Method for manufacturing cooling device and cooling device

Abstract

This method for manufacturing a cooling device comprises: a step for forming a cooling flow path first recess (20) on a surface (10a) on one side in a first thickness direction of a body (10); a step for forming a return flow path recess (21) on a bottom surface (20b) of the cooling flow path first recess part; a step for forming a first connection recess (22); a step for forming a second connection recess (23); a step for arranging a partition member (11) that divides a first connection flow path (4) into a portion (4a) connected to a cooling flow path (2) and a portion (4b) connected to a return flow path (3); a step for arranging on the bottom surface (20b) a first plate-shaped member (12) that separates the cooling flow path and the return flow path; a step for arranging a lid member (15) on the surface (10a); and a step for joining the body, the partition member and the lid member, to each other, by brazing.

Description

Cooling device manufacturing method and cooling device

[0001] The present invention relates to a method for manufacturing a cooling device and a cooling device, and more particularly to a method for manufacturing a cooling device that cools an object to be installed externally and a cooling device.

[0002] 2. Description of the Related Art A method for manufacturing a cooling device for cooling an object to be installed externally is known.

[0003] Japanese Patent Application Publication No. 2009-248169 discloses a method for manufacturing a cooling device (cold plate) in which a pipe is sandwiched in a groove formed by overlapping two metal plates. In the method for manufacturing a cooling device disclosed in Japanese Patent Application Publication No. 2009-248169, a serpentine pipe is placed between the two metal plates to manufacture the cooling device. Furthermore, the cooling device disclosed in Japanese Patent Application Publication No. 2009-248169 has a refrigerant inlet and outlet located on the same side of the main body of the cooling device, and the refrigerant drawn in through the inlet exchanges heat with a heating element located in the main body before being discharged through the outlet.

[0004] JP 2009-248169 A

[0005] In the cooling device of JP 2009-248169 A, the temperature of the refrigerant increases toward the downstream side, and the temperature of the refrigerant and the object approach each other, so the amount of heat exchanged with the object decreases. Therefore, there is a need for a manufacturing method of a cooling device and a cooling device that can suppress the decrease in the cooling ability of the object toward the downstream side of the cooling flow path.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a manufacturing method for a cooling device and a cooling device that can suppress a decrease in the cooling capacity of an object due to heat exchange downstream of the cooling flow path.

[0007] In order to achieve the above object, a manufacturing method of a cooling device according to the present invention is a manufacturing method of a cooling device having a flat main body portion and configured to cool an externally installed object, the manufacturing method including the steps of: forming a first cooling flow path recess, recessed toward the other side in a first thickness direction, on a surface on one side in a first thickness direction, which is a thickness direction of the main body portion, in which an inlet for drawing in a refrigerant and an outlet for discharging the refrigerant are provided; forming a return flow path recess, recessed toward the other side in the first thickness direction, on a bottom surface, which is a surface orthogonal to the first thickness direction, of an inner circumferential surface of the first cooling flow path recess; forming a first connection recess, recessed toward the other side in the first thickness direction, which connects with a side surface, which is a surface orthogonal to the bottom surface, and connects with an end of the return flow path recess on the side where the inlet and outlet are provided, which is on one side in a major axis direction, which is a direction along the longest side of the bottom surface; the cooling flow passage recess is connected to the other end of the cooling flow passage in the longitudinal direction of the first connecting recess and the other end of the return flow passage recess in the longitudinal direction; a partition member that separates the first connecting flow passage, which is partitioned by the first connecting recess and a flat lid member having an installation surface for the object, into a portion that connects to the cooling flow passage adjacent to the object across the installation surface and a portion that connects to the cooling flow passage via the second connecting flow passage, which is partitioned by the second connecting recess and the lid member, and connects to a return flow passage through which the refrigerant that has flowed through the cooling flow passage and the second connecting flow passage flows out into the first connecting flow passage; a partition member that separates the cooling flow passage and the return flow passage on the bottom surface of the main body, which is partitioned by the first plate-like member, which is a partition member that separates the cooling flow passage and the return flow passage; a partition member that separates the cooling flow passage and the return flow passage on the bottom surface of the main body;

[0008] The cooling device according to the present invention is a cooling device for cooling an object to be placed outside, and includes a main body portion having a flat shape and provided with an inlet for drawing in a refrigerant and an outlet for discharging the refrigerant, a flat cover member provided on one surface of the main body portion in a thickness direction and having a surface for placing the object, a first recessed cooling flow path formed on one surface of the main body portion and recessed toward the other side in the thickness direction, and a return flow path recess formed on a bottom surface, which is a surface orthogonal to the thickness direction, of an inner circumferential surface of the first recessed cooling flow path and recessed toward the other side in the thickness direction, the return flow path recess connected to the side surface, which is a surface orthogonal to the bottom surface, and connected to an end of the return flow path recess on the side where the inlet and outlet are provided, which is on one side in the major axis direction, which is along the longest side of the bottom surface. a first connection recess having a concave shape recessed toward the other side in the thickness direction, a second connection recess having a concave shape recessed toward the other side in the thickness direction, which connects to the other end of the first recess for the cooling flow path in the longitudinal direction and connects to the other end of the recess for the return flow path in the longitudinal direction, a partition member which separates the first connection flow path partitioned by the first connection recess and the cover member into a portion which connects to a cooling flow path adjacent to the object across the installation surface, and a portion which is connected to the cooling flow path via the second connection flow path partitioned by the second connection recess and the cover member and connects to a return flow path through which the refrigerant that has circulated through the cooling flow path and the second connection flow path flows out into the first connection flow path, and a first plate-like member which is provided on the bottom surface of the first recess for the cooling flow path and is a partition member which separates the cooling flow path and the return flow path.

[0009] According to the present invention, as described above, the first recess for the cooling channel is formed on one surface of the main body in the first thickness direction, which is the thickness direction of the main body, and therefore, by disposing the lid on the main body, the cooling channel can be formed without meandering on one surface of the main body in the first thickness direction. As a result, it is possible to provide a cooling device manufacturing method and a cooling device that can suppress a decrease in the cooling ability of the object toward the downstream side of the cooling channel, compared to a configuration in which the cooling channel meanders on one surface of the main body in the first thickness direction.

[0010] 1 is a schematic perspective view showing a cooling device of an embodiment; FIG. 2 is a perspective view showing a cooling device of an embodiment; FIG. 3 is a schematic view of a main body of a cooling device of an embodiment, viewed in the Z2 direction; FIG. 4 is a schematic view of a main body before each recess of a cooling device of an embodiment is formed, viewed in the Z2 direction; FIG. 5 is a schematic view of a main body after a first recess for a cooling flow path of a cooling device of an embodiment is formed, viewed in the Z2 direction; FIG. 6 is a schematic view of a main body after a return flow path recess of a cooling device of an embodiment is formed, viewed in the Z2 direction; FIG. 7 is a schematic view of a main body after a step portion of a cooling device of an embodiment is formed, viewed in the Z2 direction; FIG. 8 is a schematic view of a main body after a first connection recess of a cooling device of an embodiment is formed, viewed in the Z2 direction; FIG. 9 is a schematic view of a main body after a second connection recess of a cooling device of an embodiment is formed, viewed in the Z2 direction; FIG. 10 is a schematic view of a main body after a third connection recess and a fourth connection recess of a cooling device of an embodiment are formed, viewed in the Z2 direction; FIG. 11 is a schematic view of a main body after an inlet and an outlet of a cooling device of an embodiment, viewed in the Z2 direction. 1 is a schematic diagram of a main body portion of the cooling device of the embodiment after screw holes have been formed, as viewed in the Z2 direction; FIG. 2 is a diagram of a cross section taken along line I-I of the cooling device of the embodiment; FIG. 3 is a diagram of an enlarged step portion of the cross section taken along line I-I of the cooling device of the embodiment; FIG. 4 is a schematic diagram of a partition member of the cooling device of the embodiment, as viewed in the Z2 direction; FIG. 5 is a schematic diagram of a partition member of the cooling device of the embodiment, as viewed in the Y2 direction; FIG. 6 is a diagram of a cross section taken along line II-II of the cooling device of the embodiment; FIG. 7 is a diagram of an enlarged cross section taken along line II-II of the cooling device of the embodiment; FIG. 8 is a diagram of a cross section taken along line III-III of the cooling device of the embodiment; FIG. 9 is a perspective view of a main body portion in which a partition member of the cooling device of the embodiment is arranged; FIG. 10 is a perspective view of a main body portion in which a first plate-shaped member of the cooling device of the embodiment is arranged; FIG. 11 is a perspective view of a main body portion in which a fin member of the cooling device of the embodiment is arranged; FIG. 12 is a diagram of an enlarged cross section taken along line IV-IV of the cooling device of the embodiment; FIG. 13 is a diagram of an enlarged cross section taken along line V-V of the cooling device of the embodiment; FIG. 14 is a diagram of a cross section taken along line VI-VI of the cooling device of the embodiment. 1 is a block diagram showing the connection relationship of each flow path in the cooling device of the embodiment, and the connection relationship between the cooling device, a pump, and a heat dissipation device.Fig. 1 is a flowchart showing a manufacturing method of a first modified example of the cooling device of the embodiment; Fig. 2 is a flowchart showing a manufacturing method of a second modified example of the cooling device of the embodiment; Fig. 3 is a schematic perspective view showing a cooling device of a third modified example; Fig. 4 is a flowchart showing a manufacturing method of the cooling device of the third modified example; Fig. 5 is a schematic view showing a partition member of a fourth modified example.

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the same elements are denoted by the same reference numerals, and detailed description thereof may be omitted.

[0012] (Overall Configuration of Cooling Device) The configuration of a cooling device 100 according to this embodiment will be described with reference to FIG.

[0013] FIG. 1 is a schematic perspective view showing a cooling device 100 of this embodiment. The cooling device 100 is a so-called cold plate. The cooling device 100 cools an object 90 placed outside the cooling device 100 by exchanging heat between a refrigerant flowing inside the cooling device 100 and the object 90. The refrigerant is, for example, water. Note that the refrigerant may be a liquid other than water, such as antifreeze (brine), as long as it is capable of exchanging heat with the object 90. The object 90 is, for example, an element such as an IGBT (Insulated Gate Bipolar Transistor).

[0014] 2 is a perspective view showing the cooling device 100 of this embodiment. The cooling device 100 includes a main body 10, a partition member 11, a first plate-shaped member 12, a fin member 13, a second plate-shaped member 14, and a lid member 15. The cooling device 100 is manufactured by joining the main body 10, the partition member 11, the first plate-shaped member 12, the fin member 13, the second plate-shaped member 14, and the lid member 15 by brazing. An object 90 is placed on one side of the cooling device 100 in the thickness direction (Z direction).

[0015] In Figure 2, the thickness direction of the main body 10 of the cooling device 100 is the Z direction. The thickness direction of the main body 10 is the stacking direction when the cover member 15 and the like are stacked on the main body 10. One direction of the Z direction is the Z1 direction, and the other direction is the Z2 direction. The "thickness direction of the main body" in the claims is the thickness direction (Z direction) of the main body 10. Furthermore, the "first thickness direction" in the claims is an example of the thickness direction (Z direction) of the main body 10.

[0016] Furthermore, of the sides of the main body 10 that constitute a surface perpendicular to the Z direction, the direction along one side is the X direction, and the direction along the other side is the Y direction. One of the X directions is the X1 direction, and the other is the X2 direction. Furthermore, one of the Y directions is the Y1 direction, and the other is the Y2 direction. Furthermore, the "first direction" in the claims is the X direction.

[0017] The main body 10 is a flat metal member made of, for example, aluminum or an aluminum alloy.

[0018] The partition member 11 is an elongated metal member. The partition member 11 separates the first connection flow path 4 into a portion 4a that connects to the cooling flow path 2 and a portion 4b that connects to the return flow path 3 (see FIG. 25 ). The partition member 11 is made of, for example, aluminum or an aluminum alloy. Note that the term "elongated shape" refers to a thin shape that extends in a predetermined direction.

[0019] The first plate-shaped member 12 is a member having a core material and brazing filler metal layers provided on both sides of the core material. The first plate-shaped member 12 has a flat plate shape. The first plate-shaped member 12 has brazing filler metal layers on one side and the other side in the Z direction. The first plate-shaped member 12 is, for example, a brazing sheet.

[0020] The fin members 13 are corrugated fins. The fin members 13 are, for example, of any one of plain, perforated, herringbone, louvered, and serrated types. The fin members 13 are disposed on the upper surface of the first plate-like member 12.

[0021] The second plate-shaped member 14 is a member having a core material and brazing filler metal layers provided on both sides of the core material. The second plate-shaped member 14 has a flat plate shape. The second plate-shaped member 14 has brazing filler metal layers on one side and the other side in the Z direction. The second plate-shaped member 14 is, for example, a brazing sheet. The second plate-shaped member 14 is provided with through holes 14a through which screws for fixing the object 90 are inserted.

[0022] The lid member 15 is a flat metal member. The lid member 15 is made of, for example, aluminum or an aluminum alloy. The lid member 15 is provided on one surface 10a of the main body 10 in the Z direction. The lid member 15 has an object placement surface 15a. Note that in FIG. 2, the object placement surface 15a is illustrated by a dashed line. The lid member 15 also has a through hole 15b through which a screw for fixing the object 90 is inserted.

[0023] 3 is a schematic diagram of the main body 10 of the cooling device 100 of this embodiment, viewed in the Z2 direction. The main body 10 is provided with an inlet 1, an outlet 8, a first cooling flow path recess 20, a return flow path recess 21, a first connection recess 22, a second connection recess 23, a step portion 24, a third connection recess 25, and a fourth connection recess 26. The main body 10 is also provided with a screw hole 91 for fixing an object 90 (see FIG. 1).

[0024] The inlet 1 is a through hole connected to the third connection recess 25. The inlet 1 is provided on the end surface of the main body 10 on the Y2 direction side.

[0025] The outlet 8 is a through hole connected to the fourth connection recess 26. The outlet 8 is provided at a position on the end face of the main body 10 on the Y2 direction side, the position of which in the X direction is different from that of the inlet 1.

[0026] The first cooling flow path recesses 20 are recesses formed in the main body 10. The first cooling flow path recesses 20 are provided to connect between the third connection recesses 25 and the second connection recesses 23. In Fig. 3, four first cooling flow path recesses 20 are provided.

[0027] The return flow path recesses 21 are recesses formed in the main body 10. The return flow path recesses 21 are formed on a bottom surface 20b, which is a surface of the inner circumferential surface of the first cooling flow path recess 20 that is perpendicular to the thickness direction. In Fig. 3, two return flow path recesses 21 are provided for one first cooling flow path recess 20. That is, in Fig. 3, a total of eight return flow path recesses 21 are provided.

[0028] The first connection recesses 22 are recesses formed in the main body 10. The first connection recesses 22 connect to the side surface 20c, which is a surface perpendicular to the bottom surface 20b. The first connection recesses 22 also connect to one end 21a of the return flow path recesses 21 in the longitudinal direction. The longitudinal direction is the direction along the longest side of the bottom surface 20b. The longitudinal direction is the Y direction. The one side in the longitudinal direction is the Y1 direction side where the inlet 1 and the outlet 8 are provided. In FIG. 3 , the first connection recesses 22 connect four first cooling flow path recesses 20 and eight return flow path recesses 21.

[0029] The second connection recesses 23 are recesses formed in the main body 10. The second connection recesses 23 connect to the end portions 20d of the first cooling flow path recesses 20 on the other side in the longitudinal direction. The other side in the longitudinal direction is the Y2 direction side where the inlet 1 and the outlet 8 are not provided. The second connection recesses 23 also connect to the end portions 21b of the return flow path recesses 21 on the other side in the longitudinal direction. In FIG. 3 , the second connection recesses 23 connect four first cooling flow path recesses 20 and eight return flow path recesses 21.

[0030] The step portion 24 is a stepped portion provided on the inner circumferential surface 22a of the first connection recess. The step portion 24 is provided on the inner circumferential surface 22a of the first connection recess. The partition member 11 (see FIG. 2) is disposed on the step portion 24.

[0031] The third connection recess 25 is a recess recessed toward the other side in the Z direction (the Z2 direction side). The third connection recess 25 is a recess connecting the inlet 1 and the first connection recess 22. The third connection recess 25 is formed at a position corresponding to the plurality of first cooling flow path recesses 20.

[0032] The fourth connection recess 26 is a recess that is recessed toward the other side in the Z direction (the Z2 direction side). The fourth connection recess 26 is a recess that connects the outlet 8 and the first connection recess 22.

[0033] The screw holes 91 are holes through which screws for fixing the object 90 (see FIG. 1) are inserted. A plurality of screw holes 91 are provided at positions corresponding to the installation surface 15a (see FIG. 2). Specifically, the screw holes 91 are provided at positions corresponding to the four corners of each installation surface 15a.

[0034] (Steps of Forming Recesses and Screw Holes) Next, steps of forming recesses and screw holes 91 in the main body 10 will be described with reference to FIGS.

[0035] 4 is a schematic diagram of the main body 10 of the cooling device 100 of this embodiment, viewed in the Z2 direction, before the recesses are formed. In FIG. 4, the main body 10 has a surface 10a on which the cover member 15 (see FIG. 2) is disposed before the recesses and the screw holes 91 are formed.

[0036] The surface 10a on which the lid member 15 is disposed is formed by cutting off a portion corresponding to the shape and thickness of the lid member 15 from one surface of the main body in the Z direction.

[0037] 5 is a schematic diagram of the main body 10 viewed in the Z2 direction after the first cooling channel recesses 20 of the cooling device 100 of this embodiment have been formed. The first cooling channel recesses 20 are formed on the surface 10a of the main body 10 by cutting. A plurality of first cooling channel recesses 20 are formed at predetermined intervals. In FIG. 5, four first cooling channel recesses 20 are formed at predetermined intervals in the X direction.

[0038] 6 is a schematic diagram of the main body 10 of the cooling device 100 of this embodiment, viewed in the Z2 direction, after the return flow path recesses 21 have been formed. The return flow path recesses 21 are formed on the bottom surface 20b of the first cooling flow path recesses by cutting. A plurality of return flow path recesses 21 are formed on the bottom surface 20b of each of the plurality of first cooling flow path recesses. In FIG. 6, two return flow path recesses 21 are formed on the bottom surface 20b of each of the first cooling flow path recesses. That is, in FIG. 6, a total of eight return flow path recesses 21 are formed.

[0039] 7 is a schematic diagram of the main body 10 of the cooling device 100 of this embodiment, viewed in the Z2 direction, after the step portions 24 have been formed. The step portions 24 are formed by cutting so as to connect the first cooling flow path recesses 20 and the return flow path recesses 21. In FIG. 7, the step portions 24 are formed so as to connect the Y1-direction end portions 21a of the return flow path recesses in the Y direction.

[0040] 8 is a schematic view of the main body 10 in the Z2 direction after the first connection recess 22 of the cooling device 100 of this embodiment has been formed. The first connection recess 22 is formed on the outer periphery of the step portion by cutting.

[0041] 9 is a schematic diagram of the main body 10 in the Z2 direction after the second connection recesses 23 of the cooling device 100 of this embodiment have been formed. The second connection recesses 23 are formed by cutting so as to connect to the first cooling flow path recesses 20 and the return flow path recesses 21. In FIG. 9, the second connection recesses 23 are formed so as to connect the Y2-direction end portions 20d of the first cooling flow path recesses and the Y2-direction end portions 21b of the return flow path recesses in the Y direction.

[0042] 10 is a schematic diagram of the main body 10 viewed in the Z2 direction after the third connection recess 25 and the fourth connection recess 26 of the cooling device 100 of this embodiment have been formed. The third connection recess 25 is formed by cutting so as to connect to the Y1-direction ends 20e of each of the first cooling flow path recesses. In FIG. 10, the third connection recess 25 is formed so as to connect the ends 20e of each of the first cooling flow path recesses in the Y direction.

[0043] The fourth connection recess 26 is formed by cutting so as to connect with the first connection recess 22 .

[0044] FIG. 11 is a schematic diagram of the main body 10 of the cooling device 100 of this embodiment after the inlet 1 and the outlet 8 are formed, as viewed in the Z2 direction.

[0045] The inlet 1 is formed by cutting so as to connect with the third connecting recess 25 .

[0046] The outlet 8 is formed by cutting so as to connect with the fourth connecting recess 26 .

[0047] FIG. 12 is a schematic diagram of the main body 10 of the cooling device 100 of this embodiment after the screw holes 91 have been formed, as viewed in the Z2 direction.

[0048] The screw holes 91 are provided at predetermined positions on the surface 10a of the main body 10. Specifically, the screw holes 91 are provided on both sides of each first cooling channel recess 20 in the X direction at positions corresponding to the installation surface 15a (see FIG. 2 ).

[0049] (Structure of First Connection Recess and Step Portion) Next, the structure of the first connection recess 22 and the step portion 24 will be described with reference to FIGS. 13 and 14. FIG.

[0050] 13 is a diagram showing a cross section taken along line II of the cooling device 100 of this embodiment. The first connection recess 22 has a recessed shape recessed toward the other side in the Z direction (the Z2 direction side).

[0051] Further, the first connection recess 22 has a length L1 in the X direction that allows for the formation of a plurality of first cooling flow path recesses 20 and a plurality of return flow path recesses 21. In Fig. 13, the first connection recess 22 has a length L1 that allows for the formation of at least four or more first cooling flow path recesses 20 and eight or more return flow path recesses 21.

[0052] 14 is an enlarged cross-sectional view of the step portion 24 taken along line I-I of the cooling device 100 of this embodiment. A first depth D1, which is the length of a portion 24a of the step portion 24 along the Z direction, is smaller than a second depth D2, which is the length of the first connection recess in the Z direction.

[0053] Furthermore, the partition member 11 (see FIG. 2) is disposed on a portion 24b of the step portion 24 along the X direction.

[0054] (Structure of Partition Member) Next, the structure of the partition member 11 will be described with reference to FIGS. 15 and 16. FIG.

[0055] FIG. 15 is a schematic view of the partition member 11 of the cooling device 100 of this embodiment, viewed in the Z2 direction.

[0056] The partition member 11 is a member that separates the first connection flow path 4 (see FIG. 24). The configuration in which the partition member 11 separates the first connection flow path 4 will be described later.

[0057] The partition member 11 is provided with cooling channel second recesses 11a at positions corresponding to the plurality of cooling channel first recesses, each recessed in a direction corresponding to the direction in which the plurality of cooling channel first recesses are recessed. In Fig. 15, four cooling channel second recesses 11a are provided in the partition member 11. The partition member 11 also has three partition walls 11b and two side walls 11c.

[0058] The partition walls 11b are walls provided between the second cooling channel recesses 11a. When the cooling device 100 (see FIG. 23) is manufactured, the partition walls 11b become side walls of the cooling channel 2 (see FIG. 19).

[0059] The side walls 11c are wall portions provided at one end and the other end of the long sides of the partition member 11. In Fig. 15, the side walls 11c are provided at the end on the X1 direction side and the end on the X2 direction side of the partition member 11. When the cooling device 100 is manufactured, the side walls 11c, together with the partition walls 11b, become side walls of the cooling flow path 2.

[0060] Each of the multiple second recesses for the cooling flow path has a second width W2, which is the length between opposing surfaces of the inner surface 11d of the second recess for the cooling flow path, that corresponds to a first width W1 (see Figure 18), which is the length between opposing surfaces of the inner surface 20a of the first recess for the cooling flow path (see Figure 18) in the X direction.

[0061] 16 is a schematic view of the partition member 11 of the cooling device 100 of this embodiment as viewed in the Y2 direction. The thickness T1 of the partition member 11 in the Z direction is greater than a fourth depth D4 (see FIG. 18 ), which is the length of the first recess for the cooling flow path along the Z direction (first thickness direction), which will be described later.

[0062] Furthermore, a third depth D3, which is the length of the second cooling flow path recess along the second thickness direction, which is the thickness direction of the partition member, is a length corresponding to the fourth depth D4.

[0063] (Structure of First Cooling Flow Passage Recess and Return Flow Passage Recess) Next, the structures of the first cooling flow passage recess 20 and the return flow passage recess 21 will be described with reference to Fig. 17 and Fig. 18. Fig. 17 is a diagram showing a cross section of the cooling device 100 of this embodiment taken along line II-II.

[0064] The first cooling flow path recess 20 has a recessed shape recessed toward the other side in the Z direction (Z2 direction side).

[0065] The return flow path recess 21 has a recessed shape recessed toward the other side in the Z direction.

[0066] 18 is an enlarged cross-sectional view taken along line II-II of the cooling device 100 of this embodiment. A third width W3, which is the length between opposing inner circumferential surfaces of the return flow path recess that are perpendicular to the bottom surface 20b, is smaller than a first width W1, which is the length between opposing inner circumferential surfaces of the first cooling flow path recess that are perpendicular to the bottom surface 20b.

[0067] In FIG. 18, the sum of the third widths W3 of the two return flow passage recesses is smaller than the first width W1 of the first cooling flow passage recesses.

[0068] Furthermore, the fifth depth D5, which is the length of the return flow passage recess along the Z direction, is greater than the fourth depth D4, which is the length of the first cooling flow passage recess along the Z direction.

[0069] The fourth depth D4 of the first cooling flow path recess and the fifth depth D5 of the return flow path recess are smaller than the second depth D2 of the first connection recess (see FIG. 14).

[0070] The first cooling flow path recess 20 is formed on the surface 10a on one side in the Z direction. Specifically, the first cooling flow path recess 20 is provided on the surface 10a on the Z1 direction side closer to the Z1 direction than the return flow path recess 21.

[0071] The return flow path recess 21 is provided on the surface 10 a of the main body 10 on the Z1 side, closer to the Z2 side than the first cooling flow path recess 20 .

[0072] In other words, the bottom surface 20b of the first cooling flow path recess is located on the Z1 direction side of the bottom surface 21d, which is a surface parallel to the bottom surface 20b, of the inner circumferential surface of the return flow path recess.

[0073] (Structure of Second Connection Recess) Next, the structure of the second connection recess 23 will be described with reference to Fig. 19. Fig. 19 is a diagram showing an enlarged cross section of the cooling device 100 of this embodiment taken along line III-III. In other words, Fig. 19 is a cross section of the second connection recess 23 of the cooling device 100 of this embodiment as seen from the Y1 direction side.

[0074] The second connection recess 23 has a concave shape recessed toward the other side in the Z direction (the Z2 direction side). The second connection recess 23 has a length L2 in the X direction that allows for the formation of a plurality of first cooling flow path recesses 20 and a plurality of return flow path recesses 21. In Fig. 19, the second connection recess 23 has a length L2 that allows for the formation of at least four or more first cooling flow path recesses 20 and eight or more return flow path recesses 21.

[0075] Furthermore, a sixth depth D6, which is the length of the second connection recess along the Z direction, is greater than the fourth depth D4 (see FIG. 18) and the fifth depth D5 (see FIG. 18).

[0076] (Arrangement of Partition Member, First Plate-Shaped Member, and Fin Members with Respect to Main Body) Next, with reference to FIGS. 20 to 22, the arrangement of the partition member 11, first plate-shaped member 12, and fin members 13 with respect to the main body 10 will be described.

[0077] Fig. 20 is a perspective view showing the main body 10 in which the partition member 11 according to the cooling device 100 of this embodiment is arranged. In Fig. 20, the partition member 11 is hatched to make it easier to understand.

[0078] The partition member 11 is disposed on the Z1 direction side of the step portion 24 in the main body portion 10 .

[0079] Fig. 21 is a perspective view showing the main body 10 in which the first plate-shaped member 12 according to the cooling device 100 of this embodiment is arranged. Note that in Fig. 21, the first plate-shaped member 12 is hatched to make it easier to understand.

[0080] The first plate-shaped member 12 is disposed on the Z1 direction side of the main body 10 from the partition member 11 and the bottom surface 20b.

[0081] Fig. 22 is a perspective view showing the main body 10 on which the fin members 13 according to the cooling device 100 of this embodiment are arranged. Note that in Fig. 22, the fin members 13 are hatched to make it easier to understand the fin members 13.

[0082] The fin member 13 is disposed on the Z1 direction side of the first plate-shaped member 12 in the main body portion 10 .

[0083] (Structure of Cooling Channel and Return Channel) Next, the structure of the cooling channel 2 and the return channel 3 will be described with reference to FIGS. 23 to 25. FIG.

[0084] Fig. 23 is a diagram showing a cross section taken along line IV-IV of the cooling device 100 of this embodiment. In other words, Fig. 23 is a cross section of a portion where the partition member 11 of the cooling device 100 of this embodiment is arranged.

[0085] The cooling flow path 2 is provided at a position adjacent to the object 90 with the installation surface 15a sandwiched between them. Furthermore, in the portion where the partition member 11 is arranged, the cooling flow path 2 is partitioned by the partition member 11, the first plate-shaped member 12, and the second plate-shaped member 14. That is, the side surface 2a of the cooling flow path 2 in the X direction is partitioned by the partition member 11. Furthermore, the bottom surface 2b of the cooling flow path 2, which is the surface on the Z2 direction side of the surfaces perpendicular to the Z direction, is partitioned by the first plate-shaped member 12. Furthermore, the top surface 2c of the cooling flow path 2, which is the surface on the Z1 direction side of the surfaces perpendicular to the Z direction, is partitioned by the second plate-shaped member 14.

[0086] In addition, in the portion where the partition member 11 is arranged, the first plate-shaped member 12 is arranged on the bottom surface 11 e of the partition member 11 .

[0087] Furthermore, in the portion where the partition member 11 is disposed, the return flow path 3 is partitioned by the return flow path recess 21 and the partition member 11. Specifically, by disposing the partition member 11 on the Z1 direction side of the return flow path recess, the return flow path 3 is partitioned by a top surface 3b, which is the surface on the Z1 direction side of the surfaces perpendicular to the Z direction. In other words, the return flow path 3 is partitioned by an inner circumferential surface 21c of the return flow path recess and the top surface 3b.

[0088] Fig. 24 is a diagram showing an enlarged cross section taken along line VV of the cooling device 100 of this embodiment. In other words, Fig. 24 is a cross section of a portion of the cooling device of this embodiment where the partition member 11 is not arranged.

[0089] The first plate-shaped member 12 is provided on the bottom surface 20b of the first cooling channel recess 20. That is, the first plate-shaped member 12 is a partition member that separates the cooling channel 2 and the return channel 3.

[0090] In the portion where the partition member 11 is not arranged, the cooling flow path 2 is defined by the first cooling flow path recess 20, the first plate-shaped member 12, and the second plate-shaped member 14. That is, the side surface 2d of the cooling flow path 2 in the X direction is defined by a surface of the inner circumferential surface of the first cooling flow path recess that is perpendicular to the bottom surface 20b. Furthermore, the bottom surface 2e of the cooling flow path 2, which is the surface on the Z2 direction side of the surfaces perpendicular to the Z direction, is defined by the first plate-shaped member 12. Furthermore, the top surface 2c of the cooling flow path 2, which is the surface on the Z1 direction side of the surfaces perpendicular to the Z direction, is defined by the second plate-shaped member 14.

[0091] Furthermore, in the portion where the partition member 11 is not arranged, the return flow path 3 is defined by the return flow path recess 21 and the first plate-like member 12. Specifically, by arranging the first plate-like member 12 on the Z1 direction side of the return flow path recess, the return flow path 3 is defined by a top surface 3b, which is the surface on the Z1 direction side of the surfaces perpendicular to the Z direction. In other words, the return flow path 3 is defined by the inner circumferential surface 21c of the return flow path recess and the top surface 3b.

[0092] (First Connection Flow Path and Second Connection Flow Path) Next, the first connection flow path 4 and the second connection flow path 5 will be described with reference to Fig. 25. Fig. 25 is a diagram showing a cross section of the cooling device 100 of this embodiment taken along line VI-VI.

[0093] The first connection flow path 4 is a flow path defined by the first connection recess 22 and the cover member 15. Specifically, the first connection flow path 4 is defined by the first connection recess 22, the cover member 15, the partition member 11, and the second plate-like member 14.

[0094] The first connection flow path 4 is divided into a portion 4a that connects to the cooling flow path 2 and a portion 4b that connects to the return flow path 3 by dividing the space formed by placing the second plate-shaped member 14 and the cover member 15 in the first connection recess 22 with a partition member 11.

[0095] That is, the partition member 11 is a member that divides the first connection flow path 4 into a portion 4 a that connects to the cooling flow path 2 and a portion 4 b that connects to the return flow path 3 .

[0096] Of the first connecting flow paths, the portion 4b that connects to the return flow paths 3 connects the plurality of return flow paths 3 in the Y direction.

[0097] The second connection flow path 5 is a flow path defined by the second connection recess 23 and the cover member 15. The second connection flow path 5 connects the cooling flow path 2 and the return flow path 3. That is, the second connection flow path 5 allows the refrigerant that flows out of the cooling flow path 2 to flow into the return flow path 3.

[0098] (Connection Relationship of Flow Channels in Cooling Device) Next, the connection relationship of each flow channel in the cooling device 100 will be described with reference to Fig. 26. Fig. 26 is a block diagram showing the connection relationship of each flow channel in the cooling device 100 of this embodiment and the connection relationship between the cooling device 100, the pump 200, and the heat dissipation device 201. The cooling device 100 includes an inlet 1, a cooling flow channel 2, a return flow channel 3, a first connection flow channel 4, a second connection flow channel 5, a third connection flow channel 6, a fourth connection flow channel 7, and an outlet 8.

[0099] The inlet 1 is a through-hole that draws the refrigerant into the cooling device 100. The inlet 1 is a through-hole that connects to the third connection flow path 6. The inlet 1 allows the drawn refrigerant to flow out into the third connection flow path 6.

[0100] The cooling flow path 2 is a flow path through which a refrigerant flows to exchange heat with an object 90 (see FIG. 1 ). The cooling flow path 2 is a flow path that connects to the second connection flow path 5 and the third connection flow path 6. The cooling flow path 2 allows the refrigerant that has flowed in from the third connection flow path 6 to flow out to the second connection flow path 5.

[0101] The return flow path 3 is a flow path that connects the first connection flow path 4 and the second connection flow path 5. The return flow path 3 is a flow path that allows the refrigerant that has flowed through the second connection flow path 5 to flow out to the first connection flow path 4.

[0102] The first connection flow path 4 is a flow path that connects the return flow path 3 and the fourth connection flow path 7. The first connection flow path 4 allows the refrigerant that has flowed in from the return flow path 3 to flow out to the fourth connection flow path 7.

[0103] The second connection flow path 5 is a flow path that connects the cooling flow path 2 and the return flow path 3. The second connection flow path 5 allows the refrigerant that has flowed in from the cooling flow path 2 to flow out to the return flow path 3.

[0104] The third connection flow path 6 is a flow path that connects the inlet 1 and the cooling flow path 2. The third connection flow path 6 allows the refrigerant that has flowed in from the inlet 1 to flow out to the cooling flow path 2.

[0105] The fourth connection flow path 7 is a flow path that connects the first connection flow path 4 and the outlet 8. The fourth connection flow path 7 allows the refrigerant that has flowed in from the first connection flow path 4 to flow out to the outlet 8.

[0106] The outlet 8 is a through hole that discharges the refrigerant from the inside of the cooling device 100. The outlet 8 is connected to the fourth connection flow path 7. The outlet 8 discharges the refrigerant that has flowed in from the fourth connection flow path 7.

[0107] The cooling device 100 is also connected to the pump 200 and the heat dissipation device 201 via an inlet flow path 202 and an outlet flow path 203. The cooling device 100 draws the refrigerant flowing out from the inlet flow path 202 through the inlet 1, and circulates the refrigerant through the third connecting flow path 6, the cooling flow path 2, the second connecting flow path 5, the return flow path 3, the first connecting flow path 4, the fourth connecting flow path 7, and the outlet 8, and then flows out from the outlet 8 to the outlet flow path 203. The refrigerant flowing out from the cooling device 100 is cooled by the heat dissipation device 201. The heat dissipation device 201 includes a radiator and a fan.

[0108] (Method of Manufacturing Cooling Device) Next, a method of manufacturing a cooling device will be described with reference to Fig. 27. Fig. 27 is a flowchart showing the method of manufacturing the cooling device 100 of this embodiment.

[0109] First cooling channel recesses 20 are formed in the main body 10 (S1, see FIG. 5). Specifically, a plurality of first cooling channel recesses 20 are formed at predetermined intervals.

[0110] Next, the return flow path recesses 21 are formed in the main body 10 (S2, see FIG. 6). Specifically, the return flow path recesses 21 are formed in a concave shape recessed toward the other side in the Z direction on the bottom surface 20b, which is a surface of the inner circumferential surface of the first cooling flow path recess that is perpendicular to the Z direction. More specifically, the return flow path recesses 21 are formed on the bottom surface 20b of each of the plurality of first cooling flow path recesses (see FIG. 6). The return flow path recesses 21 are also formed so that the fifth depth D5 of the return flow path recess is greater than the fourth depth D4 of the first cooling flow path recess (see FIG. 18).

[0111] Next, it is determined whether the required number of return flow path recesses 21 have been formed (S3). If the required number of return flow path recesses 21 have not been formed (S3 NO), the process proceeds to step S2. If the required number of return flow path recesses 21 have been formed (S3 YES), the process proceeds to step S4. That is, by repeating step S2, the required number of return flow path recesses 21 are formed.

[0112] Next, the step portions 24 are formed in the main body 10 (S4, see FIG. 7). Specifically, the step portions 24 are formed to connect the plurality of first cooling flow path recesses 20 and the plurality of return flow path recesses 21.

[0113] Next, the first connection recess 22 is formed on the outer periphery of the step portion 24 (S5, see FIG. 8). Specifically, the first connection recess 22 is formed as a recess that is recessed toward the other side in the Z direction and connects to the side surface 20c, which is a surface perpendicular to the bottom surface 20b. The first connection recess 22 is also formed to connect to the end portion 21a on one side in the longitudinal direction (the Y1 direction side) of the return flow path recess 21. That is, by steps S4 and S5, the step portion 24 is formed in which the first depth D1, which is the length of the portion 24a of the step portion 24 along the Z direction, is smaller than the second depth D2, which is the length of the first connection recess 22 in the Z direction (see FIG. 14).

[0114] Next, the second connection recess 23 is formed in the main body 10 (S6, see FIG. 9). Specifically, the second connection recess 23 is formed as a recess recessed toward the other side in the Z direction, connecting to the end 20d on the other side in the longitudinal direction (Y2 direction side) of the first cooling flow path recess 20. In addition, the second connection recess 23 is formed so as to connect to the end 21b on the other side in the longitudinal direction of the return flow path recess 21.

[0115] Next, the third connection recess 25 and the fourth connection recess 26 are formed in the main body 10 (S7, see FIG. 10).

[0116] Next, through holes are formed in the end surface of the main body 10 on the Y1 direction side, thereby forming the inlet 1 and the outlet 8 (S8, see FIG. 11).

[0117] Next, the partition member 11 is placed on the step portion 24 (S9, see FIG. 20). Specifically, the partition member 11 having an elongated shape is placed on the first connection flow path 4 so as to face in the X direction, which is the direction in which the multiple first cooling flow path recesses 20 are aligned.

[0118] Next, the first plate-shaped member 12 is placed on the bottom surface 20b (S10, see FIG. 21).

[0119] Next, the fin members 13 are arranged on the arranged first plate-like member 12 (S11, see FIG. 22).

[0120] Next, the second plate-shaped member 14 is placed on one surface 20f (see FIG. 25) of the first cooling flow path recess in the Z direction (S12).

[0121] Next, the cover member 15 (see FIG. 2) is placed (S13). Specifically, the cover member 15 is placed on the surface 10a (see FIG. 2) on one side in the Z direction of the main body. More specifically, the cover member 15 is placed on the surface on one side in the Z direction of the second plate-shaped member 14.

[0122] Next, they are joined together by brazing (S14). Specifically, the main body 10, the partition member 11, and the cover member 15 are joined together by brazing. Thereafter, the manufacturing method of the cooling device is completed (end).

[0123] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0124] According to the manufacturing method of the embodiment, the cooling flow path 2 can be formed without meandering on the surface 10 a on one side in the first thickness direction of the main body portion. As a result, compared to a configuration in which the cooling flow path 2 meanders on the surface 10 a on one side in the first thickness direction of the main body portion, it is possible to suppress a decrease in the cooling ability of the object toward the downstream side of the cooling flow path.

[0125] (Second effect of this embodiment) Furthermore, according to the manufacturing method of the embodiment, a first recess 20 for a cooling flow path is formed on one side surface 10a in the first thickness direction of the main body portion, and a recess 21 for a return flow path is formed on the other side surface, making it possible to manufacture the cooling device 100 without placing separate cover members 15 on both sides.

[0126] (Third Advantage of the Present Embodiment) Furthermore, according to the manufacturing method of the present embodiment, the first depth D1 of the step portion is smaller than the second depth D2 of the first connection recessed portion, and therefore, by arranging the partition member 11 in the step portion 24, the first connection recessed portion 22 can be partitioned into two portions in the first thickness direction within the range of the second depth D2. As a result, compared to a configuration in which the step portion 24 is not provided in the first connection recessed portion 22, it is possible to more easily partition the first connection flow path 4 into a portion 4a connected to the cooling flow path 2 and a portion 4b connected to the return flow path 3.

[0127] (Fourth Advantage of the Present Embodiment) Furthermore, according to the manufacturing method of the embodiment, the partition member 11 having an elongated shape can divide the first connection flow path 4 into a portion 4a that connects to the plurality of cooling flow paths 2 and a portion 4b that connects to the return flow path 3. As a result, it is possible to provide a manufacturing method for a cooling device 100 that includes a plurality of cooling flow paths 2 and a plurality of return flow paths 3, which can suppress a decrease in cooling capacity while reducing the number of manufacturing steps and parts.

[0128] (Fifth Advantage of the Present Embodiment) Furthermore, according to the manufacturing method of the embodiment, by arranging the partition member 11 in the step portion 24, the shape of the portion of the first connection flow path that connects to the cooling flow path 2 can be made to correspond to the shape of the inner circumferential surface of the first recess for cooling flow path. Therefore, it is possible to prevent each of the multiple cooling flow paths from being connected to each other by the first connection flow path 4. This makes it possible to prevent the refrigerants from mixing in each cooling flow path 2. As a result, it is possible to prevent a decrease in the heat exchange amount in each cooling flow path 2.

[0129] (Sixth Advantage of the Present Embodiment) Furthermore, according to the manufacturing method of the present embodiment, the third width W3 of the return flow path recess is smaller than the first width W1 of the first cooling flow path recess. Therefore, compared to a configuration in which the third width W3 is formed to be the same length as the first width W1, the amount of processing of the main body portion when forming the return flow path recess 21 can be reduced. Furthermore, compared to a configuration in which the fifth depth D5 is equal to the fourth depth D4, the cross-sectional area of ​​the return flow path recess can be increased. As a result, an increase in pressure loss in the return flow path 3 can be suppressed.

[0130] (Seventh Advantage of the Present Embodiment) Furthermore, according to the manufacturing method of the present embodiment, the fin members 13 are arranged in the cooling flow path 2, so that the heat transfer area in the cooling flow path 2 can be increased compared to a configuration in which the fin members 13 are not arranged. Therefore, the amount of heat exchange in the cooling flow path 2 can be improved. As a result, the cooling capacity of the cooling device 100 can be improved compared to a configuration in which the fin members 13 are not arranged.

[0131] (Eighth Advantage of the Present Embodiment) Furthermore, according to the manufacturing method of the present embodiment, when the main body 10, the partition member 11, and the lid member 15 are brazed together, the second plate-shaped member 14 is also brazed together, so that the main body 10, the partition member 11, the second plate-shaped member 14, and the lid member 15 can be brazed together with a brazing material layer disposed on the other surface of the lid member. As a result, the main body 10, the partition member 11, the second plate-shaped member 14, and the lid member 15 can be more firmly joined together compared to a configuration in which the second plate-shaped member 14 is not disposed.

[0132] (Ninth effect of this embodiment) Furthermore, according to the cooling device 100 of the embodiment, similar to the manufacturing method of the cooling device described above, it is possible to provide a cooling device 100 that can suppress the decrease in the cooling capacity of the object as it moves downstream of the cooling flow path.

[0133] (Tenth effect of this embodiment) Furthermore, similar to the manufacturing method of the cooling device described above, a first recess 20 for a cooling flow path can be formed on one side surface 10a in the first thickness direction, and a recess 21 for a return flow path can be formed on the other side surface, thereby providing a cooling device 100 that can be manufactured without placing separate cover members 15 on both sides.

[0134] [Modifications] (First Modification) A first modification of the manufacturing method for the cooling device 100 will be described with reference to Fig. 28 . Fig. 28 is a flowchart showing the first modification of the manufacturing method for the cooling device 100 of the embodiment. As in the first modification shown in Fig. 28 , step S6 may be performed before steps S4 and S5. That is, it does not matter which of steps S4 and S5 and step S6 is performed first.

[0135] (Second Modification) A manufacturing method of a second modification of the cooling device 100 will be described with reference to Fig. 29. Fig. 29 is a flowchart showing a manufacturing method of the second modification of the cooling device 100 of the embodiment. As in the second modification shown in Fig. 29, step S8 may be performed before step S7. In other words, either step S7 or step S8 may be performed first.

[0136] (Third Modification) A cooling device 300 according to a third modification will be described with reference to Fig. 30. Fig. 30 is a schematic perspective view showing the cooling device 300 according to the third modification. As in the cooling device 300 according to the third modification shown in Fig. 30, a third plate-like member 16 may be disposed between the main body 10 and the partition member 11.

[0137] The third plate-shaped member 16 is a plate-shaped member having a brazing material layer on both sides in the Z direction. That is, the third plate-shaped member 16 is a brazing sheet.

[0138] The third plate-shaped member 16 has a shape corresponding to the partition member 11. Specifically, the third plate-shaped member 16 has a rectangular shape corresponding to the partition member 11 when viewed from above in the Z1 direction.

[0139] Next, a method for manufacturing the cooling device according to the third modified example will be described with reference to Fig. 31. Fig. 31 is a flowchart showing the method for manufacturing the cooling device 300 according to the third modified example.

[0140] By steps S1 to S8, the recesses, the step portion 24, the inlet 1 and the outlet 8 are formed.

[0141] Next, the third plate-shaped member 16 is placed in the first connection recess 22 (S20, see FIG. 30).

[0142] Next, in steps S9 to S13, the partition member 11, the first plate-shaped member 12, the fin member 13, the second plate-shaped member 14, and the lid member 15 are arranged.

[0143] Next, the components are joined together by brazing (S21). Specifically, the main body 10, the third plate-shaped member 16, the partition member 11, the first plate-shaped member 12, the fin member 13, the second plate-shaped member 14, and the cover member 15 are joined together by brazing. Thereafter, the manufacturing method of the cooling device is completed (end).

[0144] The other configurations of the third modified example are the same as those of the above embodiment.

[0145] (Effects of the third modified example) According to the manufacturing method of the third modified example, a third plate-shaped member 16 having a brazing material layer is arranged between the bottom surface 11e of the partition member and the first connection recess 22, and by joining them by brazing, the liquid-tightness of the portion 4a of the first connection flow path that connects to the cooling flow path 2 can be improved.

[0146] Other effects of the configuration of the third modified example are similar to those of the configuration of the above embodiment.

[0147] (Fourth Modification) A partition member 111 according to a fourth modification will be described with reference to Fig. 32. Fig. 32 is a schematic diagram showing a partition member 111 according to the fourth modification. Instead of forming the step portion 24, the partition member 111 may have a support portion 11f and a support portion 11g, as in the partition member 111 according to the fourth modification shown in Fig. 32.

[0148] The support portion 11f is a portion that supports the partition member 110 when the partition member 110 is placed in the first connection recess 22 (see FIG. 3). The support portion 11f is provided on the side wall 11c on one side (X1 direction side) of the partition member so as to protrude outward (in the X1 direction). The support portion 11f is configured to support the partition member 110 by abutting against the first connection recess 22 from the Z1 direction side.

[0149] The support portion 11g is a portion that supports the partition member 110 when the partition member 110 is placed in the first connection recess 22. The support portion 11g is provided on the side wall 11c so as to protrude outward (in the X2 direction) from the side wall 11c on the other side (the X2 direction side) of the partition member. The support portion 11g is configured to support the partition member 110 by abutting against the first connection recess 22 (see FIG. 3) from the Z1 direction side.

[0150] The partition member 111 according to the fourth modification shown in FIG. 32 also easily divides the first connection flow path 4 into a portion 4a connected to the cooling flow path 2 and a portion 4b connected to the return flow path 3 by first placing the partition member 11 in the first connection recess 22 and then placing the cover member 15, as in the configuration of the above embodiment. However, when a partition member 110 having support portions 11f and 11g is placed in the first connection recess 22, the support portions 11f and 11g are positioned further toward the Z1 direction than the end face of the first connection recess 22. In this case, when the cover member 15 is placed, a gap is generated between the cover member 15 and the main body 10 at and near the support portions. To prevent a gap from being generated between the cover member 15 and the main body 10, a recess must be formed in the cover member 15, which increases the number of manufacturing steps. Therefore, a configuration in which a step portion 24 is provided in the first connection recess 22 is preferable.

[0151] (Fifth Modification) The number of first cooling channel recesses is not limited to four. The number of first cooling channel recesses may be more or less than four. The number of first cooling channel recesses may be one. The number of first cooling channel recesses can be set as desired.

[0152] (Sixth Modification) The number of return flow path recesses per cooling flow path first recess is not limited to 2. The number of return flow path recesses per cooling flow path first recess may be more than 2 or may be 1. The number of return flow path recesses per cooling flow path first recess can be set as desired.

[0153] (Seventh Modification) Furthermore, the partition member 11 does not necessarily have to have the second cooling flow path recess 11a. That is, the partition member 11 may have only a pair of side walls 11c. However, if the partition member 11 does not have the second cooling flow path recess 11a, the refrigerants flowing through the cooling flow path 2 will mix with each other at the position where the partition member 11 is disposed. In this case, the amount of heat exchange through the cooling flow path 2 will decrease, and the cooling ability of the cooling device 100 to cool the object will decrease. Therefore, it is preferable that the partition member 11 has the second cooling flow path recess 11a.

[0154] (Eighth Modification) Furthermore, the second width W2 of the second cooling channel recess does not have to be a length corresponding to the first width W1 of the first cooling channel recess. However, if the second width W2 of the second cooling channel recess does not correspond to the first width W1 of the first cooling channel recess, the refrigerants flowing through the cooling channel 2 will mix at the position where the partition member 11 is disposed. In this case, the amount of heat exchange through the cooling channel 2 will decrease, and the cooling ability of the cooling device 100 to cool the object will decrease. Therefore, it is preferable that the second width W2 of the second cooling channel recess corresponds to the first width W1 of the first cooling channel recess.

[0155] Furthermore, the third depth D3 of the second cooling channel recess does not have to be a length corresponding to the fourth depth D4 of the first cooling channel recess.

[0156] (Ninth Modification) As long as the second plate-shaped member 14 has a brazing filler metal layer on one surface in the Z direction, it does not have to have a brazing filler metal layer on the other surface. Note that when the second plate-shaped member 14 also has a brazing filler metal layer on the other surface in the Z direction, the bonding strength between the main body 10 and the lid member 15 can be improved compared to a configuration in which the second plate-shaped member 14 has a brazing filler metal layer only on one surface in the Z direction.

[0157] REFERENCE SIGNS LIST 1 inlet 2 cooling flow path 3 return flow path 4 first connection flow path 5 second connection flow path 8 outlet 10 main body 10a one side surface in the first thickness direction (thickness direction) of the main body 11, 111 partition member 11a second cooling flow path recess 12 first plate-shaped member 13 fin member 14 second plate-shaped member 15 lid member 15a installation surface 20 first cooling flow path recess 20b bottom surface (bottom surface of first cooling flow path recess) 20c side surface (surface perpendicular to the bottom surface of first cooling flow path recess) 21 return flow path recess 22 first connection recess 23 second connection recess 24 step portion 24a portion of step portion along the first thickness direction 90 object 100, 300 cooling device D1 first depth (length of portion of step portion along the first thickness direction) D2 Second depth (length of first connection recess in first thickness direction) D3 Third depth (length of second cooling flow path recess along the second thickness direction which is the thickness direction of the partition member) D4 Fourth depth (length of first cooling flow path recess along the first thickness direction) D5 Fifth depth (length of return flow path recess along the first thickness direction) W1 First width (length between opposing faces in the first direction of the inner circumferential surface of first cooling flow path recess) W2 Second width (length between opposing faces in the inner circumferential surface of second cooling flow path recess) W3 Third width (length between opposing faces perpendicular to the bottom surface of the inner circumferential surface of return flow path recess) X direction First direction (direction in which first cooling flow path recesses are lined up) Z direction Thickness direction of main body

Claims

1. A method for manufacturing a cooling device having a flat main body portion and configured to cool an externally placed object, comprising the steps of: forming a first cooling flow path recess in a surface on one side in a first thickness direction, which is the thickness direction of the main body portion, on which an inlet for drawing in a refrigerant and an outlet for discharging the refrigerant are provided, the first recess being recessed toward the other side in the first thickness direction; forming a return flow path recess in a bottom surface, which is a surface orthogonal to the first thickness direction, of the inner circumferential surface of the first cooling flow path recess, the bottom surface being recessed toward the other side in the first thickness direction; forming a first connection recess in a recessed shape recessed toward the other side in the first thickness direction, the first connection recess connecting to a side surface, which is a surface orthogonal to the bottom surface, and connecting to an end of the return flow path recess on one side in the major axis direction, which is along the longest side of the bottom surface, on which the inlet and outlet are provided; a step of forming a second connection recess that is recessed toward the other side in the first thickness direction, the second connection recess connecting to the other end of the first cooling flow path recess in the longitudinal direction and connecting to the other end of the return flow path recess in the longitudinal direction; a step of arranging a partition member that separates a first connection flow path, which is partitioned by the first connection recess and a flat lid member having an installation surface for the object, into a portion that connects to a cooling flow path adjacent to the object across the installation surface, and a portion that connects to the cooling flow path via a second connection flow path, which is partitioned by the second connection recess and the lid member, and connects to a return flow path through which the refrigerant that has circulated through the cooling flow path and the second connection flow path flows out to the first connection flow path; a step of arranging a first plate-shaped member that is a partition member that separates the cooling flow path and the return flow path, on the bottom surface; a step of arranging the lid member on one surface of the main body in the first thickness direction; and a step of joining the main body, the partition member, and the lid member to each other by brazing.

2. A method for manufacturing a cooling device as described in claim 1, wherein in the step of forming the first recess for the cooling flow path, a step portion is formed on the inner surface of the first connection recess, the first depth being the length of the portion along the first thickness direction and being smaller than the second depth being the length of the first connection recess in the first thickness direction, and in the step of arranging the partition member, the partition member is arranged in the step portion.

3. A method for manufacturing a cooling device as described in claim 2, wherein in the step of forming the first recesses for the cooling flow path, a plurality of the first recesses for the cooling flow path are formed at predetermined intervals; in the step of forming the recesses for the return flow path, the recesses for the return flow path are formed on the bottom surface of each of the plurality of first recesses for the cooling flow path; and in the step of arranging the partition member, the partition member having an elongated shape is arranged in the first connecting flow path so as to face in a first direction which is the direction in which the plurality of first recesses for the cooling flow path are arranged.

4. A method for manufacturing a cooling device as set forth in claim 3, wherein the partition member is provided with second cooling channel recesses, each recessed in a direction corresponding to the direction in which each of the first cooling channel recesses is recessed, at a position corresponding to each of the plurality of first cooling channel recesses, and each of the plurality of second cooling channel recesses has a second width, which is the length between opposing faces of the inner circumferential surface of the second cooling channel recess, that corresponds to a first width, which is the length between opposing faces of the inner circumferential surface of the first cooling channel recess, and a third depth, which is the length of the second cooling channel recess along a second thickness direction, which is the thickness direction of the partition member, that corresponds to a fourth depth, which is the length of the first cooling channel recess along the first thickness direction.

5. A method for manufacturing a cooling device as described in claim 1, wherein in the step of forming the return flow path recess, the return flow path recess is formed so that a third width, which is the length between opposing surfaces of the inner circumferential surface of the return flow path recess that are perpendicular to the bottom surface, is smaller than a first width, which is the length between opposing surfaces of the inner circumferential surface of the first cooling flow path recess that are perpendicular to the bottom surface, and a fifth depth, which is the length of the return flow path recess along the first thickness direction, is greater than a fourth depth, which is the length of the first cooling flow path recess along the first thickness direction.

6. The method for manufacturing a cooling device according to claim 1, further comprising the step of arranging fin members on the arranged first plate-like member.

7. A method for manufacturing a cooling device as described in claim 1, further comprising a step of placing a second plate-shaped member having a brazing material layer on one surface of the first recess for the cooling flow path in the first thickness direction, and in the step of placing the cover member, the cover member is placed on one surface of the second plate-shaped member in the first thickness direction.

8. A cooling device for cooling an object to be placed outside, comprising: a main body portion having a flat shape and provided with an inlet for drawing in a refrigerant and an outlet for discharging the refrigerant; a flat cover member provided on one surface of the main body portion in the thickness direction and having a surface for placing the object; a first recessed cooling flow path recess formed on one surface of the main body portion and recessed toward the other side in the thickness direction; a return flow path recess formed on a bottom surface, which is a surface orthogonal to the thickness direction, of the inner circumferential surface of the first cooling flow path recess, and recessed toward the other side in the thickness direction; a first connecting recess recessed in the other side in the thickness direction, which connects with a side surface, which is a surface orthogonal to the bottom surface, and connects with an end of the return flow path recess on one side in the major axis direction, which is along the longest side of the bottom surface, where the inlet and outlet are provided; a second connection recess that is recessed toward the other side in the thickness direction and that connects to the other end of the first cooling flow path recess in the longitudinal direction and to the other end of the return flow path recess in the longitudinal direction; a partition member that separates the first connection flow path, which is separated by the first connection recess and the cover member, into a portion that connects to a cooling flow path adjacent to the object across the installation surface, and a portion that is connected to the cooling flow path via a second connection flow path separated by the second connection recess and the cover member, and connects to a return flow path through which the refrigerant that has circulated through the cooling flow path and the second connection flow path flows out to the first connection flow path; and a first plate-like member that is provided on the bottom surface of the first cooling flow path recess and is a partition member that separates the cooling flow path and the return flow path.

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