Hole cleaning device and hole cleaning method

Abstract

A hole cleaning device according to the present invention cleans a through hole of an object to be cleaned that has at least one through hole. The hole cleaning device comprises a support part that supports the object to be cleaned such that the position of a first end of the through hole is lower than the position of a second end of the through hole, a liquid supply part that includes a bubble generation device and supplies a liquid that includes bubbles that have been generated in the liquid by the bubble generation device into the through hole from the first end of the through hole, and a first container that accommodates the support part and the object to be cleaned and recovers liquid that has spilled from the second end of the through hole.

Description

Hole cleaning device and hole cleaning method

[0001] This application claims priority to Japanese Patent Application No. 2024-050977, filed on March 27, 2024, and incorporates by reference all of the contents of said Japanese application.

[0002] Patent Document 1 discloses a method for manufacturing an optical fiber, which describes a method for cleaning a through hole formed in the cladding material of an optical fiber for inserting a core material, by vapor-phase etching the inner wall surface of the through hole and heating the cladding material while flowing a cleaning gas such as chlorine or oxygen into the through hole.

[0003] JP 2017-154931 A

[0004] A hole cleaning device according to an embodiment of the present disclosure cleans a through hole of an object to be cleaned having at least one through hole. The hole cleaning device includes: a support unit that supports the object to be cleaned so that a first end of the through hole is positioned lower than a second end of the through hole; a liquid supply unit that includes a bubble generator that generates bubbles in the liquid and supplies the liquid containing bubbles into the through hole from the first end; and a first container that accommodates the support unit and the object to be cleaned and collects the liquid that overflows from the second end of the through hole.

[0005] FIG. 1 is a schematic diagram of a hole cleaning apparatus according to a first embodiment of the present disclosure. FIG. 2 shows a state in which liquid has overflowed from the second end of a through hole. FIG. 3 is a flowchart showing a hole cleaning method. FIG. 4 is a schematic diagram of a hole cleaning apparatus according to a first modified example. FIG. 5 is a diagram showing a state in which overflowing liquid is collected in a container. FIG. 6 is a schematic diagram of a hole cleaning apparatus according to a second modified example. FIG. 7A is a diagram showing a procedure for placing a clad material on a support table in the second modified example. FIG. 7B is a diagram showing a procedure for placing a clad material on a support table in the second modified example. FIG. 7C is a diagram showing a procedure for placing a clad material on a support table in the second modified example. FIG. 8 is a schematic diagram of a portion of a hole cleaning apparatus according to a third modified example. FIG. 9A is a diagram showing a procedure for placing a clad material on a support table in the third modified example. FIG. 9B is a diagram showing a procedure for placing a clad material on a support table in the third modified example. FIG. 9C is a diagram showing a procedure for placing a clad material on a support table in the third modified example. FIG. 9D is a diagram showing the procedure for placing a clad material on a support table in the third modified example. FIG. 10 is a diagram schematically showing a hole cleaning apparatus according to a fourth modified example. FIG. 11A is a diagram showing the procedure for placing a clad material on a support table in the fourth modified example. FIG. 11B is a diagram showing the procedure for placing a clad material on a support table in the fourth modified example. FIG. 11C is a diagram showing the procedure for placing a clad material on a support table in the fourth modified example. FIG. 11D is a diagram showing the procedure for placing a clad material on a support table in the fourth modified example. FIG. 12 is a diagram schematically showing a hole cleaning apparatus according to a fifth modified example. FIG. 13 is a diagram schematically showing a hole cleaning apparatus according to a sixth modified example. FIG. 14A is a diagram showing the procedure for placing a clad material on a support table in the sixth modified example. FIG. 14B is a diagram showing the procedure for placing a clad material on a support table in the sixth modified example. FIG. 14C is a diagram showing the procedure for placing a clad material on a support table in the sixth modified example. FIG. 15A is a diagram showing the procedure for placing a clad material on a support table in the sixth modified example. 15B and 15C are diagrams showing a procedure for placing a clad material on a support base in the sixth modified example.

[0006] [Problem to be Solved by the Present Disclosure] One method for manufacturing an optical fiber is the drilling method. In the drilling method, a through hole is formed in a cladding material, a core material is inserted into the through hole, and the cladding material and the core material are heated to integrate them, thereby obtaining a preform for an optical fiber. The preform is then spun to obtain an optical fiber.

[0007] In the drilling method, cleaning the inside of the through-hole is important. If the optical fiber is heated and integrated without being properly cleaned, quality defects such as a decrease in the strength of the optical fiber and fluctuations in the cladding diameter may occur. Therefore, as described in Patent Document 1, the inside of the through-hole is cleaned by vapor-phase etching the inside of the through-hole and heating the cladding material while flowing a cleaning gas such as chlorine or oxygen. The larger the preform to be produced, the larger the cladding material will be, so large heating equipment is required and the power required for heating will increase.

[0008] An object of the present disclosure is to provide a hole cleaning device and a hole cleaning method that can avoid an increase in the size of the equipment required to clean through holes in an object to be cleaned, such as a clad material.

[0009] According to the present disclosure, it is possible to provide a hole cleaning device and a hole cleaning method that can avoid increasing the size of the equipment required to clean the through holes of the object to be cleaned.

[0010] [Description of Embodiments of the Present Disclosure] First, the contents of embodiments of the present disclosure will be described. [1] A hole cleaning device according to one embodiment of the present disclosure cleans a through hole of an object to be cleaned having at least one through hole. The hole cleaning device includes: a support part that supports the object to be cleaned so that a first end of the through hole is positioned lower than a second end of the through hole; a liquid supply part that includes a bubble generator that generates bubbles in the liquid and supplies the liquid containing bubbles into the through hole from the first end of the through hole; and a first container that accommodates the support part and the object to be cleaned and collects the liquid that overflows from the second end of the through hole.

[0011] In the hole cleaning device described in [1] above, a liquid containing bubbles is supplied into the through hole from a first end located below the second end of the through hole. The liquid then moves through the through hole to the second end and overflows from the second end. Since the liquid contains bubbles, it cleans the through hole. Furthermore, by moving the liquid from the first end, which is the lower end of the through hole, to the second end, which is the upper end, a sufficient amount of liquid can be retained in the through hole for a sufficient period of time, thereby improving the cleaning effect. Furthermore, the hole cleaning device described in [1] above can be made smaller than conventional devices that clean the inside of a through hole using vapor-phase etching and a purification gas. Therefore, the hole cleaning device described in [1] above can avoid the increase in size of the equipment required to clean the through hole of the object to be cleaned. In particular, in the manufacture of optical fiber preforms by a drilling method, the increase in size of the equipment required to clean the through hole of a cladding material can be avoided.

[0012] [2] In the hole cleaning device of [1] above, the liquid supply unit may have a component connected to an end surface of the object to be cleaned, including the first end of the through hole, and guiding the liquid containing bubbles from the first end of the through hole into the through hole. This allows the liquid containing bubbles to be supplied into the through hole from the first end of the through hole.

[0013] [3] In the hole cleaning device of [2] above, the bubble generator may include at least one of an aeration device, a microbubble generator, and a nanobubble generator. In this case, fine bubbles having a cleaning effect can be generated inside the liquid.

[0014] [4] In the hole cleaning device of [1] above, the support unit may have a second container housed in the first container and spaced from the bottom surface of the first container to house the object to be cleaned, the liquid supply unit may supply the liquid containing bubbles between the bottom surface of the second container and the object to be cleaned, and the first container may collect the liquid overflowing from the second container. This allows the liquid containing bubbles to be supplied into the through hole from the first end of the through hole.

[0015] [5] In the hole cleaning device of [4] above, the bubble generator may include at least one of an aeration device, a microbubble generator, a nanobubble generator, and an ultrasonic generator. In this case, fine bubbles having a cleaning effect can be generated inside the liquid.

[0016] [6] In the hole cleaning device of [4] or [5] above, the second container may be divisible into two or more parts aligned vertically. In this case, when an operator manually places a heavy object to be cleaned in the second container, the operator can first separate and remove the upper part of the second container from the lower part, thereby lowering the sidewall of the second container and making it easier to place the object to be cleaned in the second container.

[0017] [7] In the hole cleaning device of any one of [1] to [6] above, the first container may be divisible into two or more parts arranged vertically. In this case, when an operator manually places a heavy object to be cleaned in the first container, the operator can first separate and remove the upper part of the first container from the lower part, thereby lowering the sidewall of the first container and making it easy to place the object to be cleaned in the first container.

[0018] [8] In any one of the hole cleaning devices [1] to [7] above, the support part may have a first state in which the object to be cleaned is supported in a tilted state, and a second state in which the object to be cleaned is supported so that the position of the first end is lower than the position of the second end. In this case, when placing an object to be cleaned that is long and heavy in the axial direction of the through hole on the support part, the object to be cleaned can be first placed in a tilted state (i.e., the first state) and then placed in a state during cleaning (i.e., the second state). In this way, the ability to change the position of the object to be cleaned allows an operator to easily place a long and heavy object on the support part by hand.

[0019] [9] In the hole cleaning device of any one of [1] to [8] above, the liquid is water, and the liquid supply unit may further include a water treatment device that increases the purity of the water by at least one of ion exchange, distillation, and filtration. In this case, impurities in the liquid can be minimized to improve the cleaning effect.

[0020]

[10] A hole cleaning method according to one embodiment of the present disclosure is a hole cleaning method for cleaning a through hole of an object to be cleaned having at least one through hole, the method including the steps of supporting the object to be cleaned so that a position of a first end of the through hole is lower than a position of a second end of the through hole, generating bubbles in a liquid and supplying the liquid containing the bubbles into the through hole from the first end of the through hole, and recovering the liquid that has overflowed from the second end of the through hole.

[0021] In the hole cleaning method of

[10] above, a liquid containing bubbles is supplied into the through hole from a first end located below the second end of the through hole. The liquid in the through hole is then moved to the second end and allowed to overflow from the second end. Since the liquid contains bubbles, it cleans the through hole. Furthermore, by moving the liquid from the first end, which is the lower end of the through hole, to the second end, which is the upper end, a sufficient amount of liquid can be retained in the through hole for a sufficient period of time, thereby improving the cleaning effect. Furthermore, the hole cleaning method of

[10] above allows for a smaller cleaning device compared to conventional methods that use vapor-phase etching and purification gas to clean the inside of the through hole. Therefore, the hole cleaning method of

[10] above can avoid the need for larger equipment for cleaning the through holes of the object to be cleaned. In particular, in the manufacture of optical fiber preforms by a drilling method, the need for larger equipment for cleaning the through holes of the cladding material can be avoided.

[0022] [Details of the embodiment of the present disclosure] Specific examples of the present disclosure will be described below with reference to the drawings. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims. In the following description, the same elements in the description of the drawings will be given the same reference numerals, and duplicate explanations will be omitted.

[0023] [First Embodiment] FIG. 1 is a schematic diagram illustrating a hole cleaning apparatus 1A according to a first embodiment of the present disclosure. The hole cleaning apparatus 1A is an apparatus for cleaning the through hole 51 of a clad material 50 (object to be cleaned) having at least one through hole 51. When the number of through holes 51 in the clad material 50 is one, the clad material 50 is used to manufacture a single-core fiber. When the number of through holes 51 in the clad material 50 is two, the clad material 50 is used to manufacture a multi-core fiber having two cores or a polarization-maintaining fiber. When the number of through holes 51 in the clad material 50 is three or more, the clad material 50 is used to manufacture a multi-core fiber having three or more cores. The core density of a multi-core fiber can be improved by arranging multiple cores in a single optical fiber. This makes it possible to increase the number of cores while maintaining a constant outer diameter of an optical fiber cable, or to reduce the outer diameter of the cable while maintaining a constant number of cores incorporated in the optical fiber cable. Furthermore, since the core-to-core distance can be made smaller than that of conventional fiber arrays made by arranging optical fibers, it is expected that this technology will also be used for high-density optical wiring.

[0024] As shown in FIG. 1 , the hole cleaning apparatus 1A of this embodiment includes a support unit 14, a liquid supply unit 10A, and a container 15A (first container). The clad material 50 has a cylindrical shape extending along a central axis. A through-hole 51 penetrates the cylindrical clad material 50 from a first end face to a second end face. The cross section perpendicular to the direction of extension of the through-hole 51 has a circular shape. The clad material 50 is made of, for example, quartz glass. The through-hole 51 has a first end 51 a formed at the first end face of the clad material 50 and a second end 51 b formed at the second end face of the clad material 50.

[0025] The support unit 14 supports the clad material 50 so that the position of the first end 51a of the through hole 51 is lower than the position of the second end 51b of the through hole 51. In this embodiment, the support unit 14 has a support base 14A. The support base 14A includes a table installed above the bottom surface of the container 15A, and the clad material 50 is installed on the table. For example, the clad material 50 is erected on the support base 14A so that the first end surface faces the support base 14A. In other words, the central axis of the clad material 50 is perpendicular to the surface of the table of the support base 14A. In this case, the central axis of the clad material 50 may be aligned vertically.

[0026] The liquid supply unit 10A supplies the liquid LQ containing bubbles from the first end 51a of the through-hole 51 into the through-hole 51. The liquid LQ is, for example, water, and may be pure water. The liquid supply unit 10A of this embodiment includes a water treatment device 11, a bubble generation device 12, and a component 13. The water treatment device 11 receives water as the liquid LQ via a pipe 21 and increases the purity of the water by at least one of ion exchange processing, distillation processing, and filtration processing. The bubble generation device 12 is connected to the water treatment device 11 via a pipe 22 and generates bubbles within the liquid LQ. A pipe 24 that introduces a gas GS for forming bubbles is connected to the bubble generation device 12. The bubble generation device 12 includes, for example, at least one of an aeration device, a microbubble generator, and a nanobubble generator. The component 13 is connected to the bubble generation device 12 via a pipe 23. The part 13 is placed on the table of the support stand 14A, and is connected to a first end surface of the clad material 50, which includes the first end 51a of the through hole 51. The part 13 guides the liquid LQ containing bubbles from the first end 51a of the through hole 51 into the through hole 51. The part 13 is, for example, a coupler or a joint.

[0027] The liquid LQ containing air bubbles is supplied into the through-hole 51 from the first end 51a, which is positioned below the second end 51b of the through-hole 51. The liquid LQ then moves inside the through-hole 51 to the second end 51b and overflows from the second end 51b. At this time, since the liquid LQ contains air bubbles, it cleans the inside of the through-hole 51, and foreign matter FM inside the through-hole 51 is discharged from the through-hole 51.

[0028] The container 15A is, for example, a cylindrical container with a bottom and one closed end. The container 15A is installed, for example, at floor level FL. The container 15A accommodates the support 14 and the clad material 50. The position of the upper end of the container 15A is higher than the position of the second end of the clad material 50. The container 15A collects the liquid LQ that has overflowed from the second end 51b of the through-hole 51. FIG. 2 shows the liquid LQ overflowing from the second end 51b of the through-hole 51. The container 15A has a pipe 151 on the bottom surface for discharging the liquid LQ that has accumulated at the bottom.

[0029] The hole cleaning apparatus 1A further includes a waste liquid tank 16 and a pump 17. The waste liquid tank 16 is a container that temporarily stores the liquid LQ that has been discharged from the pipe 151. The liquid LQ in the waste liquid tank 16 is sucked up by the pump 17 through the pipe 25, and is then discarded outside the hole cleaning apparatus 1A.

[0030] FIG. 3 is a flowchart showing a hole cleaning method according to this embodiment. This hole cleaning method can be performed using, for example, the hole cleaning apparatus 1A described above. This hole cleaning method cleans the through-hole 51 of a clad material 50 having at least one through-hole 51. This hole cleaning method includes a first step ST1, a second step ST2, and a third step ST3. In the first step ST1, the clad material 50 is supported so that the first end 51a of the through-hole 51 is positioned lower than the second end 51b of the through-hole 51. In the second step ST2, bubbles are generated within the liquid LQ, and the liquid LQ containing the bubbles is supplied from the first end 51a of the through-hole 51 into the through-hole 51. In the second step ST2, bubbles are generated by at least one of aeration, microbubble generation, and nanobubble generation. In the second step ST2, the liquid LQ may be water. In this case, the purity of the water may be increased by at least one of ion exchange, distillation, and filtration. In the third step ST3, the liquid LQ that has overflowed from the second ends 51b of the through-holes 51 is collected.

[0031] The effects obtained by the hole cleaning apparatus 1A and hole cleaning method of this embodiment described above will now be described. In the hole cleaning apparatus 1A of this embodiment, liquid LQ containing bubbles is supplied into the through-hole 51 from the first end 51a, which is located below the second end 51b of the through-hole 51. The liquid LQ then moves within the through-hole 51 to the second end 51b and overflows from the second end 51b. At this time, the liquid LQ contains bubbles and cleans the inside of the through-hole 51. Furthermore, by moving the liquid LQ from the first end 51a, which is the lower end of the through-hole 51, to the second end 51b, which is the upper end, a sufficient amount of liquid LQ can be retained within the through-hole 51 for a sufficient period of time, thereby improving the cleaning effect. Furthermore, the hole cleaning apparatus 1A of this embodiment can be made smaller than conventional devices that clean the inside of the through-hole 51 using vapor-phase etching and purification gas. Therefore, according to the hole cleaning device 1A of this embodiment, it is possible to avoid an increase in the size of the equipment required to clean the through-holes 51 of the cladding material 50 in manufacturing an optical fiber preform by the drilling method.

[0032] In the hole cleaning method of this embodiment, liquid LQ containing bubbles is supplied into the through hole 51 from the first end 51a, which is located below the second end 51b of the through hole 51. The liquid LQ in the through hole 51 is then moved to the second end 51b and allowed to overflow from the second end 51b. At this time, the liquid LQ contains bubbles and cleans the inside of the through hole 51. Furthermore, by moving the liquid LQ from the first end 51a, which is the lower end of the through hole 51, to the second end 51b, which is the upper end, a sufficient amount of liquid LQ can be retained in the through hole 51 for a sufficient period of time, thereby improving the cleaning effect. Furthermore, the hole cleaning method of this embodiment allows for a smaller cleaning device compared to conventional methods that clean the inside of the through hole 51 using vapor-phase etching and a purification gas. Therefore, the hole cleaning method of this embodiment makes it possible to avoid increasing the size of the equipment required to clean the through hole 51 in the cladding material 50 in the manufacture of an optical fiber preform by a drilling method.

[0033] As in the present embodiment, the liquid supply unit 10A may have a component 13 that is connected to the first end surface of the clad material 50, which includes the first end 51 a of the through hole 51, and that guides the liquid LQ that contains bubbles from the first end 51 a of the through hole 51 into the through hole 51. This makes it possible to supply the liquid LQ that contains bubbles into the through hole 51 from the first end 51 a of the through hole 51.

[0034] As in the present embodiment, the bubble generator 12 may include at least one of an aeration device, a microbubble generator, and a nanobubble generator. In this case, fine bubbles that have a cleaning effect can be generated inside the liquid LQ.

[0035] As in the present embodiment, the liquid LQ is water, and the liquid supply unit 10A may further include a water treatment device 11 that increases the purity of the water by at least one of ion exchange treatment, distillation treatment, and filtration treatment. In this case, impurities in the liquid LQ can be reduced as much as possible, thereby improving the cleaning effect.

[0036] [First Modification] Fig. 4 is a diagram schematically showing a hole cleaning device 1B according to a first modification of the above embodiment. Fig. 5 is a diagram showing how the overflowing liquid LQ is collected in a container 15A in the hole cleaning device 1B shown in Fig. 4. The hole cleaning device 1B of this modification has a liquid supply unit 10B instead of the liquid supply unit 10A of the above embodiment. The liquid supply unit 10B is the same as the liquid supply unit 10A except that it does not have a component 13. The support unit 14 of this modification has a container 20A (second container) in addition to the support base 14A.

[0037] The container 20A is, for example, a cylindrical container with a bottom and one closed end. The container 20A is housed in the container 15A and placed on the support stand 14A. The clad material 50 is housed in the container 20A with a gap between it and the bottom surface of the container 20A. Specifically, an annular support 19 is placed on the bottom surface of the container 20A, and a mesh material 18 with multiple openings is placed on the support 19. The clad material 50 is then placed on the mesh material 18 so that a first end surface of the clad material 50 faces the mesh material 18.

[0038] The pipe 23 of the liquid supply unit 10B is connected to the bottom of the container 20A. The liquid supply unit 10B supplies the liquid LQ containing bubbles to the space between the bottom surface of the container 20A and the clad material 50, specifically, to the space formed inside the annular support member 19. As the liquid LQ continues to be supplied into the container 20A, the liquid LQ moves from the bottom to the top of the container 20A. At the same time, the liquid LQ moves through the through-hole 51 to the second end 51b and overflows from the second end 51b. At this time, the liquid LQ contains bubbles, so it cleans the inside of the through-hole 51, and foreign matter FM within the through-hole 51 is discharged from the through-hole 51. When the liquid LQ reaches the top of the container 20A, it overflows from the container 20A. The container 15A collects the liquid LQ that overflows from the container 20A.

[0039] As in this modified example, the support unit 14 may have a container 20A that is housed in a container 15A and houses the clad material 50 at a distance from the bottom surface. The liquid supply unit 10A may supply the liquid LQ that contains bubbles between the bottom surface of the container 20A and the clad material 50, and the container 15A may collect the liquid LQ that overflows from the container 20A. This allows the liquid LQ that contains bubbles to be supplied into the through-hole 51 from the first end 51 a of the through-hole 51.

[0040] In this modified example, the bubble generator 12 may also include at least one of an aeration device, a microbubble generator, and a nanobubble generator. In this case, it is possible to generate fine bubbles that have a cleaning effect inside the liquid LQ.

[0041] [Second Modification] Figure 6 is a diagram schematically illustrating a hole cleaning device 1C according to a second modification of the above embodiment. The hole cleaning device 1C of this modification includes a container 15B (first container) instead of the container 15A of the above embodiment. The container 15B can be separated into two or more vertically aligned portions. In the illustrated example, the container 15B can be separated into a lower portion 152 and an upper portion 153 vertically aligned and then recombined.

[0042] 7A, 7B, and 7C are diagrams showing the procedure for placing the clad material 50 on the support table 14A in this modified example. First, as shown in FIG. 7A, the upper part 153 of the container 15B is separated and removed from the lower part 152 in advance. Next, as shown in FIG. 7B, the clad material 50 is placed on the support table 14A, and the clad material 50 is connected to the component 13. Next, as shown in FIG. 7C, the upper part 153 of the container 15B is rejoined to the lower part 152. After this, the liquid LQ is supplied to the clad material 50 via the component 13.

[0043] As in this modification, the container 15B may be divisible into two or more vertically aligned portions. In this case, when an operator manually places the heavy clad material 50 in the container 15B, the operator can first separate and remove the upper portion 153 of the container 15B from the lower portion 152, thereby lowering the sidewalls of the container 15B and facilitating the placement of the clad material 50 in the container 15B.

[0044] [Third Modification] FIG. 8 is a schematic diagram illustrating a portion of a hole cleaning device 1D according to a third modification of the embodiment. The hole cleaning device 1D of this modification includes a container 15B (first container) instead of the container 15A of the embodiment. The container 15B is the same as that of the second modification. In addition, the support unit 14 of the hole cleaning device 1D of this modification includes a support table 14B instead of the support table 14A of the embodiment. The support table 14B includes a base 141, a table 142, and a hinge 143. The base 141 is installed on the bottom surface of the container 15B. The table 142 is connected to the base 141 by the hinge 143 and is rotatable about the hinge 143 relative to the base 141. The support table 14B of this modification further includes a support plate 144 and a support table 145. One end of the support plate 144 is fixed to the table 142, and the support plate 144 supports a support base 145. The support base 145 is in contact with the side surface of the clad material 50.

[0045] 9A, 9B, 9C, and 9D are diagrams showing the procedure for placing the clad material 50 on the support table 14B in this modified example. First, as shown in FIG. 9A, the upper portion 153 of the container 15B is separated from the lower portion 152 and removed. The table 142 and the support plate 144 are then rotated around the hinges 143 to horizontally position the surface of the support table 145 that contacts the clad material 50. Next, as shown in FIG. 9B, the clad material 50 with the component 13 connected thereto is placed on the support table 145 in a tilted position, i.e., with the side of the clad material 50 in contact with the support table 145. Next, as shown in FIG. 9C, the table 142 and the support plate 144 are again rotated around the hinges 143 to position the clad material 50 as it would be during cleaning. After that, as shown in FIG. 9D, the upper part 153 of the container 15B is reconnected to the lower part 152, and the liquid LQ is supplied to the clad material 50 via the part 13.

[0046] As in this modification, the support 14 may have a first state (see FIG. 9A ) in which the clad material 50 is supported in a laid-down state, and a second state (see FIGS. 8 and 9C ) in which the clad material 50 is supported so that the first end 51 a is lower than the second end 51 b. In this case, when a clad material 50 that is long in the axial direction of the through-hole 51 and heavy is placed on the support 14, the clad material 50 can be first placed in a laid-down state (i.e., the first state) and then placed in a state during cleaning (i.e., the second state). Being able to change the orientation of the clad material 50 in this way allows an operator to easily place a long and heavy clad material 50 on the support 14 by hand.

[0047] [Fourth Modification] Figure 10 is a schematic diagram showing a hole cleaning device 1E according to a fourth modification of the embodiment. The hole cleaning device 1E of this modification includes a container 15B (first container) instead of the container 15A of the first modification. The container 15B is the same as that of the second modification (see Figure 6). The support unit 14 of the hole cleaning device 1E of this modification includes a container 20B (second container) instead of the container 20A of the first modification. The container 20B can be separated into two or more vertically aligned parts. In the illustrated example, the container 20B can be separated into a lower part 201 and an upper part 202 vertically aligned and then recombined.

[0048] 11A, 11B, 11C, and 11D are diagrams showing the procedure for placing the clad material 50 on the support table 14A in this modified example. First, as shown in FIG. 11A, the upper portion 153 of the container 15B is separated and removed from the lower portion 152 in advance. The lower portion 201 of the container 20B is placed on the support table 14A together with the mesh material 18 and the support portion 19. Next, as shown in FIG. 11B, the clad material 50 is placed on the support table 14A (specifically, on the mesh material 18). Next, as shown in FIG. 11C, the upper portion 202 of the container 20B is rejoined to the lower portion 201. Next, as shown in FIG. 11D, the upper portion 153 of the container 15B is rejoined to the lower portion 152. After this, liquid LQ is supplied into the gap between the bottom surface of the container 20B and the clad material 50.

[0049] As in the present embodiment, the container 20B may be divisible into two or more vertically aligned portions. In this case, when an operator manually places the heavy clad material 50 in the container 20B, the upper portion 202 of the container 20B can be separated and removed from the lower portion 201 in advance, thereby lowering the sidewalls of the container 20B and facilitating the placement of the clad material 50 in the container 20B.

[0050] [Fifth Modification] Figure 12 is a schematic diagram showing a hole cleaning device 1F according to a fifth modification of the above embodiment. The hole cleaning device 1F of this modification includes a liquid supply unit 10C instead of the liquid supply unit 10A. The liquid supply unit 10C differs from the liquid supply unit 10A in that it includes an ultrasonic vibrator (ultrasonic generator) 26 instead of the bubble generator 12, but is identical to the liquid supply unit 10A in other respects. The ultrasonic vibrator 26 is the bubble generator in this modification. The ultrasonic vibrator 26 is disposed between the container 20A and the support base 14A, and contacts the bottom of the container 20A to generate bubbles from the bottom surface of the container 20A in the liquid LQ within the container 20A.

[0051] As in this modified example, the bubble generator may include an ultrasonic vibrator 26. In this case, it is possible to generate fine bubbles that have a cleaning effect inside the liquid LQ.

[0052] 13 is a schematic diagram showing a hole cleaning device 1G according to a sixth modification of the embodiment. The hole cleaning device 1G of this modification differs from the hole cleaning device 1D of the third modification in the following respects, but is identical to the hole cleaning device 1D in other respects. That is, the support base 14B of this modification does not have a support plate 144, and the support base 145 is fixed to the inner surface of the container 20A fixed to the table 142.

[0053] 14A, 14B, 14C, and 15A, 15B, and 15C are diagrams showing the procedure for placing the clad material 50 on the support table 14B in this modified example. First, as shown in FIG. 14A, the upper part 153 of the container 15B is separated from the lower part 152 and removed. Then, the container 20A, with the support table 145 fixed to its inner surface, is fixed to the table 142. Next, as shown in FIG. 14B, the table 142 and the container 20A are rotated around the hinge 143 to horizontalize the surface of the support table 145 that contacts the clad material 50. Next, as shown in FIG. 14C, the clad material 50 is placed on the support table 145 in a tilted position, i.e., so that the side of the clad material 50 is in contact with the support table 145. Next, as shown in Fig. 15A, table 142 and container 20A are rotated again around hinge 143, thereby bringing clad material 50 into the position for cleaning. Next, as shown in Fig. 15B, upper part 153 of container 15B is reconnected to lower part 152. After this, as shown in Fig. 15C, liquid LQ is supplied into the gap between the bottom surface of container 20A and clad material 50.

[0054] As in this modification, the support 14 may have a first state (see FIG. 14C ) in which the clad material 50 is supported in a laid-down state, and a second state (see FIGS. 13 and 15B ) in which the clad material 50 is supported so that the first end 51 a is lower than the second end 51 b. In this case, when a clad material 50 that is long in the axial direction of the through hole 51 and heavy is placed on the support 14, the clad material 50 can be first placed in a laid-down state (i.e., the first state) and then placed in a state during cleaning (i.e., the second state). Being able to change the position of the clad material 50 in this way allows an operator to easily place a long and heavy clad material 50 on the support 14 by hand.

[0055] The hole cleaning device and hole cleaning method according to the present disclosure are not limited to the above-described embodiment and modifications, and various other modifications are possible. For example, in the above-described embodiment and modifications, the object to be cleaned is a clad material, but the object to be cleaned need only have at least one through-hole, and is not limited to a clad material. The method of generating bubbles in the liquid is not limited to those exemplified in the above-described embodiment and modifications.

[0056] DESCRIPTION OF SYMBOLS 1A to 1G...Hole cleaning device 10A, 10B, 10C...Liquid supply unit 11...Water treatment device 12...Bubble generator 13...Component 14...Support unit 14A, 14B...Support base 15A, 15B...Container (first container) 16...Waste liquid tank 17...Pump 18...Mesh material 19...Support unit 20A, 20B...Container (second container) 21 to 25...Piping 26...Ultrasonic vibrator 50...Clad material (object to be cleaned) 51...Through hole 51a...First end 51b...Second end 141...Base 142...Table 143...Hinge 144...Support plate 145...Support base 151...Piping GS...Gas FM...Foreign matter FL...Floor level ST1...First step ST2...Second step ST3...Third step LQ...Liquid

Claims

1. A hole cleaning device for cleaning at least one through-hole of an object to be cleaned, comprising: a support part that supports the object to be cleaned so that a first end of the through-hole is positioned lower than a second end of the through-hole; a liquid supply part that includes a bubble generator that generates bubbles in a liquid and supplies the liquid containing the bubbles into the through-hole from the first end of the through-hole; and a first container that contains the support part and the object to be cleaned and collects the liquid that overflows from the second end of the through-hole.

2. The hole cleaning device according to claim 1, wherein the liquid supply unit has a component connected to an end surface of the object to be cleaned, including the first end of the through hole, and the component guides the liquid containing the bubbles from the first end of the through hole into the through hole.

3. The hole cleaning device according to claim 2, wherein the bubble generator includes at least one of an aeration device, a microbubble generator, and a nanobubble generator.

4. The hole cleaning device according to claim 1, wherein the support unit has a second container housed in the first container and spaced apart from the bottom surface to house the object to be cleaned, the liquid supply unit supplies the liquid containing the bubbles between the bottom surface of the second container and the object to be cleaned, and the first container recovers the liquid that overflows from the second container.

5. The hole cleaning device according to claim 4, wherein the bubble generator includes at least one of an aeration device, a microbubble generator, a nanobubble generator, and an ultrasonic generator.

6. A hole cleaning device according to claim 4 or claim 5, wherein the second container can be divided into two or more parts arranged vertically.

7. A hole cleaning device according to any one of claims 1 to 6, wherein the first container is divisible into two or more parts arranged vertically.

8. A hole cleaning device as described in any one of claims 1 to 7, wherein the support portion has a first state in which the object to be cleaned is supported in a tilted state, and a second state in which the object to be cleaned is supported so that the position of the first end is lower than the position of the second end.

9. The hole cleaning device according to any one of claims 1 to 8, wherein the liquid is water, and the liquid supply unit further includes a water treatment device that increases the purity of the water by at least one of ion exchange, distillation, and filtration.

10. A hole cleaning method for cleaning at least one through-hole in an object to be cleaned, the hole comprising: a step of supporting the object to be cleaned so that a first end of the through-hole is positioned lower than a second end of the through-hole; a step of generating bubbles in a liquid and supplying the liquid containing the bubbles into the through-hole from the first end of the through-hole; and a step of recovering the liquid that has overflowed from the second end of the through-hole.

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