Semiconductor measurement method and apparatus, and device and medium

Abstract

A semiconductor measurement method and apparatus, and a device and a medium. The method comprises: sending configuration parameters to a moving table controller and a focus tracking axis controller by means of a local area network, wherein the configuration parameters comprise motion speeds, accelerations and target point locations of a moving table and a focus tracking axis; and respectively sending control instructions to the moving table controller, the focus tracking axis controller, an optical path switcher and an image collector according to a preset timing by means of an input / output port, such that the moving table controller and the focus tracking axis controller perform control on the basis of the configuration parameters in response to the control instructions, and the optical path switcher and the image collector operate to perform semiconductor measurement in response to the control instructions.

Description

Semiconductor measurement method, device, apparatus and medium

[0001] The present application claims priority to the Chinese patent application No. 202410414470.6, filed on April 8, 2024, the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of automated detection technology, for example to a semiconductor measurement method, device, apparatus and medium. BACKGROUND

[0003] Semiconductor measurement process refers to the process of testing and verifying semiconductor chips. This process is very important, only after sufficient testing and verification, the quality and reliability of the chip can be guaranteed. Semiconductor measurement may be, for example, overlay error measurement. Photolithography process is a process of transferring mask plate patterns onto wafers through a series of steps such as alignment and exposure. In the process of semiconductor device manufacturing, photolithography process is usually used multiple times for overlay operation. Due to various factors in photolithography process, it is impossible to achieve ideal state, which will inevitably lead to the fact that the pattern left on the wafer after exposure and development cannot be completely aligned with the existing pattern on the wafer. Therefore, the offset between the pattern left on the wafer after exposure and development and the existing pattern on the wafer, i.e. overlay error, needs to be accurately measured, so that the overlay error can be effectively compensated and corrected in subsequent processes, so that the final semiconductor device has the expected effect.

[0004] Current semiconductor measurement is mainly based on image acquisition. However, in the conventional scheme, multiple synchronous or asynchronous actions exist in each controller, and configuration parameters and control instructions are all issued by a master server through a network link, which is easy to cause congestion, delay, and even cause downtime.

[0005] SUMMARY

[0006] Embodiments of the present application provide a semiconductor measurement method, device, apparatus and medium to issue configuration parameters and control instructions in order to solve the problem of transmission data congestion.

[0007] According to an aspect of the present application, a semiconductor measurement method is provided, comprising:

[0008] sending configuration parameters to the motion stage controller and the focus tracking axis controller through the local area network; wherein the configuration parameters include the motion speed, acceleration and target point of the motion stage and the focus tracking axis;

[0009] The control instruction sending module is configured to send control instructions to the motion stage controller, the focus tracking shaft controller, the light path switcher and the image collector through the input and output port according to a preset timing sequence, so that the motion stage controller and the focus tracking shaft controller control based on the configuration parameters in response to the control instructions, and the light path switcher and the image collector work in response to the control instructions to perform semiconductor measurement.

[0010] According to an aspect of the present application, a semiconductor measurement device is provided, comprising:

[0011] The configuration parameter sending module is configured to send configuration parameters to the motion stage controller and the focus tracking shaft controller through a local area network; wherein the configuration parameters include motion speed, acceleration and target point of the motion stage and the focus tracking shaft.

[0012] The control instruction sending module is configured to send control instructions to the motion stage controller, the focus tracking shaft controller, the light path switcher and the image collector through the input and output port according to a preset timing sequence, so that the motion stage controller and the focus tracking shaft controller control based on the configuration parameters in response to the control instructions, and the light path switcher and the image collector work in response to the control instructions to perform semiconductor measurement.

[0013] According to another aspect of the present application, an electronic device is provided, comprising:

[0014] at least one processor; and

[0015] a memory in data processing connection with the at least one processor; wherein,

[0016] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the semiconductor measurement method of any embodiment of the present application.

[0017] According to another aspect of the present application, a computer readable storage medium is provided, and the computer readable storage medium stores computer instructions for enabling a processor to implement the semiconductor measurement method of any embodiment of the present application when executed. BRIEF DESCRIPTION OF DRAWINGS

[0018] The drawings required for use in the following embodiment description will be described below, and the drawings in the following description are some embodiments of the present application. For those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0019] Fig. 1 is a flowchart of a semiconductor measurement method provided by an embodiment of the present application;

[0020] Fig. 2 is a flowchart of a semiconductor measurement method provided by another embodiment of the present application;

[0021] FIG. 3 is a synchronization control architecture for overlay error measurement according to another embodiment of the present application;

[0022] FIG. 4 is a timing diagram of a semiconductor measurement process according to another embodiment of the present application;

[0023] FIG. 5 is a structural schematic diagram of a semiconductor measurement device according to an embodiment of the present application;

[0024] FIG. 6 is a structural schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0025] In order to enable persons skilled in the art to understand the present application, the embodiments of the present application will be described below in conjunction with the accompanying drawings. The described embodiments are some embodiments related to the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor shall fall within the scope of protection of the present application.

[0026] It should be noted that the terms "first", "second", "third", "fourth", "actual", "preset" and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects and do not necessarily have to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to the listed steps or units, but can include other steps or units that are not listed or inherent to the process, method, product or device.

[0027] FIG. 1 is a flowchart of a semiconductor measurement method according to an embodiment of the present application, which can be applicable to the case of controlling the equipment in a semiconductor measurement system. The method can be performed by a semiconductor measurement device, which can be implemented in the form of hardware and / or software, and can be configured in an electronic device. As shown in FIG. 1, the method comprises:

[0028] S110, sending configuration parameters to the motion stage controller and the focus tracking axis controller through the local area network; wherein the configuration parameters include the motion speed, acceleration and target point of the motion stage and the focus tracking axis.

[0029] The local area network refers to a local network established in a relatively small geographical range. The local area network can be established through a network switch between the semiconductor measurement equipment and the motion table controller and the focus tracking axis controller. The semiconductor measurement equipment, the motion table controller and the focus tracking axis controller are communicated. The motion table controller is a controller for controlling the motion of the motion table, and the motion table is used to carry the wafer to move. The focus tracking axis controller is a controller for controlling the motion of the focus tracking axis, and the focus tracking axis is synchronously moved with the image collector to find the best focus plane during image collection.

[0030] In the embodiment of the present application, the wafer on the motion table needs to be measured for image collection and overlay error, so the wafer needs to be moved into the field of view of the image collector, and the image collector needs to be focused on the wafer. The target point of the motion table, the target point of the focus tracking axis, and the motion speed and acceleration of the motion table and the focus tracking axis during the motion process required for the wafer to be located in the field of view of the image collector can be pre-configured, that is, the configuration parameters are determined in advance, and the configuration parameters are sent to the motion table controller and the focus tracking axis controller through the local area network. Since the configuration parameters are sent through the network in one direction, no two-way data transmission is involved, and only one transmission is performed, there is no data blocking, delay, etc., which does not affect the real-time performance of data transmission and subsequent data processing.

[0031] S120, control instructions are sent to the motion table controller, the focus tracking axis controller, the optical path switcher and the image collector through the IO port according to the preset timing, so that the motion table controller and the focus tracking axis controller respond to the control instructions and control based on the configuration parameters, and the optical path switcher and the image collector respond to the control instructions and work to measure the semiconductor.

[0032] The IO port, that is, the input and output port, is a key interface for communication between the host server and external devices. In the embodiment of the present application, the semiconductor measurement equipment can be connected with the external motion table controller, focus tracking axis controller and image collector through the IO port, so as to communicate with the motion table controller, focus tracking axis controller and image collector. The preset timing can be prepared according to the motion process of each device during the whole process of image collection of the wafer.

[0033] In the embodiment of the present application, after the configuration parameters are sent to the motion table controller and the focus tracking shaft controller through the local area network, control instructions are sent to the motion table controller, the focus tracking shaft controller, the light path switcher and the image collector through the IO port according to the preset timing sequence, so that the corresponding devices perform corresponding actions, for example, the motion table controller controls the motion table to move based on the configuration parameters in response to the control instruction, the focus tracking shaft controller controls the focus tracking shaft to move based on the configuration parameters in response to the control instruction, the light path switcher switches the light path according to the current control instruction, and the image collector starts or stops collecting images. Since the control instructions are sent through the IO port and not sent through the local area network, the problems of transmission congestion, delay and the like caused by too much data transmission are avoided. In addition, each IO port is connected to an external device one by one, and the control instructions are sent according to the timing sequence, so that a logical closed-loop interlocking is realized, the control efficiency of the external device is improved, and the motion speed of the external device and the semiconductor measurement efficiency are improved.

[0034] In the embodiment of the present application, control instructions are sent to the motion table controller, the focus tracking shaft controller, the light path switcher and the image collector through the IO port according to the preset timing sequence, so that the motion table controller and the focus tracking shaft controller control based on the configuration parameters in response to the control instructions, and the light path switcher and the image collector work to perform semiconductor measurement in response to the control instructions. After that, the method further comprises: determining the overlay error according to the image collected by the image collector from the wafer on the motion table.

[0035] For example, after the motion table controller controls the motion table to carry the wafer to move to the target point, and the focus tracking shaft controller controls the focus tracking shaft to move to the target point, the image collector collects the image of the wafer on the motion table, detects the collected image, and determines the overlay error.

[0036] In the embodiment of the present application, configuration parameters are sent to the motion table controller and the focus tracking shaft controller through the local area network; the configuration parameters include the motion speed, the acceleration and the target point of the motion table and the focus tracking shaft; control instructions are sent to the motion table controller, the focus tracking shaft controller, the light path switcher and the image collector through the IO port according to the preset timing sequence, so that the motion table controller and the focus tracking shaft controller control based on the configuration parameters in response to the control instructions, and the light path switcher and the image collector work to perform semiconductor measurement in response to the control instructions; and the overlay error is determined according to the image collected by the image collector from the wafer on the motion table. The above-mentioned scheme can separately issue the configuration parameters and the control instructions, solve the problems of queuing, blocking and delay caused by issuing all through the network, so that the information can be issued in an orderly and efficient manner.

[0037] FIG. 2 is a flowchart of a semiconductor measurement method according to another embodiment of the present application. The embodiment is improved based on the above-mentioned embodiment, and the solutions not described in the embodiment can be found in the above-mentioned embodiment. As shown in FIG. 2, the method according to the embodiment includes the following steps:

[0038] In S210, configuration parameters are sent to the motion stage controller and the focus tracking axis controller through a local area network. The configuration parameters include the motion speed, acceleration and target point of the motion stage and the focus tracking axis.

[0039] In S220, a start motion control instruction is sent to the motion stage controller and the focus tracking axis controller through an IO port, so that the motion stage controller controls the motion stage to move to the center of the field of view based on the configuration parameters, the focus tracking axis controller controls the focus tracking axis to move to the scanning starting position, a light path switching control instruction is sent to the light path switch, and the light path switch is controlled to switch the light path to the focus tracking light path.

[0040] In the embodiment, the start motion control instruction can be sent to the motion stage controller and the focus tracking axis controller through the IO port at the same time, so that the motion stage controller controls the motion stage to move to the target point, that is, to the center of the field of view, the focus tracking axis controller controls the focus tracking axis to move to the target point, that is, to the scanning starting position, and a light path switching instruction is sent to the light path switch at the same time, so that the light path switch is controlled to switch the light path to the focus tracking light path, thereby providing the light needed to find the best focal plane.

[0041] In S230, a scanning control instruction is sent to the focus tracking axis controller through the IO port, so that the focus tracking axis controller performs scanning from the scanning starting position, a light path switching control instruction is sent to the light path switch, so that the light path switch is controlled to switch the light path to the image acquisition light path, and a motion to the best focal plane control instruction is sent to the focus tracking axis controller, so that the focus tracking axis is controlled to move to the best focal plane.

[0042] For example, after the motion stage moves to the center of the field of view and the focus tracking axis moves to the scanning starting position, scanning of the best focal plane needs to be started. A scanning control instruction can be sent to the focus tracking axis controller through the IO port, so that the focus tracking axis controller performs scanning from the scanning starting position and determines the best focal plane according to the scanning result. After the best focal plane is determined, a motion to the best focal plane control instruction is still needed to be sent to the focus tracking axis controller, so that the focus tracking axis is controlled to move to the best focal plane. If the focus tracking axis scanning ends and the light is no longer needed, a light path switching control instruction is sent to the light path switch, so that the light path switch is controlled to switch the light path to the image acquisition light path, so as to facilitate subsequent image acquisition.

[0043] In the embodiment, the scanning control instruction sent to the focus tracking axis controller through the IO port includes:

[0044] If the motion completion signal fed back by the motion stage controller and the motion completion signal fed back by the focus tracking axis controller are received, the scanning control instruction is sent to the focus tracking axis controller through the IO port.

[0045] For example, after the focus tracking axis controller controls the focus tracking axis to move to the scanning start position, the motion completion signal is fed back to the semiconductor measurement equipment. If the motion completion signal is received by the semiconductor measurement equipment, the scanning control instruction is sent to the focus tracking axis controller through the IO port, so that the ordered sending of the instruction is realized, and it is ensured that the next action is performed after the previous action of the focus tracking axis is completed.

[0046] In the embodiment of the present application, the optical path switching control instruction is sent to the optical path switcher to make the optical path switcher switch the optical path to the image acquisition optical path, and the motion to the best focal plane control instruction is sent to the focus tracking axis controller to control the focus tracking axis to move to the best focal plane, comprising:

[0047] If the scanning completion signal fed back by the focus tracking axis controller is received, the optical path switching control instruction is sent to the optical path switcher to make the optical path switcher switch the optical path to the image acquisition optical path, and the motion to the best focal plane control instruction is sent to the focus tracking axis controller to control the focus tracking axis to move to the best focal plane.

[0048] For example, if the focus tracking axis completes the best focal plane scanning, the scanning completion signal is fed back to the semiconductor measurement equipment, and after the semiconductor measurement equipment receives the scanning completion signal, it is determined that the focus tracking axis scanning has been completed, the optical path switching control instruction is sent to the optical path switcher, and the motion to the best focal plane control instruction is sent to the focus tracking axis controller, so as to ensure that the actions of optical path switching and motion to the best focal plane are performed after the scanning is completed.

[0049] In the embodiment of the present application, before the motion to the best focal plane control instruction is sent to the focus tracking axis controller to control the focus tracking axis to move to the best focal plane, the method further comprises:

[0050] The focal plane scanning result fed back by the focus tracking axis controller is received, and the best focal plane is determined according to the focal plane scanning result.

[0051] For example, after the focus tracking axis scanning is completed, the focal plane scanning result is returned to the semiconductor measurement equipment for calculation to determine the best focal plane, and the semiconductor measurement equipment controls the focus tracking axis to move to the best focal plane to focus on the wafer on the motion stage.

[0052] S240, the image acquisition control instruction is sent to the image collector through the IO port to control the image collector to acquire the image of the wafer on the motion stage.

[0053] Exemplarily, after the motion table and the focus tracking axis are both moved to positions, an image acquisition control instruction is sent to the image collector through the IO port to control the image collector to acquire images of the wafer on the motion table to measure the overlay error of the wafer.

[0054] In the embodiment of the present application, the control instruction is sent to the image collector through the IO port, including:

[0055] If the signal of moving to the best focal plane is fed back by the focus tracking axis controller, an image acquisition control instruction is sent to the image collector through the IO port.

[0056] Exemplarily, if the focus tracking axis controller controls the focus tracking axis to move to the best focal plane, a signal of moving to the best focal plane is fed back to the semiconductor measurement equipment, and if the semiconductor measurement equipment receives the signal of moving to the best focal plane, an image acquisition control instruction is sent to the image collector through the IO port to ensure that the image acquisition is performed after the focus tracking axis moves to the best focal plane.

[0057] In the embodiment of the present application, the signals fed back by the motion table controller and the focus tracking axis controller are received through the IO port.

[0058] Exemplarily, the semiconductor measurement equipment is connected with each controller through the IO port, the semiconductor measurement equipment sends a control instruction to each controller, and each controller feeds back a signal through the IO port receiving the control instruction.

[0059] S250, determining the overlay error according to the images acquired by the image collector on the wafer on the motion table.

[0060] The embodiment of the present application provides a semiconductor measurement method, a start motion control instruction is sent to a motion table controller and a focus tracking axis controller through an IO port, so that the motion table controller controls the motion table to move to a field center based on the configuration parameter, the focus tracking axis controller controls the focus tracking axis to move to a scanning start position, a light path switching control instruction is sent to a light path switcher, and the light path switcher is controlled to switch a light path to a focus tracking light path; a scanning control instruction is sent to the focus tracking axis controller through the IO port to control the focus tracking axis controller to scan from the scanning start position, a light path switching control instruction is sent to the light path switcher to control the light path switcher to switch the light path to an image acquisition light path, a motion to the best focal plane control instruction is sent to the focus tracking axis controller to control the focus tracking axis to move to the best focal plane; and an image acquisition control instruction is sent to an image collector through the IO port to control the image collector to acquire images of the wafer on the motion table. The above scheme can orderly send control instructions to each external device, thereby ensuring efficient and real-time sending of the instructions and avoiding problems of instruction blocking and delay caused by network problems.

[0061] The embodiment of the present application provides an implementation process of a semiconductor measuring device. Exemplarily, a synchronization control architecture of overlay error measurement is shown in Fig. 3.

[0062] Referring to Fig. 3, the master server is the semiconductor measuring device in the embodiment of the present application, and the network switch is used to establish a local area network between the master server and external motion table controllers and focus axis controllers. The IO trigger card is used to establish a communication connection between the master server and external motion table controllers, focus axis controllers, optical path switches and image collectors through IO ports.

[0063] A timing diagram of the semiconductor measuring process is shown in Fig. 4.

[0064] Before T0, the master server sends motion parameters (speed, acceleration, motion target point) required by external devices in advance through a network port.

[0065] At T0, the IO trigger card sends a start motion control signal to the motion table controller and the focus axis controller, and controls the optical path switch to switch the optical path to the focus optical path.

[0066] At T2, the focus axis motion is completed, and the motion is moved to the scanning starting position, and a motion completion signal is returned to the IO trigger card.

[0067] At T3, the motion table motion is completed, and the workpiece to be measured is moved to the field center, and a motion completion signal is returned to the IO trigger card.

[0068] At T5, all motion components are moved to the position, and the IO trigger card sends a start scanning control signal to the focus axis controller.

[0069] At T6, the best focus surface scanning of the focus axis is completed, and a scanning completion signal is returned to the IO trigger card.

[0070] At T8, the focus surface scanning is completed, the IO trigger card sends a motion to the best focus surface control signal to the focus axis, and controls the optical path switch to switch to the image collection optical path.

[0071] At T9, the focus axis motion to the best focus surface is completed, the focus axis is moved to the best focus surface, and a motion to the best focus surface completion signal is returned to the IO trigger card.

[0072] At T11, the image collector is at the best focus surface, the IO trigger card sends an image collection control instruction to the image collector, and the image collector starts image collection.

[0073] Subsequent point image collection actions are repeated according to the process.

[0074] The time distribution of each motion component is as follows:

[0075] Motion time of motion stage to center of field of view Tmotion stage = T3 - T0;

[0076] Motion time of focus tracking axis to start scanning position Tfocus tracking axis 1 = T2 - T0;

[0077] Motion time of focus tracking axis scanning Tfocus tracking axis 2 = T6 - T5;

[0078] Motion time of focus tracking axis to best focus plane Tfocus tracking axis 3 = T9 - T8;

[0079] Switching time of optical path switcher to focus tracking optical path T = T8 - T0;

[0080] Image acquisition time Tloop = T11 - T0.

[0081] Embodiments of the present application have the same technical effects as any of the above embodiments.

[0082] FIG. 5 is a structural schematic diagram of a semiconductor measurement device provided by an embodiment of the present application, which can perform the semiconductor measurement method provided by any embodiment of the present application, and has the corresponding function modules and beneficial effects of the performing method. As shown in FIG. 5, the device includes:

[0083] The configuration parameter sending module 310 is configured to send configuration parameters to the motion stage controller and the focus tracking axis controller through the local area network; wherein the configuration parameters include the motion speed, acceleration and target point of the motion stage and the focus tracking axis;

[0084] The control instruction sending module 320 is configured to send control instructions to the motion stage controller, the focus tracking axis controller, the optical path switcher and the image collector through the IO port according to a preset timing sequence, so that the motion stage controller, the focus tracking axis controller respond to the control instructions and control based on the configuration parameters, and the optical path switcher and the image collector respond to the control instructions and work to perform semiconductor measurement.

[0085] In the embodiment of the present application, the control instruction sending module 320 is configured to:

[0086] Send start motion control instructions to the motion stage controller and the focus tracking axis controller through the IO port, so that the motion stage controller controls the motion stage to move to the center of the field of view based on the configuration parameters, the focus tracking axis controller controls the focus tracking axis to move to the start scanning position, sends optical path switching control instructions to the optical path switcher, and controls the optical path switcher to switch the optical path to the focus tracking optical path;

[0087] send a scanning control instruction to the focus tracking axis controller through the IO port to control the focus tracking axis controller to scan from a scanning start position, send a light path switching control instruction to the light path switch to make the light path switch switch the light path to the image acquisition light path, and send a motion to the best focal plane control instruction to the focus tracking axis controller to control the focus tracking axis to move to the best focal plane.

[0088] send an image acquisition control instruction to the image acquisition device through the IO port to control the image acquisition device to acquire images of the wafer on the motion stage.

[0089] In the embodiment of the present application, the control instruction sending module 320 is configured to:

[0090] In response to receiving the motion completion signal fed back by the motion stage controller and the motion completion signal fed back by the focus tracking axis controller, send a scanning control instruction to the focus tracking axis controller through the IO port.

[0091] In the embodiment of the present application, the control instruction sending module 320 is configured to:

[0092] In response to receiving the scanning completion signal fed back by the focus tracking axis controller, send a light path switching control instruction to the light path switch to make the light path switch switch the light path to the image acquisition light path, and send a motion to the best focal plane control instruction to the focus tracking axis controller to control the focus tracking axis to move to the best focal plane.

[0093] In the embodiment of the present application, the control instruction sending module 320 is configured to:

[0094] receive the focal plane scanning result fed back by the focus tracking axis controller, and determine the best focal plane according to the focal plane scanning result.

[0095] In the embodiment of the present application, the control instruction sending module 320 is configured to:

[0096] In response to receiving the motion to the best focal plane completion signal fed back by the focus tracking axis controller, send an image acquisition control instruction to the image acquisition device through the IO port.

[0097] In the embodiment of the present application, the signals fed back by the motion stage controller and the focus tracking axis controller are received through the IO port.

[0098] The semiconductor measurement device provided in the embodiment of the present application can execute the semiconductor measurement method provided in any embodiment of the present application, and has the corresponding function modules and beneficial effects of the execution method.

[0099] FIG. 6 shows a structural schematic diagram of an electronic device 10 that can be used to implement embodiments of the present application. The electronic device can represent various forms of digital computers, such as laptops, desktops, workstations, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular telephones, smart phones, wearable devices (e.g., headsets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be examples for the purposes of discussion.

[0100] As shown in FIG. 6, the electronic device 10 includes at least one processor 11, and a memory, such as a Read Only Memory (ROM) 12, a Random Access Memory (RAM) 13, etc., which are in data processing connection with the at least one processor 11, wherein the memory stores computer programs that can be executed by the at least one processor. The processor 11 can perform various appropriate actions and processes according to the computer programs stored in the ROM 12 or loaded into the RAM 13 from the storage unit 18. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An Input / Output (I / O) interface 15 is also connected to the bus 14.

[0101] Various components in the electronic device 10 are connected to the I / O interface 15, including an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, a speaker, etc.; a storage unit 18, such as a magnetic disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless data processing transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network, such as the Internet, and / or various telecommunication networks.

[0102] The processor 11 can be various general and / or special purpose processing components with processing and computing capabilities. Some examples of the processor 11 include a central processing unit (CPU), a graphic processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, and the like. The processor 11 performs various methods and processes described above, such as the semiconductor metrology method.

[0103] In some embodiments, the semiconductor metrology method can be implemented as a computer program tangibly embodied in a computer readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded onto the RAM 13 and executed by the processor 11, one or more steps of the semiconductor metrology method described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to perform the semiconductor metrology method by any other suitable means, such as by means of firmware.

[0104] Various implementations of the systems and techniques described above can be realized in digital electronic circuitry, integrated circuitry, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a complex programmable logic device (CPLD), a system on chip (SOC), a complex programmable logic device (CPLD), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include implementation in one or more computer programs that are executable and / or interpretable on a programmable system including at least one programmable processor, which can be special or general purpose, coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device.

[0105] Computer programs for implementing the methods of the present application can be written in any combination of one or more programming languages. These computer programs can be implemented on general purpose computers, special purpose computers, or other programmable mathematical devices to cause a processor of the computer or other programmable mathematical device to perform a function, an operation, and / or an instruction described in the flow diagrams and / or the block diagrams. The computer programs can be executed entirely on a machine, partially on a machine, partially on a machine as a standalone software package and partially on a remote machine, or entirely on a remote machine or server.

[0106] In the context of the present application, a computer readable storage medium can be a tangible medium that can contain or store the computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer readable storage medium can include an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. Alternatively, the computer readable storage medium can be a machine readable signal medium. Examples of a machine readable storage medium include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a RAM, a ROM, an erasable programmable read only memory (EPROM) or flash memory, an optical fiber, a portable compact disc read only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0107] To provide for interaction with a user, the systems and techniques described here can be implemented on an electronic device having a display device (e.g., a Cathode Ray Tube (CRT) or a Liquid Crystal Display (LCD) or a monitor) for displaying information to the user and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the electronic device. Other kinds of devices can be used to provide for interaction with a user as well; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form, including acoustic, speech, or tactile input.

[0108] The systems and techniques described herein can be implemented in a computing system that includes a back end component, e.g., as a data server, or that includes a middleware component, e.g., an application server, or that includes a front end component, e.g., a user computer having a graphical user interface or a Web browser through which a user can interact with an implementation of the systems and techniques described herein, or any combination of such back end, middleware, or front end components. The components of the system can be interconnected by any form or medium of digital data communication, e.g., a communication network. Examples of communication networks include a local area network (LAN), a wide area network (WAN), the Internet, and a blockchain network.

[0109] The computing system can include clients and servers. A client and server are generally remote from each other and typically interact through a data processing network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system, and solves the defects of large management difficulty and weak business scalability in traditional physical host and virtual private server (VPS) services.

[0110] The various forms of flow illustrated above can be used to reorder, add, or delete steps. For example, multiple steps described in the present application can be executed in parallel, in series, or in a different order, as long as the desired results of the present application can be achieved.

Claims

1. A semiconductor measurement method, comprising: Sending configuration parameters to the motion stage controller and the tracking axis controller via the local area network; wherein the configuration parameters include the motion speed, acceleration, and target point of the motion stage and the tracking axis; Control instructions are sent to the motion stage controller, focus axis controller, optical path switcher and image collector respectively through the input and output ports according to the preset timing, so that the motion stage controller and focus axis controller respond to the control instructions and perform control based on the configuration parameters, and the optical path switcher and image collector respond to the control instructions to perform semiconductor measurement.

2. The method according to claim 1, wherein Control instructions are sent to the motion stage controller, focus axis controller, optical path switcher, and image collector through the input and output ports according to the preset timing, including: Sending a start motion control instruction to the motion stage controller and the focus tracking axis controller through the input and output ports, respectively, so that the motion stage controller controls the motion stage to move to the center of the field of view based on the configuration parameters, and the focus tracking axis controller controls the focus tracking axis to move to the scanning start position, and sending an optical path switching control instruction to the optical path switcher, and controlling the optical path switcher to switch the optical path to the focus tracking optical path; Sending a scanning control instruction to the focus tracking axis controller through the input and output ports to control the focus tracking axis controller to scan from the scanning starting position, sending an optical path switching control instruction to the optical path switcher to switch the optical path to the image acquisition optical path, and sending a movement to the optimal focal plane control instruction to the focus tracking axis controller to control the focus tracking axis to move to the optimal focal plane; An image acquisition control instruction is sent to the image acquirer through the input and output ports to control the image acquirer to acquire images of the wafer on the moving stage.

3. The method according to claim 2, wherein: Send scanning control instructions to the focus axis controller through the input and output ports, including: In response to receiving the motion completion signal fed back by the motion stage controller and the motion completion signal fed back by the focus axis controller, a scanning control instruction is sent to the focus axis controller through the input and output ports.

4. The method according to claim 2, wherein: Sending an optical path switching control instruction to the optical path switcher to switch the optical path to the image acquisition optical path, and sending a movement to the optimal focal plane control instruction to the focus tracking axis controller to control the focus tracking axis to move to the optimal focal plane, including: In response to receiving the scanning completion signal feedback from the focus axis controller, an optical path switching control instruction is sent to the optical path switcher to enable the optical path switcher to switch the optical path to the image acquisition optical path, and a movement to optimal focal plane control instruction is sent to the focus axis controller to control the focus axis to move to the optimal focal plane.

5. The method according to claim 4, before sending a control instruction for moving to the optimal focal plane to the focus tracking axis controller to control the focus tracking axis to move to the optimal focal plane, the method further comprising: Receive the focus plane scanning results fed back by the focus axis controller and determine the optimal focus plane based on the focus plane scanning results.

6. The method according to claim 2, wherein: Send control instructions to the image collector through the input and output ports, including: In response to receiving a signal indicating that the focus axis controller has completed moving to the optimal focal plane, an image acquisition control instruction is sent to the image acquisition device through the input and output ports.

7. The method according to any one of claims 1 to 6, wherein The feedback signals from the motion stage controller and the focus axis controller are received through input and output ports.

8. A semiconductor measurement device comprising: a configuration parameter sending module configured to send configuration parameters to the motion stage controller and the tracking axis controller via a local area network; wherein the configuration parameters include the motion speed, acceleration, and target position of the motion stage and the tracking axis; The control instruction sending module is configured to send control instructions to the motion stage controller, focus axis controller, optical path switcher and image collector respectively through the input and output ports according to a preset timing, so that the motion stage controller and focus axis controller respond to the control instructions and perform control based on the configuration parameters, and the optical path switcher and image collector respond to the control instructions to perform semiconductor measurement.

9. An electronic device comprising: at least one processor; as well as A memory connected to the at least one processor for data processing; wherein, The memory stores a computer program executable by the at least one processor. The computer program is executed by the at least one processor to enable the at least one processor to perform the semiconductor measurement method according to any one of claims 1 to 7. 10 . A computer-readable storage medium storing computer instructions, wherein the computer instructions are configured to enable a processor to implement the semiconductor measurement method according to claim 1 when the instructions are executed.

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