Electrostatic chuck with multi-component ceramic coating applied to baseplate

Abstract

An electrostatic chuck (ESC) baseplate is provided with a shoulder region configured to support an edge ring, and a multi-component ceramic coating is spray coat applied on at least the shoulder region, the coating having a first component and a second component, the first component having a first dielectric constant that is higher than a dielectric constant of aluminum oxide and also having a first thermal conductivity, and the second component having a second thermal conductivity that is higher than the first thermal conductivity, and wherein a dielectric constant for the multi-component ceramic coating is higher than the dielectric constant of aluminum oxide. The multi-component ceramic coating has a value X within a range of 10 / millimeters (mm) to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

Description

ELECTROSTATIC CHUCK WITH MULTI-COMPONENT CERAMICCOATING APPLIED TO BASEPLATEBACKGROUND

[0001] An electrostatic chuck (ESC) can be used in a semiconductor manufacturing processing tool to hold a substrate, such as a silicon wafer, during processing. For example, an ESC can be used to hold a substrate during an etching process or a deposition process.SUMMARY

[0002] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Furthermore, the claimed subject matter is not limited to implementations that solve any or all disadvantages noted in any part of this disclosure.

[0003] Examples are disclosed that relate to an electrostatic chuck (ESC) comprising a multi-component ceramic coating applied to a baseplate of the ESC. In one example, a processing tool comprises an electrostatic chuck (ESC) that includes a baseplate having a shoulder region configured to support an edge ring, and a multicomponent ceramic coating disposed on at least the shoulder region of the baseplate. The multi-component ceramic coating has a first ceramic component and a second ceramic component, where the first ceramic component has a first dielectric constant that is higher than a dielectric constant of aluminum oxide, and also has a first thermal conductivity. The second ceramic component has a second thermal conductivity that is higher than the first thermal conductivity. A dielectric constant for the multi-component ceramic coating is higher than the dielectric constant of aluminum oxide. The multicomponent ceramic coating has a value X within a range of 10 / millimeters (mm) to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

[0004] In some such examples, the first ceramic component comprises one or more of cerium oxide (CeCh), yttria stabilized zirconia ((Y2O3)x(ZrO2)i-x, wherein x is within a range of 0.02 to 0.20 (“YSZ”)), zirconium oxide (ZrCh), yttrium oxide (Y2O3),lanthanum oxide (La2O3), titanium oxide (TiO2), or lanthanum zirconium oxide (La2Zr2O7(“LZO”)).

[0005] Alternatively or additionally, in some such examples, the second ceramic component comprises one or more of aluminum oxide (AI2O3) or aluminum nitride (AIN).

[0006] Alternatively or additionally, in some such examples, the first dielectric constant is equal to or higher than 15.

[0007] Alternatively or additionally, in some such examples, the dielectric constant for the multi-component ceramic coating is equal to or higher than 11.

[0008] Alternatively or additionally, in some such examples, the multicomponent ceramic coating is configured to provide a capacitance between the baseplate and the edge ring of greater than or equal to 0.5 nanofarads (nF) and less than or equal to 9nF at a frequency of 1 kHz.

[0009] Alternatively or additionally, in some such examples, the multicomponent ceramic coating is configured to provide a capacitance between the baseplate and the edge ring of greater than or equal to InF and less than or equal to 7.7nF.

[0010] Alternatively or additionally, in some such examples, the multicomponent ceramic coating comprises a layer having a mixture of the first ceramic component and the second ceramic component.

[0011] Alternatively or additionally, in some such examples, the multicomponent ceramic coating comprises a thickness greater than or equal to 300pm and less than or equal to 1000pm.

[0012] Alternatively or additionally, in some such examples, the multicomponent ceramic coating comprises one or more layers of the first ceramic component and one or more layers of the second ceramic component.

[0013] Alternatively or additionally, in some such examples, a thickness of each layer of the one or more layers of the first ceramic component is greater than or equal to 300pm and less than or equal to 500pm. In some such examples, a thickness of each layer of the one or more layers of the second ceramic component is greater than or equal to 50pm and less than or equal to 300pm.

[0014] Alternatively or additionally, in some such examples, the multicomponent ceramic coating has a breakdown voltage of 10 kilovolts (kV) or greater.

[0015] Alternatively or additionally, in some such examples, the processing tool comprises a dielectric plasma etching tool.

[0016] Another example provides an electrostatic chuck (ESC) having a baseplate with a shoulder region configured to support an edge ring, and a multicomponent ceramic coating on at least the shoulder region of the baseplate. The multicomponent ceramic coating has a first ceramic component and a second ceramic component. The first ceramic component has a first dielectric constant that is higher than a dielectric constant of aluminum oxide, and also has a first thermal conductivity. The second ceramic component has a second thermal conductivity that is higher than the first thermal conductivity. The multi-component ceramic coating has a value X within a range of 10 / millimeters (mm) to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

[0017] In some such examples, the first ceramic component comprises one or more of cerium oxide (CeCh), yttria stabilized zirconia ((Y2O3)x(ZrO2)i-x, wherein x is within a range of 0.02 to 0.20 (“YSZ”)), zirconium dioxide (ZrCh), yttrium oxide (Y2O3), lanthanum oxide (La2Os), titanium dioxide (TiCh), or lanthanum zirconium oxide (La2Zr2O? (“LZO”)). The second ceramic component comprises one or more of aluminum oxide (AI2O3) or aluminum nitride (AIN).

[0018] Alternatively or additionally, in some such examples, the multicomponent ceramic coating comprises a mixture of the first ceramic component and the second ceramic component.

[0019] Alternatively or additionally, in some such examples, the multicomponent ceramic coating comprises one or more layers of the first ceramic component, and one or more layers of the second ceramic component.

[0020] Yet another example provides a method for coating an electrostatic chuck (ESC). The method comprises thermal spray coating at least a shoulder region of a baseplate of the ESC with a first ceramic component and a second ceramic component. The first ceramic component has a first dielectric constant that is higher than a dielectric constant of aluminum oxide, and also has a first thermal conductivity. The second ceramic component has a second thermal conductivity that is higher than the first thermal conductivity. A dielectric constant for the multi-component ceramic coating is higher than the dielectric constant of aluminum oxide. The multi-component ceramic coating has a value X within a range of 10 / millimeters (mm) to 350 / mm,wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

[0021] In some such examples, the first ceramic component comprises one or more of cerium oxide (CeCh), yttria stabilized zirconia ((Y2O3)x(ZrO2)i-x, wherein x is within a range of 0.02 to 0.2 (“YSZ”)), zirconium dioxide (ZrCh), yttrium oxide (Y2O3), lanthanum oxide (La2Ch), titanium dioxide (TiCh), or lanthanum zirconium oxide (La2Zr2O? (“LZO”)). The second ceramic component comprises one or more of aluminum oxide (AI2O3) or aluminum nitride (AIN).

[0022] Alternatively or additionally, in some such examples, the multicomponent ceramic coating comprises a mixture of the first ceramic component and the second ceramic component.

[0023] Alternatively or additionally, in some such examples, the multicomponent ceramic coating comprises one or more layers of the first ceramic component and one or more layer of the second ceramic component.BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Fig. 1 shows a functional block diagram of an example processing tool.

[0025] Fig. 2 shows a functional block diagram of an example electrostatic chuck (ESC), and a magnified view of an example multi-component ceramic coating on a baseplate of the ESC.

[0026] Fig. 3 shows a view of an example multi-component ceramic coating comprising two layers.

[0027] Fig. 4 shows a view of an example multi-component ceramic coating comprising more than two layers.

[0028] Fig. 5 shows a flow diagram depicting an example method of forming a multi-component ceramic coating on a baseplate of an ESC.DETAILED DESCRIPTION

[0029] The terms “approximately” and “substantially” as used herein generally represent a numeric value that is within a range of plus or minus ten percent (10%) of a numeric value stated. For example, a thickness of approximately 500 micrometers (pm) generally represents a thickness of greater than or equal to 450pm and less than or equal to 550pm.

[0030] The term “baseplate” and variants thereof generally represent a component of an electrostatic chuck (ESC) that acts as an electrode for forming a plasma.

[0031] The term “dielectric breakdown voltage” generally represents a potential difference at which an insulator becomes electrically conductive.

[0032] The term “capacitance” generally represents the ability of a material object or device to store electric charge. The capacitance of a capacitor is a function of the relative permittivity (k) of a dielectric material between electrodes of the capacitor, and an inverse function of the distance separating the electrodes.

[0033] The term “coefficient of thermal expansion” (“CTE”) generally represents a fractional change in dimension of a material per degree change in the temperature of the material, at a constant pressure.

[0034] The term “coupling” generally represents capacitive coupling, which is the transfer of energy within an electrical network by the capacitance between circuit nodes.

[0035] The term “dielectric constant” generally represents a ratio of the permittivity of a material to the permittivity of free space, and is a measure of a material’s ability to store electrical energy (relative permittivity k). The k of a multicomponent ceramic coating can be estimated as a weighted sum (e.g. by volume) of the constituent ceramic components of the multi-component ceramic coating. The k can be expressed for a two-component ceramic coating (component A and component B) as kcoating = (kA)(VA) + (kn)(VB), where kA is the relative permittivity of component A, kB is the relative permittivity of component B, VA is the volume fraction of component A, and VB is the volume fraction of component B in the ceramic coating. The volume fraction of a component can be computed, for example, from a mass percentage of the component, a density of the component, and a porosity of the coating.

[0036] The term “dielectric material” generally represents a material that is an electrical insulator and that can be polarized by an electric field.

[0037] The term “dielectric etching” generally represents a process in which portions of a dielectric material are removed from a substrate.

[0038] The term “dielectric etching tool” generally represents a machine including a processing chamber and other hardware configured to enable plasma or other processes for etching a dielectric material on a substrate to be carried out in the processing chamber.

[0039] The term “edge ring” generally represents a component of a processing tool configured to encircle a substrate positioned on an electrostatic chuck.

[0040] The term “electrode” generally represents an electrical conductor used to make contact with a nonmetallic part of a circuit.

[0041] The term “electrostatic chuck” (“ESC”) generally represents a component of a processing tool used for clamping a substrate (for example, a semiconductor wafer) to a substrate support by using electrostatic force.

[0042] The term “etch rate” generally represents an etch distance as a function of time.

[0043] The terms “etch” and variants thereof generally represent removal of material from a substrate.

[0044] The term “high k material” generally represents a material with a higher dielectric constant than a dielectric constant of aluminum oxide.

[0045] The term “multi-component ceramic coating” generally represents a ceramic oxide or silicate material comprising a first ceramic phase and a second ceramic phase. The first ceramic phase and the second ceramic phase can be in a same layer (e.g. as distinct phase domains), or in different layers.

[0046] The term “phase domain” generally represents a region of a layer having a chemically distinct phase from one or more other regions of the layer as defined by stoichiometry.

[0047] The term "processing tool" generally represents a machine including a processing chamber and other hardware configured to enable processes to be carried out in the processing chamber.

[0048] The term “processing chamber” generally represents an enclosure in which processing is performed on substrates. The pressure, temperature, atmospheric composition, and other conditions within a processing chamber are controllable to perform substrate processing.

[0049] The term “radio frequency” (“RF”) generally represents the oscillation rate of electromagnetic radiation within a range of frequencies between 10 kilohertz (kHz) and 1 terahertz (THz).

[0050] The terms “shoulder region” generally represents a region of a baseplate of an ESC that accommodates and / or supports an edge ring.

[0051] The term “thermal spray coating” generally refers to a process for forming a coating in which a solid feedstock is heated and then, using a carrier gas,accelerated in the form of small particles (e.g. micrometer size) toward an object to be coated. Example thermal spray coating methods include HVOF (high velocity oxy-fuel spraying), combustion flame spraying, plasma spraying, vacuum plasma spraying, and electric arc spraying.

[0052] The term “substrate” generally represents any object that can be processed in a processing tool, such as an etching tool or a deposition tool.

[0053] The term “thermal conductivity” generally represents the ability of a material to conduct heat.

[0054] An electrostatic chuck (ESC) can be used in a semiconductor manufacturing processing tool to hold a substrate, such as a silicon wafer, during processing. An ESC includes a dielectric substrate support, and one or more clamping electrodes positioned within the dielectric substrate support to provide electrostatic clamping force to hold the substrate.

[0055] An ESC further can include a baseplate that acts as a radiofrequency (RF) electrode to form a capacitively coupled plasma in a processing chamber. A baseplate can include a shoulder region configured to support an edge ring that surrounds a substrate positioned on the electrostatic chuck. In some examples, a baseplate for a dielectric etching tool can be formed from aluminum or an aluminum alloy. A dielectric coating of aluminum oxide (AI2O3) can be applied to the baseplate, for example, by a thermal spray coating process.

[0056] A suitable thickness of an aluminum oxide coating on a baseplate can be difficult to achieve for some processes. For example, the aluminum oxide coating can reduce a magnitude of RF coupling between the baseplate and the edge ring of an ESC. A relatively thinner aluminum oxide coating can help to improve uniformity of an etch rate when processing the substrate by providing relatively better RF coupling. However, reducing the thickness of the aluminum oxide coating also reduces a dielectric breakdown voltage of the aluminum oxide coating. This increases the possibility of arcing at higher RF powers. The use of a relatively thicker aluminum oxide coating can provide a higher breakdown voltage than the use of a relatively thinner aluminum oxide coating. However, the use of a relatively thicker aluminum oxide coating can reduce RF coupling between the baseplate and the edge ring. This can result in etching nonuniformity in the edge region of a substrate being etched due to a lensing effect arising from the electric field created by structures including the RF electrodes, edge ring, and substrate.

[0057] An aluminum oxide coating also can be prone to cracking under some use conditions due to the difference between the coefficient of thermal expansion (CTE) of the aluminum oxide coating and the CTE of an aluminum or aluminum alloy baseplate material. As one such example, cryoetching involves cooling a substrate using a cryogenic fluid channeled through the baseplate during etching. Heat generated during the cryoetching can cause a sufficient thermal differential between the aluminum oxide coating and the cryogenic channels in the baseplate to lead to damage of the aluminum oxide coating, such as by cracking and / or delamination.

[0058] Accordingly, examples are disclosed that relate to a processing tool having an ESC with a baseplate comprising a multi-component ceramic coating including a high k material formed at least on a shoulder region of the baseplate. The term “high k material” as used herein refers to a material with a dielectric constant higher than that of aluminum oxide. In some examples, a multi-component ceramic coating comprising a high k material can allow a desired magnitude of RF coupling between the baseplate and an edge ring to be achieved using a thicker coating than aluminum oxide. In other examples, a multi-component ceramic coating can allow for a greater degree of RF coupling using a same thickness as an aluminum oxide coating. Where the high k material has a higher dielectric strength than aluminum oxide, the high k material may allow for a same or thinner coating thickness than an aluminum oxide coating for a target breakdown voltage. In any of these cases, the use of a multicomponent ceramic coating as disclosed can allow for a higher dielectric breakdown voltage while achieving a desired magnitude of RF coupling between the baseplate and edge ring. Additionally, some high k materials can have a CTE that is more closely matched to the CTE of an aluminum or aluminum alloy baseplate than the CTE of aluminum oxide.

[0059] Some high k materials can have lower thermal conductivities than aluminum oxide. As such, the disclosed examples include at least a second ceramic component in the multi-component ceramic coating other than the high k material. The second ceramic component has a higher thermal conductivity than the first ceramic component. The composition and thickness of the multi-component ceramic coating on the baseplate shoulder region can be tailored to achieve a desired balance of physical properties. Such properties include dielectric breakdown strength, thermal conductivity, electrical resistivity, CTE, and strength of RF coupling between an edge ring and the baseplate.

[0060] Various high k materials potentially may be used in a ceramic baseplate coating according to the present disclosure. Examples include cerium oxide (CeCh), yttria stabilized zirconia (e.g., (Y2O3)x(ZrO2)i-x, where x is within a range of 0.02-0.20), zirconium oxide (ZrCh), yttrium oxide (Y2O3), lanthanum oxide (La2O3), titanium oxide (TiCh), titanium oxide doped aluminum oxide, lanthanum zirconium oxide (La2Zr2O?, LZO), hafnium oxide (HfCh), lanthanum lutetium oxide (LaLuCh), barium oxide (BaO), tantalum pentoxide (Ta20s), strontium oxide (SrO), calcium oxide (CaO), magnesium oxide (MgO), zirconium silicate (ZrSiCh), hafnium silicate (HfSiCh), molybdenum trioxide (MoOs), tungsten trioxide (WO3), and scandium oxide (SC2O3). In some examples, a multi-component ceramic coating can include two or more of the high k materials, as individual layers and / or as mixed phases within a same layer. When included as mixed phases in a same layer, the first and second ceramic components can have any suitable phase domain sizes. Examples include phase domains with average size within a range of 200 nanometers (nm) to 100 micrometers - (pm). In other examples, phase domains of one or more of the first and second ceramic components can have average phase domain sizes outside of this range. Example ceramic materials with higher thermal conductivities than a selected low K material can include aluminum oxide, aluminum nitride, and aluminum oxynitride.

[0061] As described in more detail below, in some examples, a multicomponent ceramic coating according to the present disclosure can allow for an increased baseplate coating thickness without compromising RF coupling compared to the use of an aluminum oxide coating. The resulting coating thickness can provide for an increased breakdown voltage of the baseplate, depending upon a dielectric strength of the coating material. For example, aluminum oxide (alpha) can have a dielectric strength of 9.8-10 kilovolts / millimeter (kV / mm), whereas yttria stabilized zirconia can have a dielectric strength of 9-19 kV / mm. Thus, yttrium-stabilized zirconia can have a dielectric strength substantially above that of aluminum oxide. This can help to reduce a risk of arcing, while achieving a desired etching uniformity. Example breakdown voltages can include breakdown voltages of lOkV or higher. As another example material, yttrium oxide (Y2O3) has a dielectric strength of 16.5 kV / mm.

[0062] In other examples, a multi-component ceramic coating can be configured to allow for a greater degree of RF coupling using a same thickness as an aluminum oxide coating. Further, where the high k material has a higher dielectricstrength than aluminum oxide, the high k material may allow for a same or thinner coating thickness than an aluminum oxide coating for a target breakdown voltage.

[0063] A multi-component ceramic coating as disclosed can take the form of a single layer of mixed composition, or as two or more layers of different compositions. The composition and thickness of the multi-component ceramic coating can be designed to achieve a desired dielectric constant and a desired breakdown voltage. As examples, some compositions of yttria stabilized zirconia can have a dielectric constant of 29. Yttrium oxide has a dielectric constant of 11.5. Aluminum oxide (alpha) has a dielectric constant of 9.7-9.9. Thus, a multi-component ceramic coating comprising aluminum oxide for thermal conductivity and yttria stabilized zirconia or yttrium oxide as a high k material can provide a coating with a higher dielectric constant than aluminum oxide. This can allow for an increased coating thickness without decreasing RF coupling between the coating. Also, in view of the dielectric breakdown strengths of aluminum oxide and yttria stabilized zirconia, the increased coating thickness also can provide for a higher breakdown voltage. Other example high k materials include zirconium oxide (ZrCh) (k = 10-23) and zirconia toughened alumina (ZTA) (k = 11). In examples that utilize a high k material with a higher dielectric strength than aluminum oxide, a higher breakdown voltage can be achieved using a coating either of equal thickness as an aluminum oxide coating, or thinner than an aluminum oxide coating.

[0064] Furthermore, a multi-component ceramic coating comprising a mixture or layered combination of, for example, aluminum oxide and yttria stabilized zirconia, can provide a closer match between the coefficient of thermal expansion of the coating and the coefficient of thermal expansion of the underlying aluminum or aluminum alloy ESC baseplate material. This can reduce a thermal stress on the coating and improve adhesion of the coating during ESC operation, such as when the baseplate is cooled during cryoetching, compared to the use of an aluminum oxide coating.

[0065] Prior to discussing these examples in more detail, FIG. 1 schematically shows an example processing tool 100 configured to perform dielectric cryogenic etching processes. Processing tool 100 is an example of a tool that can utilize an ESC comprising a baseplate with a multi-component ceramic coating as disclosed. In other examples, an ESC with a multi-component ceramic coating can be used in a noncry ogenic etching tool, or a deposition tool.

[0066] Etching tool comprises a processing chamber 102, and an ESC 104 within the processing chamber. ESC 104 is configured to support a substrate 105. ESC104 comprises a baseplate 106 having a shoulder region 108 and a substrate support region 110. Baseplate 106 is configured as an electrode operable for a radiofrequency plasma generation system. A ceramic substrate support 112 is positioned on the substrate support region 110. The ceramic substrate support 112 includes one or more embedded electrodes (not shown) for electrostatically clamping substrate 106 during processing.

[0067] ESC 104 further comprises a multi-component ceramic coating 114 formed on baseplate 106. Multi-component ceramic coating 114 covers at least shoulder region 108 of baseplate 106. In the depicted example, multi-component ceramic coating 114 covers a substantial portion of a surface of baseplate 106. Multicomponent ceramic coating 114 helps to electrically insulate baseplate 106. This can help prevent arcing during plasma processing. In other examples, multi-component ceramic coating 114 can cover a different area of the surface of baseplate 106 than that shown.

[0068] Shoulder region 108 is configured to support an edge ring 118. Edge ring 118 surrounds an edge of substrate 105. Edge ring 118 is electrically conductive and undergoes radiofrequency coupling with baseplate 106 during plasma operation. Substrate 105 also undergoes radiofrequency coupling with baseplate 106 during plasma operation. Multi-component ceramic coating 114, baseplate 106 and edge ring 118 form a capacitor that can create a somewhat lower voltage at edge ring 118 than at substrate 105 during processing. A thickness and composition of multi-component ceramic coating 114 can be selected to provide a desired capacitance between shoulder region 108 and edge ring 118. Example capacitances include capacitances within a range of 0.5-9 nanofarads (nF) at 1 kilohertz (kHz) (as measured by an LCR meter) in some examples, and l-5nF at 1kHz in more specific examples. In some examples, the multi-ceramic coating can be selected to have a thickness and a dielectric constant to provide a value X within a range of 10 / millimeters (mm) to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating. The thickness and composition of multi-component ceramic coating 114 also can be selected to provide a desired dielectric breakdown voltage. Example breakdown voltages include breakdown voltages of lOkV or higher in some examples. Example multi-component ceramic coatings 114 are described in more detail below.

[0069] The capacitance can be selected to help avoid a lensing effect in the electric field at an edge region of substrate 105 during processing. This can help to achieve a suitably uniform etching rate or deposition rate at an edge region of a substrate compared to other substrate regions. Edge ring 118 can comprise any suitable construction. In some examples, edge ring 118 is formed from silicon carbide.

[0070] Processing tool 100 further comprises a gas inlet 120 and flow control hardware 122. Flow control hardware 122 is connected to an etchant source 124 and an inert gas source 126. Etchant source 124 can comprise any suitable etchant. Examples of etching agents include hydrogen fluoride (HF), nitrogen trifluoride (NF3), perfluoroalkanes, such as carbon tetrafluoride (CF4) and hexafluoroethane (C2F6), and phosphorus halides such as phosphorus trifluoride (PF3) and phosphorus pentafluoride (PFs). Further examples of etching agents include oxygen-based etching agents and hydrogen-based etching agents. Example oxygen-based etching agents include molecular oxygen (O2), carbon dioxide (CO2), and nitrous oxide (N2O). Example hydrogen-based etching agents include molecular hydrogen (H2) and ammonia (NH3). As mentioned above, in other examples, an ESC comprising a baseplate with a multicomponent ceramic coating can be used in a deposition tool, or other suitable processing tool.

[0071] Inert gas source 126 can comprise any suitable inert gas. Examples include helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), and, in some processing environments, nitrogen (N2).

[0072] Flow control hardware 122 can be controlled to flow gas from etchant source 124 and inert gas source 126 into processing chamber 102 via gas inlet 120. Flow control hardware 122 can comprise one or more valves controllable to place a selected gas source in fluid connection with gas inlet 122.

[0073] Processing tool 100 further comprises an exhaust system 128. Exhaust system 128 is configured to receive gas outflowing from processing chamber 102. In some examples, exhaust system 128 is configured to actively remove gas from processing chamber 102 and / or apply a partial vacuum. Exhaust system 128 can comprise any suitable hardware, such as roughing pump, a high vacuum pump, and suitable conduits and valves.

[0074] Processing tool 100 further comprises a radiofrequency power source 130 that is electrically connected to baseplate 106 as a first electrode for forming an RF plasma. Processing tool 100 also comprises a second electrode 132. In the example ofFIG. 1, second electrode 132 takes the form of a showerhead that is also configured to dispense processing chemicals. In other examples, a second electrode can take any other suitable form. Processing tool 100 also includes matching network 134 for impedance matching of the radiofrequency power source 130.

[0075] Processing tool 100 further comprises a chiller 140 configured to circulate a coolant through ESC 104 to cool a substrate for a cryogenic etching process. In some examples, the substrate is cooled to a temperature of 0° C or below. In some examples, the chiller can cool the substrate to a substrate temperature within a range of -60 °C to -10 °C. In other examples, substrate temperatures outside this range can be used.

[0076] Controller 150 is operatively coupled to flow control hardware 122, exhaust system 128, radiofrequency power source 130, and chiller 140. Controller 150 is configured to control various functions of processing tool 100. Examples include operating chiller 140 to cool to a desired temperature, operating flow control hardware 122 to flow selected gases into processing chamber 102, operating exhaust system 128, and / or operating radiofrequency power source 130 to form a plasma.

[0077] FIG. 2 shows a functional block diagram of an example ESC 200. ESC 200 is an example of ESC 104 of FIG. 1. ESC 200 comprises a baseplate 202 with a multi-component ceramic coating 204. Multi-component ceramic coating 204 is located at least in a shoulder region 206 of the baseplate 202. As mentioned above, shoulder region 206 is configured to support an edge ring 208. As shown in the example illustrated in FIG. 2, multi-component ceramic coating 204 further can cover a radially outward peripheral baseplate surface 210. Multi-component ceramic coating 204 further coats other surfaces of the baseplate 202, such as bottom surfaces, and a surface that interfaces with a ceramic substrate support 212 for supporting a substrate 214. As mentioned above, ceramic substrate support 212 comprises embedded electrodes (not show) for electrostatically clamping a substrate. In other examples, a multi-component ceramic coating can have a different coverage area on a baseplate.

[0078] Baseplate 202 can be formed from any suitable material. Suitable materials include materials that can function as an electrode to form a radiofrequency plasma. Suitable materials further include materials that do not pose contamination risks in a processing chamber environment. Aluminum and aluminum alloys are examples of suitable materials for baseplate 202.

[0079] As described above, multi-component ceramic coating 204 includes two or more different ceramic materials that are selected to provide desired dielectric, thermal conductivity, and / or thermal expansion properties. For example, multicomponent ceramic coating 204 includes a high k material as a first ceramic component. The high k material has a dielectric constant higher than aluminum oxide. The high k material can allow a desired magnitude of radiofrequency coupling between baseplate 202 and edge ring 208 to be achieved using a thicker coating than aluminum oxide. This can allow for a higher dielectric breakdown voltage while achieving a desired magnitude of RF coupling between the baseplate and edge ring. Example high k materials that can be incorporated in multi-component ceramic coating 204 include one or more of cerium oxide, yttria stabilized zirconia, zirconium oxide, yttrium oxide, lanthanum oxide, titanium oxide, titanium oxide doped aluminum oxide, lanthanum zirconium oxide, hafnium oxide, lanthanum lutetium oxide, barium oxide, tantalum oxide, strontium oxide, calcium oxide, magnesium oxide, zirconium silicate, hafnium silicate, molybdenum trioxide, tungsten oxide, or scandium oxide. In some examples, two or more high k materials are incorporated into the multi-component ceramic coating. Further, in some examples, the multi-component ceramic coating can include two or more layers with different compositions of ceramic components.

[0080] Multi-component ceramic coating 204 further comprises a material having a higher thermal conductivity than the high k material as a second ceramic component. For example, the second ceramic component can comprise one or more of aluminum oxide, aluminum nitride, or aluminum oxynitride. In some examples, multicomponent ceramic coating 204 can have more than one component with a higher thermal conductivity than the high k material.

[0081] The first ceramic component and the second ceramic component further can be selected to provide for other desired physical properties as well. For example, the first ceramic component and the second ceramic component can be selected to provide a suitably high electrical resistivity to achieve a desired voltage on an edge ring from RF coupling during a plasma process. The first component and the second component of the multi-component ceramic coating further can be selected to be suitably resistant to processing chemistries employed in the processing tool.

[0082] The first ceramic component and the second ceramic component also can be selected to produce a multi-component ceramic coating with a CTE that is closer to the CTE of the baseplate material (e.g. aluminum or an aluminum alloy) than theCTE of aluminum oxide. This can help to prevent cracking and / or delamination of the multi-component ceramic coating when exposed to thermal cycling, such as in a cryoetching tool, compared to an aluminum oxide coating. As one example, yttria stabilized zirconia (YSZ) has a CTE of approximately 10.3-1 lE-6 / Kelvin (K). Aluminum oxide has a coefficient of thermal expansion of 7-8E-6 / K. Aluminum alloy A16061 (as an example baseplate material) has a coefficient of thermal expansion of 23.6E-6 / K. Thus, yttria stabilized zirconia has a CTE closer to that of A16061 than aluminum oxide. As such, a multi-component ceramic coating comprising a mixture of these materials can provide a smaller difference between the coefficient of thermal expansion of the coating and the coefficient of thermal expansion of the baseplate material compared to the use of an aluminum oxide coating. In some examples that utilize coatings with separate layers of aluminum oxide and yttria stabilized zirconia, a yttria stabilized zirconia layer can be positioned between an aluminum baseplate and an aluminum oxide layer to provide for an intermediate CTE between the aluminum and aluminum oxide.

[0083] The high k material used as the first ceramic component can be selected to give the multi-component ceramic coating any suitable dielectric constant higher than the dielectric constant of aluminum oxide. In some examples, the dielectric constant of the high k material is equal to or higher than 11 and equal to or lower than 60. In more specific examples, the dielectric constant of the high k material is equal to or higher than 15. In some such examples, the dielectric constant of the multicomponent ceramic coating is equal to or greater than 11. Yttria stabilized zirconia can have a dielectric constant of approximately 29. In contrast, aluminum oxide can have a dielectric constant of approximately 9.3. Thus, a multi-component ceramic coating 204 comprising, for example, yttria stabilized zirconia as a first ceramic component and aluminum oxide as a second ceramic component can provide a coating with a higher dielectric constant than an aluminum oxide coating. This can allow for an increased coating thickness without decreasing RF coupling and breakdown voltage of the baseplate 202.

[0084] As mentioned above, the high k material may have a lower thermal conductivity than aluminum oxide. Thus, the second ceramic component the second ceramic component can be selected to have a higher thermal conductivity than the first ceramic component. For example, aluminum oxide (alpha) can have a thermal conductivity of 25-45 watts / meter-Kelvin (W / m-K). Yttria stabilized zirconia can havea thermal conductivity of 2-2.5 W / m-K. Thus, by using aluminum oxide as the second ceramic component, the thermal conductivity of the coating as a whole can be higher than where yttria-stabilized zirconia is used alone. Other examples of materials with higher thermal conductivities than yttria stabilized zirconia include zirconia-toughened alumina (ZTA) (thermal conductivity of 25 W / m-K) and yttrium oxide (thermal conductivity of 15 W / m-K).

[0085] The first ceramic component of the multi-component ceramic coating and the second ceramic component can be mixed in any suitable molar ratio. Where the first ceramic component is yttria stabilized zirconia and the second ceramic component is aluminum oxide, example molar ratios (YSZAhCh) include ratios within a range of 5:95 to 60:40. Further, the molar ratio of the first ceramic component and the second ceramic component can be selected based upon a desired dielectric constant, dielectric breakdown voltage, CTE, and / or electrical resistivity for the multi-component ceramic coating, and / or a desired capacitance between the baseplate and the edge ring.

[0086] The multi-component ceramic coating 204 can be formed by any suitable process. As one example, the multi-component ceramic coating 204 can be formed by thermal spray coating. In some examples, the multi-component ceramic coating 204 comprises a thickness 216 within a range of equal to or greater 300pm and equal to or less than 1000pm. In other examples, the thickness 216 of the multicomponent ceramic coating can be outside of this range.

[0087] The multi-component ceramic coating can have any suitable dielectric breakdown voltage. Examples include dielectric breakdown voltages within a range of equal to or greater than lOkV. Further, the multi-component ceramic coating also can have any suitable porosity. In some examples, the multi-component ceramic coating can have a porosity of 10% or less. In more specific examples, the multi-component ceramic coating can have a porosity of 5% or less. A multi-layer multi-component ceramic coating also can have a porosity within one or both of these ranges in some examples.

[0088] In some examples, the multi-component ceramic coating 204 can comprise a single layer 204 formed from a mixture including the first ceramic component and the second ceramic component. In other examples, the multicomponent ceramic coating can comprise two or more layers of different compositions. For example, the multi-component ceramic coating can comprise one or more layers comprising the first ceramic component but not the second ceramic component, andone or more layers comprising the second ceramic component. In various examples, the layers comprising the second ceramic component can omit or can include the first ceramic component. In yet further examples, additional ceramic components can be included to achieve desired physical properties for a multi-component ceramic coating. In an example two-layer arrangement, a multi-component ceramic coating can have a layer of aluminum oxide with a thickness of 200-300pm as a higher thermal conductivity material, and a layer of yttrium stabilized zirconia of 50- 100pm as a high k material. In some examples, the higher thermal conductivity material layer can be formed over the high k material layer. This can provide a progressive change in CTE through the layers. In other examples, the high k material layer can be formed over the higher thermal conductivity material layer.

[0089] As mentioned above, the thickness 216 and composition of multicomponent ceramic coating 204 can be configured to tune processing characteristics of a tool in which ESC 200 is used. An example of properties that can be tuned by varying the thickness 216 and composition of multi-component ceramic coating 204 includes a strength of RF coupling between baseplate 202 and edge ring 208. The magnitude of RF coupling between baseplate 202 and edge ring 208 can affect a uniformity (e.g. along a radial direction) of etch rate or deposition rate during substrate processing. In various examples, RF coupling between edge ring 208 and baseplate 202, as well as RF coupling between substrate 214 and baseplate 202, can be tuned to be substantially equal to one another, or vary from one another, so as to achieve desired energy densities during substrate processing.

[0090] For example, in some etching processes, it can be desirable for a substrate to be subjected to highly directional (e.g. vertical) ion flux uniformly across the (upward facing) surface of substrate 214 (opposite the baseplate 202). However, RF coupling differences across the substrate 214 and edge ring 208 can influence energy densities and energy vectors in, for example, a substrate edge region 218 between the substrate edge and the radially inward edge of the edge ring 208. The substrate edge region 218 between substrate 214 and edge ring 208 can comprise an area within which the etch rate can vary compared to the etch rates of other portions of the substrate. Whereas energy vectors across substrate 214 during substrate processing can be substantially directed vertically (downward) toward baseplate 202 opposite substrate 214 material, geometries associated with substrate edge region 218 can allow for a lensing effect in substrate edge region 218 causing changes in energy vector directionand / or intensity, thereby potentially degrading the uniformity of etch rate near the radial outward edge of the substrate 214.

[0091] RF coupling can be influenced by a capacitance between baseplate 202 and substrate 214, as well as a capacitance between baseplate 202 and edge ring 208. Multi-component ceramic coating 204 provides a dielectric layer between baseplate 202 and substrate 214, as well as between baseplate 202 and edge ring 208. Thus, multicomponent ceramic coating 204 can be designed (e.g. by varying composition and / or thickness) so as to achieve suitable RF coupling strength between edge ring 208 and baseplate 202, and also between substrate 214 and baseplate 202. This can help negate a lensing effect in the electric field that accelerates plasma ions toward the substrate surface in, for example, an etching process.

[0092] In some examples, a capacitance between baseplate 202 and edge ring 208 is greater than or equal to 0.5nF and less than or equal to 9nF at 1kHz (as measured by an LCR meter). In some such examples, a capacitance between the baseplate 202 and the edge ring 208 is greater than or equal to InF and less than or equal to 7.7nF at 1kHz. Such values can help to maintain desired targeted voltage at edge ring 208. In some such examples, the multi-ceramic coating can be selected to have a thickness and a dielectric constant to provide a value X within a range of 10 / mm to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

[0093] In some examples, a desired voltage on edge ring 208 due to RF coupling at peak RF signal amplitude can be designed, by way of the thickness and composition of the multi-component ceramic coating 204, to be greater than or equal to approximately eighty percent (80%) of the voltage at substrate 214. Such voltage relationship can provide a desired plasma density at the edge of substrate 214 so as to provide improved uniformity of etch rate.

[0094] In the example of FIG. 2, the multi-component ceramic coating comprises a single layer. FIG. 3 shows a schematic view of a portion of an example multi-component ceramic coating 302 on a baseplate 308 comprising two layers 304, 306 of different composition between a baseplate 308 and an edge ring 309. For example, layer 304 can comprise a first ceramic component, and layer 306 can comprise a second ceramic component. In other examples, the layer of the first component can be in direct contact with the baseplate 308, and the layer of the second component can be positioned over the layer of the first component.

[0095] Each layer 304, 306 independently can comprise a single ceramic component, or a mixture of ceramic components. Further, either or both of layers 304, 306 can comprise additional ceramic components other than the first ceramic component and the second ceramic component. While the example of FIG. 3 comprises two layers having different ceramic components, in other examples, a multi-component ceramic coating can have three or more layers, at least two of which can have different ceramic components.

[0096] Layers 304, 306 can have any suitable thicknesses. In some examples, layers 304, 306 have a combined thickness 314 equal to or greater than 300pm, and equal to or less than 1000pm. In other examples, the combined thickness 314 can have a value outside of this range. In some examples, where layer 304 comprises a high k material as a first ceramic component, a thickness 305 of the layer 304 of the first ceramic component can be greater than or equal to 300pm and less than or equal to 500pm. In some such examples, where layer 306 comprises a ceramic material with a higher thermal conductivity than the high k material of layer 304, a thickness 310 of layer 306 can be greater than or equal to 50pm and less than or equal to 300pm. In other examples, the thicknesses of either or both of layer 304 and / or layer 306 can be outside of these ranges.

[0097] In some examples, a shoulder region capacitance comprising the capacitance between baseplate 308 and edge ring 309, with ceramic coating 302 applied to shoulder region of the baseplate 308, is greater than or equal to 0.5nF and less than or equal to 9nF at 1kHz. In some such examples, the capacitance between baseplate 308 and the edge ring, with the multi-component ceramic coating 302 is greater than or equal to InF and less than or equal to 7.7nF at 1kHz. Further, a voltage on edge ring 309 due to RF coupling, at a peak RF signal amplitude, can be tuned, by way of the thickness and composition of the multi-component ceramic coating 302, so as to be greater than or equal to eighty percent (80%) of the voltage at the substrate. In some such examples, the multi-ceramic coating can be selected to have a thickness and a dielectric constant to provide a value X within a range of 10 / mm to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

[0098] In a yet more specific example, the first layer 304 of the multicomponent ceramic coating 302 comprises yttria stabilized zirconia as a high k material, and has a thickness 308 of approximately 500pm. Further, the second layer 306 of themulti-component ceramic coating 302 comprises aluminum oxide as a material with a higher thermal conductivity than yttria stabilized zirconia, and has a thickness 310 of approximately 50pm. A shoulder capacitance (e.g. capacitance between baseplate 308 and edge ring 309) is approximately 8.5nF at 1kHz.

[0099] In another more specific example, the first layer 304 of the multicomponent ceramic coating 302 comprises yttria stabilized zirconia as a high k material, and has a thickness 308 of approximately 500pm. Further, the second layer 306 of the multi-component ceramic coating 302 comprises aluminum oxide as a material with a higher thermal conductivity than yttria stabilized zirconia, and has a thickness 310 of approximately 100pm. The shoulder capacitance between baseplate 308 and edge ring 309 is approximately 6.7nF at 1kHz.

[0100] In yet another more specific example, the first layer 304 of the multicomponent ceramic coating 302 comprises yttria stabilized zirconia as a high k material, and has a thickness 308 of approximately 300pm. Further, the second layer 306 of the multi-component ceramic coating 302 comprises aluminum oxide as a material with a higher thermal conductivity than yttria stabilized zirconia, and has a thickness 310 of approximately 300pm. The shoulder capacitance between baseplate 306 and edge ring 308 is approximately 4.0nF at 1kHz.

[0101] FIG. 4 shows a schematic view of another example multi-component ceramic coating 402. Whereas the multi-component ceramic coating of FIG. 3 comprises two layers, the multi-component ceramic coating 402 of FIG. 4 comprises multiple layers 404, 406, 408, 410, wherein adjacent layers comprise different ceramic components. In some examples, layers 404, 406, 408 and 410 comprise alternating layers of a high k material as a first ceramic component, and layers of a material having higher thermal conductivity than the high k material as a second ceramic component. In other examples, any of layers 404, 406, 408, 410 can comprise a third ceramic component, and / or additional ceramic components. In this manner, a multi-component ceramic coating can comprise layers of different ceramic materials of compositions and / or thicknesses selected to tune the properties of the multi-component ceramic coating for a selected etching or deposition process.

[0102] FIG. 5 shows a flow diagram illustrating an example method 500 of forming a multi-component ceramic coating according to the present disclosure. A multi-component ceramic coating can be formed by various methods, including thermal spray coating methods. As mentioned above, thermal spray coating utilizes a solidfeedstock that is heated to form particles of the feedstock material. The particles are accelerated with a carrier gas toward an object to be coated. The particles impinge on the object and adhere to the surface of the object to form the coating. Example thermal spray coating methods include HVOF (high velocity oxy-fuel spraying), combustion flame spraying, plasma spraying, vacuum plasma spraying, and electric arc spraying.

[0103] Method 500 can be used to form a multi-component ceramic coating on an ESC, such as those described above with reference to FIGS. 1-4. As described above, a multi-component ceramic coating comprises a first ceramic component and a second ceramic component. The first ceramic component has a first dielectric constant that is higher than a dielectric constant of aluminum oxide and also has a first thermal conductivity. The second ceramic component has a second thermal conductivity that is higher than the first thermal conductivity. Further, a dielectric constant for the multifunctional ceramic coating is higher than the dielectric constant of aluminum oxide. In some examples, the multi-component ceramic coating is configured to provide a capacitance between the baseplate and the edge ring of greater than or equal to 0.5nF and less than or equal to 9nF at 1kHz. In some such examples, the multi-ceramic coating can be selected to have a thickness and a dielectric constant to provide a value X within a range of 10 / mm to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

[0104] At step 502, method 500 includes thermal spray coating at least the shoulder region of a baseplate with a ceramic-containing spray. The shoulder region is configured to support an edge ring.

[0105] In some examples, the ceramic-containing spray can comprise a first ceramic component and a second ceramic component, as indicated at 504, to form a layer comprising a mix of the first ceramic component and the second ceramic component. In some such examples, the mixture can be thermal spray coated by using a mixed phase solid feedstock comprising the first ceramic component and the second ceramic component. In some other such examples, the first ceramic component and the second ceramic component can be applied from separate feedstock, such as by using separate sprays. As indicated at 506, the first ceramic component has a first dielectric constant that is higher than a dielectric constant of aluminum oxide and also has a first thermal conductivity. Further, as indicated at 508, the second ceramic component has a second thermal conductivity that is higher than the first thermal conductivity.Additionally, as indicated at 510, a dielectric constant for the multi-component ceramic coating is higher than the dielectric constant of aluminum oxide. In some examples, as indicated at 511, the multi-ceramic coating can be selected to have a thickness and a dielectric constant to provide a value X within a range of 10 / mm to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

[0106] In other examples, the multi-component ceramic coating can comprise one or more layers of the first ceramic component and one or more layers comprising of the second ceramic component. Thus, as indicated at step 512, in such examples, the ceramic-containing spray comprises one of the first ceramic components or the second ceramic component. The ceramic-containing spray comprising the first ceramic component or the second ceramic component forms a first layer respectively comprising the first ceramic component or the second ceramic component. Next, as indicated at step 514, method 500 includes thermal spray coating at least the shoulder region on the baseplate of the ESC with a ceramic-containing spray comprising the other of the first ceramic component or the second ceramic component. The ceramiccontaining spray comprising the other of the first component or the second ceramic component forms a second layer comprising the other of the first ceramic component or the second ceramic component.

[0107] Thus, according to the above-disclosed examples, a baseplate coated with a multi-component ceramic coating as disclosed can provide a coating with a higher dielectric constant than the dielectric constant of aluminum oxide, and can allow for an increased coating thickness, while maintaining a desired amount of RF coupling between the baseplate and an edge ring. The multi-component ceramic coating also can achieve a higher breakdown voltage than the use of an aluminum oxide coating on a baseplate while having a similar level of RF coupling. Additionally, a multi-component ceramic coating comprising a mixture or layered combination of, for example, aluminum oxide and yttria stabilized zirconia, can provide a smaller difference between the coefficient of thermal expansion of the coating and the coefficient of thermal expansion of the underlying aluminum or aluminum alloy ESC baseplate material compared to an aluminum oxide coating. This can reduce a thermal stress on the coating and improve adhesion of the coating to the baseplate during ESC operation compared to an aluminum oxide coating.

[0108] Further, in some examples, such as where the desired physical properties of a coating can be achieved with a single material, a high k material can be used alone as a ceramic coating, without other ceramic components. As a more specific example, where a higher dielectric constant and dielectric strength are desired than are found in aluminum oxide, but where thermal conductivity is less of a concern, an yttria stabilized zirconia coating can be used in the absence of a component with a higher thermal conductivity. Such a single-layered coating could have a thickness within a range of 300-1000 pm in some examples.

[0109] It will be understood that the configurations and / or approaches described herein are exemplary in nature, and that these specific embodiments or examples are not to be considered in a limiting sense, because numerous variations are possible. The specific routines or methods described herein can represent one or more of any number of strategies. As such, various acts illustrated and / or described can be performed in the sequence illustrated and / or described, in other sequences, in parallel, or omitted. Likewise, the order of the above-described processes can be changed.

[0110] The subject matter of the present disclosure includes all novel and non- obvious combinations and sub-combinations of the various processes, systems and configurations, and other features, functions, acts, and / or properties disclosed herein, as well as any and all equivalents thereof.

Claims

CLAIMS:

1. A processing tool comprising: an electrostatic chuck (ESC), the ESC comprising: a baseplate, the baseplate comprising a shoulder region configured to support an edge ring; and a multi-component ceramic coating on at least the shoulder region of the baseplate, the multi-component ceramic coating having a first ceramic component and a second ceramic component, the first ceramic component having a first dielectric constant that is higher than a dielectric constant of aluminum oxide and also having a first thermal conductivity, and the second ceramic component having a second thermal conductivity that is higher than the first thermal conductivity, wherein a dielectric constant for the multi-component ceramic coating is higher than the dielectric constant of aluminum oxide, and wherein the multi-component ceramic coating has a value X within a range of 10 / millimeters (mm) to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

2. The tool of claim 1, wherein the multi-component ceramic coating comprises one or more layers of the first ceramic component and one or more layers of the second ceramic component.

3. The tool of claim 2, wherein a thickness of each layer of the one or more layers of the first ceramic component is greater than or equal to 300pm and less than or equal to 500pm, and a thickness of each layer of the one or more layers of the second ceramic component is greater than or equal to 50pm and less than or equal to 300pm.

4. The tool of claim 1, wherein the first ceramic component comprises one or more of cerium oxide (CeCh), yttria stabilized zirconia ((Y2O3)x(ZrO2)i-x, wherein x has a value of 0.03-0.20), zirconium oxide (ZrCh), yttrium oxide (Y2O3), lanthanum oxide (La2Os), titanium oxide (TiCh), or lanthanum zirconium oxide (La2Zr2O?).

5. The tool of claim 1, wherein the second ceramic component comprises one or more of aluminum oxide (AI2O3) or aluminum nitride (AIN).

6. The tool of claim 1, wherein the multi-component ceramic component is configured to provide a capacitance between the baseplate and the edge ring of greater than or equal to 0.5 nanofarads (nF) and less than or equal to 9nF at 1 kilohertz (kHz).

7. The tool of claim 1, wherein the multi-component ceramic coating is configured to provide a capacitance between the baseplate and the edge ring of greater than or equal to InF and less than or equal to 7.7nF at 1kHz.

8. The tool of claim 1, wherein the dielectric constant for the multi-component ceramic coating is higher than or equal to 11.

9. The tool of claim 1, wherein the multi-component ceramic coating comprises a mixture of the first ceramic component and the second ceramic component.

10. The tool of claim 1, wherein the multi-component ceramic coating comprises a thickness greater than or equal to 300pm and less than or equal to 1000pm.

11. The tool of claim 1, wherein the multi-component ceramic coating has a breakdown voltage of 10 kilovolts (kV) or greater.

12. The tool of claim 1, wherein the processing tool comprises a dielectric plasma etching tool.

13. An electrostatic chuck (ESC), comprising: a baseplate, the baseplate comprising a shoulder region configured to support an edge ring; and a multi-component ceramic coating on at least the shoulder region of the baseplate, the multi-component ceramic coating having a first ceramic component and a second ceramic component, the first ceramic component having a first dielectric constant that is higher than a dielectric constant of aluminum oxide and also having a first thermal conductivity, and the second ceramic component having a second thermal conductivity that is higher than the first thermal conductivity, wherein a dielectric constant for the multi-component ceramic coating is higher than the dielectric constantof aluminum oxide, and wherein the multi-component ceramic coating has a value X within a range of 10 / millimeters (mm) to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

14. The ESC of claim 13, wherein the first ceramic component comprises one or more of cerium oxide (CeCh), yttria stabilized zirconia ((Y2O3)x(ZrO2)i-x, wherein x has a value of 0.02-0.20), zirconium dioxide (ZrCh), yttrium oxide (Y2O3), lanthanum oxide (La2O3), titanium dioxide (TiCh), or lanthanum zirconium oxide (La2Zr2O?), and wherein the second ceramic component comprises one or more of aluminum oxide (AI2O3) or aluminum nitride (AIN).

15. The ESC of claim 13, wherein the multi-component ceramic coating comprises a mixture of the first ceramic component and the second ceramic component.

16. The ESC of claim 13, wherein the multi-component ceramic coating comprises one or more layers of the first ceramic component, and one or more layers of the second ceramic component.

17. A method for coating an electrostatic chuck (ESC), the method comprising: thermal spray coating at least a shoulder region of a baseplate of the ESC with a first ceramic component and a second ceramic component, the first ceramic component having a first dielectric constant that is higher than a dielectric constant of aluminum oxide and also having a first thermal conductivity, and the second ceramic component having a second thermal conductivity that is higher than the first thermal conductivity, to form a multi-component ceramic coating with a dielectric constant higher than the dielectric constant of aluminum oxide, wherein the multi-component ceramic coating a value X within a range of 10 / millimeters (mm) to 350 / mm, wherein X = k / d, and wherein k is a dielectric constant of the multi-component ceramic coating and d is a thickness of the multi-component ceramic coating.

18. The method of claim 17, wherein the first ceramic component comprises one or more of cerium oxide (CeCh), yttria stabilized zirconia ((Y2O3)x(ZrO2)i-x, wherein x is in a range of 0.02-0.20), zirconium dioxide (ZrCh), yttrium oxide (Y2O3), lanthanumoxide (La2Ch), titanium dioxide (TiCh), or lanthanum zirconium oxide (La2Zr2O?), and wherein the second ceramic component comprises one or more of aluminum oxide (AI2O3) or aluminum nitride (AIN).

19. The method of claim 17, wherein the multi-component ceramic coating comprises a mixture of the first ceramic component and the second ceramic component.

20. The method of claim 17, wherein the multi-component ceramic coating comprises one or more layers of the first ceramic component and one or more layers of the second ceramic component.

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