Curable resin composition, cured film and display device

Abstract

Provided are a curable resin composition, a cured film and a display device, the curable resin composition comprising a silicone-based resin of chemical formula 1 and particles, wherein the particles include nanoparticles surface-modified with an alkoxysilane having an alkyl group and / or an alkoxysilane having a (meth) acryloyloxy group.

Description

Curable resin composition, cured film and display device

[0001] The present invention relates to a curable resin composition, a cured film, and a display device.

[0002]

[0003] As the display industry advances, various display devices utilizing displays are diversifying. There is a growing demand for technologies that enhance the luminous efficiency of self-luminous materials, such as OLEDs or quantum dot displays. Low-refractive index layers are being used to improve luminous efficiency by recycling light emitted from OLEDs or quantum dots, and to provide anti-reflection effects with low refractive indexes, thereby improving visibility.

[0004]

[0005] The present invention provides a curable resin composition that implements a low refractive index layer having low haze, excellent adhesion to an inorganic layer, and excellent optical efficiency.

[0006]

[0007] According to one embodiment, a curable resin composition is provided.

[0008] 1. A curable resin composition comprises a silicone resin and particles of the following chemical formula 1, and the particles comprise nanoparticles whose surface is modified with at least one of an alkoxysilane having an alkyl group and an alkoxysilane having a (meth)acryloxy group.

[0009] [Chemical Formula 1]

[0010] (R 1 R 2 SiO 2 / 2 ) D (R 3 SiO 3 / 2 ) T (SiO 4 / 2 ) Q

[0011] (In the above chemical formula 1,

[0012] R 1 , R 2 , R3 , D, T and Q are the same as described in the description of the invention below).

[0013] 2. In 1, the surface-modified nanoparticles may be included in more than 90 wt% of the particles.

[0014] In 3.1-2, the total amount of at least one of the alkoxysilane having an alkyl group and the alkoxysilane having a (meth)acryloyloxy group among the surface modifying materials of the nanoparticles may be included at 90 mol% or more.

[0015] In 4.1-3, the nanoparticles may have an average particle diameter D50 of 10 to 150 nm.

[0016] In 5.1-4, the nanoparticles may be included in the curable resin composition at 20 to 80 wt% based on solid content.

[0017] In 6.1-5, R in the above chemical formula 1 1 , R 2 Each can independently be a methyl group or a vinyl group.

[0018] In 7.1-6, R in the above chemical formula 1 3 It may be a propyl group substituted with a methyl group, an ethyl group, a propyl group, a vinyl group or a (meth)acryloyloxy group.

[0019] In 8.1-7, the particles may further include hollow particles.

[0020] In 9.1-8, the hollow particles may be surface-unmodified or surface-modified.

[0021] In 10.1-9, the composition may further include an organic polymer having a boiling point of 250°C or lower.

[0022] In 11.1-10, the organic polymer may include a polyalkylene oxide-based, polyarylene oxide-based, glycol-based, polycaprolactone-based, polydioxanone-based, polypropylene carbonate-based homopolymer or copolymer, or a combination thereof.

[0023] In 12.1-11, the composition may include 10 to 40 wt% of the silicone resin based on solid content; 30 to 60 wt% of the particles; and 20 to 60 wt% of the organic polymer having a boiling point of 250°C or lower.

[0024] In 13.1-12, the composition may further include one or more of an additive and a solvent.

[0025] According to another embodiment, a cured film is provided.

[0026] The above cured film includes a cured product of the above curable resin composition.

[0027] In another embodiment, a display device is provided.

[0028] The above display device includes the above cured film.

[0029]

[0030] The above curable resin composition can realize a low refractive index layer having low haze, excellent adhesion to an inorganic layer, and excellent light efficiency.

[0031]

[0032] Figure 1 is a plan view schematically illustrating a color conversion panel according to an embodiment.

[0033] Figure 2 is a cross-sectional view schematically illustrating a cross-section taken along line II-II of Figure 1.

[0034] Fig. 3 is a cross-sectional view according to a modified example of Fig. 2.

[0035] Fig. 4 is a cross-sectional view according to a modified example of Figs. 2 and 3.

[0036] Fig. 5 is a cross-sectional view according to a modified example of Fig. 2.

[0037]

[0038] Hereinafter, embodiments of the present application will be described in more detail with reference to the attached drawings. However, the technology disclosed in the present application is not limited to the embodiments described herein and may be embodied in other forms. However, the embodiments introduced herein are provided so that the disclosed content can be thorough and complete and so that the spirit of the present application can be sufficiently conveyed to those skilled in the art. In order to clearly express the components of each device in the drawings, the sizes of the components, such as width and thickness, are somewhat enlarged. However, the sizes of the components, such as width and thickness, in the present invention do not limit the scope of the present invention. The same reference numerals in multiple drawings indicate substantially the same components.

[0039] The terminology used herein is for the purpose of describing exemplary embodiments only and is not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

[0040] In this specification, "upper" and "lower" are defined based on the drawing, and depending on the perspective, "upper" may be changed to "lower" and "lower" may be changed to "upper", and reference to "on" or "on" may include not only directly on but also cases where another structure is interposed in between. On the other hand, reference to "directly on" or "directly above" or "directly formed" indicates cases where there is no intervening other structure such as an intermediate body.

[0041] Unless otherwise specified herein, "alkyl group" means a C1 to C20 alkyl group, "alkenyl group" means a C2 to C20 alkenyl group, "cycloalkenyl group" means a C3 to C20 cycloalkenyl group, "heterocycloalkenyl group" means a C3 to C20 heterocycloalkenyl group, "aryl group" means a C6 to C20 aryl group, "arylalkyl group" means a C6 to C20 arylalkyl group, "alkylene group" means a C1 to C20 alkylene group, "arylene group" means a C6 to C20 arylene group, "alkylarylene group" means a C6 to C20 alkylarylene group, "heteroarylene group" means a C3 to C20 heteroarylene group, and "alkoxylene group" means a C1 to C20 It refers to an alkoxylene group.

[0042] Unless otherwise specified herein, "substitution" means that at least one hydrogen atom is substituted with a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, a C2 to C20 It means substituted with a C20 heterocycloalkynyl group, a C3 to C20 heteroaryl group, a (meth)acryloyl group, a (meth)acryloyloxy group, or a combination thereof.

[0043] Additionally, unless otherwise specified herein, “hetero” means that the chemical formula contains at least one heteroatom of at least one of N, O, S, and P.

[0044] Additionally, unless otherwise specified herein, “(meth)acrylate” means both “acrylate” and “methacrylate”, and “(meth)acrylic acid” means both “acrylic acid” and “methacrylic acid”.

[0045] Unless otherwise specified herein, “combination” means mixing or copolymerization.

[0046] When describing a numerical range in this specification, “X to Y” means X or more and Y or less (X≤ and ≤Y).

[0047] A curable resin composition according to one embodiment can provide a low refractive index layer having low haze, excellent adhesion to an inorganic layer, and excellent optical efficiency.

[0048] In one specific example, the low refractive index layer may have a haze of 2% or less, for example, 1.5% or less, or 0 to 2%. Even if the low refractive index layer includes particles within the above range, the efficiency of the display device can be significantly increased.

[0049] In one specific example, the low refractive index layer may have an adhesion strength of 5B or greater to the inorganic layer. Within the above range, the low refractive index layer is bonded with a high adhesion strength to a deposition layer such as the inorganic layer, thereby improving the reliability and process stability of the display device.

[0050] In one specific example, the low refractive index layer may have a refractive index of 1.35 or less, for example, 1.30 or less, or 1.0 to 1.35. By recycling light emitted from the display device within the above range, the light efficiency of the display device can be increased.

[0051] The low-refractive-index layer comprises a cured product of a composition comprising a silicone resin and surface-treated nanoparticles, as described below, and may have a plurality of amorphous pores formed within the cured product. As a result, the low-refractive-index layer can provide low haze, excellent adhesion to the inorganic layer, and excellent optical efficiency.

[0052] The above curable resin composition comprises a silicone resin and particles of the following chemical formula 1, and the particles comprise nanoparticles whose surface is modified with at least one of an alkoxysilane having an alkyl group and an alkoxysilane having a (meth)acryloyloxy group.

[0053] (A) Silicone resin

[0054] The above silicone resin may be a siloxane copolymer.

[0055] According to one embodiment, the siloxane copolymer is represented by the following chemical formula 1:

[0056] [Chemical Formula 1]

[0057] (R 1 R 2 SiO 2 / 2 ) D (R 3 SiO 3 / 2 ) T (SiO 4 / 2 ) Q

[0058] (In the above chemical formula 1,

[0059] 0.1 <Q<0.9, 0.05≤T≤0.6, 0≤D≤0.5, Q + T + D=1,

[0060] R 1 , R 2 , R 3are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, R'(C=O)-* (wherein, R' is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, or a substituted or unsubstituted C6 to C30 aryl group), a (meth)acrylate group, a (meth)acryloyloxy group, a C1 to C30 alkyl group having a (meth)acryloyloxy group, or these It is a combination.).

[0061] The siloxane copolymer represented by the above chemical formula 1 can help to lower the haze of a film formed from the above composition, increase adhesion to an inorganic layer, and improve light efficiency. A film formed from a composition containing a siloxane copolymer other than the above siloxane copolymer may not provide the above-described effects.

[0062] According to one embodiment, in the chemical formula 1, Q may be greater than 0.1 and less than 0.9. When Q is less than 0.9, the adhesion of the film to the inorganic layer may be high. When Q is greater than 0.1, it may be easy to provide excellent adhesion of the film to the inorganic layer, low haze, and excellent light efficiency. For example, Q may be 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.2≤Q≤0.6, 0.3≤Q≤0.6, 0.5≤Q≤0.6.

[0063] According to one embodiment, in the chemical formula 1, T may be 0.05 or more and 0.6 or less. When T is 0.6 or less, the adhesion of the film to the inorganic layer may be high. When T is 0.05 or more, it may be easy to provide excellent adhesion of the film to the inorganic layer, low haze, and excellent light efficiency. For example, T may be 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.1≤T≤0.5, 0.15≤T≤0.5.

[0064] According to one embodiment, in the chemical formula 1, D may be 0 or more and 0.5 or less. When D is 0.5 or less, the adhesion of the film to the inorganic layer may be high. When T is 0 or more, it may be easy to provide excellent adhesion of the film to the inorganic layer, low haze, and excellent light efficiency. For example, D may be 0, 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0≤D≤0.3, 0≤D≤0.25, 0.1≤D≤0.25.

[0065] In the above chemical formula 1, R 1 , R 2 can each independently be a substituted or unsubstituted C1 to C10 alkyl group, or a substituted or unsubstituted C2 to C10 alkenyl group, for example, a substituted or unsubstituted C1 to C5 alkyl group, or a substituted or unsubstituted C2 to C5 alkenyl group, for example, a methyl group or a vinyl group.

[0066] In the above chemical formula 1, R 3 It can be a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C2 to C10 alkenyl group, for example, a substituted or unsubstituted C1 to C5 alkyl group, a substituted or unsubstituted C2 to C5 alkenyl group, for example, a propyl group substituted with a methyl group, an ethyl group, a propyl group, a vinyl group, or a (meth)acryloyloxy group.

[0067] In one specific example, the siloxane copolymer can be prepared by hydrolyzing and condensing a monomer mixture comprising at least one of tetramethoxysilane, tetraethoxysilane, and tetra(i-propoxy)silane; and at least one of methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyl triethoxysilane, methyltriiso-propoxysilane, ethyltriiso-propoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, (meth)acryloyloxypropyltrimethoxysilane, and (meth)acryloyloxypropyltriethoxysilane. The above monomer mixture may further include at least one of methyldimethoxysilane, methyldiethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyldi(i-propoxy)silane, methylethyldimethoxysilane, methylethyldiethoxysilane, methylethyldi(i-propoxy)silane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, methylpropyldi(i-propoxy)silane, vinylmethyldimethoxysilane, and vinylmethyldiethoxysilane.

[0068] The polystyrene-converted weight average molecular weight (Mw) of the above siloxane copolymer is 1,000 to 50,000 g / mol, for example, 2,000 to 50,000 g / mol, 3,000 to 50,000 g / mol, 5,000 to 50,000 g / mol, 7,000 to 50,000 g / mol, 9,000 to 50,000 g / mol, 10,000 to 50,000 g / mol, 15,000 to 50,000 g / mol, 20,000 to 50,000 g / mol, 25,000 to 50,000 g / mol, 1,000 to 45,000 g / mol, 1,000 to 40,000 g / mol, 1,000 to 35,000 g / mol, 1,000 to 30,000 g / mol, 1,000 to 25,000 g / mol, but is not limited thereto.

[0069] The above silicone resin may be included in the curable resin composition in an amount of 5 to 50 wt%, for example, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50 wt%, 10 to 40 wt%, based on solid content. In the above range, there may be effects of improving optical properties and increasing mechanical properties.

[0070] In this specification, the term ‘solid content basis’ refers to the remaining components excluding the solvent when the curable resin composition includes the solvent described below.

[0071] particle

[0072] The above particles include nanoparticles whose surface is modified with at least one of an alkoxysilane having an alkyl group and an alkoxysilane having a (meth)acryloyloxy group. The surface-modified nanoparticles, when combined with the silicone resin, can easily provide a film having low haze and high adhesion to an inorganic layer.

[0073] According to one embodiment, the nanoparticles surface-modified with at least one of the alkoxysilane having an alkyl group and the alkoxysilane having a (meth)acryloyloxy group may be included in an amount of at least 90 wt%, for example, 95 wt% to 100 wt%, or 100 wt%, of the particles. In the above range, it may be easy to provide the effect of the above-described film.

[0074] According to one embodiment, the total amount of at least one of the alkoxysilane having an alkyl group and the alkoxysilane having a (meth)acryloyloxy group among the surface modifying materials of the nanoparticles may be 90 mol% or more, for example, 95 mol% to 100 mol%.

[0075] The alkoxysilane having the above alkyl group may include at least one of monoalkoxysilane, dialkoxysilane, and trialkoxysilane having an alkyl group. For example, the alkoxysilane having the alkyl group may include at least one of methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyltriethoxysilane, methyltriiso-propoxysilane, ethyltriiso-propoxysilane, methyldimethoxysilane, methyldiethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyldi(i-propoxy)silane, methylethyldimethoxysilane, methylethyldiethoxysilane, methylethyldi(i-propoxy)silane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, and methylpropyldi(i-propoxy)silane.

[0076] The alkoxysilane having the (meth)acryloyloxy group may include at least one of monoalkoxysilane, dialkoxysilane, and trialkoxysilane having a (meth)acryloyl group or an alkyl group substituted with a (meth)acryloyl group. For example, the alkoxysilane having the (meth)acryloyl group may include at least one of (meth)acryloyloxypropyltrimethoxysilane and (meth)acryloyloxypropyltriethoxysilane.

[0077] The above nanoparticles may have an average particle diameter D50 of 10 to 150 nm, for example, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150 nm, 40 to 100 nm, 40 to 50 nm, 70 to 100 nm. In the above range, they may be included in the low refractive index layer. Here, the average particle diameter D50 may mean a particle diameter meaning the diameter of particles having a cumulative volume of 50% by volume in a particle size distribution.

[0078] The above nanoparticles are solid nanoparticles without a hollow core, and may be metal oxide fine particles, and may include, for example, TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, aluminosilicate, or a combination thereof. Preferably, the nanoparticles may be silica due to the ease of surface modification.

[0079] The above nanoparticles are present in an amount of 20 to 80 wt% based on solid content in the curable resin composition, for example, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, It can be included in 74, 75, 76, 77, 78, 79, 80 wt%, 30 to 60 wt%.

[0080] In addition to the nanoparticles, the particles may further include hollow particles.

[0081] The hollow particles can further lower the refractive index of a film formed from the composition. The hollow particles may include hollow particles that are not surface-modified or have been surface-modified. When the hollow particles are surface-modified, the hollow particles may be surface-modified with at least one of the alkoxysilanes described above and the alkoxysilane having a (meth)acryloyloxy group.

[0082] The above hollow particles may have an average particle diameter D50 of 10 to 150 nm, for example, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150 nm, 40 to 100 nm, 40 to 50 nm, 70 to 100 nm. In the above range, the low refractive index layer may be included.

[0083] The hollow particles may be metal oxide fine particles, and may include TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, aluminosilicate, or a combination thereof. Preferably, the hollow particles may be hollow silica due to the ease of surface modification.

[0084] The hollow particles are present in an amount of 20 to 80 wt% based on solid content in the curable resin composition, for example, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, It can be included in 74, 75, 76, 77, 78, 79, 80 wt%, 30 to 60 wt%.

[0085] The particles are present in an amount of 20 to 80 wt% based on solid content in the curable resin composition, for example, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, It can be included in 74, 75, 76, 77, 78, 79, 80 wt%, 30 to 60 wt%.

[0086] The above curable resin composition may further include an organic polymer having a boiling point of 250°C or lower.

[0087] Organic polymers with a boiling point of 250℃ or lower

[0088] The organic polymer having a boiling point of 250°C or lower evaporates from the resin being cured by heating the composition as the temperature rises to 100°C to 250°C. Accordingly, pores are formed in the resin where the organic polymer was present, thereby providing a lower refractive index than a cured film that does not include such nanopores. In particular, the organic polymer can form amorphous pores within the cured film.

[0089] For example, the organic polymer may have a boiling point of 100°C to 250°C.

[0090] The organic polymer having a boiling point of 250°C or lower may include a homopolymer or copolymer of an aliphatic polyester such as a polyalkylene oxide, a polyarylene oxide, a glycol, a polycaprolactone, a polydioxanone, or a polypropylene carbonate, or a combination thereof.

[0091] Examples of the glycol-based homopolymer or copolymer include polyethylene glycol, polypropylene glycol, etc., and examples of the polyalkylene oxide or polyarylene oxide-based homopolymer or copolymer include polyethylene oxide, polypropylene oxide, polyphenylene oxide, etc., but are not limited thereto.

[0092] The number average molecular weight (Mn) of the organic polymer having a boiling point of 250°C or lower is 100 g / mol to 10,000 g / mol, for example, 100 g / mol to 8,000 g / mol, 200 g / mol to 7,000 g / mol, 300 g / mol to 6,000 g / mol, 400 g / mol to 5,500 g / mol, 400 g / mol to 5,000 g / mol, 500 g / mol to 5,000 g / mol, 500 g / mol to 4,500 g / mol, 600 g / mol to 5,000 g / mol, 600 g / mol to 4,500 g / mol, 700 g / mol to 5,000 g / mol, 700 g / mol to 4,500 g / mol, 800 g / mol to 5,000 g / mol, 800 g / mol to 4,500 g / mol, 900 g / mol to 5,000 g / mol, 900 g / mol to 4,500 g / mol, 1,000 g / mol to 5,000 g / mol, 1,000 g / mol to 4,500 g / mol, 1,000 g / mol to 4,000 g / mol, 1,000 g / mol to 3,500 g / mol, 1,000 g / mol to 3,000 g / mol, 1,000 g / mol to 2,500 g / mol, 1,000 g / mol to 2,000 g / mol, but is not limited thereto.

[0093] The organic polymer may be included in the curable resin composition in an amount of 10 to 60 wt% based on solid content, for example, 10, 15, 20, 25, 30, 35, 40, 45, 50, 66, 60 wt%, or 20 to 60 wt%, but is not limited thereto.

[0094] The above curable resin composition may further include one or more of a solvent and an additive.

[0095] solvent

[0096] The solvent may be any one solvent or a mixture of two or more solvents usable at a process temperature of 200°C or higher. For example, the solvent may be an alcohol-type solvent such as butanol, isopropanol, etc., a ketone-type solvent such as PMEA, DIBK, etc., and in addition to these, any solvent known in the art that may be used at a process temperature or higher may be used as a mixture of one or two or more solvents.

[0097] When two or more of the above solvents are mixed and used, it may be a mixed form of propylene glycol monomethyl ether acetate (PGMEA), gamma butyrolactone (GBL), and other types of solvents that can be used at a process temperature of 100°C to 230°C.

[0098] According to one embodiment, the solvent may be included as a residual amount in the composition.

[0099] In one embodiment, the solvent may be included in an amount of 100 to 2,000 parts by weight, for example, 100 to 1,000 parts by weight, for example, 100 to 500 parts by weight, for example, 100 to 400 parts by weight, for example, 100 to 300 parts by weight, for example, 100 to 200 parts by weight, based on 100 parts by weight of the silicone polymer, but is not necessarily limited thereto.

[0100] The above curable resin composition may further include various additives known in the art. Such additives may further include, but are not limited to, leveling agents and surfactants, such as fluorinated surfactants, for improving coating properties and preventing defects during coating of the composition.

[0101] The above additive may be included in the curable resin composition in an amount of 0.5 to 3 wt%, for example, 0.7 to 1.2 wt%, based on solid content.

[0102] Another embodiment provides a cured film manufactured by curing the curable resin composition.

[0103] The above cured film includes nanoparticles and a silicone resin whose surface is modified with at least one of an alkoxysilane having an alkyl group and an alkoxysilane having a (meth)acryloyl group, and includes amorphous pores.

[0104] The surface-modified nanoparticles and silicone resin described above are the same as those described above. Therefore, a detailed description is omitted.

[0105] The cured film comprises amorphous pores. Here, "amorphous" means that the diameters of the pores in the cured film are not uniform and / or the shapes of the pores are not uniform. The amorphous pores may be derived from the organic polymer having a boiling point of 250°C or lower, as described above.

[0106] According to one embodiment, the cured film may have a refractive index of 1.35 or less, for example, 1.30 or less, for example, 1.28 or less, for example, 1.25 or less, for example, 1.20 or less, for example, 1.18 or less, for example, 1.15 or less, for a wavelength of 500 nm to 550 nm, and may have a light transmittance of 90% or more, for example, 92% or more, for example, 95% or more, for a wavelength of 400 nm.

[0107] In order to manufacture a cured film having a low refractive index in the above range, curing at a high temperature of 350°C or higher, or at least 300°C or higher, a method requiring expensive equipment such as chemical vapor deposition (CVD) or expensive hollow silica had to be used. However, even in these cases, it was difficult to reduce the refractive index to the level of 1.2.

[0108] In contrast, the curable resin composition according to one embodiment can be easily manufactured to have the refractive index and transmittance as described above by curing at a low curing temperature, for example, in the range of about 180°C to about 240°C, for a time period of about 10 minutes to about 1 hour, and having a film thickness of about 1 μm to about 10 μm, for example, about 2 μm to about 7 μm, for example, about 2 μm to about 5 μm.

[0109] As described above, the curable resin composition according to one embodiment has a low refractive index and high transmittance as described above, and further, can produce a cured film having excellent heat resistance and adhesiveness.

[0110] For example, a display device including the cured film can be operated for more than 1,000 hours at about 85°C and can maintain a transmittance of more than about 90% at a temperature of 250°C. On the other hand, a cured film manufactured from a composition that does not include hollow particles including a siloxane polymer on the surface among the components of the composition could not secure an operating time of 1,000 hours at about 85°C and also exhibited a transmittance of less than about 85% at a temperature of 250°C, thereby confirming the advantageous effects of a cured film manufactured from a composition according to one embodiment.

[0111] In addition, a cured film manufactured from a curable resin composition according to one embodiment has a very high adhesive strength with an adhesion index of about 5B measured by a cross-cut taping test based on the ASTM D3359 international standard test method, and the adhesion measurement result by a stud pull test as described in the examples described below also showed a high adhesive strength of 30 to 50 MPa. On the other hand, a cured film manufactured from a composition not including hollow particles including a siloxane polymer on the surface had a low adhesive strength index of 0 or 1B or less by the cross-cut taping test, and a low stud pull test value of 5 to 10 MPa.

[0112] Therefore, the cured film according to one embodiment can be used in various fields such as a material for various electronic materials, for example, a low-refractive layer of a color conversion panel, an anti-reflection film on the outermost surface of a display or solar cell, a low-reflection layer of a lens on the outside of a light sensor, and a coating material for an optical member.

[0113] Accordingly, in one embodiment of the present invention, a color conversion panel including the cured film is provided. For example, the color conversion panel,

[0114] substrate;

[0115] A low refractive index layer disposed on one surface of the above substrate;

[0116] A color conversion layer including a color conversion member disposed on the low-refractive-index layer or between the low-refractive-index layer and the substrate; and

[0117] Including a planarizing layer covering the low refractive index layer and the color conversion layer,

[0118] The above low refractive index layer can be manufactured from a curable resin composition according to one embodiment.

[0119] Here, the curable resin composition is the same as described above, so detailed description thereof is omitted.

[0120] In one embodiment, the low-refractive-index layer of the color conversion panel can be manufactured by coating and curing a curable resin composition according to one embodiment on the substrate or the color conversion layer. Specifically, the curable resin composition can be coated on the substrate or the color conversion layer formed on the substrate, and then dried and cured at a temperature of about 150°C to 250°C, for example, 170°C to 250°C, for example, 180°C to 250°C, for example, 180°C to 240°C, for example, 190°C to 240°C, for example, 200°C to 240°C, for example, 210°C to 240°C, for example, 220°C to 240°C, for a time period of about 10 minutes to about 1 hour.

[0121] The method for coating the composition on the substrate or the color conversion layer may use any of various methods known in the art, including, but not limited to, spin coating, slit and spin coating, slit coating, roll coating, or die coating. In one embodiment, the composition may be spin coated on the substrate or the color conversion layer.

[0122] The low-refractive-index layer manufactured as described above may have a thickness of about 100 nm to 10 μm. For example, the cured film may have a thickness of about 1 μm to about 10 μm, for example, about 1 μm to about 8 μm, for example, about 1 μm to about 7 μm, for example, about 1 μm to about 5 μm.

[0123] Hereinafter, a color conversion panel according to one embodiment will be described in detail with reference to the drawings.

[0124] FIG. 1 is a plan view schematically illustrating a color conversion panel (100) according to one embodiment, and FIGS. 2 and 3 are cross-sectional views schematically illustrating a cross-section cut along line II-II of FIG. 1, respectively.

[0125] Referring to FIGS. 2 and 3 together, a color conversion panel (100) according to one embodiment includes a substrate (110), a low-refractive-index layer (120), a color conversion layer (130), and a planarization layer (140). The color conversion layer (130) may include color conversion layers that emit light of two or more different wavelengths, such as a first color conversion layer (132) that emits light of a first wavelength and a second color conversion layer (134) that emits light of a second wavelength. For example, the first color conversion layer (132) may emit red (R) light, and the second color conversion layer (134) may emit green (G) light, but is not limited thereto. In addition, the color conversion panel (100) may further include a third region (C) that emits blue (B) light or white light.

[0126] The substrate (110) is made of a transparent and electrically insulating material, and may further include a protective layer (112) at a position corresponding to the region where the first color conversion layer (132) and the second color conversion layer (134) are positioned. The protective layer (112) is formed on one surface of the substrate (110), so that when the color conversion layer (130) is formed on the substrate (110) later, patterning of the color conversion layer is smoothly performed, and protects the color conversion member within the color conversion layer.

[0127] The low-refractive-index layer (120) may cover a portion of the substrate (110) and the protective layer (112) on one side of the substrate (110), for example, a surface of the substrate (110) on which the protective layer (112) is formed, or, as shown in FIG. 3, the color conversion layer (130) may be first laminated on the protective layer (112), and then laminated on the color conversion layer (130), thereby covering all of the color conversion layer (130), a portion of the substrate (110), and a portion of the protective layer (112). That is, FIGS. 2 and 3 differ only in that the low-refractive-index layer (120) is positioned below the color conversion layer (130) (in the case of FIG. 2) or the low-refractive-index layer (120) is positioned above the color conversion layer (130) (in the case of FIG. 3), and all other components are the same.

[0128] According to one embodiment, the low-refractive layer (120) has a relatively low refractive index of 1.35 or less, for example, 1.32 or less, for example, 1.31 or less, for example, 1.30 or less, for example, 1.29 or less, for example, 1.28 or less, for example, 1.27 or less, for example, 1.26 or less, for example, 1.25 or less, for example, 1.24 or less, for example, 1.23 or less, for example, 1.22 or less, for example, 1.21 or less, for example, 1.20 or less, for example, 1.19 or less, for example, 1.18 or less, for example, 1.17 or less, for example, 1.16 or less, for example, 1.15 or less, for a wavelength of 500 nm to 550 nm. When the low-refractive-index layer (120) is formed above or below, or both above and below, the color conversion layer (130), it is possible to prevent light emitted from the color conversion layer (130) from being reflected toward the substrate (110). That is, when light passes through the low-refractive-index layer (120), it is reflected or refracted due to the difference in refractive index and moves back to the color conversion layer (130), thereby having the effect of reusing the lost light. Accordingly, the luminous efficiency of the color conversion panel (100) according to one embodiment in which the low-refractive-index layer (120) is formed above, below, or on both sides of the color conversion layer (130) can be further improved. The refractive index mentioned herein refers to the absolute refractive index representing the ratio of the speed of light in a vacuum and a medium.

[0129] In addition, the low-refractive-index layer may have an average value of light transmittance for a wavelength of 400 nm to 800 nm of 90% or more, for example, 91% or more, for example, 92% or more, for example, 93% or more, for example, 94% or more, for example, 95% or more, for example, 96% or more, for example, 97% or more, for example, 98% or more, for example, 99% or more, but is not limited thereto. When the average value of light transmittance for a wavelength of 400 nm to 800 nm of the low-refractive-index layer satisfies the above range, the optical properties of the low-refractive-index layer can be further improved.

[0130] In addition, the low-refractive-index layer may have an average reflectance (SCE value) of 10% or less, for example, 7% or less, for example, 5% or less, for example, 3% or less, over the entire wavelength range of 400 nm to 800 nm corresponding to the visible light range. Therefore, the color conversion panel (100) according to one embodiment may have high light transmittance even in a low wavelength range, and may further improve optical characteristics by maintaining low reflectance over the entire wavelength range corresponding to visible light.

[0131] The first color conversion layer (132) and the second color conversion layer (134) each include a first color conversion member (133) that emits light of a first wavelength and a second color conversion member (135) that emits light of a second wavelength, and each of the first color conversion member (133) and the second color conversion member (135) may include quantum dots that convert the wavelength of incident light into light of a different wavelength. These color conversion members may be formed by applying a composition for forming a color conversion layer including quantum dots onto the substrate or the low-refractive-index layer (120) formed on the substrate. The composition for forming the color conversion layer may include quantum dots, a binder resin, a photopolymerizable monomer, a photopolymerization initiator, a solvent, and other additives.

[0132] In one embodiment, the color conversion layer (130) is formed by coating a composition for forming a color conversion layer including a color conversion member (133, 135) including quantum dots on a substrate (110) or a low-refractive-index layer (120) formed on the substrate (110) and then performing a patterning process. The patterning process may be carried out through processes such as, for example, a step of applying the composition for forming the color conversion layer onto a substrate (110) or a low-refractive-index layer (120) by a spin or slit coating method, a roll coating method, a screen printing method, an applicator method, etc., and drying it to form a film, an exposure step of forming a pattern having a shape corresponding to the first color conversion layer (132) and the second color conversion layer (134) using a mask, a development step of removing unnecessary parts, and a post-treatment step of curing by reheating or irradiating with active rays, etc., in order to obtain a pattern having excellent heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc., but is not limited thereto.

[0133] The first and second color conversion layers (132, 134) may further include a light scattering body (not shown) in addition to the color conversion member (133, 135) including quantum dots. The light scattering body may be dispersed within the color conversion layer (130) together with the quantum dots. The light scattering body may induce incident light to be incident on the quantum dots, or may induce a radiation direction so that the radiation light emitted from the quantum dots can be emitted outside the color conversion layer (130). Through this, the decrease in the light efficiency of the color conversion layer (130) can be minimized. The light transmitting member (136) may also include a light scattering body.

[0134] A planarization layer (140) is formed on the low-refractive-index layer (120) and the color conversion layer (130). The planarization layer (140) covers and protects the low-refractive-index layer (120) and the color conversion layer (130), and makes the surface of the color conversion panel (100) planar. The planarization layer (140) may be made of a material that is transparent and electrically insulating so that light can be transmitted therethrough. At this time, the planarization layer (140) according to the present embodiment may be made of a polymer matrix that is the same as or different from that of the low-refractive-index layer (120). For example, the planarization layer (140) may be made of a low-refractive-index material including a carbosilane-siloxane copolymer like the low-refractive-index layer (120), thereby further improving the luminous efficiency of the color conversion panel (100). In addition, by minimizing cases where light incident on the low refractive index layer (120) is reflected or scattered when incident on the flattening layer (140), it is possible to provide a color conversion panel (100) with improved light efficiency by minimizing optical loss at the interface.

[0135] Meanwhile, the color conversion layer (130) may further include a transparent member (136) arranged to correspond to the third region (C). The transparent member (136) may emit light received from a light source as is without a separate color conversion. To this end, for example, the transparent member (136) may be formed to have the same height as the color conversion layer (130), or, as shown in FIGS. 2 and 3, may exist as an empty space that is not filled with anything to a certain extent up to the height where the color conversion layers (132, 134) and the planarization layer (140) formed thereon exist. However, the present invention is not limited thereto, and the transparent member (136) may further include quantum dots to emit light converted to a specific wavelength, like the first color conversion layer (132) and the second color conversion layer (134), and may further include the light scattering material described above.

[0136] Fig. 4 is a cross-sectional view according to a variation of Figs. 2 and 3. Fig. 4 is a cross-sectional view showing an example in which the low-refractive-index layer (120) is formed on both the upper and lower portions of the color conversion layer (130). Except for the fact that the low-refractive-index layer (120) is formed on both the upper and lower portions of the color conversion layer (130), the remaining components are all the same as those described in Figs. 2 and 3, and therefore, a detailed description thereof will be omitted. When the low-refractive-index layer (120) is present on both the upper and lower portions of the color conversion layer (130) as shown in Fig. 4, the luminous efficiency of the color conversion panel (100) can be further improved.

[0137] Fig. 5 is a cross-sectional view according to a variation of Fig. 2. Referring to Fig. 5, a color conversion panel (100) according to a variation may further include a first capping layer (150) and a second capping layer (160). Fig. 5 illustrates a variation that includes both the first capping layer (150) and the second capping layer (160), but either one of them may be omitted.

[0138] The first capping layer (150) is formed on the planarization layer (140) and covers the planarization layer (140). Therefore, it can be formed after the step of forming the planarization layer (140). The first capping layer (150) can be formed over the entire surface of the substrate (110).

[0139] The second capping layer (160) is formed between the low-refractive-index layer (120) and the color conversion layer (130), and like the first capping layer (150), can be formed over the entire surface of the substrate (110). Therefore, the second capping layer (160) can be formed between the low-refractive-index layer (120) forming step and the color conversion layer (130) forming step.

[0140] The first capping layer (150) and the second capping layer (160) may also be made of a material having a low refractive index, similar to the low refractive index layer (120), and for example, SiN. xIt may include a material such as . The first capping layer (150) forming an interface with the planarization layer (140), and the second capping layer (160) positioned between the low-refractive-index layer (120) and the planarization layer (140) or between the low-refractive-index layer (120) and the color conversion layer (130) to form an interface therewith are also made of a material having a low refractive index, thereby minimizing cases where light incident on the first capping layer (150) and the second capping layer (160) is reflected or scattered. By minimizing the optical loss at this interface, a color conversion panel (100) with improved light efficiency can be provided.

[0141] In the case of a color conversion panel (100) including a first capping layer (150) and a second capping layer (160), a luminous efficiency increase effect of 150% or more can be exhibited compared to a color conversion panel (100) that does not include a low-refractive-index layer (120), a first capping layer (150), and a second capping layer (160) at all.

[0142] Above, a color conversion panel (100) according to one embodiment of the present invention and a method for manufacturing the same have been described. According to this, a color conversion panel (100) including quantum dots or the like can be provided in which luminous efficiency by quantum dots is improved.

[0143] Another embodiment of the present invention provides a display device including a color conversion panel according to the above embodiment.

[0144] The above display device may be a display device using quantum dots, OLEDs, mini LEDs, micro LEDs, nanorod LEDs, etc., or a flexible display device, but is not limited thereto.

[0145]

[0146] Hereinafter, the structure and operation of the present invention will be described in more detail through preferred embodiments of the present invention. However, these are presented as preferred examples of the present invention and should not be construed as limiting the present invention in any way.

[0147]

[0148] Manufacturing Example 1: Manufacturing of silicone resin

[0149] In a 500 ml three-necked flask, add 0.513 g of dimethyldimethoxysilane (DMTMS), 3.180 g of 3-(methacryloyloxy)propyltrimethoxysilane (MAPTMAS), 5.335 g of tetraethoxy silane (TEOS), and 10.4 g of PGMEA. Then, while stirring at room temperature, a mixed solution of 0.341 g of a 1 M aqueous hydrochloric acid solution and 5.19 g of water is added over 10 minutes. The mixture is stirred at room temperature for 1 hour. Afterwards, the flask is immersed in an oil bath at 60°C and stirred for 250 minutes. After evaporating the reaction by-products, methanol, ethanol, aqueous hydrochloric acid, and water, for 180 minutes using a vacuum pump and Dean stark, and an appropriate amount of PGMEA is added to obtain a siloxane copolymer-containing solution having an adjusted solid content. The siloxane copolymer has 10 mol% of units derived from DMTMS, 30 mol% of units derived from MAPTMS, and 60 mol% of units derived from TEOS.

[0150]

[0151] Manufacturing Examples 2 to 12: Manufacturing of silicone resin

[0152] In Manufacturing Example 1, the type and / or content of each monomer was changed to produce a siloxane copolymer as shown in Table 1 below. In Table 1 below, '-' means that the content of the corresponding component is 0.

[0153]

[0154] Manufacturing Example 13: Manufacturing of surface-modified nano silica

[0155] To 10 g of a 20 wt% (ethanol) dispersion of unmodified nano-silica, add 2.0 g of 3-(methacryloyloxy)propyltrimethoxysilane (MAPTMAS) and 0.01 g of n-propylamine and react at 60°C for 1 hour. Slowly add 1 M HCl aqueous solution to neutralize. Then, the solvent is replaced with ethyl acetate (EA) and evaporated to remove the produced alcohol. Afterwards, water is added and the layers are separated to remove the produced salt. Afterwards, PGMEA is added and evaporated again to remove EA to prepare a solution in which the surface-modified nano-silica is dispersed in PGMEA. The prepared nano-silica is surface-modified with 3-(methacryloyloxy)propyltrimethoxysilane and has an average particle size D50 of 40 to 50 nm.

[0156]

[0157] Manufacturing Example 14: Manufacturing of surface-modified nano silica

[0158] Nanosilica surface-modified with 3-(methacryloyloxy)propyltrimethoxysilane was manufactured by referring to the method in Manufacturing Example 13. The manufactured nanosilica has an average particle diameter D50 of 70 to 100 nm.

[0159]

[0160] Manufacturing Example 15: Manufacturing of surface-modified nano silica

[0161] Nanosilica modified with a surface having an alkyl group (methyl group) was manufactured by referring to the method in Manufacturing Example 13. The manufactured nanosilica has an average particle diameter D50 of 40 to 50 nm.

[0162]

[0163] Manufacturing Example 16: Non-surface-modified nano silica

[0164] Non-surface-modified nanosilica (average particle diameter D50 of 40 to 50 nm) was used.

[0165]

[0166] Preparation of curable resin composition

[0167] (1) Silicone resin: Silicone resin of Manufacturing Examples 1 to 12

[0168] (2) Particles: Nano silica of Manufacturing Examples 13 to 16

[0169] (3) Organic polymers with a boiling point of 200℃ or lower: (C) Polypropylene glycol (number average molecular weight 4000g / mol)

[0170] (4) Leveling agent: Surfactant (F-552, fluorine-based, DIC)

[0171] (5) Solvent: Propylene glycol monomethyl ether acetate

[0172]

[0173] Example 1

[0174] Based on the solid content, 24 parts by weight of the silicone resin of Manufacturing Example 1, 45 parts by weight of the surface-modified nano silica of Manufacturing Example 13, 30 parts by weight of polypropylene glycol, and 1 part by weight of a leveling agent were mixed in a total of 100 parts by weight, and propylene glycol methyl ether was mixed as a solvent to prepare a 10 wt% solid content solution, stirred for 30 minutes, and then filtered through a 0.45 μm polypropylene (PP) material Millipore filter, thereby preparing a curable resin composition according to Example 1.

[0175]

[0176] Examples 2 to 11 and Comparative Examples 1 to 4

[0177] A curable resin composition was prepared in the same manner as in Example 1, except that the silicone resin and particles were changed as shown in Table 2 below.

[0178]

[0179] The properties shown in Table 2 below were evaluated using the manufactured curable resin composition. The manufacturing of the cured film was performed as follows.

[0180] Manufacturing of cured film:

[0181] The compositions prepared in the examples and comparative examples were spin-coated on a substrate for evaluating quantum dot efficiency using a spin coater (Mikasa, Opticoat MS-A150) at 200 rpm for 10 seconds, and then pre-baked on a hot plate at 100°C for 120 seconds to form a film. Thereafter, the film was cured and dried at a temperature of 230°C for 20 minutes to obtain a cured film having a thickness of 2.0 μm, and the thickness of the cured film was measured using Alpha-step (Surface profiler KLA, Tencor).

[0182] (1) Refractive index

[0183] The refractive index at a wavelength of 550 nm of the cured film obtained with the above composition was measured using a spectroscopic ellipsometer (M-2000D, JAWoollam Co.). If the refractive index was greater than 1.30 and less than or equal to 1.35, it was evaluated as ○, if it was less than or equal to 1.30, it was evaluated as ◎, and if it was greater than 1.35, it was evaluated as ⅹ.

[0184] (2) Adhesiveness

[0185] The above composition is spin-coated on a silicon wafer having a diameter of 6 inches using a spin coater (Mikasa, Opticoat MS-A100) at 200 rpm for 10 minutes, and then pre-baked at 100°C for 2 minutes using a hot plate to form a film. Thereafter, curing and drying are performed at a temperature of 230°C for 20 minutes to obtain a cured film having a thickness of 2.0 μm. On the cured film, a SiOx upper film is formed using a chemical vapor deposition (PE-CVD) machine. Thereafter, this upper film is cross-cut to a depth of about 100 μm and a final cutting area of ​​about 15 mm X 15 mm in accordance with the ASTM D3359 international standard test method, and then a taping test is performed using a 4.5 N / m tape. According to the definition of evaluation value disclosed in the ASTM D3359 international standard test method, the ratio of the area torn off by the tape from the above-mentioned cutting area is expressed as an adhesion evaluation index as follows:

[0186] (Adhesion evaluation index)

[0187] 0B: 100% peeling (entire surface peeled)

[0188] 1B: 80% peeling

[0189] 2B: 60% peeling

[0190] 3B: 40% peeling

[0191] 4B: 20% peeling, 90

[0192] 5B: 0% peeling (no peeling)

[0193] (3) Haze

[0194] The curable resin compositions of the examples and comparative examples were spin-coated on a glass substrate using a spin coater MS-A100 (Mikasa product) at 200 rpm for 5 seconds, and then baked using a hot plate at 100°C for 2 minutes and then at 230°C for 20 minutes to obtain a cured coating film having a thickness of 4.0 μm. The degree of haze of the cured film was measured as a Haze value at a wavelength of 650 nm using a Hazemeter. If the haze was more than 1.5% and less than 2%, it was evaluated as ○, if it was less than 1.5%, it was evaluated as ◎, and if it was more than 2%, it was evaluated as ⅹ.

[0195] (4) Light efficiency (green efficiency)

[0196] The cured film obtained with the above composition was placed under a substrate for evaluating quantum dot efficiency, and the quantum dot efficiency was measured on the substrate for evaluating quantum dot efficiency using an Absolute PL Quantum yield spectrometer Quantaurus-QY (modoo technology). When the light efficiency of Example 1 is 100%, if the measured light efficiency is 90% or more but less than 110%, it is evaluated as ○, if it is 110% or more, it is evaluated as ◎, and if it is less than 90%, it is evaluated as ⅹ.

[0197] Monomer DMDMSDMMVSTMVSTMESTMPSMTMSMAPTMSTEOS Manufacturing Example 110-----3060 Manufacturing Example 210----30-60 Manufacturing Example 3-10---30-60 Manufacturing Example 4-25---15-60 Manufacturing Example 5--10--30-60 Manufacturing Example 6---10-30-60 Manufacturing Example 7----1030-60 Manufacturing Example 8-----50-50 Manufacturing Example 9-----252550 Manufacturing Example 1050------50 Manufacturing Example 11-----100-- Manufacturing Example 12-----10-90

[0198] *In Table 1 above,

[0199] DMDMS: Dimethyldimethoxysilane

[0200] DMMVS: Methylvinyldimethoxysilane

[0201] TMVS: Vinyltrimethoxysilane

[0202] TMES: Ethyltrimethoxysilane

[0203] TMPS: Propyltrimethoxysilane

[0204] MTMS: Methyltrimethoxysilane

[0205] MAPTMS: 3-(methacryloyloxy)propyltrimethoxysilane

[0206] TEOS: Tetraethoxysilane

[0207] Silicone resin particle refractive index haze adhesion light efficiency Example 1 Manufacturing Example 1 Manufacturing Example 13○○5B○ Example 2 Manufacturing Example 1 Manufacturing Example 14○○5B○ Example 3 Manufacturing Example 1 Manufacturing Example 15◎○5B◎ Example 4 Manufacturing Example 2 Manufacturing Example 15◎◎5B◎ Example 5 Manufacturing Example 3 Manufacturing Example 15◎◎5B◎ Example 6 Manufacturing Example 4 Manufacturing Example 15◎◎5B◎ Example 7 Manufacturing Example 5 Manufacturing Example 15◎◎5B◎ Example 8 Manufacturing Example 6 Manufacturing Example 15◎◎5B◎ Example 9 Manufacturing Example 7 Manufacturing Example 15◎◎5B◎ Example 10 Manufacturing Example 8 Manufacturing Example 15○○5B○ Example 11 Manufacturing Example 9 Manufacturing Example 15○○5B○Comparative Example 1 Manufacturing Example 1 Manufacturing Example 16○ⅹ0BⅹComparative Example 2 Manufacturing Example 10 Manufacturing Example 15ⅹ○5BⅹComparative Example 3 Manufacturing Example 11 Manufacturing Example 15○ⅹ5BⅹComparative Example 4 Manufacturing Example 12 Manufacturing Example 15○ⅹ0Bⅹ

[0208] As shown in Table 2 above, the curable resin composition of the example provided a low refractive index layer with low haze, excellent adhesion to the inorganic layer, and superior optical efficiency. In addition, although not shown in Table 2 above, the cured film prepared with the curable resin composition of the example above had amorphous pores.

[0209]

[0210] Simple modifications or changes of the present invention can be easily implemented by a person having ordinary skill in the art, and all such modifications or changes can be considered to be included in the scope of the present invention.

Claims

1. Contains a silicone resin and particles of chemical formula 1, The above particles are a curable resin composition comprising nanoparticles whose surface is modified with at least one of an alkoxysilane having an alkyl group and an alkoxysilane having a (meth)acryloyloxy group: [Chemical Formula 1] (R 1 R 2 SiO 2 / 2 ) D (R 3 SiO 3 / 2 ) T (SiO 4 / 2 ) Q (In the above chemical formula 1, 0.1 <Q<0.9, 0.05≤T≤0.6, 0≤D≤0.5, Q +T+D=1, R 1 , R 2 , R 3 are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, R'(C=O)-* (wherein, R' is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, or a substituted or unsubstituted C6 to C30 aryl group), a (meth)acrylate group, a (meth)acryloyloxy group, or a combination thereof.

2. A curable resin composition according to claim 1, wherein the surface-modified nanoparticles comprise at least 90 wt% of the particles.

3. A curable resin composition in which, in the first paragraph, the total amount of at least one of the alkoxysilane having an alkyl group and the alkoxysilane having a (meth)acryloyloxy group among the surface modifying materials of the nanoparticles is 90 mol% or more.

4. A curable resin composition according to claim 1, wherein the nanoparticles have an average particle diameter D50 of 10 to 150 nm.

5. A curable resin composition according to claim 1, wherein the nanoparticles are included in an amount of 20 to 80 wt% based on solid content in the curable resin composition.

6. In the first paragraph, R in the chemical formula 1 1 , R 2 A curable resin composition, each independently representing a methyl group or a vinyl group.

7. In the first paragraph, R in the chemical formula 1 3 A curable resin composition, wherein the propyl group is substituted with a methyl group, an ethyl group, a propyl group, a vinyl group or a (meth)acryloyloxy group.

8. A curable resin composition according to claim 1, wherein the particles further comprise hollow particles.

9. In the 8th paragraph, the hollow particles are a curable resin composition that is not surface-modified or surface-modified.

10. A curable resin composition according to claim 1, wherein the composition further comprises an organic polymer having a boiling point of 250°C or lower.

11. In the 10th paragraph, the organic polymer is a curable resin composition comprising a polyalkylene oxide-based, polyarylene oxide-based, glycol-based, polycaprolactone-based, polydioxanone-based, polypropylene carbonate-based homopolymer or copolymer, or a combination thereof.

12. In the 10th paragraph, the composition is based on solid content 10 to 40 wt% of the above silicone resin; 30 to 60 wt% of the above particles, and A curable resin composition comprising 20 to 60 wt% of an organic polymer having a boiling point of 250°C or lower.

13. A curable resin composition according to claim 1, wherein the composition further comprises at least one of an additive and a solvent.

14. A cured film comprising nanoparticles and a silicone resin whose surface is modified with at least one of an alkoxysilane having an alkyl group and an alkoxysilane having a (meth)acryloyl group, and comprising amorphous pores.

15. In claim 14, the cured film comprises a cured product of the curable resin composition of any one of claims 1 to 14.

16. A display device including a cured film of Article 14.

Images