Multi-substrate Anti-backside-deposition automatic pick-and-place cavity mechanism

Abstract

A multi-substrate anti-backside-deposition automatic pick-and-place cavity mechanism, relating to the technical field of semiconductor devices, and comprising: a reaction cavity group (10), wherein the reaction cavity group (10) comprises a reaction cavity outer housing (11), one side of the reaction cavity outer housing (11) is provided with a carrier group (20), the carrier group (20) comprises a plurality of carrier discs (21), each carrier disc (21) is provided with lifting through holes (22), and one side of the carrier group (20) is provided with a mechanical claw set; and a lifting driving group (40) and shielding structures, wherein the lifting driving group comprises lifting rods (41) adapted to the lifting through holes (22), and the shielding structures are arranged in the lifting through holes (22). The lifting rods (41) sequentially pass through the lifting through holes (22) of the carrier discs (21), so as to place and pick a plurality of substrates, thereby facilitating an atomic layer deposition reaction of the substrates. The provided shielding structures may shield the lifting through holes (22), thereby avoiding atomic layer deposition attachment at the position on the bottom surface of a substrate close to the lifting through holes (22) during reaction caused by exposure of the lifting through holes (22).

Description

Multi-piece anti-winding plating automatic pick-and-place cavity mechanism

[0001] The present application claims priority to the application No. 202410475198.2 filed on April 19, 2024 with the China Patent Office; the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure belongs to the technical field of semiconductor equipment, and particularly relates to a multi-piece anti-winding plating automatic pick-and-place cavity mechanism. BACKGROUND

[0003] Anti-winding plating, a professional term, refers to preventing atomic deposition of a film on the bottom surface of a base material; in the field of semiconductor equipment, it particularly relates to occasions of simultaneously plating a film on multiple pieces of base material, in order to achieve automatic pick-and-place of the base material, a common structure is to form a relatively large hole in the bottom of a carrier, and then to achieve pick-and-place of the base material by up-and-down movement of a designed lifting column, but the hole formed in the bottom of the carrier is too large, a large number of atomic layers of the precursor are deposited on the bottom surface of the base material, and anti-winding plating cannot be ensured. In order to ensure anti-winding plating and prevent atomic layer deposition on the bottom surface of the base material, a common design is to adopt a fully sealed structure design for the surface of the carrier containing the base material, the bottom surface of the base material is completely attached to the surface of the carrier, and chemical reaction atoms are ensured to be deposited only on the surface of the base material. However, in this case, multiple base materials are placed on the carrier one by one, and a common way is to use a manual method, which is not only time-consuming and inefficient, but also likely to cause offset and damage of the base material when the base material is placed on the carrier wrapped around the base material, which affects the plating film on the surface of the base material, and uneven atomic layer deposition on the surface of the base material and atomic layer deposition on the bottom surface are likely to occur, which is inconvenient to use.

[0004] SUMMARY

[0005] The multi-piece anti-winding plating automatic pick-and-place cavity mechanism provided by the embodiment of the present disclosure comprises: a reaction cavity group, the reaction cavity group comprises a reaction cavity outer box body, a heater is arranged in the reaction cavity outer box body, an inlet is formed in one side of the reaction cavity outer box body, and a reaction cavity outer box door is connected to the other side of the reaction cavity outer box body through a guide driving group; a carrier group is arranged on one side of the reaction cavity outer box door, the carrier group comprises a plurality of carrier discs, the plurality of carrier discs are connected to one side of the reaction cavity outer box door, a placing groove is formed in the upper end of each carrier disc, and the placing groove is configured to place a base material; and

[0006] A lifting driving group is arranged below the carrier group, the lifting driving group comprises a driver and a lifting rod, the output end of the driver is connected to the lifting rod, and a lifting through-hole matched with the lifting rod is formed in the carrier disc;

[0007] One side of the carrier group is provided with a mechanical claw group, which is configured to grab the base material to place the base material on the upper end of the lifting rod;

[0008] A shielding structure is arranged in the lifting through hole, which is configured to shield the lifting through hole and can be opened under the driving of the lifting rod to enable the lifting rod to pass through the lifting through hole. BRIEF DESCRIPTION OF DRAWINGS

[0009] FIG. 1 is a schematic diagram of the overall structure of a multi-piece anti-winding plating automatic pick-and-place cavity mechanism according to an embodiment of the present disclosure;

[0010] FIG. 2 is a side view of a multi-piece anti-winding plating automatic pick-and-place cavity mechanism according to an embodiment of the present disclosure;

[0011] FIG. 3 is a top view of the base material placed inside the placement slot of the carrier disc according to an embodiment of the present disclosure;

[0012] FIG. 4 is a schematic diagram of the installation of the shielding assembly according to an embodiment of the present disclosure;

[0013] FIG. 5 is a cross-sectional view of the installation of the shielding assembly according to an embodiment of the present disclosure;

[0014] FIG. 6 is a top view of the shielding assembly according to an embodiment of the present disclosure;

[0015] FIG. 7 is an enlarged schematic diagram of the carrier disc according to an embodiment of the present disclosure;

[0016] FIG. 8 is a top cross-sectional view of the carrier disc according to an embodiment of the present disclosure;

[0017] FIG. 9 is an enlarged schematic diagram of C in FIG. 8;

[0018] FIG. 10 is a cross-sectional view of the installation of the inclined sliding block one according to an embodiment of the present disclosure;

[0019] FIG. 11 is a cross-sectional view of the installation of the auxiliary limiting stop rod according to an embodiment of the present disclosure;

[0020] FIG. 12 is an enlarged schematic diagram of the lifting rod according to an embodiment of the present disclosure.

[0021] In the figure: 10, reaction cavity group; 11, reaction cavity outer box; 12, reaction cavity outer box door; 20, carrier group; 21, carrier disc; 22, lifting through hole; 23, shielding assembly; 24, connecting seat; 25, lotus-shaped baffle; 30, guide driving group; 31, driving element; 32, guide shaft; 40, lifting driving group; 41, lifting rod; 50, auxiliary limiting stop rod; 51, inclined sliding block one; 52, sliding connecting rod one; 53, piston block one; 54, piston channel; 55, reset spring; 56, piston block two; 57, sliding connecting rod two; 58, inclined sliding block two; 59, inclined sliding block three. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0023] Please refer to FIG. 1-FIG. 6, the disclosed embodiment provides a multi-piece type anti-winding plating automatic taking and placing cavity mechanism, which can include a reaction cavity group 10, a lifting driving group 40 and a shielding structure.

[0024] The reaction cavity group 10 includes a reaction cavity outer box 11, and the inside of the reaction cavity outer box 11 is provided with a heater. The heater can be a general heating device, which can provide the heat required for the precursor chemical reaction.

[0025] In some embodiments, one side of the reaction cavity outer box 11 is provided with an inlet, which is beneficial for the gas flow of the atomic layer deposition adhesion reaction to pass through. The other side of the reaction cavity outer box 11 is connected with a reaction cavity outer box door 12 through a guide driving group 30. The reaction cavity outer box door 12 is provided with a carrier group 20 close to one side of the reaction cavity outer box 11. The carrier group 20 includes a plurality of carrier discs 21 connected to one side of the reaction cavity outer box door 12. The upper end of each carrier disc 21 is provided with a placing groove for placing a substrate material. The substrate material is placed in the placing groove, so that the atomic layer deposition reaction can be realized in the inside of the reaction cavity outer box 11.

[0026] In some embodiments, the lifting driving group 40 is located below the carrier group 20, the lifting driving group 40 comprises a driver and a lifting rod 41, the output end of the driver is connected with the lifting rod 41, the driver is a general device capable of driving the lifting rod 41 to move up and down, the driver is a pneumatic cylinder, etc., which is omitted in the figure, the carrier disc 21 is provided with a lifting through hole 22 matched with the lifting rod 41, which is beneficial to the lifting rod 41 to pass through and lift the base material, the driving device is arranged to drive the lifting rod 41 to move up and down, which is beneficial to the lifting rod 41 to place the base material in the placement groove of the carrier disc 21 or to lift the base material out of the placement groove of the carrier disc 21, which is beneficial to the base material to be placed in place.

[0027] In some embodiments, the carrier group 20 is provided with a mechanical claw group on one side, which is a general automatic grabbing mechanism capable of grabbing the base material and moving, which is not described in detail here and is omitted in the figure, the mechanical claw group can grab the base material and place it on the upper end of the lifting rod 41, which is convenient for the lifting rod 41 to place the base material in the placement groove on the upper end of the carrier disc 21. Of course, the mechanical claw group can also take the base material off the upper end of the lifting rod 41.

[0028] In some embodiments, a shielding structure is arranged in the lifting through hole 22, the shielding structure is configured to shield the lifting through hole 22 and can be opened under the driving of the lifting rod 41 to allow the lifting rod 41 to pass through the lifting through hole 22.

[0029] It can be understood that after the lifting rod 41 is separated from the lifting through hole 22, that is, after the base material is placed in place on the carrier disc 21, the shielding structure arranged at the lifting through hole 22 can shield the place, thereby avoiding the continuous exposure of the lifting through hole 22 to cause the gas flow to enter the base material attached to the bottom surface of the base material from the lifting through hole 22 during the atomic layer deposition reaction.

[0030] Specifically, the shielding structure can be a plurality of shielding pieces arranged at the lifting through hole 22 and having a deformation ability, for example, a plurality of lotus-shaped shielding pieces 25, which can be deformed and gathered in the initial state to shield the lifting through hole 22, and can be deformed and opened under the external force of the lifting rod 41 to open the lifting through hole 22, so as to facilitate the lifting rod 41 to pass through the lifting through hole 22. When the lifting rod 41 leaves the lifting through hole 22, the plurality of lotus-shaped shielding pieces 25 will deform and reset to the gathered state (initial state).

[0031] Of course, the shielding structure can be a driving member in addition to the above structure. The driving member can include a beveled sliding block 51 and a return spring 55 connected to each other. The return spring 55 is arranged in the carrier disc 21 on the side of the lifting through hole 22. Specifically, a mounting groove can be formed on the side wall of the carrier disc 21 at the lifting through hole 22, and the return spring 55 is arranged in the mounting groove. The bottom of the beveled sliding block 51 has a bevel. When the lifting rod 41 does not abut against the beveled sliding block 51, that is, the lifting rod 41 is not arranged in the lifting through hole 22, the beveled sliding block 51 can continuously be located at the lifting through hole 22 under the elastic force of the return spring 55, so as to partially or completely shield the lifting through hole. When the lifting rod 41 abuts against the beveled sliding block 51 and continuously moves upward, the lifting rod 41 forces the beveled sliding block 51 to retract into the mounting groove in the carrier disc 21 due to the design of the bevel at the bottom of the beveled sliding block 51, so as to open the lifting through hole 22, facilitate the lifting rod 41 to pass through the lifting through hole 22, and compress the return spring 55.

[0032] In addition, in order to facilitate the limiting of the return spring 55, the mounting groove can be designed as a mounting groove 1 and a mounting groove 2. The mounting groove 1 is closer to the lifting through hole 22, the cross section of the mounting groove 2 is smaller than that of the mounting groove 1, and the shape of the mounting groove 2 is matched with the return spring 55. In other words, the beveled sliding block 51 is located in the mounting groove 1 after being pressed by the lifting rod 41. When the lifting rod 41 moves away from the lifting through hole 22, the beveled sliding block 51 extends to the lifting through hole 22 under the release force of the return spring 55, so as to shield the lifting through hole 22.

[0033] The specific structure of the shielding structure can be understood with reference to the following related content.

[0034] In some embodiments, the inner cavity of the reaction cavity outer box 11 is provided with an inner cavity body, which can be used for carrying out the plating reaction of the base material and isolating the external environment. The inner cavity body is provided with a heat shield. The heat shield is made of heat-insulating ceramic and has heat-insulating and heat-preserving effects. The heat shield can control the rate of heat loss and reflect the heat reflected outward from the base material back to maintain the heat in the inner cavity body and reduce the heat transferred to the outside of the reaction cavity.

[0035] In some embodiments, the distance between two adjacent groups of carrier plates 21 is equal to ensure uniform precursor gas flow when the inner cavity is coated, and to stabilize the flow field in the inner cavity to ensure uniform coating of the substrate material surface. For example, the lifting holes 22 are arranged in four groups, as shown in FIG. 3, with each two groups located on the front and rear sides of the carrier plate 21, respectively. A portion of the lifting hole 22 penetrates the placement groove, which facilitates the lifting rod 41 to pass through the lifting hole 22, and a portion of the lifting rod 41 can pass through the placement groove and lift the substrate material, and when the lifting rod 41 is lowered, the substrate material can be placed inside the placement groove. Of course, the lifting hole 22 can also be arranged such that each two groups are located on the left and right sides of the carrier plate 21, and is not limited in particular.

[0036] As shown in FIG. 12, in some embodiments, a groove is formed on one side of the upper end of the lifting rod 41 near the placement groove, and one side of the groove is arranged as a straight surface, which facilitates clamping the side edges of the substrate material, i.e., limiting the front and rear sides of the substrate material. The straight surface of the groove and the edge of the placement groove are in the same vertical plane, which facilitates the side edges of the substrate material to be placed inside the groove of the lifting rod 41, and when the lifting rod 41 is lowered, the substrate material is also lowered until the substrate material is placed inside the placement groove.

[0037] As shown in FIGS. 1 and 2, in some embodiments, the guide driving group 30 includes a driving element 31 and a guide shaft 32. The driving element 31 is installed at the corner position near the side of the reaction cavity outer box body 11, and the output end of the driving element 31 is connected with the guide shaft 32. One end of the guide shaft 32 is connected with the corner position of the reaction cavity outer box door 12. During operation, the driving element 31 drives the guide shaft 32 to move, and then the reaction cavity outer box door 12 moves towards the reaction cavity outer box body 11, and then the reaction cavity outer box door 12 drives the carrier plate 21 to move to the inside of the reaction cavity outer box body 11, and the reaction cavity outer box door 12 is closed.

[0038] As shown in FIGS. 4-6, in some embodiments, the shielding structure can be a shielding assembly 23 capable of shielding the lifting through hole 22 to prevent atomic layer deposition on the bottom surface of the substrate material near the position of the lifting through hole 22 during the reaction. The shielding assembly 23 includes a connecting seat 24 and lotus-shaped shielding pieces 25. The connecting seat 24 is bolted to the inside of the lifting through hole 22, and a through hole is formed in the inside of the connecting seat 24 to facilitate the passage of the lifting rod 41. The upper end of the connecting seat 24 is provided with a plurality of groups of lotus-shaped shielding pieces 25 arranged in an array with the central axis of the lifting through hole 22 as the center, thereby enabling the plurality of groups of lotus-shaped shielding pieces 25 to shield the lifting through hole 22 and prevent atomic layer deposition on the bottom surface of the substrate material near the position of the lifting through hole 22 during the reaction. Each of the plurality of groups of lotus-shaped shielding pieces 25 has the ability to deform, i.e., the ability to deform upward, so that when the lifting rod 41 passes through the lifting through hole 22, it can lift the lotus-shaped shielding pieces 25 upward, causing them to deform. When the lifting rod 41 moves away from the lifting through hole 22, the lotus-shaped shielding pieces 25 can return to their original state and re-shield the lifting through hole 22. The top ends of the plurality of groups of lotus-shaped shielding pieces 25 are flush with the top end of the lifting through hole 22, without affecting the placement of the substrate material.

[0039] As shown in FIG. 5, in some embodiments, the lower end of the connecting seat 24 has a downwardly protruding arc surface, and the lower end of the connecting seat 24 protrudes from the bottom surface of the carrier disc 21. During the atomic layer deposition reaction, the gas flow blows from the left side to the right side inside the reaction chamber outer box 11, i.e., when the gas flow flows along the carrier disc 21, the path of the gas flow along the arc surface of the lower end of the connecting seat 24 is longer than that along the upper end of the connecting seat 24, so that the gas flow speed at the lower end of the connecting seat 24 is greater than that at the upper end, and the pressure at the lower end of the connecting seat 24 is less than that at the upper end, thereby preventing the gas flow from entering the lifting through hole 22 from the lower end of the connecting seat 24 and lifting the lotus-shaped shielding pieces 25, and further preventing atomic layer deposition on the bottom surface of the substrate material during the reaction.

[0040] Further, the pressure at the upper end of the connecting seat 24 is greater than that at the lower end, which can also exert a downward pressure on the carrier disc 21 and the substrate material, so that the substrate material can be better installed inside the placement groove to prevent the gas flow from entering the deposition through the gap between the substrate material and the carrier disc 21.

[0041] In some embodiments, the shielding structure can also be a driving member arranged at the lifting through hole 22 and the carrier disc 21, the driving member comprising a beveled sliding block one 51, a sliding connecting rod one 52, a piston block one 53, a piston channel 54, and a reset spring 55, the piston channel 54 being internally arranged at one end of the lifting through hole 22 and provided with the piston block one 53, one end of the piston block one 53 being connected with the sliding connecting rod one 52, the lifting through hole 22 being internally provided with the beveled sliding block one 51, one end of the sliding connecting rod one 52 being connected with the beveled sliding block one 51, the inside of the carrier disc 21 located at one side of the lifting through hole 22 being internally provided with a mounting groove one matched with the beveled sliding block one 51, for the beveled sliding block one 51 to move into the mounting groove one, the inside of the carrier disc 21 located at one side of the mounting groove one being internally provided with a mounting groove two, the mounting groove two being communicated with the mounting groove one, the inside of the mounting groove two being provided with the reset spring 55, one end of the reset spring 55 being connected with the beveled sliding block one 51.

[0042] In operation, when the lifting rod 41 passes through the lifting through hole 22, the end of the lifting rod 41 cooperates with the lower sliding surface of the beveled sliding block one 51, so that the beveled sliding block one 51 moves away from the inside of the lifting through hole 22 and drives the piston block one 53 to move through the sliding connecting rod one 52, while compressing the reset spring 55. When the lifting rod 41 moves away from the lifting through hole 22, the reset spring 55 arranged to release force can drive the beveled sliding block one 51 to reset to shield the lifting through hole 22, so as to avoid atomic layer deposition on the position of the bottom surface of the base material close to the lifting through hole 22 during the reaction.

[0043] As shown in FIG. 10, in some embodiments, the beveled sliding block one 51 is arranged in a round shape to shield the lifting through hole 22, that is, after the lifting rod 41 is lowered and the base material is placed in the placement groove, the beveled sliding block one 51 arranged can shield the lifting through hole 22, so as to avoid atomic layer deposition on the bottom surface of the base material during the atomic layer deposition reaction. The bottom surface of the beveled sliding block one 51 is arranged as a bevel that can cooperate with the end of the lifting rod 41, so that when the lifting rod 41 passes through the lifting through hole 22 and pushes the beveled sliding block one 51, it can move away from the inside of the lifting through hole 22.

[0044] As shown in FIGS. 7-11, in some embodiments, the carrier disc 21 is provided with auxiliary limiting stop rods 50 on the left and right sides, the auxiliary limiting stop rods 50 having smooth outer ends, facilitating the base material to slide along the outer ends, being capable of limiting the left and right sides of the base material, and cooperating with the lifting rod 41 to limit the front and back sides of the base material, further being capable of limiting the four sides of the base material, which is conducive to the base material being above the placement groove, and then facilitating the base material to be accurately moved into the placement groove.

[0045] In some embodiments, the auxiliary limiting stopper 50 comprises a vertical section and an inclined section, the side edges of the vertical section are aligned with the side edges of the placing groove, and the inclined section is inclined away from the placing groove, which is conducive to the case that when the mechanical claw group grabs the base material and places it in the recess of the four groups of lifting rods 41, when the base material is slightly offset to the left or right relative to the placing groove, due to the limiting effect of the auxiliary limiting stopper 50, when it is lowered, its side edges can slide along the inclined section and be guided to slide along the vertical section, thereby enabling the base material to be in the direction of the placing groove, facilitating the accurate movement of the base material into the placing groove.

[0046] In some embodiments, the driving member can also drive the auxiliary limiting stopper 50 to move, and the driving member can further comprise a piston block two 56, a sliding connection rod two 57, an inclined sliding block two 58, and an inclined sliding block three 59, the inside of the corner position of the carrier disc 21 is provided with a piston channel 54, the piston channel 54 is L-shaped, the upper end of the carrier disc 21 is provided with a vertical installation groove matched with the auxiliary limiting stopper 50, the auxiliary limiting stopper 50 is located in the vertical installation groove, the inside of the end of the piston channel 54 close to the vertical installation groove is provided with the piston block two 56, one end of the piston block two 56 is connected with the sliding connection rod two 57, the end of the sliding connection rod two 57 away from the piston block two 56 is connected with the inclined sliding block two 58, the inside of the carrier disc 21 is further provided with a transverse groove matched with the inclined sliding block two 58, the transverse groove is connected with the vertical installation groove, and the lower end of the auxiliary limiting stopper 50 is connected with the inclined sliding block three 59 matched with the inclined sliding block two 58.

[0047] For example, the outer ends of the sliding connection rod one 52 and the sliding connection rod two 57 are provided with sealing layers to improve the sealing effect of the piston channel 54.

[0048] When the lifting rod 41 passes through the lifting through hole 22, the end of the lifting rod 41 is matched with the lower sliding surface of the inclined sliding block one 51, so that the inclined sliding block one 51 drives away from the inside of the lifting through hole 22, and the piston block one 53 is driven to move by the sliding connection rod one 52, so that it moves towards the piston block two 56, and then the piston block two 56 drives the inclined sliding block two 58 to move through the sliding connection rod two 57, and then the inclined sliding block two 58 is matched with the inclined sliding block three 59, and the auxiliary limiting stopper 50 is lifted up by the inclined sliding block three 59, so that it plays a limiting auxiliary role after being lifted up, and then the auxiliary limiting stopper 50 can be lifted up and play a limiting role on the left and right sides of the base material when the base material is placed, thereby facilitating the accurate placement of the base material, and when the lifting rod 41 moves away from the lifting through hole 22, the reset spring 55 can drive the inclined sliding block one 51 and the inclined sliding block two 58 to reset.

[0049] The working principle of the multi-piece anti-winding plating automatic pick-and-place cavity mechanism provided by the embodiments of the present disclosure can be that the driver drives the lifting rod 41 to move upwards and sequentially pass through the inside of the lifting through hole 22 of each group of carrier discs 21 until the upper end of the lifting rod 41 passes through the inside of the lifting through hole 22 of the uppermost group of carrier discs 21, and then continues to move upwards by a distance, and then the first group of base materials is grabbed by the automatic grabbing mechanism and placed in the grooves at the upper ends of the four groups of lifting rods 41, so that the base materials are clamped between the four groups of lifting rods 41.

[0050] Then, the driver drives the lifting rod 41 to slowly move downwards until the first group of base materials is placed in the placement groove of the uppermost group of carrier discs 21. Then, the lifting rod 41 continues to move downwards until the upper end of the lifting rod 41 is a distance above the second group of carrier discs 21, and then the second group of base materials is grabbed by the automatic grabbing mechanism and placed in the grooves at the upper ends of the four groups of lifting rods 41, so that the base materials are clamped between the four groups of lifting rods 41. Then, the driver drives the lifting rod 41 to slowly move downwards again until the second group of base materials is placed in the placement groove of the second group of carrier discs 21. In this way, after the placement grooves of the plurality of groups of carrier discs 21 are sequentially placed with base materials, the driver drives the lifting rod 41 to continue to move downwards to move away from the carrier group 20.

[0051] Then, the driving element 31 drives the guide shaft 32 to move, so that the reaction cavity outer box door 12 moves towards the reaction cavity outer box body 11, and the carrier disc 21 is driven by the reaction cavity outer box door 12 to move into the reaction cavity outer box body 11 and close the reaction cavity outer box body 11. When the atomic layer deposition reaction is performed, the gas flows into the inside of the reaction cavity outer box body 11 through the inlet and blows towards the base materials placed in the placement groove of the carrier disc 21, so that the upper end of the base materials can be subjected to atomic layer deposition, and thus the atomic layer deposition reaction can be simultaneously performed on a plurality of groups of base materials, which is high in efficiency.

[0052] When the atomic layer deposition reaction is completed, the driving element 31 drives the guide shaft 32 to move and opens the reaction cavity outer box body 11, and then the driver drives the lifting rod 41 to slowly rise again, so that the upper end of the lifting rod 41 passes through the inside of the lifting through hole 22 of the lowermost carrier disc 21 and lifts the base materials in the placement groove of the lowermost carrier disc 21 away from the placement groove, and then the automatic grabbing mechanism grabs the base materials of the lowermost carrier disc 21 and takes them out. Then, the driver drives the lifting rod 41 to slowly rise again, so that the upper end of the lifting rod 41 passes through the inside of the lifting through hole 22 of the second lowermost carrier disc 21 and lifts the base materials of the second lowermost carrier disc 21, and then the automatic grabbing mechanism takes them away. In this way, the base materials in the placement groove of the uppermost carrier disc 21 are taken out.

[0053] Compared with the related art, the present disclosure has the following beneficial effects:

[0054] 1. For the multi-layer substrate material coating, the automatic placement and taking of the substrate material can be realized by the cooperation of the lifting rod 41 of the lifting driving group 40 and the mechanical claw group, the time is short, and the efficiency is high;

[0055] 2. The lifting rod 41 of the lifting driving group 40 is designed as a plurality of small cylindrical lifting rods 41, which sequentially pass through the lifting through holes 22 of the carrier disc 21 during work, so as to realize the placement and taking of a plurality of groups of substrate materials, facilitate the atomic layer deposition reaction of the plurality of groups of substrate materials, and shield the lifting through holes 22 through the shielding structure (shielding assembly 23 and inclined sliding block one 51), so as to avoid the atomic layer deposition from being attached to the bottom surface of the substrate material near the position of the lifting through hole 22 during the reaction.

[0056] 3. The driving part can drive the auxiliary limiting stop rod 50 to move, and the substrate material is assisted and limited during the process of being placed in the placement groove, so as to facilitate the accurate movement of the substrate material to the inside of the placement groove, and the inclined sliding block one 51 can shield the lifting through hole, effectively avoiding the atomic layer deposition from being attached to the bottom surface of the substrate material.

[0057] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A multi-chip anti-curling and automatic pick-and-place cavity mechanism, comprising: The reaction cavity group comprises a reaction cavity outer box body, the inside of the reaction cavity outer box body is provided with a heater, one side of the reaction cavity outer box body is provided with an inlet, the other side of the reaction cavity outer box body is connected with a reaction cavity outer box door through a guide driving group, the side of the reaction cavity outer box door is provided with a carrier group, the carrier group comprises a plurality of carrier disc groups, the plurality of carrier disc groups are connected to one side of the reaction cavity outer box door, the upper end of each carrier disc is provided with a placing groove, and the placing groove is configured to place a base material. The lifting driving group is located below the carrier group, the lifting driving group comprises a driver and a lifting rod, the output end of the driver is connected with the lifting rod, and the carrier disc is provided with a lifting through hole matched with the lifting rod. The side of the carrier group is provided with a mechanical claw group, the mechanical claw group is configured to grasp the base material and place the base material on the upper end of the lifting rod. The shielding structure is arranged in the lifting through hole, the shielding structure is configured to shield the lifting through hole and can be opened under the driving of the lifting rod to enable the lifting rod to pass through the lifting through hole.

2. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism of claim 1, wherein, The inside of the reaction cavity outer box body is provided with an inner cavity, and the inside of the inner cavity is provided with a heat shield.

3. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism of claim 2, wherein, The spacing between the adjacent two carrier disc groups is equal, the lifting through holes are arranged in four groups, and each two groups are located on the opposite sides of the carrier disc, and a part of the lifting through hole penetrates the placing groove.

4. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism of claim 3, wherein, The upper end of the lifting rod is provided with a groove near one side of the placing groove, one side of the groove is provided with a straight surface, and the straight surface of the groove and the edge of the placing groove are in the same vertical plane.

5. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism of claim 4, wherein, The guide driving group comprises a driving element and a guide shaft, the driving element is installed at the corner position of the side of the reaction cavity outer box body close to the reaction cavity outer box door, the output end of the driving element is connected with the guide shaft, and one end of the guide shaft is connected with the corner position of the reaction cavity outer box door.

6. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism according to any one of claims 1-5, wherein, The shielding structure comprises a shielding assembly, the shielding assembly comprises a connecting seat and a lotus-shaped shielding piece, the inside of the lifting through hole is provided with the connecting seat through a bolt, the inside of the connecting seat is provided with a through hole, the upper end of the connecting seat is provided with a plurality of lotus-shaped shielding pieces, the plurality of lotus-shaped shielding pieces are arranged in an array with the central axis of the lifting through hole as the center, the plurality of lotus-shaped shielding pieces all have a deformation capacity, and the top ends of the plurality of lotus-shaped shielding pieces are flush with the top end of the lifting through hole.

7. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism of claim 6, wherein, The lower end of the connecting seat has a downward convex arc surface, and the lower end of the connecting seat protrudes from the bottom surface of the carrier disc.

8. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism according to any one of claims 1-5, wherein, The opposite sides of the carrier disc are provided with auxiliary limiting stop rods, the auxiliary limiting stop rods have smooth outer ends, the auxiliary limiting stop rods comprise vertical segments and inclined segments, the side edges of the vertical segments are aligned with the side edges of the placing grooves, and the inclined segments are inclined away from the placing grooves.

9. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism according to any one of claims 1-5, wherein, The blocking assembly comprises a driving member, the driving member comprises a bevel sliding block one, a sliding connecting rod one, a piston block one, a piston channel and a reset spring, the piston channel is formed in the carrier disc close to the lifting through hole, the inside of the piston channel close to one end of the lifting through hole is provided with the piston block one, one end of the piston block one is connected with the sliding connecting rod one, the inside of the lifting through hole is provided with the bevel sliding block one, one end of the sliding connecting rod one away from the piston block one is connected with the bevel sliding block one, the inside of the carrier disc on one side of the lifting through hole is provided with a mounting groove one matched with the bevel sliding block one, the inside of the carrier disc on one side of the mounting groove one is provided with a mounting groove two, the inside of the mounting groove two is provided with the reset spring, one end of the reset spring is connected with the bevel sliding block one. The bevel sliding block one enters the mounting groove one under the extrusion of the lifting rod, so as to open the lifting through hole to make the lifting rod pass through and compress the reset spring; the bevel sliding block one extends out under the driving of the reset spring to block the lifting through hole after losing the extrusion of the lifting rod.

10. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism of claim 9, wherein, The bevel sliding block one is provided in a round sheet shape capable of blocking the lifting through hole, and the bottom surface of the bevel sliding block one is provided as a bevel capable of cooperating with the end of the lifting rod.

11. The multi-piece anti-curling plating automatic pick-and-place cavity mechanism of claim 9, wherein, The driving member further comprises a piston block two, a sliding connecting rod two, a bevel sliding block two and a bevel sliding block three, the inside of the corner position of the carrier disc is provided with the piston channel, the piston channel is provided in an L shape, the upper end of the carrier disc is provided with a vertical mounting groove matched with the auxiliary limiting stop rod, the auxiliary limiting stop rod is located in the inside of the vertical mounting groove, the inside of one end of the piston channel close to the vertical mounting groove is provided with the piston block two, one end of the piston block two is connected with the sliding connecting rod two, one end of the sliding connecting rod two away from the piston block two is connected with the bevel sliding block two, the inside of the carrier disc is further provided with a horizontal groove matched with the bevel sliding block two, the horizontal groove is connected with the vertical mounting groove in communication, and the lower end of the auxiliary limiting stop rod is connected with the bevel sliding block three matched with the bevel sliding block two.

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