Flexible printed circuit assembly, rotating shaft assembly and foldable electronic device

Abstract

The embodiments of the present application belong to the technical field of electronic devices. Provided are a flexible printed circuit assembly, a rotating shaft assembly and a foldable electronic device. A flexible printed circuit passes through a through hole on a rotating shaft and is arranged on the rotating shaft; a first adhesion member is in adhesive connection with a second adhesion member in the through hole, and a snap-fit member is in snap-fit engagement with the rotating shaft, thereby achieving a high positioning strength for the flexible printed circuit, preventing problems such as detachment of the flexible printed circuit in scenarios such as drops, and also helping reduce the risk of rotating shaft breakage. The first adhesion member and the second adhesion member being located on the same side of the flexible printed circuit helps reduce the space of thickness occupied by the adhesion members in the rotating shaft while ensuring a high adhesive strength, improving the strength of the rotating shaft, and reducing the risk of rotating shaft breakage in scenarios such as drops. The snap-fit engagement between the snap-fit member and the rotating shaft is detachable, and the adhesive engagement between the first adhesion member and the second adhesion member can also be separated under the action of external force, enabling the flexible printed circuit to be conveniently detached from the rotating shaft, facilitating disassembly in scenarios such as repairs.

Description

Flexible circuit board assemblies, hinge assemblies and foldable electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202410486967.9, filed on April 22, 2024, entitled "Flexible Circuit Board Assembly, Spindle Assembly and Foldable Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic device technology, and in particular to a flexible circuit board assembly, a hinge assembly, and a foldable electronic device. Background Technology

[0003] With the gradual maturation of flexible screen technology, the way electronic devices are displayed has undergone tremendous changes. One of these changes is the emergence of foldable mobile phones, computers, and other electronic devices. Foldable electronic devices can flexibly switch modes according to different usage scenarios, while also having a high screen-to-body ratio and high clarity. For example, a foldable mobile phone can be folded to the size of a traditional mobile phone, making it easy to carry, while unfolding it can have the display size of a tablet. These features make foldable devices one of the most sought-after products.

[0004] A foldable electronic device includes at least two mid-frames, a hinge, and a flexible circuit board. The two mid-frames are located on either side of the hinge and are rotatably engaged by the hinge, allowing them to rotate relative to each other. This enables the electronic device to have folded, intermediate, and flattened states. The flexible printed circuit board (FPC), a structure that can be bent and achieve circuit connectivity, is typically mounted on the hinge and connected to electronic components within the two mid-frames to achieve conductivity. The FPC is usually fixed to the hinge using magnetic attraction. For example, a magnetic element is fixed inside a hole in the hinge, and another magnetic element is fixed to the flexible circuit board. The two magnetic elements are located on opposite sides of the flexible circuit board, and their attraction secures the flexible circuit board to the hinge.

[0005] The aforementioned flexible circuit board and hinge fixing scheme will greatly affect the strength of the hinge, increasing the risk of hinge breakage in scenarios such as drops. Summary of the Invention

[0006] This application provides a flexible circuit board assembly, a hinge assembly, and a foldable electronic device, which improves the strength of the hinge while achieving a high degree of fixation between the flexible circuit board and the hinge.

[0007] A first aspect of this application provides a flexible circuit board assembly for cooperating with the hinge of a foldable electronic device. The flexible circuit board assembly includes a flexible circuit board, a first adsorption member, and a first snap-fit ​​member. The flexible circuit board is inserted through a through-hole in the hinge, allowing both ends of the flexible circuit board to be located on opposite sides of the hinge. This enables electrical connection between electronic components within the two frames of the foldable electronic device. A portion of the flexible circuit board is located within the through-hole of the hinge. The insertion direction of the flexible circuit board intersects the thickness direction and the length direction of the hinge, respectively.

[0008] The first adsorption component is disposed on the flexible circuit board. The end of the first adsorption component facing away from the flexible circuit board along the thickness direction is used to adsorb and connect with the second adsorption component in the through hole. That is, when the flexible circuit board is inserted into the rotating shaft through the through hole, the first adsorption component can be placed in the through hole of the rotating shaft and adsorb and connect with the second adsorption component in the rotating shaft to achieve the limiting and fixing of the flexible circuit board. For example, it can realize the movement limitation of the flexible circuit board relative to the rotating shaft in the thickness direction, limit the displacement of the flexible circuit board in the thickness direction in daily use or drop scenarios, and realize the conversion and fixing of the flexible circuit board and the rotating shaft.

[0009] Furthermore, the first adsorption component is adsorbed and connected to the second adsorption component at the end facing away from the flexible circuit board. That is, the first and second adsorption components are located on the same side of the flexible circuit board, ensuring a high adsorption force between the first and second adsorption components. Under the condition of satisfying the limiting firmness, the thickness of the first and second adsorption components can be reduced, that is, the thickness space occupied in the shaft can be reduced, and the strength of the shaft can be improved. In this way, the risk of shaft breakage is reduced in scenarios such as drops and impacts, and the service life and user experience are improved.

[0010] The snap-fit ​​component is mounted on the flexible circuit board. It is inserted into the through-hole along the path of the flexible circuit board and engages with the rotating shaft. When the flexible circuit board passes through the through-hole onto the rotating shaft, the snap-fit ​​component inserts into the through-hole along the path of the flexible circuit board and engages with the rotating shaft, thus limiting and fixing the flexible circuit board. This allows for limiting the movement of the flexible circuit board relative to the rotating shaft in both the length and width directions (path of insertion), restricting displacement during daily use or in scenarios such as drops, further improving the fixing strength between the flexible circuit board and the rotating shaft, and enhancing the assembly stability and reliability of the flexible circuit board. It also reduces or avoids the movement or detachment of the flexible circuit board in scenarios such as drops or impacts, and reduces the risk of shaft breakage caused by impacts between the flexible circuit board, the first adsorption component, and the rotating shaft, further improving service life and user experience.

[0011] The snap-fit ​​component can also be detached from the pivot, and the first and second adsorption components can also be separated under a certain external force. For example, pulling the other end of the flexible circuit board in the opposite direction (such as opposite to the insertion direction) can separate the snap-fit ​​component from the pivot and the first and second adsorption components, thus enabling the flexible circuit board to be detached from the pivot. This significantly improves the ease of disassembly of the flexible circuit board and facilitates disassembly in scenarios such as rework.

[0012] In one possible implementation, the flexible circuit board includes a first surface and a second surface opposite to each other in the thickness direction, at least a portion of the snap-fit ​​member and a first adsorption member are located on the first surface and the second surface, respectively, and at least a portion of the snap-fit ​​member, a portion of the flexible circuit board and the first adsorption member are stacked sequentially in the thickness direction.

[0013] One end of the first adsorption member facing away from the second surface is used to abut against the second adsorption member. That is, when the flexible circuit board is fixedly assembled with the rotating shaft via the snap-fit ​​member, the first adsorption member, and the rotating shaft, the end of the first adsorption member facing away from the flexible circuit board abuts against and adsorbs the second adsorption member. At least a portion of the snap-fit ​​member, the end facing away from the first surface, is used to abut against the inner wall of the through hole opposite to the second adsorption member along the thickness direction. In other words, the second adsorption member, the first adsorption member, a portion of the flexible circuit board, and at least a portion of the snap-fit ​​member are stacked sequentially in the thickness direction. The second adsorption member can abut against and be fixed to one of the two inner walls opposite to each other along the thickness direction of the through hole, and at least a portion of the snap-fit ​​member abuts against the other. The stacked structure composed of the second adsorption member, the first adsorption member, the flexible circuit board, and at least a portion of the snap-fit ​​member can collectively fill the through hole in the thickness direction. There can be no gap between this stacked structure and the rotating shaft (or the two inner walls of the through hole along the thickness direction) in the thickness direction. In scenarios such as drops and impacts, the flexible circuit board assembly is less likely to collide or move with the rotating shaft, further improving the drop strength of the rotating shaft and significantly reducing the risk of shaft breakage.

[0014] In one possible implementation, the snap-fit ​​component includes a first main body and at least two limiting parts, with the first main body being attached and fixed to a first surface.

[0015] At least two of the limiting parts are located on opposite sides of the first main body along the through-cutting direction. The limiting parts protrude from the side of the first main body facing the first adsorption member. The limiting parts and the first main body form an accommodating space. The first adsorption member is located in the accommodating space. The accommodating space can play a positioning role in the assembly of the first adsorption member and the snap-fit ​​member, which is conducive to the accurate positioning of the first adsorption member and the snap-fit ​​member. It also facilitates the adsorption connection between the first adsorption member and the second adsorption member when the snap-fit ​​member is snapped with the rotating shaft.

[0016] The limiting portions located on opposite sides of the first main body along the insertion direction can also limit and fix the first adsorption member, restricting the displacement of the first adsorption member relative to the snap-fit ​​member in the insertion direction, improving the consistency of movement of the snap-fit ​​member and the first adsorption member in the insertion direction, and preventing damage to the flexible circuit board caused by excessive slippage of adhesive layers such as the first adhesive layer between the flexible circuit board and the snap-fit ​​member and the second adhesive layer between the flexible circuit board and the first adsorption member during the assembly or disassembly of the flexible circuit board assembly.

[0017] In one possible implementation, at least two limiting parts are respectively distributed on opposite ends of the first main body along the length direction, ensuring consistent positioning and limiting effect of the first adsorption member in the length direction, enhancing the positioning and limiting strength of the first adsorption member, and improving the positioning and limiting effect of the limiting parts on the first adsorption member.

[0018] Among them, there is a clearance gap between the limiting parts distributed on opposite ends of the snap-fit ​​component along the length direction. Part of the flexible circuit board is located in the clearance gap, which realizes the clearance of the flexible circuit board, so that the flexible circuit board can be fixed smoothly and flat between the first main body and the first adsorption component, which helps to reduce damage to the flexible circuit board.

[0019] In one possible implementation, the snap-fit ​​component further includes a first snap-fit ​​portion. The first snap-fit ​​portion is provided at each of the opposite ends of the first main body along its length direction. The first snap-fit ​​portion engages with a second snap-fit ​​portion within the through hole. This ensures that when the snap-fit ​​component is inserted into the through hole along its insertion direction, it can be positioned and fixed to the rotating shaft through the engagement of the first and second snap-fit ​​portions, thus restricting the movement of the snap-fit ​​component and the flexible circuit board relative to the rotating shaft within the plane encompassing the width and length directions.

[0020] In one possible implementation, a first snap-fit ​​protrusion is disposed on the side of the first main body facing the first adsorption member, and the first snap-fit ​​portion, the limiting portion, and the first main body together form an accommodating space. The first snap-fit ​​portions located at both ends of the first main body along its length can also position the first adsorption member, facilitating accurate positioning of the first adsorption member and the snap-fit ​​portion, and simplifying installation. The first snap-fit ​​portions can also limit and fix the first adsorption member, restricting displacement of the first adsorption member relative to the snap-fit ​​portion in the length direction, further enhancing the limiting strength between the snap-fit ​​portion and the first adsorption member, and reducing tensile damage to the flexible circuit board.

[0021] In one possible implementation, the first and second latching portions are engaged by an elastic protrusion and a groove. One of the first and second latching portions includes an elastic protrusion, and the other includes a groove that engages with the elastic protrusion. Taking an example where the first latching portion includes an elastic protrusion and the second latching portion includes a groove, when the flexible circuit board assembly is assembled with the rotating shaft while being pulled, the latching member moves along the through-hole with the flexible circuit board in the through-path direction. The elastic protrusion can be compressed by the inner wall of the through-hole, that is, the elastic protrusion is compressed in the direction toward the first main body. Continuing to pull the flexible circuit board to insert the latching member, the elastic protrusion moves to the groove position. The elastic protrusion will recover under the rebound action, that is, the elastic protrusion moves away from the main body, so that the elastic protrusion is accommodated and latched in the groove. This allows the latching member to be connected and assembled with the rotating shaft through the engagement of the elastic protrusion and the groove.

[0022] In scenarios such as disassembling flexible circuit boards, the flexible circuit board is pulled in the opposite direction, causing the snap-fit ​​to move in the opposite direction. The elastic protrusion can be compressed again, thus allowing it to be removed from the pivot. The structure is simple and easy to manufacture.

[0023] In one possible implementation, the first snap-fit ​​portion includes an elastic protrusion, and the second snap-fit ​​portion is a groove. This simplifies the design of the internal structure of the through hole of the shaft, reduces the difficulty of shaft design and molding, and also helps to ensure the strength of the shaft, making it easy to implement.

[0024] The first snap-fit ​​portion includes a connecting arm and a snap-fit ​​arm. The connecting arm is connected to the first main body. The snap-fit ​​arm has connecting arms on both sides along the through-path direction. The two ends of the snap-fit ​​arm are connected to the connecting arms respectively. The middle part of the snap-fit ​​arm protrudes away from the receiving space to form an elastic protrusion. By forming an elastic protrusion in part of the snap-fit ​​arm to achieve snap-fit ​​engagement with the groove on the rotating shaft, and by connecting both ends of the snap-fit ​​arm to the first main body through the connecting arms, the strength of the snap-fit ​​arm is improved. This, in turn, improves the firmness of the snap-fit ​​engagement between the elastic protrusion of the snap-fit ​​arm and the groove on the rotating shaft, and improves the reliability and stability of the snap-fit ​​engagement between the snap-fit ​​component and the rotating shaft. This helps to reduce the movement or detachment of the flexible circuit board in scenarios such as drops.

[0025] In one possible implementation, the first adsorption member has a first contact surface on one side along the penetration direction.

[0026] The snap-fit ​​component also includes a notch structure located on one side of the first main body along the through-hole direction. The first abutment surface is exposed through the notch structure, allowing the first abutment surface to be exposed through the notch structure in the through-hole direction. The notch structure is used to accommodate a first boss within a portion of the through-hole, and the first abutment surface is used to abut against the first boss, thereby limiting the displacement of the flexible circuit board along the through-hole direction.

[0027] When the flexible circuit board is pulled along the through-path direction, the contact between the first abutment surface and the first protrusion restricts further movement of the flexible circuit board assembly during assembly with the rotating shaft. This allows for precise positioning of the latching component and the first suction component on the rotating shaft, preventing damage caused by excessive pulling of the flexible circuit board. For example, during the pulling process, when the first protrusion abuts against the first abutment surface, the first latching part engages with the second latching part, and the first suction component connects with the second suction component, thus avoiding problems such as excessive pulling of the flexible circuit board or improper assembly.

[0028] In addition, by having the first contact surface of the first adsorption member abut against the first boss, the impact on the snap-fit ​​member during the assembly of the flexible circuit board assembly can be reduced. Even when the width (width along the penetration direction) of the first adhesive layer between the snap-fit ​​member and the flexible circuit board is narrow, the bonding strength between the snap-fit ​​member and the flexible circuit can still be guaranteed. A narrower first adhesive layer can facilitate the bending of the flexible circuit board.

[0029] In one possible implementation, there is a notch structure between the first snap-fit ​​portion and the limiting portion located on one side of the first main body portion along the through-feed direction, which facilitates molding. For example, when the limiting portion is formed on the first snap-fit ​​portion, the notch structure can be formed by maintaining a gap between the limiting portion and the first snap-fit ​​portion. The molding method is simple and easy to implement, and it is also conducive to reducing costs.

[0030] In one possible implementation, the limiting part located on one side of the first main body along the through-path direction forms a second abutting surface on the side facing away from the receiving space. The second abutting surface is used to abut and cooperate with the second boss in the through hole. The abutting of the second boss and the second abutting surface can also limit the flexible circuit board along the through-path direction, realize the precise positioning of the snap-fit ​​and the first adsorption part on the rotating shaft, and avoid damage caused by excessive pulling of the flexible circuit board.

[0031] The limiting part abuts against the second boss, eliminating the need for a notch structure, which reduces the structural design difficulty of the snap-fit ​​part and lowers design and processing costs.

[0032] In one possible implementation, a first adhesive layer is also included, which is located between the first body portion and the first surface, and the snap-fit ​​member and the flexible circuit board are fixed by the first adhesive layer.

[0033] The flexible circuit board also includes a second adhesive layer, which is located between the flexible circuit board and the first adsorption member. The first adsorption member and the flexible circuit board are fixed by the second adhesive layer.

[0034] The width of the first adhesive layer along the penetration direction is smaller than the width of the second adhesive layer along the penetration direction, making the width of the first adhesive layer narrower. The first adhesive layer exerts less constraint on the first surface in the width direction, reducing or avoiding the influence of the first adhesive layer on the bending of the flexible circuit board, and enabling the flexible circuit board to bend better.

[0035] In one possible implementation, the flexible circuit board includes a second main body and an extension. The extension is located on both sides of the second main body along its length, and the extension and part of the second main body are located within a receiving space. Positioning the extension within the receiving space can help position the snap-fit ​​component on the flexible circuit board, enabling precise positioning and assembly of the snap-fit ​​component on the flexible circuit board, thereby facilitating precise positioning of the snap-fit ​​component and the first adsorption component on the flexible circuit board.

[0036] In one possible implementation, the first main body has a first positioning hole at each end along the length direction, the extension has a second positioning hole at each end, and the first adsorption member has a third positioning hole at each end along the length direction. The center lines of the first positioning hole, the second positioning hole and the third positioning hole coincide in the thickness direction.

[0037] The first, second, and third positioning holes can be used to assist in positioning the first main body, the snap-fit ​​component, and the flexible circuit board during assembly, thereby further improving positioning accuracy. If the first suction component, part of the flexible circuit board, and the snap-fit ​​component are stacked sequentially, a positioning rod can be used to pass through the first, second, and third positioning holes sequentially along the thickness direction. The positioning rod can coincide with the center lines of the first, second, and third positioning holes, thus enabling precise positioning and assembly of the snap-fit ​​component, flexible circuit board, and first suction component.

[0038] In one possible implementation, the diameters of the first positioning hole and the third positioning hole are equal, and the diameter of the second positioning hole is larger than the diameters of the first positioning hole and the second positioning hole, respectively. This makes the diameter of the second positioning hole on the flexible circuit board relatively large, reducing or preventing the positioning rod from impacting or contacting the circuit structure on the flexible circuit board during assembly, such as when positioning is assisted by a positioning rod, thus ensuring the electrical connection performance of the flexible circuit board.

[0039] A second aspect of this application provides a rotating shaft assembly, which includes at least a rotating shaft and any of the above-mentioned flexible circuit board assemblies. The rotating shaft has a through hole and a second adsorption member is disposed inside the rotating shaft.

[0040] The flexible circuit board is inserted into the rotating shaft through a through-hole. A first suction member, facing away from the flexible circuit board along the thickness direction of the rotating shaft, is attached to a second suction member. A snap-fit ​​member is inserted into the through-hole along the insertion direction of the flexible circuit board and engages with the rotating shaft. This allows the flexible circuit board to achieve a limiting fit with the rotating shaft through the snap-fit ​​member and the first suction member, providing high assembly stability and reliability. It reduces or prevents the flexible circuit board from moving or detaching in scenarios such as drops, and also reduces the risk of the rotating shaft breaking due to impacts. Furthermore, the first and second suction members are located on the same side of the flexible circuit board, reducing the thickness and space occupied while meeting the suction strength requirements, thus enhancing the strength of the rotating shaft and further improving its drop resistance. The snap-fit ​​engagement of the snap-fit ​​member with the rotating shaft, and the suction engagement of the first and second suction members, allow for convenient disassembly of the flexible circuit board from the rotating shaft, facilitating disassembly in scenarios such as repair.

[0041] In one possible implementation, the second adsorption element is located on the inner wall of the through hole along its thickness direction. At least a portion of the second adsorption element, the first adsorption element, a portion of the flexible circuit board, and the snap-fit ​​element are stacked sequentially in the thickness direction, with at least a portion of the snap-fit ​​element abutting against the inner wall of the through hole opposite to the second adsorption element along its thickness direction. This arrangement eliminates gaps in the thickness direction between the stacked structure (comprising the second adsorption element, the first adsorption element, the flexible circuit board, and at least a portion of the snap-fit ​​element) and the rotating shaft, further enhancing the drop resistance of the rotating shaft.

[0042] In one possible implementation, two second engaging portions are respectively provided on the two inner sidewalls opposite each other along the length of the through hole. The second engaging portions engage with the first engaging portion of the engaging member through an elastic protrusion and a groove. For example, the second engaging portion may include a groove, and the first engaging portion may include an elastic protrusion. The groove of the second engaging portion engages with the elastic protrusion of the first engaging portion. The engaging engagement between the engaging member and the rotating shaft is achieved through the first and second engaging portions. The structure is simple and easy to implement.

[0043] In one possible implementation, a mounting groove is formed on the inner wall of the through hole, and the second adsorption component is disposed within the mounting groove. The mounting groove can improve the fixation strength of the second adsorption component on the rotating shaft, thereby improving the fixation and positioning strength between the flexible circuit board assembly and the rotating shaft.

[0044] In one possible implementation, a first protruding boss is present within the through-hole, located on one side of the through-hole along the insertion direction. The first boss partially extends into a notch structure on the snap-fit ​​component. The first boss abuts against a first contact surface on the first suction component, restricting displacement of the flexible circuit board along the insertion direction. During the assembly of the flexible circuit board assembly and the rotating shaft, the contact between the first boss and the first contact surface enables precise positioning of the snap-fit ​​component and the first suction component on the rotating shaft, preventing damage caused by excessive stretching of the flexible circuit board.

[0045] In one possible implementation, a second protruding boss is provided within the through hole. This second boss is located on one side of the through hole along the insertion direction. The second boss abuts against a second contact surface on the limiting portion of the snap-fit ​​component, thus limiting the flexible circuit board along the insertion direction and achieving precise positioning of the snap-fit ​​component and the first suction component on the rotating shaft, preventing damage caused by excessive pulling of the flexible circuit board. Furthermore, the abutment between the limiting portion and the second boss eliminates the need for a notch structure, reducing the structural design difficulty of the snap-fit ​​component and lowering design and manufacturing costs.

[0046] A third aspect of this application provides a foldable electronic device, including at least two mid-frames and any one of the aforementioned hinge assemblies, wherein the two mid-frames are respectively located on both sides of the hinge assembly, and the two mid-frames are rotatably engaged by the hinge assembly.

[0047] In one possible implementation, a flexible screen is also included, which is disposed on the hinge assembly and the mid-frame. The flexible screen is located at least on the outer surface of the mid-frame and the hinge assembly. When the electronic device is in a folded state, the outer surfaces of the two mid-frames are opposite to each other, and the outer surface of the hinge assembly and the outer surface of the mid-frame are located on the same side of the electronic device.

[0048] In one possible implementation, in the thickness direction, the flexible screen is located on the side of the second adsorption member facing away from the latching member; that is, the first surface of the flexible circuit board is closer to the inner surface of the hinge assembly, and the second surface is closer to the outer surface of the hinge assembly. When the electronic device is in a folded state, the portion of the first surface of the flexible circuit board located within the first frame and the portion located within the second frame are opposite to each other, while the portion of the second surface of the flexible circuit board located within the first frame and the portion located within the second frame are opposite to each other. The width of the first adhesive layer between the latching member and the first surface can be smaller than the width of the second adhesive layer between the first adsorption member and the second surface. The first adhesive layer exerts less constraint on the first surface in the width direction, reducing or avoiding the influence of the first adhesive layer on the bending of the flexible circuit board, thus enabling the flexible circuit board to bend better. Attached Figure Description

[0049] Figure 1 is a schematic diagram of a foldable electronic device in a folded state according to an embodiment of this application;

[0050] Figure 2 is a schematic diagram of the foldable electronic device shown in Figure 1 in an intermediate state;

[0051] Figure 3 is a schematic diagram of the foldable electronic device shown in Figure 1 in a flattened state.

[0052] Figure 4 is a schematic diagram of the disassembled structure of the foldable electronic device shown in Figure 1;

[0053] Figure 5 is a schematic diagram of the assembly of a flexible circuit board and a rotating shaft in an electronic device of the related technology;

[0054] Figure 6 is a schematic diagram of a partially disassembled structure of a foldable electronic device provided in an embodiment of this application;

[0055] Figure 7 is a schematic diagram of the disassembled structure of the shaft assembly in Figure 6;

[0056] Figure 8 is a schematic diagram of the process of assembling the flexible circuit board assembly and the rotating shaft in the rotating shaft assembly of Figure 7;

[0057] Figure 9 is a schematic diagram of the structure of the flexible circuit board and the rotating shaft assembly in Figure 7 after assembly;

[0058] Figure 10 is a schematic cross-sectional view of the shaft assembly along plane AA in Figure 9;

[0059] Figure 11 is a schematic cross-sectional view of the shaft assembly along the BB plane in Figure 9;

[0060] Figure 12 is a partial enlarged schematic diagram of the structure at the mating part of the first and second snap-fit ​​parts in Figure 11;

[0061] Figure 13 is a partial schematic diagram of a disassembled structure of the flexible circuit board assembly in Figure 7;

[0062] Figure 14 is a schematic cross-sectional view of the shaft in the shaft assembly shown in Figure 9;

[0063] Figure 15 is a front view of a partial cross-sectional structure of the electronic device in Figure 6;

[0064] Figure 16 is a magnified schematic diagram of a partial structure of the flexible circuit board assembly at the snap-fit ​​in Figure 7;

[0065] Figure 17 is a partial schematic diagram of another disassembled structure of the flexible circuit board assembly in Figure 7;

[0066] Figure 18 is a schematic diagram of the snap-fit ​​component in Figure 16;

[0067] Figure 19 is a magnified schematic diagram of a partial structure of the flexible circuit board assembly at one end of the snap-fit ​​component in Figure 16.

[0068] Figure 20 is another cross-sectional structural diagram of the shaft assembly in Figure 9;

[0069] Figure 21 is a magnified cross-sectional view of a portion of the rotating shaft assembly in Figure 20.

[0070] Figure 22 is a magnified cross-sectional view of another rotating shaft assembly provided in an embodiment of this application.

[0071] Explanation of reference numerals in the attached drawings: 100 - Electronic device; 101 - Rotating shaft assembly; 10 - Rotating shaft; 11 - Through hole; 111 - Second snap-fit ​​part; 112 - Mounting groove; 113 - First boss; 114 - Second boss; 12 - Second suction element; 13 - Third adhesive layer; 20 - Flexible circuit board assembly; 21 - Snap-fit ​​element; 21a - Accommodating space; 211 - First main body part; 2111 - First positioning hole; 212 - First snap-fit ​​part; 212a - Elastic protrusion; 2121 - Snap-fit ​​arm; 2122 - Connecting arm; 213 - Limiting part; 2131 - Second abutment surface; 214 - Notch structure; 22 - First suction element; 221 - First abutment surface; 222 - Third positioning hole; 23 - Flexible circuit board; 23a - First surface; 23b - Second surface; 231-Second main body; 232-Extension; 2321-Second positioning hole; 24-First adhesive layer; 25-Second adhesive layer; 26-Electrical connection device; 27-Film; 102-Middle frame; 102a-First middle frame; 102b-Second middle frame; 103-Flexible screen; 104-Back cover. Detailed Implementation

[0072] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0073] The foldable electronic devices provided in this application embodiment may include, but are not limited to, foldable fixed terminals or mobile terminals such as mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, touch TVs, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, and virtual reality devices.

[0074] For example, taking a foldable electronic device as a foldable phone, the foldable phone can be a foldable phone with the screen folding outwards, or it can be a foldable phone with part of the screen folding inwards and part of the screen folding outwards, etc.

[0075] In this embodiment, a foldable phone with an outward-folding screen is used as an example for illustration.

[0076] Figure 1 is a schematic diagram of a foldable electronic device in a folded state according to an embodiment of this application.

[0077] Referring to Figure 1, the foldable electronic device 100 may include a hinge 10 and a middle frame 102. The number of middle frames 102 may be at least two. For example, if there are two middle frames 102, they may be a first middle frame 102a and a second middle frame 102b. The first middle frame 102a and the second middle frame 102b are located on both sides of the hinge 10 and are connected to the hinge 10 respectively.

[0078] The pivot 10 can be a structural component used to connect two middle frames 102 and allow relative rotation between the two middle frames 102. The first middle frame 102a and the second middle frame 102b can be rotated together through the pivot 10, so that the first middle frame 102a and the second middle frame 102b can rotate relative to each other.

[0079] The first middle frame 102a and the second middle frame 102b can be folded relative to each other to a closed state, as shown in Figure 1. For example, the first middle frame 102a and the second middle frame 102b are in a closed state, and the two can be completely closed to be parallel to each other (a slight deviation is allowed). At this time, the electronic device 100 is in a closed state, also known as a folded state.

[0080] Figure 2 is a schematic diagram of the foldable electronic device shown in Figure 1 in an intermediate state.

[0081] Referring to Figure 2, the first middle frame 102a and the second middle frame 102b can rotate relative to each other (fold or unfold) to an intermediate state so that the electronic device 100 is in an intermediate state.

[0082] Figure 3 is a schematic diagram of the foldable electronic device shown in Figure 1 in a flattened state.

[0083] Referring to Figure 3, the first middle frame 102a and the second middle frame 102b can be unfolded to an open state. For example, when the first middle frame 102a and the second middle frame 102b are in the open state, the unfolding angle between the first middle frame 102a and the pivot 10, and between the pivot 10 and the second middle frame 102b, can be approximately 180°. The electronic device 100 is in the open state, also known as the flattened state.

[0084] It should be noted that slight deviations are allowed in the angles illustrated in the embodiments of this application. For example, the unfolding angle of the foldable electronic device 100 shown in Figure 3 can be 180°, or approximately 180°, such as 170°, 175°, 185°, or 190°. The angles illustrated in the following examples can be understood in the same way.

[0085] The intermediate state shown in Figure 2 can be any state between the folded state and the flattened state. That is, the electronic device 100 can switch between the flattened state (i.e., the open state) and the folded state (i.e., the closed state) by the movement of the pivot 10, thereby realizing the opening and closing of the electronic device 100.

[0086] For example, when the electronic device 100 is in a flattened state, rotating the first middle frame 102a and the second middle frame 102b towards each other and folding them relative to each other can switch the electronic device 100 from a flattened state to a folded state (or an intermediate state). When the electronic device 100 is in a folded state, rotating the first middle frame 102a and the second middle frame 102b away from each other and unfolding them relative to each other can switch the electronic device 100 from a folded state to a flattened state (or an intermediate state).

[0087] The middle frame 102 can be a rectangular flat plate structure. In this embodiment, as shown in FIG3, the width direction of the middle frame 102 (such as the first middle frame 102a) is taken as the x-direction, the length direction of the middle frame 102 is taken as the y-direction, and the thickness direction of the middle frame 102 is taken as the z-direction. It can be understood that the length direction of the rotating shaft 10 can be the axial direction of the rotating shaft, that is, the extension direction of the rotating shaft. The length direction, width direction, and thickness direction of the rotating shaft 10 can be consistent with the length direction, width direction, and thickness direction of the middle frame 102, respectively.

[0088] The length, width, and thickness in the embodiments of this application are for descriptive convenience only and do not imply any limitation on the size. For example, the length can be greater than, equal to, or less than the width. It is understood that when the foldable electronic device 100 is in a folded or flattened state, the length, width, and thickness directions of the electronic device 100 can correspond to the length, width, and thickness directions of the middle frame 102.

[0089] Of course, in some other examples, the middle frame 102 can also be a flat structure in the shape of a square, circle, ellipse, rounded rectangle, etc.

[0090] It should be noted that the electronic device 100 may include only two middle frames 102, such as one first middle frame 102a and one second middle frame 102b, so that the electronic device 100 is in a folded state, with the first middle frame 102a and the second middle frame 102b folded relative to each other into two layers. For example, referring to Figure 1, the electronic device 100 includes a first middle frame 102a, a second middle frame 102b, and a pivot 10. The first middle frame 102a and the second middle frame 102b are rotatably connected by the pivot 10. When the first middle frame 102a and the second middle frame 102b are folded relative to each other in the folded state, the electronic device 100 has a two-layer middle frame stacked shape.

[0091] Alternatively, the electronic device 100 may include multiple middle frames 102. The number of first middle frames 102a, second middle frames 102b, and hinges 10 can be multiple. Adjacent first middle frames 102a and second middle frames 102b can be connected by a hinge 10, allowing the electronic device 100 to be folded into a multi-layered form. For example, the electronic device 100 may include two first middle frames 102a, one second middle frame 102b, and two hinges 10. The two first middle frames 102a are located on both sides of the second middle frame 102b, and each first middle frame 102a is rotatably connected to the second middle frame 102b via a hinge 10. One first middle frame 102a can be folded relative to the second middle frame 102b, and the other first middle frame 102a can also be folded relative to the second middle frame 102b, so that the electronic device 100 is in a folded state, with the first middle frames 102a and the second middle frames 102b folded relative to each other to form a three-layered middle frame structure. When one of the first middle frames 102a and the second middle frame 102b is unfolded relative to each other to a flattened state, the electronic device 100 is in a flattened state.

[0092] In this embodiment, the electronic device 100 includes two frames, a first frame 102a and a second frame 102b, which are rotated together by a pivot 10.

[0093] Referring to Figure 3, the electronic device 100 may also include a foldable flexible screen 103, which serves as the display screen of the electronic device 100 and is used to display images, text, videos, etc.

[0094] The flexible screen 103 is laid on the hinge 10 and the middle frame 102. For example, the flexible screen 103 can be attached to the first middle frame 102a and the second middle frame 102b, and the flexible screen 103 can be located on the same side surface of the first middle frame 102a, the second middle frame 102b, and the hinge 10. When the first middle frame 102a and the second middle frame 102b are folded relative to each other, the portion of the flexible screen 103 opposite to the hinge 10 bends. When the first middle frame 102a and the second middle frame 102b are unfolded relative to each other, the hinge 10 and the bent portion of the flexible screen 103 also unfold accordingly.

[0095] For example, in a foldable electronic device with an outward-folding screen, the flexible screen 103 can be disposed on the outer surfaces of the first middle frame 102a, the second middle frame 102b, and the hinge 10. In a foldable electronic device with an inward-folding screen, the flexible screen 103 can be disposed on the inner surfaces of the first middle frame 102a, the second middle frame 102b, and the hinge 10.

[0096] Understandably, in some other examples, such as the three-frame folding electronic device described above, the flexible screen 103 is disposed on two first frames 102a, one second frame 102b, and the hinge 10. A portion of the flexible screen 103 may be located on the inner surface of one of the first frames 102a, one of the hinges 10, and the second frame 102b, while a portion of the flexible screen 103 may be located on the outer surface of the other first frame 102a. Alternatively, in some examples, the flexible screen 103 may be located on the inner surface of the two first frames 102a, one second frame 102b, and the hinge 10.

[0097] For example, when the electronic device 100 is in a folded state, the two adjacent and opposite surfaces of the first middle frame 102a and the second middle frame 102b can be the inner surfaces of the first middle frame 102a and the second middle frame 102b, respectively. The surface of the pivot 10 that is on the same side as the inner surfaces of the first middle frame 102a and the second middle frame 102b is the inner surface of the pivot 10. The two opposite surfaces of the first middle frame 102a and the second middle frame 102b are the outer surfaces of the first middle frame 102a and the second middle frame 102b, respectively. The surface of the pivot 10 that is on the same side as the outer surfaces of the first middle frame 102a and the second middle frame 102b is the outer surface of the pivot 10.

[0098] Figure 4 is a schematic diagram of the disassembled structure of the foldable electronic device shown in Figure 1.

[0099] Referring to Figure 4, the electronic device 100 may also include a back cover 104. The flexible screen 103 and the back cover 104 may be located on opposite sides of the two middle frames 102 and the pivot 10 along the thickness direction (z direction). The back cover 104, the flexible screen 103 and the middle frame 102 together form a receiving cavity, which can be used to assemble and accommodate various functional structural components of the electronic device 100.

[0100] The back cover 104 can serve as an exterior cover for the back of the electronic device 100, protecting the internal structural components (such as circuit boards and batteries) of the electronic device 100 and enhancing the aesthetics of the electronic device 100.

[0101] For example, the electronic device 100 may also include a circuit board, a battery, a charging management module, and a power management module (not shown in the figure), and the circuit board, battery, charging management module, and power management module may be fixed in the aforementioned receiving cavity.

[0102] The circuit board may include a processor, which may include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, a display processing unit (DPU), and / or a neural network processing unit (NPU), etc. The controller may serve as the central nervous system and command center of the electronic device 100. The controller can generate operation control signals based on instruction opcodes and timing signals to control instruction fetching and execution. The processor may also include memory for storing instructions and data.

[0103] The processor may include one or more interfaces, which can be used to connect a charger to charge the electronic device 100, and can also be used to enable data transmission between the electronic device 100 and external devices, such as connecting headphones, a projection device, etc.

[0104] The charging management module receives charging input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging examples, the charging management module receives charging input from the wired charger via an interface. In some wireless charging embodiments, the charging management module receives wireless charging input via the wireless charging coil of the electronic device 100. The charging management module can charge the battery and can also supply power to the electronic device 100 via the power management module.

[0105] The power management module connects the battery, charging management module, and processor. It receives input from the battery and / or charging management module to power the processor, memory, flexible screen, camera module, and other components. The power management module can also monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance).

[0106] In some examples, the power management module may be located within the processor on the circuit board. In other examples, the power management module and the charging management module may be located in the same device.

[0107] The structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or arrange the components differently. For example, the electronic device 100 may also include a communication module, a camera module (e.g., a front-facing camera and a rear-facing camera), a microphone, a speaker, a flash, and other devices.

[0108] The first middle frame 102a, part of the back cover 104 and part of the flexible screen 103 can form a receiving cavity, and the second middle frame 102b, part of the back cover 104 and part of the flexible screen 103 can form another receiving cavity, all of which can be used to accommodate the aforementioned electronic components such as processor, flash, microphone, sensor, camera module, battery, power management module, charging management module and so on.

[0109] The electronic device also includes a flexible circuit board, which is used to realize electrical connections between electronic components inside the electronic device. The flexible circuit board is mounted on the pivot, so that one end of the flexible circuit board can be located in the receiving cavity enclosed by the first middle frame, and the other end of the flexible circuit board can be located in the receiving cavity enclosed by the second middle frame, realizing electrical connections between electronic components in the two middle frames.

[0110] It is understandable that one end of the flexible circuit board can be fixed inside the first middle frame, and the other end of the flexible circuit board can also be fixed inside the second middle frame. When the first middle frame and the second middle frame rotate relative to each other to fold or unfold, the flexible circuit board can bend along with the rotation of the first middle frame and the second middle frame.

[0111] Figure 5 is a schematic diagram of the assembly of a flexible circuit board and a rotating shaft in an electronic device of the related technology.

[0112] To achieve assembly and fixation between the flexible circuit board and the rotating shaft, the flexible circuit board and the rotating shaft are usually fixed by magnetic attraction. For example, as shown in Figure 5, the rotating shaft assembly 200 may include a rotating shaft 201, a flexible circuit board 202, a first magnet 203 and a second magnet 204. The first magnet 203 is fixed on one side of the flexible circuit board 202, and the second magnet 204 is fixed inside the rotating shaft 201. After one end of the flexible circuit board 202 passes through the rotating shaft 201, the first magnet 203 and the second magnet 204 are located on opposite sides of the flexible circuit board 202. The end of the first magnet 203 facing the flexible circuit board 202 and the end of the second magnet 204 facing the flexible circuit board 202 attract each other, so that the first magnet 203 and the second magnet 204 can be attracted together, thereby fixing the flexible circuit board 202 and the rotating shaft 201.

[0113] However, since the flexible circuit board 202 is located between the first magnet 203 and the second magnet 204, to ensure the assembly firmness between the flexible circuit board 202 and the rotating shaft 201, the first magnet 203 and the second magnet 204 need to be relatively thick to increase the magnetic attraction force. This requires more space within the rotating shaft 201 to accommodate the two magnets, resulting in a weakening of the rotating shaft 201's strength and increasing the risk of breakage in scenarios such as drops and impacts. Furthermore, relying solely on the magnetic attraction force of the magnets to limit the flexible circuit board 202 on the rotating shaft 201 results in relatively weak limiting firmness and reliability. In scenarios such as drops and impacts, the flexible circuit board 202 is also prone to movement or detachment, leading to poor reliability and further increasing the risk of breakage of the rotating shaft 201.

[0114] Based on this, this application provides a hinge assembly, including a hinge, a flexible circuit board, and a snap-fit ​​component and a first adsorption component located on the flexible circuit board. When the flexible circuit board is inserted into the hinge through a through hole, the first adsorption component can be located within the through hole and adsorbed and connected to a second adsorption component within the hinge, thereby limiting and fixing the flexible circuit board. For example, it can limit the movement of the flexible circuit board relative to the hinge in the thickness direction, restricting the displacement of the flexible circuit board in the thickness direction during daily use or in scenarios such as drops, thus achieving the assembly of the flexible circuit board and the hinge. Furthermore, the first and second adsorption components are located on the same side of the flexible circuit board, ensuring high adsorption force while reducing the total thickness of the two adsorption components, reducing the thickness space occupied within the hinge, and improving the strength of the hinge. This reduces the risk of hinge breakage in scenarios such as drops and impacts, and improves service life and user experience.

[0115] The snap-fit ​​component can also be inserted into the through hole and engage with the rotating shaft to limit and fix the flexible circuit board. This allows for movement limitation of the flexible circuit board relative to the rotating shaft in both length and width directions, restricting displacement in these directions during daily use or in scenarios involving drops. This further enhances the locking strength between the flexible circuit board and the rotating shaft, reducing or preventing movement or detachment of the flexible circuit board during drops or impacts. It also reduces the risk of shaft breakage caused by impacts between the flexible circuit board, the first suction component, and the rotating shaft. Furthermore, it allows for easy disassembly of the flexible circuit board and the rotating shaft, facilitating removal during repairs.

[0116] Figure 6 is a schematic diagram of a partially disassembled structure of a foldable electronic device provided in an embodiment of this application.

[0117] Referring to Figure 6, the pivot assembly 101 includes a flexible circuit board assembly 20 and a pivot 10. The flexible circuit board assembly 20 includes a flexible circuit board 23, which is disposed on the pivot 10. The first middle frame 102a and the second middle frame 102b are located on both sides of the pivot 10, respectively.

[0118] The insertion direction of the flexible circuit board 23 can intersect with the thickness direction and the length direction of the rotating shaft 10, respectively. That is, the insertion direction and the thickness direction, as well as the insertion direction and the length direction, can have non-zero angles.

[0119] For example, the insertion direction of the flexible circuit board 23 can be perpendicular to the thickness direction and length direction of the rotating shaft 10, respectively. That is, the insertion direction can be parallel to the width direction (x direction). In other words, one end of the flexible circuit board 23 can pass through the rotating shaft 10 along the x direction, so that one end of the flexible circuit board 23 can be placed inside the second middle frame 102b, and the other end of the flexible circuit board 23 can be placed inside the second middle frame 102b. Part of the flexible circuit board 23 is located inside the rotating shaft 10.

[0120] Of course, in some examples, the insertion direction of the flexible circuit board 23 may not be parallel to the width direction, and the insertion direction may intersect with the width direction, that is, the insertion direction and the width direction may have a non-zero angle. In this embodiment, the example is that the insertion direction of the flexible circuit board 23 is perpendicular to the length direction and thickness direction of the rotating shaft 10, and the insertion direction is parallel to the width direction.

[0121] Figure 7 is a schematic diagram of the disassembled structure of the shaft assembly in Figure 6.

[0122] As shown in Figure 7, for example, a through hole 11 can be provided on the rotating shaft 10. The through hole 11 can pass through the rotating shaft 10 in the width direction (i.e., the through direction, as shown in the x direction in the figure). The flexible circuit board 23 can be inserted into the rotating shaft 10 through the through hole 11.

[0123] In some examples, referring to Figure 7, the flexible circuit board assembly 20 may also include an electrical connection device 26. The electrical connection device 26 may be a structure capable of connecting two active devices. The electrical connection device 26 may be disposed on the flexible circuit board 23, and the flexible circuit board 23 may be electrically connected to electronic components within the frame through the electrical connection device 26. For example, the electrical connection device 26 may be disposed on one end of the flexible circuit board 23, and the electrical connection device 26 may be a board-to-board connector (BTB) or the like.

[0124] Referring again to Figure 7, the flexible circuit assembly also includes a snap-fit ​​member 21 and a first suction member 22. The snap-fit ​​member 21 and the first suction member 22 are respectively disposed on the flexible circuit board 23. The snap-fit ​​member 21 and the first suction member 22 are used to limit and fix the flexible circuit board 23 and the rotating shaft 10 when the flexible circuit board 23 passes through the rotating shaft 10, so that the flexible circuit board 23 and the rotating shaft 10 are assembled and fixed together.

[0125] Figure 8 is a schematic diagram of the process state of the flexible circuit board assembly and the rotating shaft assembly in Figure 7, and Figure 9 is a schematic diagram of the structure of the flexible circuit board and the rotating shaft assembly after assembly in Figure 7.

[0126] Referring to Figure 8, to allow the flexible circuit board 23 to pass through the rotating shaft 10, one end of the flexible circuit board 23 can be pulled so that the flexible circuit passes through the through hole 11 on the rotating shaft 10 along the passing direction (x direction in the figure). The snap-fit ​​member 21 and the first suction member 22 on the flexible circuit board 23 can then move along the passing direction with the flexible circuit board 23 and enter the through hole 11. As shown in Figure 9, when the flexible circuit board 23 passes through the through hole 11 onto the rotating shaft 10, the snap-fit ​​member (not shown in the figure) and the first suction member (not shown in the figure) are respectively placed in the through hole 11 of the rotating shaft 10 (refer to Figure 10), and are connected to the rotating shaft 10 or the structural components inside the rotating shaft 10.

[0127] Figure 10 is a schematic cross-sectional view of the shaft assembly along plane AA in Figure 9.

[0128] Referring to Figure 10, a second adsorption element 12 is provided inside the rotating shaft 10. The first adsorption element 22 and the second adsorption element 12 can refer to two structural components that can be adsorbed and connected. For example, the first adsorption element 22 and the second adsorption element 12 can be magnetic adsorption elements. For instance, the first adsorption element 22 and the second adsorption element 12 can be magnets. The first adsorption element 22 can have two magnetic poles, such as N pole and S pole, and the second adsorption element 12 can also have two magnetic poles, such as N pole and S pole. The two magnetic poles of the first adsorption element 22 and the second adsorption element 12 with opposite polarities can magnetically attract each other.

[0129] For example, when the N-end of the first adsorbent 22 is close to or abuts the S-end of the second adsorbent 12, they can be magnetically attracted to each other, thus achieving an adsorption connection between the first adsorbent 22 and the second adsorbent 12. Alternatively, when the S-end of the first adsorbent 22 is close to or abuts the N-end of the second adsorbent 12, they can be magnetically attracted to each other, thus achieving an adsorption connection between the first adsorbent 22 and the second adsorbent 12.

[0130] When the flexible circuit board 23 passes through the through hole 11 onto the rotating shaft 10, the first adsorption member 22 can enter the through hole 11 and be adsorbed and connected with the second adsorption member 12 inside the through hole 11. Specifically, the end of the first adsorption member 22 facing away from the flexible circuit board 23 along the thickness direction (z direction) is adsorbed and connected with the second adsorption member 12. For example, the polarity of the end of the first adsorption member 22 facing away from the flexible circuit board 23 along the thickness direction is opposite to that of the end of the second adsorption member 12 facing the first adsorption member 22, so that the first adsorption member 22 and the second adsorption member 12 can be magnetically connected together.

[0131] The adsorption connection between the first adsorption member 22 and the second adsorption member 12 can limit and fix the flexible circuit board 23. For example, it can limit the movement of the flexible circuit board 23 relative to the rotating shaft 10 in the thickness direction, restrict the displacement of the flexible circuit board 23 in the thickness direction in daily use or drop scenarios, and realize the assembly and fixation of the flexible circuit board 23 and the rotating shaft 10.

[0132] It is understandable that the adsorption between the first adsorbent 22 and the second adsorbent 12 can be separated under a certain external force. For example, if the external force is greater than the adsorption force between the first adsorbent 22 and the second adsorbent 12, the first adsorbent 22 and the second adsorbent 12 will be separated under the action of the external force.

[0133] As shown in Figure 10, the end of the first adsorption member 22 facing away from the flexible circuit board 23 is adsorbed and connected to the second adsorption member 12. That is, in the thickness direction, the second adsorption member 12 can be located on the side of the first adsorption member 22 facing away from the flexible circuit board 23. The first adsorption member 22 and the second adsorption member 12 are located on the same side of the flexible circuit board 23, ensuring a high adsorption force between the first adsorption member 22 and the second adsorption member 12. Under the condition of satisfying the limiting firmness between the flexible circuit board 23 and the rotating shaft 10, the thickness of the first adsorption member 22 and the second adsorption member 12 can be reduced, that is, the thickness space occupied in the rotating shaft 10 can be reduced, and the strength of the rotating shaft 10 can be improved. Thus, in scenarios such as drops and impacts, the risk of the rotating shaft 10 breaking is reduced, and the service life and user experience are improved.

[0134] As exemplarily, continuing to refer to Figure 10, to protect the first adsorbent 22 and the second adsorbent 12, a film 27 can be provided between the first adsorbent 22 and the second adsorbent. For example, the film 27 can be a plastic (polyethylene terephthalate, abbreviated as PET) film. The film 27 can reduce or avoid frictional damage to the first adsorbent 22 and / or the second adsorbent 12 during the process of the first adsorbent 22 entering the through hole 11 along the penetration direction and adsorbing with the second adsorbent 12.

[0135] The film 27 can be fixed on the first adsorption member 22, or the film 27 can also be fixed on the second adsorption member 12, or the film 27 can be provided on both the first adsorption member 22 and the second adsorption member 12.

[0136] The snap-fit ​​component 21 can be inserted into the through hole 11 along the through-path of the flexible circuit board 23 and snap-fit ​​with the rotating shaft 10. That is, the snap-fit ​​component 21 and the rotating shaft 10 are detachably connected by snap-fit ​​engagement.

[0137] When the flexible circuit board 23 passes through the through hole 11 onto the rotating shaft 10, the snap-fit ​​member 21 can be inserted into the through hole 11 along the passing direction of the flexible circuit board 23 (as shown in Figures 8 and 9). The snap-fit ​​member 21 can engage with the rotating shaft 10, allowing the flexible circuit board 23 to be connected to the rotating shaft 10, thus limiting and fixing the flexible circuit board 23. This can limit the movement of the flexible circuit board 23 relative to the rotating shaft 10 in the length and width directions, restricting displacement in these directions during daily use or in scenarios such as drops. This further improves the fixing strength between the flexible circuit board 23 and the rotating shaft 10, enhancing the assembly stability and reliability of the flexible circuit board 23. It also reduces or avoids movement or detachment of the flexible circuit board 23 in scenarios such as drops or impacts, and reduces the risk of the rotating shaft 10 breaking due to impacts between the flexible circuit board 23, the first adsorption member 22, and the rotating shaft 10, further improving service life and user experience.

[0138] The snap-fit ​​component 21 can also be detached from the rotating shaft 10. The first adsorption component 22 and the second adsorption component 12 can also be separated under a certain external force. For example, by pulling the other end of the flexible circuit board 23 in the opposite direction, the snap-fit ​​component 21 can be separated from the rotating shaft 10, and the first adsorption component 22 can be separated from the second adsorption component 12. This allows the flexible circuit board 23 to be detached from the rotating shaft 10, significantly improving the ease of disassembly of the flexible circuit board 23 and facilitating disassembly in scenarios such as rework.

[0139] In the scenario of assembling the flexible circuit board assembly 20 and the rotating shaft 10, one end of the flexible circuit is pulled through the through hole 11 on the rotating shaft 10, so that the flexible circuit board 23 is inserted into the rotating shaft 10, and the snap-fit ​​member 21 and the first adsorption member 22 are inserted into the through hole 11, so that the snap-fit ​​member 21 is snapped into the rotating shaft 10, and the first adsorption member 22 is adsorbed and connected to the second adsorption member 12, thus completing the assembly and fixation of the flexible circuit board 23 and the rotating shaft 10. The assembly method is simple and easy to implement.

[0140] In scenarios such as disassembly and repair of the flexible circuit board assembly 20, the other end of the flexible circuit board 23 can be pulled in the opposite direction to separate the snap fastener 21 from the rotating shaft 10, separate the first adsorption member 22 from the second adsorption member 12, and pull the flexible circuit board 23 out from the through hole 11 of the rotating shaft 10, thus completing the disassembly of the flexible circuit board 23.

[0141] Figure 11 is a schematic cross-sectional view of the shaft assembly along the BB plane in Figure 9.

[0142] Specifically, this design enables the snap-fit ​​engagement between the snap-fit ​​component 21 and the rotating shaft 10. For example, as shown in Figure 11, the snap-fit ​​component 21 may include a first main body portion 211. The first main body portion 211 serves as the primary structural component for assembling and fixing the snap-fit ​​component 21 to the flexible circuit board 23. For instance, the first main body portion 211 of the snap-fit ​​component 21 may be attached and fixed to the first surface 23a of the flexible circuit board 23 to achieve assembly and fixation between the snap-fit ​​component 21 and the flexible circuit board 23.

[0143] The snap-fit ​​component 21 may also include a first snap-fit ​​portion 212, such as the first snap-fit ​​portion 212 being provided at opposite ends of the first main body portion 211 along the length direction (y direction). A second snap-fit ​​portion 111 may be provided on the rotating shaft 10, such as the second snap-fit ​​portion 111 being provided on the two opposite inner sidewalls of the through hole 11 along the length direction.

[0144] The first snap-fit ​​part 212 can engage with the second snap-fit ​​part 111 to ensure that when the snap-fit ​​part 21 is inserted into the through hole 11 along the width direction (x direction), it can be fixed to the rotating shaft 10 by engaging with the first snap-fit ​​part 212 and the second snap-fit ​​part 111, thus limiting the movement of the snap-fit ​​part 21 and the flexible circuit board 23 relative to the rotating shaft 10 in the xy plane.

[0145] The first snap-fit ​​portion 212 and the second snap-fit ​​portion 111 can be structural components capable of snap-fit ​​engagement, such as a buckle and a slot, respectively. Alternatively, one of the first snap-fit ​​portion 212 and the second snap-fit ​​portion 111 can be an elastic card with a groove, and the other can be a protrusion that can snap-fit ​​into the groove on the elastic card.

[0146] Alternatively, one of the first snap-fit ​​portion 212 and the second snap-fit ​​portion 111 may include an elastic protrusion 212a, and the other may be a groove that can snap-fit ​​with the elastic protrusion 212a.

[0147] For example, continuing to refer to Figure 11, taking the first engaging portion 212 on the engaging member 21 as including an elastic protrusion 212a, and the second engaging portion 111 on the inner wall of the through hole 11 of the rotating shaft 10 as a groove, when the engaging member 21 moves along the through-hole direction (width direction, i.e., the x-direction) and is inserted into the through hole 11, the elastic protrusion 212a can be compressed by the inner wall of the through hole 11, that is, the elastic protrusion 212a is compressed in the direction toward the first main body portion 211.

[0148] Continue pulling the flexible circuit board 23 to insert the snap-fit ​​21. The elastic protrusion 212a moves to the groove position. The elastic protrusion 212a will recover under the rebound action, that is, the elastic protrusion 212a moves away from the first main body 211, so that the elastic protrusion 212a is accommodated and snapped in the groove, so that the snap-fit ​​21 can be connected and assembled with the rotating shaft 10 through the cooperation of the elastic protrusion 212a and the groove.

[0149] In scenarios such as disassembling the flexible circuit board 23, the flexible circuit board 23 is pulled in the opposite direction, causing the snap-fit ​​21 to move in the opposite direction. The elastic protrusion 212a can be compressed again, so that it can be removed from the rotating shaft 10. The structure is simple and easy to manufacture.

[0150] The first snap-fit ​​portion 212 includes an elastic protrusion 212a, and the second snap-fit ​​portion 111 is a groove, which helps to simplify the design of the internal structure of the through hole 11 of the rotating shaft 10, reduce the design and molding difficulty of the rotating shaft 10, and also helps to ensure the strength of the rotating shaft 10, making it easy to implement.

[0151] Figure 12 is a magnified schematic diagram of the partial structure at the mating part of the first and second snap-fit ​​parts in Figure 11.

[0152] For example, as shown in FIG12, the first snap-fit ​​portion 212 may include a snap-fit ​​arm 2121 and a connecting arm 2122. The snap-fit ​​arm 2121 is connected to the connecting arm 2122, and the connecting arm 2122 is connected to the first main body portion 211 (as shown in FIG18), thereby fixing the first snap-fit ​​portion 212 and the first main body portion 211 together.

[0153] The connecting arm 2122 may include two arms, which may be located on opposite sides of the snap-fit ​​arm 2121 along the through-path direction. The two ends of the snap-fit ​​arm 2121 may be connected to the two connecting arms 2122 respectively. The middle portion of the snap-fit ​​arm 2121 may protrude (e.g., protrude along its length away from the other first snap-fit ​​portion 212) to form the aforementioned elastic protrusion 212a. It should be noted that the middle portion of the snap-fit ​​arm 2121 may refer to the portion between the two ends of the snap-fit ​​arm 2121.

[0154] By forming an elastic protrusion 212a on a portion of the snap-fit ​​arm 2121 to achieve snap-fit ​​engagement with the groove on the rotating shaft 10, and by connecting both ends of the snap-fit ​​arm 2121 to the first main body 211 via connecting arms 2122, the strength of the snap-fit ​​arm 2121 is improved, thereby increasing the firmness of the snap-fit ​​engagement between the elastic protrusion 212a of the snap-fit ​​arm 2121 and the groove on the rotating shaft 10, improving the reliability and stability of the snap-fit ​​engagement between the snap-fit ​​member 21 and the rotating shaft 10, and helping to reduce the movement or detachment of the flexible circuit board 23 in scenarios such as drops.

[0155] The shape of the outer surface of the elastic protrusion 212a can match the shape of the inner surface of the groove. For example, the outer surface of the elastic protrusion 212a can be an arc-shaped surface, and the inner surface of the groove can also be an arc-shaped surface. This facilitates the elastic protrusion 212a to be accommodated and engaged in the groove when the snap-fit ​​component 21 moves along the insertion direction, thereby achieving a snap-fit ​​engagement between the elastic protrusion 212a and the groove and improving the ease of assembly. Correspondingly, in the scenario of disassembling the flexible circuit board, it is also easy to move the elastic protrusion 212a out of the groove, reducing the difficulty of disassembling the flexible circuit board.

[0156] Understandably, when assembling the flexible circuit board assembly 20, when the first snap-fit ​​portion 212 of the snap-fit ​​member 21 engages with the second snap-fit ​​portion 111 of the rotating shaft 10, the first adsorption member 22 and the second adsorption member 12 achieve adsorption engagement to ensure a high assembly firmness of the flexible circuit board assembly 20. For example, when the elastic protrusion 212a of the snap-fit ​​member 21 is accommodated and snapped into the groove on the rotating shaft 10, the position of the first adsorption member 22 can correspond to that of the second adsorption member 12 in the thickness direction. If the projections of the first adsorption member 22 and the second adsorption member 12 in the thickness direction overlap, a strong adsorption effect is ensured between the first adsorption member 22 and the second adsorption member 12.

[0157] It should be noted that the snap-fit ​​component 21 can be disposed on one side surface of the flexible circuit board 23, and the snap-fit ​​component 21 can be at least partially fixed to one side surface of the flexible circuit board 23, such as the first main body 211 of the snap-fit ​​component 21 being fixed to one side surface of the flexible circuit board 23. Alternatively, the snap-fit ​​component 21 can be entirely fixed to one side surface of the flexible circuit board 23.

[0158] In some examples, at least a portion of the snap-fit ​​member 21 and the first adsorption member 22 can be disposed on the same side surface of the flexible circuit board 23. For example, the first main body portion 211 of the snap-fit ​​member 21 and the first adsorption member 22 can be arranged sequentially along the through-cutting direction on one side of the flexible circuit board 23. While the snap-fit ​​member 21 snaps into the rotating shaft 10, the first adsorption member 22 is adsorbed and connected to the second adsorption member 12.

[0159] Alternatively, at least a portion of the snap-fit ​​member 21 and the first adsorption member 22 may be disposed on opposite sides of the flexible circuit board 23. For example, the first main body portion 211 of the snap-fit ​​member 21 and the first adsorption member 22 may be located on opposite sides of the flexible circuit board 23 along the thickness direction.

[0160] Figure 13 is a partial schematic diagram of a split structure of the flexible circuit board assembly in Figure 7.

[0161] For example, referring to FIG13, the flexible circuit board 23 may include a first surface 23a and a second surface 23b, which may be opposite to each other in the thickness direction of the flexible circuit board 23. The first main body portion 211 of the snap-fit ​​member 21 may be located on the first surface 23a of the flexible circuit board 23, and the first adsorption member 22 may be located on the second surface 23b of the flexible circuit board 23 (see FIG15). The first main body portion 211, part of the flexible circuit board 23, and the first adsorption member 22 may be stacked sequentially in the thickness direction (see FIG10). The first main body portion 211, part of the flexible circuit board 23, and the first adsorption member 22 may form a stacked structure, and the vertical projections of the first main body portion 211, the flexible circuit board 23, and the first adsorption member 22 in the thickness direction at least partially overlap.

[0162] Referring again to Figure 13, the flexible circuit board assembly 20 may further include a first adhesive layer 24 and a second adhesive layer 25, both of which can be adhesive layers. The snap-fit ​​component 21 can be bonded and fixed to the flexible circuit board 23 via the first adhesive layer 24.

[0163] For example, the first adhesive layer 24 can be located between the first main body 211 of the snap-fit ​​member 21 and the first surface 23a of the flexible circuit board 23, so that the first main body 211 is attached and fixed to the first surface 23a of the flexible circuit board 23 through the first adhesive layer 24, thereby achieving the fixation between the snap-fit ​​member 21 and the flexible circuit board 23.

[0164] The second adhesive layer 25 can be located between the first adsorption member 22 and the second surface 23b of the flexible circuit board 23, and the first adsorption member 22 can be bonded and fixed to the second surface 23b of the flexible circuit board 23 by the second adhesive layer 25.

[0165] Figure 14 is a schematic cross-sectional view of the shaft in the shaft assembly shown in Figure 9.

[0166] Referring to Figure 14, the rotating shaft assembly may include a third adhesive layer 13, which is located between the rotating shaft 10 and the second adsorption member 12. The second adsorption member 12 can be fixed inside the rotating shaft 10 by the third adhesive layer 13.

[0167] For example, the second adsorption member 12 can be located on one inner wall of the through hole 11 along the thickness direction, that is, the through hole 11 can include two inner walls opposite each other in the thickness direction, and the second adsorption member 12 can be fixed on one of the inner walls. As shown in FIG14, the through hole 11 can include inner walls 11a and 11b opposite each other in the thickness direction (see FIG15), and the second adsorption member 12 can be fixed on the inner wall 11a of the through hole 11.

[0168] For example, a mounting groove 112 can be formed on the inner wall 11a of the through hole 11. The third adhesive layer 13 can be located between the bottom of the mounting groove 112 and the second adsorption member 12, so that the second adsorption member 12 can be fixed in the mounting groove 112 through the third adhesive layer 13. The mounting groove 112 can improve the fixing firmness of the second adsorption member 12 on the rotating shaft 10, thereby improving the fixing and limiting firmness of the flexible circuit board assembly 20 and the rotating shaft 10.

[0169] Of course, in some examples, the mounting groove 112 may not be provided on the inner wall of the through hole 11. For example, the second adsorption member 12 can be fixed to one of the two inner walls of the through hole 11 that are opposite each other in the thickness direction by the third adhesive layer 13.

[0170] Figure 15 is a front view of a partial cross-sectional structure of the electronic device in Figure 6.

[0171] When the flexible circuit board 23 is fixedly assembled with the rotating shaft 10 through the snap-fit ​​member 21 and the first adsorption member 22, the end of the first adsorption member 22 facing away from the flexible circuit board 23 can abut against and adsorb the second adsorption member 12, and the end of the first main body 211 facing away from the flexible circuit board 23 can abut against the inner wall 11b of the through hole 11.

[0172] In other words, the second adsorption member 12, the first adsorption member 22, part of the flexible circuit board 23, and the first main body 211 are stacked sequentially in the thickness direction, and the second adsorption member 12 can be fixed on the inner wall 11a (or the bottom of the mounting groove) of the through hole 11, and the first main body 211 can abut against the inner wall 11b of the through hole 11. This ensures that there is no gap between the second adsorption member 12 and the inner wall 11a (or the bottom of the mounting groove) of the through hole 11, and no gap between the first main body 211 and the inner wall 11b of the through hole 11. That is, the stacked structure composed of the second adsorption member 12, the first adsorption member 22, the flexible circuit board 23, and the first main body 211 can collectively fill the through hole 11 (and the mounting groove) in the thickness direction, and there can be no gap between this stacked structure and the rotating shaft 10 (or the two inner walls of the through hole 11 along the thickness direction) in the thickness direction. In scenarios such as drops and impacts, the flexible circuit board assembly 20 and the pivot 10 are less likely to collide and move, further improving the drop strength of the pivot assembly 101 and significantly reducing the risk of the pivot 10 breaking.

[0173] Figure 16 is a magnified schematic diagram of a portion of the flexible circuit board assembly at the snap-fit ​​joint in Figure 7.

[0174] For example, referring to FIG16, the snap-fit ​​member 21 may further include a limiting part 213. The number of limiting parts 213 may be at least two, that is, the number of limiting parts 213 may be multiple. At least two of the multiple limiting parts 213 are located on opposite sides of the first main body 211 along the through-path (x direction). That is, some limiting parts 213 are located on one side of the opposite sides of the first main body 211 along the through-path, and some limiting parts 213 are located on the other side, so that limiting parts 213 may be present on at least the opposite sides of the first main body 211 along the through-path.

[0175] Figure 17 is a partial schematic diagram of another disassembled structure of the flexible circuit board assembly in Figure 7.

[0176] Referring to Figure 17, the first main body 211 of the first adsorption member 22 and the snap-fit ​​member 21 is fixed on the second surface 23b and the first surface 23a of the flexible circuit board 23, respectively. The limiting part 213 protrudes from the side of the first main body 211 facing the first adsorption member 22. For example, one end of the limiting part 213 can be fixed on the side of the first main body 211 facing the first adsorption member 22, and the other end of the limiting part 213 can extend away from the first main body 211 and toward the first adsorption member 22. For example, the other end of the limiting part 213 can extend toward the first adsorption member 22 along the thickness direction (z direction), so that the limiting part 213 can protrude from the side of the first main body 211 facing the first adsorption member 22. Multiple protruding limiting parts 213 and the first main body 211 can form a receiving space 21a.

[0177] The first latching portion 212 may also protrude from the surface of the first main body portion 211 facing the first adsorption member 22. That is, one end of the first latching portion 212 may be connected to the first main body portion 211, and the other end of the first latching portion 212 may extend away from the first main body portion 211 and toward the first adsorption member 22. For example, the other end of the first latching portion 212 may extend toward the first adsorption member 22 along the thickness direction (z direction), so that the first latching portion 212 may protrude from the surface of the first main body portion 211 facing the first adsorption member 22. The first latching portion 212, the limiting portion 213 and the first main body portion 211 together form the aforementioned receiving space 21a.

[0178] As shown in Figure 16, the first adsorption member 22 is located within the accommodating space 21a formed by the limiting part 213, the first snap-fit ​​part 212, and the first main body part 211. The accommodating space 21a can position the first adsorption member 22 and the snap-fit ​​part 21 for assembly, which facilitates assembly and helps to achieve accurate positioning of the first adsorption member 22 and the snap-fit ​​part 21, ensuring that when the snap-fit ​​part 21 is snapped into the rotating shaft 10, the first adsorption member 22 and the second adsorption member 12 are adsorbed and connected.

[0179] The limiting parts 213 located on opposite sides of the first main body 211 along the insertion direction can also limit and fix the first adsorption member 22, restrict the displacement of the first adsorption member 22 relative to the snap fastener 21 in the insertion direction, improve the consistency of movement of the snap fastener 21 and the first adsorption member 22 in the insertion direction, and prevent damage to the flexible circuit board 23 caused by excessive slippage of the adhesive layers such as the first adhesive layer 24 and the second adhesive layer 25 during the assembly or disassembly of the flexible circuit board assembly 20.

[0180] The first snap-fit ​​portion 212 located at opposite ends of the first main body portion 211 along the length direction can also limit and fix the first adsorption member 22, restrict the displacement of the first adsorption member 22 relative to the snap-fit ​​member 21 in the length direction (y direction), further enhance the limiting strength between the snap-fit ​​member 21 and the first adsorption member 22, and reduce the pulling damage to the flexible circuit board 23.

[0181] For example, the snap-fit ​​part 21 can be an integral structural component, that is, the first main body part 211, the first snap-fit ​​part 212 and the limiting part 213 can be integrally formed into an integral structural component, so that the first main body part 211, the first snap-fit ​​part 212 and the limiting part 213 have a high degree of bonding, which is beneficial to improving the stability and strength of the snap-fit ​​part 21.

[0182] Alternatively, in some examples, the first main body 211, the first snap-fit ​​part 212, and the limiting part 213 can be formed independently, and the first main body 211, the first snap-fit ​​part 212, and the limiting part 213 can be assembled together by means of adhesive connection, welding connection, snap-fit ​​connection, and thread fastening to form snap-fit ​​part 21.

[0183] The number of limiting parts 213 can be two, with the two limiting parts 213 located on opposite sides of the first main body 211 along the insertion direction. Referring to FIG16, the snap-fit ​​member 21 may only include limiting parts 213a and 213b, which are located on opposite sides of the first main body 211 along the insertion direction. The limiting parts 213a, 213b, and the first main body 211 form an accommodating space 21a to achieve positioning and limiting of the first adsorption member 22. Alternatively, the snap-fit ​​member 21 may also only include limiting parts 213a and 213c, which are also located on opposite sides of the first main body 211 along the insertion direction. The limiting parts 213a, 213c, and the first main body 211 form an accommodating space 21a. Alternatively, the snap-fit ​​member 21 may only include limiting portions 213b and 213d located on opposite sides of the first main body portion 211 along the through-path direction. Alternatively, the snap-fit ​​member 21 may only include limiting portions 213c and 213d located on opposite sides of the first main body portion 211 along the through-path direction.

[0184] Alternatively, there may be two or more limiting parts 213. Some limiting parts 213 may be located on one side of the first main body 211 along the through-path direction, and some limiting parts 213 may be located on the other side of the first main body 211 along the through-path direction. For example, referring to Figure 16, taking four limiting parts 213 as an example, such as limiting parts 213a, 213b, 213c and 213d respectively. For example, limiting parts 213a and 213d can be located on one side of the opposite sides of the first main body 211 along the through-path, and limiting parts 213b and 213c can be located on the other side of the opposite sides of the first main body 211 along the through-path. The limiting parts 213a, 213b, 213c and 213d and the first main body 211 form a receiving space 21a, realizing the positioning and limiting of the first adsorption member 22.

[0185] To improve the positioning and limiting effect of the limiting part 213 on the first adsorption member 22, multiple limiting parts 213 can be distributed on opposite ends of the snap-fit ​​member 21 along the length direction (y direction). That is, some limiting parts 213 can be located on one end of the opposite ends of the snap-fit ​​member 21 along the length direction, and some limiting parts 213 can be located on the other end, so as to ensure the consistency of positioning and limiting of the first adsorption member 22 in the length direction and enhance the positioning and limiting strength of the first adsorption member 22.

[0186] For example, as shown in Figure 16, among the four limiting parts 213, limiting parts 213a and 213c can be located at one end of the opposite ends of the first main body 211 along the length direction, and limiting parts 213b and 213d can be located at the other end of the opposite ends of the first main body 211 along the length direction. The four limiting parts 213 can play a good positioning and limiting effect on the first adsorption member 22.

[0187] For example, the first main body 211 can be a rectangular sheet structure. When the snap-fit ​​part 21 is actually formed, four protruding extensions can be formed near the four corners of the first main body 211 when the rectangular first main body 211 is formed. The four extensions are bent so that the extensions protrude on one side of the first main body 211, thereby forming the above-mentioned four limiting parts 213.

[0188] It is understandable that, in order to avoid the flexible circuit board 23 between the first main body 211 and the first adsorption member 22, there may be a clearance gap between the limiting parts 213 distributed on opposite ends of the snap-fit ​​member 21 in the length direction. Part of the flexible circuit board 23 is located in the clearance gap, thereby avoiding the flexible circuit board 23 and allowing the flexible circuit board 23 to be fixed smoothly and evenly between the first main body 211 and the first adsorption member 22, which helps to reduce damage to the flexible circuit board 23.

[0189] For example, referring to Figure 16, taking limiting portions 213a and 213d (or 213b) as examples, there is a gap in the length direction between limiting portions 213a and 213d (or 213b) to form a clearance gap (see Figure 18). A portion of the flexible circuit board is located between the snap-fit ​​member and the first adsorption member, and a portion of the flexible circuit board is disposed through this clearance gap. Taking limiting portions 213c and 213b (or 213d) as examples, there is also a gap in the length direction between limiting portions 213c and 213b (or 213d) to form a clearance gap.

[0190] It should be noted that when there are two limiting parts 213, the two limiting parts 213 can also be located at opposite ends of the first main body 211 along the length direction. As shown in FIG16, taking the limiting parts 213a and 213b as an example, the limiting parts 213a and 213b are located at opposite ends of the first main body 211 along the length direction, and the limiting parts 213a and 213b are also located on both sides of the first main body 211 along the through direction.

[0191] Alternatively, the two limiting portions 213 may be located on both sides of the first main body portion 211 along the through-path direction, and each limiting portion 213 may extend along the length direction, such that the two ends of each limiting portion 213 may extend to the opposite ends of the first main body portion 211 along the length direction.

[0192] Alternatively, in some examples, to improve the positioning and limiting effect of the limiting portion 213 on the first adsorption member 22, the limiting portion 213 can have a certain length. For example, taking two limiting portions 213 as an example, the two limiting portions 213 can be located at one end of the first main body portion 211 along the length direction, and the two limiting portions 213 are respectively located on opposite sides of the first main body portion 211 along the through-path direction. For example, taking the snap-fit ​​member 21 as an example that only includes limiting portions 213a and 213c (see Figure 16), the length of each limiting portion 213 can be a large proportion of the length of the first main body portion 211, such as the length of the limiting portion 213 being half the length of the first main body portion 211. By increasing the contact and limiting area between the limiting portion 213 and the first adsorption member 22 in the length direction, the positioning and limiting effect on the first adsorption member 22 can be improved.

[0193] To avoid the flexible circuit board 23, for example, an opening can be formed on each limiting part 213, so that the flexible circuit board 23 passes through the opening of the limiting part 213. This can also ensure a good limiting and positioning effect on the flexible circuit board 23 and reduce damage to the flexible circuit board 23.

[0194] Referring to Figure 17, the flexible circuit board 23 may include a second main body 231 and an extension 232. For example, the second main body 231 may have two extensions 232 on each side along its length. The extensions 232 and part of the second main body 231 may be located within the aforementioned receiving space 21a of the snap-fit ​​member 21. Part of the second main body 231 may pass through the clearance gap between the limiting parts 213 or the opening of the limiting parts 213. By positioning the extensions 232 within the receiving space 21a, the snap-fit ​​member 21 and the flexible circuit board 23 can be positioned, achieving precise positioning and assembly of the snap-fit ​​member 21 on the flexible circuit board 23. This facilitates precise positioning of the snap-fit ​​member 21 and the first adsorption member 22 on the flexible circuit board 23 during assembly.

[0195] For example, the first adsorption member 22, the partial flexible circuit board 23, and the first main body 211 are stacked in sequence, so that the projections (projections along the thickness direction) of the two opposite ends of the first main body 211 along the length direction, the two extensions 232, and the two opposite ends of the first adsorption member 22 along the length direction are at least partially overlapped. This allows the extensions 232 to be located in the two ends of the receiving space 21a formed by the snap-fit ​​member 21 along the length direction, which can better realize the assembly and positioning of the flexible circuit board 23, the snap-fit ​​member 21, and the first adsorption member 22, and improve the positioning accuracy.

[0196] For example, the overlapping area of ​​the two ends of the first main body 211, the two extensions 232 and the two ends of the first adsorption member 22 along the length direction can be maximized. If the two ends of the first main body 211, the two extensions 232 and the two ends of the first adsorption member 22 are nearly coincident, the assembly positioning accuracy of the flexible circuit board 23, the snap-fit ​​member 21 and the first adsorption member 22 can be further improved.

[0197] In some embodiments, first positioning holes 2111 may be provided at both ends of the first main body 211 along the length direction, and the first positioning holes 2111 may penetrate the first main body 211 in the thickness direction. Second positioning holes 2321 may be provided at both ends of the two extensions 232, and the second positioning holes 2321 may also penetrate the extensions 232 in the thickness direction. Third positioning holes 222 may be provided at both ends of the first adsorption member 22 along the length direction, and the third positioning holes 222 may also penetrate the first adsorption member 22 in the thickness direction.

[0198] The center lines of the first positioning hole 2111, the second positioning hole 2321 and the third positioning hole 222 can coincide in the thickness direction. The first positioning hole 2111, the second positioning hole 2321 and the third positioning hole 222 can be used to assist in positioning the first main body 211, the snap-fit ​​part 21 and the flexible circuit board 23 during assembly, so as to further improve the positioning accuracy.

[0199] For example, when assembling the snap-fit ​​component 21, the flexible circuit board 23, and the first suction component 22, after the first suction component 22, part of the flexible circuit board 23, and the snap-fit ​​component 21 are stacked in sequence, a positioning rod can be used to pass through the first positioning hole 2111, the second positioning hole 2321, and the third positioning hole 222 in sequence along the thickness direction. The positioning rod can coincide with the center line of the first positioning hole 2111, the second positioning hole 2321, and the third positioning hole 222, thereby enabling the snap-fit ​​component 21, the flexible circuit board 23, and the first suction component 22 to achieve precise positioning and assembly.

[0200] For example, the diameter of the first positioning hole 2111 and the diameter of the third positioning hole 222 can be equal, and the diameter of the second positioning hole 2321 can be larger than the diameters of the first positioning hole 2111 and the third positioning hole 222, respectively. By making the diameter of the second positioning hole 2321 on the flexible circuit board 23 relatively large, the impact or contact of the positioning rod on the circuit structure of the flexible circuit board 23 during the assembly process, such as when positioning is assisted by the positioning rod, can be reduced or avoided, thus ensuring the electrical connection performance of the flexible circuit board 23.

[0201] Figure 18 is a schematic diagram of the snap-fit ​​component in Figure 16.

[0202] Referring to Figure 18, the snap-fit ​​part 21 also has a notch structure 214, which can be located on one side of the snap-fit ​​part 21, such as on one side of the first main body part 211 along the through-cutting direction.

[0203] Figure 19 is a magnified schematic diagram of a portion of the flexible circuit board assembly at one end of the snap-fit ​​component in Figure 16.

[0204] Referring to Figure 19, the first adsorption member 22 has a first contact surface 221 on one side along the insertion direction (x direction). The first adsorption member 22 is located in the receiving space 21a of the snap fastener 21, and the first contact surface 221 of the first adsorption member 22 can be exposed through the notch structure 214 on the snap fastener 21. For example, the first contact surface 221 can be exposed through the notch structure 214 in the insertion direction.

[0205] Figure 20 is another cross-sectional view of the shaft assembly in Figure 9.

[0206] As shown in Figure 20, a first boss 113 may be provided in the through hole 11 of the rotating shaft 10. The first boss 113 may be located on one side of the through hole 11 along the insertion direction. After the flexible circuit board assembly and the rotating shaft 10 are assembled to form the rotating shaft assembly 101, the first boss 113 may extend at least partially into the notch structure 214 (not shown in the figure) accommodated in the snap-fit ​​member 21, and the first abutting surface 221 of the first adsorption member 22 may abut against the first boss 113, thereby restricting the displacement of the flexible circuit board 23 along the insertion direction.

[0207] When assembling the flexible circuit board assembly and the rotating shaft 10, the direction in which the flexible circuit board 23 passes through the rotating shaft 10 or the direction in which the snap fastener 21 is inserted into the rotating shaft 10 can be from the first abutment surface 221 to the first boss 113. For example, the passing direction can be to the right in the x direction shown in the figure.

[0208] By pulling the flexible circuit board 23 along the through-path direction, such as pulling it to the right along the x-direction in the figure, when the flexible circuit board assembly is assembled with the rotating shaft 10, the contact between the first abutment surface 221 and the first protrusion 113 can restrict the flexible circuit board assembly 20 from continuing to move to the right along the through-path direction. This allows for precise positioning of the snap-fit ​​component 21 and the first suction component 22 on the rotating shaft 10, avoiding damage caused by excessive pulling of the flexible circuit board 23. For example, during the pulling of the flexible circuit board 23, when the first protrusion 113 abuts against the first abutment surface 221, it ensures that the first snap-fit ​​part 212 snaps against the second snap-fit ​​part 111, and the first suction component 22 and the second suction component 12 are adsorbed and connected, avoiding problems such as excessive pulling of the flexible circuit board 23 or improper assembly.

[0209] For example, there may be at least two notch structures 214 on the snap-fit ​​member 21 (as shown in Figure 18), and the number of first bosses may correspond to the number of notch structures 214. At least two notch structures 214 may be distributed at both ends of the snap-fit ​​member 21 along the length direction (y direction), which can improve the consistency and strength of limiting the movement of the flexible circuit board 23 along the insertion direction during assembly, and further facilitate precise positioning and installation.

[0210] Figure 21 is a magnified cross-sectional view of the pivot assembly in section 20.

[0211] As shown in Figure 21, the first main body 211 has a limiting portion 213 on one side along the through-path direction, such as limiting portion 213a (and limiting portion 213d, as shown in Figure 18). The notch structure 214 can be located between the limiting portion 213a and the first engaging portion 212, which facilitates molding. If an extension portion is formed on the first main body 211 and the limiting portion 213a is formed by bending, a gap can be made between the extension portion and the first engaging portion 212 at the end. After the limiting portion 213a is formed, the notch structure 214 can be formed between the limiting portion 213a and the first engaging portion 212. The molding method is simple and easy to implement, and it helps to reduce costs.

[0212] In addition, by having the first contact surface 221 of the first adsorption member 22 abut against the first boss 113, the impact on the snap fastener 21 during the assembly of the flexible circuit board assembly 20 can be reduced. When the width (width along the penetration direction) of the first adhesive layer 24 located between the snap fastener 21 and the flexible circuit board 23 is narrow, the bonding strength between the snap fastener 21 and the flexible circuit can also be guaranteed.

[0213] For example, as shown in FIG15, the width of the first adhesive layer 24 located between the snap-fit ​​member 21 and the flexible circuit board 23 may be smaller than the width of the second adhesive layer 25 between the first adsorption member 22 and the flexible circuit board 23.

[0214] Taking a foldable device with an outward-folding screen as an example, the flexible screen is located on the outer surface of the hinge assembly. The outer surface of the hinge assembly is on the same plane as the outer surface of the hinge (as shown in Figure 15, the outer surface of hinge 10), and the inner surface of the hinge assembly is on the same plane as the inner surface of the hinge (as shown in Figure 15, the inner surface of hinge 10). In the structure where the first main body 211 of the latching member 21, a portion of the flexible circuit board 23, and the second adsorption member 12 are stacked sequentially, the latching member 21 is closer to the inner surface of the hinge 10, and the second adsorption member 12 is closer to the outer surface of the hinge 10. That is, in the thickness direction (as shown in Figure 15, the z-direction), the flexible screen is located on the side of the second adsorption member 12 facing away from the latching member 21.

[0215] The first surface 23a of the flexible circuit board 23 is closer to the inner surface of the rotating shaft 10, and the second surface 23b of the flexible circuit board 23 is closer to the outer surface of the rotating shaft 10. When the first middle frame 102a and the second middle frame 102b rotate (see Figure 15), the rotation of the two middle frames will cause the flexible circuit board 23 to bend. When the electronic device is in a folded state, the portion of the first surface 23a of the flexible circuit board 23 located inside the first middle frame 102a and the portion located inside the second middle frame 102b are opposite to each other, and the portion of the second surface 23b of the flexible circuit board 23 located inside the first middle frame 102a and the portion located inside the second middle frame 102b are opposite to each other.

[0216] By making the width of the first adhesive layer 24 between the snap-fit ​​member 21 and the first surface 23a smaller than the width of the second adhesive layer 25 between the first adsorption member 22 and the second surface 23b, the width of the first adhesive layer 24 is narrower, and the first adhesive layer 24 exerts less constraint on the first surface 23a in the width direction. This can reduce or avoid the influence of the first adhesive layer 24 on the bending of the flexible circuit board 23, allowing the flexible circuit board 23 to bend better.

[0217] Figure 22 is a magnified cross-sectional view of another rotating shaft assembly provided in an embodiment of this application.

[0218] In other embodiments, the limiting portion 213 may abut against the first boss. For example, referring to FIG22, the first main body portion 211 has a limiting portion 213, such as limiting portion 213a, on one side along the through-path direction. The side of the limiting portion 213a facing away from the receiving space may form a second abutment surface 2131. A second boss 114 may also be provided in the through hole of the rotating shaft 10. The second boss 114 is located on one side of the through hole along the through-path direction. The second abutment surface 2131 on the limiting portion 213 abuts against the second boss 114, which may also limit the displacement of the flexible circuit board 23 along the through-path direction.

[0219] Correspondingly, when assembling the flexible circuit board assembly 20 and the rotating shaft 10, the insertion direction of the flexible circuit board 23 can also be from the second abutment surface 2131 to the second protrusion 114. When the flexible circuit board 23 is pulled along the insertion direction to achieve assembly, the abutment between the second abutment surface 2131 and the second protrusion 114 can also limit the flexible circuit board assembly 20 from continuing to move relative to the rotating shaft 10, avoiding excessive pulling of the flexible circuit board 23 and causing damage.

[0220] For example, the number of the second boss 114 and the limiting part 213 that abuts against the second boss 114 can also be at least two. For example, the limiting part 213 located on one side of the first main body 211 along the through direction and located at opposite ends of the first main body 211 along the length direction (as shown in Figure 20, the limiting part 213a and the limiting part 213d) can abut against the first boss 113 respectively, which can further improve the limiting strength of the flexible circuit board 23 and ensure accurate positioning and installation.

[0221] It should be noted that in some other examples, a notch structure (such as notch structure 214 in Figure 19) can be formed at one end of the snap-fit ​​member along the length direction to expose the first abutment surface of the first adsorption member at that end, and a second abutment surface is provided on the limiting portion (such as limiting portion 213a in Figure 22) at the other end of the snap-fit ​​member along the length direction. A first boss and a second boss can be provided in the through hole of the rotating shaft, and the first boss and the second boss can be distributed at intervals along the length direction. The first abutment surface exposed by the notch structure at one end of the snap-fit ​​member can abut against the first boss, and the second abutment surface of the limiting portion at the other end of the snap-fit ​​member can abut against the second boss. This can also restrict the movement of the flexible circuit board assembly along the insertion direction, and achieve precise positioning and installation.

[0222] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0223] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A flexible circuit board assembly for engaging with the hinge of a foldable electronic device, characterized in that, include: A flexible circuit board, wherein the flexible circuit board is used to pass through the through hole of the rotating shaft and is inserted into the rotating shaft in a direction that intersects the thickness direction and the length direction of the rotating shaft, respectively. A first adsorption element is disposed on the flexible circuit board. One end of the first adsorption element facing away from the flexible circuit board along the thickness direction of the rotating shaft is used to adsorb and connect with a second adsorption element inside the rotating shaft. A snap-fit ​​component is disposed on the flexible circuit board and is used to be inserted into the through hole along the through-hole and to engage with the rotating shaft.

2. The flexible circuit board assembly according to claim 1, characterized in that, The flexible circuit board includes a first surface and a second surface that are opposite to each other in the thickness direction; At least a portion of the snap-fit ​​member and the first adsorption member are located on the first surface and the second surface, respectively. At least a portion of the snap-fit ​​member, a portion of the flexible circuit board, and the first adsorption member are stacked sequentially in the thickness direction. The end of the first adsorption member facing away from the flexible circuit board is used to abut against the second adsorption member. The end of at least a portion of the snap-fit ​​member facing away from the flexible circuit board is used to abut against the inner wall of the through hole opposite to the second adsorption member in the thickness direction.

3. The flexible circuit board assembly according to claim 2, characterized in that, The snap-fit ​​component includes a first main body and at least two limiting parts, wherein the first main body is fitted and fixed to the first surface; At least two of the limiting portions are located on opposite sides of the first main body along the penetration direction. The limiting portions protrude from the side of the first main body facing the first adsorption member. The limiting portions and the first main body form an accommodating space, and the first adsorption member is located within the accommodating space.

4. The flexible circuit board assembly according to claim 3, characterized in that, At least two of the limiting portions are respectively distributed on opposite ends of the first main body portion along the length direction; There is a clearance gap between the limiting portions distributed at opposite ends of the snap-fit ​​member along the length direction, and part of the flexible circuit board is located within the clearance gap.

5. The flexible circuit board assembly according to claim 3 or 4, characterized in that, The snap-fit ​​component further includes a first snap-fit ​​portion; The first main body is provided with first snap-fit ​​portions at opposite ends along the length direction, and the first snap-fit ​​portions are used to snap-fit ​​with the second snap-fit ​​portions in the through hole.

6. The flexible circuit board assembly according to claim 5, characterized in that, The first snap-fit ​​protrusion is disposed on the side of the first main body facing the first adsorption member, and the first snap-fit ​​part, the limiting part, and the first main body together form the receiving space.

7. The flexible circuit board assembly according to claim 5 or 6, characterized in that, The first and second locking parts are engaged by elastic protrusions and grooves.

8. The flexible circuit board assembly according to claim 7, characterized in that, The first snap-fit ​​portion includes a connecting arm and a snap-fit ​​arm, wherein the connecting arm is connected to the first main body portion; The snap-fit ​​arm has connecting arms on both sides along the insertion direction, and the two ends of the snap-fit ​​arm are respectively connected to the connecting arms. The middle part of the snap-fit ​​arm protrudes away from the receiving space to form the elastic protrusion.

9. The flexible circuit board assembly according to any one of claims 5-8, characterized in that, The first adsorption element has a first contact surface on one side along the penetration direction; The snap-fit ​​component further includes a notch structure located on one side of the first main body along the through-path direction. The first abutting surface is exposed through the notch structure. The notch structure is used to accommodate a portion of the first boss inside the through hole, and the first abutting surface is used to abut and engage with the first boss.

10. The flexible circuit board assembly according to claim 9, characterized in that, The notch structure is provided between the first snap-fit ​​portion and the limiting portion located on one side of the first main body portion along the through-path direction.

11. The flexible circuit board assembly according to any one of claims 3-10, characterized in that, The side of the limiting portion located on the side of the first main body along the through-hole facing away from the receiving space forms a second abutment surface, which is used to abut and cooperate with the first boss in the through hole.

12. The flexible circuit board assembly according to claim 9 or 10, characterized in that, It also includes a first adhesive layer, which is located between the first main body and the first surface, and the snap-fit ​​member and the flexible circuit board are fixed by the first adhesive layer; The flexible circuit board further includes a second adhesive layer, which is located between the flexible circuit board and the first adsorption member, and the first adsorption member and the flexible circuit board are fixed by the second adhesive layer; The width of the first adhesive layer along the penetration direction is smaller than the width of the second adhesive layer along the penetration direction.

13. The flexible circuit board assembly according to any one of claims 3-12, characterized in that, The flexible circuit board includes a second main body and an extension, the extension being located on both sides of the second main body along the length direction, and the extension and a portion of the second main body being located within the receiving space.

14. The flexible circuit board assembly according to claim 13, characterized in that, The first main body has a first positioning hole at each end along the length direction, the extension has a second positioning hole at each end, and the first adsorption member has a third positioning hole at each end along the length direction. The center lines of the first positioning hole, the second positioning hole and the third positioning hole coincide in the thickness direction.

15. The flexible circuit board assembly according to claim 14, characterized in that, The diameter of the first positioning hole is equal to the diameter of the third positioning hole, and the diameter of the second positioning hole is larger than the diameters of the first positioning hole and the second positioning hole, respectively.

16. A rotating shaft assembly, characterized in that, It includes at least a rotating shaft and a flexible circuit board assembly as described in any one of claims 1-15, wherein the rotating shaft has a through hole and a second adsorption element is disposed inside the rotating shaft; The flexible circuit board is inserted through the through hole onto the rotating shaft. The first adsorption member is adsorbed and connected to the second adsorption member at one end facing away from the flexible circuit board along the thickness direction of the rotating shaft. The snap-fit ​​member is inserted into the through hole along the insertion direction of the flexible circuit board and snaps into the rotating shaft.

17. The shaft assembly according to claim 16, characterized in that, The second adsorption element is located on the inner wall of the through hole along the thickness direction; The second adsorption member, the first adsorption member, a portion of the flexible circuit board, and at least a portion of the snap-fit ​​member are stacked sequentially in the thickness direction, and at least a portion of the snap-fit ​​member abuts against the inner wall of the through hole opposite to the second adsorption member in the thickness direction.

18. The shaft assembly according to claim 17, characterized in that, The through hole has two inner sidewalls opposite each other along the length direction, and the second snap-fit ​​portion is engaged with the first snap-fit ​​portion of the snap-fit ​​member through elastic protrusions and grooves.

19. The rotating shaft assembly according to any one of claims 16-18, characterized in that, An installation groove is provided on the inner wall of the through hole, and the second adsorption element is disposed in the installation groove.

20. The rotating shaft assembly according to any one of claims 16-19, characterized in that, The through hole has a raised first boss, which is located on one side of the through hole along the through direction; The first protrusion extends into the notch structure on the snap-fit ​​member, and the first protrusion abuts against the first contact surface on the first adsorption member.

21. The rotating shaft assembly according to any one of claims 16-20, characterized in that, The through hole has a raised second boss, which is located on one side of the through hole along the through-hole direction; The second protrusion abuts against the second abutting surface on the limiting part of the snap-fit ​​member.

22. A foldable electronic device, characterized in that, It includes at least two middle frames and a pivot assembly as described in any one of claims 16-21, wherein the two middle frames are respectively located on both sides of the pivot assembly, and the two middle frames are rotatably engaged by the pivot assembly.

23. The foldable electronic device according to claim 22, characterized in that, It also includes a flexible screen, which is disposed on the pivot assembly and the middle frame; The flexible screen is located at least on the outer surfaces of the mid-frame and the hinge assembly. When the electronic device is in a folded state, the outer surfaces of the two mid-frames are opposite to each other, and the outer surface of the hinge assembly is located on the same side of the electronic device as the outer surface of the mid-frame.

24. The foldable electronic device according to claim 23, characterized in that, In the thickness direction, the flexible screen is located on the side of the second adsorption member that faces away from the snap-fit ​​member.

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