Substrate handler end effector vibration isolation and method therfor

Abstract

A substrate transport apparatus includes a transport chamber, a transport support, and a selectably variable tune suspension system. The transport support is movably coupled to the transport chamber so as to move with at least one degree of freedom relative to the transport chamber, and an end effector is joined to the transport support, the end effector having a substrate holder station thereon configured so as to hold a substrate on the end effector. The selectably variable tune suspension system intervenes between and isolates the substrate holder station from the transport support. Tune variance, of the selectably variable tune suspension system, is selected to specifically and uniquely correspond to a unique dynamic response characteristic of each unique substrate holder station of each discrete substrate transport apparatus installation.

Description

Atty. Docket No.390P017137-WO (EQV) / Br3085 SUBSTRATE HANDLER END EFFECTOR VIBRATION ISOLATION AND METHOD THEREFOR CROSS-REFERENCE TO RELATED APPLICATION(S)

[0001] This application is a non-provisional of and claims the benefit of United States Provisional Patent Application Number 63 / 632,308 filed on April 10, 2024, the disclosure of which is incorporated herein by reference in its entirety. BACKGROUND 1. Field

[0002] The present disclosure generally relates to substrate processing equipment, and more particularly, to substrate transports of the substrate processing equipment. 2. Brief Description of Related Developments

[0003] Semiconductor automation generally comprises a series of building blocks that are required to support the implementation of processes to ultimately achieve predetermined levels of quality and reproducibility in semiconductor chip manufacturing. One component of semiconductor automation is the wafer (also referred to as a substrate) handler that transports the wafer or substrate between load locks and process modules and / or between process modules (e.g., in the case of sequential process tool architectures).

[0004] Conventional wafer handlers employed in semiconductor automation generally comprise multi-link robotic manipulators. The multi-link robotic manipulators have end effectors that hold and transport wafers or substrates from one location to another location. To determine the positionAtty. Docket No.390P017137-WO (EQV) / Br3085 of an end effector in space, a set of position feedback sensors is employed. The set of position feedback sensors is generally mounted, at least in part, to shafts of actuators that drive the links of the multi-link robotic manipulator. Robotic kinematic errors, such as mechanical hysteresis, vibration, and thermal expansion can significantly contribute to accuracy errors with respect to the actual location of the end effector in space.

[0005] As an alternative to the wafer handlers noted above, magnetically or electro-dynamically levitated wafer conveyors may be employed where an alternating current magnetic floating apparatus for floating and conveying a conductive floating body or paramagnetic or nonmagnetic metallic material above a line of alternating current electromagnets is provided. The magnetic levitation of the wafer conveyors induces vibration of the end effector. This vibration of the end effector affects (e.g., reduces) normal force of the wafer on support pads of the end effector, where the support pads support the wafer during wafer transport on the wafer conveyor. Reduction of the normal force in turn reduces the friction interface limits between the support pads and the wafer which may result in undesired wafer slippage / displacement of the wafer relative to the wafer conveyor (e.g., due to acceleration / deceleration of the waver conveyor).

[0006] Accordingly, the present disclosure addresses a number of those issues. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The foregoing aspects and other features of the present disclosure are explained in the following description, taken in connection with the accompanying drawings, wherein:

[0008] Fig. 1 is exemplary substrate processing apparatus in accordance with the present disclosure;

[0009] Fig. 2 is an exemplary substrate processing apparatus in accordance with the present disclosure;Atty. Docket No.390P017137-WO (EQV) / Br3085

[0010] Fig. 3A is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;

[0011] Fig.3B is a schematic elevation view of the substrate processing apparatus of Fig. 3A in accordance with the present disclosure;

[0012] Fig. 4A is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;

[0013] Fig.4B is a schematic elevation view of the substrate processing apparatus of Fig. 4A in accordance with the present disclosure;

[0014] Fig.5 is a schematic perspective illustration of a portion of a substrate processing apparatus in accordance with the present disclosure;

[0015] Fig. 6 is a schematic plan view of a portion of a substrate processing apparatus in accordance with the present disclosure;

[0016] Fig.7 is an exemplary schematic electric circuit diagram of an electromagnet of a substrate processing apparatus in accordance with the present disclosure;

[0017] Figs. 8A, 8B, and 8C are schematic illustrations portions of a transport chamber in accordance with the present disclosure;

[0018] Fig. 9 is a schematic illustration of an electromagnet control system and electromagnet array of a substrate processing apparatus in accordance with the present disclosure;

[0019] Fig.10A is a schematic illustration of the electromagnet control system and electromagnet array of Fig.9 in accordance with the present disclosure;

[0020] Fig.10B is a schematic illustration of the electromagnet control system and electromagnet array of Fig.9 in accordance with the present disclosure;Atty. Docket No.390P017137-WO (EQV) / Br3085

[0021] Fig. 11 is a bock diagram of an exemplary wafer handler of the substrate processing apparatus described herein in accordance with the present disclosure;

[0022] Fig.11A is an exemplary illustration of the wafer handler of Fig.11 in accordance with the present disclosure;

[0023] Fig. 11B is a schematic illustration of a portion of the substrate processing apparatus of Fig.1 including the wafer handler of Fig.11A in accordance with the present disclosure;

[0024] Fig. 12 is an exemplary illustration of an excitation force model for the wafer handler of Fig.11 in accordance with the present disclosure;

[0025] Fig.12A is an exemplary illustration of the wafer handler of Fig.11 in accordance with the present disclosure;

[0026] Fig.12B is an exemplary illustration of the wafer handler of Fig.11 in accordance with the present disclosure;

[0027] Fig. 12C is an exemplary illustration of a portion of the wafer handler of Fig. 11 in accordance with the present disclosure;

[0028] Fig.12D is an exemplary illustration of the wafer handler of Fig.11 in accordance with the present disclosure;

[0029] Fig.12E is an exemplary illustration of the wafer handler of Fig.11 in accordance with the present disclosure;

[0030] Fig.13A is exemplary graph of acceleration vs time for an un-damped wafer handler;

[0031] Fig. 13B is an exemplary graph of acceleration vs time for the end effector of Fig. 11 in accordance with the present disclosure;Atty. Docket No.390P017137-WO (EQV) / Br3085

[0032] Figs. 14A-14F are exemplary transport apparatus in which the present disclosure may be employed;

[0033] Figs.15 and 16 are exemplary flow diagrams for methods in accordance with the present disclosure; and

[0034] Fig.17 is an exemplary illustration of the wafer handler of Fig.11 in accordance with the present disclosure. DETAILED DESCRIPTION

[0035] The following detailed description is meant to assist the understanding of one skilled in the art, and is not intended in any way to unduly limit claims connected or related to the present disclosure.

[0036] The following detailed description references various figures, where like reference numbers refer to like components and features across various figures, whether specific figures are referenced, or not.

[0037] The word “each” as used herein refers to a single object (i.e., the object) in the case of a single object or each object in the case of multiple objects. The words “a,” “an,” and “the” as used herein are inclusive of “at least one” and “one or more” so as not to limit the object being referred to as being in its “singular” form.

[0038] The terms “top,” “bottom,” “upper,” “lower,” “front,” “back,” “vertical,” and “horizontal” as may be used herein are by way of example and illustration only are not meant to limit the description and may be exchanged in position and orientation.Atty. Docket No.390P017137-WO (EQV) / Br3085

[0039] The terms “substantially” and “about” as may be used herein refer to a feature that may be varied within an acceptable manufacturing tolerance for a given application.

[0040] Fig.1 illustrates an exemplary processing apparatus 100 employing magnetically levitated transports in accordance with the present disclosure. Although the present disclosure will be described with reference to the drawings, it should be understood that the present disclosure could be embodied in many forms. In addition, any suitable size, shape or type of elements or materials could be used.

[0041] Based on the problems and limitations of conventional substrate processing apparatus noted above, it is desirable to have a wafer (or substrate) handler (as described herein) that operates within a sealed environment (e.g., a vacuum environment, inert gas environment, atmospheric environment, or any other suitable sealed environmental condition), such as the substrate processing apparatus 100, 200, 300, 400 (see also Figs. 2-4B and 14A-14F) described herein, where a resilient mechanical suspension or energy dissipation system 1510S (also referred to herein as a selectably variable tune suspension system or resilient suspension system) substantially isolates an end effector 1520, 1520B of the wafer (or substrate) handler (and any wafers carried thereon) from vibration induced by operation of the substrate handler. For example, where the wafer handler is a levitated wafer handler 1500, the end effector 1520, 1520B of the wafer (or substrate) handler (and any wafers carried thereon) is (are) substantially isolated from vibration induced by the levitation of the wafer handler 1500 (due to the repulsive nature of levitation). The resilient mechanical suspension 1510S described herein is configured to filter a wide range of frequency harmonics associated with a drive structure and a transport driven by the drive structure. The resilient mechanical suspension 1510S is totally / entirely passive (i.e., does not require power or feedback controls) and is suitable for employment in any environment (including vacuum environments) at very low cost.

[0042] Isolating the end effector from the induced vibration may substantially reduce (or substantially eliminate) undesired disturbance from deleterious vibration and control effects ofAtty. Docket No.390P017137-WO (EQV) / Br3085 friction instability between the end effector 1520, 1520B and a wafer held at the substrate holding station SHS of the end effector 1520, 1520B. Isolating the end effector from the induced vibration may substantially maintain a normal force between the end effector and a wafer held at a substrate holding station SHS of the end effector 1520, 1520B so as to maintain friction interface limits. Substantial isolation of the end effector 1520, 1520D (and wafer(s) carried thereon) from the induced vibration may substantially maintain a normal force and a friction interface limit (values), between the end effector 1520, 1520D and the wafer held thereon, at a predetermined normal force and friction interface limit (values) determined and present between the end effector 1520, 1520D and wafer held thereon without the vibration induced by levitation of the wafer handler. As the predetermined normal force and friction interface limit (values) is / are substantially maintained with operation (such as levitation) of the wafer handler 1500, wafer slippage relative to the end effector 1520, 1520D due to vibrational effects may be substantially eliminated (or substantially reduced) to effect higher wafer transport speeds (e.g., increased throughput, wafers processed per unit of time, of the substrate processing apparatus 100, 200, 300, 400) due to the maintained predetermined normal force and friction interface limit (values).

[0043] As described in greater detail herein, the present disclosure provides a substrate transport apparatus 1599, 210, 210A, 214, 216, 217, 218 (see at least Figs.5, 6, 9-10B, and 14A-14F) that includes a base 118M (see Fig. 1, which may be a transport or transfer chamber as described herein), a transport support 1510, 1510A, and a selectably variable tune suspension system 1510S. The transport support 1510, 1510A is movably coupled to the base 118M so as to move with at least one degree of freedom (e.g., rotational and / or linear) relative to the base 118M. An end effector 1520 is joined to the transport support 1510, 1510A, where the end effector 1520 has a substrate holder station SHS thereon configured so as to hold a substrate S on the end effector 1520. The selectably variable tune suspension system 1510S intervenes between and isolates the substrate holder station SHS from the transport support 1510, 1510A, where a tune variance, of the selectably variable tune suspension system 1510S, is selected to specifically and uniquelyAtty. Docket No.390P017137-WO (EQV) / Br3085 correspond (i.e., a bespoke vibrational tuning) to a unique dynamic response characteristic of each unique substrate holder station SHS of each discrete substrate transport apparatus installation.

[0044] The substrate transport apparatus 1599, 210, 210A, 214, 216, 217, 218, as will be described in greater detail herein, may provide for one or more of the following (which may be employed alone or in any combination thereof): the selectably variable tune suspension system 1510S holds (or otherwise suspends) the substrate holder station SHS from the transport support 1510, 1510A so that the substrate holder station SHS resiles with six degrees of freedom as a unit relative to the base 118M; the selectably variable tune suspension system 1510S modulates each disturbance input imparted from the coupling of the base 118M and transport support 1510, 1510A; the tune variance is selectable in at least one rotational degree of freedom (e.g., yaw, pitch, and / or roll) and in at least one linear degree of freedom (e.g., in the X-Y plane and / or Z direction); the tune variance is substantially independently selectable in at least one rotational degree of freedom (e.g., yaw, pitch, and / or roll) from at least another rotational degree of freedom (e.g., yaw, pitch, and / or roll), and in at least one linear degree of freedom (e.g., in the X-Y plane and / or Z direction) from at least another linear degree of freedom (e.g., in the X-Y plane and / or Z direction); the selectably variable tune suspension system 1510S comprises wire rope suspension elements (also referred to as wire rope vibration insulators / isolators) 1510SS, coil springs 1510SC, torsion resilient elements 1510ST (e.g., beams, rods, wires, etc.), cantilever beams 1510CB, membranes 1510M, metal bands 1510MB, and / or a flexible apparatus 1510FA that is characterized by a spring constant with a damper element (see, at least, Figs. 12B and 12C); a mass damper 1510W coupled to the selectably variable tune suspension system 1510S so that the mass damper 1510W attenuates dynamic coupling response of the substrate holding station SHS (e.g., about a principal axis, e.g., one or more pivot axis about a respective one of the radial, tangential, and / or Z axes, and / or the radial, tangential and / or Z axes) from disturbance inputs (e.g., excitations / vibrations) imparted via the variable tune suspension system 1510S; the transport support 1510 is an electrical dynamic levitation platen 1510P levitated (e.g., electro-dynamically) from (e.g., phase coils in) the base 118M; the selectably variable suspension system 1510S intervenes between and one or more ofAtty. Docket No.390P017137-WO (EQV) / Br3085 isolates the substrate holding station SHS from levitation excitations imparted by the base 118M to the substrate holding station SHS (e.g., via the platen 1510P or arm links / joints (see Figs.14A- 14F)) and protects or isolates a substrate S held on the substrate holding station SHS from mechanical shock (such as from a loss of levitation power or any other potential impact) imparted to the transport support 1510, 1510A; the transport support 1510A is an arm linkage configured to extend and retract so as to traverse the end effector 1520 with the substrate holding station SHS; and the selectably variable suspension system 1510S intervenes between and isolates the substrate holding station SHS from each link (and each joint, i.e. the suspension system 1510S is distal from each joint and link) of the arm linkage (see Figs.14A-14F).

[0045] As described in greater detail herein, the present disclosure provides a substrate transport apparatus 1599, 210, 210A, 214, 216, 217, 218 (see at least Figs.5, 6, 9-10B, and 14A-14F) that includes a base 118M (see Fig. 1), a transport support 1510, 1510A, and a resilient suspension system 1510S. The transport support 1510, 1510A is movably coupled to the base 118M so as to move with at least one degree of freedom relative to the base 118M. An end effector 1520 is joined to the transport support 1510, 1510A, where the end effector 1520 has a substrate holder station SHS thereon configured so as to hold a substrate S on the end effector 1520. The resilient suspension system 1510S intervenes between and isolates the substrate holder station SHS from the transport support 1510, 1510A, where the resilient suspension system has multiple discrete resilient mounts 1510DM (see, at least, Figs. 12A and 12B) arranged in parallel so that resilient mount action, of each respective resilient mount 1510DM, in parallel with each other isolate the substrate holder station SHS from the substrate support 1510, 1510A, where each respective resilient mount 1510DM is separate and distinct from each other operating in parallel on the substrate holder station SHS so that the substrate holder station SHS is common to each resilient mount 1510DM of the resilient suspension system 1510S.

[0046] The substrate transport apparatus 1599, 210, 210A, 214, 216, 217, 218, as will be described in greater detail herein, may provide for one or more of the following (which may be employed alone or in any combination thereof): the resilient suspension system 1510S holds (or otherwiseAtty. Docket No.390P017137-WO (EQV) / Br3085 suspends) the substrate holder station SHS from the transport support 1510, 1510A so that the substrate holder station SHS resiles with six degrees of freedom as a unit relative to the base 118M; the resilient suspension system 1510S modulates each disturbance input imparted from the coupling of the base 118M and transport support 1510, 1510A; the resilient suspension system 1510S comprises wire rope suspension elements (also referred to as wire rope vibration insulators / isolators) 1510SS, or coil springs 1510SC, or torsion resilient elements 1510ST (e.g., beams, rods, wires, etc.), cantilever beams 1510CB, membranes 1510M, metal bands 1510MB, and / or a flexible apparatus 1510FA that is characterized by a spring constant with a damper element (see, at least, Figs. 12B and 12C); a mass damper 1510W coupled to the resilient suspension system 1510S so that the mass damper 1510W attenuates dynamic coupling response of the substrate holding station SHS (e.g., about a principal axis, e.g., one or more pivot axis about a respective one of the radial, tangential, and / or Z axes, and / or the radial, tangential and / or Z axes) from disturbance inputs (e.g., excitations / vibration) imparted via the resilient suspension system 1510S; the transport support 1510 is an electrical dynamic levitation platen 1510P levitated (e.g., electro-dynamically) from (e.g., phase coils in) the base 118M; the resilient suspension system 1510S intervenes between and one or more of isolates the substrate holding station SHS from levitation excitations imparted by the base 118M to the substrate holding station SHS (e.g., via the platen 1510P or arm links / joints (see Figs.14A-14F)) and protects or isolates a substrate S held on the substrate holding station SHS from mechanical shock (such as from a loss of levitation power or any other potential impact) imparted to the transport support 1510, 1510A; the transport support 1510A is an arm linkage configured to extend and retract so as to traverse the end effector 1520 with the substrate holding station SHS; and the resilient suspension system 1510S intervenes between and isolates the substrate holding station SHS from each link (and each joint, i.e. the suspension system 1510S is distal from each joint and link) of the arm linkage (see Figs. 14A- 14F).

[0047] It is noted that while the present disclosure is described with respect to levitated wafer handlers, the present disclosure may be equally applied to any suitable wafer handler (levitated orAtty. Docket No.390P017137-WO (EQV) / Br3085 not, and / or articulated or not) inclusive of SCARA arm robots 210, 210A (see Figs.14E and 14F), frog-leg robots 216, 217, 218 (see Figs.14A, 14D, and 14D), linearly sliding arm robots 214 (see Fig. 14B), or any other suitable transport having an end effector that transports wafers S and is subject to vibration such as from joint movement, motor operation, levitation, etc. Suitable examples of articulated arms to which the present disclosure may be employed can be found in United States patents 6,231,297 issued May 15, 2001; 5,180,276 issued January 19, 1993; 6,464,448 issued October 15, 2002; 6,224,319 issued May 1, 2001; 5,447,409 issued September 5, 1995; 7,578,649 issued August 25, 2009; 5,794,487 issued August 18, 1998; 7,946,800 issued May 24, 2011; 6,485,250 issued November 26, 2002; 7,891,935 issued February 22, 2011; 11,569,111 issued on January 31, 2023; 8,752,449 issued on June 17, 2014; 8,918,203 issued on December 23, 2014; and 11,235,935 issued February 1, 2022, and United States patent application numbers 13 / 293,717 entitled “Dual Arm Robot” and filed on November 10, 2011 and 13 / 270,844 entitled “Coaxial Drive Vacuum Robot” and filed on October 11, 2011 the disclosures of which are all incorporated by reference herein in their entireties.

[0048] The present disclosure is described herein with respect to induction based magnetic levitation substrate transport apparatus such as described in United States patent number 11,476,139 issued on October 18, 2022, United States patent application number 18 / 050,300 filed on October 27, 2022 and published as United States pre-grant publication number 2023 / 0143307, and United States Provisional Patent Application number 63 / 597,250 filed on November 8, 2023 with Attorney Docket No.390P017053-US (-#1), the disclosures of which are incorporated herein by reference in their entireties. However, it should be understood that the present disclosure may be employed for any other type of levitated substrate transport apparatus.

[0049] Referring to Fig. 1, there is shown a schematic plan view of a substrate processing apparatus 100 in accordance with the present disclosure. The substrate processing apparatus 100 is connected to an environmental front end module (EFEM) 114 which has a number of load ports 112 as shown in Fig.1. The load ports 112 are capable of supporting a number of substrate storage canisters 171 such as for example conventional FOUP canisters; though any other suitable typeAtty. Docket No.390P017137-WO (EQV) / Br3085 may be provided. The EFEM 114 communicates with the processing apparatus through load locks 116, which are connected to the processing apparatus as will be described further below. The EFEM 114 (which may be open to atmosphere) has a substrate transport apparatus (not shown – but which may be similar to a substrate transport apparatus of the transport chamber 118 in the form of a linear electrical machine 1599 as described herein, e.g., the linear electrical machine 1599 described herein may be employed in vacuum and atmospheric environments) capable of transporting substrates from load ports 112 to load locks 116. The EFEM 114 may further include substrate alignment capability, batch handling capability, substrate and carrier identification capability or otherwise. The load locks 116 may interface directly with the load ports 112 as in the case where the load locks have batch handling capability or in the case where the load locks have the ability to transfer wafers directly from the FOUP to the lock. Some examples of such apparatus are disclosed in US patent numbers 6,071,059, 6,375,403, 6,461,094, 5,588,789, 5,613,821, 5,607,276, 5,954,472, 6,120,229, and 6,869,263 all of which are incorporated by reference herein in their entirety. Other load lock options may be provided.

[0050] Still referring to Fig. 1, the processing apparatus 100 may be used for processing semiconductor substrates (e.g.200 mm, 300 mm, 450 mm, or other suitably sized wafers), panels for flat panel displays, or any other desired kind of substrate under vacuum and / or atmospheric conditions. The processing apparatus 100 generally comprises transport chamber 118 (which may hold a sealed atmosphere therein), processing modules 120, and at least one substrate transport apparatus or linear electrical machine 1599. The substrate transport apparatus 1599 shown may be integrated with the chamber 118 or coupled to the chamber in any suitable manner. Processing modules 120 are mounted on both sides of the chamber 118 as illustrated in Fig.1 or processing modules 120 may be mounted on one side of the chamber 118 as shown for example in Fig.2. As shown in Fig.1, processing modules 120 are mounted opposite each other in rows Y0, Y1, Y2 or vertical planes although, the processing modules 120 may be staggered from each other on the opposite sides of the transport chamber 118 or stacked in a vertical direction relative to each other. Referring also to Figs.5, 6, and 9-10B, the transport apparatus 1599 has at least one wafer handlerAtty. Docket No.390P017137-WO (EQV) / Br3085 1500 that is moved in the chamber 118 to transport substrates between load locks 116 and the processing chambers 120. As shown in Fig.1, only one wafer handler 1500 is provided; however, more than one wafer handler may be provided (see, e.g., Figs.6 and 9-10B). As seen in Fig.1, the transport chamber 118 (which is subjected to vacuum or an inert atmosphere or simply a clean environment or a combination thereof in its interior) has a configuration, and employs the substrate transport apparatus or linear electrical machine 1599, that allows the processing modules 120 to be mounted to the chamber 118 in a Cartesian arrangement with processing modules 120 arrayed in substantially parallel vertical planes or rows. This results in the processing apparatus 100 having a more compact footprint than a comparable conventional processing apparatus, such as those having a clustered arrangement. Moreover, the transport chamber 118 may be capable of being provided with any desired length (i.e., the length is scalable where transport chambers 118 may be coupled to each other end-to-end to the desired length) to add any desired number of processing modules 120 in order to increase throughput. The transport chamber 118 may also be capable of supporting any desired number of transport apparatus 1599 therein and allowing the transport apparatus 1599 to reach any desired processing chamber 120 coupled to the transport chamber 118 without interfering with each other. This in effect decouples the throughput of the processing apparatus 100 from the handling capacity of the transport apparatus 1599, and hence the processing apparatus 100 throughput becomes processing limited rather than handling limited. Accordingly, throughput can be increased as desired by adding processing modules 120 and corresponding handling capacity on the same platform.

[0051] Still referring to Fig.1, the transport chamber 118 has a general rectangular shape although, the chamber may have any other suitable shape. The transport chamber 118 has a slender shape (i.e. length much longer than width) and defines a generally linear transport path for the transport apparatus 1599 therein. The chamber 118 has longitudinal side walls 118S. The side walls 118S have transport openings or ports 118O (also referred to as substrate pass through openings) formed therethrough. The transport ports 118O are sized large enough to allow substrates to pass through the ports (which ports can be sealable by valves) into and out of the transport chamber 118. AsAtty. Docket No.390P017137-WO (EQV) / Br3085 can be seen in Fig.1, the processing modules 120 are mounted outside the side walls 118S with each processing module 120 being aligned with a corresponding transport port 118O in the transport chamber 118. Each processing module 120 may be sealed against the sides 118S of the chamber 118 around the periphery of the corresponding transport aperture to maintain the vacuum in the transfer chamber. Each processing module 120 may have a valve (e.g., a slot valve), controlled by any suitable means, such as controller 199, to close the transport port 118O when desired. The transport ports 118O may be located in the same horizontal plane. Accordingly, the processing modules on the chamber are also aligned in the same horizontal plane. The transport ports 118O may be disposed in different horizontal planes. As seen in Fig.1, the load locks 116 may be mounted to the chamber sides 118S at the two front most transport ports 118O. This allows the load locks 116 to be adjacent the EFEM 14 at the front of the processing apparatus. The load locks 116 may be located at any other transport ports 118O on the transport chamber 118 such as shown for example in Fig.2. The hexahedron shape of the transport chamber 118 allows the length of the chamber to be selected as desired (as noted above) in order to mount as many rows of processing modules 120 as desired.

[0052] As noted before, the transport chamber 118 in Fig.1 has a substrate transport apparatus or linear electrical machine 1599 having a single wafer handler 1500, although, there may be more than the single substrate handler as illustrated in Fig.6. The transport apparatus 1599 is integrated with the chamber 118 to translate wafer handler 1500 back and forth in the chamber 118 at least between a front 118F and a back 118R of the chamber 118 (and / or, such as illustrated in Fig. 6, between the sides 118S of the transport chamber 118). The wafer handler 1500 of the substrate transport apparatus 1599 has at least one end effector 1520 having a substrate holder station SHS for holding one or more substrates S.

[0053] It should be understood that the transport apparatus (also referred to herein as a linear electric machine) 1599, shown in Fig.1 (also referring to Figs.8A-8C) is a representative transport apparatus and, includes the wafer handler 1500 (a portion of which is illustrated in Figs.8B, 8CAtty. Docket No.390P017137-WO (EQV) / Br3085 for clarity) which is magnetically supported / levitated from linear tracks 1550 formed by an array of electromagnets or coil actuators 1700.

[0054] The transport chamber 118 may form a frame or base 118M (see Fig. 1) with a level reference plane 1299, e.g., that defines or otherwise corresponds (e.g., is substantially parallel) with a wafer transport plane 1290 (see Figs.5, 8A, and 8C). The linear tracks 1550 formed by the array of electromagnets 1700 may be mounted to the side walls 118S or floor 118L of the transport chamber 118 (where the floor 118L forms a non-magnetic isolation wall between the array of electromagnets 170 and the wafer handler 1500) and may extend the length of the chamber 118. This allows the wafer handler 1500 to traverse the length of the chamber 118. The array of electromagnets 1700 (also referred to herein as actuators 1700) form the linear tracks 1550 of Fig. 1, where each of linear tracks 1550 includes a respective array of electromagnets or actuators 1700A-1700n (see Fig.5). The array of electromagnets or actuators 1700A-1700n are referred to herein as a network of actuators as in Figs. 5, and 6 (e.g., that form at least one linear induction motor stator 1560 - noting that each drive line 177-184 may be provided with two or more than two rows of electromagnets as illustrated in Figs. 5 and 6 (see also Figs. 8A-8C), where one or more electromagnets are common to more than one drive line), connected to the transport chamber 118 to form a drive plane 1598 at a predetermined height H relative to the reference plane 1299 (see Fig.8C), the array of electromagnets 1700 (see also Fig.5) being arranged so that a series of the electromagnets 1700A-1700n define at least one drive line within the drive plane 1598, and each of the electromagnets 1700A-1700n (see Fig. 5) in the array of electromagnets 1700 being coupled to an alternating current (AC) power source 1585 energizing each electromagnet 1700A- 1700n, where the alternating power source is a three phase (or more) alternating current power source.

[0055] The transport support 1510 will be described, for exemplary purposes, as a reaction platen 1510Palthough, the transport support 1510 may be an arm linkage 1510A of a transport arm, examples of which are described herein with respect to and illustrated in Figs. 14A-14F. The reaction platen 1510P is formed of a paramagnetic, diamagnetic, or non-magnetic conductiveAtty. Docket No.390P017137-WO (EQV) / Br3085 material disposed to cooperate with the electromagnets 1700A-1700n of the array of electromagnets 1700 so that excitation of the electromagnets 1700A-1700n with alternating current from the alternating current source 1585 generates levitation forces FZ and propulsion forces FP (see Fig.5, where the propulsion forces are in any suitable direction X and / or Y direction, e.g., in the drive plane 1598) against the transport support 1510 that controllably levitate and propel the transport support 1510 along the at least one drive line 177-184, in a controlled attitude (e.g., in six degrees of freedom motion, X, Y, Z, Rx, Ry, Rz) relative to the drive plane 1598.

[0056] As noted above, the chamber floor 118L forms a non-magnetic isolation wall 4400 (see Figs.8A-8C) between the array of electromagnets 1700 and the wafer handler 1500. The array of electromagnets 1700 is disposed in an atmospheric environment while the wafer handler 1500 is disposed in a vacuum environment of the transport chamber 118. The non-magnetic isolation wall 4400 (and the chamber floor 118L) is selected so as to have a low electrical conductivity and a high resistivity to minimize the occurrence of Eddy Currents (and minimize magnetic field losses due to the Eddy Currents) while allowing a magnetic field to pass through the non-magnetic isolation wall 4400 to establish a magnetic circuit between the (e.g., coils / poles) of the electromagnets in the array of electromagnets 1700 and the transport support 1510 of the wafer handler 1500. Suitable examples of materials from which the non-magnetic isolation wall 4400 (and the floor 118L) include materials that are vacuum compatible and have a high resistivity, high stiffness, high yield strength, and high thermal conductivity such as, for example, 300-Series Stainless Steel that conforms with the electrical and magnetic (e.g., non-magnetic) properties noted above. A suitable example of the 300-series Stainless Steel includes, but is not limited to, 304 Stainless Steel. The chamber floor 118L may be a separate (i.e., different) material than that of the remainder (e.g., ends, side walls, and top) of the frame 118M such as to reduce costs of the transport chamber 118 structure. For example, the remainder of the frame 118M may be constructed of aluminum (or other suitable material) while the floor 118L is constructed of stainless steel (or other suitable material). Other suitable examples of material from which the non-magnetic isolation wall 4400 (and the floor 118L) may be constructed includes, but is notAtty. Docket No.390P017137-WO (EQV) / Br3085 limited to, low conductivity aluminum such as a 6061 series aluminum (e.g., 6061-F, 6061-0, 6061-O, 6061-T4, 6061-T6, and 6061-T9).

[0057] With respect to the magnetic circuit formed between the (e.g., coils / poles) of the electromagnets in the array of electromagnets 1700 and the transport support 1510 of the wafer handler 1500, the transport support 1510 is constructed of any suitable paramagnetic material. The paramagnetic material of the transport support 1510 has a low resistivity so as maximize induction of Eddy Currents, a low mass density to minimize weight of the transport support 1510, and be inert so as to be vacuum compatible and resistant at high temperatures (e.g., such as about 100°C or more). Suitable examples of materials from which the transport support 1510 may be constructed include, but are not limited to, 1100 series Aluminum Alloy (such as the 1100, 1100- O, and 1100-H18 Aluminum Alloys), and 6101 series Aluminum Alloy (such as the 6101-T6, 6101-T61, 6101-T63, 6101-T64, and 6101-T65 Aluminum Alloys). It is noted that for atmospheric applications of the transport described herein, the transport support 1510 may be constructed of copper or any of the other materials described herein for the transport support 1510.

[0058] The poles (see, e.g., Fig. 8C) of the electromagnets 1700 and the coil base plate are ferromagnetic and have a high magnetic permeability, high magnetic saturation, and high electrical resistivity (e.g., so as to minimize Eddy Currents) so as to maximize levitation efficiency for levitating the transport support 1510. The poles and the coil base plate may be constructed of any suitable soft magnetic composite (SMC) material with a magnetic saturation reaching about two Tesla. A suitable example of a soft magnetic composite material being, but not limited to, Hoganas’ 700HR 5P.

[0059] Referring to Figs.3A, 3B, 4A, and 4B, while the transport chamber 118 has been described above as a longitudinally extended chamber that forms part of a linear processing tool, the transport chamber may have a cluster tool configuration. For example, referring to Figs. 3A and 3B a transport chamber 118T1, of a processing apparatus 300 similar to (or the same as) processing apparatus 100, 200 but for the transport chamber shape, has a substantially square configurationAtty. Docket No.390P017137-WO (EQV) / Br3085 (although the transport chamber may have any suitable shape such as hexagonal, octagonal, etc. – see for example transport chamber 118T2 of processing apparatus 400 in Figs.4A and 4B, where processing apparatus 400 is similar to or the same as processing apparatus 100, 200 but for the transport chamber shape). An electrical machine 1599R (substantially similar to the linear electrical machine 1599) may be configured as a side-by-side transport apparatus that includes at least two side-by-side wafer handlers 1500A, 1500B that are substantially similar to wafer handler 1500 described herein such that any reference herein to wafer handler 1500 is inclusive of wafer handlers 1500A, 1500B (i.e., the wafer handlers described herein are generally referred to as wafer handler(s) 1500). The array of electromagnets 1700 is configured to move the wafer handlers 1500A, 1500B so that the wafer handlers 1500A, 1500B rotate about common axis of rotation 1277 (such axis being akin to a θ axis of, for example, a conventional SCARA type robot) for changing a direction of “extension and retraction” (the terms extension and retraction are being used herein for convenience noting that the extension and retraction is effected by linear propulsion movement of the wafer handler 1500, 1500A, 1500B along a respective drive line) of the side-by- side transport apparatus. For example, the array of electromagnets 1700 has an arrangement that forms drive lines 177, 178, 179, 180. Here drive lines 177, 178 are spaced from one another and substantially parallel to one other so as to be substantially aligned with a respective transport openings 1180A, 1180F and 1180B, 1180E. The drive lines 179, 180 are substantially orthogonal to drive lines 177, 178 and are spaced from one another and substantially parallel to one other so as to be substantially aligned with a respective transport openings 1180C, 1180H and 1180D, 1180G. The drive lines can be in any suitable pattern (such as arced or curved segments with constant or varying radii) and orientation and the description that follows is for exemplary purposes. The electromagnets 1700A-1700N (illustrated in Fig.3A but not numbered for clarity of the figure) provide for at least linear propulsion of the wafer handlers 1500A, 1500B through the transport openings 1180A-1180H. The array of electromagnets 1700 may include rotational electromagnet sub-arrays 1231-1234 that effect, under control of controller 199, with the electromagnets that form the drive lines 177-180 the rotation of the wafer handlers 1500A, 1500B about the common axis of rotation 1277 although, the electromagnets may form a dense enoughAtty. Docket No.390P017137-WO (EQV) / Br3085 and large enough grid without being specifically designated for propulsion or rotation and can perform that function based on the transport support’s 1510 position and the control law of the controller 199. While the wafer handlers 1500A, 1500B may rotate about the common axis of rotation 1277 at the same time, extension and retraction of the wafer handler 1500A, 1500B may be independent of extension and retraction of the other one of the wafer handler 1500A, 1500B. In general, the motion of the wafer handler 1500A, 1500B is independent of each other and the complexity of that motion can range from one degree of freedom to six degrees of freedom.

[0060] Referring now to Figs. 1-6, 11A, 11B, 12A-12C, and 14A-14F, the substrate transport apparatus or linear electrical machine 1599 (or transport apparatus illustrated in Figs. 14A-14F that may be provided in the transport chamber 118) will be described in greater detail (again noting that the electrical machine 1599R is substantially similar to the linear electrical machine 1599). Generally, the linear electrical machine 1599 includes a structure (e.g., wafer handler) 1500 without magnets and without any moving parts such as bearings, revolute or prismatic joints, metal bands, pulleys, steel cables or belts. As noted above, the wafer handler 1500 includes the transport support 1510 and at least one end effector 1520, 1520D.

[0061] The transport support 1510 is formed of a paramagnetic material, diamagnetic material, or a non-magnetic conductive material. The transport support 1510 may have any suitable shape and size (such as, for example, described in United States patent number 11,476,139 issued on October 18, 2022, United States patent application number 18 / 050,300 filed on October 27, 2022 and published as United States pre-grant publication number 2023 / 0143307, and United States Provisional Patent Application number 63 / 597,250 filed on November 8, 2023 with Attorney Docket No.390P017053-US (-#1), the disclosures of which were previously incorporated herein by reference in their entireties) for cooperating with the electromagnets 1700A-1700n of the array of electromagnets 1700 so as to stably transport substrates S in the manner described herein. Referring to Figs.12A and 12B the transport support 1510 may include a balance ballast weight or mass damper 1510W (e.g., a counter-balance weight or inertial / mass damper – see Fig. 12A) that at least coupled to the selectably variable tune suspension system 1510S so that the massAtty. Docket No.390P017137-WO (EQV) / Br3085 damper 1510W attenuates dynamic coupling response of the substrate holding station SHS (e.g., about a principal axis, e.g., one or more pivot axis about a respective one of the radial, tangential, and / or Z axes, and / or the radial, tangential and / or Z axes) from disturbance inputs (e.g., excitations) imparted via the variable tune suspension system 1510S. The mass damper 1510W may balance the wafer handler 1500 with respect to the end effector 1520 that is cantilevered from the transport support 1510. The mass damper 1510W may be provided to maintain a center of gravity of the wafer handler 1500 at a desirable location to ensure motion stability (i.e., the mass damper is configured so as to place a motion handler center of gravity at a predetermined location of the wafer handler 1500 to provide motion stability to the wafer handler 1500). The transport support 1510 may not have the balance ballast weight 1510W (see Fig.12B), such as where the wafer handler 1500 is maintained “level” with respect to the wafer transport plane 1290 through differential levitation forces applied to the transport support 1510 by the array of electromagnets or actuators 1700A-1700n in a manner such as described in United States Provisional Patent Application number 63 / 597,250 filed on November 8, 2023 with Attorney Docket No. 390P017053-US (-#1), the disclosure of which was previously incorporated herein by reference in its entirety. Such as where the end effector is a double sided end effector 1520D, the balance ballast weight may or may not be provided as balance of the wafer handler is substantially provided by the symmetry of the double sided end effector 1520D. Forces may be generated by the array of electromagnets or actuators 1700A-1700n to maintain a wafer S held on the end effector 1520, 1520P (and / or the end effector 1520, 1520P) substantially parallel with the wafer transport plane 1290 for picking and placing the wafer S.

[0062] The end-effector 1520, 1520D may be substantially similar to conventional end effectors and, as described herein, the end effector is coupled to the transport support 1510. As an example, the end effector may be a single sided / ended (see end effector 1520) with a single substrate holding location 1520A (e.g., one substrate holding station), a double sided / ended (see end effector 1520D) with two longitudinally spaced apart substrate holding locations 1520A, 1520B (e.g., two substrate holding stations), a side-by-side configuration where multiple substrate holding locations areAtty. Docket No.390P017137-WO (EQV) / Br3085 arranged side-by-side (e.g., laterally spaced apart) and supported from a common transport support so as to extend through side-by-side substrate transport openings, a stacked configuration were multiple substrate holding locations are arranged in a stack one above the other and supported from a common transport support so as to extend through vertically arrayed substrate transport openings although, the end effector may have any suitable configuration. The end effector 1520, 1520D may be made of materials that can one or more of withstand high temperatures, have low mass density, have low thermal expansion, have low thermal conductivity and have low outgassing. A suitable material from which the end effector 1520, 1520D may be constructed is Alumina Oxide (A12O3), although any suitable material may be used.

[0063] The end-effector 1520, 1520D is coupled to the transport support 1510 at least by a resilient mechanical suspension or energy dissipation system 1510S (also referred to herein as a selectably variable tune suspension system or resilient suspension system). As described herein, the resilient mechanical suspension system 1510S intervenes between and isolates the substrate holder station SHS from the transport support 1510, 1510A. As noted herein, where the transport support 1510A includes an arm linkage, the selectably variable suspension system intervenes between and isolates (in a manner similar to that described with respect to transport support 1510) the substrate holding station SHS from each link (and each joint, i.e. the suspension system is distal from each joint and link) of the arm linkage (see Figs.14A-14F, where for example the resilient mechanical suspension couples the end effector 1520 to the arm link most proximate to the end effector or to a wrist plate).

[0064] The resilient mechanical suspension system 1510S may include, for example any suitable passive damper(s) including, but not limited to one or more wire rope vibration insulators 1510SS (also referred to as a wire rope vibration isolator) so as to set the end-effector 1520, 1520D at a suitable nominal height H2 relative to, for example, the level reference plane 1299. Suitable examples of wire rope vibration insulators that may be employed with the present disclosure include, but are not limited to, those provided by ITT Enidine Inc. of Orchard Park, New York, United States. The resilient mechanical suspension system 1510S may include coil springs 1510SC, torsion resilient elements 1510ST (e.g., beams, rods, wires, etc.), flexible bellowsAtty. Docket No.390P017137-WO (EQV) / Br3085 1510FB, or rubber mounts 1510RM so as to set the end-effector 1520, 1520D at a suitable nominal height H2 relative to, for example, the level reference plane 1299. The resilient mechanical suspension system 1510S may include any combination of wire rope vibration insulators 1510SS, coil springs 1510SC, torsion resilient elements 1510ST (e.g., beams, rods, wires, etc.), flexible bellows 1510FB, and / or rubber mounts 1510RM. The resilient mechanical suspension 1510S may be configured as an active damper.

[0065] The resilient mechanical suspension 1510S may include one or more bellows 17000 (see Fig.17) so as to isolate or otherwise prevent exposure of the resilient mechanical suspension 1510S to a vacuum or corrosive environment. The bellows may substantially prevent outgassing of the resilient mechanical suspension 1510S components and / or release of particles generated by the resilient mechanical suspension 1510S into the environment in which the wafer handler 1500 operates. For example, each of the wire rope vibration insulators 1510SS (and / or coil springs 1510SC, torsion resilient elements 1510ST (e.g., beams, rods, wires, etc.), flexible bellows 1510FB, and / or rubber mounts 1510RM) is encapsulated between the reaction platen 1510P and the end effector 1520 by the bellows 17000. The bellows 1700 is constructed of any suitable material compatible (so as to not outgass and / or generate particles) with the environment in which it is used.

[0066] The resilient mechanical suspension 1510S may include one or more dampers 17010 (see Fig.17) that is / are employed in parallel with the wire rope vibration insulators 1510SS, coil springs 1510SC, torsion resilient elements 1510ST, flexible bellows 1510FB, and / or rubber mounts 1510RM. The dampers 17010 may be any suitable dampers including, but not limited to hydraulic dampers, gas dampers, gas-hydraulic dampers, mechanical dampers, and any suitable combination thereof. The dampers 17010 may be disposed alongside the wire rope vibration insulators 1510SS, coil springs 1510SC, torsion resilient elements 1510ST, flexible bellows 1510FB, and / or rubber mounts 1510RM. The dampers may be disposed within the wire rope vibration insulators 1510SS, coil springs 1510SC, torsion resilient elements 1510ST, flexible bellows 1510FB, and / or rubber mounts 1510RM. Fig.17 illustrates a schematic non-limiting example where the damper 17010Atty. Docket No.390P017137-WO (EQV) / Br3085 is disposed within (e.g., surrounded by) a resilient member (such as one of the wire rope vibration insulators 1510SS, coil springs 1510SC, torsion resilient elements 1510ST, flexible bellows 1510FB, and / or rubber mounts 1510RM) in what may be referred to as a suspension-over-damper configuration, where the suspension element (i.e., the wire rope vibration insulators 1510SS, coil springs 1510SC, torsion resilient elements 1510ST, flexible bellows 1510FB, and / or rubber mounts 1510RM) is co-located with the damper 17010 (e.g., in a manner similar to that of a coil- over car suspension) so as to share the same / common mounting locations. In a manner similar to that noted above, the suspension-over-damper configuration may be encapsulated by the bellows 17000.

[0067] The resilient mechanical suspension 1510S is constructed for employment in the vacuum and / or atmospheric environment(s) in which the wafer handler 1500 operates. The resilient mechanical suspension 1510S modulates each disturbance input imparted from the coupling of the base 118M and transport support 1510, 1510A. The resilient mechanical suspension 1510S may be tuned to mitigate or substantially eliminate excitation frequencies (such as one or more of those excitation frequencies described herein) induced to the wafer handler 1500, such as at the substrate holder station SHS, from dynamic levitation impulses (or where dynamic levitation is not employed, impulses induced by rotary / linear joints and any suitable drive motors). For example, a tune variance of the resilient mechanical suspension is selectable in at least one rotational degree of freedom (roll, pitch, and / or yaw) and in at least one linear degree of freedom (e.g., linear movement in the X-Y plane or in the Z direction - see, e.g., Fig. 1). The tune variance is substantially independently selectable in at least one rotational degree of freedom (roll, pitch, and / or yaw) from at least another rotational degree of freedom (roll, pitch, and / or yaw), and in at least one linear degree of freedom ((e.g., linear movement in the X-Y plane or in the Z direction) from at least another linear degree of freedom (e.g., linear movement in the X-Y plane or in the Z direction). The tuning (or selecting the tune variance) of the resilient mechanical suspension 1510S (e.g., in one or more principal axes such as one or more pivot axis about a respective one of the radial, tangential, and / or Z axes, and / or the radial, tangential and / or Z axes) may be effectedAtty. Docket No.390P017137-WO (EQV) / Br3085 in any suitable manner where a frequency response of the wire rope insulators 1510SS (or any other suitable vibration insulators including but not limited to the coil springs 1510SC, torsion resilient elements 1510ST (e.g., beams, rods, wires, etc.), flexible bellows 1510FB, and rubber mounts 1510RM) is set so as to be in opposition to excitation frequencies induced by levitation of the wafer handler 1500 such as by one or more of: varying a stiffness of one or more of the wire rope insulators 1510SS relative to other wire rope insulators 1510SS (or the coil springs 1510SC, the torsion resilient elements 1510ST, the flexible bellows 1510FB, and / or the rubber mounts 1510RM), varying a stiffness of one or more of the wire rope insulators 1510SS (or the coil springs 1510SC, the torsion resilient elements 1510ST, the flexible bellows 1510FB, and / or the rubber mounts 1510RM) depending on a location of the one or more wire rope insulators 1510SS (or the coil springs 1510SC, the torsion resilient elements 1510ST, the flexible bellows 1510FB, and / or the rubber mounts 1510RM) on the wafer handler 1500, and varying a mounting orientation of one or more wire rope insulators 1500SS (or the coil springs 1510SC, the torsion resilient elements 1510ST, the flexible bellows 1510FB, and / or the rubber mounts 1510RM).

[0068] For exemplary purposes only, each wire rope vibration insulator 1510SS (see Fig.12C) of the resilient mechanical suspension 1510S includes a top mounting plate or bar TMP, a bottom mounting plate or bar BMP, and one or more wire rope elements WRE coupling the top mounting plate TMP to the bottom mounting plate BMP so as to provide the wire rope vibration insulator 1510SS with a predetermined spring constant Ks (the terms “top” and “bottom” being used here for exemplary purposes only and any other suitable spatial identifiers may be employed to describe mounting plates TMP, BMP). The top mounting plate TMP is coupled to the end effector 1520, 1520P in any suitable manner (such as with suitable fasteners) and the bottom mounting plate BMP is coupled to the transport support 1510 in any suitable manner (such as with fasteners) so as to couple the end effector 1520, 1520P to the transport support 1510. For exemplary purposes, the end effector 1520, 1520P is coupled to the transport support with four wire rope vibration insulators 1510SS1-1510SS4 (see Figs.11A, 12D and 12E; see also Figs.12A and 12B) although, more or less than four wire rope vibration insulators 1510SS may be employed. The other resilientAtty. Docket No.390P017137-WO (EQV) / Br3085 mechanical suspension 1510S members may be coupled to the transport support 1510 and end effector 1520 in a similar manner to that described above, or in any other suitable manner.

[0069] It is noted that the resilient mechanical suspension 1510S has a low weight so as to be negligible with respect to the levitation and balance of the wafer handler 1500, 1500A, 1500B. For exemplary purposes only, the four wire rope vibration insulators 1510SS1-1510SS4 may have a total weight of about 30g or less, where the wafer handler 1500 with single end effector 1520 has a total weight of about 6.4 Kg, with the end effector 1520 weighing about 3.6 Kg, with a pan offset (e.g., reach extending beyond the transport support 1510) of about 448 mm and a total length (from the tip of the end effector tines to the opposite end of the transport support 1510) of about 1053 mm (see Figs. 12A-12C). The wafer handler 1500 may have any suitable dimensions and weight.

[0070] The wafer handler 1500, as described herein, is moved in space (in at least three degrees of freedom) using any suitable electrodynamic levitation principles (although as noted, the present disclosure may be applied to any suitable levitation principles). The actuation elements (e.g., the array of electromagnets 1700), as shown in, for example, Fig.5 include independently controlled coils or electromagnetics 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 (also referred to herein as coil segments) that generate desired magnetic field that induces thrust and lift force vectors in the transport support 1510. The independently controlled coils or electromagnetics 1700A-1700n, 1700A1-1700n1, 1700A2- 1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 may effect self-deterministic absolute wafer handler position feedback for each wafer handler(s) 1500 as described in for example, as described in United States patent application number 18 / 050,300, previously incorporated herein by reference in its entirety.

[0071] In accordance with the present disclosure, and referring to Figs.5, 6, and 7, the controller 199 is operably coupled to the array of electromagnets 1700 and the alternating current power source 1585 and configured to sequentially excite the electromagnets 1700A-1700n, 1700A1-Atty. Docket No.390P017137-WO (EQV) / Br3085 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 with multiphase alternating current with a predetermined excitation characteristic (such as, e.g., inductance, a phase lag / amplitude, and / or power factor) so that each reaction platen 1510P or transport support 1510 (of the wafer handler 1500) is levitated and propelled with up to six degrees of freedom. The array of electromagnets 1700 is configured to produce levitation and propulsion forces that drive, under control of controller 199, the wafer handler 1500 along a predetermined trajectory. The controller 199 may be configured so as to determine reaction platen position feedback, in at least one degree of freedom from the up to six degrees of freedom, in any suitable manner. The controller 199 may be configured to determine reaction platen (wafer handler) position feedback (i.e., referred to herein as a position feedback signal PFBS) from one or more of a variance in a predetermined excitation characteristic (e.g., changes in inductance, impedance, phase lag / amplitude, and / or power factor signature) of the alternating current of at least one electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 effecting levitation or propulsion of the transport support 1510 (as described in United States patent application number 18 / 050,300, previously incorporated herein by reference in its entirety), The processing apparatus 100, 200, 300, 400 may include a vision system VS coupled to (or forming part of) the controller 199 where the vision system VS is configured to track movement of the reaction platen and / or substrate holder station SHS (e.g., of a respective wafer handler 1500, 1500A, 1500B - see also Figs.1, 6, and 12) and form at least a portion of a position feedback loop providing the position feedback signal PFBS to the controller 199.

[0072] Still referring to Figs. 5, 6 and also to Figs. 9 and 10B, as described herein, the linear electric machine 1599 includes a matrix of independently controlled electromagnets or coil actuators 1700A-1700n, that when energized induce a magnetic levitation field on a predetermined one or more of the wafer handler 1500. To control all six degrees of freedom of the wafer handler 1500 a determination is made, such as by master controller 199 and based on a position of a respective wafer handler 1500, 1500A, 1500B (such position being determined by the vision system VS and / or the variance in the predetermined excitation characteristic), as to which coilAtty. Docket No.390P017137-WO (EQV) / Br3085 actuators 1700A-1700n can contribute to forces and moments on wafer handler 1500 where these determined coil actuators 1700A-1700n are energized to generate desired propulsion and levitation forces on the wafer handler 1500 that produce a desired motion path of the wafer handler 1500.

[0073] The master controller 199 is programmed or otherwise configured to determine kinematic motion of the transport support 1510 from an initial substrate handler pose to a final substrate handler pose. The master controller 199 is also programmed or otherwise configured to determine the kinematics of attitude / yaw control (in three degrees of freedom – pitch, roll, and yaw) related to the determined kinematic motion. The kinematic motion and kinematics of attitude / yaw (i.e., control variable values) may be determined, using, for example, one or more of a dynamic model and a form factor in combination with a predetermined substrate processing recipe (e.g., where and when the substrate is to be transferred and what process is to be performed on the substrate) in a manner substantially similar to that described in United States patent application number 18 / 050,300 previously incorporated by reference herein in its entirety. The kinematic motion and kinematics of attitude / yaw (i.e., the control variable values) may be determined, using, for example, a neural network 199N in combination with a predetermined substrate processing recipe (e.g., the substrate processing recipe defining where and when the substrate is to be transferred and what process is to be performed on the substrate).

[0074] Fig.9 illustrates a distributed network of drive or coil controllers 1750A-1750n where each coil controller 1750A-1750n is communicably coupled (e.g., through a wired or wireless connection) to a respective matrix or group of coil actuators 1700G1-1700Gn. Each (or all) of the coil controllers 1750A-1750n (and the vision system VS) are communicably coupled (e.g., through any suitable wired or wireless connection) to the master controller 199 through, for example, the data network (which may be any suitable wired or wireless network, including but not limited to EtherCAT). Power is provided to each coil controller 1750A-1750n and the master controller 199 in any suitable manner, such as by independent power lines or by power transmitted through the data network cable (such as, or in a manner similar to, power over Ethernet). The master controller 199 may be configured as described below with respect to Figs.10A and 10B.Atty. Docket No.390P017137-WO (EQV) / Br3085

[0075] For exemplary purposes only, Fig.9 illustrates two wafer handlers 1500A, 1500B that may be simultaneously controlled with any suitable control algorithm (such as of the master controller 199) which configures the master controller 199 to send commands to each of the coil controllers 1750A-1750n. The coil controllers 1750A-1750n employ the commands to effect generation of the desired forces and moments on each wafer handler 1500A, 1500B so that the wafer handlers 1500A, 1500B travel along a desired motion path in space (i.e., within the transport chamber 118). The data network traffic propagates in a deterministic real time execution where the data network traffic is collected and processed (such as described with respect to Figs. 10A and 10B) within tight execution time constraints (such as at about 1KHz or faster) in order to maintain stability of each wafer handler 1500A, 1500B motion in space.

[0076] Fig. 10A illustrates one example of a motion control architecture operating in the data network. The master controller 199 includes a processor and operating system that configure the controller 199 (e.g., with any suitable non-transitory computer program code) to effect (or run thereon) a deterministic position feedback control loop PFBL at a sampling rate (e.g., such as 1 KHz although, the sampling rate may be greater or less than 1 KHz) that is fast enough to be able to control the motion of the levitating wafer handlers 1500, 1500A, 1500B. The controller 199 includes a path planning module PPM that is configured to define a set of desired trajectories for each of the levitating wafer handlers 1500A, 1500B. The controller 199 may include a path planning module similar to that described in United States patent application number 18 / 050,300 filed on October 27, 2022, the disclosure of which was previously incorporated herein by reference in its entirety. For example, the local drive controller 1750A-1750n (or the controller 199, such as where the local drive controller 1750A-1750n conveys the voltage and current to the controller 199 for position determination) are configured with any suitable strategy for position determination of the wafer handler(s) 1500 within the transport chamber 118.

[0077] A position feedback signal PFBS (e.g., obtained in the manner described herein), of the position feedback control loop PFBL, is received by or generated by the controller 199, where the position feedback signal PFBS includes or otherwise embodies a six degree of freedom vector forAtty. Docket No.390P017137-WO (EQV) / Br3085 each levitating wafer handler 1500A, 1500B. The controller 199 also includes a control law module CLM that is configured to receive the actual trajectories (e.g., from position feedback) and desired trajectories of the wafer handlers 1500A, 1500B and calculate (or otherwise determine) a set of control signal outputs for each coil actuator 1700A-1700n in the network of coil controllers 1750A-1750n. As an example, the control law of the control law module CLM can be a set of six proportional-Integral-Derivative (PID) control equations associated with the tracking errors of each degree of freedom (e.g., such as X, Y, Z, roll, pitch, and Yaw) respectively of each wafer handler 1500A, 1500B. As an example, for induction based levitation of the wafer handlers 1500 as described herein, the control output variables associated with the respective coil actuators 1700A-1700n may be a desired alternating current amplitude and alternating current phase angle between neighboring coil actuators 1700-1700n or relative to a reference coil actuator of the array of coil actuators 1700. The notation of such variables is illustrated in Fig.10A as Magijkand Phijk, for alternating current (AC) current magnitude and phase angle, respectively.

[0078] As noted herein, the levitation of the wafer handler 1500 by the electromagnets or coil actuators 1700A-1700n induces vibration to the wafer handler 1500. Referring to Figs. 11A, 11B, and 12A-12C the levitation of the wafer handler 1500 may be referred to as an electrodynamic suspension (although any suitable non-contact suspension may be effected) which electrodynamic suspension has what may be referred to as a spring constant KEDbetween the coil actuators 1700A- 1700n and the transport support 1510. The coupling between the end effector 1520, 1520D and the transport support 1510 (such as by the resilient mechanical suspension 1510S) has spring constant Ks.

[0079] For a wafer handler similar to the wafer handler 1500 illustrated in Figs.12A an exemplary un-damped (i.e., without employment of the resilient mechanical suspension 1510S and with the single-ended end effector 1520, rigidly coupled to the transport support 1510) vibratory frequency response to levitation excitation of the transport support 1510 and end effector 1520 (such as with the levitation excitation force model illustrated in Fig.12) is illustrated in Fig.13A (plotting wafer handler / end effector acceleration vs. time). As illustrated in Fig. 13A, the acceleration (e.g.,Atty. Docket No.390P017137-WO (EQV) / Br3085 vibration) of the transport support induced by levitation excitation is about 2.5g. The acceleration of the end effector 1520 (at the substrate holding holder SHS or each substrate holder station SHS of the double-ended end effector 1520D) induced by the levitation excitation is about 0.4g in the Z direction.

[0080] It is noted that the un-damped response exhibits three harmonics, those harmonics being at 2.7Hz (of the levitation “spring” (e.g., KED) and wafer handler 1500), at 20Hz (of the end effector to transport support coupling stiffness and the end effector assembly), and at 160Hz (of the levitation excitation). The present disclosure addresses at least the 20Hz harmonic at the end effector substrate holder station SHS, noting that responses at the 2.7Hz harmonic at the substrate holder station SHS may be addressed in any suitable manner such as by a levitation closed loop control of the electromagnets or coil actuators 1700A-1700n (such as described in United States Provisional Patent Application numbers 63 / 597,250 filed on November 8, 2023 with Attorney Docket No.390P017053-US (-#1), the disclosure of which is incorporated herein by reference in its entirety). The response at the 160Hz harmonic (e.g., referred to as residual vibration) at the end effector substrate holder station SHS may be considered negligible (e.g., such where the residual vibration is less than or equal to about + / - 0.05g) or addressed in any suitable manner. The resilient mechanical suspension 1510S may be tuned (as noted herein) to mitigate or substantially eliminate frequency response(s) at the substrate holder station SHS of the end effector 1520, 1520D resulting from one or more of the 2.7Hz, 20Hz, and 160Hz excitation frequencies.

[0081] For the wafer handler 1500 illustrated in Figs. 12A an exemplary damped (i.e., with employment of the resilient mechanical suspension 1510S coupling the end effector 1520 to the transport support 1510) vibratory frequency response to levitation excitation of the transport support 1510 and end effector 1520 (such as with the levitation excitation force model illustrated in Fig.12) is illustrated in Fig.13B (plotting wafer handler / end effector acceleration vs. time). As illustrated in Fig. 13B, the acceleration (e.g., vibration) of the transport support induced by levitation excitation remains at about 2.5g; however, the acceleration of the end effector 1520 (at the substrate holder station SHS, or each substrate holder station SHS of the double-ended endAtty. Docket No.390P017137-WO (EQV) / Br3085 effector 1520D) induced by the levitation excitation is reduced from the about 0.4g to about 0.1g in the Z direction with the residual vibration at about 0.03g (less than about + / - 0.015g). While not illustrated in Fig.13B it is noted that radial acceleration of the end effector 1520, 1520D at the wafer holder station SHS with employment of the resilient mechanical suspension 1510S is less than about 0.05g and tangential acceleration of the end effector 1520, 1520D at the wafer holder station SHS with employment of the resilient mechanical suspension 1510S is less than about 0.05g.

[0082] Referring to Figs.1-6, 11A, 11B, 12A-12C, and 14A-14F and 15, an exemplary method will be described. The method includes providing a substrate transport apparatus 1599, 210, 210A, 214, 216, 217, 218 (such as those described herein) (Fig.15, Block 1500) having a base 118M, a transport support 1510, 1510A, and a selectably variable tune suspension system 1510S. The transport support 1510, 1510A is movably coupled to the base 118M so as to move with at least one degree of freedom (as described herein) relative to the base 118M. An end effector 1520 is joined to the transport support 1510, 1510A, where the end effector 1520 has a substrate holder station SHS thereon configured so as to hold a substrate S on the end effector 1520. The selectably variable tune suspension system 1510S intervenes (as described herein) between and isolates the substrate holder station SHS from the transport support 1510, 1510A. The method further includes selecting a tune variance (as described herein) (Fig. 15, Block 1510), of the selectably variable tune suspension system 1510S, to specifically and uniquely correspond to a unique dynamic response characteristic of each unique substrate holder station SHS of each discrete substrate transport apparatus installation.

[0083] In accordance with the present disclosure, the method of Fig.15 may include one or more of (individually or in any combination thereof): the selectably variable tune suspension system 1510S holding the substrate holder station SHS from the transport support 1510, 1510A so that the substrate holder station SHS resiles with six degrees of freedom (as described herein) as a unit relative to the base 118M; the selectably variable tune suspension system 1510S modulates each disturbance input imparted from the coupling of the base 118M and transport support 1510, 1510AAtty. Docket No.390P017137-WO (EQV) / Br3085 (as described herein); the tune variance is selectable in at least one rotational degree of freedom (e.g., yaw, pitch, and / or roll) and in at least one linear degree of freedom (e.g., a linear direction in the X-Y plane and / or Z direction); tune variance is substantially independently selectable in at least one rotational degree of freedom (e.g., yaw, pitch, and / or roll) from at least another rotational degree of freedom (e.g., yaw, pitch, and / or roll), and in at least one linear degree of freedom (e.g., in the X-Y plane and / or Z direction) from at least another linear degree of freedom ((e.g., in the X-Y plane and / or Z direction)); the selectably variable tune suspension system comprises wire rope suspension elements 1510SS, coil springs 1510SC, torsion resilient elements 1510ST, cantilever beams 1510CB, membranes 1510M, metal bands 1510MB, and / or a flexible apparatus 1510FA that is characterized by a spring constant with a damper element; a mass damper 1510W is coupled to the selectably variable tune suspension system 1510S so that the mass damper 1510W attenuates dynamic coupling response of the substrate holding station SHS from disturbance inputs imparted via the variable tune suspension system 1510S; the transport support 1510 is an electrical dynamic levitation platen 1510P levitated from the base 118M; the selectably variable suspension system intervenes between and one or more of isolates the substrate holding station SHS from levitation excitations imparted by the base 118M to the substrate holding station SHS and protects or isolates a substrate S held on the substrate holding station SHS from mechanical shock (such as from a loss of levitation power or any other potential impact) imparted to the transport support 1510, 1510A; the transport support 1510A is an arm linkage configured to extend and retract so as to traverse the end effector 1520 with the substrate holding station SHS; and / or the selectably variable suspension system 1510S intervenes between and isolates the substrate holding station SHS from each link of the arm linkage.

[0084] Referring to Figs. 1-6, 11A, 11B, 12A-12C, and 14A-14F and 16, an exemplary method will be described. The method includes providing a substrate transport apparatus 1599, 210, 210A, 214, 216, 217, 218 (such as those described herein) (Fig.16, Block 1600) having a base 118M, a transport support 1510, 1510A, and a resilient suspension system 1510S. The transport support 1510, 1510A is movably coupled to the base 118M so as to move with at least one degree ofAtty. Docket No.390P017137-WO (EQV) / Br3085 freedom (as described herein) relative to the base 118M. An end effector 1520 is joined to the transport support 1510, 1510A, where the end effector 1520 has a substrate holder station SHS thereon configured so as to hold a substrate S on the end effector 1520. The resilient suspension system 1510S intervenes between and isolates the substrate holder station SHS from the transport support 1510, 1510A. The method further includes arranging multiple discrete mounts (e.g., such as the wire rope suspension elements 1510SS, coil springs 1510SC, torsion resilient elements 1510ST, cantilever beams 1510CB, membranes 1510M, metal bands 1510MB, and / or a flexible apparatus 1510FA that is characterized by a spring constant with a damper element) of the resilient suspension system 1510S (Fig.16, Block 1610) in parallel so that resilient mount action, of each respective resilient mount, in parallel with each other isolate the substrate holder station SHS from the substrate support 1510, 1510A. Each respective resilient mount is separate and distinct from each other operating in parallel on the substrate holder station SHS so that the substrate holder station SHS is common to each resilient mount of the resilient suspension system 1510S.

[0085] In accordance with the present disclosure, the method of Fig.16 may include one or more of (individually or in any combination thereof): the resilient suspension system 1510S holding the substrate holder station SHS from the transport support 1510, 1510A so that the substrate holder station SHS resiles with six degrees of freedom as a unit relative to the base 118M; the resilient suspension system 1510S modulates each disturbance input imparted from the coupling of the base 118M and transport support 1510, 1510A; the resilient suspension system comprises wire rope suspension elements 1510SS, coil springs 1510SC, torsion resilient elements 1510ST, cantilever beams 1510CB, membranes 1510M, metal bands 1510MB, and / or a flexible apparatus 1510FA that is characterized by a spring constant with a damper element; a mass damper 1510W is coupled to the resilient suspension system 1510S so that the mass damper 1510W attenuates dynamic coupling response of the substrate holding station SHS from disturbance inputs imparted via the resilient suspension system 1510S; the transport support 1510 is an electrical dynamic levitation platen 1510P levitated from the base 118M; the resilient suspension system 1510S intervenes between and one or more of isolates the substrate holding station SHS from levitation excitationsAtty. Docket No.390P017137-WO (EQV) / Br3085 imparted by the base 118M to the substrate holding station SHS and protects or isolates a substrate S held on the substrate holding station SHS from mechanical shock (such as from a loss of levitation power or any other potential impact) imparted to the transport support 1510, 1510A; the transport support 1510A is an arm linkage configured to extend and retract so as to traverse the end effector 1520 with the substrate holding station SHS; and the resilient suspension system 1510S intervenes between and isolates the substrate holding station SHS from each link of the arm linkage.

[0086] The following are provided in accordance with the present disclosure and may be employed individually, in any combination with each other, and / or in any combination with the features described above.

[0087] A substrate transport apparatus includes: a transport chamber; a transport support movably coupled to the transport chamber so as to move with at least one degree of freedom relative to the transport chamber, and an end effector joined to the transport support, the end effector having a substrate holder station thereon configured so as to hold a substrate on the end effector; and a selectably variable tune suspension system that intervenes between and isolates the substrate holder station from the transport support; wherein tune variance, of the selectably variable tune suspension system, is selected to specifically and uniquely correspond to a unique dynamic response characteristic of each unique substrate holder station of each discrete substrate transport apparatus installation.

[0088] The substrate transport apparatus may include one or more of the following, employed individually or in any combination thereof: the selectably variable tune suspension system holds the substrate holder station from the transport support so that the substrate holder station resiles with six degrees of freedom as a unit relative to the transport chamber; the selectably variable tune suspension system modulates each disturbance input imparted from the coupling of the transport chamber and transport support; the tune variance is selectable in at least one rotational degree of freedom and in at least one linear degree of freedom; the tune variance is substantiallyAtty. Docket No.390P017137-WO (EQV) / Br3085 independently selectable in at least one rotational degree of freedom from at least another rotational degree of freedom, and in at least one linear degree of freedom from at least another linear degree of freedom; the selectably variable tune suspension system comprises wire rope suspension elements, coil springs, torsion resilient elements, cantilever beams, membranes, metal bands, and / or a flexible apparatus that is characterized by a spring constant with a damper element; a mass damper is coupled to the selectably variable tune suspension system so that the mass damper attenuates dynamic coupling response of the substrate holding station from disturbance inputs imparted via the variable tune suspension system; the transport support is an electrical dynamic levitation platen levitated from the transport chamber; the selectably variable suspension system intervenes between and one or more of isolates the substrate holding station from levitation excitations imparted by the transport chamber to the substrate holding station and protects or isolates a substrate held on the substrate holding station from mechanical shock imparted to the transport support; the transport support is an arm linkage configured to extend and retract so as to traverse the end effector with the substrate holding station; and the selectably variable suspension system intervenes between and isolates the substrate holding station from each link of the arm linkage.

[0089] A substrate transport apparatus includes: a transport chamber; a transport support movably coupled to the transport chamber so as to move with at least one degree of freedom relative to the transport chamber, and an end effector joined to the transport support, the end effector having a substrate holder station thereon configured so as to hold a substrate on the end effector; and a resilient suspension system that intervenes between and isolates the substrate holder station from the transport support; wherein the resilient suspension system has multiple discrete resilient mounts arranged in parallel so that resilient mount action, of each respective resilient mount, in parallel with each other isolate the substrate holder station from the substrate support, each respective resilient mount being separate and distinct from each other operating in parallel on the substrate holder station so that the substrate holder station is common to each resilient mount of the resilient suspension system.Atty. Docket No.390P017137-WO (EQV) / Br3085

[0090] The substrate transport apparatus may include one or more of the following, employed individually or in any combination thereof: the resilient suspension system holds the substrate holder station from the transport support so that the substrate holder station resiles with six degrees of freedom as a unit relative to the transport chamber; the resilient suspension system modulates each disturbance input imparted from the coupling of the transport chamber and transport support; the resilient suspension system comprises wire rope suspension elements, coil springs, torsion resilient elements, cantilever beams, membranes, metal bands, and / or a flexible apparatus that is characterized by a spring constant with a damper element; a mass damper is coupled to the resilient suspension system so that the mass damper attenuates dynamic coupling response of the substrate holding station from disturbance inputs imparted via the resilient suspension system; the transport support is one of: an electrical dynamic levitation platen levitated from the transport chamber; and an arm linkage configured to extend and retract so as to traverse the end effector with the substrate holding station.

[0091] A method includes: providing a substrate transport apparatus having: a transport chamber; a transport support movably coupled to the transport chamber so as to move with at least one degree of freedom relative to the transport chamber, and an end effector joined to the transport support, the end effector having a substrate holder station thereon configured so as to hold a substrate on the end effector; and a selectably variable tune suspension system that intervenes between and isolates the substrate holder station from the transport support; selecting a tune variance, of the selectably variable tune suspension system, to specifically and uniquely correspond to a unique dynamic response characteristic of each unique substrate holder station of each discrete substrate transport apparatus installation.

[0092] The method may include one or more of the following, employed individually or in any combination thereof: the selectably variable tune suspension system holds the substrate holder station from the transport support so that the substrate holder station resiles with six degrees of freedom as a unit relative to the transport chamber; and the transport support is one of: an electricalAtty. Docket No.390P017137-WO (EQV) / Br3085 dynamic levitation platen levitated from the transport chamber; and an arm linkage configured to extend and retract so as to traverse the end effector with the substrate holding station.

[0093] It should be understood that the foregoing description is only illustrative of the present disclosure. Various alternatives and modifications can be devised by those skilled in the art without departing from the present disclosure. Accordingly, the present disclosure is intended to embrace all such alternatives, modifications and variances that fall within the scope of any claims appended hereto. Further, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be advantageously used, such a combination remaining within the scope of the present disclosure.

[0094] What is claimed is:

Claims

Atty. Docket No.390P017137-WO (EQV) / Br3085 CLAIMS 1. A substrate transport apparatus comprising: a transport chamber; a transport support movably coupled to the transport chamber so as to move with at least one degree of freedom relative to the transport chamber, and an end effector joined to the transport support, the end effector having a substrate holder station thereon configured so as to hold a substrate on the end effector; and a selectably variable tune suspension system that intervenes between and isolates the substrate holder station from the transport support; wherein tune variance, of the selectably variable tune suspension system, is selected to specifically and uniquely correspond to a unique dynamic response characteristic of each unique substrate holder station of each discrete substrate transport apparatus installation.

2. The substrate transport apparatus of claim 1, wherein the selectably variable tune suspension system holds the substrate holder station from the transport support so that the substrate holder station resiles with six degrees of freedom as a unit relative to the transport chamber.

3. The substrate transport apparatus of claim 1, wherein the selectably variable tune suspension system modulates each disturbance input imparted from the coupling of the transport chamber and transport support.

4. The substrate transport apparatus of claim 1, wherein the tune variance is selectable in at least one rotational degree of freedom and in at least one linear degree of freedom.

5. The substrate transport apparatus of claim 1, wherein the tune variance is substantially independently selectable in at least one rotational degree of freedom from at least another rotationalAtty. Docket No.390P017137-WO (EQV) / Br3085 degree of freedom, and in at least one linear degree of freedom from at least another linear degree of freedom.

6. The substrate transport apparatus of claim 1, wherein the selectably variable tune suspension system comprises wire rope suspension elements, or coil springs, or torsion resilient elements, or cantilever beams, or membranes, or metal bands, or a flexible apparatus that is characterized by a spring constant with a damper element.

7. The substrate transport apparatus of claim 1, further comprising a mass damper coupled to the selectably variable tune suspension system so that the mass damper attenuates dynamic coupling response of the substrate holding station from disturbance inputs imparted via the variable tune suspension system.

8. The substrate transport apparatus of claim 1, wherein the transport support is an electrical dynamic levitation platen levitated from the transport chamber.

9. The substrate transport apparatus of claim 8, wherein the selectably variable suspension system intervenes between and one or more of isolates the substrate holding station from levitation excitations imparted by the transport chamber to the substrate holding station and protects or isolates a substrate held on the substrate holding station from mechanical shock imparted to the transport support.

10. The substrate transport apparatus of claim 1, wherein the transport support is an arm linkage configured to extend and retract so as to traverse the end effector with the substrate holding station.

11. The substrate transport apparatus of claim 10, wherein the selectably variable suspension system intervenes between and isolates the substrate holding station from each link of the arm linkage.

12. A substrate transport apparatus comprising:Atty. Docket No.390P017137-WO (EQV) / Br3085 a transport chamber; a transport support movably coupled to the transport chamber so as to move with at least one degree of freedom relative to the transport chamber, and an end effector joined to the transport support, the end effector having a substrate holder station thereon configured so as to hold a substrate on the end effector; and a resilient suspension system that intervenes between and isolates the substrate holder station from the transport support; wherein the resilient suspension system has multiple discrete resilient mounts arranged in parallel so that resilient mount action, of each respective resilient mount, in parallel with each other isolate the substrate holder station from the substrate support, each respective resilient mount being separate and distinct from each other operating in parallel on the substrate holder station so that the substrate holder station is common to each resilient mount of the resilient suspension system.

13. The substrate transport apparatus of claim 12, wherein the resilient suspension system holds the substrate holder station from the transport support so that the substrate holder station resiles with six degrees of freedom as a unit relative to the transport chamber.

14. The substrate transport apparatus of claim 12, wherein the resilient suspension system modulates each disturbance input imparted from the coupling of the transport chamber and transport support.

15. The substrate transport apparatus of claim 12, wherein the resilient suspension system comprises wire rope suspension elements, or coil springs, or torsion resilient elements, or cantilever beams, or membranes, or metal bands, or a flexible apparatus that is characterized by a spring constant with a damper element.

16. The substrate transport apparatus of claim 12, further comprising a mass damper coupled to the resilient suspension system so that the mass damper attenuates dynamic coupling responseAtty. Docket No.390P017137-WO (EQV) / Br3085 of the substrate holding station from disturbance inputs imparted via the resilient suspension system.

17. The substrate transport apparatus of claim 12, wherein the transport support is one of: an electrical dynamic levitation platen levitated from the transport chamber; and an arm linkage configured to extend and retract so as to traverse the end effector with the substrate holding station.

18. A method comprising: providing a substrate transport apparatus having: a transport chamber; a transport support movably coupled to the transport chamber so as to move with at least one degree of freedom relative to the transport chamber, and an end effector joined to the transport support, the end effector having a substrate holder station thereon configured so as to hold a substrate on the end effector; and a selectably variable tune suspension system that intervenes between and isolates the substrate holder station from the transport support; selecting a tune variance, of the selectably variable tune suspension system, to specifically and uniquely correspond to a unique dynamic response characteristic of each unique substrate holder station of each discrete substrate transport apparatus installation.

19. The method of claim 18, wherein the selectably variable tune suspension system holds the substrate holder station from the transport support so that the substrate holder station resiles with six degrees of freedom as a unit relative to the transport chamber.Atty. Docket No.390P017137-WO (EQV) / Br3085 20. The method of claim 18, wherein the transport support is one of: an electrical dynamic levitation platen levitated from the transport chamber; and an arm linkage configured to extend and retract so as to traverse the end effector with the substrate holding station.

21. The substrate transport apparatus of claim 1, further comprising mass damper disposed on the transport support and configured so as to place center of gravity at a predetermined location of the transport support to provide motion stability to the transport support and end effector joined thereto.

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