Chip vacuum pickup tool

Abstract

The present invention provides a chip vacuum pickup tool (1) that ensures holding force even when picking up a thin and large semiconductor chip (C), and without applying stress that may damage the semiconductor chip (C). Specifically, the present invention provides a chip vacuum pickup tool (1) comprising: a collet (30) having a flat portion (33) that adheres closely to a semiconductor chip (C) and provided with a vacuum suction hole (31) in the flat portion (33), and a holder (20) that holds the collet (30), wherein the holder (20) has a protruding portion (20) provided with a through hole (21) connected to the vacuum suction hole (31) on the surface that holds the collet (30) and a side wall (23) that adheres closely to the perimeter of the collet (30), and a recessed portion (32) that fits with the protruding portion (20) of the holder (20) is formed in the collet (30).

Description

Chip suction tool

[0001] The present invention relates to a chip suction tool used when picking up a semiconductor chip.

[0002] When picking up semiconductor chips obtained by dividing a wafer attached to a dicing tape, a needle pushes up the semiconductor chip from the back side of the dicing tape, and a chip suction tool suctions and holds it (see, for example, Patent Document 1). The chip suction tool used in this case generally has a configuration in which a collet made of an elastic body with a chip suction surface is fixed to a metal holder.

[0003] FIG. 11 shows a representative example of such a chip suction tool, with FIG. 11(a) being a view from the chip suction surface that holds the semiconductor chip, and FIG. 11(b) being a cross-sectional view taken along line A-A in FIG. 11(a). The chip suction tool 1000 of FIG. 11 has the collet 3 shown in FIG. 12 fixed to the holder 2000 shown in FIG. 13. Here, FIG. 12(a) is a view from the chip suction surface, and FIG. 12(b) is a cross-sectional view taken along line A-A in FIG. 12(a). Also, FIG. 13(a) is a view from the side that holds the collet, and FIG. 13(b) is a cross-sectional view taken along line A-A in FIG. 13(a). Note that in FIG. 13, the holder body 20 and the protrusions 22 are depicted with different fill patterns for convenience in order to distinguish them from each other, but they do not necessarily need to be made of different materials; they are generally integrally molded from the same material.

[0004] 11, the protrusion 220 of the holder 2000 is fitted into the recess 32 of the collet 3. Here, by making the recess 32 shown in FIG. 12 slightly smaller than the protrusion 220 shown in FIG. 13, when fitted, the elasticity of the collet 3 causes the inner surface of the recess 32 to adhere tightly to the outer periphery of the protrusion 220, and the collet 3 is fixed to the holder 2000.

[0005] As shown in FIG. 11, when the collet 3 is fixed to the holder 2000, the through-hole 21 provided to penetrate the protrusion 220 and the holder body 20 is connected to the suction hole 31 of the collet 3.

[0006] Incidentally, for the sake of simplicity, the collet 3 shown in Figure 12 only has suction holes 31 on the flat surface 33, but grooves are often used to attract a wide area of ​​the semiconductor chip C. As an example, Figure 14 shows a collet 300 with grooves formed along diagonal lines. Here, Figure 14(a) is a view of the collet 300 as seen from the chip suction surface side, and Figure 14(b) is a cross-sectional view taken along line A-A in Figure 14(a). Hereinafter, when describing the collet 3, collets with grooves such as collet 300 also apply.

[0007] As described above, in the chip suction tool 1000 shown in Figure 11, the suction holes 31 and through holes 21 are connected, and the outer periphery of the protrusion 32 is sealed with an elastic body. Therefore, by connecting the through holes 21 to a decompression system, it is possible to suck in the semiconductor chip that is in close contact with the flat portion 33. This makes it possible to suck and hold the semiconductor chip C as shown in Figure 15. In other words, it is possible to receive the semiconductor chip C that has been pushed up from the dicing sheet.

[0008] However, as mentioned above, the size (design dimensions) of the recess 32 is smaller than the protrusion 220, making it difficult to achieve a secure fit. This can result in an incomplete fit, as shown in FIG. 16( a). If an attempt is made to suction a semiconductor chip C in this state, the cross section will be boat-shaped, i.e., a dent will occur near the suction hole 31 in the flat portion 33, as shown in FIG. 16( b). As a result, stress is applied to the semiconductor chip C being suction-held, which can cause deformation and cracks or breakage in the case of a thin semiconductor chip. Even if no cracks or breakage occur, the function of the semiconductor element may be impaired.

[0009] On the other hand, a chip suction tool for suction-holding a thin semiconductor chip has a configuration as shown in Fig. 17 (Patent Document 2). The chip suction tool 1001 in Fig. 17 is configured by fitting a collet 3001 shown in Fig. 18 into (between side walls 23 of) a holder 2001 shown in Fig. 19, and the design dimensions lx and ly of the collet 3001 are slightly larger than the Lx and Ly of the holder 2001, so that the chip is fixed by elastic force.

[0010] In the case of the chip suction tool 1001 of FIG. 17, the cross section does not deform into a boat shape as shown in FIG. 16(b), and it is possible to hold a thin semiconductor chip without deformation.

[0011] JP 2017-130499 A JP 2006-161588 A

[0012] Recently, as electronic devices continue to become smaller, there is a trend toward incorporating multiple functions into a single semiconductor chip to achieve overall miniaturization. As a result, the number of large-sized semiconductor chips is also increasing. Meanwhile, thickness is also trending toward thinner chips. Therefore, chip suction tools that can accommodate thin and large semiconductor chips are required. Here, the chip suction tool shown in FIG. 11 is not suitable for thin semiconductor chips. Due to leakage, attempts were made to pick up thin and large semiconductor chips using the chip suction tool shown in FIG. 17, but there were occasions when the tool was unable to suction and hold the chips, particularly when picking them up from dicing tape. In other words, it was found that there were cases where the suction force was insufficient to hold the large semiconductor chips.

[0013] 20, a small gap occurs at the surface where the collet 3001 and the chip suction tool 2001 come into close contact, and due to a small leak (where leaks LW0 and LW1 become inflow OM0), it is not possible to sufficiently reduce the pressure inside the suction hole 31, and it is not possible to ensure a suction force sufficient to hold the large semiconductor chip C. The present invention has been made in view of the above problems, and provides a chip suction tool that ensures a holding force even when picking up a thin and large semiconductor chip, without applying stress that would damage the semiconductor chip.

[0014] In order to solve the above problem, the invention described in claim 1 is a chip suction tool used to suction and hold a semiconductor chip, comprising: a collet having a flat portion that comes into close contact with the semiconductor chip and having a suction hole formed in the flat portion; and a holder that holds the collet, wherein the holder has, on the surface that holds the collet, a protrusion with a through hole that communicates with the suction hole, and a side wall that comes into close contact with the periphery of the collet, and the collet is a chip suction tool formed with a recess that fits into the protrusion of the holder.

[0015] A second aspect of the present invention is the chip suction tool according to the first aspect, wherein the outer periphery of the protrusion of the holder and the inner periphery of the recess of the collet are not in close contact with each other, but a gap is formed.

[0016] The invention described in claim 3 is the chip suction tool described in claim 1, wherein a groove is formed along the inner periphery of the side wall on the surface of the holder that holds the collet.

[0017] A fourth aspect of the present invention is the chip suction tool according to any one of the first to third aspects, wherein the side wall of the holder surrounds the entire periphery of the collet.

[0018] A fifth aspect of the present invention is the chip suction tool according to any one of the first to third aspects, wherein the side wall of the holder is divided at a plurality of locations.

[0019] A sixth aspect of the present invention is the chip suction tool according to the fourth aspect, wherein the member forming the holder has higher rigidity than the collet.

[0020] A seventh aspect of the present invention is the chip suction tool according to the fifth aspect, wherein the member forming the holder has higher rigidity than the collet.

[0021] The invention described in claim 8 is a chip suction tool described in claim 7, wherein the shape of the surface of the collet that comes into close contact with the holder is rectangular, and the side walls are divided at the four corners of the rectangle.

[0022] A ninth aspect of the present invention is the chip suction tool according to the eighth aspect, wherein the opposing side walls have different rigidities.

[0023] According to the present invention, it is possible to pick up a thin and large semiconductor chip while ensuring a holding force and without applying stress that may damage the semiconductor chip.

[0024] 1A is a view of a chip suction tool according to a first embodiment of the present invention, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view of a collet constituting the chip suction tool according to the first embodiment of the present invention, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view of a holder constituting the chip suction tool according to the first embodiment of the present invention, as seen from the collet-holding side, and FIG. 1B is a cross-sectional view of a chip suction tool according to a first modified embodiment of the first embodiment of the present invention, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view of a holder constituting the chip suction tool according to a second modified embodiment of the first embodiment of the present invention, as seen from the collet-holding side, and FIG. 1B is a cross-sectional view of a chip suction tool according to a second modified embodiment of the first embodiment of the present invention, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view of a holder constituting the chip suction tool according to the second embodiment of the present invention, as seen from the collet-holding side, and FIG. 1B is a cross-sectional view of a chip suction tool according to the second embodiment of the present invention, as seen from the chip suction surface ... 1A is a view of a holder constituting a chip suction tool according to a modified example of a second embodiment of the present invention, as seen from the collet-holding side, and FIG. 1B is a cross-sectional view of the holder. FIG. 1A is a view of a chip suction tool according to a modified example of a second embodiment of the present invention, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view of the chip suction tool. FIG. 1B is a view of an example of a conventional chip suction tool, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view of the collet constituting a conventional chip suction tool. FIG. 1A is a view of an example of a holder constituting a conventional chip suction tool, as seen from the collet-holding side, and FIG. 1B is a cross-sectional view of the collet. FIG. 1B is a view of an example of a conventional chip suction tool, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view of the collet in which a groove is provided on the chip suction surface of the collet. FIG. 1C is a view of a semiconductor chip being held by an example of a conventional chip suction tool. FIG. 1C is a view of an example of a conventional chip suction tool, as seen from the collet-holding side, and FIG. 1B is a cross-sectional view of the chip suction tool. 1A and 1B are a view and a cross-sectional view of a collet constituting another example of a conventional chip suction tool, respectively, as viewed from the chip suction surface side.1A is a view of a holder constituting another example of a conventional chip suction tool, as seen from the side holding a collet, and FIG. 1B is a cross-sectional view thereof; FIG. 1A is a view of another example of a conventional chip suction tool, as seen from the side holding a collet, and FIG. 1B is a cross-sectional view thereof; and FIG. 1B is a view for explaining problems that arise in another example of a conventional chip suction tool.

[0025] An embodiment of the present invention will be described with reference to the drawings. Fig. 1 shows a chip suction tool 1 according to a first embodiment of the present invention, in which Fig. 1(a) is a view from the chip suction surface on the side holding a semiconductor chip, and Fig. 1(b) is a cross-sectional view taken along line A-A in Fig. 1(a).

[0026] The chip suction tool 1 of FIG. 1 has the collet 3 shown in FIG. 2 fixed to the holder 2 shown in FIG. 3. Here, FIG. 2(a) is a view of the collet 3 as seen from the chip suction surface side, and FIG. 2(b) is a cross-sectional view taken along line A-A in FIG. 2(a). Also, FIG. 3(a) is a view of the holder 2 as seen from the side holding the collet, and FIG. 3(b) is a cross-sectional view taken along line A-A in FIG. 3(a). Note that in FIG. 3, the holder main body 20, the protrusions 22, and the sidewalls 23 are conveniently depicted with different filled patterns to distinguish them, but they do not necessarily need to be made of different materials and are generally integrally molded from the same material.

[0027] The collet 3 is preferably made of an elastic material, such as natural or synthetic rubber, commonly known as rubber. The holder body 20, protrusions 22, and side walls 23 that make up the holder 2 are made of a material that is at least more rigid than the collet 3, and are generally selected from metals such as aluminum, titanium, and stainless steel, taking into consideration strength and weight, but are not limited to metals and may also be made of glass or ceramics.

[0028] The collet 3 constituting the chip suction tool 1 shown in FIG. 1 is basically the same as that shown in FIG. 12, and may also have a groove 34 provided in the flat portion 33, as in the collet 300 shown in FIG. 14.

[0029] On the other hand, the holder 2 has a protrusion 22 having a through-hole 21 penetrating the holder body 20 , and side walls 23 that sandwich the periphery of the collet 3 .

[0030] For this reason, although the chip suction tool 1 appears to be a simple combination of the chip suction tool 1000 shown in Figure 11 and the chip suction tool 1001 shown in Figure 17, the dimensional relationship between the protrusion 22 of the holder 2 and the recess 32 of the collet 3 is different from that of the chip suction tool 1000 shown in Figure 11.

[0031] Specifically, in the chip suction tool 1000 shown in FIG. 11 , the protrusion 220 of the holder 2000 is in close contact with the recess 32 of the collet 3, whereas in the chip suction tool 1, a gap is formed between the outer periphery of the protrusion 22 of the holder 2 and the inner periphery of the recess 32 of the collet 3. That is, the width D220 of the protrusion 220 of the holder 2000 is slightly larger (up to approximately 1000 μm) than the design dimension of the width D32 of the recess 32 of the collet 3, while the width D22 of the protrusion 22 of the holder 2 constituting the chip suction tool 1 is smaller than the design dimension of the width D32 of the recess 32. In this embodiment, the protrusion 22 is shaped like a rectangular prism. However, this is not necessarily required, although a polygonal shape is preferable. It is also preferable that the recess 32 be shaped to match the shape of the protrusion 22. The gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22 is preferably 0 μm to 200 μm, more preferably 100 μm or less. Here, a gap of 0 μm means that even if part of the outer periphery is in close contact, it is acceptable as long as there is a gap in other parts.

[0032] Because there is a gap between the inner surface of recess 32 and the outer periphery of protrusion 22, holder 2 cannot hold collet 3 with protrusion 22. For this reason, the design dimensions of lx and ly of collet 3 shown in Figure 2(a) are slightly larger (by 20 to 500 μm depending on the size of Lx and Ly) than Lx and Ly of holder 2 shown in Figure 3(a), so that collet 3 is fixed by elastic force.

[0033] 1B, the chip suction tool 1 configured as described above has a larger pressure loss from the leak LW0 or leak LW1 to the inflow OM1 than the chip suction tool 1001 shown in FIG. 17. Therefore, the inflow OM1 is extremely small, and the reduced pressure in the suction hole 31 ensures a suction force sufficient to hold a large semiconductor chip C. The reason why the gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22 is set to 200 μm or less (preferably 100 μm or less) is to ensure pressure loss.

[0034] Furthermore, because the chip suction tool 1 has a gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22, the periphery of the opening of the recess of the collet 3 can be tightly attached to the holder 2 when the collet 3 is fitted into the holder 2. This prevents the cross section from becoming boat-shaped as shown in Figure 16(b) when the semiconductor chip C is suctioned. In other words, no stress is generated that could deform and damage the semiconductor chip C.

[0035] In the chip suction tool 1 of the first embodiment shown in Figure 1, the surface of the collet 3 that comes into close contact with the holder 2 is rectangular, and side walls 23 are provided that surround this rectangle with the four corners cut off. However, in such an arrangement of side walls 23, it is also possible to provide a difference in rigidity between the side walls at opposing positions. An example of this is the chip suction tool 100, which is a first modification of the first embodiment shown in Figure 4. In the chip suction tool 100, the side wall 23S is made of a material with lower rigidity than the side wall 23H, and may be an elastic body such as rubber.

[0036] The chip suction tool 100 shown in Figure 4 is characterized in that it is relatively easy to fit the collet 3, and when force is applied perpendicularly to the surface formed by the flat portion 33, the side wall 23S absorbs the force applied in the lateral direction (X direction, Y direction) of the collet 3, thereby maintaining the flatness of the flat portion 33.

[0037] The holder 201 shown in Fig. 5 constitutes the chip suction tool 101, which is a second modification of the first embodiment shown in Fig. 6. The holder 201 is characterized in that a groove 24 is provided along the inner periphery of the side wall 23 of the surface that holds the collet 3, compared to the holder 2 in Fig. 3. By providing this groove 24, it is possible to prevent the outer periphery of the collet 3 from swelling up when the collet 3 is fitted into the holder 201 as shown in Fig. 6. In other words, when the holder main body 20 and the side wall 23 are integrally molded, it is possible to eliminate the influence of the R (so-called corner R) remaining in the corner formed by the inside of the side wall 23 and the surface of the holder main body 20.

[0038] The holder 202 shown in FIG. 7 constitutes the chip suction tool 102 according to a second embodiment of the present invention, shown in FIG. 8. Unlike the holder 2 shown in FIG. 3, the holder 202 shown in FIG. 7 has a side wall 230 that surrounds the entire periphery of the collet 3. Therefore, the chip suction tool 102 shown in FIG. 8 does not generate a leak at the bottom of the collet 3, but is limited to the leak LW1 shown in FIG. 8(b). This allows it to have a suction force greater than that of the chip suction tool 1 shown in FIG. 1. However, it is difficult to securely fit the collet 3 inside the side wall 230, and care must be taken because torsional stress may remain in the collet 3.

[0039] Furthermore, even in a configuration in which the side wall 230 covers the entire circumference of the collet 3, a rounded corner is likely to remain in the corner formed by the inside of the side wall 230 and the surface of the holder body 20. For this reason, it is desirable to use a chip suction tool 103 in which the collet 3 is fitted into a holder 203 in which a groove 240 is formed along the inner circumference of the side wall 230, as shown in Figure 9.

[0040] As described above, the various chip suction tools shown as embodiments of the present invention can pick up thin and large semiconductor chips while ensuring a sufficient holding force and without applying stress that could damage the semiconductor chips. This makes it possible to reliably pick up even thin and large semiconductor chips that are tightly attached to a dicing tape.

[0041] 1, 100, 101, 102, 103, 1000, 1001 Chip suction tool 2, 200, 201, 202, 203, 2000, 2001 Holder 3, 300, 3001 Collet 20 Holder body 21 Through hole 22, 220 Projection 23 Side wall 23H Elastic side wall 23S Rigid side wall 24 Groove 30 Elastic body 31 Suction hole 32 Recess 33 Flat portion 34 Groove 230 (Full circumference) side wall 240 (Full circumference) groove

Claims

1. A chip suction tool used to suction and hold a semiconductor chip, comprising: a collet having a flat portion that comes into close contact with the semiconductor chip and having a suction hole formed in the flat portion; and a holder that holds the collet, wherein the holder has, on the surface that holds the collet, a protrusion with a through hole that communicates with the suction hole, and a side wall that comes into close contact with the periphery of the collet, and the collet has a recess formed therein that fits into the protrusion of the holder.

2. A chip suction tool according to claim 1, wherein the outer periphery of the protrusion of the holder and the inner periphery of the recess of the collet do not come into close contact with each other, leaving a gap.

3. A chip suction tool according to claim 1, wherein a groove is formed along the inner periphery of the side wall on the surface of the holder that holds the collet.

4. A chip suction tool according to any one of claims 1 to 3, wherein the side wall of the holder surrounds the entire periphery of the collet.

5. A chip suction tool according to any one of claims 1 to 3, wherein the side wall of the holder is divided at a plurality of locations.

6. A chip suction tool according to claim 4, wherein the member forming the holder has higher rigidity than the collet.

7. A chip suction tool according to claim 5, wherein the member forming the holder has higher rigidity than the collet.

8. A chip suction tool according to claim 7, wherein the shape of the surface of the collet that comes into close contact with the holder is rectangular, and the side walls are divided at the four corners of the rectangle.

9. A chip suction tool according to claim 8, wherein the opposing side walls have different rigidities.

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