Member, and semiconductor manufacturing–related device

Abstract

The present invention provides a member having excellent corrosion resistance and a semiconductor manufacturing–related device using the same. Provided is a member that includes at least one thermoplastic resin selected from the group consisting of polyolefin resins and chlorine-based resins, the member being at least one member selected from the group consisting of building material members, mobility members, aerospace members, semiconductor members, and information communication members, and the member coming into contact with a corrosive substance.

Description

Components and semiconductor manufacturing related equipment

[0001] The present disclosure relates to components and semiconductor manufacturing-related equipment.

[0002] It has been proposed to use polyethylene that satisfies certain requirements for high-purity drug containers (see, for example, Patent Document 1).

[0003] Japanese Patent Application Publication No. 10-17729

[0004] An object of the present disclosure is to provide a member having excellent corrosion resistance and a semiconductor manufacturing-related device using the same.

[0005] The present disclosure (1) relates to a member containing at least one thermoplastic resin selected from the group consisting of polyolefin resins and chlorine-based resins, the member being at least one selected from the group consisting of building materials, mobility materials, aerospace materials, semiconductor materials, and information and communication materials, and being a member that comes into contact with a corrosive substance.

[0006] The present disclosure (2) is the member according to the present disclosure (1), wherein the thermoplastic resin has crystallinity.

[0007] The present disclosure (3) is the member according to the present disclosure (1) or (2), wherein the polyolefin resin is at least one selected from the group consisting of polyethylene resin, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin.

[0008] The present disclosure (4) is a member of any combination with any of the present disclosures (1) to (3), in which the chlorine-based resin is at least one selected from the group consisting of vinyl chloride resin, chlorinated vinyl chloride resin, and chlorinated polyethylene resin.

[0009] The present disclosure (5) is a member of any combination with any of the present disclosures (1) to (4), in which the thermoplastic resin is at least one selected from the group consisting of polyethylene resin, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, polymethylpentene resin, and vinyl chloride resin.

[0010] The present disclosure (6) is a member of any combination with any of the present disclosures (1) to (4), in which the thermoplastic resin is at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin.

[0011] The present disclosure (7) is a member of any combination with any of the present disclosures (1) to (6), wherein the member is at least one selected from the group consisting of a container, a pipe, a nozzle, a tube, a tank, a joint, a valve, a pump, a spin chuck, an O-ring, a packing, a gasket, a washer, and a sealing material.

[0012] The present disclosure (8) is a member of any combination with any of the present disclosures (1) to (7), wherein the thermoplastic resin is at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin, and the member is at least one selected from the group consisting of a container, a pipe, a nozzle, a tube, a tank, a joint, a valve, a pump, a spin chuck, an O-ring, a packing, a gasket, a washer, and a sealing material.

[0013] The present disclosure (9) is a component of any combination with any of the present disclosures (1) to (8), in which the pH of the corrosive substance is 6 or less or 8 or more.

[0014] The present disclosure (10) is a member of any combination with any of the present disclosures (1) to (9), in which the oxidation-reduction potential (vs. NHE) of the corrosive substance is −2.0 to 3.0 V.

[0015] The present disclosure (11) is a member of any combination with any of the present disclosures (1) to (10), wherein the corrosive substance is at least one selected from the group consisting of an acidic substance, a basic substance, an oxidizing substance, an organic solvent, and salt water.

[0016] The present disclosure (12) is the member according to the present disclosure (11), wherein the acidic substance is at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid.

[0017] The present disclosure (13) provides a method for preparing a tetrahydrofuran (TMAH)-based tertiary ammonium hydroxide solution, wherein the basic substance is TMAH([(CH ３ ) ４ N] ＋ [OH] － ), the component according to the present disclosure (11) or (12), which is at least one selected from the group consisting of an aqueous solution of sodium hydroxide, aqueous ammonia, and a mixed solution of aqueous hydrogen peroxide and aqueous ammonia.

[0018] The present disclosure (14) is directed to a method for treating a corrosive substance, which is selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, a mixed chemical solution of hydrogen peroxide and sulfuric acid, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), a sodium hydroxide aqueous solution, a mixed chemical solution of hydrogen peroxide and ammonia water, and at least one selected from the group consisting of isopropyl alcohol. Any combination of any of (1) to (13) of the present disclosure.

[0019] The present disclosure (15) is a member of any combination with any of the present disclosures (1) to (14) in which the member is a member for semiconductor manufacturing related equipment.

[0020] The present disclosure (16) is the member according to the present disclosure (15), wherein the semiconductor manufacturing related device is a device in which a chemical is used.

[0021] The present disclosure (17) is a component in any combination with any of the present disclosures (1) to (16), in which a test piece (size: 10 mm x 50 mm x 2 mm) of the component is immersed in each of the following three chemical solutions for one week, and the relative value of the mass after immersion, with the mass before immersion being 100, is 95 to 105 in all cases. (Chemical solution) 25 mass% TMAH([(CH ３ ) ４ N] ＋ [OH] － ) (80°C), mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% hydrofluoric acid and 69-71% nitric acid at a volume ratio of 1:100) (20°C), SPM (a mixture of 98% sulfuric acid and 30-36% hydrogen peroxide at a volume ratio of 2:1) (80°C).

[0022] The present disclosure (18) is a member in any combination with any of the present disclosures (1) to (17), in which a test piece (size: 10 mm x 50 mm x 2 mm) of the member is immersed in each of the following 10 kinds of chemical solutions for one week, and the relative value of the mass after immersion is calculated, with the mass before immersion being set to 100, and the average of the relative values ​​for the 10 kinds of chemical solutions is 95 to 105, and the standard deviation is 20 or less. (Chemical solution) 25 mass% TMAH([(CH ３ ) ４ N] ＋ [OH] － ) (80°C) 98% by mass sulfuric acid (90°C) 100% by mass isopropyl alcohol (80°C) 49% by mass hydrofluoric acid (70°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:5) (20°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:100) (20°C) SPM (a mixture of 98% by mass sulfuric acid and 30 to 36% by mass hydrogen peroxide solution in a volume ratio of 2:1) (80°C) SC1 (a mixture of 25 to 28% by mass ammonia water, 30 to 36% by mass hydrogen peroxide solution, and deionized water in a volume ratio of 1:1:5) (70°C) SC2 (a mixture of 35-37% by mass hydrochloric acid, 30-36% by mass hydrogen peroxide, and deionized water in a volume ratio of 1:1:4) (70°C) 85% by mass phosphoric acid (80°C)

[0023] The present disclosure (19) is a member of any combination with any of the present disclosures (1) to (18), which has a deflection temperature under load of 50°C or higher at a load of 1.82 MPa.

[0024] The present disclosure (20) is a member in any combination with any of the present disclosures (1) to (19), in which the amount of metal elution of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) is 20 ppb or less when a test piece (size: 10 mm x 50 mm x 2 mm) of the member is immersed in 3.6 mass% hydrochloric acid at 23°C for one week.

[0025] The present disclosure (21) is a semiconductor manufacturing-related device equipped with any combination of components of the present disclosures (1) to (20).

[0026] The present disclosure (22) is a semiconductor manufacturing-related device of the present disclosure (21), which is at least one selected from the group consisting of semiconductor manufacturing devices and devices related to semiconductor manufacturing devices.

[0027] The present disclosure (23) is the semiconductor manufacturing-related equipment of the present disclosure (22), wherein the semiconductor manufacturing equipment is at least one selected from the group consisting of a photolithography process equipment, a thin film formation / etching / cleaning / drying equipment, an inspection / evaluation equipment / manufacturing equipment, a resist processing equipment, an etching equipment, a cleaning / drying equipment, a CVD equipment, a thin film formation equipment, a CMP equipment, a processing equipment, an aging equipment, and an inspection equipment, and the semiconductor manufacturing equipment-related equipment is at least one selected from the group consisting of a pure water / chemical equipment, a gas equipment, a clean room equipment, and a manufacturing-related equipment.

[0028] The present disclosure (24) is directed to a photolithography process apparatus in which the photolithography process apparatus is at least one selected from the group consisting of a coating apparatus, a resist stripping apparatus, a developing apparatus (developer), and a descum apparatus; the thin film formation / etching / cleaning / drying apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a cleaning apparatus, a drying apparatus, and a scrub cleaning apparatus; the inspection / evaluation apparatus / manufacturing apparatus is a defect repair apparatus; the resist processing apparatus is at least one selected from the group consisting of a coating apparatus, a developing apparatus, a resist stripping apparatus, and an ashing apparatus; the etching apparatus is at least one selected from the group consisting of a dry etching apparatus and a wet etching apparatus; the cleaning / drying apparatus is at least one selected from the group consisting of a wet cleaning apparatus, a scrub cleaning apparatus, and a drying apparatus; the CVD apparatus is at least one selected from the group consisting of a high-pressure CVD apparatus, a SACVD apparatus, a low-pressure CVD apparatus, a plasma CVD apparatus, a metal CVD apparatus, and an ALD apparatus; the thin film forming apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a silicon epitaxial growth apparatus, a compound semiconductor epitaxial apparatus (MOCVD apparatus, MBE apparatus), and a plating apparatus; the CMP apparatus is at least one selected from the group consisting of a CMP apparatus and a CMP cleaning apparatus; the processing apparatus is a bump plating apparatus; the aging apparatus is at least one selected from the group consisting of an aging apparatus, a burn-in apparatus, an IC insertion apparatus, and an IC extraction apparatus; the inspection apparatus is a life test apparatus; the pure water / chemical liquid apparatus is at least one selected from the group consisting of a chemical supply apparatus, a slurry supply apparatus, a chemical purification apparatus, and a waste liquid treatment apparatus; the gas apparatus is at least one selected from the group consisting of a gas generation apparatus, a gas purification apparatus, a gas mixing apparatus, a gas detection apparatus, and an exhaust gas treatment apparatus; the clean room apparatus is at least one selected from the group consisting of a thermal chamber and an environmental test apparatus; The manufacturing-related equipment is at least one selected from the group consisting of a jig cleaning / drying device, a flow control device, a packaging device, and a measuring device for liquids and gases.

[0029] According to the present disclosure, it is possible to provide a member having excellent corrosion resistance and a semiconductor manufacturing-related device using the same.

[0030] The present disclosure will be specifically described below.

[0031] The present disclosure relates to a member comprising at least one thermoplastic resin selected from the group consisting of polyolefin resins and chlorine-based resins, the member being at least one selected from the group consisting of building materials, mobility materials, aerospace materials, semiconductor materials, and information and communication materials, and which comes into contact with corrosive substances. The member of the present disclosure has excellent corrosion resistance (particularly chemical resistance).

[0032] The member of the present disclosure also has excellent heat resistance and can suppress metal elution.

[0033] The member of the present disclosure contains at least one thermoplastic resin selected from the group consisting of polyolefin resins and chlorine-based resins. In terms of heat resistance, it is preferable to contain a polyolefin resin.

[0034] The thermoplastic resin may be crystalline or amorphous, but is preferably crystalline in terms of corrosion resistance and heat resistance.

[0035] When the thermoplastic resin is a crystalline resin, the melting point is preferably 100°C or higher, more preferably 120°C or higher, even more preferably 150°C or higher, and particularly preferably 180°C or higher, in order to further improve corrosion resistance and heat resistance. Also, the melting point is preferably 350°C or lower, more preferably 320°C or lower. The melting point of a thermoplastic resin is the temperature corresponding to the maximum value on the heat of fusion curve when heated at a rate of 10°C / min using a differential scanning calorimetry (DSC) device.

[0036] In the case of a crystalline resin, the thermoplastic resin preferably has a glass transition temperature of −130° C. or higher, more preferably −10° C. or higher, and even more preferably 5° C. or higher, in order to further improve corrosion resistance and heat resistance, and preferably has a glass transition temperature of 300° C. or lower, more preferably 250° C. or lower, even more preferably 200° C. or lower, and even more preferably 100° C. or lower.

[0037] In the case of an amorphous resin, the thermoplastic resin preferably has a glass transition temperature of 60°C or higher, more preferably 100°C or higher, and even more preferably 120°C or higher, in order to further improve corrosion resistance and heat resistance, and preferably has a glass transition temperature of 300°C or lower, more preferably 250°C or lower, and even more preferably 200°C or lower.

[0038] The glass transition temperature of a thermoplastic resin is measured in accordance with JIS K7121 using a differential scanning calorimetry (DSC) device under the condition of a temperature rise rate of 10°C / min.

[0039] The above thermoplastic resin preferably has a heat of fusion of 1 J / g or more, more preferably 5 J / g or more, even more preferably 10 J / g or more, even more preferably 30 J / g or more, particularly preferably 40 J / g or more, and preferably 300 J / g or less, more preferably 150 J / g or less, even more preferably 120 J / g or less, even more preferably 100 J / g or less, particularly preferably 90 J / g or less, in order to further improve corrosion resistance and heat resistance. The heat of fusion of the thermoplastic resin is measured using a differential scanning calorimetry (DSC) device under conditions of a heating rate of 10 ° C. / min.

[0040] The thermoplastic resin has a density of 1.50 g / m3 in terms of corrosion resistance. ３ Preferably, the content is 1.10 g / m or less. ３ More preferably, it is 0.80 g / m or less. ３ The density of the thermoplastic resin is measured in accordance with JIS K7112.

[0041] Examples of the polyolefin resin include polyethylene resin, polypropylene resin, ethylene-propylene copolymer resin, amorphous cycloolefin resin, crystalline cycloolefin resin, polymethylpentene resin, amorphous polystyrene resin, crystalline polystyrene resin, polybutylene resin, etc., and one or more of them can be used. Among them, from the viewpoint of corrosion resistance, at least one selected from the group consisting of polyethylene resin, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin is preferred, and from the viewpoint of heat resistance, at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin is more preferred, and at least one selected from the group consisting of amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin is even more preferred.

[0042] The polyethylene resin may be a homopolymer of ethylene and / or a copolymer of ethylene and an α-olefin. In the case of a copolymer of ethylene and an α-olefin, the α-olefin is preferably an α-olefin having 3 to 20 carbon atoms, more preferably an α-olefin having 3 to 18 carbon atoms, and even more preferably an α-olefin having 3 to 12 carbon atoms.

[0043] Specific examples of the α-olefin include propylene, 1-butene, 1-hexene, 1-octene, 4-methyl-1-pentene, 3-methyl-1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-undecene, 1-dodecene, 1-tridecene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-octadecene, 1-nonadecene, and 1-eicosene, and one or more of these can be used. Of these, 1-butene and 1-hexene are preferred.

[0044] The polyethylene resin may also be a copolymer of ethylene and a diene. Examples of the diene compound used in this case include butadiene, 1,4-hexadiene, ethylidene norbornene, and dicyclopentadiene, and one or more of these may be used.

[0045] The proportion of copolymerizable monomers such as α-olefins and dienes is preferably 40 mol% or less, more preferably 30 mol% or less, even more preferably 20 mol% or less, still more preferably 10 mol% or less, and particularly preferably 5.0 mol% or less, and may be 0 mol% or more, or may be 0.001 mol% or more.

[0046] The melt flow rate (MFR) of the polyethylene resin (excluding the ultra-high molecular weight polyethylene described below) is not particularly limited, but from the viewpoint of the appearance of the obtained molded article, when the polyethylene resin is used for blow molding, for example, the MFR measured at 190°C under a load of 2.16 kg is preferably 0.03 g / 10 min or more, more preferably 0.1 g / 10 min or more, and even more preferably 0.2 g / 10 min or more, and is preferably 3 g / 10 min or less, more preferably 2 g / 10 min or less, even more preferably 1.5 g / 10 min or less, even more preferably 1 g / 10 min or less, and particularly preferably 0.5 g / 10 min or less.

[0047] When the polyethylene resin (excluding the ultra-high molecular weight polyethylene described below) is used for extrusion molding, it is preferable that the MFR be 0.01 g / 10 min or more, more preferably 0.1 g / 10 min or more, and is preferably 5 g / 10 min or less, more preferably 4.5 g / 10 min or less, and even more preferably 4 g / 10 min or less.

[0048] When the polyethylene resin (excluding the ultra-high molecular weight polyethylene described below) is used for injection molding, it is preferable that the MFR be 1 g / 10 min or more, more preferably 3 g / 10 min or more, even more preferably 5 g / 10 min or more, even more preferably 10 g / 10 min or more, and particularly preferably 20 g / 10 min or more, and it is preferably 300 g / 10 min or less, more preferably 200 g / 10 min or less, even more preferably 100 g / 10 min or less, even more preferably 90 g / 10 min or less, and particularly preferably 80 g / 10 min or less.

[0049] The MFR is measured in accordance with JIS K6922-2:1997 at 190° C. under a load of 2.16 kg.

[0050] The MFR of the polyethylene resin can be adjusted by the ethylene polymerization temperature, the use of a chain transfer agent, or the like. For example, by increasing the polymerization temperature of ethylene and an α-olefin, the molecular weight can be reduced, resulting in an increased MFR. By decreasing the polymerization temperature, the molecular weight can be increased, resulting in a decreased MFR. Furthermore, in the copolymerization reaction of ethylene and an α-olefin, by increasing the amount of coexisting hydrogen (amount of chain transfer agent), the molecular weight can be reduced, resulting in an increased MFR. By decreasing the amount of coexisting hydrogen (amount of chain transfer agent), the molecular weight can be increased, resulting in a decreased MFR.

[0051] The polyethylene resin has a density of 0.900 to 0.980 g / cm ３ More preferably, it is 0.910 g / cm ３ More preferably, 0.920 g / cm ３ or more, and even more preferably 0.930 g / cm ３ More preferably, 0.932 g / cm ３ or more, more preferably 0.970 g / cm ３ More preferably, 0.960 g / cm ３ or less, and even more preferably 0.950 g / cm ３Particularly preferably 0.948 g / cm ３ The density is measured in accordance with JIS-K6922-1, 2:1997. The density can be adjusted, for example, by changing the type and amount of α-olefin copolymerized with ethylene.

[0052] The polyethylene resin can be produced by a known method, and there are no limitations on the production catalyst, process, etc. Furthermore, the raw material monomer may be derived from a petroleum raw material, may be derived from a biomass raw material, or may be both.

[0053] As the polymerization catalyst, a conventionally known catalyst such as a metal catalyst, e.g., a Ziegler-Natta catalyst, a Phillips catalyst, a metallocene catalyst, etc. Generally, these catalysts are in a state where a complex composed of an organometallic compound is supported on a carrier such as silica or an Mg compound.

[0054] Polymerization methods include high-pressure, solution, slurry, and gas-phase polymerization. High-pressure polymerization uses a radical-generating source such as oxygen or peroxide, or a catalyst composed of a metal complex, as an initiator. Ethylene, a comonomer, and an initiator are introduced into a reaction vessel and polymerization is carried out under high-temperature and high-pressure conditions. Depending on the shape of the reaction vessel, this can be further divided into tubular and autoclave polymerization. Solution polymerization is carried out in a state where the polymer is dissolved in a hydrocarbon solvent at a temperature above the melting point of the polymer. Slurry polymerization is a polymerization method in which a hydrocarbon compound is used as the solvent, and the resulting polyethylene exists in the solvent as a slurry. Depending on the shape of the reaction vessel, it can be broadly divided into autoclave and loop-pipe polymerization. Preferred solvents are inert hydrocarbon solvents selected from aliphatic hydrocarbons such as hexane and heptane, aromatic hydrocarbons such as benzene, toluene, and xylene, and alicyclic hydrocarbons such as cyclohexane and methylcyclohexane. Gas-phase polymerization involves feeding ethylene, an α-olefin as a comonomer, and hydrogen as a chain transfer agent in gaseous form into the bottom of a vertical reaction vessel, followed by the addition of a polymerization catalyst.

[0055] The polyethylene resin may contain a polar group. Examples of polar group-containing polyethylene resins include polymers obtained by graft-modifying an ethylene homopolymer and / or a copolymer of ethylene and an α-olefin with a polar group. Preferred α-olefins and their copolymerization ratios are as described above. The polar group refers to an electrically polar substituent, preferably a carboxyl group and / or a carboxylic acid anhydride group. The polar group-containing polyethylene resin can be produced by reacting an ethylene homopolymer and / or a copolymer of ethylene and an α-olefin with a compound containing a polar group. Examples of the polar group-containing compound include α,β-unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, and itaconic acid, or anhydrides thereof, and unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, vinylacetic acid, and pentenoic acid. Of these, maleic anhydride, acrylic acid, and methacrylic acid are preferred.

[0056] The polar group content of the polar group-containing polyethylene resin is preferably 0.05% by mass or more, more preferably 0.10% by mass or more, and is preferably 2.0% by mass or less, more preferably 1.0% by mass or less, relative to the polar group-containing polyethylene resin. The amount of polar groups can be measured by infrared spectroscopy (IR).

[0057] Polar group-containing polyethylene resins can be produced by methods such as graft-modifying polyethylene with a polar group-containing monomer, and known methods can be used as appropriate. Specifically, known methods include a melt method in which a polar group-containing monomer is reacted with a polyethylene resin molten by an extruder or the like using a reaction initiator, and a solution method in which a polyethylene resin is dissolved in a solvent and then reacted with a polar group-containing monomer using a reaction initiator. While both methods are suitable, the melt method is more preferred in terms of production cost and environmental impact. The melt-kneading device used for graft modification is not limited, and commonly used devices include single-screw extruders, twin-screw extruders, kneaders, Banbury mixers, Brabender mixers, and reciprocating kneaders (Buss Kneader). Among these, single-screw extruders and twin-screw extruders are more preferred in terms of productivity. Examples of reaction initiators used for graft modification include radical initiators that decompose upon heating or the like to generate radicals. Examples of radical initiators include organic peroxides, dihydroaromatic compounds, and dicumyl compounds. The temperature for graft modification is appropriately selected taking into consideration deterioration of the polyethylene resin, decomposition of the polar group-containing monomer, the decomposition temperature of the peroxide used, etc., but in the case of the melt-kneading method, for example, the temperature is usually 190 to 350°C, and particularly preferably 200 to 300°C.

[0058] The polyethylene resin may contain, as needed, additives typically used in polyolefins, such as antioxidants, weather stabilizers, antistatic agents, lubricants, antiblocking agents, organic or inorganic pigments, etc. The method for mixing the additives into the resin is not particularly limited, and examples thereof include a method in which the additives are added directly in the pelletizing step after polymerization, and a method in which a high-concentration masterbatch is prepared in advance and then dry-blended during molding.

[0059] Examples of the polyethylene resin (PE) include high-density polyethylene (HDPE), medium-density polyethylene (MDPE), low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), very low-density polyethylene (VLDPE), ultra-high molecular weight polyethylene (UHPE), cross-linked polyethylene (PEX), etc. Among these, from the viewpoint of corrosion resistance, at least one selected from the group consisting of high-density polyethylene and ultra-high molecular weight polyethylene is preferred, and ultra-high molecular weight polyethylene is more preferred.

[0060] The high-density polyethylene has a density of 0.940 g / m ３ It is preferable that the density is 0.945 g / cm or more. ３ More preferably, it is 0.970 g / m or more. ３ Preferably, the content is 0.965 g / m or less. ３ The density of polyethylene is measured in accordance with JIS K7112.

[0061] The high-density polyethylene preferably has a linear structure, and when fractionated by molecular weight, the number of long chain branches in a fraction having an Mn of 100,000 or more is preferably 0.10 or less, and may be 0.01 or more, per 1,000 carbon atoms in the main chain.

[0062] Molecular weight fractionation is carried out by the following method. A glass bead-packed column (diameter: 21 mm, length: 60 cm) is used, the column temperature is set to 130°C, and 1 g of sample dissolved in 30 mL of xylene is injected. Next, a 5 / 5 ratio of xylene / 2-ethoxyethanol is used as the developing solvent, and the distillate is removed. Thereafter, xylene is used as the developing solvent to distill off the components remaining in the column, yielding a polymer solution. Five times the amount of methanol is added to the obtained polymer solution to precipitate the polymer, which is then filtered and dried to recover components with an Mn of 100,000 or more.

[0063] The number of long chain branches is measured by the following method: using a nuclear magnetic resonance spectrometer, model JNM-GSX400, manufactured by JEOL Ltd. １３The number of branches with hexyl groups or higher is measured by C-NMR. The solvent is benzene-d6 / orthodichlorobenzene (volume ratio 30 / 70). The number per 1,000 main chain methylene carbons (chemical shift: 30 ppm) is calculated from the average value of the peaks for α-carbon (34.6 ppm) and β-carbon (27.3 ppm).

[0064] The high-density polyethylene may be a modified high-density polyethylene, which is a resin obtained by grafting at least one monomer selected from the group consisting of unsaturated carboxylic acids and derivatives thereof onto unmodified high-density polyethylene in the presence of a radical generator.

[0065] The unsaturated carboxylic acids and derivatives thereof used in producing the modified high-density polyethylene include monobasic unsaturated carboxylic acids and dibasic unsaturated carboxylic acids, as well as their metal salts, amides, imides, esters, and anhydrides. Among these, the monobasic unsaturated carboxylic acids generally have at most 20 carbon atoms, preferably at most 15 carbon atoms. Furthermore, the derivatives thereof generally have at most 20 carbon atoms, preferably at most 15 carbon atoms. Furthermore, the dibasic unsaturated carboxylic acids generally have at most 30 carbon atoms, preferably at most 25 carbon atoms. Furthermore, the derivatives thereof generally have at most 30 carbon atoms, preferably at most 25 carbon atoms. Among these unsaturated carboxylic acids and derivatives thereof, acrylic acid, methacrylic acid, maleic acid and its anhydride, 5-norbornene-2,3-dicarboxylic acid and its anhydride, and glycidyl methacrylate are preferred, with maleic anhydride and 5-norbornene anhydride being particularly preferred.

[0066] The radical generator used in producing the modified high-density polyethylene is not particularly limited, but an organic peroxide is preferred. Suitable organic peroxides have a half-life decomposition temperature of 100°C or higher. Suitable organic peroxides include dicumyl peroxide, benzoyl peroxide, di-t-butyl peroxide, 2,5-dimethyl-di-(t-butylperoxy)hexane, 2,5-dimethyl-2,5-(t-butylperoxy)hexane-3, lauroyl peroxide, and t-butyl peroxybenzoate.

[0067] The modified high-density polyethylene is produced by uniformly mixing and processing unmodified high-density polyethylene resin, an unsaturated carboxylic acid and / or its derivative, and a radical generator. Specific examples include a melt-kneading method using an extruder, Banbury mixer, kneader, or the like; a solution method in which the resin is dissolved in an appropriate solvent; a slurry method in which the resin is suspended in an appropriate solvent; and a so-called vapor-phase grafting method. The processing temperature is appropriately selected taking into consideration factors such as deterioration of the high-density polyethylene, decomposition of the unsaturated carboxylic acid or its derivative, and the decomposition temperature of the peroxide used. For example, in the case of the melt-kneading method, the processing temperature is typically 190 to 350°C, with 200 to 300°C being particularly preferred.

[0068] In producing the modified high-density polyethylene, as described in JP-A-62-010107, known methods can be employed for the purpose of improving its performance, such as a method of treating with an epoxy compound or a polyfunctional compound containing an amino group or a hydroxyl group during or after the graft modification, and a method of removing unreacted monomers (unsaturated carboxylic acids and their derivatives) and by-product components by heating, washing, etc. The graft amount of at least one monomer selected from the group consisting of unsaturated carboxylic acids and their derivatives is preferably as high as possible, but is generally in the range of 0.001 to 10% by mass.

[0069] The ultra-high molecular weight polyethylene has a weight average molecular weight of 1.0 × 10 ６ It is preferable that the ratio is 1.2×10 or more. ６ More preferably, it is 7.0 × 10 or more. ７Preferably, it is 7.0 × 10 or less. ６ The molecular weight of polyethylene is measured by gel permeation chromatography (GPC) in terms of polystyrene, and the molecular weight of ultra-high molecular weight polyethylene is measured by conversion from the intrinsic viscosity by a viscometric method.

[0070] Examples of the ultra-high molecular weight polyethylene include ultra-high molecular weight ethylene homopolymers; ultra-high molecular weight ethylene-α-olefin copolymers such as ultra-high molecular weight ethylene-propylene copolymers, ultra-high molecular weight ethylene-1-butene copolymers, ultra-high molecular weight ethylene-1-hexene copolymers, and ultra-high molecular weight ethylene-1-octene copolymers; and the like.

[0071] The ultra-high molecular weight polyethylene may be in any form, such as particles, pellets, sheets, or blocks, and among these, particles having an average particle size of 1 to 1,000 μm are preferred because they are excellent in productivity during processing and the resulting product has excellent physical properties and moldability. The average particle size can be measured, for example, by a sieving test method using a standard sieve specified in JIS Z8801.

[0072] From the viewpoints of mechanical strength and heat resistance, the ultra-high molecular weight polyethylene preferably has an intrinsic viscosity ([η]) of 10 dl / g or more, more preferably 15 dl / g or more, and even more preferably 20 dl / g or more, and preferably 80 dl / g or less, more preferably 60 dl / g or less, and even more preferably 50 dl / g or less. The intrinsic viscosity can be measured, for example, using an Ubbelohde viscometer at 135°C in a solution containing decahydronaphthalene as a solvent and having a polymer concentration of 0.0005 to 0.01%.

[0073] The ultra-high molecular weight polyethylene may be commercially available, such as GUR4113, GUR4120, and GUR4130 (all manufactured by Celanese Corporation), Sunfine UH900 and Sunfine UH950 (all manufactured by Asahi Kasei Chemicals Corporation), and Hi-Zex Million 240M and Hi-Zex Million 340M (all manufactured by Mitsui Chemicals, Inc.).

[0074] Any method may be used for producing the ultra-high molecular weight polyethylene, and examples thereof include a method of homopolymerizing ethylene or copolymerizing ethylene with another olefin using a catalyst for producing polyethylene, and examples of the α-olefin used in this method include propylene, 1-butene, 4-methyl-1-pentene, 1-hexene, 1-octene, etc. Furthermore, examples of the polymerization method include solution polymerization, bulk polymerization, gas phase polymerization, and slurry polymerization, and among these, slurry polymerization is particularly preferred because it enables the production of ultra-high molecular weight polyethylene having a regular particle shape and enables the efficient and stable production of ultra-high molecular weight polyethylene that can provide an ultra-high molecular weight polyethylene composition having a high melting point, a high degree of crystallinity, and excellent mechanical strength, heat resistance, and abrasion resistance. The solvent used in the slurry polymerization method may be any commonly used organic solvent, such as benzene, toluene, xylene, pentane, hexane, or heptane. Liquefied gases such as isobutane or propane, or olefins such as propylene, 1-butene, 1-octene, or 1-hexene may also be used as the solvent.

[0075] The polypropylene resin (PP) may be a propylene homopolymer, a copolymer of propylene and another monomer, or a hydrogenated product of the above polymer. Two or more types of propylene resins (e.g., a propylene homopolymer and a propylene copolymer) may be used in combination as the polypropylene resin.

[0076] The other monomers copolymerizable with propylene include α-olefins, non-conjugated dienes, etc., and these may be used alone or in combination of two or more.

[0077] The α-olefins include α-olefins having 2 or 4 to 20 carbon atoms. More specific examples include ethylene, 1-butene, 2-methyl-1-propene, 2-methyl-1-butene, 3-methyl-1-butene, 1-pentene, 1-hexene, 2-ethyl-1-butene, 2,3-dimethyl-1-butene, 2-methyl-1-pentene, 3-methyl-1-pentene, 4-methyl-1-pentene, 3,3-dimethyl-1-butene, 1-heptene, methyl-1-hexene, dimethyl-1-pentene, ethyl-1-pentene, trimethyl-1-butene, methylethyl-1-butene, 1-octene, methyl-1-pentene, ethyl-1-hexene, dimethyl-1-hexene, propyl-1-heptene, methylethyl-1-heptene, trimethyl-1-pentene, propyl-1-pentene, diethyl-1-butene, 1-nonene, 1-decene, 1-undecene, and 1-dodecene.

[0078] The non-conjugated diene may be a diene represented by the following formula (A): CH ２ =CR １Ａ - (CH ２ ) ｎ -CR ２Ａ =CR ３Ａ R ４Ａ (In the formula, R １Ａ , R ２Ａ , R ３Ａ , and R ４Ａ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n is an integer of 1 to 20.

[0079] R １Ａ , R ２Ａ , R ３Ａ , and R ４Ａ The alkyl group having 1 to 6 carbon atoms may be either linear or branched. Specific examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, an n-pentyl group, an isopentyl group, a t-pentyl group, a neopentyl group, an n-hexyl group, and an isohexyl group.

[0080] When the polypropylene resin is a copolymer, it may be either a random copolymer or a block copolymer. The content of propylene-derived skeletons in the random copolymer is usually 90 to 99 mol%, preferably 92 to 98 mol%. The content of propylene-derived skeletons in the block copolymer is usually 70 to 99 mol%, preferably 75 to 98 mol%.

[0081] The polypropylene resin is preferably a crystalline polypropylene resin.

[0082] The polypropylene resin may be a propylene-based block copolymer containing a crystalline propylene polymer portion and a propylene-ethylene random copolymer portion. Such a propylene-based block copolymer is a reaction mixture of a crystalline propylene polymer portion and a propylene-ethylene random copolymer portion, and is obtained by a production process that involves polymerizing a propylene homopolymer portion (the crystalline propylene polymer portion) (first stage) followed by polymerizing a propylene-ethylene random copolymer portion (second stage). The crystalline propylene polymer is produced in one or more polymerization stages (each stage under the same or different reaction conditions), and the propylene-ethylene random copolymer portion is also produced in one or more polymerization stages (each stage under the same or different reaction conditions). Therefore, the entire production process for the propylene-based block copolymer is a sequential multi-stage polymerization process of at least two stages.

[0083] The above polypropylene resin has the following properties in terms of flexural modulus and heat resistance: １３ The isotactic pentad fraction (mmmm fraction) of the propylene homopolymer portion measured by C-NMR is preferably 96.0% or more, more preferably 96.5% or more, and even more preferably 97.0% or more.

[0084] Here, the isotactic pentad fraction (mmmm fraction) is determined by the method described by A. Zambelli et al. in Macromolecules, Vol. 6, 925 (1973), i.e. １３The isotactic fraction of pentad units in a polypropylene molecular chain is measured by C-NMR (nuclear magnetic resonance) and is the fraction of propylene monomer units in which five consecutive propylene units are isotactically bonded.

[0085] １３ The peak assignments in the C-NMR spectrum are based on the description in Macromolecules, Vol. 8, 687 (1975). １３ C-NMR can be measured using a Fourier transform NMR [500 MHz (when measuring hydrogen nuclei)] device at a frequency of 125 MHz, with 20,000 cumulative measurements, improving the signal detection limit to 0.001.

[0086] The polypropylene resin may have a long chain branching structure. Having a long chain branching structure improves melt properties. The long chain branching structure can be evaluated, for example, by the strain hardening (λmax) in the measurement of extensional viscosity. The greater the amount of branching and the longer the branching length, the greater the strain hardening. The strain hardening is preferably 6.0 or more, more preferably 7.0 or more, even more preferably 8.0 or more, and even more preferably 9.0 or more. Regarding the method for measuring strain hardening, any method can, in principle, obtain the same value as long as it can measure the uniaxial extensional viscosity. For example, the measurement method and measurement equipment described in Polymer 42 (2001) 8663 can be used.

[0087] The polypropylene resin has a weight average molecular weight of 5.0 × 10 ４ It is preferable that the ratio is 1.0×10 or more. ５ More preferably, it is 1.0 × 10 or more. ６ Preferably, it is 7.0 × 10 or less. ５ The molecular weight of the polypropylene resin is measured in terms of polystyrene by gel permeation chromatography (GPC, column temperature: 140° C., eluent: 1,2,4-trichlorobenzene).

[0088] The melt flow rate (MFR) of the polypropylene resin is not particularly limited, but from the viewpoint of the appearance of the obtained molded article, when the polypropylene resin is used for blow molding, the MFR is preferably 0.03 g / 10 min or more, more preferably 0.1 g / 10 min or more, and even more preferably 0.2 g / 10 min or more, and is preferably 3 g / 10 min or less, more preferably 2 g / 10 min or less, even more preferably 1.5 g / 10 min or less, even more preferably 1 g / 10 min or less, and particularly preferably 0.5 g / 10 min or less, from the viewpoint of the appearance of the obtained molded article.

[0089] When the polypropylene resin is used for extrusion molding, the MFR is preferably 0.01 g / 10 min or more, more preferably 0.1 g / 10 min or more, and is preferably 5 g / 10 min or less, more preferably 4.5 g / 10 min or less, and even more preferably 4 g / 10 min or less.

[0090] When the polypropylene resin is used for injection molding, the MFR is preferably 1 g / 10 min or more, more preferably 3 g / 10 min or more, even more preferably 5 g / 10 min or more, and particularly preferably 10 g / 10 min or more, and is preferably 300 g / 10 min or less, more preferably 200 g / 10 min or less, even more preferably 100 g / 10 min or less, even more preferably 90 g / 10 min or less, and particularly preferably 80 g / 10 min or less.

[0091] The MFR of the polypropylene resin is measured at 230° C. under a load of 21.18 N (2.16 kg) in accordance with JIS K 7210. The polypropylene resin may be a mixture of two or more polypropylene resins having different MFRs.

[0092] The polypropylene resin may contain reinforcing fibers. Examples of the reinforcing fibers include glass fibers, carbon fibers, carbon nanotubes, basic magnesium sulfate fibers (magnesium oxysulfate fibers), potassium titanate fibers, aluminum borate fibers, calcium silicate fibers, calcium carbonate fibers, silicon carbide fibers, wollastonite, xonotlite, metal fibers, natural fibers (cotton, cellulose, silk, wool, hemp, etc.), regenerated fibers (rayon, cupra, etc.), semi-synthetic fibers (acetate, promix, etc.), synthetic fibers (polyester, polyacrylonitrile, polyamide, aramid, polyolefin, etc.), and modified fibers whose surfaces and ends are chemically modified. Among these, glass fibers are preferred.

[0093] The reinforcing fibers are preferably in the form of chopped strands. Chopped strands usually have a length of 1 to 10 mm and a fiber diameter of 5 to 20 μm, preferably a length of 1.5 to 6 mm and a fiber diameter of 8 to 14 μm. Alternatively, continuous fiber bundles can be used. Continuous fiber bundles are commercially available, for example, as rovings. The fiber diameter is usually 5 to 30 μm, preferably 13 to 20 μm.

[0094] The content of the reinforcing fibers is preferably 10 to 50 parts by mass, more preferably 20 to 40 parts by mass, based on 100 parts by mass of the total of the propylene polymer and the reinforcing fibers.

[0095] The amorphous cycloolefin resin and the crystalline cycloolefin resin may be a homopolymer (COP) of a cycloolefin, or a cycloolefin copolymer (COC), which is a copolymer of a cycloolefin and an acyclic olefin such as ethylene.

[0096] The amorphous cycloolefin resin has a weight average molecular weight of 1.0×10 ４ It is preferable that the ratio is 2.0×10 or more. ４ More preferably, it is 1.0 × 10 or more. ６ Preferably, it is 7.0 × 10 or less. ５The molecular weight of the amorphous cycloolefin resin is measured in terms of polyisobutylene by gel permeation chromatography (GPC, column temperature: 40° C., eluent: methylcyclohexane).

[0097] The cycloolefin monomer used in the amorphous cycloolefin resin is preferably a norbornene-based monomer. Norbornene-based monomers are monomers containing a norbornene ring, and specific examples include norbornenes, tetracyclododecenes, and dicyclopentadienes. These may have a hydrocarbon group or a polar group as a substituent. Examples of the hydrocarbon group include alkyl groups, alkenyl groups, alkylidene groups, and aryl groups. Examples of the polar group include a hydroxyl group, an alkoxy group having 1 to 10 carbon atoms, an alkoxycarbonyl group, an aryloxycarbonyl group, a cyano group, an amide group, an imide ring-containing group, a triorganosiloxy group, a triorganosilyl group, an amino group, an acyl group, an alkoxysilyl group, a sulfonyl-containing group, a carboxyl group, an acid anhydride group, and a halogen atom. More specifically, the alkoxy group can be exemplified by, for example, a methoxy group, an ethoxy group, etc.; the alkoxycarbonyl group can be exemplified by, for example, a methoxycarbonyl group, an ethoxycarbonyl group, etc.; the aryloxycarbonyl group can be exemplified by, for example, a phenoxycarbonyl group, a naphthyloxycarbonyl group, a fluorenyloxycarbonyl group, a biphenylyloxycarbonyl group, etc.; the triorganosiloxy group can be exemplified by, for example, a trimethylsiloxy group, a triethylsiloxy group, etc.; the triorganosilyl group can be exemplified by, for example, a trimethylsilyl group, a triethylsilyl group, etc.; the amino group can be exemplified by, for example, a primary amino group, and the alkoxysilyl group can be exemplified by, for example, a trimethoxysilyl group, a triethoxysilyl group, etc. In addition, the norbornene-based monomer can have a double bond other than the double bond of the norbornene ring.Among these, the norbornene-based monomer that does not contain a polar group, that is ... The norbornene-based monomer preferably has 3 to 6 rings, more preferably 3 or 4 rings, and most preferably 4 rings.

[0098] Examples of norbornene-based monomers not containing a polar group include norbornenes having two rings, such as 2-norbornene, 5-methyl-2-norbornene, 5-ethyl-2-norbornene, 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-decyl-2-norbornene, 5-ethylidene-2-norbornene, 5-vinyl-2-norbornene, and 5-propenyl-2-norbornene; norbornenes having three rings, such as 5-cyclohexyl-2-norbornene, 5-cyclopentyl-2-norbornene, 5-cyclohexenyl-2-norbornene, 5-cyclopentenyl-2-norbornene, and 5-phenyl-2-norbornene; tetracyclo[9.2.1.0] ２，１０ .0 ３，８ ]tetradeca-3,5,7,12-tetraene (also called 1,4-methano-1,4,4a,9a-tetrahydro-9H-fluorene), tetracyclo[10.2.1.0 ２，１１ .0 ４，９ ] norbornenes having four rings, such as pentadeca-4,6,8,13-tetraene (also called 1,4-methano-1,4,4a,9,9a,10-hexahydroanthracene);

[0099] Tetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-methyltetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-ethyltetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-methylenetetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-ethylidenetetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-vinyltetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-propenyltetracyclo[6.2.1.1 ３，６ .0 ２，７]dodec-4-ene, and other tetracyclododecenes having four rings; 9-cyclohexyltetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-cyclopentyltetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-cyclohexenyltetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-cyclopentenyltetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-4-ene, 9-phenyltetracyclo[6.2.1.1 ３，６ .0 ２，７ ] tetracyclododecenes having five rings, such as dodec-4-ene;

[0100] Dicyclopentadiene, methyldicyclopentadiene, dihydrodicyclopentadiene (tricyclo[5.2.1.0 ２，６ ]dec-8-ene, and other dicyclopentadienes having three rings;

[0101] Pentacyclo[6.5.1.1 ３，６ .0 ２，７ .0 ９，１３ ] pentadeca-4,10-diene, pentacyclo[9.2.1.1 ４，７ .0 ２，１０ .0 ３，８ ] pentadeca-5,12-diene, hexacyclo[6.6.1.1 ３，６ .1 １０，１３ .0 ２，７ .0 ９，１４ norbornene-based monomers other than norbornenes, tetracyclododecenes and dicyclopentadienes, having 5 or more rings such as heptadec-4-ene; and the like.

[0102] Examples of norbornene-based monomers containing polar groups include tetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-9-ene-4-carboxylic acid methyl ester, tetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-9-ene-4-methanol, tetracyclo[6.2.1.1３，６ .0 ２，７ ] dodec-9-ene-4-carboxylic acid, tetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-9-ene-4,5-dicarboxylic acid, tetracyclo[6.2.1.1 ３，６ .0 ２，７ ] dodec-9-ene-4,5-dicarboxylic anhydride, methyl 5-norbornene-2-carboxylate, methyl 2-methyl-5-norbornene-2-carboxylate, 5-norbornen-2-yl acetate, 5-norbornene-2-methanol, 5-norbornene-2-ol, 5-norbornene-2-carbonitrile, 2-acetyl-5-norbornene, 7-oxa-2-norbornene, etc. The norbornene-based monomers may be used alone or in combination of two or more.

[0103] As the cycloolefin monomer, other cycloolefin monomers other than norbornene-based monomers may be used in combination. Examples of the other cycloolefin monomers include cyclobutene, cyclopentene, cyclopentadiene, cyclohexene, cyclohexadiene, cycloheptene, cycloheptadiene, cyclooctene, cyclooctadiene, cyclodecene, cyclododecene, tricyclo[6.2.1.0] ２，７ ]undec-4-ene (tricycloundecene), and derivatives thereof. Here, the term "derivative" refers to a group having a substituent on the ring (olefin ring). Examples of such a substituent include an alkyl group, an alkylene group, a vinyl group, an alkoxycarbonyl group, and an alkylidene group. The ring of the "derivative" may have one or more of these substituents. The above-mentioned other cycloolefin monomers may be used singly or in combination of two or more.

[0104] The number of carbon atoms constituting the ring (olefin ring) of the other cycloolefin monomer is preferably 4 or more, more preferably 5 or more, and even more preferably 6 or more, and is preferably 20 or less, more preferably 15 or less, even more preferably 12 or less, and particularly preferably 8 or less.

[0105] As the other cycloolefin monomer, cyclooctene, cycloheptene, and derivatives thereof are preferred, cyclooctene and derivatives thereof are more preferred, and cyclooctene is even more preferred.

[0106] The content of the structural units derived from the other cycloolefin monomers is preferably 10 mol % or more, more preferably 30 mol % or more, even more preferably 40 mol % or more, and preferably 50 mol % or less.

[0107] The melt flow rate (MFR) of the amorphous cycloolefin resin measured at 280°C under a load of 2.16 kg according to JIS-K-6719 may be appropriately selected depending on the intended use, but is usually 0.1 g / 10 min or more, preferably 1 g / 10 min or more, more preferably 5 g / 10 min or more, and is usually 200 g / 10 min or less, preferably 150 g / 10 min or less, more preferably 100 g / 10 min or less. When the MFR is within the above range, the molding processability and the yield rate of molded articles are improved.

[0108] The amorphous cycloolefin resin may contain various additives, such as a polymerization reaction retarder, a radical crosslinking retarder, a reinforcing agent, a modifier, an antioxidant, a flame retardant, a filler, a colorant, and a light stabilizer.

[0109] Examples of the reinforcing material include glass fiber, glass cloth, paper substrate, and glass nonwoven fabric.

[0110] Examples of the modifier include natural rubber, butadiene rubber (BR), isoprene rubber (IR), cyclopentene rubber (CPR), styrene-butadiene copolymer (SBR), styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene copolymer (SIS), ethylene-propylene-diene terpolymer (EPDM), ethylene-vinyl acetate copolymer (EVA), and elastomers such as hydrogenated products thereof.

[0111] Examples of the antioxidant include various antioxidants for plastics and rubbers, such as hindered phenol-based, phosphorus-based, and amine-based antioxidants. These antioxidants may be used alone, but it is preferable to use two or more of them in combination.

[0112] Examples of the flame retardant include phosphorus-based flame retardants, nitrogen-based flame retardants, halogen-based flame retardants, metal hydroxide-based flame retardants such as aluminum hydroxide, antimony compounds such as antimony trioxide, etc. Although the flame retardants may be used alone, it is preferable to use two or more of them in combination.

[0113] The crystalline cycloolefin resin has a number average molecular weight of 5.0×10 ３ It is preferable that the ratio is 1.0×10 or more. ４ More preferably, it is 1.0 × 10 or more. ６ Preferably, it is 5.0 × 10 or less. ５ The molecular weight of the crystalline cycloolefin resin is more preferably not more than 10 ... １ It is calculated based on the ratio of the number of hydrogen atoms present at the polymer chain terminals to the number of hydrogen atoms present in the polymer chain other than the terminals, based on H-NMR measurement.

[0114] Examples of the cycloolefin monomer used in the crystalline cycloolefin resin include those exemplified as the cycloolefin monomer used in the amorphous cycloolefin resin. The crystalline cycloolefin resin may be a hydrogenated crystalline norbornene ring-opening polymer or a hydrogenated crystalline dicyclopentadiene ring-opening polymer, and from the viewpoint of heat resistance, a hydrogenated crystalline dicyclopentadiene ring-opening polymer is preferred.

[0115] The hydrogenated crystalline norbornene ring-opening polymer has the following formula (2-1): It has a repetition represented by:

[0116] Here, m is 1 or 2. ａ , R ｂ each independently represents a hydrogen atom or a group selected from a substituted or unsubstituted alkyl group having 1 to 12 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and a substituted or unsubstituted aryl group having 6 to 12 carbon atoms.

[0117] The hydrogenated crystalline norbornene ring-opening polymer containing the repeating unit represented by the above formula (2-1) has stereoregularity because the carbon atom represented by (*) in the above formula (2-1) is an asymmetric carbon atom.

[0118] The presence or absence of stereoregularity of the hydrogenated crystalline norbornene ring-opening polymer is not particularly limited as long as the polymer has crystallinity (i.e., has a melting point), but a hydrogenated crystalline norbornene ring-opening polymer having isotactic or syndiotactic regularity is one preferred embodiment. In the hydrogenated crystalline norbornene ring-opening polymer having isotactic regularity, the ratio of racemo dyads to the repeating units of norbornene monomers is preferably 20% or less, more preferably 10% or less. The ratio of racemo dyads in the hydrogenated crystalline norbornene ring-opening polymer can be determined by the following formula: １３ C-NMR measurement can be performed and the intensity can be calculated based on the intensity ratio of the signal at 43.35 ppm derived from the meso dyad and the signal at 43.43 ppm derived from the racemo dyad.

[0119] From the viewpoint of improving the heat resistance of the hydrogenated crystalline norbornene ring-opening polymer having isotactic regularity and increasing its crystallization rate, it is preferable to use a norbornene monomer containing dicyclopentadiene. The proportion of dicyclopentadiene in the norbornene monomer is not particularly limited, but is preferably 80% by mass or more, more preferably 90% by mass or more, and particularly preferably 95% by mass or more.

[0120] The norbornene-based monomer may also be used in combination with the other cycloolefin monomers described above. However, from the viewpoint of particularly improving the heat resistance of the hydrogenated norbornene ring-opening polymer and increasing its crystallization rate, the amount of the other cycloolefin monomer used is preferably 20% by mass or less, more preferably 10% by mass or less, and particularly preferably 5% by mass or less, based on the total amount of the monomers.

[0121] The hydrogenated crystalline norbornene ring-opening polymer having isotactic regularity can be prepared, for example, by reacting the above-mentioned norbornene monomer with the following formula: (wherein M represents an atom selected from Group 6 transition metal atoms of the periodic table, R １ represents a group selected from alkyl groups having 1 to 12 carbon atoms and aryl groups having 6 to 12 carbon atoms which may have a substituent, R ２ ~R ９ each independently represents a group selected from a hydrogen atom, an alkyl group having 1 to 12 carbon atoms which may have a substituent, and an aryl group having 6 to 12 carbon atoms which may have a substituent; R ２ ~R ９ may be bonded to each other to form a ring structure. In addition, X independently represents an atom selected from halogen atoms, n is 1 or 2, and m is 0 or 2.), and the resulting norbornene ring-opening polymer is hydrogenated to produce the norbornene ring-opening polymer.

[0122] From the viewpoint of solvent resistance, the hydrogenated crystalline norbornene ring-opening polymer is also preferably a hydrogenated syndiotactic norbornene ring-opening polymer having a racemo dyad ratio of more than 90% and high syndiotactic stereoregularity. The racemo dyad ratio is preferably more than 90%, more preferably more than 95%, and particularly preferably more than 99%.

[0123] The syndiotacticity can be calculated by the formula: [(racemo dyad) / (meso dyad + racemo dyad) x 100]. The ratio of racemo dyads (racemo dyads) is １３ For example, the hydrogenated norbornene ring-opening polymer can be calculated by analyzing the C-NMR spectrum at 60° C. using chloroform-d as a solvent. １３ By performing C-NMR spectrum analysis, the spectrum of the methylene carbon atoms of the five-membered ring can be quantitatively determined. That is, the ratio of racemo-dyads to meso-dyads can be determined based on the intensity ratio of the signal at 31.787 ppm assigned to the meso-dyad and the signal at 31.799 ppm assigned to the racemo-dyad. For example, a hydrogenated tetracyclododecene ring-opening polymer is heated at 200°C using a mixed solvent of ortho-dichlorobenzene-d4 / trichlorobenzene (1 / 2 weight ratio). １３ By performing C-NMR spectroscopy (of the non-main-chain methine carbon atoms of the five-membered ring), the ratio of racemo dyads to meso dyads can be determined based on the intensity ratio of the signal at 51.63 ppm assigned to the meso dyad and the signal at 51.72 ppm assigned to the racemo dyad.

[0124] Examples of the norbornene monomer used in the hydrogenated crystalline norbornene ring-opening polymer having syndiotactic stereoregularity include those mentioned above.

[0125] The hydrogenated crystalline norbornene ring-opening polymer having syndiotactic stereoregularity may be produced by combining a norbornene monomer with the above-mentioned other cycloolefin monomer, as long as the resulting hydrogenated norbornene ring-opening polymer has solvent resistance.

[0126] The hydrogenated crystalline norbornene ring-opening polymer having syndiotactic stereoregularity can be prepared, for example, by reacting the above-mentioned norbornene monomer with a compound represented by the following formula: (In the formula, M １１ represents an atom selected from the transition metal atoms of Group 6 of the periodic table; １１ , R １２ each independently represents a hydrogen atom or a group selected from a substituted or unsubstituted alkyl group having 1 to 12 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and a substituted or unsubstituted aryl group having 6 to 12 carbon atoms; L １１ represents an oxygen atom, or an unsubstituted or substituted nitrogen atom selected from a substituted or unsubstituted alkyl group having 1 to 12 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and a substituted or unsubstituted aryl group having 6 to 12 carbon atoms; L １２ , L １３ each independently represents a substituted or unsubstituted conjugated heterocyclic group having 5 to 15 ring members and containing at least one nitrogen atom, or O-R １３ R is a group represented by １３ is a group selected from a substituted or unsubstituted alkyl group having 1 to 12 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and a substituted or unsubstituted aryl group having 6 to 30 carbon atoms; L １４ is a phosphorus-containing compound, an oxygen-containing compound, or a nitrogen-containing compound, and n is 0 or 1.), and then the resulting norbornene ring-opening polymer is hydrogenated to produce the norbornene ring-opening polymer.

[0127] The hydrogenated crystalline dicyclopentadiene ring-opening polymer has the following formula (2-2): It has a repeating unit represented by the following formula:

[0128] The hydrogenated crystalline dicyclopentadiene ring-opening polymer has tacticity because the carbon atom represented by (1,4) in formula (2-2) is an asymmetric carbon (marked with *). From the viewpoint of high melting point and processability, the hydrogenated crystalline dicyclopentadiene ring-opening polymer has syndiotactic tacticity, and is preferably a polymer in which the syndiotacticity, i.e., the proportion of racemo diads in the total of meso diads and racemo diads in the stereoconfiguration (hereinafter sometimes simply referred to as the proportion of racemo diads), is greater than 90%. In the hydrogenated crystalline dicyclopentadiene ring-opening polymer, the proportion of racemo diads is preferably greater than 91%, more preferably greater than 92%.

[0129] Specifically, the syndiotacticity can be calculated by the formula I: [(racemo dyad) / (meso dyad + racemo dyad) x 100 (%)]. The ratio of the racemo dyads in the hydrogenated crystalline dicyclopentadiene ring-opening polymer is １３ The amount of carbon atoms in the repeating unit of the formula (2-2) can be calculated by analyzing the C-NMR spectrum. Specifically, the amount of carbon atoms in the repeating unit of the formula (2-2) can be calculated by quantifying the spectrum of the carbon atoms in the repeating unit of the formula (2-2) represented by (5, 9). ４ / trichlorobenzene [mixing ratio (by weight) 1 / 2] mixed solvent at 200°C １３ The proportion of racemo dyads can be determined by measuring the C-NMR spectrum and substituting the peak area value of the signal at 43.35 ppm derived from the meso dyad and the peak area value of the signal at 43.43 ppm derived from the racemo dyad into the formula I.

[0130] The hydrogenated crystalline dicyclopentadiene ring-opening polymer has the following formula (3-2): It has a repeating unit derived from dicyclopentadiene represented by the following formula:

[0131] The crystalline hydrogenated dicyclopentadiene ring-opening polymer preferably contains a large amount of repeating units derived from dicyclopentadiene, from the viewpoints of particularly improving the heat resistance of the hydrogenated product and increasing its crystallization rate. The proportion of repeating units derived from dicyclopentadiene in all repeating units in the hydrogenated crystalline dicyclopentadiene ring-opening polymer is not particularly limited, but is preferably 90% by mass or more, more preferably 95% by mass or more, and particularly preferably 97% by mass or more.

[0132] Dicyclopentadiene exists as endo and exo stereoisomers, and either can be used as a monomer. One isomer may be used alone, or an isomeric mixture in which the endo and exo isomers exist in any ratio can be used. From the viewpoint of increasing the crystallinity of the crystalline hydrogenated dicyclopentadiene ring-opening polymer and particularly improving its heat resistance, it is preferable to increase the ratio of one stereoisomer. The dicyclopentadiene used preferably has a ratio of 90% or more of the endo or exo isomer, more preferably 95% or more, and particularly preferably 99% or more. From the viewpoint of ease of synthesis, the stereoisomer with a higher ratio is preferably the endo isomer.

[0133] Dicyclopentadiene can also be used in combination with other cyclic olefin monomers. The amount of the other cyclic olefin monomers used is usually less than 10% by mass, preferably less than 3% by mass, and more preferably less than 1% by mass, based on the total amount of dicyclopentadiene and the other cyclic olefin monomers.

[0134] Other cyclic olefin monomers that can be used in combination with dicyclopentadiene include the above-mentioned norbornene-based monomers (excluding dicyclopentadiene), the above-mentioned other cycloolefin monomers, and the like.

[0135] The crystalline hydrogenated dicyclopentadiene ring-opening polymer can be prepared, for example, by reacting the above-mentioned dicyclopentadiene or a monomer mixture containing dicyclopentadiene and another cyclic olefin monomer with a compound represented by the following formula: (Wherein, W represents a tungsten atom, R ２１ and R ２２ each independently represents a group selected from a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms which may have a substituent, and a cycloalkyl group having 3 to 20 carbon atoms which may have a substituent; L ２１ represents a nitrogen atom which may have a substituent selected from an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms which may have a substituent, and a cycloalkyl group having 3 to 20 carbon atoms which may have a substituent; L ２２ represents a conjugated heterocyclic group having 5 to 15 ring members and containing at least one nitrogen atom, and the conjugated heterocyclic group may have a substituent; L ２３ is O-R ２３ R represents an alkoxy group represented by ２３ represents a group selected from an optionally substituted alkyl group having 1 to 12 carbon atoms and an optionally substituted aryl group having 6 to 30 carbon atoms; L ２４ represents a neutral conjugated heterocyclic ligand having 12 to 24 ring members and at least two nitrogen atoms, and the conjugated heterocyclic ligand may have a substituent.), and the resulting dicyclopentadiene ring-opening polymer is then hydrogenated to produce the compound.

[0136] The amorphous cycloolefin resin and the crystalline cycloolefin resin are also preferably cycloolefin copolymers (COC).

[0137] The cycloolefin copolymer may be a copolymer of ethylene or an α-olefin with a cycloolefin monomer, a ring-opening copolymer of a cycloolefin monomer, a hydrogenated product of a ring-opening copolymer of a cycloolefin monomer, or a graft-modified product thereof.

[0138] The cycloolefin monomer in the cycloolefin copolymer is not particularly limited as long as it does not impair the objectives of the present disclosure. Typically, norbornene and substituted norbornenes, dicyclopentadiene, 1,4,5,8-dimethano-1,2,3,4,4a,5,8,8a-octahydronaphthalene (TCD), and 1,4,4a,9a-tetrahydro-1,4-methanofluorene (MTF) are preferably used as the cycloolefin monomer. Norbornene, TCD, and dicyclopentadiene are particularly preferred as the cycloolefin monomer in terms of a good balance between cost, polymerizability, and the physical properties of the resulting cycloolefin copolymer. The cycloolefin monomer may be used alone or in combination of two or more.

[0139] The substituted norbornene is not particularly limited. Examples of the substituents on the substituted norbornene include halogen atoms and monovalent or divalent hydrocarbon groups. Specific examples of the substituted norbornene include those represented by the following formula (I): (In the formula, R ａ１ ~R ａ１２ R may be the same or different and are atoms or groups selected from the group consisting of hydrogen atoms, halogen atoms, and hydrocarbon groups. ａ９ and R ａ１０ , R ａ１１ and R ａ１２ may combine together to form a divalent hydrocarbon group. ａ９ or R ａ１０ And, R ａ１１ or R ａ１２ may be bonded to each other to form a ring. n is 0 or a positive integer. When n is 2 or more, R ａ５ ~R ａ８ may be the same or different in each repeating unit. However, when n is 0, R ａ１ ~R ａ４ and R ａ９ ~R ａ１２ at least one of which is not a hydrogen atom.

[0140] R ａ１ ~R ａ８Specific examples of R include a hydrogen atom; a halogen atom such as fluorine, chlorine, and bromine; and an alkyl group having 1 to 20 carbon atoms. ａ１ ~R ａ８ may all consist of different atoms or groups. ａ１ ~R ａ８ Some or all of these may be the same atom or group.

[0141] R ａ９ ~R ａ１２ Specific examples of R include a hydrogen atom; a halogen atom such as fluorine, chlorine, and bromine; an alkyl group having 1 to 20 carbon atoms; a cycloalkyl group such as a cyclohexyl group; a substituted or unsubstituted aromatic hydrocarbon group such as a phenyl group, a tolyl group, an ethylphenyl group, an isopropylphenyl group, a naphthyl group, and an anthryl group; and an aralkyl group such as a benzyl group and a phenethyl group. ａ９ ~R ａ１２ may all consist of different atoms or groups. ａ９ ~R ａ１２ Some or all of these may be the same atom or group.

[0142] R ａ９ and R ａ１０ , or R ａ１１ and R ａ１２ Specific examples of divalent hydrocarbon groups that can be formed by combining these groups include alkylidene groups such as an ethylidene group, a propylidene group, and an isopropylidene group.

[0143] R ａ９ or R ａ１０ And, R ａ１１ or R ａ１２ When these bond to each other to form a ring, the ring formed may be a monocyclic or polycyclic ring. The ring formed may be a polycyclic ring having a bridge. The ring formed may have a double bond. The ring formed may have a substituent such as a methyl group.

[0144] Specific examples of the substituted norbornene represented by formula (I) include 5-methyl-bicyclo[2.2.1]hept-2-ene, 5,5-dimethyl-bicyclo[2.2.1]hept-2-ene, 5-ethyl-bicyclo[2.2.1]hept-2-ene, 5-butyl-bicyclo[2.2.1]hept-2-ene, 5-ethylidene-bicyclo[2.2.1]hept-2-ene, 5-hexyl-bicyclo[2.2.1]hept-2-ene, 5-methyl-bicyclo[2.2.1]hept-2-ene, 5,5-dimethyl-bicyclo[2.2.1]hept-2-ene, 5-ethyl-bicyclo[2.2.1]hept-2-ene, 5-hexyl-bicyclo[2.2.1]hept-2-ene, 5-methyl ... Bicyclic cycloolefins such as cyclo[2.2.1]hept-2-ene, 5-octyl-bicyclo[2.2.1]hept-2-ene, 5-octadecyl-bicyclo[2.2.1]hept-2-ene, 5-methylidene-bicyclo[2.2.1]hept-2-ene, 5-vinyl-bicyclo[2.2.1]hept-2-ene, and 5-propenyl-bicyclo[2.2.1]hept-2-ene; tricyclo[4.3.0.1 ２，５ ]deca-3,7-diene (trivial name: dicyclopentadiene), tricyclo[4.3.0.1 ２，５ ]dec-3-ene; tricyclo[4.4.0.1 ２，５ ]undeca-3,7-diene or tricyclo[4.4.0.1 ２，５ ]undeca-3,8-diene or a partially hydrogenated product thereof (or an adduct of cyclopentadiene and cyclohexene), tricyclo[4.4.0.1 ２，５ ]undec-3-ene; tricyclic cycloolefins such as 5-cyclopentyl-bicyclo[2.2.1]hept-2-ene, 5-cyclohexyl-bicyclo[2.2.1]hept-2-ene, 5-cyclohexenylbicyclo[2.2.1]hept-2-ene, and 5-phenyl-bicyclo[2.2.1]hept-2-ene; tetracyclo[4.4.0.1 ２，５ .1 ７，１０ ] dodec-3-ene (also simply called tetracyclododecene), 8-methyltetracyclo[4.4.0.1 ２，５ .1 ７，１０ ] dodec-3-ene, 8-ethyltetracyclo[4.4.0.1 ２，５ .1 ７，１０ ] dodec-3-ene, 8-methylidenetetracyclo[4.4.0.1 ２，５ .1 ７，１０ ] dodec-3-ene, 8-ethylidenetetracyclo[4.4.0.1 ２，５.1 ７，１０ ] dodec-3-ene, 8-vinyltetracyclo[4,4.0.1 ２，５ .1 ７，１０ ] dodec-3-ene, 8-propenyl-tetracyclo[4.4.0.1 ２，５ .1 ７，１０ ]dodec-3-ene; 8-cyclopentyl-tetracyclo[4.4.0.1 ２，５ .1 ７，１０ ] dodec-3-ene, 8-cyclohexyl-tetracyclo[4.4.0.1 ２，５ .1 ７，１０ ] dodec-3-ene, 8-cyclohexenyl-tetracyclo[4.4.0.1 ２，５ .1 ７，１０ ] dodec-3-ene, 8-phenyl-cyclopentyl-tetracyclo[4.4.0.1 ２，５ .1 ７，１０ ] dodec-3-ene; tetracyclo[7.4.1 ３，６ .0 １，９ .0 ２，７ ]tetradeca-4,9,11,13-tetraene (also called 1,4-methano-1,4,4a,9a-tetrahydrofluorene), tetracyclo[8.4.1 ４，７ .0 １，１０ .0 ３，８ ]pentadeca-5,10,12,14-tetraene (also known as 1,4-methano-1,4,4a,5,10,10a-hexahydroanthracene); pentacyclo[6.6.1.1 ３，６ .0 ２，７ .0 ９，１４ ]-4-hexadecene, pentacyclo[6.5.1.1 ３，６ .0 ２，７ .0 ９，１３ ]-4-pentadecene, pentacyclo[7.4.0.0 ２，７ .1 ３，６ .1 １０，１３ ]-4-pentadecene; heptacyclo[8.7.0.1 ２，９ .1 ４，７ .1 １１，１７ .0 ３，８ .0 １２，１６ ]-5-eicosene, heptacyclo[8.7.0.1 ２，９ .0 ３，８ .1４，７ .0 １２，１７ .1 １３，ｌ６ ]-14-eicosene; polycyclic cycloolefins such as a tetramer of cyclopentadiene.

[0145] Among these, alkyl-substituted norbornenes such as bicyclo[2.2.1]hept-2-ene substituted with one or more alkyl groups, and alkylidene-substituted norbornenes substituted with one or more alkylidene groups such as bicyclo[2.2.1]hept-2-ene are preferred, with 5-ethylidene-bicyclo[2.2.1]hept-2-ene (common name: 5-ethylidene-2-norbornene, or simply ethylidenenorbornene) being particularly preferred.

[0146] The ethylene or α-olefin is preferably an α-olefin having from 2 to 20 carbon atoms, and particularly preferably ethylene. As such an α-olefin, not only unsubstituted α-olefins but also substituted α-olefins having a substituent such as a halogen atom can be used. The number of carbon atoms in the α-olefin is from 3 to 20, preferably from 4 to 12, and more preferably from 6 to 10.

[0147] Specific examples of α-olefins having 3 to 12 carbon atoms include propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, 3-ethyl-1-hexene, 1-octene, 1-decene, and 1-dodecene. Of these, 1-hexene, 1-octene, and 1-decene are preferred.

[0148] The molecular weight of the cycloolefin copolymer is not particularly limited. The weight average molecular weight (Mw) of the cycloolefin copolymer, as measured by gel permeation chromatography (GPC) in terms of polystyrene, is preferably 5,000 to 200,000, and more preferably 10,000 to 100,000. The number average molecular weight (Mn) of the cycloolefin copolymer, as measured by gel permeation chromatography (GPC) in terms of polystyrene, is preferably 5,000 to 200,000, and more preferably 10,000 to 100,000. The dispersion ratio (Mw / Mn) is preferably 1.2 or more, and more preferably 1.3 or more.

[0149] The melt flow rate (MFR) of the cycloolefin copolymer is not particularly limited, but from the viewpoint of the appearance of the obtained molded article, it is usually 1 g / 10 min or more, preferably 2 g / 10 min or more, more preferably 5 g / 10 min or more, and is usually 400 g / 10 min or less, preferably 200 g / 10 min or less, more preferably 100 g / 10 min or less. The MFR is a value measured in accordance with ASTM 1238 (260°C, 2.16 kg).

[0150] The above-mentioned cycloolefin copolymer may be mixed with various additives as necessary, and then molded into, for example, a film, a sheet, etc., and then used in a wide variety of applications. Examples of additives that can be added to the cycloolefin copolymer include antioxidants, weather stabilizers, ultraviolet absorbers, antibacterial agents, flame retardants, colorants, etc. These additives are added to the cycloolefin copolymer in amounts that take into account the typical amounts used depending on the type of additive.

[0151] The polymethylpentene resin (PMP) may be a homopolymer of 4-methyl-1-pentene, or a copolymer of 4-methyl-1-pentene with another monomer.

[0152] The other monomer (comonomer) in the polymethylpentene resin is not particularly limited as long as it is a monomer that can be copolymerized with 4-methyl-1-pentene. From the viewpoints of availability and copolymerization properties, preferred examples of the other monomer include α-olefins having 2 to 20 carbon atoms, such as ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, 3-methyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1-pentene, 4,4-dimethyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4-ethyl-1-hexene, and 3-ethyl-1-hexene. The other monomers may be used alone or in combination of two or more. Among these, ethylene, propylene, 1-butene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, and 1-octadecene are preferred, and α-olefins other than methyl-1-pentene having 6 to 20 carbon atoms, such as 1-hexene, 3-methyl-1-pentene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, and 1-octadecene are more preferred, and 1-hexene, 1-decene, 1-hexadecene, and 1-octadecene are even more preferred.

[0153] In the polymethylpentene resin, the content of structural units derived from 4-methyl-1-pentene is usually 85 mol % or more, preferably 90 mol % or more, more preferably 95 mol % or more, and the content of structural units derived from other monomers is usually 15 mol % or less, preferably 10 mol % or less, more preferably 5 mol % or less. １３ It can be measured by C-NMR.

[0154] The polymethylpentene resin may be a graft-modified polymer obtained by graft-modifying a 4-methyl-1-pentene polymer with a polar monomer.

[0155] Examples of polar monomers used for graft modification include hydroxyl group-containing ethylenically unsaturated compounds, amino group-containing ethylenically unsaturated compounds, epoxy group-containing ethylenically unsaturated compounds, aromatic vinyl compounds, unsaturated carboxylic acids or derivatives thereof, vinyl ester compounds, vinyl chloride, and carbodiimide compounds. Unsaturated carboxylic acids or derivatives thereof are particularly preferred. Examples of unsaturated carboxylic acids or derivatives thereof include unsaturated compounds having one or more carboxylic acid groups, esters of compounds having carboxylic acid groups with alkyl alcohols, and unsaturated compounds having one or more carboxylic acid anhydride groups. Examples of unsaturated groups include vinyl groups, vinylene groups, and unsaturated cyclic hydrocarbon groups.

[0156] Specific examples of the polar monomer include unsaturated carboxylic acids such as acrylic acid, maleic acid, fumaric acid, tetrahydrophthalic acid, itaconic acid, citraconic acid, crotonic acid, isocrotonic acid, and Nadic Acid™ (endo-cis-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid), as well as derivatives of unsaturated carboxylic acids such as acid halides, amides, imides, anhydrides, and esters. Specific examples of such derivatives include malenyl chloride, maleimide, maleic anhydride, citraconic anhydride, monomethyl maleate, dimethyl maleate, and glycidyl maleate.

[0157] The polymethylpentene resin may optionally contain at least one selected from other polymers different from 4-methyl-1-pentene polymers and resin additives, depending on the application, as long as the effects of the present disclosure are not impaired.

[0158] As the other polymer, a wide variety of thermoplastic resins different from the 4-methyl-1-pentene polymer can be used. The content of the other polymer is preferably 30% by mass or less, more preferably 20% by mass or less, and even more preferably 10% by mass or less, relative to the content of the 4-methyl-1-pentene polymer.

[0159] The thermoplastic resin is not particularly limited as long as it is different from the 4-methyl-1-pentene polymer, and examples thereof include: thermoplastic polyolefin resins: for example, polyethylenes such as low-density, medium-density, and high-density polyethylene, and high-pressure low-density polyethylene; polypropylenes such as isotactic polypropylene and syndiotactic polypropylene; poly-1-butene, poly-4-methyl-1-pentene, poly-3-methyl-1-pentene, poly-3-methyl-1-butene, ethylene-α-olefin copolymers, propylene-α-olefin copolymers, 1-butene-α-olefin copolymers, 4-methyl-1-pentene-α-olefin copolymers, cyclic olefin polymers, crystalline cyclic olefin polymers, cyclic olefin copolymers, chlorinated polyolefins, and modified polyolefin resins obtained by modifying these olefin resins; thermoplastic polyamide resins: for example, aliphatic polyamides (nylon 6, nylon 11, nylon 12, nylon 66, nylon 610, nylon 612); thermoplastic polyester resins: for example, polyethylene terephthalate, polybutylene terephthalate, and polyester elastomers; Thermoplastic vinyl aromatic resins: for example, polystyrene, crystalline polystyrene, ABS resin, AS resin, styrene-based elastomers (styrene-butadiene-styrene block polymers, styrene-isoprene-styrene block polymers, styrene-isobutylene-styrene block polymers, and hydrogenated products thereof); thermoplastic polyurethanes; vinyl chloride resins; vinylidene chloride resins; acrylic resins; vinyl acetate copolymers such as ethylene-vinyl acetate copolymers; ethylene-methacrylic acid acrylate copolymers; ionomers; ethylene-vinyl alcohol copolymers; polyvinyl alcohol; fluorine-based resins; polycarbonate; polyacetal; polyphenylene oxide; polyphenylene sulfide polyimide; polyarylate; polysulfone; polyethersulfone; rosin-based resins; terpene-based resins and petroleum resins;Copolymer rubbers: for example, ethylene-α-olefin-diene copolymers, propylene-α-olefin-diene copolymers, 1-butene-α-olefin-diene copolymers, polybutadiene rubber, polyisoprene rubber, cyclopentene rubber, neoprene rubber, nitrile rubber, butyl rubber, polyisobutylene rubber, natural rubber, silicone rubber, etc.;

[0160] Of the thermoplastic polyolefin resins mentioned above, for example, polyethylene and polypropylene can also be used as a crystal nucleating agent, and in this case, the preferred content is 0.001 to 5% by mass relative to the content of the 4-methyl-1-pentene polymer.

[0161] Among thermoplastic resins, preferred are low-density, medium-density, high-density polyethylene, high-pressure low-density polyethylene, isotactic polypropylene, syndiotactic polypropylene, amorphous cyclic olefin polymers, crystalline cyclic olefin polymers, cyclic olefin copolymers, poly-1-butene, poly-3-methyl-1-pentene, poly-3-methyl-1-butene, ethylene-α-olefin copolymers, propylene-α-olefin copolymers, 1-butene-α-olefin copolymers, styrene-based elastomers, vinyl acetate copolymers, ethylene-methacrylic acid acrylate copolymers, ionomers, fluorine-based resins, rosin-based resins, terpene-based resins, and petroleum resins. More preferred are polyethylene, isotactic polypropylene, syndiotactic polypropylene, cyclic olefin copolymers, ethylene-α-olefin copolymers, propylene-α-olefin copolymers, 1-butene-α-olefin copolymers, vinyl acetate copolymers, styrene-based elastomers, rosin-based resins, terpene-based resins, and petroleum resins, from the viewpoints of improved heat resistance, improved low-temperature resistance, and flexibility.

[0162] A part or all of the other polymer may be a graft-modified polymer obtained by graft-modifying a polymer with a polar monomer. The graft modification is as described above.

[0163] Examples of the resin additives include nucleating agents, antiblocking agents, pigments, dyes, fillers, lubricants, plasticizers, mold release agents, antioxidants, flame retardants, ultraviolet absorbers, antibacterial agents, surfactants, antistatic agents, weather stabilizers, heat stabilizers, antislip agents, foaming agents, crystallization aids, antifogging agents, antioxidants, hydrochloric acid absorbers, impact modifiers, crosslinking agents, co-crosslinking agents, crosslinking aids, adhesives, softeners, and processing aids.

[0164] The resin additives may be used alone or in combination of two or more. The content of the resin additives is not particularly limited depending on the application within a range that does not impair the object of the present disclosure, but it is preferably 0.001 to 30 mass% for each additive to be blended relative to the content of the 4-methyl-1-pentene polymer.

[0165] As the nucleating agent, known nucleating agents can be used to further improve the moldability of the resin, i.e., to increase the crystallization temperature and speed up the crystallization rate. Specific examples include dibenzylidene sorbitol-based nucleating agents, phosphate ester salt-based nucleating agents, rosin-based nucleating agents, metal benzoate salt-based nucleating agents, fluorinated polyethylene, sodium 2,2-methylenebis(4,6-di-t-butylphenyl)phosphate, pimelic acid and its salts, 2,6-naphthalene dicarboxylic acid dicyclohexylamide, and ethylene bisstearic acid amide.

[0166] The amount of the nucleating agent is not particularly limited, but is preferably 0.001 to 5 parts by mass per 100 parts by mass of the total amount of the 4-methyl-1-pentene polymer and other polymers. The nucleating agent can be added as appropriate during or after polymerization, or during molding.

[0167] As the antiblocking agent, known antiblocking agents can be used. Specific examples include finely powdered silica, finely powdered aluminum oxide, finely powdered clay, powdered or liquid silicone resin, tetrafluoroethylene resin, finely powdered crosslinked resin, such as crosslinked acrylic or methacrylic resin powder, and amide-based lubricants. Of these, finely powdered silica and crosslinked acrylic or methacrylic resin powder are preferred.

[0168] Examples of pigments include inorganic pigments (titanium oxide, iron oxide, chromium oxide, cadmium sulfide, etc.) and organic pigments (azo lake pigments, thioindigo pigments, phthalocyanine pigments, anthraquinone pigments). Examples of dyes include azo pigments, anthraquinone pigments, triphenylmethane pigments, etc. The amount of these pigments and dyes added is not particularly limited, but is usually 5% by mass or less, and preferably 0.1 to 3% by mass, in total, based on the content of the 4-methyl-1-pentene polymer.

[0169] Examples of fillers include glass fibers, carbon fibers, silica fibers, metal (stainless steel, aluminum, titanium, copper, etc.) fibers, carbon black, silica, glass beads, silicates (calcium silicate, talc, clay, etc.), metal oxides (iron oxide, titanium oxide, alumina, etc.), metal carbonates (calcium sulfate, barium sulfate), and various metal (magnesium, silicon, aluminum, titanium, copper, etc.) powders, mica, and glass flakes.

[0170] Examples of lubricants include waxes (such as carnauba wax), higher fatty acids (such as stearic acid), higher alcohols (such as stearyl alcohol), and higher fatty acid amides (such as stearic acid amide).

[0171] Examples of the plasticizer include aromatic carboxylic acid esters (dibutyl phthalate, etc.), aliphatic carboxylic acid esters (methyl acetylricinoleate, etc.), aliphatic dicarboxylic acid esters (adipic acid-propylene glycol polyester, etc.), aliphatic tricarboxylic acid esters (triethyl citrate, etc.), phosphate triesters (triphenyl phosphate, etc.), epoxy fatty acid esters (epoxybutyl stearate, etc.), and petroleum resins.

[0172] Examples of the release agent include lower (C1-4) alcohol esters of higher fatty acids (butyl stearate, etc.), polyhydric alcohol esters of fatty acids (C4-30) (hydrogenated castor oil, etc.), glycol esters of fatty acids, and liquid paraffin.

[0173] As the antioxidant, known antioxidants can be used, and specific examples thereof include phenol-based antioxidants (2,6-di-t-butyl-4-methylphenol, etc.), polycyclic phenol-based antioxidants (2,2'-methylenebis(4-methyl-6-t-butylphenol), etc.), phosphorus-based antioxidants (tri(2,4-di-t-butylphenyl)phosphate, tetrakis(2,4-di-t-butylphenyl)-4,4-biphenylenediphosphonate, etc.), sulfur-based antioxidants (dilauryl thiodipropionate, etc.), amine-based antioxidants (N,N-diisopropyl-p-phenylenediamine, etc.), and lactone-based antioxidants.

[0174] Examples of the flame retardant include organic flame retardants (nitrogen-containing, sulfur-containing, silicon-containing, phosphorus-containing, etc.) and inorganic flame retardants (antimony trioxide, magnesium hydroxide, zinc borate, red phosphorus, etc.).

[0175] Examples of ultraviolet absorbers include benzotriazole-based, benzophenone-based, salicylic acid-based, and acrylate-based ultraviolet absorbers. Examples of antibacterial agents include quaternary ammonium salts, pyridine-based compounds, organic acids, organic acid esters, halogenated phenols, and organic iodines.

[0176] Examples of surfactants include nonionic, anionic, cationic, and amphoteric surfactants. Nonionic surfactants include polyethylene glycol-type nonionic surfactants such as higher alcohol ethylene oxide adducts, fatty acid ethylene oxide adducts, higher alkylamine ethylene oxide adducts, and polypropylene glycol ethylene oxide adducts; and polyhydric alcohol-type nonionic surfactants such as polyethylene oxide, glycerin fatty acid esters, pentaerythritol fatty acid esters, sorbitol or sorbitan fatty acid esters, polyhydric alcohol alkyl ethers, and alkanolamine fatty amides. Examples of anionic surfactants include sulfate ester salts such as alkali metal salts of higher fatty acids; sulfonates such as alkylbenzene sulfonates, alkyl sulfonates, and paraffin sulfonates; and phosphate ester salts such as higher alcohol phosphate ester salts. Examples of cationic surfactants include quaternary ammonium salts such as alkyltrimethylammonium salts. Examples of amphoteric surfactants include amino acid-type amphoteric surfactants such as higher alkylaminopropionates; and betaine-type amphoteric surfactants such as higher alkyldimethyl betaines and higher alkyldimethyl hydroxyethyl betaines.

[0177] Examples of the antistatic agent include the above-mentioned surfactants, fatty acid esters, and polymeric antistatic agents. Examples of the fatty acid esters include esters of stearic acid and oleic acid, and examples of the polymeric antistatic agents include polyether ester amides.

[0178] Examples of the heat stabilizer include conventionally known stabilizers such as amine-based stabilizers, phenol-based stabilizers, and sulfur-based stabilizers. Specific examples include aromatic secondary amine stabilizers such as phenylbutylamine and N,N'-di-2-naphthyl-p-phenylenediamine; phenolic stabilizers such as dibutylhydroxytoluene, tetrakis[methylene(3,5-di-t-butyl-4-hydroxy)hydrocinnamate]methane, and octadecyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate; thioether stabilizers such as bis[2-methyl-4-(3-n-alkylthiopropionyloxy)-5-t-butylphenyl]sulfide; dithiocarbamate stabilizers such as nickel dibutyldithiocarbamate; 2-mercaptobenzoylimidazole and zinc salts of 2-mercaptobenzimidazole; and sulfur-based stabilizers such as dilaurylthiodipropionate and distearylthiodipropionate. These stabilizers may be used alone or in combination of two or more.

[0179] As the crosslinking agent, for example, an organic peroxide is used. Examples of organic peroxides include dicumyl organic peroxide, di-tert-butyl organic peroxide, 2,5-dimethyl-2,5-di-(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-di-(tert-butylperoxy)hexyne-3, 1,3-bis(tert-butylperoxyisopropyl)benzene, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, n-butyl-4,4-bis(tert-butylperoxy)valerate, benzoyl organic peroxide, p-chlorobenzoyl peroxide, 2,4-dichlorobenzoyl organic peroxide, tert-butyl peroxybenzoate, tert-butyl perbenzoate, tert-butylperoxyisopropyl carbonate, diacetyl organic peroxide, lauroyl organic peroxide, and tert-butylcumyl organic peroxide.

[0180] The organic peroxide is preferably used in a proportion of 0.05 to 10 parts by mass per 100 parts by mass of the total amount of the 4-methyl-1-pentene polymer and other polymers.

[0181] In the crosslinking treatment with an organic peroxide, a crosslinking aid that can be blended includes peroxy crosslinking aids such as sulfur, p-quinone dioxime, p,p'-dibenzoylquinone dioxime, N-methyl-N-4-dinitrosoaniline, nitrosobenzene, diphenyl guanidine, and trimethylolpropane-N,N'-m-phenylenedimaleimide; polyfunctional methacrylate monomers such as divinylbenzene, triallyl cyanurate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, and allyl methacrylate; and polyfunctional vinyl monomers such as vinyl butyrate and vinyl stearate.

[0182] The use of the above compounds is expected to result in a uniform and mild crosslinking reaction. Divinylbenzene is particularly preferred. Divinylbenzene is easy to handle, has good compatibility with polymers, and solubilizes organic peroxides, acting as a dispersant for the organic peroxides. This results in a uniform crosslinking effect and a dynamically heat-treated product with a good balance between fluidity and physical properties.

[0183] The crosslinking aid is preferably used in an amount of 0.05 to 10 parts by mass per 100 parts by mass of the total amount of the 4-methyl-1-pentene polymer and other polymers.

[0184] The melt flow rate (MFR) of the polymethylpentene resin measured in accordance with ASTM D1238 under conditions of a load of 5 kg and a temperature of 260°C is not particularly limited, but from the viewpoint of the appearance of the obtained molded article, it is usually 1 g / 10 min or more, preferably 2 g / 10 min or more, more preferably 5 g / 10 min or more, and is usually 400 g / 10 min or less, preferably 200 g / 10 min or less, more preferably 100 g / 10 min or less.

[0185] The melting point of the polymethylpentene resin is not particularly limited, but is usually 100°C or higher, preferably 150°C or higher, and is usually 240°C or lower.

[0186] The mesodiad isotacticity (mesodiad fraction) of the polymethylpentene resin is not particularly limited, but is usually 85% or more, preferably 90% or more, more preferably 95% or more, and is usually 100% or less.

[0187] The polymethylpentene resin has a weight average molecular weight of 5.0×10 ４ It is preferable that the ratio is 1.0×10 or more. ５ More preferably, it is 1.0 × 10 or more. ６ Preferably, it is 7.0 × 10 or less. ５ The molecular weight of the polymethylpentene resin is measured in terms of polystyrene by gel permeation chromatography (GPC, column temperature: 140° C., eluent: 1,2,4-trichlorobenzene).

[0188] The polymethylpentene resin can be produced by a conventionally known method, for example, the method disclosed in Comparative Example 9 of WO 2006 / 054613.

[0189] Examples of the chlorine-based resin include vinyl chloride resin, chlorinated vinyl chloride resin, chlorinated polyethylene resin, polyvinylidene chloride, etc., and one or more of these may be used. Among these, vinyl chloride resin and chlorinated vinyl chloride resin are preferred from the viewpoint of corrosion resistance.

[0190] The vinyl chloride resin may be a homopolymer of vinyl chloride or a copolymer of vinyl chloride and another monomer.

[0191] The other monomers copolymerizable with vinyl chloride include vinyl-based monomers. Specific examples include α-olefins such as ethylene, propylene, and butylene; vinyl esters such as vinyl acetate, vinyl caproate, vinyl laurate, and vinyl stearate; alkyl vinyl ethers such as 2-ethylhexyl vinyl ether, butyl vinyl ether, octyl vinyl ether, dodecyl vinyl ether, and phenyl vinyl ether; acrylic acid or methacrylic acid esters such as ethyl acrylate, n-butyl acrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate, and stearyl methacrylate; aromatic vinyls such as styrene and α-methylstyrene; halogenated olefins such as vinylidene chloride, vinyl fluoride, vinyl bromide, and propylene chloride; N-substituted maleimides such as N-t-butylmaleimide, N-phenylmaleimide, and N-cyclohexylmaleimide; and acrylic derivatives such as acrylic acid, methacrylic acid, acrylonitrile, maleic anhydride, and itaconic anhydride. These may be used alone or in combination of two or more.

[0192] The average degree of polymerization of the vinyl chloride resin is preferably 500 to 3000, and particularly preferably 700 to 1300. When the average degree of polymerization is within the range of 500 to 3000, the melt viscosity does not become too high, making it easy to mold into a desired shape, and the resulting molded article tends to have sufficient impact strength and can easily satisfy the required properties. In this specification, the average degree of polymerization of the vinyl chloride resin is measured by the method of JIS K 7367-2.

[0193] The vinyl chloride resin preferably has a chlorine content of 40% by mass or more, more preferably 50% by mass or more, and more preferably 60% by mass or less.

[0194] In this specification, the chlorine content of a chlorine-based resin is measured by heating and burning a sample in a glass tube with the flame of a gas burner, decomposing the sample to remove hydrochloric acid, absorbing the generated hydrochloric acid gas into distilled water, and neutralizing titrating the resulting gas with a 0.1 mol / L normal solution of sodium hydroxide.

[0195] To improve injection moldability, the vinyl chloride resin may be blended with a methyl methacrylate copolymer. The methyl methacrylate copolymer is a copolymer of methyl methacrylate and an acrylic ester. Examples of the acrylic ester used here include methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, 2-ethylhexyl acrylate, ethyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, and 2-ethylhexyl methacrylate. These methyl methacrylate copolymers are used alone or in combination of two or more. The methyl methacrylate copolymer is used in an amount of 0.1 to 5 parts by weight, preferably 0.5 to 2 parts by weight, per 100 parts by weight of the vinyl chloride resin.

[0196] If necessary, stabilizers, plasticizers, modifiers, fillers, colorants, lubricants, processing aids, antioxidants, ultraviolet absorbers, heat resistance improvers, smoke suppressants, and the like, which are generally used in vinyl chloride resins, can be added to the vinyl chloride resin composition within a range that does not impair the object of the present disclosure.

[0197] Examples of stabilizers include lead-based stabilizers such as tribasic lead sulfate, dibasic lead phosphite, basic lead sulfite, dibasic lead phthalate, white lead, and lead laurate or stearate; and tin stabilizers such as butyltin maleate, octyltin maleate, di-n-alkyltin mercaptide, di-n-alkyltin dilaurate, dibutyltin dimaleate, dibutyltin lauryl mercaptide, dioctyltin-S,S'-bis(isooctylmercaptoacetate), dibutyltin bisisooctylthioglycolate, di-n-octyltin maleate polymer, and dibutyltin mercaptopropionate. stabilizers; organic metal salt-based stabilizers such as calcium, cadmium, barium, or zinc laurate or stearate, and metal soap-based stabilizers; antimony-based stabilizers such as antimony mercaptocarboxylate salts or ester salts; phosphate-based stabilizers; epoxidized oil stabilizers such as epoxidized soybean oil and epoxidized linseed oil; hindered phenols such as BHT, sulfur, and bisphenols dimerized with a methylene group, etc.; salicylic acid esters, benzophenone, benzotriazole, and other ultraviolet absorbers, and these may be used alone or in combination of two or more.

[0198] Examples of the plasticizer include phthalate esters such as dimethyl phthalate, diethyl phthalate, dibutyl phthalate, di-n-octyl phthalate (hereinafter referred to as DOP), diisodecyl phthalate, and butyl benzyl phthalate; aliphatic dibasic acid esters such as dibutyl adipate, di-n-hexyl adipate, and dibutyl sebacate; phosphate esters such as tributyl phosphate, tri-2-n-ethylhexyl phosphate, tricresyl phosphate, and triphenyl phosphate; tri-2-ethylhexyl trimellitate, trimellitate, and the like. Examples include trimellitic acid esters such as tributyl citrate; glycol esters such as pentaerythritol esters and diethylene glycol benzoate; epoxidized vegetable oils such as epoxidized soybean oil and epoxidized linseed oil; citric acid esters such as acetyl tributyl citrate, acetyl trioctyl citrate and tri-n-butyl citrate; tetra-n-octyl pyromellitate, polypropylene adipate, and other polyester plasticizers, and these may be used alone or in combination of two or more.

[0199] Examples of the modifier include impact improvers such as ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, chlorinated polyethylene, methyl methacrylate-butadiene-styrene copolymer, acrylonitrile-butadiene-styrene copolymer, and acrylic rubber; heat-resistant modifiers such as acrylonitrile-butadiene-α-methylstyrene copolymer, methyl methacrylate-acrylic acid ester copolymer, and other copolymers using maleimide; flame retardants such as antimony trioxide, aluminum hydroxide, sodium antimonate, phosphate esters and phosphate compounds, chlorinated paraffin, chlorinated olefin, and hexabromobenzene; elasticity-imparting agents such as partially crosslinked NBR, acrylic rubber, and polyurethane; and foaming agents, antistatic agents, surfactants, and conductivity-imparting agents, which are arbitrarily selected from these and used alone or in combination of two or more.

[0200] Examples of fillers include carbonate-based fillers such as heavy calcium carbonate, light calcium carbonate, precipitated calcium carbonate, magnesium carbonate, and dawsonite; oxide-based fillers such as silica, diatomaceous earth, and titanium oxide; hydroxide-based fillers such as aluminum hydroxide and magnesium hydroxide; (or sub-)sulfite-based fillers such as calcium sulfate and barium sulfate; silicate-based fillers such as talc, clay, mica, and calcium silicate; carbon-based fillers such as carbon black and graphite; inorganic fiber-based fillers such as hollow or solid glass beads, short glass fibers, metal fibers, short carbon fibers, and carbon fibers; metal powder-based fillers such as iron powder and copper powder; and heat-resistant resins such as polyimide and silicone, and these may be used alone or in combination of two or more.

[0201] The colorant can be selected from any of those conventionally used for coloring plastics. Examples of such colorants include inorganic pigments such as metal powders (e.g., aluminum powder, bronze powder, etc.), carbonates (e.g., carbon black, etc.), oxides (e.g., titanium oxide, zinc white, red iron oxide, etc.), sulfates (e.g., precipitated barium sulfate, etc.), carbonates (e.g., calcium carbonate, basic magnesium carbonate, etc.), silicates (e.g., clay, ultramarine blue, etc.), chromates (e.g., yellow lead, etc.), aluminates (e.g., cobalt blue, etc.), and ferrocyanide compounds (e.g., Prussian blue, etc.); azo pigments (e.g., toluidine red, permanent carmine FB, disazo yellow AAA, lake red C, etc.); polycyclic pigments (e.g., phthalocyanine blue, indanthrone blue, quinacridone red, etc.); organic pigments (e.g., dye lakes (e.g., Victoria Pure Blue BO Lake, alkali blue toner, etc.), azine pigments, fluorescent pigments, etc.); and dyes (e.g., basic dyes, acid dyes, oil-soluble dyes, disperse dyes, etc.), which may be used alone or in combination of two or more.

[0202] Examples of lubricants include aliphatic hydrocarbon lubricants such as low molecular weight wax, polyethylene wax, paraffin wax, and liquid paraffin; higher aliphatic alcohol lubricants such as stearyl alcohol; aliphatic amide lubricants such as stearic acid amide, palmitic acid amide, and methylene bisstearamide; fatty acid ester lubricants such as glycerin monostearate, ethyl diaminostearate, and butyl stearate, as well as metal soaps and silicone oils, and these may be used alone or in combination of two or more.

[0203] The vinyl chloride resin and other components can be mixed in the same manner as conventional vinyl chloride resins. That is, it is preferable to dry blend them using a mixer such as a Henschel mixer or ribbon blender at a resin temperature in the range of 100 to 120°C. In particular, it is preferable to charge a blend consisting of the vinyl chloride resin and other components into the mixer at room temperature, mix them, and remove them when the resin temperature rises to the range of 100 to 120°C. The temperature of the mixer may be adjusted at this time. The blend can be kneaded and granulated using a Banbury mixer, mixing roll, single-screw or twin-screw extruder, or the like, as with conventional vinyl chloride resins. Alternatively, the blend can be molded in an injection molding machine without granulation to obtain a molded product.

[0204] The chlorinated vinyl chloride resin is usually produced by a method of chlorinating vinyl chloride resin as a raw material in an aqueous medium, supplying chlorine to the vinyl chloride resin in a dispersed state in an aqueous medium, and irradiating the dispersion with a mercury lamp, chlorinating by heating, or chlorinating in the presence of a catalyst; or by a method of chlorinating vinyl chloride resin in a gas phase, such as chlorinating vinyl chloride resin in a gas phase under irradiation with a mercury lamp.

[0205] Examples of the vinyl chloride resin before chlorination as a raw material include, but are not limited to, a homopolymer of vinyl chloride and a copolymer of vinyl chloride with another copolymerizable monomer (e.g., ethylene, propylene, vinyl acetate, allyl chloride, allyl glycidyl ether, acrylic ester, vinyl ether, etc.).

[0206] The average degree of polymerization of the vinyl chloride resin before chlorination may be 600 to 1,500, preferably 600 to 1,300, and more preferably 600 to 1,200.

[0207] The degree of chlorination of the chlorinated vinyl chloride resin may be 62 to 70% by mass, preferably 63 to 70% by mass, and more preferably 64 to 70% by mass.

[0208] From the viewpoint of low-temperature impact resistance, the chlorinated vinyl chloride resin may be blended with MBS (a copolymer of methyl methacrylate, butadiene, and styrene). The butadiene content of the MBS is preferably greater than 60% by mass. Examples of such MBS include B56 manufactured by Kaneka Corporation and BTAIIINX manufactured by Kureha Corporation. The MBS is preferably blended in an amount of 1 to 9 parts by mass per 100 parts by mass of the chlorinated vinyl chloride resin.

[0209] To the chlorinated vinyl chloride resin, processing aids, stabilizers, lubricants, fillers, pigments, etc., which are commonly used in chlorinated vinyl chloride resins, can also be added within the range that allows the objects of the present disclosure to be achieved.

[0210] The chlorinated polyethylene resins are obtained by chlorinating polyethylene. The various methods for chlorinating polyethylene are generally classified into three types: solution chlorination, suspension chlorination, and bulk chlorination. Chlorination in an aqueous suspension or in an inert liquid is described, for example, in U.S. Pat. Nos. 2,592,763 and 3,454,544. Bulk chlorination, or chlorination in the absence of a liquid suspending agent or solvent, is described, for example, in U.S. Pat. Nos. 2,890,213 and 4,425,206 and British Patent No. 834,905.

[0211] The chlorinated polyethylene resin preferably has a chlorine content of 5 to 25% by mass, more preferably 10% by mass or more and more preferably 20% by mass or less, and also preferably 50 to 85% by mass, more preferably 60% by mass or more and more preferably 75% by mass or less.

[0212] The chlorinated polyethylene resin may contain a plasticizer as needed. Examples of the plasticizer include those represented by the following formula: (wherein R represents a 2-propylheptyl group or a mixture of a 2-propylheptyl group and a 4-methyl-2-propylhexyl group.) From the viewpoint of heat resistance and bleeding properties, R must have 10 carbon atoms, and in the case of a mixture, the 4-methyl-2-propylhexyl group content is preferably 30 mass% or less.

[0213] To further improve flame retardancy, the chlorinated polyethylene resin may be blended with metal oxides such as antimony trioxide and antimony pentoxide, bromine-based or chlorine-based organic substances such as tetrabromobisphenol A, hexabromobenzene and chlorinated paraffin, or well-known heat stabilizers such as tribasic lead sulfate, dibasic lead stearate, dibasic lead phosphite and basic lead sulfite. Vinyl chloride resin may also be blended into the resin component. Furthermore, various well-known additives may be blended as needed, for example, phenolic antioxidants such as 1,1,3-tris-(2-methyl-4-hydroxy-5-t-butylphenyl)butane and tetrakis-[methylene-3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate]methane, crosslinking agents such as di-t-butyl peroxide, t-butylcumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane and 2,5-dimethyl-2,5-di(t-butylperoxy)hexyne-3, crosslinking aids such as trimethylolpropane triacrylate, lubricants, ultraviolet absorbers, fillers, colorants, etc. Additionally, the resin component may be crosslinked, for example, by irradiation with ionizing radiation or addition of a peroxide.

[0214] The chlorinated polyethylene resin can be molded by a molding machine for molding general thermoplastic resins, such as a single-screw extruder, a twin-screw extruder, an injection molding machine, or a compression molding machine.

[0215] When the above-mentioned additives are used, for example, the chlorinated polyethylene resin and the above-mentioned additives are mixed in predetermined proportions and uniformly dispersed using a ribbon blender, cake mixer, high-speed mixer or the like, and then the mixture is kneaded at a temperature of 110 to 180°C using a mill roll, Banbury mixer, pressure kneader, single-screw extruder, twin-screw kneading extruder, plasticator, co-kneader, injection molding machine, compression molding machine or the like, and then pelletized and molded into a desired shape.

[0216] The vinylidene chloride resin is preferably a copolymer of vinylidene chloride and a monomer copolymerizable with vinylidene chloride (vinylidene chloride copolymer). From the viewpoints of hot-melt extrusion stability and gas barrier properties, vinylidene chloride preferably accounts for 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more of all monomers in the vinylidene chloride resin, and preferably 98% by mass or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less.

[0217] Examples of monomers copolymerizable with vinylidene chloride include vinyl halides such as vinyl chloride; alkyl acrylates such as methyl acrylate, ethyl acrylate, butyl acrylate, octyl acrylate, and lauryl acrylate; alkyl methacrylates such as methyl methacrylate, ethyl methacrylate, and butyl methacrylate; acrylic acid, methacrylic acid, maleic acid, itaconic acid, maleic anhydride, itaconic anhydride, alkyl maleate esters, alkyl itaconic acid esters, acrylonitrile, vinyl acetate, ethylene, propylene, isobutylene, and butadiene. These may be used alone or in combination of two or more.

[0218] The weight-average molecular weight (Mw) of the vinylidene chloride resin is not particularly limited, but from the viewpoint of strength and thermal stability during melt molding, it is preferably 50,000 or more, more preferably 60,000 or more, and is preferably 150,000 or less, more preferably 130,000 or less, and even more preferably 120,000 or less. In this specification, the weight-average molecular weight (Mw) of the vinylidene chloride resin is a value determined by gel permeation chromatography (GPC) using polystyrene as a standard.

[0219] The polymerization method for the vinylidene chloride resin is not particularly limited, and any known method such as suspension polymerization, emulsion polymerization, or solution polymerization can be used. Among these, suspension polymerization is preferred. Examples of suspension polymerization include a direct suspension method in which a monomer is added to water in which a suspending agent is dissolved, and a suspension method, as described in JP-A-62-280207, in which water in which a suspending agent is dissolved is added to a monomer to form a dispersion in which the monomer phase is a continuous phase and water is a discontinuous phase, followed by a dispersion in which the monomer phase is a discontinuous phase and water is a continuous phase.

[0220] The vinylidene chloride resin may contain various known additives, such as plasticizers, heat stabilizers, light stabilizers, organic lubricants, inorganic powders, and colorants, as needed.

[0221] Furthermore, the vinylidene chloride resin may be mixed with at least one thermoplastic resin selected from the group consisting of polyolefin-based resins and diene-based polyurethane resins, if necessary.

[0222] The polyolefin resin used to mix with the vinylidene chloride resin refers to a homopolymer of an olefin monomer (ethylene, propylene, butylene, etc.), a copolymer of two or more olefin monomers, or a copolymer of an olefin monomer and a non-olefin monomer. Specific examples include high-density polyethylene, low-density polyethylene, linear low-density polyethylene, and ultra-low-density polyethylene produced using a Ziegler multi-site catalyst, an ethylene-α-olefin copolymer produced using a single-site catalyst, and even polypropylene, polybutylene, an ethylene-propylene copolymer, an ethylene-butylene copolymer, and an ethylene-propylene-butylene copolymer. Polyolefin copolymers modified by copolymerization or graft polymerization of unsaturated carboxylic acids such as maleic acid, fumaric acid, and acrylic acid, or derivatives thereof, such as their acid anhydrides, can also be used.

[0223] The diene-based polyurethane resin used to mix with the vinylidene chloride resin refers to a thermoplastic polyurethane resin having a polydiene skeleton (or diene skeleton). The thermoplastic polyurethane resin is typically a polyurethane resin having a soft segment (derived from a polyol, such as a polymeric glycol) and a hard segment (derived from a polyisocyanate, such as a diisocyanate). A chain extender and / or a crosslinking agent may be used during the reaction of the polyol with the polyisocyanate. Multiple types of polyol, polyisocyanate, chain extender, and crosslinking agent may each be used. The use of such a diene-based polyurethane resin can improve low-temperature properties while maintaining the barrier properties of the vinylidene chloride resin.

[0224] In the diene-based polyurethane resin, at least one of the raw materials, polyol and polyisocyanate, preferably has a polydiene skeleton (or diene skeleton), and more preferably the polyol has a polydiene skeleton (or diene skeleton). In the diene-based polyurethane resin, at least one of the raw materials, polyol and polyisocyanate, preferably has a butadiene skeleton or an isoprene skeleton, and more preferably a butadiene-based polyurethane resin having a butadiene skeleton.

[0225] Examples of polyisocyanates that can be used as raw materials for the diene polyurethane resin include compounds such as methylene diisocyanate (HDI), tolylene diisocyanate (TDI), diphenylmethane diisocyanate, naphthalene diisocyanate, isophorone diisocyanate (IPDI), xylylene diisocyanate, and phenylene diisocyanate, as well as modified products, derivatives, mixtures, and polymeric compounds thereof. Examples of chain extenders and / or crosslinking agents that can be used include ethylene glycol, butanediol, and propanediol.

[0226] The thermoplastic resin is preferably at least one selected from the group consisting of polyethylene resin, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, polymethylpentene resin, and vinyl chloride resin, more preferably at least one selected from the group consisting of high-density polyethylene, ultra-high molecular weight polyethylene, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, polymethylpentene resin, and vinyl chloride resin, even more preferably at least one selected from the group consisting of ultra-high molecular weight polyethylene, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, polymethylpentene resin, and vinyl chloride resin, even more preferably at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, polymethylpentene resin, and vinyl chloride resin, even more preferably at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin, even more preferably at least one selected from the group consisting of amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin, particularly preferably at least one selected from the group consisting of amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin.

[0227] The member of the present disclosure may contain other components as needed, including various known additives such as antioxidants, stabilizers, antistatic agents, lubricants, mold release agents, UV absorbers, dyes and pigments, reinforcing materials (e.g., glass fiber fillers and carbon fiber fillers), anti-drip agents, fillers, flame retardants, and impact-improving elastomers.

[0228] The use of an antioxidant as the other component is one preferred embodiment. Examples of the antioxidant include amine-based antioxidants and phenol-based antioxidants as primary antioxidants, and one or more of these can be used. Examples of the secondary antioxidant include sulfur-based antioxidants and phosphorus-based antioxidants. The combined use of a primary antioxidant and a secondary antioxidant is preferred, and a combination of a phenol-based antioxidant and a phosphorus-based antioxidant is particularly preferred.

[0229] The content of the antioxidant is preferably 0 parts by mass or more, more preferably 0.1 parts by mass or more, and particularly preferably 0.2 parts by mass or more, relative to 100 parts by mass of the thermoplastic resin, and is preferably 5 parts by mass or less, and particularly preferably 3 parts by mass or less. An amount exceeding 5 parts by mass is not preferred because bleeding occurs.

[0230] The other components can be blended in a range that does not impair the effects of the present disclosure. The content of the other components is preferably 20% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and even more preferably 3% by mass or less, relative to the thermoplastic resin. It may also be 0.01% by mass or more.

[0231] The member of the present disclosure is one that comes into contact with a corrosive substance. A part of the member may come into contact with the corrosive substance, or the entire member may come into contact with the corrosive substance.

[0232] The corrosive substance may be any substance that is corrosive to rubber, resin, metal, etc. The corrosive substance may be liquid, solid, or gaseous. In order to more significantly exhibit the effects of the present disclosure, the corrosive substance is preferably liquid.

[0233] The redox potential (vs. NHE) of the corrosive substance is preferably −2.0 V or higher, more preferably −1.0 V or higher, and even more preferably −0.5 V or higher, and is preferably 3.0 V or lower, more preferably 2.5 V or lower, and even more preferably 2.1 V or lower.

[0234] Examples of the corrosive substance include acidic substances, basic substances, oxidizing substances, organic solvents, and salt water.

[0235] The acidic substance may be a chemical solution having a pH of 6 or less, preferably 5 or less, and more preferably 4 or less. Specific examples include acids such as sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, and hydrochloric acid; mixtures of these acids; and mixtures of these acids with other substances (such as hydrogen peroxide). Among these, at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid is preferred, and at least one selected from the group consisting of hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid is more preferred.

[0236] The basic substance may be a chemical solution having a pH of 8 or more, preferably 9 or more, and more preferably 10 or more. Specifically, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), aqueous sodium hydroxide solution, ammonia, and the like; mixtures of these bases; mixtures of these bases with other substances (hydrogen peroxide, etc.). Among these, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), at least one selected from the group consisting of aqueous sodium hydroxide solution, aqueous ammonia, and a mixed solution of aqueous hydrogen peroxide and aqueous ammonia is preferred.

[0237] The basic substance also includes a chemical solution having an oxidation-reduction potential (vs. NHE) of −2.0 to 0 V, preferably −1.0 to 0 V, more preferably −0.5 to 0 V. Specifically, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), aqueous sodium hydroxide solution, aqueous ammonia, hydroxylamine, hydrazine, hydrogen water, sodium sulfite, and other basic substances; and mixtures of these basic substances with other substances.３ ) ４ N] ＋ [OH] － ), ammonia water, and a mixed chemical solution of hydrogen peroxide water and ammonia water are preferred.

[0238] The oxidizing substance may be a chemical solution having an oxidation-reduction potential (vs. NHE) of 0 to 3.0 V, preferably 0.5 to 2.5 V, and more preferably 1.0 to 2.1 V. Specific examples include sulfuric acid, nitric acid, hydrochloric acid, hydrogen peroxide solution, and mixtures of these oxidizing substances with other substances (such as hydrofluoric acid). Among these, at least one selected from the group consisting of sulfuric acid, nitric acid, hydrochloric acid, hydrogen peroxide solution, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide solution and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide solution and sulfuric acid is preferred, and at least one selected from the group consisting of nitric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide solution and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide solution and sulfuric acid is more preferred.

[0239] Examples of the organic solvent include esters such as methyl acetate, ethyl acetate, propyl acetate, n-butyl acetate, and tert-butyl acetate; ketones such as acetone, methyl ethyl ketone, and cyclohexanone; aliphatic hydrocarbons such as hexane, cyclohexane, octane, nonane, decane, undecane, dodecane, and mineral spirits; aromatic hydrocarbons such as benzene, toluene, xylene, naphthalene, and solvent naphtha; alcohols such as methanol, ethanol, isopropyl alcohol, tert-butanol, and ethylene glycol monoalkyl ether; cyclic ethers such as tetrahydrofuran, tetrahydropyran, and dioxane; nitriles such as acetonitrile and propionitrile; amides such as dimethyl sulfoxide, N,N-dimethylformamide, and N,N-dimethylacetamide; halogenated hydrocarbons such as dichloromethane, dichloroethane, and chloroform; and mixtures thereof. Among these, alcohols are preferred, and isopropyl alcohol is more preferred.

[0240] The corrosive substance is preferably at least one selected from the group consisting of acidic substances, basic substances, oxidizing substances, organic solvents, and brine, more preferably at least one selected from the group consisting of acidic substances, basic substances, oxidizing substances, and organic solvents, and even more preferably at least one selected from the group consisting of acidic substances and basic substances.

[0241] The corrosive substance is preferably at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, a mixed chemical solution of hydrogen peroxide and sulfuric acid, TMAH, a sodium hydroxide aqueous solution, ammonia water, a mixed chemical solution of hydrogen peroxide and ammonia water, isopropyl alcohol, and salt water; more preferably at least one selected from the group consisting of hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, a mixed chemical solution of hydrogen peroxide and sulfuric acid, TMAH, a sodium hydroxide aqueous solution, a mixed chemical solution of hydrogen peroxide and ammonia water, and isopropyl alcohol; and even more preferably at least one selected from the group consisting of hydrofluoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and sulfuric acid, and TMAH.

[0242] The member of the present disclosure may have only a portion (layer) containing the thermoplastic resin, or may have a portion (layer) containing the thermoplastic resin and other portions (layers). From the viewpoint of ensuring corrosion resistance, it is preferable that at least a portion of the surface that comes into contact with the corrosive substance is composed of a portion (layer) containing the thermoplastic resin, and it is more preferable that the entire surface that comes into contact with the corrosive substance is composed of a portion (layer) containing the thermoplastic resin.

[0243] The member of the present disclosure is used as at least one member selected from the group consisting of building materials, mobility materials, aerospace materials, medical materials, semiconductor materials, and information and communication materials. As the member, a semiconductor material is preferable because of its excellent corrosion resistance and low metal elution amount, and a semiconductor manufacturing-related equipment member (semiconductor manufacturing-related equipment article) is more preferable.

[0244] When the member of the present disclosure contains a polypropylene resin, it is used as at least one member selected from the group consisting of building materials, mobility members, aerospace members, medical members, semiconductor members, and information and communication members. As the member, a semiconductor member is preferable because of its excellent corrosion resistance and low metal elution amount, and a semiconductor manufacturing-related equipment member (semiconductor manufacturing-related equipment article) is more preferable.

[0245] When the member of the present disclosure contains an amorphous cycloolefin resin, it is used as at least one member selected from the group consisting of building materials, mobility members, aerospace members, medical members, semiconductor members, and information and communication members. As the member, a semiconductor member is preferable in terms of excellent corrosion resistance and a small amount of metal elution, and a semiconductor manufacturing-related equipment member (semiconductor manufacturing-related equipment article) is more preferable.

[0246] When the member of the present disclosure contains a crystalline cycloolefin resin, it is used as at least one member selected from the group consisting of building materials, mobility members, aerospace members, medical members, semiconductor members, and information and communication members. As the member, a semiconductor member is preferable because of its excellent corrosion resistance and low metal elution amount, and a semiconductor manufacturing-related equipment member (semiconductor manufacturing-related equipment article) is more preferable.

[0247] When the member of the present disclosure contains a polymethylpentene resin, it is used as at least one member selected from the group consisting of building materials, mobility members, aerospace members, medical members, semiconductor members, and information and communication members. As the member, a semiconductor member is preferable because of its excellent corrosion resistance and low metal elution amount, and a semiconductor manufacturing-related equipment member (semiconductor manufacturing-related equipment article) is more preferable.

[0248] Examples of the building materials (construction materials) include interior architectural materials such as baseboards, ceiling materials, and plumbing materials, and exterior architectural materials such as waterproof sheets, waterproofing materials, exterior wall materials, and roofing materials. Examples of the mobility components include parts used in ferries, trains, automobiles, motorcycles, drones, robots, and the like. Examples of the aerospace components include exterior and interior materials for aircraft, rockets, and the like, wire coating materials, cable protection materials, jet engines, cabin interior materials, and parts thereof. Examples of the medical components include piping materials, chemical containers, sterilization containers, medical tools, laboratory and analytical instruments, and packaging. Examples of the semiconductor components include process materials used in semiconductor manufacturing and parts for semiconductor manufacturing-related equipment. Examples of the information and communication components include parts for devices such as wireless LAN transmission and reception circuits, circuit boards, and parts for optical communication devices.

[0249] Examples of components according to the present disclosure include containers, piping, nozzles, tubes, tanks, joints, valves, pumps, housings, spin chucks, O-rings, packings, gaskets, washers, sealing materials, nuts, bolts, films, bottles, wire coatings, hoses, pipes, sheets, rollers, cocks, connectors, filter housings, filter cages, flow meters, wafer carriers, and wafer boxes.

[0250] Because corrosion resistance is required, the member of the present disclosure can be suitably applied to at least one selected from the group consisting of containers, piping, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packing, gaskets, washers, and sealing materials. In one preferred embodiment, the thermoplastic resin is at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin, and the member is at least one selected from the group consisting of containers, piping, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packing, gaskets, washers, and sealing materials. Another preferred embodiment is when the thermoplastic resin is polyethylene resin having a melting point of 120°C or higher, and the member is at least one selected from the group consisting of piping (excluding piping for transporting ultrapure water), nozzles, tubes, joints, valves, pumps, spin chucks, O-rings, packing, gaskets, washers, and sealing materials.

[0251] The member of the present disclosure can be suitably applied to at least one selected from the group consisting of containers, piping, nozzles, tubes, tanks, joints, valves, pumps, and spin chucks, and can be particularly suitably applied to containers, piping, nozzles, tubes, tanks, joints, and valves. Furthermore, the member can be suitably used in the containers, piping, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packings, gaskets, and seals (preferably containers, piping, nozzles, tubes, tanks, joints, and valves, and more preferably containers, piping, nozzles, tubes, tanks, and joints) in semiconductor manufacturing-related equipment.

[0252] When the member of the present disclosure contains a polypropylene resin, it can be suitably applied to at least one selected from the group consisting of containers, piping, nozzles, tubes, tanks, joints, valves, pumps, and spin chucks, and is particularly suitably applied to containers, piping, nozzles, tubes, tanks, joints, and valves. Furthermore, it can be suitably used for the above-mentioned containers, piping, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packings, gaskets, and sealants (preferably containers, piping, nozzles, tubes, tanks, joints, and valves, and more preferably containers, piping, nozzles, tubes, tanks, and joints) in semiconductor manufacturing-related equipment.

[0253] When the member of the present disclosure contains a crystalline cycloolefin resin, it can be suitably applied to at least one selected from the group consisting of a container, a pipe, a nozzle, a tube, a tank, a joint, a valve, a pump, and a spin chuck, and can be particularly suitably applied to a container, a pipe, a nozzle, a tube, a tank, a joint, and a valve. Furthermore, it can be suitably used for the above-mentioned containers, pipes, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packings, gaskets, and sealants (preferably containers, pipes, nozzles, tubes, tanks, joints, and valves, and more preferably containers, pipes, nozzles, tubes, tanks, and joints) in semiconductor manufacturing-related equipment.

[0254] When the member of the present disclosure contains an amorphous cycloolefin resin, it can be suitably applied to at least one selected from the group consisting of containers, piping, nozzles, tubes, tanks, joints, valves, pumps, and spin chucks, and is particularly suitably applied to containers, piping, nozzles, tubes, tanks, joints, and valves. Furthermore, it can be suitably used in the containers, piping, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packings, gaskets, and seals (preferably containers, piping, nozzles, tubes, tanks, joints, and valves, and more preferably containers, piping, nozzles, tubes, tanks, and joints) in semiconductor manufacturing-related equipment.

[0255] When the member of the present disclosure contains a polymethylpentene resin, it can be suitably applied to at least one selected from the group consisting of a container, a pipe, a nozzle, a tube, a tank, a joint, a valve, a pump, and a spin chuck, and can be particularly suitably applied to a container, a pipe, a nozzle, a tube, a tank, a joint, and a valve. Furthermore, it can be suitably used for the above-mentioned containers, pipes, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packings, gaskets, and sealants (preferably containers, pipes, nozzles, tubes, tanks, joints, and valves, and more preferably containers, pipes, nozzles, tubes, tanks, and joints) in semiconductor manufacturing-related equipment.

[0256] The piping is not particularly limited, but its shape preferably has an inner diameter of 2 mm to 400 mm, more preferably 2 mm to 100 mm, and particularly preferably 2 mm to 25 mm. Examples include a robust pipe type, a flexible hose that can be incorporated to fit the installation space, and a bellows pipe with a large diameter that can be bent. The inside of the piping is made of a clean material (low contamination of the chemical solution by extracted ions) and chemical-resistant, and may be polished with high precision to prevent dust generation and to prevent disturbance of the liquid or gas flow. Depending on the chemical solution being passed through, such as an organic solvent, antistatic properties may be required to prevent static electricity buildup. Conductive fillers (carbon black, carbon nanotubes, etc.) may be added to the piping to the extent that cleanliness is not impaired.

[0257] The nozzle is not particularly limited, but the tip may be precisely machined to match the size and shape of the part, and in addition, since it comes into contact with the part, it can be made of a highly hard and durable material that is resistant to friction and bending.

[0258] The tube is not particularly limited, but the tube diameter is preferably 2 mm to 400 mm, more preferably 2 mm to 100 mm, and particularly preferably 2 to 25 mm. Materials having stress crack resistance, chemical resistance, excellent mechanical strength, and cleanliness (less contamination of the chemical solution by extracted ions) are used. Depending on the chemical solution being passed through, such as an organic solvent, antistatic properties may be required to prevent static electricity buildup. Conductive fillers (carbon black, carbon nanotubes, etc.) may be added to the tube to the extent that cleanliness is not impaired, thereby providing antistatic properties.

[0259] The containers and tanks are not particularly limited, but may be precision cleaned (water washing, acetic acid immersion, hydrochloric acid immersion, nitric acid immersion, wiping cleaning, pure water cleaning, etc.) to remove dirt and residues. Packaging after cleaning may be carried out in a clean room or clean booth environment.

[0260] The joints and valves are not particularly limited, but are required to be oil-free, particle-free, dead space-free, and external leak-free, and the size is preferably in the range of Φ3.2 mm to 40 mm, and more preferably in the range of Φ3.2 to 12.7 mm.

[0261] The pump is not particularly limited, but may be required to have retractability.

[0262] The spin chuck is not particularly limited, but may be required to have hardness, corrosion resistance, and dimensional stability, and may be provided with electrical conductivity.

[0263] O-rings and sealing materials are not particularly limited, but the material properties required are excellent elasticity, good compression set, excellent wear resistance, excellent heat resistance, resistance to corrosion by applied liquids and gases, and a long life. In particular, O-rings used in semiconductor manufacturing-related equipment are used in harsh chemical environments, such as being exposed to various plasmas, and therefore are required to have high heat resistance, chemical resistance, and plasma resistance. The compression set at 100°C for 72 hours is preferably 25% or less, more preferably 20% or less, even more preferably 15% or less, and even more preferably 10% or less.

[0264] The packing and gasket are not particularly limited, but may be required to have a good compression set, a low coefficient of friction, and excellent abrasion resistance, and may also be required to have heat resistance, cold resistance, pressure resistance, and chemical resistance to prevent leakage. The compression set at 100°C for 72 hours is preferably 25% or less, more preferably 20% or less, even more preferably 15% or less, and even more preferably 10% or less.

[0265] The washer is not particularly limited, but is expected to be used in a clean room or the like and may be required to have durability, corrosion resistance, and rust prevention properties.

[0266] The members of the present disclosure can be used, for example, in the following applications: <Building materials> Exterior materials for furniture, and architectural interior materials such as walls, ceilings, and floors; Exterior materials for buildings such as exterior walls such as siding, fences, roofs, gates, and gable boards; Surface decorative materials such as window frames, doors, handrails, thresholds, and lintels; Membrane materials (roofing materials, ceiling materials, exterior wall materials, interior wall materials, covering materials, etc.) for membrane structure buildings (sports facilities, horticultural facilities, atriums, etc.); Plate materials for outdoor use (soundproof walls, windbreak fences, wave fences, garage canopies, shopping malls, walkway walls, roofing materials); Building materials such as tent materials for tent warehouses, sunshade membrane materials, partial roofing materials for letting in light, window materials in place of glass, membrane materials for fire-retardant partitions, curtains, exterior wall reinforcement, waterproof membranes, smoke-proof membranes, non-flammable transparent partitions, and road reinforcement; Agricultural films, weather-resistant covers for various roofing materials and side walls, etc.; Covering materials for glass such as non-flammable fire-resistant safety glass; etc. Among these, because corrosion resistance is required, the thermoplastic resin is particularly suitable for use in membrane materials for membrane structure buildings, outdoor use board materials, tent materials for tent warehouses, sunshade membrane materials, partial roof materials for lighting, window materials replacing glass, flame retardant partition membrane materials, curtains, building materials such as exterior wall reinforcement, waterproof membranes, smokeproof membranes, non-flammable transparent partitions, road reinforcement, agricultural films, and weather-resistant covers for various roof materials and side walls, etc. When the member of the present disclosure is used for the above applications, from the viewpoints of corrosion resistance, weather resistance, and economy, the thermoplastic resin is preferably at least one selected from the group consisting of polyethylene resin, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin.

[0267] <Mobility> O-rings, tubes, packings, valve core materials, hoses, seals, and diaphragms used in automotive fuel systems and peripheral devices (for example, injector O-rings, injector packings, fuel pump O-rings, diaphragms, fuel hoses, filler hoses, and evaporation hoses) (these may be for sour gasoline resistance, alcohol resistance, or resistance to fuels containing gasoline additives such as methyl tertiary butyl ether or amine resistance). Hoses and seals used in automotive automatic transmissions (for example, ATF hoses). Gaskets, shaft seals, valve stem seals, seals, and hoses used in automotive engines and peripheral devices (for example, carburetor flange gaskets, engine head gaskets, metal gaskets, crankshaft seals, camshaft seals, valve stem seals, manifold packing, and oil hoses). Oxygen sensors for automotive engines. Other automotive components such as automotive brake hoses, air conditioning hoses, radiator hoses, radiator tanks, chemical tanks, bellows, spacers, rollers, gasoline tanks, bumpers, door trim, instrument panels, and electrical wire coating materials; O-rings, tubes, packings, valve core materials, hoses, sealants, and diaphragms used in marine fuel systems and peripheral devices; Anticorrosion tapes for piping, such as tapes wrapped around piping on marine decks, etc. Among these, because corrosion resistance is required, the composition is particularly suitable for use in tubes, valve core materials, hoses, and diaphragms used in marine fuel systems and peripheral devices, automotive brake hoses, air conditioning hoses, radiator hoses, radiator tanks, chemical tanks, bellows, spacers, rollers, gasoline tanks, bumpers, door trim, instrument panels, and electrical wire coating materials, and other automotive components, hoses used in automotive automatic transmission systems, and tubes, valve core materials, hoses, and diaphragms used in marine fuel systems and peripheral devices. When the member of the present disclosure is used for the above-mentioned applications, from the viewpoint of corrosion resistance and oil resistance, the thermoplastic resin is preferably at least one selected from the group consisting of polyethylene resin, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin.

[0268] <Aerospace> O-rings, tubes, packings, valve cores, hoses, seals, diaphragms, etc. used in fuel systems and peripheral devices of aircraft and rockets. Among these, the members of the present disclosure are particularly suitable for use in tubes, valve cores, hoses, and diaphragms used in fuel systems and peripheral devices of aircraft and rockets, as they require corrosion resistance. When the members of the present disclosure are used for the above applications, from the viewpoints of corrosion resistance and heat resistance, the thermoplastic resin is preferably at least one selected from the group consisting of amorphous cycloolefin resins, crystalline cycloolefin resins, and polymethylpentene resins.

[0269] <Medical> Piping materials such as medical infusion tubes, blood collection tubes, drain tubes, catheters, catheter connection parts, stents, piping, joints, tube connectors, valves, and filters; liquid, powder, and solid drug containers such as packaging, bottles, bottle caps, vials, ampoules, prefilled syringes, infusion bags, infusion bag connection parts, sealed medicine bags, press-through packages, and eye drop containers; sample containers such as urine collection bags, blood test tubes for sampling, blood collection tubes, test cells, and specimen containers; sterilized containers for medical equipment such as scalpels, forceps, gauze, and contact lenses; housings for electronic devices such as medical sensors, cardiac devices, and pacemakers; medical equipment such as inhalation masks, syringes, syringe rods, injection needles, surgical trays, protective stoppers, rubber stoppers, and endoscopes; laboratory and analytical equipment such as beakers, petri dishes, flasks, test tubes, and centrifuge tubes; medical optical components such as plastic lenses for medical testing; Artificial organs and parts thereof, such as denture bases, dentures, artificial hearts, artificial tooth roots, artificial bones, and artificial joints; etc. Among these, from the viewpoint of chemical resistance and heat resistance, the thermoplastic resin is particularly suitable for medical infusion tubes, blood collection tubes, drainage tubes, catheters, piping, joints, tube connectors, valves, bottles, bottle caps, vials, ampoules, prefilled syringes, infusion bags, urine collection bags, sampling test tubes for blood tests, blood collection tubes, test cells, specimen containers, sterilization containers, syringes, syringe rods, surgical trays, and protective stoppers. When the member of the present disclosure is used for the above applications, the thermoplastic resin is preferably at least one selected from the group consisting of polyethylene resins, polypropylene resins, amorphous cycloolefin resins, crystalline cycloolefin resins, and polymethylpentene resins.

[0270] <Information and Communications> Insulating plates for high-frequency circuits, insulating materials for connecting parts, printed wiring boards; bases and antenna covers for high-frequency vacuum tubes; wire coating materials for coaxial cables, LAN cables, etc.; optical fiber coating materials; displays such as liquid crystal displays; mobile phone components; etc. Among these, because corrosion resistance is required, the thermoplastic resin is particularly suitable for insulating plates for high-frequency circuits, insulating materials for connecting parts, printed wiring boards, bases and antenna covers for high-frequency vacuum tubes, wire coating materials for coaxial cables, LAN cables, etc., and optical fiber coating materials. When the member of the present disclosure is used for the above applications, the thermoplastic resin is preferably at least one selected from the group consisting of polyethylene resin, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin.

[0271] <Semiconductors> Chemical liquid transfer components such as chemical liquid tanks, containers, casings, piping, O-rings, tubes, packing, valve core materials, hoses, sealing materials, rolls, gaskets, washers, diaphragms, nozzles, joints, coatings, and linings for the inner surfaces of pipes used in semiconductor factories and semiconductor manufacturing-related equipment; Chemical stoppers and packaging films; Waste liquid transport components such as tanks, containers, piping, tubes, hoses, joints, and nozzles for transporting waste liquid; High-temperature liquid transport components such as containers, tubes, and hoses for transporting high-temperature liquids; Steam piping components such as tubes and hoses for steam piping; etc. Among these, from the standpoint of chemical resistance and heat resistance, the product can be suitably used for chemical liquid transfer components such as chemical liquid tanks, containers, casings, piping, O-rings, tubes, packing, valve core materials, hoses, sealing materials, gaskets, washers, diaphragms, nozzles, and joints used in semiconductor manufacturing-related equipment, and waste liquid transport components such as containers, piping, tubes, and hoses for transporting waste liquid. When the member of the present disclosure is used for the above-mentioned applications, from the viewpoint of chemical resistance and heat resistance, the thermoplastic resin is preferably at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, polymethylpentene resin, and vinyl chloride resin, even more preferably at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin, and particularly preferably at least one selected from the group consisting of amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin.

[0272] The semiconductor manufacturing equipment of the above-mentioned semiconductor manufacturing related equipment includes photolithography process equipment (coating equipment, resist stripping equipment, developing equipment (developer), baking equipment, descum equipment), thin film formation, etching, cleaning and drying equipment (vacuum deposition equipment, sputtering equipment, CVD equipment, cleaning equipment, etching equipment, drying equipment, scrub cleaning equipment), inspection and evaluation equipment and other manufacturing equipment (defect repair equipment), wafer processing equipment (wafer marking equipment), resist processing equipment (coating equipment, developing equipment, resist stripping equipment, ashing equipment, baking equipment), etching Equipment (dry etching equipment, wet etching equipment), cleaning and drying equipment (dry cleaning equipment, wet cleaning equipment, scrub cleaning equipment, drying equipment), heat treatment equipment (oxidation equipment, diffusion equipment, annealing equipment), ion implantation equipment (high current ion implantation equipment, medium current ion implantation equipment, high energy ion implantation equipment), thin film formation equipment, CVD equipment (high pressure CVD equipment, SACVD, low pressure CVD, plasma CVD equipment, metal CVD equipment, ALD equipment), sputtering equipment, other thin film formation equipment (vacuum deposition equipment, silicon epitaxial growth equipment, compound semiconductor conductor epitaxial equipment (MOCVD equipment, MBE equipment), plating equipment), inspection and evaluation equipment (Auger electron spectroscopy equipment), CMP equipment (CMP equipment, CMP cleaning equipment), other processing equipment (wafer marking equipment, back grinding machines, bump plating equipment, back grinder tape applicators, back grinders, back grinder tape peelers), dicing equipment (dicing equipment, wafer mounting equipment), bonding equipment (die bonding equipment, hybrid bonding equipment, wire bonding equipment, inner lead bonding equipment, outer lead bonding equipment, flip chip bonding equipment), packaging equipment (molding equipment, deburring equipment, solder processing equipment), other testing equipment (electron beam testing equipment, laser beam testing equipment), probing equipment (proppers), handlers, aging equipment (aging equipment, burn-in equipment, IC insertion equipment, IC extraction equipment), other inspection equipment (cold-heat testing equipment, temperature and humidity testing equipment, pressure cooker equipment, laser processing systems, various life test equipment), etc.Equipment related to semiconductor manufacturing includes various transport devices (intra-process wafer transport devices, inter-process wafer transport devices, stockers), pure water and chemical liquid equipment (pure water production equipment, ultrafiltration equipment, reverse osmosis equipment, sterilization equipment, chemical supply equipment, slurry supply equipment, chemical purification equipment, waste liquid treatment equipment), various gas equipment (gas generators, gas purification equipment, gas mixing equipment, gas detection equipment, exhaust gas treatment equipment), clean room equipment (clean benches, clean tunnels, thermal chambers, environmental testing equipment, air showers, pass boxes), and other manufacturing-related equipment (various jig cleaning and drying equipment, flow control equipment, various taping equipment, various packaging equipment, measuring equipment for liquids and various gases).

[0273] Among these, semiconductor manufacturing equipment in which corrosive substances are used within the equipment is not particularly limited, but from the viewpoint of making use of the physical properties of chemical resistance, photolithography process equipment (coating equipment, resist stripping equipment, developing equipment (developer), descum equipment), thin film formation / etching / cleaning / drying equipment (vacuum deposition equipment, CVD equipment, cleaning equipment, etching equipment, drying equipment, scrub cleaning equipment), inspection evaluation equipment and other manufacturing equipment (defect repair equipment), resist processing equipment (coating equipment, developing equipment, resist stripping equipment, ashing equipment), etching equipment (dry etching equipment, wet etching equipment), cleaning Preferred are cleaning / drying equipment (wet cleaning equipment, scrub cleaning equipment, drying equipment), CVD equipment (high-pressure CVD equipment, SACVD, low-pressure CVD, plasma CVD equipment, metal CVD equipment, ALD equipment), other thin film formation equipment (vacuum deposition equipment, silicon epitaxial growth equipment, compound semiconductor epitaxial equipment (MOCVD equipment, MBE equipment), plating equipment), CMP equipment (CMP equipment, CMP cleaning equipment), other processing equipment (bump plating equipment), aging equipment (aging equipment, burn-in equipment, IC insertion equipment, IC extraction equipment), and other inspection equipment (various life test equipment). Preferred examples of equipment related to semiconductor manufacturing equipment include pure water / chemical liquid equipment (chemical supply equipment, slurry supply equipment, chemical purification equipment, waste liquid treatment equipment), various gas equipment (gas generators, gas purification equipment, gas mixing equipment, gas detection equipment, exhaust gas treatment equipment), clean room equipment (thermal chambers, environmental testing equipment), and other manufacturing-related equipment (various jig cleaning / drying equipment, flow control equipment, various packaging equipment, measuring equipment for liquids and various gases).

[0274] As described above, the members of the present disclosure can be suitably used as semiconductor manufacturing-related equipment components (semiconductor manufacturing-related equipment articles), and because of their excellent chemical resistance, they are more suitable as components constituting semiconductor manufacturing-related equipment in which chemicals are used within the equipment, in particular as components that come into contact with chemicals.

[0275] The chemicals are not particularly limited, but include chemicals used in semiconductor manufacturing related equipment, etc. The chemicals can be used alone or in combination of two or more.

[0276] Specific examples of the chemical include TMAH ([(CH３ ) ４ N] ＋ [OH] － ), sodium hydroxide solution, sulfuric acid, isopropyl alcohol, hydrofluoric acid, mixed acid of hydrofluoric acid and nitric acid, SPM (Sulfuric Acid Hydrogen Peroxide Mixture), SC1 (NH ４ OH, H ２ O ２ and H ２ O mixture), SC2 (HCl, H ２ O ２ and H ２ Among these, TMAH, isopropyl alcohol, hydrofluoric acid, a mixed acid of hydrofluoric acid and nitric acid, SPM, SC1, SC2, phosphoric acid, and hydrochloric acid are preferred, and TMAH, hydrofluoric acid, a mixed acid of hydrofluoric acid and nitric acid, and SPM are more preferred.

[0277] Other examples of the chemical include at least one selected from the group consisting of silicon-based gases, arsenic-based gases, phosphorus-based gases, boron-based gases, metal hydride gases, metal alkyl gases, halogenated hydrocarbon gases, halogen-halide gases, nitrogen oxide gases, hydrogen sulfide gases, ammonia gas, trimethylamine gas, propane gas, trimethylaluminum gas, hydrogen gas, helium gas, nitrogen gas, oxygen gas, argon gas, and carbon dioxide gas. Also preferred as the chemical is at least one selected from the group consisting of silicon-based gases, arsenic-based gases, phosphorus-based gases, boron-based gases, metal hydride gases, metal alkyl gases, halogenated hydrocarbon gases, halogen-halide gases, nitrogen oxide gases, hydrogen sulfide gas, ammonia gas, trimethylamine gas, propane gas, trimethylaluminum gas, hydrogen gas, helium gas, nitrogen gas, oxygen gas, argon gas, and carbon dioxide gas.

[0278] Examples of the silicon-based gas include monosilane, dichlorosilane, trichlorosilane, silicon tetrachloride, silicon tetrafluoride, and disilane. Examples of the arsenic-based gas include arsine, arsenic(III) fluoride, arsenic(V) fluoride, arsenic(III) chloride, and arsenic(V) chloride. Examples of the phosphorus-based gas include phosphine, phosphorus(III) fluoride, phosphorus(V) fluoride, phosphorus(III) chloride, phosphorus(V) chloride, and phosphorus oxychloride. Examples of the boron-based gas include diborane, boron trifluoride, boron trichloride, and boron tribromide. Examples of the metal hydride gas include hydrogen selenide, monogermane, hydrogen telluride, stibine, and tin hydride. Examples of the metal alkyl gas include trialkylgallium and trialkylindium. Examples of the halogenated hydrocarbon gas include tetrafluoromethane, trifluoromethane, difluoromethane, hexafluoropropane, octafluoropropane, and octafluorocyclobutane. Examples of the halogen / halide gas include fluorine, hydrogen fluoride, chlorine, hydrogen chloride, carbon tetrachloride, hydrogen bromide, sulfur hexafluoride, nitrogen trifluoride, sulfur tetrafluoride, tungsten(VI) fluoride, molybdenum(VI) fluoride, germanium tetrachloride, tin(IV) chloride, antimony(V) chloride, tungsten(VI) chloride, and molybdenum hexachloride. Examples of the nitrogen oxide gas include nitric oxide, nitrogen dioxide, and dinitrogen monoxide. Among these, ammonia gas, nitrogen trifluoride, dinitrogen monoxide, monosilane, and octafluorocyclobutane are preferred, and ammonia gas, nitrogen trifluoride, and dinitrogen monoxide are more preferred.

[0279] The semiconductor manufacturing-related equipment member (semiconductor manufacturing-related equipment article) may have only a portion (layer) containing the thermoplastic resin, or may have a portion (layer) containing the thermoplastic resin and other portions (layers). From the viewpoint of ensuring chemical resistance, it is preferable that at least a portion of the surface that comes into contact with the chemicals is composed of a portion (layer) containing the thermoplastic resin, and it is more preferable that the entire surface that comes into contact with the chemicals is composed of a portion (layer) containing the thermoplastic resin.

[0280] For the member of the present disclosure, a test piece (size: 10 mm x 50 mm x 2 mm) of the member is immersed in each of the three chemical solutions (1), (6), and (7) described below for one week, and the relative mass after immersion, where the mass before immersion is 100, is preferably 95 to 105 in all cases. A member that satisfies this requirement has excellent corrosion resistance. The relative value is more preferably 97 or more, even more preferably 98 or more, even more preferably 99 or more, more preferably 103 or less, even more preferably 102 or less, and even more preferably 101 or less. Ideally (most preferably), it is 100.

[0281] It is more preferable that a test piece (size: 10 mm × 50 mm × 2 mm) of the component of the present disclosure is immersed in each of the 10 chemical solutions (1) to (10) described below for one week, and the relative values ​​of the mass after immersion, where the mass before immersion is taken as 100, are all within the above-mentioned range.

[0282] A test piece (size: 10 mm x 50 mm x 2 mm) of the member of the present disclosure is immersed in each of ten chemical solutions (1) to (10) described below for one week, and the relative mass values ​​after immersion are calculated, with the mass before immersion being 100. Preferably, the average of the relative values ​​for the ten chemical solutions is 95 to 105, and the standard deviation is 20 or less. A member that satisfies these requirements has excellent corrosion resistance. The average of the relative values ​​is more preferably 97 or more, even more preferably 98 or more, even more preferably 99 or more, more preferably 103 or less, even more preferably 102 or less, and even more preferably 101 or less. Ideally (most preferably) it is 100. The standard deviation of the relative values ​​is more preferably 10 or less, even more preferably 5 or less, even more preferably 3 or less, even more preferably 2 or less, particularly preferably 1 or less, and may be 0 or more. Ideally (most preferably) it is 0.

[0283] The chemical solutions used for immersing the test pieces are as follows: (1) 25% by mass TMAH ([(CH ３ ) ４ N]＋ [OH] － ) (80°C) (2) 98% by mass sulfuric acid (90°C) (3) 100% by mass isopropyl alcohol (80°C) (4) 49% by mass hydrofluoric acid (70°C) (5) mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:5) (20°C) (6) mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:100) (20°C) (7) SPM (a mixture of 98% by mass sulfuric acid and 30 to 36% by mass hydrogen peroxide solution in a volume ratio of 2:1) (80°C) (8) SC1 (a mixture of 25 to 28% by mass ammonia water, 30 to 36% by mass hydrogen peroxide solution, and deionized water in a volume ratio of 1:1:5) (70°C) (9) SC2 (a mixture of 35 to 37% by mass hydrochloric acid, 30 to 36% by mass hydrogen peroxide, and deionized water in a volume ratio of 1:1:4) (70°C) (10) 85% by mass phosphoric acid (80°C)

[0284] In the member of the present disclosure, when a test piece (size: 10 mm x 50 mm x 2 mm) of the member is immersed in 3.6 mass% hydrochloric acid at 23°C for one week, the amount of metal elution (by mass) of each of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) is preferably 20 ppb or less, more preferably 10 ppb or less, even more preferably 6 ppb or less, even more preferably 3 ppb or less, even more preferably 2 ppb or less, even more preferably 1.6 ppb or less, and particularly preferably 1 ppb or less. Ideally (most preferably) 0 ppb, but it may be an amount below the detection limit or more.

[0285] When a test piece (size: 10 mm × 50 mm × 2 mm) of the member of the present disclosure is immersed in each of the 10 chemical solutions (1) to (10) described above for one week and the change in color before and after immersion is confirmed by the yellowing index (ΔYI), the number of chemical solutions in which the ΔYI changed by 3 or more is preferably 4 or less, more preferably 3 or less, and even more preferably 2 or less, and may also be 0 or more, or 1 or more.

[0286] In terms of heat resistance, the member of the present disclosure preferably has a deflection temperature under load of 1.82 MPa of 50° C. or higher, more preferably 60° C. or higher, even more preferably 70° C. or higher, even more preferably 85° C. or higher, particularly preferably 120° C. or higher, and may be 200° C. or lower, or may be 150° C. or lower. The deflection temperature under load is measured at a load of 1.82 MPa in accordance with ASTM D648.

[0287] The member of the present disclosure can be manufactured by molding a material containing the above-mentioned thermoplastic resin and, if necessary, the other components described above. The molding method is not particularly limited, and known methods such as extrusion molding, injection molding, transfer molding, blow molding, inflation molding, and compression molding can be used.

[0288] The present disclosure also relates to semiconductor manufacturing-related equipment equipped with the above-described member of the present disclosure. By using the member of the present disclosure, the equipment can be endowed with excellent corrosion resistance.

[0289] The semiconductor manufacturing-related device of the present disclosure is preferably one of the semiconductor manufacturing devices and related devices described above. Also, the semiconductor manufacturing-related device of the present disclosure is preferably at least one selected from the group consisting of semiconductor manufacturing devices and related devices for semiconductor manufacturing devices.

[0290] The semiconductor manufacturing equipment is preferably at least one selected from the group consisting of photolithography process equipment, thin film formation / etching / cleaning / drying equipment, inspection / evaluation equipment / manufacturing equipment, resist processing equipment, etching equipment, cleaning / drying equipment, CVD equipment, thin film formation equipment, CMP equipment, processing equipment, aging equipment, and inspection equipment, and the semiconductor manufacturing equipment-related equipment is preferably at least one selected from the group consisting of pure water / chemical equipment, gas equipment, clean room equipment, and manufacturing-related equipment.

[0291] the photolithography process equipment is at least one selected from the group consisting of a coating equipment, a resist stripping equipment, a developing equipment (developer), and a descum equipment; the thin film formation / etching / cleaning / drying equipment is at least one selected from the group consisting of a vacuum deposition equipment, a cleaning equipment, a drying equipment, and a scrub cleaning equipment; the inspection / evaluation equipment / manufacturing equipment is a defect repair equipment; the resist processing equipment is at least one selected from the group consisting of a coating equipment, a developing equipment, a resist stripping equipment, and an ashing equipment; the etching equipment is at least one selected from the group consisting of a dry etching equipment and a wet etching equipment; the cleaning / drying equipment is at least one selected from the group consisting of a wet cleaning equipment, a scrub cleaning equipment, and a drying equipment; the CVD equipment is at least one selected from the group consisting of a high-pressure CVD equipment, a SACVD equipment, a low-pressure CVD equipment, a plasma CVD equipment, a metal CVD equipment, and an ALD equipment; the thin film forming apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a silicon epitaxial growth apparatus, a compound semiconductor epitaxial apparatus (MOCVD apparatus, MBE apparatus), and a plating apparatus; the CMP apparatus is at least one selected from the group consisting of a CMP apparatus and a CMP cleaning apparatus; the processing apparatus is a bump plating apparatus; the aging apparatus is at least one selected from the group consisting of an aging apparatus, a burn-in apparatus, an IC insertion apparatus, and an IC extraction apparatus; the inspection apparatus is a life test apparatus; the pure water / chemical liquid apparatus is at least one selected from the group consisting of a chemical supply apparatus, a slurry supply apparatus, a chemical purification apparatus, and a waste liquid treatment apparatus; the gas apparatus is at least one selected from the group consisting of a gas generation apparatus, a gas purification apparatus, a gas mixing apparatus, a gas detection apparatus, and an exhaust gas treatment apparatus; the clean room apparatus is at least one selected from the group consisting of a thermal chamber and an environmental test apparatus; The manufacturing-related equipment is preferably at least one selected from the group consisting of jig cleaning / drying equipment, flow rate control equipment, packaging equipment, and liquid / gas measuring equipment.

[0292] Although the embodiments have been described above, it will be understood that various changes in form and details can be made without departing from the spirit and scope of the claims.

[0293] The present disclosure will now be described in more detail with reference to examples, but the present disclosure is not limited to these examples.

[0294] Various physical properties were measured by the following methods.

[0295] <Chemical Resistance (Corrosion Resistance) Test> The resin sheets obtained in the Examples and Comparative Examples were cut into a size of 10 mm x 50 mm x 2 mm to prepare test specimens. The test specimens were dried at 60°C for 2 hours. After drying, the mass of the test specimens before immersion was measured at room temperature (20°C). After measurement, the test specimens were completely immersed in each of the chemical solutions (1) to (10) below and held for 1 week (168 hours). After holding, the test specimens were washed with pure water, water droplets on the surface were wiped off, and the specimens were dried at 60°C for 12 hours. The mass of the test specimens after immersion was measured at room temperature (20°C). From the measured masses before and after immersion, the relative value of the mass after immersion was calculated, with the mass before immersion being set at 100. The average and standard deviation of the masses (relative values) after immersion for the 10 types (1) to (10) were also calculated. (Chemical Solutions) (1) 25% by mass TMAH([(CH ３ ) ４ N] ＋ [OH] －) (80°C) (2) 98% by mass sulfuric acid (90°C) Oxidation-reduction potential (vs. NHE): 1.1 V (3) 100% by mass isopropyl alcohol (80°C) (4) 49% by mass hydrofluoric acid (70°C) (5) Mixed acid of hydrofluoric acid and nitric acid (mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:5) (20°C) (6) Mixed acid of hydrofluoric acid and nitric acid (mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:100) (20°C) (7) SPM (mixture of 98% by mass sulfuric acid and 30 to 36% by mass hydrogen peroxide solution in a volume ratio of 2:1) (80°C) Oxidation-reduction potential (vs. NHE): 1.8 V (8) SC1 (a mixture of 25 to 28 mass% ammonia water, 30 to 36 mass% hydrogen peroxide water, and deionized water in a volume ratio of 1:1:5) (70°C) Oxidation-reduction potential (vs. NHE): 1.2 V (9) SC2 (a mixture of 35 to 37 mass% hydrochloric acid, 30 to 36 mass% hydrogen peroxide water, and deionized water in a volume ratio of 1:1:4) (70°C) Oxidation-reduction potential (vs. NHE): 1.6 V (10) 85 mass% phosphoric acid (80°C)

[0296] <Changes in Appearance> The change in color of the test piece before and after immersion in the chemical solutions was confirmed by measuring the yellowing index (ΔYI), and the number of chemical solutions for which the ΔYI changed by 3 or more was used for evaluation. The yellowing index was measured in accordance with JIS K 7373.

[0297] <Deflection temperature under load> The deflection temperature under load was measured in accordance with ASTM D648 at a load of 1.82 MPa.

[0298] <Metal elution test> The resin sheets obtained in the examples and comparative examples were cut into a size of 10 mm x 50 mm x 2 mm to prepare test specimens. As a pre-cleaning step, the test specimens were immersed in 3.6% by mass hydrochloric acid for 1 hour, and then washed with running pure water. The test specimens were then immersed in 100 mL of 3.6% by mass hydrochloric acid at 23 ° C. One week (168 hours) after the start of immersion, a portion of each immersion solution was extracted, and the metal concentrations of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) were measured using ICP-MSI (Agilent 8900 manufactured by Agilent Technologies) to determine the amount of metal elution.

[0299] The materials used in the examples and comparative examples are as follows: (Resin) LDPE: "Novatec LD LJ802" manufactured by Japan Polyethylene Co., Ltd., melting point: 106°C, heat of fusion: 100 J / g, density: 0.921 g / m ３ HDPE: "Novatec HD HJ360" manufactured by Japan Polyethylene Co., Ltd., melting point: 130°C, heat of fusion: 180 J / g, density: 0.951 g / m ３ Ultra-high molecular weight PE: "Lubmer L4000" manufactured by Mitsui Chemicals, Inc., melting point: 138°C, heat of fusion: 127 J / g, density: 0.967 g / m ３ PP: "Novatec PP MA3" manufactured by Japan Polypropylene Corporation, melting point: 163°C, heat of fusion: 84 J / g, density: 0.90 g / m ３ PMP: "TPX RT31" manufactured by Mitsui Chemicals, Inc., melting point: 232°C, heat of fusion: 42 J / g, density: 0.83 g / m ３ Amorphous COP: "ZEONEX T62R" manufactured by Zeon Corporation, glass transition temperature: 154°C, density: 1.01 g / m ３ Crystalline COP: A crystalline hydrogenated ring-opening polymer (syndiotactic crystalline dicyclopentadiene ring-opening polymer hydrogenated) synthesized as in Synthesis Example 1 described later was used. PVC: "Vinica D7653" manufactured by Mitsubishi Chemical Corporation, glass transition temperature: 72°C, density: 1.35 g / m ３ , chlorine content: 57% by mass PEEK: "VICTREX PEEK 450G" manufactured by Victrex, melting point: 338 ° C., heat of fusion: 51 J / g, density: 1.30 g / m ３ PPS: "FZ-2100" manufactured by DIC Corporation, melting point: 277°C, heat of fusion: 33 J / g, density: 1.34 g / m ３ PEI: "Duratron U1000PEI" manufactured by Mitsubishi Chemical Advanced Materials Corporation, glass transition temperature: 217°C, density: 1.27 g / m ３

[0300] Synthesis Example 1 (Synthesis of Crystalline COP) <Catalyst Synthesis> (Synthesis of bis{3,3'-di(t-butyl)-5,5',6,6'-tetramethyl-2,2'-biphenoxy}phenylimidotungsten(VI)) In a glass reactor equipped with a stirrer, tungsten phenylimidotetrachloride diethyl ether complex (W(=NPh)Cl ４ (Et２ 5.80 g of 3,3'-di(t-butyl)-5,5',6,6'-tetramethyl-2,2'-biphenoxylithium and 60 ml of diethyl ether were added, and the mixture was cooled to -78°C. Then, 8.38 g of 3,3'-di(t-butyl)-5,5',6,6'-tetramethyl-2,2'-biphenoxylithium dissolved in 60 ml of diethyl ether was added. The mixture was gradually returned to room temperature and reacted for 20 hours. After the reaction, diethyl ether was distilled off from the reaction mixture, and the mixture was dissolved in a 1 / 3 toluene / hexane mixed solvent (weight ratio). The white precipitate was filtered through Celite, and the solvent was completely distilled off from the solution, yielding a red solid in 94% yield. The resulting mixture was cooled to -30°C, allowed to stand, and recrystallized to obtain a solid product consisting of red needle-like fine crystals. The yield of the obtained solid was 8.96 g (76% yield). This solid product was １ H-NMR, １３ C-NMR and elemental analysis identified it as bis{3,3'-di(t-butyl)-5,5',6,6'-tetramethyl-2,2'-biphenoxy}phenylimidotungsten(VI).

[0301] <Polymerization> 0.1112 g of bis{3,3'-di(t-butyl)-5,5',6,6'-tetramethyl-2,2'-biphenoxy}phenylimidotungsten(VI) obtained in Synthesis Example and 8 ml of toluene were added to a glass reactor equipped with a stirrer, and the mixture was cooled to -78°C. A solution of 0.01452 g of n-butyllithium in 2 ml of hexane was then added, and the mixture was allowed to warm to room temperature and react for 20 minutes. Next, 15.0 g of dicyclopentadiene, 54 g of cyclohexane, and 0.64 g of 1-hexene were added to the resulting reaction mixture, and polymerization was carried out at 80°C. A white precipitate precipitated immediately after the initiation of the polymerization reaction. After the reaction was allowed to proceed for 2 hours, a large amount of acetone was poured into the polymerization reaction solution to flocculate the precipitate, which was then filtered, washed, and dried under reduced pressure at 40°C for 24 hours. The yield of the resulting ring-opened polymer was 14.8 g, and the number average molecular weight was 18,000. Next, 6.0 g of the obtained ring-opened polymer and 95 g of cyclohexane were added to an autoclave equipped with a stirrer. Then, RuHCl(CO)(PPh ３A dispersion of 40.00314 g of methyl methyl acrylate was further added, and the hydrogenation reaction was carried out at 160°C under a hydrogen pressure of 4.0 MPa for 12 hours. The hydrogenation reaction solution was poured into a large amount of acetone to completely precipitate the resulting hydrogenated ring-opening polymer. The precipitate was filtered, washed, and then dried under reduced pressure at 40°C for 24 hours. The hydrogenation rate of the resulting hydrogenated ring-opening polymer was 99% or more, and the racemo-dyad ratio was 5% or less. The melting point of the vacuum-dried hydrogenated ring-opening polymer was measured as is as a sample. The vacuum-dried hydrogenated ring-opening polymer was heated at 300°C for 10 minutes to fully melt it, then cooled to room temperature at a rate of 10°C / min to fully crystallize it. The melting point of the sample measured was 289°C. The analysis was carried out using the following methods (1) to (4). (1) Number-average molecular weight of the ring-opening polymer １ Based on the H-NMR measurement, the ratio of the number of hydrogen atoms present at the polymer chain terminals to the number of hydrogen atoms present in the polymer chain other than the terminals was determined, and the number average molecular weight of the ring-opened polymer was calculated based on this ratio. １ It was determined based on H-NMR measurement. (3) Melting point of crystalline hydrogenated ring-opening polymer: It was measured by raising the temperature at 10°C / min using a differential scanning calorimeter. (4) Racemo-dyad ratio of crystalline hydrogenated ring-opening polymer: It was measured by heating at 150°C using orthodichlorobenzene-d4 as a solvent. １３ C-NMR measurement was performed and the peak intensity was determined based on the intensity ratio of the signal at 43.35 ppm derived from the meso dyad and the signal at 43.43 ppm derived from the racemo dyad.

[0302] Examples 1 to 4 Pellets of the resins shown in Table 1 were heated and melted in a hot press at 220°C for 10 minutes, molded into a shape of 10 mm x 500 mm x 2 mm, and then cooled to room temperature at a rate of 10°C / min to produce resin sheets (components). Chemical resistance tests and evaluation of appearance changes were performed using the resulting resin sheets. Measurements of deflection temperature under load and metal elution tests were also performed. The results are shown in Table 1.

[0303] Example 5 Pellets of the resins shown in Table 1 were heated and melted in a hot press at 280°C for 10 minutes, molded into a shape of 10 mm x 500 mm x 2 mm, and then cooled to room temperature at a rate of 10°C / min to produce resin sheets (members). Using the resulting resin sheets, chemical resistance tests and evaluations of appearance changes were performed in the same manner as in Examples 1 to 4. Measurements of deflection temperature under load and metal elution tests were also performed. The results are shown in Table 1.

[0304] Example 6 Pellets of the resins shown in Table 1 were heated and melted in a hot press at 230°C for 10 minutes, molded into a shape of 10 mm x 500 mm x 2 mm, and then cooled to room temperature at a rate of 10°C / min to produce resin sheets (members). Using the resulting resin sheets, chemical resistance tests and evaluations of appearance changes were performed in the same manner as in Examples 1 to 4. Measurements of deflection temperature under load and metal elution tests were also performed. The results are shown in Table 1.

[0305] Example 7 The crystalline COP obtained in Synthesis Example 1 was heated to 320°C for 10 minutes to melt and mold it into a shape of 10 mm x 500 mm x 2 mm, and then cooled to room temperature at a rate of 10°C / min to produce a resin sheet (member). Using the obtained resin sheet, a chemical resistance test, an evaluation of appearance change, measurement of deflection temperature under load, and a metal elution test were performed in the same manner as in Examples 1 to 4. The results are shown in Table 1.

[0306] Example 8 Pellets of the resins shown in Table 1 were heated and melted in a hot press at 180°C for 10 minutes, molded into a shape of 10 mm x 500 mm x 2 mm, and then cooled to room temperature at a rate of 10°C / min to produce resin sheets (members). Using the obtained resin sheets, chemical resistance tests, evaluation of appearance changes, and measurement of deflection temperature under load were performed in the same manner as in Examples 1 to 4. The results are shown in Table 1.

[0307] Comparative Examples 1 and 3: Pellets of the resins shown in Table 1 were heated and melted in a hot press at 350°C for 10 minutes, molded into a shape of 10mm x 500mm x 2mm, and then cooled to room temperature at a rate of 10°C / min to produce resin sheets (members). Using the obtained resin sheets, chemical resistance tests and evaluations of appearance changes were carried out in the same manner as in Examples 1 to 4. The results are shown in Table 1.

[0308] Comparative Example 2 Pellets of the resins shown in Table 1 were heated and melted in a hot press at 300°C for 10 minutes, molded into a shape of 10 mm x 500 mm x 2 mm, and then cooled to room temperature at a rate of 10°C / min to produce a resin sheet (member). Using the obtained resin sheet, a chemical resistance test and an evaluation of appearance change were carried out in the same manner as in Examples 1 to 4. The results are shown in Table 1.

[0309]

[0310] The members of the examples were suitable for use as members (components) in semiconductor manufacturing related equipment where chemicals are used.

Claims

1. A component comprising at least one thermoplastic resin selected from the group consisting of polyolefin resins and chlorine-based resins, said component being at least one selected from the group consisting of building materials, mobility materials, aerospace materials, semiconductor materials, and information and communications materials, and which comes into contact with corrosive substances.

2. The member according to claim 1, wherein said thermoplastic resin has crystallinity.

3. The member according to claim 1 or 2, wherein the polyolefin resin is at least one selected from the group consisting of polyethylene resin, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin and polymethylpentene resin.

4. The member according to any one of claims 1 to 3, wherein the chlorine-based resin is at least one selected from the group consisting of vinyl chloride resin, chlorinated vinyl chloride resin, and chlorinated polyethylene resin.

5. A member according to any one of claims 1 to 4, wherein the thermoplastic resin is at least one selected from the group consisting of polyethylene resin, polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, polymethylpentene resin, and vinyl chloride resin.

6. A member according to any one of claims 1 to 4, wherein the thermoplastic resin is at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin.

7. The member according to any one of claims 1 to 6, wherein the member is at least one selected from the group consisting of a container, a pipe, a nozzle, a tube, a tank, a joint, a valve, a pump, a spin chuck, an O-ring, a packing, a gasket, a washer, and a sealing material.

8. The member according to any one of claims 1 to 7, wherein the thermoplastic resin is at least one selected from the group consisting of polypropylene resin, amorphous cycloolefin resin, crystalline cycloolefin resin, and polymethylpentene resin, and the member is at least one selected from the group consisting of containers, piping, nozzles, tubes, tanks, joints, valves, pumps, spin chucks, O-rings, packing, gaskets, washers, and sealing materials.

9. The member according to any one of claims 1 to 8, wherein the pH of the corrosive substance is 6 or less or 8 or more.

10. The member according to any one of claims 1 to 9, wherein the oxidation-reduction potential (vs. NHE) of the corrosive substance is -2.0 to 3.0V.

11. The member according to any one of claims 1 to 10, wherein the corrosive substance is at least one selected from the group consisting of acidic substances, basic substances, oxidizing substances, organic solvents, and salt water.

12. The member according to claim 11, wherein the acidic substance is at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid.

13. The basic substance is TMAH([(CH ３ ) ４ N] ＋ [OH] － 13. The member according to claim 11, wherein the chemical is at least one selected from the group consisting of an aqueous solution of sodium hydroxide, aqueous ammonia, and a mixed solution of aqueous hydrogen peroxide and aqueous ammonia.

14. The corrosive substance is sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed solution of hydrogen peroxide and hydrochloric acid, a mixed solution of hydrogen peroxide and sulfuric acid, TMAH([(CH ３ ) ４ N] ＋ [OH] － ), a sodium hydroxide aqueous solution, a mixed chemical solution of hydrogen peroxide and ammonia water, and at least one selected from the group consisting of isopropyl alcohol.

15. The member according to any one of claims 1 to 14, which is a member for semiconductor manufacturing related equipment.

16. The member according to claim 15, wherein the semiconductor manufacturing related equipment is an equipment in which chemicals are used.

17. A component according to any one of claims 1 to 16, wherein a test piece of the component (size: 10 mm x 50 mm x 2 mm) is immersed in each of the following three chemical solutions for one week, and the relative mass after immersion, with the mass before immersion being 100, is 95 to 105 in all cases. (Chemical solution) 25 mass% TMAH([(CH ３ ) ４ N] ＋ [OH] － ) (80°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% hydrofluoric acid and 69-71% nitric acid at a volume ratio of 1:100) (20°C) SPM (a mixture of 98% sulfuric acid and 30-36% hydrogen peroxide at a volume ratio of 2:1) (80°C) 18. The component according to any one of claims 1 to 17, wherein a test piece of the component (size: 10 mm x 50 mm x 2 mm) is immersed in each of the following 10 chemical solutions for one week, and the relative values ​​of the mass after immersion are calculated, with the mass before immersion being 100. The average of the relative values ​​for the 10 chemical solutions is 95 to 105, and the standard deviation is 20 or less. (Chemical solution) 25 mass% TMAH([(CH ３ ) ４ N] ＋ [OH] － ) (80°C) 98% by mass sulfuric acid (90°C) 100% by mass isopropyl alcohol (80°C) 49% by mass hydrofluoric acid (70°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:5) (20°C) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% by mass hydrofluoric acid and 69 to 71% by mass nitric acid in a volume ratio of 1:100) (20°C) SPM (a mixture of 98% by mass sulfuric acid and 30 to 36% by mass hydrogen peroxide solution in a volume ratio of 2:1) (80°C) SC1 (a mixture of 25 to 28% by mass ammonia water, 30 to 36% by mass hydrogen peroxide solution, and deionized water in a volume ratio of 1:1:5) (70°C) SC2 (a mixture of 35-37% by mass hydrochloric acid, 30-36% by mass hydrogen peroxide, and deionized water in a volume ratio of 1:1:4) (70°C) 85% by mass phosphoric acid (80°C) 19. The member according to any one of claims 1 to 18, which has a deflection temperature under load of 50°C or higher at a load of 1.82 MPa.

20. A component according to any one of claims 1 to 19, wherein when a test piece (size: 10 mm x 50 mm x 2 mm) of the component is immersed in 3.6 mass % hydrochloric acid at 23°C for one week, the amount of metal elution of each of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) is 20 ppb or less.

21. A semiconductor manufacturing related device equipped with a member according to any one of claims 1 to 20.

22. The semiconductor manufacturing related equipment according to claim 21, which is at least one selected from the group consisting of semiconductor manufacturing equipment and equipment related to semiconductor manufacturing equipment.

23. The semiconductor manufacturing related equipment according to claim 22, wherein the semiconductor manufacturing equipment is at least one selected from the group consisting of photolithography process equipment, thin film formation / etching / cleaning / drying equipment, inspection / evaluation equipment / manufacturing equipment, resist processing equipment, etching equipment, cleaning / drying equipment, CVD equipment, thin film formation equipment, CMP equipment, processing equipment, aging equipment, and inspection equipment, and the semiconductor manufacturing equipment related equipment is at least one selected from the group consisting of pure water / chemical equipment, gas equipment, clean room equipment, and manufacturing related equipment.

24. The photolithography process equipment is at least one selected from the group consisting of a coating equipment, a resist stripping equipment, a developing equipment (developer), and a descum equipment; the thin film formation / etching / cleaning / drying equipment is at least one selected from the group consisting of a vacuum deposition equipment, a cleaning equipment, a drying equipment, and a scrub cleaning equipment; the inspection / evaluation equipment / manufacturing equipment is a defect repair equipment; the resist processing equipment is at least one selected from the group consisting of a coating equipment, a developing equipment, a resist stripping equipment, and an ashing equipment; the etching equipment is at least one selected from the group consisting of a dry etching equipment and a wet etching equipment; the cleaning / drying equipment is at least one selected from the group consisting of a wet cleaning equipment, a scrub cleaning equipment, and a drying equipment; the CVD equipment is at least one selected from the group consisting of a high-pressure CVD equipment, a SACVD equipment, a low-pressure CVD equipment, a plasma CVD equipment, a metal CVD equipment, and an ALD equipment; the thin film forming apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a silicon epitaxial growth apparatus, a compound semiconductor epitaxial apparatus (MOCVD apparatus, MBE apparatus), and a plating apparatus; the CMP apparatus is at least one selected from the group consisting of a CMP apparatus and a CMP cleaning apparatus; the processing apparatus is a bump plating apparatus; the aging apparatus is at least one selected from the group consisting of an aging apparatus, a burn-in apparatus, an IC insertion apparatus, and an IC extraction apparatus; the inspection apparatus is a life test apparatus; the pure water / chemical liquid apparatus is at least one selected from the group consisting of a chemical supply apparatus, a slurry supply apparatus, a chemical purification apparatus, and a waste liquid treatment apparatus; the gas apparatus is at least one selected from the group consisting of a gas generation apparatus, a gas purification apparatus, a gas mixing apparatus, a gas detection apparatus, and an exhaust gas treatment apparatus; the clean room apparatus is at least one selected from the group consisting of a thermal chamber and an environmental test apparatus; 24. The semiconductor manufacturing related equipment according to claim 23, wherein the manufacturing related equipment is at least one selected from the group consisting of a jig cleaning / drying device, a flow control device, a packaging device, and a liquid / gas measuring device.

Images