Load port and conveyance device

Abstract

This load port has a placement surface on which a container for accommodating a substrate is placed and is configured to be connectable to a housing that houses a conveying robot for conveying the substrate, wherein a coupling member that couples the load port to the housing is provided, an access part to an adjustment mechanism for adjusting a level of the load port with respect to the housing is provided on the coupling member, and a cutout part to which a positioning pin provided in the housing is locked is provided at a center part of the coupling member in the width direction.

Description

Load port and transport device

[0001] The present disclosure relates to a load port and a transport device.

[0002] Japanese Patent Application Laid-Open No. 2003-122222 discloses an EFEM (Equipment Front End Module) device for transferring an object to and from a processing device using a transfer robot provided inside a housing.

[0003] Japanese Patent Application Laid-Open No. 2023-22095

[0004] The semiconductor manufacturing equipment is provided with a processing device for processing substrates and a transport device. The transport device includes an EFEM device for transferring transported objects such as substrates and consumable parts (e.g., focus rings) between the processing device and the equipment using a transport robot provided inside a housing, and a load port connected to the EFEM device on which containers for storing substrates and consumable parts are placed.

[0005] Conventionally, when a load port is connected to an EFEM apparatus, the level adjustment mechanism for the load port is located behind the load port, i.e., on the EFEM apparatus side. In such cases, when the load port is attached to the EFEM apparatus, the level adjustment mechanism cannot be accessed from the load port side. For this reason, if the level of the load port does not meet the required specifications, the load port must be removed from the EFEM apparatus and the level of the load port must be adjusted using the level adjustment mechanism. This procedure is repeated until the level of the load port meets the specifications. Therefore, connecting a load port to an EFEM apparatus requires a lot of work. Therefore, the technology disclosed herein provides a load port and a transfer apparatus that can efficiently adjust the level of the load port when connecting the load port to a housing that houses a transfer robot.

[0006] One aspect of the present disclosure is a load port having a mounting surface for placing a container that holds substrates, and configured to be connectable to a housing that houses a transport robot that transports the substrates, the load port including a connecting member that connects the load port to the housing, the connecting member having an access portion to an adjustment mechanism that adjusts the level of the load port relative to the housing, and a notch in the widthwise center of the connecting member into which a positioning pin provided on the housing is engaged.

[0007] According to the present disclosure, when connecting a load port to a housing that houses a transfer robot, the level of the load port can be adjusted efficiently.

[0008] FIG. 1 is a plan view showing an outline of a wafer processing system including a transfer device according to a first embodiment; FIG. 2 is a cross-sectional side view of the transfer device showing the door in a closed state; FIG. 3 is a cross-sectional side view of the transfer device showing the door in an open state; FIG. 4 is a cross-sectional plan view of the transfer device; FIG. 5 is a cross-sectional view of the load port; FIG. 6 is a front view of the load port; FIG. 7 is a perspective view of the front side of the load port with the protective cover removed; FIG. 8 is a perspective view of the rear side of the load port with the protective cover removed; FIG. 9 is a front view of the load port with the protective cover removed; FIG. 10 is a rear view of the load port with the protective cover removed; FIG. 11 is a partially enlarged view of a cutout portion of the load port; FIG. 12 is a front view of an adjustment mechanism for the main body; FIG. 13 is a cross-sectional view of the adjustment mechanism for the main body; FIG. 14 is a perspective view of a transfer robot; FIG. 15 is an explanatory view showing how the load port is coupled to a housing; FIG. 16 is an explanatory view showing how the level of the load port is adjusted in the depth direction of the device; FIG. 17 is an explanatory view showing how the level of the load port is adjusted in the width direction of the device; FIG. 18 is a front view of the load port adjustment mechanism according to a second embodiment; FIG. 19 is a cross-sectional view of the load port adjustment mechanism according to the second embodiment.

[0009] The load port and transfer device according to this embodiment will be described below with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configuration are designated by the same reference numerals, and redundant description will be omitted. In the drawings, the X direction is the width direction of the device, in which a plurality of load ports 101 (described below) are arranged. The Y direction is the depth direction of the device, in which the front wall 121 and rear wall 122 of the main body 102 of the transfer device 20 (described below) are arranged. The negative side of the Y direction is the front side, and the positive side of the Y direction is the rear side. The Z direction is the vertical direction.

[0010] First Embodiment <Wafer Processing System 1> FIG. 1 is a plan view showing an outline of a wafer processing system 1 including a transfer device 20 according to a first embodiment.

[0011] 1, the wafer processing system 1 includes a processing device 10 and a transfer device 20. The processing device 10 and the transfer device 20 are provided adjacent to each other.

[0012] The processing apparatus 10 is an apparatus for processing a semiconductor wafer (hereinafter, simply referred to as a "wafer") W as a substrate, and includes, for example, a processing module 30 and a vacuum transfer module 40.

[0013] For example, a plurality of processing modules 30 are provided. Each processing module 30 processes the wafer W under a reduced pressure atmosphere, i.e., a vacuum atmosphere. The processing performed by the processing module 30 includes, for example, a film formation process, an etching process, an impurity diffusion process, and the like. Each processing module 30 also includes a vacuum processing chamber 31 in which the above processing is performed on the wafer W under a vacuum atmosphere. Each vacuum processing chamber 31 is connected to a vacuum transfer chamber 41 (described later) of the vacuum transfer module 40 via a gate valve G1.

[0014] The vacuum transfer module 40 includes a vacuum transfer chamber 41 whose interior is maintained under a vacuum atmosphere. The vacuum transfer chamber 41 is configured to be sealable and is formed, for example, in a substantially polygonal shape (a square shape in the illustrated example) in a plan view. The vacuum transfer chamber 41, which is connected to each processing module 30, is also connected to a load lock module 50 (described later). Specifically, the vacuum transfer chamber 41 is connected to a load lock chamber 51 (described later) of the load lock module 50 via a gate valve (not shown). A transfer mechanism 42 for transferring a wafer W is provided within the vacuum transfer chamber 41. The vacuum transfer module 40 transfers the wafer W to and from the vacuum transfer chamber 41 with the vacuum processing chamber 31 and the load lock chamber 51 using the transfer mechanism 42.

[0015] Furthermore, the processing apparatus 10 is provided with a load lock module 50 at the end on the transfer device 20 side. For example, a plurality of load lock modules 50 may be provided. Each load lock module 50 is used to transfer the wafer W between a vacuum atmosphere space and a non-reduced atmosphere, i.e., a normal pressure atmosphere space. Each load lock module 50 has a load lock chamber 51 configured so that the interior atmosphere can be switched between a normal pressure atmosphere and a vacuum atmosphere. The load lock chamber 51 is provided to connect the vacuum transfer module 40 and the transfer device 20.

[0016] The transfer device 20 is a device that transfers wafers W into and out of the processing device 10. Specifically, the transfer device 20 is a device configured to be able to transfer wafers W between a FOUP (Front-Opening Unified Pod) 900, which is a container that accommodates a plurality of wafers W, and the processing device 10 without exposing the wafers W to the external atmosphere. The transfer device 20 has a load port 101 and a main body 102, which is also referred to as an EFEM device.

[0017] The load port 101 is configured so that a FOUP 900 can be placed thereon, and a plurality of load ports 101 (five in the illustrated example) are arranged, for example, along the width direction of the device (X direction).

[0018] The main body 102 is disposed on the rear side (positive side in the Y direction) of the load port 101; specifically, the main body 102 is disposed adjacent to the load port 101 on the rear side thereof. A load lock chamber 51 is connected to the main body 102; specifically, the load lock chamber 51 is connected to the rear side (positive side in the Y direction), for example. The interior of the main body 102 is maintained at atmospheric pressure. A transfer robot 110 is also provided inside the main body 102, which supports and transfers a wafer W. This transfer robot 110 can transfer the wafer W between, for example, a FOUP 900 placed on the load port 101 and the load lock chamber 51.

[0019] The wafer processing system 1 described above is provided with at least one control device C. The control device C processes computer-executable instructions that cause the wafer processing system 1 to perform the various processes described in this disclosure. The control device C may be configured to control each element of the wafer processing system 1 to perform the various processes described herein. In one embodiment, some or all of the control device C may be included in the wafer processing system 1. The control device C may include a processing unit, a storage unit, and a communication interface. The control device C may be implemented, for example, by a computer. The processing unit may be configured to read from the storage unit a program that provides logic or routines that enable various control operations and execute the read program to perform various control operations. This program may be stored in the storage unit in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit and read from the storage unit by the processing unit for execution. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit) or one or more circuits. The storage unit may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), a SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the wafer processing system 1 via a communication line such as a LAN (Local Area Network).

[0020] <Wafer Processing> Next, a description will be given of wafer processing by the wafer processing system 1 configured as above. The following wafer processing is performed under the control of the control device C.

[0021] First, the wafer W is taken out of the FOUP 900 by the transfer robot 110 and carried into the load lock chamber 51 of the load lock module 50. Then, the load lock chamber 51 is sealed and a vacuum atmosphere is created.

[0022] Thereafter, a gate valve (not shown) on the vacuum transfer chamber 41 side of the load lock chamber 51 is opened, and the wafer W is transferred from the load lock chamber 51 to the vacuum transfer chamber 41 by the transfer mechanism 42 .

[0023] Next, after the gate valve is closed, the gate valve G1 for the processing module 30 in which the target processing is to be performed is opened. Subsequently, the wafer W is loaded into the vacuum processing chamber 31 of the target processing module 30 by the transfer mechanism 42. Thereafter, the gate valve G1 is closed, and the desired processing is performed on the wafer W in the processing module 30.

[0024] After the desired processing is completed, the wafer W is returned from the vacuum processing chamber 31 to the FOUP 900 in the reverse order of the procedure used to carry the wafer W from the FOUP 900 to the vacuum processing chamber 31. This completes the series of wafer processing steps.

[0025] <Transport Device 20> FIGS. 2 and 3 are cross-sectional side views of the transport device 20, with FIG. 2 showing the state when a door 190 (described later) is in a closed position, and FIG. 3 showing the state when the door 190 (described later) is in an open position. FIG. 4 is a cross-sectional plan view of the transport device 20. FIGS. 5 and 6 are a cross-sectional view and a front view of the load port 101, respectively. FIGS. 7 to 10 are a front perspective view, a rear perspective view, a front view, and a rear view, respectively, of the load port 101 with the protective cover removed. FIG. 11 is a partially enlarged view of a cutout portion 144 (described later) of the load port 101. FIGS. 12 and 13 are a front view and a cross-sectional view, respectively, of an adjustment mechanism 220 (described later) of the main body 102. FIG. 14 is a perspective view of the transport robot 110.

[0026] As shown in FIGS. 2 to 4, the transfer device 20 has the above-mentioned load port 101 and main body 102, and further has a lower housing section 103 for housing various components.

[0027] The main body 102 has a substantially rectangular parallelepiped housing 120. The housing 120 has a front wall 121, a rear wall 122, a pair of side walls 123, a bottom wall 124, and a top wall 125.

[0028] The front wall 121 extends in the apparatus width direction (X direction) in plan view on the front side (negative side in the Y direction) of the main body 102. The load port 101 and the lower accommodation section 103 are connected to the front wall 121. The lower accommodation section 103 is disposed below the load port 101. The front wall 121 is provided with an opening 126 in which the load port 101 is installed. The front wall 121 also is provided with an opening 127 which is an opening for loading and unloading the wafer W into and from the lower accommodation section 103.

[0029] The rear wall 122 faces the front wall 121 in the depth direction of the apparatus and extends in the width direction of the apparatus in a plan view on the rear side (positive side in the Y direction) of the main body 102. The load lock module 50 is connected to the rear wall 122. An opening 128 is provided in the rear wall 122 at a position corresponding to the load lock chamber 51. The opening 128 is provided in a portion of the rear wall 122 at approximately the same vertical position as the transfer position in the load lock chamber 51. The transfer position in the load lock chamber 51 is the vertical position of the wafer W when the wafer W is transferred between the load lock chamber 51 and the transfer robot 110.

[0030] The pair of side walls 123 face each other in the width direction of the device and extend in the depth direction of the device in a plan view. The bottom wall 124 and the ceiling wall 125 face each other in the vertical direction and extend in the horizontal direction (X direction and Y direction).

[0031] The main body 102 has an internal space formed by a front wall 121, a rear wall 122, side walls 123, a bottom wall 124, and a ceiling wall 125. The internal space is vertically divided into a lower transfer space S1 and an upper storage space S2 by a partition wall 129 provided between the bottom wall 124 and the ceiling wall 125. As will be described later, purified gas is supplied from the storage space S2 to the transfer space S1, and an opening 130 for supplying the gas is provided in the partition wall 129.

[0032] The lower accommodating section 103 is configured by stacking a plurality of accommodating sections in the vertical direction, and includes, for example, an upper first accommodating section 103A and a lower second accommodating section 103B.

[0033] The first accommodation section 103A accommodates a function expansion module including at least one of a measurement module that measures a film on the wafer W, an inspection module that inspects the wafer W for defects, and an alignment module that adjusts the orientation position of the wafer W. The opening 127 described above is provided in the front wall 121 of the main body 102 at a position corresponding to the first accommodation section 103A.

[0034] The measurement module or inspection module accommodated in first accommodation unit 103A includes, for example, a module having a mounting table (not shown) on which wafer W is placed and configured to be movable in the horizontal direction, and an imaging unit (not shown) that images the wafer W placed on the mounting table and moving in the horizontal direction. Instead of or in addition to this module, the measurement module or inspection module may include a module configured to use the imaging unit (not shown) to image the wafer W supported and moved in the horizontal direction by transfer robot 110 inserted therein through opening 127.

[0035] The second accommodation unit 103B accommodates electrical components including a power supply unit, etc. No opening such as the opening 127 is provided in the second accommodation unit 103B. That is, of the first accommodation unit 103A and the second accommodation unit 103B, only the first accommodation unit 103A, which is located on the upper side, is provided with an opening that serves as a loading / unloading port for the wafer W.

[0036] 5 to 10 , the load port 101 has a connecting plate 140 as a connecting member that connects the load port 101 to the housing 120 of the main body 102. When connected to the housing 120, the connecting plate 140 is attached to the front surface of the front wall 121 so as to cover the opening 126.

[0037] The connecting plate 140 has a structure in which an upper connecting plate 140A and a lower connecting plate 140B are integrated together. The upper connecting plate 140A extends and protrudes from above the mounting portion 150 (described later). The lower connecting plate 140B extends so as to cover the rear surface of the mounting portion 150 (described later).

[0038] A pair of openings 141 serving as access portions are provided at both upper corners of the upper connecting plate 140A. When the connecting plate 140 is connected to the housing 120, adjustment screw portions 222 of the adjustment mechanism 220 (described later) are exposed from each opening 141 when viewed from the front side.

[0039] Further, an opening 142 serving as a loading / unloading port for loading / unloading wafers W into / from the FOUP 900 is provided below the pair of openings 141 in the center of the upper connecting plate 140A.

[0040] The lower connecting plate 140B is provided with a slit 143 extending vertically for raising and lowering an arm 202 of a moving mechanism 200, which will be described later.

[0041] Furthermore, a notch 144 is provided at the lower end of the lower connecting plate 140B in the center in the device width direction (X direction). A positioning pin 230 (described later) provided on the front wall 121 of the main body 102 is engaged in the notch 144. As shown in Figure 11, the upper part of the notch 144 forms a positioning surface 144a that sets the position of the load port 101 in the device width direction. Furthermore, the notch 144 has a tapered shape that widens from the top to the bottom.

[0042] As will be described later, when connecting the load port 101 to the housing 120, the positioning pin 230 is engaged with the notch 144, and then the load port 101 is rotated around the positioning pin 230 as a fulcrum. This adjusts the level of the load port 101 in the device width direction (X direction).

[0043] Fixing screw holes 145 are provided in the four corners of the connecting plate 140. That is, a pair of fixing screw holes 145 is provided in both upper corners of the upper connecting plate 140A, and a pair of fixing screw holes 145 is provided in both lower corners of the lower connecting plate 140B. Furthermore, at both upper corners of the upper connecting plate 140A, the pair of fixing screw holes 145 is provided on the outer side of the pair of openings 141 in the device width direction.

[0044] A fixing screw 146, which will be described later, is inserted into and threaded into the fixing screw hole 145. The fixing screw 146 fastens the connecting plate 140 to the front wall 121 of the main body 102 via an adjustment mechanism 220, which will be described later. The fixing screw hole 145 is larger than the fixing screw 146, and a gap is formed between the fixing screw hole 145 and the fixing screw 146.

[0045] The load port 101 has a mounting portion 150. The mounting portion 150 has an isolation cover 160 and a main cover 161.

[0046] The isolation cover 160 forms an accommodation space S3 between itself and the front surface of the connecting plate 140, for accommodating a moving mechanism 200 (described later). The isolation cover 160 also covers the slit 143 from the front side. By providing the isolation cover 160, it is possible to prevent gas in the transfer space S1 of the main body 102 from leaking outside the transfer device 20.

[0047] The cover 161 forms an accommodation space S4 between the connecting plate 140 and the isolation cover 160, for accommodating the advancing / retreating mechanism 180 (described later). The cover 161 also covers the advancing / retreating mechanism 180 (described later) and the isolation cover 160. In this embodiment, the cover 161 covers the front wall and top wall of the isolation cover 160, but does not cover the bottom wall.

[0048] The bottom wall of the isolation cover 160 and the bottom wall of the main cover 161 form the bottom surface 150a of the mounting section 150. The bottom surface 150a is inclined upward (positive side in the Z direction) from the rear side (positive side in the Y direction) in the device depth direction to the front side (negative side in the Y direction). Because the bottom surface 150a is inclined in this manner, when connecting the load port 101 to the housing 120, as will be described later, the positioning pin 230 can be easily engaged with the cutout portion 144.

[0049] A pair of slide members 162 are provided on the bottom surface 150a of the mounting section 150. The slide members 162 extend in the device depth direction (Y direction) from the rear end to the front end of the bottom surface 150a. As described below, when the load port 101 is connected to the housing 120, the slide members 162 slide on the upper surface of the first storage section 103A of the lower storage section 103. For this reason, the slide members 162 are made of a material that easily slides on the upper surface of the first storage section 103A, such as resin (rubber). The slide members 162 may be provided on the entire bottom surface 150a, but their contact area with the upper surface of the first storage section 103A is reduced to reduce resistance against the upper surface. When the load port 101 is connected to the main body 102, the slide members 162 are positioned away from the upper surface of the first storage section 103A.

[0050] The load port 101 also includes a stage 170 and a reciprocating mechanism 180 .

[0051] The stage 170 includes a mounting surface 170a for the FOUP 900 that accommodates the wafers W. Specifically, the upper surface of the stage 170 serves as the mounting surface 170a for the FOUP 900. The stage 170 supports the FOUP 900 on the mounting surface 170a. The FOUP 900 placed on the mounting surface 170a is disposed such that a lid 901, which is a door of the FOUP 900, faces the opening 142 of the connecting plate 140. The stage 170 is provided on the upper surface of the main cover 161 described above.

[0052] A nozzle 171 is provided on the stage 170 to supply gas to the FOUP 900. Specifically, the nozzle 171 supplies an inert gas such as nitrogen gas into the FOUP 900 placed on the stage 170. The nozzle 171 is movable by the advancing / retracting mechanism 180, and specifically, is movable together with the stage 170 which is moved by the advancing / retracting mechanism 180. The nozzle 171 protrudes from the bottom surface of the stage 170, with its lower portion protruding into the storage space S4 described above.

[0053] The advancing / retracting mechanism 180 advances and retreats the stage 170 in the horizontal direction. Specifically, the advancing / retracting mechanism 180 moves the stage 170 back and forth to advance and retreat relative to the opening 142. More specifically, the advancing / retracting mechanism 180 moves the stage 170 between a front position and a rear position. The front position is a position where the FOUP 900 is transferred between an externally provided transfer device for the FOUP 900 and the stage 170. The rear position is a position where the wafer W is transferred between the FOUP 900 and the inside of the main body 102 via the opening 142.

[0054] The advancing / retreating mechanism 180 has, for example, a guide 181 and a support member 182. The guide 181 guides the movement of the stage 170 in the depth direction of the device. Specifically, the guide 181 guides the movement of the support member 182, which supports the stage 170, in the front-to-rear direction. The support member 182 has an upper end to which the stage 170 is connected, and a lower end to which the guide 181 extends so as to be movable in the depth direction of the device. The advancing / retreating mechanism 180 is housed in the above-mentioned housing space S4.

[0055] The load port 101 also has a door 190 and a moving mechanism 200 .

[0056] The door 190 opens and closes the opening 142. The door 190 is configured to be able to unlock the lid 901 of the FOUP 900 and to hold the lid 901. When the door 190 is set to the open state while holding the unlocked lid 901, the lid 901 is opened. When the door 190 opens or closes, the door 190 moves within the main body 102 (specifically, within the transfer space S1).

[0057] The movement mechanism 200 functions as an elevator mechanism that opens and closes the door 190 and the lid 901, and raises and lowers them. The movement mechanism 200 includes, for example, an actuator 201, an arm 202, and an elevator 203.

[0058] The actuator 201 drives the lifting and lowering of the door 190. Specifically, the actuator 201 drives the lifting and lowering of an elevator 203 that supports the door 190 via an arm 202. The actuator 201 is provided inside the load port 101 so as to extend in the vertical direction (Z direction). The actuator 201 may be an electro-pneumatic actuator such as an air cylinder, or an electro-mechanical actuator.

[0059] The arm 202 supports the door 190 and is driven by an actuator 201. The upper end of the arm 202 is connected to the door 190, which can be located inside the main body 102 (specifically, inside the transfer space S1), and the lower end of the arm 202 is connected via an elevator 203 to the actuator 201, which is located inside the load port 101, i.e., outside the main body 102. In order to enable the arm 202 to be raised and lowered in this connected state, the front wall 121 of the main body 102 is provided with a slit 143, as described above. That is, the front wall 121 of the main body 102 is provided with a slit 143 that is configured to allow the arm 202 to be inserted therethrough and through which the arm 202 passes when the arm 202 is raised and lowered.

[0060] The lifting body 203 moves up and down along the actuator 201, that is, moves in the vertical direction.

[0061] The movement mechanism 200 is configured to be able to move the door 190 in the depth direction of the device (Y direction). For example, an arm 202 that supports the door 190 is connected to an elevator 203 so as to be able to move in the front-rear direction.

[0062] The moving mechanism 200 is accommodated in the accommodation space S4 of the above-described main cover 161. Specifically, the accommodation space S4 accommodates the parts of the moving mechanism 200 that are located outside the main body 102, i.e., the actuator 201 of the moving mechanism 200, part of the arm 202, and the lifting body 203.

[0063] The moving mechanism 200 also has an actuator (not shown) that drives the forward and backward movement of the door 190. The moving mechanism 200 is controlled by a control device C, and more specifically, the above-mentioned actuators of the moving mechanism 200 and the actuator 201 are controlled by the control device C.

[0064] The load port 101 also has a first protective cover 210 and a second protective cover 211 .

[0065] The first protective cover 210 covers the connecting plate 140. Specifically, the first protective cover 210 covers the upper connecting plate 140A except for the opening 142, and covers the lower connecting plate 140B except for the mounting portion 150. The second protective cover 211 covers the lower part of the mounting portion 150. Specifically, the second protective cover 211 covers the side wall of the isolation cover 160 and the side wall of the main cover 161.

[0066] As shown in FIGS. 2, 3 and 5 , the main body 102 has an adjustment mechanism 220 .

[0067] The adjustment mechanism 220 adjusts the level of the load port 101 in the device depth direction (Y direction) relative to the housing 120 of the main body 102, and also adjusts its position in the device depth direction. The adjustment mechanism 220 is provided on the front surface of the front wall 121 of the main body 102, at a position corresponding to the pair of openings 141 of the load port 101.

[0068] As shown in FIGS. 12 and 13 , the adjustment mechanism 220 includes a block body 221 and a pair of adjustment screws 222 .

[0069] The block body 221 has a substantially rectangular parallelepiped shape and is attached to the front surface of the front wall 121.

[0070] The adjustment screw portions 222 are provided in pairs at both ends in the device width direction (X direction) of the block body 221. Each adjustment screw portion 222 has a pair of pull screws 223 and push screws 224.

[0071] The draw screws 223 are provided in pairs in the vertical direction (Z direction). Because the draw screws 223 are provided in pairs in this way, tilting of the block body 221 is suppressed when the level of the load port 101 in the device depth direction is adjusted using the adjustment mechanism 220, as will be described later. A tip 223a of the draw screws 223 is threaded into the front wall 121. The draw screws 223 are inserted through the block body 221, and a screw head 223b of the draw screws 223 is exposed at the front surface of the block body 221.

[0072] The push screw 224 is provided on the outer side of the pull screw 223 in the device width direction. A tip 224a of the push screw 224 abuts against or is separated from the front surface of the front wall 121. The push screw 224 is inserted through the block body 221, and a screw head 224b of the push screw 224 is exposed at the front surface of the block body 221.

[0073] Each adjustment screw portion 222 is provided at a position corresponding to an opening 141 of the load port 101. When the connecting plate 140 is connected to the housing 120, the adjustment screw portion 222 is exposed from the opening 141 when viewed from the front. An operator can access the adjustment screw portion 222 from the opening 141.

[0074] The block body 221 has a fixing screw hole 225 formed on the outer side of the push screw 224 in the device width direction. The fixing screw hole 225 is provided in a position corresponding to the fixing screw hole 145 of the load port 101. A fixing screw 146 is inserted into the fixing screw hole 225 and screwed into it. That is, the fixing screw 146 is screwed into the fixing screw hole 145 of the load port 101 and the fixing screw hole 225 of the adjustment mechanism 220, and is further screwed into the front wall 121 of the main body 102. The fixing screw hole 225 is larger than the fixing screw 146, and a gap is formed between the fixing screw hole 225 and the fixing screw 146.

[0075] As will be described later, when connecting the load port 101 to the housing 120, the distance between the block body 221 and the front wall 121 is adjusted by tightening or loosening at least one of the pull screw 223 or the push screw 224 of the adjustment mechanism 220. This adjusts the level of the load port 101 in the device depth direction (Y direction). At this time, the position of the load port 101 in the device depth direction is also adjusted.

[0076] As shown in FIGS. 2, 3 and 5 , the main body 102 also has a positioning pin 230 .

[0077] The positioning pin 230 protrudes from the front surface of the front wall 121 of the main body 102 and is provided at a position corresponding to the cutout 144 of the load port 101. The positioning pin 230 is engaged with the cutout 144. As shown in Figure 11, the upper part of the cutout 144 forms a positioning surface 144a, and the position of the load port 101 in the device width direction is set by engaging the positioning pin 230 with the positioning surface 144a of the cutout 144.

[0078] As shown in FIGS. 2 and 3 , the main body 102 also has a door 240 and a lifting mechanism 250 .

[0079] The door 240 opens and closes the opening 128 in the rear wall 122. The lifting mechanism 250 raises and lowers the door 240 to open and close the opening 128. The door 240 and the lifting mechanism 250 are provided inside the main body 102 (specifically, inside the transfer space S1).

[0080] The lifting mechanism 250 has an actuator (not shown) that drives the lifting and lowering of the door 240. The lifting mechanism 250 is controlled by a control device C, and more specifically, the actuator of the lifting mechanism 250 is controlled by the control device C.

[0081] The main body 102 also has the transfer robot 110 that supports and transfers the wafer W as described above. Specifically, the transfer robot 110 transfers the wafer W between the opening 142 and the opening 128, etc. The transfer robot 110 is housed in the transfer space S1 described above and placed on the bottom wall 124.

[0082] As shown in FIG. 14, the transfer robot 110 has a horizontal arm 260 and a vertical articulated arm 270 as transfer arms.

[0083] The horizontal arm 260 is configured to be able to horizontally transport the wafer W. The horizontal arm 260 is, for example, an articulated arm, and includes a fork 261, a first arm 262, and a second arm 263.

[0084] The fork 261 supports the wafer W at its tip end. The fork 261 is connected to the tip end of a first arm 262 at its base end so as to be rotatable about an axis (hereinafter referred to as the "vertical axis") extending in the vertical direction (Z direction). The first arm 262 is connected to the tip end of a second arm 263 so as to be rotatable about the vertical axis on the base end side. The second arm 263 is connected to the tip of a vertical articulated arm 270 so as to be rotatable about the vertical axis.

[0085] The vertical articulated arm 270 is made up of an articulated arm and is configured to be able to at least raise and lower the horizontal arm 260. In this embodiment, the vertical articulated arm 270 is configured to be able to move the horizontal arm 260 in the vertical direction (Z direction) and the device width direction (X direction). The vertical articulated arm 270 has an arm 271 that is provided so as to be able to pivot in the vertical direction, and a base 272 that is connected to the arm 271 and is fixed to a support stand 280, which will be described later.

[0086] The arm 271 includes, for example, a first arm 271A and a second arm 271B. The horizontal arm 260 is connected to the tip side of the first arm 271A. The first arm 271A is connected to the tip side of the second arm 271B at its base end so as to be rotatable about an axis extending in the depth direction of the device (hereinafter referred to as the "front-rear axis"). The second arm 271B is connected to the upper end of the base 272 so as to be rotatable about the front-rear axis on its base end side.

[0087] The base 272 supports the horizontal arm 260 via the arm 271. The base 272 has a pair of plate-like members 273 and a bottom member 274.

[0088] The pair of plate-like members 273 are arranged side by side in the device depth direction (Y direction). The second arm 271B is pivotally supported between the pair of plate-like members 273.

[0089] The plate-shaped member 273 extends vertically within the transfer space S1. When viewed from the depth direction of the device, the plate-shaped member 273 has a substantially isosceles triangular shape that includes a pair of long sides extending vertically and a short side connecting the pair of long sides.

[0090] The bottom surface member 274 is disposed so as to connect the lower ends of the pair of plate-like members 273. A plurality of, for example, two positioning pins (not shown) are provided on the bottom surface of the bottom surface member 274. The positioning pins are inserted into pin holes provided in a support base 280, which will be described later.

[0091] As shown in FIGS. 2 to 4, the main body 102 has a support base 280 and a pair of exhaust boxes 290 serving as exhaust units.

[0092] The support base 280 and the pair of exhaust boxes 290 are provided on the bottom wall 124 and arranged side by side in the apparatus width direction (X direction). Specifically, the pair of exhaust boxes 290 are arranged side by side on both sides of the support base 280 in the apparatus width direction. The front surface of the support base 280 extending in the apparatus width direction (negative side surface in the Y direction) is continuous with the front surface of the exhaust box 290. Furthermore, the rear surface of the support base 280 extending in the apparatus width direction (positive side surface in the Y direction) is continuous with the rear surface of the exhaust box 290.

[0093] The support base 280 fixes and supports the transfer robot 110. The upper surface of the support base 280 is provided with a plurality of, for example, two pin holes (not shown) at positions corresponding to the positioning pins of the transfer robot 110 described above. When the transfer robot 110 is placed on the support base 280, the positioning pins are inserted into the pin holes. This fixes the transfer robot 110 at a desired position relative to the support base 280.

[0094] The exhaust box 290 exhausts the gas from the transfer space S1. The exhaust box 290 has a fan filter unit (not shown) inside, and filters the gas in the transfer space S1 before discharging it. In this embodiment, the filtered gas is returned to the accommodation space S2 as described below. Note that the filtered gas may be discharged outside the main body 102 (specifically, for example, into a clean room in which the transfer device 20 is installed).

[0095] The main body 102 also has a fan filter unit (FFU) 300 as an air blowing unit.

[0096] The FFU 300 supplies purified gas, i.e., gas from which particles have been filtered, from above to below in the transfer space S1. The FFU 300 is provided in the accommodation space S2 described above, and is supported, for example, by the partition wall 129. As described above, the partition wall 129 has an opening 130 formed therein, and the FFU 300 supplies purified gas to the transfer space S1 through the opening 130.

[0097] In this embodiment, one end of a supply pipe 310 that supplies an inert gas such as nitrogen gas to the accommodation space S2 is connected to the main body 102. The other end of the supply pipe 310 is connected to a gas supply mechanism 311. The gas supply mechanism 311 includes, for example, an inert gas supply source, a switching valve that switches on / off the supply of the inert gas, and a flow rate adjustment valve that adjusts the flow rate of the inert gas.

[0098] Since the supply pipe 310 as described above is provided, in this embodiment, the FFU 300 can supply purified inert gas to the accommodation space S2.

[0099] In this embodiment, the inert gas is circulated inside the main body 102 by the FFU 300 and the exhaust box 290. The inert gas circulates through a circulation path that is composed of, for example, the transfer space S1, the storage space S2, and a return path (not shown). That is, the purified inert gas is sent downward from the storage space S2 to the transfer space S1 through the opening 130 by the FFU 300, reaches the lower end of the transfer space S1, and then is returned to the storage space S2 by the exhaust box 290 through the return path.

[0100] The return path is provided to extend vertically through the transfer space S1 and the storage space S2, and its arrangement is arbitrary. For example, the return path may be provided along the rear surface of the front wall 121 of the main body 102, or may be provided inside a pillar that constitutes the main body 102.

[0101] In the above example, an inert gas is circulated inside the main body 102. Alternatively, dry air may be circulated inside the main body 102. In this case, for example, dry air is supplied from the gas supply mechanism 311 to the accommodation space S2 via the supply pipe 310.

[0102] <Method of Connecting the Load Port 101> Next, a method of connecting the load port 101 to the housing 120 of the main body 102 will be described. Fig. 15 is an explanatory diagram showing how the load port 101 is connected to the housing 120. Fig. 16 is an explanatory diagram showing how the level of the load port 101 in the depth direction of the device (Y direction) is adjusted. Fig. 17 is an explanatory diagram showing how the level of the load port 101 in the width direction of the device (X direction) is adjusted.

[0103] 15(a), the load port 101, with the first protective cover 210 and second protective cover 211 removed, is placed on the top surface of the first accommodation section 103A of the lower accommodation section 103. Because the bottom surface 150a of the placement section 150 is inclined upward from the rear side (positive side in the Y direction) to the front side (negative side in the Y direction), the load port 101 is placed with an incline toward the front.

[0104] 15(b), the load port 101 is then moved rearward in the depth direction of the device and positioned in front of the front wall 121. A slide member 162 is provided on the bottom surface 150a, allowing the load port 101 to move smoothly.

[0105] 15(c), the load port 101 is raised rearward and the positioning pin 230 is engaged with the cutout 144. The slide member 162 moves away from the top surface of the first accommodation section 103A, and the load port 101 is supported by the positioning pin 230. As described above, the upper part of the cutout 144 forms the positioning surface 144a, and the position of the load port 101 in the device width direction is set by the positioning pin 230.

[0106] Next, the four corners of the connecting plate 140 of the load port 101 are temporarily fixed to the front wall 121 of the housing 120 with fixing screws 146. Specifically, the fixing screws 146 are threaded into the fixing screw holes 145 of the load port 101 and the fixing screw holes 225 of the adjustment mechanism 220, and are further threaded into the front wall 121 of the main body 102.

[0107] 15D, a spirit level 500 is placed on the stage 170 of the load port 101. Subsequently, the spirit level 500 is used to measure the level (horizontal degree) of the load port 101 relative to the housing 120.

[0108] 15( e), the level of the load port 101 relative to the housing 120 is adjusted based on the measurement results of the level 500. Specifically, the level of the load port 101 in the device depth direction (Y direction) and the level of the load port 101 in the device width direction (X direction) are adjusted. Note that if the measurement results of the level 500 show that the level of the load port 101 meets the required specifications, level adjustment of the load port 101 is omitted.

[0109] 16 , the level of the load port 101 in the device depth direction (Y direction) is adjusted using the adjustment mechanism 220. When the front wall 121 and the connecting plate 140 are temporarily fastened as described above, the adjustment mechanism 220 is positioned close to the connecting plate 140. At this time, the adjustment screw portion 222 is exposed from the opening, and the operator can access the adjustment screw portion 222 from the opening 141.

[0110] To tilt the load port 101 forward (negative side in the Y direction), the pair of pull screws 223 of the adjustment mechanism 220 are loosened, and the press screw 224 is tightened to push it in. To tilt the load port 101 rearward (positive side in the Y direction), the pair of pull screws 223 of the adjustment mechanism 220 are loosened, and the press screw 224 is loosened and retracted. Then, using the positioning pin 230 engaged in the cutout portion 144 as a fulcrum, the upper part of the load port 101 is moved forward or rearward as described above to adjust the level in the depth direction of the device. At this time, the level of the load port 101 can be adjusted while checking the level measured by the level 500.

[0111] Furthermore, when the upper portion of the load port 101 is moved forward or backward using the adjustment mechanism 220 in this manner, the position of the load port 101 in the device depth direction is also adjusted.

[0112] 17 , level adjustment of the load port 101 in the device width direction (X direction) is performed by rotating the upper part of the load port 101 in the X direction, using the positioning pin 230 engaged in the cutout portion 144 as a fulcrum. Level adjustment of the load port 101 in the device width direction includes, for example, coarse adjustment and fine adjustment.

[0113] When coarsely adjusting the level of the load port 101 in the device width direction, the pair of pull screws 223 of the adjustment mechanism 220 are loosened, and the pair of fixing screws 146 of the lower connecting plate 140B are loosened, and the load port 101 is moved in the device width direction together with the block body 221. At this time, the level of the load port 101 in the device width direction can be adjusted while checking the level of the load port 101 measured by the level 500. Alternatively, the amount of movement (movement angle) of the load port 101 in the device width direction may be set based on the measurement results of the level 500 so that the level of the load port 101 satisfies specifications.

[0114] When fine-tuning the level of the load port 101 in the device width direction, the fixing screws 146 at the four corners of the connecting plate 140 are loosened, and the load port 101 is moved in the device width direction using the gaps between the fixing screw holes 145 and the fixing screws 146. In this case, the block body 221 is not moved.

[0115] Once the level of the load port 101 relative to the housing 120 has been adjusted as described above, the fixing screws 146 at the four corners of the connecting plate 140 are fully tightened to secure the load port 101 to the front wall 121. Furthermore, a first protective cover 210 is attached to the connecting plate 140, and a second protective cover 211 is attached to the bottom of the mounting portion 150.

[0116] This completes the series of steps for connecting the load port 101 to the housing 120. Each step may be performed manually by an operator, or may be performed automatically by a device that executes each step.

[0117] <Major Advantages of the Present Embodiment> Conventionally, a mechanism for adjusting the level of a load port was provided on the rear side of the load port, but the load port's connecting plate did not have an opening for accessing the adjustment mechanism, as in the present embodiment. For this reason, the load port was connected to the housing of the main body (EFEM apparatus) using the following procedure. First, the positioning pins of the housing were inserted into the load port, and the housing and load port were temporarily fixed with fixing screws. Next, a spirit level was installed on the load port's stage to measure the level (horizontalness) of the load port. Next, if the level of the load port does not meet the specifications, the load port was temporarily removed from the housing and the adjustment mechanism was adjusted. As described above, conventional load ports do not have the opening of the present embodiment, and the adjustment mechanism cannot be accessed from the front, so this load port removal work is necessary. Next, the load port is reattached to the housing, and the level is measured using the spirit level. The above-mentioned work process is then repeated until the level of the load port meets the specifications. As described above, when using conventional load ports, the adjustment mechanism cannot be accessed from the load port side, so the load port must be removed, the adjustment mechanism adjusted, and the load port reattached repeatedly, which requires a lot of work.

[0118] In this regard, the load port 101 of this embodiment is provided with a pair of openings 141 at both upper corners of the upper connecting plate 140A. When the connecting plate 140 is connected to the housing 120, the adjustment screw 222 of the adjustment mechanism 220 is exposed through the openings 141. An operator can access the adjustment screw 222 through the openings 141. Therefore, when adjusting the level of the load port 101, there is no need to remove the load port 101 as in the past. Level adjustment can be performed while the load port 101 is attached to the housing 120. As a result, the number of work steps can be reduced and the workability of level adjustment of the load port 101 at manufacturing sites and start-up sites can be improved. Furthermore, the maintainability of the load port 101 can be improved, and level adjustment of the load port 101 can be performed efficiently.

[0119] Furthermore, in this embodiment, the adjustment screw 222 is accessed from the front side (negative side in the Y direction) of the load port 101 via the opening 141, and the level of the load port 101 in the device depth direction is adjusted. Furthermore, the top of the load port 101 is accessed from the front side (negative side in the Y direction) of the load port 101, and the top of the load port 101 is moved forward or backward using the positioning pin 230 as a fulcrum, thereby adjusting the level of the load port 101 in the device width direction. In this way, level adjustment of the load port 101 is performed only from the front side of the load port 101, improving operability.

[0120] Furthermore, in this embodiment, the level of the load port 101 can be adjusted while the load port 101 is attached to the housing 120 and the level of the load port 101 is being checked using the level 500. This improves the accuracy of level adjustment of the load port 101. It also makes it possible to reduce the time required to adjust the level of the load port 101.

[0121] Here, in a conventional housing, a Y-direction adjustment mechanism is provided at a position corresponding to the top of the load port to adjust the level of the load port in the depth direction (Y direction) of the device, and an X-direction adjustment mechanism is provided at a position corresponding to the bottom of the load port to adjust the level of the load port in the width direction (X direction) of the device. The X-direction adjustment mechanism has two positioning pins and a block body to which the positioning pins are attached. The two positioning pins are each engaged with two notches formed in the bottom of the load port. At least one end of the block body is configured to be movable in the vertical direction. Then, with the positioning pins engaged in the notches, the level of the load port in the width direction of the device is adjusted by moving at least one end of the block body in the vertical direction.

[0122] In this regard, according to this embodiment, the adjustment mechanisms 220 having the adjustment screws 222 are concentrated at the top of the load port 101, and the level of the load port 101 in the device depth direction is adjusted. Furthermore, in this embodiment, a single positioning pin 230 is provided on the front wall 121, and the positioning pin 230 engaged in the cutout 144 is used as a fulcrum to move the top of the load port 101 forward or rearward, thereby adjusting the level of the load port 101 in the device width direction. Therefore, there is no need for two adjustment mechanisms, one above and one below, as in the prior art, and level adjustment of the load port 101 can be carried out simply.

[0123] In particular, in this embodiment, the lower accommodation section 103 is provided below the load port 101, making it difficult to access the lower part of the load port 101. For this reason, consolidating the adjustment mechanisms 220 above the load port 101 contributes to improving workability, and this embodiment is also useful from this perspective.

[0124] There is a demand for reducing the on-site equipment footprint of the conveying device 20. By reducing the equipment footprint, it is possible to install more equipment on-site, thereby improving product productivity.

[0125] In the conventional transfer device, a transfer robot having a horizontal articulated arm is provided in the main body (EFEM device). When a horizontal articulated arm is used, the arms constituting the horizontal articulated arm are long in the horizontal direction, and the operating range of the transfer robot extends in the horizontal direction (X direction and Y direction). Therefore, the conventional transfer device requires a large space in the depth direction (Y direction) of the device.

[0126] In this regard, in the transfer device 20 of this embodiment, the transfer robot 110 has a vertical articulated arm 270, and the operating range of the vertical articulated arm 270 extends in the vertical direction (Z direction) and the device width direction (X direction). This allows the length of the main body 102 in the device depth direction (Y direction) to be reduced. Furthermore, the horizontal arm 260 supported by the vertical articulated arm 270 moves horizontally, but the first arm 262 and the second arm 263 constituting the horizontal arm 260 are short. From this perspective, the length of the main body 102 in the device depth direction (Y direction) can also be reduced. Therefore, according to the transfer device 20 of this embodiment, the length of the main body 102 in the device depth direction can be reduced, thereby reducing the device footprint. Furthermore, since the device footprint can be reduced in this way and the work of connecting the load port 101 to the housing 120 can be made more efficient, the device cost can be reduced.

[0127] Furthermore, the cutout 144 in this embodiment is provided in the center of the lower end of the lower connecting plate 140B in the device width direction (X direction). Therefore, when the positioning pin 230 is engaged with the cutout 144, the positioning pin 230 can appropriately support the load port 101.

[0128] Furthermore, the cutout 144 in this embodiment has a tapered shape that widens from top to bottom, and further has a positioning surface 144a at the top. Therefore, when the positioning pin 230 is engaged with the cutout 144, the positioning pin 230 can be easily inserted from below the cutout 144. Furthermore, by engaging the positioning pin 230 with the positioning surface 144a, the position of the load port 101 in the device width direction can be appropriately fixed and set.

[0129] Furthermore, in the load port 101 of this embodiment, the bottom surface 150a of the mounting section 150 is inclined upward (positive side in the Z direction) from the rear side (positive side in the Y direction) in the device depth direction to the front side (negative side in the Y direction). Because the bottom surface 150a is inclined in this manner, when the load port 101 is connected to the housing 120, the load port 101 is first placed on the upper surface of the first accommodation section 103A with the load port 101 inclined forward. Then, to engage the positioning pin 230 with the cutout 144, the load port 101 simply needs to be raised rearward. This makes it easier to engage the positioning pin 230 with the cutout 144. Furthermore, because the bottom surface 150a is inclined, the center of gravity of the load port 101 can be located in the center in a plan view, stabilizing the load port 101.

[0130] Furthermore, in the load port 101 of this embodiment, a slide member 162 is provided on the bottom surface 150a. Therefore, when the load port 101 is connected to the housing 120, the load port 101 can be smoothly moved on the upper surface of the first accommodation section 103A.

[0131] Second Embodiment FIGS. 18 and 19 are a front view and a cross-sectional view, respectively, of an adjustment mechanism 400 of a load port 101. FIG.

[0132] In the first embodiment, the adjustment mechanism 220 was provided in the housing 120 (front wall 121) of the main body 102, but in the second embodiment, the adjustment mechanism 400 is provided in the upper connecting plate 140A of the load port 101. Also, in the first embodiment, an opening 141 was provided in the upper connecting plate 140A as an access portion to the adjustment mechanism 220, but in the second embodiment, an adjustment screw portion 402 is used as an access portion to a block body 401 of the adjustment mechanism 400, as will be described later. That is, in the second embodiment, the opening 141 is not provided in the upper connecting plate 140A.

[0133] As shown in FIGS. 18 and 19, the adjustment mechanism 400 has a block body 401 and a pair of adjustment screws 402 .

[0134] The block body 401 has a substantially rectangular parallelepiped shape and is attached to the rear surface of the upper connecting plate 140A.

[0135] The pair of adjustment screws 402 are provided at both upper corners of the upper connecting plate 140A. That is, the pair of adjustment screws 402 are provided at the same positions as the pair of openings 141 in the first embodiment. Each adjustment screw 402 has a pair of pull screws 403 and push screws 404.

[0136] The draw screws 403 are provided in pairs in the vertical direction (Z direction). Tips 403a of the draw screws 403 are threaded into the block body 401. The draw screws 403 pass through the upper connecting plate 140A, and screw heads 403b of the draw screws 403 are exposed at the front surface of the upper connecting plate 140A.

[0137] The push screw 404 is provided on the outer side in the device width direction of the pull screw 403. A tip 404a of the push screw 404 abuts against or moves away from the front surface of the block body 401. The push screw 404 is inserted through the upper connecting plate 140A, and a screw head 404b of the push screw 404 is exposed at the front surface of the upper connecting plate 140A.

[0138] As described above, the screw head 403b of the pull screw 403 and the screw head 404b of the push screw 404 are exposed on the front surface of the upper connecting plate 140A, so that the operator can access the adjustment screw portion 402.

[0139] The block body 401 has a fixing screw hole 405 formed on the outer side of the push screw 404 in the device width direction. The fixing screw hole 405 is provided in a position corresponding to the fixing screw hole 145 of the load port 101. A fixing screw 146 is inserted into the fixing screw hole 405 and screwed into it. That is, the fixing screw 146 is screwed into the fixing screw hole 145 of the load port 101 and the fixing screw hole 405 of the adjustment mechanism 400, and is further screwed into the front wall 121 of the main body 102. The fixing screw hole 405 is larger than the fixing screw 146, and a gap is formed between the fixing screw hole 405 and the fixing screw 146.

[0140] The level of the load port 101 in the depth direction (Y direction) of the device is adjusted using the adjustment mechanism 400 configured as described above.

[0141] To tilt the load port 101 forward (negative side in the Y direction), the pair of pull screws 403 of the adjustment mechanism 400 are loosened, and the press screw 404 is tightened to push it in. To tilt the load port 101 rearward (positive side in the Y direction), the pair of pull screws 403 of the adjustment mechanism 400 are loosened, and the press screw 404 is loosened and retracted. Then, using the positioning pin 230 engaged in the cutout portion 144 as a fulcrum, the upper part of the load port 101 is moved forward or rearward as described above to adjust the level in the depth direction of the device. At this time, the level of the load port 101 can be adjusted while checking the level measured by the level 500.

[0142] Furthermore, when the upper portion of the load port 101 is moved forward or backward using the adjustment mechanism 400 in this manner, the position of the load port 101 in the device depth direction is also adjusted.

[0143] According to this embodiment, when connecting the connecting plate 140 to the housing 120, the worker can access the adjustment screw portion 402 exposed on the front surface of the upper connecting plate 140A. Therefore, when adjusting the level of the load port 101, there is no need to remove the load port 101 as in the conventional case, and the level adjustment can be performed with the load port 101 attached to the housing 120. As a result, the number of work steps can be reduced. Therefore, the second embodiment can also enjoy the same effects as the first embodiment described above.

[0144] When adjusting the level of the load port 101, the clearance between the load port 101 and the housing 120 (front wall 121) is important, and it is preferable to set an initial value for this clearance. In this regard, in the first embodiment, the block body 221 of the adjustment mechanism 220 is attached to the front wall 121, and so the initial value of the clearance described above can be set by specifying the amount by which the block body 221 protrudes from the front surface of the front wall 121. Therefore, from this perspective, the first embodiment is preferable.

[0145] <Other Modifications> In the first and second embodiments, the notch 144 is provided at the lower end of the lower connecting plate 140B, but the position of the notch 144 is not limited to this. For example, the notch 144 may be provided at the upper part of the upper connecting plate 140A. However, if the notch 144 is provided at the upper part of the upper connecting plate 140A, the upper connecting plate 140A will bend, and therefore the strength of the upper connecting plate 140A will be required. From the standpoint of the strength of such connecting plate 140, it is preferable to provide the notch 144 at the lower end of the lower connecting plate 140B.

[0146] In the first and second embodiments, the upper part of the cutout 144 forms the positioning surface 144a, and the cutout 144 has a tapered shape that widens from the top to the bottom, but the shape of the cutout 144 is not limited to this. The shape of the cutout 144 is arbitrary as long as the cutout 144 can engage the positioning pin 230 and fix the position of the load port 101 in the device width direction.

[0147] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0148] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that would be apparent to a person skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0149] The following configuration examples also fall within the technical scope of the present disclosure. (1) A load port having a mounting surface for mounting a container that contains substrates, and configured to be connectable to a housing that houses a transfer robot that transports the substrates, comprising a connecting member that connects the load port to the housing, the connecting member having an access portion to an adjustment mechanism that adjusts the level of the load port relative to the housing, and a cutout portion that is provided in the widthwise center of the connecting member and into which a positioning pin provided on the housing is engaged. (2) The load port according to (1), wherein an upper portion of the cutout portion forms a positioning surface that sets the position of the load port in the device width direction. (3) The load port according to (1) or (2), wherein the cutout portion has a tapered shape that widens from the top to the bottom. (4) The load port according to any of (1) to (3), wherein the cutout portion is provided in the bottom of the connecting member. (5) The load port according to any of (1) to (4), wherein the access portion is an opening for accessing the adjustment mechanism. (6) The load port according to (5), wherein the openings are provided as a pair at both upper corners of the connecting member. (7) The load port according to any of (1) to (4), wherein the access portion is an adjustment screw portion that adjusts the depth direction level of the load port. (8) The load port according to any of (1) to (7), wherein the connecting member is provided with an opening for loading and unloading the substrate into and from the container. (9) The load port according to any of (1) to (8), comprising a mounting portion that is formed integrally with the connecting member and has the mounting surface, wherein the bottom surface of the mounting portion is inclined upward toward the opposite side from the connecting member. (10) The load port according to (9), wherein a slide member extending toward the opposite side from the connecting member is provided on the bottom surface of the mounting portion.(11) A transport device that loads and unloads substrates into and from a processing apparatus for processing the substrates, comprising: a housing that houses a transport robot that transports the substrates; a load port having a mounting surface on which a container that accommodates the substrates is placed and configured to be connectable to the housing; and an adjustment mechanism that adjusts the level of the load port with respect to the housing, wherein the load port has a connecting member that connects the load port to the housing, the housing is provided with a positioning pin, the connecting member is provided with an access portion to the adjustment mechanism, and a cutout portion in a widthwise center of the connecting member for engaging the positioning pin. (12) The transport device according to (11), wherein an upper portion of the cutout portion forms a positioning surface that sets the position of the load port in the device width direction. (13) The transport device according to (11) or (12), wherein the cutout portion has a tapered shape that widens from top to bottom. (14) The transport device according to any one of (11) to (13), wherein the cutout portion is provided in a lower portion of the connecting member. (15) The transport device according to any one of (11) to (14), wherein the adjustment mechanism is provided in the housing, and the access portion is an opening for accessing the adjustment mechanism. (16) The transport device according to (15), wherein the openings are provided in a pair at both upper corners of the connecting member. (17) The transport device according to any one of (11) to (14), wherein the adjustment mechanism is provided in the load port, and the access portion is an adjustment screw portion for adjusting the level of the load port in the depth direction. (18) The transport device according to any one of (11) to (17), wherein the connecting member has an opening for loading and unloading the substrate into and from the container. (19) The transport device according to any one of (11) to (18), further comprising a mounting section formed integrally with the connecting member and having the mounting surface, the bottom surface of the mounting section being inclined upward toward the opposite side from the connecting member. (20) The transport device according to (19), further comprising a slide member provided on the bottom surface of the mounting section and extending toward the opposite side from the connecting member.

[0150] REFERENCE SIGNS LIST 10 Processing device 20 Transfer device 101 Load port 120 Housing 140 Connecting plate 141 Opening 144 Notch 110 Transfer robot 170a Placement surface 220 Adjustment mechanism 230 Positioning pin 900 FOUP W Wafer

Claims

1. A load port having a mounting surface for placing a container that contains substrates and configured to be connectable to a housing that houses a transport robot that transports the substrates, the load port comprising a connecting member that connects the load port to the housing, the connecting member having an access portion to an adjustment mechanism that adjusts the level of the load port relative to the housing, and a notch in the widthwise center of the connecting member into which a positioning pin provided on the housing is engaged.

2. A load port according to claim 1, wherein the upper portion of the cutout portion constitutes a positioning surface for setting the position of the load port in the device width direction.

3. The load port according to claim 1, wherein the notch has a tapered shape that widens from the top to the bottom.

4. The load port according to claim 1, wherein the cutout is provided in the lower part of the connecting member.

5. The load port according to claim 1, wherein the access portion is an opening for accessing the adjustment mechanism.

6. The load port according to claim 5, wherein the openings are provided in pairs at both upper corners of the connecting member.

7. The load port according to claim 1, wherein the access portion is an adjustment screw portion for adjusting the depth level of the load port.

8. A load port according to any one of claims 1 to 7, wherein the connecting member is provided with an opening for loading and unloading the substrate into and from the container.

9. A load port according to any one of claims 1 to 7, comprising a mounting section formed integrally with the connecting member and having the mounting surface, the bottom surface of the mounting section being inclined upwardly on the opposite side from the connecting member.

10. A load port according to claim 9, wherein a slide member extending from the connecting member toward the opposite side is provided on the bottom surface of the mounting portion.

11. A transport device that transports substrates into and out of a processing device that processes the substrates, comprising: a housing that houses a transport robot that transports the substrates; a load port having a mounting surface on which a container that houses the substrates is placed and configured to be connectable to the housing; and an adjustment mechanism that adjusts the level of the load port relative to the housing, wherein the load port has a connecting member that connects the load port to the housing, the housing is provided with a positioning pin, the connecting member is provided with an access portion to the adjustment mechanism, and the connecting member is provided with a notch in the widthwise center thereof into which the positioning pin is engaged.

12. A transfer device according to claim 11, wherein an upper portion of the cutout portion constitutes a positioning surface for setting the position of the load port in the device width direction.

13. The conveying device according to claim 11, wherein the notch has a tapered shape that widens from the top to the bottom.

14. The conveying device according to claim 11, wherein the notch is provided in the lower part of the connecting member.

15. The transport device according to claim 11, wherein the adjustment mechanism is provided in the housing, and the access portion is an opening for accessing the adjustment mechanism.

16. The conveying device according to claim 15, wherein the openings are provided in pairs at both upper corners of the connecting member.

17. A transport device according to claim 11, wherein the adjustment mechanism is provided in the load port, and the access portion is an adjustment screw portion that adjusts the level of the load port in the depth direction.

18. A transport device according to any one of claims 11 to 17, wherein the connecting member is provided with an opening for carrying the substrate into and out of the container.

19. A conveying device as claimed in any one of claims 11 to 17, comprising a mounting section formed integrally with the connecting member and having the mounting surface, the bottom surface of the mounting section being inclined upwardly towards the opposite side from the connecting member.

20. A transport device according to claim 19, wherein a slide member is provided on the bottom surface of the mounting portion, extending from the connecting member toward the opposite side.

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