Substrate holding device

Abstract

Provided is a substrate holding device which enables a substrate to be securely suction-attached to a stage. Specifically, the substrate holding device 10 comprises: a stage 11 which has a flat surface 12 on which a substrate W1 is mounted and to which the substrate W1 can be suction-attached; a plurality of support pins 15 which are disposed in a portion 13 of the stage 11 having the flat surface 12 and which have a tip end on which the substrate W1 is mounted; a plurality of outer guide pins 18 which are disposed in a portion of the stage 11 around the flat surface 12; and a pressing member 25 which is capable of descending from a retracted position above the flat surface 12. The support pins 15 can be displaced between an upper position in which the tip end projects upward from the flat surface 12 and a lower position where the tip end is lower than the flat surface 12. The outer guide pins 18 are disposed so as to be capable of contacting the outer peripheral edge of the substrate W1, which is mounted on the support pins 15 displaced to the lower position, from a plurality of directions. The pressing member 25 descends from the retracted position and pushes the substrate W1 onto the flat surface 12.

Description

Substrate holding device

[0001] The present invention relates to a substrate holding device.

[0002] In manufacturing processes for various substrates, such as substrates for semiconductor wafers, display devices, and color filters, various processes, such as a coating process for applying a liquid to the substrate, are performed. In some cases, the processes are performed while the substrate is held on a stage. For example, Patent Document 1 discloses a coating apparatus for applying a liquid to a substrate. The coating apparatus includes a device for holding the substrate for the coating process.

[0003] JP 2012-69833 A

[0004] The device for holding a substrate has a stage on which the substrate is placed. The stage can hold the substrate along the flat surface (top surface) of the stage by adsorbing the substrate. Then, for example, a liquid ejected from a coating head of a coating device is applied to the top surface of the substrate. Here, if the substrate is warped (warped), even if the substrate is placed on the flat surface of the stage, it may not be able to be held securely.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a substrate holding device that can reliably hold a substrate on a stage by suction.

[0006] The substrate holding device of the present invention comprises a stage having a flat surface on which a substrate is placed and capable of adsorbing the substrate, a plurality of support pins arranged on the portion of the stage having the flat surface and having tips on which the substrate is placed, a plurality of outer guide pins arranged on the portion of the stage surrounding the flat surface, and a pressing member that can be lowered from a retracted position above the flat surface, wherein the support pins are displaceable between an upper position in which their tips protrude above the flat surface and a lower position in which their tips are below the flat surface, and the plurality of outer guide pins are arranged so that they can contact the outer edge of the substrate placed on the support pins that are displaced to the lower position from multiple directions, and the pressing member descends from the retracted position and presses the substrate against the flat surface while the support pins are in the lower position.

[0007] According to the substrate holding device of the present invention, even if the substrate is warped, the warp is corrected by the pressing member, and the stage sucks and holds the substrate. The substrate is securely sucked and held by the stage.

[0008] FIG. 1 is an explanatory diagram of a coating apparatus having a substrate holding device of the present invention. FIG. 2 is a plan view showing an example of the substrate holding device. FIG. 3 is a cross-sectional view of the substrate holding device shown in FIG. 1 when viewed from the side. FIG. 4 is an explanatory diagram of the operation of the substrate holding device. FIG. 5 is an explanatory diagram of the operation of the substrate holding device. FIG. 6 is an explanatory diagram of the operation of the substrate holding device. FIG. 7 is a plan view showing a state in which the substrate holding device holds a first substrate. FIG. 8 is a plan view showing a state in which the substrate holding device holds a second substrate. FIG. 9 is an explanatory diagram showing a state in which the second substrate is placed on a stage. FIG. 10 is an explanatory diagram showing a state in which the second substrate is pressed against a mounting surface by a second pressing member. FIG. 11A is an explanatory diagram of a convex portion of the first pressing member shown in FIGS. 2 and 3. FIG. 11B is an explanatory diagram showing a first modified convex portion. FIG. 11C is an explanatory diagram showing a second modified convex portion. FIG. 11D is an explanatory diagram showing a third modified convex portion. FIG. 12A is an explanatory diagram of a pressing member that can press a substrate over a wide range along the edge of the substrate. Fig. 12B is an explanatory diagram showing a first modified example of the pressing member. Fig. 12C is an explanatory diagram showing a second modified example of the pressing member. Fig. 12D is an explanatory diagram showing a third modified example of the pressing member. Fig. 13 is an explanatory diagram showing a state in which the pressing member presses the substrate against the stage.

[0009] <Outline of Embodiments of the Present Invention> The following is a list of outlines of embodiments of the present invention. (1) A substrate holding device of the present invention includes a stage having a flat surface on which a substrate is placed and capable of adsorbing the substrate, a plurality of support pins that are arranged on a portion of the stage having the flat surface and have tips on which the substrate is placed, a plurality of outer guide pins that are arranged on a portion of the stage surrounding the flat surface, and a presser member that is capable of descending from a retracted position above the flat surface, wherein the support pins are displaceable between an upper position where their tips protrude above the flat surface and a lower position where their tips are below the flat surface, the plurality of outer guide pins are arranged so as to be able to contact, from multiple directions, the outer edge of the substrate that is placed on the support pins that are displaced to the lower position, and the presser member descends from the retracted position to press the substrate against the flat surface with the support pins in the lower position.

[0010] With this substrate holding device, the substrate is placed on the tips of the support pins. When the support pins are displaced to the lower position, the outer edge of the substrate can come into contact with the multiple outer guide pins from multiple directions, and the substrate descends while being positioned by the multiple outer guide pins. When the support pins reach the lower position, the substrate rests on the flat surface of the stage. When the pressing member descends, the pressing member presses the substrate onto the flat surface. At this time, the support pins are in the lower position. Even if the substrate is warped, the warp is corrected by the pressing member, and the stage adsorbs and holds the substrate. As described above, the substrate is securely adsorbed and held on the stage.

[0011] (2) The substrate holding device of (1) has a plurality of inner guide pins arranged in a portion closer to the center of the flat surface than the plurality of outer guide pins, and a second pressing member that can be lowered from a retracted position above the flat surface, wherein the plurality of support pins are arranged in the portion having the flat surface so as to be able to support a second substrate smaller than the first substrate, the plurality of inner guide pins are displaceable between an upper position where their tips protrude above the flat surface and a lower position where their tips are below the flat surface, the plurality of inner guide pins are arranged so as to be able to contact, from multiple directions, the outer edge of the second substrate placed on the support pins that are displaced to the lower position, and the second pressing member descends from the retracted position to press the second substrate against the flat surface with the support pins in the lower position.

[0012] In the case of a substrate holding device having the above configuration, in addition to the substrate (1) (first substrate), it is possible to hold a second substrate smaller than the first substrate on the stage. The second substrate is supported by the support pins as in the case of the substrate (1) and is positioned by the inner guide pins when it is lowered. Even if the second substrate is warped, it is corrected by the second pressing member, and the stage adsorbs and holds the second substrate. The substrate holding device can be used for two types of substrates with different contour sizes.

[0013] (3) In the substrate holding device of (1) or (2), the outer guide pins have tapered tips. Even if the substrate placed on the support pins displaced to the lower position comes into contact with the tips of the outer guide pins, the substrate slides along the tapered tips and moves toward the stage along the outer guide pins, where it is positioned.

[0014] (4) In the substrate holding device of (2), the inner guide pin has a tapered tip. Even if the second substrate placed on the support pin displaced to the lower position comes into contact with the tip of the inner guide pin, the second substrate slides along the tapered tip and moves toward the stage along the inner guide pin, and is positioned there.

[0015] (5) In the substrate holding device according to any one of (1) to (4), the pressing member has a protrusion for partially contacting the substrate. The portion of the pressing member that contacts the substrate is the protrusion, which makes it possible to reduce the contact area of ​​the pressing member with the substrate.

[0016] (6) In the substrate holding device of (5), the convex portion has a cross-sectional contour shape that becomes smaller toward the substrate. The portion where the pressing member contacts the substrate is the tip (lower end) of the convex portion, which can further reduce the contact area of ​​the pressing member with the substrate. This is suitable when it is desirable to avoid contact of the substrate with other objects as much as possible.

[0017] (7) Depending on the type of warpage of the substrate, it may be preferable for the pressing member to press the substrate over a wide area along the edge of the substrate. In this case, in the substrate holding device of any one of (1) to (4), the pressing member has a linear portion that contacts the substrate along the edge.

[0018] (8) In the substrate holding device according to any one of (1) to (7), the outer guide pins are displaceable between an upper position where their tips protrude above the flat surface and a lower position where their tips are below the flat surface. When a process (e.g., a coating process) is performed on the substrate held on the stage, and when the substrate is unloaded from the stage after the process, the outer guide pins are in the lower position, so that they do not get in the way.

[0019] <Details of the embodiment of the present invention> Details of the embodiment of the present invention will be described below. [Overall configuration of the substrate holding device] Fig. 1 is an explanatory diagram of a coating device having a substrate holding device of the present invention. The coating device 5 shown in Fig. 1 has a substrate holding device 10, a coating head 7 that ejects a liquid, and a drive device 8 that moves the stage 11 of the substrate holding device 10 relative to the coating head 7. The substrate holding device 10 adsorbs and holds a substrate W1 (W2). The substrate holding device 10 of this embodiment is capable of holding either a first substrate W1 or a second substrate W2, which have different sizes.

[0020] While the stage 11 of the substrate holding device 10 and the coating head 7 are moved relative to each other by the drive device 8, the liquid ejected from the coating head 7 is applied to the upper surface of the substrate W1 (W2) held by the substrate holding device 10 (stage 11). As a result, a coating film of a predetermined shape is formed on the substrate W1 (W2). The substrate W1 (W2) is, for example, a substrate for a semiconductor wafer, a substrate for a display, or a substrate for a color filter.

[0021] Fig. 2 is a plan view showing an example of the substrate holding device 10. Fig. 3 is a cross-sectional view of the substrate holding device 10 shown in Fig. 1 when viewed from the side. Figs. 4, 5, and 6 are explanatory views of the operation of the substrate holding device 10. The substrate holding device 10 of this embodiment has a stage 11, a plurality of support pins 15, a plurality of outer guide pins 18, a plurality of inner guide pins 22, a first pressing member 25, and a second pressing member 27. The substrate holding device 10 further has a suction device 41 (see Fig. 2).

[0022] [Regarding the Stage 11] The stage 11 has, as its upper surface, a flat surface (mounting surface) 12 on which the substrate W1 is placed. Although not shown, the stage 11 has a number of through holes opening in the flat surface 12. Alternatively, the stage 11 has porous holes. The suction device 41 has air flow paths 42 that connect to the many through holes (or porous holes). The suction device 41 has, for example, a suction pump 411. The suction pump 411 sucks air on the flat surface 12 through the through holes (or porous holes) and the air flow paths 42. This allows the stage 11 to adsorb the substrate W1 placed on the flat surface 12 (see FIGS. 5 and 6).

[0023] [Regarding the Support Pins 15] A plurality of support pins 15 are arranged in the portion 13 of the stage 11 having the flat surface 12. In the present embodiment (see FIG. 2), five support pins 15 are arranged on the stage 11. The support pins 15 are needle-shaped (thin columnar) members that are long in the vertical direction. The portion 13 of the stage 11 having the flat surface 12 has holes 131, the same number as the support pins 15 (see FIG. 3). One support pin 15 is provided in each hole 131.

[0024] Each of the multiple support pins 15 can be raised and lowered in the hole 131. The substrate holding device 10 has an actuator (not shown) that raises and lowers the multiple support pins 15. The actuator is located below the stage 11. The multiple support pins 15 rise and lower synchronously. The actuator is configured to have, for example, a lifting member and a motor that moves the lifting member up and down.

[0025] Each of the plurality of support pins 15 has a tip 16 on which the substrate W1 is placed. Hereinafter, the tip 16 of the support pin 15 may be referred to as the "support pin tip 16." The support pin tip 16 has a tapered shape that narrows toward the top.

[0026] The support pins 15 are displaceable between an upper position Pu (see FIG. 3) and a lower position Pd (see FIGS. 4, 5, and 6). The upper position Pu is a position where the support pin tips 16 protrude above the flat surface 12. The lower position Pd is a position where the support pin tips 16 are below the flat surface 12. This displacement is performed by the actuators (not shown) for the support pins 15. With the support pins 15 in the upper position Pu (see FIG. 3), a transport robot (not shown) loads the first substrate W1 onto the stage 11 and places it on the multiple support pins 15.

[0027] Fig. 7 is a plan view showing the state in which the substrate holding device 10 holds a first substrate W1. The substrates that the stage 11 can hold include not only the first substrate W1 but also a second substrate W2 having a different contour size. Fig. 8 is a plan view showing the state in which the substrate holding device 10 holds the second substrate W2. The second substrate W2 is smaller than the substrate W1. On the stage 11 (flat surface 12), the second substrate W2 is placed inside the range in which the first substrate W1 is placed.

[0028] Like the first substrate W1, the second substrate W2 can also be placed on the tips 16 of the multiple support pins 15. That is, the multiple support pins 15 are arranged in the portion 13 having the flat surface 12 so as to be able to support the second substrate W2 (see FIG. 8). On the stage 11 (flat surface 12), the multiple support pins 15 are arranged within the range in which the second substrate W2 is placed.

[0029] In this embodiment, five support pins 15 are arranged on the stage 11, but the number can be changed and may be four. The square sides of the rectangular substrate W1 (W2) are supported from below by four support pins 15. When there are five support pins 15, the center of the substrate W1 (W2) is supported by one support pin 15. The number of support pins 15 is not limited to four or five.

[0030] 3 and 4, when the support pins 15 are displaced from the upper position Pu to the lower position Pd while the first substrate W1 is placed on the support pin tips 16, the first substrate W1 is placed on the flat surface 12 of the stage 11. In this embodiment, the first substrate W1 is warped (warpage deformation), and is placed on a plurality of support pins 15 (FIG. 3), and the warped first substrate W1 is placed on the flat surface 12 (FIG. 4). The operation of placing the second substrate W2 on the flat surface 12 is the same as that for the first substrate W1.

[0031] [Regarding the outer guide pins 18] A plurality of outer guide pins 18 are arranged in a peripheral portion 14 of the stage 11 around the flat surface 12. The upper surface of the peripheral portion 14 of the flat surface 12 forms a common plane with the flat surface 12. In the present embodiment (see FIG. 2), eight outer guide pins 18 are arranged separately on the stage 11. The outer guide pins 18 are columnar members that are long in the vertical direction. The stage 11 has holes 132, the same number as the outer guide pins 18, formed in the peripheral portion 14 of the flat surface 12 (see FIG. 3). One outer guide pin 18 is provided in one hole 132.

[0032] Each of the outer guide pins 18 can be raised and lowered in the hole 132. The substrate holding device 10 has an actuator (not shown) that raises and lowers the outer guide pins 18. The actuator is located below the stage 11. The outer guide pins 18 rise and lower synchronously. The actuator is configured to have, for example, a lifting member and a motor that moves the lifting member up and down.

[0033] Each of the multiple outer guide pins 18 has a tapered tip 19. Hereinafter, the tip 19 of the outer guide pin 18 may be referred to as the "outer pin tip 19." The outer pin tip 19 has a tapered shape that becomes thinner toward the top. The outer guide pin 18 is displaceable between an upper position Qu (see FIGS. 3, 4, and 5) and a lower position Qd (see FIG. 6). The upper position Qu is a position where the outer pin tip 19 protrudes above the flat surface 12. The lower position Qd is a position where the outer pin tip 19 is below the flat surface 12. This displacement is performed by the actuator (not shown) for the outer guide pin 18.

[0034] The outer guide pins 18 are arranged on both sides of each corner E1 of the rectangular first substrate W1 (see FIG. 7 ). For this purpose, eight outer guide pins 18 are provided on the stage 11. Two outer guide pins 18 can come into contact with one side of the first substrate W1.

[0035] The outer guide pins 18 have a columnar shape with a circular cross section. Therefore, the outer guide pins 18 can come into point contact with part of the outer peripheral edge W1e of the first substrate W1. In other words, the outer guide pins 18 have contact points 181 on their side surfaces that can come into contact with part of the outer peripheral edge W1e of the first substrate W1. In a plan view, the rectangular area connecting the contact points 181 of the eight outer guide pins 18 is slightly larger than the outline shape of the first substrate W1.

[0036] As described above, the multiple (eight) outer guide pins 18 are arranged so as to be able to contact the outer edge W1e of the first substrate W1 placed on the support pin 15 (support pin tip 16) displacing from the upper position Pu to the lower position Pd from multiple directions, as shown in Figures 3 and 4.

[0037] In this embodiment (see FIG. 7 ), the outer guide pins 18 are arranged so as to be able to contact the outer peripheral edge W1e of the first substrate W1 from four directions: front, back, left, and right. However, as described above, the rectangular area connecting the contact points 181 of the eight outer guide pins 18 is slightly larger than the outline shape of the first substrate W1, so that not all eight outer guide pins 18 come into contact with the descending first substrate W1, but rather only some of the eight outer guide pins 18. The outer guide pins 18 may come into contact with the outer peripheral edge W1e of the first substrate W1 from two of the four directions: front, back, left, and right (for example, from the front and right).

[0038] In this way, when the support pins 15 are displaced to the lower position Pd, the outer peripheral edge W1e of the first substrate W1 placed on the support pins 15 can come into contact with the eight outer guide pins 18 from multiple directions (for example, from the front and the right), and the first substrate W1 descends while being positioned by these outer guide pins 18. The first substrate W1 is positioned so as to fit within the area inside the eight outer guide pins 18. When the support pins 15 reach the lower position Pd, the substrate W1 rests on the flat surface 12 of the stage 11 (see FIG. 4).

[0039] As described above, the outer guide pins 18 have tapered outer pin tips 19. Therefore, even if the first substrate W1 placed on the support pins 15 displaced to the lower position Pd comes into contact with the outer pin tips 19, the first substrate W1 slides along the tapered outer pin tips 19 and moves along the outer guide pins 18 toward the stage 11, where it is positioned.

[0040] [Regarding the inner guide pins 22] The multiple inner guide pins 22 function to position the second substrate W2, which is smaller than the first substrate W1. Fig. 9 is an explanatory diagram showing how the second substrate W2 placed on the support pin tips 16 is placed on the stage 11 (flat surface 12) by the lowering of the support pins 15.

[0041] The multiple inner guide pins 22 are arranged in a portion 13 of the stage 11 that has the flat surface 12. To explain this arrangement more specifically (see FIG. 2), the multiple inner guide pins 22 are arranged closer to the center of the flat surface 12 than the multiple (eight) outer guide pins 18. The multiple inner guide pins 22 are arranged closer to the outer guide pins 18 than the multiple (five) support pins 15.

[0042] In this embodiment (see FIG. 2), eight inner guide pins 22 are arranged separately on the stage 11. The inner guide pins 22 are columnar members that are long in the vertical direction. The portion 13 of the stage 11 that has the flat surface 12 is provided with holes 133, the same number as the inner guide pins 22 (see FIGS. 3 and 9). One inner guide pin 22 is provided in one hole 133.

[0043] Each of the multiple inner guide pins 22 can be raised and lowered in the hole 133. The substrate holding device 10 has an actuator (not shown) that raises and lowers the multiple inner guide pins 22. The actuator is located below the stage 11. The multiple inner guide pins 22 rise and lower synchronously. The actuator is configured to have, for example, a lifting member and a motor that moves the lifting member up and down.

[0044] Each of the multiple inner guide pins 22 has a tapered tip 23. Hereinafter, the tip 23 of the inner guide pin 22 may be referred to as the "inner pin tip 23." The inner pin tip 23 has a tapered shape that becomes thinner toward the top. The inner guide pin 22 is displaceable between an upper position Ru (see FIG. 9) and a lower position Rd (see FIGS. 3, 4, 5, and 6). The upper position Ru is a position where the inner pin tip 23 protrudes above the flat surface 12. The lower position Rd is a position where the inner pin tip 23 is below the flat surface 12. This displacement is performed by the actuator (not shown) for the inner guide pin 22.

[0045] The inner guide pins 22 are arranged on both sides of each corner E2 of the rectangular second substrate W2 (see FIG. 8 ). For this purpose, eight inner guide pins 22 are provided on the stage 11. Two inner guide pins 22 can come into contact with one side of the second substrate W2.

[0046] The inner guide pins 22 have a columnar shape with a circular cross section. Therefore, the inner guide pins 22 can come into point contact with part of the outer peripheral edge W2e of the second substrate W2. In other words, the inner guide pins 22 have contact points 221 on their side surfaces that can come into contact with part of the outer peripheral edge W2e of the second substrate W2. In a plan view, the rectangular area connecting the contact points 221 of the eight inner guide pins 22 is slightly larger than the outline shape of the second substrate W2.

[0047] As described above, the plurality of (eight) inner guide pins 22 are arranged so as to be able to come into contact with the outer circumferential edge W2e of the second substrate W2 placed on the support pins 15 (support pin tips 16) displacing from the upper position Pu to the lower position Pd from multiple directions, as shown in Figures 9 and 10. Figure 10 is an explanatory diagram showing a state in which the second substrate W2 placed on the flat surface 12 is pressed against the flat surface 12 by the second pressing member 27 described later.

[0048] In this embodiment (see FIG. 8 ), the inner guide pins 22 are arranged so as to be able to contact the outer peripheral edge W2e of the second substrate W2 from four directions: front, back, left, and right. However, as described above, the rectangular area connecting the contact points 221 of the eight inner guide pins 22 is slightly larger than the outline shape of the second substrate W2, so that not all eight inner guide pins 22 come into contact with the descending second substrate W2, but only some of the eight inner guide pins 22. The inner guide pins 22 may come into contact with the outer peripheral edge W2e of the second substrate W2 from two of the four directions: front, back, left, and right (for example, from the front and right).

[0049] In this way, when the support pins 15 are displaced to the lower position Pd, the outer periphery W2e of the second substrate W2 placed on the support pins 15 can come into contact with the eight inner guide pins 22 from multiple directions (for example, from the front and the right), and the second substrate W2 descends while being positioned by these inner guide pins 22. The second substrate W2 is positioned so as to fit within the area inside the eight inner guide pins 22. When the support pins 15 reach the lower position Pd, the substrate W2 rests on the flat surface 12 of the stage 11 (see FIG. 9 ).

[0050] As described above, the inner guide pins 22 have tapered inner pin tips 23. Therefore, even if the second substrate W2 placed on the support pins 15 displaced to the lower position Pd comes into contact with the inner pin tips 23, the second substrate W2 slides along the tapered inner pin tips 23 and moves along the inner guide pins 22 toward the stage 11, where it is positioned.

[0051] [Regarding the first pressing member 25] The first pressing member 25 is provided on the flat surface 12 of the stage 11 and is movable up and down (see FIGS. 3 and 5). The substrate holding device 10 has an actuator (not shown) that moves the first pressing member 25 up and down. The actuator is located above the stage 11. The actuator includes, for example, a lifting member and a motor that moves the lifting member up and down. The first pressing member 25 is attached to the lifting member via a first lifting rod 61.

[0052] The first pressing member 25 is displaceable between a retracted position S1 (see FIG. 3) above the flat surface 12 and a pressing position D1 (see FIG. 5). The retracted position S1 is a position where the first pressing member 25 is away from the stage 11 (flat surface 12). The pressing position D1 is a position where the first pressing member 25 is close to the stage 11 (flat surface 12). The pressing position D1 is a position where the first substrate W1 is pressed against the stage 11 (flat surface 12) from above. The first pressing member 25 is capable of descending from the retracted position S1 above the flat surface 12 to the pressing position D1.

[0053] 4 and 5, the first presser member 25 descends from the retracted position S1 and presses the first substrate W1 on the stage 11 onto the flat surface 12. At this time, the support pins 15 and the inner guide pins 22 are in their lower positions. As a result, the warped first substrate W1 (FIG. 4) is corrected to a flat shape that conforms to the flat surface 12 (FIG. 5). Then, with the first presser member 25 pressing the first substrate W1 against the flat surface 12, the stage 11 adsorbs the first substrate W1.

[0054] [Regarding the second pressing member 27] The second pressing member 27 is provided on the flat surface 12 of the stage 11 and is movable up and down (see FIGS. 9 and 10). The substrate holding device 10 has an actuator (not shown) that moves the second pressing member 27 up and down. The actuator is located above the stage 11. The actuator includes, for example, a lifting member and a motor that moves the lifting member up and down. The second pressing member 27 is attached to the lifting member via a second lifting rod 62.

[0055] The second pressing member 27 is displaceable between a retracted position S2 (see FIG. 9 ) above the flat surface 12 and a pressing position D2 (see FIG. 10 ). The retracted position S2 is a position where the second pressing member 27 is away from the stage 11 (flat surface 12). The pressing position D2 is a position where the second pressing member 27 approaches the stage 11 (flat surface 12). The pressing position D2 is a position where the second substrate W2 is pressed against the stage 11 (flat surface 12) from above. The second pressing member 27 is capable of descending from the retracted position S2 above the flat surface 12 to the pressing position D2.

[0056] 9 and 10 , the second presser member 25 descends from the retracted position S2 and presses the second substrate W2 on the stage 11 onto the flat surface 12. At this time, the support pins 15 are in the lower position Pd. As a result, the warped second substrate W2 ( FIG. 9 ) is corrected to a flat shape that conforms to the flat surface 12 ( FIG. 10 ). Then, with the second presser member 27 pressing the second substrate W2 against the flat surface 12, the stage 11 adsorbs the second substrate W2.

[0057] [Regarding the first pressing member 25 and the second pressing member 27] As shown in Figures 2 and 3, the first pressing member 25 of this embodiment has a plurality of protrusions 29 for partially contacting the substrate W1. The first pressing member 25 (see Figure 2) has a first frame 51 having substantially the same shape as the outer peripheral contour of the first substrate W1. The first frame 51 is formed by combining four straight beam members 511, forming a rectangle overall. The area surrounded by the four beam members 511 is open. The lifting rod 61 is attached to the first frame 51.

[0058] A plurality of protrusions 29 are attached to the bottom of the first frame 51. In the embodiment shown in Fig. 2, a protrusion 29 is attached to each of the four corners of the first frame 51. When the first pressing member 25 is in the lower pressing position D1 (see Fig. 5), the square protrusions 29 press the four corners of the first substrate W1. In the present embodiment, a protrusion 29 is also provided in the central portion of one beam member 511 in the longitudinal direction, and these protrusions 29 also press the first substrate W1. The protrusions 29 may be arranged according to the type of warpage of the first substrate W1.

[0059] When the first pressing member 25 has the convex portion 29, the portion of the first pressing member 25 that comes into contact with the first substrate W1 becomes the convex portion 29. The contact area of ​​the first pressing member 25 with the first substrate W1 becomes smaller.

[0060] 2 and 9, the second pressing member 25 of this embodiment has a plurality of protrusions 39 for partially contacting the substrate W2. The second pressing member 27 is configured to be smaller in size than the first pressing member 25. The second pressing member 27 can pass through the opening of the first frame 51.

[0061] The second presser member 27 (see FIG. 2) has a second frame 52 having a shape substantially identical to the outer peripheral contour of the second substrate W2. The second frame 52 is formed by combining four straight beam members 521, forming a rectangle as a whole. The area surrounded by the four beam members 521 is open. The lifting rod 62 is attached to the second frame 52.

[0062] A plurality of protrusions 39 are attached to the bottom of the second frame 52. In the case of the configuration shown in Fig. 2, the protrusions 39 are attached to each of the four corners of the second frame 52. When the second pressing member 27 is in the pressing position D2 (see Fig. 10), which is the lower position, the four protrusions 39 press the four corners of the second substrate W2. The protrusions 39 may also be provided at the center of one beam member 521 in the longitudinal direction. The protrusions 39 may be arranged according to the type of warpage of the second substrate W2.

[0063] When the second pressing member 27 has the convex portion 39, the portion of the second pressing member 27 that comes into contact with the second substrate W2 becomes the convex portion 39. The contact area of ​​the second pressing member 27 with the second substrate W2 becomes smaller.

[0064] The convex portion 29 of the first pressing member 25 and the convex portion 39 of the second pressing member 27 may have the same shape. The specific configuration will be described below using the convex portion 29 of the first pressing member 25 as an example.

[0065] Fig. 11A is an explanatory diagram of the protrusion 29 of the first pressing member 25 shown in Fig. 2 and Fig. 3. The lower view of Fig. 11A is a side view of the protrusion 29, and the upper view of Fig. 11A is a cross-sectional view taken along the arrow A in the lower view of Fig. 11A. The protrusion 29 has a cylindrical portion 291 that is short in the axial direction, and a tip portion 292 that is continuous with the cylindrical portion 291 and whose cross-sectional contour shape becomes smaller toward the bottom. The tip portion 292 has a shape that follows a spherical surface.

[0066] Fig. 11B is an explanatory diagram showing a first modified example of the protrusion 29. The lower view of Fig. 11B is a side view of the protrusion 29, and the upper view of Fig. 11A is a cross-sectional view taken along the arrow B in the lower view of Fig. 11A. The protrusion 29 has a cylindrical portion 291 that is short in the axial direction, and a tip portion 292 that is continuous with the cylindrical portion 291 and whose cross-sectional contour shape becomes smaller toward the bottom. The tip portion 292 has a shape that follows a conical surface.

[0067] Fig. 11C is an explanatory diagram showing a second modified example of the protrusion 29. The lower view of Fig. 11C is a side view of the protrusion 29, and the upper view of Fig. 11C is a cross-sectional view taken along arrow C in the lower view of Fig. 11C. The protrusion 29 has a truncated cone shape.

[0068] 11A, 11B, and 11C have a cross-sectional contour that gradually decreases downward toward the substrate W1 side. In this configuration, the portion where the pressing member 25 contacts the substrate W1 is the tip of the pressing member 29, making it possible to further reduce the contact area of ​​the pressing member 25 with the substrate W1. In particular, the pressing member 29 in the form shown in FIG. 11A or 11B is preferred. The contact mode of the pressing member 25 (pressing member 29) with the substrate W1 becomes closer to point contact, making it possible to further reduce the contact area.

[0069] Fig. 11D is an explanatory diagram showing a third modified example of the protrusion 29. The lower view of Fig. 11D is a side view of the protrusion 29, and the upper view of Fig. 11D is a cross-sectional view taken along the arrow D in the lower view of Fig. 11D. The protrusion 29 has a cylindrical shape that is short in the axial direction. In the case of the protrusions 29 shown in Figs. 11A, 11B, 11C, and 11D, the contact area of ​​the pressing member 25 with the substrate W1 can be reduced. This configuration is suitable when it is desirable to avoid contact of the substrate W1 with other objects as much as possible.

[0070] Alternatively, depending on the type of warpage of the first substrate W1, it may be preferable for the first pressing member 25 to press over a wide range along the edge of the first substrate W1. Similarly, depending on the type of warpage of the second substrate W2, it may be preferable for the second pressing member 27 to press over a wide range along the edge of the second substrate W2.

[0071] When pressing the substrate over a wide area so as to bend the edge of the substrate, the first pressing member 25 and the second pressing member 27 can have the same configuration (however, the size of the outer periphery contour is different). The specific configuration will be described below using the first pressing member 25 as an example.

[0072] 12A, 12B, 12C, and 12D are explanatory diagrams of the first pressing member 25 that can press the first substrate W1 over a wide area along the edge thereof. These diagrams show the first pressing member 25 as viewed from above. In each diagram, the substrate W1 is indicated by a two-dot chain line. FIG. 13 is an explanatory diagram showing the state in which the first pressing member 25 presses the substrate W1 against the stage 11 (flat surface 12).

[0073] The first pressing member 25 shown in Figure 12A has a frame structure with approximately the same shape as the outer peripheral contour of the first substrate W1. The first pressing member 25 is formed by combining four linear portions 30 to form a rectangle as a whole. The area surrounded by the four linear portions 30 is open. The first pressing member 25 shown in Figure 12B has four linear portions 30, as in the case shown in Figure 12A. However, these linear portions 30 are discontinuous. The lifting rod 61 (see Figure 13) is attached to each linear portion 30. The first pressing member 25 shown in Figures 12A and 12B is capable of pressing the substrate W1 along the entire periphery.

[0074] The first pressing member 25 shown in each of Figures 12C and 12D has two linear portions 30. The two linear portions 30 are arranged in parallel. The linear portions 30 are arranged according to the type of warping of the first substrate W1. In other words, when the substrate W1 is warped and its edge portions on both the left and right sides are raised above the flat surface 12, the first pressing member 25 shown in Figure 12C is used. This configuration makes it possible to press down the raised edge portions on both the left and right sides of the substrate W1, which is preferable.

[0075] When the substrate W1 is warped and both edges in the front-rear direction are raised above the flat surface 12, the first pressing member 25 shown in Fig. 12D is employed. This configuration is preferable because it makes it possible to press down the raised edges on both sides in the front-rear direction of the substrate W1. As described above, the pressing members 25 shown in each of Figs. 12A, 12B, 12C, and 12D have linear portions 30 that come into contact along the edges (sides) of the substrate W1.

[0076] [Operation of the Substrate Holding Device 10] The substrate holding operation performed by the substrate holding device 10 having the above configuration will be described. A case will be described in which the substrate holding device 10 holds a first substrate W1. Note that the first substrate W1 is warped. With the support pins 15 in the upper position Pu (see FIG. 3), a transport robot (not shown) carries the first substrate W1 onto the stage 11 and places it on the multiple support pins 15. The first substrate W1 is placed on the support pin tips 16.

[0077] When the support pins 15 are displaced to the lower position Pd, the outer peripheral edge W1e of the first substrate W1 can come into contact with the outer guide pins 18 from multiple directions, and the first substrate W1 descends while being positioned by the outer guide pins 18. When the support pins 15 reach the lower position Pd (see FIG. 4), the first substrate W1 rests on the flat surface 12 of the stage 11. In this state, the warping of the first substrate W1 has not been eliminated.

[0078] As shown in Figure 5, when the first presser member 25 descends from the retracted position S1, the first presser member 25 presses the first substrate W1 onto the flat surface 12. At this time, the support pins 15 and inner guide pins 22 are in their lower positions. Any warping that occurs in the first substrate W1 is corrected by the first presser member 25. The stage 11 sucks and holds the first substrate W1. As a result, the first substrate W1 is securely sucked and held on the stage 11.

[0079] While the substrate holding device 10 holds the first substrate W1, various processes are performed on the first substrate W1. In the present embodiment (see FIG. 1 ), the first substrate W1 (stage 11) and the coating head 7 move relative to each other, and liquid is ejected from the coating head 7 to coat the first substrate W1. When the coating process is completed, suction of the first substrate W1 on the stage 11 is stopped. The support pins 15 move from the lower position Pd to the upper position Pu. The coated (processed) first substrate W1 placed on the support pins 15 is transported out of the substrate holding device 10 by a transport robot (not shown).

[0080] When processing (e.g., coating processing) is performed on the first substrate W1 held on the stage 11, and when the first substrate W1 is removed from the stage 11 after the processing, the outer guide pins 18 are in the lower position Qd (see Figure 6), so that the outer guide pins 18 do not get in the way.

[0081] A case will be described in which the substrate holding device 10 holds a second substrate W2. Note that the second substrate W2 is warped. As in the case of the first substrate W1 (see FIG. 3 ), with the support pins 15 in the upper position Pu, a transport robot (not shown) loads the second substrate W2 onto the stage 11 and places it on the support pins 15. The second substrate W2 is placed on the tips 16 of the support pins.

[0082] As shown in Figure 9, the inner guide pins 22 are in the upper position Ru. The outer guide pins 18 are in the lower position Qd. When the support pins 15 are displaced to the lower position Pd, the outer peripheral edge W2e of the second substrate W2 can come into contact with the multiple inner guide pins 22 from multiple directions, and the second substrate W2 descends while being positioned by the multiple inner guide pins 22. When the support pins 15 reach the lower position Pd (see Figure 9), the second substrate W2 rests on the flat surface 12 of the stage 11. In this state, the warping of the second substrate W2 has not been eliminated.

[0083] 10, when the second presser member 27 descends from the retracted position S1, the second presser member 27 presses the second substrate W2 onto the flat surface 12. At this time, the support pins 15 are in the lower position Pd. Any warping that occurs in the second substrate W2 is corrected by the second presser member 27. The stage 11 sucks and holds the second substrate W2. As a result, the second substrate W2 is securely sucked and held on the stage 11.

[0084] While the substrate holding device 10 holds the second substrate W2, various processes are performed on the second substrate W2. In the present embodiment (see FIG. 1 ), the second substrate W2 (stage 11) and the coating head 7 move relative to each other, and liquid is ejected from the coating head 7 to coat the second substrate W2 with the liquid. When the coating process is completed, suction of the second substrate W2 on the stage 11 is stopped. The support pins 15 move from the lower position Pd to the upper position Pu. The coated (processed) second substrate W2 placed on the support pins 15 is transported out of the substrate holding device 10 by a transport robot (not shown).

[0085] When processing (e.g., coating processing) is performed on the second substrate W2 held on the stage 11, and when the second substrate W2 is removed from the stage 11 after the processing, the inner guide pin 22 and the outer guide pin 18 are in a lower position (not shown), so that the inner guide pin 22 and the outer guide pin 18 do not get in the way.

[0086] [Regarding the Substrate Holding Device 10 of the Present Embodiment] The substrate holding device 10 of the present embodiment is capable of holding, on the stage 11, not only the first substrate W1 but also a second substrate W2 that is smaller than the first substrate W1. As with the first substrate W1, the second substrate W2 is supported by the support pins 15 and lowered, and is then positioned by the inner guide pins 22 (see FIG. 9). Even if the second substrate W2 is warped, it is corrected by the second pressing member 27 (see FIG. 10), and the stage 11 suction-holds the second substrate W2. The substrate holding device 10 can be used for two types of substrates with different contour sizes.

[0087] [Others] The substrate holding device 10 of this embodiment is used for two types of substrates (W1, W2) having different outline sizes as described above, but it may also be configured to hold only one type of substrate. The substrate holding device of the present invention can be applied to other devices in addition to being provided in the coating device 5.

[0088] The embodiments disclosed herein are illustrative in all respects and are not restrictive. The technical scope of the present invention is not limited to the above-described embodiments, and includes all modifications within the scope of equivalents to the configurations described in the claims.

[0089] 10 Substrate holding device 11 Stage 12 Flat surface 13 Portion having flat surface 14 Surrounding portion of flat surface 15 Support pin 16 Tip (tip of support pin) 18 Outer guide pin 19 Tip (tip of outer pin) 22 Inner guide pin 23 Tip (tip of inner pin) 25 First pressing member 27 Second pressing member 29 Convex portion 30 Linear portion 39 Convex portion W1 First substrate W1e Outer peripheral edge W2 Second substrate W2e Outer peripheral edge S1 Retracted position D1 Pressing position S2 Retracted position D2 Pressing position Pu Upper position of support pin Pd Lower position of support pin Qu Upper position of outer guide pin Qd Lower position of outer guide pin Ru Upper position of inner guide pin Rd Lower position of inner guide pin

Claims

1. A substrate holding device comprising: a stage having a flat surface on which a substrate is placed and capable of adsorbing the substrate; a plurality of support pins arranged on the portion of the stage having the flat surface and having tips on which the substrate rests; a plurality of outer guide pins arranged on the portion of the stage surrounding the flat surface; and a presser member that can be lowered from a retracted position above the flat surface, wherein the support pins are displaceable between an upper position where their tips protrude above the flat surface and a lower position where their tips are below the flat surface, the plurality of outer guide pins are arranged so that they can contact, from multiple directions, the outer edge of the substrate that rests on the support pins that are displaced to the lower position, and the presser member descends from the retracted position to press the substrate against the flat surface with the support pins in the lower position.

2. A substrate holding device as described in claim 1, comprising: a plurality of inner guide pins arranged in a portion of the flat surface closer to the center than the plurality of outer guide pins; and a second pressing member that is capable of descending from a retracted position above the flat surface, wherein the plurality of support pins are arranged in the portion having the flat surface so as to be able to support a second substrate that is smaller than the first substrate, the plurality of inner guide pins are displaceable between an upper position in which their tips protrude above the flat surface and a lower position in which their tips are below the flat surface, the plurality of inner guide pins are arranged so as to be able to contact, from multiple directions, the outer edge of the second substrate that rests on the support pins that are displaced to the lower position, and the second pressing member descends from the retracted position to press the second substrate onto the flat surface with the support pins in the lower position.

3. A substrate holding device according to claim 1 or claim 2, wherein the outer guide pin has a tapered tip.

4. The substrate holding device according to claim 2, wherein the inner guide pin has a tapered tip.

5. A substrate holding device according to claim 1 or claim 2, wherein the pressing member has a protrusion for partially contacting the substrate.

6. The substrate holding device according to claim 5, wherein the convex portion has a cross-sectional contour shape that becomes smaller toward the substrate.

7. A substrate holding device according to claim 1 or claim 2, wherein the pressing member has a linear portion that contacts the edge of the substrate.

8. A substrate holding device as described in claim 1 or claim 2, wherein the outer guide pin is displaceable between an upper position where its tip protrudes above the flat surface and a lower position where its tip is below the flat surface.

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