Conveyance device and discharge method

Abstract

Provided is a conveyance device for carrying a substrate into and out from a processing device for processing a substrate, the conveyance device comprising a main body having a conveyance space in which a conveyance robot for conveying the substrate is provided and a storage space that is connected to the conveyance space and supports the substrate, the main body being provided with: a housing that constitutes the conveyance space, the housing having a wall portion that forms a front surface to which a load port having a substrate-accommodating container mounted thereon is connected, a rear surface to which a load lock provided to the processing device is connected, and a pair of side surfaces connecting the front surface and the rear surface in the device depth direction, and also having a columnar member connected to the wall portion; and a discharge path for discharging a gas that is supplied to the storage space, the discharge path being formed within the columnar member of the housing.

Description

Conveyance device and exhaust method

[0001] The present disclosure relates to a transfer device and an exhaust method.

[0002] Japanese Patent Application Laid-Open No. 2003-124222 discloses an EFEM (Equipment Front End Module) device for transferring an object to and from a processing device using a transfer robot provided inside a housing.

[0003] Japanese Patent Application Laid-Open No. 2023-22095

[0004] A semiconductor manufacturing system includes a processing device for processing substrates and a transfer device. The transfer device includes an EFEM device for transferring transferred objects such as substrates and consumable parts (e.g., focus rings) between the processing device and the transfer device using a transfer robot installed inside a housing, and a load port connected to the EFEM device on which containers for storing substrates and consumable parts are placed. For such transfer devices, there is a strong demand for a reduced on-site equipment footprint (occupied area) and also a high demand for reduced manufacturing costs.

[0005] Therefore, the technology disclosed herein provides a transport device and an exhaust method that can contribute to cost reduction while suppressing an increase in the equipment footprint of a transport device that transports substrates into and out of a processing device that processes the substrates.

[0006] One aspect of the present disclosure is a transport device that transports substrates into and out of a processing device that processes the substrates, the transport device having a main body having a transport space in which a transport robot that transports the substrates is provided, and a storage space connected to the transport space and supporting the substrates, the main body being a housing that constitutes the transport space, the housing having a wall that forms a front surface to which a load port on which a container that stores the substrates is connected, a rear surface to which a load lock provided in the processing device is connected, and a pair of side surfaces that connect the front surface and the rear surface in the depth direction of the device, and column members connected to the wall portions, and an exhaust path that exhausts gas supplied to the storage space, the exhaust path being formed within the column members of the housing.

[0007] According to the present disclosure, it is possible to suppress an increase in the footprint of a transport device that transports substrates into and out of a processing device that processes substrates, while contributing to cost reduction.

[0008] 19 is a plan view showing an outline of a wafer processing system including a transfer device according to a first embodiment. FIG. 19 is a cross-sectional view of the transfer device as seen from a side. FIG. 19 is a cross-sectional view of the transfer device as seen from a side. FIG. 19 is a cross-sectional view of the transfer device as seen from a side. FIG. 19 is a top view of the main body. FIG. 19 is a cross-sectional view of the transfer device as seen from a front. FIG. 19 is a perspective view of the lower part of one end of the main body in the device width direction. FIG. 19 is a cross-sectional view of the load port. FIG. 19 is a side view of the rear side of the load port. FIG. 19 is a front view of the transfer robot. FIG. 19 is a cross-sectional perspective view for explaining a storage space. FIG. 19 is a perspective view for explaining members arranged in the storage space. FIG. 19 is a side view of the flow path forming member on the storage space side. FIG. 19 is a partially enlarged side view of the rear pillar member on the storage space side. FIG. 19 is a view for explaining the relationship between the air intake surface and the exhaust surface. FIG. 19 is a view for explaining the relationship between the air intake surface and the exhaust surface. FIG. 19 is a partially enlarged side view of the rear side of the lower part of the transfer device. FIG. 19 is a bottom view of the transfer device. FIG. 19 is a cross-sectional view of the transfer device according to a second embodiment as seen from a side. FIG. 19 is a partially enlarged view of FIG. 19. FIG. 19 is a cross-sectional view of the transfer device according to the second embodiment as seen from a front. FIG. 19 is an exploded view of the sub-exhaust box.

[0009] The transfer device according to this embodiment will be described below with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configuration are designated by the same reference numerals, and redundant description will be omitted. In the drawings, the X direction is the device width direction, which is the direction in which a pair of side surfaces 123a of a main body 102 of a transfer device 20 (described below) are aligned and in which multiple load ports 101 are aligned. The Y direction is the device depth direction, which is the direction in which a front surface 121a and a rear surface 122a of a main body 102 of a transfer device 20 (described below) are aligned, with the negative side of the Y direction being the front side and the positive side of the Y direction being the rear side. The Z direction is the vertical direction, i.e., the height direction.

[0010] First Embodiment <Wafer Processing System 1> FIG. 1 is a plan view showing an outline of a wafer processing system 1 including a transfer device 20 according to a first embodiment.

[0011] 1, the wafer processing system 1 includes a processing device 10 and a transfer device 20. The processing device 10 and the transfer device 20 are provided adjacent to each other.

[0012] The processing apparatus 10 is an apparatus for processing a semiconductor wafer (hereinafter, simply referred to as a "wafer") W as a substrate, and includes, for example, a processing module 30 and a vacuum transfer module 40.

[0013] For example, a plurality of processing modules 30 are provided. Each processing module 30 processes the wafer W under a reduced pressure atmosphere, i.e., a vacuum atmosphere. The processing performed by the processing module 30 includes, for example, a film formation process, an etching process, an impurity diffusion process, and the like. Each processing module 30 also includes a vacuum processing chamber 31 in which the above processing is performed on the wafer W under a vacuum atmosphere. Each vacuum processing chamber 31 is connected to a vacuum transfer chamber 41 (described later) of the vacuum transfer module 40 via a gate valve G1.

[0014] The vacuum transfer module 40 includes a vacuum transfer chamber 41 whose interior is maintained under a vacuum atmosphere. The vacuum transfer chamber 41 is configured to be sealable and is formed, for example, in a substantially polygonal shape (a square shape in the illustrated example) in a plan view. The vacuum transfer chamber 41, which is connected to each processing module 30, is also connected to a load lock module 50 (described later). Specifically, the vacuum transfer chamber 41 is connected to a load lock chamber 51 (described later) of the load lock module 50 via a gate valve (not shown). A transfer mechanism 42 for transferring a wafer W is provided within the vacuum transfer chamber 41. The vacuum transfer module 40 transfers the wafer W to and from the vacuum transfer chamber 41 with the vacuum processing chamber 31 and the load lock chamber 51 using the transfer mechanism 42.

[0015] Furthermore, the processing apparatus 10 is provided with a load lock module 50 at the end on the transfer device 20 side. For example, a plurality of load lock modules 50 may be provided. Each load lock module 50 is used to transfer the wafer W between a vacuum atmosphere space and a non-reduced atmosphere, i.e., a normal pressure atmosphere space. Each load lock module 50 has a load lock chamber 51 configured so that the interior atmosphere can be switched between a normal pressure atmosphere and a vacuum atmosphere. The load lock chamber 51 is provided to connect the vacuum transfer module 40 and the transfer device 20.

[0016] The transfer device 20 is a device that transfers wafers W into and out of the processing device 10. Specifically, the transfer device 20 is a device configured to be able to transfer wafers W between a FOUP (Front-Opening Unified Pod) 2000, which is a container that accommodates a plurality of wafers W, and the processing device 10 without exposing the wafers W to the external atmosphere. The transfer device 20 has a load port 101 and a main body 102, which is also referred to as an EFEM device.

[0017] The load port 101 is configured so that a FOUP 2000 can be placed thereon, and a plurality of load ports 101 (five in the illustrated example) are arranged, for example, along the width direction of the device (X direction).

[0018] The main body 102 is disposed on the rear side (positive side in the Y direction) of the load port 101, and more specifically, the main body 102 is disposed on the rear side of the load port 101 so as to be adjacent to the load port 101. The main body 102 is also connected to the load lock chamber 51, and more specifically, the load lock chamber 51 is connected to its rear side (positive side in the Y direction), for example. The interior of the main body 102 is kept under normal pressure.

[0019] The main body 102 includes a housing 120 that defines a transfer space S1 in which a transfer robot 110 that supports and transfers a wafer W is provided. The number of transfer robots 110 provided in the transfer space S1 is one. The transfer robot 110 can transfer the wafer W between the FOUP 2000 placed on the load port 101 and the load lock chamber 51, for example.

[0020] The main body 102 also has a storage space S11 connected to the transfer space S1 and supporting wafers W. In this embodiment, the storage space S11 is connected to the rear side (positive side in the Y direction) of the transfer space S1. Specifically, the storage space S11 is connected to the rear side of each of the two end portions of the transfer space S1 in the device width direction (X direction). The storage space S11 and the transfer space are covered by the housing 120. The storage space S11 is configured to be able to accommodate multiple wafers W, for example, more wafers W than can be accommodated in the FOUP 2000.

[0021] The wafer processing system 1 described above is provided with at least one control device C. The control device C processes computer-executable instructions that cause the wafer processing system 1 to perform the various processes described in this disclosure. The control device C may be configured to control each element of the wafer processing system 1 to perform the various processes described herein. In one embodiment, some or all of the control device C may be included in the wafer processing system 1. The control device C may include a processing unit, a storage unit, and a communication interface. The control device C may be implemented, for example, by a computer. The processing unit may be configured to read from the storage unit a program that provides logic or routines that enable various control operations and execute the read program to perform various control operations. This program may be stored in the storage unit in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit and read from the storage unit by the processing unit for execution. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit) or one or more circuits. The storage unit may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), a SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the wafer processing system 1 via a communication line such as a LAN (Local Area Network).

[0022] <Wafer Processing> Next, a description will be given of an example of wafer processing by the wafer processing system 1 configured as above. The following wafer processing is performed under the control of the control device C.

[0023] First, the wafers W are sequentially removed from the FOUP 2000 and transferred into the storage space S11 by the transfer robot 110. The wafers W transferred into the storage space S11 are then sequentially removed from the FOUP 2000 and transferred into the load lock chamber 51 of the load lock module 50. Then, the load lock chamber 51 is sealed and a vacuum atmosphere is created.

[0024] Thereafter, a gate valve (not shown) on the vacuum transfer chamber 41 side of the load lock chamber 51 is opened, and the wafer W is transferred from the load lock chamber 51 to the vacuum transfer chamber 41 by the transfer mechanism 42 .

[0025] Next, after the gate valve is closed, the gate valve G1 for the processing module 30 in which the target processing is to be performed is opened. Subsequently, the wafer W is loaded into the vacuum processing chamber 31 of the target processing module 30 by the transfer mechanism 42. Thereafter, the gate valve G1 is closed, and the desired processing is performed on the wafer W in the processing module 30.

[0026] After the desired processing is completed, the wafer W is returned from the vacuum processing chamber 31 to the FOUP 2000 in the reverse order of the procedure of carrying it from the FOUP 2000 to the vacuum processing chamber 31. Specifically, the processed wafer W is carried from the vacuum processing chamber 31 into the storage space S11, and then returned to the FOUP 2000. This completes the series of wafer processing steps.

[0027] <Transport Device 20> An example of the configuration of the transport device 20 will be described using the aforementioned FIG. 1 and FIGS. 2 to 18. FIGS. 2 to 4 are cross-sectional side views of the transport device 20. FIG. 2 shows the central portion of the transport device 20 in the device width direction (Y direction). FIG. 3 shows a portion of the transport device 20 in the device width direction that includes the storage space S11. FIG. 4 shows a portion of the transport device 20 in the device width direction that includes a column member, described below. FIG. 5 is a top view of the main body 102. FIG. 6 is a cross-sectional front view of the transport device 20, showing a portion of the internal configuration of the housing 120. FIG. 7 is a perspective view of the lower portion of one end of the main body 102 in the device width direction. FIG. 8 is a cross-sectional view of the load port 101. FIG. 9 is a side view of the rear side of the load port 101. FIG. 10 is a front view of the transport robot 110. FIG. 11 is a perspective cross-sectional view illustrating the storage space S11. FIG. 12 is a perspective view illustrating components arranged in the storage space S11. Fig. 13 is a side view of the storage space S11 side of the flow path forming member described below. Fig. 14 is a partially enlarged side view of the storage space S11 side of the rear pillar member. Figs. 15 and 16 are diagrams for explaining the relationship between the air intake surface and the exhaust surface described below. Fig. 17 is a partially enlarged side view of the rear side of the lower part of the transport device 20. Fig. 18 is a bottom view of the transport device 20.

[0028] As shown in FIGS. 2 to 6, the transfer device 20 has the above-mentioned load port 101 and main body 102, and further has a lower housing section 103 for housing various components.

[0029] The main body 102 has a housing 120 that is U-shaped in plan view. The housing 120 has a wall 120A, a plurality of pillar members 500, 510, and a beam member 520.

[0030] The wall portion 120A has a front wall 121 including a front surface 121a, a rear wall 122 including a rear surface 122a, a pair of side walls 123 each including a side surface 123a, a bottom wall 124, and a ceiling wall 125.

[0031] The front surface 121a extends in the apparatus width direction (X direction) in plan view on the front side (negative side in the Y direction) of the main body 102. The load port 101 and the lower accommodation unit 103 are connected to the front surface 121a. The lower accommodation unit 103 is disposed below the load port 101. The front surface 121a is provided with an opening 126 in which the load port 101 is installed. The front surface 121a also is provided with an opening 127 which is an opening for loading and unloading the wafer W into and from the lower accommodation unit 103.

[0032] The rear surface 122a faces the front surface 121a in the depth direction (Y direction) of the apparatus. A central portion of the rear surface 122a in the width direction (X direction) of the apparatus extends in the width direction (X direction) of the apparatus on the rear side (positive side of the Y direction) of the main body 102 in a plan view. The load lock module 50 is connected to the central portion of the width direction of the rear surface 122a. An opening 128 is provided in the central portion of the width direction of the rear surface 122a at a position corresponding to the load lock chamber 51. The opening 128 is provided in a portion of the rear surface 122a at approximately the same vertical position as the transfer position in the load lock chamber 51. The transfer position in the load lock chamber 51 is the vertical position of the wafer W when the wafer W is transferred between the load lock chamber 51 and the transfer robot 110.

[0033] Both ends of the rear surface 122a in the device width direction are located rearward (positive side in the Y direction) from the center of the rear surface 122a in the device width direction (X direction) so that a storage space S11 is formed within the housing 120.

[0034] The pair of side surfaces 123a connect the front surface 121a and the rear surface 122a in the device depth direction (Y direction). In one embodiment, the pair of side surfaces 123a connect the front surface 121a and the rear surface 122a in the device depth direction via the outer peripheral surfaces of the pillar members 500, 510. The pair of side surfaces 123a also face each other in the device width direction (X direction). Each of the side surfaces 123a extends in the device depth direction in a plan view.

[0035] The bottom wall 124 and the top wall 125 face each other in the vertical direction and extend in the horizontal direction (X direction and Y direction).

[0036] The main body 102 has an internal space comprised of a front wall 121, a rear wall 122, side walls 123, a bottom wall 124, and a ceiling wall 125. The internal space is vertically divided into a lower transport space S1 and an upper space (also referred to as a storage space) S2 at the center of the device width direction (X direction) by a partition wall 131 provided between the bottom wall 124 and the ceiling wall 125. The internal space is also vertically divided by the partition wall 131 at both ends of the device width direction into a lower transport space S1, a storage space S11, and a storage space S2. As described below, purified gas is supplied from the storage space S2 to the transport space S1, and the partition wall 131 has an opening 132A for supplying the gas. As described below, purified gas is supplied from the storage space S2 to the storage space S11, and the partition wall 131 has an opening 132B for supplying the gas.

[0037] As shown in FIG. 5, the pillar members 500 and 510 are each connected to the wall portion 120A.

[0038] The pillar members 500 are arranged at the corners of the housing 120 on the negative side in the X direction and the front side (negative side in the Y direction) and on the positive side in the X direction and the front side (negative side in the Y direction). The pillar members 500 arranged on the front side extend in the vertical direction. Here, as shown in FIG. 5 , the pillar members 500 are arranged so as to protrude to the front side (negative side in the Y direction) of the transport device 20. This makes it possible to maximize the volume of the transport space S1.

[0039] The pillar members 510 are arranged at a corner on the negative side in the X direction and on the rear side (positive side in the Y direction) of the housing 120, and at a corner on the positive side in the X direction and on the rear side (positive side in the Y direction) of the housing 120. As shown in Figures 4 and 7 , the pillar members 510 are each composed of, for example, an upper member 511 located above and a lower member 512 located below and continuous with the upper member 511.

[0040] The rear surface 512a of the lower member 512 is disposed further forward (negative side in the Y direction) than the rear surface 511a of the upper member 511. Specifically, the upper member 511 extends vertically, and the upper portion of the lower member 512 forms an inclined portion 513 that extends diagonally downward toward the front, and the portion of the lower member 512 below the inclined portion 513 extends vertically. That is, the pillar member 510 extends vertically downward from its upper end to the inclined portion 513, and the inclined portion 513 extends diagonally downward toward the front, and the portion from the inclined portion 513 to its lower end extends vertically downward. As a result, a space S21 is formed below the upper member 511 of the pillar member 510 (specifically, below the inclined portion 513). Peripheral components (e.g., a storage exhaust duct 750 described below) provided outside the main body 102 are disposed, i.e., housed, in this space S21.

[0041] Furthermore, both ends of the rear surface 122a of the wall portion 120A in the device width direction may have a shape similar to that of the rear surface 511a of the pillar member 510. As a result, a space S22 similar to the space S21 is also formed below the rear surface 122a of the wall portion 120A.

[0042] The beam member 520 is connected to the wall portion 120A at the lower rear portion of the main body portion 102. The beam member 520 is provided so as to extend in the device width direction (X direction) along the center portion of the rear wall 122 in the device width direction, for example.

[0043] As shown in FIGS. 8 and 9, the load port 101 includes a connection plate 140 , an isolation cover 150 , and a main cover 151 .

[0044] When connected to the main body 102, the connecting plate 140 is attached to the front surface 121 a so as to cover the opening 126. The upper side of the connecting plate 140 extends and protrudes from above the main cover 151. An opening 141, which is an opening for loading and unloading the wafer W, is provided on the upper side of the connecting plate 140 above the isolation cover 150 and the main cover 151. The lower side of the connecting plate 140 extends so as to cover the rear surface of the isolation cover 150 and the rear surface of the main cover 151. A slit 142, which extends vertically, is provided on the lower side of the connecting plate 140 to raise and lower an arm 192 of a moving mechanism 190, which will be described later.

[0045] The isolation cover 150 forms an accommodation space S3 between itself and the front surface of the connecting plate 140, for accommodating a moving mechanism 190 (described later). The isolation cover 150 also covers the slit 142 from the front. By providing the isolation cover 150, it is possible to prevent gas in the transfer space S1 of the main body 102 from leaking to the outside of the transfer device 20.

[0046] The main cover 151 forms an accommodation space S4 between the connecting plate 140 and the isolation cover 150, for accommodating the advancing / retreating mechanism 170 (described later). The main cover 151 also covers the advancing / retreating mechanism 170 (described later) and the isolation cover 150. In this embodiment, the main cover 151 covers the front wall and top wall of the isolation cover 150, but does not cover the bottom wall.

[0047] The bottom wall of the isolation cover 150 and the bottom wall of the main cover 151 form the bottom surface of the load port 101. A slide member 152 is provided on the bottom surface of the load port 101. When the load port 101 is attached to the main body 102, the slide member 152 is slid on the upper surface of a first storage section 103A (described below) of the lower storage section 103. When the load port 101 is connected to the main body 102, the slide member 152 is positioned away from the upper surface of the first storage section 103A.

[0048] The load port 101 also includes a stage 160 and a reciprocating mechanism 170 .

[0049] The stage 160 includes a mounting surface 160a for the FOUP 2000 that accommodates the wafers W. Specifically, the upper surface of the stage 160 serves as the mounting surface 160a for the FOUP 2000. The stage 160 supports the FOUP 2000 on the mounting surface 160a. The FOUP 2000 placed on the mounting surface 160a is disposed such that a lid 2001, which is a door of the FOUP 2000, faces the opening 141 of the connecting plate 140. The stage 160 is provided on the upper surface of the main cover 151 described above.

[0050] A nozzle 161 is provided on the stage 160 to supply gas to the FOUP 2000 on the stage 160. Specifically, the nozzle 161 supplies an inert gas such as nitrogen gas into the FOUP 2000 placed on the stage 160. The nozzle 161 is movable by the advancing / retracting mechanism 170, and specifically, is movable together with the stage 160 which is moved by the advancing / retracting mechanism 170. The nozzle 161 protrudes from the bottom surface of the stage 160, with its lower portion protruding into the storage space S4 described above.

[0051] The advancing / retracting mechanism 170 advances and retreats the stage 160 in the horizontal direction. Specifically, the advancing / retracting mechanism 170 moves the stage 160 back and forth to advance and retreat relative to the opening 141. More specifically, the advancing / retracting mechanism 170 moves the stage 160 between a front position and a rear position. The front position is a position where the FOUP 2000 is transferred between an externally provided transfer device for the FOUP 2000 and the stage 160. The rear position is a position where the wafer W is transferred between the FOUP 2000 and the inside of the main body 102 via the opening 141.

[0052] The advancing / retreating mechanism 170 has, for example, a guide 171 and a support member 172. The guide 171 guides the movement of the stage 160 in the depth direction of the device. Specifically, the guide 171 guides the movement of the support member 172, which supports the stage 160, in the front-to-rear direction. The support member 172 has an upper end to which the stage 160 is connected, and a lower end to which the guide 171 extends so as to be movable in the depth direction of the device. The advancing / retreating mechanism 170 is housed in the housing space S4 described above.

[0053] The load port 101 also has a door 180 and a moving mechanism 190 .

[0054] The door 180 opens and closes the opening 141. The door 180 is configured to be able to unlock the lid 2001 of the FOUP 2000 and to hold the lid 2001. When the door 180 is opened while holding the unlocked lid 2001, the lid 2001 is opened. When the door 180 is opened or closed, the door 180 moves within the main body 102 (specifically, within the transfer space S1).

[0055] The movement mechanism 190 functions as an elevator mechanism that opens, closes, and raises and lowers the door 180 and the lid 2001. The movement mechanism 190 includes, for example, an actuator 191, an arm 192, and an elevator 193.

[0056] The actuator 191 drives the lifting and lowering of the door 180. Specifically, the actuator 191 drives the lifting and lowering of an elevator 193 that supports the door 180 via an arm 192. The actuator 191 is provided inside the load port 101 so as to extend in the vertical direction (Z direction). The actuator 191 may be an electro-pneumatic actuator such as an air cylinder, or an electro-mechanical actuator.

[0057] The arm 192 supports the door 180 and is driven by an actuator 191. For example, as shown in FIG. 8 , a pair of arms 192 are provided along the width direction (X direction) of the apparatus. The upper end of each arm 192 is connected to the door 180, which may be located inside the main body 102 (specifically, inside the transfer space S1), and the lower end of each arm 192 is connected via an elevator 193 to an actuator 191 located inside the load port 101, i.e., outside the main body 102. To enable the arms 192 to be raised and lowered in this connected state, the front wall 121 of the main body 102 is provided with a slit 142, as described above. That is, the front wall 121 of the main body 102 is provided with a slit 142 through which the arm 192 can be inserted and through which the arm 192 passes when the arm 192 is raised and lowered. For example, a slit 142 is provided for each arm 192.

[0058] The lifting body 193 moves up and down along the actuator 191, that is, moves vertically.

[0059] The movement mechanism 190 is configured to be able to move the door 180 in the depth direction of the device (Y direction). For example, an arm 192 that supports the door 180 is connected to an elevator 193 so as to be able to move in the front-rear direction.

[0060] The moving mechanism 190 is accommodated in the accommodation space S4 of the above-described main cover 151. Specifically, the accommodation space S4 accommodates the portion of the moving mechanism 190 located outside the main body 102, i.e., the actuator 191 of the moving mechanism 190, part of the arm 192, and the lifting body 193.

[0061] The moving mechanism 190 also has an actuator (not shown) that drives the forward and backward movement of the door 180. The moving mechanism 190 is controlled by a control device C, and more specifically, the actuators of the moving mechanism 190 and the actuator 191 are controlled by the control device C.

[0062] As shown in FIGS. 2 to 4, the lower accommodating section 103 is made up of a plurality of accommodating sections stacked in the vertical direction, and includes, for example, an upper first accommodating section 103A and a lower second accommodating section 103B.

[0063] The first accommodation section 103A accommodates a function expansion module including at least one of a measurement module for measuring a film on the wafer W, an inspection module for inspecting defects in the wafer W, and an alignment module for adjusting the orientation position of the substrate. The opening 127 described above is provided in the front wall 121 of the main body 102 at a position corresponding to the first accommodation section 103A.

[0064] The measurement module or inspection module accommodated in first accommodation unit 103A includes, for example, a module having a mounting table (not shown) on which wafer W is placed and configured to be movable in the horizontal direction, and an imaging unit (not shown) that images the wafer W placed on the mounting table and moving in the horizontal direction. Instead of or in addition to this module, the measurement module or inspection module may include a module configured to use the imaging unit (not shown) to image the wafer W supported and moved in the horizontal direction by transfer robot 110 inserted therein through opening 127.

[0065] The second accommodation unit 103B accommodates electrical components including a power supply unit, etc. No opening such as the opening 127 is provided in the second accommodation unit 103B. That is, of the first accommodation unit 103A and the second accommodation unit 103B, only the first accommodation unit 103A, which is located on the upper side, is provided with an opening that serves as a loading / unloading port for the wafer W.

[0066] The main body 102 has a door 200 and a lifting mechanism 210 .

[0067] The door 200 opens and closes the opening 128 in the rear wall 122. The lifting mechanism 210 raises and lowers the door 200 to open and close the opening 128. The door 200 and the lifting mechanism 210 are provided inside the main body 102 (specifically, inside the transfer space S1).

[0068] The lifting mechanism 210 has an actuator (not shown) that drives the lifting and lowering of the door 200. The lifting mechanism 210 is controlled by a control device C, and more specifically, the actuator of the lifting mechanism 210 is controlled by the control device C.

[0069] The main body 102 also has the transfer robot 110 that supports and transfers the wafer W as described above. Specifically, the transfer robot 110 transfers the wafer W between the opening 141 and the storage space S11, between the opening 128 and the storage space S11, etc. The transfer robot 110 is housed in the transfer space S1 described above and placed on the bottom wall 124.

[0070] As shown in FIG. 10, the transfer robot 110 has a horizontal arm 220 and a vertical articulated arm 230 as transfer arms.

[0071] The horizontal arm 220 is configured to be able to horizontally transport the wafer W. The horizontal arm 220 is, for example, an articulated arm, and includes a fork 221, a first arm 222, and a second arm 223.

[0072] The fork 221 supports the wafer W at its tip end. The fork 221 is connected to the tip end of a first arm 222 at its base end so as to be rotatable about an axis (hereinafter referred to as the "vertical axis") extending in the vertical direction (Z direction). The first arm 222 is connected to the tip end of a second arm 223 so as to be rotatable about the vertical axis on the base end side. The second arm 223 is connected to the tip of a vertical articulated arm 230 so as to be rotatable about the vertical axis.

[0073] The vertical articulated arm 230 is made up of an articulated arm and is configured to be able to at least raise and lower the horizontal arm 220. In this embodiment, the vertical articulated arm 230 is configured to be able to move the horizontal arm 220 in the vertical direction (Z direction) and the device width direction (X direction). The vertical articulated arm 230 has an arm 231 that is provided so as to be able to pivot in the vertical direction, and a base 232 that is connected to the arm 231 and is fixed to a support stand 240, which will be described later.

[0074] The arm 231 includes, for example, a first arm 231A and a second arm 231B. The horizontal arm 220 is connected to the tip end of the first arm 231A. The first arm 231A is connected to the tip end of the second arm 231B at its base end so as to be rotatable about an axis extending in the depth direction of the device (hereinafter referred to as the "front-rear axis"). The second arm 231B is connected to the upper end of the base 232 so as to be rotatable about the front-rear axis on its base end side.

[0075] The base 232 supports the horizontal arm 220 via the arm 231. The base 232 has a pair of plate-like members 233 and a bottom member 234.

[0076] The pair of plate-shaped members 233 are arranged side by side in the device depth direction (Y direction). Specifically, of the pair of plate-shaped members 233, the first plate-shaped member 233A is arranged on the front side (negative side in the Y direction), and the second plate-shaped member 233B is arranged on the rear side (positive side in the Y direction). The second arm 231B is pivotally supported between the first plate-shaped member 233A and the second plate-shaped member 233B.

[0077] The plate-shaped member 233 extends in the vertical direction within the transfer space S1. When viewed from the depth direction of the device, the plate-shaped member 233 has a substantially isosceles triangular shape that includes a pair of long sides extending in the vertical direction and a short side connecting the pair of long sides.

[0078] The bottom surface member 234 is disposed so as to connect the lower end of the first plate-shaped member 233A and the lower end of the second plate-shaped member 233B. A plurality of, for example, two positioning pins (not shown) are provided on the bottom surface of the bottom surface member 234. The positioning pins are inserted into pin holes provided in the support base 240, which will be described later.

[0079] As shown in FIGS. 2 to 4 and 6, the main body 102 has a support base 240 and a pair of exhaust boxes 250 serving as exhaust units.

[0080] The support base 240 and the pair of exhaust boxes 250 are provided on the bottom wall 124 and are arranged side by side in the width direction of the apparatus (X direction). Specifically, the pair of exhaust boxes 250 are arranged side by side on both sides of the support base 240 in the width direction of the apparatus.

[0081] The support base 240 fixes and supports the transfer robot 110. The upper surface of the support base 240 is provided with a plurality of, for example, two pin holes (not shown) at positions corresponding to the positioning pins of the transfer robot 110 described above. When the transfer robot 110 is placed on the support base 240, the positioning pins are inserted into the pin holes. This fixes the transfer robot 110 at a desired position relative to the support base 240.

[0082] The exhaust box 250 exhausts the gas within the transfer space S1 into the exhaust box 250. To this end, the exhaust box 250 has a fan (not shown). The gas exhausted from the transfer space S1 into the exhaust box 250 is exhausted to the outside of the apparatus, for example, via a transfer space exhaust duct 760 (described later). The fan may be a fan filter unit (FFU) integrated with a filter that filters the gas. In this case, the gas within the exhaust box 250 filtered by the FFU may be exhausted to the outside of the main body 102 (specifically, for example, into a clean room in which the transfer apparatus 20 is installed). Furthermore, if the gas that has flowed into the exhaust box 250 is circulated so as to be supplied again to the storage space S11 without being exhausted to the outside of the main body 102, the exhaust box 250 may not be provided with a fan.

[0083] As shown in FIGS. 2 and 3, the main body 102 has a first FFU 260 as a first gas supply unit that supplies ambient gas (specifically, ambient gas above it) to the transfer space S1.

[0084] The first FFU 260 sends out gas to be supplied to the transfer space S1. Specifically, the first FFU 260 supplies purified gas, i.e., gas that has been filtered to remove particles, alkaline substances, acidic substances, organic substances, etc., from the top to the bottom of the transfer space S1. The first FFU 260 is provided in the above-mentioned accommodation space S2 above the transfer space S1 and is supported by, for example, the partition wall 131. As described above, the partition wall 131 has an opening 132A, and the first FFU 260 supplies purified gas to the transfer space S1 through the opening 132A.

[0085] As described above, the main body 102 has a storage space S11. The storage space S11 is partitioned into a plurality of regions R along the vertical direction, as shown in, for example, Figures 3, 4, and 6. Specifically, the storage space S11 is partitioned into five regions R arranged vertically by partition plates 600. Note that, hereinafter, the five regions R may be referred to as, from top to bottom, a first region R1, a second region R2, a third region R3, a fourth region R4, and a fifth region R5.

[0086] 10 and 11 , each region R is provided with a plurality of pairs of support claws 610 (e.g., 25 pairs) arranged vertically so that it can accommodate a plurality of wafers W. The pair of support claws 610 supports the peripheral edge of the wafer W, thereby supporting the wafer W horizontally. The support claws 610 and the partition plate 600 are supported by a frame 620, as shown in FIG. 12 . By fixing the frame 620, the support claws 610 and the partition plate 600 are fixed within the main body 102 (specifically, within the storage space S11).

[0087] 6 and 11, the main body 102 is also provided with an air supply path D that supplies gas to the storage space S11. The air supply path D has an individual air supply path D1 for each region R of the storage space S11, and supplies gas individually to each region R via the individual air supply path D1. Note that hereinafter, the individual air supply paths D1 corresponding to the first region R1, second region R2, third region R3, fourth region R4, and fifth region R5 may be referred to as the first individual air supply path D11, second individual air supply path D12, third individual air supply path D13, fourth individual air supply path D14, and fifth individual air supply path D15, respectively.

[0088] At least a portion of air supply path D is formed within wall portion 120A of housing 120. Specifically, wall portion 120A has a wall main body portion 630 including rear surface 122a of housing 120, and an air supply path forming member 640 that forms a space between wall main body portion 630 and wall portion 120A, and the space becomes air supply path D.

[0089] As shown in Fig. 13, the air supply path forming member 640 has a flat plate portion 641 formed in a flat plate shape. The air supply path forming member 640 also has first to fourth partition walls 651 to 654, each extending from the flat plate portion 641 toward the wall main body portion 630. The first partition wall 651 forms a space that becomes the first individual air supply path D11 and a space that becomes the second individual air supply path D12 between the flat plate portion 641 and the wall main body portion 630, and separates these spaces. The second partition wall 652 forms a space that becomes the second individual air supply path D12 and a space that becomes the third individual air supply path D13 between the flat plate portion 641 and the wall main body portion 630, and separates these spaces. The third partition wall 653 forms a space that becomes the third individual air supply passage D13 and a space that becomes the fourth individual air supply passage D14 between the flat plate portion 641 and the wall main body portion 630, and separates these spaces. The fourth partition wall 654 forms a space that becomes the fourth individual air supply passage D14 and a space that becomes the fifth individual air supply passage D15 between the flat plate portion 641 and the wall main body portion 630, and separates these spaces.

[0090] The main body 102 further includes an air intake port 660 that is continuous with the air intake path D. The air intake port 660 is formed, for example, for each region R within the storage space S11 on an air intake surface 641 a that faces the storage space side of the flat plate portion 641 of the air intake path forming member 640.

[0091] Furthermore, the main body 102 includes a baffle member 670 that covers the air inlet 660. The baffle member 670 has a plurality of through holes 671 formed in a portion facing the air inlet 660.

[0092] 6 and 11, the main body 102 is provided with an exhaust path E that exhausts the gas supplied to the storage space S11. In this embodiment, the exhaust path E is formed inside the pillar member 510 on the rear side (positive side in the Y direction).

[0093] Furthermore, the main body 102 is provided with exhaust ports 700 that are continuous with the exhaust path E. As shown in Fig. 11, the exhaust ports 700 are formed on the side surface of the rear pillar member 510 on the storage space S11 side, i.e., on the exhaust surface 510a that faces the storage space S11. Specifically, as shown in Figs. 4 and 14, the exhaust ports 700 are formed on the exhaust surface 510a for each region within the storage space S11.

[0094] The main body 102 also includes a baffle member 710 that covers the exhaust port 700. The baffle member 710 has a plurality of through holes 711 formed in a portion facing the exhaust port 700.

[0095] In this embodiment, the air intake port 660 and the exhaust port 700 are formed to satisfy the following conditions. As shown in FIG. 15 , a virtual normal L1 extending from the air intake surface 641a on which the air intake port 660 is formed and a virtual normal L2 extending from the exhaust surface 510a on which the exhaust port is formed each intersect with the transfer space S1. The air intake surface 641a and the exhaust surface 510a are non-parallel. However, as shown in FIG. 16 , the air intake port 660 and the exhaust port 700 may be formed so that the air intake surface 641a and the exhaust surface 510a are parallel. By arranging the air intake port 660 and the exhaust port 700 as shown in FIGS. 15 and 16 , it is possible to more effectively prevent the downflow from the first FFU 260 formed in the transfer space S1 from being drawn into the exhaust port 700, while creating an appropriate airflow in the storage space S11.

[0096] Furthermore, as shown in FIGS. 3 and 6, the main body 102 has a second FFU 720 as a second gas supply unit in addition to the first FFU 260.

[0097] The second FFU 720 sends out the gas to be supplied to the storage space S11. Specifically, the second FFU 720 supplies purified gas, i.e., gas from which particles have been filtered, toward the air supply path D. This causes the air supply path D to supply the gas from the second FFU to the storage space S11. The second FFU 720 is provided, for example, in the above-mentioned storage space S2 and supported by the partition wall 131. As described above, an opening 132B is formed in the partition wall 131, and the second FFU 720 supplies the purified gas to the air supply path D via the opening 132B.

[0098] In this embodiment, all gas supplied to the storage space S11 and exhausted to the exhaust path E is exhausted to the outside of the apparatus. For this reason, the transfer apparatus 20 further includes a storage exhaust duct 750 that exhausts gas in the exhaust path E of the rear pillar member 510 to the outside of the apparatus, as shown in FIG. 4 . The storage exhaust duct 750 is an external exhaust path component that constitutes an external exhaust path that exhausts gas in the exhaust path E to the outside of the apparatus. One end of the storage exhaust duct 750 is connected, for example, from the rear side to the lower member 512 of the pillar member 510, i.e., connected to the rear surface 512a. The exhaust path E and the flow path in the storage exhaust duct 750 communicate with each other via a communication port 751 provided at the connection portion of the storage exhaust duct 750 in the lower member 512.

[0099] As shown in Figures 17 and 18, the storage exhaust duct 750 includes a storage exhaust duct 750A connected to the column member 510 on the positive side of the X direction, and a storage exhaust duct 750B connected to the column member 510 on the negative side of the X direction.

[0100] The storage exhaust duct 750A connected to the column member 510 on the positive side in the X direction includes an on-off valve 752, a flow rate adjustment valve 753, a flexible exhaust tube 754, an intra-beam exhaust path 755, and an exhaust pipe 756. The on-off valve 752 switches between starting and stopping exhaust from the exhaust path E via the storage exhaust duct 750. The flow rate adjustment valve 753 adjusts the amount of exhaust from the exhaust path E via the storage exhaust duct 750. The flexible exhaust tube 754 connects the flow rate adjustment valve 753 to the intra-beam exhaust path 755. The intra-beam exhaust path 755 is formed inside the central portion of the beam member 520 in the device width direction (X direction). The central portion of the beam member 520 in the device width direction is located within an area where the beam member 520 overlaps with the load lock chamber 51 in the device width direction (X direction). The exhaust pipe 756 connects the intra-beam exhaust path 755 to an integration box (described later) located on the negative side in the X direction.

[0101] Of the exhaust path within the storage exhaust duct 750A (i.e., of the external exhaust path constituted by the storage exhaust duct 750A, which is an external exhaust path component), the portion located within the area where the position in the device width direction (X direction) overlaps with the load lock chamber 51 is constituted by an exhaust path within the beam.

[0102] On the other hand, the storage exhaust duct 750B connected to the column member 510 on the negative side in the X direction is connected directly to the integrated box without going through the exhaust path 755 within the beam.

[0103] At least the end of the storage exhaust duct 750 on the pillar member 510 side is housed in a space S21 below the upper member 511 of the pillar member 510 (specifically, below the inclined portion 513). In the space S21, for example, the above-mentioned on-off valve 752 and the flow rate adjustment valve 753 are disposed, i.e., housed. Furthermore, the space S21 can also house peripheral parts other than the storage exhaust duct 750, such as tubes that supply gas for operating the components of the transport device 20 and power cables that supply power to the above-mentioned components.

[0104] Furthermore, the transfer device 20 has a transfer space exhaust duct 760. The transfer space exhaust duct 760 exhausts the gas in the transfer space S1 to the outside of the device, specifically, exhausts the gas in the exhaust box 250 to the outside of the device. The transfer space exhaust duct 760 is housed, for example, in the aforementioned space S22 on the negative side in the X direction.

[0105] The transfer apparatus 20 further includes an integration box 770. The integration box 770 connects the storage exhaust duct 750 and the transfer space exhaust duct 760 together to an exhaust mechanism (not shown) outside the transfer apparatus 20. The downstream ends of the storage exhaust duct 750 and the transfer space exhaust duct 760 are connected to the integration box 770, and the other end of a main exhaust pipe (not shown), one end of which is connected to the exhaust mechanism, is also connected to the integration box 770. The integration box 770 is housed, for example, so as to straddle the aforementioned spaces S21 and S22 on the negative side in the X direction. Although not shown, the storage exhaust duct 750 and the transfer space exhaust duct 760 may extend below the transfer apparatus 20 and be connected to a factory-side exhaust line.

[0106] In the transfer device 20 configured as described above, the gas supplied to the storage space S11 is exhausted through the exhaust path E formed in the pillar member 510 of the housing 120. In addition, in the transfer device 20, the gas sent out from the second FFU 720 provided in the main body 102 separately from the first FFU 260 is supplied to the storage space S11.

[0107] <Major Effects of the Present Embodiment> As described above, in the present embodiment, the exhaust path E that exhausts the gas supplied to the storage space S11 is formed inside the column member 510 that constitutes the housing 120. Therefore, compared to when the exhaust path E is provided outside the housing 120, it is possible to suppress an increase in the footprint of the device, and also to reduce the number of parts, which can contribute to a reduction in manufacturing costs.

[0108] In this embodiment, the transfer space S1 and the storage space S11 adjacent to the transfer space S1 are collectively covered by the housing 120. Therefore, compared to a case in which the transfer space S1 and the storage space S11 are covered by separate housings, the number of parts can be reduced, which can contribute to reducing manufacturing costs.

[0109] Unlike the present embodiment, in a configuration in which the storage space S11 is connected to the transfer space S1 so as to be continuous with the device width direction, there is room for improvement in the following respects regarding the maintenance of the transfer robot 110 in the transfer space S1 and the components around the transfer space S1, which is performed by an operator accessing the transfer space S1. That is, the access route to the transfer space S1 is limited to the rear side of the transfer space S1, or in order to access the transfer space S1 from the side, it is necessary to remove components of the storage space S11 (such as the partition plate 600 in this embodiment). Note that, depending on the size of the transfer robot 110, even if the transfer space S1 is accessed from the rear side, it may not be possible to remove the transfer robot 110 from the housing 120 without disassembling it. In contrast, in this embodiment, a column member 510 with an exhaust path E formed therein is provided on the rear side (toward the rear surface 122a), and the storage space S11 is connected to the rear side of the transfer space S1. Therefore, when performing the above-described maintenance, the transfer space S1 can be accessed from the side (the side surface 123a side), and this access does not require removing components of the storage space S11. Therefore, according to this embodiment, it is possible to contribute to improving the maintainability of the transfer device 20.

[0110] Furthermore, in this embodiment, the column member 510, in which the exhaust path E is formed, has an exhaust port 700, which is continuous with the exhaust path E, on the side surface on the storage space S11 side. Therefore, an airflow that passes over the wafer W supported in the storage space S11 and flows along the surface of the wafer W can be formed in the storage space S11.

[0111] Furthermore, in this embodiment, the main body 102 further includes an air supply path D that supplies gas to the storage space S11, and at least a portion of the air supply path D is formed within the wall 120A of the housing 120. Therefore, according to this embodiment, unlike the previous embodiment, the air supply path D is not formed within the wall 120A of the housing 120, and compared to an embodiment in which it is provided separately, an increase in the number of parts and an increase in manufacturing costs can be suppressed.

[0112] Unlike this embodiment, in a configuration in which the air supply path D and the second FFU 720 are not provided, if part of the gas sent from the first FFU 260 into the transfer space S1 is made to flow into the storage space S11 by exhaust from the exhaust path E, it may be difficult to form a downflow of desired strength in the transfer space S1. The downflow can be made stronger by increasing the flow rate of the gas sent from the first FFU 260, but there is also a limit to how much this flow rate can be increased.

[0113] In contrast, in this embodiment, the main body 102 of the transfer device 20 includes, in addition to the first FFU 260 and the exhaust path E, a second FFU 720 that is provided separately from the first FFU 260 and that outputs gas to be supplied to the storage space S11, and an air supply path D that supplies the gas output from the second FFU 720 to the storage space S11. Therefore, a required flow rate of gas can be supplied to the storage space S11 without increasing the flow rate of gas output from the first FFU 260. That is, within the range of the flow rate of gas that can be output from the first FFU 260, gas can be supplied to both the transfer space S1 and the storage space S11 at a flow rate required to form appropriate airflows in these spaces. Therefore, appropriate airflows can be formed in both the transfer space S1 and the storage space S11. This prevents particles from being stirred up in the transfer space S1 and also prevents corrosive gases from being generated from the wafer W supported in the storage space S11.

[0114] In this embodiment, the use of the vertical articulated arm 230 in the transfer robot 110 allows the footprint of the transfer space S1 to be reduced. Specifically, the width of the transfer space S1 in the depth direction (Y direction) of the device can be reduced compared to when a module is used in which a horizontal arm is moved vertically and in the width direction of the device by a lifting body configured to be movable along a rail extending in the width direction of the device (X direction) instead of the vertical articulated arm 230. However, when the footprint of the transfer space S1 is reduced, the area of ​​the first FFU 260 in a plan view is reduced, which may result in a reduced flow rate of gas supplied from the first FFU 260 to the transfer space S1. In this embodiment, even when the footprint of the transfer space S1 is small and the flow rate of gas supplied from the first FFU 260 to the transfer space S1 is relatively low, the use of the second FFU 720 allows gas to be supplied to both the transfer space S1 and the storage space S11 at a flow rate required to form appropriate airflows within these spaces.

[0115] Furthermore, when a large number of wafers W can be accommodated in the storage space S11, a large flow rate of gas is required for the storage space S11. Even when a large flow rate of gas is required for the storage space S11, by using the second FFU 720 as in this embodiment, gas can be supplied to both the transfer space S1 and the storage space S11 at a flow rate required to form an appropriate airflow in these spaces.

[0116] Furthermore, in this embodiment, the storage space S11 is partitioned into a plurality of regions R. The air supply path D has an individual air supply path D1 provided for each region R of the storage space S11. Therefore, it is possible to prevent differences in the flow rate of gas supplied to each region R of the storage space S11 via the air supply path D from the second FFU 720, which is a single gas supply source for the air supply path D, between the regions R.

[0117] Furthermore, in this embodiment, the main body 102 is provided with an air intake port 660 that is continuous with the air intake path D, and the air intake port 660 is covered with a baffle member 670 that has a plurality of through holes 671. Therefore, it is possible to prevent the strength of the airflow formed by the gas supplied from the air intake path D through the air intake port 660 from becoming uneven within the storage space S11.

[0118] Furthermore, in this embodiment, the main body 102 is provided with an exhaust port 700 that is continuous with the exhaust path E, and the exhaust port 700 is covered with a baffle member 710 that has a plurality of through holes 711. Therefore, it is possible to prevent the strength of the airflow formed by exhaust through the exhaust port 700 and the exhaust path E from becoming uneven within the storage space S11.

[0119] Furthermore, in this embodiment, a virtual normal L1 extending from the air supply surface 641a, where the air supply port 660 is formed and facing the storage space, intersects with the transfer space S1. Therefore, the airflow formed by the gas supplied from the air supply port 660 can prevent the gas in the transfer space S1 from flowing into the storage space S11. Furthermore, a virtual normal L2 extending from the exhaust surface 510a, where the exhaust port 700 is formed and facing the storage space S11, intersects with the transfer space S1, and the air supply surface 641a and the exhaust surface 510a are arranged to sandwich the wafer W supported in the storage space S11 and form an inverted V shape (a gap at the tip) in a plan view. Therefore, the airflow formed by the gas supplied from the air supply port 660 being exhausted through the exhaust port 700 can be supplied to a larger area on the surface of the wafer W supported in the storage space S11.

[0120] Furthermore, in this embodiment, of the multiple pillar members, the pillar member 510 located on the rear side is composed of an upper member 511 and a lower member 512, and the rear surface 512a of the lower member 512 is located forward of the rear surface 511a of the upper member. Specifically, the pillar member 510 extends vertically downward from its upper end to the inclined portion 513, which extends diagonally downward toward the front, and extends vertically downward from the inclined portion 513 to its lower end. Therefore, the space S21 below the upper member 511 (specifically, below the inclined portion 513) (i.e., the space behind the rear surface 512a of the lower member 512) can be used as an accommodation space for accommodating a storage exhaust duct, etc. Unlike the present embodiment, if the rear surface 512a of the lower member 512 of the rear pillar member 510 is located at the same position as the rear surface 511a of the upper member 511, installing the storage exhaust duct 750 or the like in the space behind the rear surface 512a of the lower member 512 would result in the equipment footprint of the transport device 20 expanding rearward by that amount. According to the present embodiment, the storage exhaust duct 750 or the like can be accommodated in the space S21 below the upper member 511 of the rear pillar member 510, which can contribute to reducing the equipment footprint, and specifically, can prevent the equipment footprint of the transport device 20 from expanding rearward.

[0121] Furthermore, in this embodiment, an intra-beam exhaust channel 755 is formed inside a central portion of the beam member 520 of the housing 120, which is located within the region where the beam member 520 overlaps with the load lock chamber 51 in the device width direction (X direction), and the portion of the exhaust channel in the storage exhaust duct 750A located within the overlapping region is configured by the intra-beam exhaust channel 755. Therefore, according to this embodiment, unlike an embodiment in which the storage exhaust duct is located at the rear of the housing 120 in the overlapping region, it is not necessary to move the load lock chamber 51 rearward from the transfer device 20 to avoid interference between the storage exhaust duct and components (e.g., components of the load lock module 50) provided below the load lock chamber 51. Furthermore, since it is not necessary to narrow the storage exhaust duct to shorten the distance from the transfer device 20 to the load lock chamber 51, the exhaust capacity through the storage exhaust duct can be ensured. Therefore, according to this embodiment, it is possible to contribute to reducing the footprint of the wafer processing system 1 including the transport device 20 and the processing device 10 while suppressing the impairment of exhaust through the storage exhaust duct.

[0122] Furthermore, in this embodiment, an integrated box 770 is provided that is connected to an exhaust mechanism external to the transfer device 20, and the storage exhaust duct 750 and the transfer space exhaust duct 760 are connected together to the external exhaust mechanism via the integrated box 770. Therefore, according to this embodiment, compared to when the storage exhaust duct 750 and the transfer space exhaust duct 760 are individually connected to the external exhaust mechanism, piping for connecting the storage exhaust duct 750 and the transfer space exhaust duct 760 to the external exhaust mechanism is easier, which can contribute to reducing manufacturing costs.

[0123] Furthermore, the integrated box 770 is housed in the space S21 below the upper member 511 that constitutes the rear pillar member 510. Therefore, an increase in the device footprint due to the provision of the integrated box 770 can be suppressed.

[0124] Second Embodiment Fig. 19 is a cross-sectional side view of a transport device 20 according to a second embodiment. Fig. 20 is a partially enlarged view of Fig. 19. Fig. 21 is a cross-sectional front view of a transport device 20 according to the second embodiment. Fig. 22 is an exploded view of a sub-exhaust box, which will be described later.

[0125] In the transfer device according to the first embodiment, all of the gas supplied to the storage space S11 and exhausted to the exhaust path E is exhausted to the outside of the device. In the transfer device 20 according to the second embodiment, the gas supplied to the storage space S11 and exhausted to the exhaust path E is circulated so that it is supplied to the storage space S11 again.

[0126] 19 , in the transfer device 20 according to the second embodiment, a return path B is formed in the front (negative side in the Y direction) of the column member 500, which returns the gas supplied to the transfer space S1 from the storage space S2 (the upper space of the transfer space S1) where the first FFU 260 is provided to the storage space S2 back to the storage space S2. The transfer device 20 according to the second embodiment uses this return path B to circulate the gas supplied to the storage space S11 and exhausted to the exhaust path E. This will be described in more detail below. Note that the following describes the configuration of the positive side in the X direction of the main body 102 of the transfer device 20 according to the second embodiment, and the configuration of the negative side in the X direction is the same as the configuration of the positive side in the X direction, so a description of that will be omitted.

[0127] In this embodiment, on the positive side of the main body 102 in the X direction, the exhaust path E is formed in the rear pillar member 510, and the return path B is formed inside the front pillar member 500. That is, in this embodiment, the pillar member 510 in which the exhaust path E is formed and the pillar member 510 in which the return path B is formed are aligned along the device depth direction (Y direction) and face each other.

[0128] An exhaust port 701 communicating with the exhaust path E of the pillar member 510 is formed in the front surface 510b at the lower end of the rear pillar member 510. The front surface 510b extends in the device width direction (X direction). A fan 800 is disposed in the exhaust path E within the lower end of the rear pillar member 510, and guides gas supplied to the storage space S11 into the exhaust path E. The fan 800 sends the gas within the exhaust path E toward the exhaust port 701, i.e., sends the gas within the exhaust path E through the exhaust port 701 into a sub-exhaust box 810 (described later). Specifically, the fan 800 is disposed in the exhaust path E below the inclined portion 513 of the pillar member 510. The fan 800 may be disposed in the sub-exhaust box 810 (described later).

[0129] The exhaust passage E is formed along the shape of the rear pillar member 510 having the inclined portion 513 .

[0130] An inlet 702 communicating with the return path B is formed on the rear surface 500a of the lower end of the front pillar member 500. The rear surface 500a extends in the device width direction (X direction). In this embodiment, the exhaust port 701 is formed at a first height position, and the inlet 702 is formed at a second height position different from the first height position (in the example shown in the figure, the second height position is higher than the first height position). A fan (not shown) that guides gas around the inlet 702 into the return path B may be provided in the return path B of the front pillar member 500.

[0131] Furthermore, as shown in Figures 20 and 21, a sub-exhaust box 810 is provided in the housing 120 as a component for guiding the gas discharged from the exhaust path E of the rear pillar member 510 to the return path B of the front pillar member 500. The sub-exhaust box 810 is supplied with the gas discharged from the exhaust path E.

[0132] On the positive side of the main body 102 in the X direction, the sub-exhaust box 810 is provided on the bottom wall 124. Specifically, the sub-exhaust box 810 is provided on the bottom wall 124 so as to be aligned in the device width direction (X direction) with the exhaust box 250 (hereinafter sometimes referred to as the "main exhaust box 250"). The sub-exhaust box 810 is also provided so as to connect the rear pillar member 510 and the front pillar member 500. Specifically, the sub-exhaust box 810 is provided so as to connect the exhaust port 701 of the rear pillar member 510 and the intake port 702 of the front pillar member 510.

[0133] Furthermore, in this embodiment, the sub-exhaust box 810 is configured so that gas from the transfer space S1 is supplied to it. Specifically, the sub-exhaust box 810 is connected to the main exhaust box 250, and as shown in Fig. 22, an opening 811 is formed in the surface facing the main exhaust box 250. More specifically, the sub-exhaust box 810 is arranged so that a first box 821 (described later) is adjacent to the main exhaust box 250 in the apparatus width direction (X direction), and the opening 811 is formed in a surface 821a of the first box 821 facing the main exhaust box 250.

[0134] The main exhaust box 250 has an opening 251 formed in an end face 250a on the side of the sub-exhaust box 810 in the device width direction (X direction) in a plan view, i.e., on the side of the exhaust path E and return path B. The internal space of the main exhaust box 250 and the internal space of the sub-exhaust box 810 are in communication with each other via the opening 811 and the opening 251. The end face 250a extends in the device depth direction (Y direction).

[0135] The sub-exhaust box 810 has, for example, a first box 821 and a second box 822 that are provided at different heights. For example, the first box 821 is provided below the second box 822. The first box 821 and the second box 822 are each formed to be hollow, and more specifically, formed to be hollow rectangular parallelepiped.

[0136] The first box 821 is connected to the portion of the rear pillar member 510 where the exhaust port 701 is formed. A surface 821a of the first box 821 on the main exhaust box 250 side is the first surface that is connected to the end surface 250a of the main exhaust box 250. This surface 821a extends in the device depth direction (Y direction), and has the opening 811 formed therein, as described above. The internal space of the main exhaust box 250 and the internal space of the first box 821 communicate with each other via the opening 811 and the opening 251.

[0137] Furthermore, the rear surface 821b of the first box 821 serves as a second surface connected to the end surface of the pillar member 510, inside which the exhaust path E is formed, on the return path B side in plan view, i.e., the front surface 510b. This rear surface 821b extends in the device width direction (X direction) and has an opening 812 formed therein. The internal space of the first box 821 and the exhaust path E formed inside the pillar member 510 communicate with each other via the opening 812 and the exhaust port 701.

[0138] Furthermore, an upper surface 821c of the first box 821 is connected to a lower surface 822a of the second box 822. This upper surface 821c extends horizontally and has an opening 813 formed therein. Similar to the upper surface 821c of the first box 821, the lower surface 822a of the second box 822 also extends horizontally and has an opening 814 formed therein. The internal spaces of the first box 821 and the second box 822 communicate with each other via the openings 813 and 814.

[0139] Furthermore, a front surface 822b of the second box 822 serves as a third surface connected to the end surface of the pillar member 500, inside which the return path B is formed, on the exhaust path E side in plan view, i.e., the rear surface 500a. This front surface 822b extends in the device width direction (X direction) and has an opening 815 formed therein. The internal space of the second box 822 and the return path B formed inside the pillar member 500 communicate with each other via the opening 815 and the intake port 702.

[0140] The sub-exhaust box 810 may be provided with a fan 830 that sends gas from the main exhaust box 250 into the sub-exhaust box 810. The fan 830 is provided in the first box 821, for example.

[0141] In this embodiment, the gas in the accommodation space S2 is supplied to each of the transfer space S1 and the storage space S11, and the gas exhausted from the exhaust path E, which is supplied into the sub-exhaust box 810 provided in the housing 120, and the gas in the transfer space S1 are returned to the accommodation space S2 via the return path B. This makes it possible to supply the gas in the accommodation space S2 again to the storage space S11 and the transfer space S1. Note that in the transfer device 20 according to this embodiment, a portion of the gas exhausted to the exhaust path E may be circulated, and the remainder may be exhausted to the outside of the device via the storage exhaust duct 750.

[0142] 21 , one end of a supply pipe 270 that supplies an inert gas such as nitrogen gas to the accommodation space S2 may be connected to the housing 120. The other end of the supply pipe 270 is connected to a gas supply mechanism 271. The gas supply mechanism 271 includes, for example, an inert gas supply source, a switching valve that switches on / off the supply of the inert gas, and a flow rate adjustment valve that adjusts the flow rate of the inert gas.

[0143] By providing the supply pipe 270 as described above, purified inert gas can be supplied from the first FFU 260 and the second FFU 720, and the inert gas can be circulated inside the main body 102. Note that dry air may also be circulated inside the main body 102. In this case, for example, dry air is supplied into the accommodation space S2 from the gas supply mechanism 271 via the supply pipe 270.

[0144] <Major Effects of the Present Embodiment> According to the present embodiment, even when circulating gas for the storage space S11, it is possible to suppress an increase in the footprint of the device because the exhaust path E for exhausting the gas supplied to the storage space S11 is formed inside the column members 510 that constitute the housing 120. In addition, it is possible to reduce the number of parts, which also contributes to a reduction in manufacturing costs.

[0145] Furthermore, in this embodiment, the return path B is formed within the pillar member 500. The pillar member 510, in which the exhaust path E is formed, and the pillar member 500, in which the return path B is formed, are aligned along the device depth direction (Y direction) and face each other. Therefore, the distance from the pillar member 510 in which the exhaust path E is formed to the return path B is shortened. Therefore, in the case where gas supplied from the accommodation space S2 to the storage space S11 and exhausted via the exhaust path E is returned to the accommodation space S2 via the return path B and circulated, as in this embodiment, it is possible to prevent the component (specifically, the sub-exhaust box 810) that guides the gas exhausted from the exhaust path E of the pillar member 510 to the return path B of the pillar member 500 from becoming large. This can contribute to reducing the manufacturing cost of the sub-exhaust box 810, and as a result, can contribute to reducing the manufacturing cost of the transport device 20.

[0146] In this embodiment, the sub-exhaust box 810 supplies the gas exhausted from the exhaust path E to the return path B. This prevents the downflow formed in the transfer space S1 from being disturbed by the gas exhausted from the exhaust path E. As a result, it is possible to prevent the downflow from being disturbed and a vortex from being formed in the transfer space S1, thereby preventing particles from being stirred up.

[0147] Furthermore, in this embodiment, the sub-exhaust box 810 has a hollow first box 821 and a hollow second box 822 that are provided at different heights. The first box 821 and the second box 822 are connected so that their hollow portions communicate with each other. The first box 821 is provided with a first surface (surface 821a) that connects to the end surface 250a of the main exhaust box 250 that faces the exhaust path E and the return path B in a planar view, and a second surface (rear surface 821b) that connects to the end surface (front surface 510b) of the pillar member 510 that faces the return path B in a planar view, the pillar member 510 having the exhaust path E formed therein. In addition, the second box 822 is provided with a third surface (front surface 822b) that connects to the end surface (rear surface 500a) of the pillar member 500 that faces the exhaust path E in a planar view, the pillar member 500 having the return path B formed therein.

[0148] Unlike the present embodiment, when the sub-exhaust box 810 is configured as a single rectangular parallelepiped box, it may be difficult to closely connect each of the first to third surfaces to the end faces of the corresponding components (face 821a, front face 510b, rear face 500a). In contrast, in the present embodiment, the sub-exhaust box 810 is configured as described above, so each of the first to third surfaces can be closely connected to the end faces of the corresponding components. This prevents gas from leaking into the transfer space S1 from the connection between the sub-exhaust box 810 and the main exhaust box 250 and the connection between the sub-exhaust box 810 and the pillar members 500 and 510. As a result, the downflow formed in the transfer space S1 is prevented from being disturbed by gas leaking from the connection. Furthermore, in the present embodiment, the first box 821 and the second box 822 may have a simple rectangular parallelepiped shape. Therefore, this embodiment contributes to reducing the manufacturing cost of the sub-exhaust box 810, and as a result, contributes to reducing the manufacturing cost of the transfer device 20.

[0149] In this embodiment, the pillar member 510 disposed on the rear side extends downward from its upper end to the inclined portion 513, the inclined portion 513 extends diagonally downward toward the front side, and extends downward from the inclined portion 513 to its lower end. An exhaust path E is formed inside the pillar member 510 along the shape of the pillar member 510. Therefore, the space S21 below the inclined portion 513 can be used as an accommodation space for a storage exhaust duct 750 or the like. One possible configuration for forming an accommodation space in a similar position to this embodiment is to form the rear pillar member 510 and the exhaust path E in a crank shape. However, compared to this configuration, this embodiment allows for a smoother flow of gas within the exhaust path E.

[0150] Furthermore, in this embodiment, a fan 800 is provided that guides the gas supplied to the storage space S11 into the exhaust path E. Therefore, it is possible to adjust the exhaust flow rate from the storage space S11. Also, it is possible to ensure the flow rate of the gas that is supplied from the accommodation space S2 to the storage space S11 and exhausted via the exhaust path E, and returned to the accommodation space S2 via the return path B.

[0151] Modification of Second Embodiment The first surface described above, which is provided on the first box 821 in the above example, may be provided on the second box 822 .

[0152] <Modifications of the First and Second Embodiments> Although the first FFU 260 and the second FFU 720 are accommodated in the same accommodation space S2, they may be accommodated in separate spaces that are separated from each other. In a configuration in which the gas from the second FFU 720 is circulated by returning the gas discharged from the exhaust path E to the space in which the first FFU 260 is accommodated via the return path B, as in the second embodiment, when the first FFU 260 and the second FFU 720 are accommodated in separate spaces that are separated from each other, for example, the configuration may be as follows. That is, the space in which the first FFU 260 is accommodated and the space in which the second FFU 720 is accommodated are connected by a gas supply pipe.

[0153] In the above example, the exhaust path E is shared among the multiple regions R of the storage space S11, but an exhaust path E may be provided for each region R, and each exhaust path may be formed within a single pillar member. Alternatively, two exhaust paths may be formed within a pillar member, with one exhaust path exhausting air from a specific region (e.g., the region on the top three layers) and the other exhaust path exhausting air from the other region (e.g., the region on the bottom two layers). When multiple exhaust paths are formed within a single pillar member, a storage exhaust duct 750 and a fan 800 may be provided for each exhaust path. When multiple exhaust paths are formed within a single pillar member, for example, an exhaust port 701 is provided for each exhaust path, and the sub-exhaust box 810 is shared between the exhaust paths.

[0154] In the above example, the storage space S11 is connected to the rear side of the transfer space S1, but it may also be connected to the front side of the transfer space S1. In this case, an exhaust path E is formed in the front pillar member, and a return path B is formed in the rear pillar member. However, connecting the storage space S11 to the rear side of the transfer space S1 allows the number of load ports 101 to be maintained while reducing the footprint of the device. Furthermore, the storage space S11 provided at one end of the device width direction and the storage space S11 provided at the other end of the device width direction may be different. For example, the number of regions R, i.e., the number of divisions of the storage space S11, may be different between the storage space S11 provided at one end of the device width direction and the storage space S11 provided at the other end of the device width direction.

[0155] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0156] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that would be apparent to a person skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0157] The following configuration examples also fall within the technical scope of the present disclosure. (1) A transport device that loads and unloads substrates into and from a processing device that processes the substrates, the transport device comprising: a main body having a transport space in which a transport robot that transports the substrates is provided; and a storage space connected to the transport space and supporting the substrates, the main body comprising: a housing that constitutes the transport space, the housing having walls that form a front side to which a load port on which a container that stores the substrates is connected, a rear side to which a load lock provided in the processing device is connected, and a pair of side surfaces that connect the front side and the rear side in the depth direction of the device, and pillar members connected to the walls; and an exhaust path that exhausts gas supplied to the storage space, the exhaust path being formed in the pillar members of the housing. (2) The transport device according to (1), wherein the pillar member with the exhaust path formed therein is provided on the rear side, and the storage space is connected to the rear side of the transport space. (3) The transport device according to (1) or (2), wherein the pillar member having the exhaust path formed therein has an exhaust port continuous to the exhaust path on a side surface facing the storage space. (4) The transport device according to any one of (1) to (3), wherein the main body further includes an air supply path that supplies the gas to the storage space, and at least a portion of the air supply path is formed within the wall of the housing. (5) The transport device according to any one of (1) to (4), wherein the main body further includes: an accommodation space that accommodates a gas supply unit that supplies the ambient gas to the transfer space; and a return path that returns the gas in the transfer space to the accommodation space, and the return path is formed within the pillar member of the housing, and the pillar member having the exhaust path formed therein and the pillar member having the return path formed therein are aligned along the device depth direction and face each other.(6) A method for exhausting gas from a storage space supporting a substrate, connected to a transport space in which a transport robot for transporting the substrate is provided, in a transport device that transports substrates to and from a processing device for processing the substrate, wherein the transport device has a main body having the transport space and the storage space, the main body being a housing that constitutes the transport space, the housing having a wall portion that forms a front surface to which a load port on which a container for accommodating the substrate is connected, a rear surface to which a load lock provided in the processing device is connected, a pair of side surfaces that connect the front surface and the rear surface, and column members that are connected to the wall portion, and the exhaust method comprises exhausting gas supplied to the storage space through an exhaust path formed in the column members of the housing.

[0158] REFERENCE SIGNS LIST 10 Processing device 20 Transfer device 51 Load lock chamber 101 Load port 102 Main body 110 Transfer robot 120 Housing 120A Wall 121a Front surface 122a Rear surface 123a Side surface 500 Pillar member 510 Pillar member E Exhaust path S1 Transfer space S11 Storage space W Wafer

Claims

1. A transport device for loading and unloading substrates into and from a processing device for processing the substrates, the transport device comprising: a main body having a transport space in which a transport robot for transporting the substrates is provided; and a storage space connected to the transport space and for supporting the substrates; the main body being a housing constituting the transport space, the housing having walls forming a front surface to which a load port on which a container for accommodating the substrates is connected, a rear surface to which a load lock provided in the processing device is connected, and a pair of side surfaces connecting the front surface and the rear surface in the depth direction of the device, and column members connected to the walls; and an exhaust path for exhausting gas supplied to the storage space, the exhaust path being formed within the column members of the housing.

2. The transport device according to claim 1, wherein the pillar member having the exhaust path formed therein is provided on the rear side, and the storage space is connected to the rear side of the transport space.

3. A transport device according to claim 1 or 2, wherein the column member having the exhaust path formed therein has an exhaust port on the side facing the storage space that is continuous with the exhaust path.

4. A conveying device according to claim 1 or 2, wherein the main body further comprises an air supply passage for supplying the gas to the storage space, and at least a portion of the air supply passage is formed within the wall of the housing.

5. A conveying device as described in claim 1 or 2, wherein the main body further comprises: a storage space that stores a gas supply unit that supplies the surrounding gas to the conveying space; and a return path that returns the gas in the conveying space to the storage space, the return path being formed within the pillar member of the housing; and the pillar member in which the exhaust path is formed and the pillar member in which the return path is formed being aligned along the depth direction of the device and facing each other.

6. A method for exhausting gas from a storage space for supporting substrates, connected to a transport space in which a transport robot for transporting the substrates is provided, in a transport device that transports substrates into and out of a processing device for processing the substrates, wherein the transport device has a main body having the transport space and the storage space, the main body being a housing that constitutes the transport space, the housing having a front surface to which a load port on which a container for accommodating the substrates is connected, a rear surface to which a load lock provided in the processing device is connected, and a pair of side surfaces connecting the front surface and the rear surface, and column members connected to the wall portions, and the exhaust method comprises exhausting gas supplied to the storage space through an exhaust path formed in the column members of the housing.

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