Transparent display module and transparent LED display screen

Abstract

In order to overcome the problem in the prior art of the resolution of transparent display modules still requiring further improvement, the present application provides a transparent display module and a transparent LED display screen. In one aspect, the present application provides a transparent display module, which comprises a light-transmitting substrate and a light-transmitting backplane, wherein the light-transmitting substrate is provided with light-transmitting holes; regions other than the light-transmitting holes are non-light-transmitting regions, such that the light-transmitting substrate presents a transparent effect; light-emitting units are arranged in an array on the front surface of the light-transmitting substrate, and a driving circuit is arranged on the back surface thereof; and the driving circuit comprises driving units arranged in an array. In the transparent display module disclosed in the present application, light-emitting units and driving units in original LED lamp beads are respectively disposed on the front surface and the back surface of the light-transmitting substrate and are electrically connected. In this way, each light-emitting unit only includes a light-emitting chip, and each driving chip is independently arranged on the back surface of the light-transmitting substrate, the driving chip being a bare chip with an area less than or equal to 1.2 mm2, such that the area of the light-emitting unit can be effectively reduced, thereby significantly improving the light transmittance and resolution of the transparent display module.

Description

Transparent display module and transparent LED display screen

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application No. 202410450397.8, filed on April 15, 2024, and entitled "Transparent display module and transparent LED display screen", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the field of transparent LED display screens, in particular to the field of transparent LED display screens with light transmission holes on the circuit board. BACKGROUND

[0004] Transparent LED display screens are gradually widely used in the market and various product forms have been developed. The prior art provides an improved transparent display module 100, as shown in FIGS. 1a, 1b and 2, which includes a light transmission substrate 1 and a light transmission cover plate 2; the light transmission substrate 1 and the light transmission cover plate 2 are both arrayed with corresponding light transmission holes, and the area outside the light transmission holes forms a non-light transmission area; the light transmission holes on the light transmission substrate 1 are first light transmission holes 11, and the light transmission holes on the light transmission cover plate 2 are second light transmission holes 21; the front surface of the light transmission substrate 1 is provided with a driving circuit and pixel pads, and the pixel pads are arrayed in the non-light transmission area outside the first light transmission holes 11; wherein a plurality of light emitting units 12 are mounted on the pixel pads and connected to the driving circuit through the pixel pads; the light emitting unit 12 includes a driving chip (not marked in the figure) and a light emitting wafer (not marked in the figure); the non-light transmission area outside the second light transmission holes 21 on the light transmission cover plate 2 is arrayed with light emitting through holes 22, and the light emitting through holes 22 correspond to the pixel pads, so that the light emitting unit 12 is located in the light emitting through hole 22. The above-mentioned way can arrange the light emitting unit 12 in the light emitting through hole 22 formed by the above-mentioned light transmission cover plate 2, and the light emitting unit 12 is not easy to be damaged by knocking. It can make its light emitting unit without additional exposed solder joints, and it is easy to realize waterproof and moisture-proof.

[0005] However, due to the space limitation, the arrangement of the RGB light-emitting chips of the light-emitting unit is not on the pixel symmetry axis of the display surface, which forms obvious color difference when viewed from left and right, and it is difficult to meet the high-quality display requirements. At the same time, since the light-emitting unit contains both the light-emitting chip and the driving chip, the area occupied by the light-emitting unit is still large, and the spacing between the light-emitting units is large. When it is necessary to further improve the resolution, the existing setting mode cannot meet the requirements (it is difficult to accommodate the installation of the driving chip and the light-emitting chip at the same time, especially in the case of arranging the RGB light-emitting chip on the pixel center line, the space is more difficult to accommodate. Placing the driving chip and the RGB light-emitting chip in the non-light-transmitting area of the single surface at the same time already occupies a relatively large area ratio. The spacing between the light-emitting pixel pieces cannot be small, the resolution is small, the aperture left for the light-transmitting hole is small, and the physical transparency is difficult to be higher than 40% under the condition of less than P3.91mm pixel spacing. ) The resolution and light transmittance still have room for improvement. SUMMARY

[0006] In order to overcome the problems of the transparent display module in the prior art that color difference is still easy to form when viewed from left and right, and the resolution still needs to be further improved, the present application provides a transparent display module and a transparent LED display screen.

[0007] In one aspect, the present application provides a transparent display module, comprising a light-transmitting substrate and a light-transmitting back plate; the light-transmitting back plate is arranged on the opposite side of the light-transmitting substrate;

[0008] The light-transmitting substrate is provided with a light-transmitting hole, and the area outside the light-transmitting hole is a non-light-transmitting area, so that the light-transmitting substrate has a transparent effect; the front surface of the light-transmitting substrate is provided with an array of light-emitting units, and the light-emitting unit comprises a light-emitting chip; the back surface of the light-transmitting substrate is provided with a driving circuit, and the driving circuit comprises an array of driving units, and the driving unit comprises a driving chip; the driving chip is a bare chip, and the area of the driving chip is less than or equal to 1.2mm 2 ;

[0009] The light-emitting unit and the driving unit are electrically connected.

[0010] The transparent display module disclosed by the present application separately arranges the light-emitting unit and the driving unit in the front surface and the back surface of the light-transmitting substrate and electrically connects them. In this way, the light-emitting unit only contains the light-emitting chip, and the driving chip is independently arranged on the back surface of the light-transmitting substrate, and the driving chip is a bare chip with an area of less than or equal to 1.2mm 2 , which can effectively reduce the area of the light-emitting unit and greatly improve the light transmittance and resolution.

[0011] In another aspect, the present application provides a transparent LED display screen comprising the above-mentioned transparent display module.

[0012] The transparent LED display provided by the present application, due to containing the improved transparent display module and being electrically connected, thus the light emitting unit only contains the light emitting wafer, and the driving chip is independently arranged on the back of the light transmission substrate, and the driving chip adopts a bare chip with an area less than or equal to 1.2mm 2 , which can effectively reduce the area of the light emitting unit and greatly improve the light transmittance and resolution. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1a is an exploded perspective view of a transparent display module provided in the prior art;

[0014] Fig. 1b is an enlarged view of E in Fig. 1a;

[0015] Fig. 2 is a perspective view of a transparent display module provided in the prior art;

[0016] Fig. 3 is a front perspective view of a transparent display module provided in Embodiment 1 of the present application;

[0017] Fig. 4 is a back perspective view of a transparent display module provided in Embodiment 1 of the present application;

[0018] Fig. 5 is an exploded front perspective view of a transparent display module provided in Embodiment 1 of the present application;

[0019] Fig. 6 is an exploded back perspective view of a transparent display module provided in Embodiment 1 of the present application;

[0020] Fig. 7 is an enlarged view of A in Fig. 5;

[0021] Fig. 8 is an enlarged view of B in Fig. 6;

[0022] Fig. 9 is a front partial perspective view of a transparent display module provided in Embodiment 1 of the present application;

[0023] Fig. 10 is a back partial perspective view of a transparent display module provided in Embodiment 1 of the present application;

[0024] Fig. 11 is a front plan view of a light transmission substrate provided in Embodiment 1 of the present application;

[0025] Fig. 12 is a back plan view of a light transmission substrate provided in Embodiment 1 of the present application;

[0026] Fig. 13 is an enlarged view of C in Fig. 11;

[0027] Fig. 14 is an enlarged view of D in Fig. 12;

[0028] Fig. 15 is a top view of another transparent display module according to an embodiment of the present application;

[0029] Fig. 16 is a front view of another transparent display module according to an embodiment of the present application;

[0030] Fig. 17 is a perspective view of a transparent LED display according to an embodiment of the present application;

[0031] Fig. 18 is a front view of a transparent display module according to an embodiment of the present application;

[0032] Fig. 19 is a back view of a transparent display module according to an embodiment of the present application;

[0033] Fig. 20 is a top view of a transparent display module according to an embodiment of the present application;

[0034] Fig. 21 is an enlarged view of F in Fig. 20;

[0035] Fig. 22 is a top view of a transparent display module according to an embodiment of the present application;

[0036] Fig. 23 is an enlarged view of G in Fig. 22;

[0037] Fig. 24 is a partial cross-sectional view of a transparent display module according to an embodiment of the present application;

[0038] Fig. 25 is an exploded perspective view of a transparent LED display according to an embodiment of the present application.

[0039] In the drawings, reference numerals: 1000, transparent LED display; 100, transparent display module; 200, transparent mother board;

[0040] 1, light-transmitting substrate; 2, light-transmitting cover plate; 3, light-transmitting back plate; 11, first light-transmitting hole; 12, light-emitting unit; 12a, LED lamp bead; 12a1, cathode pin; 12a2, red pin; 12a3, green pin; 12a4, blue pin; 13, driving unit; 21, second light-transmitting hole; 22, light-emitting through hole; 221, light-transmitting glue; 120, front pad; 121, light-emitting wafer; 122, metal via; 130, back pad; 131, driving chip; 31, third light-transmitting hole; 32, driving unit hole. DETAILED DESCRIPTION

[0041] In order to make the technical problems, technical solutions and beneficial effects solved by the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0042] Embodiment 1

[0043] In order to overcome the problems of color difference still being easy to form when watching left and right and resolution still needing to be further improved in the prior art, the present application provides a transparent display module and a transparent LED display screen.

[0044] As shown in FIGS. 3-9, the present application provides a transparent display module in one aspect, which comprises a light-transmitting substrate 1, a light-transmitting cover plate 2 and a light-transmitting back plate 3; the light-transmitting substrate 1 is clamped between the light-transmitting cover plate 2 and the light-transmitting back plate 3; wherein the light-transmitting cover plate 2 is arranged on the front surface of the light-transmitting substrate 1, and the light-transmitting back plate 3 is arranged on the back surface of the light-transmitting substrate 1; wherein FIGS. 3 and 4 respectively show perspective views from the front surface and the back surface of the transparent display module, and it can be seen that the whole is provided with a light-transmitting hole, so that the product as a whole presents a light-transmitting effect. It should be noted that the light-transmitting cover plate 2 in the present example is a non-mandatory structure, but a preferred structure.

[0045] FIG. 5 schematically shows the light-transmitting cover plate 2 separated from the front surface of the transparent display module; and FIG. 6 schematically shows the light-transmitting back plate 3 separated from the back surface of the transparent display module; in this way, the effects of the light-transmitting substrate 1 on which the light-emitting units 12 and the driving units 13 are respectively mounted can be seen. The light-transmitting substrate 1 is provided with a light-transmitting hole, and the area outside the light-transmitting hole is a non-light-transmitting area, so that the light-transmitting substrate 1 presents a transparent effect, wherein the front surface of the light-transmitting substrate 1 is arrayed with the light-emitting units 12, and the back surface is provided with a driving circuit, the driving circuit comprises the driving units 13 arranged in an array, and the light-emitting units and the driving units are electrically connected.

[0046] Specifically, the binding pads of the R, G, and B pins of the corresponding driving chip of the driving unit 13 on the front and back sides of the transparent substrate 1 are respectively electrically connected to the pin pads of one pole of the R, G, and B light-emitting chips of the light-emitting unit 12 through metal vias 122; generally, the larger the ratio of the area of ​​the transparent area to the area of ​​the non-transparent area, the higher the transparency of the transparent display module 100 and the better the permeability. The size of the above-mentioned transparent hole can be optimized according to actual needs during the production process, and a balance can be found between maintaining transparency and ensuring the display performance of the product. For those skilled in the art, since the idea has been introduced in this example, those skilled in the art can obtain it without creative work. In this application, the transparent substrate 1 is generally formed of a non-transparent material, for example, it is generally directly a printed circuit board, and circuit patterns are respectively provided on both sides of the printed circuit board for transmitting signals and providing electrical energy. The transparent cover plate 2 is a printed circuit board, and it is preferred to use a printed circuit board containing a shielding circuit (short-circuited with the ground terminal GND on the transparent substrate 1) as the transparent cover plate 2. The transparent substrate 1 and the transparent cover plate 2 are formed by pressing or bonding. The transparent cover plate 2 can also be formed by die-casting of plastic material, or a plate-like structure made of any other material that can be bonded to the transparent substrate 1.

[0047] The shape of the light-transmitting hole can be a circular through hole as shown in the figure, or a triangle, a quadrilateral, or other polygons, or any other regular or irregular form, preferably a circular through hole.

[0048] As shown in Figures 7-14, the light-emitting unit 12 includes a front soldering area and a light-emitting chip 121 mounted on the front soldering area; the front soldering area is provided with a plurality of front solder pads 120. The light-emitting chips 121 in this application are well known to the public and include red light-emitting chips, green light-emitting chips, and blue light-emitting chips. Each light-emitting unit 12 is a light-emitting pixel that can be combined to emit light of various colors. The light-emitting unit 12 in this example includes an unpackaged light-emitting chip 121 soldered to the front soldering area.

[0049] The driving unit 13 includes a backside soldering area and a driving chip 131 mounted on the backside soldering area. The backside soldering area is provided with a plurality of backside solder pads 130.

[0050] The front solder pads 120 and the back solder pads 130 are electrically connected, allowing the driver chip 131 to drive the light-emitting chip 121. Preferably, the front solder pads 120 and the back solder pads 130 are electrically connected via metal vias 122. Metal vias 122 are well known to those skilled in the art of circuit boards. After punching a hole in the circuit board, the inner walls of the vias connecting the front and back sides are metallized to connect the circuits on both sides of the circuit board. This description will not be repeated.

[0051] The diameter of the area occupied by the light emitting unit 12 is 0.5-2.5mm; the center distance between the light emitting units 12 is 2-8mm. The driving chip 131 is a bare chip, and the area of the driving chip is less than or equal to 1.2mm 2 The advantage of using a bare chip as the driving chip 131 is that the installation space is saved. If the driving chip 131 is not a bare chip but a packaged chip, the size will be very large, which cannot meet the installation requirements of the light-transmitting substrate in the case of small pixel distance. The general size of the packaged driving chip 131 is greater than 4mm x 4mm, and the size of the small-size packaged driving chip 131 can be as small as 2mm x 4mm, but it is still difficult to install in the transparent display module with a transparent effect and a pixel distance less than 4mm x 4mm. However, by using the light emitting unit 12 in the present example, the size of each light emitting pixel and the gap between the light emitting pixels can be greatly reduced.

[0052] In the present example, as shown in FIGS. 7, 9 and 13, the light emitting wafer 121 on the light emitting unit 12 is mounted in a face-up manner, that is, the light emitting surface of the light emitting wafer 121 faces upward, and a pin is arranged on the light emitting surface, which is electrically connected to the front pad 120 by bonding wire binding. The specific binding connection method of the light emitting wafer 121 is known to the public, and will not be described here.

[0053] In the present example, as shown in FIGS. 8, 10 and 14, the driving chip 131 is mounted in a face-up manner, that is, a pin is arranged on the upper surface of the driving chip 131, which is electrically connected to the back pad 130 by bonding wire binding. The specific binding connection method of the driving chip 131 is known to the public, and will not be described here.

[0054] Of course, the driving unit 13 is generally provided with power supply and signals by the driving circuit formed on the back surface of the light-transmitting substrate 1 or the light-transmitting back plate 3. The way of providing power supply and signals for the driving unit 13 is not the focus of the present application, and can be implemented by the way known to those skilled in the art, which will not be described here.

[0055] The transparent display module disclosed in the application sets the light-emitting wafer 121 and the driving chip 131 in the original LED lamp bead on the front surface and the back surface of the light-transmitting substrate 1 respectively and electrically connects them through the metal via hole 122. In this way, the light-emitting unit 12 only contains the light-emitting wafer 121, and the driving chip 131 is independently arranged on the back surface of the light-transmitting substrate 1, which can effectively reduce the area occupied by the light-emitting unit 12 and greatly improve the light transmittance and resolution thereof. Meanwhile, in the case where the driving chip and the light-emitting wafer are packaged together in the same lamp cup, due to the large number of bonding wires, defects are prone to occur. The way of arranging the driving chip and the light-emitting wafer on the front surface and the back surface respectively in the application can check the bonding quality of the light-emitting wafer and the driving chip step by step, which is more convenient for detection and maintenance.

[0056] The metal via hole 122 directly connects the corresponding pads and directly reduces the space occupied by the wiring on the circuit board.

[0057] The light-transmitting hole on the light-transmitting substrate 1 is the first light-transmitting hole 11. The material of the light-transmitting cover plate 2 can be a non-transparent structure, and a light-transmitting hole is arranged thereon to transmit light, or the light-transmitting cover plate 2 can be a transparent material as a whole. As shown in FIG. 5, as an embodiment, the light-transmitting cover plate 2 in this example is a non-transparent plate, and a second light-transmitting hole 21 and a light-emitting through hole 22 are arranged thereon; the second light-transmitting hole 21 and the first light-transmitting hole 11 are arranged one by one in correspondence with each other; the light-emitting through hole 22 is arranged one by one in correspondence with the light-emitting unit 12; and each light-emitting unit 12 is located in the light-emitting through hole 22. The light-emitting through hole 22 is used to accommodate the light-emitting unit 12, and therefore the number of light-emitting through holes 22 is the same as that of light-emitting units 12.

[0058] The light-transmitting back plate 3 is used to cover the back surface of the light-transmitting substrate 1 and plays a protective role. It can be a transparent light-transmitting back plate 3 or a non-transparent light-transmitting back plate 3. As an embodiment, as shown in FIG. 6, the light-transmitting back plate 3 is a non-transparent plate, and a third light-transmitting hole 31 is arranged thereon; the third light-transmitting hole 31 and the first light-transmitting hole 11 are arranged one by one in correspondence with each other; similarly, the second light-transmitting hole 21 and the third light-transmitting hole 31 can also be arranged one by one in correspondence with each other. In order to avoid affecting the transparency of the light-transmitting substrate 1 as much as possible, the second light-transmitting hole 21 and the third light-transmitting hole 31 should be greater than or equal to the first light-transmitting hole 11.

[0059] As a preferred mode, the light-transmitting cover plate 2 is a transparent cover plate formed by curing transparent potting glue. The material of the transparent potting glue is generally epoxy resin, and the thickness of the light-transmitting cover plate 2 formed after curing is generally 300-600 μm. On this basis, in order to avoid the scattering of the chips of the light-emitting unit 12 through the transparent cover plate, a non-light-transmitting ink layer is generally provided on the light-transmitting cover plate 2, which is arranged to correspond to the non-light-transmitting area of the light-transmitting substrate 1, so that the light-emitting unit 12 cannot scatter light outward through the non-light-transmitting ink layer.

[0060] As another mode, as shown in FIG. 4 and FIG. 6, the light-transmitting back plate 3 is provided with a driving unit hole 32, and the driving unit 13 on the reverse side of the light-transmitting substrate 1 is arranged one by one in the driving unit hole 32. The driving unit hole 32 is filled with epoxy resin, which forms protection for the driving unit 13 after curing. As another embodiment, as shown in FIG. 10, the light-transmitting back plate 3 is a packaging layer formed by curing potting glue, which encapsulates the driving chip 131 in the light-transmitting back plate 3. The potting glue is generally dark or black, and the material is generally epoxy resin. The projection geometric shape of the light-transmitting back plate 3 formed by curing the potting glue is consistent with the projection geometric shape of the light-transmitting substrate 1, and the thickness is 300-500 μm. The thickness of the final transparent display module after packaging in this example is 0.8-2.8 mm. The thickness can be very thin to reduce the weight of the transparent display module.

[0061] As shown in FIG. 9 and FIG. 10, the light-emitting unit 12 and the driving unit 13 on the transparent display module are partially enlarged and displayed. As an embodiment, the light-transmitting cover plate 2 on the front side of the light-transmitting substrate 1 is provided with a light-emitting through hole 22, and the light-emitting unit 12 is arranged in the light-emitting through hole 22. The light-transmitting back plate 3 on the reverse side of the light-transmitting substrate 1 is formed by integrally potting with transparent material.

[0062] As shown in FIG. 15, as a preferred mode, the light-emitting through hole is filled with light-transmitting glue 221 to transparently encapsulate the light-emitting unit 12 in the light-emitting through hole. The light-emitting unit 12 and the light-transmitting glue 221 form an LED package contained in the light-emitting through hole. The encapsulation after potting with the light-transmitting glue 221 further protects the light-emitting unit 12 in the light-emitting through hole 22, and the encapsulated transparent display module 100 has better airtightness and better waterproof and moisture-proof performance.

[0063] As shown in FIG. 16, in addition to the above-mentioned normal mounting mode of the light emitting wafer 121, the light emitting wafer 121 on the light emitting unit 12 can also be inverted, and the pins of at least part of the light emitting wafer 121 are directly soldered to the front pads 120. The so-called inversion is known to the public, the light emitting surface of the light emitting wafer 121 faces upward, the pins thereon are arranged on the opposite side of the light emitting surface, and the pins are directly soldered to the front pads 120 without the need for additional bonding wires to bind.

[0064] As a preferred mode, as shown in FIG. 9, FIG. 13, and FIG. 16, the red light emitting wafer, the green light emitting wafer, and the blue light emitting wafer are arranged along the center line of the front pad area, and are center linearly symmetrical. The requirements for RGB mixed light quality in high-end display application scenarios can be met. There is no color difference when viewing left and right angles.

[0065] The transparent display module 100 disclosed in this example separately arranges the light emitting unit 12 and the driving unit 13 in the original LED lamp bead in the front and back of the light-transmitting substrate 1, and electrically connects them. In this way, the light emitting unit 12 only contains the light emitting wafer 121, and the driving chip 131 is independently arranged on the back of the light-transmitting substrate 1, and the driving chip 131 adopts a bare chip with an area less than or equal to 1.2mm 2 , which can effectively reduce the area of the light emitting unit 12 and greatly improve the light transmittance and resolution thereof.

[0066] Embodiment 2

[0067] Another aspect of the present application provides a transparent LED display screen 1000, which comprises the transparent display module 100 in the above-mentioned embodiment 1. The large transparent LED display screen is formed by assembling a plurality of transparent display modules 100.

[0068] As a preferred mode, as shown in FIG. 18, a transparent mother board 200 is further included, and a plurality of the transparent display modules 100 are mounted on the transparent mother board 200. The transparent mother board 200 is provided with a transmission circuit (not shown in the figure) for providing power supply and signals for the transparent display module 100; the transparent mother board 200 and the transparent display module 100 as a whole present a transparent display effect. The transparent display module 100 is further provided with an electrical connection structure (not shown in the figure) for electrical connection with the transmission circuit on the transparent mother board 200; so as to electrically connect each of the transparent display modules 100 to the transparent mother board 200, and provide power supply and control signals for the light emitting unit on the transparent display module 100.

[0069] The transparent LED display disclosed in the example comprises a transparent display module, which respectively arranges the light emitting unit 12 and the driving unit 13 in the original LED lamp bead in the front and back of the light-transmitting substrate 1 and electrically connects them through the metal via hole 122. In this way, the light emitting unit 12 only contains the light emitting wafer 121, and the driving chip 131 is independently arranged on the back of the light-transmitting substrate 1. The driving chip 131 adopts a bare chip with an area less than or equal to 1.2 mm 2 , which can effectively reduce the area of the light emitting unit 12 and greatly improve the light transmittance and resolution.

[0070] Embodiment 3

[0071] In the example, a new transparent display module 100 is provided, and the internal structure of the transparent display module 100 is mostly the same as that of the transparent display module 100 in Embodiment 1. The difference is only as follows: 1. It does not contain a light-transmitting cover plate 2, and the light emitting unit is not an unpackaged light emitting wafer. Instead, it is an LED lamp bead 12a without a driving chip after packaging. The example will combine FIGS. 18-24 to explain the scheme of packaging the light emitting wafer 121 into the LED lamp bead 12a without the driving chip 131. As for the design of the light-transmitting substrate 1, the light-transmitting back plate 3, the driving chip, the light-transmitting hole and other structures, the selection of materials, the connection mode of the metal via hole, etc., they are the same as in Embodiment 1, and they can be directly quoted in Embodiment 1. Therefore, only a simple explanation is given in the example, and no repeated description is given.

[0072] As shown in FIG. 18, the front perspective view of the transparent display module 100 and FIG. 20, the front view of the transparent display module 100, the transparent display module 100 comprises a light-transmitting substrate 1 and a light-transmitting back plate 3, and the LED lamp bead 12a without the driving chip 131 is mounted on the non-light-transmitting area of the front of the light-transmitting substrate 1 of the transparent display module 100. Specifically, it is arranged on the front soldering area for mounting the LED lamp bead 12a at the position formed between the light-transmitting holes. The LED lamp bead 12a is mounted in the manner introduced in Embodiment 1, that is, it is soldered on the front soldering area. Specifically, as shown in the enlarged view of FIG. 21, the LED lamp bead 12a generally has four pins, namely, a VCC pin 12a1, a red pin 12a2, a green pin 12a3 and a blue pin 12a4, which are respectively soldered to the corresponding front pads 120 on the front soldering area. The corresponding pads generally include corresponding front VCC pads, front red pads, front green pads and front blue pads, etc.

[0073] The LED lamp bead 12a can be a TOP type lamp bead or a CHIP type lamp bead, which is well known to those skilled in the art and will not be described here.

[0074] As shown in the reverse perspective view of the transparent display module 100 in FIG. 19 and the reverse top view in FIG. 22, the driving chip 131 is mounted on the reverse side of the light-transmitting substrate 1 of the transparent display module 100, and also in the non-light-transmitting area, specifically at the position between the light-transmitting holes, a reverse soldering area for mounting the driving chip 131 is arranged thereon; as shown in the enlarged view in FIG. 23, the reverse soldering area is provided with a plurality of back pads 130 corresponding to the pins on the driving chip, which generally include a GND pad, a VCC pad, a signal input (DI) pad, a signal output (DO) pad, a reverse red pad, a reverse green pad, a reverse blue pad, etc. The front pads and the reverse pads are connected one by one through the metal via holes 122, such as the front red pad corresponding to the reverse red pad, the front green pad corresponding to the reverse green pad, the front blue pad corresponding to the reverse blue pad, etc.

[0075] As shown in FIG. 24, the LED lamp bead 12a encapsulating the light-emitting wafer 121 of RGB three colors without the driving chip 131 has its pins soldered on the corresponding front pads 120 of the light-transmitting substrate 1, which are connected to the back pads 130 on the reverse side of the light-transmitting substrate 1 through the corresponding metal via holes 122, and the driving chip 131 is mounted on the back pads 130 through the binding connection. The driving unit holes 32 are arranged on the reverse side of the light-transmitting substrate 1, and the driving chip 131 on the reverse side of the light-transmitting substrate 1 is arranged in the driving unit holes 32 one by one.

[0076] In this way, the light-emitting unit 12 on the front side is the LED lamp bead 12a encapsulating the light-emitting wafer 121 without the driving chip 131, which has the beneficial effects of the embodiment 1 and further has the effects of simple structure, higher integration, easier implementation in process, and further reduced cost.

[0077] Embodiment 4

[0078] This example is similar to the embodiment 2, and another aspect of the present application provides a transparent LED display screen 1000, which includes the transparent display module 100 in the above embodiment 3. The large transparent LED display screen is formed by assembling a plurality of transparent display modules 100.

[0079] As a preferred mode as shown in Figure 25, further comprising a transparent mother board 200, and several transparent display modules 100 are mounted on the transparent mother board 200. The transparent mother board 200 is provided with a transmission circuit (not shown in the figure) for providing power supply and signals for the transparent display module 100; the transparent mother board 200 and the transparent display module 100 as a whole show transparent display effect. The transparent display module 100 is further provided with an electrical connection structure (not shown in the figure) for electrical connection with the transmission circuit on the transparent mother board 200; so as to electrically connect each transparent display module 100 to the transparent mother board 200, and provide power supply and control signals for the light emitting unit on the transparent display module 100.

[0080] The transparent LED display screen disclosed in the present application comprises a transparent display module, which respectively sets the light emitting unit 12 and the driving unit 13 in the original LED lamp bead on the front surface and the back surface of the light-transmitting substrate 1. In this way, only the light emitting wafer 121 is contained in the light emitting unit 12, and the driving chip 131 is independently set on the back surface of the light-transmitting substrate 1, and the driving chip 131 adopts a bare chip with an area less than or equal to 1.2mm 2 , which can effectively reduce the area of the light emitting unit 12 and greatly improve the light transmittance and resolution. At the same time, the light emitting unit 12 on the front surface adopts the LED lamp bead 12a formed by encapsulating the light emitting wafer 121 without the driving chip 131, which has simple structure, higher integration, and is easier to implement in process, and can further reduce the cost.

[0081] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A transparent display module, characterized in that, The transparent display module comprises a transparent substrate and a transparent backboard; the transparent backboard is arranged on the back of the transparent substrate; The light-transmitting substrate is provided with a light-transmitting hole, and the area outside the light-transmitting hole is a non-light-transmitting area, so that the light-transmitting substrate has a transparent effect; the front surface of the light-transmitting substrate is provided with a light-emitting unit, and the light-emitting unit comprises a light-emitting wafer; the back surface of the light-transmitting substrate is provided with a driving circuit, and the driving circuit comprises an array of driving units, and each driving unit comprises a driving chip; the driving chip is a bare chip, and the area of the driving chip is less than or equal to 1.2mm 2 ​ The light emitting unit and the driving unit are electrically connected. 2.The transparent display module of claim 1, wherein, The transparent display module further comprises a transparent cover plate; the transparent cover plate is arranged on the front of the transparent substrate, and the transparent substrate is arranged between the transparent cover plate and the transparent backboard. 3.The transparent display module of claim 2, wherein, The light emitting unit comprises a front soldering area and an unpackaged light emitting wafer mounted on the front soldering area; a plurality of front pads are arranged on the front soldering area; The driving unit comprises a back soldering area and a driving chip mounted on the back soldering area; a plurality of back pads are arranged on the back soldering area; The front pads and the back pads are electrically connected, so that the driving chip drives the light emitting wafer to work. 4.The transparent display module of claim 3, wherein, The front pads and the back pads are electrically connected through metal vias. 5.The transparent display module of claim 2, wherein, The transparent hole on the transparent substrate is a first transparent hole, the transparent cover plate is a non-transparent plate, and a second transparent hole and a light emitting through hole are arranged on the transparent cover plate; the second transparent hole and the first transparent hole are arranged one by one in correspondence; the light emitting through hole is arranged one by one in correspondence with the light emitting unit; so that each light emitting unit is located in the light emitting through hole. 6.The transparent display module of claim 5, wherein, The transparent backboard is a non-transparent plate, and a third transparent hole is arranged on the transparent backboard; the third transparent hole is arranged one by one in correspondence with the first transparent hole. 7.The transparent display module of claim 2, wherein, The transparent cover plate is a transparent cover plate formed by curing of transparent potting glue. The transparent cover plate is a transparent cover plate formed by curing of transparent potting glue. 8.The transparent display module of claim 7, wherein, The transparent cover plate is provided with a non-transparent ink layer, which is arranged in correspondence with the non-transparent area of the transparent substrate, so that the light emitting unit cannot scatter light outward through the non-transparent ink layer. The transparent backboard is a packaging layer formed by curing of potting glue, which packages the driving chip in the transparent backboard. 9.The transparent display module of claim 1, wherein, The light emitting wafer on the light emitting unit is surface mounted, and the pins thereof are electrically connected to the front pads by bonding wires; 10.The transparent display module of claim 3, wherein, And / or, the driving chip is surface mounted, and is electrically connected to the back pads by bonding wires. At least one light emitting wafer on the light emitting unit is flip-chip mounted, and the pins of the flip-chip mounted light emitting wafer are directly welded to the front pads. 11.The transparent display module of claim 3, wherein, The light emitting through hole is filled with transparent glue to transparently package the light emitting unit in the light emitting through hole; the light emitting unit and the transparent glue form an LED package accommodated in the light emitting through hole. 12.The transparent display module of claim 5, wherein, The transparent backboard is provided with a driving unit hole, and the driving unit on the back of the transparent substrate is arranged one by one in correspondence in the driving unit hole. 13.The transparent display module of claim 6, wherein, The diameter of the light emitting unit is 0.5-2.5mm; the center distance between the light emitting units is 2-8mm. 14.The transparent display module of claim 1, wherein, The light emitting wafer comprises a red light emitting wafer, a green light emitting wafer and a blue light emitting wafer; the red light emitting wafer, the green light emitting wafer and the blue light emitting wafer are arranged along the center line of the front soldering area, and are symmetrically arranged along the center line. 15.The transparent display module of claim 3, wherein, The thickness of the transparent display module is 0.8-2.8mm. 16.The transparent display module of claim 1, wherein, The light emitting unit comprises a front soldering area and an LED lamp bead without driving chip formed after packaging of a light emitting wafer; a plurality of front pads are arranged on the front soldering area; and the LED lamp bead is mounted on the front pads. 17.The transparent display module of claim 1, wherein, ​ 18.The transparent display module of claim 17, wherein, The LED lamp bead is provided with a plurality of pins, and the pins are welded on the front pads of the front welding areas.

19. A transparent LED display, characterized by The transparent display module comprises the transparent display module as claimed in any one of claims 1-18.

20. The transparent LED display of claim 19, wherein, The application further comprises a transparent mother plate, and the plurality of transparent display modules are installed on the transparent mother plate.

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