Display device and manufacturing method therefor

Abstract

A display device and a manufacturing method therefor. The display device comprises: a cover plate (1); a display assembly (2) located on one side of the cover plate (1), wherein the display assembly (2) comprises a display panel (21), a heat dissipation plate (22) located on the side of the display panel (21) distant from the cover plate (1), and a flexible circuit board (23) bound to the display panel (21), the heat dissipation plate (22) comprises a first edge (a) and a second edge (b), two ends of the first edge (a) are connected to two ends of the second edge (b), and the flexible circuit board (23) is arranged close to the first edge (a) and is attached to the side of the heat dissipation plate (22) distant from the display panel (21) after being bent; and an edge sealing structure (3), at least covering the first edge (a) of the heat dissipation plate (22) and extending to be close to the edge of the cover plate (1). The edge sealing structure (3) comprises a first baffle (31), a second baffle (32) and a filling layer (33); the first baffle (31) is located on the side of the cover plate (1) close to the display panel (21), and is at least arranged along the edge of the cover plate (1) corresponding to the first edge (a); the second baffle (32) is located on the side of the heat dissipation plate (22) distant from the cover plate (1), and is at least arranged along the first edge (a) of the heat dissipation plate (22); and the filling layer (33) fills a first recess (a1) defined by the first baffle (31), the second baffle (32), the display assembly (2) and the cover plate (1), and a bending area (C) of the flexible circuit board (23) is located in the first recess (a1).

Description

Display device and manufacturing method thereof

[0001] Cross-reference to related applications

[0002] The present application claims priority to the Chinese patent application No. 202410432472.8, filed on April 10, 2024, and entitled "Display device and manufacturing method thereof", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of display, and in particular, to a display device and a manufacturing method thereof. BACKGROUND

[0004] In a conventional mobile phone product, the bonding precision of the cover plate 1', the bending precision of the flexible printed circuit (FPC) 2', the thickness precision of the metal cover layer (MCL) adhesive layer 3' on the surface of the flexible printed circuit 2', the minimum lap space required by the middle frame 4' of the whole machine (as shown in FIG. 1, which is a lap diagram of the middle frame and the cover plate in a conventional mobile phone), the assembly precision deviation of the middle frame 4', and the clearance reserved to ensure that the middle frame 4' and the FPC do not contact, so the distance d' between the edge of the cover plate 1' and the vertex of the bending area of the flexible printed circuit 2' is affected by multiple factors, and the value of d' is large.

[0005] Therefore, how to reduce the distance between the edge of the cover plate and the vertex of the bending area of the flexible printed circuit, and realize narrow frame design, has become a technical problem to be solved. SUMMARY

[0006] Embodiments of the present disclosure provide a display device and a manufacturing method thereof to solve the above technical problems in the prior art.

[0007] In a first aspect, to solve the above technical problems, the present disclosure provides a display device, comprising:

[0008] a cover plate;

[0009] a display assembly located on one side of the cover plate, the display assembly comprising a display panel, a heat dissipation plate located on a side of the display panel away from the cover plate, and a flexible printed circuit bonded with the display panel, an edge of the heat dissipation plate being recessed relative to an edge of the display panel, the heat dissipation plate comprising a first edge and a second edge, two ends of the first edge and two ends of the second edge being connected, the flexible printed circuit being arranged close to the first edge, and the flexible printed circuit being attached to a side of the heat dissipation plate away from the display panel after being bent;

[0010] An edge sealing structure covering at least an edge of the first side of the heat dissipation plate and extending to an edge of the cover plate; the edge sealing structure comprises a first enclosure, a second enclosure and a filling layer; the first enclosure is located on a side of the cover plate close to the display panel and is arranged at least along an edge of the cover plate corresponding to the first side; the second enclosure is located on a side of the heat dissipation plate away from the cover plate and is arranged at least along the first side of the heat dissipation plate; the filling layer is filled in a first recess formed by the first enclosure, the second enclosure, the display assembly and the cover plate; and the bending area of the flexible circuit board is located in the first recess.

[0011] In a possible implementation, the edge sealing structure surrounds and covers the edge of the heat dissipation plate and extends to the edge of the cover plate.

[0012] The first enclosure surrounds the edge of the cover plate, and a side of the first enclosure away from the second enclosure is close to the edge of the cover plate; and the second enclosure surrounds the edge of the heat dissipation plate, and a side of the second enclosure close to the first enclosure is arranged in recess relative to the edge of the heat dissipation plate.

[0013] In a possible implementation, the first enclosure comprises a plurality of first sub-enclosures arranged in layers, and the first sub-enclosures surround the edge of the cover plate; and the second enclosure comprises a plurality of second sub-enclosures arranged in layers, and the second sub-enclosures surround the edge of the heat dissipation plate.

[0014] The second sub-enclosure has a smaller longitudinal section area corresponding to the first side than a longitudinal section area corresponding to the second side.

[0015] In a possible implementation, the first sub-enclosure does not overlap the display assembly in the orthographic projection of the cover plate.

[0016] In a possible implementation, the display device further comprises:

[0017] An ink layer located on a side of the cover plate close to the display panel; an edge of the ink layer has a ring-shaped recess arranged around the edge of the cover plate; and the orthographic projection of the first sub-enclosure on the cover plate is located in the orthographic projection of the ring-shaped recess on the cover plate.

[0018] In a possible implementation, at least a first layer of the first sub-enclosures in the first enclosure is black, and the first layer of the first sub-enclosures is a layer of the first sub-enclosures closest to the cover plate among the plurality of first sub-enclosures.

[0019] In a possible implementation, the first sub-enclosure comprises:

[0020] The first baffle wall and the second baffle wall are connected at the head and tail and have the same height; the first baffle wall is located on the side of the first edge away from the second enclosure, the second baffle wall is located on the side of the second edge away from the second enclosure, and the longitudinal section area of the first baffle wall is smaller than that of the second baffle wall; the first baffle wall does not overlap the display assembly in the orthographic projection of the cover plate, and the second baffle wall overlaps the display assembly in the orthographic projection of the cover plate.

[0021] In a possible implementation, the first enclosure comprises a plurality of layers of the first baffle wall arranged in a stacked manner.

[0022] In the direction away from the cover plate, the plurality of layers of the second baffle wall included in the first enclosure are arranged in a stepped manner.

[0023] In a possible implementation, the first enclosure comprises two layers of the second baffle wall arranged in a stacked manner.

[0024] The first layer of the second baffle wall is located on the side of the cover plate close to the display panel, the side of the first layer of the second baffle wall close to the second enclosure abuts against the edge of the heat dissipation plate, and the side of the first layer of the second baffle wall away from the second enclosure is close to the edge of the cover plate.

[0025] The second layer of the second baffle wall is located on the side of the first layer of the second baffle wall away from the cover plate, the end of the second layer of the second baffle wall away from the second enclosure is stepped relative to the end of the first layer of the second baffle wall away from the second enclosure, and the end of the second layer of the second baffle wall close to the second enclosure is stepped relative to the second edge of the heat dissipation plate.

[0026] In a possible implementation, the height of the second sub-enclosure at the corresponding position of the first edge is smaller than the height of the second sub-enclosure at the corresponding position of the second edge.

[0027] In a possible implementation, the filling layer has the same material as the second baffle wall corresponding to the second edge.

[0028] In a possible implementation, the filling layer fills the first groove.

[0029] In a possible implementation, the filling layer comprises:

[0030] The inner filling layer is located in the bending space formed after the flexible circuit board is bent.

[0031] The outer filling layer is located in the space enclosed by the flexible circuit board, the cover plate, the first enclosure, and the second enclosure.

[0032] In a possible implementation, the bending area of the flexible circuit board has two through holes penetrating through the flexible circuit board, and the two through holes are respectively close to two open ends of the bending space.

[0033] In a possible implementation, the display assembly further includes:

[0034] A back film is located between the heat dissipation plate and the display panel and covers part of the flexible circuit board; the back film has a second groove exposing the bending area of the flexible circuit board, and the inner filling layer is filled in the second groove.

[0035] In a possible implementation, the first enclosure has a first spacing with the edge of the cover plate, and the first spacing ranges from 0.02 mm to 0.08 mm.

[0036] In a possible implementation, the display device further includes:

[0037] The middle frame includes a first part and a second part; the first part is located on a side of the edge sealing structure away from the cover plate, and the second part extends from an edge of the first part to the edge of the cover plate and overlaps the cover plate;

[0038] The middle frame adhesive is located between the edge sealing structure and the first part.

[0039] One end of the second part close to the cover plate has an overlapping groove overlapping the edge of the cover plate, one side of the overlapping groove abuts against the edge of the cover plate close to the display panel, and the other side of the overlapping groove abuts against the side of the cover plate.

[0040] In a possible implementation, the second part abuts against multiple layers of the second barrier wall in the first enclosure, and the surface of the second part abutting against the multiple layers of the second barrier wall is a bevel surface.

[0041] In a possible implementation, the display assembly further includes:

[0042] The at least one first accommodating hole is located in the display assembly at a position corresponding to the second side, the first enclosure is arranged along the edge of the first accommodating hole, the first accommodating hole is used for accommodating a receiver, and the part of the first enclosure arranged along the edge of the first accommodating hole is a bevel surface.

[0043] In a possible implementation, the display assembly further includes:

[0044] The second accommodating hole is located in the area surrounded by the edge sealing structure, and the second enclosure extends to the second accommodating hole and surrounds outside the second accommodating hole.

[0045] The edge sealing structure further comprises a third enclosing barrier surrounding the second accommodating hole and located in the area enclosed by the second enclosing barrier, the third enclosing barrier being located on the side surface of the cover plate close to the display panel; the filling layer further fills the space enclosed by the third enclosing barrier and the second enclosing barrier.

[0046] In a possible implementation, the flexible circuit board further comprises:

[0047] A driving chip is located on the side of the flexible circuit board away from the heat dissipation plate, and the flexible circuit board is attached to the side of the heat dissipation plate away from the cover plate.

[0048] The second enclosing barrier at least semi-surrounds the driving chip along the periphery of the driving chip, and the filling layer further fills the area corresponding to the driving chip.

[0049] In a second aspect, the embodiments of the present disclosure provide a manufacturing method of a display device, comprising:

[0050] A display assembly and a cover plate are provided; the cover plate is located on the light exit surface of the display assembly, the display assembly comprises a display panel, a heat dissipation plate located on the side of the display panel away from the cover plate, and a flexible circuit board bonded with the display panel, the edge of the heat dissipation plate is recessed relative to the edge of the display panel, the heat dissipation plate comprises a first edge and a second edge, the two ends of the first edge and the two ends of the second edge are connected, the flexible circuit board is arranged close to the first edge, and the flexible circuit board is attached to the side of the heat dissipation plate away from the display panel after being bent.

[0051] An edge sealing structure is formed on the side of the cover plate close to the display assembly, covering at least the edge of the first edge of the heat dissipation plate and extending to the edge close to the cover plate; the edge sealing structure comprises a first enclosing barrier, a second enclosing barrier, and a filling layer; the first enclosing barrier is located on the side of the cover plate close to the display panel and is arranged at least along the edge of the cover plate corresponding to the first edge; the second enclosing barrier is located on the side of the heat dissipation plate away from the cover plate and is arranged at least along the first edge; the filling layer fills the first recess formed by the first enclosing barrier, the second enclosing barrier, the display assembly, and the cover plate, and the bent area of the flexible circuit board is located in the first recess.

[0052] In a possible implementation, the edge sealing structure formed on the side of the cover plate close to the display assembly, covering at least the edge of the first edge of the heat dissipation plate and extending to the edge close to the cover plate, comprises:

[0053] On the side of the cover plate close to the display assembly, a plurality of layers of first sub-enclosures are printed along the edge of the cover plate to form the first enclosure, wherein the side of the first enclosure away from the second enclosure is close to the edge of the cover plate;

[0054] On the side of the display assembly away from the cover plate, a plurality of layers of second sub-enclosures are printed along the edge of the heat dissipation plate to form the second enclosure, wherein the printing speed of the second sub-enclosure at the first edge corresponding position is lower than the printing speed at the second edge corresponding position; the side of the second enclosure close to the first enclosure is recessed relative to the heat dissipation plate;

[0055] The first groove is filled with a filler to form the filling layer.

[0056] A possible implementation, on the side of the cover plate close to the display assembly, a plurality of layers of first sub-enclosures are printed along the edge of the cover plate to form the first enclosure, comprising:

[0057] On the side of the cover plate close to the display assembly, a first layer of second walls corresponding to the second edge is printed; the side of the first layer of second walls away from the second enclosure is close to the edge of the cover plate, and the side of the first layer of second walls close to the second enclosure abuts the edge of the second edge;

[0058] On the side of the first layer of second walls away from the cover plate, a second layer of second walls corresponding to the second edge is printed; the side of the second layer of second walls away from the second enclosure is recessed relative to the side of the first layer of second walls away from the second enclosure, and the side of the second layer of second walls close to the second enclosure is recessed relative to the edge of the second edge;

[0059] On the side of the cover plate close to the display assembly, a plurality of layers of first walls corresponding to the first edge are printed, and the first walls do not overlap the display assembly; wherein the second enclosure is printed after the plurality of layers of second walls are printed and before the plurality of layers of first walls are printed, the longitudinal sectional area of the second walls is greater than the longitudinal sectional area of the first walls, and the plurality of layers of first walls and the plurality of layers of second walls are connected end to end.

[0060] A possible implementation, the first groove is filled with a filler to form the filling layer, comprising:

[0061] After the second enclosure is formed, a plurality of layers of first adhesives are printed in the space of the first groove corresponding to the second walls before the plurality of layers of first walls are formed to form a part of the filling layer corresponding to the second walls in the filling layer; and the first enclosure, the second enclosure, and the part of the filling layer are solidified;

[0062] After forming the first barrier wall, filling and solidifying a filling material in a space of the first groove corresponding to the first barrier wall to form another part of the filling layer corresponding to the first barrier wall in the filling layer; wherein the filling agent comprises the first adhesive and the filling material;

[0063] Partially milling the position where the first barrier wall and the second barrier wall meet in the edge sealing structure to make the edge sealing structure flush with one side of the cover plate.

[0064] A possible implementation, on the side of the cover plate close to the display assembly, before forming the edge sealing structure extending to the edge of the cover plate covering at least the first edge of the heat dissipation plate, further comprises:

[0065] Forming an ink layer on the side of the cover plate close to the display assembly;

[0066] Forming a ring-shaped groove around the edge of the ink layer on the side of the cover plate away from the cover plate;

[0067] On the side of the cover plate close to the display assembly, printing a plurality of layers of the first sub-enclosure along the edge of the cover plate to form the first enclosure, comprising:

[0068] Printing a plurality of layers of the first sub-enclosure in the ring-shaped groove to form the first enclosure.

[0069] A possible implementation, before bending the flexible circuit board, further comprises:

[0070] Filling and solidifying a second adhesive in a second groove of the back film, so that the solidification rate of the second adhesive reaches a preset proportion; wherein the back film is located between the display panel and the heat dissipation plate and covers part of the flexible circuit board; the second groove exposes the bending area of the flexible circuit board;

[0071] Bending the flexible circuit board, so that the solidified second adhesive fills the bending space formed after the bending of the flexible circuit board to form an inner layer of the filling layer.

[0072] A possible implementation, after bending the flexible circuit board, further comprises:

[0073] Injecting a second adhesive into one open end of the bending space formed after the bending of the flexible circuit board, and using a fan to adsorb the second adhesive at the other open end, so that the second adhesive fills the bending space;

[0074] curing the second adhesive filled in the bending space to form an inner filling layer of the filling layer.

[0075] In a possible implementation, after the flexible circuit board is bent, the method further includes:

[0076] blocking two open ends of the bending space formed after the flexible circuit board is bent, wherein the bending area of the flexible circuit board has two through holes, and the two through holes are respectively close to the two open ends;

[0077] injecting a second adhesive into the blocked bending space through one of the through holes until the second adhesive overflows from the other through hole, so that the second adhesive is filled in the bending space;

[0078] curing the second adhesive filled in the bending space to form an inner filling layer of the filling layer. BRIEF DESCRIPTION OF DRAWINGS

[0079] FIG. 1 is a schematic view of the lapping of a middle frame and a cover plate in a conventional mobile phone;

[0080] FIG. 2 is a top view of the back of a display device according to an embodiment of the present disclosure;

[0081] FIG. 3 is a sectional view of AA' direction in FIG. 2 according to an embodiment of the present disclosure;

[0082] FIG. 4 is a top view of another display device according to an embodiment of the present disclosure;

[0083] FIG. 5 is a sectional view of BB' direction in FIG. 4 according to an embodiment of the present disclosure;

[0084] FIG. 6 is a sectional view of the edge sealing structure on the side of the flexible circuit board according to an embodiment of the present disclosure;

[0085] FIG. 7 is a sectional view of the edge sealing structure at a position other than the side of the flexible circuit board according to an embodiment of the present disclosure;

[0086] FIG. 8 and FIG. 9 are schematic views of another display device according to an embodiment of the present disclosure;

[0087] FIG. 10 is a top view of the back of another display device according to an embodiment of the present disclosure;

[0088] FIG. 11 is a sectional view of CC' direction in FIG. 10 according to an embodiment of the present disclosure;

[0089] FIG. 12 is a sectional view of DD' direction in FIG. 10 according to an embodiment of the present disclosure;

[0090] FIG. 13 is a sectional view of a second edge of another display device according to an embodiment of the present disclosure;

[0091] FIG. 14 is a structural schematic diagram of a filling layer according to an embodiment of the present disclosure;

[0092] FIG. 15 is a partial top view of a display device according to an embodiment of the present disclosure;

[0093] FIG. 16 is a schematic diagram of a flexible circuit board before bending according to an embodiment of the present disclosure;

[0094] FIG. 17 is a schematic diagram of a flexible circuit board after bending according to an embodiment of the present disclosure;

[0095] FIGS. 18 and 19 are structural schematic diagrams of another display device according to an embodiment of the present disclosure;

[0096] FIG. 20 is a structural schematic diagram of another display device according to an embodiment of the present disclosure;

[0097] FIG. 21 is a top view of another display device according to an embodiment of the present disclosure;

[0098] FIG. 22 is a sectional view of EE' in FIG. 21 according to an embodiment of the present disclosure;

[0099] FIG. 23 is a sectional view in the direction of FF' in FIG. 21 according to an embodiment of the present disclosure;

[0100] FIGS. 24 and 25 are top views of another display device according to an embodiment of the present disclosure;

[0101] FIG. 26 is a sectional view in the direction of GG' in FIG. 24 according to an embodiment of the present disclosure;

[0102] FIGS. 27-28 are top views of another display device according to an embodiment of the present disclosure;

[0103] FIG. 29 is a sectional view in the direction of MM' in FIG. 27 according to an embodiment of the present disclosure;

[0104] FIG. 30 is a flowchart of a manufacturing method of a display device according to an embodiment of the present disclosure;

[0105] FIG. 31 is a manufacturing schematic diagram of an edge sealing structure according to an embodiment of the present disclosure;

[0106] FIG. 32 is a schematic diagram of forming an edge sealing structure according to an embodiment of the present disclosure;

[0107] FIG. 33 is a printing principle diagram of a direct writing air pressure valve according to an embodiment of the present disclosure;

[0108] FIG. 34 is a printing principle diagram of a solenoid valve according to an embodiment of the present disclosure;

[0109] FIG. 35 is a position schematic diagram of a glue valve and a cover plate according to an embodiment of the present disclosure;

[0110] FIG. 36 is a schematic view of a production process for forming an edge sealing structure according to an embodiment of the present disclosure;

[0111] FIG. 37 is a schematic view of forming a ring-shaped groove according to an embodiment of the present disclosure;

[0112] FIG. 38 is a schematic view of forming another edge sealing structure according to an embodiment of the present disclosure;

[0113] FIG. 39 is a schematic view of the size of a first layer of a second barrier according to an embodiment of the present disclosure;

[0114] FIG. 40 is a schematic view of the size of a second layer of a second barrier according to an embodiment of the present disclosure;

[0115] FIG. 41 is another schematic view of smearing according to an embodiment of the present disclosure;

[0116] FIG. 42 is a schematic view of a milling process according to an embodiment of the present disclosure;

[0117] FIG. 43 is a schematic view of a milling structure according to an embodiment of the present disclosure;

[0118] FIG. 44 is a schematic view of the slope angle of a partial first barrier formed by a plurality of layers of a second barrier according to an embodiment of the present disclosure;

[0119] FIG. 45 is a schematic view of a production process for forming another edge sealing structure according to an embodiment of the present disclosure;

[0120] FIG. 46 is a schematic view of filling a second adhesive into a bending space according to an embodiment of the present disclosure;

[0121] FIG. 47 is another schematic view of filling a second adhesive into a bending space according to an embodiment of the present disclosure.

[0122] FIG. 47 is another schematic view of filling a second adhesive into a bending space according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0123] The present disclosure provides a display device and a manufacturing method thereof.

[0124] It should be understood that the specific structures and functional details set forth in the embodiments disclosed by the present disclosure are merely representative, and are for the purpose of describing the exemplary embodiments of the present disclosure. However, the present disclosure can be embodied in many alternative forms, and should not be interpreted as being limited to the embodiments set forth herein.

[0125] In the description of the present disclosure, it should be understood that the terms "center", "transverse", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, the term "includes" and any variations thereof are intended to cover non-exclusive inclusion.

[0126] In the description of the present disclosure, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0127] The terms used in the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments. Unless the context clearly indicates otherwise, the singular form "a", "an" used herein is also intended to include the plural. It should also be understood that the terms "include" and / or "contain" as used herein specify the existence of the stated features, integers, steps, operations, units and / or components, and do not exclude the existence or addition of one or more other features, integers, steps, operations, units, components and / or combinations thereof.

[0128] The term "and / or" in the embodiments of the present disclosure is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0129] In order to make the above objectives, features and advantages of the present disclosure more apparent, the present disclosure will be further described below with reference to the drawings and examples. However, the example embodiments can be implemented in various forms, and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be more thorough and complete, and to fully convey the inventive concept of the example embodiments to those skilled in the art. Identical reference numerals in the drawings denote identical or similar structures, and thus repetitive descriptions thereof will be omitted. The words expressing position and direction described in the present disclosure are described with reference to the drawings, but can be changed as needed, and the changes made are included in the scope of protection of the present disclosure. The drawings of the present disclosure are only used to illustrate the relative positional relationship and do not represent the true proportions.

[0130] It should be noted that specific details are set forth in the following description in order to provide a thorough understanding of the present disclosure. However, the present disclosure can be practiced in a variety of ways other than those described herein, and those skilled in the art can make similar substitutions without departing from the scope of the present disclosure. Therefore, the present disclosure is not limited to the specific embodiments disclosed below. The subsequent description of the specification is a preferred embodiment for implementing the present disclosure, and is intended to illustrate the general principles of the present disclosure, rather than to limit the scope of the present disclosure. The scope of protection of the present disclosure is defined by the appended claims.

[0131] The display device and the manufacturing method thereof provided by the embodiments of the present disclosure will be described in detail below with reference to the drawings.

[0132] Please refer to FIG. 2-FIG. 3, FIG. 2 is a top view of the back of a display device provided by an embodiment of the present disclosure, and FIG. 3 is a cross-sectional view of AA' direction in FIG. 2, the display device comprises:

[0133] a cover plate 1;

[0134] a display assembly 2 located on the back of the cover plate 1; the display assembly 2 comprises a display panel 21, a heat dissipation plate 22 located on the side of the display panel 21 away from the cover plate 1, and a flexible circuit board 23 bound with the display panel 21, the edge of the heat dissipation plate 22 is recessed relative to the edge of the display panel 21, the heat dissipation plate 22 comprises a first edge a and a second edge b, the two ends of the first edge a and the two ends of the second edge b are connected, the flexible circuit board 23 is arranged close to the first edge a, and the flexible circuit board 23 is attached to the side of the heat dissipation plate 22 away from the display panel 21 after being bent; the second edge b is the remaining edge of the heat dissipation plate 22 other than the first edge a, for example, the heat dissipation plate 22 is rectangular, comprising four edges of upper, lower, left and right, assuming that the “lower” edge is the first edge a, then the remaining three edges (upper, left and right) are collectively referred to as the second edge b.

[0135] The edge sealing structure 3 covers at least the edge of the first edge a of the heat dissipation plate 22 and extends to the edge close to the cover plate 1; the edge sealing structure 3 comprises a first enclosing wall 31, a second enclosing wall 32 and a filling layer 33; the first enclosing wall 31 is located on the side of the cover plate 1 close to the display panel 21 and is arranged at least along the edge of the cover plate 1 corresponding to the first edge a; the second enclosing wall 32 is located on the side of the heat dissipation plate 22 away from the cover plate 1 and is arranged at least along the first edge a of the heat dissipation plate 22 and is recessed relative to the edge of the heat dissipation plate 22; the filling layer 33 fills the first recess a1 enclosed by the first enclosing wall 31, the second enclosing wall 32, the display assembly 2 and the cover plate 1, and the bending area C of the flexible circuit board 23 is located in the first recess a1.

[0136] The first enclosing wall 31, the second enclosing wall 32 and the filling layer 33 can be composed of an adhesive, which can be a gel, for example; the first enclosing wall 31 and the second enclosing wall 32 can use the same viscosity adhesive, such as an adhesive with a viscosity greater than or equal to 300 w.

[0137] In some embodiments, the filling layer 33 is filled in the first recess a1, so that the side of the edge sealing structure 3 away from the cover plate 1 is a plane, that is, the side of the first enclosing wall 31, the second enclosing wall 32 and the filling layer 33 away from the cover plate 1 is in a plane, so as to facilitate the use of the edge sealing structure 3 to at least form protection for the edge of the side where the flexible circuit board 23 is located in the display device, to prevent damage to the flexible circuit board 23.

[0138] As shown in FIG. 2, the first enclosing wall 31 is arranged around the edge of the cover plate 1 on the side of the cover plate 1 close to the display assembly 2; the second enclosing wall 32 is arranged around the edge of the heat dissipation plate 22 on the side of the heat dissipation plate 22 away from the cover plate 1 and is recessed relative to the edge of the heat dissipation plate 22 (that is, the second enclosing wall 32 is arranged close to the first edge a of the heat dissipation plate 22, and the orthographic projection of the second enclosing wall 32 is located in the orthographic projection of the heat dissipation plate 22); as shown in FIG. 3, the filling layer 33 fills the first recess a1 enclosed by the first enclosing wall 31 and the second enclosing wall 32, and the bending area C of the flexible circuit board 23 is located in the first recess a1; therefore, in the display device, the edge sealing structure 3 covers at least the first edge a of the heat dissipation plate 22 extending to the edge close to the cover plate 1, so that the bending area C of the flexible circuit board 23 is located in the packaging structure, so that the bending area C of the flexible circuit board 23 is integrally filled inside and outside, and in the whole machine assembly of the display device, the middle frame 4' in FIG. 1 can be directly lapped on the edge sealing structure 3, at least the minimum lapping space required by the middle frame 4' in the prior art shown in FIG. 1 is saved, so as to effectively reduce the distance from the vertex of the bending area C of the flexible circuit board 23 to the edge of the cover plate 1, and realize narrow frame design.

[0139] Please refer to FIG. 4 and FIG. 5, FIG. 4 is a top view of another display device provided by the embodiments of the present disclosure, and FIG. 5 is a sectional view of the direction of BB' in FIG. 4 provided by the embodiments of the present disclosure.

[0140] The edge sealing structure 3 surrounds and covers the edge of the heat dissipation plate 22 and extends to the edge of the cover plate 1.

[0141] The first enclosure 31 surrounds the edge of the cover plate 1, and the side of the first enclosure 31 away from the second enclosure 32 is close to the edge of the cover plate 1; the second enclosure 32 surrounds the edge of the heat dissipation plate 22, and the side of the second enclosure 32 close to the first enclosure 31 is arranged in recess relative to the edge of the heat dissipation plate 22.

[0142] In FIG. 4, the first recess a1 surrounded by the first enclosure 31, the second enclosure 32, the display assembly 2 and the cover plate 1 is annular, and the corresponding filling layer 33 is also annular, the first enclosure 31 is located outside the annular, and the second enclosure 32 is located inside the annular. The cross-sectional view of the edge sealing structure 3 on the side of the flexible circuit board 23 in FIG. 4 can refer to FIG. 3, and the cross-sectional view of the edge sealing structure 3 at a position other than the side of the flexible circuit board 23 can refer to FIG. 5.

[0143] In the embodiments provided in the present disclosure, by letting the edge sealing structure 3 surround and cover the edge of the heat dissipation plate 22 and extend to the edge of the cover plate 1, and letting the first enclosure 31 surround the edge of the cover plate 1, and the side of the first enclosure 31 away from the second enclosure 32 is close to the edge of the cover plate 1; the second enclosure 32 surrounds the edge of the heat dissipation plate 22, and the side of the second enclosure 32 close to the first enclosure 31 is arranged in recess relative to the edge of the heat dissipation plate 22, the edge sealing structure 3 can be integrated to protect the entire edge of the display device, and the characteristics of the display device that is easy to be damaged by falling from the edge are improved.

[0144] Please refer to FIG. 6 and FIG. 7, FIG. 6 is a cross-sectional view of an edge sealing structure provided by an embodiment of the present disclosure on the side of a flexible circuit board, and FIG. 7 is a cross-sectional view of an edge sealing structure provided by an embodiment of the present disclosure at a position other than the side of the flexible circuit board.

[0145] The first enclosure 31 includes a plurality of first sub-enclosures 311 arranged in layers, and the first sub-enclosure 311 surrounds the edge of the cover plate 1; the second enclosure 32 includes a plurality of second sub-enclosures 321 arranged in layers, and the second sub-enclosure 321 surrounds the edge of the heat dissipation plate 22 (the corresponding top view can refer to FIG. 4);

[0146] As shown in FIG. 6 and FIG. 7, the second sub-enclosure 321 has a smaller longitudinal sectional area S1 at the first edge a than a longitudinal sectional area S2 at the second edge b. The longitudinal sectional area S1 of the second sub-enclosure 321 at the first edge a is the sectional area in the thickness direction of the second sub-enclosure 321 at any position corresponding to the first edge a in the direction in which the second sub-enclosure 321 points to the first sub-enclosure 311. The longitudinal sectional area S2 of the second sub-enclosure 321 at the second edge b is the sectional area in the thickness direction of the second sub-enclosure 321 at any position corresponding to the second edge b in the direction in which the second sub-enclosure 321 points to the first sub-enclosure 311.

[0147] As shown in FIG. 6 and FIG. 7, the first enclosure 31 includes 6 layers of the first sub-enclosure 311, and the second enclosure 32 includes 2 layers of the second sub-enclosure 321. However, the second sub-enclosure 321 has a smaller longitudinal sectional area S1 at the first edge a (i.e., the side where the flexible circuit board 23 is located) than a longitudinal sectional area S2 at the second edge b (i.e., the side other than the side where the flexible circuit board 23 is located). Since the display device has the thickness of the bent flexible circuit board 23 and the film material between the heat dissipation plate 22 and the bent flexible circuit board 23 at the position of the first edge a, the thickness of the display assembly 2 at the position corresponding to the first edge a is higher than the thickness at the position corresponding to the second edge b. The present disclosure sets the longitudinal sectional area S1 of the second sub-enclosure 321 at the position of the first edge a to be smaller than the longitudinal sectional area S2 of the second sub-enclosure 321 at the position of the second edge b, so as to adapt to the different thicknesses of the display assembly 2 at the positions of the first edge a and the second edge b, and keep the side of the edge sealing structure 3 away from the cover plate 1 flat.

[0148] It should be understood that the sectional planes shown in FIG. 6 and FIG. 7 are actually the sectional planes of the first edge a and the second edge b, and the first edge a and the second edge b also need to be referred to FIG. 2.

[0149] Please continue to refer to FIG. 6 and FIG. 7. The height h1 of the second sub-enclosure 321 at the position of the first edge a is smaller than the height h2 at the position of the second edge b, so as to ensure that the height of the second enclosure 32 at the position of the first edge a is smaller than the height at the position of the second edge b, thereby adapting to the feature that the display module is relatively thick at the position of the first edge a, and keeping the side of the edge sealing structure 3 away from the cover plate 1 flat.

[0150] Please continue to refer to FIG. 6 and FIG. 7. The first sub-enclosure 311 does not overlap with the projection of the display assembly 2 on the cover plate 1 in the orthographic projection of the cover plate 1. In this way, the same printing head can be used to print each layer of the first sub-enclosure 311, so that it is not necessary to replace the printing head or adjust the printing parameters in the middle, thereby improving the printing efficiency.

[0151] Please continue to refer to FIG. 6 and FIG. 7, the first sub-enclosure 311 has a first spacing d1 with the edge of the cover plate 1, the value of the first spacing d1 ranges from 0.02mm to 0.08mm, the first spacing d1 can be the printing accuracy of the equipment used for printing the first sub-enclosure 311. For example, if the printing accuracy of the equipment used for printing the first sub-enclosure 311 is 0.05mm, the first spacing is set to 0.05mm, so that when printing the first sub-enclosure 311, the adhesive used for printing the first sub-enclosure 311 can be prevented from flowing to the outer edge of the cover plate 1 to cause the collapse of the shape.

[0152] FIG. 8 and FIG. 9 are structural schematic diagrams of another display device provided by the embodiment of the present disclosure, which also comprises:

[0153] The ink layer 4 is located on the side of the cover plate 1 close to the display panel 21; the edge of the ink layer 4 has a ring-shaped groove 4a arranged around the edge of the cover plate 1; the orthographic projection of the first sub-enclosure 311 on the cover plate 1 is located within the orthographic projection of the ring-shaped groove 4a on the cover plate 1.

[0154] Since the ink layer 4 is arranged on the side of the cover plate 1 facing the display panel 21 in the display device, if the first enclosure 31 is directly arranged on the ink layer 4 (for example, the arrangement mode shown in FIG. 6 and FIG. 7), the first sub-enclosure 311 needs to have at least the first spacing d1 with the edge of the cover plate 1 as shown in FIG. 6 and FIG. 7 to prevent the adhesive from overflowing to the outer edge of the cover plate 1, and at this time, compared with the prior art shown in FIG. 1, the distance d' from the edge of the cover plate 1' to the vertex of the bending area of the flexible circuit board 2' at least does not need to consider the minimum lap space required by the whole machine frame 4' and the first spacing d1 shown in FIG. 6 and FIG. 7.

[0155] The present disclosure further reduces the first spacing d1 from the first sub-enclosure 311 to the edge of the cover plate 1 by arranging the ring-shaped groove 4a around the edge of the ink layer 4 on the ink layer 4, and the ring-shaped groove 4a can be arranged close to the edge of the cover plate 1. When the first sub-enclosure 311 is formed, the adhesive used for printing the first sub-enclosure 311 is retained in the ring-shaped groove 4a and cannot overflow to the outer edge of the cover plate 1, so it is not necessary to keep at least the first spacing d1 corresponding to the printing accuracy of the printing equipment between the first sub-enclosure 311 and the outer edge of the cover plate 1 as shown in FIG. 6 and FIG. 7, thereby further reducing the spacing from the first sub-enclosure 311 to the edge of the cover plate 1.

[0156] Please refer to FIG. 8 and FIG. 9, in the scheme of arranging the ring-shaped groove 4a on the edge of the ink layer 4, the color of at least the first layer of the first sub-enclosure 311 in the first enclosure 31 is black, and the first layer of the first sub-enclosure 311 is the layer of the first sub-enclosure 311 closest to the cover plate 1 among the multiple layers of the first sub-enclosure 311, so that the light leakage near the ring-shaped groove 4a can be prevented.

[0157] Please continue to see Figure 9, the width w3 of the annular groove 4a can be consistent with the width w1 of the first sub-enclosure 311, the height h3 of the annular groove 4a is less than or equal to the thickness m of the ink layer 4. As the width w1 of the first sub-enclosure 311 is 2c, the width w3 of the annular groove 4a is also 2c, the thickness of the ink layer 4 is m, and the height h3 of the annular groove 4a can be set to m, the value range of m is 12.6um~23.4um.

[0158] Please see Figures 10-12, Figure 10 is a top view of the back of another display device provided by the embodiments of the present disclosure, Figure 11 is a cross-sectional view of CC' direction in Figure 10 provided by the embodiments of the present disclosure, and Figure 12 is a cross-sectional view of DD' direction in Figure 10 provided by the embodiments of the present disclosure. The first enclosure 31 comprises:

[0159] The first and second retaining walls 311a and 311b are connected at the head and tail and have the same height; the first retaining wall 311a is located on the side of the first edge a away from the second enclosure 32, and the second retaining wall 311b is located on the side of the second edge b away from the second enclosure 32; the longitudinal section area S3 of the first retaining wall 311a is smaller than the longitudinal section area S4 of the second retaining wall 311b; the orthographic projection of the first retaining wall 311a on the cover plate 1 does not overlap the orthographic projection of the display assembly 2 on the cover plate 1, and the orthographic projection of the second retaining wall 311b on the cover plate 1 overlaps the orthographic projection of the display assembly 2 on the cover plate 1. The longitudinal section area S3 of the first retaining wall 311a, that is, the cross-sectional area of any position of the first retaining wall 311a in the thickness direction along the direction in which the second enclosure 32 points to the first enclosure 31; the longitudinal section area S4 of the second retaining wall 311b, that is, the cross-sectional area of any position of the second retaining wall 311b in the thickness direction along the direction in which the second enclosure 32 points to the first enclosure 31.

[0160] It should be noted that the display assembly 2 in Figure 10 includes a display panel 21, a heat sink 22, and a flexible circuit board 23, but since the display panel 21 is blocked in Figure 10, it is not shown.

[0161] As shown in FIG. 11 and FIG. 12, the second baffle wall 311b is arranged on the side of the second edge b away from the second enclosure 32, and the lengthwise cross-sectional area S3 of the first baffle wall 311a is smaller than the lengthwise cross-sectional area S4 of the second baffle wall 311b, which can reduce the number of layers of the second baffle wall 311b required to form the first enclosure 31, reduce the forming time of the multi-layer second baffle wall 311b with the longest length in the first enclosure 31, and improve the production efficiency; for example, assuming that the total length of the first enclosure 31 is 6l, the length of the first baffle wall 311a is l, and the length of the second baffle wall 311b is 5l, it is obvious that the length of the second baffle wall 311b accounts for the highest proportion of the total length of the first enclosure 31, so the fewer the layers of the second baffle wall 311b, the less time the printing consumes, and accordingly the less time the first enclosure 31 takes to form, and the production efficiency can be improved accordingly.

[0162] Since the edge sealing structure 3 needs to cover the bending area C of the flexible circuit board 23 at the position of the first edge a, and the first baffle wall 311a is arranged such that its orthographic projection on the cover plate 1 does not overlap with the orthographic projection of the display assembly 2 on the cover plate 1, the bending area C of the flexible circuit board 23 can be avoided when printing the first baffle wall 311a, preventing the first baffle wall 311a from being unevenly formed at the bending area C, and since the edge sealing structure 3 covers the bending area C of the flexible circuit board 23, at least the minimum lap space required by the whole machine frame 4' does not need to be considered as in the prior art shown in FIG. 1, so that the width of the edge sealing structure 3 at the position of the first edge a can be reduced; since the distance between the first edge a of the heat dissipation plate 22 and the edge of the cover plate 1 is greater than the distance between the second edge b of the heat dissipation plate 22 and the edge of the cover plate 1 due to the existence of the bending area C, the width of the edge sealing structure 3 at the position of the first edge a is wider than the width of the edge sealing structure 3 at the position of the second edge b, and the orthographic projection of the second baffle wall 311b on the cover plate 1 is arranged to overlap with the orthographic projection of the display assembly 2 on the cover plate, which can not only ensure that the edge of the display assembly 2 corresponding to the second edge b is covered by the edge sealing structure 3, but also reduce the width of the edge sealing structure 3 at the position of the second edge b.

[0163] As shown in FIG. 12, the multi-layer first baffle wall 311a included in the first enclosure 31 is arranged in an overlapping manner;

[0164] Please refer to FIG. 13 for another cross-sectional view of the display device provided by the embodiment of the present disclosure at the position corresponding to the second edge b, in the direction Y away from the cover plate 1, the multi-layer second baffle wall 311b included in the first enclosure 31 is arranged in a sequentially recessed manner. As shown in FIG. 13, the second layer of the second baffle wall 311b farthest from the cover plate 1 is recessed by d2 relative to the first layer of the second baffle wall 311b closest to the cover plate, and if there is a third layer of the second baffle wall 311b on the side of the second layer of the second baffle wall 311b away from the cover plate 1, the third layer of the second baffle wall 311b is also recessed by d2 relative to the second layer of the second baffle wall 311b.

[0165] As shown in FIGS. 11 and 12, since the longitudinal sectional area S3 of the first barrier wall 311a is smaller than the longitudinal sectional area S4 of the second barrier wall 311b, and the first barrier wall 311a has no overlapping side with the display assembly 2, when printing the first barrier wall 311a, the first barrier wall 311a uses less adhesive fluidity, can maintain a better shape, and can overlap multiple layers of the first barrier wall 311a. Since the edge of the heat dissipation plate 22 is recessed relative to the edge of the display panel 21 on the side of the second edge b, the topography covered by the second barrier wall 311b is in a stepped shape, so that the adhesive used by the second barrier wall 311b is prone to flow away from the edge of the cover plate 1 on the side of the second edge b, so that the surface of the second barrier wall 311b on the side close to the cover plate 1 has a larger inclination. When printing the upper layer of the second barrier wall 311b away from the cover plate 1 on the side of the first layer of the second barrier wall 311b closest to the cover plate 1, the upper layer of the second barrier wall 311b is prone to flow away from the cover plate 1 on the side of the second edge b, so that the topography of the upper layer of the second barrier wall 311b is prone to change. As shown in FIG. 13, the present disclosure sequentially recesses multiple layers of the second barrier wall 311b in the direction Y away from the cover plate, so as to reduce the change of the topography of the upper layer of the second barrier wall 311b.

[0166] It should be understood that the second edge b shown in FIG. 13 is actually a cross section of a point on the second edge b.

[0167] Please continue to refer to FIG. 13, the first barrier 31 includes two layers of the second barrier wall 311b stacked; the first layer of the second barrier wall 311b is located on the side of the cover plate 1 close to the display panel 21, the side of the first layer of the second barrier wall 311b close to the second barrier 32 abuts against the edge of the heat dissipation plate 22, and the side of the first layer of the second barrier wall 311b away from the second barrier 32 is close to the edge of the cover plate 1.

[0168] The second layer of the second barrier wall 311b is located on the side of the first layer of the second barrier wall 311b away from the cover plate 1, the side of the second layer of the second barrier wall 311b away from the second barrier 32 is recessed relative to the side of the first layer of the second barrier wall 311b away from the second barrier 32, and the side of the first layer of the second barrier wall 311b close to the second barrier 32 is recessed relative to the second edge b of the heat dissipation plate 22.

[0169] The part of the first enclosure 31 at the position of the second edge b is provided as two layers of the second retaining wall 311b, the first layer of the second retaining wall 311b closest to the cover plate 1 abuts the edge of the second edge of the heat dissipation plate 22 and extends to the edge close to the cover plate 1, and the second layer of the second retaining wall 311b is arranged to be recessed from the side of the first layer of the second retaining wall 311b away from the first edge b, and the second layer of the second retaining wall 311b extends from the side of the second edge b of the heat dissipation plate 22 away from the edge of the cover plate 1 to the side close to the edge of the cover plate 1 close to the first layer of the second retaining wall 311b, so that the second layer of the second retaining wall 311b is placed in a relatively flat area, and the appearance of the second layer of the second retaining wall 311b is changed.

[0170] In some embodiments, the filling layer 33 can be formed of one material.

[0171] In some other embodiments, the filling layer 33 can be formed of multiple materials.

[0172] In some embodiments, the filling layer 33 at the position corresponding to the second edge b is formed of the same material as the second retaining wall 311b.

[0173] If the second retaining wall 311b is formed of glue with a viscosity greater than or equal to 300w, the part of the filling layer 33 at the position corresponding to the second edge b is also formed of the glue.

[0174] In the embodiments provided in the present disclosure, by using the same material for the filling layer 33 at the position corresponding to the second edge b and the second retaining wall 311b, the part of the filling layer 33 at the position corresponding to the second edge b can be printed after the second retaining wall 311b and the second enclosure 32 are printed, so that the material does not need to be replaced, and the printing efficiency is improved.

[0175] Please refer to FIG. 14 for a structure diagram of a filling layer provided in an embodiment of the present disclosure. The filling layer 33 comprises:

[0176] The inner filling layer 331 is located in the bending space formed after the flexible circuit board 23 is bent.

[0177] The outer filling layer 332 is located outside the inner filling layer 331.

[0178] After the flexible circuit board 23 is bent, the bending space has two open ends in the width direction of the flexible circuit board 23 (the direction perpendicular to the paper in FIG. 14), and the inner filling layer 331 and the outer filling layer 332 can be formed by filling the adhesive into the bending space in a way that one open end is filled with glue and the other open end is sucked with glue, and the outer filling layer 332 can be printed into the first groove a1 between the first enclosure 31 and the second enclosure 32 after the first enclosure 31 and the second enclosure 32 are formed.

[0179] In the embodiments provided in the present disclosure, by filling the inner layer filling layer 331 in the bending space and the outer layer filling layer 332 outside the bending space with different materials, the inner layer filling layer 331 in the bending space can be formed by using different processes, and the filling rate of the inner layer filling layer 331 in the bending space is improved, so that the stability of the bending area C of the flexible circuit board 23 is improved, and the bending area C of the flexible circuit is protected from being damaged.

[0180] Please refer to FIG. 15 for a partial top view of a display device provided in an embodiment of the present disclosure.

[0181] The bending area C of the flexible circuit board 23 has two through holes H1 penetrating through the flexible circuit board 23, and the two through holes H1 are respectively close to the two open ends of the bending space.

[0182] When the inner layer filling layer 33 is formed, after the flexible circuit board 23 is bent, the two open ends of the bending space formed after the flexible circuit board 23 is bent can be blocked, then an adhesive can be injected into one of the two through holes H1 opened in the bending area C of the flexible circuit board 23, until the other through hole H1 overflows the adhesive to indicate that the adhesive in the bending space is full, and then the adhesive in the bending space is solidified to form the inner layer filling layer 331. Then the first barrier 31 and the second barrier 32 and the outer layer filling layer 332 can be formed.

[0183] In the embodiments provided in the present disclosure, by providing two through holes H1 in the bending area C of the flexible circuit board 23, and making the two through holes H1 respectively close to the two open ends of the bending space formed after the flexible circuit board 23 is bent, after the two open ends of the bending space are blocked, the inner layer filling layer 331 can be formed by injecting adhesive into one of the two through holes H1 and observing whether the other through hole H1 overflows the adhesive, so that the inner layer filling layer 331 can fill the bending space.

[0184] Please refer to FIG. 16 and FIG. 17, FIG. 16 is a schematic diagram of a flexible circuit board before bending provided in an embodiment of the present disclosure, and FIG. 17 is a schematic diagram of a flexible circuit board after bending provided in an embodiment of the present disclosure.

[0185] The display device further comprises:

[0186] The back film 24 is located between the heat dissipation plate 22 and the display panel 21, and covers the flexible circuit board 23; the back film 24 has a second groove 24a exposing the bending area C of the flexible circuit board 23, and the inner layer filling layer 331 is filled in the second groove 24a.

[0187] As shown in FIG. 16, before the flexible circuit board 23 is bent, an adhesive can be filled in the second groove 24a of the back film 24, and after pre-solidification (such as the solidification rate reaches a preset proportion), the flexible circuit board 23 is bent, and the inner layer filling layer 331 is formed as shown in FIG. 17.

[0188] In the embodiments provided in the present disclosure, by filling the inner layer filling layer 331 in the second groove 24a of the flexible circuit board 23 exposed by the back film 24, the inner layer filling layer 331 can be formed before the flexible circuit board 23 is bent, and the filling rate of the inner layer filling layer 331 in the bending area C is improved.

[0189] Please refer to FIG. 18 and FIG. 19 for the structural schematic diagram of another display device provided in the embodiments of the present disclosure. The display device further comprises:

[0190] The middle frame 5 comprises a first part 51 and a second part 52. The first part 51 is located on the side of the edge sealing structure 3 away from the cover plate 1, and the second part 52 extends from the edge of the first part 51 to the edge of the cover plate 1 and overlaps with the cover plate 1;

[0191] The middle frame glue 6 is located between the edge sealing structure 3 and the first part 51;

[0192] The end of the second part 52 close to the cover plate 1 has an overlapping groove 52a overlapping with the edge of the cover plate 1, one side of the overlapping groove 52a abuts against the edge of the cover plate 1 close to the display panel 21, and the other side of the overlapping groove 52a overlaps with the side of the cover plate 1.

[0193] The width w4 of the overlapping groove 52a ranges from 35 to 65 um.

[0194] As shown in FIG. 18 and FIG. 19, for the scheme that the first barrier 31 does not overlap with the display assembly 2 (including the scheme that the annular groove 4a is arranged in the ink layer 4 and the scheme that the annular groove 4a is not arranged), the second part 52 of the middle frame 5 close to the first barrier 31 is perpendicular to the cover plate 1, and the overlapping groove 52a abutting against the edge of the cover plate 1 close to the display panel 21 is arranged on the side close to the cover plate 1, so that the middle frame 5 can be overlapped on the side of the cover plate 1 close to the display panel 21, and part of the stress can be shared to prevent the edge of the display assembly 2 from being damaged.

[0195] Please refer to FIG. 20 for the structural schematic diagram of another display device provided in the embodiments of the present disclosure. The second part 52 abuts against the multi-layer second barrier wall 311b in the first barrier 31, and the surface of the second part 52 abutting against the multi-layer second barrier wall 311b is a bevel surface.

[0196] In the direction of the cover plate 1 pointing to the display panel 21, the multi-layer second barrier wall 311b is gradually retracted, and the surface of the second part 52 of the middle frame 5 abutting against the multi-layer second barrier wall 311b can be arranged as a bevel surface matching the retraction amount of the second barrier wall 311b as shown in FIG. 20, so that the bevel surface of the second part 52 can be abutted against the second barrier wall 311b, and the overlapping groove 52a is arranged at the end of the bevel surface close to the cover plate 1, so that the middle frame 5 can be overlapped on the back of the cover plate 1 to share the stress and protect the edge of the display assembly 2.

[0197] Please refer to Fig. 21 for a top view of another display device provided by the embodiments of the present disclosure. The display assembly 2 further comprises:

[0198] At least one first accommodating hole H2 is located in the display assembly 2 at a position corresponding to the second side b, and the first enclosing wall 31 is arranged along the edge of the first accommodating hole H2. The first accommodating hole H2 can be used to accommodate an earpiece, and the portion of the first enclosing wall 31 arranged along the edge of the first accommodating hole H2 is a bevel.

[0199] Please refer to Fig. 22 for a sectional view of the EE' direction in Fig. 21 provided by the embodiments of the present disclosure. The portion of the first enclosing wall 31 arranged along the edge of the first accommodating hole H2 is a bevel.

[0200] Fig. 23 shows a sectional view of the FF' direction in Fig. 21 provided by the embodiments of the present disclosure. The first accommodating hole H2 can also be used to accommodate a button (such as a power button, a volume button, etc.), and in this case, the portion of the first enclosing wall 31 arranged along the edge of the first accommodating hole H2 is perpendicular to the cover plate 1.

[0201] In the embodiments provided by the present disclosure, by arranging the first enclosing wall 31 along the edge of the first accommodating hole H2, full avoidance of the device accommodated in the first accommodating hole H2 can be achieved. By arranging the first enclosing wall 31 along the edge of the first accommodating hole H2 for accommodating the earpiece as a bevel, not only full avoidance of the earpiece can be achieved, but also sound diffusion can be facilitated and echo can be reduced.

[0202] Please refer to Figs. 24 and 25 for a top view of another display device provided by the embodiments of the present disclosure, and Fig. 26 for a sectional view of the GG' direction in Fig. 24 provided by the embodiments of the present disclosure. The display assembly 2 further comprises:

[0203] A second accommodating hole H3 is located in the area enclosed by the edge sealing structure 3, and the second enclosing wall 32 extends towards the second accommodating hole H3 and surrounds the outside of the second accommodating hole H3. The second accommodating hole H3 can be used to accommodate a camera;

[0204] The edge sealing structure 3 further comprises a third enclosing wall 34, which surrounds the second accommodating hole H3 and is located in the area enclosed by the second enclosing wall 34. The third enclosing wall 34 is located on the side surface of the cover plate 1 close to the display panel 21. The filling layer 33 also fills the space enclosed by the third enclosing wall 34 and the second enclosing wall 32.

[0205] The second enclosing barrier 32 can extend to the second accommodating hole H3 by one straight line and surround the second accommodating hole H3 along the edge of the second accommodating hole H3 as shown in FIG. 24, or extend to the second accommodating hole H3 by two straight lines and surround the second accommodating hole H3 along the edge of the second accommodating hole H3 as shown in FIG. 25. Regardless of the extending mode of the second enclosing barrier 32, the third enclosing barrier 34 is arranged on the side surface of the cover plate 1 close to the display panel 21, and the filling layer 33 is further filled in the space enclosed by the third enclosing barrier 34 and the second enclosing barrier 32.

[0206] In the embodiments provided in the present disclosure, by extending the second enclosing barrier 32 to the direction of the second accommodating hole H3 and surrounding the edge of the second accommodating hole H3, and arranging the third enclosing barrier 34 on the side surface of the cover plate 1 close to the display panel 21 and filling the filling layer 33 between the second enclosing barrier 32 and the third enclosing barrier 34, the edge of the second accommodating hole H3 and the edge of the display device can be integrally sealed, and the second accommodating hole H3 can be effectively protected.

[0207] Please refer to FIGS. 27-28, which are top views of another display device provided in the embodiments of the present disclosure, and FIG. 29 is a sectional view in the direction of MM' in FIG. 27. The flexible circuit board 23 further comprises:

[0208] a driving chip 231, the flexible circuit board 23 is attached to the side of the heat dissipation plate 22 away from the cover plate 1, and the driving chip 231 is located on the side of the flexible circuit board 23 away from the heat dissipation plate 22;

[0209] the second enclosing barrier 32 at least half-surrounds the driving chip 231 along the periphery of the driving chip 231, and the filling layer 33 is further filled in the corresponding area of the driving chip 231.

[0210] As shown in FIG. 27, the second enclosing barrier 32 can extend to the direction of the driving chip 231 and half-surround the driving chip 231 along the edge of the driving chip 231, or as shown in FIG. 28, the second enclosing barrier 32 can extend to the direction of the driving chip 231 and fully surround the driving chip 231, and the filling layer 33 is further filled in the space surrounded by the second enclosing barrier 32.

[0211] In the embodiments provided in the present disclosure, by extending the second enclosing barrier 32 to the direction of the driving chip 231 and at least half-enclosing the driving chip 231, and filling the filling layer 33 in the area at least half-enclosed by the second enclosing barrier 32, the protection of the driving chip 231 can be strengthened by the sealing structure 3.

[0212] The display device can be an Organic Light-Emitting Diode (OLED) display, an OLED display screen, an OLED television, or the like, and can also be a mobile device such as a mobile phone, a tablet computer, a notebook computer, or the like.

[0213] Based on the same inventive concept, the disclosure provides a manufacturing method of a display device, as shown in FIG. 30, the manufacturing method comprises the following steps:

[0214] S11: providing a display assembly 2 and a cover plate 1; the cover plate 1 is located on the light-emitting surface of the display assembly 2; the display assembly 2 comprises a display panel 21, a heat dissipation plate 22 located on the side of the display panel 21 away from the cover plate 1, and a flexible circuit board 23 bonded to the display panel 21; the edge of the heat dissipation plate 22 is recessed relative to the edge of the display panel 21; the heat dissipation plate 22 comprises a first edge a and a second edge b; the two ends of the first edge a and the two ends of the second edge b are connected; the flexible circuit board 23 is arranged close to the first edge a; and the flexible circuit board 23 is attached to the side of the heat dissipation plate 22 away from the display panel 21 after being bent.

[0215] S12: forming an edge sealing structure 3 on the side of the cover plate 1 close to the display assembly 2, the edge sealing structure 3 covering at least the edge of the first edge a of the heat dissipation plate 22 and extending to the edge of the cover plate 1; the edge sealing structure 3 comprises a first barrier 31, a second barrier 32, and a filling layer 33; the first barrier 31 is located on the side of the cover plate 1 close to the display panel 21 and is arranged at least close to the edge of the cover plate 1 corresponding to the first edge a; the second barrier 32 is located on the side of the heat dissipation plate 22 away from the cover plate 1 and is arranged at least along the first edge a; and the filling layer 33 fills the first recess a1 formed by the first barrier 31, the second barrier 32, the display assembly 2, and the cover plate 1; and the bending area C of the flexible circuit board 23 is located in the first recess a1.

[0216] When the edge sealing structure 3 covers the edge of the first edge a of the heat dissipation plate 22 and extends to the edge of the cover plate 1, as shown in FIG. 31, a manufacturing diagram of an edge sealing structure according to an embodiment of the disclosure, the following methods can be used to achieve the same:

[0217] S21: forming the second barrier 32 on the side of the heat dissipation plate 22 away from the cover plate 1 along the first edge a close to the heat dissipation plate 22;

[0218] The second barrier 32 can be formed by printing, for example, a layer of adhesive is printed on the side of the heat dissipation plate 22 away from the cover plate 1 along the first edge a close to the heat dissipation plate 22 to form the second barrier 32; or multiple second sub-barriers 321 can be reciprocally printed along the first edge a close to the heat dissipation plate 22 to form the second barrier 32 (see FIG. 6).

[0219] S22: Print the first enclosure 31 along the edge of the cover plate 1 on the side close to the display assembly 2, and connect the two ends of the first enclosure 31 with the two ends of the second enclosure 32, so that the first enclosure 31, the second enclosure 32, the display assembly 2 and the cover plate 1 together enclose the first recess a1.

[0220] When printing the first enclosure 31, it can also be achieved by printing, for example, on the side of the cover plate 1 close to the display assembly 2, taking the position where the printing of the second enclosure 32 ends as the starting position of printing, printing a U-shaped first enclosure 31, the horizontal line of the U shape being parallel to the first edge a of the heat dissipation plate 22, and the two ends of the second enclosure 32 on the same side of the flexible circuit board 23 being connected by a vertical line of the U shape, so that the first enclosure 31, the second enclosure 32, the display assembly 2 and the cover plate 1 together enclose the first recess a1.

[0221] The first enclosure 32 can also be composed of multiple layers of first sub-enclosures 311 (see FIG. 6), and each layer of first sub-enclosures 311 has the same shape, such as a U shape.

[0222] S23: Fill the filling layer 33 in the first recess a1.

[0223] The filling layer 33 can also be formed by printing, or it can be formed by other means, which are not limited here. After that, the entire edge sealing structure 3 can be cured as a whole.

[0224] It should be understood that the printing of the multiple layers of second sub-enclosures 321 is achieved by reciprocating printing, and taking two layers of second sub-enclosures 321 as an example, after printing the first layer of second sub-enclosures 321 closest to the cover plate 1, the second layer of second sub-enclosures 321 is printed on the side of the first layer of second sub-enclosures 321 away from the cover plate 1, and the starting position of printing of the second layer of second sub-enclosures 321 is the end position of printing of the first layer of second sub-enclosures 321; when the second enclosure 32 contains more layers of second sub-enclosures 321, such as a third layer of second sub-enclosures 321 on the side of the second layer of second sub-enclosures 321 away from the cover plate 1, the starting position of printing of the third layer of second sub-enclosures 321 is the end position of printing of the second layer of second sub-enclosures 321, so that printing is to avoid moving the glue valve for a long distance and improve printing efficiency; in fact, the glue valve can also be moved to the starting position of printing of the first layer of second sub-enclosures 321 to start printing the second layer of second sub-enclosures 321 after printing the first layer of second sub-enclosures 321. Similarly, when starting to print the first enclosure 31, the starting position of printing of the first enclosure 31 can also be the starting position of printing of the second enclosure 32, but the printing glue valve needs to be moved, and the printing efficiency is slightly lower.

[0225] In the embodiments provided in the present disclosure, the edge covering at least the first edge a of the heat dissipation plate 22 and extending to the edge of the cover plate 1 is formed on the side of the cover plate 1 close to the display assembly 2, and the edge covering structure 3 is formed, and the edge covering structure 3 comprises a first enclosing wall 31, a second enclosing wall 32 and a filling layer 33; the first enclosing wall 31 is located on the side of the cover plate 1 close to the display panel 21, and is arranged at least close to the edge of the cover plate 1 corresponding to the first edge a; the second enclosing wall 32 is located on the side of the heat dissipation plate 22 away from the cover plate 1, and is arranged at least along the first edge a; the filling layer 33 fills the first recess a1 enclosed by the first enclosing wall 31, the second enclosing wall 32, the display assembly 2 and the cover plate 1; the flexible circuit board 23 is located on the side of the first edge a of the heat dissipation plate 22, and the bending area C of the flexible circuit board 23 is located in the first recess a1, so that the inside and outside of the bending area C of the flexible circuit board 23 are integrally filled, and in the whole machine assembly of the display device, the middle frame 4' in FIG. 1 can be directly overlapped on the edge covering structure 3, at least the minimum overlapping space required by the middle frame 4' in the prior art shown in FIG. 1 is saved, so that the distance from the vertex of the bending area C of the flexible circuit board 23 to the edge of the cover plate 1 can be effectively reduced, and the narrow frame design can be realized.

[0226] In some embodiments, the edge covering at least the first edge a of the heat dissipation plate 22 and extending to the edge of the cover plate 1 on the side of the cover plate 1 close to the display assembly 2 can be realized by the following ways:

[0227] The first enclosing wall 31 is formed by printing a plurality of layers of first sub-enclosing walls 311 around the edge of the cover plate 1 on the side of the cover plate 1 close to the display assembly 2; and the side of the first enclosing wall 31 away from the second enclosing wall 32 is close to the edge of the cover plate 1.

[0228] The second enclosing wall 32 is formed by printing a plurality of layers of second sub-enclosing walls 321 around the edge of the heat dissipation plate 22 on the side of the display assembly 2 away from the cover plate 1; the printing speed of the second sub-enclosing walls 321 at the position corresponding to the first edge a is lower than the printing speed of the second sub-enclosing walls 321 at the position corresponding to the second edge b; and the side of the second enclosing wall 32 close to the first enclosing wall 31 is recessed relative to the heat dissipation plate 22.

[0229] The first recess a1 is filled with a filling agent to form the filling layer 33.

[0230] Please refer to FIG. 32 for a schematic diagram of forming the edge covering structure provided in the embodiments of the present disclosure.

[0231] S31: forming the first enclosing wall 31.

[0232] On the side of the cover plate 1 close to the display panel 21, a plurality of layers of the first sub-enclosure 311 are printed around the edge of the cover plate 1. For example, if six layers of the first sub-enclosure 311 are printed, the first layer of the first sub-enclosure 311 can be printed in a counterclockwise direction along the edge of the cover plate 1; the second layer of the first sub-enclosure 311 can be printed in a clockwise direction along the edge of the cover plate 1, with the end position of the printing of the first layer of the first sub-enclosure 311 as the starting position of the printing of the second layer of the first sub-enclosure 311; and so on until the printing of the sixth layer of the first sub-enclosure 311 is completed, thus completing the printing of the first enclosure 31. By using the end position of the printing of the previous layer of the first sub-enclosure 311 as the starting position of the printing of the next layer of the first sub-enclosure 311, the printing head does not need to be moved when the printing layer is changed, thus effectively improving the printing efficiency.

[0233] The material used for the first sub-enclosure 311 can be an adhesive, such as glue. A direct writing air pressure valve can be used for printing. FIG. 33 is a schematic diagram of a direct writing air pressure valve printing principle provided in an embodiment of the present disclosure. For example, a direct writing air pressure valve with a glue valve head diameter of 2c can be selected, and the printing is performed at a preset printing air pressure and a speed of 2v; wherein c represents the diameter of a reference glue valve head, v represents the moving speed of the reference glue valve head (which will be used in the subsequent examples and will not be described separately), the preset printing air pressure is 445-845 psi, and the value range of the diameter of the glue valve head is 0.05-0.5 mm. The width of the first sub-enclosure 311 printed each time is 2c, and the height is 2c. After repeated printing for six times, a total of 12c of the first enclosure 31 is formed. If the position accuracy of the printing is ±50 um, a first spacing needs to be provided between the first enclosure 31 and the edge of the cover plate 1 to avoid overflow to the outer edge of the cover plate 1 when the first sub-enclosure 311 is printed, and the first spacing is greater than or equal to the printing accuracy, so the first spacing is at least 0.05 mm. The cross-sectional view of the first enclosure 31 at the first side a corresponding to the flexible circuit board 23 can be seen in FIG. 6, and the cross-sectional view of the first enclosure 31 at the second side b can be seen in FIG. 7.

[0234] S32: Forming the second enclosure 32.

[0235] After the first enclosure 31 is printed, a plurality of second sub-enclosures 321 are printed along the edge of the heat dissipation plate 22 on the side of the heat dissipation plate 22 away from the cover plate 1. For example, two layers of second sub-enclosures 321 are printed. The first layer of second sub-enclosures 321 closest to the cover plate 1 can be printed from either end of the edge of the heat dissipation plate 22 in a counterclockwise direction along the edge of the heat dissipation plate 22. The second layer of second sub-enclosures 321 on the side of the first layer of second sub-enclosures 321 away from the cover plate 1 is printed in a clockwise direction along the edge of the heat dissipation plate 22 starting from the end position of the first layer of second sub-enclosures 321, thereby completing the printing of the second enclosure 32. The second sub-enclosures 321 printed on the first side a have a smaller longitudinal cross-sectional area S1 than the second sub-enclosures 321 printed on the second side b. The straight writing air pressure valve with a glue valve head diameter of 2c can still be used to print the second sub-enclosures 321 at a preset printing air pressure and speed 2v, but the speed needs to be reduced, for example, from 2v to v, when printing the part of the second sub-enclosures 321 corresponding to the first side a, so that the side of the second enclosure 32 away from the cover plate 1 is in the same plane as the side of the first enclosure 31 away from the cover plate 1, thereby maintaining the uniformity of the overall height. Please refer to FIGS. 6 and 7. Of course, if the part of the second sub-enclosures 321 corresponding to the first side a is printed first, then the speed needs to be increased when printing the part of the second sub-enclosures 321 corresponding to the second side b.

[0236] Since the same size straight writing air pressure valve is used to print the first enclosure 31 and the second enclosure 32, the print head does not need to be replaced, thereby improving the printing efficiency.

[0237] In some embodiments, the first sub-enclosures 311 and the second sub-enclosures 321 can be made of the same material.

[0238] S33: Forming a filling layer 33.

[0239] After the first enclosure 31 and the second enclosure 32 are printed, the first enclosure 31 and the second enclosure 32 need to be solidified for the first time. For example, the entire surface can be solidified using an ultraviolet lamp. The wavelength of the solidification is in the range of 256-475 nm, and the solidification time is in the range of 14-26 s.

[0240] After that, the first groove a1 formed by the first enclosing wall 31, the second enclosing wall 32 and the cover plate 1 can be filled with a filling layer, which can be flattened and compacted by using an electromagnetic valve. As shown in FIG. 34, it is a printing schematic diagram of an electromagnetic valve provided by the embodiment of the present disclosure. The electromagnetic valve corresponding to the glue valve has a diameter of c, and reciprocates at a speed of 7v for 50 times to form a filling layer 33 consistent with the height of the first enclosing wall 31. During each printing, the distance between the glue valve and the cover plate 1 remains unchanged, such as the distance between the glue valve and the cover plate 1 is always the height of the first enclosing wall 31. The first sub-enclosing wall 311 printed last time overlaps the first sub-enclosing wall 311 printed last time, until the last layer of the first sub-enclosing wall 311 is printed. When the last layer of the first sub-enclosing wall 311 is printed, the glue valve is close to the glue, so that the side of the last layer of the first sub-enclosing wall 311 away from the cover plate 1 is flattened by the glue valve, and the printing of the first enclosing wall 31 is completed. The surface form of the side of the last layer of the first sub-enclosing wall 311 away from the cover plate 1 is shown in FIG. 33, and FIG. 35 is a position schematic diagram of the glue valve and the cover plate provided by the embodiment of the present disclosure.

[0241] The printing of the edge sealing structure 3 is completed through the above steps S31-S33, and then the entire edge sealing structure 3 is secondly cured, such as the whole surface is cured by using an ultraviolet lamp. The corresponding production process is shown in FIG. 34, and FIG. 36 is a production process schematic diagram of forming an edge sealing structure provided by the embodiment of the present disclosure. In the production process of the edge sealing structure 3, in addition to the printing and curing process introduced above, before printing the first layer of the first sub-enclosing wall 311, it is also necessary to perform loading and cleaning, such as plasma cleaning. After the second curing is completed, product detection is also needed, such as overall detection of the display device according to the delivery standard.

[0242] In other embodiments, before the edge of the first side a of the cover plate 1 close to the display assembly 2 extends to the edge sealing structure 3 covering at least the heat dissipation plate 22, it further includes:

[0243] forming an ink layer 4 on the side of the cover plate 1 close to the display assembly 2;

[0244] forming a ring-shaped groove 4a around the edge of the ink layer 4 on the side of the cover plate 1 away from the display assembly 2;

[0245] printing a plurality of layers of the first sub-enclosing wall 311 around and close to the edge of the cover plate 1 on the side of the cover plate 1 close to the display assembly 2 to form the first enclosing wall 31, including:

[0246] printing a plurality of layers of the first sub-enclosing wall 311 in the ring-shaped groove 4a to form the first enclosing wall 31.

[0247] Please refer to FIG. 37 for a schematic diagram of forming a ring-shaped groove provided by the embodiment of the present disclosure.

[0248] As shown in Fig. 37, after the ink layer 4 is printed, an additional adhesion is performed at the edge of the ink layer 4 (i.e. the edge of the cover plate 1) using a small head with a width W' (e.g. W' ranges from 0.14mm to 2.6mm), which removes the ink layer 4 at the corresponding position that is not completely cured to form a small groove with a width W' and a height less than or equal to the thickness of the ink layer 4. The small head moves around the edge of the ink layer 4 for one round to obtain a ring-shaped groove 4a; and then, the multi-layer first sub-enclosure 311 is printed in the ring-shaped groove 4a.

[0249] In some embodiments, the multi-layer first sub-enclosure 311 is printed along the edge of the cover plate 1 on the side of the cover plate 1 close to the display assembly 2 to form the first enclosure 31, which can be achieved by the following methods:

[0250] The first layer of the second wall 311b corresponding to the second edge b is printed on the side of the cover plate 1 close to the display assembly 2; the side of the first layer of the second wall 311b away from the second enclosure 32 is close to the edge of the cover plate 1, and the side of the first layer of the second wall 311b close to the second enclosure 32 abuts the edge of the second edge b;

[0251] The second layer of the second wall 311b corresponding to the second edge b is printed on the side of the first layer of the second wall 311b away from the cover plate 1; the side of the second layer of the second wall 311b away from the second enclosure 32 is recessed relative to the side of the first layer of the second wall 311b away from the second enclosure 32, and the side of the second layer of the second wall 311b close to the second enclosure 32 is recessed relative to the edge of the second edge b;

[0252] The multi-layer first wall 311a corresponding to the first edge a is printed on the side of the cover plate 1 close to the display assembly 2, and the first wall 311a does not overlap the display assembly 2; wherein the second enclosure 32 is printed after the multi-layer second wall 311b is printed and before the multi-layer first wall 311a is printed, the longitudinal sectional area of the second wall 311b is larger than that of the first wall 311a, and the multi-layer first wall 311a and the multi-layer second wall 311b are connected end to end. The number of layers of the multi-layer first wall 311a and the multi-layer second wall 311b can be different.

[0253] The first groove 4a is filled with a filler to form the filling layer 33, which can be achieved by the following methods:

[0254] After the second enclosure 32 is formed, the multi-layer first wall 311a is formed before the first groove 4a is filled with a filler to form the filling layer 33; and the first enclosure 31, the second enclosure 32 and a part of the filling layer 33b are cured.

[0255] After the first barrier wall 311a is formed, the filling material is filled and solidified in the space of the first groove 4a corresponding to the first barrier wall 311a, to form another part of the filling layer 33a corresponding to the first barrier wall 311a in the filling layer 33; wherein the filling agent includes a first adhesive and a filling material.

[0256] The position where the multi-layer first barrier wall 311a and the multi-layer second barrier wall 311b intersect in the edge sealing structure 3 is locally milled, so that the edge sealing structure 3 is flush with the side of the cover plate away from the cover plate.

[0257] Please refer to FIG. 38 for a schematic diagram of forming another edge sealing structure provided by the present disclosure.

[0258] S41: Form the first layer of the second barrier wall 311b.

[0259] From the right end of the flexible circuit board 23 shown in FIG. 38, print along the edge of the cover plate 1 in the counterclockwise direction on the side of the cover plate 1 close to the display panel to the left end of the flexible circuit board 23 shown in FIG. 38, to form the first layer of the second barrier wall 311b corresponding to the second edge b. The first layer of the second barrier wall 311b also covers the part of the edge of the display panel 21 exposed to the edge of the heat dissipation plate 22, so that the side of the first layer of the second barrier wall 311b close to the second edge b of the heat dissipation plate 22 is in contact with the second edge b of the heat dissipation plate 22, and the side of the first layer of the second barrier wall 311b away from the cover plate 1 and the surface of the heat dissipation plate 22 form an approximately planar state, which facilitates printing the second layer of the second barrier wall 311b on the side of the first layer of the second barrier wall 311b away from the cover plate 1. At the same time, the side of the first layer of the second barrier wall 311b away from the second edge b needs to be reserved with a first interval d1 (as shown in FIG. 7) from the edge of the cover plate 1 to avoid overflow of the material (such as glue) used for printing the second barrier wall 311b to the outside of the edge of the cover plate 1.

[0260] S42: Form the second layer of the second barrier wall 311b.

[0261] After the first layer of the second barrier wall 311b is printed, the second layer of the second barrier wall 311b is printed along the first layer of the second barrier wall 311b in the counterclockwise direction from the end position of the first layer of the second barrier wall 311b, so that the side of the second layer of the second barrier wall 311b close to the edge of the cover plate 1 is recessed relative to the side of the first layer of the second barrier wall 311b close to the edge of the cover plate 1, and the side of the second layer of the second barrier wall 311b away from the edge of the cover plate 1 is located on the side of the second edge b away from the edge of the cover plate 1.

[0262] The longitudinal section area of the first layer second barrier wall 311b and the second layer second barrier wall 311b can be the same, if the same, the second layer second barrier wall 311b can be set in the first layer second barrier wall 311b as shown in FIG. 13 when printing the second layer second barrier wall 311b; the longitudinal section area of the first layer second barrier wall 311b and the second layer second barrier wall 311b can also be different, the width of the second layer second barrier wall 311b can be greater than the width of the first layer second barrier wall 311b, as shown in FIG. 39 and FIG. 40, FIG. 39 is a size schematic diagram of the first layer second barrier wall provided by the embodiment of the present disclosure, and FIG. 40 is a size schematic diagram of the second layer second barrier wall provided by the embodiment of the present disclosure, the first layer second barrier wall 311b with a width w'5 of 7c and a height h5 of 6c can be printed, and the second layer second barrier wall 311b with a width w5 of 9c and a height h5 of 6c can be printed, so that the side of the first layer second barrier wall 311b close to the edge of the cover plate 1 is aligned with the side of the second layer second barrier wall 311b close to the edge of the cover plate 1, thus forming a part of the first surrounding barrier 31 corresponding to the second edge with a height of 12c.

[0263] S43: forming a second surrounding barrier 32;

[0264] After printing the second layer second barrier wall 311b, the second surrounding barrier 32 around the edge of the heat dissipation plate 22 is printed from the position corresponding to the edge of the heat dissipation plate 22 to the position where the printing of the second layer second barrier wall 311b ends as the starting position, the second surrounding barrier 32 can be composed of a first layer second sub-surrounding barrier 321, wherein the longitudinal section area S1 of the part of the first layer second sub-surrounding barrier 321 corresponding to the first edge a is less than the longitudinal section area S2 of the part of the first layer second sub-surrounding barrier 321 corresponding to the second edge b. For example, it is assumed that due to the bending of the flexible circuit board 23, the film thickness of the display assembly 2 at the first edge a position increases, so the height of the part of the first layer second sub-surrounding barrier 321 located at the first edge a is less than the height of the part of the first layer second sub-surrounding barrier 322 located at the second edge b. If the width of the part of the first layer second sub-surrounding barrier 321 located at the second edge b is 9c and the height is 6c, the width of the part of the first layer second sub-surrounding barrier 321 located at the first edge a is 6c and the height is 2c. In the case where the height of the glue valve does not change when printing the part of the first layer second sub-surrounding barrier 321 located at the second edge b, the printing speed v can be used when printing the part of the first layer second sub-surrounding barrier 321 located at the second edge b, and the printing speed 0.3v can be used when printing the part of the first layer second sub-surrounding barrier 321 located at the first edge a. The above printing process can use a direct writing air pressure valve, the diameter of the glue valve is 8cmm, and the value range of the air pressure is 56-104psi.

[0265] S44: forming a part of the filling layer 33b;

[0266] After printing the second barrier 32, the first adhesive can be printed in the space of the first groove a1 corresponding to the second barrier wall 311b, to obtain a part of the filling layer 33b corresponding to the second side b. The printing can be started from the position where the printing of the second barrier 32 is ended, and the distance between the printing head (i.e. the glue valve) and the cover plate 1 can be kept unchanged during the printing, for example, the printing head is close to the side of the second barrier 32 and the multi-layer second barrier wall 311b away from the cover plate 1, and a part of the filling layer 33b is flattened, as shown in FIG. 41, which is another flattening schematic diagram provided by the embodiment of the present disclosure. The materials of the first barrier 31 and the second barrier 32 can be the first adhesive.

[0267] S45: forming the multi-layer first barrier wall 311a.

[0268] On the side of the cover plate 1 close to the display panel 21, the multi-layer first barrier wall 311a is reciprocatingly printed along the edge of the cover plate 1 corresponding to the first side a, to form the part of the first barrier 31 corresponding to the first side a. For example, the direct writing air pressure valve is used, the glue valve diameter is 2c, the preset printing air pressure and speed are 2v, the printing width of the first barrier wall 311a is 2c and the height is 2c, the reciprocating printing is performed 6 times, and 6 layers of the first barrier wall 311a are formed, so that the part of the first barrier 31 corresponding to the first side a is printed and formed, which can be referred to FIG. 14.

[0269] S46: forming another part of the filling layer 33a.

[0270] After printing the multi-layer first barrier wall 311a, the filling agent can be filled in the space of the first groove a1 corresponding to the first barrier wall 311a, to obtain another part of the filling layer 33a corresponding to the first side a. The electromagnetic valve can be used for printing, for example, the low-viscosity glue (filling agent) with a viscosity less than 200 cps is selected, the glue valve diameter is c, the printing speed is 7v, and the reciprocating printing is performed 50 times, and the distance between the glue valve and the cover plate 1 is kept unchanged during each printing, and the glue valve is close to the glue printing during the printing ending process, and the flattening mode is similar to that of FIG. 41, which will not be described herein.

[0271] The printing of the edge sealing structure 3 can be completed through steps S41-S46. Since the longitudinal section area of the printed second barrier wall 311b and the second sub-enclosure 321 is larger than the longitudinal section area of the first sub-enclosure 311 and the second sub-enclosure 321 printed in steps S21-S23, the total number of printing is less, and the printing efficiency can be effectively improved. The edge sealing structure 3 obtained through steps S31-S33 does not have the problem of the guide angle as the edge sealing structure 3 obtained through steps S31-S36, and does not need to use the milling process and does not have the risk of particles, so one milling process can be saved. In the above process, after completing the printing of part of the filling layer 33b, the ultraviolet lamp can be used to perform the first curing on the part corresponding to the second edge b of the edge sealing structure 3; after completing the printing of another part of the filling layer 33a, the ultraviolet lamp can be used to perform the second curing on the part corresponding to the first edge a of the edge sealing structure 3.

[0272] Since the first barrier wall 311a and the second barrier wall 311b intersect at the position of the starting printing end or the ending printing end during printing, there is obvious glue accumulation in the region where the first barrier wall 311a and the second barrier wall 311b intersect. After the product is completely cured, a local milling process can be used to locally mill the region where the first barrier wall 311a and the second barrier wall 311b intersect, so that the region where the multi-layer first barrier wall 311a and the multi-layer second barrier wall 311b intersect is away from one side of the cover plate 1 and keeps flat with the whole edge sealing structure 3. As shown in FIG. 42, a milling process provided by the embodiment of the present disclosure is shown. The milling process can use a milling head with a diameter of 2 mm, and the rotational speed reaches a preset rotational speed. The preset rotational speed is in the range of 700-1300 rpm. After milling, the surface flatness is within ±100 μm. During the milling process, local particles are generated. The present disclosure uses a blowing+gas suction device to remove surface foreign matter and improve the cleanliness of the surface. As shown in FIG. 43, a milling structure provided by the embodiment of the present disclosure is shown. The milling mechanism includes a milling head, a blowing port, and a gas suction port.

[0273] Based on the above process conditions, the part of the first enclosure 31 formed by the multi-layer second barrier wall 311b will form a slope angle θ of 10.5°-19.5° (local concave 35-65 μm), and the lower edge has no slope angle (local concave 3.5-6.5 μm), as shown in FIG. 44. As shown in FIG. 45, another manufacturing process of the edge sealing structure provided by the embodiment of the present disclosure is shown.

[0274] In the above process, when printing the filling layer 33, if the printing material used by the filling layer 33 has poor fluidity, the printing material cannot sufficiently flow into the bending space formed after the flexible circuit board 23 is bent, and thus the filling layer 33 cannot better fill the bending area C of the flexible circuit board 23. Therefore, the present disclosure provides the following methods to improve the filling rate of the bending area C and protect the bending area C of the flexible circuit board 23.

[0275] In some other embodiments, before the flexible circuit board 23 is bent, the inner filling layer 331 of the filling layer 33 can be formed in the following manner:

[0276] The second adhesive is filled and solidified in the second groove 24a of the back film 24, so that the solidification rate of the second adhesive reaches a preset proportion; the back film 24 is located between the display panel 21 and the heat dissipation plate 22 and covers part of the flexible circuit board 23; the second groove 24a exposes the bending area C of the flexible circuit board 23.

[0277] The flexible circuit board 23 is bent, so that the solidified second adhesive is filled in the bending space formed after the flexible circuit board 23 is bent, and the inner filling layer 331 of the filling layer 33 is formed; for the sake of distinction, the filling layer 33 formed by printing in the foregoing embodiments can be referred to as an outer filling layer 332.

[0278] For example, as shown in FIG. 16, the second adhesive is filled and solidified in the second groove 24a of the back film 24, so that the solidification rate of the second adhesive reaches a preset proportion, and the preset proportion is in a range of 80% to 98%; then the flexible circuit board 23 is bent, so that the solidified second adhesive is filled in the bending space formed after the flexible circuit board 23 is bent, and the inner filling layer 331 of the filling layer 33 is formed, as shown in FIG. 17.

[0279] In some other embodiments, after the flexible circuit board 23 is bent, the inner filling layer 331 of the filling layer 33 can also be formed in the following manner:

[0280] The second adhesive is injected into one opening end of the space formed after the flexible circuit board 23 is bent, and the second adhesive is adsorbed by a fan at the other opening end, so that the second adhesive is filled in the bending space formed after the flexible circuit board 23 is bent.

[0281] The second adhesive filled in the bending space is solidified to form the inner filling layer of the filling layer.

[0282] Please refer to FIG. 46 for a schematic diagram of filling the second adhesive into the bending space according to an embodiment of the present disclosure. The bending space formed after the flexible circuit board 23 is bent has two open ends. The second adhesive (e.g. glue) can be injected into the edge of one open end through the glue outlet to ensure that the local area is fully covered without leaving any gap. A high-power fan is used to resist the outlet at the other open end to uniformly adsorb the second adhesive. The second adhesive on the left is uniformly adsorbed and filled into the interior of the bending space to form the inner filling layer.

[0283] In some other embodiments, the inner filling layer 331 can also be formed after the flexible circuit board 23 is bent by the following method:

[0284] The two open ends of the bending space formed after the flexible circuit board 23 is bent are blocked. The bending area C of the flexible circuit board 23 has two through holes H1, and the two through holes H1 are respectively close to the two open ends.

[0285] The second adhesive is injected into the blocked bending space through one of the through holes H1 until the second adhesive overflows from the other through hole H1, so that the second adhesive is filled in the bending space formed after the flexible circuit board 23 is bent.

[0286] The second adhesive filled in the bending space is solidified to form the inner filling layer 331 of the filling layer 33.

[0287] As shown in FIG. 15, two through holes H1 can be arranged in the bending area C of the flexible circuit board 23, and the diameter of the through holes H1 ranges from 0.35 mm to 0.65 mm.

[0288] Please refer to FIG. 47 for another schematic diagram of filling the second adhesive into the bending space according to an embodiment of the present disclosure. After the flexible circuit board 23 is bent, the two open ends of the bending space formed after the flexible circuit board 23 is bent are blocked with the second adhesive (e.g. glue) to prevent the glue from overflowing during the subsequent glue injection process. Then, a glue valve with the same size as the two through holes H1 on the bending area C of the flexible circuit board 23 is inserted into one of the through holes H1 to uniformly inject the glue at a speed v. The bending space is fully filled with the glue, and the glue overflows at the other through hole H1, which indicates that the filling in the bending space is completed to form the inner filling layer 331.

[0289] Although the preferred embodiments of the present disclosure have been described, those skilled in the art can make additional changes and modifications to the embodiments once they know the basic creative concept. Therefore, the appended claims are intended to include all the preferred embodiments and all the changes and modifications falling within the scope of the present disclosure.

[0290] It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the spirit or scope of the disclosure. Thus, it is intended that the present disclosure cover the modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents.

Claims

1. A display device, wherein: include: cover; a display assembly located on one side of the cover plate; the display assembly includes a display panel, a heat sink located on a side of the display panel away from the cover plate, and a flexible circuit board bonded to the display panel, wherein an edge of the heat sink is indented relative to an edge of the display panel, the heat sink includes a first side and a second side, with two ends of the first side connected to two ends of the second side, the flexible circuit board is disposed near the first side, and is bent and attached to the side of the heat sink away from the display panel; An edge sealing structure covers at least the edge of the first side of the heat sink and extends to the edge close to the cover plate; the edge sealing structure includes a first enclosure, a second enclosure and a filling layer; the first enclosure is located on a side of the cover plate close to the display panel and is arranged at least along the edge of the cover plate corresponding to the first side; the second enclosure is located on a side of the heat sink away from the cover plate and is arranged at least along the first side of the heat sink; the filling layer is filled in a first groove jointly enclosed by the first enclosure, the second enclosure, the display assembly and the cover plate, and the bending area of ​​the flexible circuit board is located in the first groove.

2. The display device according to claim 1, wherein The edge sealing structure surrounds and covers the edge of the heat dissipation plate and extends to the edge close to the cover plate; The first enclosure surrounds the edge of the cover plate, and the side of the first enclosure away from the second enclosure is close to the edge of the cover plate; the second enclosure surrounds the edge of the heat sink, and the side of the second enclosure close to the first enclosure is indented relative to the edge of the heat sink.

3. The display device according to claim 2, wherein: The first enclosure includes multiple layers of stacked first sub-enclosures, and the first sub-enclosures are arranged around the edge of the cover plate; the second enclosure includes multiple layers of stacked second sub-enclosures, and the second sub-enclosures are arranged around the edge of the heat dissipation plate; The longitudinal section area of ​​the second sub-enclosure corresponding to the first side is smaller than the longitudinal section area of ​​the second sub-enclosure corresponding to the second side.

4. The display device according to claim 3, wherein: The orthographic projection of the first sub-enclosure on the cover plate does not overlap with the orthographic projection of the display assembly on the cover plate.

5. The display device according to claim 4, wherein: The display device further includes: An ink layer is located on a side of the cover plate close to the display panel; the edge of the ink layer has an annular groove arranged around the edge of the cover plate; the orthographic projection of the first sub-enclosure on the cover plate is located within the orthographic projection of the annular groove on the cover plate.

6. The display device according to claim 5, wherein: At least the first layer of the first sub-enclosure in the first enclosure is black in color, and the first layer of the first sub-enclosure is the layer of the first sub-enclosure closest to the cover plate among the multiple layers of the first sub-enclosure.

7. The display device according to claim 3, wherein: The first sub-enclosure includes: A first retaining wall and a second retaining wall connected end to end and having the same height; wherein the first retaining wall is located on the side of the first side away from the second enclosure, the second retaining wall is located on the side of the second side away from the second enclosure, and the longitudinal section area of ​​the first retaining wall is smaller than the longitudinal section area of ​​the second retaining wall; the orthographic projection of the first retaining wall on the cover plate does not overlap with the orthographic projection of the display component on the cover plate, and the orthographic projection of the second retaining wall on the cover plate overlaps with the orthographic projection of the display component on the cover plate.

8. The display device according to claim 7, wherein: The first enclosure includes multiple layers of the first retaining walls arranged in an overlapping manner; In the direction in which the second retaining wall is away from the cover plate, the multiple layers of the second retaining walls included in the first enclosure are sequentially retracted.

9. The display device according to claim 8, wherein: The first enclosure includes two layers of the second retaining wall stacked together; The second retaining wall of the first layer is located on a side of the cover plate close to the display panel, the side of the second retaining wall of the first layer close to the second enclosure abuts against the edge of the heat sink, and the side of the second retaining wall of the first layer away from the second enclosure is close to the edge of the cover plate; The second retaining wall of the second layer is located on the side of the second retaining wall of the first layer away from the cover plate, the end of the second retaining wall of the second layer away from the second enclosure is indented relative to the end of the second retaining wall of the first layer away from the second enclosure, and the end of the second retaining wall of the second layer close to the second enclosure is indented relative to the second side of the heat sink.

10. The display device according to any one of claims 3 to 9, wherein: A height of the second sub-enclosure at a position corresponding to the first side is smaller than a height of the second sub-enclosure at a position corresponding to the second side.

11. The display device according to any one of claims 7 to 9, wherein: The filling layer is made of the same material as the second retaining wall corresponding to the second side.

12. The display device according to any one of claims 1 to 9, wherein: The filling layer fills the first groove.

13. The display device according to any one of claims 1 to 9, wherein: The filling layer comprises: An inner filling layer is located in a bending space formed after the flexible circuit board is bent; The outer filling layer is located in the space enclosed by the flexible circuit board, the cover plate, the first enclosure and the second enclosure.

14. The display device according to claim 13, wherein: The bending area of ​​the flexible circuit board has two through holes penetrating the flexible circuit board, and the two through holes are respectively close to two opening ends of the bending space.

15. The display device according to claim 13, wherein: The display assembly further includes: A back film is located between the heat dissipation plate and the display panel and covers a portion of the flexible circuit board; the back film has a second groove exposing the bending area of ​​the flexible circuit board, and the inner filling layer is filled in the second groove.

16. The display device according to any one of claims 2 to 5, wherein: There is a first distance between the first enclosure and the edge of the cover plate, and the value range of the first distance is 0.02mm to 0.08mm.

17. The display device according to claim 16, wherein: The display device further includes: a middle frame, the middle frame comprising a first portion and a second portion; the first portion is located on a side of the edge sealing structure away from the cover plate, and the second portion extends from an edge of the first portion toward an edge of the cover plate and overlaps the cover plate; a middle frame glue, located between the edge sealing structure and the first part; The second portion has an end near the cover plate with a lap groove overlapping the edge of the cover plate, one side of the lap groove abuts the edge of the cover plate near the display panel, and the other side of the lap groove abuts the side of the cover plate.

18. The display device according to claim 17, wherein: The second portion abuts against the multiple layers of the second retaining walls in the first enclosure, and the surface of the second portion abutting against the multiple layers of the second retaining walls is an inclined surface.

19. The display device according to any one of claims 1 to 8, wherein: The display assembly further includes: At least one first accommodating hole is located at a position in the display component corresponding to the second side, the first enclosure is set along the edge of the first accommodating hole, the first accommodating hole is used to accommodate the earpiece, and the part of the first enclosure set along the edge of the first accommodating hole is a slope.

20. The display device according to any one of claims 1 to 8, wherein: The display assembly further includes: A second accommodating hole is located in the area surrounded by the edge sealing structure, and the second enclosure extends toward the second accommodating hole and surrounds the second accommodating hole; The edge sealing structure also includes a third enclosure, which surrounds the second accommodating hole and is located in the area enclosed by the second enclosure. The third enclosure is located on the side surface of the cover plate close to the display panel; the filling layer also fills the space enclosed by the third enclosure and the second enclosure.

21. The display device according to any one of claims 1 to 8, wherein: The flexible circuit board also includes: a driving chip, located on a side of the flexible circuit board away from the heat sink, and the flexible circuit board is attached to a side of the heat sink away from the cover; The second enclosure at least half surrounds the driver chip along the periphery of the driver chip, and the filling layer also fills the area corresponding to the driver chip.

22. A method for manufacturing a display device, wherein: include: A display assembly and a cover plate are provided; the cover plate is located on a light-emitting surface of the display assembly; the display assembly includes a display panel, a heat sink located on a side of the display panel away from the cover plate, and a flexible circuit board bonded to the display panel; the edge of the heat sink is indented relative to the edge of the display panel; the heat sink includes a first side and a second side, with two ends of the first side connected to two ends of the second side; the flexible circuit board is disposed near the first side and is bent and attached to the side of the heat sink away from the display panel; On the side of the cover plate close to the display assembly, a sealing structure is formed, which covers at least the edge of the first side of the heat sink and extends to the edge close to the cover plate; the sealing structure includes a first enclosure, a second enclosure and a filling layer; the first enclosure is located on the side of the cover plate close to the display panel, and is arranged at least along the edge of the cover plate corresponding to the first side; the second enclosure is located on the side of the heat sink away from the cover plate, and is arranged at least along the first side; the filling layer is filled in a first groove surrounded by the first enclosure, the second enclosure, the display assembly and the cover plate, and the bending area of ​​the flexible circuit board is located in the first groove.

23. The production method according to claim 22, wherein: On a side of the cover plate close to the display assembly, a sealing edge structure is formed, which covers at least the edge of the first side of the heat dissipation plate and extends to a side close to the edge of the cover plate, including: On a side of the cover plate close to the display assembly, a multi-layer first sub-enclosure is printed along the edge of the cover plate, surrounding the edge of the cover plate, to form the first enclosure; wherein a side of the first enclosure away from the second enclosure is close to the edge of the cover plate; On a side of the display assembly away from the cover plate, multiple layers of second sub-enclosures are printed along the edge of the heat sink, surrounding the edge of the heat sink, to form the second enclosure; wherein a printing speed of the second sub-enclosure at a position corresponding to the first side is lower than a printing speed at a position corresponding to the second side; and a side of the second enclosure close to the first enclosure is retracted relative to the heat sink; The first groove is filled with a filler to form the filling layer.

24. The production method according to claim 23, wherein: On a side of the cover plate close to the display assembly, a multi-layer first sub-enclosure is printed along the edge of the cover plate to surround the edge of the cover plate, forming the first enclosure, including: On a side of the cover plate close to the display assembly, a first layer of second retaining walls corresponding to the second side is printed; a side of the first layer of the second retaining walls away from the second enclosure is close to the edge of the cover plate, and a side of the first layer of the second retaining walls close to the second enclosure is in contact with the edge of the second side; On the side of the first layer of the second retaining wall away from the cover plate, print the second layer of the second retaining wall corresponding to the second edge; the side of the second layer of the second retaining wall away from the second enclosure is indented relative to the side of the first layer of the second retaining wall away from the second enclosure, and the side of the second layer of the second retaining wall close to the second enclosure is indented relative to the edge of the second edge; On one side of the cover plate close to the display component, multiple layers of first retaining walls corresponding to the first side are printed, and the first retaining walls do not overlap with the display component; wherein, the second enclosure is printed after printing multiple layers of the second retaining walls and before printing multiple layers of the first retaining walls, the longitudinal section area of ​​the second retaining wall is larger than the longitudinal section area of ​​the first retaining wall, and the multiple layers of the first retaining walls are connected end to end with the multiple layers of the second retaining walls.

25. The production method according to claim 24, wherein: Filling the first groove with a filler to form the filling layer comprises: After forming the second enclosure and before forming the multiple layers of the first retaining wall, printing multiple layers of the first adhesive in the space of the first groove corresponding to the second retaining wall to form a portion of the filling layer corresponding to the second retaining wall; and curing the first enclosure, the second enclosure, and the portion of the filling layer; After forming the first retaining wall, filling and curing a filling material in the space of the first groove corresponding to the first retaining wall to form another portion of the filling layer corresponding to the first retaining wall; wherein the filler includes the first adhesive and the filling material; Partial milling is performed on the junction of the first retaining wall and the second retaining wall in the edge sealing structure, so that the side of the edge sealing structure away from the cover plate is flush.

26. The production method according to claim 23, wherein: Before forming an edge sealing structure on a side of the cover plate close to the display assembly, which covers at least the edge of the first side of the heat dissipation plate and extends close to the edge of the cover plate, the method further includes: forming an ink layer on a side of the cover plate close to the display component; On a side of the ink layer away from the cover plate, an annular groove is formed surrounding an edge of the ink layer; On a side of the cover plate close to the display assembly, a multi-layer first sub-enclosure is printed along the edge of the cover plate, surrounding and close to the edge of the cover plate, to form the first enclosure, including: Multiple layers of the first sub-enclosure are printed in the annular groove to form the first enclosure.

27. The production method according to any one of claims 23 to 26, wherein: Before bending the flexible circuit board, the method further includes: Filling and curing the second adhesive in the second groove of the backing film so that the curing rate of the second adhesive reaches a preset ratio; wherein the backing film is located between the display panel and the heat dissipation plate and covers a portion of the flexible circuit board; the second groove exposes the bending area of ​​the flexible circuit board; The flexible circuit board is bent so that the cured second adhesive fills the bending space formed after the flexible circuit board is bent, forming an inner filling layer of the filling layer.

28. The production method according to any one of claims 23 to 26, wherein: After bending the flexible circuit board, the method further comprises: injecting a second adhesive into one open end of a bending space formed after the flexible circuit board is bent, and using a fan to absorb the second adhesive at the other open end so that the second adhesive fills the bending space; The second adhesive filled in the bending space is solidified to form an inner filling layer of the filling layer.

29. The production method according to any one of claims 23 to 26, wherein: After bending the flexible circuit board, the method further comprises: Blocking the two open ends of the bending space formed after the flexible circuit board is bent; wherein the bending area of ​​the flexible circuit board has two through holes, and the two through holes are respectively close to the two open ends; injecting a second adhesive into the blocked bending space through one of the through holes until the second adhesive overflows from the other through hole, so that the second adhesive fills the bending space; The second adhesive filled in the bending space is solidified to form an inner filling layer of the filling layer.

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