Transfer-type sheet-like bonding material

Abstract

Provided is a transfer-type sheet-like bonding material that: (I) provides an excellent transferability even under moderate transfer conditions at which copper particle sintering does not proceed, and (II) can stably secure an adequate bonding strength even in low temperature bonding at 250°C or below. This transfer-type sheet-like bonding material is characterized by being a dried paste film made by applying, onto a resin substrate, a paste containing copper particles, a reducing agent, a resin, and a solvent, and drying, and having a solvent content of 0.5-2.0 mass%.

Description

Transfer-type sheet adhesive material

[0001] The present invention relates to a transfer type sheet-like bonding material.

[0002] Conventionally, solder materials have been widely used as bonding materials for electronic components. However, solder materials have a problem of poor heat resistance. Therefore, for example, it has been difficult to use solder materials as bonding materials in power devices using SiC elements that are expected to be used at high temperatures of 150°C or higher.

[0003] Therefore, a bonding material using silver particles has been proposed as a sintered bonding material. In addition, copper particles are expected to be a promising option from the viewpoints of cost and ion migration, and the development of a transfer-type sheet-type bonding material using copper particles is underway.

[0004] The transfer-type sheet-like bonding material is formed by applying a paste containing at least copper particles, a reducing agent, a resin, and a solvent onto a resin substrate such as a release PET film and drying it. Bonding of two members (a first member and a second member) using the transfer-type sheet-like bonding material is performed as follows: First, the sheet-like bonding material is transferred to the first member under predetermined transfer conditions, and then the resin substrate is peeled off. Next, the sheet-like bonding material transferred to the first member is brought into contact with the second member, and the first member and the second member are bonded via the sheet-like bonding material under predetermined bonding conditions.

[0005] Patent Document 1 describes a sheet-like bonding material obtained by applying a paste containing copper particles (D10: 100 nm or more, D90: 2000 nm or less) surface-coated with triethanolamine as a capping agent, dicarboxylic acid as an activator, a dispersant, epoxy methacrylate urethane as a binder, and terpineol as an organic solvent to a PET film and drying the paste. Patent Document 1 also describes that this sheet-like bonding material can be transferred to an Au-plated silicon die under transfer conditions of a transfer temperature of 200 to 225°C, a pressure of 5 MPa, and a transfer time of 1 to 10 seconds.

[0006] Special Publication No. 2021-529258

[0007] However, in Patent Document 1, the transfer temperature is 200°C or higher, so copper sinters during transfer, impairing the surface activity of the copper particles. This can impair the sintering of copper and the atomic diffusion into the bonded material during subsequent bonding, resulting in problems such as unstable sinterability and atomic diffusion (bondability). If transfer is performed under gentle transfer conditions that do not cause sintering of copper particles, there are problems such as the sheet-shaped bonding material not being able to be transferred to the entire surface of the transfered material, or residues of the dried paste film (transfer-type sheet-shaped bonding material) remaining on the resin substrate.

[0008] Furthermore, the sheet-shaped bonding material of Patent Document 1 has a problem in that it is difficult to stably ensure sufficient bonding strength during low-temperature bonding at a bonding temperature of 250° C. or less. That is, it has been found that the sheet-shaped bonding material of Patent Document 1 may cause variations in shear strength of bonded samples after bonding. Variations in shear strength cause variations in power module performance, which is problematic in practical use.

[0009] In view of the above problems, the present invention aims to provide a transfer-type sheet-like bonding material that (I) can obtain excellent transferability even under gentle transfer conditions in which sintering of copper particles does not progress, and (II) can stably ensure sufficient bonding strength even when bonding at low temperatures of 250°C or less.

[0010] In order to solve the above problems, the present inventors have conducted extensive research and have found that the above problems (I) and (II) can be solved by optimizing the solvent content of a transfer-type sheet-like bonding material, which is a paste-dried film formed by applying a paste containing copper particles, a reducing agent, a resin, and a solvent onto a resin substrate and drying the paste.

[0011] The gist of the present invention, which was completed based on the above findings, is as follows: [1] A transfer-type sheet-like bonding material, which is a paste-dried film obtained by applying a paste containing copper particles, a reducing agent, a resin, and a solvent onto a resin substrate and drying the paste, and which has a solvent content of 0.5 mass % or more and 2.0 mass % or less.

[0012] [2] The transfer type sheet-like bonding material according to the above [1], wherein the reducing agent is triethanolamine.

[0013] [3] The transfer sheet-like bonding material according to the above [1] or [2], wherein the content of the reducing agent is 3 parts by mass or more and 9 parts by mass or less per 100 parts by mass of copper particles.

[0014] [4] The transfer sheet-like bonding material according to any one of [1] to [3] above, wherein the average particle diameter of the copper particles is 70 nm or more and 300 nm or less.

[0015] [5] The transfer type sheet-like bonding material according to any one of the above [1] to [4], wherein the resin is an acrylic resin.

[0016] [6] The transfer sheet-like bonding material according to any one of [1] to [5] above, wherein the content of the resin is 1 part by mass or more and 5 parts by mass or less per 100 parts by mass of copper particles.

[0017] [7] The copper particles have a surface layer, at least a portion of which is a coating containing cuprous oxide and copper carbonate, and a carbon concentration of 0.03 mass% or more and 0.30 mass% or less, and an oxygen concentration of 0.5 mass% or more and 3.0 mass% or less. [8] The transfer type sheet-like bonding material according to any one of [1] to [6] above.

[0018] The transfer-type sheet-like bonding material of the present invention (I) has excellent transferability even under mild transfer conditions in which sintering of copper particles does not progress, and (II) can stably ensure sufficient bonding strength even when bonding at low temperatures of 250°C or less.

[0019] [Transfer-type sheet-like bonding material] A transfer-type sheet-like bonding material according to one embodiment of the present invention is a paste-dried film obtained by applying a paste containing copper particles, a reducing agent, a resin, and a solvent onto a resin substrate and drying the paste, and is characterized by having a solvent liquid content of 0.5 mass % or more and 2.0 mass % or less.

[0020] (Copper particles) The copper particles are mainly composed of copper. The copper particles preferably contain 95% by mass or more and 100% by mass or less of copper element relative to 100% by mass of the copper particles, and more preferably 97% by mass or more. When the copper element is contained in an amount of 95% by mass or more, the bonding material has excellent heat resistance and further excellent bonding strength.

[0021] The average particle diameter of the copper particles is preferably 300 nm or less. When the average particle diameter of the copper particles is 300 nm or less, a sufficiently high bonding strength can be ensured even at low-temperature bonding at 250°C or less. The average particle diameter of the copper particles is more preferably 150 nm or less. Furthermore, the average particle diameter of the copper particles is preferably 5 nm or more. When the average particle diameter of the copper particles is 5 nm or more, copper microparticles are easily available. The average particle diameter of the copper particles is more preferably 70 nm or more. When the average particle diameter of the copper particles is 70 nm or more, a sufficiently high bonding strength can be ensured even at low-temperature bonding at 250°C or less.

[0022] The shape (form) of the copper particles is not particularly limited. Examples of the shape of the copper particles include spherical (sphere), ellipsoid (ellipsoid), and plate-like shapes. Among these, spherical and ellipsoid shapes are preferred, and spherical shapes are more preferred.

[0023] The average particle size of copper particles can be determined by observing 10 fields of view at 10,000x magnification using a scanning electron microscope (SEM). The particle size of each copper particle in the 10 fields of view was measured for all copper particles selected according to the following selection criteria (1) to (5), and the resulting D50 was calculated. For particles that are not perfectly round, such as ellipses, the major axis was used as the particle size. The particle size distribution of copper particles was also determined based on the particle sizes of all copper particles measured. When determining the average particle size and particle size distribution of copper particles in a sheet-like bonding material, the outermost surface of the sheet was observed. In the powder state before sheet production, the powder was placed on carbon tape with a spatula, excess powder was removed with an air duster, and the tape surface was observed. (1) Particles with parts outside the field of view of the image were not measured. (2) Particles with clear outlines and isolated locations were measured. (3) Even if particles deviate from the average particle shape, particles that are independent and can be measured as individual particles were measured. (4) If particles overlap but the boundaries between them are clear and the overall shape of the particle can be determined, measure each particle as a single particle. (5) If particles overlap but the boundaries are unclear and the overall shape of the particle cannot be determined, do not measure them as their shape cannot be determined.

[0024] It is preferable to use copper particles that do not require a protective agent, a dispersant, etc. Examples of such copper particles include ultrafine metal powder obtained by the manufacturing method described in Japanese Patent No. 4304221 and copper fine particles obtained by the manufacturing method described in Japanese Patent No. 6130616. However, the copper particles are not limited to these examples.

[0025] Preferably, at least a portion of the surface layer of the copper particles is a coating containing copper carbonate. By forming the surface layer of the copper particles with a coating containing copper carbonate, the sintering temperature of the copper particles can be kept lower than conventionally while increasing the bonding strength. The coating containing copper carbonate may further contain cuprous oxide.

[0026] It is preferable to use copper particles that are not coated with an organic protective film. When the copper particles are coated with an organic protective film, sintering of the copper particles does not proceed unless the organic protective film is decomposed. Therefore, a bonding temperature higher than the decomposition temperature of the organic protective film is required, and low-temperature bonding at 250°C or lower may not be possible. In addition, decomposition gases from the organic protective film may form voids in the bonding layer or cracks may occur in the bonding layer, resulting in a risk of reduced reliability.

[0027] The carbon concentration of the copper particles is preferably 0.03% by mass or more and 0.30% by mass or less. If the carbon concentration of the copper particles is 0.03% by mass or more, the dispersibility of the copper particles in organic solvents is ensured and copper particle agglomerates are less likely to occur, so sufficient bonding strength can be stably ensured even at low temperatures of 250°C or less. If the carbon concentration of the copper particles is 0.30% by mass or less, sintering of the copper particles is not inhibited by the carbon contained in the surface layer of the copper particles, so sufficient bonding strength can be stably ensured even at low temperatures of 250°C or less. The carbon concentration of the copper particles can be measured using a carbon-sulfur analyzer (for example, the "EMIA-920V" manufactured by Horiba, Ltd.).

[0028] The oxygen concentration of the copper particles is preferably 0.5% by mass or more and 3.0% by mass or less. If the oxygen concentration of the copper particles is 0.5% by mass or more, reactivity with oxygen in the air is suppressed, so sufficient bonding strength can be stably ensured even at low-temperature bonding at 250°C or less. If the oxygen concentration of the copper particles is 3.0% by mass or less, the oxide film is easily removed during bonding and sintering is less likely to be inhibited, so sufficient bonding strength can be stably ensured even at low-temperature bonding at 250°C or less. The oxygen concentration of the copper particles can be measured using an oxygen / nitrogen analyzer (e.g., LECO's "TC600").

[0029] The "copper particle content" in the sheet-shaped bonding material is equivalent to the copper particle content in the paste, and can be determined, for example, by heating the sheet to about 1000°C in a nitrogen atmosphere and determining the weight after heating.

[0030] (Reducing Agent) The reducing agent is a compound that reduces the oxide film that inevitably exists on the surface of the copper particles during bonding. During bonding, the oxide film is removed by the reducing agent, causing the copper particles (pure copper) to come into contact with each other, promoting sintering and diffusion bonding.

[0031] In this embodiment, the reducing agent is preferably triethanolamine, which is highly effective in removing oxide films, has a high boiling point, and is low volatile, so it is not easily removed during transfer, and has high stability over time, so it has excellent storage stability before bonding.

[0032] In this embodiment, the content of the reducing agent is preferably 3 parts by mass or more and 9 parts by mass or less per 100 parts by mass of copper particles. If the content of the reducing agent is 3 parts by mass or more, the amount of reducing agent is sufficient, and even at low-temperature bonding at 250°C or less, the amount of reducing agent is sufficient, and sufficiently high bonding strength can be stably ensured. Furthermore, if the content of the reducing agent is 9 parts by mass or less, the reducing agent is less likely to seep out during transfer and bonding, and transfer and bonding in the same shape as the bonded material can be achieved. Furthermore, there is no increase in decomposition gas components, and voids and cracks are less likely to occur in the bonding layer.

[0033] The content of the reducing agent in the sheet-like bonding material is the same as the content of the reducing agent in the paste.

[0034] (Resin) The resin functions as an adhesive when the transfer-type sheet-like bonding material is transferred to the first member, and preferably also functions as a dispersant for dispersing the copper particles.

[0035] The resin is preferably a resin such as an acrylic resin or an aliphatic polycarbonate, which is a highly degradable binder. In particular, the resin is preferably an acrylic resin. This is because acrylic resin has an adhesive function and therefore has excellent transferability. Specifically, one or more selected from poly(alkyl methacrylate), poly(alkyl methacrylate), and methacrylic acid ester copolymers can be used.

[0036] In this embodiment, the resin content is preferably 1 part by mass or more and 5 parts by mass or less, more preferably 1.5 parts by mass or more, per 100 parts by mass of copper particles. If the resin content is 1 part by mass or more, full-surface transfer is possible without uneven shading under gentle transfer conditions where sintering of the copper particles does not progress. Furthermore, if the resin content is 5 parts by mass or less, decomposable components and undecomposed substances in the binder do not form voids in the bonding layer, and adhesion to the bonded materials is not impaired, so sufficient bonding strength can be stably ensured even at low temperatures of 250 ° C or less.

[0037] The resin content in the sheet-like bonding material is equal to the resin content in the paste.

[0038] (Solvent) The solvent preferably has a boiling point of about 200°C and low volatility. This is because if the solvent evaporates during paste application and the metal concentration changes, uneven thickness of the coating film will occur. Furthermore, if a resin is contained in the paste, the solvent must be able to dissolve the resin used. From these perspectives, for example, one or more solvents selected from the group consisting of terpene solvents such as terpineol, dihydroterpineol, dihydroterpinyl acetate, and dihydroterpinyl methyl ether; alcohols such as 1-propanol, 2-propanol, butanol, pentanol, hexanol, heptanol, and octanol; ketones such as acetone and methyl ethyl ketone; and aromatic solvents such as toluene can be used.

[0039] The solvent concentration (charged solvent concentration) C0 in the paste is preferably 5% by mass or more and 40% by mass or more. If the solvent concentration in the paste is 5% by mass or more, appropriate coating can be performed, and if the solvent concentration in the paste is 40% by mass or less, the coating film does not easily flow after the paste is applied, and the coating film can be easily adjusted.

[0040] (Solvent content of transfer-type sheet-like bonding material) It is important that the transfer-type sheet-like bonding material of this embodiment has a solvent content of 0.5% by mass or more and 2.0% by mass or less. By setting the solvent content within an appropriate range, (I) excellent transferability can be obtained even under gentle transfer conditions where sintering of copper particles does not proceed, and (II) sufficient bonding strength can be stably ensured even at low temperatures of 250 ° C or less. If the solvent content is too low, cracks will occur in the dried paste film, and excellent transferability will not be obtained under gentle transfer conditions where sintering of copper particles does not proceed. Therefore, the solvent content is set to 0.5% by mass or more. On the other hand, if the solvent content is too high, transfer will be good, but the solvent remaining in the sheet-like bonding material will cause voids and cracks in the bonding layer, making it impossible to stably ensure sufficient bonding strength at low temperatures of 250 ° C or less. Therefore, the solvent content is set to 2.0% by mass or less, preferably 1.7% by mass or less, and more preferably 1.5% by mass or less.

[0041] The solvent content of the transfer type sheet-like bonding material can be adjusted by controlling the drying conditions of the paste coating film applied to the resin substrate, specifically, the drying temperature and drying time.

[0042] The solvent content V of the transfer-type sheet-like bonding material can be calculated using the following formulas (1) and (2): V = {W0 - (WB - WA)} / WA x 100 ... formula (1) W0 = WB x C0 / 100 ... formula (2) where, W0: theoretical weight of solvent present in the paste-coated film, WB: weight of the paste-coated film immediately after applying the paste to the resin substrate, WA: weight of the dried paste film, and C0: solvent concentration in the paste. WB can be calculated by measuring the weight of the substrate including the paste-coated film after application and subtracting the weight of the substrate measured before application from this weight. WA can be calculated by subtracting the weight of the substrate from which the dried paste film has been removed from the weight of the substrate including the dried paste film.

[0043] (Sheet Shape) The bonding material of this embodiment is in the shape of a sheet. The thickness of the bonding material is not particularly limited, and can be, for example, 10 μm or more and less than 1 mm.

[0044] Furthermore, the shape of the joining material (the shape when viewed in a plane from the thickness direction) is not particularly limited and can be selected appropriately depending on the shape of the joining surfaces of the joined members, for example, rectangular or circular.

[0045] [Method for manufacturing transfer type sheet-like bonding material] The transfer type sheet-like bonding material of this embodiment can be produced by applying a paste containing copper particles, a reducing agent, a resin, and a solvent onto a resin substrate and drying the paste.

[0046] The method for preparing the paste is not particularly limited, and it can be prepared by mixing the components using a planetary mixer, a mortar, a mill, a stirrer, or the like. The method for applying and drying the paste to a resin substrate is also not particularly limited. For example, the paste can be applied to a resin substrate using an applicator and the paste-coated film can be dried in a hot air oven to obtain a dried paste film (transfer-type sheet-like bonding material). The drying conditions are appropriately adjusted so that the solvent content is 0.5% by mass or more and 2.0% by mass or less. For example, the drying temperature (ambient temperature) can be selected from the range of 50°C to 90°C, and the drying time can be selected from the range of 5 minutes to 300 minutes. The solvent content depends not only on the drying temperature and drying time, but also on the drying rate. That is, to adjust the solvent content, it is desirable to proceed with drying slowly. Specifically, a drying rate of 0.1% / min to 0.5% / min, based on the weight before drying (100), makes it easy to adjust the solvent content. For example, slow drying can be achieved by drying in a semi-closed system (such as placing the coating film sample on a tray and covering it with a lid) so that the drying vapor does not easily escape.

[0047] The resin substrate is not particularly limited, and examples thereof include a release PET film, a silicone film, a fluororesin film, etc. The thickness of the resin substrate can be set to about 50 to 200 μm in consideration of release properties.

[0048] The joining of two members (a first member and a second member) using the transfer-type sheet-like joining material is carried out through the following two steps of transfer and joining.

[0049] (Transfer) First, the sheet-shaped bonding material is bonded to the first member, and then the resin substrate is peeled off. That is, the sheet-shaped bonding material is transferred to the first member. The conditions for transferring the transfer-type sheet-shaped bonding material formed on the resin substrate to the first member are not particularly limited, but in this embodiment, excellent transferability can be obtained even under gentle transfer conditions that do not cause sintering of the copper particles, such as a transfer temperature (atmospheric temperature) of 150°C or less, a pressure of 10 MPa or less, and a transfer time of 1 minute or less. The transfer conditions can be in the range of a transfer temperature of 50°C or more and 150°C or less, a pressure of 1 MPa or more and 10 MPa or less, and a transfer time of 10 seconds or more and 1 minute or less. The atmosphere during transfer is nitrogen (N ２ The atmosphere may be an inert atmosphere such as air.

[0050] (Bonding) Next, the sheet-like bonding material transferred onto the first member is brought into contact with the second member, and the first member and the second member are bonded via the sheet-like bonding material under predetermined bonding conditions. The bonding conditions are not particularly limited, but in this embodiment, sufficient bonding strength can be stably ensured even at low-temperature bonding of 250°C or less. The bonding conditions can be set to a bonding temperature (ambient temperature) of 200°C or more and 250°C or less, a pressure of 1 MPa or more and 40 MPa or less, and a transfer time of 1 minute or more and 60 minutes or less. The atmosphere during bonding is nitrogen (N ２ It is preferable to use an inert atmosphere such as an inert atmosphere.

[0051] [Production of Transfer-Type Sheet-Type Bonding Material] (Test Example No. 1) 40 g of Taiyo Nippon Sanso copper particles (particle diameter 110 nm product; D10: 39 nm, D50: 112 nm, D90: 310 nm), 3.2 g of triethanolamine as a reducing agent, 0.8 g of acrylic binder (Kyoeisha Chemical Co., Ltd., Oricox KC-1700), and 13.14 g of terpineol as a solvent were mixed in a planetary mixer to obtain a paste. The surface layer of the copper particles was a coating containing cuprous oxide and copper carbonate, the carbon concentration of the copper particles was 0.17% by mass, and the oxygen concentration of the copper particles was 1.6% by mass. The solvent concentration (charged solvent concentration) C0 in the paste was 23.0% by mass.

[0052] Next, the prepared paste was applied to a 100 μm-thick release PET film using an applicator to form a coating film with a thickness of 200 μm, and the coating film was dried in a hot air oven at a drying temperature of 80 ° C. for 240 minutes to remove part of the terpineol, thereby obtaining a paste dried film (transfer-type sheet-like bonding material). The composition of the obtained transfer-type sheet-like bonding material and the solvent liquid content of the transfer-type sheet-like bonding material measured by the above-mentioned method are shown in Table 1.

[0053] (Test Examples Nos. 2 to 29) The copper particle content was fixed at 40 g, and the specifications of the copper particles (particle size, carbon concentration, and oxygen concentration), the content of the reducing agent, the type and content of the resin, and the type of solvent were changed to those shown in Table 1, and pastes were obtained in the same manner as in Test Example No. 1. The solvent concentration (charged solvent concentration) C0 in the paste was set to the value shown in Table 1. Next, under the drying conditions shown in Table 1, a paste dried film (transfer-type sheet-like bonding material) was obtained in the same manner as in Test Example No. 1. Table 1 shows the composition of the obtained transfer-type sheet-like bonding material and the solvent liquid content of the transfer-type sheet-like bonding material measured by the above-mentioned method.

[0054] [Transferability Evaluation] In each test example, Au-plated SiC (5 mm square, 350 μm thick) was mounted on a transfer-type sheet-shaped bonding material, and the transfer temperature was 150 ° C., the pressure was 10 MPa, the transfer time was 30 seconds, and the transfer-type sheet-shaped bonding material was transferred to the Au-plated surface of the SiC under the transfer conditions of atmospheric air. If the sheet-shaped bonding material was transferred uniformly to the SiC without any unevenness over the entire surface, it was rated as "excellent." If the sheet-shaped bonding material was transferred to the SiC entirely but with some unevenness in shade, it was rated as "fair." If the sheet-shaped bonding material could not be transferred to the SiC entirely, it was rated as "poor." These are shown in the "Transferability" column in Table 2. Note that if the transferability was "poor," there was a significant variation in the shear strength of the bonded sample after bonding, so subsequent bonding tests were not performed.

[0055] [Evaluation of shear strength of bonded product] In each test example, the transfer-type sheet-like bonding material transferred onto SiC was brought into contact with an oxygen-free copper plate C1020 (20 mm square, 2 mm thick), and the bonding was performed in a pressure bonding device at a bonding temperature of 250°C, a pressure of 10 MPa, a bonding time of 5 minutes, and N ２The bonded parts were produced by bonding SiC and oxygen-free copper plates via a sheet-like bonding material under bonding conditions in an atmosphere. The shear strength of the bonded parts was measured using a bond tester (manufactured by Dage, 4000Plus) at a tool height of 100 μm and a tool speed of 200 μm / s. Five bonded parts were produced for each test example, and the shear strength measurements are shown in Table 2.

[0056] The average shear strength of the five bonded products in each test example is shown in Table 2. The average value is shown in the "Shear strength evaluation" column in Table 2 as "Excellent" when it is 70 MPa or more, "Fair" when it is 50 MPa or more and less than 70 MPa, and "Poor" when it is less than 50 MPa.

[0057] In each test example, the shear strength variation index (%) was calculated by dividing the average value of {(maximum shear strength - minimum shear strength) x 100} by the shear strength, and is shown in Table 2. The results are shown in the "Shear strength variation evaluation" column in Table 2, with the variation index being rated as "excellent" when it was less than 15%, "fair" when it was 15% or more and less than 25%, and "poor" when it was 25% or more.

[0058] [Evaluation of Exudation of Bonding Layer After Bonding] In each test example, the outer periphery of the SiC in the bonded product was observed at 20x magnification using a microscope (L-KIT504, manufactured by Hozan Corporation) to check for the presence or absence of liquid exudation around the outer periphery of the SiC. The results are shown in Table 2.

[0059]

[0060] *1 110 nm product (D10: 39 nm, D50: 112 nm, D90: 310 nm) 50 nm product (D10: 15 nm, D50: 51 nm, D90: 194 nm) 70 nm product (D10: 24 nm, D50: 72 nm, D90: 284 nm) 300 nm product (D10: 52 nm, D50: 298 nm, D90: 652 nm) 400 nm product (D10: 66 nm, D50: 403 nm, D90: 811 nm) *2: Reducing agent content (parts by mass) per 100 parts by mass of copper particles *3: Acrylic resin content (parts by mass) in acrylic binder per 100 parts by mass of copper particles

[0061]

[0062] As is clear from Tables 1 and 2, in Comparative Example No. 1, in which the solvent content of the transfer type sheet-like bonding material is less than 0.5 mass%, excellent transferability was not obtained, and in Comparative Example No. 5, in which the solvent content of the transfer type sheet-like bonding material is more than 2.0 mass%, sufficient bonding strength could not be stably secured. On the other hand, in the invention examples in which the solvent content of the transfer type sheet-like bonding material is in the range of 0.5 mass% to 2.0 mass%, excellent transferability was obtained even under gentle transfer conditions in which sintering of copper particles does not progress, and sufficient bonding strength was stably secured even at low temperatures of 250 ° C.

[0063] The transfer type sheet-like bonding material of the present invention can be industrially used for bonding electronic components. Specifically, it can be used to bond components such as substrates and elements in high-temperature environments where it is difficult to use bonding materials such as solder, such as in electronic devices called power devices.

Claims

1. A transfer-type sheet-like bonding material that is a dried paste film formed by applying a paste containing copper particles, a reducing agent, a resin, and a solvent onto a resin substrate and drying it, and that has a solvent content of 0.5% by mass or more and 2.0% by mass or less.

2. The transfer-type sheet-like bonding material according to claim 1, wherein the reducing agent comprises triethanolamine.

3. A transfer sheet-like bonding material according to claim 1 or 2, wherein the content of the reducing agent is 3 parts by mass or more and 9 parts by mass or less per 100 parts by mass of copper particles.

4. A transfer-type sheet-like bonding material according to claim 1 or 2, wherein the copper particles have an average particle diameter of 70 nm or more and 300 nm or less.

5. A transferable sheet-like bonding material according to claim 1 or 2, wherein the resin is an acrylic resin.

6. A transfer sheet-like bonding material according to claim 1 or 2, wherein the content of the resin is 1 part by mass or more and 5 parts by mass or less per 100 parts by mass of copper particles.

7. A transfer-type sheet-like bonding material according to claim 1 or 2, wherein at least a portion of the surface of the copper particles is a coating containing cuprous oxide and copper carbonate, the carbon concentration is 0.03% by mass or more and 0.30% by mass or less, and the oxygen concentration is 0.5% by mass or more and 3.0% by mass or less.

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