Electronic device

Abstract

The present invention suppresses curving of a circuit board due to external impact. An electronic device (10) may have a circuit board shield (120) covering the surface of a circuit board (110) and having a peripheral part (120e) secured to the circuit board (110). A plurality of first elongated recesses (122) may be formed in the circuit board shield (120). Each of the plurality of first elongated recesses (122) may be recessed toward the circuit board (110) and may extend in a first direction. The plurality of first elongated recesses (122) may be arranged in a second direction that crosses the first direction.

Description

electronic equipment

[0001] The present invention relates to electronic devices.

[0002] In electronic devices that use IC (integrated circuit) chips such as CPUs (Central Processing Units), memories, and SoCs (Systems on a Chip) that integrate these, noise countermeasures are taken to block noise (unwanted radiation noise) such as electromagnetic waves emitted from the IC chips. In the electronic device described in Patent Document 1 below, the circuit board is covered with a circuit board shield and a plate to block noise emitted from the IC chips mounted on the circuit board.

[0003] International Publication No. 2023 / 199608

[0004] When an electronic device receives an external impact, it is desirable that the circuit board does not bend.

[0005] An object of the present disclosure is to suppress bending of a circuit board due to an external impact.

[0006] The electronic device proposed in the present disclosure may include a circuit board and a first circuit board shield covering a first surface of the circuit board and having an outer periphery fixed to the circuit board. A plurality of first extended recesses may be formed in the first circuit board shield. Each of the plurality of first extended recesses may be recessed toward the circuit board and extend in a first direction. The plurality of first extended recesses may be aligned in a second direction intersecting the first direction. This can suppress deflection of the circuit board fixed to the outer periphery of the first circuit board shield. In other words, bending of the circuit board can be suppressed when the electronic device receives an external impact.

[0007] 1. A perspective view of an electronic device. A perspective view of an electronic device. An exploded perspective view showing the internal components of the device main body. A plan view showing the assembled state of the components shown in FIG. 2A. A perspective view showing the internal structure of the device main body. A bottom view showing the internal structure of the device main body. An exploded perspective view showing the components of a circuit board unit. A perspective view showing a circuit board. A perspective view showing a state in which a first cooling device is attached to the circuit board unit. A plan view showing a heat-receiving member and a shield plate. A plan view showing a cooling fan and a first cooling device. An enlarged view of a connection portion of a plurality of heat pipes in the plan view of FIG. 7. An exploded perspective view showing a state in which the first heat sink of the first cooling device is disassembled. A perspective view showing a first fin and a second fin. A perspective view showing the first fin. An enlarged view of the second heat sink of FIG. 5. A partially enlarged view of an enlarged lower shield of FIG. 3B. A cross-sectional view showing a cut surface taken along line XII-XII of FIG. 11. A cross-sectional view showing a cut surface taken along line XIII-XIII of FIG. 11. A cross-sectional view showing a cut surface taken along line XIV-XIV of FIG. 11. A perspective view showing a portion of the upper shield shown in FIG. 4A. A plan view showing a portion of the upper shield. 22A is an enlarged view of the battery cover member and the battery opening portion of FIG. 22A. FIG. 23 is a cross-sectional view showing the cross section taken along line XXIV-XXIV of FIG. 23. FIG. 24 is an enlarged view of the screw and insertion hole shown in the cross-sectional view of FIG. 24. FIG. 25 is a cross-sectional view showing the state of the battery cover member before the screw is attached to the battery cover member. FIG. 26 is a cross-sectional view showing the state of the battery cover member after the screw has been removed from the screw hole.

[0008] 1. Overview of Electronic Device An electronic device 10, which is an example of an electronic device proposed in this disclosure, will be described below with reference to the drawings. Figures 1A and 1B are perspective views showing the electronic device 10. The electronic device 10 may be a computer such as a game device, a video / audio playback device, a personal computer, or a server computer.

[0009] In the following description, the X1 and X2 directions of the X axis shown in FIG. 1A and elsewhere are defined as right and left, respectively. The Y1 and Y2 directions of the Y axis perpendicular to the X axis are defined as forward and backward, respectively. The Z1 and Z2 directions of the Z axis perpendicular to the X and Y axes are defined as upward and downward, respectively. However, the directions shown in FIG. 1A and elsewhere are defined to explain the shapes and relative positional relationships of the elements (components, members, and sections) of the electronic device 10, and do not limit the orientation of the electronic device 10 relative to the installation surface.

[0010] As shown in FIG. 1A , the electronic device 10 may include a device main body 11 and a first exterior panel 12 and a second exterior panel 13 covering the device main body 11. The first exterior panel 12 may cover the top surface of the device main body 11. The first exterior panel 12 may include a first left partial panel 12L covering the left portion of the top surface of the device main body 11 and a first right partial panel 12R covering the right portion of the top surface. A gap may be provided between the first right partial panel 12R and the first left partial panel 12L, functioning as an air intake for sending air to a cooling fan 50 (described later). Furthermore, as shown in FIG. 1B , the second exterior panel 13 may cover the bottom surface of the device main body 11. The second exterior panel 13 may include a second left partial panel 13L covering the left portion of the bottom surface of the device main body 11 and a second right partial panel 13R covering the right portion of the bottom surface. A gap that functions as an air intake may also be provided between the second right partial panel 13R and the second left partial panel 13L.

[0011] 1B , the electronic device 10 may have two support members 14a and 14b. The two support members 14a and 14b may be attached to the gap between the second right partial panel 13R and the second left partial panel 13L. The lower ends of the two support members 14a and 14b may contact an installation surface such as a desk or floor. The electronic device 10 can be placed on the installation surface such that the first exterior panel 12 is positioned above the second exterior panel 13.

[0012] FIG. 2A is an exploded perspective view showing the internal components of the device body 11. FIG. 2B is a plan view showing the assembled state of the components shown in FIG. 2A. FIG. 3A is a perspective view showing the underside of the internal structure of the device body 11. FIG. 3B is a bottom view showing the internal structure of the device body 11. The device body 11 may include the circuit board unit 20, first cooling device 30, second cooling device 40, cooling fan 50, and power supply unit 60 shown in FIGS. 2A and 2B, as well as the case member 70 shown in FIGS. 3A and 3B. The case member 70 may have a box shape that opens downward (in the Z2 direction). Note that FIG. 3A shows the cooling fan 50 shown in FIG. 2B removed from the case member 70. The cooling fan 50 may be positioned below (in the Z2 direction) the ventilation hole 73 formed in the case member 70.

[0013] 2A , the circuit board unit 20 may be disposed between the first cooling device 30 and the second cooling device 40 in the vertical direction. The first cooling device 30 may be disposed below the circuit board unit 20. The second cooling device 40 may be disposed above the circuit board unit 20, and the power supply device 60 may be disposed thereon. The cooling fan 50 may be disposed adjacent to a structure combining the circuit board unit 20, the first cooling device 30, and the second cooling device 40 (at the same position as this structure in the vertical direction) in a direction intersecting the vertical direction (e.g., the left-right direction).

[0014] 3A and 3B , the first cooling device 30 is shown as a component below the circuit board unit 20. As shown in FIG. 3B , the circuit board unit 20, the first cooling device 30, and the cooling fan 50 may be housed in a box-shaped case member 70. Similarly, the second cooling device 40 and the power supply device 60 may also be housed in the case member 70. As shown in FIGS. 3A and 3B , the device main body 11 may have a battery board 90 to which a button-type battery 91 is attached and a member 92 having a screw hole 93 (see FIG. 22B ), which will be described later. The battery board 90 and member 92 may also be housed in the case member 70. The lower side of the box-shaped case member 70, which is open downward, may be covered by a cover member 80 (see FIG. 22A ), which will be described later. Note that in FIG. 3A , the battery board 90 is shown separated downward (in the Z2 direction) from the case member 70 to clearly show the battery board 90.

[0015] As shown in FIG. 1B , the rear surface of the case member 70 may be formed with a plurality of exhaust ports 71 for discharging air sent from the cooling fan 50. As shown in FIG. 1B , the rear surface of the case member 70 may be formed with a plurality of louvers 72 aligned in the left-right direction (X-axis direction). The exhaust ports 71 may be formed between adjacent louvers 72. Each of the plurality of louvers 72 may extend in an oblique direction inclined with respect to the left-right direction (X-axis direction) and the front-rear direction (Y-axis direction). This configuration can prevent the internal structure of the device body 11, such as the circuit board unit 20, the first cooling device 30, the second cooling device 40, the cooling fan 50, and the power supply unit 60, from being visually exposed when viewing the device body 11 from behind.

[0016] FIG. 4A is an exploded perspective view showing components of the circuit board unit 20. As shown in FIG. 4A , the circuit board unit 20 may include a circuit board 110, a first circuit board shield 120, a second circuit board shield 130, a leaf spring 140, and a spring support member 150. The first circuit board shield 120 and the second circuit board shield 130 may be formed by sheet metal processing of a flat metal (e.g., aluminum or iron). The first circuit board shield 120 may cover the upper side of the circuit board 110, and the second circuit board shield 130 may cover the lower side of the circuit board 110. The circuit board 110 may be disposed between the first circuit board shield 120 and the second circuit board shield 130. In the following description, the first circuit board shield 120 will also be referred to as the upper shield 120, and the second circuit board shield 130 will also be referred to as the lower shield 130.

[0017] 4A , electronic components such as an IC (integrated circuit) chip 111 may be mounted on an upper surface 110U of the circuit board 110. The IC chip 111 may be a SoC (System on a Chip) that integrates the functions of a GPU (Graphics Processing Unit), a CPU (Central Processing Unit), and I / O (Input / Output). The IC chip 111 may also include memory functions such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0018] Furthermore, multiple electronic components 113a and 113b may be mounted on the upper surface 110U of the circuit board 110. In the example shown in Fig. 2A, the multiple electronic components 113a are arranged along the front-rear direction (Y-axis direction) at positions spaced apart in the left-right direction (X-axis direction) from the IC chip 111. Furthermore, the multiple electronic components 113b are arranged next to the multiple electronic components 113a in the left-right direction and are arranged along the front-rear direction.

[0019] 4A , a frame member 112 having an opening formed in the center may be provided on an upper surface 110U of the circuit board 110. The IC chip 111 may be disposed inside the opening of the frame member 112 when viewed from above the circuit board 110 (electronic device 10). In addition, a liquid metal may be applied to the IC chip 111 to transfer heat from the IC chip 111 to a heat-receiving plate 34 (see FIG. 6 ), which will be described later.

[0020] 4A , a ground pattern 114 made of a conductive material may be formed on the upper surface 110U of the circuit board 110. The ground pattern 114 may extend along the edge of the circuit board 110. The ground pattern 114 may surround the IC chip 111, the plurality of electronic components 113a, and the plurality of electronic components 113b.

[0021] 4B is a perspective view showing the lower surface 110D of the circuit board 110. As shown in FIG. 4B, a plurality of electronic components, such as electronic components 113c, 113d, and a chip 115, may also be mounted on the lower surface 110D of the circuit board 110. In the example shown in FIG. 4B, the plurality of electronic components 113c are arranged along the front-to-rear direction (Y-axis direction). The plurality of electronic components 113c may be disposed in the same positions as the plurality of electronic components 113a (see FIG. 4A) in a plan view of the circuit board 110.

[0022] In the example shown in FIG. 4B , the electronic components 113d are arranged next to the electronic components 113c in the left-right direction and are aligned in the front-to-back direction (Y-axis direction). The electronic components 113d may be transistors such as field effect transistors (FETs). The chips 115 may also be IC chips that include memory functions such as ROM and RAM. In a plan view of the circuit board 110, the chips 115 may be mounted around the IC chip 111 and may surround the IC chip 111 (see FIG. 4A ).

[0023] 4B , a ground pattern 116 extending along the edge of the circuit board 110 may be formed on the lower surface 110D of the circuit board 110. The ground pattern 116 may be made of a conductive material and may surround a plurality of electronic components including the electronic component 113d and the chip 115.

[0024] 4A , the upper shield 120 may cover at least a portion of the upper surface 110U of the circuit board 110. The upper shield 120 may have a first outer periphery 120e fixed to the upper surface 110U of the circuit board 110. The outer periphery 120e of the upper shield 120 may be in contact with the ground pattern 114 formed on the upper surface 110U of the circuit board 110. In addition, the upper shield 120 may have a second outer periphery 120f fixed to the lower shield 130.

[0025] As shown in FIG. 4A , the lower shield 130 may cover at least a portion of the lower surface 110D of the circuit board 110. The lower shield 130 may have an outer periphery 130e fixed to the lower surface 110D of the circuit board 110 and the second outer periphery 120f of the upper shield 120. The outer periphery 130e of the lower shield 130 may be in contact with the ground pattern 116 (see FIG. 4B ) formed on the lower surface 110D of the circuit board 110. The upper shield 120 and the lower shield 130 may be fastened together by a plurality of fastening members 190 (see FIGS. 3A and 3B ), such as screws or rivets. This ensures contact between the upper shield 120 and the ground pattern 114 and between the lower shield 130 and the ground pattern 116.

[0026] 3A and 3B may be attached to holes or notches formed in the upper shield 120, the lower shield 130, and the circuit board 110. The multiple fastening members 190 may include fastening members 190 that are attached only to the upper shield 120 and the lower shield 130 and are not attached to the circuit board 110.

[0027] [2. First Cooling Device] The first cooling device 30 will be described in detail below.

[0028] [2-1. Overall Structure of First Cooling Device] Fig. 5 is a perspective view showing the first cooling device 30 attached to the circuit board unit 20 shown in Fig. 2A. Fig. 6 is a plan view showing the heat-receiving member 34 and shield plate 35 included in the first cooling device 30. As shown in Fig. 5, the first cooling device 30 may have a plurality of heat pipes 31, a first heat sink 32, and a second heat sink 33. Also, as shown in Fig. 6, the first cooling device 30 may have the heat-receiving member 34 that receives heat from the IC chip 111, and a shield plate 35 for fixing the heat-receiving member 34 to the position of the IC chip 111.

[0029] 4A , the upper shield 120 may have an opening 121 (hole) that exposes the IC chip 111, and a plurality of mounting holes 121a formed on an edge 124 of the opening 121 and surrounding the opening 121. As shown in FIG. 6 , a plurality of mounting holes 35a may also be formed in the shield plate 35 of the first cooling device 30. By passing fastening members such as screws or rivets through the mounting holes 35a, 121a and fastening the shield plate 35 and the upper shield 120 together, the heat-receiving member 34 can be fixed between the shield plate 35 and the upper shield 120. This allows the heat-receiving member 34 of the first cooling device 30 to be fixed at the position of the IC chip 111 exposed from the opening 121 of the upper shield 120.

[0030] 4A , the edge 124 of the opening 121 where the mounting hole 121a is formed may bulge upward (in the Z1 direction). This ensures contact between the edge 124 of the opening 121 and the shield plate 35, and prevents noise such as electromagnetic waves generated from electronic components and wiring mounted on the circuit board 110 from leaking outside the circuit board unit 20 (see FIG. 2A ) through the opening 121.

[0031] 6 , an opening 35b exposing the heat-receiving member 34 may be formed in the center of the shield plate 35. A plurality of mounting holes 35a formed in the shield plate 35 may surround the opening 35b. Furthermore, a protrusion 35c bulging upward may be formed at the corner of the edge of the opening 35b of the shield plate 35. A recess recessed at the position of the protrusion 35c may be formed in the underside of the shield plate 35, and the heat-receiving member 34 may be fitted into this recess.

[0032] The plurality of heat pipes 31 may be connected to the heat-receiving member 34 inside the opening 35b (see FIG. 6 ). Each of the plurality of heat pipes 31 may be connected to one or both of the first heat sink 32 and the second heat sink 33. This allows the heat of the IC chip 111 received by the heat-receiving member 34 to be transferred to the first heat sink 32 and the second heat sink 33 via the plurality of heat pipes 31 and released at the first heat sink 32 and the second heat sink 33. As a result, the IC chip 111 can be cooled.

[0033] 7 is a plan view showing the cooling fan 50 and the first cooling device 30. FIG. 7 shows the structure shown in FIG. 2B with the circuit board unit 20 and the power supply device 60 removed. As shown in FIG. 7, the first cooling device 30 may have a first heat sink 32 and a second heat sink 33. At least one of the multiple heat pipes 31 may have a portion connected to the first heat sink 33. Furthermore, at least one of the multiple heat pipes 31 may have a portion connected to the second heat sink 33.

[0034] 7, the plurality of heat pipes 31 may have a connecting portion 311 where adjacent heat pipes 31 are connected to each other. The connecting portion 311 may be a portion where all of the plurality of heat pipes 31 (seven in the example shown in FIG. 7) included in the first cooling device 30 are connected to each other. The connecting portion 311 may be a portion where adjacent heat pipes 31 are welded to each other, or a portion where adjacent heat pipes 31 are connected to each other by a fixing means such as soldering.

[0035] The connecting portions 311 of the multiple heat pipes 31 may be disposed on the heat-receiving member 34 and may be in contact with the heat-receiving member 34. The heat-receiving member 34 may be disposed on the IC chip 111 (see FIG. 4A ). The connecting portions 311 of the multiple heat pipes 31 may be located above the IC chip 111. Each of the multiple heat pipes 31 may be aligned along the surface 111U of the IC chip 111 (see FIG. 6 ) at the connecting portions 311.

[0036] 6 and 7, the outline of the IC chip 111 is indicated by a dotted line. The shape of the IC chip 111 may be rectangular or approximately rectangular when viewed from above the circuit board 110 (electronic device 10). As shown in Fig. 6, the IC chip 111 may have a surface 111U facing upward (Z1 direction in Fig. 4A), a first side surface 111R facing right (X1 direction in Fig. 6), and a second side surface 111B facing rearward (Y2 direction in Fig. 6).

[0037] 7, the first heat sink 32 may be disposed obliquely with respect to the IC chip 111, and the connecting portion 311 of the heat pipe 31 may extend obliquely toward the first heat sink 32. More specifically, the first heat sink 32 may be positioned obliquely to the right and rear of the IC chip 111 (the direction indicated by arrow R1 in FIG. 7). Furthermore, the connecting portion 311 of the heat pipe 31 may be disposed above the surface 111U of the IC chip 111 (see FIG. 6) and extend obliquely to the right and rear of the IC chip 111 (the direction indicated by arrow R2 in FIG. 7).

[0038] By doing so, the end of the connecting portion 311 of the heat pipe 31 (first connection portion 313 described later, see FIG. 8 ) can be brought closer to the first heat sink 32. This shortens the length from the connecting portion 311 of the heat pipe 31 (more specifically, the four heat pipes 31 a) to the portion where it is connected to the first heat sink 32, and allows the heat of the IC chip 111 received by the heat-receiving member 34 to be quickly transferred to the first heat sink 32. This improves the cooling performance of the first cooling device 30.

[0039] As shown in Fig. 6, the protrusion 35c of the shield plate 35 may also be formed with an edge 35d extending in a diagonal direction inclined toward the right and rear. The extension direction of the edge 35d may coincide with the extension direction of the connecting portion 311 (the direction indicated by arrow R2 in Fig. 7). This allows the extension direction of the connecting portion 311 to be determined by the extension direction of the edge 35d. In other words, the positioning of the connecting portion 311 can be easily performed.

[0040] 6, the shield plate 35 may have two edge portions 35d facing each other in a direction along the surface 111U of the IC chip 111. The connecting portion 311 may be disposed between the two edge portions 35d. The distance between the two edge portions 35d may be substantially the same as the thickness of the connecting portion 311 in the direction in which the heat pipes 31 are connected to each other (a direction perpendicular to the direction indicated by arrow R2 in FIG. 7). This makes it easier to position the connecting portion 311.

[0041] The first heat sink 32 may have a larger heat rejection capacity than the second heat sink 33. The heat rejection capacity is, for example, the amount of heat released by the heat sinks 32 and 33 within a predetermined time. The heat rejection capacity is determined by, for example, the airflow rate flowing through the fins that make up the heat sink, the speed of the airflow through the heat sink, whether other electronic components (e.g., the power supply 60) that obstruct the airflow are located near the heat sink, the number of fins that make up the heat sink, the size of the heat sink, and the like. The heat rejection capacity can also be referred to as the cooling performance for the IC chip 111. The heat rejection capacity can also be referred to as the amount of heat or temperature removed from the IC chip 111 within a predetermined time.

[0042] 7, the position of the exhaust port 71 formed on the rear surface of the case member 70 shown in FIG. 1B is indicated by a two-dot chain line. As shown in FIG. 7, the distance from the exhaust port 71 (opening) to the first heat sink 32 may be shorter than the distance from the exhaust port 71 to the second heat sink 33. The length of the airflow path from the first heat sink 32 to the exhaust port 71 (e.g., the length indicated by arrow R3) may be shorter than the length of the airflow path from the second heat sink 32 to the exhaust port 71 (e.g., the length indicated by arrow R4). As a result, the amount of heat released from the first heat sink 32 may be greater than the amount of heat released from the second heat sink 33.

[0043] 2B , the power supply unit 60 may be disposed on the opposite side of the second heat sink 33 from the cooling fan 50. Gaps between the fins constituting the first heat sink 32 may be formed along the exhaust port 71. Air that has passed through the first heat sink 32 may be directed directly toward the exhaust port 71. In contrast, gaps between the fins constituting the second heat sink 33 may be formed along the intake port 61 (see FIG. 2B ) of the power supply unit 60. Air that has passed through the second heat sink 32 may be directed toward the exhaust port 71 via the power supply unit 60. As a result, the amount of heat released from the first heat sink 32 may be greater than the amount of heat released from the second heat sink 33.

[0044] 8 is an enlarged view of the connecting portions 311 of the plurality of heat pipes 31 in the plan view of FIG. 7. As shown in FIG. 8, the plurality of heat pipes 31 may have a first connecting portion 313 located rearward of the connecting portion 311 and connected to the connecting portion 311, and a second connecting portion 314 located forward of the connecting portion 311 and connected to the connecting portion 311. In the left-right direction, a distance d3 from a center P3 of the first connecting portion 313 to the first heat sink 32 may be smaller than a distance d4 from a center P4 of the second connecting portion 314 to the second heat sink 33.

[0045] By doing so, the length from the connecting portion 311 of the heat pipe 31 to the connection portion between the heat pipe 31 and the first heat sink 32 can be made shorter than the length from the connecting portion 311 to the connection portion between the heat pipe 31 and the second heat sink 33. This allows the heat from the IC chip 111 received by the heat-receiving member 34 to be transferred to the first heat sink 32, which has a larger amount of heat rejection, more quickly than to the second heat sink 33, which has a smaller amount of heat rejection. As a result, the cooling performance of the first cooling device 30 can be improved.

[0046] Each of the multiple heat pipes 31 may be connected to the first heat sink 32 or the second heat sink 33. Furthermore, the number of heat pipes 31 connected to the first heat sink 32 may be greater than the number of heat pipes 31 connected to the second heat sink 33. As described above, the first heat sink 32 may have a greater amount of heat exhaust than the second heat sink 33. By increasing the number of heat pipes connected to the first heat sink 32, which has a greater amount of heat exhaust, compared to the number of heat pipes connected to the second heat sink 33, which has a smaller amount of heat exhaust, the cooling performance of the first cooling device 30 can be improved.

[0047] 7 , four heat pipes 31a of the seven heat pipes 31 are connected to the first heat sink 32, and two heat pipes 31b and one heat pipe 31c are connected to the second heat sink 33. However, this is not limiting, and at least one of the multiple heat pipes 31 may be connected to both the first heat sink 32 and the second heat sink 33.

[0048] 8 , at least one of the plurality of heat pipes 31 (more specifically, four heat pipes 31a) may have a first extension portion 315 extending from the first connection portion 313 to the first heat sink 32. Furthermore, at least one of the plurality of heat pipes 31 (more specifically, two heat pipes 31b) may have a second extension portion 316 extending from the second connection portion 314 to the second heat sink 33.

[0049] As shown in FIG. 7 , the connecting portion 311 of the heat pipe 31 may extend obliquely (indicated by arrow R2) toward the right and rear. As a result, the distance d3 from the center P3 of the first connecting portion 313 to the first heat sink 32 may be shorter than the distance d4 from the center P4 of the second connecting portion 314 to the second heat sink 33 in the left-right direction. This allows the first extending portion 315 extending from the first connecting portion 313 to the first heat sink 32 to be shorter than the second extending portion 316 extending from the second connecting portion 314 to the second heat sink 33. This allows the heat of the IC chip 111 received by the heat-receiving member 34 to be transferred to the first heat sink 32 more quickly than to the second heat sink 33. This improves the cooling performance of the first cooling device 30.

[0050] At least one of the heat pipes 31 (more specifically, one heat pipe 31c) may have a third extension portion 317 extending from the first connection portion 313 to the second heat sink 33. The multiple fins constituting the second heat sink 33 may be aligned along the front-to-rear direction (Y-axis direction). The second extension portion 316 may be connected to the front fins of the second heat sink 33, and the third extension portion 317 may be connected to the rear fins of the second heat sink 33. This arrangement allows the number of heat pipes 31 connected to each of the heat sinks 32 and 33 to be optimized. Furthermore, the extension portions 316 and 317 can be prevented from becoming too long. This improves the cooling performance of the first cooling device 30.

[0051] 9 is an exploded perspective view showing the first heat sink 32 of the first cooling device 30. As shown in Fig. 9, at least one of the plurality of heat pipes 31 (more specifically, two heat pipes 31d) may have an extension portion 318 extending in the front-rear direction (the Y-axis direction in Fig. 9) at the position of the first cooling device 30.

[0052] 9 , the first heat sink 32 may have a plurality of first fins 320 disposed below the extension portion 318 (in the direction indicated by Z2 in FIG. 9 ) and connected to the extension portion 318, and a plurality of second fins 330 disposed above the extension portion 318 (in the direction indicated by Z1 in FIG. 9 ) and connected to the extension portion 318. The first heat sink 32 may be formed by combining the plurality of first fins 320 and the plurality of second fins 330 in the vertical direction. The plurality of first fins 320 may be disposed above the plurality of second fins 330.

[0053] The extension portion 318 of the heat pipe 31 may be disposed between the first fin 320 and the second fin 330 and may be fixed to both the first fin 320 and the second fin 330 by a fixing means such as solder. When assembling the first cooling device 30, the extension portion 318 may be fixed to the upper ends of the plurality of first fins 320 by a fixing means. Then, the lower ends of the plurality of second fins 330 may be fixed to the extension portion 318 by a fixing means. This ensures connectivity between the plurality of first fins 320 and the plurality of second fins 330 constituting the first heat sink 32 and the extension portion 318. This allows heat from the IC chip 111 transferred to the extension portion 318 to be transferred to the plurality of first fins 320 and the plurality of second fins 330 and dissipated by these fins 320, 330.

[0054] FIG. 10A is a perspective view showing the front side of the first fin 320 and the second fin 330. FIG. 10B is a perspective view showing the rear side of the first fin 320. As shown in FIG. 10A , each of the multiple first fins 320 may have an upper edge 321 in which a first recess 321a recessed downward is formed. Also, as shown in FIGS. 10A and 10B , each of the multiple second fins 330 may have a lower edge 331 in which a second recess 331a recessed upward is formed. The extension 318 of the heat pipe 31 may be disposed between the first recess 321a and the second recess 331a. By forming the recesses 321a and 331a in the fins 320 and 330 in this manner, the edges of the recesses 321a and 331a can surround the extension 318. This allows for more reliable connection between each of the multiple first fins 320 and the multiple second fins 330 and the extension 318.

[0055] 9 , the extension 318 may be provided on each of the two heat pipes 31d. That is, the two heat pipes 31d may be disposed between the first fin 320 and the second fin 330. Two first recesses 321a may be formed in the upper edge 321 of the first fin 320. Two second recesses 331a may be formed in the lower edge 331 of the second fin 330.

[0056] The first fin 320 may be formed by sheet metal processing on a metal plate. The second fin 330 may also be formed by sheet metal processing on a metal plate. As shown in FIG. 10A , the first fin 320 may have a flat plate portion 322, and the first recess 321 a may be formed by bending the flat plate portion 322. As shown in FIG. 10B , the second fin 330 may have a flat plate portion 332, and the second recess 331 a may be formed by bending the flat plate portion 332. This increases the area of ​​the recess 321 a, 331 a that contacts the extension 318. This allows for more reliable connection between each of the multiple first fins 320 and the multiple second fins 330 and the extension 318.

[0057] 10C is an enlarged view of the first heat sink 32 in FIG. 5. As shown in FIG. 10C, a gap d5 may be provided between the upper edge 321 of each of the first fins 320 constituting the second heat sink 33 and the lower edge 331 of each of the second fins 330. The gap d5 may be formed by making the thickness of the extension 318 in the vertical direction greater than the sum of the depth of the first recess 321a at the upper edge 321 and the depth of the second recess 331a at the lower edge 331. This also makes it possible to more reliably connect each of the first fins 320 and the second fins 330 to the extension 318.

[0058] 10A , each of the multiple first fins 320 may have a claw portion 321b protruding rearward at an upper edge portion 322. The claw portion 321b may be formed by bending rearward from the flat plate portion 322 of the first fin 320. Furthermore, at the upper edge portion 322, a gap d6 may be provided between the first recess 321a and the claw portion 321b.

[0059] 10A , each of the multiple first fins 320 may have a portion 323b that is bent relative to the flat portion 322 at a position different from a recess 323a (described later) of the lower edge portion 323. At least a portion of this portion 323b may also be hooked onto the adjacent second fin 330. That is, each of the multiple first fins 320 may be hooked onto the adjacent first fin 320 by a claw portion 321b formed on the upper edge portion 322 and at least a portion of the lower edge portion 323.

[0060] 10B , each of the multiple second fins 330 may have a claw portion 331b protruding rearward at the lower edge portion 331. The claw portion 331b may be formed by bending rearward from the flat plate portion 332 of the second fin. Furthermore, at the lower edge portion 331, a gap d7 may be provided between the second recess 331a and the claw portion 331b.

[0061] 10A , each of the multiple second fins 330 may have an upper edge 333 that is bent relative to the flat plate portion 322. The entire upper edge 333 may be bent relative to the flat plate portion 322. At least a portion of the upper edge 333 may hook onto an adjacent second fin 330. That is, each of the multiple second fins 330 may hook onto an adjacent second fin 330 by at least a portion of the upper edge 333 and a claw portion 331 b formed on the lower edge 331.

[0062] The gap d6 provided at the upper edge 322 of the first fin 320 and the gap d7 provided at the lower edge 331 of the second fin 330 may be formed at the same position in the left-right direction (the X-axis direction in FIG. 10A ). In this manner, an air flow path can be formed between the plurality of first fins 320 and the plurality of second fins 330. This allows air to flow from the space between two adjacent first fins 320 through the gaps d6 and d7 toward the space between two adjacent second fins 330, or vice versa. As a result, the air exhaust efficiency of the first heat sink 32 can be increased.

[0063] As shown in FIG. 10C , two heat pipes 31e may be arranged on the lower edge portions 323 of the multiple first fins 320. As shown in FIG. 10A , two recesses 323a may be formed on the lower edge portions 323 of the first fins 320, into which the two heat pipes 31e fit. The heat pipes 31e may be fixed to the recesses 323a by a fixing means such as solder. The two recesses 323a may also be formed by bending the flat portion 322 backward. Furthermore, as shown in FIG. 10C , at least one of the two recesses 323a may have a gap d8 between it and the heat pipe 31e in the width direction (X-axis direction) of the heat pipe 31e. This gap d8 forms a flow path for air flowing along the lower edge portions 323 of the multiple second fins 330.

[0064] [3. Second Cooling Device] Next, the second cooling device 40 will be described in detail. As shown in FIGS. 2A and 3A , the second cooling device 40 may include a plurality of heat pipes 41, a first heat sink 42, and a second heat sink 43. The first heat sink 42 and the second heat sink 43 may have a plurality of fins. As shown in FIG. 3A , each of the plurality of heat pipes 41 may be connected to both the first heat sink 42 and the second heat sink 43. In the example shown in FIG. 3A , the number of heat pipes 41 included in the second cooling device 40 is two. However, the number of heat pipes 41 included in the second cooling device 40 may be one, or three or more.

[0065] As shown in Figures 2A and 3A, the multiple heat pipes 41 (e.g., two heat pipes 41) included in the second cooling device 40 may be entirely arranged on the opposite side of the circuit board 110, sandwiching the lower shield 130 therebetween.

[0066] 11 is a partially enlarged view of the lower shield 130 of FIG. 3B . As shown in FIG. 11 , one or more of the heat pipes 41 may have first portions 41a that overlap with the electronic components 113d (see FIG. 4B ) in a plan view of the second cooling device 40 (electronic device 10). The heat pipes 41 may transfer heat generated by the electronic components 113d to the heat sinks 42 and 43. The heat can then be dissipated in the heat sinks 42 and 43, thereby removing heat from the electronic components 113d. In other words, the electronic components 113d can be cooled using the second cooling device 40.

[0067] FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 11 . As shown in FIG. 12 , the first portion 41a of the heat pipe 41 may be disposed below the electronic component 113d (in the Z2 direction) with the lower shield 130 sandwiched therebetween. Furthermore, a thermal interface material (TIM) such as putty or grease may be filled between the electronic component 113d and the lower shield 130. This allows the electronic component 113d and the lower shield 130 to be thermally connected. Heat generated by the multiple electronic components 113d may be transferred to the heat sinks 42 and 43 via the thermal conductive material, the lower shield 130, and the heat pipe 41.

[0068] Fig. 13 is a cross-sectional view showing a cut surface taken along line XIII-XIII in Fig. 11. As shown in Figs. 12 and 13, the second heat sink 43 may cover the electronic component 113d (electronic component) in a plan view of the circuit board 110. Furthermore, the first portions 41a of one or more of the plurality of heat pipes 41 may be disposed between the second heat sink 43 and the lower shield 130 in the up-down direction (Z-axis direction). Furthermore, the first portions 41a may be in contact with both the second heat sink 43 and the lower shield 130.

[0069] In this way, heat generated by the plurality of electronic components 113d can be transferred via the first portion 41a to the second heat sink 43. The plurality of heat pipes 41 may be fixed to the second heat sink 43 by a fixing means such as solder at a portion including the first portion 41a.

[0070] 13 , a recess recessed downward (in the Z2 direction) may be formed in the upper edge 43U of the second heat sink 43. Multiple heat pipes 41 may fit into this recess. Gaps d9 and d10 may be provided between the upper edge 43U of the second heat sink 43 and the lower shield 130. This allows the first portion 41a of the heat pipe 41 to be reliably in contact with the second heat sink 43 and the lower shield 130.

[0071] The heat pipes 41 may be fixed to the lower shield 130 by a fixing means such as solder at a portion including the first portion 41 a. Alternatively, a cover member 80 (see FIG. 22A ), which will be described later and which covers the lower side of the box-shaped case member 70 that opens downward, may bias the second heat sink 43 upward, thereby pressing the heat pipes 41 against the lower surface (outer surface) of the lower shield 130.

[0072] As shown in FIG. 11 , the upper shield 120 and the lower shield 130 may be fastened by a plurality of fastening members 190. The plurality of fastening members 190 may contact the ground patterns 114, 116 of the circuit board 110 shown in FIGS. 4A and 4B and may surround a plurality of electronic components mounted on the circuit board 110 (e.g., the IC chip 111 and electronic components 113a, 113b shown in FIG. 4A ). The distance between two adjacent fastening members 190 may be within a predetermined range (e.g., within 4 cm, more preferably within 3 cm). This configuration can prevent noise, such as electromagnetic waves, generated by the electronic components mounted on the circuit board 110 from leaking from the upper shield 120 and the lower shield 130.

[0073] Figure 14 is a cross-sectional view showing a cut surface taken along line XIV-XIV in Figure 11. As shown in Figures 11 and 14, one or more of the multiple heat pipes 41 may have second portions 41b that overlap with the fastening members 190 in a plan view of the circuit board 110. As shown in Figure 14, the second portions 41b may be disposed below (in the Z2 direction) the multiple fastening members 190 (two in Figure 14). A gap d11 may be provided between the second portions 41b and the fastening members 190 in the up-down direction (the Z-axis direction).

[0074] 2A and 3A , the plurality of heat pipes 41 included in the second cooling device 40 may be entirely disposed on the opposite side of the circuit board 110 across the lower shield 130. This allows for an assembly procedure in which the second cooling device 40 is disposed below the lower shield 130 after the lower shield 130, the upper shield 120, and the circuit board 110 are attached to one another using a plurality of fastening members 190. This allows for the position of the fastening members 190 to be unrestricted by the second cooling device 40, improving the degree of freedom in the position of the fastening members 190. For example, as shown in FIG. 14 , the second portion 41 b of the heat pipe 41 may be disposed below (in the Z2 direction) the fastening members 190 that fasten the lower shield 130.

[0075] 11 , the second portion 41b of the heat pipe 41 may overlap two or more adjacent fastening members 190 among the multiple fastening members 190 surrounding the multiple electronic components in a plan view of the circuit board 110. The second portion 41b may extend along a line connecting the two adjacent fastening members 190.

[0076] 11 , the first heat sink 42 to which the plurality of heat pipes 41 are connected may be disposed closer to the cooling fan 50 than the second heat sink 43. This allows the speed of the air flowing over the fins of the first heat sink 42 to be faster than the speed of the air flowing over the fins of the first heat sink 42.

[0077] 11 , the first heat sink 42 may be larger than the second heat sink 43 in a plan view of the electronic device 10. Furthermore, the distance d1 between adjacent fins in the first heat sink 42 may be smaller than the distance d2 between adjacent fins in the second heat sink 43. The number of fins constituting the first heat sink 42 may be larger than the number of fins constituting the second heat sink 43. In this way, the first heat sink 42 located near the cooling fan 50 can efficiently dissipate heat. In other words, the cooling performance of the second cooling device 40 can be improved.

[0078] 4. Circuit Board Shield The upper shield 120 and the lower shield 130 will be described in detail below. As shown in FIG. 4A , the upper shield 120 may cover the upper surface 110D of the circuit board 110. A first outer periphery 120e of the upper shield 120 may be fixed to the upper surface 110U of the circuit board 110. The lower shield 130 may cover the lower surface 110D of the circuit board 110. A outer periphery 130e of the lower shield 130 may be fixed to the lower surface 110D of the circuit board 110.

[0079] [4-1. Upper Shield] Fig. 15 is a perspective view showing a portion of the upper shield 120 shown in Fig. 4A. Fig. 16 is a plan view showing a portion of the upper shield 120. Fig. 17 is a cross-sectional view showing a cut surface taken along line XVII-XVII in Fig. 16. Fig. 18 is a cross-sectional view showing a cut surface taken along line XVIII-XVIII in Fig. 16.

[0080] As shown in Figures 15 and 16, a plurality of first extended recesses 122 may be formed on the upper surface 120U (outer surface) of the upper shield 120. Each of the plurality of first extended recesses 122 may be recessed toward the circuit board 110 (see Figure 4A) and extend in the left-right direction. The plurality of first extended recesses 122 may be aligned in the front-rear direction. Furthermore, a plurality of first extended protrusions 123 may be formed on the upper surface 120U of the upper shield 120. Each first extended protrusion 123 may be formed between two adjacent first extended recesses 122. The first extended recesses 122 and the first extended protrusions 123 may be aligned alternately in the front-rear direction.

[0081] By forming a plurality of first extended recesses 122 in the upper shield 120, it is possible to make it difficult for the first end 122a, which is one end of each of the first extended recesses 122, to bend relative to the second end 122b, which is the other end, as shown in Fig. 16. This makes it possible to suppress deflection of the circuit board 110 fixed to the first outer peripheral portion 120e of the upper shield 120. In other words, it is possible to suppress bending of the circuit board 110 when the electronic device 10 receives an external impact.

[0082] As shown in FIG. 17 , the width w1 of each of the multiple first extended recesses 122 in the front-rear direction may be substantially the same. "Substantially the same" means that the respective values ​​are the same or approximately the same (e.g., the difference between the respective values ​​is within the tolerance range). Furthermore, the width w2 of each of the multiple first extended protrusions 123 in the front-rear direction may also be substantially the same. The first extended recesses 122 and the first extended protrusions 123 may be alternately arranged without any gaps between them. As a result, the spacing d11 between adjacent first extended recesses 122 may be substantially the same. That is, the multiple first extended recesses 122 may be formed at substantially the same intervals (equidistant spacing). The multiple first extended protrusions 123 may also be formed at substantially the same intervals.

[0083] As shown in FIG. 4A , the upper shield 120 may have an opening 121 that exposes the IC chip 111. In the upper shield 120, a plurality of first extended recesses 122 may be formed around the opening 121. As shown in FIG. 4A , the circuit board 110 may have an outer edge 110e along the front-rear direction (Y-axis direction). As shown in FIG. 16 , the plurality of first extended recesses 122 may be formed between a straight line L1 that intersects with the opening 121 and extends along the front-rear direction and the outer edge 110e of the circuit board 110 (the edge shown by the dotted line in FIG. 16 ). At least one of the plurality of first extended recesses 122 (four in FIG. 16 ) may be formed between an edge 124 of the opening 121 and the outer edge 110e of the circuit board 110. This configuration can prevent the circuit board 110 from bending around the opening 121 in the upper shield 120. This makes it possible to prevent the periphery of IC chip 111 (see FIG. 4A) on circuit board 110 from curving.

[0084] 18 also shows the circuit board 110 and electronic components mounted on the circuit board 110. As shown in Fig. 16 and Fig. 18 , a first convex portion 125 that bulges in the direction away from the circuit board 110 may be formed on the upper surface 120U (outer surface) of the upper shield 120. The first convex portion 125 may be formed to avoid interference with multiple electronic components 113b (see Fig. 18 ) mounted on the circuit board 110.

[0085] 16 and 18 , the first end 122 a of each of the multiple first extended recesses 122 may be connected to a first protrusion 125. The number of first protrusions 125 formed on the upper shield 120 may be one or more. When multiple first protrusions 125 are formed on the upper shield 120, the first end 122 a of each first extended recess 122 may be connected to any one of the multiple first protrusions 125.

[0086] Alternatively, the first end 122 a of each of the plurality of first extended recesses 122 may reach the outer edge 110 e (see FIGS. 4A and 16 ) of the circuit board 110. This also makes it possible to suppress deflection of the upper shield 120 and the circuit board 110 fixed to the first outer peripheral portion 120 e of the upper shield 120.

[0087] 16 and 18 , one or more second protrusions 126 that bulge in the direction away from the circuit board 110 may be formed on the upper surface 120U (outer surface) of the upper shield 120. The second protrusions 126 may include an edge portion 124 that surrounds the opening 121 and bulges in the direction away from the circuit board 110. Furthermore, as shown in FIG. 16 , the second protrusions 126 may include a protrusion 127 that contacts the edge portion 124 and is formed around the edge portion 124.

[0088] 16 , the second end 122b of each of the plurality of first extended recesses 122 may be connected to the second protrusion 126. The second end 122b of at least one of the plurality of first extended recesses 122 may reach the edge 124 of the opening 121. In the example shown in FIG. 16 , the second end 122b of some of the plurality of first extended recesses 122 are connected to the edge 124 of the opening 121, and the second end 122b of other some of the first extended recesses 122 are connected to the protrusion 127. However, this is not limiting, and all of the second end 122b of the plurality of first extended recesses 122 may contact the edge 124 of the opening 121.

[0089] [4-2. Lower Shield] FIG. 19 is an enlarged perspective view of the lower shield 130 of FIG. 3A. FIG. 20 is an enlarged bottom view of the lower shield 130 of FIG. 11. FIG. 21 is a cross-sectional view showing a cut surface taken along line XXI-XXI in FIG. 19. As shown in FIGS. 19 and 20, a plurality of second extended recesses 132 may be formed on the lower surface 130D (outer surface) of the lower shield 130. Each of the plurality of second extended recesses 132 may be recessed toward the circuit board 110 (see FIG. 4A) and extend in the left-right direction. The plurality of second extended recesses 132 may be aligned in the front-rear direction. Furthermore, a plurality of second extended protrusions 133 may be formed on the lower surface 120U of the lower shield 130. Each second extended protrusion 133 may be formed between two adjacent second extended recesses 132. The second extending recesses 132 and the second extending protrusions 133 may be arranged alternately in the front-rear direction.

[0090] By forming a plurality of second extended recesses 132 in the lower shield 130, it is possible to make one end of each second extended recess 132, that is, a second end 132a, less likely to bend relative to the other end, that is, a second end 132b, as shown in Fig. 20. This makes it possible to suppress deflection of the circuit board 110 fixed to the outer circumferential portion 130e of the lower shield 130. This also makes it possible to suppress bending of the circuit board 110 when the electronic device 10 receives an external impact.

[0091] As shown in FIG. 21 , the width w3 of each of the multiple second extended recesses 132 in the front-rear direction (Y-axis direction) may also be substantially the same. Furthermore, the width w4 of each of the multiple second extended protrusions 133 in the front-rear direction may also be substantially the same. The second extended recesses 132 and the second extended protrusions 133 may be arranged alternately without any gaps between them. As a result, the distances d12 between adjacent first extended recesses 132 may be substantially the same. That is, the multiple second extended recesses 132 may be formed at substantially the same intervals (equidistant intervals). The multiple second extended protrusions 133 may also be formed at substantially the same intervals.

[0092] As shown in FIGS. 19 and 20 , a first protrusion 135 bulging in the direction away from the circuit board 110 may also be formed on the lower surface 120U (outer surface) of the lower shield 130. The first protrusion 135 may be formed at the position of multiple electronic components 113d (see FIG. 4B ) mounted on the circuit board 110. As shown in FIG. 20 , the first end 132a of each of the multiple second extended recesses 132 may be connected to the first protrusion 135. The number of first protrusions 135 formed on the lower shield 130 may also be one or more. When multiple first protrusions 135 are formed on the lower shield 130, the first end 132a of each second extended recess 132 may be connected to one of the multiple first protrusions 135. Furthermore, the first end 132a of each of the multiple second extended recesses 132 may reach the outer edge 110e (see FIG. 4A ) of the circuit board 110. This also makes it possible to suppress bending of the lower shield 130 and the circuit board 110 fixed to the outer periphery 130 e of the lower shield 130 .

[0093] As shown in Figures 19 and 20, a second convex portion 136 bulging in the opposite direction from the circuit board 110 may be formed on the lower surface 130U (outer surface) of the lower shield 130. The portion of the upper surface (inner surface) of the lower shield 130 where the second convex portion 136 is formed may be a recess into which the spring bearing member 150 shown in Figure 4A fits. Furthermore, a convex portion 137 bulging in the opposite direction from the circuit board 110 and extending in an oblique direction inclined relative to the front-rear and left-right directions may be formed on the lower surface 130U (outer surface) of the lower shield 130. The portion of the upper surface (inner surface) of the lower shield 130 where the convex portion 137 is formed may be a recess into which the leaf spring 140 shown in Figure 4A fits. The second convex portion 136 may contact the center of the convex portion 137.

[0094] 19 , the second end 132 b of each of the multiple second extended recesses 132 may be connected to a second protrusion 136. The number of second protrusions 136 formed on the lower shield 130 may be one or more. For example, the second end 122 b of each of the multiple second extended recesses 132 may be in contact with one of the multiple second protrusions 136.

[0095] In a plan view of the electronic device 10, at least a portion of the plurality of first extended recesses 122 shown in Fig. 16 may overlap with at least a portion of the plurality of second extended recesses 132 shown in Fig. 20. By providing portions where the plurality of first extended recesses 122 and the plurality of second extended recesses 132 overlap in a plan view of the electronic device 10, it is possible to more effectively suppress bending of the circuit board 110, which is fixed to both the upper shield 120 and the lower shield 130.

[0096] As shown in FIG. 4B , multiple chips 115 may be mounted on the lower surface 110D of the circuit board 110. The convex portions 127 (inner convex portions) formed on the upper shield 120 shown in FIGS. 15 and 16 may protrude at the positions of the chips 115. Terminals such as pins extending from the chips 115 and fixing means such as solder for fixing these terminals may be exposed on the upper surface 110U of the circuit board 110. By forming the convex portions 127 on the upper shield 120 at the positions of the chips 115, the lower surface (inner surface) of the upper shield 120 is recessed in the direction away from the circuit board 110 at these positions, thereby reliably avoiding contact between the upper shield 120 and the terminals of the chips 115 (or fixing means such as solder).

[0097] 15 and 16 , a reinforcing recess 128 may be formed on the top surface of the upper shield 120, surrounding a protrusion 127 (inner protrusion). Furthermore, a protrusion 129 (outer protrusion) may be formed around the reinforcing recess 128. In this way, by forming the reinforcing recess 128 between the two protrusions 127, 129, the upper shield 120 can be made less likely to bend in a direction intersecting with the reinforcing recess 128. This makes it possible to suppress deflection of the circuit board 110, which is fixed to the first outer peripheral portion 120e of the upper shield 120.

[0098] As shown in FIGS. 19 and 20 , the lower surface 130D (outer surface) of the lower shield 130 may have a recess 138a (inner recess) recessed at the position of the chip 115 (see FIG. 4B ), and a reinforcing protrusion 138b surrounding the recess 138a. A recess 138c (outer recess) may be formed around the reinforcing protrusion 138b. The portion of the upper surface (inner surface) of the lower shield 130 where the recess 138a is formed may be a protrusion that contacts the lower surface of the chip 115. Contact between the upper surface (inner surface) of the lower shield 130 and the lower surface of the chip 115 contributes to cooling the chip 115. Furthermore, forming the reinforcing protrusion 138b between the two recesses 138a and 138c can suppress deflection of the lower shield 130 in a direction intersecting with the reinforcing protrusion 138b. This suppresses deflection of the circuit board 110 fixed to the outer peripheral portion 130e of the lower shield 130.

[0099] 3A and 3B , a battery board 90, which is a circuit board on which a battery 91 is attached, may be housed in the case member 70 of the device body 11. The battery cover that covers the battery 91 in the device body 11 will be described in detail below.

[0100] FIG. 22A is an exploded perspective view showing a cover member 80 (frame) covering the opening of the box-shaped case member 70 and a battery cover member 210 (a mounting member attached to the frame). The device body 11 may have the cover member 80 and the battery cover member 210 shown in FIG. 22A . As shown in FIG. 22A , the cover member 80 may have a battery opening 81, which is a hole that exposes the battery 91. The battery opening 81 may expose the entire battery 91 mounted on the battery board 90 (see FIG. 3A ). This allows the battery 91 to be attached to and removed from the battery board 90 by passing the battery 91 through the battery opening 81 without removing the cover member 80 from the case member 70. The battery opening 81 may also be a notch formed on the edge of the cover member 80.

[0101] FIG. 22B is an enlarged view of the battery cover member 210 and the battery opening 81. As shown in FIG. 22B , the cover member 80 may have a recess 82 on its underside (the surface facing the Z2 direction). A battery opening 81, which is a hole exposing the battery 91, may be formed inside the recess 82 (more specifically, on the bottom surface of the recess 82). The battery cover member 210 may have an edge shaped to correspond to the edge of the recess 82. The battery cover member 210 may be attached to the recess 82 of the cover member 80 with screws 220 to cover the battery 91 exposed in the recess 82. The battery cover member 210 may be formed by sheet metal processing a metal plate. The cover member 80 may have a flat plate portion 211. A recess 212a corresponding to the shape of the hole 81 of the cover member 80 may be formed on the underside of the flat plate portion 221. The back surface of the recess 212 a may be a protrusion 212 b (see FIG. 24 ) that fits onto the edge of the hole 81 .

[0102] Figure 23 is a plan view showing the battery cover member 210. Figure 24 is a cross-sectional view showing a cut surface taken along line XXIV-XXIV in Figure 23. Figure 24 also shows the battery cover member 210 and the screw 220 inserted into the screw hole 93. Figure 25A is an enlarged view of the screw 220 and insertion hole 213 shown in the cross-sectional view of Figure 24. Figure 25B is a cross-sectional view showing the state of the battery cover member 210 before the screw 220 is attached to the battery cover member 210. Figure 25C is a cross-sectional view showing the state of the battery cover member 210 after the screw 220 has been removed from the screw hole 93.

[0103] As shown in Fig. 24, the screw 220 may have a head 221, a tip portion 222 which is the end opposite to the head 221, and an intermediate portion 223 which extends in a rod shape between the head 221 and the tip portion 222. The head 23 is located at the end of the screw 220 and may have the largest diameter among the elements of the screw 220. The tip portion 222 of the screw 220 may be thicker in the radial direction than the intermediate portion 223, and this tip portion 222 may be threaded. The intermediate portion 223 of the screw 220 may not be threaded. The screw 220 may be threaded only on the tip portion 222.

[0104] 22B , the underside of cover member 80 may expose screw holes 93 into which tip portions 222 of screws 220 fit. For example, holes that expose screw holes 93 of member 92 (see FIG. 11 ) may be formed in the bottom surface of recess 82 of cover member 80. Battery cover member 210 may be attached to the underside of cover member 80 with screws 220.

[0105] An insertion opening 213 into which the screw 220 is inserted may be formed in the flat plate portion 211 of the battery cover member 210. In the example shown in Fig. 23 , the insertion opening 213 is a hole formed in the flat plate portion 211, but the insertion opening 213 may also be a notch formed in the edge of the flat plate portion 211. The size of the insertion opening 213 in the radial direction of the screw 220 may be larger than the tip portion 222 of the screw 220. Furthermore, as shown in Fig. 24 , an intermediate portion 223 of the screw 220 may be disposed in the insertion opening 213.

[0106] 23 and 25A , the battery cover member 210 may have a protruding portion 214a that connects to a first edge portion 213a that is part of the edge of the insertion opening 213 and that protrudes toward the middle portion 222 of the screw 220. The battery cover member 210 may also have a protruding portion 214b that connects to a second edge portion 213b that is part of the edge of the insertion opening 213 and that protrudes toward the middle portion 223 of the screw 220. As described below, forming the protruding portions 214a, 214b on the battery cover member 210 can prevent the screw 220 from falling off and can simplify the installation of the screw 220.

[0107] As shown in Figure 25B, in battery cover member 210 before screw 220 is attached, protruding portions 214a, 214b may be bent relative to flat plate portion 211. Protruding portion 214a may be bent downward (in the Z2 direction in Figure 25B) from flat plate portion 211 at first edge portion 213a to which protruding portion 214a is connected. Similarly, protruding portion 214b may be bent downward from flat plate portion 211 at second edge portion 213b to which protruding portion 214b is connected.

[0108] By doing so, a distance d21 that is greater than the diameter of the tip 222 of the screw 220 can be ensured between the tip P1 of the overhanging portion 214a and the tip P2 of the overhanging portion 214b. This makes it possible to easily pass the tip 222 of the screw 220 between the two overhanging portions 214a and 214b.

[0109] As shown in Fig. 25B , a distance d21 between a tip P1 of the overhanging portion 214a and a tip P2 of the overhanging portion 214b may be smaller than the diameter of the head 221 of the screw 220. By attaching the tip 222 of the screw 220 to the screw hole 93 (Fig. 22B) and passing the middle portion 223 of the screw 220 between the tip P1 of the overhanging portion 214a and the tip P2 of the overhanging portion 214b, the head 221 of the screw 220 may push the tip P1 of the overhanging portion 214a and the tip P2 of the overhanging portion 214b upward (in the Z1 direction in Fig. 24 ) as shown in Fig. 25A . As a result, the two overhanging portions 214a and 214b may be plastically deformed so as to extend along the flat plate portion 211.

[0110] The distance d22 between the tip P1 of the protruding portion 214a and the tip P2 of the protruding portion 214b after plastic deformation is smaller than the distance d21 before plastic deformation and may be smaller than the diameter of the tip 222 of the screw 220. By doing so, as shown in FIG. 25C , the tip 222 of the screw 220 removed from the screw hole 93 catches on the edges of the two protruding portions 214a, 214b. This prevents the screw 220 from falling off the battery cover member 210. The distance d22 between the two protruding portions 214a, 214b after plastic deformation may be larger than the diameter of the middle portion 223 of the screw 220.

[0111] The number of protruding portions formed on the edge of the insertion opening 213 is not limited to two, and may be three or more, or may be one. When the number of protruding portions is one, the distance between the tip of the protruding portion (e.g., protruding portion 214a) after plastic deformation and the edge (e.g., edge 213b) opposite the edge to which this protruding portion is connected may be smaller than the diameter of the tip 222 of the screw 220. When the tip 222 of the screw 220 is removed from the screw hole 93, the tip 222 of the screw 220 may be caught on the edge of the protruding portion and the edge of the insertion opening 213. This also prevents the screw 220 from falling off the battery cover member 210.

[0112] As shown in FIG. 23 , a notch 215a recessed toward the first edge 213a may be formed at the tip of the overhanging portion 214a. A notch 215b recessed toward the second edge 213b may be formed at the tip of the overhanging portion 214b. The tip P1 shown in FIG. 25A may be defined by the edge of the notch 215a. The tip P2 shown in the same figure may be defined by the edge of the notch 215b. As shown by the tip portions P1 and P2 in FIG. 25A , the edge of the notch 215a and the edge of the notch 215b may contact the middle portion 223 of the screw 220.

[0113] By forming notches 215a and 215b in protruding portions 214a and 214b in this manner, it is possible to ensure an area where tip end 222 of screw 220 comes into contact with protruding portions 214a and 214b in the state shown in Fig. 25C. This makes it possible to more reliably prevent screw 220 from falling off battery cover member 210.

[0114] 25A , the battery cover member 210 may have a folded portion 216 folded upward (in the Z1 direction in FIG. 24 ) at an end of the flat portion 211, and a second flat portion 217 extending from the end of the folded portion 216 and disposed above the flat portion 211 (in the Z1 direction). The second flat portion 217 may extend along the flat portion 211. The second flat portion 217 may also have a second insertion opening 218 formed therein, which is a hole or notch into which the middle portion 222 of the screw 220 is inserted. In a plan view of the electronic device 10, the second insertion opening 218 may overlap the insertion opening 213.

[0115] Furthermore, the size of second insertion opening 218 in a plan view of electronic device 10 may be smaller than insertion opening 213 and larger than the diameter of tip portion 222 of screw 220. In this way, battery cover member 210 can be reinforced by second flat plate portion 217 without interfering with the attachment of screw 220. Furthermore, protruding portions 214a, 214b pressed by head 221 of screw 220 come into contact with the edge of second insertion opening 218. This prevents protruding portions 214a, 214b from being excessively deformed, and allows distance d22 between protruding portions 214a, 214b after plastic deformation to be kept within a range smaller than the diameter of tip portion 222 of screw 220.

[0116] As shown in Figures 3B, 11, and 4A, the device main body 11 may have a circuit board 110 on which electronic components are mounted, a lower shield 130 covering the circuit board 110, and a battery board 90 (see Figures 3B and 11) which is a circuit board on which a battery 91 is attached. As shown in Figure 22B, a cover member 80 covering the battery board 90 may be formed with a battery opening 81 which is a hole or cutout that exposes the battery 91. Also, as shown in Figures 3B and 11, the battery board 90 may be disposed below the lower shield 130. The battery board 90 may be located on the opposite side of the circuit board 110 with the lower shield 130 in between.

[0117] 3A , a protrusion 95a that protrudes downward (in the Z2 direction) may be formed on the lower shield 130, and a hole 95b that fits into this protrusion 95a may be formed on the battery substrate 90. This makes it easy to arrange the circuit board 110 on the lower shield 130. Note that the relationship between the protrusion 95a and the hole 95b may be reversed. For example, a hole or a recess may be formed on the lower shield 130, and a protrusion that fits into this hole or recess may be formed on the battery substrate 90.

[0118] As shown in Fig. 4A, the device body 11 may have an upper shield 120 covering the circuit board 110. Also, as shown in Fig. 2A, the device body 11 may have a power supply unit 60 that supplies power to the circuit board 110. The circuit board 110 may be located between the lower shield 130 and the upper shield 120. The battery board 90 may be located on the opposite side of the power supply unit 60 across the lower shield 130, the circuit board 110, and the upper shield 120.

[0119] 11 , the device main body 11 may have a cable 96 connecting the circuit board 110 and the battery board 90. The lower shield 130 may expose a portion of the lower surface 110D of the circuit board 110 (more specifically, the outer edge of the area surrounded by the ground pattern 116). An end 96a of the cable 96 may be connected to the portion of the lower surface 110D of the circuit board 110 that is exposed from the lower shield 130. By arranging the battery board 90 and the cable 96 in this manner, it is possible to prevent noise, such as electromagnetic waves, generated in the power supply device 60 from being transmitted to the circuit board 110 via the battery board 90 and the cable 96.

[0120] [6. Summary] (A1) The electronic device proposed in this disclosure may include an IC chip, a first heat sink, and a plurality of heat pipes. The IC chip may have a surface facing a first direction, a first side surface facing a second direction intersecting the first direction, and a second side surface facing a third direction intersecting the first and second directions. At least one of the plurality of heat pipes may have a portion connecting to the first heat sink. The plurality of heat pipes may be aligned along the surface and have a connecting portion where adjacent heat pipes are connected to each other. The first heat sink may be positioned in an oblique direction with respect to the IC chip, inclined with respect to the second and third directions. The connecting portion may be disposed in the first direction with respect to the surface, and extend in an oblique direction with respect to the second and third directions.

[0121] According to the structure of A1, the end of the connecting portion of the heat pipe can be brought closer to the first heat sink. This shortens the length from the connecting portion of the heat pipe to the part connected to the first heat sink, and the heat of the IC chip received by the heat-receiving member can be quickly transferred to the first heat sink. This improves the cooling performance of the heat pipe.

[0122] (A2) The electronic device of A1 may further include a second heat sink. Each of the plurality of heat pipes may have a portion connected to at least one of the first heat sink and the second heat sink. The first heat sink may have a larger amount of heat rejection than the second heat sink. The plurality of heat pipes may further include a first connection portion connected to the connection portion in the third direction and a second connection portion connected to the connection portion in a direction opposite to the third direction. In the second direction, the distance from the center of the first connection portion to the first heat sink may be shorter than the distance from the center of the second connection portion to the second heat sink.

[0123] (A3) The electronic device proposed in this disclosure may include an IC chip, a first heat sink, a second heat sink, and a plurality of heat pipes. The IC chip may have a surface facing a first direction, a first side surface facing a second direction intersecting the first direction, and a second side surface facing a third direction intersecting the first and second directions. Each of the plurality of heat pipes may have a portion connected to at least one of the first heat sink and the second heat sink. The first heat sink may have a larger amount of heat rejection than the second heat sink. The first heat sink and the second heat sink may be positioned in the second direction relative to the IC chip. The first heat sink may be positioned in the third direction relative to the second heat sink. The plurality of heat pipes may be arranged along the surface and may have a connecting portion where adjacent heat pipes are connected to each other, a first connecting portion connected to the connecting portion in the third direction, and a second connecting portion connected to the connecting portion in a direction opposite to the third direction. In the first direction, a distance from a center of the first connecting portion to the first heat sink may be smaller than a distance from a center of the second connecting portion to the second heat sink.

[0124] According to the structure of A2 or A3, the length from the connector of the heat pipe to the connection between the heat pipe and the first heat sink can be made shorter than the length from the connector to the connection between the heat pipe and the second heat sink. This allows the heat from the IC chip received by the heat-receiving member to be transferred to the first heat sink, which has a larger heat output, more quickly than to the second heat sink, which has a smaller heat output. As a result, the cooling performance of the heat pipe can be improved.

[0125] (A4) The electronic device of A2 or A3 may further include a housing that houses the first heat sink, the second heat sink, and the plurality of heat pipes and has an opening formed therein, wherein a distance from the opening to the first heat sink may be smaller than a distance from the opening to the second heat sink.

[0126] (A5) In the electronic device of any of A2 to A4 above, at least one of the plurality of heat pipes may have a first extension portion extending from the first connection portion to the first heat sink, and at least one of the plurality of heat pipes may have a second extension portion extending from the second connection portion to the second heat sink.

[0127] (A6) In any of the electronic devices A2 to A5 above, at least one of the plurality of heat pipes may have a third extension portion extending from the first connection portion to the second heat sink.

[0128] (A7) In any of the electronic devices of A2 to A6 above, each of the plurality of heat pipes may be connected to the first heat sink or the second heat sink, and the number of heat pipes connected to the first heat sink may be greater than the number of heat pipes connected to the second heat sink.

[0129] (B1) The electronic device proposed in this disclosure may include a heat sink and a heat pipe having an extension extending along a first direction. The heat sink may include a plurality of first fins connected to the extension in a second direction intersecting the first direction, and a plurality of second fins connected to the extension in a third direction opposite the second direction. This allows the extension of the heat pipe to be fixed to the upper ends of the first fins using a fixing means such as solder, and then the lower ends of the second fins to be fixed to the extension using a fixing means. This ensures connectivity between each of the first fins and the second fins constituting the first heat sink and the extension.

[0130] (B2) In the electronic device of B1, each of the plurality of first fins may have an edge portion in which a first recess recessed in the second direction is formed. Each of the plurality of second fins may have an edge portion in which a second recess recessed in the third direction is formed. The extension portion may be disposed between the first recess and the second recess. This allows the first recess and the second recess to surround the extension portion of the heat pipe. This more reliably connects each of the plurality of first fins and the plurality of second fins to the extension portion.

[0131] (B3) In the electronic device of B1 or B2, a gap may be provided between the edge of each of the first fins and the edge of each of the second fins, thereby more reliably connecting each of the first fins and the second fins to the extension.

[0132] (B4) In the electronic device of B2, each of the second fins may have a claw portion at the edge of the second fin that protrudes in the first direction and hooks onto an adjacent second fin. A gap may be provided between the second recess and the claw portion.

[0133] (B5) In the electronic device of B2 or B4, each of the plurality of first fins may have a claw portion at the edge of the first fin that protrudes in the first direction and hooks onto an adjacent first fin. A gap may be provided between the first recess and the claw portion.

[0134] (B6) The heat dissipation device proposed in this disclosure may include a heat sink and a heat pipe having an extension extending along a first direction. The heat sink may include a plurality of first fins connected to the extension in a second direction intersecting the first direction, and a plurality of second fins connected to the extension in a third direction opposite the second direction. This allows the extension of the heat pipe to be fixed to the upper ends of the first fins using a fixing means such as solder, and then the lower ends of the second fins to be fixed to the extension using a fixing means. This ensures connectivity between each of the first fins and second fins constituting the first heat sink and the extension.

[0135] (C1) An electronic device proposed in the present disclosure may include a circuit board on which electronic components are mounted, a circuit board shield covering the circuit board, a fastening member attached to the circuit board shield and the circuit board to secure the circuit board shield to the circuit board, and a heat pipe. The heat pipe may be entirely located on the opposite side of the circuit board from the circuit board shield, and may have a first portion overlapping the electronic components in a plan view of the circuit board, and a second portion overlapping the fastening member in the plan view.

[0136] According to the structure of C1, the entire heat pipe is positioned on the opposite side of the circuit board across the circuit board shield. This allows for the assembly procedure of attaching the circuit board shield and the circuit board to each other with multiple fastening members, and then placing the heat pipe on the circuit board shield. This allows for greater freedom in the positioning of the fastening members, as they are not restricted by the heat pipe.

[0137] (C2) The electronic device of C1 may include a plurality of fastening members surrounding the electronic component in the plan view, and the second portion may overlap two or more of the plurality of fastening members that are adjacent to each other in the plan view.

[0138] (C3) In the electronic device of C1 or C2, a thermally conductive member may be disposed between the electronic component and the circuit board shield, thereby enabling thermal connection between the electronic component and the circuit board shield.

[0139] (C4) Any of the electronic devices of C1 to C3 may have a cooling fan, and a first heat sink and a second heat sink disposed on opposite sides of the circuit board with the circuit board shield interposed therebetween and connected to the heat pipe. The first heat sink may be disposed closer to the cooling fan than the second heat sink. The first heat sink may be larger than the second heat sink in the plan view.

[0140] (C5) Any of the electronic devices of C1 to C4 above may include a cooling fan, and first and second heat sinks arranged on opposite sides of the circuit board with the circuit board shield in between and connected to the heat pipe. The first heat sink may be arranged closer to the cooling fan than the second heat sink. The first and second heat sinks may have a plurality of fins. The spacing between adjacent fins on the first heat sink may be smaller than the spacing between adjacent fins on the second heat sink.

[0141] According to the structure of C4 or C5, the first heat sink located near the cooling fan can efficiently dissipate heat, thereby improving the cooling performance for the electronic components.

[0142] (C6) In any of the electronic devices of C1 to C5 above, the second heat sink may cover the electronic component in the plan view. The first portion may be disposed between the second heat sink and the circuit board shield and may be in contact with both the second heat sink and the circuit board shield. This allows heat generated in the electronic component to be transferred to the second heat sink via the first portion of the heat pipe.

[0143] (D1) The electronic device proposed in this disclosure may include a circuit board and a first circuit board shield covering a first surface of the circuit board and having an outer periphery fixed to the circuit board. A plurality of first extended recesses may be formed in the first circuit board shield. Each of the plurality of first extended recesses may be recessed toward the circuit board and extend in a first direction. The plurality of first extended recesses may be aligned in a second direction intersecting the first direction. This can suppress deflection of the circuit board fixed to the outer periphery of the first circuit board shield. In other words, bending of the circuit board can be suppressed when the electronic device receives an external impact.

[0144] (D2) In the electronic device of D1, an IC chip may be mounted on the first surface of the circuit board. An opening exposing the IC chip may be formed in the first circuit board shield. The plurality of first extended recesses may be formed around the opening.

[0145] (D3) In the electronic device of D1 or D2, an IC chip may be mounted on the first surface of the circuit board. An opening exposing the IC chip may be formed in the first circuit board shield. The circuit board may have an outer edge along the second direction. The plurality of first extended recesses may be formed between the outer edge and a straight line that intersects the opening and extends along the second direction.

[0146] The structure of D2 and / or D3 described above can prevent the circuit board from bending at the opening of the first circuit board shield, thereby preventing the circuit board from bending around the IC chip.

[0147] (D4) In any of the electronic devices D1 to D3, each of the plurality of first extended recesses may have a first end and a second end located opposite each other. One or more first protrusions may be formed on the first circuit board shield. The first end of each of the plurality of first extended recesses may be connected to the one or more first protrusions.

[0148] (D5) In the electronic device of D4, the first circuit board shield may be formed with one or more second protrusions, and the second end of each of the plurality of first extended recesses may be connected to the one or more second protrusions.

[0149] (D6) In the electronic device of D4 or D5, an IC chip may be mounted on the first surface of the circuit board. An opening exposing the IC chip may be formed in the first circuit board shield. The second end of at least one of the plurality of first extended recesses may reach an edge of the opening.

[0150] (D7) In any of the electronic devices D1 to D3, each of the plurality of first extended recesses may have a first end and a second end located opposite each other. The circuit board may have an outer edge along the second direction. The first end of each of the plurality of first extended recesses may reach the outer edge.

[0151] (D8) In any one of the electronic devices D1 to D7, the plurality of first elongated recesses may be formed at substantially equal intervals.

[0152] (D9) In any one of the electronic devices D1 to D8, the first circuit board shield may be formed with a plurality of first extended protrusions, and the first extended recesses and the first extended protrusions may be arranged alternately in the second direction.

[0153] (D10) Any of the electronic devices of D1 to D9 may include a second circuit board shield covering a second surface of the circuit board and having an outer periphery fixed to the circuit board. A plurality of second extended recesses may be formed in the second circuit board shield. Each of the plurality of second extended recesses may be recessed toward the circuit board and extend in a first direction. The plurality of second extended recesses may be aligned in a second direction intersecting the first direction.

[0154] (D11) In the electronic device of D10, at least a portion of the first extended recesses may overlap with at least a portion of the second extended recesses in a plan view, thereby more effectively suppressing deflection of the circuit board fixed to both the first circuit board shield and the second circuit board shield.

[0155] (D12) In any of the electronic devices D1 to D11, an electronic component may be mounted on the first surface of the circuit board. The first circuit board shield may have an inner convex portion protruding at the location of the electronic component, a reinforcing recess portion surrounding the inner convex portion, and an outer convex portion formed around the reinforcing recess portion. This makes it possible to make the first circuit board shield less likely to bend in a direction intersecting with the reinforcing recess portion. This makes it possible to suppress deflection of the circuit board fixed to the first circuit board shield.

[0156] (D13) In any of the electronic devices D1 to D11 above, an electronic component may be formed on the first surface of the circuit board. The first circuit board shield may have an inner recess recessed at the location of the electronic component, a reinforcing protrusion surrounding the inner recess, and an outer recess formed around the reinforcing protrusion. This makes it possible to make the first circuit board shield less likely to bend in a direction intersecting with the reinforcing protrusion. This makes it possible to suppress deflection of the circuit board fixed to the first circuit board shield.

[0157] (E1) The electronic device proposed in this disclosure may include a screw having a tip portion thicker than a middle portion, a frame having a surface on which a screw hole into which the tip portion of the screw fits is exposed, and a mounting member attached to the surface of the frame by the screw. The mounting member may include a flat portion having a hole or notch that is larger in the radial direction of the screw than the tip portion and has an insertion opening through which the screw is inserted, and a protruding portion that connects to a portion of the edge of the insertion opening and protrudes toward the middle portion of the screw. This prevents the screw from falling off and makes it easier to mount the screw.

[0158] (E2) In the electronic device of E1 above, the mounting member may have a first protruding portion that is connected to a first edge portion that is a part of the edge of the insertion port and that protrudes toward the middle portion of the screw, and a second protruding portion that is connected to a second edge portion that is a part of the edge of the insertion port that is different from the first edge portion and that protrudes toward the middle portion of the screw.

[0159] (E3) In the electronic device of E1 or E2, the protruding portion may have a notch. The edge of the notch of the protruding portion may contact the middle portion of the screw. This ensures an area where the tip of the screw comes into contact with the protruding portion. This more reliably prevents the screw from falling off the workpiece.

[0160] (E4) Any of the electronic devices of E1 to E3 may further include a first circuit board on which electronic components are mounted, a first circuit board shield covering the first circuit board, and a second circuit board on which a battery is attached. The frame may cover the second circuit board and may further include a battery opening that is a hole or cutout that exposes the battery. The second circuit board may be located on the opposite side of the first circuit board with the first circuit board shield in between.

[0161] (E5) The electronic device of E4 may further include a second circuit board shield covering the first circuit board and a power supply device supplying power to the first circuit board. The first circuit board may be located between the first circuit board shield and the second circuit board shield. The second circuit board may be located on the opposite side of the power supply device across the first circuit board shield, the first circuit board, and the second circuit board shield. This prevents noise, such as electromagnetic waves, generated in the power supply device from being transmitted to the first circuit board via the second circuit board.

[0162] (E6) The workpiece proposed in this disclosure may be attached to a frame by a screw whose tip is thicker than its middle. The workpiece may have a flat portion having a hole or notch that is larger in the radial direction of the screw than the tip of the screw and that defines an insertion opening for the screw, and a protruding portion that bends from the flat portion at a portion that connects with a part of the edge of the insertion opening and is pressed by the head of the screw to plastically deform so as to extend along the flat portion. This prevents the screw from falling out of the workpiece and simplifies the process of attaching the screw to the workpiece.

[0163] It will be understood that the present invention is not limited to the above embodiments, and that the subject matter encompassed by the present invention is limited only by the scope of the claims.

Claims

1. An electronic device comprising: a circuit board; and a first circuit board shield covering a first surface of the circuit board and having an outer periphery fixed to the circuit board, wherein a plurality of first extended recesses are formed in the first circuit board shield, each of the plurality of first extended recesses being recessed toward the circuit board and extending in a first direction, and the plurality of first extended recesses being aligned in a second direction intersecting the first direction.

2. The electronic device according to claim 1, wherein an IC chip is mounted on the first surface of the circuit board, an opening is formed in the first circuit board shield to expose the IC chip, and the plurality of first extended recesses are formed around the periphery of the opening.

3. The electronic device described in claim 1, wherein an IC chip is mounted on the first surface of the circuit board, an opening that exposes the IC chip is formed in the first circuit board shield, the circuit board has an outer edge that is aligned with the second direction, and the plurality of first extended recesses are formed between the outer edge and a straight line that intersects with the opening and is aligned with the second direction.

4. The electronic device described in claim 1, wherein each of the plurality of first extended recesses has a first end and a second end located opposite each other, one or more first protrusions are formed on the first circuit board shield, and the first end of each of the plurality of first extended recesses is connected to the one or more first protrusions.

5. The electronic device according to claim 4, wherein one or more second protrusions are formed on the first circuit board shield, and the second end of each of the plurality of first extended recesses is connected to the one or more second protrusions.

6. The electronic device according to claim 4, wherein an IC chip is mounted on the first surface of the circuit board, an opening is formed in the first circuit board shield to expose the IC chip, and the second end of at least one of the plurality of first extended recesses reaches the edge of the opening.

7. The electronic device described in claim 1, wherein each of the plurality of first extended recesses has a first end and a second end located opposite each other, the circuit board has an outer edge along the second direction, and the first end of each of the plurality of first extended recesses reaches the outer edge.

8. The electronic device according to claim 1, wherein the plurality of first extended recesses are formed at substantially equal intervals.

9. The electronic device according to claim 1, wherein a plurality of first extending protrusions are formed on the first circuit board shield, and the first extending recesses and the first extending protrusions are arranged alternately in the second direction.

10. The electronic device of claim 1, further comprising a second circuit board shield covering a second surface of the circuit board and having an outer periphery fixed to the circuit board, wherein the second circuit board shield is formed with a plurality of second extending recesses, each of the plurality of second extending recesses being recessed toward the circuit board and extending in a first direction, and the plurality of second extending recesses being aligned in a second direction intersecting the first direction.

11. The electronic device according to claim 10, wherein, in a plan view of the electronic device, at least a portion of the plurality of first extended recesses overlaps with at least a portion of the plurality of second extended recesses.

12. The electronic device described in claim 1, wherein an electronic component is mounted on the first surface of the circuit board, and the first circuit board shield has an inner convex portion protruding at the position of the electronic component, a reinforcing recess surrounding the inner convex portion, and an outer convex portion formed around the reinforcing recess.

13. The electronic device described in claim 1, wherein electronic components are formed on the first surface of the circuit board, and the first circuit board shield has an inner recess that is recessed at the position of the electronic components, a reinforcing protrusion that surrounds the inner recess, and an outer recess that is formed around the reinforcing protrusion.

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