Imaging device and manufacturing method for imaging device

Abstract

An imaging device according to one embodiment of the present disclosure comprises: a substrate which has an imaging element; a holder which is provided on the substrate, holds a lens part, and forms, together with the substrate and the lens part, an internal space accommodating the imaging element; an adhesive part which brings the substrate and the holder into close contact with each other; a through hole which is formed in the substrate and connected to the internal space; a component which is separated from the substrate and covers the through hole; and a fixing part which is provided on the substrate so as to avoide the through hole and fixes the component to the substrate.

Description

Image pickup device and method for manufacturing the same

[0001] The present disclosure relates to an imaging device and a method for manufacturing an imaging device.

[0002] Typically, in the manufacture of imaging devices such as in-vehicle cameras, a holder that holds a lens is fixed to a substrate on which an imaging element is mounted by placing the holder on the surface of the substrate via a UV (ultraviolet) curing adhesive, adjusting the positional relationship between the lens part and the imaging element (after alignment), irradiating the adhesive with UV light to pre-cure it, and then fully curing the pre-cure adhesive in a heat curing oven or the like.

[0003] During the final curing process, the pressure inside the holder increases. The adhesive cannot withstand this pressure increase, causing air bubbles to form in the adhesive, which can lead to a misalignment in the positional relationship between the lens unit and the image sensor (e.g., the focal point of the lens). To prevent this misalignment, a through-hole connected to the inside of the holder is provided in the substrate, allowing the increased pressure inside the holder during the final curing process to escape to the outside, equalizing the pressure inside the holder with the external pressure. However, foreign matter (e.g., dust, dirt, etc.) can enter the holder through the through-hole and adhere to the image sensor. To prevent this foreign matter from entering, the through-hole is blocked with a sheet such as breathable adhesive tape (see, for example, Patent Document 1).

[0004] International Publication No. 2021 / 020256

[0005] However, the technology using sheets such as the aforementioned adhesive tape requires an area on the board for the sheet to be attached. This makes it difficult to apply the sheet to a board with a large number of components, for example. The area for attaching the sheet is usually set to a certain size, taking into consideration the possibility of misalignment when the sheet is attached manually or by an automatic attachment machine. This requirement makes it difficult to achieve high-density packaging.

[0006] Therefore, the present disclosure provides an imaging device and a manufacturing method for the imaging device that can achieve high-density packaging while suppressing misalignment of the positional relationship between the lens unit and the imaging element and the inclusion of foreign matter.

[0007] An imaging device according to one embodiment of the present disclosure includes a substrate having an imaging element, a holder provided on the substrate, holding a lens unit, and forming an internal space that, together with the substrate and the lens unit, accommodates the imaging element, an adhesive portion that tightly contacts the substrate and the holder, a through hole formed in the substrate and leading to the internal space, a component spaced apart from the substrate and covering the through hole, and a fixing portion provided on the substrate avoiding the through hole and fixing the component to the substrate.

[0008] A manufacturing method for an imaging device according to one embodiment of the present disclosure includes providing a holder on a substrate having an imaging element, the holder holding a lens unit via an adhesive and forming an internal space that accommodates the imaging element together with the substrate and the lens unit, aligning the lens unit and the imaging element, and hardening the adhesive after the alignment is performed, wherein the substrate has a through hole formed in the substrate and connected to the internal space, a component spaced apart from the substrate and covering the through hole, and a fixing portion provided on the substrate avoiding the through hole and fixing the component to the substrate.

[0009] 1 is a cross-sectional view showing a configuration example of an imaging device according to an embodiment of the present disclosure; FIG. 2 is a cross-sectional view showing a configuration example of a cover unit according to an embodiment of the present disclosure; FIG. 3 is a plan view showing a configuration example of a cover unit according to an embodiment of the present disclosure; FIG. 4 is an explanatory diagram showing a flow of a manufacturing process of an imaging device according to an embodiment of the present disclosure; FIG. 5 is a cross-sectional view showing a configuration example of an imaging device of a comparative example according to an embodiment of the present disclosure; FIG. 6 is a cross-sectional view showing a configuration example of an imaging device of a first modified example according to an embodiment of the present disclosure; FIG. 7 is a cross-sectional view showing a configuration example of a cover unit of an imaging device of a second modified example according to an embodiment of the present disclosure; FIG. 8 is a plan view showing a configuration example of a cover unit of an imaging device of a second modified example according to an embodiment of the present disclosure; FIG. 9 is a block diagram showing an example of a schematic configuration of a vehicle control system; FIG. 10 is an explanatory diagram showing an example of the installation positions of an outside vehicle information detection unit and an imaging unit;

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments include examples and modifications. Note that the devices, methods, systems, etc. according to the present disclosure are not limited to the embodiments. Furthermore, in the embodiments, essentially identical components are designated by the same reference numerals, and redundant explanations will be omitted.

[0011] The present disclosure will be described in the following order: 1. Embodiment 1-1. Configuration example of imaging device 1-2. Configuration example of cover portion 1-3. Example of manufacturing process of imaging device 1-4. Modification 1 1-5. Modification 2 1-6. Actions and effects 2. Other embodiments 3. Application examples 4. Supplementary notes

[0012] 1. Embodiment 1-1. Configuration Example of Imaging Device An example of the configuration of an imaging device 1 according to this embodiment will be described with reference to Fig. 1. Fig. 1 is a cross-sectional view showing an example of the configuration of an imaging device 1 according to this embodiment.

[0013] As shown in FIG. 1, the imaging device 1 according to this embodiment includes a substrate 10 , an imaging element 20 , a lens unit 30 , a holder 40 , an adhesive unit 50 , and a cover unit 60 .

[0014] The substrate 10 has an inner surface (first surface) A1, an outer surface (second surface) A2, and a through hole 11. The inner surface A1 and the outer surface A2 are each flat, and the inner surface A1 and the outer surface A2 face each other. The through hole 11 is formed to extend in the Z-axis direction from the inner surface A1 to the outer surface A2. The through hole 11 may be, for example, a through hole, a through via hole, or the like. The substrate 10 may be, for example, an organic substrate, an inorganic substrate, or the like.

[0015] The imaging element 20 is provided on the inner surface A1 of the substrate 10. For example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor is used as the imaging element 20. In addition to the imaging element 20, various electronic components (e.g., chips, resistors, connectors, capacitors, etc.) are mounted on the substrate 10.

[0016] The lens unit 30 has a plurality of lenses 31, 32 and a lens barrel unit 33. Each of the lenses 31, 32 is provided inside the lens barrel unit 33. In the example of FIG. 1 , two lenses 31, 32 are provided at both ends of the lens barrel unit 33 in the Z-axis direction (optical axis direction). The lens barrel unit 33 holds each of the lenses 31, 32. For example, a biconvex lens, a plano-convex lens, a biconcave lens, a plano-concave lens, a meniscus lens, or the like is used as each of the lenses 31, 32.

[0017] The holder 40 holds the lens unit 30. This holder 40 holds, for example, one end in the Z-axis direction of the barrel unit 33 of the lens unit 30. For example, one end in the Z-axis direction of the barrel unit 33 is inserted into a housing hole 41 of the holder 40, and the outer periphery of that end is tightly attached to and fixed in the housing hole 41. As the holder 40, for example, a metal holder made of aluminum die-cast or the like is used.

[0018] The holder 40 holding the lens unit 30 is provided on the inner surface A1 of the substrate 10 via an adhesive unit 50 so as to form an internal space 42 that houses the imaging element 20 together with the substrate 10 and the lens unit 30. The internal space 42 is connected to the external space via the through-hole 11 in the substrate 10. The holder 40 is adhered and fixed to the inner surface A1 of the substrate 10 by the adhesive unit 50. This brings the holder 40 and the substrate 10 into close contact (contact with no gaps). Note that if the through-hole 11 does not exist in the substrate 10, the imaging element 20 in the internal space 42 will be sealed.

[0019] The adhesive portion 50 is provided in a ring shape on the inner surface A1 of the substrate 10. This adhesive portion 50 secures the holder 40 by tightly contacting it to the inner surface A1 of the substrate 10. At this time, the outer peripheral region of the inner surface A1 of the substrate 10 and the lower surface of the outer peripheral wall of the holder 40 (the lower surface in FIG. 1 ) are in close contact with each other. The adhesive portion 50 may be formed, for example, from a hybrid adhesive (a photo-curing and thermosetting adhesive) having photo-curing properties (e.g., UV-curing properties) and thermosetting properties.

[0020] The cover portion 60 has a component 61 and a fixing portion 62. The fixing portion 62 has a first holding member 62a and a second holding member 62b. The first holding member 62a and the second holding member 62b hold the component 61. The component 61 is spaced from the outer surface A2 of the substrate 10 to cover the through-hole 11, and is fixed to the outer surface A2 of the substrate 10 by the fixing portion 62. Such a cover portion 60 will be described in detail later.

[0021] Although the through-hole 11 described above extends parallel to the Z-axis direction, it may extend obliquely relative to the Z-axis direction, or may extend in a stepped or bent line shape. Furthermore, the lens unit 30 and the holder 40 are formed as separate bodies as described above, but they may also be formed integrally. Furthermore, the adhesive unit 50 may be formed of, for example, an adhesive having only thermosetting properties (a thermosetting adhesive) in addition to the hybrid adhesive.

[0022] <1-2. Configuration Example of Cover Section> A configuration example of the cover section 60 according to this embodiment will be described with reference to Fig. 2 and Fig. 3. Fig. 2 is a cross-sectional view showing the configuration example of the cover section 60 according to this embodiment. Fig. 3 is a plan view showing the configuration example of the cover section 60 according to this embodiment.

[0023] 2 and 3, the cover portion 60 has a component 61 and a fixing portion 62. In the example of Figures 2 and 3, a plurality of conductive layers 12a, 12b, 12c, and 12d and a plurality of protective layers 13a and 13b are provided on the outer surface A2 of the substrate 10.

[0024] The conductive layers 12a and 12d are, for example, pads. The conductive layers 12b and 12c are, for example, wiring patterns. The conductive layers 12b and 12c are provided with the through hole 11 therebetween. The conductive layers 12a and 12d are provided with the through hole 11, the conductive layers 12b and 12c therebetween.

[0025] The protective layer 13a is in contact with and covers the conductive layer 12b. The protective layer 13b is in contact with and covers the conductive layer 12c. These protective layers 13a and 13b are in contact with, for example, the component 61. Each of the protective layers 13a and 13b may be formed of, for example, a solder resist.

[0026] The through hole 11 has a conductive layer 11a. This conductive layer 11a includes a land 11b. For example, the through hole 11 is a through hole having a conductive layer 11a made of copper foil or the like on its inner surface. Note that the through hole 11 may be, other than a through hole, a through hole or a through via hole, as described above. The diameter of the through hole 11 may be proportional to the thickness of the substrate 10, for example. For example, if the thickness of the substrate 10 is 1 mm, the diameter of the through hole 11 may be about 0.5 mm.

[0027] The component 61 is spaced a predetermined distance from the outer surface A2 of the substrate 10 and covers the through-hole 11 of the substrate 10. The component 61 may be, for example, an electronic component such as a chip, or a plate material such as a copper plate. In addition to chips such as semiconductor chips and integrated circuit (IC) chips, other electronic components may also be, for example, resistors, connectors, capacitors, etc.

[0028] The fixing portion 62 has a first holding member 62a and a second holding member 62b. The first holding member 62a and the second holding member 62b are provided on the outer surface A2 of the substrate 10, i.e., on the conductive layers 12a and 12d, avoiding the through-holes 11 of the substrate 10. The first holding member 62a and the second holding member 62b are formed of, for example, solder.

[0029] The first holding member 62a and the second holding member 62b hold the component 61 together and fix the held component 61 to the outer surface A2 of the substrate 10. The first holding member 62a holds the first end 61a of the component 61, and the second holding member 62b holds the second end 61b. The first end 61a and the second end 61b face each other. Therefore, the first holding member 62a and the second holding member 62b are also arranged to face each other.

[0030] Here, the separation distance B1 between the through hole 11 and the component 61 is set according to the desired size of foreign matter (e.g., approximately 20 to 80 μm) that is to be prevented from entering the through hole 11. For example, if the desired foreign matter size is 50 μm, the separation distance B1 is set to a desired separation distance of 50 μm or less. In the example of FIG. 2 , the separation distance B1 is the length in the Z-axis direction of the gap between the end C1 of the through hole 11 on the component 61 side and the surface C2 of the component 61 on the substrate 10 side.

[0031] Here, the desired foreign object size is the smallest size of foreign objects that one wishes to prevent from entering the through-hole 11. In other words, the desired foreign object size is the largest size of foreign objects that are considered to be acceptable (permissible) even if they enter the through-hole 11. The desired foreign object size may also be expressed as the acceptable foreign object size. The smallest value of the size of foreign objects that one wishes to prevent from entering the through-hole 11, or the largest value of the size of foreign objects that are considered to be acceptable even if they enter the through-hole 11, is referred to as the foreign object size threshold. The acceptable foreign object size is calculated based on the size of the light beam incident on the lens unit 30-side surface of the cover glass disposed on the upper surface of the image sensor 20, which is incident on each photoelectric conversion element of the image sensor 20. The size of the light beam incident on one photoelectric conversion element of the image sensor 20 is calculated based on the distance from the image plane of the image sensor 20 to the surface of the cover glass placed on the top surface of the image sensor 20 facing the image sensor 20, the thickness of the cover glass, the distance from the image plane of the image sensor 20 to the surface of the cover glass facing the lens unit 30, the angle of incidence of light entering the cover glass from the space on the lens unit 30 side, and the angle of emission of light when light entering the cover glass from the space on the lens unit 30 side exits from the space on the lens unit 30 side to the cover glass.

[0032] The separation distance B1 can be changed to a desired distance by, for example, adjusting the thickness (length in the Z-axis direction) of each of the first holding member 62a and the second holding member 62b. The thickness of each of the first holding member 62a and the second holding member 62b can be adjusted by, for example, adjusting the amount of solder applied or the area over which the solder is applied and spreads (e.g., the planar size of each of the conductive layers 12a and 12d). For example, adjusting the amount or area of ​​solder changes the thickness of the solder between the first end 61a of the component 61 and the conductive layer 12a, and also changes the thickness of the solder between the second end 61b of the component 61 and the conductive layer 12d.

[0033] The height position of the component 61 is adjusted by changing the thickness of each of the first holding member 62a and the second holding member 62b, and the separation distance B1 is set to a value equal to or less than a desired foreign object size (a predetermined foreign object size threshold). In other words, by setting the separation distance B1 to the desired separation distance, foreign objects (dust, dirt, etc.) that should be prevented from entering the through-hole 11, such as foreign objects that adversely affect imaging by the imaging element 20, are prevented from entering the internal space 42 of the holder 40.

[0034] It is desirable that the separation distance B1 be set to a value equal to or smaller than the desired foreign matter size. However, in some cases, the separation distance B1 may be set to a value greater than the desired foreign matter size. For example, if the desired foreign matter size is 50 μm, the separation distance B1 may be set to 55 μm. Even in this case, it is possible to prevent foreign matter from entering the internal space 42 of the holder 40.

[0035] Here, if component 61 completely blocks through-hole 11, this could cause internal pressure expansion. However, because conductive layers 12b, 12c and protective layers 13a, 13b are present between component 61 and substrate 10, even if an external force is applied to component 61, separation distance B1 can be ensured, and component 61 can be prevented from completely blocking through-hole 11.

[0036] For example, the conductive layers 12b and 12c are disposed with the through hole 11 between them in a plan view. Therefore, the protective layers 13a and 13b are also disposed with the through hole 11 between them in a plan view (see FIG. 3). The protective layers 13a and 13b are in contact with the component 61.

[0037] The conductive layer 12b and the protective layer 13a constitute members that come into contact with the surface C2 of the component 61 that faces the substrate 10. Similarly, the conductive layer 12c and the protective layer 13b also constitute members that come into contact with the surface C2 of the component 61 that faces the substrate 10. These members come into contact with the surface C2 of the component 61 that faces the substrate 10, and function as spacers that ensure the separation distance B1. Furthermore, because these members are present around the through hole 11, they can prevent foreign matter from entering the through hole 11.

[0038] If the component 61 is made of a non-conductive material, it will not be electrically affected by the substrate 10. On the other hand, if the component 61 is made of a conductive material such as an electronic component and is solder-bonded to the conductive layers 12a and 12d, the component 61 will be electrically affected by the substrate 10. In the solder-bonding, the first holding member 62a and the second holding member 62b are formed by solder.

[0039] In order to prevent the component 61 from being electrically affected by the components on the substrate 10, for example, the conductive layers 12a and 12d may be connected to the ground (GND) potential of the substrate 10. In other words, the through hole 11 may be formed in the ground region (region at ground potential) of the substrate 10, and the component 61 may be provided in the ground region of the substrate 10 so as to cover the through hole 11.

[0040] In addition, if component 61 is, for example, a non-conductive material or a component that does not suffer from electrical effects, through hole 11 may be formed in an area other than the ground area of ​​substrate 10, and component 61 may be provided in an area other than the ground area of ​​substrate 10 so as to cover through hole 11.

[0041] <1-3. Example of Manufacturing Process of Imaging Device> An example of a manufacturing process of the imaging device 1 according to this embodiment will be described with reference to Fig. 4 and Fig. 5. Fig. 4 is an explanatory diagram showing the flow of the manufacturing process of the imaging device 1 according to this embodiment. Fig. 5 is a cross-sectional view showing an example of the configuration of an imaging device 1A as a comparative example according to this embodiment.

[0042] As shown in Figure 4, the manufacturing process of the imaging device 1 according to this embodiment includes an adhesive application process (step S11), a holder installation process (step S12), an alignment process (step S13), a pre-curing process (step S14), and a full-curing process (step S15).

[0043] In the adhesive application process of step S11, a hybrid adhesive is applied to the inner surface A1 of the substrate 10 using an application needle or the like (see FIG. 1). The adhesive is applied in, for example, a rectangular ring shape to match the planar shape (full-circumferential planar shape) of the outer peripheral wall of the holder 40. For example, a hybrid adhesive is used as the adhesive. Note that a through-hole 11 is formed in the substrate 10, and further, a cover portion 60 is provided on the outer surface A2 of the substrate 10 (see FIG. 1).

[0044] In the holder installation process of step S12, the holder 40 holding the lens unit 30 is placed on the inner surface A1 of the substrate 10 via the adhesive (see FIG. 1). The adhesive is present between the inner surface A1 of the substrate 10 and the lower surface of the outer peripheral wall of the holder 40. Note that the lens unit 30 is provided and fixed to the holder 40 before the holder installation process.

[0045] In the alignment process of step S13, alignment is performed between the lens unit 30 held by the holder 40 provided on the inner surface A1 of the substrate 10 and the image sensor 20 mounted on the substrate 10 (see FIG. 1). This aligns the optical axes of the lens unit 30 and the image sensor 20, and determines the positional relationship between the lens unit 30 and the image sensor 20. For example, six-axis alignment is performed using an MTF (Modulation Transfer Function) measurement method.

[0046] The MTF measurement method is defined by ISO (International Organization for Standardization) 12233. In the MTF measurement method, a chart on which an MTF measurement pattern is drawn is photographed by a camera to be measured (e.g., the image sensor 20), and the degree of reproducibility of the contrast of the chart pattern is evaluated. Note that, with the increase in resolution and the miniaturization of the cell size of the image sensor 20, six-axis alignment has become the mainstream method for adjusting the positional relationship between the lens unit 30 and the image sensor 20.

[0047] In the provisional curing step of step S14, after the above-described alignment, light such as UV light is irradiated onto the adhesive on the inner surface A1 of the substrate 10 (see FIG. 1 ), thereby provisionally curing the adhesive and provisionally fixing the substrate 10 and the holder 40 together with the adhesive.

[0048] In the main curing step of step S15, after the aforementioned provisional curing, heat is applied to the adhesive on the inner surface A1 of the substrate 10 (see FIG. 1). For example, the imaging device 1 after the provisional curing is placed in a heat curing oven, and heat is applied to the adhesive on the inner surface A1 of the substrate 10. This causes the adhesive to fully cure, and the substrate 10 and holder 40 are completely fixed together by the adhesive (adhesive portion 50). At this time, the substrate 10 and holder 40 are in close contact with each other.

[0049] 5, the imaging device 1A of the comparative example does not have a through-hole 11 in the substrate 10, nor does it have a cover portion 60. In this case, when the main curing is performed in step S15 described above, the pressure in the internal space 42 of the holder 40 increases, and the adhesive cannot withstand this pressure, which can cause air bubbles 51 to form in the adhesive. The formation of these air bubbles 51 can cause a misalignment in the positional relationship between the lens portion 30 and the imaging element 20 (for example, the focal position of the lens portion 30).

[0050] On the other hand, in the imaging device 1 of this embodiment, a through hole 11 is formed in the substrate 10 (see FIG. 1). The through hole 11 connects the internal space 42 of the holder 40 with the external space, so that the pressure increase in the internal space 42 of the holder 40 during main curing is released to the outside, and the pressure in the internal space 42 of the holder 40 is equalized with the external pressure. This makes it possible to suppress the generation of air bubbles 51 in the adhesive, i.e., in the adhesive joint 50, and thus suppress misalignment of the positional relationship between the lens unit 30 and the imaging element 20.

[0051] Furthermore, the through-hole 11 is covered with a cover portion 60 (see FIG. 1 ). This makes it possible to prevent foreign matter such as dust and dirt from entering the internal space 42 of the holder 40 through the through-hole 11, thereby preventing the foreign matter from adhering to the imaging element 20. In other words, it is possible to prevent the intrusion of foreign matter into the imaging device 1. The cover portion 60 is provided, for example, on the outer surface A2 of the substrate 10, i.e., on the surface of the substrate 10 opposite the imaging element 20 side.

[0052] Furthermore, cover portion 60 can cover through-hole 11 in a smaller space than a sheet such as adhesive tape, thereby realizing high-density mounting. Furthermore, even if component 61 and fixing portion 62 of cover portion 60 are made smaller, component 61 can be more reliably fixed to substrate 10 than a sheet such as adhesive tape. Furthermore, when attaching a sheet to substrate 10 by hand or with an automatic attachment machine, an attachment process is required, but when mounting component 61 on substrate 10, component mounting can be performed in a normal component mounting process, thereby simplifying the manufacturing process.

[0053] <1-4. Modification 1> Modification 1 of the imaging device 1 according to this embodiment will be described with reference to Fig. 6. Fig. 6 is a cross-sectional view showing an example of the configuration of the imaging device 1 of Modification 1 according to this embodiment.

[0054] 6, in the first modification, the cover portion 60 is provided on the inner surface A1 of the substrate 10. The inner surface A1 is the surface of the substrate 10 on the imaging element 20 side.

[0055] The component 61 of the cover portion 60 is spaced a predetermined distance from the inner surface A1 of the substrate 10 and covers the through hole 11 of the substrate 10. The fixing portion 62, i.e., the first holding member 62a and the second holding member 62b, are provided on the inner surface A1 of the substrate 10, avoiding the through hole 11 of the substrate 10. The first holding member 62a and the second holding member 62b fix the component 61 to the inner surface A1 of the substrate 10.

[0056] In this modified example 1, as in the above-described embodiment, it is possible to suppress misalignment of the positional relationship between the lens unit 30 and the image sensor 20, to suppress the intrusion of foreign matter into the image pickup device 1, and to achieve high-density packaging. Note that, as in the above-described embodiment, the other effects described above can also be obtained.

[0057] <1-5. Modification 2> Modification 2 of the imaging device 1 according to the present embodiment will be described with reference to Fig. 7 and Fig. 8. Fig. 7 is a cross-sectional view showing an example of the configuration of the cover unit 60 of the imaging device 1 according to Modification 2 according to the present embodiment. Fig. 8 is a plan view showing an example of the configuration of the cover unit 60 of the imaging device 1 according to Modification 2 according to the present embodiment.

[0058] 7 , in Modification 2, protective layer 13 a and protective layer 13 b are not in contact with component 61. In other words, there is a gap between component 61 and each of protective layer 13 a and protective layer 13 b.

[0059] 8, conductive layer 12b and conductive layer 12c are connected by conductive layer 12e and conductive layer 12f. These conductive layers 12b, 12c, 12e, and 12f are provided in, for example, a rectangular ring shape so as to surround through hole 11 in plan view.

[0060] Protective layer 13 a and protective layer 13 b are connected by protective layer 13 c and protective layer 13 d. These protective layers 13 a, 13 b, 13 c, and 13 d are provided in, for example, a rectangular ring shape so as to surround through hole 11 in a plan view.

[0061] Protective layer 13c covers conductive layer 12e, and protective layer 13d covers conductive layer 12f. Like protective layers 13a and 13b, protective layers 13c and 13d are not in contact with component 61. In other words, there are gaps between component 61 and protective layers 13c and 13d, respectively.

[0062] The conductive layer 12b and the protective layer 13a are located around the through hole 11 of the substrate 10 and form a member spaced apart from the component 61. Similarly, the conductive layer 12c and the protective layer 13b are also located around the through hole 11 of the substrate 10 and form a member spaced apart from the component 61. The conductive layer 12e and the protective layer 13c are also located around the through hole 11 of the substrate 10 and form a member spaced apart from the component 61. The conductive layer 12f and the protective layer 13d are also located around the through hole 11 of the substrate 10 and form a member spaced apart from the component 61.

[0063] In this modified example 2, as in the above-described embodiment, it is possible to suppress misalignment of the positional relationship between the lens unit 30 and the image sensor 20, to suppress the intrusion of foreign matter into the image pickup device 1, and to achieve high-density packaging. Note that, as in the above-described embodiment, the other effects described above can also be obtained.

[0064] In Modification 2, none of the protective layers 13a to 13d contact the component 61. However, for example, any one or more of the protective layers 13a to 13d may contact the component 61. The separation distance between the protective layer 13a and the component 61 may be the same as the separation distance B1 between the through hole 11 and the component 61, or may be smaller or larger than the separation distance B1. For example, if the separation distance B1 is equal to or smaller than a desired separation distance (e.g., 50 μm), the separation distance between the protective layer 13a and the component 61 may be larger than 0. On the other hand, if the separation distance B1 is larger than the desired separation distance, it is desirable that the separation distance between the protective layer 13a and the component 61 be equal to or smaller than the desired separation distance. This also applies to the other protective layers 13b to 13d.

[0065] <1-6. Actions and Effects> As described above, the imaging device 1 according to this embodiment includes a substrate 10 having an imaging element 20, a holder 40 provided on the substrate 10, holding a lens unit 30, and forming, together with the substrate 10 and the lens unit 30, an internal space 42 that accommodates the imaging element 20, an adhesive unit 50 that tightly contacts the substrate 10 and the holder 40, a through hole 11 formed in the substrate 10 and connecting to the internal space 42, a component 61 spaced from the substrate 10 and covering the through hole 11, and a fixing unit 62 provided on the substrate 10 avoiding the through hole 11 and fixing the component 61 to the substrate 10 (see FIGS. 1 to 3 , etc.). As a result, the through hole 11 allows a pressure increase in the internal space 42 of the holder 40 during main curing to escape to the outside, making it possible to suppress the generation of air bubbles 51 in the adhesive unit 50, thereby suppressing misalignment between the lens unit 30 and the imaging element 20. It is also possible to prevent foreign matter such as dust and dirt from entering the internal space 42 of the holder 40 through the through-hole 11, thereby preventing foreign matter from entering the imaging device 1. Furthermore, the cover portion 60 can cover the through-hole 11 in a space-saving manner compared to a sheet such as adhesive tape, thereby achieving high-density mounting.

[0066] Furthermore, the component 61 may be an electronic component (see FIGS. 1 to 3, etc.), which makes it possible to reliably achieve high-density packaging.

[0067] Furthermore, the component 61 may be provided on the surface (outer surface A2) of the substrate 10 opposite to the imaging element 20 side (see FIG. 1, etc.), which allows for greater design freedom.

[0068] The component 61 may also be provided on the surface (inner surface A1) of the substrate 10 facing the imaging element 20 (see FIG. 6), which allows for greater design freedom.

[0069] Furthermore, the distance B1 between the through-hole 11 and the component 61 may be set to be equal to or less than the foreign matter size threshold (see FIGS. 2 and 3). This makes it possible to reliably prevent foreign matter from entering the imaging device 1.

[0070] Furthermore, the fixing portion 62 may have a first holding member 62a that holds the first end 61a of the component 61 and a second holding member 62b that holds the second end 61b of the component 61 (see FIGS. 2 and 3 ). This allows the component 61 located above the through-hole 11 in the substrate 10 to be held and the held component 61 to be fixed to the substrate 10.

[0071] The first and second holding members 62a and 62b may be arranged to face each other (see FIGS. 2 and 3), thereby enabling the component 61 located above the through-hole 11 of the substrate 10 to be securely held.

[0072] The first and second holding members 62a and 62b may also be formed of solder (see FIGS. 2 and 3), which allows the component 61 to be reliably fixed to the substrate 10.

[0073] Furthermore, the distance B1 between the through hole 11 and the component 61 may be determined by the thicknesses of the first and second holding members 62a and 62b (see FIGS. 2 and 3), which allows the distance B1 to be easily adjusted.

[0074] Furthermore, even when the separation distance B1 is determined by the thickness of each of the first and second holding members 62 a and 62 b, the separation distance B1 may be set to be equal to or less than the foreign matter size threshold (see FIGS. 2 and 3 ), thereby reliably preventing foreign matter from entering the imaging device 1.

[0075] The imaging device 1 may further include members (e.g., conductive layer 12b, protective layer 13a, conductive layer 12c, protective layer 13b, etc.) that are provided on the substrate 10 to avoid the through-hole 11 and that contact the surface C2 of the component 61 facing the substrate 10 (see FIGS. 2 and 3 ). This ensures the separation distance B1 even when an external force is applied to the component 61, preventing the component 61 from completely blocking the through-hole 11. Furthermore, because the aforementioned members are present around the through-hole 11, they can prevent foreign matter from entering the through-hole 11.

[0076] Furthermore, the member in contact with the surface C2 of the component 61 facing the substrate 10 may include a conductive layer 12b (or a conductive layer 12c) provided on the substrate 10 and a protective layer 13a (or a protective layer 13b) provided on the substrate 10 and covering the conductive layer 12b (see FIGS. 2 and 3). This allows the above-mentioned component to be formed with a simple configuration.

[0077] Furthermore, the imaging device 1 may further include members (e.g., conductive layer 12b, protective layer 13a, conductive layer 12c, protective layer 13b, etc.) that are provided on the substrate 10 to avoid the through-hole 11 and are positioned around the through-hole 11 to be spaced apart from the component 61 (see FIGS. 7 and 8). In this way, the aforementioned members are present around the through-hole 11, and therefore, it is possible to prevent foreign matter from entering the through-hole 11.

[0078] Furthermore, the member spaced apart from the component 61 may be provided directly below the component 61 (see FIGS. 7 and 8 ). This makes it possible to ensure the separation distance B1 even when an external force is applied to the component 61, and to prevent the component 61 from completely blocking the through-hole 11.

[0079] Furthermore, the member spaced apart from the component 61 may be formed so as to surround the through hole 11 in plan view (see FIGS. 7 and 8). In this way, the member is present around the through hole 11 so as to surround the through hole 11, thereby reliably preventing foreign matter from entering the through hole 11.

[0080] Furthermore, the member separated from the component 61 may have the conductive layer 12b (or conductive layer 12c) provided on the substrate 10 (see FIGS. 7 and 8). This allows the aforementioned member to be formed with a simple configuration.

[0081] Furthermore, the member separated from the component 61 may have a protective layer 13a (or protective layer 13b) provided on the substrate 10 and covering the conductive layer 12b (see FIGS. 7 and 8). This allows the above-mentioned member to be formed with a simple configuration.

[0082] Furthermore, the through holes 11 may be formed in the ground region of the substrate 10 (see FIG. 1, etc.). This makes it possible to prevent the component 61 from being electrically affected by the components on the substrate 10, even if the component 61 is made of a conductive material such as an electronic component.

[0083] The adhesive portion 50 may also be formed from a hybrid adhesive having both photocuring and thermosetting properties (see FIG. 1, etc.), which allows the substrate 10 and the holder 40 to be securely fixed in close contact with each other.

[0084] 2. Other Embodiments The configurations and processes according to the above-described embodiments (including examples and modified examples) may be implemented in various different forms other than the above-described embodiments. For example, the configurations and processes are not limited to the above-described examples and may be implemented in various forms. Furthermore, for example, the configurations, processing procedures, specific names, or information including various data and parameters shown in the above documents and drawings may be changed arbitrarily unless otherwise specified.

[0085] Furthermore, the components and processes according to the above-described embodiments (including examples and modifications) do not necessarily have to be physically configured as shown in the drawings. In other words, the specific forms of distribution and integration of the components and processes are not limited to those shown in the drawings, and all or part of them may be functionally or physically distributed or integrated in any unit depending on various loads, usage conditions, etc.

[0086] Furthermore, the configurations and processes of the above-described embodiments (including examples and modified examples) may be combined as appropriate. For example, at least a part of an embodiment may be combined as appropriate with at least a part of another embodiment. Furthermore, the effects of the embodiments are merely examples and are not intended to be limiting, and other effects may also be obtained.

[0087] 3. Application Examples The technology according to the present disclosure can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of moving body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, a robot, construction machinery, or agricultural machinery (tractor). Furthermore, for example, the technology according to the present disclosure may be realized as a device mounted on an endoscopic surgery system, a microsurgery system, or the like.

[0088] 9 is a block diagram showing a schematic configuration example of a vehicle control system 7000, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied. The vehicle control system 7000 includes a plurality of electronic control units connected via a communication network 7010. In the example shown in FIG. 9 , the vehicle control system 7000 includes a drive system control unit 7100, a body system control unit 7200, a battery control unit 7300, an outside-vehicle information detection unit 7400, an inside-vehicle information detection unit 7500, and an integrated control unit 7600. The communication network 7010 connecting these multiple control units may be an in-vehicle communication network conforming to any standard, such as a Controller Area Network (CAN), a Local Interconnect Network (LIN), a Local Area Network (LAN), or FlexRay (registered trademark).

[0089] Each control unit includes a microcomputer that performs arithmetic processing according to various programs, a memory unit that stores the programs executed by the microcomputer or parameters used in various calculations, and a drive circuit that drives various controlled devices. Each control unit includes a network I / F for communicating with other control units via a communication network 7010, and a communication I / F for communicating with devices or sensors inside and outside the vehicle via wired or wireless communication. Figure 9 illustrates the functional configuration of the integrated control unit 7600, including a microcomputer 7610, a general-purpose communication I / F 7620, a dedicated communication I / F 7630, a positioning unit 7640, a beacon receiving unit 7650, an in-vehicle device I / F 7660, an audio / video output unit 7670, an in-vehicle network I / F 7680, and a memory unit 7690. The other control units also include a microcomputer, a communication I / F, a memory unit, and the like.

[0090] The drivetrain control unit 7100 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 7100 functions as a control device for a drive force generating device for generating drive force for the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating braking force for the vehicle. The drivetrain control unit 7100 may also function as a control device for an ABS (Antilock Brake System) or an ESC (Electronic Stability Control), etc.

[0091] A vehicle state detection unit 7110 is connected to the drivetrain control unit 7100. The vehicle state detection unit 7110 includes at least one of a gyro sensor that detects the angular velocity of the axial rotational motion of the vehicle body, an acceleration sensor that detects the acceleration of the vehicle, or a sensor that detects the amount of operation of the accelerator pedal, the amount of operation of the brake pedal, the steering angle of the steering wheel, the engine rotation speed, the rotation speed of the wheels, etc. The drivetrain control unit 7100 performs arithmetic processing using signals input from the vehicle state detection unit 7110, and controls the internal combustion engine, the drive motor, the electric power steering device, the brake device, etc.

[0092] The body system control unit 7200 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 7200 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 7200. The body system control unit 7200 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0093] The battery control unit 7300 controls the secondary battery 7310, which is the power supply source for the drive motor, in accordance with various programs. For example, information such as battery temperature, battery output voltage, or remaining battery capacity is input to the battery control unit 7300 from a battery device equipped with the secondary battery 7310. The battery control unit 7300 performs arithmetic processing using these signals, and controls the temperature regulation of the secondary battery 7310 or a cooling device or the like equipped in the battery device.

[0094] The outside vehicle information detection unit 7400 detects information outside the vehicle equipped with the vehicle control system 7000. For example, at least one of an imaging unit 7410 and an outside vehicle information detection unit 7420 is connected to the outside vehicle information detection unit 7400. The imaging unit 7410 includes at least one of a time-of-flight (ToF) camera, a stereo camera, a monocular camera, an infrared camera, and other cameras. The outside vehicle information detection unit 7420 includes at least one of an environmental sensor for detecting the current weather or climate, or a surrounding information detection sensor for detecting other vehicles, obstacles, pedestrians, etc. around the vehicle equipped with the vehicle control system 7000.

[0095] The environmental sensor may be, for example, at least one of a raindrop sensor that detects rain, a fog sensor that detects fog, a sunshine sensor that detects the degree of sunshine, and a snow sensor that detects snowfall. The surrounding information detection sensor may be at least one of an ultrasonic sensor, a radar device, and a LIDAR (Light Detection and Ranging, Laser Imaging Detection and Ranging) device. The imaging unit 7410 and the outside vehicle information detection unit 7420 may each be provided as an independent sensor or device, or may be provided as a device in which multiple sensors or devices are integrated.

[0096] 10 shows an example of the installation positions of the imaging unit 7410 and the vehicle exterior information detection unit 7420. The imaging units 7910, 7912, 7914, 7916, and 7918 are provided, for example, at least one of the front nose, side mirrors, rear bumper, back door, and upper part of the windshield inside the vehicle cabin of the vehicle 7900. The imaging unit 7910 provided on the front nose and the imaging unit 7918 provided on the upper part of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 7900. The imaging units 7912 and 7914 provided on the side mirrors mainly acquire images of the sides of the vehicle 7900. The imaging unit 7916 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 7900. The imaging unit 7918 provided on the upper part of the windshield inside the vehicle cabin is mainly used to detect leading vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0097] 10 shows an example of the imaging ranges of the imaging units 7910, 7912, 7914, and 7916. Imaging range a indicates the imaging range of the imaging unit 7910 provided on the front nose, imaging ranges b and c indicate the imaging ranges of the imaging units 7912 and 7914 provided on the side mirrors, respectively, and imaging range d indicates the imaging range of the imaging unit 7916 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 7910, 7912, 7914, and 7916, a bird's-eye view image of the vehicle 7900 viewed from above can be obtained.

[0098] The outside vehicle information detection units 7920, 7922, 7924, 7926, 7928, and 7930 provided on the front, rear, sides, corners, and above the windshield inside the vehicle cabin of the vehicle 7900 may be, for example, ultrasonic sensors or radar devices. The outside vehicle information detection units 7920, 7926, and 7930 provided on the front nose, rear bumper, back door, and above the windshield inside the vehicle cabin of the vehicle 7900 may be, for example, LIDAR devices. These outside vehicle information detection units 7920 to 7930 are mainly used to detect preceding vehicles, pedestrians, obstacles, etc.

[0099] Returning to FIG. 9 , the explanation will be continued. The outside-vehicle information detection unit 7400 causes the imaging unit 7410 to capture an image outside the vehicle and receives the captured image data. The outside-vehicle information detection unit 7400 also receives detection information from the connected outside-vehicle information detection unit 7420. If the outside-vehicle information detection unit 7420 is an ultrasonic sensor, a radar device, or a LIDAR device, the outside-vehicle information detection unit 7400 emits ultrasonic waves or electromagnetic waves and receives information on the received reflected waves. Based on the received information, the outside-vehicle information detection unit 7400 may perform object detection processing or distance detection processing for people, vehicles, obstacles, signs, text on the road, etc. Based on the received information, the outside-vehicle information detection unit 7400 may also perform environment recognition processing for recognizing rainfall, fog, road conditions, etc. Based on the received information, the outside-vehicle information detection unit 7400 may also calculate the distance to an object outside the vehicle.

[0100] The outside vehicle information detection unit 7400 may also perform image recognition processing or distance detection processing to recognize people, vehicles, obstacles, signs, or characters on the road surface based on the received image data. The outside vehicle information detection unit 7400 may perform processing such as distortion correction or alignment on the received image data, and may also generate an overhead image or a panoramic image by combining image data captured by different image capturing units 7410. The outside vehicle information detection unit 7400 may also perform viewpoint conversion processing using image data captured by different image capturing units 7410.

[0101] The interior information detection unit 7500 detects information inside the vehicle. A driver state detection unit 7510 that detects the driver's state is connected to the interior information detection unit 7500, for example. The driver state detection unit 7510 may include a camera that captures an image of the driver, a biosensor that detects the driver's biometric information, or a microphone that collects sound from within the vehicle cabin. The biosensor is provided, for example, on the seat or steering wheel, and detects the biometric information of a passenger sitting in the seat or the driver gripping the steering wheel. The interior information detection unit 7500 may calculate the driver's level of fatigue or concentration based on the detection information input from the driver state detection unit 7510, or may determine whether the driver is dozing off. The interior information detection unit 7500 may perform processing such as noise canceling on the collected audio signal.

[0102] The integrated control unit 7600 controls the overall operation of the vehicle control system 7000 according to various programs. An input unit 7800 is connected to the integrated control unit 7600. The input unit 7800 may be implemented by a device that can be operated by a passenger, such as a touch panel, a button, a microphone, a switch, or a lever. Data obtained by voice recognition of a voice input through a microphone may be input to the integrated control unit 7600. The input unit 7800 may be, for example, a remote control device using infrared or other radio waves, or an externally connected device such as a mobile phone or a personal digital assistant (PDA) that can operate the vehicle control system 7000. The input unit 7800 may be, for example, a camera, in which case the passenger can input information using gestures. Alternatively, data obtained by detecting the movement of a wearable device worn by the passenger may be input. Furthermore, the input unit 7800 may include, for example, an input control circuit that generates an input signal based on information input by the passenger using the input unit 7800 and outputs the input signal to the integrated control unit 7600. Passengers and the like operate this input unit 7800 to input various data to the vehicle control system 7000 and to instruct processing operations.

[0103] The storage unit 7690 may include a ROM (Read Only Memory) that stores various programs executed by the microcomputer, and a RAM (Random Access Memory) that stores various parameters, calculation results, sensor values, etc. The storage unit 7690 may also be realized by a magnetic storage device such as an HDD (Hard Disc Drive), a semiconductor storage device, an optical storage device, a magneto-optical storage device, or the like.

[0104] The general-purpose communication I / F 7620 is a general-purpose communication I / F that mediates communication with various devices present in the external environment 7750. The general-purpose communication I / F 7620 may implement a cellular communication protocol such as GSM (Global System of Mobile communications), WiMAX (registered trademark), LTE (Long Term Evolution), or LTE-Advanced (LTE-A), or other wireless communication protocols such as a wireless LAN (also referred to as Wi-Fi (registered trademark)) or Bluetooth (registered trademark). The general-purpose communication I / F 7620 may connect to a device (e.g., an application server or a control server) present on an external network (e.g., the Internet, a cloud network, or an operator-specific network) via, for example, a base station or an access point. In addition, the general-purpose communication I / F 7620 may connect to a terminal located near the vehicle (e.g., a terminal of a driver, pedestrian, or store, or an MTC (Machine Type Communication) terminal) using, for example, P2P (Peer To Peer) technology.

[0105] The dedicated communication I / F 7630 is a communication I / F that supports a communication protocol designed for use in vehicles. The dedicated communication I / F 7630 may implement a standard protocol such as WAVE (Wireless Access in Vehicle Environment), which is a combination of a lower layer IEEE 802.11p and an upper layer IEEE 1609, DSRC (Dedicated Short Range Communications), or a cellular communication protocol. The dedicated communication I / F 7630 typically performs V2X communication, which is a concept including one or more of vehicle-to-vehicle communication, vehicle-to-infrastructure communication, vehicle-to-home communication, and vehicle-to-pedestrian communication.

[0106] The positioning unit 7640 performs positioning by receiving, for example, GNSS signals from GNSS (Global Navigation Satellite System) satellites (for example, GPS signals from GPS (Global Positioning System) satellites), and generates position information including the latitude, longitude, and altitude of the vehicle. Note that the positioning unit 7640 may identify the current position by exchanging signals with a wireless access point, or may obtain position information from a terminal such as a mobile phone, PHS, or smartphone that has a positioning function.

[0107] The beacon receiving unit 7650 receives, for example, radio waves or electromagnetic waves transmitted from radio stations or the like installed on the road, and acquires information such as the current location, congestion, road closures, required travel time, etc. The function of the beacon receiving unit 7650 may be included in the dedicated communication I / F 7630 described above.

[0108] The in-vehicle device I / F 7660 is a communication interface that mediates connections between the microcomputer 7610 and various in-vehicle devices 7760 present in the vehicle. The in-vehicle device I / F 7660 may establish wireless connections using wireless communication protocols such as wireless LAN, Bluetooth (registered trademark), NFC (Near Field Communication), or WUSB (Wireless USB). Furthermore, the in-vehicle device I / F 7660 may establish a wired connection such as USB (Universal Serial Bus), HDMI (High-Definition Multimedia Interface), or MHL (Mobile High-Definition Link) via a connection terminal (and a cable, if necessary) not shown. The in-vehicle device 7760 may include, for example, at least one of a mobile device or a wearable device owned by a passenger, or an information device carried into or attached to the vehicle. The in-vehicle device 7760 may also include a navigation device that searches for a route to an arbitrary destination. The in-vehicle device I / F 7660 exchanges control signals or data signals with these in-vehicle devices 7760.

[0109] The in-vehicle network I / F 7680 is an interface that mediates communication between the microcomputer 7610 and the communication network 7010. The in-vehicle network I / F 7680 transmits and receives signals in accordance with a predetermined protocol supported by the communication network 7010.

[0110] The microcomputer 7610 of the integrated control unit 7600 controls the vehicle control system 7000 in accordance with various programs based on information acquired via at least one of the general-purpose communication I / F 7620, the dedicated communication I / F 7630, the positioning unit 7640, the beacon receiving unit 7650, the in-vehicle device I / F 7660, and the in-vehicle network I / F 7680. For example, the microcomputer 7610 may calculate control target values ​​for the driving force generating device, the steering mechanism, or the braking device based on the acquired information inside and outside the vehicle, and output control commands to the drivetrain control unit 7100. For example, the microcomputer 7610 may perform cooperative control aimed at realizing functions of an Advanced Driver Assistance System (ADAS), including vehicle collision avoidance or impact mitigation, following driving based on the following distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane departure warning, etc. In addition, the microcomputer 7610 may perform cooperative control for the purpose of autonomous driving, in which the vehicle travels autonomously without relying on driver operation, by controlling a driving force generating device, a steering mechanism, a braking device, etc. based on information acquired about the vehicle's surroundings.

[0111] The microcomputer 7610 may generate three-dimensional distance information between the vehicle and objects such as surrounding structures and people, and create local map information including information about the vicinity of the vehicle's current location, based on information acquired via at least one of the general-purpose communication I / F 7620, the dedicated communication I / F 7630, the positioning unit 7640, the beacon receiving unit 7650, the in-vehicle device I / F 7660, and the in-vehicle network I / F 7680. Furthermore, the microcomputer 7610 may predict dangers, such as a vehicle collision, the approach of a pedestrian, or entry into a closed road, based on the acquired information, and generate a warning signal. The warning signal may be, for example, a signal for generating a warning sound or turning on a warning lamp.

[0112] The audio / image output unit 7670 transmits at least one of audio and image output signals to an output device capable of visually or audibly notifying vehicle occupants or the outside of the vehicle of information. In the example of FIG. 9 , an audio speaker 7710, a display unit 7720, and an instrument panel 7730 are illustrated as output devices. The display unit 7720 may include, for example, at least one of an on-board display and a head-up display. The display unit 7720 may have an AR (Augmented Reality) display function. The output device may also be other devices, such as headphones, a wearable device such as an eyeglass-type display worn by the occupant, a projector, or a lamp. When the output device is a display device, the display device visually displays results obtained by various processes performed by the microcomputer 7610 or information received from other control units in various formats, such as text, images, tables, and graphs. When the output device is an audio output device, the audio output device converts audio signals, such as reproduced audio data or acoustic data, into analog signals and audibly outputs the analog signals.

[0113] In the example shown in FIG. 9 , at least two control units connected via the communication network 7010 may be integrated into a single control unit. Alternatively, each control unit may be composed of multiple control units. Furthermore, the vehicle control system 7000 may include another control unit not shown. In the above description, some or all of the functions performed by one of the control units may be assigned to another control unit. In other words, as long as information is transmitted and received via the communication network 7010, predetermined arithmetic processing may be performed by one of the control units. Similarly, a sensor or device connected to one of the control units may be connected to another control unit, and multiple control units may transmit and receive detection information to each other via the communication network 7010.

[0114] A computer program for realizing each function (e.g., an imaging function) of the imaging device 1 according to this embodiment described with reference to FIG. 1 can be implemented in any control unit or the like. A computer-readable recording medium storing such a computer program can also be provided. Examples of the recording medium include a magnetic disk, an optical disk, a magneto-optical disk, and a flash memory. The computer program may also be distributed, for example, via a network without using a recording medium.

[0115] In the vehicle control system 7000 described above, the imaging device 1 according to the present embodiment described with reference to Fig. 1 can be applied to devices related to the outside-vehicle information detection unit 7400 and inside-vehicle information detection unit 7500, which are application examples shown in Fig. 9. For example, the imaging device 1 can be applied to the imaging unit 7410, the outside-vehicle information detection unit 7420, the driver state detection unit 7510, etc.

[0116] Furthermore, at least some of the components of the imaging device 1 according to the present embodiment described with reference to Fig. 1 (for example, a control unit related to the imaging element 20) may be implemented in a module (for example, an integrated circuit module configured on a single die) for the integrated control unit 7600 shown in Fig. 9. Alternatively, at least some of the components of the imaging device 1 according to the present embodiment described with reference to Fig. 1 may be implemented by a plurality of control units of the vehicle control system 7000 shown in Fig. 9.

[0117] <4. Supplementary Note> The present technology may also have the following configurations. (1) An imaging device comprising: a substrate having an imaging element; a holder provided on the substrate, holding a lens unit, and forming, together with the substrate and the lens unit, an internal space accommodating the imaging element; an adhesive portion for tightly contacting the substrate and the holder; a through hole formed in the substrate and leading to the internal space; a component spaced from the substrate and covering the through hole; and a fixing portion provided on the substrate avoiding the through hole and fixing the component to the substrate. (2) The imaging device described in (1), wherein the component is an electronic component. (3) The imaging device described in (1) or (2), wherein the component is provided on a surface of the substrate opposite to the imaging element side. (4) The imaging device described in (1) or (2), wherein the component is provided on a surface of the substrate facing the imaging element side. (5) The imaging device according to any one of (1) to (4), wherein a separation distance between the through hole and the component is set to be equal to or less than a foreign matter size threshold. (6) The imaging device according to any one of (1) to (5), wherein the fixing portion has: a first holding member that holds a first end of the component; and a second holding member that holds a second end of the component. (7) The imaging device according to (6), wherein the first holding member and the second holding member are arranged to face each other. (8) The imaging device according to (6) or (7), wherein the first holding member and the second holding member are formed of solder. (9) The imaging device according to any one of (6) to (8), wherein the separation distance between the through hole and the component is determined by the respective thicknesses of the first holding member and the second holding member. (10) The imaging device according to (9), wherein the separation distance is set to be equal to or less than a foreign matter size threshold. (11) The imaging device according to any one of (1) to (10), further comprising a member provided on the substrate avoiding the through hole and in contact with a surface of the component facing the substrate. (12) The imaging device according to (11), wherein the member has: a conductive layer provided on the substrate; and a protective layer provided on the substrate and covering the conductive layer.(13) The imaging device according to any one of (1) to (10), further comprising a member that is provided on the substrate avoiding the through hole, and that is located around the through hole and spaced apart from the component. (14) The imaging device according to (13), wherein the member is provided directly below the component. (15) The imaging device according to (13) or (14), wherein the member is formed to surround the through hole in a plan view. (16) The imaging device according to any one of (13) to (15), wherein the member has a conductive layer provided on the substrate. (17) The imaging device according to (16), wherein the member has a protective layer that is provided on the substrate and covers the conductive layer. (18) The imaging device according to any one of (1) to (17), wherein the through hole is formed in a ground region of the substrate. (19) The imaging device according to any one of (1) to (18), wherein the adhesive portion is formed of a hybrid adhesive having photocuring properties and thermosetting properties. (20) A method for manufacturing an imaging device, comprising: providing a holder that holds a lens unit via an adhesive on a substrate having an imaging element and that, together with the substrate and the lens unit, forms an internal space that houses the imaging element; aligning the lens unit and the imaging element; and hardening the adhesive after the alignment is performed, wherein the substrate has: a through hole that is formed in the substrate and leads to the internal space, a component that is spaced from the substrate and covers the through hole, and a fixing portion that is provided on the substrate avoiding the through hole and fixes the component to the substrate. (21) An electronic device comprising the imaging device according to any one of (1) to (19). (22) A method for manufacturing an imaging device, comprising manufacturing the imaging device according to any one of (1) to (19).

[0118] REFERENCE SIGNS LIST 1 Imaging device 1A Imaging device 10 Substrate 11 Through hole 11a Conductive layer 11b Land 12a Conductive layer 12b Conductive layer 12c Conductive layer 12d Conductive layer 12e Conductive layer 12f Conductive layer 13a Protective layer 13b Protective layer 13c Protective layer 13d Protective layer 20 Imaging element 30 Lens portion 31 Lens 32 Lens 33 Lens barrel portion 40 Holder 41 Accommodating hole 42 Internal space 50 Adhesive portion 51 Air bubble 60 Cover portion 61 Component 61a First end 61b Second end 62 Fixing portion 62a First holding member 62b Second holding member A1 Inner surface A2 Outer surface B1 Separation distance C1 End C2 Surface

Claims

1. An imaging device comprising: a substrate having an imaging element; a holder provided on the substrate, holding a lens unit, and forming, together with the substrate and the lens unit, an internal space for accommodating the imaging element; an adhesive portion for tightly adhering the substrate and the holder; a through hole formed in the substrate and leading to the internal space; a component spaced apart from the substrate and covering the through hole; and a fixing portion provided on the substrate avoiding the through hole and fixing the component to the substrate.

2. The imaging device according to claim 1, wherein the component is an electronic component.

3. The imaging device according to claim 1, wherein the component is provided on a surface of the substrate opposite to the imaging element side.

4. The imaging device according to claim 1, wherein the component is provided on a surface of the substrate facing the imaging element.

5. The imaging device according to claim 1, wherein the distance between the through-hole and the component is set to be equal to or less than a foreign matter size threshold.

6. The imaging device according to claim 1, wherein the fixing portion has: a first holding member that holds a first end of the component; and a second holding member that holds a second end of the component.

7. The imaging device according to claim 6, wherein the first holding member and the second holding member are arranged to face each other.

8. The imaging device according to claim 6, wherein the first holding member and the second holding member are formed of solder.

9. The imaging device according to claim 6, wherein the distance between the through hole and the component is determined by the thickness of each of the first holding member and the second holding member.

10. The imaging device according to claim 9, wherein the separation distance is set to be equal to or less than a foreign matter size threshold.

11. The imaging device according to claim 1, further comprising a member that is provided on the board avoiding the through-hole and that contacts the surface of the component facing the board.

12. The imaging device according to claim 11, wherein the member comprises: a conductive layer provided on the substrate; and a protective layer provided on the substrate and covering the conductive layer.

13. The imaging device according to claim 1, further comprising a member provided on the substrate avoiding the through-hole, positioned around the through-hole and spaced apart from the component.

14. The imaging device according to claim 13, wherein the member is provided directly below the component.

15. The imaging device according to claim 13, wherein the member is formed so as to surround the through-hole in a plan view.

16. The imaging device according to claim 13, wherein the member has a conductive layer provided on the substrate.

17. The imaging device according to claim 16, wherein the member has a protective layer provided on the substrate and covering the conductive layer.

18. The imaging device according to claim 1, wherein the through-hole is formed in a ground region of the substrate.

19. The imaging device according to claim 1, wherein the adhesive portion is formed from a hybrid adhesive having photocuring and thermosetting properties.

20. A method for manufacturing an imaging device, comprising: providing a holder for a substrate having an imaging element, the holder holding a lens unit via an adhesive and forming an internal space for accommodating the imaging element together with the substrate and the lens unit; aligning the lens unit and the imaging element; and hardening the adhesive after the alignment is performed, wherein the substrate has: a through hole formed in the substrate and leading to the internal space; a component spaced from the substrate and covering the through hole; and a fixing portion provided on the substrate avoiding the through hole and fixing the component to the substrate.

Images