Touch panel and manufacturing method therefor

Abstract

The present invention provides a touch panel and a manufacturing method therefor. The touch panel comprises: a display backplane; a display unit, located on one side of the display backplane; a thin film encapsulation layer, located on the side of the display unit away from the display backplane and encapsulating the display unit; a touch pattern layer, located on the side of the thin film encapsulation layer away from the display unit; and a binding pin, located on the same side of the display backplane as the display unit and connected to the display unit and the touch pattern layer. The present invention can reduce the thickness of the touch panel and narrow a bezel, implement multiplexing of the binding pin to further narrow the bezel, and implement multiplexing of a flexible circuit board to reduce the manufacturing difficulty.

Description

Touch panel and manufacturing method thereof TECHNICAL FIELD

[0001] The present application relates to the field of touch display, in particular, to a touch panel and manufacturing method thereof. BACKGROUND

[0002] With the continuous development of science and technology, touch electronic devices are more and more widely used in people's daily life and work.

[0003] The traditional touch panel, taking an AMOLED (Active Matrix Organic Light Emitting Diode) display panel as an example, comprises a display backboard and an encapsulation cover plate, the encapsulation cover plate is integrated with a touch sensing unit, the touch sensing unit and a touch trace connected with the touch sensing unit are prepared in a glass encapsulation glue, a touch binding pin externally connected with the touch sensing unit is outside the glass encapsulation glue, and a display binding pin externally connected with a display unit is on the display backboard.

[0004] The touch panel with the existing structure has the following problems: (1) the encapsulation cover plate is relatively thick, so that the overall thickness of the touch panel is relatively large; (2) the touch sensing unit and the display unit are independently connected with a touch binding pin and a display binding pin respectively, which occupies the frame space; (3) the touch flexible printed circuit (FPC) and the display flexible printed circuit need to be designed respectively for the touch binding pin and the display binding pin, which is complex in processing.

[0005] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information which does not constitute prior art known to those of ordinary skill in the art.

[0006] SUMMARY

[0007] Therefore, the present application provides a touch panel and a manufacturing method thereof, which can reduce the thickness of the touch panel and the frame, reuse the binding pin to further reduce the frame, and reuse the flexible printed circuit to reduce the manufacturing difficulty.

[0008] One aspect of the present application provides a touch panel, comprising:

[0009] a display backboard;

[0010] a display unit located on one side of the display backboard;

[0011] a thin film encapsulation layer located on a side of the display unit away from the display backboard and encapsulating the display unit;

[0012] a touch pattern layer on a side of the thin film encapsulation layer away from the display unit; and

[0013] a binding pin on a same side of the display backplane as the display unit, connected to the display unit and the touch pattern layer.

[0014] In some embodiments, the touch pattern layer comprises a plurality of touch patterns.

[0015] The touch panel further comprises a plurality of touch traces, each of the touch traces connecting one of the binding pins and one of the touch patterns.

[0016] The touch panel further comprises a plurality of display traces connecting the binding pins and the display unit.

[0017] In some embodiments, the touch panel further comprises:

[0018] a thin film blocking strip on a same side of the display backplane as the display unit, surrounding the display unit, the display unit and the thin film encapsulation layer being located in a groove formed by the thin film blocking strip and the display backplane.

[0019] a passivation layer between the thin film encapsulation layer and the touch pattern layer; and

[0020] a protection layer on a side of the touch pattern layer away from the passivation layer.

[0021] In some embodiments, the touch panel further comprises:

[0022] a contact unit on a side of the binding pin away from the display backplane, connecting the touch traces and the display traces, the contact unit being made of the same material as the touch pattern layer.

[0023] In some embodiments, the touch traces are on a side of the passivation layer away from the display backplane.

[0024] In some embodiments, the thin film encapsulation layer has a thickness of 6-20 um.

[0025] In some embodiments, the binding pin is separated from a projection of the thin film encapsulation layer on the display backplane.

[0026] The binding pin is separated from a projection of the touch pattern layer on the display backplane.

[0027] The binding pin is in line contact with a projection of the passivation layer on the display backplane.

[0028] In some embodiments, a projection of the thin film encapsulation layer on the display backplane comprises a projection of the display unit on the display backplane.

[0029] In some embodiments, the touch panel further comprises:

[0030] A flexible circuit board connected to the binding pins.

[0031] Another aspect of the present application further provides a method for manufacturing a touch panel, comprising the following steps:

[0032] providing the display backplane;

[0033] manufacturing display units and the binding pins on one side of the display backplane;

[0034] manufacturing a thin film encapsulation layer on a side of the display units away from the display backplane, so as to encapsulate the display units; and

[0035] manufacturing a touch pattern layer on a side of the thin film encapsulation layer away from the display units; wherein the binding pins are connected to the display units and the touch pattern layer respectively.

[0036] The present application has at least the following advantages compared with the prior art:

[0037] The touch panel and the method for manufacturing the same have the following advantages: (1) the thin film encapsulation layer is used to replace the encapsulation cover plate, so as to reduce the thickness of the touch panel and the frame size; (2) the binding pins are reused, so that the touch pattern layer and the display units are connected to the binding pins, thereby further reducing the frame size; and (3) the binding pins are reused, so that the flexible circuit board can be reused, thereby reducing the manufacturing difficulty.

[0038] It should be understood that the general description above and the detailed description below are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0039] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments consistent with the present application and, together with the specification, serve to explain the principles of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0040] Fig. 1 shows a schematic diagram of a cross-sectional structure of a touch panel provided by the present application;

[0041] Fig. 2 shows a schematic diagram of a top view structure of a touch panel provided by the present application;

[0042] Fig. 3 shows a flow chart of a method for manufacturing a touch panel according to the present application;

[0043] Fig. 4 shows a cross-sectional view of an intermediate product after step S120 in Fig. 3;

[0044] Fig. 5 shows a cross-sectional view of an intermediate product after step S130 in Fig. 3;

[0045] Fig. 6 shows a cross-sectional view of an intermediate product after step S140 in Fig. 3;

[0046] Fig. 7 shows a schematic view of a touch device according to the present application.

[0047] Reference numerals: 1 display back plate 2 display unit 3 thin film encapsulation layer 4 touch pattern layer 41 touch pattern 5 binding pin 51 contact unit 6 touch trace 7 thin film barrier 8 passivation layer 9 protection layer 10 touch device DETAILED DESCRIPTION

[0048] Example embodiments now will be described more fully hereinafter with reference to the accompanying drawings. Example embodiments, may, however, be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art, and the present disclosure will only be defined by the claims. Like reference numerals refer to like elements throughout the several views.

[0049] The terms "first", "second", and similar terms do not denote any order, quantity, or importance, but are used to identify different components. Also, the terms "upper", "lower", and similar terms are used to indicate the orientation or position relationship in the description of the present application based on the orientation or position relationship shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0050] It should be noted that the embodiments of the present application and the features in different embodiments can be combined with each other without conflict.

[0051] The present application provides a solution to the problems existing in the prior art. The present application provides a touch panel and a preparation method thereof, wherein the touch panel comprises: a display backboard; a display unit located on one side of the display backboard; a thin film packaging layer located on the side of the display unit away from the display backboard and encapsulating the display unit; a touch pattern layer located on the side of the thin film packaging layer away from the display unit; and a binding pin located on the same side of the display backboard as the display unit and connected with the display unit and the touch pattern layer. The touch panel and the preparation method thereof of the present application have the following advantages: (1) the thin film packaging layer is used instead of the encapsulation cover plate, thereby reducing the thickness of the touch panel and the frame; (2) the binding pin is multiplexed, so that the touch pattern layer and the display unit are both connected with the binding pin, thereby further reducing the frame; and (3) the binding pin is multiplexed, and thus the flexible circuit board can be multiplexed, thereby reducing the preparation difficulty.

[0052] The specific embodiments of the present application are further described in detail below with reference to the accompanying drawings.

[0053] FIG. 1 shows a cross-sectional structure schematic diagram of a touch panel provided by the present application; and FIG. 2 shows a top view structure schematic diagram of a touch panel provided by the present application.

[0054] Referring to FIGS. 1 and 2, one aspect of the present application provides a touch panel, comprising: a display backboard 1, a display unit 2, a thin film packaging layer 3, a touch pattern layer 4, and a binding pin 5.

[0055] In some embodiments, the display backboard 1 is an important component in the touch panel, which provides support and basic structure so that other components such as the display unit 2 and the touch pattern layer 4 can be correctly installed and work. The display backboard 1 is usually a solid plate, which can be made of glass, plastic, metal or other materials, and has sufficient strength and stability to support other components of the touch panel. Glass is usually selected as the material of the display backboard 1 because of its high hardness, good optical transparency, strong corrosion resistance and other characteristics, especially in high-end display panels such as smart phones, tablet computers and the like.

[0056] In some embodiments, the display unit 2 is located on one side of the display backboard 1. The display unit 2 can be an OLED (Organic Light-Emitting Diode) or an AMOLED (Active Matrix Organic Light-Emitting Diode), or a liquid crystal display unit, but is not limited thereto.

[0057] In some embodiments, the thin film encapsulation layer 3 is located on the side of the display unit 2 away from the display backplane 1 and encapsulates the display unit 2. The thickness of the thin film encapsulation layer 3 is 6-20 um, but is not limited thereto. In addition, the projection of the thin film encapsulation layer 3 on the display backplane 1 contains the projection of the display unit 2 on the display backplane 1, so that the thin film encapsulation layer 3 can completely cover the display unit 2. The thin film encapsulation layer 3 plays a key role in encapsulation and protection in the touch panel, mainly for: encapsulating the display unit, providing insulation protection, protecting the panel structure, and improving optical performance, etc. As for the materials that the thin film encapsulation layer 3 can use, they may be different according to specific applications and requirements. Common thin film encapsulation layer structures include: a dense inorganic film formed by CVD (Chemical Vapor Evaporation) process, a high-molecular polymer with buffering effect, and a dense inorganic film formed by CVD process, which are three-layer composite. The touch panel of the present application uses the thin film encapsulation layer 3 instead of the encapsulation cover plate of the prior art. Since the thickness of the thin film encapsulation layer 3 is much smaller than that of the encapsulation cover plate, the thickness of the touch panel can be reduced, and at the same time the frame can be reduced.

[0058] In some embodiments, the touch panel further comprises: a thin film barrier strip 7 located on the same side of the display backplane 1 as the display unit 2 and surrounding the display unit 2, and the display unit 2 and the thin film encapsulation layer 3 are both located in the groove formed by the thin film barrier strip 7 and the display backplane 1. The thin film barrier strip 7 is used to limit the thin film encapsulation layer 3, so that it completely covers the display unit 2, and the coverage range of the thin film encapsulation layer 3 is minimized to reduce the frame of the touch panel. The thin film encapsulation structure formed by the thin film encapsulation layer 3 and the thin film barrier strip 7 has a thickness much smaller than that of the encapsulation cover plate and the small glass encapsulation glue in the prior art, which can reduce the thickness of the touch panel and at the same time reduce the coverage range to reduce the frame.

[0059] In some embodiments, the touch pattern layer 4 is located on the side of the thin film encapsulation layer 3 away from the display unit 2. The following takes the capacitive touch pattern layer 4 as an example to briefly explain the touch principle. Capacitive touch screens use changes in capacitance to detect touch locations. The touch pattern layer 4 is usually composed of a capacitive array formed by one or more layers of conductive material (such as ITO or silver nanowires), which can be placed on a glass or plastic substrate. When a user touches the screen, the distribution of capacitance changes, thereby determining the touch location.

[0060] In some embodiments, the binding pins 5 are located on the same side of the display backplane 1 as the display units 2, and are connected to the display units 2 and the touch pattern layer 4. The touch panel generally has a plurality of binding pins 5. It can be understood that the binding pins 5 are connected to the display units 2 and transmit display data and power signals to the display units 2 to activate the pixels and control their display content. These signals can be video data, timing control signals, power supply, etc. The binding pins 5 are connected to the touch pattern layer 4 and transmit touch signals and control commands to the touch pattern layer 4 to detect and recognize the user's touch operation. These signals are usually capacitive changes, resistance changes, or other sensing signals used to determine the touch position and type. The touch panel of the present application multiplexes the binding pins 5 so that the touch pattern layer 4 and the display units 2 are both connected to the binding pins 5 to further reduce the frame.

[0061] In some embodiments, the touch panel further comprises a plurality of touch traces 6 and a plurality of display traces, and the touch pattern layer 4 comprises a plurality of touch patterns 41. Each touch trace 6 is connected to one binding pin 5 and one touch pattern 41 to transmit display data and power signals from the binding pin 5 to the display unit 2. The display trace is connected to the binding pin 5 and the display unit 2 to transmit touch signals and control commands from the binding pin 5 to the touch pattern layer 4.

[0062] In some embodiments, the touch panel further comprises a passivation layer 8 located between the thin film packaging layer 3 and the touch pattern layer 4. It can be understood that the passivation layer 8 provides a layer of isolation and protection between the touch pattern layer 4 and the display unit 2. This helps to ensure the normal transmission of signals and functional operation between the display unit 2 and the touch pattern layer 4, while reducing the possibility of interference and misoperation. The passivation layer 8 can be made of a variety of materials, including but not limited to SiNx thin film, polyimide (PI), polyester film (PET), polyether ketone (PEEK), and fluoropolymer, etc.

[0063] In some embodiments, the touch panel further comprises a protective layer 9 located on the side of the touch pattern layer 4 away from the passivation layer 8. It can be understood that the protective layer 9 serves to provide additional protection on the back of the touch pattern layer 4 to prevent damage to the touch panel from the external environment and ensure its long-term stable operation. Specifically, the protective layer 9 has the physical protection function of preventing scratching, collision or extrusion, the dust and water prevention function of preventing external substances such as dust and water vapor from entering the interior of the touch panel, and the anti-pollution function of reducing the impact of stains on the touch panel to maintain its cleanliness and transparency. The protective layer 9 can be made of a variety of materials, including but not limited to glass, polycarbonate (PC), polyurethane (PU), and polyester film (PET).

[0064] In some embodiments, the touch panel further comprises a contact unit 51 located on the side of the binding pin 5 away from the display backboard 1 to connect the touch trace 6 and the display trace. It can be understood that the contact unit 51 connects the touch trace 6 and the display trace to realize the transmission and interaction between the touch signal and the display data. In some embodiments, the contact unit 51 can also be used to provide power supply to ensure the normal operation and work of each part of the touch panel. In addition, the contact unit 51 is made of the same material as the touch pattern layer 4, and both are prepared at the same time and connected through the touch trace 6.

[0065] In some embodiments, the touch trace 6 is located on the side of the passivation layer 8 away from the display backboard 1. Specifically, it can be arranged close to the passivation layer 8 and located between the passivation layer 8 and the protection layer 9. The metal material of the touch trace 6 can cross the boundary of the thin film packaging layer 3 and be directly connected to the binding pin 5 of the display backboard 1 to connect the binding pin 5 and the touch pattern 41 of the touch pattern layer 4, which can reduce the touch binding pin designed for the touch pattern layer 4 alone, and reuse the existing display binding pin to further reduce the frame.

[0066] In some embodiments, the touch panel further comprises a flexible circuit board connected to the binding pin 5. It can be understood that the flexible circuit board (FPC) is a circuit board made of flexible substrate, which is used to connect and support various components in the touch panel, such as the touch pattern layer 4, the display unit 2 and the contact unit 51, etc. The flexible circuit board has the characteristics of excellent flexibility and bending, and can freely bend in complex structures and adapt to different shape panel design requirements. The flexible circuit board is usually composed of flexible substrate (such as polyester film, polyimide, etc.) and conductive circuit, which can be manufactured by printing, thin film deposition and other processes. The flexible circuit board connects various components in the touch panel through wires and connectors to form a complete circuit system, and is responsible for transmitting touch signals, display data and power signals, etc. The touch panel of the present application reuses the binding pin, so that it is not necessary to design a touch flexible circuit board separately, and the existing display flexible circuit board can be reused to reduce the preparation difficulty.

[0067] In some embodiments, the projection of the binding pin 5 on the display backboard 1 is separated from the projection of the thin film packaging layer 3 on the display backboard 1, and the projection of the binding pin 5 on the display backboard 1 is separated from the projection of the touch pattern layer 4 on the display backboard 1, so as to represent that the thin film packaging layer 3 and the touch pattern layer 4 are located in the display area of the touch panel, and the binding pin 5 is located in the non-display area of the touch panel. The projection line of the binding pin 5 on the display backboard 1 contacts the passivation layer 8 to facilitate the electrical connection between the touch trace 6 prepared on the passivation layer 8 and the contact unit 51 prepared on the binding pin 5.

[0068] The touch panel of the present application, (1) by using a thin film packaging layer 3 instead of a packaging cover plate, reduces the thickness of the touch panel and reduces the frame; (2) by multiplexing the binding pins 5, the touch pattern layer 4 and the display unit 2 are connected to the binding pins 5, so as to further reduce the frame; (3) by multiplexing the binding pins 5, the flexible circuit board can be multiplexed, so as to reduce the preparation difficulty.

[0069] Figure 3 shows a step flow chart of a preparation method of a touch panel provided by the present application; Figure 4 shows a cross-sectional structure schematic diagram of an intermediate product after step S120 in Figure 3 is executed; Figure 5 shows a cross-sectional structure schematic diagram of an intermediate product after step S130 in Figure 3 is executed; Figure 6 shows a cross-sectional structure schematic diagram of an intermediate product after step S140 in Figure 3 is executed.

[0070] Referring to Figures 3 to 6, another aspect of the present application further provides a preparation method of a touch panel, for preparing the above-mentioned touch panel, at least comprising the following steps:

[0071] S110, providing a display back plate 1;

[0072] S120, preparing a display unit 2 and a binding pin 5 on one side of the display back plate 1;

[0073] S130, preparing a thin film packaging layer 3 on the side of the display unit 2 away from the display back plate 1, so as to package the display unit 2; and

[0074] S140, preparing a touch pattern layer 4 on the side of the thin film packaging layer 3 away from the display unit 2; wherein the binding pin 5 is connected to the display unit 2 and the touch pattern layer 4 respectively.

[0075] It is worth noting that S110-S140 are only step labels, which are used for facilitating step designation and avoiding repeated words, and are not used for limiting the implementation order of each step of the method. In other embodiments, the above-mentioned steps of the method can also be exchanged in writing order, and are not limited thereto. The subsequent step labels in the present application all have the same meaning, and the repeated parts will not be described herein.

[0076] In some embodiments, referring to Figure 4, for the above-mentioned step S120, the display unit 2 can be an OLED device or an AMOLED device, and is prepared by evaporation on one side of the processed display back plate 1.

[0077] In some embodiments, between the above-mentioned step S120 and step S130, the following step can also be included: S150, preparing a thin film blocking strip 7 on the side of the display unit 2 away from the display back plate 1.

[0078] In some embodiments, referring to FIG. 5, for the above step S130, the thin film packaging layer 3 is prepared within the area range defined by the thin film barrier strip 7 to collectively form a thin film packaging structure.

[0079] In some embodiments, between the above steps S130 and S140, the following step S160 can also be included: depositing and preparing a passivation layer 8 on the side of the thin film packaging layer 3 away from the display unit 2, and performing exposure etching to remove part of the photoresist and expose the binding pins 5 covered by the material of the passivation layer 8 during deposition.

[0080] In some embodiments, referring to FIG. 6, for the above step S140, a metal layer is deposited on the passivation layer 8, and an exposure etching process is performed to remove the photoresist and form the touch pattern layer 4, the touch wires 6, and the contact unit 51. The touch patterns 41 collectively constitute the touch pattern layer 4. The contact unit 51 is located on the side of the binding pins 5 away from the display backboard 1, and the contact unit 51 and the touch pattern layer 4 are made of the same material and are prepared at the same time. The touch wires 6 connect the touch patterns 41 and the contact unit 51.

[0081] In some embodiments, referring to FIG. 1, after the above step S140, the following step S170 can also be included: depositing and preparing a protection layer 9 on the side of the touch pattern layer 4 away from the thin film packaging layer 3, and performing an exposure etching process to remove the photoresist and expose the binding pins 5 covered by the material of the protection layer 9 during deposition.

[0082] Other aspects of the present embodiments can refer to the above-described embodiments of the touch panel and achieve the same technical effects, and thus repeated descriptions are omitted.

[0083] The method for preparing the touch panel of the present application has the following advantages: (1) the thin film packaging layer 3 is used instead of the packaging cover plate to reduce the thickness of the touch panel and the frame size; (2) the binding pins 5 are reused to connect the touch pattern layer 4 and the display unit 2 to further reduce the frame size; and (3) the binding pins 5 are reused to further reuse the flexible circuit board to reduce the preparation difficulty.

[0084] FIG. 7 shows a structural schematic diagram of a touch device provided by the present application.

[0085] As shown in FIG. 7, based on the same inventive concept, another aspect of the present embodiments also provides a touch device 10 including the above-described touch panel. The touch device 10 can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, etc. Other aspects of the present embodiments can refer to the above-described embodiments of the touch panel and achieve the same technical effects, and thus repeated descriptions are omitted.

[0086] In summary, the touch panel and the preparation method thereof have the following advantages: (1) the thickness of the touch panel is reduced and the frame is shrunk by using the thin film packaging layer instead of the packaging cover plate; (2) the touch pattern layer and the display unit are connected to the binding pins by multiplexing the binding pins, so as to further shrink the frame; and (3) the flexible circuit board can be multiplexed by multiplexing the binding pins, so as to reduce the preparation difficulty.

[0087] The above is a further detailed description of the present application in combination with specific optional embodiments, and the specific implementation of the present application should not be limited to these descriptions. For ordinary skilled persons in the technical field of the present application, a number of simple deductions or replacements can be made without departing from the concept of the present application, and all of them should be considered as falling within the protection scope of the present application.

Claims

1. A touch panel, characterized in that: include: Display back panel; A display unit, located on one side of the display back panel; a thin film encapsulation layer, located on a side of the display unit facing away from the display backplane, and encapsulating the display unit; a touch pattern layer, located on a side of the thin film encapsulation layer facing away from the display unit; as well as A binding pin is located on the same side of the display backplane as the display unit and is connected to the display unit and the touch pattern layer.

2. The touch panel according to claim 1, wherein: The touch pattern layer includes a plurality of touch patterns; The touch panel further includes: a plurality of touch traces, each of the touch traces connecting one of the binding pins and one of the touch patterns; The touch panel further includes: a plurality of display traces connecting the binding pins and the display unit.

3. The touch panel according to claim 2, wherein: Also includes: a thin film barrier strip located on the same side of the display backplane as the display unit and surrounding the display unit, wherein the display unit and the thin film encapsulation layer are both located in a groove formed by the thin film barrier strip and the display backplane; a passivation layer, located between the thin film encapsulation layer and the touch pattern layer; and The protection layer is located on a side of the touch pattern layer away from the passivation layer.

4. The touch panel according to claim 3, wherein: Also includes: A contact unit is located on a side of the binding pin away from the display backplane to connect the touch wiring and the display wiring. The contact unit is made of the same material as the touch pattern layer.

5. The touch panel according to claim 3, wherein: The touch control wiring is located on a side of the passivation layer away from the display backplane.

6. The touch panel according to claim 1, wherein: The thickness of the thin film encapsulation layer is 6 to 20 μm.

7. The touch panel according to claim 3, wherein: The binding pins are separated from the projection of the thin film encapsulation layer on the display backplane; The binding pins are separated from the projection of the touch pattern layer on the display backplane; The binding pin contacts a projection line of the passivation layer on the display backplane.

8. The touch panel according to claim 1, wherein: The projection of the thin film encapsulation layer on the display backplane includes the projection of the display unit on the display backplane.

9. The touch panel according to claim 1, wherein: Also includes: A flexible circuit board is connected to the binding pins.

10. A method for preparing a touch panel, for preparing the touch panel according to any one of claims 1 to 9, characterized in that: The following steps are involved: Providing the display back panel; Prepare a display unit and the binding pins on one side of the display backplane; preparing a thin film encapsulation layer on a side of the display unit facing away from the display backplane to encapsulate the display unit; as well as A touch pattern layer is prepared on a side of the thin film encapsulation layer facing away from the display unit; wherein the binding pins are respectively connected to the display unit and the touch pattern layer.

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