Substrate warpage control apparatus based on torque of clamp drive unit, substrate processing apparatus comprising same, and substrate warpage control method using same

Abstract

A substrate processing apparatus, according to an embodiment of the present invention, comprises: a support unit for supporting a substrate; a clamp ring for pressing a peripheral portion of the substrate in relation to warpage thereof; a drive unit for driving the clamp ring up and down to adjust a pressing force applied to the peripheral portion of the substrate; a torque measurement unit for measuring, on the basis of a torque measurement sensor or power of the drive unit, torque applied to the drive unit as the clamp ring is driven up and down by the drive unit; and a control unit for adjusting the pressing force of the clamp ring on the basis of a torque measurement value measured by the torque measurement unit.

Description

Clamp drive torque-based substrate warpage control device, substrate processing device including the same, and substrate warpage control method using the same

[0001] The present invention relates to a device and a method for controlling substrate warpage based on a clamp drive torque, and more particularly, to a device for controlling substrate warpage based on the torque of a drive that applies a clamp load to control substrate warpage, a substrate processing device including the same, and a substrate processing method using the same. The present invention is derived from research conducted as part of the Small and Medium Business Technology Innovation Development (Small and Medium Business Accounting) of the Ministry of SMEs and Startups (Project Identification Number: 1425176307, Subproject Number: S3300781, Research Project Name: Plasma Processing Device for Fan-Out Semiconductor Packaging, Organizer: PSK Holdings Co., Ltd., Research Period: 2023.01.01~2023.12.31).

[0002]

[0003] Semiconductor integrated circuits are generally very small and thin silicon chips, but they are composed of various electronic components, and go through various manufacturing processes, including photo processes, etching processes, deposition processes, reflow processes, and packaging processes, until a single semiconductor chip is produced.

[0004] As various materials are deposited on a semiconductor substrate, such as a wafer, warpage may occur in the semiconductor substrate due to factors such as different thermal expansion rates. This warpage may vary depending on the wafer material and / or thickness (e.g., silicon, glass, etc.).

[0005] When plasma treatment is performed while the wafer is in a state where bending deformation occurs in this way, local plasma may be generated on the lower surface of the wafer, which may cause damage to the wafer and components. To prevent this, a clamp ring called a window clamp is placed on the edge of the wafer, and a clamp load is applied to the edge of the wafer by the clamp ring, thereby preventing bending deformation of the wafer. At this time, the pressing force applied to the wafer can be controlled by providing a device that drives the clamp ring upward and downward to pressurize the edge of the wafer. However, the conventional method of providing a pressing force to the edge of the wafer may cause damage to the substrate and the material on the substrate due to differences in the degree of warpage of each substrate or differences in the physical properties between the substrate and the material on the substrate due to the load applied by the clamp and the upward and downward driving device.

[0006]

[0007] The present invention provides a warpage control device that controls the warpage of a substrate based on the torque of a clamp driving unit that applies a clamp load to control the warpage of a substrate, a substrate processing device including the same, and a substrate processing method using the same.

[0008] In addition, the present invention provides a warpage control device, a substrate processing device, and a warpage control method that can suppress warping of a substrate while preventing the substrate from being broken or damaged due to the clamp driving unit pressurizing the substrate with an excessive pressurizing load exceeding the allowable load value set for the substrate.

[0009] The technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0010]

[0011] A substrate processing device according to an embodiment of the present invention includes: a support for supporting a substrate; a clamp ring configured to pressurize a peripheral portion of the substrate in relation to a warpage of the substrate; a driving unit configured to adjust a pressing force applied to the peripheral portion of the substrate by driving the clamp ring up and down; a torque measuring unit configured to measure a torque applied to the driving unit as the clamp ring is driven up and down by the driving unit based on a torque measuring sensor or power of the driving unit; and a control unit configured to adjust a pressing force of the clamp ring based on a torque measurement value measured by the torque measuring unit.

[0012] The driving unit may include a clamp shaft coupled to the clamp ring and configured to pressurize the clamp ring; and a driving motor configured to drive the clamp shaft upward and downward. The torque measuring unit may measure a torque applied to the driving motor as the clamp shaft is driven upward and downward.

[0013] The substrate processing device according to an embodiment of the present invention may further include a data analysis unit that compares the torque measurement value measured by the torque measurement unit with a set maximum load value. The control unit may stop the actuator operation of the driving unit when the torque measurement value measured by the torque measurement unit exceeds the maximum load value. The maximum load value may be set according to physical property values ​​including the thickness and material of the substrate and the degree of warpage generation of the substrate.

[0014] The method may further include a clamping device provided between the driving unit and the clamp ring and configured to distribute a load applied by the clamp ring to the peripheral portion of the substrate as the driving unit descends.

[0015] The above clamp ring may include a clamp ring body in a ring shape; and a plurality of connecting pieces formed by protruding from the clamp ring body and having insertion holes so that the plurality of clamping devices are each inserted.

[0016] The clamping device may include a clamp guide coupled to the driving unit and raised and lowered by the driving unit, and having a damping groove at an upper end; a damping member coupled to the clamp guide and driven integrally, the damping member having a lower end received in the damping groove; and a damping guide having a lower end inserted into the damping groove and disposed between the clamp guide and the damping member, such that the damping member disperses the pressure applied to the clamp ring when the driving unit is driven downward.

[0017] A substrate processing method according to an embodiment of the present invention comprises: (A) a step of providing a pressing force to a peripheral portion of a substrate supported on a support portion by a clamp ring driven by a driving unit; (B) a step of measuring a torque applied to the driving unit as the clamp ring is driven up and down by the driving unit based on a torque measuring sensor or power of the driving unit by a torque measuring unit; and (C) a step of adjusting a pressing force of the clamp ring based on a torque measurement value of the torque measuring unit by a control unit.

[0018] A substrate processing method according to an embodiment of the present invention may further include a step (D) of comparing the torque measurement value measured by the torque measurement unit with a set maximum load value by a data analysis unit. The step (C) may include a step of stopping the actuator operation of the driving unit when the torque measurement value measured by the torque measurement unit exceeds the maximum load value.

[0019]

[0020] According to an embodiment of the present invention, a warpage control device and a warpage control method are provided for controlling warpage of a substrate based on the torque of a clamp driving unit that applies a clamp load to control warpage of the substrate.

[0021] According to an embodiment of the present invention, in the process of suppressing warpage (bending) of a substrate by pressing the edge of the substrate with a clamp ring by a clamp driving unit, the load value applied by the clamp driving unit is measured in real time and controlled to apply a load that does not break or damage the substrate, thereby preventing the substrate from being broken or damaged due to the clamp driving unit applying an excessive pressurized load exceeding the allowable load value set for the substrate, thereby suppressing warping of the substrate.

[0022] The effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention belongs from the description below.

[0023]

[0024] FIG. 1 is a perspective view of a substrate processing device according to an embodiment of the present invention.

[0025] Figure 2 is a cross-sectional view taken along line A-A' shown in Figure 1.

[0026] Figure 3 is an enlarged view of part B shown in Figure 2.

[0027] Figure 4 is a configuration diagram of a substrate processing device according to an embodiment of the present invention.

[0028] Figure 5 is an exemplary diagram of a substrate processing device according to an embodiment of the present invention.

[0029] Figure 6 is a cross-sectional view of a substrate processing device according to another embodiment of the present invention.

[0030] Fig. 7 is an enlarged view showing the first embodiment of part C shown in Fig. 6.

[0031] Fig. 8 is an enlarged view showing a second embodiment of part C shown in Fig. 6.

[0032] Figure 9 is a flowchart of a substrate processing method according to an embodiment of the present invention.

[0033] Figure 10 is a flowchart of a substrate processing method according to an embodiment of the present invention.

[0034]

[0035] Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. The embodiments of the present invention may be modified in various ways, and the scope of the present invention should not be construed as being limited to the embodiments described below. These embodiments are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes of elements in the drawings may be exaggerated for clarity.

[0036] In order to clearly solve the problem to be solved by the present invention, the composition of the invention is described in detail based on a preferred embodiment of the present invention with reference to the attached drawings. In assigning reference numbers to components in the drawings, the same reference numbers are assigned to the same components even if they are in different drawings, and it is made clear in advance that components in other drawings may be cited when necessary when describing the drawings.

[0037] FIG. 1 is a perspective view of a substrate processing device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line A-A' of FIG. 1, FIG. 3 is an enlarged view of section B of FIG. 2, and FIG. 4 is a configuration diagram of a substrate processing device according to an embodiment of the present invention. Referring to FIGS. 1 to 4, the substrate processing device according to an embodiment of the present invention is a device for performing a process of processing a substrate (1).

[0038] The substrate processing device may be a device that performs, for example, a package process such as a fan-out package, a plasma process, a reflow process, an etching process, a deposition process, a photo process, or a heat treatment process. The substrate (1) processed by the substrate processing device may be provided as a semiconductor wafer, a mask, a glass substrate, or a liquid crystal display (LCD) panel, but is not limited thereto. Although not shown, these processes may be performed in a space in a chamber where the substrate is processed, and various components required for processing the substrate (1) may be provided inside the chamber depending on the type of substrate processing process performed by the substrate processing device.

[0039] A substrate processing device according to an embodiment of the present invention may include a support unit (1000), a clamp ring (2000), a driving unit (3000), a clamping device (4000), a torque measuring unit (5000), a data analyzing unit (6000), a warpage prediction unit (7000), and a control unit (8000). The torque measuring unit (5000), the data analyzing unit (6000), the warpage prediction unit (7000), and the control unit (8000) correspond to a warpage control device according to an embodiment of the present invention.

[0040] The support member (1000) may be configured to support the substrate. For example, the support member (1000) may include a support member such as an electrostatic chuck that supports the lower surface (bottom surface) of the substrate (1), but is not limited thereto. The support member (1000) may be insulated by an insulator. Although not shown, the support member (1000) may be provided with a plurality of lift pins. As is well known, the lift pins are devices for elevating the substrate (1), and may be configured to receive the substrate (1) and the clamp ring (2000) that are brought into the chamber through the inlet / outlet by the end effector hand of a substrate transport robot for a substrate processing process from the end effector hand and lower them onto the support member (1000), and to raise the processed substrate (1) and the clamp ring (2000) from the support member and transfer them to the end effector hand.

[0041] When the substrate (1) and the clamp ring (2000) are lifted by a plurality of lift pins, the substrate (1) is taken out by the end effector hand, and then a new substrate for subsequent processing is brought back into the chamber by the end effector hand, so that the substrate processing process is repeatedly performed.

[0042] The support member (1000) may include a guide ring (1100). The guide ring (1100) may have a circular ring shape and provide a guide for the substrate (1) to be secured. The guide ring (1100) may include a guide protrusion (1110), and the guide protrusion (1110) may be formed to protrude from the upper surface of the guide ring. At this time, a plurality of guide protrusions (1110) may be provided at regular intervals (angles) along the peripheral direction of the guide ring (1100).

[0043] A substrate (1) can be mounted on the guide ring (1100). Specifically, the peripheral portion of the substrate (1) can be mounted on an area close to the inner surface of the guide ring (1100) based on the guide protrusion (1110). As a result, the substrate (1) can be stably supported.

[0044] The clamp ring (2000) may be configured to pressurize the peripheral portion of the substrate (1). Specifically, the clamp ring (2000) may apply a load to the peripheral portion of the substrate (1) to prevent warping (bending deformation) from occurring in the substrate (1) during the substrate processing process. The clamp ring (2000) may include a clamp ring body (2100) and a connecting piece (2200). The clamp ring body (2100) may have a circular ring shape and may include a guide groove (2110) on the lower surface. The guide groove (2110) may have a shape corresponding to the guide protrusion (1110). Accordingly, the clamp ring (2000) may be engaged with the guide ring (1100) to pressurize the substrate. In addition to the circular ring, the clamp ring (2000) may also be changed to a shape such as a square ring.

[0045] The connecting piece (2200) may be formed by protruding from the clamp ring body (2100). An insertion hole may be provided in the connecting piece (2200). A plurality of connecting pieces (2200) may be provided, and a plurality of clamping devices (4000) may be configured to be inserted into each of the insertion holes. A description thereof will be given in detail together with the clamping device (4000) described below.

[0046] The driving unit (3000) can drive the clamp ring (2000) up and down to adjust the pressure level that the clamp ring (2000) provides to the substrate (1). The driving unit (3000) can be configured in multiple numbers along the circumference of the substrate (1). The multiple driving units (3000) can be respectively connected to the multiple clamping devices (4000), thereby driving the multiple connecting pieces (2200) up and down, respectively. The pressure that each of the multiple connecting pieces (2200) provides to the substrate (1) by the driving unit (3000) can be set to be the same or different from each other, and the pressure level that the plurality of connecting pieces (2200) provide to the substrate (1) can be adjusted.

[0047] The clamping device (4000) may be installed between the driving unit (3000) and the clamp ring (2000) and configured to distribute the load applied by the clamp ring (2000) to the peripheral portion of the substrate (1) as the driving unit (3000) descends. A detailed description thereof will be provided below with reference to FIGS. 6 to 8.

[0048] The torque measuring unit (5000) may be configured to measure the torque applied to the driving motor as the clamp shaft is raised and lowered based on the torque measuring sensor (load detection sensor) and / or the power of the driving unit. The clamp is lowered by the power of the driving motor, and the lowered clamp presses the substrate. If warpage occurs on the substrate, the peripheral portion of the substrate is pressed by the clamp, thereby preventing warpage.

[0049] The torque measuring unit (5000) may include a load detection sensor called a load cell. The torque measuring unit (5000) may measure the load (torque) applied by the driving motor to the clamp. The torque measurement value of the clamp driving motor measured by the torque measuring unit (5000) may be input to the data analysis unit (6000).

[0050] The data analysis unit (6000) can determine whether the torque measurement value measured by the torque measurement unit (5000) exceeds the set maximum load value. If the torque measurement value exceeds the maximum load value, the control unit (8000) can stop the operation of the drive motor through software control. The maximum load value can be set based on the physical properties of the substrate (1), such as the thickness and material.

[0051] When the material properties such as the thickness and material of the substrate (1) are input through the input interface, the control unit (8000) can determine the maximum load value based on the input material properties, a correspondence table of the material properties and the maximum load value, a preset function, etc. The determined maximum load value can be compared with the torque value of the clamp driving motor and used to control the operation of the actuator that drives the clamp ring.

[0052] In addition, the maximum load value, which serves as a reference for controlling the actuator operation of the clamp driving motor, may be set according to the degree of warpage occurrence (warpage level or warpage prediction level) of the substrate (1). The maximum load value may be set to increase or decrease linearly or nonlinearly in proportion to the degree of warpage occurrence of the substrate (1). This is because a change in the torque value occurs due to the warpage of the substrate (1), and the allowable load value of the substrate (1) (load range in which the substrate is not broken or damaged) may change depending on the amount of warpage occurrence of the substrate (1).

[0053] Since warpage may occur only in a specific area of ​​the peripheral portion of the substrate (1) or the level of warpage occurring in the peripheral portion may differ along the circumferential direction, when the clamp ring is driven by a plurality of actuators, the allowable torque values ​​(maximum load values) of the actuators driving the clamp ring along the peripheral portion of the substrate (1) may be set differently.

[0054] The control unit (8000) can control a plurality of driving units (3000) by adjusting the driving level of the actuator according to the location and level of warpage occurrence predicted by the warpage determination unit (7000). At this time, the driving level of the actuator can be determined by an algorithm (program) of the control unit (8000) to a value necessary to prevent warpage from occurring on the substrate (1) during the substrate processing process and to prevent damage to the substrate (1) according to the physical properties of the substrate.

[0055] FIG. 5 is an exemplary diagram of a substrate processing device according to an embodiment of the present invention. FIG. 5 is an exemplary diagram to help understand the operation according to an embodiment of the present invention, and is not necessarily limited thereto. Referring to FIGS. 1 to 5 together, the substrate processing device according to an embodiment of the present invention can be divided into a first zone (R1) to a fourth zone (R4), and for example, each zone can be one of a plurality of fan-shaped zones that divide the substrate into a plurality of regions. The first zone (R1) to the fourth zone (R4) shown in FIG. 5 are exaggerated for better understanding of the drawing, and it is preferable that the arcs of the first zone (R1) to the fourth zone (R4) coincide with the outer periphery of the substrate.

[0056] Each zone may be provided with a clamp ring (2001, 2002, 2003, 2004), a driving unit (3001, 3002, 3003, 3004), and a clamping device (4001, 4002, 4003, 4004). In a substrate processing process performed after providing a reference pressure level to the substrate through the clamp ring (2001, 2002, 2003, 2004), if warpage occurs in the first zone (R1) and the third zone (R3), the warpage determination unit (7000) can predict the occurrence of warpage from a change in the torque value of the clamp driving motor in the first zone (R1) and the third zone (R3).

[0057] The control unit (8000) can control the driving unit (3000) according to the predicted location and level of warpage occurrence in the warpage determination unit (7000) to adjust the driving level provided to the substrate (1) by the clamp ring (2001, 2002, 2003, 2004). In the example described above, the first driving unit (3001) and the third driving unit (3003) can drive the clamp ring with a higher driving pressure than the second driving unit (3002) and the fourth driving unit (3004).

[0058] The control unit (8000) can determine the driving level based on the physical properties such as the thickness and material of the substrate. In an embodiment, the control unit (8000) can determine the driving level based on a corresponding table of driving levels corresponding to the thickness and / or material of the substrate (1) stored in a database, or based on a predetermined function or artificial intelligence. The corresponding table can be preset through repeated experiments to find an optimal pressure level that can prevent the occurrence of warpage during the substrate processing process for, for example, the thickness and / or material of the substrate, and stored in the database.

[0059] Fig. 6 is a cross-sectional view of a substrate processing apparatus according to another embodiment of the present invention, and Fig. 7 is an enlarged view showing a first embodiment of part C shown in Fig. 6. Fig. 8 is an enlarged view showing a second embodiment of part C shown in Fig. 6. Referring to Figs. 6 to 8, the substrate processing apparatus according to another embodiment of the present invention has a different configuration of a clamping device (4000) compared to the substrate processing apparatus according to the embodiment of the present invention shown in Figs. 1 to 4, and therefore, only the different configurations will be described below, and a detailed description of the same configurations with overlapping drawing reference numerals will be omitted.

[0060] A clamping device (4000) may be provided between a driving unit (3000) and a clamp ring (2000) to distribute a load applied by the clamp ring (2000) to the peripheral portion of the substrate (1) as the driving unit (3000) descends. Here, the driving unit (3000) may include a driving frame (3100) and an actuator (3200), and the actuator (3200) may allow the driving frame (3100) to be introduced and withdrawn.

[0061] The clamping device (4000) may include a clamp guide (4100), a damping member (4200), and a damping guide (4300). The clamp guide (4100) is coupled to a driving unit (3000) and can be raised and lowered by the driving unit (3000). When the clamp guide (4100) is raised by the driving unit (3000), the lower surface of the clamp ring (2000) is supported by the clamp guide (4100) and is raised, and when the clamp guide (4100) is lowered, the clamp ring (2000) can be seated on the upper portion of the clamp guide (4100).

[0062] The clamp guide (4100) may have a damping groove (4101) formed at the upper end. The damping groove (4101) may have an open upper surface. The damping member (4200) is coupled with the clamp guide (4100) to operate integrally, and the lower end may be accommodated in the damping groove (4101). The damping member (4200) may be made of an elastic material or an inelastic material. When the damping member (4200) is made of an elastic material, the load applied to the substrate (1) can be distributed by the cushioning of the damping member (4200).

[0063] The damping member (4200) may include a damping shaft (4210) and a pressurizing body (4220). The damping shaft (4210) has a vertical length, and its lower end may be fixedly connected to a clamp guide (4100). The pressurizing body (4220) is connected to the upper end of the damping shaft (4210) and may slide along the inner surface of the damping guide (4300).

[0064] Specifically, the pressurizing body (4220) may include a step portion (4221) and a pressurizing body (4222). A detailed description thereof will be described later together with the damping guide (4300). Accordingly, the pressurizing body (4220) directly provides a pressurizing force to the damping guide (4210), and the pressurizing force distributed through the damping guide (4210) may be provided to the clamp ring (2000).

[0065] Additionally, the damping member (4200) may further include a spring (4230). The spring (4230) is arranged between the pressure body (4220) and the bottom surface of the damping groove (4101) to cushion the elevation of the pressure body (4220).

[0066] For example, when the damping guide (4300) applies a load to the substrate (1) by lowering the damping member (4200), the spring (4230) can be compressed to buffer the load applied to the substrate (1). The spring (4230) may be arranged to wrap around the outer circumference of the damping shaft (4210), but is not necessarily limited thereto.

[0067] The damping guide (4300) is inserted into the damping groove (4101) at the lower end and is positioned between the clamp guide (4100) and the damping member (4200), so as to disperse the pressure applied by the damping member (4200) to the clamp ring (2000) when the driving unit (3000) is driven downward.

[0068] For example, the damping guide (4300) may include a sliding portion (4310) and a catch portion (4320). The sliding portion (4310) may be formed to have a cylindrical shape with an open upper portion and a first inner diameter (D1). At this time, the first inner diameter (D1) may be designed to have the same value as the diameter of the damping groove (4101). Accordingly, the sliding portion (4310) may be inserted into the damping groove (4101) and may be raised and lowered together with the raising and lowering of the clamp guide (4100).

[0069] Additionally, a communication hole is formed on the lower surface of the sliding part (4310) so that a damping shaft (4210) can be inserted.

[0070] The engaging portion (4320) is formed on the upper portion of the sliding portion (4310) and is formed with a second inner diameter (D2) that is larger than the first inner diameter (D1) to form a step with the sliding portion (4310). The engaging portion (4320) can be formed to engage with the step portion (4221) of the pressurizing body (4220), thereby pressurizing the damping guide (4300) when the clamp guide (4100) fixedly coupled to the damping member (4200) descends.

[0071] In other words, when the clamp guide (4100) is lowered, the damping member (4200) is driven downward together, and the damping guide (4300) is arranged between the clamp guide (4100) and the pressurizing body (4220) so that it can be driven downward together by engaging with the step portion (4221) of the pressurizing body (4220).

[0072] At this time, the connecting piece (2200) can be placed between the clamp guide (4100) and the engaging portion (4320) of the damping guide (4300), and the damping guide (4300) can be inserted into the insertion hole provided in the connecting piece (2200). Accordingly, the load applied to the substrate (1) by the clamp ring (2000) due to the lowering of the driving unit (3000) can be distributed by the clamping device (4000).

[0073] In addition, the outer surface of the damping guide (4300) has a shape corresponding to the inner surface of the clamp guide (4100), so that when the clamp guide (4100) is lowered, the damping guide (4300) can slide down stably along the outer surface of the clamp guide (4100). Accordingly, a buffered pressure level can be provided compared to a case where the clamp ring (2000) directly presses the substrate (1), thereby reducing the possibility of damage to the substrate (1).

[0074] FIG. 9 is a flowchart of a substrate processing method according to an embodiment of the present invention. Referring to FIG. 9 together with FIGS. 1 to 4, the substrate processing method according to the embodiment of the present invention may include a step (S10) in which a clamp ring is driven by a driving unit to provide a pressing force to a peripheral portion of a substrate supported by a support unit, a step (S20) in which a torque measuring unit measures a torque applied to the driving unit as the clamp ring is driven up and down by the driving unit, a step (S30) in which a data analysis unit compares a torque measurement value measured by the torque measurement unit with a set maximum load value, and a step (S40) in which a control unit adjusts the pressing force of the clamp ring based on the torque measurement value of the torque measurement unit and the comparison result of the data analysis unit. The control unit may stop driving an actuator of the driving unit when the torque measurement value measured by the torque measurement unit exceeds the maximum load value.

[0075] A substrate processing device according to an embodiment of the present invention may be provided in a structure in which a single drive motor is coupled to a single torque measuring unit, and these are connected and coupled to all clamp shafts. Alternatively, the device may be provided in a structure in which individual torque measuring units and drive motors are coupled to each clamp shaft. In this case, the pressurized load for each shaft can be measured through individual torque measuring units coupled to each clamp shaft.

[0076] The actuator may be provided as a hydraulic cylinder in addition to a drive motor. In the embodiment of the present invention, the clamp pressurizing parts are driven up and down by a drive motor, but the clamp pressurizing parts may be driven by a hydraulic cylinder instead of a drive motor.

[0077] In addition, in the embodiment of the present invention, the torque measuring unit is combined with the driving motor to measure the load applied to the substrate, but when a structure using a driving motor and a control device capable of current control without a torque measuring unit is used, the actuator operation of the clamp driving motor can also be controlled based on the power of the driving motor.

[0078] When controlling the position of a drive motor, power is consumed until it reaches a specific position. However, the power consumed can increase in proportion to the external resistance generated before reaching the target position. For example, when warpage occurs on a substrate, the external resistance generated by the warped shape can increase the power consumption of the drive motor to pressurize the substrate. This is because the power consumption of the drive motor is proportional to the size of the external resistance. Therefore, the actuator operation of the drive motor can be controlled in a similar way to the torque measurement value based on the power consumption of the drive motor.

[0079] Fig. 10 is a flowchart illustrating a process for performing clamping control of a substrate according to an embodiment of the present invention. Referring to Fig. 10, first, a maximum load value (allowable load value) for each substrate is stored and set (S101). The maximum load value for each substrate type may be determined through testing or may be determined based on information provided by the equipment manufacturer. Next, when the equipment user inputs the characteristics (material, thickness, degree of warpage, etc.) of the substrate to be used in the substrate processing process (S102), the substrate type most similar to the substrate to be processed is selected from among the previously stored substrate types (S103).

[0080] Next, the substrate is placed between the lift pin and the clamp ring (S104), and the driving motor and actuator of the driving unit are driven to lower the clamp ring (S105, S106). During this process, the load (load) transmitted by the contact between the substrate and the clamp ring is measured to obtain a torque measurement value (S107, S108). When the torque measurement value is obtained in real time, it is checked whether the torque value collected in real time approaches the maximum load value set for the substrate type corresponding to the substrate (S109). When the torque measurement value reaches a certain value, the actuator speed is lowered, and when the allowable load value is reached, the driving motor and actuator are stopped (S110), thereby stopping the clamp ring (S111).

[0081] Fig. 11 is a flowchart illustrating a process for detecting warpage occurrence of a substrate according to an embodiment of the present invention. Referring to Fig. 11, a substrate is inserted (S201), and a driving motor and an actuator of a driving unit are driven to lower a clamp ring (S202, S203). During this process, a load (load) transmitted by contact between the substrate and the clamp ring is measured to obtain a torque measurement value (S204, S205, S206). When the torque measurement value is obtained over time, whether warpage has occurred is determined based on the torque value collected in real time (S207). During the process, if the torque measurement value exceeds a set reference torque value, it is determined that warpage has occurred and an alarm can be generated (S208, S209).

[0082] According to an embodiment of the present invention, in the process of suppressing warpage (bending) of a substrate by pressing the edge of the substrate with a clamp ring by a driving unit, the load value applied by the driving unit is measured in real time and controlled to apply a load that does not break or damage the substrate, thereby preventing the substrate from being broken or damaged due to the driving unit applying an excessive pressurizing load exceeding the allowable load value set for the substrate, thereby suppressing warping of the substrate.

[0083] The detailed description above is illustrative of the present invention. Furthermore, the foregoing description illustrates preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. In other words, changes or modifications may be made within the scope of the inventive concepts disclosed herein, the scope equivalent to the written disclosure, and / or the scope of technology or knowledge in the art. The written embodiments illustrate the best possible state for implementing the technical idea of ​​the present invention, and various modifications required for specific applications and uses of the present invention are also possible. Therefore, the detailed description of the present invention above is not intended to limit the present invention to the disclosed embodiments. Furthermore, the appended claims should be construed to include other embodiments.

Claims

1. A support for supporting the substrate; A clamp ring configured to pressurize a peripheral portion of the substrate in relation to the warpage of the substrate; A driving unit configured to drive the clamp ring upward and downward to control the pressing force applied to the peripheral portion of the substrate; A torque measuring unit configured to measure the torque applied to the driving unit as the clamp ring is raised and lowered by the driving unit based on the power of the torque measuring sensor or the driving unit; and A substrate processing device comprising a control unit configured to adjust the pressing force of the clamp ring based on the torque measurement value measured by the torque measurement unit.

2. In claim 1, The above driving part: A clamp shaft coupled to the clamp ring and configured to pressurize the clamp ring; and It includes a driving motor configured to drive the above clamp shaft upward and downward, A substrate processing device, wherein the torque measuring unit is configured to measure the torque applied to the driving motor as the clamp shaft is driven upward and downward.

3. In claim 1, Further comprising a data analysis unit that compares the torque measurement value measured by the torque measurement unit with a set maximum load value, A substrate processing device, wherein the control unit stops driving the actuator of the driving unit when the torque measurement value measured by the torque measurement unit exceeds the maximum load value.

4. In claim 3, A substrate processing device, wherein the maximum load value is set according to the physical property values ​​including the thickness and material of the substrate and the degree of warpage occurrence of the substrate.

5. In claim 1, A substrate processing device further comprising a clamping device provided between the driving unit and the clamp ring and configured to distribute a load applied by the clamp ring to the peripheral portion of the substrate as the driving unit descends.

6. In claim 5, The above clamp ring: A ring-shaped clamp ring body; and A substrate processing device comprising a plurality of connecting pieces formed by protruding from the clamp ring body and configured to have insertion holes so that a plurality of clamping devices can be inserted therein.

7. In claim 5, The above clamping device: A clamp guide coupled to the above driving unit, raised and lowered by the driving unit, and having a damping groove at the upper end; A damping member that is integrally driven by being combined with the above clamp guide and whose lower part is accommodated in the above damping groove; and A substrate processing device, comprising a damping guide having a lower portion inserted into the damping groove and positioned between the clamp guide and the damping member to disperse the pressure applied by the damping member to the clamp ring when the driving unit is driven downward. 8.(A) A step in which a clamp ring is driven by a driving unit to provide a pressing force to the peripheral part of a substrate supported on a support unit; (B) a step of measuring the torque applied to the driving unit as the clamp ring is driven up and down by the driving unit based on the power of the torque measuring sensor or the driving unit by the torque measuring unit; and (C) A substrate processing method, comprising: a step of adjusting the pressing force of the clamp ring based on the torque measurement value of the torque measurement unit by a control unit; 9. In claim 8, (D) further comprising a step of comparing the torque measurement value measured by the torque measurement unit with a set maximum load value by the data analysis unit; A substrate processing method, wherein the step (C) includes a step of stopping the actuator operation of the driving unit when the torque measurement value measured by the torque measurement unit exceeds the maximum load value.

10. In claim 9, A substrate processing method, wherein the maximum load value is set according to the physical property values ​​including the thickness and material of the substrate and the degree of warpage occurrence of the substrate.

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