Computing device and data center

Abstract

The present application provides a computing device and a data center. The computing device comprises: a box body, an accommodating cavity being defined therein, and the accommodating cavity being used for accommodating a computing module; and a power supply module, isolated from the computing module by means of the box, body and used for supplying power to the computing module. A first side wall of the box body is attached to a second side wall of a housing of the power supply module; the first side wall is provided with a first clearance opening, and the second side wall is provided with a second clearance opening, the first clearance opening being correspondingly in communication with the second clearance opening so as to allow a conductive member to pass through, and the computing module being electrically connected to the power supply module by means of the conductive member. On the basis of the technology of the present application, the cooling effect on the computing module is improved, and it is also advantageous for reducing the size of the box body and reducing the weight of the box body, thereby improving the processing convenience of the computing device, and saving manufacturing costs for the box body.

Description

Computing equipment and data centers

[0001] This application claims priority to Chinese Patent Application No. 202410502216.1, filed on April 24, 2024, entitled "Computing Device and Data Center", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of computing product technology, and more particularly to a computing device and a data center. Background Technology

[0003] With technological advancements, computing devices employing multiple dedicated chips arranged in series or parallel on a computing board are becoming increasingly widespread, encompassing fields such as blockchain and AI (Artificial Intelligence). However, the increased number of chips leads to higher overall power consumption, and chip heat dissipation directly impacts chip performance and lifespan, making machine cooling increasingly crucial. In related technologies, computing devices utilizing immersion liquid cooling for the computing board typically house the power module and computing board within the device's enclosure. The power module's space occupancy within the enclosure results in uneven distribution of the cooling medium, thus affecting the computing board's heat dissipation capabilities. Summary of the Invention

[0004] This application provides a computing device and a data center to solve or alleviate one or more technical problems in the prior art.

[0005] As one aspect of the embodiments of this application, this application provides a computing device, including: a housing with an internally defined receiving cavity for accommodating a computing module; a power module isolated from the computing module by the housing for supplying power to the computing module; a first side wall of the housing being fitted to a second side wall of the power module housing; the first side wall having a first clearance opening and the second side wall having a second clearance opening, the first clearance opening and the second clearance opening being correspondingly connected to allow conductive components to pass through, and the computing module and the power module being electrically connected through the conductive components.

[0006] In one embodiment, the top of the enclosure and the top of the power module are coplanar; the computing device further includes a top cover, with the top of the enclosure and the top of the power module respectively connected to the top cover.

[0007] In one embodiment, the receiving cavity is also used to receive a control circuit board, which is connected to the top cover and received within the receiving cavity.

[0008] In one embodiment, the top cover includes a first region and a second region, the first region covering the top of the housing and the second region covering the top of the power module; wherein the first region and / or the second region are provided with a plurality of through holes.

[0009] In one embodiment, the power module is detachably connected to the first sidewall.

[0010] In one embodiment, the first sidewall and / or the second sidewall are provided with at least one weight-reducing through hole.

[0011] In one embodiment, the first clearance opening is formed by a downward recess of the top edge of the first sidewall; and / or, the second clearance opening is formed by a downward recess of the top edge of the second sidewall.

[0012] In one embodiment, the computing module includes at least one computing circuit board, which is vertically disposed within a receiving cavity.

[0013] In one embodiment, the cavity also houses a control circuit board, the plane of which the control circuit board is perpendicular to the plane of the computing circuit board.

[0014] In one embodiment, the computing circuit board is provided with a clearance groove, which is formed by a downward indentation of the top edge of the computing circuit board and penetrates the computing circuit board in the thickness direction; wherein, the control circuit board passes through the clearance groove of at least one computing circuit board.

[0015] In one embodiment, the two opposite sidewalls of the housing in the first direction are respectively provided with limiting grooves, and the two opposite side edges of the computing circuit board in the first direction are respectively locked in the corresponding limiting grooves.

[0016] In one embodiment, the bottom of the housing is connected to a bottom support plate, the bottom support plate is provided with at least one support rib, the support rib extends along a second direction and has at least one support groove, the at least one support groove corresponds to at least one computing circuit board, so that the lower edge of the computing circuit board is engaged in the corresponding support groove; wherein, the second direction is perpendicular to the first direction.

[0017] In one embodiment, there are multiple support ribs spaced apart in a first direction, each support rib is provided with multiple support grooves, and the multiple support grooves are spaced apart in a second direction and correspond one-to-one with multiple computing circuit boards.

[0018] In one embodiment, the bottom support plate is provided with a hollow area connecting the receiving cavity and the outside, the hollow area being used to allow the cooling working fluid to enter the receiving cavity to cool the computing module.

[0019] In one embodiment, the computing module further includes at least one heat sink module, and the at least one heat sink module is configured to correspond one-to-one with at least one computing circuit board.

[0020] In one embodiment, the bottom of the heat sink fin module is spaced apart from the upper surface of the bottom support plate.

[0021] As another aspect of the embodiments of this application, the embodiments of this application provide a data center, including the computing device of any of the above embodiments of this application.

[0022] According to the computing device of this application embodiment, by placing the power module on the outside of the enclosure, the power module and the computing module can be isolated by the enclosure, thus avoiding the power module occupying space in the internal cavity of the enclosure. This allows at least one computing circuit board included in the computing module to be evenly distributed within the cavity. This improves the uniformity of the cooling fluid flow relative to the computing module within the enclosure, thereby enhancing the cooling effect on the computing module. Furthermore, since the power module does not need to be housed inside the enclosure, it is beneficial to reduce the size and weight of the enclosure, thereby improving the ease of processing and saving manufacturing costs.

[0023] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0024] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0025] Figure 1 shows a schematic diagram of the structure of a computing device according to an embodiment of this application;

[0026] Figure 2 shows an exploded view of a computing device according to an embodiment of this application;

[0027] Figure 3 shows a top view of a computing device according to an embodiment of this application;

[0028] Figure 4 shows a partial structural schematic diagram of a computing device according to an embodiment of this application;

[0029] Figure 5 shows a structural schematic diagram of the housing of the computing device according to an embodiment of this application from one perspective;

[0030] Figure 6 shows a structural schematic diagram of the housing of the computing device according to an embodiment of this application from another perspective;

[0031] Figure 7 shows a schematic diagram of the structure of the bottom support plate of the computing device according to an embodiment of this application;

[0032] Figure 8 shows a schematic diagram of the cooperation between the computing circuit board and the bottom support plate of the computing device according to an embodiment of this application;

[0033] Figure 9 shows a schematic diagram of the assembly of the heat sink fin module and the bottom support plate of the computing device according to an embodiment of this application.

[0034] Explanation of reference numerals in the attached drawings: Computing device 1; Housing 10; Receiving cavity 10a; First side wall 11; Assembly hole 11a; Weight reduction through hole 11b; First clearance opening 12; Limiting groove 13; Power module 20; Housing 20a; Conductive component 21; Second side wall 20b; Second clearance opening 22; Computing module 30; Operation circuit board 31; Clearance groove 31a; Heat dissipation fin module 32; Top cover 40; First area 40a; Second area 40b; First heat dissipation through hole 41; Second heat dissipation through hole 42; Operation through hole 43; Connecting plate 44; Handle 45; Connecting through hole 46; Control circuit board 50; Bottom support plate 60; Hollowed-out area 60a; Support rib 61; Support groove 61a. Detailed Implementation

[0035] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0036] Figure 1 shows a structural schematic diagram of the computing device 1 according to an embodiment of this application, and Figure 2 shows an exploded schematic diagram of the computing device 1 according to an embodiment of this application. As shown in Figures 1 and 2, the computing device 1 according to an embodiment of this application includes a housing 10 and a power module 20. The housing 10 defines a receiving cavity 10a for accommodating the computing module 30. The power module 20 and the computing module 30 are isolated by the housing 10, and the power module 20 supplies power to the computing module 30. The first sidewall 11 of the housing 10 is fitted to the second sidewall 20b of the housing 20a of the power module 20. The first sidewall 11 is provided with a first clearance opening 12, and the second sidewall 20b is provided with a second clearance opening 22. The first clearance opening 12 and the second clearance opening 22 are correspondingly connected to allow a conductive element 21 to pass through. The computing module 30 and the power module 20 are electrically connected through the conductive element 21.

[0037] In this embodiment, the computing device 1 can be applied to a data center, specifically for providing blockchain or AI computing services. The power module 20 is used to connect to an external power source and provide power support to the computing module 30.

[0038] In this embodiment, the computing module 30 may include at least one computing circuit board 31, and each computing circuit board 31 may integrate multiple chip units. This embodiment does not specifically limit the specific structure of the computing circuit board 31 or the arrangement of the chip units, and those skilled in the art can flexibly set them according to the actual situation.

[0039] For example, the power module 20 can be disposed on the outside of the housing 10, that is, the power module 20 is disposed outside the housing cavity 10a, so that the power module 20 and the computing module 30 are isolated by the housing 10.

[0040] In this embodiment, the housing 10 is in contact with the housing 20a of the power module 20, and the first side wall 11 of the housing 10 is attached to the second side wall 20b of the housing 20a. The first side wall 11 of the housing 10 and the second side wall 20b of the housing 20a can be directly connected or indirectly connected through other components.

[0041] In some examples, the power module 20 can be directly connected to the outer wall of the housing 10 via fasteners, such as screws. In other examples, the power module 20 and the housing 10 can be connected together to the top cover 40 to achieve an indirect connection between them.

[0042] In this embodiment, the specific positions of the first clearance opening 12 on the first side wall 11 and the second clearance opening 22 on the second side wall 20b are not limited, as long as the positions of the first clearance opening 12 and the second clearance opening 22 correspond to each other so that they are connected. For example, the first clearance opening 12 can be located near the top of the housing 10, and the second clearance opening 22 can also be located near the top of the housing 10a. Furthermore, the shape and size of the first clearance opening 12 and the second clearance opening 22 are not specifically limited, as long as the conductive component 21 can pass through both the first clearance opening 12 and the second clearance opening 22 simultaneously.

[0043] It should be noted that by providing a first clearance opening 12 on the first side wall 11 and a second clearance opening 22 on the second side wall 20b, and by connecting the first clearance opening 12 and the second clearance opening 22, the conductive component 21 can pass through the housing 10 and the shell 20a through the first clearance opening 12 and the second clearance opening 22, thereby enabling the two ends of the conductive component 21 to be electrically connected to the power module 20 and the computing module 30 respectively, so as to realize the power module 20 to supply power to the computing module 30.

[0044] In this embodiment, the computing device 1 can cool the computing module 30 using immersion cooling. Immersion liquid cooling refers to directly immersing the computing module 30 in a cooling medium with electrical insulating properties, so that the heat generated by the computing module 30 during operation can be directly conducted to the cooling medium, thereby cooling the computing module 30. By using immersion liquid cooling, the heat generated by the computing module 30 can be directly and effectively transferred to the cooling medium. Compared with the air cooling or water cooling methods commonly used in related technologies, there is no need to set up thermal interface materials, heat sinks, fans, or other components, which significantly improves the cooling efficiency of the computing module 30 and is also beneficial to energy conservation and environmental protection. In order to ensure that the computing module 30 immersed in the cooling medium can work normally, the cooling medium must have insulating properties and a certain degree of corrosion resistance to avoid damaging the encapsulation of the computing module 30. The cooling medium must also meet the conditions of being non-flammable, non-toxic, and easy to clean.

[0045] In some alternative examples, the coolant can be an electronic fluorinated fluid, i.e. a coolant containing fluorides, which can effectively improve the thermal conductivity, corrosion resistance and lower the freezing point of the coolant.

[0046] In other alternative examples, cooling oil can also be used as the working fluid. For instance, GTL (Gas to Liquid) base oil can be used. GTL base oil is a base oil synthesized from hydrocarbons. It has a high saturated hydrocarbon content, is virtually free of nitrogen and sulfur, contains no aromatics, is 100% isoalkanes, exhibits excellent oxidation stability and low-temperature performance, has low volatility, and an extremely high viscosity index. Therefore, using GTL base oil as the cooling fluid can improve the stability of the cooling fluid at low temperatures, thereby enhancing the reliability of the cooling system. Another example is transformer oil. Transformer oil is a fractionation product of petroleum, and its main components are alkanes, cycloalkanes, and aromatic unsaturated hydrocarbons. Commonly known as transformer oil, it is a light yellow, transparent liquid with a relative density of 0.895 and a freezing point <-45℃. Transformer oil is a mineral oil obtained from natural petroleum through distillation and refining. It is a mixture of pure, stable, low-viscosity, highly insulating, and cooling liquid natural hydrocarbons obtained by acid and alkali refining of lubricating oil fractions from petroleum. By using transformer oil as a coolant, the stability of the coolant at low temperatures can be improved, and it also possesses good insulation properties, thereby enhancing the reliability of computing equipment during operation.

[0047] Furthermore, in some alternative examples, the computing module can be waterproof, in which case the cooling medium can also be water. For example, the computing module can be fitted with a waterproof housing on the outside of the computing circuit board, and the heat generated by the computing circuit board is conducted to the cooling medium through the housing to cool the computing circuit board.

[0048] The above are merely examples, and this application does not limit the specific material of the cooling medium. Exemplarily, the bottom of the housing 10 may be provided with an opening connecting the receiving cavity 10a and the outside. The opening is used to allow the cooling medium to enter the receiving cavity 10a, so that the cooling medium can immerse the computing module 30 and exchange heat with the computing module 30, thereby achieving the purpose of cooling the computing module 30.

[0049] According to the computing device 1 of this application embodiment, by placing the power module 20 on the outside of the housing 10, the power module 20 and the computing module 30 can be isolated by the housing 10, thereby avoiding the power module 20 occupying space in the internal cavity 10a of the housing 10. This allows at least one computing circuit board 31 included in the computing module 30 to be evenly distributed within the cavity 10a. This improves the uniformity of the cooling medium's flow relative to the computing module 30 within the housing 10, thus enhancing the cooling effect on the computing module 30. Furthermore, since the housing 10 does not need to house the power module 20, it is beneficial to reduce the size and weight of the housing 10, thereby improving the ease of processing the housing 10 and saving manufacturing costs. Secondly, by providing a first clearance opening 12 on the first side wall 11 of the housing 10 and a second clearance opening 22 on the second side wall 20b of the housing 20a, and by providing corresponding communication between the first clearance opening 12 and the second clearance opening 22, conductive components can pass through and be electrically connected to the power module 20 and the computing module 30 respectively, thereby realizing electrical conduction between the power module 20 and the computing module 30, and thus enabling the power module 20 to supply power to the computing module 30. This reduces the difficulty of electrical connection between the power module 20 and the computing module 30 and improves assembly convenience.

[0050] In one embodiment, the top of the housing 10 is coplanar with the top of the power module 20. The computing device 1 also includes a top cover 40, to which the top of the housing 10 and the top of the power module 20 are respectively connected.

[0051] In this embodiment, the top and bottom of the housing 10 refer to the two ends of the housing 10 in the vertical direction; similarly, the top and bottom of the computing module 30 refer to the two ends of the computing module 30 in the vertical direction. Exemplarily, the computing device 1 of this embodiment can be placed vertically during use.

[0052] In some examples, the top height of the enclosure 10 is approximately the same as the top height of the power module 20, and the top surface of the enclosure 10 and the top surface of the power module 20 are substantially coplanar. The top cover 40 has a plurality of spaced-apart connecting holes 46 near its edge for fasteners such as screws to pass through. These fasteners are adapted to connect to the top of the enclosure 10 and the top of the power module 20, thereby enabling a detachable connection between the top cover 40 and the enclosure 10 and the power module 20.

[0053] In other examples, the top cover 40 can be detachably connected to the top of the housing 10 and the top of the power module 20 via a snap-fit ​​structure. For example, the edge of the top cover 40 may be provided with multiple snap-fits that are movably connected, and the top of the housing 10 and the top of the power module 20 may be provided with protrusions that engage with the snap-fits. The detachable connection between the top cover 40 and the housing 10 and the power module 20 is achieved through the engagement of the snap-fits and the protrusions.

[0054] Through the above implementation method, the enclosure 10 and the power module 20 can be detachably connected through the top cover plate 40, which improves the connection stability and reliability between the two, and helps to reduce the assembly difficulty of the enclosure 10 and the power module 20 and improve the assembly efficiency.

[0055] Figure 3 shows a top view of the computing device 1 according to an embodiment of the present application. As shown in Figure 3, in one embodiment, the top cover 40 includes a first region 40a and a second region 40b. The first region 40a covers the top of the housing 10, and the second region 40b covers the top of the power module 20. The first region 40a and / or the second region 40b are provided with a plurality of through holes.

[0056] For example, the first region 40a and the second region 40b are arranged adjacent to each other. Specifically, the first region 40a may be the region corresponding to the orthographic projection of the housing 10 on the top cover 40, and the second region 40b may be the region corresponding to the orthographic projection of the power module 20 on the top cover 40.

[0057] In some examples, the multiple through holes include multiple first heat dissipation through holes 41 disposed in the first region 40a, and the multiple first heat dissipation through holes are arranged in an array in the first region 40a. This arrangement allows the receiving cavity 10a to communicate with the outside through the multiple first heat dissipation through holes 41, thereby facilitating the dissipation of heat generated by the computing module 30 within the receiving cavity 10a through the multiple first heat dissipation through holes 41, further improving the cooling effect on the computing module 30. Furthermore, the multiple first heat dissipation through holes 41 also help reduce the weight of the top cover plate 40, thereby reducing the overall weight of the computing device 1.

[0058] In other examples, multiple through holes and multiple second heat dissipation through holes 42 are disposed in the second region 40b, and the multiple second heat dissipation through holes 42 are evenly distributed in the two regions. This arrangement allows the interior of the power module 20 to communicate with the outside through the multiple second heat dissipation through holes 42, thereby facilitating the dissipation of heat from the power module 20 and improving the cooling effect. Furthermore, the multiple second heat dissipation through holes 42 also help to further reduce the weight of the top cover 40, thereby further reducing the overall weight of the computing device 1.

[0059] It should be noted that the embodiments of this application do not specifically limit the shape and size of the first heat dissipation through hole 41 and the second heat dissipation through hole 42, and those skilled in the art can flexibly set them according to actual needs. For example, the shape of the first heat dissipation through hole 41 can be rectangular, and the shape of the second heat dissipation through hole 42 can be circular or elliptical.

[0060] In addition, in some other examples, the multiple through holes may also include operation through holes 43 disposed in the second region 40b, the operation through holes 43 being disposed corresponding to the positions of the switching units and / or interfaces of the power module 20, so as to expose the switching units and / or interfaces of the power module 20 through the operation through holes 43, thereby facilitating related operations on the switching units and / or interfaces.

[0061] Referring again to FIG3, in some optional embodiments, a handle 45 is also provided on the upper surface of the top cover 40. There may be two handles 45 arranged opposite each other, and the handles 45 are movably connected to the upper surface of the top cover 40.

[0062] For example, the handle 45 is rotatably connected to the upper surface of the top cover 40, and the two handles 45 are spaced apart and arranged opposite each other in the length direction of the computing device 1.

[0063] With this setup, staff can hold the two handles with both hands to move the computing device 1, thereby improving the convenience of manual handling of the computing device 1 and facilitating its flexible deployment in data centers and other scenarios.

[0064] Figure 4 shows a partial structural schematic diagram of the computing device 1 according to an embodiment of this application. As shown in Figure 4, in one embodiment, the receiving cavity 10a is also used to receive a control circuit board 50, which is connected to the top cover plate 40 and received in the receiving cavity 10a. In this embodiment, the control circuit board 50 is communicatively connected to the computing module 30 and is used to provide control functions such as communication and power supply to the computing module 30.

[0065] For example, the control circuit board 50 can be vertically arranged within the receiving cavity 10a, meaning the plane containing the control circuit board 50 is parallel to the vertical direction. A connecting plate 44 (as shown in Figure 2) is provided near the lower edge of the top cover 40, and the plane containing the connecting plate 44 is perpendicular to the plane containing the top cover 40. The control circuit board 50 can be fixedly connected to the connecting plate 44 using screws or other fasteners to achieve the connection between the control circuit board 50 and the top cover 40.

[0066] Through the above-described embodiment, the control circuit board 50 can be first fixedly connected to the top cover plate 40, and then the control circuit board 50 can be accommodated in the receiving cavity 10a through the connection between the top cover plate 40 and the top of the housing 10. Therefore, compared with directly connecting the control circuit board 50 to the inside of the housing 10, this embodiment can improve the connection convenience of the control circuit board 50, thereby reducing the assembly difficulty of the computing device 1.

[0067] As shown in Figures 2 and 4, in one embodiment, the computing module 30 includes at least one computing circuit board 31, which is vertically arranged within the receiving cavity 10a.

[0068] For example, the computing module 30 may include a plurality of spaced-apart computing circuit boards 31, and the planes on which the plurality of computing circuit boards 31 are located are arranged parallel to each other. The computing circuit boards 31 being vertically arranged within the receiving cavity 10a means that the planes on which the computing circuit boards 31 are located are parallel to the vertical direction.

[0069] It should be noted that the width and height dimensions of the housing 10 can be set accordingly with reference to the width and height dimensions of the computing circuit board 31. In this embodiment, the number and spacing of chip units on the computing circuit board 31 can be set according to the computing power and power consumption requirements, thereby adjusting the height dimension of the computing circuit board 31 accordingly. The height dimension of the housing 10 can be set according to the height dimension of the computing circuit board 31, so as not to change the cross-sectional shape and size of the housing 10, so that the housing 10 can be flexibly cut and shaped according to the height dimension of the computing circuit board 31.

[0070] Therefore, in the manufacturing process of the enclosure 10 of this application embodiment, the computing circuit board 31 of the corresponding height size can be matched according to the computing power requirements and power consumption requirements simply by adjusting the height size. This increases the applicability of the enclosure 10 while reducing the manufacturing difficulty of the enclosure 10.

[0071] In one embodiment, the receiving cavity 10a also houses a control circuit board 50, which is perpendicular to the plane containing the arithmetic circuit board 31. In some examples, both the arithmetic circuit board 31 and the control circuit board 50 are vertically housed in the receiving cavity 10a, and the plane containing the arithmetic circuit board 31 is perpendicular to the plane containing the control circuit board 50. The control circuit board 50 can be located on one side of multiple arithmetic circuit boards 31. This arrangement improves the space utilization of the receiving cavity 10a, thus allowing the control circuit board 50 and multiple arithmetic circuit boards 31 to be accommodated simultaneously without increasing the size of the housing 10.

[0072] In one embodiment, the computing circuit board 31 is provided with a clearance groove 31a, which is formed by a downward indentation from the top edge of the computing circuit board 31 and penetrates the computing circuit board 31 in the thickness direction; wherein, the control circuit board 50 passes through at least one clearance groove 31a of the computing circuit board 31.

[0073] For example, each computing circuit board 31 has a downwardly recessed clearance groove 31a on its top. The clearance grooves 31a of the multiple computing circuit boards 31 form a clearance space in the receiving cavity 10a. The control circuit board 50 is located in the clearance space so that the control circuit board 50 can be placed perpendicular to the multiple computing circuit boards 31 in the limited space of the receiving cavity 10a.

[0074] This design improves the space utilization of the cavity 10a, which helps to reduce the size of the housing 10 and thus reduce the space occupied by the computing device 1.

[0075] In one embodiment, the power module 20 is detachably connected to the first sidewall 11.

[0076] For example, the cross-sectional shape of the enclosure 10 can be generally rectangular. The enclosure 10 may include two sidewalls arranged opposite each other in a first direction and two sidewalls arranged opposite each other in a second direction. The first direction and the second direction are respectively perpendicular to the vertical direction, and the first direction and the second direction are perpendicular to each other. The power module 20 can be disposed on either side of the enclosure 10. The sidewall of the enclosure 10 that is in contact with the housing 20a of the power module 20 is the first sidewall 11, and the housing 20a and the first sidewall 11 are detachably connected.

[0077] Figure 5 shows a structural schematic diagram of the housing 10 of the computing device 1 according to an embodiment of this application from one perspective. As shown in Figure 5, in some examples, the side wall of the housing 10 adjacent to the power module 20 is a first side wall 11, and the power module 20 is adapted to be connected to the first side wall 11. The first side wall 11 is provided with a plurality of mounting holes 11a, and the power module 20 is detachably connected to the corresponding plurality of mounting holes 11a by a plurality of fasteners.

[0078] More specifically, multiple mounting holes 11a can be spaced apart near the edge of the first sidewall 11 and at the four corners to ensure that the multiple mounting holes 11a are evenly distributed, thereby improving the connection effect of the power module 20 on the first sidewall 11.

[0079] The above-described implementation method can further improve the connection stability between the power module 20 and the enclosure 10, and can achieve detachable connection through fasteners, etc., which reduces the assembly difficulty and facilitates disassembly of the two for inspection and maintenance.

[0080] In one embodiment, the first sidewall 11 and / or the second sidewall 20b are provided with at least one weight-reducing through hole 11b.

[0081] Referring again to Figure 5, in some examples, a plurality of weight-reducing through holes 11b are provided on the first sidewall 11. The plurality of weight-reducing through holes 11b can be arranged in an array on the first sidewall 11. For example, the plurality of weight-reducing through holes 11b can be arranged in multiple rows in the horizontal direction, with each row including a plurality of weight-reducing through holes 11b spaced equally apart in the vertical direction. The second sidewall 20b, which is in contact with the first sidewall 11, can shield the weight-reducing through holes 11b on the first sidewall 11, thereby preventing the cooling medium in the receiving cavity 10a from leaking through the weight-reducing through holes 11b.

[0082] In other examples, the second sidewall 20b may have multiple weight-reducing through holes. The first sidewall 11, which is in contact with the second sidewall 20b, can block the multiple weight-reducing through holes.

[0083] In some other examples, at least one weight-reducing through-hole is provided on the first sidewall 11 and the second sidewall 20b, respectively. The weight-reducing through-holes on the first sidewall 11 and the second sidewall 20b are staggered, meaning there is no overlap between any weight-reducing through-hole on the first sidewall 11 and any weight-reducing through-hole on the second sidewall 20b. This allows the area on the second sidewall 20b without a weight-reducing through-hole to shield the weight-reducing through-hole on the first sidewall 11, thereby preventing the cooling medium in the receiving cavity 10a from leaking through the weight-reducing through-hole 11b.

[0084] In this embodiment, the size and shape of the weight-reducing through-hole 11b are not specifically limited, and those skilled in the art can flexibly set them according to the actual situation. For example, the shape of the weight-reducing through-hole 11b can be a rectangle as shown in the figure, or it can be any other shape such as a circle, ellipse, or triangle.

[0085] Through the above-described embodiments, the weight of the housing 10 can be further reduced, thereby further reducing the overall weight of the computing device 1. Furthermore, since the power module 20 is fitted into the first side wall 11 of the housing 10, the cooling medium within the cavity 10a will not leak through the weight-reduction through-hole 11b, thus ensuring the reliability of the immersion liquid cooling system.

[0086] In one embodiment, the first clearance opening 12 is formed by a downward recess of the top edge of the first sidewall 11; and / or, the second clearance opening 22 is formed by a downward recess of the top edge of the second sidewall 20b. Continuing to refer to FIG5, exemplarily, the first clearance opening 12 is formed by a downward recess of the top edge of the first sidewall 11, and the length direction of the first clearance opening 12 may be parallel to the extending direction of the top edge of the first sidewall 11. The conductive element 21 may specifically be a conductive copper busbar, and the number of conductive elements 21 is arranged in a one-to-one correspondence with at least one computing circuit board 31 included in the computing module 30. Each conductive element 21 passes through the first clearance opening 12 such that its two ends are located in the receiving cavity 10a of the housing 10 and inside the power module 20, respectively, thereby realizing the electrical connection between the power module 20 and the computing circuit board 31. Furthermore, multiple conductive elements 21 may be arranged at intervals along the length direction of the first clearance opening 12 to avoid short circuits between conductive copper busbars. The second clearance opening 22 is formed by a downward indentation at the top edge of the second side wall 20b of the housing 20a, and the position of the second clearance opening 22 corresponds to the position of the first clearance opening 12 so that the two are connected.

[0087] Through the above implementation method, the power module 20 and the computing module 30 can be electrically connected, and the conductive component 21 can be cleverly set on the lower side of the top cover plate 40 to avoid the conductive component 21 being exposed, thereby improving the power distribution safety and also helping to improve the space utilization of the computing device 1.

[0088] Figure 6 shows a structural schematic diagram of the housing 10 of the computing device 1 according to an embodiment of the present application from another perspective. As shown in Figure 6, in one embodiment, the housing 10 is provided with limiting grooves 13 on two opposite side walls in the first direction, and the two opposite side edges of the computing circuit board 31 are respectively engaged in the corresponding limiting grooves 13.

[0089] In this embodiment of the application, the first direction may be parallel to the width direction or the length direction of the housing 10.

[0090] In some specific examples, the first direction is parallel to the length direction of the housing 10, and the power module 20 can be disposed on the outer surface of any side wall in the width direction of the housing 10. Two opposite side walls in the length direction of the housing 10 are respectively provided with limiting grooves 13, wherein the number of limiting grooves 13 on any side wall is the same as the number of computing circuit boards 31, and the limiting grooves 13 on the two side walls are correspondingly arranged in the length direction of the housing 10. In other words, the two opposite side walls of the housing 10 in length together form a set of limiting grooves 13 corresponding to the two side edges of at least one computing circuit board 31. The limiting grooves 13 can extend vertically so that the two side edges of the vertically arranged computing circuit board 31 can be respectively engaged in the corresponding limiting groove 13. During the assembly process of the computing module 30 and the housing 10, each computing circuit board 31 can be slid sequentially from the top of the housing 10 along the corresponding set of limiting grooves 13 into the receiving cavity 10a.

[0091] Through the above-described embodiments, the computing circuit board 31 can be effectively positioned, preventing it from shaking within the receiving cavity 10a and improving its stability. Therefore, during the transportation or use of the computing device 1, the computing circuit board 31 will not collide with the housing 1 due to shaking, thus protecting it and improving the reliability of the computing device 1 while reducing the failure rate.

[0092] Figure 7 shows a structural schematic diagram of the bottom support plate 60 of the computing device 1 according to an embodiment of this application, and Figure 8 shows a schematic diagram of the cooperation between the computing circuit board 31 and the bottom support plate 60 of the computing device 1 according to an embodiment of this application. As shown in Figures 7 and 8, in one embodiment, the bottom of the housing 10 is connected to the bottom support plate 60, and the bottom support plate 60 is provided with at least one support rib 61. The support rib 61 extends along a second direction and has at least one support groove 61a. The at least one support groove 61a corresponds one-to-one with at least one computing circuit board 31, so that the lower edge of the computing circuit board 31 is engaged in the corresponding support groove 61a. Wherein, the second direction is perpendicular to the first direction.

[0093] For example, the first direction may be parallel to the length direction of the box 10, and the second direction may be parallel to the width direction of the box 10.

[0094] In some specific examples, the bottom support plate 60 can be a frame structure, including two first side frames arranged opposite each other in a first direction and two second side frames arranged opposite each other in a second direction, with the four side frames connected sequentially to form the frame structure. Furthermore, the two first side frames are respectively arranged corresponding to the bottom edges of the two opposite side walls of the housing 10 in the first direction, and are fixedly connected to the bottom edges of the two opposite side walls of the housing 10 in the first direction by fasteners; the two second side frames are respectively arranged corresponding to the bottom edges of the two opposite side walls of the housing 10 in the second direction, and are fixedly connected to the bottom edges of the two opposite side walls of the housing 10 in the second direction by fasteners.

[0095] Multiple computing circuit boards 31 are spaced apart in the second direction, and the extension direction of the bottom edge of the computing circuit board 31 is parallel to the first direction. The length direction of the support groove 61a is parallel to the second direction, and the support groove 61a is centrally located in the bottom support plate 60 in the first direction. Each support rib 61 is provided with at least one support groove 61a, and the position of at least one support groove 61a corresponds to the position of at least one computing circuit board 31, so that the bottom edge of the computing circuit board 31 can be engaged in the corresponding support groove 61a.

[0096] In some specific examples, there are multiple support ribs 61 and they are spaced apart in the first direction. Each support rib 61 is provided with multiple support grooves 61a. The multiple support grooves 61a are spaced apart in the second direction and correspond one-to-one with multiple computing circuit boards 31. The bottom edge of each computing circuit board 31 is engaged in the corresponding support groove 61a on the multiple support ribs 61.

[0097] Through the above-described embodiments, the bottom support plate 60 can support the computing circuit board 31, further improving the stability of the computing circuit board 31 within the receiving cavity 10a. It can also effectively prevent deformation of the computing circuit board 31 during transportation or use, thereby providing a certain degree of protection for the computing circuit board 31 and improving the structural reliability of the computing circuit board 31.

[0098] It should be noted that in other examples of this application, the bottom support plate 60 may not be provided at the bottom of the housing 10 and the power module 20, and the bottom of the housing 20a of the housing 10 and the power module 20 may be open.

[0099] Referring to FIG7, in one embodiment, the bottom support plate 60 is provided with a hollow area 60a, which connects the receiving cavity 10a and the outside. The hollow area 60a is used to allow the cooling working fluid to enter the receiving cavity 10a to cool the computing module 30.

[0100] For example, the bottom of the housing 10 has an opening connecting the receiving cavity 10a to the outside, and a bottom support plate 60 is connected to the bottom of the housing 10 so that the receiving cavity 10a can further communicate with the outside through a cutout area 60a on the bottom support plate 60. The area of ​​the cutout area 60a can be set accordingly with reference to the size of the computing circuit board 31. For example, the area of ​​the cutout area 60a can be at least greater than the sum of the projected areas of multiple computing circuit boards 31 on the bottom support plate 60.

[0101] Through the above implementation method, the cooling medium can enter the interior of the receiving cavity 10a through the hollow area 60a, thereby increasing the amount of cooling medium entering the cavity and improving the cooling efficiency of the computing module 30.

[0102] Figure 9 shows a schematic diagram of the assembly of the heat sink fin module 32 and the bottom support plate 60 of the computing device 1 according to an embodiment of this application. As shown in Figure 9, in one embodiment, the computing module 30 further includes at least one heat sink fin module 32, and the at least one heat sink fin module 32 is correspondingly arranged with at least one computing circuit board 31. The bottom of the heat sink fin module 32 is spaced apart from the upper surface of the bottom support plate 60.

[0103] For example, the heat dissipation fin module 32 may include multiple fin structures, which are disposed on opposite sides of the computing circuit board 31 to conduct the heat generated by the computing circuit board 31 to the cooling medium, thereby improving the cooling effect of the computing circuit board 31.

[0104] This configuration avoids the bottom of the heat sink fins from touching the upper surface of the bottom support plate 60, allowing the cooling medium to flow between the bottom of the heat sink fin module 32 and the upper surface of the bottom support plate 60. This facilitates full contact between the cooling medium and the heat sink fin module 32 within the receiving cavity 10a, thereby improving heat dissipation uniformity.

[0105] This application also provides a data center, which includes the computing device 1 described in the above embodiments of this application. The data center may have multiple computing devices 1, which are integrated and deployed within the data center's storage space.

[0106] Other components of the data center in the above embodiments can be derived from various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0107] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0108] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0109] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0110] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0111] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0112] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A computing device, characterized in that, include: The housing has an internal cavity for accommodating the computing module. The power module and the computing module are isolated by the enclosure and are used to supply power to the computing module; The first sidewall of the enclosure is fitted to the second sidewall of the power module housing; the first sidewall is provided with a first clearance opening, and the second sidewall is provided with a second clearance opening, the first clearance opening and the second clearance opening are connected to each other to allow conductive components to pass through, and the computing module and the power module are electrically connected through the conductive components.

2. The computing device according to claim 1, characterized in that, The top of the enclosure is coplanar with the top of the power module; the computing device further includes: A top cover is provided, and the top of the housing and the top of the power module are respectively connected to the top cover.

3. The computing device according to claim 2, characterized in that, The cavity is also used to house a control circuit board, which is connected to the top cover and housed within the cavity.

4. The computing device according to claim 2, characterized in that, The top cover includes a first region and a second region, the first region covering the top of the housing and the second region covering the top of the power module; wherein the first region and / or the second region are provided with multiple through holes.

5. The computing device according to claim 1, characterized in that, The power module is detachably connected to the first sidewall.

6. The computing device according to claim 1, characterized in that, The first sidewall and / or the second sidewall are provided with at least one weight-reducing through hole.

7. The computing device according to claim 1, characterized in that, The first clearance opening is formed by a downward indentation of the top edge of the first sidewall; and / or, the second clearance opening is formed by a downward indentation of the top edge of the second sidewall.

8. The computing device according to claim 1, characterized in that, The computing module includes at least one computing circuit board, which is vertically arranged within the receiving cavity.

9. The computing device according to claim 8, characterized in that, The cavity also houses a control circuit board, and the plane containing the control circuit board is perpendicular to the plane containing the computing circuit board.

10. The computing device according to claim 9, characterized in that, The computing circuit board is provided with a clearance groove, which is formed by the downward indentation of the top edge of the computing circuit board and penetrates the computing circuit board in the thickness direction. The control circuit board is disposed in a clearance groove of at least one of the computing circuit boards.

11. The computing device according to claim 8, characterized in that, The housing is provided with limiting grooves on two opposite side walls in the first direction, and the computing circuit board is respectively engaged in the corresponding limiting grooves on two opposite side edges in the first direction.

12. The computing device according to claim 8, characterized in that, The bottom of the housing is connected to a bottom support plate, and the bottom support plate is provided with at least one support rib. The support rib extends along a second direction and has at least one support groove. The at least one support groove corresponds one-to-one with the at least one computing circuit board, so that the lower edge of the computing circuit board is engaged in the corresponding support groove; wherein, the second direction is perpendicular to the first direction.

13. The computing device according to claim 12, characterized in that, The support ribs are multiple and spaced apart in the first direction. Each support rib is provided with multiple support grooves. The multiple support grooves are spaced apart in the second direction and correspond one-to-one with the multiple computing circuit boards.

14. The computing device according to claim 12, characterized in that, The bottom support plate is provided with a hollow area that connects the receiving cavity and the outside. The hollow area is used to allow the cooling working fluid to enter the receiving cavity to cool the computing module.

15. The computing device according to claim 12, characterized in that, The computing module further includes at least one heat dissipation fin module, and the at least one heat dissipation fin module is configured in a one-to-one correspondence with the at least one computing circuit board.

16. The computing device according to claim 15, characterized in that, The bottom of the heat dissipation fin module is spaced apart from the upper surface of the bottom support plate.

17. A data center, characterized in that, Includes the computing device as described in any one of claims 1 to 16.

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