Liquid jet impingement cooling structure, method for manufacturing same, and electronic device

Abstract

A liquid jet impingement cooling structure, a method for manufacturing same, and an electronic device, the liquid jet impingement cooling structure comprising: a substrate (10), a chip (11), a cooling cover (12), a molding body (13), and a metal protective layer (14). The chip (11) and the cooling cover (12) are located above the substrate (10), the cooling cover (12) and the substrate (10) form a cavity, and the chip (11) is located inside of the cavity. The molding body (13) is filled between the chip (11) and the cooling cover (12) on the substrate (10), the molding body (13) covers a side surface of the chip (11), and the part of the molding body (13) close to the chip (11) is flush with at least a first surface of the chip (11), the first surface being the surface on the side of the chip (11) away from the substrate (10). The metal protective layer (14) covers the surface on the side of the molding body (13) away from the substrate (10), and the metal protective layer (14) covers a gap between the chip (11) and the molding body (13). According to the present application, the molding body is locally thickened, which relieves the stress on the chip at corner positions, such that tearing, penetration, and layering, for example, in the metal protective layer are not likely to occur at the corner positions of the chip, improving the integrity and reliability of the metal protective layer, and thus improving the sealing reliability of the chip.

Description

A jet flow liquid cooling structure, a manufacturing method thereof and an electronic device

[0001] Cross-reference to Related Applications

[0002] The present application claims priority to the Chinese patent application No. 202410453352.6, filed on April 15, 2024, and entitled "A jet flow liquid cooling structure, a manufacturing method thereof and an electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0003] The present application relates to the field of chip heat dissipation technology, in particular to a jet flow liquid cooling structure, a manufacturing method thereof and an electronic device. BACKGROUND

[0004] With the continuous evolution of chip processing, highly integrated and miniaturized electronic devices have been widely used, and the power density of chips has been rising. Therefore, how to use an efficient heat dissipation scheme to avoid high temperature or over-temperature phenomenon in the local area of the chip to improve the related performance and reliability of the electronic device is an urgent problem to be solved.

[0005] Among many heat dissipation schemes, the chip-level jet flow liquid cooling structure can effectively solve the heat dissipation problem of high-power and high-power-density chips. The heat dissipation principle of the chip-level jet flow liquid cooling structure is that the cooling liquid forms a high-speed jet flow after passing through the inlet of the cavity under a certain pressure difference, the high-speed jet flow impacts the surface of the chip for heat exchange, and then the cooling liquid flows out through the outlet of the cavity, thereby taking away the heat.

[0006] In the related art, in order to prevent the cooling liquid from penetrating into the substrate, underfill (UF) and other organic materials under the chip, causing electrical failure and reliability problems of the chip or substrate, a sealing structure needs to be formed around the chip. However, since the heat dissipation efficiency of the chip is related to the jet flow speed of the cooling liquid, and the jet flow speed of the cooling liquid is related to the pressure difference between the inlet and the outlet, under high impact pressure, the penetration probability of the cooling liquid will further increase, which requires the sealing structure of the chip to have high pressure resistance, and the pressure resistance of the sealing structure needs to be matched with the heat dissipation design. Therefore, how to improve the sealing reliability of the chip is an urgent technical problem to be solved. SUMMARY

[0007] In order to improve the sealing reliability of the chip in the chip-level jet flow liquid cooling structure, the present application provides a jet flow liquid cooling structure, a manufacturing method thereof and an electronic device.

[0008] In a first aspect, to improve the sealing reliability of a chip in a chip-level fluidic cooling structure, an embodiment of the present application provides a fluidic cooling structure. The fluidic cooling structure provided by an embodiment of the present application can include a substrate, a chip, a cooling cover, a plastic encapsulation body, and a metal protective layer. The chip and the cooling cover are located above the substrate, the cooling cover and the substrate form a cavity, and the chip is located inside the cavity. The chip in an embodiment of the present application can be various forms of chips, for example, the chip can be a chip die, or the chip can also have a certain degree of packaging. The cavity is free of filler medium material, and the cavity can accommodate cooling liquid when the fluidic cooling structure is working. The cooling cover is provided with an inlet and an outlet for the cooling liquid to flow in and out, respectively.

[0009] In an embodiment of the present application, by arranging the plastic encapsulation body and the metal protective layer around the chip, a good sealing effect can be achieved on the chip, and the cooling liquid can be effectively prevented from penetrating into the chip, the substrate, and other structures. Specifically, the plastic encapsulation body is located above the substrate, and the plastic encapsulation body is filled between the chip and the cooling cover. For example, the chip can be completely surrounded by the plastic encapsulation body, that is, the plastic encapsulation body can be a ring structure surrounding the chip. The plastic encapsulation body generally includes organic materials such as resin, and the plastic encapsulation body can fill the gap around the chip and protect the chip. The metal protective layer covers the surface of the plastic encapsulation body away from the substrate, and the metal protective layer covers the gap between the chip and the plastic encapsulation body. That is, the metal protective layer covers the surface of the plastic encapsulation body away from the substrate and overlaps the edge of the chip. By arranging the metal protective layer to cover the surface of the plastic encapsulation body away from the substrate, the cooling liquid can be prevented from soaking the plastic encapsulation body, and the cooling liquid can be prevented from penetrating into the substrate and other structures below through the plastic encapsulation body, causing electrical failure and reliability problems. Moreover, by arranging the metal protective layer to cover the gap between the chip and the plastic encapsulation body, the cooling liquid can be prevented from penetrating into the substrate and other structures below through the gap between the chip and the plastic encapsulation body.

[0010] In an embodiment of the present application, the chip has a first surface, a second surface, and a side surface, wherein the first surface is the surface of the chip away from the substrate, that is, the upper surface of the chip mentioned above, the second surface is the surface of the chip toward the substrate, and the side surface connects the first surface and the second surface. The plastic encapsulation body covers the side surface of the chip, and the part of the plastic encapsulation body close to the chip is at least flush with the first surface of the chip. That is, the part of the plastic encapsulation body close to the chip is flush with the first surface of the chip, or the part of the plastic encapsulation body close to the chip is higher than the first surface of the chip. It can be understood that, in an embodiment of the present application, flush means that two planes are substantially flush within a certain error range.

[0011] In the jet flow liquid cooling structure provided in the embodiments of the present application, the part of the plastic package body close to the chip is at least flush with the first surface of the chip by locally thickening the plastic package body, so that the side surface of the chip is substantially completely wrapped by the plastic package body, the stress of the chip at the corner position (i.e. the position where the first surface connects with the side surface) is relieved, the metal protective layer is less likely to have tearing, penetration, delamination and other phenomena at the corner position of the chip, the integrity and reliability of the metal protective layer are improved, and the sealing reliability of the chip is improved, thereby preventing the chip from having problems such as local sealing failure, water bubble, corrosion and electrical failure, and thus the jet flow liquid cooling structure has good reliability.

[0012] In some embodiments of the present application, the cooling cover can include a ring-shaped barrier wall and an upper cover. The ring-shaped barrier wall is located above the substrate, and the ring-shaped barrier wall surrounds the chip. The upper cover is located on the side of the ring-shaped barrier wall away from the substrate, and the upper cover is provided with an inlet and an outlet. In the embodiments of the present application, the inlet and the outlet are both arranged in the upper cover. In the specific arrangement, the inlet can be arranged in the upper cover, and the outlet can be arranged in the ring-shaped barrier wall. The positions and quantities of the inlet and the outlet can be reasonably arranged according to the actual situation. In a possible implementation manner, the opening size of the upper cover can be greater than the opening size of the ring-shaped barrier wall. The upper cover can be covered above the ring-shaped barrier wall, and the opening edge of the upper cover surrounds the outside of the ring-shaped barrier wall. Of course, in some cases, the opening size of the upper cover can also be less than or equal to the opening size of the ring-shaped barrier wall, as long as the upper cover and the ring-shaped barrier wall can be covered. In the specific arrangement, at least one sealing ring can be arranged between the ring-shaped barrier wall and the upper cover to make the sealing effect at the connection position of the ring-shaped barrier wall and the upper cover better. In the embodiments of the present application, the ring-shaped barrier wall and the upper cover in the cooling cover are arranged in a split structure. In the manufacturing process, the ring-shaped barrier wall and the chip can be first installed on the surface of the substrate, and then the upper cover is installed after the plastic package body and the metal protective layer are formed, so that the manufacturing process can be simplified. Of course, in some cases, the cooling cover can also be arranged in an integral structure, which can be arranged according to the actual situation.

[0013] In a possible implementation manner, the cooling cover can be fixed to the surface of the substrate through an adhesive layer. Exemplarily, the adhesive layer can include a colloidal material with adhesive properties, or the adhesive layer can also include other materials with adhesive properties. The pattern of the adhesive layer can be substantially consistent with the pattern of the ring-shaped barrier wall, that is, the shape of the adhesive layer can be annular. The adhesive layer can be an annular integral structure, or the adhesive layer can include a plurality of adhesive parts arranged in a split manner, and each adhesive part in the adhesive layer can surround an annular shape.

[0014] In a specific implementation, the metal protection layer can include a metal material, for example, the metal material can be copper, nickel, gold, etc. Since the metal material has a low permeability, the metal protection layer can effectively prevent the cooling liquid from permeating towards the chip and the substrate. In order to make the metal protection layer have a better anti-permeation effect, the thickness of the metal protection layer can be set to be relatively thick, for example, the thickness of the metal protection layer can be in micrometers (μm), for example, the thickness of the metal protection layer can be set to several micrometers or tens of micrometers.

[0015] In some embodiments of the present application, the metal protection layer can be an integral film layer covering the first surface of the chip and the surface of the plastic package away from the substrate. In this way, the metal protection layer is less likely to have defect points, and the metal protection layer has a better anti-permeation effect and improves the reliability of the metal protection layer. In a possible implementation, the metal protection layer can cover the first surface of the chip, the surface of the plastic package away from the substrate, and the inner wall of the annular barrier wall. In addition, the metal protection layer can also cover the top of the annular barrier wall and extend to the outer side wall of the annular barrier wall. In this way, the metal protection layer has a large area, and the metal protection layer has a good bonding effect with the chip, the plastic package, and other components. Therefore, the metal protection layer is less likely to have defect points and is less likely to peel off. In another possible implementation, the metal protection layer can cover the first surface of the chip, the surface of the plastic package away from the substrate, and the inner wall of the annular barrier wall. The metal protection layer can not extend to the outer side wall of the annular barrier wall. The metal protection layer can cover the top surface of the annular barrier wall; or the metal protection layer can not cover the top surface of the annular barrier wall. In this way, the metal protection layer also has a large area, and the metal protection layer has a good bonding effect with the chip, the plastic package, and other components. In another possible implementation, the metal protection layer can cover the first surface of the chip and the surface of the plastic package away from the substrate, that is, the metal protection layer can not cover the annular barrier wall. In this way, the metal protection layer has a good anti-permeation effect, and the metal protection layer is less likely to have defect points and is less likely to peel off. Since the first surface of the general chip is not provided with a conductive structure such as an electrode or a circuit, the first surface of the chip is in contact with the metal protection layer and will not cause short circuiting, series connection, or other malfunctions.

[0016] In some embodiments of the present application, the metal protection layer can cover the surface of the plastic package away from the substrate and extend to the edge of the first surface of the chip. A large part of the first surface of the chip is not covered by the metal protection layer, that is, the pattern of the metal protection layer can be annular around the chip. Since the first surface of the general chip is not provided with a conductive structure such as an electrode or a circuit, the first surface of the chip will not be damaged after being in contact with the cooling liquid, and a large part of the middle of the first surface of the chip can also not be covered by the metal protection layer. In this way, the metal protection layer also has a good anti-permeation effect.

[0017] In a specific implementation, in order to enhance the adhesion of the metal protection layer, an adhesion layer can be arranged between the metal protection layer and the chip, between the metal protection layer and the plastic package, and between the metal protection layer and the annular barrier wall. The adhesion layer can be made of metal materials such as titanium (Ti) and aluminum (Al). In a specific implementation, the pattern of the adhesion layer can be a full-surface film layer consistent with the pattern of the metal protection layer, or the pattern of the adhesion layer can be arranged at some positions where the metal protection layer is prone to falling off. The pattern of the adhesion layer can be set according to actual conditions.

[0018] In a possible implementation, the jet flow liquid cooling structure in the embodiment of the present application can further include a surface treatment layer on the surface of the metal protection layer. The surface treatment layer covers the surface of the metal protection layer and can prevent the metal protection layer from being oxidized, washed, and corroded. The surface treatment layer can include metal materials or inorganic materials with anti-oxidation, anti-washing, and anti-corrosion functions. In a manufacturing process, materials with anti-oxidation, anti-washing, and anti-corrosion functions can be used to form the surface treatment layer on the surface of the metal protection layer, or the surface of the metal protection layer can be treated to form the surface treatment layer. In another possible implementation, when the metal protection layer itself has good anti-oxidation, anti-washing, and anti-corrosion functions, for example, the metal protection layer includes anti-oxidation metal materials such as gold and platinum, the surface of the metal protection layer can not be provided with the surface treatment layer.

[0019] The basic structure of the jet flow liquid cooling structure in the embodiment of the present application is introduced above, and the specific implementation of the plastic package in the embodiment of the present application is described in detail below.

[0020] Implementation 1

[0021] In some embodiments of the present application, the plastic package covers the side surface of the chip, and the plastic package wraps the edge of the first surface. In this way, the plastic package can wrap the corner position of the chip, and reduce the stress of the chip at the corner position. After the metal protection layer is formed on the surface of the chip and the plastic package, the metal protection layer can be smoothly transitioned along the surface of the plastic package, so that the metal protection layer is not prone to tearing, penetrating, delamination and the like at the corner position of the chip in scenarios such as reliability tests and actual applications, and the integrity and reliability of the metal protection layer are improved, and thus the sealing reliability of the chip is improved. In a possible implementation, the part of the surface of the plastic package away from the substrate and close to the chip can be curved, so that the slope of the surface of the plastic package away from the substrate is relatively gentle, and the metal protection layer formed subsequently can extend along the surface of the plastic package and be smoothly transitioned at the position close to the periphery of the chip, so as to effectively prevent the metal protection layer from tearing, penetrating, delaminating and the like at the corner position of the chip. Of course, the surface of the plastic package away from the substrate can also have other shapes, as long as it can wrap the corner position of the chip and does not form a stress concentration point, and can be set according to actual conditions.

[0022] In the actual process, after the chip and the annular barrier wall are installed on the surface of the substrate, the liquid plastic packaging material is filled in the gap between the chip and the cooling cover by using the dispensing process, and the plastic package is obtained after solidification. The dispensing process path and the glue amount can be adjusted, so that the plastic packaging material can form a natural glue after solidification. The edge of the first surface of the chip can be wrapped to make the obtained plastic package wrap the corner position of the chip. For example, during the dispensing process, the glue amount at the position close to the periphery of the chip can be increased, so that the plastic package is locally thickened at the position close to the periphery of the chip, so that the plastic package wraps the corner position of the chip. For another example, the plastic packaging material can be filled in the gap between the chip and the cooling cover first, and after the plastic packaging material is solidified or semi-solidified, secondary dispensing is performed at the position around the chip, so that the obtained plastic package is locally thickened at the position close to the periphery of the chip.

[0023] Implementation two:

[0024] In some embodiments of the present application, the plastic package can include a first plastic package and a second plastic package, the first plastic package surrounds the chip, and the second plastic package surrounds the first plastic package. In some embodiments of the present application, the first plastic package and the second plastic package can be annular. The first plastic package covers the side surface of the chip, and the surface of the first plastic package facing away from the substrate side is at least flush with the first surface. In one possible implementation, the surface of the first plastic package facing away from the substrate side can be flush with the first surface, so that the side surface of the chip can be completely wrapped by the first plastic package, and the first surface of the chip and the upper surface (the surface facing away from the substrate side) of the first plastic package substantially constitute a plane, and the subsequently formed metal protection layer can transition along the interface plane constituted by the chip and the first plastic package, so that the metal protection layer does not form a stress concentration point at the corner position of the chip, thereby improving the integrity and reliability of the metal protection layer. In another possible implementation, the surface of the first plastic package facing away from the substrate side can also be slightly higher than the first surface, and due to the smaller stress generated by the plastic package material, the metal protection layer can smoothly transition along the surface of the chip and the first plastic package, so that the metal protection layer does not form a stress concentration point at the position between the chip and the first plastic package, thereby also improving the integrity and reliability of the metal protection layer.

[0025] In addition, the thickness of the second plastic package can be less than or equal to the thickness of the first plastic package, the upper surface (the surface facing away from the substrate side) of the second plastic package can be flush with the upper surface of the first plastic package, or the upper surface of the second plastic package can be lower than the upper surface of the first plastic package. That is, there can be a height difference between the second plastic package and the first plastic package. Since the first plastic package and the second plastic package both include plastic package material, the first plastic package and the second plastic package can include the same plastic package material, or the first plastic package and the second plastic package can include different plastic package materials, that is, the materials of the first plastic package and the second plastic package are the same or similar, so that the coefficient thermal expansion (CTE) mismatch between the first plastic package and the second plastic package is small, and the stress generated at the position between the first plastic package and the second plastic package is relatively moderate, so that the metal protection layer does not form a stress concentration point at the position between the first plastic package and the second plastic package, even if there is a height difference between the first plastic package and the second plastic package.

[0026] Therefore, in the second implementation, the plastic package is provided to include the first plastic package and the second plastic package, which can effectively prevent the metal protection layer from forming a stress concentration point at the corner position of the chip, thereby improving the integrity and reliability of the metal protection layer.

[0027] Implementation three:

[0028] In some embodiments of the present application, the side surface of the chip can include a first side surface and a second side surface, the first side surface is connected with the first surface, and the first side surface is connected with the second surface through the second side surface. The first side surface forms an obtuse angle with the first surface, and the plastic package covers the first side surface and the second side surface. In the manufacturing process, the corner of the chip can be cut off before the plastic package is formed, so as to obtain an inclined first side surface and make the edge of the chip free of right angles. In this way, in the process of forming the plastic package, the plastic material can automatically climb to the inclined first side surface along the second side surface under the action of surface tension, so that the plastic package formed after solidification has a natural arc transition. The metal protection layer formed subsequently can smoothly transition along the surface of the chip and the plastic package, and the metal protection layer will not form a stress concentration point at the corner of the chip, thereby improving the integrity and reliability of the metal protection layer.

[0029] In the manufacturing process, the corner of the chip can be cut before the chip is mounted on the surface of the substrate. For example, laser cutting or mechanical cutting can be used for cutting. Alternatively, the corner of the chip can be cut after the chip is mounted on the surface of the substrate. For example, laser cutting can be used for cutting.

[0030] In a possible implementation, the first side surface can be a plane, and in the manufacturing process, the corner of the chip can be cut off by straight-line cutting. In another possible implementation, the first side surface can be a curved surface, and in the manufacturing process, the corner of the chip can be cut off by arc-line cutting. Of course, in some cases, the first side surface can also have other shapes, which are not limited herein.

[0031] Implementation four:

[0032] In some embodiments of the present application, the above-mentioned implementation one and implementation two can be combined, the plastic package is provided with a first plastic package and a second plastic package, and the first plastic package is locally thickened to wrap the edge of the first surface of the chip, thereby further improving the reliability of the metal protection layer. The specific implementation of implementation four can refer to the above-mentioned implementation one and implementation two, and the repeated parts will not be described herein.

[0033] Implementation five:

[0034] In some other embodiments of the present application, the above-mentioned implementation manner one and implementation manner three can be combined, the corner position of the chip is cut off, the chip has an inclined first side surface, the plastic package is partially thickened, and the plastic package wraps the edge of the first surface of the chip, so as to further improve the reliability of the metal protection layer. The specific implementation of the implementation manner five can refer to the above-mentioned implementation manner one and implementation manner three, and the repeated parts will not be described herein.

[0035] Implementation manner six:

[0036] In some other embodiments of the present application, the above-mentioned implementation manner two and implementation manner three can be combined, the corner position of the chip is cut off, the chip has an inclined first side surface, and the plastic package is provided to include a first plastic package and a second plastic package, so as to further improve the reliability of the metal protection layer. The specific implementation of the implementation manner six can refer to the above-mentioned implementation manner two and implementation manner three, and the repeated parts will not be described herein.

[0037] Implementation manner seven:

[0038] In some other embodiments of the present application, the above-mentioned implementation manner one, implementation manner two and implementation manner three can be combined, the corner position of the chip is cut off, the chip has an inclined first side surface, the plastic package is provided to include a first plastic package and a second plastic package, and the first plastic package is partially thickened, so that the first plastic package wraps the edge of the first surface of the chip, so as to further improve the reliability of the metal protection layer. The specific implementation of the implementation manner seven can refer to the above-mentioned implementation manner one, implementation manner two and implementation manner three, and the repeated parts will not be described herein.

[0039] The above introduces several implementation manners of the plastic package in the embodiments of the present application, and it should be understood that the plastic package can also have other implementation manners in specific implementation, which will not be exemplified one by one herein.

[0040] In a second aspect, the embodiments of the present application further provide a manufacturing method of the fluid-jet liquid cooling structure, and the manufacturing method of the fluid-jet liquid cooling structure provided by the embodiments of the present application can include:

[0041] Step one, fix the chip and the annular barrier wall on the substrate, so that the annular barrier wall surrounds the chip. The chip has a first surface, a second surface and a side surface. The first surface is the surface of the chip away from the substrate, the second surface is the surface of the chip towards the substrate, and the side surface connects the first surface and the second surface. In one possible implementation, the annular barrier wall can be fixed to the surface of the substrate through an adhesive layer. The adhesive layer can include a colloidal material with adhesive properties, or the adhesive layer can also include other materials with adhesive properties. The pattern of the adhesive layer can be substantially consistent with the pattern of the annular barrier wall, that is, the shape of the adhesive layer can be annular. The adhesive layer can be an annular whole structure, or the adhesive layer can include a plurality of discrete adhesive parts, and each adhesive part in the adhesive layer can form an annular shape.

[0042] Step two, fill the plastic encapsulation body between the chip and the annular barrier wall, so that the plastic encapsulation body covers the side surface of the chip, and the part of the plastic encapsulation body close to the chip is at least flush with the first surface. That is, the part of the plastic encapsulation body close to the chip is flush with the first surface of the chip, or the part of the plastic encapsulation body close to the chip is higher than the first surface of the chip. It can be understood that in the embodiments of the present application, flush means that two planes are substantially flush within a certain error range. In the actual process, a dispensing process can be used to fill the liquid plastic encapsulation material in the gap between the chip and the annular barrier wall, and the plastic encapsulation body is obtained by solidification. In the process of making the plastic encapsulation body, the plastic encapsulation body can be locally thickened, so that the part of the plastic encapsulation body close to the chip is at least flush with the first surface of the chip.

[0043] After the above step two, a protective layer can be formed on the surface of the substrate away from the chip to prevent the substrate from being damaged in the subsequent manufacturing process. The protective layer can be a film layer with a protective function such as an adhesive tape.

[0044] Step three, form a metal protective layer on the chip and the plastic encapsulation body, so that the metal protective layer covers the surface of the plastic encapsulation body away from the substrate, and the metal protective layer covers the gap between the chip and the plastic encapsulation body. That is, the metal protective layer covers the surface of the plastic encapsulation body away from the substrate, and overlaps the edge of the chip. Thus, the metal protective layer can effectively prevent the cooling liquid from penetrating into the chip, the substrate and other structures below.

[0045] In the manufacturing process, the metal protective layer can be made of copper, nickel, gold and other metal materials. The thickness of the metal protective layer can be in micrometers (μm), for example, the thickness of the metal protective layer can be several micrometers or tens of micrometers.

[0046] In the actual process, in order to enhance the adhesion of the metal protective layer, an adhesion layer can be formed in the area where the metal protective layer is to be formed before the metal protective layer is formed. For example, the adhesion layer can be made of titanium (Ti), aluminum (Al), or other metal materials. The pattern of the adhesion layer can be a full film layer consistent with the pattern of the metal protective layer, or the pattern of the adhesion layer can be arranged at some positions where the metal protective layer is prone to fall off. The actual arrangement can be determined according to the actual situation.

[0047] After the metal protective layer is formed, a surface treatment layer can be formed on the surface of the metal protective layer. The surface treatment layer covers the surface of the metal protective layer and can prevent the metal protective layer from being oxidized, washed, corroded, and the like. In the manufacturing process, a material with oxidation resistance, washing resistance, corrosion resistance, and the like, such as a metal material or an inorganic material, can be used to form the surface treatment layer on the surface of the metal protective layer, or the surface of the metal protective layer can be surface treated to form the surface treatment layer on the surface of the metal protective layer. In some cases, when the metal protective layer itself has good oxidation resistance, washing resistance, corrosion resistance, and the like, for example, when the metal protective layer includes oxidation-resistant metal materials such as gold and platinum, the surface treatment layer can not be formed on the surface of the metal protective layer.

[0048] Then, the protective layer on the surface of the substrate away from the chip is removed, and a plurality of solder balls are formed on the surface of the substrate away from the chip, so as to facilitate electrical connection between the substrate and other components.

[0049] In one possible implementation, at least one sealing ring can be arranged between the annular barrier wall and the upper cover to achieve better sealing effect at the connection position of the annular barrier wall and the upper cover. In the embodiment of the present application, the annular barrier wall and the upper cover of the cooling cover are arranged separately, and in the manufacturing process, the annular barrier wall and the chip can be mounted on the surface of the substrate first, and then the upper cover can be mounted after the plastic package and the metal protective layer are formed, so as to simplify the manufacturing process.

[0050] In the manufacturing method of the fluid cooling structure provided in the embodiment of the present application, the plastic package is locally thickened so that the part of the plastic package close to the chip is at least flush with the first surface of the chip, so that the side surface of the chip is substantially completely wrapped by the plastic package, and the stress of the chip at the corner position (i.e., the position where the first surface and the side surface are connected) is relieved. In this way, after the metal protective layer is formed on the chip and the plastic package, the metal protective layer is not prone to tearing, penetrating, delamination, and the like at the corner position of the chip, the integrity and reliability of the metal protective layer are improved, and the sealing reliability of the chip is improved, thereby preventing the chip from having problems such as local sealing failure, water bubble, corrosion, and electrical failure.

[0051] In some embodiments of the present application, the step two can specifically include: filling the plastic packaging material between the chip and the ring-shaped barrier wall by using a dispensing process, and adjusting the dispensing path and dosage in the dispensing process, so that the plastic packaging material, after solidification, forms a plastic packaging body covering the side surface of the chip and wrapping the edge of the first surface, i.e., the plastic packaging body can wrap the corner position of the chip. For example, during the dispensing process, the amount of glue near the chip can be increased, so that the plastic packaging body is locally thickened near the chip, so that the plastic packaging body wraps the corner position of the chip. Alternatively, the plastic packaging material can be first filled in the gap between the chip and the cooling cover, and after the plastic packaging material is solidified or semi-solidified, secondary dispensing is performed at the position around the chip, so that the obtained plastic packaging body is locally thickened near the chip.

[0052] In some embodiments of the present application, before the step one, the method can further include: placing a plurality of chips on the carrier board, and filling the plastic packaging material in the gap between the chips. In a possible implementation, the dispensing process can be used to fill the plastic packaging material between the chips, and the height of the filled plastic packaging material can be higher than the height of the chip, so that the plastic packaging material covers all or part of the upper surface of the chip. After the plastic packaging material is solidified, the surface of the chip and the surface of the plastic packaging material are ground to be flush with each other. Then, the plastic packaging material is cut at the position between the adjacent chips, to obtain a chip surrounded by a first plastic packaging body. The same manufacturing process can be used to obtain a plurality of chips surrounded by the first plastic packaging body, so as to simplify the steps of the manufacturing process and improve the manufacturing efficiency. In actual process, the number of chips can be set according to actual needs. In some cases, the first plastic packaging body can be thickened, so that the upper surface of the first plastic packaging body is slightly higher than the upper surface of the chip, or the first plastic packaging body covers the edge of the upper surface of the chip, so that the first plastic packaging body wraps the corner position of the chip. The step one can specifically include: fixing the chip surrounded by the first plastic packaging body and a ring-shaped barrier wall on the substrate, the ring-shaped barrier wall surrounds the first plastic packaging body, and the ring-shaped barrier wall has a gap with the first plastic packaging body. The step two can specifically include: filling the plastic packaging material between the first plastic packaging body and the ring-shaped barrier wall, and obtaining a second plastic packaging body surrounding the first plastic packaging body after solidification. In the manufacturing process, the first plastic packaging body and the second plastic packaging body can be made of the same plastic packaging material, or the first plastic packaging body and the second plastic packaging body can be made of different materials. Since the first plastic packaging body and the second plastic packaging body are manufactured at different times, there is a clear interface between the first plastic packaging body and the second plastic packaging body.

[0053] In some other embodiments of the present application, before or after the above step one, there can further include: performing a chamfering process on the edge of the first surface of the chip, so that the side surface of the obtained chip can include a first side surface and a second side surface. The first side surface is connected with the first surface, and the first side surface is connected with the second surface through the second side surface, and the included angle formed by the first side surface and the first surface is an obtuse angle. In the manufacturing process, the edge corner position of the chip can be cut before the chip is mounted on the surface of the substrate. For example, laser cutting or mechanical cutting can be used for cutting. Alternatively, the edge corner position of the chip can be cut after the chip is mounted on the surface of the substrate. For example, laser cutting can be used for cutting.

[0054] It should be understood that, in the specific implementation, the jet flow liquid cooling structure in the embodiments of the present application can also have other deformation structures, and the specific manufacturing process can refer to the above-mentioned implementation, which will not be illustrated one by one here.

[0055] In a third aspect, the embodiments of the present application also provide an electronic device. The electronic device provided by the embodiments of the present application can include any of the jet flow liquid cooling structures in the above-mentioned first aspect and a circuit board. The jet flow liquid cooling structure is fixed on the circuit board. Since the jet flow liquid cooling structure in the above-mentioned first aspect of the embodiments of the present application has good reliability, the electronic device including any of the jet flow liquid cooling structures also has good reliability. BRIEF DESCRIPTION OF DRAWINGS

[0056] FIG. 1 is a structural schematic diagram of a jet flow liquid cooling structure provided by the embodiments of the present application;

[0057] FIG. 2 is another structural schematic diagram of a jet flow liquid cooling structure provided by the embodiments of the present application;

[0058] FIG. 3 is another structural schematic diagram of a jet flow liquid cooling structure provided by the embodiments of the present application;

[0059] FIG. 4 is another structural schematic diagram of a jet flow liquid cooling structure provided by the embodiments of the present application;

[0060] FIG. 5 is another structural schematic diagram of a jet flow liquid cooling structure provided by the embodiments of the present application;

[0061] FIG. 6 is another structural schematic diagram of a jet flow liquid cooling structure provided by the embodiments of the present application;

[0062] FIG. 7 is another structural schematic diagram of a jet flow liquid cooling structure provided by the embodiments of the present application;

[0063] FIG. 8 is another structural schematic diagram of a jet flow liquid cooling structure provided by the embodiments of the present application;

[0064] FIG. 9 is another structural schematic diagram of a jet flow liquid cooling structure provided by the embodiments of the present application;

[0065] FIG. 10 is a structural schematic diagram of a chip in an embodiment of the present application;

[0066] FIG. 11 is another structural schematic diagram of a fluidic liquid cooling structure provided by an embodiment of the present application;

[0067] FIG. 12 is another structural schematic diagram of a fluidic liquid cooling structure provided by an embodiment of the present application;

[0068] FIG. 13 is another structural schematic diagram of a fluidic liquid cooling structure provided by an embodiment of the present application;

[0069] FIG. 14 is another structural schematic diagram of a fluidic liquid cooling structure provided by an embodiment of the present application;

[0070] FIG. 15 is a flowchart of a manufacturing method of a fluidic liquid cooling structure provided by an embodiment of the present application;

[0071] FIG. 16 is a structural schematic diagram corresponding to each step in the manufacturing method of a fluidic liquid cooling structure provided by an embodiment of the present application;

[0072] FIG. 17 is a top view structural schematic diagram in the manufacturing method of a fluidic liquid cooling structure provided by an embodiment of the present application;

[0073] FIG. 18 is another structural schematic diagram corresponding to each step in the manufacturing method of a fluidic liquid cooling structure provided by an embodiment of the present application;

[0074] FIG. 19 is another structural schematic diagram corresponding to each step in the manufacturing method of a fluidic liquid cooling structure provided by an embodiment of the present application.

[0075] Reference signs: 10 - substrate; 11 - chip; 12 - cooling cover; 121 - annular barrier wall; 122 - upper cover; 123 - sealing ring; 13 - plastic encapsulation body; 131 - first plastic encapsulation body; 132 - second plastic encapsulation body; 14 - metal protective layer; 15 - adhesive layer; 16 - surface treatment layer; 17 - protective layer; 18 - carrier plate; 19 - plastic encapsulation material; Q - cavity; U1 - inlet; U2 - outlet; S1 - first surface; S2 - second surface; S3 - side surface; S31 - first side surface; S32 - second side surface. DETAILED DESCRIPTION

[0076] In order to make the purpose, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings.

[0077] It should be noted that the drawings of the present application are only used for illustrating relative position relationship and do not represent real proportions. The same reference signs in the drawings of the present application represent the same or similar structures, and thus repeated description will be omitted.

[0078] The expression position and direction described in the present application, for example, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, are based on the orientation or positional relationship shown in the drawings for description and simplification of the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. Changes can also be made as needed, and the changes made are included within the scope of protection of the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0079] In order to facilitate the understanding of the technical solutions of the embodiments of the present application, first, the heat dissipation principle of the jet flow liquid cooling structure in the embodiments of the present application is described. Fig. 1 is a structural schematic diagram of the jet flow liquid cooling structure provided by the embodiments of the present application, as shown in Fig. 1, the jet flow liquid cooling structure provided by the embodiments of the present application can include: a substrate 10, a chip 11 and a cooling cover 12. The chip 11 and the cooling cover 12 are located above the substrate 10, the cooling cover 12 and the substrate 10 form a cavity Q, and the chip 11 is located inside the cavity Q. There is no filling medium material in the cavity Q, which is convenient for accommodating the cooling liquid when the jet flow liquid cooling structure is working. The cooling cover 12 is provided with an inlet U1 and an outlet U2 for flowing in and flowing out of the cooling liquid respectively. In specific setting, the number of the inlet U1 and the outlet U2 in the cooling cover 12 can be one or more, and the number and position of the inlet U1 and the outlet U2 can be set according to actual needs. In Fig. 1, the cooling liquid is represented by arrows. When the jet flow liquid cooling structure is working, the cooling liquid flows through the inlet U1 of the cavity Q under a certain pressure difference, forming high-speed jet flow liquid, which impacts the surface of the chip 11 for heat exchange, and then the cooling liquid flows out through the outlet U2 of the cavity Q, thereby taking away the heat.

[0080] From the point of view of thermal resistance chain, the jet flow liquid cooling structure in the embodiments of the present application does not need to set a thermal interfacial material (TIM) layer, directly avoids the heat dissipation bottleneck of chip packaging, and in addition, avoids the use of heat conduction thermal resistance such as heat dissipation cover, cold plate or heat sink, and the heat dissipation path of the chip is more direct. From the cooling form, compared with the traditional air cooling and micro-channel liquid cooling, the impact speed of the jet flow liquid in the jet flow liquid cooling structure is greater, which can form a thinner heat exchange boundary layer on the surface of the chip, and the heat exchange capacity of the jet flow liquid cooling structure is more significant.

[0081] Continuing to refer to FIG. 1, in the related art, in order to prevent the cooling liquid from penetrating into the substrate 10, the organic material such as the underfill (UF) and the like under the chip 11, causing the electrical failure and the reliability problem of the chip 11 or the substrate 10, it is necessary to form a sealing structure (not shown in FIG. 1) around the chip 11. However, since the heat dissipation efficiency of the chip 11 is related to the jet velocity of the cooling liquid, and the jet velocity of the cooling liquid is related to the pressure difference between the inlet U1 and the outlet U2, under high impact pressure, the penetration probability of the cooling liquid is further increased, which requires the sealing structure of the chip 11 to have high pressure resistance, and the pressure resistance of the sealing structure needs to be matched with the heat dissipation design.

[0082] In order to improve the sealing reliability of the chip in the chip-level jet flow liquid cooling structure, the embodiments of the present application provide a jet flow liquid cooling structure, a manufacturing method thereof, and an electronic device. The jet flow liquid cooling structure provided by the embodiments of the present application can be a chip-level jet flow liquid cooling structure. Of course, in some cases, the jet flow liquid cooling structure in the embodiments of the present application can also be applied to other heat dissipation scenes such as package level and board level, which are not limited here. The jet flow liquid cooling structure in the embodiments of the present application can be applied to various types of electronic devices, for example, can be applied to terminal devices such as mobile phones, tablet computers, notebook computers, and smart wearable devices, or can also be applied to other electronic devices such as smart televisions, smart door locks, and smart home appliances.

[0083] FIG. 2 is another structural schematic diagram of the jet flow liquid cooling structure provided by the embodiments of the present application. As shown in FIG. 2, the jet flow liquid cooling structure provided by the embodiments of the present application can include a substrate 10, a chip 11, a cooling cover 12, a plastic package 13, and a metal protective layer 14. The chip 11 and the cooling cover 12 are located above the substrate 10, the cooling cover 12 and the substrate 10 form a cavity Q, and the chip 11 is located inside the cavity Q. The chip 11 in the embodiments of the present application can be various forms of chips, for example, the chip 11 can be a chip die, or the chip 11 can also be a chip with a certain degree of packaging. FIG. 2 is a schematic diagram of the jet flow liquid cooling structure in a working state, and the cavity Q is not filled with a medium material. The cavity Q can contain cooling liquid when the jet flow liquid cooling structure is working. The cooling cover 12 is provided with an inlet and an outlet for flowing in and out of the cooling liquid, respectively. The inlet and the outlet on the cooling cover 12 are not shown in the view angle shown in FIG. 2, and the specific setting of the inlet and the outlet can refer to the structure shown in FIG. 1.

[0084] In some embodiments of the present application, the cooling cover 12 can include a ring-shaped barrier wall 121 and an upper cover 122. The ring-shaped barrier wall 121 is located above the substrate 10 and surrounds the chip 11. The upper cover 122 is located on the side of the ring-shaped barrier wall 121 away from the substrate 10, and the upper cover 122 is provided with an inlet and an outlet. In the embodiments of the present application, the inlet and the outlet are both arranged in the upper cover 122, but in actual arrangement, the inlet can be arranged in the upper cover 122 and the outlet can be arranged in the ring-shaped barrier wall 121, and the positions and the number of the inlet and the outlet can be reasonably arranged according to actual conditions. In a possible implementation manner, the opening size of the upper cover 122 can be greater than the opening size of the ring-shaped barrier wall 121, the upper cover 122 can be covered on the ring-shaped barrier wall 121, and the opening edge of the upper cover 122 surrounds the outside of the ring-shaped barrier wall 121. Of course, in some cases, the opening size of the upper cover 122 can also be less than or equal to the opening size of the ring-shaped barrier wall 121, as long as the upper cover 122 can be covered on the ring-shaped barrier wall 121. In actual arrangement, at least one sealing ring 123 can be arranged between the ring-shaped barrier wall 121 and the upper cover 122, so that the sealing effect at the connecting position of the ring-shaped barrier wall 121 and the upper cover 122 is better. In the embodiments of the present application, the ring-shaped barrier wall 121 and the upper cover 122 in the cooling cover 12 are arranged separately, in the manufacturing process, the ring-shaped barrier wall 121 and the chip 11 can be first installed on the surface of the substrate 10, and then the upper cover 122 is installed after the plastic package 13 and the metal protection layer 14 are formed, so that the manufacturing process can be simplified. Of course, in some cases, the cooling cover 12 can also be arranged as an integral structure, and can be arranged according to actual conditions.

[0085] In a possible implementation manner, the cooling cover 12 can be fixed to the surface of the substrate 10 through the adhesive layer 15. Exemplarily, the adhesive layer 15 can include a colloid material with adhesive properties, or the adhesive layer 15 can also include other materials with adhesive properties. The pattern of the adhesive layer 15 can be basically consistent with the pattern of the ring-shaped barrier wall 121, that is, the shape of the adhesive layer 15 can be ring-shaped. The adhesive layer 15 can be an integral ring-shaped structure, or the adhesive layer 15 can include a plurality of adhesive parts arranged separately, and each adhesive part in the adhesive layer 15 can surround a ring shape.

[0086] In the embodiments of the present application, the plastic encapsulation 13 and the metal protective layer 14 are arranged around the chip 11, which can effectively seal the chip 11 and prevent the cooling liquid from penetrating into the chip 11 and the substrate 10. Specifically, the plastic encapsulation 13 is arranged above the substrate 10, and the plastic encapsulation 13 is filled between the chip 11 and the cooling cover 12. For example, the chip 11 can be completely surrounded by the plastic encapsulation 13, that is, the plastic encapsulation 13 can be an annular structure surrounding the chip 11. The plastic encapsulation 13 generally includes an organic material such as resin, which can fill the gap around the chip 11 and protect the chip 11. The metal protective layer 14 covers the surface of the plastic encapsulation 13 away from the substrate 10, and covers the gap between the chip 11 and the plastic encapsulation 13. That is, the metal protective layer 14 covers the surface of the plastic encapsulation 13 away from the substrate 10 and overlaps the edge of the chip 11. By arranging the metal protective layer 14 to cover the surface of the plastic encapsulation 13 away from the substrate 10, the cooling liquid can be prevented from soaking the plastic encapsulation 13, and the cooling liquid can be prevented from penetrating into the substrate 10 and other structures below through the plastic encapsulation 13, thereby causing electrical failure and reliability problems. In addition, by arranging the metal protective layer 14 to cover the gap between the chip 11 and the plastic encapsulation 13, the cooling liquid can be prevented from penetrating into the substrate 10 and other structures below through the gap between the chip 11 and the plastic encapsulation 13.

[0087] In a specific arrangement, the metal protective layer 14 can include a metal material, for example, the metal material can be copper, nickel, gold, etc. Since the metal material has a low permeability, the cooling liquid can be effectively prevented from penetrating towards the chip 11 and the substrate 10. In order to make the metal protective layer 14 have a good anti-permeation effect, the thickness of the metal protective layer 14 can be set to be thick, for example, the thickness of the metal protective layer 14 can be in micrometers (μm), for example, the thickness of the metal protective layer 14 can be set to several micrometers or tens of micrometers.

[0088] In the manufacturing process of the plastic package 13, a dispensing process is generally used to fill the liquid plastic package material into the gap between the chip 11 and the cooling cover 12, and the plastic package 13 is obtained by solidification. However, due to the flowability and tension of the liquid plastic package material, the height of the plastic package material is difficult to control. Under the action of tension, the liquid plastic package material often forms an arc climbing on the side surface of the chip 11, so that the upper surface of the obtained plastic package 13 (the surface on the side of the plastic package 13 away from the substrate 10) is generally lower than the upper surface of the chip 11 (the surface on the side of the chip 11 away from the substrate 10). If the dispensing amount of the plastic package material is increased, the liquid plastic package material will flow to the upper surface of the chip 11, and the plastic package 13 obtained after solidification will cover the upper surface of the chip 11. Since the thermal conductivity of the plastic package material is poor, the plastic package 13 covering the upper surface of the chip 11 will seriously affect the heat dissipation effect of the chip 11. Therefore, in the actual manufacturing process, the upper surface of the obtained plastic package 13 is generally lower than the upper surface of the chip 11, so that the side surface of the chip 11 cannot be completely wrapped by the plastic package 13, resulting in a sharp corner at the corner position of the chip 11 (i.e., the position where the upper surface and the side surface are connected, such as the position shown by the dashed line circle M in FIG. 2). In this way, after the metal protective layer 14 is formed on the chip 11 and the plastic package 13, the corner position of the chip 11 will become a stress concentration point of the metal protective layer 14. In the subsequent packaging process, power consumption and other scenarios, under the condition of temperature cycle stress, the metal protective layer 14 covering the corner position of the chip 11 will be torn and penetrated, which can easily cause local sealing failure, water blistering, corrosion and electrical failure of the chip 11, and other problems.

[0089] FIG. 3 is another structural schematic diagram of the jet flow liquid cooling structure provided by the embodiments of the present application. As shown in FIG. 3, in the embodiments of the present application, the chip 11 has a first surface S1, a second surface S2 and a side surface S3, wherein the first surface S1 is the surface on the side of the chip 11 away from the substrate 10, i.e., the upper surface of the chip 11 mentioned above, the second surface S2 is the surface on the side of the chip 11 toward the substrate 10, and the side surface S3 connects the first surface S1 and the second surface S2. The plastic package 13 covers the side surface S3 of the chip 11, and the part of the plastic package 13 close to the chip 11 is at least flush with the first surface S1 of the chip 11. That is, the part of the plastic package 13 close to the chip 11 is flush with the first surface S1 of the chip 11, or the part of the plastic package 13 close to the chip 11 is higher than the first surface S1 of the chip 11. It can be understood that in the embodiments of the present application, flush means that the two planes are basically flush within a certain error range.

[0090] In the liquid jet cooling structure provided in the embodiment of the present application, by locally thickening the plastic sealing body 13, the part of the plastic sealing body 13 close to the chip 11 is at least flush with the first surface S1 of the chip 11, so that the side surface S3 of the chip 11 is substantially completely wrapped by the plastic sealing body 13, the stress of the chip 11 at the corner position (i.e. the position where the first surface S1 and the side surface S3 are connected) is relieved, the metal protective layer 14 is not prone to tearing, penetrating, delamination and other phenomena at the corner position of the chip 11, the integrity and reliability of the metal protective layer 14 are improved, and the sealing reliability of the chip 11 is improved, thereby preventing the chip 11 from having problems such as local sealing failure, water bubble, corrosion and electrical failure, and thus the reliability of the liquid jet cooling structure in the embodiment of the present application is better.

[0091] In some embodiments of the present application, the metal protective layer 14 can be a full-area film layer covering the first surface S1 of the chip 11 and the surface of the plastic package 13 facing away from the substrate 10. In this way, the metal protective layer 14 is less likely to have defect points, and the metal protective layer 14 has better permeation prevention effect, thereby improving the reliability of the metal protective layer 14. In a possible implementation, as shown in FIG. 3, the metal protective layer 14 can cover the first surface S1 of the chip 11, the surface of the plastic package 13 facing away from the substrate 10, and the inner wall of the annular barrier wall 121. In addition, the metal protective layer 14 can also cover the top of the annular barrier wall 121 and extend to the outer side wall of the annular barrier wall 121. In this way, the area of the metal protective layer 14 is larger, and the metal protective layer 14 has better bonding effect with the chip 11, the plastic package 13 and other components, so that the metal protective layer 14 is less likely to have defect points and is less likely to peel off. In another possible implementation, as shown in FIG. 4, which is another structural schematic diagram of the liquid jet cooling structure provided by the embodiments of the present application, the metal protective layer 14 can cover the first surface S1 of the chip 11, the surface of the plastic package 13 facing away from the substrate 10, and the inner wall of the annular barrier wall 121. The metal protective layer 14 can not extend to the outer side wall of the annular barrier wall 121. The metal protective layer 14 can cover the top surface of the annular barrier wall 121, or the metal protective layer 14 can not cover the top surface of the annular barrier wall 121. In this way, the area of the metal protective layer 14 is larger, and the metal protective layer 14 has better bonding effect with the chip 11, the plastic package 13 and other components. In another possible implementation, as shown in FIG. 5, which is another structural schematic diagram of the liquid jet cooling structure provided by the embodiments of the present application, the metal protective layer 14 can cover the first surface S1 of the chip 11 and the surface of the plastic package 13 facing away from the substrate 10, i.e., the metal protective layer 14 can not cover the annular barrier wall 121. In this way, the metal protective layer 14 has better permeation prevention effect, and is less likely to have defect points and peel off. In the structures shown in FIGS. 3 to 5, the first surface S1 of the chip 11 is covered by the metal protective layer 14. Since the first surface S1 of the chip 11 is generally not provided with conductive structures such as electrodes and circuits, the first surface S1 of the chip 11 is in contact with the metal protective layer 14, and will not cause short circuit, series connection and other defects.

[0092] In some embodiments of the present application, as shown in FIG. 6, which is another structural schematic diagram of the liquid jet cooling structure provided by the embodiments of the present application, the metal protection layer 14 can cover the surface of the plastic package 13 on the side away from the substrate 10 and extend to the edge of the first surface S1 of the chip 11, and most of the area of the first surface S1 of the chip 11 is not covered by the metal protection layer 14, that is, the pattern of the metal protection layer 14 can be annular around the chip 11. Generally, the first surface S1 of the chip 11 is not provided with conductive structures such as electrodes and circuits, and thus the first surface S1 of the chip 11 will not be damaged after being in contact with the cooling liquid, and most of the middle area of the first surface S1 of the chip 11 can also not be covered by the metal protection layer 14. In this way, the metal protection layer 14 can also play a better anti-permeation effect.

[0093] In a specific implementation, in order to enhance the adhesion of the metal protection layer 14, an adhesion layer can also be arranged between the metal protection layer 14 and the chip 11, between the metal protection layer 14 and the plastic package 13, and between the metal protection layer 14 and the annular barrier wall 121. Exemplarily, the adhesion layer can be a metal material such as titanium (Ti) and aluminum (Al). In a specific implementation, the pattern of the adhesion layer can be a full-surface film layer consistent with the pattern of the metal protection layer 14, or the pattern of the adhesion layer can also be arranged at some positions where the metal protection layer 14 is prone to falling off, which can be set according to actual conditions.

[0094] FIG. 7 is another structural schematic diagram of the liquid jet cooling structure provided by the embodiments of the present application. As shown in FIG. 7, in a possible implementation, the liquid jet cooling structure in the embodiments of the present application can further include a surface treatment layer 16 on the surface of the metal protection layer 14. The surface treatment layer 16 covers the surface of the metal protection layer 14 and can prevent the metal protection layer 14 from being oxidized, washed, corroded, and the like. Exemplarily, the surface treatment layer 16 can include a metal material or an inorganic material with functions of anti-oxidation, anti-washing, and anti-corrosion. In the manufacturing process, a material with functions of anti-oxidation, anti-washing, and anti-corrosion can be used to form the surface treatment layer 16 on the surface of the metal protection layer 14, or the surface of the metal protection layer 14 can be surface-treated to form the surface treatment layer 16 on the surface of the metal protection layer 14. In another possible implementation, when the metal protection layer 14 itself has good functions of anti-oxidation, anti-washing, and anti-corrosion, for example, the metal protection layer 14 includes an anti-oxidation metal material such as gold and platinum, the surface of the metal protection layer 14 can also not be provided with the surface treatment layer 16.

[0095] The above introduces the basic structure of the liquid jet cooling structure in the embodiments of the present application, and the specific implementation of the plastic package in the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0096] Implementation manner one

[0097] As shown in FIG. 3, in some embodiments of the present application, the plastic package 13 covers the side surface S3 of the chip 11, and the plastic package 13 wraps the edge of the first surface S1. In this way, the plastic package 13 can wrap the corner position of the chip 11, and reduce the stress of the chip 11 at the corner position. After the metal protection layer 14 is formed on the surface of the chip 11 and the plastic package 13, the metal protection layer 14 can be smoothly transitioned along the surface of the plastic package 13, so that the metal protection layer 14 is not prone to tearing, penetrating, delamination and other phenomena at the corner position of the chip 11 in scenarios such as reliability testing and actual application, and the integrity and reliability of the metal protection layer 14 are improved, thereby improving the sealing reliability of the chip 11. In a possible implementation, the part of the surface of the plastic package 13 away from the substrate 10 and close to the chip 11 can be curved, so that the slope of the surface of the plastic package 13 away from the substrate 10 is relatively gentle, and the metal protection layer 14 formed subsequently can extend along the surface of the plastic package 13 and be smoothly transitioned at the position close to the chip 11, thereby effectively preventing the metal protection layer 14 from tearing, penetrating, delaminating and other phenomena at the corner position of the chip 11. Of course, the surface of the plastic package 13 away from the substrate 10 can also be other shapes, as long as it can wrap the corner position of the chip 11 and does not form a stress concentration point, and can be set according to actual conditions.

[0098] In the actual process, after the chip 11 and the annular barrier wall 121 are installed on the surface of the substrate 10, the liquid plastic packaging material is filled in the gap between the chip 11 and the cooling cover 12 by using the dispensing process, and the plastic package 13 is obtained after solidification. The dispensing process path and the glue amount can be adjusted, so that the plastic packaging material can form a natural glue after solidification. The edge of the first surface S1 of the chip 11 can be wrapped to make the obtained plastic package 13 wrap the corner position of the chip 11. For example, during the dispensing process, the glue amount at the position close to the chip 11 can be increased, so that the plastic package 13 is locally thickened at the position close to the chip 11, so that the plastic package 13 wraps the corner position of the chip 11. For another example, the plastic packaging material can be filled in the gap between the chip 11 and the cooling cover 12 first, and the secondary dispensing can be performed at the position around the chip 11 after the plastic packaging material is solidified or semi-solidified, so that the obtained plastic package 13 is locally thickened at the position close to the chip 11.

[0099] Implementation two:

[0100] FIG. 8 is another structural schematic diagram of the jet flow liquid cooling structure provided by the embodiments of the present application. As shown in FIG. 8, in some other embodiments of the present application, the plastic package 13 can include a first plastic package 131 and a second plastic package 132. The first plastic package 131 surrounds the chip 11, and the second plastic package 132 surrounds the first plastic package 131. In the embodiments of the present application, the first plastic package 131 and the second plastic package 132 can be annular. The first plastic package 131 covers the side surface S3 of the chip 11, and the surface of the first plastic package 131 away from the substrate 10 is at least flush with the first surface S1. In a possible implementation, the surface of the first plastic package 131 away from the substrate 10 can be flush with the first surface S1. In this way, the side surface S3 of the chip 11 can be completely wrapped by the first plastic package 131, and the first surface S1 of the chip 11 and the upper surface (the surface away from the substrate 10) of the first plastic package 131 substantially constitute a plane. The subsequently formed metal protection layer 14 can be smoothly transitioned along the interface plane constituted by the chip 11 and the first plastic package 131, and the metal protection layer 14 will not form a stress concentration point at the position between the chip 11 and the first plastic package 131, thereby improving the integrity and reliability of the metal protection layer 14. In another possible implementation, the surface of the first plastic package 131 away from the substrate 10 can be slightly higher than the first surface S1. Since the stress generated by the plastic package material is small, the metal protection layer 14 can be smoothly transitioned along the surface of the first plastic package 131, and the metal protection layer 14 will not form a stress concentration point at the position between the chip 11 and the first plastic package 131, thereby also improving the integrity and reliability of the metal protection layer 14.

[0101] In addition, the thickness of the second plastic package 132 can be less than or equal to the thickness of the first plastic package 131, and the upper surface (the surface away from the substrate 10) of the second plastic package 132 can be flush with the upper surface of the first plastic package 131, or the upper surface of the second plastic package 132 can be lower than the upper surface of the first plastic package 131. That is, there can be a height difference between the second plastic package 132 and the first plastic package 131. Since the first plastic package 131 and the second plastic package 132 both include plastic package materials, the first plastic package 131 and the second plastic package 132 can include the same plastic package material, or the first plastic package 131 and the second plastic package 132 can include different plastic package materials. That is, the materials of the first plastic package 131 and the second plastic package 132 are the same or similar, and thus the coefficient thermal expansion (CTE) mismatch between the first plastic package 131 and the second plastic package 132 is small, and the stress generated at the position between the first plastic package 131 and the second plastic package 132 is relatively moderate. Even if there is a height difference between the first plastic package 131 and the second plastic package 132, the metal protection layer 14 will not form a stress concentration point at the position between the first plastic package 131 and the second plastic package 132.

[0102] Therefore, in the second implementation, the plastic package 13 is arranged to include the first plastic package 131 and the second plastic package 132, which can effectively prevent the metal protection layer 14 from forming a stress concentration point at the corner position of the chip 11, thereby improving the integrity and reliability of the metal protection layer 14.

[0103] The third implementation:

[0104] FIG. 9 is another structural schematic diagram of the jet flow liquid cooling structure provided by the embodiments of the present application. As shown in FIG. 9, in some other embodiments of the present application, the side surface S3 of the chip 11 can include a first side surface S31 and a second side surface S32. The first side surface S31 is connected with the first surface S1, and the first side surface S31 is connected with the second surface S2 through the second side surface S32. The included angle formed by the first side surface S31 and the first surface S1 is an obtuse angle, and the plastic package 13 covers the first side surface S31 and the second side surface S32. In the manufacturing process, the corner position of the chip 11 can be cut off to obtain the inclined first side surface S31 before the plastic package 13 is formed, so that the edge of the chip 11 has no right angle. In this way, in the process of forming the plastic package 13, the plastic material can automatically climb to the inclined first side surface S31 along the second side surface S32 under the action of surface tension, so that the plastic package 13 formed by solidification has a natural arc transition. The metal protection layer 14 formed subsequently can smoothly transition along the surface of the chip 11 and the plastic package 13, and the metal protection layer 14 will not form a stress concentration point at the corner position of the chip 11, thereby improving the integrity and reliability of the metal protection layer 14.

[0105] In the manufacturing process, the corner position of the chip 11 can be cut before the chip 11 is installed on the surface of the substrate 10. For example, laser cutting or mechanical cutting can be used for cutting. Alternatively, the corner position of the chip 11 can be cut after the chip 11 is installed on the surface of the substrate 10. For example, laser cutting can be used for cutting.

[0106] FIG. 10 is a structural schematic diagram of a chip in an embodiment of the present application. As shown in (1) of FIG. 10, in a possible implementation, the first side surface S31 can be a plane. In the manufacturing process, the chip 11 can be cut at the corner position by using a straight line cutting method, for example, the chip 11 can be cut at the corner position along the dashed line in the figure. As shown in (2) of FIG. 10, in another possible implementation, the first side surface S31 can be an arc surface. In the manufacturing process, the chip 11 can be cut at the corner position by using an arc line cutting method, for example, the chip 11 can be cut at the corner position along the dashed line in the figure. Of course, in some cases, the first side surface S31 can also be of other shapes, which are not limited herein.

[0107] Implementation four:

[0108] FIG. 11 is another structural schematic diagram of a liquid jet cooling structure provided by an embodiment of the present application. As shown in FIG. 11, in some other embodiments of the present application, the above-mentioned implementation one and implementation two can be combined, the plastic package 13 is set to include the first plastic package 131 and the second plastic package 132, and the first plastic package 131 is locally thickened, so that the first plastic package 131 wraps the edge of the first surface S1 of the chip 11, thereby further improving the reliability of the metal protection layer 14. The specific implementation of the implementation four can refer to the above-mentioned implementation one and implementation two, and the repeated parts will not be described herein.

[0109] Implementation five:

[0110] FIG. 12 is another structural schematic diagram of a liquid jet cooling structure provided by an embodiment of the present application. As shown in FIG. 12, in some other embodiments of the present application, the above-mentioned implementation one and implementation three can be combined, the chip 11 is cut at the corner position, so that the chip 11 has an inclined first side surface S31, and the plastic package 13 is locally thickened, so that the plastic package 13 wraps the edge of the first surface S1 of the chip 11, thereby further improving the reliability of the metal protection layer 14. The specific implementation of the implementation five can refer to the above-mentioned implementation one and implementation three, and the repeated parts will not be described herein.

[0111] Implementation six:

[0112] FIG. 13 is another structural schematic diagram of a liquid jet cooling structure provided by an embodiment of the present application. As shown in FIG. 13, in some other embodiments of the present application, the above-mentioned implementation two and implementation three can be combined, the chip 11 is cut at the corner position, so that the chip 11 has an inclined first side surface S31, and the plastic package 13 is set to include the first plastic package 131 and the second plastic package 132, thereby further improving the reliability of the metal protection layer 14. The specific implementation of the implementation six can refer to the above-mentioned implementation two and implementation three, and the repeated parts will not be described herein.

[0113] Implementation seven

[0114] FIG. 14 is another structural schematic diagram of the jet flow liquid cooling structure provided by the embodiments of the present application. As shown in FIG. 14, in some other embodiments of the present application, the implementation one, the implementation two and the implementation three can be combined, the corner position of the chip 11 is cut off, the chip 11 has an inclined first side surface S31, the plastic package 13 is set to include the first plastic package 131 and the second plastic package 132, and the first plastic package 131 is partially thickened to wrap the edge of the first surface S1 of the chip 11, so as to further improve the reliability of the metal protection layer 14. The specific implementation of the implementation seven can refer to the implementation one, the implementation two and the implementation three, and the repeated parts will not be described here.

[0115] The above introduces several implementation manners of the plastic package in the embodiments of the present application. It should be understood that the plastic package can also have other implementation manners in specific implementation, which will not be exemplified one by one here.

[0116] Based on the same technical concept, the embodiments of the present application also provide a manufacturing method of the jet flow liquid cooling structure. FIG. 15 is a flow chart of the manufacturing method of the jet flow liquid cooling structure provided by the embodiments of the present application, and FIG. 16 is a structural schematic diagram corresponding to each step in the manufacturing method of the jet flow liquid cooling structure provided by the embodiments of the present application. As shown in FIG. 15 and FIG. 16, the manufacturing method of the jet flow liquid cooling structure provided by the embodiments of the present application can include:

[0117] S201, referring to (1) in FIG. 16, the chip 11 and the annular barrier wall 121 are fixed on the substrate 10, so that the annular barrier wall 121 surrounds the chip 11. Wherein, the chip 11 has a first surface S1, a second surface S2 and a side surface S3, the first surface S1 is the surface of the chip 11 away from the substrate 10, the second surface S2 is the surface of the chip 11 towards the substrate 10, and the side surface S3 connects the first surface S1 and the second surface S2. In one possible implementation, the annular barrier wall 121 can be fixed on the surface of the substrate 10 through the adhesive layer 15. Exemplarily, the adhesive layer 15 can include a colloidal material with adhesive property, or the adhesive layer 15 can also include other materials with adhesive property. The pattern of the adhesive layer 15 can be basically consistent with the pattern of the annular barrier wall 121, that is, the shape of the adhesive layer 15 can be annular. The adhesive layer 15 can be an annular integral structure, or the adhesive layer 15 can include a plurality of adhesive parts arranged separately, and each adhesive part in the adhesive layer 15 can form an annulus.

[0118] S202, referring to (2) in FIG. 16, the plastic encapsulation 13 is filled between the chip 11 and the annular barrier wall 121, so that the plastic encapsulation 13 covers the side surface S3 of the chip 11, and the part of the plastic encapsulation 13 close to the chip 11 is at least flush with the first surface S1. That is, the part of the plastic encapsulation 13 close to the chip 11 is flush with the first surface S1 of the chip 11, or the part of the plastic encapsulation 13 close to the chip 11 is higher than the first surface S1 of the chip 11. It can be understood that, in the embodiment of the present application, flush means that the two planes are substantially flush within a certain error range. In the actual process, the point gluing process can be used to fill the liquid plastic encapsulation material in the gap between the chip 11 and the annular barrier wall 121, and the plastic encapsulation 13 is obtained by solidification. In the process of manufacturing the plastic encapsulation 13, the plastic encapsulation 13 can be locally thickened, so that the part of the plastic encapsulation 13 close to the chip 11 is at least flush with the first surface S1 of the chip 11.

[0119] Referring to (3) in FIG. 16, after the above step S202, a protective layer 17 can be formed on the surface of the substrate 10 away from the chip 11 to prevent the substrate 10 from being damaged in the subsequent manufacturing process. Exemplarily, the protective layer 17 can be a film layer with a protective function such as an adhesive tape.

[0120] S203, referring to (4) in FIG. 16, a metal protective layer 14 is formed on the chip 11 and the plastic encapsulation 13, so that the metal protective layer 14 covers the surface of the plastic encapsulation 13 away from the substrate 10, and the metal protective layer 14 covers the gap between the chip 11 and the plastic encapsulation 13. That is, the metal protective layer 14 covers the surface of the plastic encapsulation 13 away from the substrate 10, and overlaps the edge of the chip 11. Thus, the metal protective layer 14 can effectively prevent the cooling liquid from penetrating into the structures such as the chip 11 and the substrate 10 below.

[0121] In the manufacturing process, the metal protective layer 14 can be made of metal materials such as copper, nickel and gold, and the thickness of the metal protective layer 14 can be in micrometers (μm), for example, the thickness of the metal protective layer 14 can be several micrometers or tens of micrometers.

[0122] In the actual process, in order to enhance the adhesion of the metal protective layer 14, an adhesion layer can be formed in the area where the metal protective layer 14 is to be formed before the metal protective layer 14 is formed. Exemplarily, the adhesion layer can be made of metal materials such as titanium (Ti) and aluminum (Al). The pattern of the adhesion layer can be a full-surface film layer consistent with the pattern of the metal protective layer 14, or the pattern of the adhesion layer can be set at some positions where the metal protective layer 14 is prone to fall off, which can be set according to the actual situation.

[0123] Referring to (5) of FIG. 16, after the metal protection layer 14 is formed, a surface treatment layer 16 can also be formed on the surface of the metal protection layer 14. The surface treatment layer 16 covers the surface of the metal protection layer 14 and can prevent the metal protection layer 14 from being oxidized, washed, corroded, etc. During the manufacturing process, a material with the functions of oxidation resistance, wash resistance, corrosion resistance, etc. such as a metal material or an inorganic material can be used to form the surface treatment layer 16 on the surface of the metal protection layer 14, or the surface of the metal protection layer 14 can be surface treated to form the surface treatment layer 16 on the surface of the metal protection layer 14. In some cases, when the metal protection layer 14 itself has good oxidation resistance, wash resistance, corrosion resistance, etc. such as when the metal protection layer 14 includes an oxidation-resistant metal material such as gold or platinum, the surface treatment layer 16 can not be formed on the surface of the metal protection layer 14.

[0124] Referring to (6) of FIG. 16, the protective layer on the surface of the substrate 10 away from the chip 11 is removed, and then a plurality of solder balls are formed on the surface of the substrate 10 away from the chip 11 to facilitate electrical connection of the substrate 10 with other components.

[0125] S204, an upper cover is installed on the annular barrier wall 121 to obtain the structure shown in (7) of FIG. 16. The upper cover 122 is provided with an inlet and an outlet (not shown in the figure) for inflow and outflow of the cooling liquid, respectively. In one possible implementation, at least one sealing ring 123 can be arranged between the annular barrier wall 121 and the upper cover 122 to achieve better sealing effect at the connection position of the annular barrier wall 121 and the upper cover 122. In the embodiment of the present application, the annular barrier wall 121 and the upper cover 122 of the cooling cover 12 are arranged separately. During the manufacturing process, the annular barrier wall 121 and the chip 11 can be first installed on the surface of the substrate 10, and then the upper cover 122 is installed after the plastic package 13 and the metal protection layer 14 are formed, which can simplify the manufacturing process.

[0126] In the manufacturing method of the fluid-cooled structure provided in the embodiment of the present application, the plastic package 13 is locally thickened so that the part of the plastic package 13 close to the chip 11 is at least flush with the first surface S1 of the chip 11, which can substantially completely wrap the side surface S3 of the chip 11 and relieve the stress of the chip 11 at the corner position (i.e., the position where the first surface S1 and the side surface S3 are connected). After the metal protection layer 14 is formed on the chip 11 and the plastic package 13, the metal protection layer 14 is less likely to be torn, penetrated, delaminated, etc. at the corner position of the chip 11, which improves the integrity and reliability of the metal protection layer 14 and further improves the sealing reliability of the chip 11, preventing the chip 11 from having problems such as local sealing failure, water bubble, corrosion, and electrical failure, etc.

[0127] In some embodiments of the present application, the step S202 can specifically include:

[0128] Referring to (2) in FIG. 16, the dispensing process is adopted to fill the plastic packaging material between the chip 11 and the annular barrier wall 121. The dispensing path and the dosage in the dispensing process are adjusted so that, after the plastic packaging material is solidified, the plastic packaging body 13 covering the side surface S3 of the chip 11 and wrapping the edge of the first surface S1 is obtained, that is, the plastic packaging body 13 can wrap the corner position of the chip 11, and the structure in the above-mentioned implementation manner one can be obtained. For example, during the dispensing process, the amount of glue at the position close to the periphery of the chip 11 can be increased, so that the plastic packaging body 13 is locally thickened at the position close to the periphery of the chip 11, so that the plastic packaging body 13 wraps the corner position of the chip 11. Alternatively, the plastic packaging material can be first filled in the gap between the chip 11 and the cooling cover 12, and after the plastic packaging material is solidified or semi-solidified, secondary dispensing is performed at the position around the chip 11, so that the obtained plastic packaging body 13 is locally thickened at the position close to the periphery of the chip 11.

[0129] In some embodiments of the present application, as shown in FIG. 17, which is a top view structural schematic diagram of the manufacturing method of the fluid-jet liquid cooling structure provided by the embodiments of the present application, before the above-mentioned step S201, the method can further include:

[0130] Referring to (1) in FIG. 17, the plurality of chips 11 are placed on the carrier board 18, and the plastic packaging material 19 is filled in the gap between the chips 11. In a possible implementation manner, the dispensing process can be adopted to fill the plastic packaging material 19 between the chips 11. The height of the filled plastic packaging material 19 can be higher than the height of the chip 11, so that the plastic packaging material 19 covers all or part of the upper surface of the chip 11.

[0131] Referring to (2) in FIG. 17, after the plastic packaging material 19 is solidified, the surface of each chip 11 and the plastic packaging material 19 is ground so that the plastic packaging material 19 is flush with the surface of the chip 11.

[0132] Referring to (3) in FIG. 17, the plastic packaging material 19 is cut at the position between the adjacent chips 11, for example, the plastic packaging material 19 can be cut along the dashed line in the drawing, and the chip 11 surrounded by the first plastic packaging body 131 is obtained.

[0133] In the manufacturing process shown in FIG. 17, a plurality of chips 11 surrounded by the first plastic package 131 can be obtained, so that the manufacturing process can be simplified and the manufacturing efficiency can be improved. For a clearer illustration, one chip 11 surrounded by the first plastic package 131 is shown in (4) of FIG. 17, and (1) to (3) of FIG. 17 are shown by taking nine chips 11 as an example. In the actual process, the number of chips 11 can be set according to actual needs. It can be understood that, in the manufacturing process shown in FIG. 17, the upper surface of the first plastic package 131 is substantially flush with the upper surface of the chip 11. In some cases, the first plastic package 131 can also be thickened, so that the upper surface of the first plastic package 131 is slightly higher than the upper surface of the chip 11, or the first plastic package 131 covers the edge of the upper surface of the chip 11, so that the first plastic package 131 wraps the corner position of the chip 11.

[0134] FIG. 18 is another structure corresponding to each step in the manufacturing method of the liquid jet cooling structure provided by the embodiment of the present application. The step S201 can specifically include:

[0135] Referring to (1) of FIG. 18, the chip 11 surrounded by the first plastic package 131 and the annular barrier wall 121 are fixed on the substrate 10, that is, the structure obtained in (4) of FIG. 17 can be mounted on the substrate 10. The annular barrier wall 121 surrounds the first plastic package 131, and the annular barrier wall 121 has a gap with the first plastic package 131.

[0136] The step S202 can specifically include:

[0137] Referring to (2) of FIG. 18, the plastic packaging material is filled between the first plastic package 131 and the annular barrier wall 121, and the second plastic package 132 surrounding the first plastic package 131 is obtained after curing. In the manufacturing process, the first plastic package 131 and the second plastic package 132 can be made of the same plastic packaging material, or the first plastic package 131 and the second plastic package 132 can be made of different materials. Since the second plastic package 132 is made at a different time from the first plastic package 131, there is a clear interface between the first plastic package 131 and the second plastic package 132.

[0138] The steps shown in (3) to (7) of FIG. 18 can be implemented with reference to (3) to (7) of FIG. 16, and the repeated parts will not be described herein. The structure in the second implementation manner can be obtained by using the steps shown in FIG. 18.

[0139] FIG. 19 is another structure corresponding to each step in the manufacturing method of the liquid jet cooling structure provided by the embodiment of the present application. As shown in FIG. 19, before or after the step S201, the following step can also be included:

[0140] Referring to (1) in FIG. 19, a chip 11 is chamfered at the edge of the first surface S1 of the chip 11, and the side surface S3 of the obtained chip 11 can include a first side surface S31 and a second side surface S32. The first side surface S31 is connected to the first surface S1, and the first side surface S31 is connected to the second surface S2 through the second side surface S32. The first side surface S31 and the first surface S1 form an obtuse angle. In the manufacturing process, the edge corner position of the chip 11 can be cut before the chip 11 is mounted on the surface of the substrate 10. For example, laser cutting or mechanical cutting can be used for cutting. Alternatively, the edge corner position of the chip 11 can be cut after the chip 11 is mounted on the surface of the substrate 10. For example, laser cutting can be used for cutting.

[0141] The steps shown in (2) to (7) in FIG. 19 can be implemented with reference to (2) to (7) in FIG. 16, and repeated parts will not be described again. The structure in the above-mentioned implementation mode three can be manufactured by using the steps shown in FIG. 19.

[0142] The manufacturing processes of the above-mentioned implementation modes one to three are introduced above. The manufacturing processes of the above-mentioned implementation modes four to seven can be implemented with reference to the manufacturing processes of the above-mentioned implementation modes one to three, and repeated parts will not be described again. It should be understood that in specific implementation, the jet flow liquid cooling structure in the embodiments of the present application can also have other variant structures, and the specific manufacturing process can be implemented with reference to the above-mentioned implementation, which will not be exemplified one by one here.

[0143] Based on the same technical concept, the embodiments of the present application also provide an electronic device. The electronic device provided by the embodiments of the present application can include any of the above-mentioned jet flow liquid cooling structures and a circuit board. The jet flow liquid cooling structure is fixed on the circuit board. Since the reliability of the above-mentioned jet flow liquid cooling structure in the embodiments of the present application is good, the reliability of the electronic device including any of the above-mentioned jet flow liquid cooling structures is also good.

[0144] Although the preferred embodiments of the present application have been described, those skilled in the art can make further changes and modifications to the embodiments once they know the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including all changes and modifications falling within the scope of the present application.

[0145] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.

Claims

1. A fluidic liquid cooling structure, characterized by, include: substrate; a chip, wherein the chip is located on the substrate; The chip has a first surface, a second surface, and a side surface, wherein the first surface is a surface of the chip facing away from the substrate, the second surface is a surface of the chip facing the substrate, and the side surface connects the first surface and the second surface; A cooling cover is located above the substrate, and the cooling cover and the substrate form a cavity, and the chip is located inside the cavity; the cooling cover is provided with an inlet and an outlet for respectively allowing cooling liquid to flow in and out; A plastic package body, the plastic package body being located on the substrate and filling the space between the chip and the cooling cover; the plastic package body covering the side of the chip, and a portion of the plastic package body close to the chip being at least flush with the first surface of the chip; A metal protective layer covers the surface of the plastic package body that is away from the substrate, and the metal protective layer covers the gap between the chip and the plastic package body.

2. The fluidic liquid cooling structure of claim 1, wherein, The plastic package covers the side surfaces of the chip and wraps the edge of the first surface.

3. The fluidic liquid cooling structure of claim 2, wherein, A portion of the surface of the plastic package body facing away from the substrate and close to the chip is curved.

4. The fluidic liquid cooling structure according to any one of claims 1 to 3, wherein The plastic packaging body includes: a first plastic packaging body and a second plastic packaging body, wherein the first plastic packaging body surrounds the chip, and the second plastic packaging body surrounds the first plastic packaging body; The first plastic package body covers the side surface of the chip, and the surface of the first plastic package body facing away from the substrate is at least flush with the first surface.

5. The fluidic liquid cooling structure according to any one of claims 1 to 4, wherein The side surfaces of the chip include: a first side surface and a second side surface; The first side surface is connected to the first surface, and the first side surface is connected to the second surface through the second side surface; An included angle between the first side surface and the first surface is an obtuse angle, and the plastic package body covers the first side surface and the second side surface.

6. The fluidic liquid cooling structure of claim 5, wherein, The first side surface is a plane or a curved surface.

7. The fluidic liquid cooling structure according to any one of claims 1 to 6, wherein The metal protection layer is a whole-surface film layer covering the first surface of the chip and the surface of the plastic package body facing away from the substrate.

8. The fluidic liquid cooling structure according to any one of claims 1 to 7, wherein The cooling cover comprises: an annular retaining wall and an upper cover; The annular retaining wall is located on the substrate and surrounds the chip; The upper cover is located on a side of the annular retaining wall away from the base plate, and the upper cover is provided with the inlet and the outlet.

9. An electronic device, comprising: include: The jet liquid cooling structure according to any one of claims 1 to 8, and a circuit board; the jet liquid cooling structure is fixed on the circuit board.

10. A method for manufacturing a fluidic liquid cooling structure, characterized by, include: Fixing a chip and an annular retaining wall on a substrate so that the annular retaining wall surrounds the chip; wherein the chip has a first surface, a second surface, and a side surface, the first surface being a surface of the chip facing away from the substrate, the second surface being a surface of the chip facing the substrate, and the side surface connecting the first surface and the second surface; Filling a plastic package between the chip and the annular retaining wall so that the plastic package covers the side of the chip and a portion of the plastic package close to the chip is at least flush with the first surface; A metal protection layer is formed on the chip and the plastic package, so that the metal protection layer covers the surface of the plastic package away from the substrate, and the metal protection layer covers the gap between the chip and the plastic package; An upper cover is installed on the annular barrier wall, and the upper cover is provided with an inlet and an outlet for inflow and outflow of the cooling liquid respectively.

11. The method of claim 10, wherein The filling of the plastic package between the chip and the annular barrier wall specifically comprises: The plastic package material is filled between the chip and the annular barrier wall by using a dispensing process, and the dispensing path and the dose in the dispensing process are adjusted, so that the plastic package material is solidified to obtain the plastic package covering the side surface of the chip and wrapping the edge of the first surface.

12. The manufacturing method according to claim 10, wherein: Before the chip and the annular barrier wall are fixed on the substrate, the method further comprises: A plurality of chips are placed on a carrier plate, and plastic package material is filled in the gap between the plurality of chips; After the plastic package material is solidified, the surface of the plurality of chips and the plastic package material is ground, so that the plastic package material is flush with the surface of the chip; The plastic package material is cut between the positions between adjacent chips to obtain the chip surrounded by the first plastic package; The chip surrounded by the first plastic package and the annular barrier wall are fixed on the substrate; the annular barrier wall surrounds the first plastic package, and the annular barrier wall has a gap with the first plastic package. The filling of the plastic package between the chip and the annular barrier wall specifically comprises: The plastic package material is filled between the first plastic package and the annular barrier wall, and the second plastic package surrounding the first plastic package is obtained after solidification. Before or after the chip and the annular barrier wall are fixed on the substrate, the method further comprises:

13. The production method according to claim 10, wherein: An angle cutting treatment is performed on the edge of the first surface of the chip, and the side surface of the obtained chip comprises a first side surface and a second side surface; the first side surface is connected with the first surface, and the first side surface is connected with the second surface through the second side surface; the included angle between the first side surface and the first surface is obtuse. ​

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