Housing and wearable electronic device comprising same

Abstract

According to one embodiment of the present disclosure, a wearable electronic device may comprise a housing and at least one electrical component disposed inside the housing. The housing may comprise: a window forming at least a portion of the outer surface of the wearable electronic device; a coating layer disposed on the inner surface of the window; and a printed layer disposed under the inner surface of the coating layer. At least one opening defined by the printed layer may be aligned with the at least one electrical component. The refractive index of the coating layer may be greater than the refractive index of the window. Various other embodiments may be possible.

Description

Housing and wearable electronic device including the same

[0001] Various embodiments disclosed in this document relate to wearable electronic devices, for example, to a housing and a wearable electronic device including the same.

[0002] Recently, wearable electronic devices have become more miniaturized and can be worn on parts of the body, such as the wrist or head, thanks to improvements in display and battery performance. Because wearable electronic devices are worn directly on the body, they can improve portability and / or user accessibility.

[0003] Among wearable electronic devices, an electronic device that a user can wear on their face, such as a head-mounted device (HMD), is disclosed. Head-mounted devices can be usefully utilized to implement virtual reality or augmented reality. For example, a wearable electronic device can implement virtual reality by providing a three-dimensional image of a virtual space in a game enjoyed through a television or computer monitor while blocking the image of the actual space in which the user is located. Another type of wearable electronic device can provide an environment in which the user can visually perceive an actual image of the space in which the user is located, while implementing a virtual image to provide the user with various visual information, thereby providing augmented reality.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, a wearable electronic device may include a housing and at least one electrical component disposed inside the housing. The housing may include a window forming at least a portion of an outer surface of the wearable electronic device, a coating layer disposed under an inner surface of the window, and a printed layer disposed on an inner surface of the coating layer. At least one opening defined by the printed layer may be aligned with the at least one electrical component. A refractive index of the coating layer may be greater than a refractive index of the window.

[0006] According to one embodiment of the present disclosure, a wearable electronic device may include a housing and at least one electrical component disposed within the housing. The housing may include a window forming at least a portion of an outer surface of the wearable electronic device, and a coating layer disposed on an inner surface of the window. The refractive index of the coating layer may be greater than the refractive index of the window.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a front perspective view of a wearable electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a rear perspective view of a wearable electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is a front view of a wearable electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0012] FIG. 6 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0013] FIG. 7 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0014] FIG. 8A is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0015] FIG. 8b is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0016] FIG. 9 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0017] FIG. 10 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0018] FIG. 11 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0019] FIG. 12 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0020] FIG. 13 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0021] FIG. 14 is a schematic diagram illustrating a coating layer according to one embodiment of the present disclosure.

[0022] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0023] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0024] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0025] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0026] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0027] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0031] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0032] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0033] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0037] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0039] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0042] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0043] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0044] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0047] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0048] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0049] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0050] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0051] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0052] FIG. 2 is a front perspective view of a wearable electronic device according to one embodiment of the present disclosure.

[0053] FIG. 3 is a rear perspective view of a wearable electronic device according to one embodiment of the present disclosure.

[0054] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 14.

[0055] The configuration of the wearable electronic device (101) of FIG. 2 may be partially or entirely identical to the configuration of the electronic device (101) of FIG. 1.

[0056] Referring to FIGS. 2 and 3, a wearable electronic device (101) may include a housing (210).

[0057] According to one embodiment, the wearable electronic device (101) may be a body-worn device. For example, the wearable electronic device (101) may be a head-mounted device (HMD), smart glasses, PT (pass-through) device, AR glasses, or VST (video see-through) device capable of providing images directly in front of the user's eyes. In the illustrated embodiment, the wearable electronic device (101) is illustrated as having the appearance of goggles, but the wearable electronic device (101) of the present disclosure is not limited thereto and may have various types of appearances.

[0058] According to one embodiment, the wearable electronic device (101) may include a housing (210) that forms the exterior of the wearable electronic device (101). According to one embodiment, the housing (210) may form the exterior of the wearable electronic device (101) and provide a space in which components of the wearable electronic device (101) may be placed.

[0059] According to one embodiment, the housing (210) may include a first housing (202), a second housing (203), or at least one wearable member (204). In FIG. 3, for convenience of explanation, the second housing (203) is illustrated separated from the wearable electronic device (101).

[0060] According to one embodiment, the first housing (202) may provide a space in which components of the wearable electronic device (101) may be placed. For example, the first housing (202) may be referred to as a cover housing or a main body housing.

[0061] According to one embodiment, the first housing (202) may include a nose pad (e.g., the nose pad (2021) of FIG. 4) having at least one portion formed concave. The nose pad (2021) may be positioned on the user's nose or supported by the user's nose.

[0062] According to one embodiment, the wearable electronic device (101) may include a display module (e.g., the display module (160) of FIG. 1) disposed inside the first housing (202) and capable of outputting visual images. The display module may output visual images to the left and right eyes of the user through lenses (221, 222) disposed on the rear surface of the first housing (202) (e.g., the surface facing the +Z direction of FIGS. 2 and 3). For example, the lenses (221, 222) may include a first lens (221) configured to correspond to the left eye of the user, and a second lens (222) configured to correspond to the right eye of the user.

[0063] According to one embodiment, a wearable electronic device (101) may include VST camera modules (211, 212), a plurality of camera modules (213, 214, 215, 216), and / or an infrared (IR) camera module (217).

[0064] According to one embodiment, the camera modules (211 to 217) may be disposed on the first housing (202) or may be exposed to the outside of the wearable electronic device (101) through an opening formed in the first housing (202).

[0065] According to one embodiment, at least some of the camera modules (211 to 217) may be disposed inside the first housing (202). At least some of the camera modules (211 to 217) may be disposed inside the first housing (202) and may not be exposed to the outside of the first housing (202). For example, the first housing (202) may include a material that allows light to pass through. At least some of the camera modules (211 to 217) may detect the outside of the wearable electronic device (101) or capture the outside of the wearable electronic device (101) through a transparent area of ​​the first housing (202).

[0066] According to one embodiment, the VST camera modules (211, 212) may be camera modules for VST (video see through). For example, the wearable electronic device (101) may display at least a portion of an image associated with a surrounding environment captured by the VST camera modules (211, 212) (or an object processed based on at least a portion of the image and / or an object corresponding to at least a portion of the image) as at least a portion of VST content on the display module. Accordingly, a user may check at least a portion of an image associated with a surrounding environment captured by the VST camera modules (211, 212). For example, the VST content may be generated by mixing content for a VR environment and at least a portion of an image captured by the VST camera modules (211, 212). For example, VST content can be generated by mixing content for a VR environment and the processing results (or corresponding objects) of at least a portion of images captured through a VST camera module (211, 212). For example, VST content can be generated based on at least a portion of images captured through a VST camera module (211, 212). For example, VST content can be generated based on the processing results (or corresponding objects) of at least a portion of images captured through a VST camera module (211, 212).

[0067] According to one embodiment, a wearable electronic device (101) can obtain a visual image of an object or environment in a direction that a user is looking at or in which the wearable electronic device (101) is directed (e.g., the -Z axis direction of FIGS. 2 and 3) using a plurality of camera modules (213, 214, 215, 216).

[0068] According to one embodiment, the camera modules (213, 214) may be positioned relatively above the first housing (202) (or may be exposed through an opening formed in the first housing (202). The camera modules (213, 214) may capture images corresponding to a field of view (FOV) based on at least one point of the first housing (202), for example, an FOV corresponding to a relatively upper side when the user wears the wearable electronic device (101). The images acquired by the camera modules (213, 214) may be used for, for example, simultaneous localization and mapping (SLAM) and / or six degrees of freedom (6DoF), and / or for recognizing and / or tracking an object corresponding to the FOV. The images acquired by the camera modules (213, 214) may also be used for head tracking.

[0069] According to one embodiment, the camera modules (215, 216) may be disposed on a relatively lower portion of the first housing (202) (or may be exposed through an opening formed in the first housing (202). Here, the upper portion corresponding to the camera modules (213, 214) and the lower portion corresponding to the camera modules (215, 216) are defined when the user wears the wearable electronic device (101), and it will be understood by those skilled in the art that the part relatively closer to the ground is referred to as the lower portion and the part relatively farther from the ground is referred to as the upper portion, and this is only for convenience of explanation. The camera modules (215, 216) may capture an image corresponding to an FOV based on at least one point of the first housing (202), for example, an FOV corresponding to a relatively lower portion when the user wears the electronic device (101). The images acquired by the camera modules (215, 216) can be used for recognition and / or tracking of a subject corresponding to the FOV. For example, the images acquired by the camera modules (215, 216) can be used for recognition and / or tracking of a subject positioned relatively lower than the portion corresponding to the head, for example, the user's hand, when the user wears the electronic device (101), but there is no limitation.

[0070] According to one embodiment, the wearable electronic device (101) can perform recognition and / or tracking of a subject using at least one image captured by the camera module (213, 214, 215, 216). The wearable electronic device (101) can perform an operation identified based on the recognition and / or tracking result, for example, can provide a visual object at a location corresponding to the subject, but there is no limitation on the operation. For example, when a virtual keyboard is provided by the wearable electronic device (101), keys designated on the virtual keyboard can be recognized based on the tracking result of the user's hand. Actions corresponding to the recognition and / or tracking results may be performed solely by the wearable electronic device (101), for example, but this is exemplary and the actions may also be performed based on cooperation between the wearable electronic device (101) and an external electronic device (e.g., the electronic device (102), the electronic device (104) and / or the server (108) of FIG. 1).

[0071] According to one embodiment, the camera module (213, 214, 215, 216) is for 3DoF, 6DoF head tracking, hand detection, hand tracking and / or spatial recognition, and may be, but is not limited to, a GS (global shutter) camera and / or an RS (rolling shutter) camera.

[0072] According to one embodiment, the IR (infrared) camera module (217) may include a time of flight (TOF) camera or a structured light camera. For example, the IR camera module (217) may operate as at least a part of a sensor module (sensor module or Lidar sensor) for detecting a distance to a subject. According to one embodiment, the wearable electronic device (101) may further include a sensor module (e.g., Lidar sensor). For example, the sensor module may include at least one of a vertical cavity surface emitting laser (VCSEL), an infrared sensor, and / or a photodiode. According to one embodiment, the IR camera module (217) may be used for the purpose of confirming the distance to an object (subject), such as TOF.

[0073] In one embodiment, the wearable electronic device (101) may include a face tracking camera module (225). The face tracking camera module (225) may be used to detect and track a user's facial expressions. For example, the face tracking camera module (225) may be exposed through an opening formed in the first housing (202).

[0074] In one embodiment, the wearable electronic device (101) may include a microphone module (226) (e.g., the input module (150) of FIG. 1 ). The microphone module (226) may convert sound into an electrical signal. The microphone module (226) may be used to acquire voice information. In one embodiment, the microphone module (226) may be exposed through an opening formed in the first housing (202).

[0075] According to one embodiment, the second housing (203) may be a portion that comes into contact with the user's face when the user wears the wearable electronic device (101). In addition, the second housing (203) may be formed so that at least one portion is curved to correspond to the user's forehead or cheekbone.

[0076] In one embodiment, the second housing (203) may block external light from reaching the user's eyes by coming into contact with the user's face when the user wears the wearable electronic device (101). The second housing (203) may also be referred to as a face cover or cover housing. For example, the second housing (203) may be detachably coupled to the rear of the first housing (202).

[0077] According to one embodiment, at least one wearing member (204) may extend from an end of the first housing (202) and be supported or positioned on the user's body (e.g., an ear). According to one embodiment, the at least one wearing member (204) may include a first wearing member (2041) supported on the user's left ear and a second wearing member (2042) supported on the user's right ear.

[0078] According to one embodiment, the housing (210) may further include at least one hinge structure (229). According to one embodiment, at least one wearing member (204) may be rotatably coupled to the first housing (202) via at least one hinge structure (229). The at least one hinge structure (229) may be disposed between the first housing (202) and the at least one wearing member (204). When the user is not wearing the wearable electronic device (101), the user may fold the wearing member (204) so ​​that a portion thereof overlaps the first housing (202) and carry or store the wearing member (204).

[0079] According to one embodiment, the plurality of camera modules (213, 214, 215, 216) may be respectively arranged adjacent to an edge region of the first housing (202). For example, the plurality of camera modules (213, 214, 215, 216) may be arranged at a corner of the first housing (202) to secure a wide FOV. According to one embodiment, the plurality of camera modules (213, 214, 215, 216) may be exposed to the outside of the wearable electronic device (101) through openings formed at the corners of the first housing (202).

[0080] FIG. 4 is a front view of a wearable electronic device according to one embodiment of the present disclosure.

[0081] The embodiment of FIG. 4 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 5 to 14.

[0082] Referring to FIG. 4, a wearable electronic device (101) (e.g., the electronic device (101) of FIG. 1, or the wearable electronic device (101) of FIGS. 2 to 3) may include a housing (210), a first housing (202), VST camera modules (211, 212), a plurality of camera modules (213, 214, 215, 216), an IR camera module (217), or a nose pad (2021).

[0083] The configuration of the housing (210), the first housing (202), the VST camera modules (211, 212), the plurality of camera modules (213, 214, 215, 216), or the IR camera module (217) of FIG. 4 may be partially or entirely identical to the configuration of the housing (210), the first housing (202), the VST camera modules (211, 212), the plurality of camera modules (213, 214, 215, 216), or the IR camera module (217) of FIGS. 2 and 3.

[0084] According to one embodiment, at least a portion of the first housing (202) may include a concavely formed nose pad (2021). The nose pad (2021) may be positioned on the user's nose or supported by the user's nose.

[0085] According to one embodiment, the VST camera modules (211, 212) may include a first VST camera module (211) positioned corresponding to the user's right eye, or a second VST camera module (212) positioned corresponding to the user's left eye.

[0086] According to one embodiment, the IR camera module (217) may be positioned between the first VST camera module (211) and the second VST camera module (212).

[0087] According to one embodiment, the camera modules (211 to 217) may be covered by the first housing (202) and not exposed to the outside of the wearable electronic device (101).

[0088] According to one embodiment, the first housing (202) may form at least a portion of an outer surface of the wearable electronic device (101).

[0089] FIG. 5 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0090] FIG. 6 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0091] Figures 5 and 6 are cross-sectional views taken along line AA' of Figure 4.

[0092] The embodiments of FIGS. 5 to 6 can be combined with the embodiments of FIGS. 1 to 4, or the embodiments of FIGS. 7 to 14.

[0093] Referring to FIGS. 5 and 6, a wearable electronic device (e.g., the wearable electronic device (101) of FIGS. 2 to 4) may include a housing (300) or at least one electrical component (400).

[0094] According to one embodiment, the housing (300) (e.g., the first housing (202) of FIGS. 2 to 4) may form at least a portion of an outer surface of the wearable electronic device.

[0095] According to one embodiment, at least one electrical component (400) may be placed in an internal space of a wearable electronic device formed by a housing (300).

[0096] According to one embodiment, the housing (300) can cover at least one electrical component (400).

[0097] According to one embodiment, the housing (300) may include a window (310). The window (310) may include glass. For example, the window (310) may include glass having a light transmittance of about 90% to about 92%. However, the light transmittance of the window (310) is not limited thereto. The window (310) may include tempered glass. The window (310) may include an injection-molded material, plastic, or ceramic that includes a substantially light-transmitting material or a substantially transparent material.

[0098] According to one embodiment, the housing (300) may include a coating layer (320). The coating layer (320) may be disposed on the inner surface of the window (310). For example, the coating layer (320) may be stacked on the inner surface of the window (310).

[0099] According to one embodiment, the coating layer (320) may be disposed between the window (310) and the film layer (340). The coating layer (320) may be disposed between the window (310) and the printing layer (330).

[0100] According to one embodiment, the coating layer (320) may include an organic binder (e.g., organic binder (321) of FIG. 14) and an inorganic material (e.g., inorganic material (322) of FIG. 14).

[0101] According to one embodiment, the coating layer (320) may be a composite layer of an organic binder and an inorganic material.

[0102] According to one embodiment, the coating layer (320) may be formed on the film layer (340) through a wet coating process, but is not limited thereto. According to one embodiment, the coating layer (320) may be laminated on the inner surface of the window (310) while being laminated on the film layer (340).

[0103] In one embodiment, the refractive index of the coating layer (320) may be greater than or equal to the refractive index of the window (310). For example, the refractive index of the coating layer (320) may be greater than the refractive index of the window.

[0104] In one embodiment, the refractive index of the window (310) may be, but is not limited to, about 1.5. In one embodiment, the refractive index of the coating layer (320) may be, but is not limited to, greater than about 1.5. In one embodiment, the refractive index of the coating layer (320) may be, but is not limited to, about 1.3.

[0105] According to one embodiment, since the refractive index of the coating layer (320) is provided to be greater than the refractive index of the window (310), a portion of the light passing through the window (310) may be reflected from one surface of the coating layer (320) (e.g., a surface facing the window (310). For example, a portion of the light passing through the window (310) may be reflected at the boundary between the window (310) and the coating layer (320). Accordingly, when viewed from the outside of the wearable electronic device, the visibility of at least one electrical component disposed inside the housing (300) may be reduced.

[0106] According to one embodiment, the housing (300) may include a film layer (340) disposed on the inner surface of the coating layer (320).

[0107] According to one embodiment, the film layer (340) may be disposed between the coating layer (320) and the print layer (330). The film layer (340) may be disposed between the window (310) and the print layer (330).

[0108] In one embodiment, the film layer (340) may be configured to prevent and / or limit scattering of the housing (300) when an impact is applied to the housing (300).

[0109] According to one embodiment, the film layer (340) may include, but is not limited to, at least one of an optically clear adhesive (OCA), a polymer film layer, a thermoplastic polyurethane (TPU), or a polyolefin (PO). The film layer (340) may include a flexible material to correspond to a window (310) that includes a curved surface or a curve. For example, when the film layer (340) is laminated on a window (310) that includes a curved surface or a curve, the occurrence of cracks in the coating layer (320) laminated on the film layer (340) may be limited and / or reduced as the film layer (340) is not folded but is well bent.

[0110] In one embodiment, the Young's modulus of the film layer (340) may be, but is not limited to, about 2000 Mpa or less. For example, the strength (e.g., Young's modulus) of the film layer (340) may range from about 50 Mpa to about 2000 Mpa, but is not limited thereto.

[0111] According to one embodiment, the housing (300) may include a print layer (330). The print layer (330) may be disposed on the inner surface of the film layer (340). The print layer (330) may be laminated to the film layer (340). The print layer (330) may be disposed under the inner surface of the coating layer (320). For example, the print layer (330) may be disposed or positioned downward (e.g., in the +Z direction) with respect to the inner surface of the coating layer (320).

[0112] According to one embodiment, the print layer (330) may include an impermeable material. For example, the print layer (330) may include a black color pigment. The print layer (330) may include pigments and other additives.

[0113] According to one embodiment, the print layer (330) may include, but is not limited to, a black series thermosetting resin or a black series UV curable resin.

[0114] According to one embodiment, the print layer (330) may include an opaque material that prevents electrical / electronic components disposed inside the wearable electronic device from being visually exposed.

[0115] According to one embodiment, the print layer (330) may include at least one opening (331, 332). The at least one opening (331, 332) may be defined by the print layer (330). The at least one opening (331, 332) may be aligned with at least one electrical component (400).

[0116] According to one embodiment, at least one opening (331, 332) may comprise a hole formed in the print layer (330).

[0117] According to one embodiment, at least one opening (331, 332) may include a first opening (331) and a second opening (332) that are spaced apart from each other.

[0118] In one embodiment, the first opening (331) of the print layer (330) may be configured to allow external light to reach the sensor (410). The second opening (332) of the print layer (330) may allow external light to reach the camera (420).

[0119] According to one embodiment, at least one electrical component (400) may be positioned inside the housing (300). The at least one electrical component (400) may include a sensor (410) or a camera (420).

[0120] According to one embodiment, the sensor (410) (e.g., the IR camera module (217) of FIG. 4) may include an infrared sensor. The sensor (410) may include a sensor module (e.g., the sensor module (176) of FIG. 1) for detecting a distance from an external subject of the wearable electronic device. Light that passes through the window (310), the coating layer (320), the film layer (340), the infrared-transmitting layer (360), and the AR coating layer (370) may reach the sensor (410).

[0121] In one embodiment, the sensor (410) may be aligned with the first opening (331). For example, the sensor (410) may overlap the first opening (331).

[0122] In one embodiment, the camera (420) (e.g., the second VST camera module (212) of FIG. 4) may be configured to capture images of objects external to the wearable electronic device. Light passing through the window (310), the coating layer (320), the film layer (340), and the AR coating layer (370) may reach the sensor (410).

[0123] According to one embodiment, the housing (300) may include an infrared transmissive layer (360). The infrared transmissive layer (360) may be disposed in the first opening (331). The infrared transmissive layer (360) may be accommodated in the first opening (331). The infrared transmissive layer (360) may be configured to transmit infrared light. The IR transmissive layer (360) may be configured to at least partially block visible light.

[0124] In one embodiment, the infrared transmittance of the infrared transmissive layer (360) may be greater than the visible light transmittance of the infrared transmissive layer (360). For example, the infrared transmittance of the infrared transmissive layer (360) may be greater than or equal to about 70%. The visible light transmittance of the infrared transmissive layer (360) may be less than or equal to about 10%.

[0125] In one embodiment, visibility of a sensor (410) positioned within the housing (300) may be reduced as the infrared transmissive layer (360) blocks and / or limits visible light.

[0126] In one embodiment, the infrared transmissive layer (360) may include a thermosetting resin or a UV-curable resin. The infrared transmissive layer (360) may include pigments and other additives that implement color. The infrared transmissive layer (360) may include cellophane tape.

[0127] According to one embodiment, the infrared transmitting layer (360) may be defined as a coating layer formed in the first opening (331) through physical vapor deposition (PVD) or chemical vapor deposition (CVD).

[0128] According to one embodiment, the housing (300) may include an anti-reflective (AR) coating layer (370).

[0129] According to one embodiment, the AR coating layer (370) may be disposed or laminated on the print layer (330) or the film layer (340). At least a portion of the AR coating layer (370) may be disposed on the infrared transmissive layer (360).

[0130] According to one embodiment, the AR coating layer (370) may be configured to reduce surface reflection at the surface of the infrared transmissive layer (360) or to reduce surface reflection at the surface of the film layer (340).

[0131] According to one embodiment, the AR coating layer (370) may face a sensor (410) or a camera (420).

[0132] In one embodiment, the AR coating layer (370) may be configured to improve the optical performance of light introduced from the exterior of the housing (300) to at least one electrical component (400). For example, the transmittance of light introduced from the exterior of the housing (300) to at least one electrical component (400) may be improved by about 2% to about 3% by the AR coating layer (370).

[0133] According to one embodiment, the AR coating layer (370) may include an oxide deposition layer or a metal deposition layer formed on the printed layer (330), the infrared transmitting layer (360), or the film layer (340) through physical vapor deposition (PVD) or chemical vapor deposition (CVD).

[0134] According to one embodiment, the AR coating layer (370) may be formed through dry coating or wet coating. The AR coating layer (370) may include, but is not limited to, a wet coating layer including an organic binder and / or an inorganic material.

[0135] According to one embodiment, the AR coating layer (370) may include a composite metal material including at least one or at least two of SiO2, Ti3O5, SiN, Al2O3, Nb2O5, ZrO2, or indium.

[0136] According to one embodiment, the AR coating layer (370) may include a second portion (372). The second portion (372) may be positioned within the second opening (332). The second portion (372) may be laminated to the film layer (340).

[0137] According to one embodiment, the coating layer (320) may have a first thickness (t1) (e.g., the thickness in the Z-axis direction of FIGS. 5 and 6). The printing layer (330) may have a second thickness (t2) (e.g., the thickness in the Z-axis direction of FIGS. 5 and 6). The first thickness (t1) may be less than the second thickness (t2). The first thickness (t1) may be, but is not limited to, about 40 nm to about 100 nm (nanometer). The second thickness (t2) may be, but is not limited to, about 10 um to about 20 um (micrometer). The second thickness (t2) may be, but is not limited to, about 100 times to about 500 times the first thickness (t1).

[0138] According to one embodiment, the thickness of the infrared transmissive layer (360) (e.g., the thickness in the Z-axis direction of FIGS. 5 and 6) may be substantially equal to, but is not limited to, the second thickness (t2) of the printed layer (330).

[0139] According to one embodiment, the thickness of the AR coating layer (370) (e.g., the thickness in the Z-axis direction of FIGS. 5 and 6 ) may be, but is not limited to, about 100 nm to about 200 nm.

[0140] Referring to FIG. 5, the second portion (372) of the AR coating layer (370) may not be contiguous with another portion of the AR coating layer (370). The second portion (372) of the AR coating layer (370) and the other portion of the AR coating layer (370) may be positioned on different planes.

[0141] Referring to FIG. 6, the second portion (372) of the AR coating layer (370) may be contiguous with another portion of the AR coating layer (370). The AR coating layer (370) may include a third portion (373) connected to the second portion (372) and the other portion. The third portion (373) may be disposed on an inner surface of the printing layer (330) defining the second opening (332). The third portion (373) may be disposed on a side surface of the second opening (332).

[0142] Referring to FIGS. 5 and 6, the coating layer (320) may be formed on one surface of the film layer (340) through a slot die coating process. A printing layer (330) including at least one opening (331, 332) may be printed on the other surface of the film layer (340). An infrared-transmitting layer (360) may be coated on the first opening (331). With the above-described components (320, 330, 360) respectively disposed on one surface and the other surface of the film layer (340), the film layer (340) may be laminated on the window (310). With the film layer (340) laminated on the window (310), an AR coating layer (370) may be formed through a coating process.

[0143] FIG. 7 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0144] The embodiment of FIG. 7 can be combined with the embodiments of FIGS. 1 to 6, or the embodiments of FIGS. 8 to 14.

[0145] Referring to FIG. 7, a coating layer (320) (e.g., coating layer (320) of FIGS. 5 and 6) may be disposed between a film layer (340) (e.g., film layer (340) of FIGS. 5 and 6) and a print layer (330) (e.g., print layer (330) of FIGS. 5 and 6).

[0146] FIG. 8a is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0147] FIG. 8b is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0148] The embodiments of FIGS. 8A to 8B can be combined with the embodiments of FIGS. 1 to 7, or the embodiments of FIGS. 9 to 14.

[0149] Referring to FIGS. 8A and 8B , an infrared transmitting layer (3601) (e.g., the infrared transmitting layer (3601) of FIGS. 5 and 6 ) may be disposed between a film layer (340) (e.g., the film layer (340) of FIGS. 5 and 6 ) and a printing layer (330) (e.g., the printing layer (330) of FIGS. 5 and 6 ). The infrared transmitting layer (3601) may be disposed between a coating layer (320) (e.g., the coating layer (320) of FIGS. 5 and 6 ) and a printing layer (330).

[0150] According to one embodiment, the AR coating layer (370) (e.g., the AR coating layer (370) of FIGS. 5 and 6) may include a first portion (371) or a second portion (372) (e.g., the second portion (372) of FIGS. 5 and 6).

[0151] According to one embodiment, the first portion (371) and / or the second portion (372) may be positioned on a different plane than another portion of the AR coating layer (370).

[0152] According to one embodiment, the first portion (371) may be disposed in the first opening (331) and laminated on the surface of the infrared transmissive layer (3601). The second portion (372) may be disposed in the second opening (332) and laminated on the surface of the infrared transmissive layer (3601).

[0153] Referring to FIG. 8A, the first portion (371) and / or the second portion (372) may not be continuous with another portion of the AR coating layer (370). The first portion (371) and / or the second portion (372) may be positioned on a different plane from the other portion of the AR coating layer (370).

[0154] Referring to FIG. 8B, the first portion (371) and / or the second portion (372) may be continuous with another portion of the AR coating layer (370). The AR coating layer (370) may include a third portion (373) connected to the second portion (372) and the other portion. The third portion (373) may be disposed on an inner surface of the print layer (330) defining the second opening (332). The third portion (373) may be disposed on a side surface of the second opening (332). The AR coating layer (370) may include a fourth portion (374) connected to the first portion (371) and the other portion. The fourth portion (374) may be disposed on an inner surface of the print layer (330) defining the first opening (331). The fourth part (374) can be placed on the side of the first opening (331).

[0155] FIG. 9 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0156] The embodiment of FIG. 9 can be combined with the embodiments of FIGS. 1 to 8b, or the embodiments of FIGS. 10 to 14.

[0157] Referring to FIG. 9, a coating layer (320) (e.g., the coating layer (320) of FIGS. 5 and 6) may be disposed between a film layer (340) (e.g., the film layer (340) of FIGS. 5 and 6) and an infrared transmitting layer (3601) (e.g., the infrared transmitting layer (3601) of FIGS. 8A to 8B).

[0158] FIG. 10 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0159] The embodiment of FIG. 10 can be combined with the embodiments of FIGS. 1 to 9, or the embodiments of FIGS. 11 to 14.

[0160] Referring to FIG. 10, an AR coating layer (3701) (e.g., the AR coating layer (370) of FIGS. 5 and 6) may be disposed or laminated on a film layer (340) (e.g., the film layer (340) of FIGS. 5 and 6). The film layer (340) may be disposed between a coating layer (320) (e.g., the coating layer (320) of FIGS. 5 and 6) and the AR coating layer (3701).

[0161] FIG. 11 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0162] The embodiment of FIG. 11 can be combined with the embodiments of FIGS. 1 to 10, or the embodiments of FIGS. 12 to 14.

[0163] Referring to FIG. 11, an AR coating layer (3701) (e.g., AR coating layer (370) of FIGS. 5 and 6) may be disposed or laminated on a coating layer (320) (e.g., coating layer (320) of FIGS. 5 and 6). The coating layer (320) may be disposed between a film layer (340) (e.g., film layer (340) of FIGS. 5 and 6) and the AR coating layer (3701).

[0164] FIG. 12 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0165] The embodiment of FIG. 12 can be combined with the embodiments of FIGS. 1 to 11, or the embodiments of FIGS. 13 to 14.

[0166] Referring to FIG. 12, a film layer (340) (e.g., film layer (340) of FIGS. 5 and 6) may be disposed or laminated on a coating layer (320) (e.g., coating layer (320) of FIGS. 5 and 6). The film layer (340) may directly face at least one electrical component (400) (e.g., at least one electrical component (400) of FIGS. 5 and 6).

[0167] FIG. 13 is a cross-sectional view showing the arrangement relationship of a housing and electrical components according to one embodiment of the present disclosure.

[0168] The embodiment of FIG. 13 can be combined with the embodiments of FIGS. 1 to 12, or the embodiment of FIG. 14.

[0169] Referring to FIG. 13, a coating layer (320) (e.g., the coating layer (320) of FIGS. 5 and 6) may be disposed or laminated on a film layer (340) (e.g., the film layer (340) of FIGS. 5 and 6). The coating layer (320) may directly face at least one electrical component (400) (e.g., at least one electrical component (400) of FIGS. 5 and 6).

[0170] FIG. 14 is a schematic diagram illustrating a coating layer according to one embodiment of the present disclosure.

[0171] The embodiment of FIG. 14 can be combined with the embodiments of FIGS. 1 to 13.

[0172] Referring to FIG. 14, the coating layer (320) (e.g., the coating layer (320) of FIGS. 5 and 6) may include an organic binder (321) and an inorganic material (322).

[0173] According to one embodiment, the coating layer (320) may be a composite layer including an organic binder (321) and an inorganic material (322). According to one embodiment, the coating layer (320) may be laminated without cracks occurring on a film layer (e.g., film layer (340) of FIGS. 5 and 6) or a window (e.g., window (310) of FIGS. 5 and 6) by including the organic binder (321).

[0174] According to one embodiment, the coating layer (320) may be composed of a single layer, but is not limited thereto and may be composed of multiple layers.

[0175] In one embodiment, the organic binder (321) may include a resin. For example, the organic binder (321) may include a natural resin, a synthetic resin (e.g., an acrylic, urethane, or polyester-based synthetic resin), or an additive (e.g., a dispersant or UV absorber). The organic binder (321) may include a monomer, oligomer, or photoinitiator capable of reacting to UV curing.

[0176] According to one embodiment, the inorganic material (322) may include an inorganic filler. The inorganic material (322) may include TiO2, ZrO2, C2O2, or ZnS.

[0177] In one embodiment, the refractive index of the inorganic material (322) may be greater than the refractive index of the organic binder (321). For example, the refractive index of the inorganic material (322) may be about 2.0 to about 5.0, and the refractive index of the organic binder (321) may be about 1.3 to about 1.7.

[0178] According to one embodiment, the refractive index of the coating layer (320) in which the organic binder (321) and the inorganic material (322) are mixed may be defined by the volume ratio of the organic binder (321) and the inorganic material (322). For example, the refractive index of the coating layer (320) may be about 1.3 or more, but is not limited thereto.

[0179] In one embodiment, the refractive index of the window (e.g., window (310) of FIGS. 5 and 6) may be about 1.5. The refractive index of the coating layer (320) may be greater than the refractive index of the window. For example, the refractive index of the coating layer (320) may be greater than about 1.5.

[0180] According to one embodiment, since the refractive index of the coating layer (320) is provided to be greater than the refractive index of the window, a portion of the light passing through the window may be reflected from the surface of the coating layer (320). Accordingly, a smaller amount of light may reach at least one opening (e.g., at least one opening (331, 332) of FIGS. 5 and 6) than the light passing through the window. Accordingly, the boundary of the inner surface of the printed layer (e.g., the printed layer (330) of FIGS. 5 and 6) defining at least one opening (e.g., at least one opening (331, 332) of FIGS. 5 and 6) may be reduced from being visible from the outside of the wearable electronic device. Accordingly, the design quality of the wearable electronic device may be improved.

[0181] A wearable electronic device may include a sensor or camera for detecting the distance to an external subject or for photographing an external object. The sensor or camera may be positioned within the housing of the wearable electronic device.

[0182] To allow light to pass through the sensor or camera, the housing may include a transparent material. As the housing is configured to be at least partially transparent, the sensor or camera may be visible from the outside of the wearable electronic device.

[0183] According to one embodiment of the present disclosure, a housing that prevents a sensor or camera from being recognized from the outside and a wearable electronic device including the same can be provided.

[0184] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0185] According to one embodiment of the present disclosure, a housing having an improved color material finish (CMF) design and a wearable electronic device including the same can be provided so that a sensor or camera is not visible from the outside.

[0186] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0187] According to one embodiment of the present disclosure, a wearable electronic device (101) may include a housing (300).

[0188] According to one embodiment, the wearable electronic device (101) may include at least one electrical component (400) disposed inside the housing (300).

[0189] According to one embodiment, the housing (300) may include a window (310) forming at least a portion of an outer surface of the wearable electronic device (101).

[0190] According to one embodiment, the housing (300) may include a coating layer (320) disposed on the inner surface of the window (310).

[0191] According to one embodiment, the housing (300) may include a printed layer (330) disposed under the inner surface of the coating layer (320). According to one embodiment, the housing (300) may include a printed layer (330) disposed in a downward direction (e.g., in the +Z direction) of the coating layer (320).

[0192] According to one embodiment, at least one opening (331, 332) defined by the print layer (330) can be aligned with the at least one electrical component (400).

[0193] According to one embodiment, the refractive index of the coating layer (320) may be greater than the refractive index of the window (310).

[0194] According to one embodiment, the housing (300) may further include a film layer (340) disposed on the coating layer (320).

[0195] According to one embodiment, the film layer (340) may be disposed between the coating layer (320) and the printing layer (330).

[0196] According to one embodiment, the film layer (340) may be disposed between the window (310) and the printing layer (330).

[0197] According to one embodiment, the Young's modulus of the film layer (340) may be 2000 MPa or less.

[0198] According to one embodiment, the coating layer (320) may have a first thickness.

[0199] According to one embodiment, the printed layer (330) may have a second thickness greater than the first thickness.

[0200] In one embodiment, the first thickness may be 100 to 500 times the second thickness.

[0201] According to one embodiment, the at least one opening (331, 332) may include a first opening (331) and a second opening (332) spaced apart from the first opening (331).

[0202] According to one embodiment, the at least one electrical component (400) may include an infrared sensor (410) aligned with the first opening (331) and a camera (420) aligned with the second opening (332).

[0203] According to one embodiment, the housing (300) may further include an infrared transmitting layer (360) disposed in the first opening (331).

[0204] According to one embodiment, the housing (300) may further include an infrared transmitting layer (3601) disposed between the coating layer (320) and the printing layer (330).

[0205] According to one embodiment, the housing (300) may further include an AR (anti-reflective) coating layer (370) disposed on the printing layer (330).

[0206] According to one embodiment, the AR coating layer (370) may include a first portion (371) disposed in the first opening (331) and a second portion (372) disposed in the second opening (332).

[0207] According to one embodiment, the first portion (371) and the second portion (372) may be positioned on different planes from other portions of the AR coating layer (370).

[0208] According to one embodiment, the coating layer (320) may include an organic binder (321) and an inorganic material (322).

[0209] According to one embodiment, the refractive index of the organic binder (321) may be smaller than the refractive index of the inorganic material (322).

[0210] According to one embodiment of the present disclosure, a wearable electronic device (101) may include a housing (300).

[0211] According to one embodiment, the wearable electronic device (101) may include at least one electrical component (400) disposed inside the housing (300).

[0212] According to one embodiment, the housing (300) may include a window (310) forming at least a portion of an outer surface of the wearable electronic device (101).

[0213] According to one embodiment, the housing (300) may include a coating layer (320) disposed on the inner surface of the window (310).

[0214] According to one embodiment, the refractive index of the coating layer (320) may be greater than the refractive index of the window (310).

[0215] According to one embodiment, the housing (300) may further include a film layer (340) disposed on the coating layer (320) and having a Young's modulus of 2000 MPa or less.

[0216] According to one embodiment, the coating layer (320) may be formed on one surface of the film layer (340) through wet coating treatment.

[0217] According to one embodiment, the housing (300) may further include an AR coating layer (3701) disposed on the coating layer (320) or the film layer (340).

[0218] According to one embodiment, the coating layer (320) may include an organic binder (321) and an inorganic material (322).

[0219] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In a wearable electronic device (101), Housing (300); and At least one electrical component (400) disposed inside the housing (300), The above housing (300) is, A window (310) forming at least a portion of the outer surface of the wearable electronic device (101); A coating layer (320) disposed on the inner surface of the above window (310); and It includes a printing layer (330) disposed under the inner surface of the above coating layer (320), At least one opening (331, 332) defined by the above printing layer (330) is aligned with the at least one electrical component (400), A wearable electronic device in which the refractive index of the coating layer (320) is greater than the refractive index of the window (310).

2. In paragraph 1, The above housing (300) is, A wearable electronic device further comprising a film layer (340) disposed on the above coating layer (320).

3. In either of paragraphs 1 and 2, The above film layer (340) is A wearable electronic device disposed between the coating layer (320) and the printing layer (330).

4. In any one of paragraphs 1 to 3, The above film layer (340) is A wearable electronic device disposed between the above window (310) and the above printing layer (330).

5. In any one of paragraphs 1 to 4, The Young's modulus of the above film layer (340) is Wearable electronic devices with a strength of less than 2000 MPa.

6. In any one of paragraphs 1 to 5, The above coating layer (320) is With the first thickness, The above printing layer (330) is A wearable electronic device having a second thickness greater than the first thickness.

7. In any one of paragraphs 1 to 6, The above first thickness is, A wearable electronic device having a thickness 100 to 500 times greater than the second thickness.

8. In any one of paragraphs 1 to 7, At least one of the above openings (331, 332) is It includes a first opening (331) and a second opening (332) spaced apart from the first opening (331), At least one electrical component (400) above, A wearable electronic device comprising an infrared sensor (410) aligned with the first opening (331) and a camera (420) aligned with the second opening (332).

9. In any one of paragraphs 1 to 8, The above housing (300) is, A wearable electronic device further comprising an infrared transmitting layer (360) disposed in the first opening (331).

10. In any one of paragraphs 1 to 8, The above housing (300) is, A wearable electronic device further comprising an infrared transmitting layer (3601) disposed between the coating layer (320) and the printing layer (330).

11. In any one of paragraphs 1 to 10, The above housing (300) is, A wearable electronic device further comprising an AR (anti-reflective) coating layer (370) disposed on the above printing layer (330).

12. In any one of paragraphs 1 to 11, The above AR coating layer (370) is A wearable electronic device comprising a first part (371) disposed in the first opening (331) and a second part (372) disposed in the second opening (332).

13. In any one of paragraphs 1 to 12, The above first part (371) and the above second part (372) are, A wearable electronic device positioned on a different plane from other parts of the above AR coating layer (370).

14. In any one of paragraphs 1 to 13, The above coating layer (320) is A wearable electronic device comprising an organic binder (321) and an inorganic material (322).

15. In any one of paragraphs 1 to 14, A wearable electronic device in which the refractive index of the organic binder (321) is lower than the refractive index of the inorganic material (322).

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