Display motherboard and manufacturing method therefor, and display panel

Abstract

The present disclosure provides a display motherboard, provided with a plurality of single-panel regions distributed at intervals, a plurality of sub-pixels being arranged in each single-panel region. The display motherboard comprises a driving backplane and a plurality of light-emitting elements arranged on the driving backplane, the light-emitting elements are arranged in the corresponding sub-pixels, and each light-emitting element comprises at least two vapor-deposited film layers sequentially stacked in a direction from a position closer to the driving backplane to a position distant from the driving backplane. At least some of the sub-pixels are configured such that: when the vapor-deposited film layers are formed by performing horizontal vapor evaporation on the basis of a linear vapor deposition source, the aspect ratio of each sub-pixel is greater than or equal to 1, and a length extension direction of the sub-pixel is a moving direction of the linear vapor deposition source; or when the vapor-deposited film layers are formed on the basis of a vertical vapor deposition mode, the aspect ratio of the sub-pixel is 0.82-1.22. The present disclosure further provides a manufacturing method for a display motherboard and a display panel. The display motherboard and the manufacturing method therefor and the display panel of the present disclosure can reduce the rate of defective display products.

Description

Display mother board and manufacturing method thereof, and display panel

[0001] Cross Reference to Related Applications

[0002] This application claims priority to Chinese Patent Application No. 202410451747.2, filed on April 15, 2024, the contents of which are incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of display, and in particular, to a display mother board and manufacturing method thereof, and a display panel. BACKGROUND

[0004] In the preparation process of an OLED (Organic Light-Emitting Diode) organic light-emitting device, the film layers in the light-emitting element include a light-emitting material layer, etc., which can be a deposition film layer formed by depositing a deposition material into a sub-pixel of a driving backplane in a deposition manner. Due to the shadow effect in the deposition process, the deposition film layer actually formed has a deviation compared with the design size or design position of the film layer, thereby causing display products to have defects. SUMMARY

[0005] Embodiments of the present disclosure provide a display mother board and manufacturing method thereof, and a display panel, which can improve the defect phenomenon of display products.

[0006] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0007] In a first aspect, the embodiments of the present disclosure provide a display mother board having a plurality of single panel regions distributed at intervals, each of the single panel regions being provided with a plurality of sub-pixels; the display mother board comprises a driving backplane and a plurality of light-emitting elements provided on the driving backplane, the light-emitting elements being arranged in the corresponding sub-pixels, the light-emitting elements comprising at least two deposition film layers arranged in a stacking manner from a direction close to the driving backplane to a direction away from the driving backplane; wherein at least part of the sub-pixels are configured to:

[0008] When the deposition film layers are formed by horizontal deposition based on a linear deposition source, the aspect ratio of the sub-pixel is greater than or equal to 1, and the length extension direction of the sub-pixel is the moving direction of the linear deposition source; or

[0009] When the deposition film layers are formed by a vertical deposition manner, the aspect ratio of the sub-pixel is 0.82-1.22.

[0010] Exemplarily, the display mother board further comprises:

[0011] a pixel definition layer disposed on the driving backplane and provided with a plurality of pixel openings to define a plurality of the sub-pixels;

[0012] an isolation column disposed on a side of the pixel definition layer away from the driving backplane and surrounding the pixel openings; and

[0013] a pixel encapsulation layer covering a side of the light emitting element away from the driving backplane; wherein

[0014] the light emitting element comprises, from a side close to the driving backplane to a side away from the driving backplane, an anode, a light emitting functional layer and a cathode, and at least two of the evaporation film layers comprise the light emitting functional layer and the cathode; in the same light emitting element, a normal projection of the cathode on the driving backplane is at least partially outside a normal projection of the light emitting functional layer on the driving backplane, so that the cathodes of adjacent light emitting elements are all lapped to the isolation column to be connected to each other.

[0015] Illustratively, the isolation column comprises, from a side close to the pixel definition layer to a side away from the pixel definition layer, a conductive structure and an insulating structure, an edge of the insulating structure protrudes from an edge of the conductive structure to form a gable structure, and the gable structure and a side surface of the conductive structure and the pixel definition layer enclose a recessed area, the cathode is at least partially located in the recessed area and lapped to the conductive structure.

[0016] Illustratively, in the same sub-pixel, boundaries of normal projections of the cathode and the light emitting functional layer on the driving backplane all exceed a boundary of a normal projection of the anode; and along a width direction of the sub-pixel, the cathode and the anode have a first distance d1 between their boundaries, and the light emitting functional layer and the anode have a second distance d2 between their boundaries; along a length direction of the sub-pixel, the cathode and the anode have a third distance d3 between their boundaries, and the light emitting functional layer and the anode have a fourth distance d4 between their boundaries.

[0017] wherein the first distance d1 is greater than or equal to the third distance d3, and the second distance d2 is greater than or equal to the fourth distance d4.

[0018] Illustratively, along the width and / or length direction of the sub-pixel, the isolation column has a first width d0, wherein a difference between the second distance d2 and the fourth distance d4 is less than the first width d0.

[0019] Exemplarily, the display motherboard comprises at least two substrate areas arranged in a mixed manner, each of the substrate areas comprises a plurality of single panel areas; the plurality of sub-pixels comprises at least two kinds of sub-pixels of different colors; the aspect ratios of the sub-pixels of the same color in different substrate areas are within a threshold value and the opening shapes are the same; and the sub-pixels in at least one of the substrate areas are configured such that, when the evaporation film layer is formed based on horizontal evaporation of a linear evaporation source, the aspect ratio of at least part of the sub-pixels is greater than or equal to 1 and the length extension direction is the moving direction of the linear evaporation source; or, when the evaporation film layer is formed based on a vertical evaporation method, the aspect ratio of at least part of the sub-pixels is 0.82-1.22.

[0020] Exemplarily, the at least two substrate areas comprise a first substrate area and a second substrate area, and the length directions of the single panel areas in the first substrate area and the single panel areas in the second substrate area are perpendicular to each other.

[0021] Exemplarily, the length extension directions of the sub-pixels of the same color in each of the substrate areas are the same.

[0022] Exemplarily, in the first substrate area, the target aspect ratio of the sub-pixels is K1; in the second substrate area, the target aspect ratio of the sub-pixels is K2; and when the evaporation film layer is formed based on a vertical evaporation method, the threshold value K is less than or equal to Kmax-1, where Kmax is the larger one of K1 and K2.

[0023] Exemplarily, in the first substrate area, the plurality of sub-pixels in the single panel area are arranged in m1 along the length direction of the sub-pixel and n1 along the width direction of the sub-pixel, the length of the single panel area along the length direction of the sub-pixel is L1, the width of the single panel area along the width direction of the sub-pixel is W1, the length of a single sub-pixel is Lp1=L1 / m1, and the width of a single sub-pixel is Mp1=W1 / n1.

[0024] The plurality of sub-pixels in the single panel area are arranged in W2 along the length direction of the sub-pixel and n2 along the width direction of the sub-pixel, the length of the single panel area along the length direction of the sub-pixel is L2, the width of the single panel area along the width direction of the sub-pixel is W2, the length of a single sub-pixel is Lp2=L2 / n2, and the width of a single sub-pixel is Wp2=W2 / n2.

[0025] Wherein, K1=Lp1 / Mp1 and K2=Lp2 / Wp2.

[0026] In a second aspect, the present disclosure also provides a manufacturing method of a display mother board, which is used to manufacture the display mother board as described above; the method comprises:

[0027] manufacturing a driving back plate;

[0028] forming a plurality of light emitting elements on the driving back plate, wherein the light emitting elements are arranged in the corresponding sub-pixels, and the light emitting elements comprise at least two evaporation film layers arranged in sequence from the side close to the driving back plate to the side away from the driving back plate; wherein,

[0029] the evaporation film layers are formed by horizontal evaporation using a linear evaporation source, the aspect ratio of at least part of the sub-pixels is greater than or equal to 1, and the moving direction of the linear evaporation source is the length extension direction of the sub-pixels; or

[0030] the evaporation film layers are formed by vertical evaporation, and the aspect ratio of at least part of the sub-pixels is 0.82-1.22.

[0031] Exemplarily, after the manufacturing of the driving back plate, before the forming of the plurality of light emitting elements on the driving back plate, the method further comprises the following steps:

[0032] forming a pixel definition layer and a separation column on the driving back plate, wherein the pixel definition layer is provided with a plurality of pixel openings to define a plurality of sub-pixels, and the separation column is arranged on the side of the pixel definition layer away from the driving back plate and surrounds the pixel openings;

[0033] the forming of the plurality of light emitting elements on the driving back plate specifically comprises:

[0034] forming an anode in the pixel openings;

[0035] evaporating and depositing a plurality of evaporation materials in sequence on the side of the anode away from the driving back plate to form a light emitting functional layer and a cathode, wherein in the same light emitting element, the orthographic projection of the cathode on the driving back plate is at least partially located outside the orthographic projection of the light emitting functional layer on the driving back plate, so that the cathodes of adjacent light emitting elements are all connected to the separation column to be connected to each other.

[0036] Exemplarily, when the plurality of sub-pixels comprise at least two color sub-pixels, the evaporating and depositing a plurality of evaporation materials in sequence on the side of the anode away from the driving back plate to form a light emitting functional layer and a cathode specifically comprises:

[0037] performing the patterning steps of the light emitting elements corresponding to each color sub-pixel in sequence to complete the patterning of the light emitting elements of all color sub-pixels; wherein, for any color sub-pixel, the patterning step of the light emitting element of the color sub-pixel comprises:

[0038] Depositing a plurality of evaporation materials on the side of the anode distal to the driving backplate in sequence to form a light-emitting functional layer and a cathode in all the sub-pixels;

[0039] Performing thin film packaging on the side of the cathode distal to the driving backplate;

[0040] Using photolithography to remove the light-emitting functional layer and the cathode in the sub-pixels other than the current color sub-pixel to complete the patterning of the current color sub-pixel.

[0041] Illustratively, in the method, when the evaporation film layer is formed by horizontal evaporation using a linear evaporation source, or when the evaporation film layer is formed by vertical evaporation, the evaporation angle a of the evaporation source is 60-90°.

[0042] In a third aspect, the embodiments of the present disclosure further provide a display panel, which is a single display panel formed by dividing the single panel area in the display mother panel as described above.

[0043] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0044] In the above scheme, in the light-emitting element of the display mother panel, part of the film layers are evaporation film layers formed by evaporation, and by improving the arrangement size of the sub-pixels on the display mother panel, for example, when the evaporation film layer is formed by horizontal evaporation using a linear evaporation source, the aspect ratio of the sub-pixel is greater than or equal to 1, and the length extension direction of the sub-pixel is the moving direction of the linear evaporation source; or when the evaporation film layer is formed by vertical evaporation, the aspect ratio of the sub-pixel is 0.82-1.22, which can serve the purpose of limiting the film layer boundary position of the evaporation film layer of the light-emitting element in the sub-pixel, to improve the problem of display product failure caused by the deviation of the film layer boundary position of the evaporation film layer from the design due to the existence of shadow effect in the evaporation process. BRIEF DESCRIPTION OF DRAWINGS

[0045] FIG. 1 shows a schematic diagram of the principle that the cathode and the isolation column may be poorly overlapped due to the existence of shadow effect;

[0046] FIG. 2 shows a schematic diagram of the pixel arrangement of a display mother panel in some embodiments of the present disclosure;

[0047] FIG. 3 shows a schematic diagram of the pixel arrangement of a display mother panel in some embodiments of the present disclosure;

[0048] FIG. 4 shows a schematic diagram of the cross-sectional structure of a display mother panel in some embodiments of the present disclosure;

[0049] FIG. 5 shows a schematic diagram of forming a deposition film layer at different deposition angles;

[0050] FIG. 6 shows a schematic diagram of the distribution of film layers between the cathode, anode and light-emitting functional layer in a sub-pixel on a display mother board in some embodiments of the present disclosure;

[0051] FIG. 7 shows a schematic diagram of the distribution of film layers between the cathode, anode and light-emitting functional layer in a sub-pixel on a display mother board in some embodiments of the present disclosure;

[0052] FIG. 8 shows an image of a sub-pixel obtained by fluorescence microscopy;

[0053] FIG. 9 shows a schematic diagram of the arrangement of pixels on a display mother board in some embodiments of the present disclosure;

[0054] FIG. 10 shows a schematic diagram of the arrangement of pixels on a display mother board in some embodiments of the present disclosure. DETAILED DESCRIPTION

[0055] In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of, rather than all of, the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without any inventive effort fall within the scope of protection of the present disclosure.

[0056] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning understood by a person of ordinary skill in the art to which the present disclosure pertains. The terms “first”, “second” and similar terms used in the present disclosure do not denote any order, quantity or importance, but are merely used to distinguish different constituent parts. Similarly, the terms “one”, “a” or “the” and similar terms do not denote a quantity restriction, but mean that there is at least one. The terms “include”, “contain” and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, without excluding other elements or objects. The terms “connect” or “connected” and similar terms do not mean a physical or mechanical connection, but can include an electrical connection, whether direct or indirect. The terms “up”, “down”, “left”, “right” and similar terms are merely used to represent relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships can also change accordingly.

[0057] Before the display mother board and the manufacturing method thereof and the display panel provided by the embodiments of the present disclosure are described in detail, the related art is described as follows:

[0058] In the preparation process of an OLED (Organic Light-Emitting Diode, OLED) organic light-emitting device, the OLED light-emitting element includes an evaporation film layer of a light-emitting material, etc. The evaporation film layer can be formed by depositing evaporation material into a sub-pixel of a driving backplane in an evaporation manner. Due to the shadow effect in the evaporation process, the actual evaporation formed evaporation film layer deviates from the designed size or position of the film layer, thereby causing product defects.

[0059] In the OLED organic light-emitting device, there are two evaporation methods for each evaporation film layer: vertical evaporation process and horizontal evaporation process. The current mainstream scheme of AMOLED is a scheme of using a linear evaporation source for horizontal evaporation.

[0060] Specifically, in the horizontal evaporation process, the to-be-evaporated substrate is placed horizontally, the linear evaporation source is located above or below the to-be-evaporated substrate, the linear evaporation source moves horizontally in a certain direction, and the evaporation material is evaporated vertically onto the to-be-evaporated substrate. In the vertical evaporation process, the to-be-evaporated substrate is vertically arranged, the evaporation source is located at the side of the to-be-evaporated substrate, and the evaporation material is evaporated horizontally onto the to-be-evaporated substrate.

[0061] The inventors of the present application have found that one of the reasons for the above-mentioned defects is that, in the evaporation process, theoretically, only the relative position between the center of the evaporation source and the center of the corresponding sub-pixel on the to-be-evaporated substrate needs to be determined to determine the alignment of the evaporation source and the to-be-evaporated substrate. However, in actual application, the evaporation source has a certain evaporation angle, and there is a shadow effect during evaporation, so the center of the light-emitting functional layer actually formed by evaporation may not be the center of the designed sub-pixel. In other words, during the evaporation process, the evaporation angle needs to be controlled, and due to the shadow effect, the boundary position of the evaporation film layer deviates from the designed size or position of the film layer.

[0062] In addition, in the manufacturing process of the OLED organic light-emitting device, in order to improve production efficiency, a display mother board including a plurality of spaced and independent single panel areas is first manufactured instead of manufacturing display panels one by one. After the display mother board is manufactured, the display mother board is cut based on the single panel areas to obtain a plurality of display panels. During the manufacturing of the display panel mother board, the same film layer on each display panel area (i.e., the single panel area) is synchronously manufactured.

[0063] Therefore, in order to improve the above-mentioned problems, a display mother board and a manufacturing method thereof, and a display device are provided in the embodiments of the present disclosure, which can improve the problem that the boundary position of the evaporation film layer deviates from the designed position, thereby causing product defects.

[0064] As shown in FIG. 2 and FIG. 3, the display mother board 1 provided by the embodiments of the present disclosure has a plurality of single panel areas A1 distributed at intervals, the single panel area A1 is an area based on which the display mother board 1 is divided to form a single display panel, and a plurality of sub-pixels P are arranged in each single panel area A1.

[0065] In terms of the stacked structure, as shown in FIG. 4, the display mother board 1 includes a driving back plate 100 and a plurality of light emitting elements 200 arranged on the driving back plate 100, the light emitting elements 200 are arranged in the corresponding sub-pixels P, and the light emitting elements 200 include at least two evaporation film layers B arranged in the direction from close to the driving back plate 100 to away from the driving back plate 100. The driving back plate 100 can include a substrate 110 and a driving circuit layer 120 arranged on the substrate 110, and the driving circuit layer 120 is used to drive the sub-pixels P to emit light.

[0066] Among them, at least part of the sub-pixels P are configured as:

[0067] As shown in FIG. 2, when the evaporation film layer B is formed based on linear evaporation source horizontal evaporation, the aspect ratio of the sub-pixel P is greater than or equal to 1, and the length extension direction of the sub-pixel P is the moving direction of the linear evaporation source (X direction in the figure);

[0068] Or, as shown in FIG. 3, when the evaporation film layer B is formed based on vertical evaporation method, the aspect ratio of the sub-pixel P is 0.82-1.22.

[0069] For the horizontal evaporation method, the linear evaporation source 10 has a certain evaporation angle a in the horizontal moving (Scan) direction thereof, as shown in FIG. 1, with the movement of the linear evaporation source 10, the evaporation angle a of the evaporation material evaporated onto the evaporation substrate 20 in the horizontal moving direction X of the linear evaporation source 10 will change accordingly, in other words, the evaporation angle a in the horizontal moving direction X of the linear evaporation source 10 is controllable; while in the direction perpendicular to the horizontal direction of the linear evaporation source 10, the angle of the evaporation material evaporated onto the evaporation substrate 20 does not change with the movement of the linear evaporation source 10, in other words, the evaporation angle a in the direction perpendicular to the horizontal moving direction X of the linear evaporation source 10 is uncontrollable.

[0070] In the above scheme, in order to reduce the deviation between the actual deposition film layer B and the design size, the arrangement of the sub-pixels P on the display mother board 1 is improved, at least part of the sub-pixels P in the display mother board 1 are arranged in parallel with the horizontal moving direction X of the linear deposition source 10 in the length direction, so that the size of the shadow area of the deposition film layer B corresponding to the at least part of the sub-pixels P in the length direction of the sub-pixels P is more controllable, that is, the boundary position of the deposition film layer B in the length direction of the sub-pixels P is controllable, compared with the scheme in which the boundary position of the deposition film layer B in the width direction of the sub-pixels P is controllable, it is more conducive to reducing the deviation between the boundary of the deposition film layer B and the design size.

[0071] For the vertical deposition method, the center of the deposition source directly faces the center of the sub-pixel P, and the deposition source has a certain deposition angle α, which will form a deposition shadow in the four directions of the sub-pixel P. If the length and width of the sub-pixel P differ greatly, the size difference of the deposition shadow in the length and width directions of the sub-pixel P will be relatively large, in other words, the boundary position deviation uniformity of the deposition film layer B in the four side directions will be poor. Therefore, in order to ensure that the size of the deposition shadow area in the four side directions of the sub-pixel P is more uniform, when the deposition film layer B is formed based on the vertical deposition method, the aspect ratio of the sub-pixel P can be approximately close to 1:1, for example, the aspect ratio of the sub-pixel P can be 0.82-1.22.

[0072] In some exemplary embodiments, as shown in FIG. 4, the light emitting element 200 can include an anode 210, a light emitting functional layer 220, and a cathode 230 arranged in a stack, and the light emitting functional layer 220 can include at least one thin film of various kinds, such as an emitting material layer (EL layer), a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron injection layer (EIL), etc. In the preparation process of the light emitting element 200, a plurality of deposition materials can be used to form the required thin films, each thin film can be a deposition film layer B formed by depositing each deposition material on a substrate, and a plurality of layers of these films are stacked to finally complete the light emitting element 200.

[0073] In addition, the sub-pixel packaging technology is a kind of metal mask-free self-alignment pixelation technology. This technology can significantly improve the performance of AMOLED (Active-matrix organic light-emitting diode, Active-matrix organic light-emitting diode or Active-matrix organic light-emitting diode), greatly increase the effective light-emitting area (aperture ratio) of AMOLED, and is conducive to greatly improving the pixel density. Compared with the traditional FMM (Fine Metal Mask) deposition technology, it can realize the effects of improving the device life and improving the device brightness.

[0074] In some exemplary embodiments, the display motherboard 1 can be a display motherboard obtained by using a sub-pixel packaging technology. Specifically, as shown in FIG. 4, the display motherboard 1 further comprises a pixel definition layer 300, a spacer column 400 and a pixel packaging layer 500, wherein the pixel definition layer 300 is arranged on the driving backboard 100 and is provided with a plurality of pixel openings 310 to define a plurality of sub-pixels P; the spacer column 400 is arranged on the side of the pixel definition layer 300 away from the driving backboard 100 and surrounds the pixel openings 310; the pixel packaging layer 500 covers the side of the light-emitting element 200 away from the driving backboard 100; wherein the light-emitting element 200 comprises, in sequence from the side close to the driving backboard 100 to the side away from the driving backboard 100, an anode 210, a light-emitting functional layer 220 and a cathode 230, and at least two of the plurality of evaporation film layers B comprise the light-emitting functional layer 220 and the cathode 230; in the same light-emitting element 200, the cathode 230 is at least partially located outside the orthographic projection of the light-emitting functional layer 220 on the driving backboard 100, so that the cathodes 230 of adjacent light-emitting elements 200 are all overlapped with the spacer column 400 to be connected with each other.

[0075] For example, as shown in FIG. 4, the spacer column 400 comprises, in sequence from the side close to the pixel definition layer 300 to the side away from the pixel definition layer 300, a conductive structure 410 and an insulating structure 420, the edge of the insulating structure 420 is protruded from the edge of the conductive structure 410 to form a gable structure 430, and the gable structure 430 and the side surface of the conductive structure 410 and the pixel definition layer 300 together enclose a recessed area C, and the cathode 230 is at least partially located in the recessed area C and is overlapped with the conductive structure 410.

[0076] By using the above scheme, the edge of the insulating structure 420 is protruded from the edge of the conductive structure 410 to form a gable structure 430, and the gable structure 430 and the side surface of the conductive structure 410 and the pixel definition layer 300 together enclose a recessed area C, so that the spacer column 400 can be used as an insulating partition to separate different sub-pixels P, and the conductive structure 410 can be used to connect the cathodes 230 between adjacent two sub-pixels P.

[0077] The specific preparation process of the display motherboard 1 using the sub-pixel packaging technology can be as follows:

[0078] First, form the pixel definition layer 300 on the driving backboard 100 with the driving circuit layer 120 prepared, and define a plurality of pixel openings 310 on the pixel definition layer 300;

[0079] Then, isolation columns 400 are formed on the side of the pixel definition layer 300 away from the driving backboard 100, the isolation columns 400 are located between adjacent pixel openings 310, and the isolation columns 400 include conductive structures 410 and insulating structures 420 stacked in sequence from the side close to the pixel definition layer 300 to the side away from the pixel definition layer 300;

[0080] Then, full-area evaporation is performed to complete deposition of the first color full set of OLED light-emitting functional layers 220 and cathodes 230, and then full-area thin film packaging (first inorganic layer) is performed, and then by means of processes such as gluing, exposure, development, etching, and stripping, the parts of the substrate that do not need to be retained are selectively removed (this is a key step for eliminating the fine metal mask), so as to complete patterning of the first color, and then the above process is repeated twice to complete full-color patterning of RGB three primary colors.

[0081] Then, full-area thin film packaging is performed on the obtained substrate to obtain a display mother board 1.

[0082] On the prepared display mother board 1, the conductive structures 410 of the isolation columns 400 need to be overlapped with the cathodes 230, and not overlapped with the light-emitting functional layers 220.

[0083] However, in the related art, in the display device using the sub-pixel packaging technology, due to the shadow effect of the evaporation film layer B in the light-emitting functional layer 220 during evaporation, the boundary position of the light-emitting functional layer 220 deviates from the designed position, which may cause uneven overlap or failure of overlap between the cathode 230 and the isolation column 400.

[0084] In the display mother board 1 provided by the embodiments of the present disclosure, in the application scenario where the display mother board 1 uses the sub-pixel packaging technology, for the horizontal evaporation mode, the sub-pixels P are configured to have a length direction along the horizontal movement direction of the linear evaporation source 10, which can reduce the deviation between the boundary position of the light-emitting functional layer 220 and the cathode 230 and the designed size, thereby improving the problem that the cathode 230 and the isolation column 400 cannot be effectively overlapped; and for the vertical evaporation mode, the arrangement mode of the sub-pixels P is configured to have an aspect ratio close to 1:1, for example, the aspect ratio of the sub-pixels P can be 0.82-1.22, which can ensure that the evaporation shadow of the light-emitting functional layer 220 and the cathode 230 in the four side directions of the sub-pixels P is uniform, thereby ensuring the uniformity of the overlap between the cathode 230 and the isolation column 400 in the four side directions of the sub-pixels P.

[0085] In some exemplary embodiments, as shown in FIGS. 6 and 7, the boundaries of the positive projections of the cathode 230 and the light-emitting functional layer 220 on the driving backplane 100 all exceed the boundary of the positive projection of the anode 210 within the same sub-pixel P. Along the width direction of the sub-pixel P, the first distance d1 is between the boundary of the cathode 230 and the boundary of the anode 210, and the second distance d2 is between the boundary of the light-emitting functional layer 220 and the boundary of the anode 210; along the length direction of the sub-pixel P, the third distance d3 is between the boundary of the cathode 230 and the boundary of the anode 210, and the fourth distance d4 is between the boundary of the light-emitting functional layer 220 and the boundary of the anode 210; the first distance d1 is greater than or equal to the third distance d3, and the second distance d2 is greater than or equal to the fourth distance d4.

[0086] Specifically, referring to FIG. 8, when the aspect ratio of the sub-pixel P is greater than 1, the display mother board 1 obtained by using the sub-pixel packaging technology, when the light-emitting element 200 is formed based on the horizontal evaporation method, is observed by a fluorescence microscope, and it is found that b > a, where b is the distance between the boundary of the optical functional layer and the boundary of the anode 210 in the length direction of the sub-pixel P, and a is the distance between the edge of the optical functional layer and the boundary of the anode 210 in the width direction of the sub-pixel P. That is, the shadow area caused by the shadow effect along the length direction of the conventional sub-pixel P is larger.

[0087] In some exemplary embodiments of the present disclosure, when the aspect ratio of the sub-pixel P is greater than 1, the distribution of the film layers in the light-emitting element 200 is shown in FIG. 6. As shown in FIG. 6, when the film layers B of the light-emitting element 200 are formed based on the horizontal evaporation method, and the sub-pixels P are arranged in parallel with the moving direction X of the linear evaporation source 10, the distribution of the film layers is as follows: the distance between the boundary of the cathode 230 and the boundary of the anode 210 in the width direction of the sub-pixel P is the first distance d1, and the distance in the length direction of the sub-pixel P is the second distance d2, where d1 is greater than or equal to d2; the distance between the boundary of the light-emitting functional layer 220 and the boundary of the anode 210 in the width direction Y of the sub-pixel P is the third distance d3, and the distance in the length direction of the sub-pixel P is the fourth distance d4, where d3 is greater than or equal to d4.

[0088] It can be seen that, when the film layers B of the light-emitting element 200 are formed based on the horizontal evaporation method, and the sub-pixels P are arranged in parallel with the moving direction of the linear evaporation source 10, the width of the shadow area in the length direction of the sub-pixel P can be effectively reduced.

[0089] Similarly, when the aspect ratio of the sub-pixel P is close to 1:1, the distribution of the film layers in the light-emitting element 200 is shown in FIG. 7. As shown in FIG. 7, when the light-emitting element 200 is formed by the horizontal evaporation method, and the sub-pixel P is arranged with the length direction parallel to the moving direction of the linear evaporation source 10, the distribution of the film layers is as follows: between the boundary of the cathode 230 and the anode 210, the distance in the width direction of the sub-pixel P is a first distance d1, and the distance in the length direction X of the sub-pixel P is a second distance d2, where d1 is greater than or equal to d2; between the boundary of the light-emitting functional layer 220 and the anode 210, the distance in the width direction Y of the sub-pixel P is a third distance d3, and the distance in the length direction of the sub-pixel P is a fourth distance d4, where d3 is greater than or equal to d4. It can be seen that when the light-emitting element 200 is formed by the horizontal evaporation method, and the sub-pixel P is arranged with the length direction parallel to the moving direction X of the linear evaporation source 10, the width of the shadow area in the length direction of the sub-pixel P can be effectively reduced.

[0090] In addition, in some exemplary embodiments, the isolation column 400 has a first width d0 along the width and / or length direction of the sub-pixel P, where the difference between the second distance d2 and the fourth distance d4 is less than the first width d0. The isolation column 400 can act as an insulating partition wall between adjacent sub-pixels P to separate different sub-pixels P. In order to ensure that the light-emitting functional layers 220 of adjacent sub-pixels P are separated, the isolation column 400 needs to have a certain width, i.e., the first width d0, where the difference between the second distance d2 and the fourth distance d4 is less than the first width d0.

[0091] It should be noted that in the embodiments provided in the present disclosure, the sub-pixel P can be any suitable shape such as a quadrilateral, a polygon, or a circle.

[0092] In order to maximize the utilization rate of the substrate 110 of the display mother board 1, OLED products of different sizes can be prepared on the same substrate 110, i.e., mixed arrangement (MMG).

[0093] In some exemplary embodiments of the present disclosure, as shown in FIGS. 9 and 10, the display mother board 1 includes at least two substrate regions 11 arranged in a mixed arrangement, and each of the substrate regions 11 includes a plurality of single panel regions A1. It should be noted that the single panel regions A1 in different substrate regions 11 can be obtained by cutting the display mother board 1 to obtain OLED display panels of different sizes.

[0094] The plurality of sub-pixels P include sub-pixels P of at least two different colors, such as RGB sub-pixels P; the aspect ratios of the sub-pixels P of the same color in different substrate regions 11 are within a threshold value, and the opening shapes are the same, for example, the opening shapes of R sub-pixels P in two substrate regions 11 are the same, and the aspect ratios are within a threshold value; and the sub-pixels P in at least one substrate region 11 are configured such that, as shown in FIG. 9, when the evaporation film layer B is formed by horizontal evaporation based on a linear evaporation source 10, the aspect ratios of at least part of the sub-pixels P are greater than or equal to 1, and the length extension direction is the moving direction of the linear evaporation source 10; or, as shown in FIG. 10, when the evaporation film layer B is formed by a vertical evaporation method, the aspect ratios of at least part of the sub-pixels P are 0.82-1.22.

[0095] It should be noted that, in the above scheme, the aspect ratios of the sub-pixels P of the same color are within a threshold value, which can specifically mean that the aspect ratios of the sub-pixels P of the same color in different substrate regions 11 are close, for example, the aspect ratios of the sub-pixels P of the same color in different substrate regions 11 are within the range of 0.82-1.22.

[0096] It should also be noted that the above scheme can be applied to horizontal evaporation mixed arrangement and vertical evaporation mixed arrangement, and by designing the sub-pixels P of the same color in different substrate regions 11 to have similar opening shapes and close aspect ratios, in other words, by designing all sub-pixels P of the same color in the mixed arrangement display mother board 1 to have similar opening shapes and close aspect ratios, the effective overlap between the cathode 230 and the isolation column 400 in each product under mixed arrangement is ensured.

[0097] Specifically, the arrangement of the sub-pixels P in different substrate regions 11 can be as follows:

[0098] In some embodiments, as shown in FIG. 9, the at least two substrate regions 11 include a first substrate region 11A and a second substrate region 11B, and the length directions of the single panel regions A1 in the first substrate region 11A and the second substrate region 11B are perpendicular to each other. In this way, when the aspect ratio of the sub-pixel P is greater than 1, the different substrate regions 11 can be mixedly arranged while the utilization rate of the substrate 110 is as high as possible.

[0099] In another embodiment, as shown in FIG. 9, the at least two substrate regions 11 include a first substrate region 11A and a second substrate region 11B, and the length directions of the single panel regions A1 in the first substrate region 11A and the second substrate region 11B can also be arranged parallel to each other.

[0100] In addition, in some exemplary embodiments, the length extension direction of the same color sub-pixel P in different substrate regions 11 is the same.

[0101] Please refer to FIG. 5. In the process of forming the display mother board 1 by using the sub-pixel packaging technology, when forming the evaporation film layer B in the sub-pixel P, there is no metal mask, the evaporation source 10 has a certain evaporation angle a, and the distance between the evaporation source 10 and the substrate 20 to be evaporated is S. In a single sub-pixel P, the size A of the evaporation film layer B in a certain direction can be calculated based on the formula A = cot a * S.

[0102] The evaporation angle a in the traditional scheme shown in FIG. 5(a) is denoted as the first evaporation angle a1; the evaporation angle a in the scheme of the present application shown in FIG. 5(b) is denoted as the second evaporation angle a2, and a1 is less than a2. As shown in FIG. 5(a) and FIG. 5(b), the size of the evaporation film layer B when the evaporation angle a of the evaporation source is a1 is greater than the size of the evaporation film layer B when the evaporation angle a of the evaporation source is a2. Therefore, in order to ensure that the shadow area of the light-emitting functional layer 220 does not affect the overlap between the cathode 230 and the isolation column 400, in some embodiments of the present disclosure, when forming the evaporation film layer B such as the light-emitting functional layer 220, the evaporation angle a can be increased compared with the traditional evaporation angle a.

[0103] For example, in the traditional technology, the evaporation angle a in the evaporation process is about 50-52°, and in some embodiments of the present application, the evaporation angle a can be 60-90°. The specific value of the evaporation angle a can be adjusted and selected according to the size of each evaporation film layer B in the sub-pixel P. For example, the evaporation angle a can be 65°.

[0104] The present application is further described below in relation to specific application scenarios.

[0105] In the case where the light-emitting element 200 of the sub-pixel P is formed by horizontal evaporation of each evaporation film layer B:

[0106] When the display mother board 1 is mixed, since the evaporation angle a is controllable in the horizontal movement direction of the evaporation source, but the evaporation angle a is not controllable in the vertical direction of the evaporation source. In order to ensure that the cathode 230 and the isolation column 400 are effectively overlapped, the arrangement mode of the sub-pixel P can be limited as follows: for example, as shown in FIG. 9, the opening shape of the same color sub-pixel P in different substrate regions 11 is similar or the same, and the length direction of the same color sub-pixel P in any substrate region 11 is the same. The length of the same color sub-pixel P in at least one substrate region 11 is the same as the horizontal movement direction of the evaporation source. The aspect ratio of the sub-pixel P can be greater than or equal to 1. The shape of the sub-pixel P can include but is not limited to any suitable shape such as quadrilateral, polygon, or circle.

[0107] wherein, in the first substrate region 11A, a plurality of the sub-pixels P within the single panel region A1 are arranged m1 in the length direction of the sub-pixel P and n1 in the width direction of the sub-pixel P, the length of the single panel region A1 in the length direction of the sub-pixel P is L1, the width of the single panel region A1 in the width direction of the sub-pixel P is W1, the length of a single sub-pixel P is Lp1 = L1 / m1, and the width of a single sub-pixel P is Wp1 = W1 / n1.

[0108] In the second substrate region 11B, a plurality of the sub-pixels P within the single panel region A1 are arranged W2 in the length direction of the sub-pixel P and n2 in the width direction of the sub-pixel P, the length of the single panel region A1 in the length direction of the sub-pixel P is L2, the width of the single panel region A1 in the width direction of the sub-pixel P is W2, the length of a single sub-pixel P is Lp2 = L2 / n2, and the width of a single sub-pixel P is Wp2 = W2 / n2.

[0109] In the case where the light emitting element 200 of the sub-pixel P is formed by vertical evaporation of each evaporation film layer B:

[0110] In order to ensure that the cathode 230 and the isolation column 400 are uniformly overlapped in each direction of the four sides of the sub-pixel P, the aspect ratio of the sub-pixels P of the same color is close, and the aspect ratio of the sub-pixel P can be within 0.82-1.22 when the display mother board 1 is not mixed. Specifically, in the single panel region A1, a plurality of the sub-pixels P are arranged m0 in the length direction of the sub-pixel P and n0 in the width direction of the sub-pixel P, the length of the single panel region A1 in the length direction of the sub-pixel P is L0, the width of the single panel region A1 in the width direction of the sub-pixel P is W0, the length of a single sub-pixel P is Lp0 = L0 / m0, and the width of a single sub-pixel P is Wp0 = W0 / n0. The target aspect ratio of the sub-pixels P of the same color is less than or equal to a threshold value K, and the threshold value K is less than or equal to K0-1, K0 = Lp0 / Wp0.

[0111] In the case where the display mother board 1 is mixed, in the first substrate region 11A, a plurality of the sub-pixels P within the single panel region A1 are arranged m1 in the length direction of the sub-pixel P and n1 in the width direction of the sub-pixel P, the length of the single panel region A1 in the length direction of the sub-pixel P is L1, the width of the single panel region A1 in the width direction of the sub-pixel P is W1, the length of a single sub-pixel P is Lp1 = L1 / m1, and the width of a single sub-pixel P is Wp1 = W1 / n1.

[0112] In the second substrate area 11B, a plurality of the sub-pixels P in the single panel area A1 are arranged in the length direction of the sub-pixel P with W2, and arranged in the width direction of the sub-pixel P with n2, the length of the single panel area A1 in the length direction of the sub-pixel P is L2, the width of the single panel area A1 in the width direction of the sub-pixel P is W2, the length of a single sub-pixel P is Lp2=L2 / n2, and the width of a single sub-pixel P is Wp2=W2 / n2. In theory, the target aspect ratio of the sub-pixel P in the first substrate area 11A is K1=Lp1 / Mp1, and the target aspect ratio of the sub-pixel P in the second substrate area 11B is K2=Lp2 / Wp2.

[0113] In the second substrate area 11B, a plurality of the sub-pixels P in the single panel area A1 are arranged in the length direction of the sub-pixel P with W2, and arranged in the width direction of the sub-pixel P with n2, the length of the single panel area A1 in the length direction of the sub-pixel P is L2, the width of the single panel area A1 in the width direction of the sub-pixel P is W2, the length of a single sub-pixel P is Lp2=L2 / n2, and the width of a single sub-pixel P is Wp2=W2 / n2. In theory, the target aspect ratio of the sub-pixel P in the first substrate area 11A is K1=Lp1 / Mp1, and the target aspect ratio of the sub-pixel P in the second substrate area 11B is K2=Lp2 / Wp2.

[0114] In some example embodiments of the present disclosure, the driving circuit layer 120 is used to form the pixel driving circuit and some conductive connection parts. For example, as shown in FIG. 4, the driving circuit layer 120 includes, in order from the side away from the driving backboard 100, an isolation layer Bar, an active layer Poly, a first gate insulating layer GI1, a first gate metal layer gate1, a second gate insulating layer GI2, a second gate metal layer gate2, an interlayer insulating layer ILD, a first source-drain metal layer SD1, a first planar layer PLN1, a second source-drain metal layer SD2, and a second planar layer PLN2, but not limited thereto.

[0115] In addition, in some embodiments, as shown in FIG. 4, the display motherboard 1 can further include a thin film packaging layer 600 disposed on the side of the pixel packaging layer 500 away from the driving backboard 100. For example, the thin film packaging layer 600 can include, in order from the side away from the driving backboard 100, an organic packaging layer IJP and a second inorganic packaging layer CVD2.

[0116] In addition, as shown in FIG. 4, in some embodiments, the display motherboard 1 can further include a color film layer 700 disposed on the driving backboard 100, the color film layer 700 is disposed on the side of the thin film packaging layer 600 away from the driving backboard 100, and the color film layer 700 includes a color film pattern 710 and a black matrix pattern 720, the orthographic projection of the black matrix pattern 720 on the driving backboard 100 at least partially overlaps with the orthographic projection of the isolation column 400 on the driving backboard 100.

[0117] For example, the color filter layer 700 includes a red color filter pattern CFR, a green color filter pattern CFG, and a blue color filter pattern CFB, and the black matrix pattern (BM) 620 is located between adjacent color filter patterns 710.

[0118] In addition, FMLOC (Flexible Multi Layer On Cell) refers to a technology of manufacturing a touch function layer outside the thin film packaging layer 600 in a display substrate. The FMLOC can integrate a display structure and a touch structure together, has advantages of thinness, foldability, etc., and can meet product requirements of flexible folding, narrow frame, etc.

[0119] In some exemplary embodiments of the present disclosure, as shown in FIG. 4, the display mother board 1 further includes a touch function layer 800, the touch function layer 800 includes a first touch layer TMA and a second touch layer TMB, patterns of the first touch layer TMA and the second touch layer TMB are connected to each other to form a plurality of touch electrode patterns, and at least one of the first touch layer TMA and the second touch layer TMB is located on a side of the thin film packaging layer 600 away from the drive backboard 100.

[0120] For example, in some exemplary embodiments of the present disclosure, as shown in FIG. 4, the first touch layer TMA and the second touch layer TMB are both arranged between the thin film packaging layer 600 and the color filter layer 700.

[0121] In addition, in a second aspect, the embodiments of the present disclosure further provide a manufacturing method of a display mother board 1, which is used to manufacture the display mother board 1 provided by the embodiments of the present disclosure; the method includes the following steps:

[0122] Step S01, manufacturing a drive backboard 100;

[0123] The drive backboard 100 can include a substrate 110 and a drive circuit layer 120 arranged on the substrate 110, etc., the drive circuit layer 120 is used to drive a sub-pixel P to emit light, for example, the drive circuit layer 120 can include a gate line, a data line, a thin film transistor, etc.

[0124] Step S03, forming a plurality of light emitting elements 200 on the drive backboard 100, wherein the light emitting elements 200 are arranged in the corresponding sub-pixels P, the light emitting elements 200 include at least two evaporation film layers B arranged in a direction from close to the drive backboard 100 to away from the drive backboard 100; wherein,

[0125] The evaporation film layer B is formed by horizontal evaporation using a linear evaporation source 10, the length-width ratio of at least part of the sub-pixels P is greater than or equal to 1, and the moving direction of the linear evaporation source 10 is the length extension direction of the sub-pixels P; or

[0126] The evaporation film layer B is formed by vertical evaporation, and the length-width ratio of at least part of the sub-pixels P is 0.82-1.22.

[0127] Obviously, the manufacturing method of the display mother board 1 provided by the embodiments of the present disclosure also has the beneficial effects brought by the display mother board 1 provided by the embodiments of the present disclosure, which will not be repeated here.

[0128] Exemplarily, after the step S01 and before the step S03, the method further includes the following steps:

[0129] The step S02 includes forming a pixel definition layer 300 and a separation column 400 on the driving back plate 100, wherein the pixel definition layer 300 is provided with a plurality of pixel openings 310 to define a plurality of sub-pixels P, and the separation column 400 is arranged on the side of the pixel definition layer 300 away from the driving back plate 100 and surrounds the pixel openings 310;

[0130] The step of forming a plurality of light emitting elements 200 on the driving back plate 100 specifically includes:

[0131] The step S021 includes forming an anode 210 in the pixel opening 310;

[0132] The step S022 includes sequentially evaporating and depositing a plurality of evaporation materials on the side of the anode 210 away from the driving back plate 100 to form a light emitting functional layer 220 and a cathode 230, wherein in the same light emitting element 200, the orthographic projection of the cathode 230 on the driving back plate 100 is at least partially located outside the orthographic projection of the light emitting functional layer 220 on the driving back plate 100, so that the cathodes 230 of adjacent light emitting elements 200 are all connected to the separation column 400 and connected to each other.

[0133] Exemplarily, when the plurality of sub-pixels P include at least two color sub-pixels P, the step S022 specifically includes sequentially performing the light emitting element 200 patterning step corresponding to each color sub-pixel P to complete the light emitting element 200 patterning of all color sub-pixels P; wherein for any color sub-pixel P, the light emitting element 200 patterning step includes:

[0134] The step S0221 includes sequentially evaporating and depositing a plurality of evaporation materials on the side of the anode 210 away from the driving back plate 100 to form a light emitting functional layer 220 and a cathode 230 in all the sub-pixels P.

[0135] Step S0222, performing full-area thin film packaging on the side of the cathode 230 away from the driving back plate 100;

[0136] Step S0223, removing the light-emitting functional layer 220 and the cathode 230 in the sub-pixels P other than the current color sub-pixel P by using photolithography to complete the patterning of the current color sub-pixel P.

[0137] Illustratively, in the method, when the film layer B is formed by horizontal evaporation using the linear evaporation source 10 or when the film layer B is formed by vertical evaporation, the evaporation angle a of the evaporation source is 60-90°.

[0138] Illustratively, the distance between the evaporation source and the surface to be evaporated on the driving back plate 100 is S, and the evaporation angle a of the evaporation source and the opening size A of the sub-pixel P satisfy the following relationship: A=S*cot a. Here, the opening size A of the sub-pixel can refer to the length or width of the sub-pixel.

[0139] In a third aspect, the embodiments of the present disclosure also provide a display panel, which is a single display panel formed based on the single panel area A1 in the display mother board 1 provided by the embodiments of the present disclosure. Obviously, the display panel provided by the embodiments of the present disclosure also has the beneficial effects brought by the display mother board 1 provided by the embodiments of the present disclosure, which will not be described here again.

[0140] It should be noted that the display panel can be any display panel with display function, such as a television, a display, a digital photo frame, a mobile phone, a tablet computer, etc., and the display panel can further include a flexible circuit board, a printed circuit board, a back plate, etc. Illustratively, the display panel includes a liquid crystal display panel, an organic light-emitting diode display panel, etc., but is not limited thereto.

[0141] The following points need to be explained:

[0142] (1) The drawings of the embodiments of the present disclosure only involve the structures involved in the embodiments of the present disclosure, and other structures can be referred to the general design.

[0143] (2) For the sake of clarity, the thickness of a layer or region is exaggerated or reduced in the drawings used to describe the embodiments of the present disclosure, i.e., these drawings are not drawn according to the actual scale. It can be understood that when an element such as a layer, a film, a region or a substrate is referred to as being located “on” or “under” another element, the element can be “directly” located on or under another element or there can be an intermediate element.

[0144] (3) In the case of no conflict, the embodiments and features in the embodiments of the present disclosure can be combined to obtain new embodiments.

[0145] The above merely describes the specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display motherboard, characterized by, The display mother board comprises a driving back plate and a plurality of light emitting elements arranged on the driving back plate, the light emitting elements are arranged in the corresponding sub-pixels, the light emitting elements comprise at least two evaporation film layers arranged in sequence from the direction close to the driving back plate to the direction away from the driving back plate; wherein at least part of the sub-pixels are configured as: When the evaporation film layers are formed by horizontal evaporation based on a linear evaporation source, the aspect ratio of the sub-pixel is greater than or equal to 1, and the length extension direction of the sub-pixel is the moving direction of the linear evaporation source; or When the evaporation film layers are formed by vertical evaporation, the aspect ratio of the sub-pixel is 0.82-1.

22.

2. The display motherglass of claim 1, wherein, The display mother board further comprises: a pixel definition layer arranged on the driving back plate and provided with a plurality of pixel openings to define a plurality of sub-pixels; a separation column arranged around the pixel openings on the side of the pixel definition layer away from the driving back plate; and a pixel encapsulation layer covering the side of the light emitting element away from the driving back plate; wherein the light emitting element comprises an anode, a light emitting functional layer and a cathode arranged in sequence from the direction close to the driving back plate to the direction away from the driving back plate, and the at least two evaporation film layers comprise the light emitting functional layer and the cathode; in the same light emitting element, the cathode is at least partially located outside the orthographic projection of the light emitting functional layer on the driving back plate, so that the cathodes of adjacent light emitting elements are all overlapped to the separation column to be connected to each other.

3. The display motherglass of claim 2, wherein, The separation column comprises a conductive structure and an insulating structure arranged in sequence from the direction close to the pixel definition layer to the direction away from the pixel definition layer, the edge of the insulating structure protrudes from the edge of the conductive structure to form a gable structure, and the gable structure and the side surface of the conductive structure and the pixel definition layer form a recessed area, and the cathode is at least partially located in the recessed area and overlapped to the conductive structure.

4. The display motherglass of claim 2, wherein, In the same sub-pixel, the boundaries of the orthographic projections of the cathode and the light emitting functional layer on the driving back plate all exceed the boundary of the orthographic projection of the anode; and along the width direction of the sub-pixel, the first distance d1 is between the boundaries of the cathode and the anode, and the second distance d2 is between the boundaries of the light emitting functional layer and the anode; along the length direction of the sub-pixel, the third distance d3 is between the boundaries of the cathode and the anode, and the fourth distance d4 is between the boundaries of the light emitting functional layer and the anode; wherein the first distance d1 is greater than or equal to the third distance d3, and the second distance d2 is greater than or equal to the fourth distance d4.

5. The display motherglass of claim 4, wherein, Along the width and / or length direction of the sub-pixel, the separation column has a first width d0, and the difference between the second distance d2 and the fourth distance d4 is less than the first width d0.

6. The display motherglass of claim 1, wherein, The display motherboard comprises at least two substrate areas arranged in a mixed manner, each of the substrate areas comprises a plurality of single panel areas; the plurality of sub-pixels comprises sub-pixels of at least two different colors; the aspect ratios of the sub-pixels of the same color in different substrate areas are within a threshold value and the opening shapes are the same; and the sub-pixels in at least one of the substrate areas are configured such that, when the evaporation film layer is formed by horizontal evaporation based on a linear evaporation source, the aspect ratios of at least part of the sub-pixels are greater than or equal to 1 and the length extension direction is the moving direction of the linear evaporation source; or, when the evaporation film layer is formed by a vertical evaporation method, the aspect ratios of at least part of the sub-pixels are 0.82-1.

22.

7. The display motherglass of claim 6, wherein, The at least two substrate areas comprise a first substrate area and a second substrate area, and the length directions of the single panel areas in the first substrate area and the second substrate area are perpendicular to each other.

8. The display motherglass of claim 6, wherein, The length extension directions of the sub-pixels of the same color in each of the substrate areas are the same.

9. The display motherglass of claim 7, wherein, In the first substrate area, the target aspect ratio of the sub-pixels is K1; in the second substrate area, the target aspect ratio of the sub-pixels is K2; and when the evaporation film layer is formed by a vertical evaporation method, the threshold value K is less than or equal to Kmax-1, where Kmax is the larger one of K1 and K2.

10. The display motherglass of claim 9, wherein, In the first substrate area, the plurality of sub-pixels in the single panel area are arranged in m1 along the length direction of the sub-pixel and n1 along the width direction of the sub-pixel, the length of the single panel area along the length direction of the sub-pixel is L1, the width of the single panel area along the width direction of the sub-pixel is W1, the length of a single sub-pixel is Lp1=L1 / m1, and the width of a single sub-pixel is Mp1=W1 / n1. In the second substrate area, the plurality of sub-pixels in the single panel area are arranged in m2 along the length direction of the sub-pixel and n2 along the width direction of the sub-pixel, the length of the single panel area along the length direction of the sub-pixel is L2, the width of the single panel area along the width direction of the sub-pixel is W2, the length of a single sub-pixel is Lp2=L2 / n2, and the width of a single sub-pixel is Wp2=W2 / n2. Wherein, K1=Lp1 / Mp1 and K2=Lp2 / Wp2.

11. A manufacturing method of a display mother board, characterized by, The method for preparing the display motherboards as claimed in any one of claims 1 to 10 comprises: Preparation of a driving backboard; Formation of a plurality of light emitting elements on the driving backboard, wherein the light emitting elements are arranged in the corresponding sub-pixels, and the light emitting elements comprise at least two evaporation film layers arranged in sequence from close to the driving backboard to away from the driving backboard; and wherein The evaporation film layers are formed by horizontal evaporation using a linear evaporation source, the aspect ratios of at least part of the sub-pixels are greater than or equal to 1, and the moving direction of the linear evaporation source is the length extension direction of the sub-pixel; or The evaporation film layers are formed by a vertical evaporation method, and the aspect ratios of at least part of the sub-pixels are 0.82-1.

22.

12. The method of claim 11, wherein, The method is applied to the display mother board as claimed in claim 2, after the driving back plate is prepared, before the plurality of light emitting elements are formed on the driving back plate, the method further comprises the following steps: forming a pixel definition layer and a separation column on the driving back plate, wherein the pixel definition layer is provided with a plurality of pixel openings to define a plurality of the sub-pixels, and the separation column is arranged on the side of the pixel definition layer away from the driving back plate and surrounds the pixel openings; the step of forming a plurality of light emitting elements on the driving back plate specifically comprises: forming an anode in the pixel opening; depositing a plurality of evaporation materials on the side of the anode away from the driving back plate in sequence to form a light emitting functional layer and a cathode, wherein in the same light emitting element, the orthographic projection of the cathode on the driving back plate is at least partially located outside the orthographic projection of the light emitting functional layer on the driving back plate, so that the cathodes of adjacent light emitting elements are all connected to the separation column.

13. The method of claim 12, wherein, when the plurality of the sub-pixels comprises at least two color sub-pixels, the step of depositing a plurality of evaporation materials on the side of the anode away from the driving back plate in sequence to form a light emitting functional layer and a cathode specifically comprises: performing the patterning step of the light emitting element corresponding to each color sub-pixel in sequence to complete the patterning of the light emitting element of all color sub-pixels; wherein for any color sub-pixel, the patterning step of the light emitting element thereof comprises: depositing a plurality of evaporation materials on the side of the anode away from the driving back plate in sequence to form the light emitting functional layer and the cathode of the light emitting element in all the sub-pixels; performing full-area thin film packaging on the side of the cathode away from the driving back plate; adopting a photolithography method to remove the light emitting functional layer and the cathode in the sub-pixels other than the current color sub-pixel to complete the patterning step of the current color sub-pixel.

14. The method of claim 11, wherein, in the method, when the evaporation film layer is formed by horizontal evaporation using a linear evaporation source, or when the evaporation film layer is formed by vertical evaporation, the evaporation angle α of the evaporation source is 60-90°.

15. A display panel, characterized by the display panel is a single display panel formed based on the single panel area in the display mother board as claimed in any one of claims 1 to 14 after being divided.

Images