Processing system, control method, and computer program

Abstract

This processing system is for processing an object with an energy beam. The processing system includes: a deflector capable of changing the traveling direction of an energy beam; a reflector having a reflection surface whereby the energy beam that has passed through the deflector is reflected toward an object; a support device to which the reflector is fixed; and a controller that controls the deflector on the basis of the posture of the support device, which is rotatable on an axis crossing the reflection surface.

Description

Machining system, control method and computer program

[0001] The present invention relates to the technical fields of machining systems, control methods and computer programs.

[0002] As an example of a processing apparatus capable of processing an object, Patent Document 1 describes a processing apparatus that forms a structure by irradiating a surface of an object with processing light. This type of processing apparatus is required to process the object appropriately.

[0003] U.S. Patent Publication No. 2005 / 0103763

[0004] According to a first aspect, there is provided a processing system for processing an object with an energy beam, comprising: a deflection device capable of changing the direction of travel of the energy beam; a reflection device having a reflective surface that reflects the energy beam that has passed through the deflection device toward the object; a support device to which the reflection device is attached; and a control device that controls the deflection device based on the attitude of the support device, which is rotatable around an axis that intersects the reflective surface.

[0005] According to a second aspect, there is provided a processing system for processing an object with an energy beam, comprising: a deflection device capable of changing the direction of travel of the energy beam; a reflection device having a reflective surface that reflects the energy beam that has passed through the deflection device toward the object; a support device to which the reflection device is attached; and a control device that controls the deflection device based on the displacement amount of the support device, which is rotatable around an axis intersecting the reflective surface, when the energy beam is incident on the reflective surface of the reflection device attached to the support device.

[0006] According to a third aspect, there is provided a processing system for processing an object with an energy beam, comprising: a deflection device capable of changing the direction of travel of the energy beam; a reflection device having a reflective surface that reflects the energy beam that has passed through the deflection device toward the object; a drive device that enables the reflection device to rotate around an axis that intersects with the reflective surface when the energy beam is incident on the reflective surface; and a control device that controls the deflection device based on the positions that the reflection device can assume when rotated around the axis.

[0007] According to a fourth aspect, there is provided a processing system for processing an object with an energy beam, comprising: a deflection device capable of changing the direction of travel of the energy beam; a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object; a drive device that enables the reflection device to rotate around an axis that intersects with the reflection surface when the energy beam is incident on the reflection surface; and a control device that controls the deflection device based on the amount of displacement of the reflection device.

[0008] According to a fifth aspect, there is provided a control method for controlling a processing system comprising a deflection device capable of changing the direction of travel of an energy beam for processing an object, a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object, and a support device to which the reflection device is attached, wherein the support device is rotatable around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface, and the control method controls the deflection device based on the attitude of the support device.

[0009] According to a sixth aspect, there is provided a control method for controlling a processing system comprising a deflection device capable of changing the direction of travel of an energy beam for processing an object, and a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object, wherein the reflection device is rotatable around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface, and the control method controls the deflection device based on the displacement amount of the reflection device.

[0010] According to a seventh aspect, there is provided a control method for controlling a processing system comprising a deflection device capable of changing the direction of travel of an energy beam for processing an object, and a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object, wherein the reflection device is rotatable around an axis intersecting the reflection surface while the energy beam is incident on the reflection surface, and the control method controls the deflection device based on the positions that the reflection device can assume when rotated around the axis.

[0011] According to an eighth aspect, there is provided a control method for controlling a processing system comprising a deflection device capable of changing the direction of travel of an energy beam for processing an object, and a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object, wherein the reflection device is rotatable around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface, and the control method controls the deflection device based on the displacement amount of the reflection device.

[0012] According to a ninth aspect, there is provided a computer program capable of controlling a processing system comprising a deflection device capable of changing the direction of travel of an energy beam for processing an object, a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object, and a support device to which the reflection device is attached, wherein the support device is rotatable around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface, and the computer program generates control information for the deflection device based on the attitude of the support device.

[0013] According to a tenth aspect, there is provided a computer program capable of controlling a processing system comprising a deflection device capable of changing the direction of travel of an energy beam for processing an object, and a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object, wherein the reflection device is rotatable around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface, and the computer program generates control information for the deflection device based on the positions that the reflection device can assume when rotated around the axis.

[0014] FIG. 1 is a system configuration diagram showing an example of the system configuration of a machining system according to an embodiment. FIG. 2 is a perspective view schematically showing the overall structure of the machining system according to an embodiment. FIG. 3 is a cross-sectional view showing the structure of a machining head according to an embodiment. FIG. 4 is a cross-sectional view showing an example of the optical path of machining light irradiated onto a workpiece via an fθ lens and a mirror. FIG. 5 is a perspective view showing an area irradiated with machining light incident from an objective optical system. FIG. 6 is a conceptual diagram showing the concept of stitching. FIG. 7 is a diagram for explaining problems that may arise during workpiece machining. FIG. 8 is a diagram showing an example of machining performed on a workpiece. FIG. 9 is a block diagram showing a part of the system configuration of the machining system according to an embodiment. FIG. 10 is a conceptual diagram showing the concept of machining in the machining system according to an embodiment. FIG. 11 is a diagram showing another example of machining performed on a workpiece. FIG. 12 is a diagram showing an example of a movement trajectory indicated by machining path information. FIG. 13 is a flowchart showing the operation of a controller according to an embodiment. FIG. 14 is a flowchart showing the operation of a control device according to an embodiment. FIG. 15 is a diagram showing an example of an arrangement in which a head housing is arranged inside a cylindrical workpiece. Fig. 16 is a cross-sectional view showing another example of the optical path of the processing light irradiated onto the workpiece via the fθ lens and the mirror. Fig. 17 is a conceptual diagram showing the concept of shift deviation of the rotation axis. Fig. 18 is a system configuration diagram showing another example of the system configuration of the processing system according to the embodiment. Fig. 19 is a conceptual diagram showing the concept of tilt deviation of the rotation axis.

[0015] Hereinafter, an embodiment of a processing system will be described with reference to the drawings. The processing system SYS that processes a workpiece W with processing light EL will be described. However, the present invention is not limited to the embodiment described below.

[0016] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For ease of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) will be referred to as the θX direction, θY direction, and θZ direction, respectively.

[0017] (1) Overall Configuration of Machining System SYS The structure of the machining system SYS of the embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a system configuration diagram showing the system configuration of the machining system SYS of the embodiment. Fig. 2 is a perspective view showing the structure of the machining system SYS of the embodiment. As shown in Fig. 1 and Fig. 2, the machining system SYS includes a machining device 1, a stage device 2, and a control device 3.

[0018] The processing device 1 is capable of processing a workpiece W under the control of the control device 3. The workpiece W is an object (workpiece) processed by the processing device 1. The workpiece W may be made of at least one of metal, alloy (e.g., duralumin, etc.), semiconductor (e.g., silicon), resin, composite material (e.g., CFRP: Carbon Fiber Reinforced Plastic, etc.), paint (e.g., a paint layer applied to a base material), and glass. Note that the workpiece W may be an object made of any material.

[0019] The processing device 1 irradiates the workpiece W with processing light EL to process the workpiece W. Specifically, the processing device 1 may perform a removal process, removing a portion of the workpiece W by irradiating the workpiece W with the processing light EL. The processing device 1 may perform the removal process, for example, to form a riblet structure on the workpiece W. The riblet structure is a fine texture structure known as a sharkskin structure, which can reduce the resistance of the surface of the workpiece W to a fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). For example, the riblet structure has a structure in which grooves extending along a first direction (the Y-axis direction in FIG. 2 ) on the surface of the workpiece W are arranged along a second direction (the X-axis direction in FIG. 2 ) intersecting the first direction, thereby reducing noise generated when the fluid and the surface of the workpiece W move relative to each other. Note that the term "fluid" here refers to a medium (e.g., at least one of a gas and a liquid) flowing relative to the surface of the workpiece W. For example, if the surface of the workpiece W moves relative to a medium while the medium itself is stationary, the medium may also be referred to as a fluid.

[0020] The machining system SYS is not limited to the riblet structure, and may perform removal processing on the surface of the workpiece W to form any structure having any shape. One example of the arbitrary structure is a structure that generates vortices in the flow of a fluid on the surface of the workpiece W. Another example of the arbitrary structure is a structure that imparts hydrophobicity to the surface of the workpiece W. Another example of the arbitrary structure is a regularly or irregularly formed micro / nanometer-order fine texture structure (typically an uneven structure).

[0021] The fine texture structure may be a sharkskin structure or a dimple structure that has the function of reducing resistance due to fluids (gas and / or liquid). The fine texture structure may include a lotus leaf surface structure that has at least one of a liquid-repellent function and a self-cleaning function (e.g., having the lotus effect). The fine texture structure may include at least one of a micro-projection structure that has a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), a concave-convex structure that has a lyophilic function, a convex-convex structure that has an anti-fouling function, a moth-eye structure that has at least one of a reflectance-reducing function and a liquid-repellent function, a convex-convex structure that exhibits a structural color by intensifying only light of a specific wavelength through interference, a pillar array structure that has an adhesive function utilizing van der Waals forces, a convex-convex structure that has an aerodynamic noise reduction function, a honeycomb structure that has a droplet collection function, a convex-convex structure that improves adhesion with a layer formed on the surface, a convex-convex structure for reducing frictional resistance, etc.

[0022] The machining system SYS may not only form a riblet structure or any other structure, but may also smooth the surface of the workpiece W by performing removal processing. Here, if the surface after processing is smoother than the surface before processing, the processing of the surface may be referred to as smoothing. The machining system SYS may also remove burrs present on the surface of the workpiece W.

[0023] Furthermore, in addition to or instead of the subtractive processing, the processing device 1 may perform additional processing, in which a new structure is added to the workpiece W by irradiating the workpiece W with processing light EL while supplying a shaping material to the workpiece W. In this case, the processing device 1 may perform additional processing to form the above-mentioned riblet structure on the surface of the workpiece W. In addition to or instead of at least one of the subtractive processing and the additional processing, the processing device 1 may perform marking processing, in which a desired mark is formed on the surface of the workpiece W by irradiating the workpiece W with processing light EL.

[0024] The processing device 1 can further measure the state of the workpiece W under the control of the control device 3. The processing device 1 irradiates the workpiece W with measurement light ML in order to measure the workpiece W. The state of the workpiece W may include the position of the workpiece W, i.e., the position of the surface of the workpiece W. The position of the surface of the workpiece W may include the position of each surface portion obtained by dividing the surface of the workpiece W in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction, and further the position of each surface portion obtained by dividing the surface of the workpiece W in at least one of the θX direction, the θY direction, and the θZ direction.

[0025] The position of each surface portion in at least one of the θX direction, the θY direction, and the θZ direction may be considered to be equivalent to the orientation of each surface portion (substantially equivalent to the orientation of each surface portion (the orientation of the normal to each surface portion) and the amount of inclination of each surface portion with respect to at least one of the X-axis, the Y-axis, and the Z-axis). In this case, it can be said that the state of the workpiece W substantially includes the shape (three-dimensional shape) of the workpiece W. The state of the workpiece W may also include the size of the workpiece W (the size in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction). The processing apparatus 1 may also be capable of measuring the characteristics of the workpiece W using the measurement light ML. The characteristics of the workpiece W may include at least one of the surface roughness and reflectance of the surface of the workpiece W. In this way, since the processing apparatus 1 is capable of measuring the workpiece W using the measurement light ML, the processing apparatus 1 may also be called a measurement apparatus.

[0026] As shown in Figure 1, in order to process and measure the workpiece W, the processing device 1 is equipped with a processing light source 11 that generates processing light EL, a measurement light source 12 that generates measurement light ML, a processing head 13 that irradiates the workpiece W with the processing light EL from the processing light source 11 and the measurement light ML from the measurement light source 12, and a head drive system 14 that moves the processing head 13.

[0027] (Stage Device 2) The stage device 2 includes a base 21, a stage 22, and a stage drive system 23 (FIGS. 1 and 2).

[0028] The surface plate 21 is placed on a support surface such as a floor. A stage 22 is placed on the surface plate 21. A vibration isolation device (not shown) may be installed between the support surface such as the floor and the surface plate 21 to suppress transmission of vibrations of the surface plate 21 to the stage 22. Furthermore, a support frame 5 may be placed on the surface plate 21 to support the processing device 1 (particularly, the processing head 13 and the head drive system 14).

[0029] The workpiece W is placed on the stage 22. As shown in FIG. 2 , the workpiece W may be placed on a support surface 221 of the stage 22 that is capable of supporting the workpiece W. The stage 22 supports the workpiece W placed on the stage 22 via the support surface 221. For this reason, the stage 22 may be referred to as an object support device. The support surface 221 is, for example, a surface that faces the machining head 13. The support surface 221 is, for example, a surface that extends along the XY plane.

[0030] The stage 22 does not have to fix the workpiece W placed on the support surface 221. In other words, the stage 22 does not have to apply a holding force to the workpiece W placed on the support surface 221 to hold and fix the workpiece W. Alternatively, the stage 22 may fix the workpiece W placed on the support surface 221. In other words, the stage 22 may apply a holding force to the workpiece W placed on the support surface 221 to hold and fix the workpiece W. For example, the stage 22 may hold and fix the workpiece W by vacuum suction and / or electrostatic suction.

[0031] The stage drive system 23 moves the stage 22 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. Note that moving the stage 22 along at least one of the θX direction, the θY direction, and the θZ direction may be considered equivalent to changing the posture of the stage 22 (and further the workpiece W placed on the stage 22) about at least one of the X-axis, the Y-axis, and the Z-axis. Alternatively, moving the stage 22 along at least one of the θX direction, the θY direction, and the θZ direction may be considered equivalent to rotating (or rotationally moving) the stage 22 about at least one of the X-axis, the Y-axis, and the Z-axis.

[0032] 2 shows an example of a configuration in which the stage drive system 23 moves the stage 22 along the Y-axis direction. In this case, the stage drive system 23 includes, for example, at least one Y slider member 231 that is placed on the base 21 via a vibration isolation device and extends along the Y-axis direction. The stage 22 is connected to the Y slider member 231 so as to be movable along the Y slider member 231. As a result, the stage 22 is movable along the Y-axis direction. Note that the stage 22 may also be configured to be supported on the base 21 via an air bearing.

[0033] Note that, when the stage 22 moves, the positional relationship between the stage 22 (and further, the workpiece W placed on the stage 22) and the machining head 13 changes. In other words, when the stage 22 moves, the relative positions of the machining head 13, the stage 22, and the workpiece W change. Therefore, moving the stage 22 is equivalent to changing the positional relationship between the stage 22, the workpiece W, and the machining head 13. Furthermore, when the positional relationship between the stage 22, the workpiece W, and the machining head 13 changes, the positional relationship between the stage 22, the workpiece W, and the optical systems provided in the machining head 13 changes. Therefore, moving the stage 22 is equivalent to changing the positional relationship between the stage 22, the workpiece W, and the optical systems provided in the machining head 13. Furthermore, when the positional relationship between the stage 22, the workpiece W, and the machining head 13 changes, the irradiation positions of the machining light EL and the measurement light ML on the workpiece W change. Therefore, moving the stage 22 is equivalent to changing the irradiation positions on the workpiece W of the processing light EL and the measurement light ML.

[0034] (Support frame 5) The support frame 5 includes, for example, a pair of leg members 51 arranged on the base plate 21 via an anti-vibration device and extending along the Z-axis direction, and a beam member 52 arranged on the pair of leg members 51 so as to extend along the X-axis direction and connect the upper ends of the pair of leg members 51.

[0035] (Head drive system 14) The head drive system 14 moves the machining head 13 along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. For this reason, the head drive system 14 may be referred to as a moving device. Note that moving the machining head 13 along at least one of the θX direction, θY direction, and θZ direction can be considered equivalent to changing the orientation of the machining head 13 around at least one of the X-axis, Y-axis, and Z-axis.

[0036] 2 shows a configuration in which the head drive system 14 is capable of moving the machining head 13 along each of the X-axis direction, the Z-axis direction, and the θY direction. In this case, the head drive system 14 includes, for example, an X rail member 141 extending along the X-axis direction, an X moving member 142 equipped with a Z rail portion 143 that moves along the X rail member 141, and a Z moving member 144 that moves along the Z rail portion 143 and to which the machining head 13 is fixed.

[0037] The X rail member 141 is disposed on the support frame 5, more specifically, on the beam member 52, which is disposed on the surface plate 21 (support device 2) via a vibration isolation device, and extends along the X-axis. The X moving member 142 engages with the X rail member 141 to be movable in the X direction. That is, the X moving member 142 allows movement in the X direction in which the X rail member 141 extends, while restricting movement in the Y direction perpendicular to the X direction. The Z moving member 144 engages with a Z rail portion 143 provided on the X moving member 142 to be movable in the Z direction. That is, the Z moving member 144 allows movement in the Z direction in which the Z rail member 143 extends, while restricting movement in the X direction perpendicular to the Z direction. The machining head 13 (first head housing 136) is connected to the Z moving member 144 via a Y rotating shaft (not shown) so as to be rotatable about the Y axis.

[0038] Therefore, the head drive system 14 can move the machining head 13 (first head housing 136) along each of the X-axis direction, the Z-axis direction, and the θY direction by moving the X moving member 142 in the X direction along the X rail member 141, moving the Z moving member 144 in the Z direction along the Z rail portion 143, and rotating the first head housing 136 about the Y axis relative to the Z moving member 144. In other words, under the control of the control device 3, the head drive system 14 can move (move) the machining head 13 relative to at least one of the surface plate 21 and the stage 22 (and further, the workpiece W placed on the stage 22) provided in the stage device 2.

[0039] Note that, when the machining head 13 moves, the positional relationship between the stage 22 (and further the workpiece W placed on the stage 22) and the machining head 13 changes. In other words, when the machining head 13 moves, the relative positions of the stage 22, the workpiece W, and the machining head 13 change. Therefore, moving the machining head 13 is equivalent to changing the positional relationship between the stage 22, the workpiece W, and the machining head 13. Furthermore, when the positional relationship between the stage 22, the workpiece W, and the machining head 13 changes, the positional relationship between the stage 22, the workpiece W, and each of the optical systems included in the machining head 13 (i.e., at least one of the machining optical system 131, the measurement optical system 132, the synthesis optical system 133, the state control optical system 134, and the objective optical system 135) changes. Therefore, moving the machining head 13 is equivalent to changing the positional relationship between the stage 22, the workpiece W, and each of the optical systems included in the machining head 13. Moving the machining head 13 is equivalent to moving each of the optical systems included in the machining head 13. Furthermore, when the positional relationship between the stage 22 and the workpiece W and the machining head 13 changes, the irradiation positions of the machining light EL and the measurement light ML on the workpiece W change. Therefore, moving the machining head 13 is equivalent to changing the irradiation positions of the machining light EL and the measurement light ML on the workpiece W.

[0040] (Control device 3) The control device 3 controls the operation of the machining system SYS. For example, the control device 3 sets machining conditions for the workpiece W and controls the machining device 1 and the stage device 2 so that the workpiece W is machined in accordance with the set machining conditions.

[0041] The control device 3 may include, for example, an arithmetic unit 31 and a storage device 32. The arithmetic unit 31 includes at least one processor (i.e., one processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. The processor conforming to the von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. The processor conforming to the non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Circuit).

[0042] The storage device 32 includes at least one memory capable of storing desired data. Because the memory is capable of storing desired data, the memory may also be referred to as a storage medium / recording medium. The memory may include, for example, at least one of a hard disk drive and a semiconductor memory. The storage device 32 may be built into the control device 3 or may be external to the control device 3.

[0043] The arithmetic device 31 executes a computer program 321 including at least one of computer program code and computer program instructions, causing the control device 3 to function as a device that controls the operations of the processing device 1 and the stage device 2. Therefore, the computer program 321 is a computer program for causing the control device 3 (arithmetic device 31) to perform (i.e., execute) the operations that the control device 3 should perform. In other words, the computer program 321 is a computer program for causing the control device 3 to function so as to cause the processing device 1 and the stage device 2 to perform predetermined operations.

[0044] To execute the computer program 321, the arithmetic device 31 reads the computer program 321. For example, the arithmetic device 31 may read the computer program 321 stored in the storage device 32. Alternatively, the arithmetic device 31 may read the computer program 321 stored in a computer-readable, non-transitory storage medium using a storage medium reading device (not shown) provided in the control device 3. The computer program 321 read from the storage medium may be stored in the storage device 32. Alternatively, the arithmetic device 31 may download the computer program 321 from a device external to the control device 3 via a network interface (not shown) provided in the control device 3. The downloaded computer program 321 may be stored in the storage device 32.

[0045] As described above, the arithmetic device 31 executes the computer program 321, causing the control device 3 to function as a device that controls the operations of the processing device 1 and the stage device 2. At this time, the arithmetic device 31 executes the computer program 321, causing logical functional blocks to be realized within the arithmetic device 31 for executing the operations to be performed by the control device 3. In other words, the arithmetic device 31, together with the storage device 32 in which the computer program 321 is stored (in other words, together with the storage device 32 and the computer program 321 stored in the storage device 32), may function as a controller or computer for realizing the logical functional blocks for executing the operations to be performed by the control device 3. Therefore, at least one processor included in the arithmetic device 31, at least one memory included in the storage device 32, and the computer program 321 may be configured to cause the control device 3 to perform the operations to be performed by the control device 3.

[0046] The control device 3 does not have to be provided inside the machining system SYS. In other words, the control device 3 does not have to constitute a part of the machining system SYS. For example, the control device 3 may be provided as a server or the like outside the machining system SYS. In other words, the control device 3 may be configured as a device / system different from the machining system SYS. In this case, the control device 3 and the machining system SYS may be connected by a wired and / or wireless network (or a data bus and / or a communication line).

[0047] The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an Ethernet (registered trademark) interface, such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T.

[0048] A network using radio waves may be used as the wireless network. An example of a network using radio waves is a network conforming to IEEE 802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network.

[0049] In this case, the control device 3 and the machining system SYS may be configured to be able to send and receive various information via a network. Furthermore, the control device 3 may be able to send information such as commands and control parameters to the machining system SYS via the network. The machining system SYS may include a receiving device that receives information such as commands and control parameters from the control device 3 via the network. Alternatively, a first control device that performs part of the processing performed by the control device 3 may be provided inside the machining system SYS, while a second control device that performs another part of the processing performed by the control device 3 may be provided outside the machining system SYS.

[0050] The recording medium for recording the computer program 321 executed by the arithmetic device 31 may be at least one of optical disks such as CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW and Blu-ray (registered trademark), magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program.

[0051] The recording medium may include a device capable of recording the computer program 321 (for example, a general-purpose device or a dedicated device in which the computer program 321 is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program 321 may be realized by a logical processing block realized in the control device 3 when the control device 3 (i.e., a computer) executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 3, or may be realized in a form in which the logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0052] (2) Structure of the Machining Head 13 The structure of the machining head 13 will be described with reference to Fig. 3. Fig. 3 is a cross-sectional view showing the structure of the machining head 13. The machining head 13 includes a machining optical system 131, a measurement optical system 132, a synthesis optical system 133, a state control optical system 134, and an objective optical system 135. The structure of the machining head 13 will be described in detail later with reference to Fig. 3.

[0053] The processing optical system 131, the measurement optical system 132, the synthesis optical system 133, and the state control optical system 134 provided in the processing head 13 are housed in a first head housing 136. The objective optical system 135 provided in the processing head 13 is housed in a second head housing 137. However, at least a portion of the processing optical system 131, the measurement optical system 132, the synthesis optical system 133, and the state control optical system 134 does not have to be housed in the first head housing 136.

[0054] The second head housing 137 is connected to the first head housing 136. The second head housing 137 is connected vertically below (on the -Z side of) the first head housing 136. The second head housing 137 is disposed at a position closer to the stage 22 (and further closer to the workpiece W placed on the stage 22) than the first head housing 136.

[0055] 2, a cylindrical space WSP extending along the Z-axis direction is formed in the workpiece W and surrounded by a cylindrical inner wall surface (side surface) Wsw extending along the Z-axis direction. The space WSP may be the space inside a through-hole that penetrates the workpiece W. Alternatively, the space WSP may be the space inside a depression, i.e., a recess, that is formed in the workpiece W and does not penetrate the workpiece W.

[0056] At least a portion of the second head housing 137 can be inserted into the space WSP by driving the head drive system 14. Consequently, with the second head housing 137 of the machining head 13 inserted into the space WSP, the machining head 13 can measure and machine the workpiece W. On the other hand, the first head housing 136, which is connected vertically above the second head housing 137 (i.e., on the +Z side), is not inserted into the space WSP of the workpiece W.

[0057] The processing light EL generated by the processing light source 11 is incident on the processing head 13, more specifically, the processing optical system 131, via an optical transmission member such as an optical fiber. The processing light source 11 is capable of generating the processing light EL. The processing light EL does not have to be the laser light of this embodiment, and any type of light may be used as long as it can process the workpiece W when irradiated with the processing light EL. Therefore, the processing light EL may include pulsed light (e.g., pulsed light with an emission time of picoseconds or less) or continuous light without pulsed light. Furthermore, the wavelength of the processing light EL may be any wavelength as long as it can process the workpiece W when irradiated with the workpiece W. In other words, the processing light EL may be visible light or invisible light (e.g., at least one of infrared light, ultraviolet light, and extreme ultraviolet light). When the processing light EL is laser light, the processing light source 11 may include, for example, a laser diode. Furthermore, the processing light source 11 may be a light source capable of pulse oscillation. In this case, the processing light source 11 can generate pulsed light (for example, pulsed light having an emission time of picoseconds or less) as the processing light EL. Note that the processing light source 11 may also be a CW (continuous wave) light source that generates CW.

[0058] The processing optical system 131 is an optical system into which the processing light EL from the processing light source 11 is incident. The processing optical system 131 is an optical system that causes the processing light EL incident on the processing optical system 131 to further enter the combining optical system 133. The processing light EL that has passed through the processing optical system 131 is irradiated onto the workpiece W via the combining optical system 133, the state control optical system 134, and the objective optical system 135.

[0059] The processing optical system 131 may include, for example, a position adjustment optical system 1311, an angle adjustment optical system 1312, and a focusing position adjustment optical system 1313. The position adjustment optical system 1311 can adjust the emission position of the processing light EL from the processing optical system 131. The position adjustment optical system 1311 may include, for example, a parallel plane plate that can be tilted with respect to the traveling direction of the processing light EL, and the emission position of the processing light EL may be changed by changing the tilt angle of the parallel plane plate. The angle adjustment optical system 1312 can adjust the emission angle (emission direction) of the processing light EL from the processing optical system 131. The angle adjustment optical system 1312 may include, for example, a mirror that can be tilted with respect to the traveling direction of the processing light EL, and the emission angle of the processing light EL may be changed by changing the tilt angle of the mirror. The focusing position adjustment optical system 1313 is an optical element that can adjust the focusing position of the processing light EL in the traveling direction of the processing light EL. The focusing position adjustment optical system 1313 may include, for example, multiple lenses aligned along the traveling direction of the processing light EL. In this case, the focusing position of the processing light EL is adjusted by moving at least one of the multiple lenses along its optical axis direction. Alternatively, the focusing position adjustment optical system 1313 may include, for example, an optical element (typically, a galvanometer mirror) that can move the focusing position of the processing light EL along a desired direction by deflecting the processing light EL (changing the traveling direction of the processing light EL). However, the processing optical system 131 does not necessarily have to include at least one of the position adjustment optical system 1311, the angle adjustment optical system 1312, and the focusing position adjustment optical system 1313.

[0060] The combining optical system 133 includes a beam splitter (e.g., a polarizing beam splitter) 1331. The beam splitter 1331 causes the processing light EL, which has passed through the processing optical system 131 and entered the beam splitter 1331, to further enter the state control optical system 134. In the example shown in FIG. 3 , the processing light EL, which has entered the beam splitter 1331, is configured to pass through (become transmitted through) the polarization separation surface of the beam splitter 1331 and then further enter the state control optical system 134. Specifically, the processing light EL is configured to use a polarization direction that can pass through the polarization separation surface of the beam splitter 1331 (e.g., a polarization direction that becomes p-polarized light with respect to the polarization separation surface), and to pass through (become transmitted through) the polarization separation surface of the beam splitter 1331 and then further enter the state control optical system 134.

[0061] The state control optical system 134 includes a shape-changing optical system 1341 and a galvanometer mirror 1342. The processing light EL is incident on the shape-changing optical system 1341 after passing through the beam splitter 1331. The shape-changing optical system 1341 is an optical system that can change the shape of the processing light EL (i.e., the cross-sectional shape of the processing light EL) in a plane intersecting (orthogonal to) the traveling direction of the processing light EL under the control of the control device 3. The shape-changing optical system 1341 may also be referred to as a beam shape changing device.

[0062] The processing light EL that passes through the shape-changing optical system 1341 is incident on the galvanometer mirror 1342. The galvanometer mirror 1342 deflects the processing light EL. In other words, the galvanometer mirror 1342 changes the traveling direction of the processing light EL, i.e., deflects the processing light EL. For this reason, the galvanometer mirror 1342 may also be referred to as a beam deflection device. By deflecting the processing light EL, the galvanometer mirror 1342 changes the direction in which the processing light EL is emitted from the galvanometer mirror 1342. When the direction in which the processing light EL is emitted from the galvanometer mirror 1342 is changed, the traveling direction of the processing light EL from the galvanometer mirror 1342 toward the objective optical system 135 is changed. For this reason, the galvanometer mirror 1342 may be considered to change the traveling direction of the processing light EL toward the objective optical system 135 by deflecting the processing light EL. The emission angle, emission direction, and traveling direction of the processing light EL from the galvanometer mirror 1342 are each a specific example of the state of the processing light EL. For this reason, the galvanometer mirror 1342 may be referred to as a beam state changing device that can change the state of the processing light EL heading toward the objective optical system 135.

[0063] The galvanometer mirror 1342 includes an X-scanning mirror 1342X and a Y-scanning mirror 1342Y. Each of the X-scanning mirror 1342X and the Y-scanning mirror 1342Y is a tilt-angle variable mirror that changes its angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1342. For example, the X-scanning mirror 1342X may be rotatable or oscillating about the Y-axis. For example, the Y-scanning mirror 1342Y may be rotatable or oscillating about the X-axis.

[0064] In addition to or instead of the galvanometer mirror 1342, the processing optical system 131 may include any deflection optical element capable of deflecting the processing light EL (i.e., capable of changing at least one of the emission angle, emission direction, and traveling direction of the processing head 13). An example of such a deflection optical element is a polygon mirror having multiple reflective surfaces with different angles. The polygon mirror is rotatable so as to change the incident angle of the processing light EL with respect to one reflective surface while the processing light EL is irradiated onto that reflective surface and to switch the reflective surface onto which the processing light EL is irradiated among multiple reflective surfaces. Other examples of such a deflection optical element include at least one of an acousto-optical element, a MEMS mirror, and a two-dimensional mirror that can rotate (swing) in two axial directions.

[0065] The processing light EL that passes through the galvanometer mirror 1342 is incident on the objective optical system 135. The objective optical system 135 irradiates the processing light EL incident from the galvanometer mirror 1342 onto the workpiece W. For this reason, the objective optical system 135 may be referred to as a beam irradiation device. Specifically, the objective optical system 135 includes an fθ lens 1351 and a mirror 1352. The positional relationship between the fθ lens 1351 and the mirror 1352 may be fixed. Furthermore, although the fθ lens 1351 and the mirror 1352 are configured to be housed in the second head housing 137, this is not limiting, and at least a portion of the objective optical system 135 may not be housed in the second head housing 137. For example, the fθ lens 1351 included in the objective optical system 135 may not be housed in the second head housing 137. In this case, the second head housing 137 may house only the mirror 1352 included in the objective optical system 135. The processing light EL that has passed through the galvanometer mirror 1342 is incident on an fθ lens 1351. The objective optical system 135 (second head housing 137) may be detachable from the first head housing 136. In this case, the objective optical system 135 (second head housing 137) may be replaceable with an objective optical system having a different configuration.

[0066] The fθ lens 1351 is an optical system for irradiating the workpiece W with the processing light EL from the galvanometer mirror 1342. In particular, the fθ lens 1351 is an optical system for focusing the processing light EL within the irradiation range on the workpiece W, and can convert the processing light EL from the galvanometer mirror 1342 at different angles of incidence into light parallel to the optical axis AX. However, in this embodiment, the fθ lens 1351 focuses the processing light EL on the workpiece W via the mirror 1352. Here, with reference to FIG. 4 in addition to FIG. 3, the processing light EL irradiated onto the workpiece W via the fθ lens 1351 and the mirror 1352 will be described. FIG. 4 is a cross-sectional view showing the optical path of the processing light EL irradiated onto the workpiece W via the fθ lens 1351 and the mirror 1352.

[0067] 3 and 4, the mirror 1352 has a reflecting surface 13521 that is inclined with respect to the optical axis AX of the fθ lens 1351. In this embodiment, the optical axis AX is an axis along the Z axis, but it may be an axis that is inclined with respect to the Z axis.

[0068] The fθ lens 1351 emits the processing light EL toward the reflecting surface 13521. As a result, the mirror 1352 uses the reflecting surface 13521 to reflect the processing light EL incident from the fθ lens 1351 toward the workpiece W. The mirror 1352 reflects the processing light EL incident from the fθ lens 1351 at the reflecting surface 13521, causing the processing light EL to be incident on the workpiece W. The mirror 1352 changes the traveling direction of the processing light EL incident from the fθ lens 1351, causing the processing light EL to be incident on the workpiece W. The mirror 1352 emits the processing light EL toward the workpiece W via the reflecting surface 13521. For this reason, the mirror 1352 may be referred to as an emission optical system.

[0069] The cross-sectional shape of the processing light EL incident on the reflecting surface 13521 may be different from the cross-sectional shape of the processing light EL reflected by the reflecting surface 13521. In other words, the mirror 1352 may change the cross-sectional shape of the processing light EL by reflecting the processing light EL by the reflecting surface 13521.

[0070] Because the reflecting surface 13521 is inclined with respect to the optical axis AX of the fθ lens 1351, the mirror 1352 emits (i.e., reflects) the processing light EL in a direction intersecting the optical axis AX. As a result, as shown in FIGS. 3 and 4 , the mirror 1352 can irradiate the processing light EL onto the surface of the workpiece W that intersects with a plane (XY plane) perpendicular to the optical axis AX. For example, the second head housing 137 containing the mirror 1352 can be inserted into the space WSP of the workpiece W, and the processing light EL can be irradiated via the mirror 1352 onto the inner wall surface Wsw of the workpiece W that defines the space WSP. For this reason, the second head housing 137 may be referred to as a probe.

[0071] In particular, in this embodiment, the processing light EL that has passed through the galvanometer mirror 1342, i.e., the processing light EL deflected by the galvanometer mirror 1342, is incident on the fθ lens 1351. When the traveling direction of the processing light EL from the galvanometer mirror 1342 to the fθ lens 1351 changes, the incident position of the processing light EL on the fθ lens 1351 and, consequently, the exit position of the processing light EL from the fθ lens 1351 changes. Therefore, the galvanometer mirror 1342 may be considered to change the exit position of the processing light EL from the fθ lens 1351 by deflecting the processing light EL. When the exit position of the processing light EL from the fθ lens 1351 changes, the incident position of the processing light EL on the reflecting surface 13521 of the mirror 1352 changes. Therefore, the galvanometer mirror 1342 may be considered to change the incident position of the processing light EL on the reflecting surface 13521 by deflecting the processing light EL.

[0072] 4 , when the processing light EL traveling from the galvanometer mirror 1342 toward the objective optical system 135 travels in a first direction d1, the fθ lens 1351 emits the processing light EL from a first emission position op1. The processing light EL emitted from the first emission position op1 of the fθ lens 1351 is incident on a first incident position ip1 on the reflecting surface 13521 of the mirror 1352. On the other hand, when the processing light EL traveling from the galvanometer mirror 1342 toward the objective optical system 135 travels in a second direction d2 different from the first direction d1, the fθ lens 1351 emits the processing light EL from a second emission position op2 different from the first emission position op1. The processing light EL emitted from the second emission position op2 of the fθ lens 1351 is incident on a second incidence position ip2 on the reflecting surface 13521 of the mirror 1352, which is different from the first incidence position ip1.

[0073] As described above, the traveling direction (i.e., the emission direction) of the processing light EL from the galvanometer mirror 1342 is one specific example of the state of the processing light EL. In this case, the objective optical system 135 (particularly the mirror 1352) may be considered to emit the processing light EL in a first direction when the state of the processing light EL is a first state, and to emit the processing light EL in a second direction different from the first direction when the state of the processing light EL is a second state different from the first state.

[0074] In this way, when the galvanometer mirror 1342 deflects the processing light EL and the emission angle of the processing light EL from the galvanometer mirror 1342 changes, the incident position of the processing light EL on the reflecting surface 13521 changes in the direction along the optical axis AX. As a result, the position from which the processing light EL is emitted from the objective optical system 135 changes along the direction in which the optical axis AX extends (in the example shown in FIG. 4 , it moves up and down along the Z-axis direction).

[0075] As described above, the objective optical system 135 is housed in the second head housing 137. Therefore, as shown in FIGS. 3 and 4 , the second head housing 137 may have an opening 1371 formed therein through which the processing light EL emitted from the objective optical system 135 can pass. The processing head 13 may include a housing drive system 138 that rotates the second head housing 137 around the Z axis using the driving force of a drive source. In other words, the rotation axis of the second head housing 137 coincides with the optical axis AX of the objective optical system 135 (fθ lens 1351) housed in the second head housing 137. As shown in FIG. 3 , one end of the second head housing 137 is connected to the housing drive system 138, and a mirror 1352 is disposed at the other end of the second head housing 137. The housing drive system 138 may include, for example, an air spindle. Furthermore, since the housing drive system 138 rotates the second head housing 137, it may also be referred to as a drive device.

[0076] As shown in Fig. 4, the incident position of the processing light EL from the galvanometer mirror 1342 onto the plane of the f-theta lens 1351 extending along the XY plane changes. Here, the XY plane is a plane that intersects (is perpendicular to) the optical axis AX of the f-theta lens 1351. Therefore, it can be said that the galvanometer mirror 1342 moves the position of the processing light EL incident onto the plane of the f-theta lens 1351 that intersects with the optical axis AX of the f-theta lens 1351. As a result, as shown in Fig. 4, the processing light EL emitted from the f-theta lens 1351 travels on or along the optical axis AX.

[0077] Here, the area of ​​the workpiece W irradiated with the processing light EL emitted from the objective processing system 135 will be described with reference to Fig. 5. Fig. 5 is a perspective view showing the area irradiated with the processing light EL emitted from the objective optical system 135.

[0078] The processing light EL emitted from the objective processing system 135 may be irradiated onto at least a portion of the inner wall surface Wsw of the workpiece W. For example, when the positional relationship between the second head housing 137 and the workpiece W is the first relationship, the processing light EL emitted from the objective processing system 135 is irradiated onto an area Ar1 of the inner wall surface Wsw of the workpiece W. Furthermore, when the positional relationship between the second head housing 137 and the workpiece W is changed from the first relationship to the second relationship by rotating the second head housing 137 around the optical axis AX by the housing drive system 138, the processing light EL emitted from the objective processing system 135 is irradiated onto an area Ar2 of the inner wall surface Wsw of the workpiece W. Furthermore, when the second head housing 137 rotates around the optical axis AX by the housing drive system 138, and the positional relationship between the second head housing 137 and the workpiece W is changed from the second relationship to the third relationship, the processing light EL emitted from the objective processing system 135 is irradiated onto area Ar3 of the inner wall surface Wsw of the workpiece W.

[0079] In other words, by rotating the second head housing 137 by the housing drive system 138, the mirror 1352 housed in the second head housing 137 rotates around the optical axis AX (or around an axis parallel to the optical axis AX). As a result, the emission direction of the processing light EL from the reflecting surface 13521 of the mirror 1352 is changed around the optical axis AX. Therefore, the housing drive system 138 rotates the second head housing 137 around the optical axis AX, changing the positional relationship between the second head housing 137 and the workpiece W, and the processing light EL is sequentially irradiated onto circumferentially adjacent areas on the inner wall surface Wsw of the workpiece W. This allows the machining system SYS to irradiate the inner wall surface Wsw of the workpiece W with the processing light EL over a 360-degree range surrounding the optical axis AX.

[0080] By performing the above-described operation, the processing light EL may be irradiated onto at least a portion of an annular area EA of the inner wall surface Wsw of the workpiece W that surrounds the optical axis AX of the fθ lens 1351. That is, the objective optical system 135 can irradiate the processing light EL toward at least a portion of the inner wall surface Wsw of the workpiece W that surrounds the optical axis AX. In other words, the objective optical system 135 can irradiate the processing light EL toward at least a portion of the annular area EA that is set on at least a portion of the inner wall surface Wsw of the workpiece W that surrounds the optical axis AX. As a result, at least a portion of the annular area EA of the inner wall surface Wsw of the workpiece W can be processed.

[0081] Furthermore, when the machining head 13 is moved so that the second head housing 137 moves in the Z-axis direction along the inner wall surface Wsw of the workpiece W, the annular area EA moves in the Z-axis direction on the inner wall surface Wsw of the workpiece W. Therefore, the machining system SYS can machine a wide range of the inner wall surface Wsw of the workpiece W by alternately repeating the operation of irradiating the annular area EA with the machining light EL and the operation of moving the machining head 13 (as a result, moving the annular area EA on the inner wall surface Wsw of the workpiece W).

[0082] The processing system SYS may flow gas for cooling the fθ lens 1351 inside the second head housing 137. The processing system SYS may also eject the gas flowing inside the second head housing 137 from an opening 1371 of the second head housing 137. The processing system SYS may use the gas ejected from the opening 1371 to reduce adhesion of fumes and the like to optical components that may be generated when the processing light EL is irradiated onto the workpiece W.

[0083] As described above, the mirror 1352 reflects the processing light EL incident from the galvanometer mirror 1342 toward the workpiece W (the inner wall surface Wsw of the workpiece W). For this reason, the mirror 1352 may be referred to as a reflecting device. The second head housing 137 houses the objective optical system 135. In other words, it can be said that the objective optical system 135 (fθ lens 1351 and mirror 1352) is attached to the second head housing 137. In other words, it can be said that the second head housing 137 supports the objective optical system 135. For this reason, the second head housing 137 may be referred to as a support device. Note that, as shown in FIG. 3 , the longitudinal direction of the second head housing 137 extends along the optical axis AX. In other words, the second head housing 137 is configured so that the processing light EL can travel along the optical axis AX.

[0084] The mirror 1352 having the reflective surface 13521 may be disposed on the second head housing 137 so that the reflective surface 13521 can rotate in accordance with the rotation of the second head housing 137 when the processing light EL is incident on the reflective surface 13521 of the mirror 1352. The second head housing 137 shown in FIG. 2 has a cylindrical appearance. However, the second head housing 137 may be configured, for example, by a frame, which is a structural body such as a framework (i.e., the second head housing 137 does not need to have walls). The second head housing 137 may also be configured using, for example, a base that serves as a pedestal for placing the mirror 1352.

[0085] (2-2) Structure Related to Measurement Light ML The measurement light ML generated by the measurement light source 12 is further incident on the processing head 13 via an optical transmission member such as an optical fiber ( FIG. 3 ). The measurement light source 12 may include an optical comb light source. The optical comb light source is a light source that can generate light (optical frequency comb) containing frequency components equally spaced on the frequency axis as pulsed light. In this case, the measurement light source 12 emits pulsed light containing frequency components equally spaced on the frequency axis as the measurement light ML. However, the measurement light source 12 may include a light source other than the optical comb light source.

[0086] The measurement light ML is not limited to an optical frequency comb, and may be any type of light as long as it can measure the workpiece W when irradiated onto the workpiece W. The measurement light ML may be a type of light other than an optical frequency comb or laser light. Therefore, the measurement light ML may include pulsed light (for example, pulsed light having an emission time of picoseconds or less), or may be continuous light that does not include pulsed light. Furthermore, the wavelength of the measurement light ML may be any wavelength as long as it can measure the workpiece W when irradiated onto the workpiece W. In other words, the measurement light ML may be visible light or invisible light (for example, at least one of infrared light, ultraviolet light, and extreme ultraviolet light).

[0087] The wavelength of the measurement light ML may be different from the wavelength of the processing light EL. For example, the wavelength of the measurement light ML may be shorter than the wavelength of the processing light EL. As an example, light in the wavelength band of 266 nm or 355 nm may be used as the measurement light ML, and light in the wavelength band of 532 nm, 1 μm, or 10 μm may be used as the processing light EL.

[0088] In this case, the spot diameter of the measurement light ML on the workpiece W is smaller than the spot diameter of the processing light EL on the workpiece W. As a result, the measurement resolution of the measurement light ML is higher than the processing resolution of the processing light EL. However, the wavelength of the measurement light ML does not have to be shorter than the wavelength of the processing light EL. The wavelength of the measurement light ML may be the same as the wavelength of the processing light EL.

[0089] In the example shown in FIG. 3 , the processing system SYS includes multiple measurement light sources 12 (measurement light sources 12#1 and 12#2). The multiple measurement light sources 12 each emit multiple measurement light beams ML that are phase-synchronized and coherent with each other. For example, the multiple measurement light sources 12 may have different oscillation frequencies. In this case, the multiple measurement light beams ML emitted by the multiple measurement light sources 12 each have different pulse frequencies (e.g., the number of pulsed beams per unit time, which is the reciprocal of the emission period of the pulsed beam). As an example, the measurement light source 12#1 may emit measurement light beam ML#1 with a pulse frequency of 25 GHz, and the measurement light source 12#2 may emit measurement light beam ML#2 with a pulse frequency of 25 GHz+α (e.g., +100 kHz). However, the processing system SYS may also include a single measurement light source 12.

[0090] The measurement light ML emitted from the measurement light source 12 is incident on the measurement optical system 132. The measurement optical system 132 is an optical system that emits the measurement light ML incident on the measurement optical system 132 toward the emission optical system 133. In other words, the measurement optical system 132 is an optical system that guides the measurement light ML emitted from the measurement light source 12 to the synthesis optical system 133. The measurement light ML emitted by the measurement optical system 132 is irradiated onto the workpiece W via the synthesis optical system 133, the state control optical system 134, and the objective optical system 135. In other words, in order to measure the workpiece W, the measurement optical system 132 irradiates the measurement light ML onto the workpiece W via the synthesis optical system 133, the state control optical system 134, and the objective optical system 135. For this reason, the measurement optical system 132 may be referred to as a measurement device.

[0091] The measurement optical system 132 includes, for example, a mirror 1320 , a beam splitter 1321 , a beam splitter 1322 , a detector 1323 , a beam splitter 1324 , a mirror 1325 , a detector 1326 , and a mirror 1327 .

[0092] The measurement light ML emitted from the measurement light source 12 is incident on a beam splitter 1321. Specifically, the measurement light ML#1 (measurement light ML) emitted from the measurement light source 12#1 is incident on the beam splitter 1321. The measurement light ML#2 (measurement light ML) emitted from the measurement light source 12#2 is incident on the beam splitter 1321 via a mirror 1320. The beam splitter 1321 causes the measurement light ML#1 and ML#2 incident on the beam splitter 1321 to be incident on a beam splitter 1322.

[0093] The beam splitter 1322 reflects measurement light ML#1-1, which is a part of measurement light ML#1 that is incident on the beam splitter 1322, toward a detector 1323. The beam splitter 1322 makes measurement light ML#1-2, which is another part of measurement light ML#1 that is incident on the beam splitter 1322, incident on a beam splitter 1324. The beam splitter 1322 reflects measurement light ML#2-1, which is a part of measurement light ML#2 that is incident on the beam splitter 1322, toward a detector 1323. The beam splitter 1322 makes measurement light ML#2-2, which is another part of measurement light ML#2 that is incident on the beam splitter 1322, incident on a beam splitter 1324.

[0094] The measurement beams ML#1-1 and ML#2-1 that have passed through the beam splitter 1322 are incident on the detector 1323. The detector 1323 detects interference light generated by interference between the measurement beams ML#1-1 and ML#2-1. Specifically, the detector 1323 detects the interference light by receiving the interference light. For this reason, the detector 1323 may be provided with a light-receiving element (a light-receiving unit, typically a photoelectric conversion element) that can receive light. The detection result of the detector 1323 is output to the control device 3.

[0095] The measurement beams ML#1-2 and ML#2-2 that have passed through the beam splitter 1322 are incident on a beam splitter 1324. The beam splitter 1324 causes at least a portion of the measurement beam ML#1-2 that has entered the beam splitter 1324 to be incident on a mirror 1325. The beam splitter 1324 causes at least a portion of the measurement beam ML#2-2 that has entered the beam splitter 1324 to be incident on a mirror 1327.

[0096] Measurement light ML#1-2 incident from beam splitter 1324 is incident on mirror 1325. Measurement light ML#1-2 incident on mirror 1325 is reflected by the reflecting surface of mirror 1325 (the reflecting surface may also be referred to as a reference surface). Specifically, mirror 1325 reflects measurement light ML#1-2 incident on mirror 1325 toward beam splitter 1324. That is, mirror 1325 causes measurement light ML#1-2 incident on mirror 1325 to be incident on beam splitter 1324 as measurement light ML#1-3, which is its reflected light. Measurement light ML#1-3 passing through mirror 1325 is incident on beam splitter 1324. Beam splitter 1324 causes measurement light ML#1-3 incident on beam splitter 1324 to be incident on beam splitter 1322. The measurement beams ML#1-3 emitted from the beam splitter 1324 are incident on the beam splitter 1322. The beam splitter 1322 causes the measurement beams ML#1-3 incident on the beam splitter 1322 to be incident on the detector 1326.

[0097] On the other hand, the measurement light ML#2-2 that has passed through the beam splitter 1324 is incident on a mirror 1327. The mirror 1327 reflects the measurement light ML#2-2 that has been incident on the mirror 1327 toward the emission optical system 113. In other words, the mirror 1327 causes the measurement light ML#2-2 that has been incident on the mirror 1327 to be incident on the combining optical system 133.

[0098] The measurement light ML#2-2 that passes through the mirror 1327 enters the combining optical system 133. A beam splitter 1331 of the combining optical system 133 causes the measurement light ML#2-2 that entered the beam splitter 1331 to enter the state control optical system 134. In the example shown in Fig. 3, the measurement light ML#2-2 that entered the state control optical system 134 is reflected by the polarization separation surface and thereby enters the state control optical system 134. Therefore, in the example shown in Fig. 3, the measurement light ML#2-2 enters the polarization separation surface of the beam splitter 1331 in a state having a polarization direction that can be reflected by the polarization separation surface (for example, a polarization direction that becomes s-polarized with respect to the polarization separation surface).

[0099] As described above, the processing light EL is incident on the beam splitter 1331 in addition to the measurement light ML#2-2. That is, both the measurement light ML#2-2 and the processing light EL pass through the beam splitter 1331. The beam splitter 1331 causes the processing light EL and the measurement light ML#2-2, which have entered the beam splitter 1331 from different directions, to be incident in the same direction (that is, toward the same state control optical system 134). Therefore, the beam splitter 1331 essentially functions as a combining optical system that combines the processing light EL and the measurement light ML#2-2 (that is, an optical path combining component that combines the optical path of the processing light EL and the optical path of the measurement light ML#2-2).

[0100] Note that, when the wavelengths of the processing light EL and the measurement light ML are different, the combining optical system 133 may include a dichroic mirror as the combining optical system instead of the beam splitter 1331. Even in this case, the combining optical system 133 can combine the processing light EL and the measurement light ML#2-2 using the dichroic mirror (that is, combine the optical path of the processing light EL and the optical path of the measurement light ML#2-2).

[0101] The measurement light ML#2-2 incident from the beam splitter 1331 is incident on a shape-changing optical system 1341 of the state control optical system 134. The shape-changing optical system 1341 may change the shape of the measurement light ML#2-2 in a plane intersecting the traveling direction of the measurement light ML#2-2 (i.e., the cross-sectional shape of the measurement light ML#2-2) under the control of the control device 3. Specifically, similar to the case of changing the cross-sectional shape of the processing light EL, the shape-changing optical system 1341 may change the cross-sectional shape of the measurement light ML#2-2 so that the shape of the spot of the measurement light ML#2-2 on the surface of the workpiece W becomes a desired shape. Note that the manner in which the cross-sectional shape of the measurement light ML#2-2 is changed may be the same as the manner in which the cross-sectional shape of the processing light EL is changed, and therefore a detailed description thereof will be omitted.

[0102] Measurement light ML#2-2 incident from shape-changing optical system 1341 is incident on galvanometer mirror 1342. Galvanometer mirror 1342 deflects measurement light ML#2-2 in the same way as when deflecting processing light EL. Therefore, galvanometer mirror 1342 can change the emission angle of measurement light ML#2-2, the direction in which measurement light ML#2-2 is emitted from galvanometer mirror 1342, and the traveling direction of measurement light ML#2-2 from galvanometer mirror 1342 toward objective optical system 135.

[0103] As described above, the processing light EL is incident on the galvanometer mirror 1342 in addition to the measurement light ML#2-2. That is, the processing light EL and measurement light ML#2-2 combined by the beam splitter 1331 are incident on the galvanometer mirror 1342. Therefore, both the measurement light ML#2-2 and the processing light EL pass through the same galvanometer mirror 1342. Therefore, the galvanometer mirror 1342 can synchronously change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W. That is, the galvanometer mirror 1342 can change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in conjunction with each other.

[0104] The measurement light ML#2-2 that has passed through the galvanometer mirror 1342 is incident on the objective optical system 135 (particularly, the fθ lens 1351). The fθ lens 1351 irradiates (specifically, focuses) the measurement light ML#2-2 from the galvanometer mirror 1342 onto the workpiece W via the mirror 1352. Note that the emission mode of the measurement light ML#2-2 from the objective optical system 135 may be similar to the emission mode of the processing light EL from the objective optical system 135, and therefore a detailed description thereof will be omitted.

[0105] When the measurement light ML#2-2 is irradiated onto the workpiece W, light resulting from the irradiation of the measurement light ML#2-2 is generated from the workpiece W. In other words, when the measurement light ML#2-2 is irradiated onto the workpiece W, light resulting from the irradiation of the measurement light ML#2-2 is emitted from the workpiece W. The light resulting from the irradiation of the measurement light ML#2-2 (in other words, the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2) may include at least one of the measurement light ML#2-2 reflected by the workpiece W (i.e., reflected light), the measurement light ML#2-2 scattered by the workpiece W (i.e., scattered light), the measurement light ML#2-2 diffracted by the workpiece W (i.e., diffracted light), and the measurement light ML#2-2 transmitted through the workpiece W (i.e., transmitted light).

[0106] At least a portion of the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2 (hereinafter, this light will be referred to as "measurement light ML#2-3") is incident on the objective optical system 135. Note that the measurement light ML#2-3 may include light of the measurement light ML#2-2 reflected by the workpiece W. The measurement light ML#2-3 may include light of the measurement light ML#2-2 scattered by the workpiece W. The measurement light ML#2-3 incident on the objective optical system 135 is incident on the state control optical system 134 via a mirror 1352 and an fθ lens 1351. The measurement light ML#2-3 incident on the state control optical system 134 is incident on the combining optical system 133 via a galvanometer mirror 1342 and a shape changing optical system 1341. The beam splitter 1331 of the combining optical system 133 emits the measurement light ML#2-3 incident on the beam splitter 1331 toward the measurement optical system 132. In the example shown in Fig. 3, the measurement light ML#2-3 incident on the beam splitter 1331 is reflected on the polarization separation surface and is then incident on the measurement optical system 132. Therefore, in the example shown in Fig. 3, the measurement light ML#2-3 is incident on the polarization separation surface of the beam splitter 1331 in a state where it has a polarization direction that allows it to be reflected by the polarization separation surface.

[0107] The measurement light ML#2-3 that passes through the beam splitter 1331 is incident on a mirror 1327 of the measurement optical system 132. The mirror 1327 reflects the measurement light ML#2-3 that has entered the mirror 1327 toward the beam splitter 1324. The beam splitter 1324 causes at least a portion of the measurement light ML#2-3 that has entered the beam splitter 1324 to enter the beam splitter 1322. The beam splitter 1322 emits at least a portion of the measurement light ML#2-3 that has entered the beam splitter 1322 toward a detector 1326.

[0108] As described above, in addition to measurement light ML#2-3, measurement light ML#1-3 is incident on detector 1326. That is, measurement light ML#2-3 directed toward detector 1326 via workpiece W, and measurement light ML#1-3 directed toward detector 1326 without via workpiece W, are incident on detector 1326. Note that measurement light ML#1-3 may also be referred to as reference light. Detector 1326 detects interference light generated by interference between measurement light ML#1-3 and measurement light ML#2-3. Specifically, detector 1326 detects interference light by receiving the interference light. For this reason, detector 1326 may be equipped with a light receiving element (light receiving unit) capable of receiving light. The detection result of detector 1326 is output to control device 3.

[0109] The control device 3 may calculate the state of the workpiece W based on the detection results of the detector 1323 and the detector 1326. Specifically, since the pulse frequency of measurement light ML#1 is different from the pulse frequency of measurement light ML#2, the pulse frequency of measurement light ML#1-1 is different from the pulse frequency of measurement light ML#2-1. Therefore, the interference light between measurement light ML#1-1 and measurement light ML#2-1 is interference light in which pulse light appears in synchronization with the timing when the pulse light constituting measurement light ML#1-1 and the pulse light constituting measurement light ML#2-1 are simultaneously incident on the detector 1323. Similarly, the pulse frequency of measurement light ML#1-3 is different from the pulse frequency of measurement light ML#2-3. Therefore, the interference light between the measurement light ML#1-3 and the measurement light ML#2-3 becomes interference light in which pulsed light appears in synchronization with the timing when the pulsed light constituting the measurement light ML#1-3 and the pulsed light constituting the measurement light ML#2-3 simultaneously enter the detector 1326.

[0110] Here, the position (position on the time axis) of the pulsed light that creates the interference light detected by the detector 1326 varies based on the positional relationship between the machining head 13 and the workpiece W. This is because the interference light detected by the detector 1326 is interference light between measurement light ML#2-3 that heads toward the detector 1326 via the workpiece W and measurement light ML#1-3 that heads toward the detector 1326 without passing through the workpiece W. On the other hand, the position (position on the time axis) of the pulsed light that creates the interference light detected by the detector 1323 does not vary based on the positional relationship between the machining head 13 and the workpiece W. For this reason, it can be said that the time difference between the pulsed light that creates the interference light detected by the detector 1326 and the pulsed light that creates the interference light detected by the detector 1323 indirectly indicates the positional relationship between the machining head 13 and the workpiece W (typically, the distance between the machining head 13 and the workpiece W).

[0111] Therefore, the control device 3 can calculate the state of the workpiece W based on the time difference between the pulsed light that creates the interference light detected by the detector 1326 and the pulsed light that creates the interference light detected by the detector 1323. Specifically, the control device 3 can calculate the position of the portion of the workpiece W that is irradiated with the measurement light ML#2-2 based on the time difference between the pulsed light that creates the interference light detected by the detector 1326 and the pulsed light that creates the interference light detected by the detector 1323. In other words, the control device 3 can obtain information regarding the position of the portion of the workpiece W that is irradiated with the measurement light ML#2-2. Furthermore, if the measurement light ML#2-2 is irradiated at multiple locations on the workpiece W and / or if the measurement light ML#2-2 is irradiated so as to scan the surface of the workpiece W, the control device 3 can also calculate the shape of the workpiece W.

[0112] The calculated state of the workpiece W may be used to control the machining system SYS. Specifically, the calculated state of the workpiece W may be used to control the machining device 1. The calculated state of the workpiece W may be used to control the machining head 13. The calculated state of the workpiece W may be used to control the head drive system 14. The calculated state of the workpiece W may be used to control the stage device 2. The calculated state of the workpiece W may be used to control the stage drive system 23.

[0113] The control device 3 may control the machining system SYS without calculating the state of the workpiece W based on the detection results of the detector 1323 and the detector 1326. For example, the control device 3 may control the machining device 1 based on the detection results of the detector 1323 and the detector 1326. The control device 3 may control the machining head 13 based on the detection results of the detector 1323 and the detector 1326. The control device 3 may control the head drive system 14 based on the detection results of the detector 1323 and the detector 1326. The control device 3 may control the stage device 2 based on the detection results of the detector 1323 and the detector 1326. The control device 3 may control the stage drive system 23 based on the detection results of the detector 1323 and the detector 1326.

[0114] As described above, by irradiating the workpiece W with the measurement light ML (measurement light ML#2-2), the distance between the machining head 13 (for example, the reflective surface 13521 of the mirror 1352 housed in the second head housing 137) and the workpiece W (the inner wall surface Wsw of the workpiece W) may be calculated based on the detection results of the detector 1323 and the detector 1326. Therefore, it can be said that the measurement optical system 132 of the machining apparatus 1 measures information related to the distance between the machining head 13 and the workpiece W. Here, the above-mentioned interference light is an example of "information related to the distance." It can be said that the distance between the machining head 13 and the workpiece W indicates the positional relationship between the machining head 13 and the workpiece W. Therefore, the "information related to the distance" may also be referred to as "information related to the positional relationship." It can be said that the reflective surface 13521 of the mirror 1352 is the focusing position of the machining light EL transmitted through the fθ lens 1351. Therefore, the "information regarding distance" may also be referred to as "information regarding the positional relationship (i.e., deviation) between the focusing position of the processing light EL and the surface (inner wall surface Wsw) of the workpiece W."

[0115] (3) Specific Example of Machining by Machining System SYS A specific example of machining of a workpiece W by the machining system SYS will be described with reference to FIG. 6. FIG. 6(a) is a diagram showing a machining pattern PT in a unit area to be applied to the workpiece W. FIG. 6(b) is a diagram showing a configuration in which machining patterns PT are formed in adjacent areas Ar1 to Ar3 in a ring-shaped area EA on the inner wall surface Wsw of the workpiece W. As shown in FIG. 6(a), the machining pattern PT formed in this example is specifically a machining pattern for forming a plurality of grooves extending in one direction. In other words, the machining shape PT is a machining pattern for forming a riblet structure.

[0116] For example, after the positional relationship between the second head housing 137 and the workpiece W is set to a first relationship, the processing light EL incident from the objective processing system 135 is irradiated onto area Ar1 (see FIG. 5) on the inner wall surface Wsw of the workpiece W. By irradiating area Ar1 on the inner wall surface Wsw with the processing light EL, a processing shape PT, i.e., a riblet structure, is formed in area Ar1 (see FIG. 6B). Next, the housing drive system 138 rotates the second head housing 137 around the optical axis AX, changing the positional relationship between the second head housing 137 and the workpiece W from the first relationship to a second relationship. Then, the processing light EL incident from the objective processing system 135 is irradiated onto area Ar2 (see FIG. 5) on the inner wall surface Wsw. By irradiating area Ar2 on the inner wall surface Wsw with the processing light EL, a processing shape PT, i.e., a riblet structure, is formed in area Ar2 (see FIG. 6B). At this time, regions Ar1 and Ar2 are adjacent to each other, and a riblet structure (machining pattern PT) is formed in region Ar2 so that the edge of the riblet structure formed in region Ar1 on the region Ar2 side is connected to the edge of the riblet structure formed in region Ar2 on the region Ar1 side. Then, the second head housing 137 is further rotated around the optical axis AX by the housing drive system 138, changing the positional relationship between the second head housing 137 and the workpiece W from the second relationship to a third relationship, and then the processing light EL incident from the objective processing system 135 is irradiated onto region Ar3 of the inner wall surface Wsw (see FIG. 5 ). By irradiating region Ar3 of the inner wall surface Wsw with the processing light EL, the processing pattern PT, i.e., the riblet structure, is formed in region Ar3 (see FIG. 6B ). At this time, regions Ar2 and Ar3 are adjacent to each other, and a riblet structure (processing pattern PT) is formed in region Ar3 so that the edge of the riblet structure formed in region Ar2 on the region Ar3 side is connected to the edge of the riblet structure formed in region Ar3 on the region Ar2 side.

[0117] In this way, when the second head housing 137 is fixed, only a portion of the annular area EA on the inner wall surface Wsw of the workpiece W can be machined. Therefore, by rotating the second head housing 137, the machineable area is changed and a machining pattern PT, i.e., a riblet structure, is formed over the entire annular area EA on the inner wall surface Wsw of the workpiece W.

[0118] (3-1) Issues when forming the machining shape PT (riblet structure) in the annular area EA The control device 3 generates machining control information including machining path information for each machining area that is changed by rotating the second head housing 137, based on the intended shape (ideal shape) of the inner wall surface Wsw of the workpiece W. Then, based on the machining control information, specifically the machining path information, the galvanometer mirror 1342 is controlled to deflect the machining light EL and cause the machining light EL to scan the inner wall surface Wsw of the workpiece W. In this way, the machining pattern PT, i.e., the riblet structure, is formed in the annular area EA of the inner wall surface Wsw of the workpiece W.

[0119] When forming a riblet structure in the annular area EA of the inner wall surface Wsw of the workpiece W, the second head housing 137 housing the mirror 1352 is rotated around the optical axis AX by the housing drive system 138. The reflective surface 1352 (flat surface) of the mirror 1352 forms an acute or obtuse angle with the optical axis AX of the fθ lens 1351 (which is substantially the same as the incident direction of the processing light EL on the mirror 1352). Therefore, when the second head housing 137 rotates, the mirror 1352 rotates around the optical axis AX while changing the normal direction of the reflective surface 1352 of the mirror 1352. On the other hand, the galvanometer mirror 1342 is housed in the first head housing 136 (see FIG. 3). In other words, the position and orientation of the galvanometer mirror 1342 are not affected by the rotation of the second head housing 137. As a result, when the second head housing 137 is rotated by the housing drive system 138, the attitude of the mirror 1352, and therefore the attitude of the reflecting surface 13521 of the mirror 1352, changes relative to the galvanometer mirror 1342. In other words, the rotation of the second head housing 137 is synonymous with the rotation of the mirror 1352 in the width direction M (the direction perpendicular to the optical axis AX within the reflecting surface 1352).

[0120] Here, when only information regarding the ideal shape is input to the control device 3, the control device 3 generates processing control information for controlling the galvanometer mirror 1342 to form multiple grooves extending in one direction from the processing path information. In other words, the processing light EL incident on the mirror 1352 (objective optical system 135) from the galvanometer mirror 1342 is caused to scan along the scanning direction Def1, which is a uniform direction of the processing light EL.

[0121] As a result, when the second head housing 137 is rotated, the position of the processing light EL scanning the reflecting surface 13521 of the mirror 1352 moves in the direction of extension of the optical axis AX, with one end moving closer to the fθ lens 1351 and the other end moving away from the fθ lens 1351, or one end moving away from the fθ lens 1351 and the other end moving closer to the fθ lens 1351. In other words, when the second head housing 137 rotates, the width direction M of the mirror 1352 (a direction perpendicular to the optical axis AX within the reflecting surface 1352) rotates with respect to the scanning direction Def1 of the processing light EL incident on the mirror 1352 from the galvanometer mirror 1342. In other words, the rotation of the second head housing 137 changes the attitude of the mirror 1352 with respect to the galvanometer mirror 1342. As a result, the scanning direction of the processing light EL, which passes through the galvanometer mirror 1342 and the mirror 1352 in this order and is irradiated onto the inner wall surface Wsw of the workpiece W, changes and rotates as the second head housing 137 rotates.

[0122] Specifically, when the scanning direction Def1 of the processing light EL and the width direction M of the mirror 1352 are orthogonal ( FIG. 7A ), the direction Sp1 in which the trajectory of the processing light EL extends on the reflecting surface 13521 of the mirror 1352 is orthogonal to the width direction M of the mirror 1352. When the trajectory of the processing light EL is projected from the X direction using the Y-Z plane as the projection plane, the shadow of the trajectory of the processing light EL is oriented along the Z direction. In other words, the scanning direction of the processing light EL on the inner wall surface Wsw of the workpiece W is displaced along the Z direction (the incident direction of the processing light EL incident on the mirror 1352) without displacing in the Y direction. Consequently, a riblet structure (processing pattern PT) extending along the Z direction is formed on the inner wall surface Wsw of the workpiece W ( FIG. 8A ).

[0123] When the angle between the scanning direction Def1 of the processing light EL and the width direction M of the mirror 1352 is an obtuse or acute angle ( FIG. 7B ), the direction Sp2 in which the trajectory of the processing light EL extends on the reflecting surface 13521 of the mirror 1352 forms an obtuse or acute angle with the width direction M of the mirror 1352. When the trajectory of the processing light EL is projected from the X direction using the Y-Z plane as the projection plane, or from the Y direction using the X-Z plane as the projection plane, the shadow of the trajectory of the processing light EL is in a direction that forms an obtuse or acute angle with the Z direction. As a result, a riblet structure (processing pattern PT′) is formed on the inner wall surface Wsw of the workpiece W, extending in a direction that forms an obtuse or acute angle with the Z direction ( FIG. 8B ).

[0124] When the scanning direction Def1 of the processing light EL and the width direction M of the mirror 1352 are parallel ( FIG. 7C ), the direction Sp3 in which the trajectory of the processing light EL extends on the reflecting surface 13521 of the mirror 1352 is parallel to the width direction M of the mirror 1352. When the trajectory of the processing light EL is projected from the Y direction using the X-Z plane as the projection plane, the shadow of the trajectory of the processing light EL is oriented along the X direction. Consequently, a riblet structure (processing pattern PT") extending along the X direction, which is perpendicular to the Z direction, is formed on the inner wall surface Wsw of the workpiece W ( FIG. 8C ). Note that the fθ lens 1351 is not shown in FIG. 7 .

[0125] As described above, the orientation of the reflecting surface 13521 of the mirror 1352 relative to the galvanometer mirror 1342 changes as the second head housing 137 rotates. For this reason, if the galvanometer mirror 1342 is controlled based only on the machining path information to move in the scanning direction Def1, the relationship between the scanning direction Def1 (or the directions Sp1 to Sp3 in which the trajectory of the processing light EL extends on the reflecting surface 13521 of the mirror 1352) and the width direction M of the mirror 1352 changes, and as a result, the scanning direction of the processing light EL on the inner wall surface Wsw of the workpiece W cannot be made uniform. In other words, because the orientation of the reflecting surface 13521 relative to the galvanometer mirror 1342 changes due to the rotation of the second head housing 137, if the galvanometer mirror 1342 is controlled based only on the machining path information, the machining shape PT will rotate on the inner wall surface Wsw of the workpiece W, and the desired machining (for example, machining to form the riblet structure shown in FIG. 6B) cannot be performed on the inner wall surface Wsw of the workpiece W. More specifically, if the galvanometer mirror 1342 is scanned in each machining area based on information about the ideal shape without any special operation, when the second head housing 137 rotates once around the Z axis, the trajectory of the machining light EL irradiated onto the annular area EA on the inner wall surface Wsw of the workpiece W, in other words, the image formed by the machining light EL, will rotate once around a rotation axis perpendicular to the Z direction.

[0126] (3-2) Method for Solving the Problem The problem occurs when the second head housing 137 rotates, changing the attitude of the reflecting surface 13521 of the mirror 1352 relative to the galvanometer mirror 1342. For this reason, the problem can also be solved by, for example, accommodating the galvanometer mirror 1342 in the second head housing 137 and keeping the attitude of the mirror 1352 relative to the galvanometer mirror 1342, and therefore the attitude of the reflecting surface 13521 of the mirror 1352, constant. However, accommodating the galvanometer mirror 1342 in the second head housing 137 creates a new problem in that it becomes difficult to reduce the size and weight of the second head housing 137.

[0127] Therefore, in this embodiment, the above problem is solved by changing the control of the galvanometer mirror 1342 in response to the rotation of the second head housing 137. In other words, in this embodiment, the above problem is solved by correcting the machining control information corresponding to the machining shape PT (adding angle supplemental information to the machining path information) in response to changes in the attitude of the reflecting surface 13521 relative to the galvanometer mirror 1342 caused by the rotation of the second head housing 137. More specifically, in this embodiment, to form a machining shape PT (riblet shape) having multiple grooves extending in one direction, the scanning direction of the scanning processing light EL is changed in response to the rotation of the second head housing 137 (for each region aligned in the circumferential direction of the inner wall surface Wsw of the workpiece W), thereby forming multiple grooves extending in a uniform direction along the circumferential direction of the inner wall surface Wsw of the workpiece W. Here, the scanning direction of the processing light EL refers to the fixed direction (main scanning direction) when the focal position of the processing light EL is periodically moved at high speed, i.e., wobbled, to scan in a fixed direction.

[0128] The following describes a configuration for changing the scanning direction of the processing light EL incident on the mirror 1352 from the galvanometer mirror 1342 in accordance with the rotation of the second head housing 137, with reference to Fig. 9. Fig. 9 is a block diagram showing the configuration of a portion of the processing system SYS.

[0129] 9, the state control optical system 134 may have a galvanometer controller 1343 that controls the X scanning mirror 1342X and Y scanning mirror 1342Y (see FIG. 3) of the galvanometer mirror 1342. The housing drive system 138 may have an encoder 1381 that detects the rotation of the second head housing 137. Note that the state control optical system 134 does not have to have the galvanometer controller 1343. In this case, the control device 3 may directly control the X scanning mirror 1342X and Y scanning mirror 1342Y.

[0130] The detection result of the encoder 1381 included in the housing drive system 138 may be output as angle supplement information to the control device 3. The detection result of the encoder 1381 may indicate, for example, at least one of the rotation phase and rotation displacement amount, rotation angle, and rotation position of the second head housing 137.

[0131] For example, when the detection result of the encoder 1381 indicates the state shown in FIG. 10(a), the control device 3 (calculation device 31) uses the angle complement information to control the galvanometer mirror 1342 (X scanning mirror 1342X, Y scanning mirror 1342Y) with the galvanometer controller 1343, so that the processing light EL scanned along the scanning direction Def1 enters the objective optical system 135 (mirror 1352) from the galvanometer mirror 1342. In other words, the control device 3 may control the galvanometer mirror 1342 with the galvanometer controller 1343 to control the scanning direction Def1 of the processing light EL that passes through the galvanometer mirror 1342 and enters the mirror 1352 so that the direction Sp1 in which the trajectory of the processing light EL extends on the reflecting surface 13521 of the mirror 1352 is perpendicular to the width direction M of the mirror 1352, that is, to rotate the scanning direction Def1 of the processing light EL around the Z axis by the same amount as the second head housing 137 rotates.

[0132] At this time, on the reflecting surface 13521 of the mirror 1352, the trajectory of the processing light EL extends along a direction Sp1 that is perpendicular to the width direction M of the mirror 1352, so the processing light EL scans along the Z-axis direction on the inner wall surface Wsw of the workpiece W. As a result, a riblet structure in which grooves extend in the Z-axis direction as shown in FIG. 11( a) is formed on the inner wall surface Wsw.

[0133] Furthermore, when the mirror 1352 is in the first posture shown in Figure 10 (a), the control device 3 may control the shape-changing optical system 1341 (see Figure 3) so that the cross-sectional shape of the processing light EL incident on the reflecting surface 13521 of the mirror 1352 becomes the first cross-sectional shape in a plane perpendicular to the optical axis AX.

[0134] 10B shows the state in which the housing drive system 138 rotates the second head housing 137 in the direction indicated by the arrow R, causing the mirror 1352 shown in FIG. 10A to change from the first posture to the second posture. In this case, the control device 3 uses the angle interpolation information to control the galvanometer controller 1343 to control the galvanometer mirror 1342 (X scanning mirror 1342X, Y scanning mirror 1342Y) so that the processing light EL scanned along a scanning direction Def2 different from the scanning direction Def1 is incident from the galvanometer mirror 1342 to the objective optical system 135 (mirror 1352). In other words, the control device 3 may control the galvanometer mirror 1342 using the galvanometer controller 1343 to control the scanning direction Def2 of the processing light EL that passes through the galvanometer mirror 1342 and enters the mirror 1352 so that the direction Sp2 in which the trajectory of the processing light EL extends on the reflecting surface 13521 of the mirror 1352 is perpendicular to the width direction M of the mirror 1352.

[0135] At this time, the trajectory of the processing light EL extends on the reflecting surface 13521 of the mirror 1352 in a direction Sp2a perpendicular to the width direction M of the mirror 1352, so the processing light EL scans the inner wall surface Wsw of the workpiece W along the Z-axis direction. As a result, a riblet structure in which grooves extend in the Z-axis direction as shown in Fig. 11(b) is formed on the inner wall surface Wsw. Note that in the state shown in Fig. 10(b), the control device 3 may control the shape-changing optical system 1341 so that the cross-sectional shape of the processing light EL incident on the reflecting surface 13521 of the mirror 1352 becomes a second cross-sectional shape different from the first cross-sectional shape.

[0136] 10C shows the state in which the second head housing 137 is further rotated by the housing drive system 138 in the direction indicated by arrow R, and the mirror 1352 shown in FIG. 10B is changed from the second posture to the third posture. In this case, the control device 3 uses the angle interpolation information to control the galvanometer controller 1343 to control the galvanometer mirror 1342 (X scanning mirror 1342X, Y scanning mirror 1342Y) so that the processing light EL scanned along a scanning direction Def3, which is different from the scanning directions Def1 and Def2, is incident from the galvanometer mirror 1342 to the objective optical system 135 (mirror 1352). In other words, the control device 3 may control the galvanometer mirror 1342 with the galvanometer controller 1343 to control the scanning direction Def3 of the processing light EL that passes through the galvanometer mirror 1342 and enters the mirror 1352 so that the direction Sp3 in which the trajectory of the processing light EL extends on the reflecting surface 13521 of the mirror 1352 is perpendicular to the width direction M of the mirror 1352.

[0137] At this time, on the reflecting surface 13521 of the mirror 1352, the trajectory of the processing light EL extends along a direction Sp3a perpendicular to the width direction M of the mirror 1352, so the processing light EL scans along the Z-axis direction on the inner wall surface Wsw of the workpiece W. As a result, a riblet structure in which grooves extend in the Z-axis direction as shown in Fig. 11(c) is formed on the inner wall surface Wsw. Note that in the state shown in Fig. 10(c), the control device 3 may control the shape-changing optical system 1341 so that the cross-sectional shape of the processing light EL incident on the reflecting surface 13521 of the mirror 1352 becomes a third cross-sectional shape different from the first cross-sectional shape and the second cross-sectional shape.

[0138] Thus, in this embodiment, when the attitude of the reflecting surface 13521 relative to the galvanometer mirror 1342 changes due to the rotation of the second head housing 137, the deflection mode of the processing light EL by the galvanometer mirror 1342 is changed according to the rotation of the second head housing 137 (in other words, according to the change in the position and attitude of the reflecting surface 13521).

[0139] That is, in accordance with the rotation of the second head housing 137 by the housing drive system 138, and thus with changes in the position and attitude of the mirror 1352 (reflecting surface 13521) relative to the galvanometer mirror 1342, the galvanometer controller 1343 controls the galvanometer mirror 1342 to control the scanning direction of the processing light EL that passes through the galvanometer mirror 1342 and is incident on the mirror 1352 so that the direction in which the trajectory of the processing light EL extends on the reflecting surface 13521 of the mirror 1352 remains constant. In other words, in this embodiment, even if the attitude of the reflecting surface 13521 relative to the galvanometer mirror 1342 changes due to the rotation of the second head housing 137, the galvanometer mirror 1342 is controlled so that the incident position of the processing light EL on the reflecting surface 13521 does not change.

[0140] As a result, according to this embodiment, the desired processing (processing to form the riblet structure shown in FIG. 6(b)) can be performed on the inner wall surface Wsw of the workpiece W.

[0141] In this embodiment, the machining shape PT is a riblet shape. Therefore, the multiple grooves extending in the same direction that make up the riblet shape are formed by the machining light EL scanned in the same scanning direction. Therefore, the scanning direction of the galvanometer mirror 1342 is controlled by the galvanometer mirror 1342 based on the rotation of the second head housing 137 and, ultimately, the posture information (angle supplement information) of the mirror 1352 (reflecting surface 13521). However, the reference direction of the machining path information corresponding to the machining shape PT is not limited to the scanning direction of the galvanometer mirror 1342. In the case of a non-riblet shape that is not scanned in the same scanning direction, it may be the direction of the outer edge of a portion of the machining shape PT, for example, the direction of one side. In this case, the control device 3 generates machining control information including machining path information for each machining area that is shifted by rotating the second head housing 137 based on the intended shape (ideal shape) of the inner wall surface Wsw of the workpiece W.

[0142] Note that rotation of the second head housing 137 may be considered equivalent to changing the attitude of the second head housing 137. Therefore, in the operation of the control device 3 described above, it can be said that the control device 3 controls the galvanometer mirror 1342 based on the attitude of the second head housing 137, which is rotatable around the optical axis AX that intersects with the reflecting surface 13521 of the mirror 1352. Note that the attitude of the second head housing 137 may be represented by, for example, at least one of the rotation phase, rotational displacement amount, rotation angle, rotation position, and tilt of the second head housing 137. Alternatively, the second head housing 137 may be configured to rotate stepwise by a predetermined angle to complete one rotation, that is, to rotate once in a predetermined number of steps, and the attitude of the second head housing 137 may be represented by the number of steps from a reference position.

[0143] For example, if the information about the posture of the second head housing 137 (complementary angle information) is represented by a rotational phase, the control device 3 may control the galvanometer mirror 1342 using a correction value corresponding to the rotational phase. Here, the correction value may vary depending on the difference between a predetermined reference rotational phase and the rotational phase indicated by the detection result of the encoder 1381. For example, if the posture of the second head housing 137 is represented by a rotational displacement amount, the control device 3 may control the galvanometer mirror 1342 based on the rotational displacement amount. Note that the rotational displacement amount of the second head housing 137 can be said to indicate the amount of change in the position of the second head housing 137. Therefore, the rotational displacement amount of the second head housing 137 can be said to include the positional change of the second head housing 137. Furthermore, if the information about the posture of the second head housing 137 (complementary angle information) is represented by the number of steps from a reference position, the control device 3 may control the galvanometer mirror 1342 using a correction value corresponding to the number of steps.

[0144] The attitude of the second head housing 137 can be considered equivalent to the position of the mirror 1352 housed in the second head housing 137. Therefore, controlling the galvanometer mirror 1342 based on the attitude of the second head housing 137 can be considered to be controlling the galvanometer mirror 1342 based on the position of the mirror 1352. Furthermore, the amount of rotational displacement of the second head housing 137 can be considered to be equivalent to the amount of rotational displacement of the mirror 1352. Therefore, controlling the galvanometer mirror 1342 based on the position of the mirror 1352 can be considered to be controlling the galvanometer mirror 1342 based on the amount of rotational displacement of the mirror 1352.

[0145] (3-2-1) First Control Mode A first mode for realizing the above-described operation will be described. The control device 3 transmits machining control information including machining path information generated based on the machining shape PT to the control device 3. At this time, in the first mode, the control device 3 (arithmetic device 31) generates angle supplement information generated based on the detection results of the encoder 1381 in addition to the machining shape PT and, by extension, the machining path information based on the machining shape PT. In other words, the control device 3 rotates the machining path information based on the angle supplement information. Specifically, the control device 3 rotates the machining path information, and controls the X-scanning mirror 1342X and Y-scanning mirror 1342Y of the galvanometer mirror 1342 using the galvanometer controller 1343 based on the newly generated machining path information.

[0146] The relationship between the detection result of the encoder 1381 (for example, at least one of the rotation phase, rotational displacement amount, rotation angle, and rotational position of the second head housing 137), i.e., the angle supplement information, and the rotation amount of the machining path information is predetermined, and in this embodiment, they are displaced by the same angle. The meaning of "the control device 3 rotates the machining path information" is that the control device 3 corrects the machining path information in accordance with the angle supplement information, and may include the control device 3 rotating the machining path information by 0 degrees.

[0147] For example, when the detection result of the encoder 1381 indicates the state shown in Fig. 10(a), the control device 3 rotates the machining path information MP#0 to generate machining path information MP#1 (see Fig. 12(b)). The control device 3 controls the X scanning mirror 1342X and the Y scanning mirror 1342Y using the galvano controller 1343 based on the machining path information MP#1.

[0148] When the second head housing 137 is rotated in the direction indicated by arrow R by the housing drive system 138 and changes from the state shown in Figure 10(a) to the state shown in Figure 10(b), the detection result of the encoder 1381 indicates the state shown in Figure 10(b). The control device 3 may rotate the machining path information MP#0 to generate machining path information MP#2 (see Figure 12(c)). The control device 3 controls the X scanning mirror 1342X and the Y scanning mirror 1342Y using the galvano controller 1343 based on the machining path information MP#2.

[0149] When the second head housing 137 is further rotated in the direction indicated by arrow R by the housing drive system 138 and changes from the state shown in Figure 10(b) to the state shown in Figure 10(c), the detection result of the encoder 1381 indicates the state shown in Figure 10(c). The control device 3 rotates the machining path information MP#0 to generate machining path information MP#3 (see Figure 12(d)). The control device 3 controls the X scanning mirror 1342X and the Y scanning mirror 1342Y using the galvano controller 1343 based on the machining path information MP#3.

[0150] The operation of the control device 3 described above will be further explained with reference to the flowchart of Fig. 13. In Fig. 13, the control device 3 acquires the detection result of the encoder 1381 (step S101). The control device 3 rotates the machining path information MP#0 (corresponding to the machining pattern PT) transmitted from the control device 3 based on the detection result of the encoder 1381 (step S102). Thereafter, the control device 3 controls the X scanning mirror 1342X and the Y scanning mirror 1342Y using the galvano controller 1343 based on new machining path information (e.g., at least one of machining path information MP#1, MP#2, and MP#3) indicating the rotated machining path information (step S103).

[0151] The control device 3 may control the housing drive system 138 that rotates the second head housing 137. The operation of the control device 3, including the control of the housing drive system 138, may be as follows. For example, the control device 3 may control the housing drive system 138 so that the second head housing 137 (in other words, the posture of the mirror 1352) is in the state shown in FIG. 10( a). The control device 3 may control the X-scanning mirror 1342X and the Y-scanning mirror 1342Y of the galvanometer mirror 1342 based on the processing path information (processing path information MP#1) so that the processing light EL is irradiated onto a first region on the surface (inner wall surface Wsw) of the workpiece W in the state shown in FIG. 10( a).

[0152] For example, the control device 3 may control the housing drive system 138 so that the second head housing 137 changes from the state shown in Fig. 10(a) to the state shown in Fig. 10(b). In the state shown in Fig. 10(b), the control device 3 may control the X-scanning mirror 1342X and the Y-scanning mirror 1342Y of the galvanometer mirror 1342 based on the processing path information (processing path information MP#2) so that the processing light EL is irradiated onto a second area adjacent to the first area on the surface of the workpiece W (in other words, so that the processing light EL scans the second area).

[0153] For example, the control device 3 may control the housing drive system 138 so that the second head housing 137 changes from the state shown in Fig. 10(b) to the state shown in Fig. 10(c). In the state shown in Fig. 10(c), the control device 3 may control the X scanning mirror 1342X and the Y scanning mirror 1342Y of the galvanometer mirror 1342 based on the processing path information (processing path information MP#3) so that the processing light EL is irradiated onto a third area adjacent to the second area on the surface of the workpiece W (in other words, so that the processing light EL scans the third area).

[0154] (3-2-2) Second Control Mode A second mode for realizing the above-described operation will now be described. In the first control mode, machining path information is rotated based on the output (angle correction information) of the encoder 1381 to generate new machining path information. In contrast, the second control mode differs in that machining path information corresponding to the rotation is generated in advance from the machining path information, and one piece of generated machining path information is selected based on the output (angle correction information) of the encoder 1381. The control device 3 (arithmetic unit 31) generates machining path information based on a machining pattern PT (see FIG. 6A) input by an operator of the machining system SYS. At this time, the control device 3 rotates the machining pattern PT to generate multiple machining patterns corresponding to multiple rotation angles of the second head housing 137. The control device 3 then generates multiple pieces of machining path information corresponding to the multiple machining patterns. In addition, the meaning of "the control device 3 rotates the processing pattern PT" is that the control device 3 corrects the processing pattern PT according to the angle complement information, and may include the control device 3 rotating the processing pattern PT by 0 degrees.

[0155] The control device 3 may transmit the generated machining control information including the plurality of pieces of machining path information to the control device 3 of the machining device 1. The control device 3 (arithmetic device 31) may select one piece of machining path information corresponding to the detection result of the encoder 1381 from the plurality of pieces of machining path information included in the machining control information. Then, the control device 3 controls the galvanometer mirror 1342 based on the selected one piece of machining path information.

[0156] For example, if the detection result of the encoder 1381 indicates the state shown in Fig. 10(a), the control device 3 selects one piece of machining path information (machining path information MP#1) corresponding to the state shown in Fig. 10(a) from the plurality of pieces of machining path information. Then, based on the machining path information MP#1, the control device 3 controls the X scanning mirror 1342X and the Y scanning mirror 1342Y using the galvanometer controller 1343. As a result, the incident position of the machining light EL incident from the galvanometer mirror 1342 on the objective optical system 135 is aligned with the arrow Def1.

[0157] When the housing drive system 138 rotates the second head housing 137 in the direction indicated by arrow R, changing the state from that shown in FIG. 10(a) to that shown in FIG. 10(b), the detection result of the encoder 1381 indicates the state shown in FIG. 10(b). The control device 3 selects, from among the multiple pieces of machining path information, one piece of machining path information (machining path information MP#2) corresponding to the state shown in FIG. 10(b). Then, based on the machining path information MP#2, the control device 3 controls the X-scanning mirror 1342X and the Y-scanning mirror 1342Y using the galvanometer controller 1343. As a result, the incident position of the machining light EL incident from the galvanometer mirror 1342 on the objective optical system 135 is aligned with the arrow Def2.

[0158] When the housing drive system 138 further rotates the second head housing 137 in the direction indicated by arrow R, changing the state from that shown in FIG. 10(b) to that shown in FIG. 10(c), the detection result of the encoder 1381 indicates the state shown in FIG. 10(c). The control device 3 selects, from the plurality of pieces of machining path information, one piece of machining path information (machining path information MP#3) corresponding to the state shown in FIG. 10(c). Then, the control device 3 controls the X scanning mirror 1342X and the Y scanning mirror 1342Y using the galvanometer controller 1343 based on the machining path information MP#3. As a result, the incident position of the machining light EL incident from the galvanometer mirror 1342 on the objective optical system 135 is aligned with the arrow Def3.

[0159] The operation of the control device 3 described above will be further explained with reference to the flowchart in Fig. 14. The control device 3 acquires the processing pattern PT (step S201). The control device 3 generates a plurality of pieces of processing path information (corresponding to a plurality of processing patterns) corresponding to a plurality of rotation angles of the second head housing 137 based on the processing pattern PT acquired in the processing of step S201 (step S202). Thereafter, the control device 3 transmits the plurality of pieces of processing path information to the control device 3 of the processing device 1 (step S203).

[0160] (4) Modifications (4-1) First Modification A first modification of the machining system SYS will be described with reference to Fig. 15. Fig. 15 is a conceptual diagram showing the concept of machining according to the modification.

[0161] In the embodiment described above, the control device 3 controls at least one of the head drive system 14 of the processing device 1 and the stage drive system 23 of the stage device 2, and positions the second head housing 137 so that the rotation axis of the second head housing 137 (in other words, the optical axis AX) approaches, or more specifically, so that they coincide with, the central axis of the cylindrical workpiece W. In other words, when a cross section of the workpiece W cut along a plane (e.g., the XY plane) intersecting the rotation axis of the second head housing 137 (in other words, the optical axis AX) has an arc shape surrounding the second head housing 137, the second head housing 137 is positioned so that a point at a certain distance from any part of the arc shape approaches, or more specifically, so that they coincide with, the rotation axis of the second head housing 137.

[0162] However, as shown in Figure 15, if the size of the cylindrical workpiece W is significantly larger than the size of the second head housing 137, when the second head housing 137 is positioned so that the rotation axis of the second head housing 137 coincides with the central axis of the workpiece W, the distance from the second head housing 137 to the inner wall surface Wsw of the workpiece W becomes relatively long.

[0163] If the distance from the second head housing 137 to the inner wall surface Wsw of the workpiece W becomes relatively long, the power of the processing light EL at the inner wall surface Wsw may decrease. As a result, the inner wall surface Wsw of the workpiece W may not be properly processed due to the decrease in the power of the processing light EL at the inner wall surface Wsw.

[0164] Therefore, the control device 3 may control at least one of the head drive system 14 of the processing device 1 and the stage drive system 23 of the stage device 2 so as to shorten the distance between the second head housing 137 and the inner wall surface Wsw of the workpiece W. As a result, the second head housing 137 may be moved to the position indicated by the symbol 137a in FIG.

[0165] In this case, the control device 3 may control at least one of the head drive system 14 and the stage drive system 23 to move the second head housing 137a and the workpiece W relatively so that the second head housing 137a is aligned with the inner wall surface Wsw of the workpiece W. In other words, because the inner wall surface Wsw of the workpiece W is cylindrical, the control device 3 controls at least one of the head drive system 14 and the stage drive system 23 so that, in a plane perpendicular to the optical axis AX, the housing drive system 138 makes one revolution of the second head housing 137a, while the housing drive system 138 makes one revolution, the second head housing 137a makes one revolution in an orbit spaced a certain distance apart from the optical axis AX.

[0166] With this configuration, the power of the processing light EL on the inner wall surface Wsw of the workpiece W can be made suitable for processing the inner wall surface Wsw.

[0167] (4-2) Second Modification A second modification of the machining system SYS will be described with reference to Fig. 16. Fig. 16 is a cross-sectional view showing the optical path of the machining light irradiated onto the workpiece via the fθ lens and the mirror. The machining system SYS according to the second modification may include an objective optical system 135a instead of the above-described objective optical system 135.

[0168] 16, the objective optical system 135a may have a shape-changing optical system 1353 in addition to the fθ lens 1351 and the mirror 1352. As shown in Fig. 16, the shape-changing optical system 1353 is arranged on the optical path of the processing light EL (and further, the measurement light ML). Specifically, the shape-changing optical system 1353 is arranged on the workpiece W side of the reflecting surface 13521 of the mirror 1352 in the optical path of the processing light EL (and further, the measurement light ML) (downstream of the mirror 1352 (reflecting surface 13521) in the traveling direction of the processing light EL).

[0169] The shape-changing optical system 1353 is an optical element capable of changing the spot shape of the processing light EL (and further, the measurement light ML). For example, the shape-changing optical system 1353 may change the cross-sectional shape of the processing light EL so that the spot shape of the processing light EL on the surface (inner wall surface Wsw) of the workpiece W becomes a desired shape. In other words, the shape-changing optical system 1353 may change the spot shape of the processing light EL, which may change depending on the incident position of the processing light EL on the reflecting surface 13521, so that it becomes a desired shape regardless of the incident position of the processing light EL on the reflecting surface 13521. For this reason, the shape-changing optical system 1353 may be referred to as a beam shape changing device.

[0170] The processing system SYS according to the second modified example does not need to include the shape-changing optical system 1341 (FIG. 3) described above.

[0171] (5) Correction (5-1) Shift Misalignment Correction For example, as shown in FIG. 17( a), the optical axis AX of the processing light EL may be misaligned with the rotation axis RX of the second head housing 137. When the processing light EL is used to process the inner wall surface Wsw of the workpiece W while the housing drive system 138 rotates the second head housing 137, the misalignment between the optical axis AX and the rotation axis RX causes the irradiation position of the processing light EL on the inner wall surface Wsw to deviate from the intended irradiation position. As a result, the annular area EA (see FIG. 5) of the inner wall surface Wsw, which is formed by multiple processing patterns PT and processed using the processing light EL, will meander as shown in FIG. 17( b).

[0172] Correction of the misalignment between the optical axis AX and the rotation axis RX (so-called shift misalignment) may be performed, for example, as described below. Here, the machining system SYS may be a machining system SYSa shown in FIG. 18 that includes an imaging device 6 for measuring the workpiece W machined by the processing light EL. An example of the imaging device 6 is a three-dimensional (3D) scanner. In the machining system SYSa, the machining device 1, the stage device 2, and the imaging device 6 may be housed in a housing 4. However, the machining device 1, the stage device 2, and the imaging device 6 do not have to be housed in the housing 4. In other words, the machining system SYSa does not have to include a housing 4 that houses the machining device 1, the stage device 2, and the imaging device 6.

[0173] The control device 3 may control the machining device 1 to machine a test object corresponding to the workpiece W. Next, the control device 3 may control the imaging device 6 to measure the machined test object. The control device 3 may identify, for example, the amount of deviation in the Z-axis direction of the machining pattern PT based on the measurement results (image data) of the imaging device 6. Specifically, the control device 3 may identify the amount of deviation ΔZ in the Z-axis direction of the machining patterns located at the upper and lower ends.

[0174] The deviation ΔZ of the machining pattern PT in the Z-axis direction is correlated (proportional) to the deviation between the optical axis AX and the rotation axis RX. The control device 3 (arithmetic device 31) may calculate a first offset value for correcting a control value for at least one of the X-scanning mirror 1342X and the Y-scanning mirror 1342Y of the galvanometer mirror 1342 based on the deviation of the machining pattern PT in the Z-axis direction. Here, the first offset value is an offset value for correcting the irradiation position of the machining light EL on the surface (inner wall surface Wsw) of the workpiece W due to the deviation between the optical axis AX and the rotation axis RX.

[0175] The control device 3 may transmit the first offset value to the control device 3 of the processing device 1. For example, the control device 3 may add the first offset value to a control value related to at least one of the X scanning mirror 1342X and the Y scanning mirror 1342Y of the galvanometer mirror 1342. Then, the control device 3 may control the galvanometer mirror 1342 with the control value to which the first offset value has been added.

[0176] The calculation of the first offset value may be performed before the machining system SYSa machines the workpiece W. For example, the control device 3 may store the first offset value calculated in advance in the storage device 32. Then, the control device 3 may use the first offset value stored in the storage device 32 to correct a control value related to at least one of the X scanning mirror 1342X and the Y scanning mirror 1342Y, and control the galvanometer mirror 1342.

[0177] Incidentally, the misalignment between the optical axis AX and the rotation axis RX may also be referred to as axial eccentricity. As described above, the first offset value is an offset value for correcting the irradiation position of the processing light EL on the surface (inner wall surface Wsw) of the workpiece W due to the misalignment between the optical axis AX and the rotation axis RX. Therefore, the first offset value can be considered to be information regarding axial eccentricity. Furthermore, storing the first offset value in the storage device 32 can be considered to be the control device 3 retaining information regarding axial eccentricity. Therefore, the control device 3 correcting the control value for at least one of the X scanning mirror 1342X and the Y scanning mirror 1342Y using the first offset value stored in the storage device 32 to control the galvanometer mirror 1342 can be considered to be the control device 3 correcting the control value for at least one of the X scanning mirror 1342X and the Y scanning mirror 1342Y based on the information regarding axial eccentricity that has been stored in advance, and controlling the galvanometer mirror 1342.

[0178] (5-2) Tilt Misalignment Correction For example, as shown in FIG. 19 , the rotation axis RX of the second head housing 137 may be tilted relative to the optical axis AX of the processing light EL. When the housing drive system 138 rotates the second head housing 137 and processes the inner wall surface Wsw of the workpiece W with the processing light EL, the tilt of the rotation axis RX relative to the optical axis AX (the angle between the rotation axis RX and the optical axis AX is β) causes the irradiation position of the processing light EL on the inner wall surface Wsw to deviate from the intended irradiation position and also causes the irradiation area to deform. As a result, the annular area EA (see FIG. 5 ) of the inner wall surface Wsw, which is composed of multiple processing patterns processed using the processing light EL, becomes distorted and meandering, as shown in FIG. 19( b). Specifically, the area EA meanders in the Z direction, and the processing pattern located at the top end and the processing pattern located at the bottom end only change processing positions from the original irradiation, and the processing pattern located between the top and bottom ends rotates by a maximum of +β degrees on one side of the top end and a maximum of -β degrees on the other side of the top end. More specifically, the part located on one side of the top end, which is located at the original irradiation position, rotates by a maximum of +β degrees clockwise, and the part located on the other side of the top end rotates by a maximum of -β degrees counterclockwise.

[0179] The deviation caused by the inclination of the rotation axis RX with respect to the optical axis AX (so-called tilt deviation) may be corrected, for example, as described below. Here, the machining system SYS may be the machining system SYSa shown in FIG.

[0180] The control device 3 may control the machining device 1 to machine a test object corresponding to the workpiece W. Next, the control device 3 may control the imaging device 6 to measure the machined test object. The control device 3 may identify, for example, the amount of deviation of the machining pattern in the Z-axis direction based on the measurement results (image data) of the imaging device 6. Specifically, the control device 3 may identify the amount of deviation ΔZ of the machining patterns located at the upper and lower ends in the Z-axis direction and whether or not the machining pattern is rotated.

[0181] The deviation amount ΔZ of the machining pattern in the Z-axis direction is correlated (proportional) to the maximum value of the tilt of the rotation axis RX with respect to the optical axis AX. When the machining pattern is rotating, the control device 3 (arithmetic device 31) may calculate a second offset value for correcting the control value for at least one of the X scanning mirror 1342X and the Y scanning mirror 1342Y of the galvanometer mirror 1342 based on the deviation amount of the machining pattern in the Z-axis direction. Here, the second offset value is an offset value for correcting the irradiation position of the machining light EL on the surface (inner wall surface Wsw) of the workpiece W due to the tilt of the rotation axis RX with respect to the optical axis AX.

[0182] The control device 3 may transmit the second offset value to the control device 3 of the processing device 1. For example, the control device 3 may add the second offset value to a control value for at least one of the X scanning mirror 1342X and the Y scanning mirror 1342Y of the galvanometer mirror 1342. Then, the control device 3 may control the galvanometer mirror 1342 with the control value to which the second offset value has been added.

[0183] The calculation of the second offset value may be performed before the machining system SYSa machines the workpiece W. For example, the control device 3 may store the second offset value calculated in advance in the storage device 32. Then, the control device 3 may use the second offset value stored in the storage device 32 to correct the control value for at least one of the X scanning mirror 1342X and the Y scanning mirror 1342Y, and control the galvanometer mirror 1342.

[0184] Here, correcting the control value for at least one of the X scanning mirror 1342X and the Y scanning mirror 1342Y using the second offset value can be considered equivalent to correcting the tilt of the rotation axis RX with respect to the optical axis AX. Therefore, it can be said that the control device 3 corrects the tilt of the rotation axis RX with respect to the optical axis AX. In this case, the control device 3 may be referred to as a correction device.

[0185] The control device 3 may use the first offset value and the second offset value to correct a control value for at least one of the X scanning mirror 1342X and the Y scanning mirror 1342Y, and control the galvanometer mirror 1342. In other words, the control device 3 may correct both a shift in the irradiation position of the processing light EL on the surface of the workpiece W caused by a misalignment between the optical axis AX and the rotation axis RX, and a shift in the irradiation position of the processing light EL on the surface of the workpiece W caused by an inclination of the rotation axis RX with respect to the optical axis AX.

[0186] The above-described embodiments and modifications can be combined as appropriate. The present invention is not limited to the above-described embodiments, and can be modified as appropriate within the scope of the claims and the gist or concept of the invention as can be read from the entire specification. The machining system, control method, and computer program that incorporate such modifications are also included in the technical scope of the present invention.

[0187] REFERENCE SIGNS LIST 1 Processing device 2 Stage device 3 Control device 13 Processing head 14 Head drive system 22 Stage 23 Stage drive system 134 State control optical system 135, 135a Objective optical system 137 Second head housing 138 Housing drive system 1342 Galvanometer mirror 1351 fθ lens 1352 Mirror SYS, SYSa Processing system

Claims

1. A processing system for processing an object with an energy beam, comprising: a deflection device capable of changing the direction of travel of the energy beam; a reflection device having a reflective surface that reflects the energy beam that has passed through the deflection device toward the object; a support device to which the reflection device is attached; and a control device that controls the deflection device based on the attitude of the support device, which is rotatable around an axis that intersects with the reflective surface.

2. The processing system according to claim 1, wherein the orientation includes a position that the support device can take when rotated around the axis.

3. The processing system according to claim 1 or 2, wherein the control device controls the deflection device using a correction value according to the rotation phase around the axis of the support device that assumes the posture.

4. A processing system for processing an object with an energy beam, comprising: a deflection device capable of changing the direction of travel of the energy beam; a reflection device having a reflective surface that reflects the energy beam that has passed through the deflection device toward the object; a support device to which the reflection device is attached; and a control device that controls the deflection device based on the amount of displacement of the support device, which is rotatable about an axis that intersects with the reflective surface, when the energy beam is incident on the reflective surface of the reflection device attached to the support device.

5. The processing system according to claim 4, wherein the displacement amount includes a change in position of the support device rotated around the axis.

6. A processing system according to any one of claims 1 to 5, wherein the support device is rotatable relative to the deflection device around the axis.

7. A processing system according to any one of claims 1 to 6, comprising at least one optical element including the reflecting device, between the deflecting device and the object, along which the energy beam travels, and wherein only the reflecting device is rotatable around the axis together with the supporting device.

8. The processing system according to any one of claims 1 to 7, further comprising a plurality of optical elements including the reflecting device, along a path of the energy beam from the deflection device to the object, the plurality of optical elements including an fθ lens, the axis of which coincides with the optical axis of the fθ lens.

9. A processing system as described in claim 8, wherein the deflection device changes the direction of travel, thereby enabling the position of the energy beam incident on the fθ lens to be moved along a plane intersecting the optical axis of the fθ lens, parallel to the optical axis.

10. The processing system described in claim 8, wherein the deflection device is controlled so that when the reflecting device is in a first position around the axis, the position of the energy beam incident on the fθ lens moves along a first orthogonal axis that perpendicularly intersects the optical axis of the fθ lens, and when the reflecting device is in a second position around the axis, the position of the energy beam incident on the fθ lens moves along a second orthogonal axis different from the first orthogonal axis that perpendicularly intersects the optical axis of the fθ lens.

11. The control device controls the deflection device around the axis (i) when the reflection device is in a first position, so that a first region on the surface of the object is processed by moving the irradiation position of the energy beam on the surface of the object, and (ii) when the reflection device is in a second position, so that a second region on the surface of the object, which is different from the first region, is processed by moving the irradiation position of the energy beam on the surface of the object, and the processing forms the same pattern in the first region and the second region. A processing system as described in any one of claims 1 to 10.

12. The processing system described in claim 11, wherein the control device controls the deflection device so that: (i) when the reflection device is in the first position, the incident position of the energy beam on the reflection surface is scanned along a first line; and (ii) when the reflection device is in the second position, the irradiation position of the energy beam on the reflection surface is scanned along a second line different from the first line.

13. A processing system as described in claim 1 or 11, wherein the control device controls the deflection device so that the incident position of the energy beam on the reflecting surface is the same when (i) the reflecting device is in a first position and when (ii) the reflecting device is in a second position.

14. The processing system described in any one of claims 1 to 10, wherein the control device controls the deflection device to scan the energy beam over a first region on the surface of the object while the rotation phase of the reflection device about the axis is set to a first phase, in order to process the first region, and controls a drive device that rotates the support device to change the rotation phase of the reflection device about the axis from the first phase to a second phase after processing the first region, and controls the deflection device to scan the energy beam over the second region while the rotation phase of the reflection device about the axis is set to the second phase, in order to process a second region adjacent to the first region on the surface of the object.

15. A processing system according to any one of claims 1 to 14, further comprising a detection device capable of detecting the rotation phase of the support device around the axis, and the control device controls the deflection device based on the output of the detection device.

16. A processing system according to any one of claims 1 to 15, wherein the support device extends in a direction along the axis and holds the energy beam so that it is incident on the reflecting device.

17. The processing system according to claim 16, wherein the support device is configured to allow the energy beam to travel in a direction along the axis.

18. A processing system according to claim 16 or 17, wherein one end of the support device is connected to a drive device that can rotate the support device in the direction along the axis, and the other end holds the reflecting device.

19. A processing system described in any one of claims 1 to 18, wherein the deflection device changes the cross-sectional shape of the energy beam incident on the reflecting surface to a first cross-sectional shape when the support device is in a first position, and changes the cross-sectional shape of the energy beam incident on the reflecting surface to a second cross-sectional shape different from the first cross-sectional shape when the support device is in a second position different from the first position.

20. The processing system described in claim 19, wherein the reflecting device reflects the energy beam having the first cross-sectional shape to form a third cross-sectional shape different from the first cross-sectional shape, and reflects the energy beam having the second cross-sectional shape to form a fourth cross-sectional shape different from the second cross-sectional shape.

21. The processing system according to any one of claims 1 to 20, wherein the deflection device comprises a galvanometer mirror.

22. A processing system according to any one of claims 1 to 21, further comprising a position changing device that displaces the support device in a direction perpendicular to the axis.

23. A processing system as described in claim 22, wherein when the surface of the object is arc-shaped surrounding the support device in a cross section perpendicular to the axis, the position changing device displaces the position of the support device so that a point at a fixed distance from any part of the arc shape approaches the rotation axis of the support device.

24. The processing system according to claim 22 or 23, wherein the position changing device is capable of displacing the support device in the direction in which the axis extends.

25. The processing system according to any one of claims 1 to 24, further comprising a measurement device that irradiates the object with measurement light and measures information relating to the distance between the reflecting surface and the object based on the light generated by the object.

26. The processing system according to claim 25, wherein the measurement device irradiates the object with the measurement light that has passed through the deflection device and the reflection device, and measures information relating to the distance between the reflection device and the object based on the light generated by the object and received via the reflection device and the deflection device.

27. A processing system according to claim 25 or 26, further comprising a position change device that displaces the support device in a direction perpendicular to the axis, and the position change device displaces the position of the support device based on the measurement results of the measurement device.

28. A processing system as described in any one of claims 1 to 27, further comprising: an imaging device that images the object processed by irradiating it with the energy beam; and a correction device that corrects the inclination of the axis with respect to the direction of travel of light incident on the reflecting surface based on image data captured by the imaging device.

29. A processing system for processing an object with an energy beam, comprising: a deflection device capable of changing the direction of travel of the energy beam; a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object; a drive device that can rotate the reflection device around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface; and a control device that controls the deflection device based on the positions that the reflection device can take when rotated around the axis.

30. The processing system according to claim 29, wherein the control device controls the deflection device using a correction value according to the rotation phase around the axis at the reflection device at the position.

31. A processing system for processing an object with an energy beam, comprising: a deflection device capable of changing the direction of travel of the energy beam; a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object; a drive device that can rotate the reflection device around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface; and a control device that controls the deflection device based on the amount of displacement of the reflection device.

32. The processing system according to claim 31, wherein the displacement amount includes a change in position of the support device rotated about the axis.

33. A processing system according to any one of claims 29 to 32, further comprising a detection device capable of detecting the rotation phase of the reflecting device around the axis, and the control device controls the deflection device based on the output of the detection device.

34. A processing system according to any one of claims 29 to 33, further comprising a plurality of optical elements including the reflecting device along which the energy beam travels from the deflecting device to the object, the plurality of optical elements including an fθ lens, and the axis coincides with the optical axis of the fθ lens.

35. A processing system according to claim 34, wherein the deflection device is capable of moving the position of the energy beam incident on the fθ lens within a plane perpendicular to the optical axis of the fθ lens.

36. A processing system described in any one of claims 29 to 35, wherein the deflection device changes the cross-sectional shape of the energy beam incident on the reflecting surface to a first cross-sectional shape when the rotation phase of the reflecting device about the axis is a first phase, and changes the cross-sectional shape of the energy beam incident on the reflecting surface to a second cross-sectional shape different from the first cross-sectional shape when the rotation phase of the reflecting device about the axis is a second phase different from the first phase.

37. The processing system described in claim 36, wherein the reflecting device reflects the energy beam having the first cross-sectional shape to form a third cross-sectional shape different from the first cross-sectional shape, and reflects the energy beam having the second cross-sectional shape to form a fourth cross-sectional shape different from the second cross-sectional shape.

38. A processing system according to any one of claims 29 to 37, wherein the reflecting device is rotatable relative to the deflecting device about the axis.

39. A processing system according to any one of claims 29 to 38, wherein the deflection device comprises a galvanometer mirror.

40. A processing system according to any one of claims 29 to 39, comprising a position changing device that displaces the reflecting device in a direction perpendicular to the axis.

41. A processing system as described in claim 40, wherein when the surface of the object facing and surrounding the reflecting device is arc-shaped in a cross section perpendicular to the axis, the position changing device displaces the position of the reflecting device so that the rotation axis of the reflecting device approaches a point that is a fixed distance from any part of the arc.

42. A processing system according to claim 40 or 41, wherein the position changing device is capable of displacing the reflecting device in the direction in which the axis extends.

43. The processing system according to any one of claims 29 to 42, further comprising a measurement device that irradiates the object with measurement light and measures information relating to the distance between the reflecting device and the object based on the light generated by the object.

44. The processing system according to claim 43, wherein the measurement device irradiates the object with the measurement light that has passed through the deflection device and the reflection device, and measures information relating to the distance between the reflection device and the object based on the light generated by the object and detected via the reflection device and the deflection device.

45. A processing system according to claim 43 or 44, further comprising a position change device that displaces the reflecting device in a direction perpendicular to the axis, and the position change device displaces the position of the reflecting device based on the measurement results of the measurement device.

46. ​​A processing system according to any one of claims 29 to 45, further comprising: an imaging device that images the object processed by irradiating it with the energy beam; and a correction device that corrects the tilt of the axis based on image data captured by the imaging device.

47. A control method for controlling a processing system comprising: a deflection device capable of changing the direction of travel of an energy beam for processing an object; a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object; and a support device to which the reflection device is attached, wherein the support device is rotatable around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface, the control method controlling the deflection device based on the attitude of the support device.

48. A control method according to claim 47, further comprising controlling the deflection device using a correction value according to the rotation phase around the axis of the support device that assumes the attitude.

49. A control method as described in claim 48, comprising controlling the deflection device to scan the energy beam over a first region on the surface of the object while the rotation phase of the support device about the axis is set to a first phase, in order to process the first region; controlling a drive device that rotates the support device to rotate the rotation phase of the support device about the axis from the first phase to a second phase after processing the first region; and controlling the deflection device to scan the energy beam over the second region while the rotation phase of the support device about the axis is set to the second phase, in order to process a second region adjacent to the first region on the surface of the object.

50. A control method according to any one of claims 47 to 49, wherein the correction value is a plurality of values ​​according to the rotation phase of the support device about the axis.

51. A control method for controlling a processing system comprising a deflection device capable of changing the direction of travel of an energy beam for processing an object, and a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object, wherein the reflection device is rotatable around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface, the control method controlling the deflection device based on the amount of displacement of the reflection device.

52. The control method of claim 51, wherein the displacement amount includes a change in position of the support device rotated about the axis.

53. A control method according to any one of claims 47 to 52, wherein the deflection device is controlled using the rotation phase of the reflecting device about the axis obtained from a detection device provided in the processing system.

54. A control method according to any one of claims 47 to 53, wherein the deflection device performs control such that when the support device is in a first position, the cross-sectional shape of the energy beam incident on the reflecting surface is a first cross-sectional shape, and when the support device is in a second position different from the first position, the cross-sectional shape of the energy beam incident on the reflecting surface is a second cross-sectional shape different from the first cross-sectional shape.

55. A control method according to any one of claims 47 to 54, wherein the rotation phase of the reflecting device around the axis is calculated based on an input to a drive device provided in the processing system that rotates the reflecting device, and the deflection device is controlled.

56. A control method according to any one of claims 47 to 55, wherein a position changing device provided in the processing system displaces the position of the support device so that, when the surface of the object facing and surrounding the support device is arc-shaped in a cross section perpendicular to the axis, a point at a fixed distance from any part of the arc-shaped surface approaches the rotation axis of the support device.

57. A control method according to any one of claims 47 to 56, wherein a position change device provided in the processing system displaces the position of the support device in a direction perpendicular to the axis based on the measurement results of a measurement device provided in the processing system that irradiates measurement light onto the object and measures information regarding the distance between the reflecting device and the object based on the light generated by the object.

58. A computer program for carrying out the control method according to any one of claims 47 to 57.

59. A control method for controlling a processing system comprising a deflection device capable of changing the direction of travel of an energy beam for processing an object, and a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object, wherein the reflection device is rotatable around an axis intersecting the reflection surface while the energy beam is incident on the reflection surface, and wherein the control method controls the deflection device based on the positions that the reflection device can take when rotated around the axis.

60. A control method according to claim 59, wherein the deflection device is controlled using a correction value according to the rotation phase around the axis of the reflecting device at the position.

61. A control method as described in claim 60, comprising controlling the deflection device to scan the energy beam over a first region on the surface of the object while the rotation phase of the reflection device about the axis is set to a first phase, in order to process the first region; controlling a drive device that rotates the support device to change the rotation phase of the reflection device about the axis from the first phase to a second phase after processing the first region; and controlling the deflection device to scan the energy beam over the second region while the rotation phase of the reflection device about the axis is set to the second phase, in order to process a second region adjacent to the first region on the surface of the object.

62. A control method according to any one of claims 59 to 61, wherein the correction value is a plurality of values ​​according to the rotation phase of the reflecting device about the axis.

63. A control method for controlling a processing system comprising a deflection device capable of changing the direction of travel of an energy beam for processing an object, and a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object, wherein the reflection device is rotatable around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface, the control method controlling the deflection device based on the amount of displacement of the reflection device.

64. The control method of claim 63, wherein the displacement amount includes a change in position of the support device rotated about the axis.

65. A control method according to any one of claims 59 to 64, wherein the deflection device is controlled using the rotation phase of the reflecting device about the axis obtained from a detection device provided in the processing system.

66. A control method according to any one of claims 59 to 65, wherein the deflection device performs control so that when the reflecting device is in a first position, the cross-sectional shape of the energy beam incident on the reflecting surface is a first cross-sectional shape, and when the reflecting device is in a second position different from the first position, the cross-sectional shape of the energy beam incident on the reflecting surface is a second cross-sectional shape different from the first cross-sectional shape.

67. A control method according to any one of claims 59 to 66, wherein the rotation phase of the reflecting device around the axis is calculated based on an input to a drive device provided in the processing system that rotates the reflecting device, and the deflection device is controlled.

68. A control method described in any one of claims 59 to 67, wherein a position changing device provided in the processing system displaces the position of the reflecting device so that, when the surface of the object facing and surrounding the reflecting device is arc-shaped, a point that is a certain distance from any part of the arc-shaped surface approaches the rotation axis of the reflecting device.

69. A control method according to any one of claims 59 to 68, wherein a position change device provided in the processing system displaces the position of the reflecting device in a direction perpendicular to the axis based on the measurement results of a measuring device provided in the processing system that irradiates measuring light onto the object and measures information regarding the distance between the reflecting device and the object based on the light generated by the object.

70. A computer program for carrying out the control method according to any one of claims 59 to 69.

71. A computer program capable of controlling a processing system comprising: a deflection device capable of changing the direction of travel of an energy beam for processing an object; a reflection device having a reflection surface that reflects the energy beam that has passed through the deflection device toward the object; and a support device to which the reflection device is attached, wherein the support device is rotatable around an axis that intersects with the reflection surface while the energy beam is incident on the reflection surface, the computer program generating control information for the deflection device based on the attitude of the support device.

72. A computer program capable of controlling a processing system comprising a deflector capable of changing the direction of travel of an energy beam for processing an object, and a reflector having a reflecting surface that reflects the energy beam that has passed through the deflector toward the object, wherein the reflector can rotate around an axis that intersects with the reflecting surface while the energy beam is incident on the reflecting surface, and which generates control information for the deflector based on the positions that the reflector can assume when rotated around the axis.

Images