Multicomponent glass with high etch resistance during dry etching, component made of the multicomponent glass, and use thereof

Abstract

In order to reduce, in known multicomponent glasses with high etch resistance during dry etching, the formation of particles during the dry etching process, the invention proposes for the multicomponent glass to contain SiO2 in an amount in the range of, but not exceeding, 60 mol % and at least one further component which forms a temperature-stable reaction product with halogen-containing etching gas.

Description

[0001] 2025P00031 April 10, 2025 1 DESCRIPTION Multi-component glass with high etch resistance during dry etching, component made of the multi-component glass, and use thereof Technical background The invention relates to a multi-component glass, in particular for producing a glass component, which is designed for use in a plasma-assisted dry etching process. The plasma-assisted dry etching process is a technology used, for example, to produce ultrafine structures of semiconductor components, high-resolution displays, and solar cell manufacturing. A substrate is subjected to a physico-chemical etching process in a plasma chamber, which comprises ion bombardment and a chemical reaction on the substrate surface. In so-called reactive ion etching – also referred to as "RIE" (reactive ion etching) for short – charged, reactive ions are used in a high-frequency plasma.The volatile etching and erosion products released from the wafer substrate are removed from the plasma chamber by vacuum. Etching silicon-based structures typically requires halogen-containing etching gases, such as CF4, C2F6, C3F8, C4F6CH2F2, C4F8, NF3, SF6, HF, HCl, or HBr. State of the art: During the dry etching process, not only the substrate is exposed to the reactive plasma, but also the walls of the plasma chamber and its internals, particularly in the vicinity of a substrate to be processed, such as a wafer. The reactor internals—such as wafer holders, heating devices, support or clamping elements, etching rings, and ring covers—are often made of quartz glass. Quartz glass is characterized by high purity, UV transparency, chemical resistance to many substances used in the manufacturing process, and high temperature resistance.However, quartz glass erodes quickly during the aggressive etching process and must be replaced frequently, leading to downtime. To improve machine availability and reduce downtime, there is a constant search for better, etch-resistant materials. In addition to ceramic or metal chambers coated with yttrium oxide (Y2O3), multi-component glasses have also been developed. These glasses often contain SiO2, Al2O3, MgO, and other alkaline earth oxides, as well as Y2O3. These glasses, known as aluminosilicate glasses, exhibit greater resistance to plasma erosion than quartz glass. For example, in US 2014 / 0274653 A1 the following chemical composition is specified for plasma-resistant aluminosilicate glasses: Yttrium oxide (Y2O3): 5 wt% to 40 wt% Aluminum oxide (Al2O3): 5 wt% to 30 wt% Silicon dioxide (SiO2): 10 wt% to 80 wt% Magnesium oxide (MgO): 1 wt% to 20 wt%.US 2014 / 027653 A describes, in addition to aluminosilicate glasses, glass ceramics and sintered products as suitable materials. US 2023 / 0406755 A1 discloses another plasma-resistant multicomponent glass that contains a fluoride component to improve etch resistance to fluorine-containing etching gas. The multicomponent glass contains, for example, SiO2 in an amount of 40 to 75 mol%, Al2O3 in an amount of 5 to 20 mol%, MgO in an amount of 10 to 40 mol%, and MgF2 in an amount of 0.01 to 10 mol%. US 2024 / 0217864 A1 discloses another plasma-resistant multicomponent glass that includes, among other materials, SiO2 and at least MgO or CaO. The multi-component glass is particularly characterized by containing impurities of less than 15 mol% to improve resistance in plasma-assisted dry etching processes.The impurities to be avoided according to this prior art do not include alkali metal oxides, which can be present in the multicomponent glass in amounts of up to 1.2 mol%. A disadvantage of the multicomponent glasses known from US 2025P00031 10.04.2025 3 2024 / 0217864 A, however, is the diffusivity in the glass associated with the use of some alkali metal oxides. Technical problem When using the known aluminosilicate glasses in the RIE process, however, increased particle formation was observed. Particles can be detached parts of layers or reaction products from the etching process, which inevitably deposit on the substrate surfaces during the plasma etching process. The invention aims to reduce particle formation due to corrosive erosion.In particular, the object is to provide a multicomponent glass suitable for the production of a glass component which, when used in a plasma-assisted manufacturing process, is characterized by high etch resistance combined with the lowest possible particle formation. A further aspect of the present invention is to provide a multicomponent glass that is not prone to devitrification and solidifies in a glassy-amorphous state. Technical Solution This object is achieved by a multicomponent glass with high etch resistance during dry etching, which contains SiO2 in a proportion of up to 60 mol% and at least one further component that forms a temperature-stable reaction product with halogen-containing etching gas.The multicomponent glass is then characterized in that it contains niobium oxide in an amount of 5 to 50 mol% and tantalum oxide in an amount of up to 30 mol%, the sum of niobium oxide and tantalum oxide, based on the total amount of multicomponent glass, being 5 to 50 mol%. According to the invention, it was discovered that multicomponent glasses with the aforementioned amounts of niobium oxide and / or tantalum oxide lead to lower particle formation. 2025P00031 10.04.2025 4 Aluminum oxide (Al2O3) as a glass component is, on the one hand, a common additive in glass technology as a so-called intermediate oxide. In the silicate composite, so-called aluminosilicate glasses are formed, which exhibit technical advantages such as thermal stability, mechanical strength, chemical resistance, and lower thermal expansion.On the other hand, these glasses are problematic in the intended application because aluminum oxide, when reacting with fluorine-containing etching gases, tends to form the high-temperature-stable reaction product aluminum fluoride (AlF3). This compound sublimates at approximately 1260 °C without reaching a defined boiling point. This leads to the formation of unwanted particles when using aluminum oxide-containing glasses in the RIE process, which can significantly impact the process yield. Niobium(V) oxide and tantalum(V) oxide, like aluminum oxide, are intermediate oxides that integrate advantageously into silicate networks. Etching tests have shown that these oxides exhibit comparable etch resistance to Al2O3 – although these two oxides have boiling points of 236 °C (NbF5) and 230 °C (TaF5), respectively, which are significantly below the sublimation point of AlF3 and within the range of process temperatures used in modern RIE processes.As a result, significantly lower particle formation is to be expected. Embodiments of the multicomponent glasses according to the invention are described below. The amount of niobium oxide in the multicomponent glass according to the invention is at least 5 mol%, more preferably at least 6 mol%, more preferably at least 7 mol%, more preferably at least 8 mol%, more preferably at least 9 mol%, even more preferably at least 10 mol%. The amount of niobium oxide in the multicomponent glass according to the invention is at most 50 mol%, more preferably at most 45 mol%, more preferably at most 40 mol%, more preferably at most 35 mol%, more preferably at most 34 mol%, even more preferably at most 30 mol%. The amount of niobium oxide in the multicomponent glass according to the invention is 5 to 50 mol%, more preferably 6 to 45 mol%, more preferably 7 to 40 mol%, more preferably 2025P00031 10.04.2025 5 preferably 8 to 35 mol%, more preferably 9 to 34 mol%, more preferably 10 to 30 mol%. The amount of tantalum oxide in the multicomponent glass according to the invention is more than 0 mol%, more preferably at least 1 mol%, more preferably at least 2 mol%, more preferably at least 3 mol%, more preferably at least 4 mol%, even more preferably at least 5 mol%. The amount of tantalum oxide in the multicomponent glass according to the invention is at most 30 mol%, more preferably at most 29 mol%, more preferably at most 28 mol%, more preferably at most 27 mol%, more preferably at most 26 mol%, even more preferably at most 25 mol%. The amount of tantalum oxide in the multicomponent glass according to the invention is 0 to 30 mol%, more preferably 1 to 29 mol%, more preferably 2 to 28 mol%, more preferably 3 to 27 mol%, more preferably 4 to 26 mol%, more preferably 5 to 25 mol%.The total amount of niobium oxide and tantalum oxide in the multicomponent glass according to the invention is at least 5 mol%, more preferably at least 6 mol%, more preferably at least 7 mol%, more preferably at least 8 mol%, more preferably at least 9 mol%, even more preferably at least 10 mol%. The total amount of niobium oxide and tantalum oxide in the multicomponent glass according to the invention is at most 50 mol%, more preferably at most 49 mol%, more preferably at most 48 mol%, more preferably at most 47 mol%, more preferably at most 46 mol%, even more preferably at most 45 mol%. The total amount of niobium oxide and tantalum oxide in the multicomponent glass according to the invention is 5 to 50 mol%, more preferably 6 to 49 mol%, more preferably 7 to 48 mol%, more preferably 8 to 47 mol%, more preferably 9 to 46 mol%, more preferably 10 to 45 mol%.This results, for example, in the following specific generic compositions for the multi-component glass according to the invention: Composition Amount of Nb2O5 Amount of Ta2O5 (in Amount of Nb2O5 (mol-%) mol-%) and Ta2O5(mol-%) 2025P00031 10.04.2025 6 A1 5 to 50 0 to 30 5 to 50 A2 5 to 45 1 to 29 6 to 49 A3 5 to 40 2 to 28 7 to 48 A4 8 to 35 3 to 27 8 to 47 A5 9 to 34 4 to 26 9 to 46 A6 10 to 30 5 to 25 10 to 45 Furthermore, as will be explained further below, it has been found to be preferred that the amount of aluminum oxide Al2O3 does not exceed 10 mol-%.The amount of aluminum oxide Al2O3in the multicomponent glass according to the invention is thus at most 10 mol%, more preferably at most 9 mol%, more preferably at most 8 mol%, more preferably at most 7 mol%, more preferably at most 6 mol%, more preferably at most 5 mol%, more preferably at most 4 mol%, more preferably at most 3 mol%, more preferably at most 2 mol%. This results, for example, in the following specific generic compositions for the multi-component glass according to the invention: Composition Amount of Amount of Amount of maximum Nb2O5(mol-%) Ta2O5(in mol- Nb2O5and Amount of %) Ta2O5(mol-%) Al2O3A7 5 to 50 0 to 30 5 to 50 10 A8 6 to 46 1 to 29 6 to 49 8 A9 7 to 42 2 to 28 7 to 48 7 A10 8 to 38 3 to 27 8 to 47 5 A11 9 to 34 4 to 26 9 to 46 4 A12 10 to 30 5 to 25 10 to 45 2 General description of the invention 2025P00031 10.04.2025 7 With regard to the multi-component glass, this object is achieved by a multi-component glass having the features of claim 1. The invention is explained below. A glass component is considered which has a glass surface which is exposed to a halogen-containing etching gas at a process temperature during an RIE dry etching process in an evacuable process chamber and is subject to unwanted and undesired degradation. It can be assumed that at least two mechanisms occur simultaneously on the glass surface during the RIE dry etching process. One mechanism is based on erosion, as a result of which material is continuously removed from the glass surface. The other mechanism is based on passivation, in which halide reaction products form a halide-rich reaction product layer on the glass surface, which counteracts further erosion.This reaction product layer could, in principle, be capable of inhibiting further halide formation, but it appears to be continuously destabilized and damaged by the erosion mechanism, which may explain the formation of particles during the process in the multi-component glasses known to date. Particle formation can therefore be attributed to the fact that residues of the reaction product layer or agglomerates thereof remain on the glass surface in the form of halide reaction products, are not completely removed by suction, and end up on the semiconductor component being processed during the dry etching process.The present invention is based on the concept of optimizing the chemical composition of the multi-component glass in such a way that the formation of a stable reaction product layer is promoted which is eroded as little as possible in the dry etching process, above all does not release any particles during the process and is not prone to devitrification. To achieve this, a glass composition is proposed which, in addition to SiO2, contains one or more further oxidic components which, with halogen-containing etching gas, form a thermally and structurally stable reaction product. 2025P00031 10.04.2025 8 Furthermore, the glass composition according to the invention contains niobium and / or tantalum, which can reduce particle formation within the meaning of the present invention. The at least one further component is a compound of a chemical element, for example an oxide which, in addition to oxygen ions (O 2-) can also contain fluorine ions (F-) in small amounts. Ideally, apart from SiO2, the multi-component glass consists exclusively of components which, with halogen-containing etching gas, form a thermally and structurally stable reaction product within the meaning of this invention. In particular, such components in the multi-component glass advantageously have a molar proportion of at least 30 mol%, preferably at least 40 mol%, more preferably at least 45 mol%, more preferably at least 50 mol%, more preferably at least 60 mol%, more preferably at least 70 mol%. The halide-containing reaction product of the at least one further component (besides SiO2) contains a fluorine, chlorine and / or bromine compound which is stable at the process temperature and the process pressure, i.e. is not volatile and does not pass into the gas phase.This prevents the reaction product from being continuously removed from the process chamber by suction, which would counteract the formation of a reaction product layer, but rather ensures that the reaction product remains on the glass surface and contributes to the most stable reaction product layer possible. The reaction product layer reduces further corrosive erosion of the glass surface through halide formation and, advantageously, does not release any particles itself, which leads to a reduction in particle formation during the dry etching process. SiO2 does not form temperature-stable reaction products with the halogens fluorine, chlorine, and bromine, but rather volatile ones. For this reason, a glass component made of undoped quartz glass fundamentally does not exhibit a stable reaction product layer and, consequently, has comparatively low dry etching resistance.In the multi-component glass according to the invention, the SiO2 content is therefore limited to a maximum of 60 mol%. As a result, the glass component made of the multi-component glass exhibits, on the one hand, greater dry etching resistance during the dry etching process than the glass component made of undoped quartz glass (100% SiO2). However, it would not be satisfactory to achieve a reduced etching rate alone if this is accompanied by higher particle formation, as is the case with known multi-component glasses. Therefore, on the one hand, the proportion of the SiO2 component in the multi-component glass is limited to a maximum of 60 mol%, and on the other hand, the at least one additional component also has the function of reducing the degradation of the multi-component glass during the dry etching process compared to that of undoped quartz glass and, at the same time, contributing to the formation of a stable reaction product layer.In further embodiments of the present invention, the proportion of the SiO2 component in the multi-component glass is limited to a maximum of 60 mol%, more preferably a maximum of 59 mol%, more preferably a maximum of 58 mol%, more preferably a maximum of 57 mol%, more preferably a maximum of 56 mol%, more preferably a maximum of 55 mol%, more preferably a maximum of 54 mol%, more preferably a maximum of 53 mol%, more preferably a maximum of 55 mol%, more preferably a maximum of 51 mol%, more preferably a maximum of 50 mol%. This function is advantageously achieved in that the at least one further component forms a thermally and structurally stable reaction product by reaction with halogen-containing etching gas. One measure of this is that the reaction product has a comparatively high boiling point or a high sublimation point.As an indication of a high boiling point or sublimation point, a volatilization temperature above 200°C, preferably above 400°C, and particularly preferably above 500°C, is defined here. The "volatility temperature" is either the boiling point temperature or the sublimation point temperature under standard pressure conditions (atmospheric pressure = 101,325 Pa), depending on the phase transition the specific component undergoes. For components with a melting point below the boiling point or below the sublimation point, the "volatility temperature" is understood to be the melting point temperature. 2025P00031 10.04.2025 10 In the case of a multi-component glass which, in addition to the SiO2 component, also contains a large number of further components (i.e. at least two further components), it is sufficient if at least one of the large number of further components has a volatilisation temperature above 200°C, preferably a volatilisation temperature above 400°C and particularly preferably a volatilisation temperature above 500°C. However, it is particularly preferred that (apart from SiO2) all other components of the multi-component glass have a volatilisation temperature above 200°C, preferably a volatilisation temperature above 400°C and particularly preferably a volatilisation temperature above 500°C. Halide-containing reaction products whose volatilisation temperature lies in this temperature range are characterised by greater thermal stability than silicon halides.For example, volatilization temperatures of 200°C and above are above both the sublimation point of SiF4 (-95°C) and the boiling points of SiCl4 (57°C) and SiBr4 (154°C). Components of the multicomponent glass that form such reaction products with the etching gas can help reduce the degradation of the multicomponent glass during the dry etching process compared to undoped quartz glass. They can also contribute to the formation of a reaction product layer that erodes only slightly during the subsequent dry etching process and thus releases few particles. Compounds of trivalent or tetravalent elements can act as so-called "network formers" in glass. Well-known oxide network formers are SiO2, B2O3, P2O5, and GeO2. These oxides can form a three-dimensional, oxide, amorphous glass network, either alone or with other components.Trivalent or tetravalent elements are known to stabilize the network structure of multicomponent glass and are therefore required for glass formation. A trivalent or tetravalent element, or several trivalent or tetravalent elements, can therefore advantageously form the main component of multicomponent glass alongside SiO2. They can be used to reduce the SiO2 content in the glass, thus enabling the formation of halide reaction products that are thermally significantly more stable than the halides of silicon. 2025P00031 10.04.2025 11 Monovalent or divalent elements, on the other hand, can loosen the glass network and thereby counteract crystallization of the glass and demixing during solidification from the melt. Therefore, an oxide of a monovalent or divalent element, or oxides of several monovalent or divalent elements, can have a beneficial effect in multicomponent glass.Since the halides of these elements are particularly temperature-stable, they are suitable for the formation of a structurally and thermally stable reaction product layer and can therefore advantageously be included in a high proportion in the overall composition. It has proven advantageous if the at least one further component is a compound selected from at least one of the following groups: (i) a first group consisting of oxides of Rb or Cs, the alkaline earth elements and Zn, (ii) a second group consisting of oxides of the rare earth metals with the exception of promethium (Pm), (iii) a third group consisting of oxides of elements from transition groups 4 to 6 of the periodic table, namely: Ti, Zr, Hf, V, Nb, Ta, Mo and W (iv) a fourth group consisting of oxides of elements from main groups 13 to 15 of the periodic table, namely: Al, Ga, In, Ge, Sn and Bi.In addition to SiO2, the multicomponent glass contains one further component, preferably selected from one of groups (i) to (iv), or it contains several further components selected from one or more or all of groups (i) to (iv). The aim is to reduce the SiO2 content in the multicomponent glass, preferably to a maximum of 60 mol%, preferably to less than 55 mol%, advantageously less than 50 mol%, or less than 45 mol%, and particularly preferably less than 40 mol%. Additions of oxides from the aforementioned groups (i) to (iv) are suitable for this purpose, in order to minimize the formation of volatile halide compounds. 2025P00031 10.04.2025 12 The technical significance of groups (i) and (ii) for the present invention lies in the fact that these components can serve as network modifiers which promote glass formation and at the same time form low-volatility halide compounds.This group includes, in particular, alkali and alkaline earth oxides, which generally act as so-called "network modifiers" in multi-component glass and are also referred to as "interface formers." They disrupt the network structure of the glass and reduce its viscosity, thus facilitating glass formation. In high concentrations, however, they increase the tendency toward devitrification, i.e., the crystallization of the solidifying glass melt. However, these oxides can contribute to the formation of a stable reaction product layer because their halides are consistently temperature-stable compounds. Without being bound to any theory, it is assumed that the lower oxides of alkali and other monovalent cations are undesirable for use in semiconductor processes due to their high diffusivity. This applies only to a limited extent to cesium and rubidium compounds because these cations are relatively large and therefore immobile.As with alkaline earth elements, their halides are thermally stable. It is assumed that alkali metal oxides in a multicomponent glass according to the invention are detrimental to devitrification because they can destabilize the structure of the glass. Glass consists of a network of SiO₂ and other oxides that act as network formers or network modifiers. Alkali metal oxides weaken the glass structure by creating separation points in the silicate network. This increases the mobility of the structural groups, which promotes nucleation and crystal growth. In addition, alkali metal oxides can also impair the chemical resistance of the glass by altering the interactions between the various components of the glass. The glass becomes overall more susceptible to chemical attack and decomposition, which is particularly disadvantageous when used according to the invention in the plasma-assisted dry etching process. 2025P00031 10.04.2025 13 Therefore, the present invention teaches a diametrically different approach than the prior art US 2024 / 0217864 A1, which considers the control of the presence of alkali metal oxides to be irrelevant. Therefore, within the scope of the present invention, it is surprisingly provided that the multicomponent glass does not contain alkali metals or alkali metal compounds, or preferably contains them in a concentration of less than 1000 mol ppm each, with the exception of oxidic compounds of cesium and / or rubidium.In further embodiments of the present invention, the content of alkali metals or alkali metal compounds in the multi-component glass according to the invention is a maximum of 900 mol ppm, more preferably a maximum of 800 mol ppm, more preferably a maximum of 700 mol ppm, more preferably a maximum of 600 mol ppm, more preferably a maximum of 500 mol ppm, more preferably a maximum of 400 mol ppm, more preferably a maximum of 300 mol ppm, more preferably a maximum of 200 mol ppm, more preferably a maximum of 100 mol ppm. If it is assumed within the scope of the present invention that the alkali metals or alkali metal compounds are not present or are preferably present in a concentration of less than 1000 mol ppm, with the exception of oxidic compounds of cesium and / or rubidium, this initially applies to each individual alkali metal or each individual alkali metal oxide compound.In a preferred embodiment of the present invention, the feature that the alkali metals or alkali metal compounds are not present or are preferably present in a concentration of less than 1000 mol-ppm, with the exception of oxidic compounds of caesium and / or rubidium, means that the content in the glass refers to the sum of all alkali metals or alkali metal oxide compounds (including Cs and Rb). These two options from the two paragraphs above then also apply to preferred upper limits for alkali metals and / or alkali metal oxides that are defined in the present invention. For the purposes of the present invention, alkali metals or alkali metal oxide compounds that are not present or are preferably present in a concentration of 2025P00031 10.04.2025 14, in particular lithium oxide, sodium oxide, and potassium oxide, are present in the glass compositions according to the invention in amounts of less than 1000 mol ppm. A further advantage of the present invention is that by limiting the presence of alkali metals or alkali metal compounds, there is no disruptive release of the alkali metals or alkali metal compounds in processes for producing semiconductor materials, in which such constituents would have a detrimental effect. Within the scope of the present invention, the limitation of the presence of alkali metals or alkali metal compounds can be achieved by using high-purity starting materials, in particular SiO2 and Al2O3.These high-purity starting materials are generally available, but have not yet been used for the production of multi-component glasses for components used in plasma-assisted dry etching or RIE processes. Commercial examples of suitable Al2O3 starting materials are Al2O3 products from Nabalox, which, depending on the type, contain 0.1 to 0.3 mass% Na2O (= 0.15 to 0.5 mol% Na2O). Further measures to limit the presence of alkali metals or alkali metal compounds can include purifying the starting materials to be used and carrying out the production of the multi-component glasses exclusively in devices that do not release alkali metals or alkali metal compounds. This includes, for example, the selection of a suitable crucible material or a suitable melting system that, in particular, does not use ceramic materials or that uses platinum materials (e.g.Platinum crucibles). Therefore, the present invention also relates to the use of metal oxides having a low content of alkali metals and / or alkali metal oxides for the production of multicomponent glasses for use in plasma-assisted dry etching or RIE processes. ZnO can serve as an alternative to Al2O3, which is suspected of contributing to particle formation in the RIE process. This will be explained in more detail below. 2025P00031 10.04.2025 15 The halides of the rare earth metals (including scandium and yttrium) generally have a high melting or volatilization temperature. Possible materials are Y2O3, La2O3 (LaF3: boiling point: 2327°C), CeO2 (CeF3: melting point: 1460°C), Sm2O3 (SmF3: melting point: 1306°C), Gd2O3 (GdF3: melting point: 1231°C) and Dy2O3 (DyF3: boiling point: 2200°C) and Yb2O3 (YbF3: melting point: 1157°C).In one embodiment of the present invention, however, the multicomponent glass according to the invention does not comprise yttrium. The technical significance of group (iii) for the present invention can be seen in the fact that these intermediate oxides, as additives, can stabilize the glass network. Although some elements of this group form rather volatile halides, these are still more stable than silicon halides and can therefore be used in the present invention. The technical significance of group (iv) for the present invention can be seen in the fact that these components act as glass formers that crosslink the glass structure, with SiO2 forming by far the most volatile halide compounds. However, some of the elements of this group can reduce temperature stability, such as Bi2O3. They are therefore included in the composition of the multicomponent glass in relatively small proportions.From group (iv), in addition to Al2O3, SnO2 and Bi2O3 are particularly suitable as further components of the multicomponent glass. However, it has been shown that multicomponent glasses, particularly with compositions containing high Al2O3 contents of more than 35 mol%, often tend to form particles. This can be attributed to the fact that many etching gases contain fluorine and AlF3 has a high sublimation point of 1260°C. Therefore, a preferred embodiment of the multicomponent glass contains aluminum compounds in a concentration of less than 30 mol%, preferably less than 15 mol%, particularly preferably less than 5 mol%. In one embodiment of the present invention, however, the multicomponent glasses according to the invention contain Al2O3. 2025P00031 10.04.2025 16 The boiling points of the aluminum halides AlCl3 (180°C) and AlBr3 (263°C) are in the upper range of typical process temperatures, so that these halides can pass into the gas phase when using exclusively chlorine- or bromine-containing etching gas (particularly at the usual low process pressures, even lower volatilization temperatures can be expected than at atmospheric pressure) and thus do not contribute to the formation of a thermally and structurally stable reaction product layer. Advantageously, the molar proportion of oxides from the first group and the second group together in the composition of the multi-component glass is therefore higher than the molar proportion of the oxides from the third group. In particular, the molar proportion of oxides from the first group and the second group together is at least 1.5 times higher - preferably 2 times higher - than the molar proportion of the oxides from the third group.Advantageously, the molar fraction of the oxides from the first group, from the second group, and from the third group together is higher than the molar fraction of the oxides from the fourth group plus the proportion of SiO2. In particular, the molar fraction of oxides from the first group, from the second group, and from the third group together is at least 1.5 times higher—preferably 1.75 times higher—than the molar fraction of the oxides from the fourth group plus the molar fraction of SiO2. Boron and phosphorus are used as dopants in semiconductor materials, so that the introduction of boron- and phosphorus-containing impurities during semiconductor production should be excluded as far as possible. In this regard, an embodiment of the multi-component glass is preferred which does not contain boron and phosphorus compounds or contains them in a concentration of less than 1000 ppm by weight each.Compounds of antimony, arsenic, and gallium would also be suitable as components of the multicomponent glass in principle. However, these substances also occur as dopants in semiconductor materials. In view of this, a 2025P00031 10.04.2025 17 multicomponent glass is preferred that does not contain compounds of antimony, arsenic, or gallium, or that contains them as impurities in a concentration of less than 1000 ppm by weight. Another preferred embodiment of the multicomponent glass contains gold, silver, and copper (or their compounds), each in a concentration of less than 100 ppm by weight. The reason for this is the high diffusivity of these elements in the glass network. Another preferred embodiment of the multicomponent glass is characterized by being free of lead, cadmium, and thallium compounds, which are toxic (less than 100 ppm by weight each).Experience shows that higher-melting multicomponent glasses have more stable glass networks than low-melting glasses, which generally has a positive macroscopic effect on properties such as mechanical hardness and strength, as well as chemical resistance. The so-called glass transition temperature Tg (also known as transformation temperature) can serve as a measure of the viscosity of the multicomponent glass; this has a viscosity of 10. 13,2 dpa .s is attributed to. In the multicomponent glass according to the invention, it has proven advantageous if the glass transition temperature Tg is comparatively high and lies in the range from 600 to 920°C, particularly advantageously in the range from 700 to 880°C. In the production of technical glasses, refining agents are usually added, the function of which is to reduce the blistering in the glass melt by releasing large bubbles or by gas absorption. These are usually foreign substances such as arsenic or antimony trioxide in concentrations of the order of 0.1 wt.%. This is problematic for the production of high-purity multicomponent glasses for semiconductor applications, which is why the expulsion of bubbles should only occur physically, for example by bubble growth and rise. For this purpose, it is advantageous to be able to set a low viscosity in the melting process. This viscosity is preferably in the range of 10 1 dPa s to 104 dPa·s, typically around 10 2dPa s. If platinum is used as the crucible material, the temperature for the latter viscosity should not exceed 1600°C, preferably 1500°C. 2025P00031 10.04.2025 18 In a preferred embodiment of the multi-component glass, the at least one further component is a chemical compound from the group consisting of: Bi2O3, Al2O3, ZnO, SnO2, TiO2, ZrO2, WO3, MoO3, Nb2O5, Ta2O5, MgO, CaO, SrO, BaO, rare earth metal oxides (including Sc2O3 and Y2O3). The multi-component glass preferably has the following composition: Component Concentration range from – to (mol-%) SiO2 25 60 Bi2O3 0 50 SiO2+Bi2O3 30 80 Al2O3 0 35 ZnO 0 40 Al2O3+ZnO 0 60 SnO2 0 15 TiO2 0 35 ZrO2 0 15 WO3 0 20 MoO3 0 20 Nb2O5 5 50 Ta2O5 0 30 Nb2O5+ Ta2O5 5 50 MgO 0 60 CaO 0 60 SrO 0 60 BaO 0 60 Alkaline earth oxides 0 70 Rare earth metal oxides 0 30 Total rare earth metal oxides 0 40 HfO2 0 10 V2O5 0 15 GeO2 0 10 2025P00031 10.04.2025 19 In a particularly preferred embodiment, the multi-component glass can be classified as so-called “aluminosilicate glass”. In this case, the multi-component glass preferably has the following composition: Component Concentration range from – to (mol-%) SiO2 25 60 Bi2O3 0 10 SiO2+Bi2O3 25 70 Al2O3 5 25 ZnO 0 30 Al2O3+ZnO 5 50 SnO2 0 10 TiO2 0 20 ZrO2 0 10 WO3 0 10 MoO3 0 10 Nb2O5 5 50 Ta2O5 0 30 Nb2O5 + Ta2O5 5 50 MgO 0 50 CaO 0 50 SrO 0 50 BaO 0 50 Total alkaline earth oxides 0 70 Rare earth metal oxides 0 30 Total rare earth metal oxides 0 40 HfO2 0 10 V2O5 0 10 GeO20 10 2025P00031 10.04.2025 20 In another preferred embodiment, the multicomponent glass can be classified as a so-called “bismuth silicate glass”.In this case, the multi-component glass preferably has the following composition: Component Concentration range from – to (mol-%) SiO2 30 60 Bi2O3 20 45 SiO2+Bi2O3 50 80 Al2O3 0 20 ZnO 0 40 Al2O3+ZnO 0 50 SnO2 0 10 TiO2 0 20 ZrO2 0 10 WO3 0 10 MoO3 0 10 Nb2O5 50 Ta2O5 0 30 Nb2O5 + Ta2O5 5 50 MgO 0 30 CaO 0 30 SrO 0 30 BaO 0 30 Alkaline earth oxides 0 40 Rare earth metal oxides 0 30 Total rare earth metal oxides 0 40 HfO2 0 10 V2O5 0 10 GeO20 10 2025P00031 10.04.2025 21 In another preferred embodiment, the multicomponent glass can be classified as “niobium-tantalum-silicate glass”.In this case, the multi-component glass preferably has the following composition: Component Concentration range from – to (mol-%) SiO2 20 60 Bi2O3 0 20 SiO2+Bi2O3 20 70 Al2O3 0 20 ZnO 0 30 Al2O3+ZnO 0 40 SnO2 0 10 TiO2 0 20 ZrO2 0 10 WO3 0 10 MoO3 0 10 Nb2O5 50 Ta2O5 0 30 Nb2O5 + Ta2O5 5 50 MgO 0 60 CaO 0 60 SrO 0 60 BaO 0 60 Alkaline earth oxides 0 70 Rare earth metal oxides 0 30 Total rare earth metal oxides 0 40 HfO2 0 10 V2O5 0 10 GeO20 10 2025P00031 10.04.2025 22 In another preferred embodiment, the multicomponent glass can be classified as “titanium silicate glass”.In this case, the multi-component glass preferably has the following composition: Component Concentration range from – to (mol-%) SiO2 30 60 Bi2O3 0 20 SiO2+Bi2O3 30 80 Al2O3 0 20 ZnO 0 30 Al2O3+ZnO 0 40 SnO2 0 10 TiO2 5 35 ZrO2 0 10 WO3 0 10 MoO3 0 10 Nb2O5 5 50 Ta2O5 0 30 Nb2O5 + Ta2O5 5 50 MgO 0 30 CaO 0 30 SrO 0 30 BaO 0 30 Alkaline earth oxides 0 40 Rare earth metal oxides 0 30 Total rare earth metal oxides 0 40 HfO2 0 10 V2O5 0 10 GeO2 0 10 2025P00031 10.04.2025 23 The multi-component glass is characterized by a high level of purity, which is exemplified by the fact that impurities of Cr, Mn, Fe, Co and Ni and compounds for each of these elements are less than 50 ppm by weight and particularly preferably less than 20 ppm by weight, and that the sum of the impurities of Cr, Mn, Fe, Co and Ni is less than 100 ppm by weight. In the simplest and preferred case, the multi-component glass is a purely oxidic glass in which all anions consist of oxygen ions (O 2-). The oxygen ions optionally occupy 100% of the anion sites in the network structure of the glass. In another, equally preferred embodiment, a portion of the oxygen ions is substituted by fluorine ions. In this case, the multicomponent glass has a network structure with anion sites, with (100-x)% of the anion sites being occupied by oxygen ions (O 2- ) and the proportion x (%) is occupied by fluorine ions (F-), where x is the degree of substitution (in %) and is in the range between 0.1 and 10, preferably in the range from 0.1 to 5 and particularly preferably in the range from 0.1 to 4. The number of substituting fluoride ions is twice as large as that of the substituted oxygen ions (O 2-In this embodiment, the fluorine ions are melted into the glass during production, for example in the form of raw material substitution (CaO --> CaF2). The partial substitution of oxygen ions by fluorine ions can contribute to greater dry etching resistance to halogen-containing etching gases. At a degree of fluorine substitution of less than 0.1%, this effect is not significantly pronounced, and degrees of fluorine substitution of more than 10% no longer result in any improvement in dry etching resistance. An upper limit for the degree of fluorine substitution of 5% is therefore preferred, and an upper limit of 4% is even better. In one embodiment of the present invention, the multi-component glasses therefore contain fluoride.With regard to the glass component for use in a dry etching process in contact with a plasma and a halogen-containing etching gas, the above-mentioned technical problem is solved by a glass component having the features of claim 20. 2025P00031 10.04.2025 24 A glass component is produced from the multi-component glass. This is done, for example, using a melt-casting process. A glass melt is produced from the multi-component glass in a melting unit, for example, in a glass melting tank or in a crucible, and the glass melt is poured into a casting mold. When processing the multi-component glass by casting, the glass melt preferably has a viscosity in the range of 10. 1 dPa s to 10 4dPa s. The glass component is designed, for example, as a chamber wall or lining of a plasma etching reactor and / or as a wafer holder, heating device, support or clamping element, ring cover, and in particular as an etching ring. Features relating to the chemical composition and other properties of the multi-component glass are explained above, and these explanations are hereby included for the glass component. Definitions and measuring methods Individual terms from the above description are defined in more detail below. The definitions form part of the description of the invention. In the event of a contradiction between one of the following definitions and the rest of the description, the statement in the rest of the description shall prevail. For terms and measuring methods not specifically defined in the description, the interpretation according to the International Telecommunication Union (ITU) shall prevail.If a measurement method is not specified for a parameter, the standard measurement method shall be used for that parameter, and in particular the measurement method specified in the relevant ISO standard whose publication date is closest to that of this application. If measurement conditions are not specified, the standard conditions (SATP conditions) shall be 298.15 K (25°C, 77°F) for temperature and 100 kPa (14.504 psi, 0.986 atm) for absolute pressure. Multicomponent glasses 2025P00031 10.04.2025 25 Multicomponent glasses according to the invention contain, in addition to silicon dioxide, at least one further component, which is characterized in that it forms a halogen compound with an etching gas used in a plasma-assisted dry etching process. This halogen compound is solid at the process temperature in the dry etching process, i.e., does not evaporate or sublimate. The process temperature during reactive ion etching (RIE etching) varies depending on the specific requirements of the process and the materials used and is generally in the range from room temperature to approximately 200°C. Composition of the multicomponent glass The "mol %" specification refers both to the elemental species of the component of the multicomponent glass as such and to compounds containing the component in ionic or covalent bonds.The phrase "has a composition" or "consists of" is intended to encompass the possibility that unexpressively mentioned, common and unavoidable impurities may be present in the composition, the amounts of which are insignificant and which are not intentionally added. The phrase stating that the composition "does not contain" a particular component or that the composition is "free" of a component is to be understood to mean that the component is present at most as an impurity—i.e., including the hypothetical case of 0 wt% and in any case not in appreciable amounts—and, in particular, that it is not intentionally added. The amount of impurity in the multi-component glass is given here in ppm by weight. A "negligible amount" is understood to mean less than 5000 ppm by weight of the composition, less than 500 ppm by weight, less than 50 ppm by weight, or less than 5 ppm by weight, based on the mass of the multi-component glass.Scandium, yttrium, and the lanthanides are subsumed under "rare earth metals." This multicomponent glass is an "oxidic glass" in the sense that all anion sites are filled with oxygen ions (O). 2- ) are occupied or at most a small part of the oxygen ions (O 2- ) is substituted by other anions, in particular by fluorine ions (F-). This applies equivalently to the designation of individual components of the multi-component glass as "oxide". Even in these oxides, a small part of the oxygen ions (O 2- ) may be substituted by other anions. The degree of substitution may be in the range between 0.1 and 10% (based on the theoretical total number of oxygen ions (O 2- )). Viscosity measurement The multi-component glass is cast into molded bodies in a liquid, low-viscosity state. The viscosity of the melt is in the range of 10 1 dPa s to 10 4dPa s. Viscosity is measured using shear or rotational viscometry, with the viscosity and density values ​​given in Table 1 being calculated. Instead of using exponential notation, viscosity values ​​are often given using the decimal logarithm in the form lg(dPa s). Dry etch resistance measurement To measure dry etch resistance, a sample of the multi-component glass is subjected to a standard procedure with the following treatment steps in an RIE plasma reactor: (a) One flat side of the sample is polished to a surface roughness with an R a-value of 4 nm or less. (b) A portion of the polished flat side is masked with Kapton adhesive tape. (c) The correspondingly partially masked, polished flat side is subjected to a dry etching process characterized by the following parameters: • A power of 600 watts is fed into the RF energy source. • Using the RF energy source, a bias voltage of minus 100 volts is applied to the test sample at an input power of 10 watts • The following process gases are introduced into the reactor chamber: 5 sccm argon, 1 sccm CF4, 0.3 sccm O2. • The chamber pressure is set to 6 Pa. • The etching time is 60 minutes. 2025P00031 10.04.2025 27 (d) The step height between the masked area and the unmasked area of ​​the glass sample is measured using a profile measuring device. The absolute etching rate is determined from the step height, which is a measure of the dry etching resistance of the glass sample.This etching rate is compared with the etching rate determined simultaneously on a reference sample made of quartz glass, which was etched at the same time as the sample. The determined value is the so-called relative etching rate. Estimation of particle formation Particle formation in the RIE process was estimated based on the composition of the multi-component glass. The estimate is based on the assumption of the extent to which it is possible to form a thermally and structurally stable reaction product layer on the surface of the multi-component glass during the RIE process at a process temperature below 200 °C using the halogen-containing etching gas (containing fluorine, chlorine, or bromine). It is known that aluminum oxide forms particles. The lower the proportion of aluminum oxide, the lower the estimated particle formation.It is expected that Al2O3 will form AlF3 (evaporation temperature 1290 °C) as a reaction product in the RIE process (when using a fluorine-containing etching gas), making it one of the elements useful for the formation of a passivating layer. At the same time, it is known that the use of Al2O3 leads to increased particle formation. In the present invention, it has been possible to reduce the proportion of Al2O3 and to use other intermediate oxides that promote glass formation. Nb2O5 and Ta2O5 exhibit similarly good etch resistance in the RIE process. It can therefore be assumed that Nb2O5 and Ta2O5 do not significantly impair the formation of a passivation layer by the remaining components of the glass. Due to the evaporation temperature of NbF5 (233 °C) and TaF5 (230 °C) being close to the process temperature, a simultaneous reduction in particle formation is expected. 2025P00031 04 / 10 / 2025 28 Tboil / Tsub Tboil / Tsub Oxide Fluoride °C Chloride. °C BromidTboil / Tsub °CSiO2 SiF4 -90.3 SiCl4 57 SiBr4 153 Al2O3 AlF3 1290 AlCl3 180 AlBr3 255 Nb2O5 NbF5 233 NbCl5 254 NbBr5 364 Ta2O5 TaF5 230 TaCl5 240 TaBr5 349 MgO MgF2 1676 MgCl2 1412 MgBr2 1250 CaO CaF2 2500 CaCl2 1935 CaBr2 1953 SrO SrF2 2489 SrCl2 1250 SrBr2 2146 BaO BaF2 2260 BaCl2 1560 BaBr2 1835Exemplary embodiments The invention is explained in more detail below using exemplary embodiments. To produce test specimens from the multicomponent glass, high-purity oxidic and / or fluoride starting powders were melted in a platinum crucible at temperatures ranging from 1450 to 1600°C. The melt was held at melting temperature for 1 to 3 hours for refining and then poured into a casting mold. The test specimens obtained after solidification of the melt were subjected to stress-relieving annealing. Dry etch resistance was measured in an RIE plasma reactor, and particle formation was estimated using the method specified under "Definitions." Table 1 lists the compositions and properties of the samples.

[0002] 2025P00031 10.04.2025 29 Table 1 Composition Etching rate Viscosity Density Partikel- b ildung Sample T@ T@ Components Proportions Absolute Relative 10 13.2 10 2 ρ dpa. s dPa . s [mol-%] [µm / h] [%] [°C] [°C] [g / cm³]1SiO2-Nb2O5-CaO 35-13-52 0.18 3% 704 1055 3.33 02SiO2-Nb2O5-SrO 42-15-43 0.28 5% 620 1156 3.89 +3SiO2-Ta2O5-MgO 47-8-45 7% 795 1397 3.40 +4SiO2-Ta2O5-SrO 50-10-40 7% 769 1512 4.31 +5SiO2-Ta2O5-CaO 44-12-44 6% 767 1500 3.90 + V6 SiO2-Al2O3-CaO 35-20-45 0.14 2% 737 1350 2.83 - V7 SiO2-Al2O3-CaO 54-11-35 0.15 3% 757 1532 2.68 -8SiO2-Nb2O5-SrO 35-13-52 4% 703 1136 4.35 09SiO2-Ta2O5-BaO 55-7-38 6% 758 1482 4.60 +V10 SiO2-Al2O3- 35-20- 3% 828 1360 3.30 - SrO 45 11 SiO2-Nb2O5- 40-17- 7% 618 1147 3.93 + SrO 43 12 SiO2-Nb2O5- 38-19- 7% 617 1135 3.97 + SrO 43

[0003] 2025P00031 10.04.2025 30 The column “relative etching rate” indicates the etching rate of the test sample relative to the etching rate of undoped, synthetically produced quartz glass (SUPRASIL ®; trade name of Heraeus Quarzglas GmbH & Co. KG) as a reference. The symbolism for the qualitative assessment in the "Particle Formation" column means: (+): little, (0): acceptable, (-): high. The composition of sample V10 – given here in mol-% – is known from US 2014 / 0274653 A1. The composition in wt.% is: 43 SiO2 - 19 Al2O3 - 29 Y2O3 - 9 MgO. This multicomponent glass is characterized by high dry etching resistance. The value for the relative etch rate given in column 5 of Table 1 is calculated. The value given in Fig. 1 of the above-mentioned patent is probably based on an etching procedure different from the standard etching procedure described in the present document. However, with regard to particle formation, the sample is a comparative example, which can be attributed at least in part to its high SiO2 content in the composition and the associated volatility in the RIE process.Samples 1 to 5 are Al2O3-free, ternary multicomponent glasses containing either niobium oxide or tantalum oxide in a maximum concentration of 17 mol% in addition to SiO2. Both components, in combination with SiO2, act as network modifiers, reducing viscosity and transformation temperature. The other component in each case is either lanthanum oxide or an alkaline earth oxide. Sample 1 has a particularly low SiO2 concentration of 35 mol% and exhibits a low etch rate. The multicomponent glass of sample V6 has a ternary composition with SiO2, Al2O3, and an alkaline earth oxide (CaO). The SiO2 concentration is particularly low, while the CaO concentration is particularly high. In the standard dry etching procedure in the RIE plasma reactor, CaO reacts to form CaF2 (melting point: 1,423°C, boiling point: 2,500°C). This sample shows the lowest absolute and relative etching rate, which can be attributed to the formation of a more or less erosion-resistant reaction product layer.The multicomponent glass of sample V7 also has a ternary composition with SiO2, Al2O3, and CaO and exhibits a similarly low etch rate as sample V6. However, the SiO2 content is increased at the expense of a lower Al2O3 content. As a result, the temperature range for low viscosities is shifted to higher temperatures (T at 10² dPa s 1532°C). In general, the following statements can be made regarding the etch rates and estimated particle formation: - High alkaline earth contents have a positive effect on the etching behavior. - A high Al2O3 content also has a positive effect on the etch rate. - Nb2O5 and Ta2O5 exhibit slightly worse etch rate behavior. However, lower particle formation is expected for these glasses at comparable etch rates. - As expected, an excessively high SiO2 content is problematic because the passivating layers that form are destabilized by preferential etching loss of this component.In addition, it was surprisingly found that both high alkaline earth contents and high rare earth contents have a positive effect on the etching behavior.

Claims

2025P00031 10.04.2025 32 PATENT CLAIMS 1. Multi-component glass with high etching resistance during dry etching, which contains SiO2 in a proportion in the range of maximum 60 mol% and at least one further component which forms a temperature-stable reaction product with halogen-containing etching gas, characterized in that the multi-component glass contains niobium oxide in an amount of 5 to 50 mol% and / or tantalum oxide in an amount of up to 30 mol%, the sum of niobium oxide and tantalum oxide, based on the total amount of multi-component glass, being 5 to 50 mol%.

2. Multicomponent glass according to claim 1, characterized in that the amount of niobium oxide in the multicomponent glass is 5 to 50 mol%, more preferably 5 to 45 mol%, more preferably 5 to 40 mol%, more preferably 8 to 35 mol%, more preferably 9 to 34 mol%, more preferably 10 to 30 mol%. 3.Multicomponent glass according to claim 1 or 2, characterized in that the amount of tantalum oxide in the multicomponent glass is 0 to 30 mol%, more preferably 1 to 29 mol%, more preferably 2 to 28 mol%, more preferably 3 to 27 mol%, more preferably 4 to 26 mol%, more preferably 5 to 25 mol%.

4. Multicomponent glass according to one of claims 1 to 3, characterized in that the total amount of niobium oxide and tantalum oxide in the multicomponent glass is 5 to 50 mol%, more preferably 6 to 49 mol%, more preferably 7 to 48 mol%, more preferably 8 to 47 mol%, more preferably 9 to 46 mol%, more preferably 10 to 45 mol%.Multicomponent glass according to one of claims 1 to 4, characterized in that the amount of aluminum oxide Al2O3 in the multicomponent glass is at most 10 mol%, more preferably at most 9 mol%, more preferably at most 8 mol%, more preferably at most 7 mol%, more preferably at most 6 mol%, more preferably at most 5 mol%, more preferably at most 4 mol%, more preferably at most 3 mol%, more preferably at most 2 mol%.

6. Multicomponent glass according to one of claims 1 to 5, characterized in that the multicomponent glass contains alkali metals or alkali metal compounds. 2025P00031 10.04.2025 33 in a concentration of less than 1000 mol-ppm each, with the exception of oxidic compounds of cesium and / or rubidium.

7. Multicomponent glass according to one of claims 1 to 6, characterized in that the multicomponent glass contains no alkali metals or alkali metal compounds, with the exception of oxidic compounds of cesium and / or rubidium.

8. Multicomponent glass according to one of claims 1 to 7, characterized in that the temperature-stable reaction product has a volatilization temperature above 200°C, preferably above 400°C, and particularly preferably above 500°C. 9.Multicomponent glass according to one of claims 1 to 8, characterized in that the at least one further component is a compound selected from at least one of the following groups: (i) a first group consisting of oxides of Rb and Cs, the alkaline earth elements, and Zn, (ii) a second group consisting of oxides of rare earth metals with the exception of promethium (Pm), (iii) a third group consisting of oxides of elements from transition groups 4 to 6 of the Periodic Table, namely: Ti, Zr, Hf, V, Nb, Ta, Mo, and W, (iv) a fourth group consisting of oxides of elements from main groups 13 to 15 of the Periodic Table, namely: Al, Ga, In, Ge, Sn, and Bi.

10. Multicomponent glass according to claim 9, characterized in that the molar proportion of oxides from the first group and from the second group together is higher than the molar proportion of the oxides from the third group. 11.Multicomponent glass according to claim 10, characterized in that the molar proportion of oxides from the first group and from the second group together is at least 1.5 times higher - preferably 2 times higher - than the molar proportion of the oxides from the third group.

12. Multicomponent glass according to claim 9, characterized in that the molar proportion of the oxides from the first group, from the second group, and from the third group. 2025P00031 10.04.2025 34 group together is higher than the molar proportion of the oxides from the fourth group plus the molar proportion of SiO2.

13. Multi-component glass according to claim 12, characterized in that the molar proportion of oxides from the first group and from the second group and the third group together is at least 1.5 times higher - preferably 1.75 times higher - than the molar proportion of the oxides from the fourth group plus the molar proportion of SiO2.

14. Multi-component glass according to one or more of the preceding claims, characterized in that it does not contain compounds of antimony, arsenic, gallium or contains them as an impurity in a concentration of less than 1000 ppm by weight in each case.

15. Multi-component glass according to one or more of the preceding claims, characterized in that it does not contain boron and phosphorus compounds or contains them in a concentration of less than 1000 ppm by weight in each case. 16.Multi-component glass according to one or more of the preceding claims, characterized in that the at least one further component is a chemical compound from the group consisting of: Bi2O3, ZnO, SnO2, TiO2, ZrO2, WO3, MoO3, MgO, CaO, SrO, BaO and rare earth metal oxides.

17. Multi-component glass according to one or more of the preceding claims, characterized in that it has a purely oxidic network structure.

18. Multi-component glass according to one or more of the preceding claims, characterized in that it has a network structure with anion sites, wherein (100-x)% of the anion sites are occupied by oxygen ions (O 2-) and the proportion x (%) is occupied by fluorine ions (F-), where x is the degree of substitution (in %) and is in the range between 0.1 and 10, preferably in the range from 0.1 to 5 and particularly preferably in the range from 0.1 to 4.

19. Multicomponent glass according to one or more of the preceding claims, characterized by the following composition: 2025P00031 10.04.2025 35 Component Concentration range from – to (mol-%) SiO2 25 60 Bi2O30 50 SiO2+Bi2O330 100 Al2O30 35 ZnO 0 40 Al2O3+ZnO 0 60 SnO2 0 15 TiO2 0 35 ZrO20 15 WO30 20 MoO3 0 20 Nb2O5 5 50 Ta2O5 0 30 Nb2O5 + Ta2O5 5 50 MgO 0 60 CaO 0 60 SrO 0 60 BaO 0 60 Alkaline earth oxides 0 70 Rare earth oxides 0 30 Total rare earth oxides 0 40 HfO20 10 V2O50 15 GeO20 10 20. Multicomponent glass according to one or more of the preceding claims, characterized by the following composition classified as “aluminosilicate glass”: 2025P00031 10.04.2025 36 Component Concentration range from – to (mol-%) SiO2 25 60 Bi2O30 10 SiO2+Bi2O325 70 Al2O35 25 ZnO 0 30 Al2O3+ZnO 5 50 SnO2 0 10 TiO2 0 20 ZrO20 10 WO30 10 MoO3 0 10 Nb2O5 5 50 Ta2O5 0 30 Nb2O5 + Ta2O5 5 50 MgO 0 50 CaO 0 50 SrO 0 50 BaO 0 50 Total alkaline earth oxides 0 70 Rare earth metal oxides 0 30 Total rare earth metal oxides 0 40 HfO20 10 V2O50 10 GeO20 10 21. Multicomponent glass according to one or more of claims 1 to 15, characterized by the following bismuth silicate glass classified composition: 2025P00031 10.04.2025 37 Component Concentration range from – to (mol-%) SiO2 30 60 Bi2O3 20 45 SiO2+Bi2O3 50 80 Al2O3 0 20 ZnO 0 40 Al2O3+ZnO 0 50 SnO2 0 10 TiO2 0 20 ZrO2 0 10 WO3 0 10 MoO3 0 10 Nb2O5 5 50 Ta2O5 0 30 Nb2O5 + Ta2O5 5 50 MgO 0 30 CaO 0 30 SrO 0 30 BaO 0 30 Alkaline earth oxides 0 40 Rare earth oxides 0 30 Total rare earth oxides 0 40 HfO2 0 10 V2O50 10 GeO20 10 22. Multicomponent glass according to one or more of claims 1 to 15, characterized by the following niobium-tantalum-silicate glass composition: 2025P00031 10.04.2025 38 Component Concentration range from – to (mol-%) SiO2 20 60 Bi2O30 20 SiO2+Bi2O320 70 Al2O30 20 ZnO 0 30 Al2O3+ZnO 0 40 SnO2 0 10 TiO2 0 20 ZrO20 10 WO30 10 MoO3 0 10 Nb2O5 5 50 Ta2O5 0 30 Nb2O5 + Ta2O5 5 50 MgO 0 60 CaO 0 60 SrO 0 60 BaO 0 60 Alkaline earth oxides 0 70 Rare earth oxides 0 30 Total rare earth oxides 0 40 HfO20 10 V2O50 10 GeO20 10 23. Multicomponent glass according to one or more of claims 1 to 15, characterized by the following composition classified as “titanium silicate glass”: 2025P00031 10.04.2025 39 Component Concentration range from – to (mol-%) SiO2 30 60 Bi2O30 20 SiO2+Bi2O330 80 Al2O30 20 ZnO 0 30 Al2O3+ZnO 0 40 SnO2 0 10 TiO2 5 35 ZrO20 10 WO30 10 MoO3 0 10 Nb2O5 5 50 Ta2O5 0 30 Nb2O5 + Ta2O5 5 50 MgO 0 30 CaO 0 30 SrO 0 30 BaO 0 30 Alkaline earth oxides 0 40 Rare earth metal oxides 0 30 Total rare earth metal oxides 0 40 HfO20 10 V2O50 10 GeO2 0 10 24. Multicomponent glass according to one or more of the preceding claims, characterized in that impurities of Cr, Mn, Fe, Co and Ni and compounds of these elements are each present in an amount of less than 50 ppm by weight and preferably less than 20 ppm by weight, and that the sum of the impurities of Cr, Mn, Fe, Co and Ni is less than 100 ppm by weight. 2025P00031 10.04.2025 40 25. A glass component for use in a dry etching process in contact with a plasma and halogen-containing etching gases, characterized in that it has a surface exposed to the etching gases, which consists of a multi-component glass according to one of claims 1 to 20.

26. A glass component according to claim 26, characterized in that it is designed as a chamber wall or chamber lining of a plasma etching reactor and / or as a wafer holder, heating device, pedestal, support or clamping element, ring cover, and in particular as an etching ring.

27. Use of the glass component according to claim 26 or 27 for use in an RIE dry etching process for the purpose of minimizing particle formation upon contact with a plasma and halogen-containing etching gas.

28. Use according to claim 28 for the production of chamber walls or chamber lining of a plasma etching reactor and / or as a wafer holder, heating device, pedestal, support or clamping element, ring cover and etching ring.

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