor can be used to capture images of the area around the eye, the surface of the eye, or the inside of the eye (such as the fundus) of a user of a wearable device. Therefore, the wearable device can have a function to detect one or more of the user's blinking, movement of the pupil, and movement of the eyelid.

[0511] The light receiving device can also be used as a touch sensor (also called a direct touch sensor) or a near-touch sensor (also called a hover sensor, hover touch sensor, non-contact sensor, or touchless sensor).

[0512] Here, the touch sensor or near-touch sensor can detect the proximity or contact of an object (such as a finger, hand, or pen).

[0513] A touch sensor can detect an object when the display device and the object are in direct contact with each other. A near-touch sensor can detect an object even if the object does not touch the display device. For example, a configuration in which the display device can detect an object when the distance between the display device and the object is between 0.1 mm and 300 mm, preferably between 3 mm and 50 mm, is preferred. This configuration allows the display device to be operated without the object directly touching it, in other words, it allows the display device to be operated in a non-contact (touchless) manner. This configuration reduces the risk of the display device becoming dirty or scratched, or allows the object to operate the display device without directly touching dirt (e.g., dust, viruses, etc.) attached to the display device.

[0514] Furthermore, the display device of one embodiment of the present invention can have a variable refresh rate. For example, the refresh rate can be adjusted (for example, adjusted within a range of 1 Hz to 240 Hz) depending on the content displayed on the display device to reduce power consumption. Furthermore, the drive frequency of the touch sensor or the near-touch sensor may be changed depending on the refresh rate. For example, when the refresh rate of the display device is 120 Hz, the drive frequency of the touch sensor or the near-touch sensor can be configured to be higher than 120 Hz (typically 240 Hz). This configuration enables low power consumption and an increased response speed of the touch sensor or the near-touch sensor.

[0515] The display device 500 shown in FIGS. 39C to 39E includes, between a substrate 351 and a substrate 359, a layer 353 having a light-receiving device, a functional layer 355, and a layer 357 having a light-emitting device.

[0516] The functional layer 355 has a circuit for driving the light-receiving device and a circuit for driving the light-emitting device. The functional layer 355 may be provided with one or more of a switch, a transistor, a capacitor, a resistor, a wiring, a terminal, etc. Note that when the light-emitting device and the light-receiving device are driven by a passive matrix method, a configuration without a switch or a transistor may be used.

[0517] 39C , light emitted by a light-emitting device in layer 357 having a light-emitting device is reflected by finger 352 that touches display device 500, and the reflected light is detected by a light-receiving device in layer 353 having a light-receiving device. This makes it possible to detect that finger 352 has touched display device 500.

[0518] Also, as shown in Figures 39D and 39E, the display device may have a function of detecting or capturing an image of an object that is close to (i.e., not in contact with) the display device.

[0519] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0520] 10: Electronic device, 10A: Electronic device, 11: Display unit, 12: Battery unit, 12A: Battery unit, 12B: Battery unit, 12C: Battery unit, 12D: Battery unit, 12E: Battery unit, 12F: Battery unit, 12G: Battery unit, 12H: Battery unit, 13: Control circuit unit, 13A: Control circuit unit, 13B: Control circuit unit, 13C: Control circuit unit, 13D: Control circuit unit, 13E: Control circuit unit, 13F: Control circuit unit, 13G: Control circuit unit, 13H: Control circuit unit, 14: Flexible substrate unit, 14a: First region, 14b: Second region, 15: Sensor unit, 15a: Strain gauge, 16: IC chip, 16A: Battery control unit control IC, 16B: CPU, 16C: memory, 16D: DCDC converter, 16E: charging control IC, 16H: driving IC, 17: sensor unit, 17A: sensor unit, 17B: sensor unit, 17C: sensor unit, 17D: sensor unit, 17E: sensor unit, 17F: sensor unit, 17G: sensor unit, 17H: sensor unit, 18A: current sensor, 18B: voltage sensor, 18C: voltage sensor, 19A: switch, 19B: switch, 19C: switch, 19D: switch, 19E: switch, 20: integrated substrate, 20A: integrated substrate, 20B: integrated substrate, 20C: integrated substrate, 20D: integrated substrate, 21A: wireless charging power receiving unit, 21B: wired charging power receiving unit, 22A: DCDC converter, 22B: DCDC converter, 23: charging circuit, 110: battery, 110A: battery, 110B: battery, 111: exterior body, 111A: exterior body, 120: positive electrode, 121: positive electrode current collector, 122: positive electrode active material layer, 123: positive electrode lead, 130: negative electrode, 131: negative electrode current collector, 132: negative electrode active material layer, 133: negative electrode lead, 140: separator, 150A: exterior body, 151: sealing portion, 152: sealing portion, 170: flat surface, 171: flat surface, 175: sealing layer, 176a: Lead metal, 176b: lead metal, 181: film, 181a: film, 181b: film, 181c: film, 190: film, 191: traveling direction, 195: embossing roll, 195a: convex portion, 196: embossing roll, 196a: convex portion, 202: transistor, 202A: transistor, 202B: transistor, 203A: diode, 203B: diode, 204: connection portion, 204A: terminal, 204B: terminal, 205A: terminal, 205B: terminal, 206A: terminal, 206B: terminal, 209: transistor, 210: transistor,211: insulating layer, 212: insulating layer, 214: insulating layer, 215: insulating layer, 218: insulating layer, 221: conductive layer, 222a: conductive layer, 222b: conductive layer, 223: conductive layer, 225: insulating layer, 228: connection portion, 231: semiconductor layer, 231i: channel formation region, 231n: low resistance region, 242: connection layer, 351: substrate, 352: finger, 353: layer, 355: functional layer, 357: layer, 359: substrate, 400: display device, 411a: conductive layer, 411b: conductive layer, 411c: conductive layer, 412B: EL layer, 412G: EL layer, 413: common electrode, 414: common layer, 416: protective layer, 421: insulating layer, 422: resin layer, 424: layer, 430b: light-emitting element, 430c: light-emitting element, 442: adhesive layer, 451: substrate, 452: substrate, 453: substrate, 454: substrate, 455: adhesive layer, 462: display section, 464: circuit, 465: wiring, 466: conductive layer, 472: FPC, 473: I C, 500: display device, 501: substrate, 510: light-emitting element, 510a: light-emitting element, 510B: light-emitting element, 510b: light-emitting element, 510c: light-emitting element, 510G: light-emitting element, 510R: light-emitting element, 511: pixel electrode, 511B: pixel electrode, 511C: connection electrode, 511G: pixel electrode, 511R: pixel electrode, 512: organic layer, 512B: organic layer, 512G: organic layer, 512R: organic layer, 513: common electrode, 514: common layer, 52 1: protective layer, 524a: pixel, 524b: pixel, 525: insulating layer, 526: resin layer, 528: layer, 540: connecting portion, 550: pixel, 711: light-emitting layer, 712: light-emitting layer, 713: light-emitting layer, 720: layer, 730: layer, 761: lower electrode, 762: upper electrode, 765: layer, 766: layer, 767: active layer, 768: layer, 790: EL layer, 790a: EL layer, 790b: EL layer, 791: lower electrode, 792: upper electrode, 795: colored layer,

Claims

a first battery unit, a second battery unit, a sensor unit, and a flexible substrate unit; the first battery unit and the second battery unit are provided on the flexible substrate unit; the first battery portion is flexible; the sensor unit is provided between the flexible substrate unit and the first battery unit, the first battery unit and the second battery unit are electrically connected to each other; Battery module. 　 a first battery unit, a second battery unit, a sensor unit, and a flexible substrate unit; the flexible substrate portion has a first region, a second region, and a third region that is more flexible than the first region and the second region; In a cross-sectional view, the third region is located between the first region and the second region, the first battery portion is provided in the first region, the second battery portion is provided in the second region, the first battery portion is flexible, the sensor unit is provided between the first battery unit and the flexible substrate unit, the flexible substrate portion has a wiring layer extending to the first region, the second region, and the third region; the first battery unit and the second battery unit are connected via the wiring layer; Battery module. 　 a first battery unit, a second battery unit, a sensor unit, a first control circuit unit, a second control circuit unit, and a flexible substrate unit; the flexible substrate portion has a first region, a second region, and a third region that is more flexible than the first region and the second region; In a cross-sectional view, the third region is located between the first region and the second region, the first control circuit is provided on an upper surface of the first region, the second control circuit is provided on an upper surface of the second region, the sensor unit is provided on an upper surface of the first control circuit unit, the first battery unit is provided on an upper surface of the sensor unit, the second battery unit is provided on an upper surface of the second control circuit unit, the first battery portion is flexible, the flexible substrate portion has a wiring layer extending to the first region, the second region, and the third region; the first battery unit and the second battery unit are connected via the wiring layer; Battery module. 　 a first battery unit, a second battery unit, a sensor unit, a first switch, a second switch, a third switch, a first DC-DC converter, a second DC-DC converter, a charging circuit, a first terminal, and a second terminal; the first battery portion is flexible, the sensor unit is provided at a position where it contacts the first battery unit, the first terminal is connected to a negative terminal of the first battery unit and a negative terminal of the second battery unit; a positive terminal of the first battery module is connected to one terminal of the first switch and one terminal of the first DC-DC converter; a positive terminal of the second battery unit is connected to one terminal of the second switch and one terminal of the second DC-DC converter; the other terminal of the first switch and the other terminal of the second switch are connected to one terminal of the charging circuit; the other terminal of the charging circuit is connected to one terminal of the third switch; the other terminal of the first DC-DC converter, the other terminal of the second DC-DC converter, and the other terminal of the third switch are connected to a second terminal; Battery module. In any one of claims 1 to 4, The sensor unit includes a strain sensor. Battery module. 　 A battery module comprising the battery module according to claim 5. electronic equipment. 　 a first battery unit, a second battery unit, a sensor unit, a first control circuit unit, a second control circuit unit, a flexible substrate unit, and a display unit; the flexible substrate portion has a first region, a second region, and a third region that is more flexible than the first region and the second region; In a cross-sectional view, the third region is located between the first region and the second region, the first control circuit is provided on an upper surface of the first region, the second control circuit is provided on an upper surface of the second region, the sensor unit is provided on an upper surface of the first control circuit unit, the first battery unit is provided on an upper surface of the sensor unit, the second battery unit is provided on an upper surface of the second control circuit unit, the first battery portion is flexible, the flexible substrate portion has a wiring layer extending to the first region, the second region, and the third region; the first battery unit and the second battery unit are connected via the wiring layer; the display unit has an area overlapping with the first battery unit, the second battery unit, the first control circuit unit, the second control circuit unit, the first area, the second area, and the third area; electronic equipment. 　 An electronic device including a first battery unit and a second battery unit connected in parallel, a strain sensor, and a control circuit, When the value of the strain sensor changes, the control circuit stops discharging the first battery unit, When the value of the strain sensor stops changing, the control circuit controls the supply of current to the first battery unit in accordance with a voltage difference between the first battery unit and the second battery unit. Discharge method. 　 A method for discharging a first battery unit and a second battery unit included in an electronic device, comprising: the electronic device includes the first battery unit, the second battery unit, a strain sensor, and a control circuit; the strain sensor has a function of detecting deformation of the first battery portion, the first battery unit and the second battery unit are connected in parallel, the control circuit has a function of controlling the start and stop of discharge of the first battery unit and the second battery unit, When the first battery unit and the second battery unit are discharging, and deformation of the first battery unit is detected by a change in the value of the strain sensor, discharging of the first battery unit is stopped. Discharge method. 　 In claim 9, the control circuit has a function of detecting a voltage of the first battery module and a voltage of the second battery module, When a change in the value of the strain sensor is detected, discharging of the first battery unit is stopped; thereafter, when the value of the strain sensor no longer changes and the difference between the voltage of the first battery unit and the voltage of the second battery unit is less than 10 mV, discharging of the first battery unit is started. Discharge method. 　 In claim 10, the electronic device includes a first DC-DC converter connected to the first battery unit and a second DC-DC converter connected to the second battery unit; When the value of the strain sensor no longer changes, the difference between the voltage of the first battery unit and the voltage of the second battery unit is equal to or greater than 10 mV and less than 500 mV. the first battery unit is discharged via the first DC-DC converter; the second battery unit is discharged via the second DC-DC converter; Discharge method. 　 A method for charging a first battery unit and a second battery unit included in an electronic device, comprising: the electronic device includes the first battery unit, the second battery unit, a strain sensor, and a control circuit; the strain sensor has a function of detecting deformation of the first battery portion, the first battery unit and the second battery unit are connected in parallel, the control circuit has a function of controlling the start and stop of charging of the first battery unit and the second battery unit, When the first battery unit and the second battery unit are being charged, if the deformation of the first battery unit is detected by the strain sensor, charging of the first battery unit is stopped. Charging method. 　 In claim 12, the control circuit has a function of detecting a voltage of the first battery module and a voltage of the second battery module, When a change in the value of the strain sensor is detected, charging of the first battery unit is stopped; thereafter, when the value of the strain sensor no longer changes and the difference between the voltage of the first battery unit and the voltage of the second battery unit is less than 10 mV, charging of the first battery unit is started. Charging method. 　 In claim 13, the electronic device includes a first DC-DC converter connected to the first battery unit and a second DC-DC converter connected to the second battery unit; When the value of the strain sensor no longer changes, the difference between the voltage of the first battery unit and the voltage of the second battery unit is equal to or greater than 10 mV and less than 500 mV. the first battery unit is charged via the first DC-DC converter; the second battery unit is charged via the second DC-DC converter; Charging method.

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