Active vibration cancellation system for semiconductor device and active vibration cancellation method

Abstract

The present invention provides an active vibration cancellation system for a semiconductor device and an active vibration cancellation method. The active vibration cancellation system is provided with a data acquisition apparatus, a control apparatus, and a vibration generation apparatus. The vibration generation apparatus can generate a vibration wave having an adaptive frequency, adaptive phase, and adaptive amplitude. On the basis of the interference principle of mechanical waves, the active vibration cancellation method is used to generate a counter-phase vibration wave so as to perform destructive interference on the original vibration wave to eliminate or partially eliminate the measured external vibration wave. In this way, in the process of producing a semiconductor, vibration waves generated by various production devices can be canceled or partially canceled by vibration waves generated by the vibration generation apparatus. Therefore, a glass-based IC substrate cannot be excited to generate resonance, thereby avoiding breakage of the glass-based IC substrate, and subsequent impacts on production panels or contamination of a manufacturing process.

Description

An active vibration cancellation system and method for semiconductor devices Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to an active vibration cancellation system and method for semiconductor devices. Background Technology

[0002] Every object has a specific natural frequency, determined by factors such as its material, shape, size, thickness, and supporting conditions. When an object is subjected to a periodic external force, it undergoes forced vibration. In forced vibration, the amplitude is at its maximum when the frequency of the external force equals the object's natural frequency, thus exciting the object to resonate.

[0003] Generally, mechanical waves generated by mechanical vibration sources are divided into transverse waves and longitudinal waves. Longitudinal waves can apply periodic external forces to objects through direct contact or air propagation, while transverse waves can also apply periodic external forces to objects through direct contact. The external force applied to the surface of an object causes it to vibrate. When the frequency of the applied vibration approaches or equals the natural frequency of the object, it will excite the object to resonate, causing the object to enter a resonant state. At this time, its amplitude will increase significantly, and the stress inside the object will also increase. When the stress exceeds the yield strength or fatigue limit of the object, it will cause the object to begin to undergo plastic deformation or microcrack propagation, resulting in damage to the object.

[0004] In the semiconductor industry, due to the continuous upgrading and changes in semiconductor manufacturing processes, the materials and equipment used are also constantly being upgraded and changed. For example, the introduction of new materials in the IC substrate manufacturing industry has brought new challenges to substrate manufacturers and corresponding equipment suppliers, such as the glass used in TGV production.

[0005] Due to the fragile nature of glass, vibrations generated by various production equipment during semiconductor manufacturing are applied to the glass IC substrate via the equipment or air, affecting its performance. When these vibrations cause the substrate's vibration frequency to match its natural frequency, resonance occurs, leading to breakage. The resulting fragments can render the entire production board unusable and also contaminate the entire manufacturing process. Summary of the Invention

[0006] To address the aforementioned technical problems, this application provides an active vibration cancellation system and method for semiconductor devices.

[0007] A first aspect of this application provides an active vibration cancellation system for semiconductor devices, comprising:

[0008] A data acquisition device for monitoring vibration and collecting vibration data;

[0009] A control device for receiving, analyzing and processing the vibration data, and outputting control commands;

[0010] A vibration generator used to receive control commands and generate anti-phase vibration waves.

[0011] In some embodiments of this application, the data acquisition device is installed on a preset production equipment and / or in a production environment.

[0012] In some embodiments of this application, the vibration generating device is disposed on a preset production equipment and / or in a production environment.

[0013] In some embodiments of this application, the layout diagram of the preset production environment is gridded to form a production environment layout coordinate diagram. A data acquisition device is set up according to the production environment layout coordinate diagram, and the data acquisition positions are numbered and marked on the production environment layout coordinate diagram.

[0014] In some embodiments of this application, the position of the vibration generating device is set according to the position of the data acquisition device, and the vibration generating positions are numbered and marked in the production environment layout coordinate diagram.

[0015] In some embodiments of this application, the data acquisition device is disposed on and / or around the carrier of the IC carrier board.

[0016] In some embodiments of this application, the vibration generating device is disposed on and / or around the support device of the IC carrier.

[0017] In some embodiments of this application, the data acquisition device is a vibration sensor array, which includes at least one vibration sensor.

[0018] In some embodiments of this application, the vibration generating device is a vibration generator array, which includes at least one vibration generator, wherein the vibration generator is at least one of a vibrating diaphragm, piezoelectric vibration, or ultrasonic vibration.

[0019] A second aspect of this application provides an active vibration cancellation method, comprising the following steps:

[0020] S1. The data acquisition device collects vibration data and transmits the collected vibration data to the control device;

[0021] S2. The control device receives vibration data sent by the data acquisition device, processes the vibration data, generates control commands, and sends the control commands to the vibration generating device.

[0022] S3. The vibration generating device receives the control command issued by the control device and generates an anti-phase vibration wave that is opposite to the vibration data.

[0023] In some embodiments of this application, the process of vibration data by the control device in step S2 includes the following steps:

[0024] The vibration data transmitted by each vibration sensor is analyzed to obtain vibration data that is harmful to the IC carrier board.

[0025] Based on vibration data that is harmful to the IC substrate, determine the vibration parameters of the anti-phase vibration waves that each vibration generator needs to produce.

[0026] In some embodiments of this application, the process of obtaining vibration data that is harmful to the IC carrier board is as follows:

[0027] Model the carrier device of the IC substrate and other devices equipped with vibration sensors and vibration generators, and label the position coordinates and numbers of each vibration sensor and vibration generator;

[0028] The vibration data collected by each vibration sensor is mapped to the model of each device to obtain vibration data such as vibration frequency and vibration amplitude of each device;

[0029] Vibration data of the IC carrier board is obtained based on the vibration data of the bearing device;

[0030] Experimental modal analysis or finite element analysis is performed on the IC substrate to obtain its natural frequencies;

[0031] The vibration data of each device is compared with the natural frequency of the IC carrier. Vibration data with a frequency close to the natural frequency of the IC carrier are considered to be harmful to the IC carrier.

[0032] Compared with the prior art, the present invention has the following advantages and beneficial effects: The active vibration elimination system for semiconductor equipment of this application is equipped with a vibration generating device. The vibration generating device can generate vibration waves with appropriate frequency, phase and amplitude. Based on the interference principle of mechanical waves, the active vibration elimination method is used to generate anti-phase vibration waves to destructively interfere with the original vibration waves, so as to cancel or partially cancel the measured external vibration waves. In this way, during the semiconductor production process, the vibration waves generated by various production equipment will be canceled or partially canceled by the vibration waves generated by the vibration generating device. Therefore, it will not excite the glass IC carrier to resonate, causing the glass IC carrier to break, thereby affecting the production board or contaminating the production process.

[0033] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit this document. Attached Figure Description

[0034] The accompanying drawings, which form part of this document, are used to provide a further understanding of the document. The illustrative embodiments and descriptions herein are used to explain the document and do not constitute an undue limitation thereof. In the drawings:

[0035] Figure 1 is a schematic diagram of an active vibration cancellation system for semiconductor devices provided in an exemplary embodiment of this application;

[0036] Figure 2 is a layout diagram of a data acquisition device and a vibration generating device provided in an exemplary embodiment of this application;

[0037] Figure 3 is a gridded layout diagram of the data acquisition device and vibration generating device provided in an exemplary embodiment of the application;

[0038] Figure 4 is a schematic diagram of a vibration generating device provided in an exemplary embodiment of this application;

[0039] Figure 5 is a block diagram illustrating the principle of an active vibration elimination method provided in an exemplary embodiment of this application;

[0040] Figure 6 is a vibration data diagram of a vibration sensor and vibration generator installed at a fixed part of a production equipment according to an exemplary embodiment of this application;

[0041] Figure 7 is an X-axis vibration data diagram of a vibration sensor and vibration generator installed on a three-axis moving part of a production equipment according to an exemplary embodiment of this application.

[0042] Figure 8 is a Y-axis vibration data diagram of a vibration sensor and vibration generator installed on a three-axis moving part of a production equipment according to an exemplary embodiment of this application.

[0043] Figure 9 is a Z-axis vibration data diagram of a vibration sensor and vibration generator installed on a three-axis moving part of a production equipment according to an exemplary embodiment of this application.

[0044] Figure 10 is an X-axis vibration data diagram of a vibration sensor and vibration generator installed on a two-axis moving part of a production equipment according to an exemplary embodiment of this application.

[0045] Figure 11 is a Y-axis vibration data diagram of a vibration sensor and vibration generator installed on a two-axis moving part of a production equipment according to an exemplary embodiment of this application.

[0046] Figure 12 is an X-axis vibration data diagram of a vibration sensor and vibration generator installed on a bearing device according to an exemplary embodiment of this application;

[0047] Figure 13 is an X-axis vibration data diagram of a vibration sensor and vibration generator installed on a bearing device according to an exemplary embodiment of this application;

[0048] Figure 14 is an X-axis vibration data diagram of a vibration sensor and vibration generator installed on a bearing device according to an exemplary embodiment of this application.

[0049] In the picture:

[0050] 201. Excited vibration surface; 301. Mounting plate; 302. Vibrating body; 303. Terminal block. Embodiments of the present invention

[0051] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other.

[0052] In related technologies, due to the fragile nature of glass, vibrations generated by various production equipment during semiconductor manufacturing are applied to the glass IC substrate via the equipment or air, affecting its performance. When these vibrations coincide with the substrate's natural frequency, resonance occurs, causing the substrate to break. The resulting fragments can render the entire production board unusable and contaminate the entire manufacturing process.

[0053] Based on this, an exemplary embodiment of this application provides an active vibration cancellation system for semiconductor equipment. Based on the interference principle of mechanical waves, the active vibration cancellation method generates an anti-phase vibration wave to destructively interfere with the original vibration wave, thereby overcoming the bias of the above-mentioned technical approach. The system is equipped with a vibration generating device that can generate vibration waves with appropriate frequency, phase, and amplitude to cancel or partially cancel the originally measured external vibration wave. Thus, during the semiconductor manufacturing process, the vibrations generated by various production equipment will be canceled or partially canceled by the vibration waves generated by the vibration generating device. Therefore, it will not excite the glass IC substrate to resonate, causing the glass IC substrate to break, thereby affecting the production board or contaminating the production process.

[0054] An exemplary embodiment of this application provides an active vibration cancellation system for semiconductor devices, as shown in FIG1. ​​The active vibration cancellation system includes a data acquisition device, a control device, and a vibration generator. The data acquisition device monitors vibration and collects vibration data, transmitting the collected vibration data to the control device. The control device receives, analyzes, and processes the vibration data, and outputs control commands. The vibration generator receives the control commands and generates an anti-phase vibration wave. Thus, the anti-phase vibration wave generated by the vibration generator can cancel or partially cancel the original vibration wave, thereby reducing the vibration wave transmitted to the glass IC substrate, preventing resonance in the glass IC substrate, and preventing damage to the glass IC substrate that could affect the production board or contaminate the production process.

[0055] The data acquisition device is a vibration sensor array, including at least one vibration sensor. The vibration sensor collects vibration data and transmits it to the control device. The configured vibration sensor array forms a data acquisition matrix, enabling matrix-style data acquisition of vibrations in equipment or the environment. This provides dense data acquisition points, increasing the coverage density of the monitoring area of ​​the equipment or production environment, achieving refined monitoring and measurement, and improving the accuracy of vibration measurements and the quality of collected vibration data. Furthermore, the use of multi-point synchronous sampling enables multi-point synchronous monitoring, improving data acquisition efficiency and real-time performance. In addition, by analyzing the response of each point in the vibration sensor array, the position of each vibration sensor can be determined. At this point, the position of the vibration generator can be determined based on the position of the vibration sensor, allowing the control device to issue control commands to the vibration generator at the corresponding position.

[0056] The vibration generating device is a vibration generator array, which includes at least one vibration generator, which is at least one of vibrating diaphragm vibration, piezoelectric vibration, or ultrasonic vibration. Typically, it can be set to activate the vibration generator at the corresponding location when the collected vibration data exceeds a preset value, and to deactivate the vibration generator at the corresponding location when the data is below the preset value.

[0057] Figure 4 shows a schematic diagram of a vibration generating device. In one embodiment, the vibration generating device includes a frequency generator and a vibration generator. The vibration generator is mounted on a mounting plate 301, which has terminals 302. The mounting plate 301 is in direct contact with the excited vibration surface 201. The vibration generator includes a vibrating diaphragm or vibrating body 302. The frequency generator generates a stable electrical signal according to the control command issued by the control device. The control command may include parameters of the vibration wave to be generated, such as frequency, waveform, and amplitude. The vibration generator converts the electrical signal into a vibration wave. To completely cancel out the original vibration wave, the frequency and amplitude of the vibration wave to be generated are the same as the original vibration wave, but the waveform is opposite. Therefore, the vibration wave generated by the vibration generating device can cancel out the original vibration wave, achieving a vibration reduction effect.

[0058] In another exemplary embodiment, the vibration generator does not need to generate an antiphase vibration wave that is completely opposite to the original vibration. It only needs to generate a vibration wave with an opposite phase. The amplitude of this vibration wave can be smaller than the amplitude of the original vibration wave. In this case, since the amplitude of the vibration wave generated by the vibration generator is smaller than the amplitude of the original vibration, it can partially cancel the original vibration wave and reduce the amplitude of the original vibration wave. The active vibration elimination method reduces the amplitude applied to the glass IC carrier, reduces the stress inside the glass IC carrier, and prevents the glass IC carrier from breaking.

[0059] To drive the diaphragm to achieve sufficient amplitude, a power amplifier is required. The output signal from the frequency generator is first amplified by the power amplifier to provide sufficient electrical energy to drive subsequent vibration. To convert electrical energy into vibration, a piezoelectric transducer (piezoelectric vibration) or an ultrasonic transducer (ultrasonic vibration) can be used. When the diaphragm receives the mechanical vibration transmitted from the transducer, it will vibrate at a preset frequency, generating a vibration opposite in phase to the original vibration. This cancels or partially cancels the original vibration, preventing damage to the glass IC substrate caused by the original vibration.

[0060] In Example 1, a vibration sensor is installed on a pre-set production equipment, and a vibration generator is installed on the pre-set production equipment or in the production environment. Specifically, based on production needs and the production equipment, the vibration source of the production equipment is predicted, and the vibration sensor is installed according to the predicted location of the vibration source. In this case, vibration sensors and vibration generators can be installed on one or more devices. The location of the vibration generator can be close to the location of the vibration sensor, or the location of the vibration generator can be set according to the collected vibration data. The locations of the vibration sensor and vibration generator vary depending on the production equipment. For example, vibration sensors can be installed on the supporting device, conveying system, loader, boom, flying knife, process module, equipment chassis, equipment shell, etc., while vibration generators can be installed at the supporting device, boom, flying knife, etc., or in the production environment. The supporting device is used to support and clamp the IC carrier board, the conveying system is used to transport the supporting device to drive the IC carrier board to achieve displacement movement in the X, Y, and Z directions, the boom is used to connect the conveying system and the supporting device, and the process module is used to process the IC carrier board. At this point, vibration data can be collected from each part of a production equipment or a group of production equipment, and a vibration generator can be set up to generate vibration waves based on the collected vibration data to eliminate or partially eliminate the original vibration waves.

[0061] In Example 2, a vibration sensor and a vibration generator are both installed in a preset production equipment or environment, as shown in Figure 2. The boxes represent the various production devices within the environment, and the circles represent the vibration acquisition locations. The position of the vibration generator can be set based on the collected vibration data or the position of the vibration sensor. Typically, in semiconductor manufacturing processes, several devices are located in the same production workshop or environment, forming one or more production steps. In this case, vibration data from several devices and preset locations within the production environment can be collected, and the position of the vibration generator can be set based on the collected vibration data to generate an inverse vibration wave to cancel or partially cancel the original vibration wave. Preferably, a vibration generator is installed at each vibration sensor location, meaning the vibration sensor and vibration generator are combined and installed. This eliminates the need to differentiate installation locations, simplifying the installation process for the vibration sensor and vibration generator.

[0062] In Example 3, to facilitate monitoring of the entire production environment, a pre-defined production environment layout diagram can be created by gridding the layout diagram, establishing a three-dimensional spatial coordinate system for the production environment. The horizontal direction of the production environment's horizontal plane is designated as the X-axis, the direction perpendicular to the X-axis as the Y-axis, and the direction perpendicular to both the X and Y axes as the Z-axis, as shown in Figure 3. This forms a production environment layout coordinate diagram. Vibration sensors are then set up according to this diagram, numbered, and their three-dimensional coordinates are marked on the layout coordinate diagram. In this case, the vibration sensors of the data acquisition device can be evenly distributed within the production environment according to preset parameters; for example, adjacent vibration sensors are spaced equally along the X and Y axes, forming a wireless sensor matrix. The control device analyzes the vibration data collected by each vibration sensor, locates the position of each vibration sensor using the production environment layout coordinate map, determines the position of the vibration generator, and numbers the vibration occurrence position. The vibration occurrence position is marked on the production environment layout coordinate map. The control device can generate corresponding control commands and send them to the vibration generators at the corresponding coordinates. Each vibration generator generates an inverse vibration wave according to the received control command to cancel or partially cancel the original vibration wave.

[0063] In Example 4, vibration sensors are mounted on the support device of the glass IC substrate. Specifically, vibration sensors are only placed on the support device, which is in direct contact with the glass IC substrate, to collect vibration data. Based on the collected vibration data, vibration generators are placed on or around the support device to generate vibration waves that are opposite in phase to the original vibration. In this case, by canceling or partially canceling the vibration waves from the support device directly in contact with the glass IC substrate, damage to the glass IC substrate caused by the original vibration can be avoided. In this example, only vibration data from the support device in direct contact with the IC substrate is collected, without considering the source of harmful vibration or the attenuation and superposition of vibration during its transmission from the source to the IC substrate. Vibration generators are placed on or around the support device to generate opposite vibration waves to eliminate harmful vibrations to the IC substrate. This configuration allows for simple and convenient collection of harmful vibration data, reduces the number of vibration sensors and generators, simplifies the control system's computational program, and greatly optimizes the control system's operation.

[0064] Figures 12 to 14 show vibration data volumes where both the vibration sensor and the vibration generator are mounted on the support device. The first vibration data graph in Figures 12 to 14 shows vibration data collected by the vibration sensor in the X, Y, and Z axes. Based on this data, the vibration generator produces the second vibration data graph shown in Figures 12 to 14. After the vibration generator produces the reverse vibration data, vibration data is re-collected on the support device, resulting in the third vibration data graph shown in Figures 12 to 14. This demonstrates that, through the reverse vibration generated by the vibration generator, the maximum amplitude of the vibration data in the X-axis direction on the support device is reduced from nearly 120 to below 100. After effectiveness analysis and comparison, the result shown in the fourth graph of Figure 12 shows a reduction of 24.23% in harmful vibration. The maximum amplitude of the vibration data in the Y-axis direction on the support device is reduced from over 80 to over 60. After effectiveness analysis and comparison, the result shown in the fourth graph of Figure 13 shows a reduction of 21.43% in harmful vibration. The maximum amplitude of the vibration data carried by the bearing device in the Z-axis direction was reduced from nearly 40 to nearly 30. After effectiveness analysis and comparison, the analysis and comparison results shown in the fourth figure of Figure 14 were obtained, and the percentage of harmful vibration reduction reached 12.76%.

[0065] In Example 5, vibration sensors are positioned around the glass IC carrier, specifically around the support structure of the glass IC carrier. Vibration data is collected only around the support structure. For example, the vibration sensors are positioned at the connection between the support structure and the transmission system, or on the transmission system itself. Based on the collected vibration data, a vibration generator is placed on or around the support structure to generate a vibration wave that is in the opposite phase to the original vibration, thus preventing damage to the glass IC carrier caused by the original vibration.

[0066] Figure 6 shows vibration data graphs where both the vibration sensor and the vibration generator are installed at a fixed location on the production equipment. This fixed location may vibrate due to the movement of other parts. The first vibration data graph in Figure 6 shows the vibration data collected by the vibration sensor. Based on this data, the vibration generator is set to produce vibration data as shown in the second vibration data graph. After the vibration generator produces reverse vibration data, vibration data is collected again, resulting in the third vibration data graph. It can be concluded that, after the reverse vibration generated by the vibration generator, the maximum amplitude of the vibration data at this fixed location is reduced from nearly 20 to nearly 15. After effectiveness analysis and comparison, the results shown in the fourth graph of Figure 6 show that the percentage of harmful vibration reduction reaches 19.70%.

[0067] Figures 7 to 9 show vibration data diagrams of a three-axis moving part where a vibration sensor and vibration generator are installed. This three-axis moving part can be a transmission system capable of movement in the X, Y, and Z directions. The first vibration data diagram in Figures 7 to 9 shows vibration data collected by the vibration sensor in the X, Y, and Z axes. Based on this vibration data, a vibration generator is used to generate vibration data as shown in the second vibration data diagram in Figures 7 to 9. After the vibration generator generates reverse vibration data, vibration data on the load-bearing device is re-collected, resulting in the third vibration data diagram in Figures 7 to 9. It can be concluded that, through the reverse vibration generated by the vibration generator, the maximum amplitude of the vibration data in the X-axis direction of the three-axis moving part is reduced from nearly 60 to below 50. After effectiveness analysis and comparison, the results shown in the fourth figure of Figure 7 show that the percentage of harmful vibration reduction reaches 33.44%. The maximum amplitude of vibration data in the Y-axis direction of the three-axis moving parts decreased from over 80 to over 70. After effectiveness analysis and comparison, as shown in the fourth figure of Figure 8, the percentage of harmful vibration reduction reached 22.84%. The maximum amplitude of vibration data in the Z-axis direction of the three-axis moving parts decreased from nearly 40 to nearly 30. After effectiveness analysis and comparison, as shown in the fourth figure of Figure 9, the percentage of harmful vibration reduction reached 8.55%.

[0068] Figures 10 and 11 show vibration data diagrams of a vibration sensor and a vibration generator installed at a two-axis moving part, which can be a transmission system capable of X and Y direction movement. The first vibration data diagram in Figures 10 and 11 shows vibration data in the X and Y axis directions collected by the vibration sensor. Based on this data, a vibration generator is used to generate vibration data as shown in the second diagram in Figures 10 and 11. After the vibration generator generates reverse vibration data, vibration data is collected again, resulting in the third vibration data diagram in Figures 10 and 11. This demonstrates that, through the reverse vibration generated by the vibration generator, the maximum amplitude of the vibration data carried in the X-axis direction at the two-axis moving part is reduced from over 40 to over 30. After effectiveness analysis and comparison, the results shown in the fourth diagram of Figure 10 show that the percentage of harmful vibration reduction reaches 9.27%. The maximum amplitude of the vibration data in the Y-axis direction of the three-axis moving parts was reduced from more than 80 to more than 60. After effectiveness analysis and comparison, the analysis and comparison results shown in the fourth figure of Figure 10 were obtained, and the percentage of harmful vibration reduction reached 32.39%.

[0069] Therefore, it can be concluded that after the vibration generator produces the anti-phase vibration wave, it can significantly reduce the original vibration wave. Thus, in the semiconductor manufacturing process, the vibration waves generated by various production equipment will be canceled or partially canceled by the vibration wave generated by the vibration generator. Therefore, it will not excite the glass IC substrate to resonate, causing the glass IC substrate to break, thereby affecting the production board or contaminating the production process.

[0070] An exemplary embodiment of this application provides an active vibration cancellation method, as shown in FIG5, which includes the following steps:

[0071] S1. The data acquisition device collects vibration data and transmits the collected vibration data to the control device;

[0072] S2. The control device receives the vibration data sent by the data acquisition device, obtains the vibration data of the vibration sensor within a certain period of time, processes the vibration data, generates control commands, and sends the control commands to the vibration generating device.

[0073] S3. The vibration generating device receives the control command issued by the control device and generates an anti-phase vibration wave that is opposite to the vibration data.

[0074] The process by which the control device processes the vibration data is as follows:

[0075] The vibration data transmitted by each vibration sensor is analyzed to obtain vibration data that is harmful to the glass IC substrate; the vibration data includes, but is not limited to, vibration frequency, amplitude, direction, phase and its variation over time.

[0076] Based on vibration data that is harmful to the glass IC substrate, the vibration parameters of the anti-phase vibration waves that each vibration generator needs to produce are determined.

[0077] The process for obtaining vibration data that is harmful to the glass IC substrate is as follows:

[0078] Experimental modal analysis or finite element analysis was performed on the glass IC substrate to obtain its natural frequencies;

[0079] Model the support device of the glass IC substrate and other devices equipped with vibration sensors and vibration generators, and label the position coordinates and numbers of each vibration sensor and vibration generator. Map the vibration data collected by each vibration sensor to the model of each device to obtain the vibration frequency, vibration amplitude and vibration transmission process of each device, and thus obtain the vibration status of each device within a certain time period. Since the glass IC substrate is in direct contact with the support device, the vibration frequency, vibration amplitude and other data on the glass IC substrate can be obtained, thus obtaining the vibration status of the glass IC substrate.

[0080] Based on the vibration frequency, vibration amplitude, and natural frequency of the glass IC substrate, it can be concluded that vibration data with a vibration frequency close to the natural frequency of the glass IC substrate are harmful to the glass IC substrate.

[0081] Based on the vibration frequency and amplitude data of the glass IC carrier, the stress distribution and deformation data of the glass IC carrier can be obtained; vibration data that cause stress or deformation to the glass IC carrier exceeding the preset range are vibration data that are harmful to the glass IC carrier.

[0082] Preferably, to better collect effective vibration data, the vibration sensor is installed in the following locations: at the fixing point between the glass IC carrier and the support device, thus better obtaining the vibration transmission process and better predicting the vibration data of the glass IC carrier; at the connection point between the support device and its transmission system to obtain vibration data imported from the outside; the transmission system is a device that transports the support device, such as a robotic arm or magnetic levitation track; at the edge of the support device to monitor its vibration in a timely manner; and at locations where rotation, translation, or other movements occur to detect the vibration of moving components in real time.

[0083] Preferably, a vibration generator is provided at each vibration sensor to eliminate the source vibration that generates harmful vibration; or the vibration generator is located close to the glass IC carrier to improve the response speed and enhance the effect of eliminating harmful vibration; or the vibration generator is located at the connection between the carrier device and the transmission device to eliminate vibration waves transmitted from the outside to the carrier device in advance and reduce the vibration waves transmitted to the glass IC carrier.

[0084] The process of determining the vibration parameters of the anti-phase vibration waves to be generated by each vibration generator is as follows:

[0085] After modeling the carrier device of the glass IC substrate and other devices equipped with vibration sensors and vibration generators, the vibration data collected by each vibration sensor is mapped to the model of each device. Based on the vibration data such as vibration frequency and vibration amplitude of each device, the vibration data such as vibration frequency and vibration amplitude of each device are used as the original input parameters of the vibration generator. Based on the original input parameters, the vibration parameters of the vibration generator that are opposite to them are obtained.

[0086] For example, before the vibration generator generates the anti-phase vibration wave, the vibration data collected by the vibration sensor at the bearing device is the first vibration data;

[0087] After the vibration generator at a certain location generates an anti-phase vibration wave, the vibration sensor at the bearing device continues to collect vibration data and names the collected vibration data as the second vibration data; the second vibration data is compared with the first vibration data to obtain the comparison result; based on the comparison result, the valid vibration generator can be identified.

[0088] If the parameters of the second vibration data are significantly smaller than those of the first vibration data, then the anti-phase vibration generated by the vibration generator is a valid anti-phase vibration, and the vibration generator is marked as a valid vibration generator, and its label and coordinates are recorded. If the parameters of the second vibration data do not change significantly compared with those of the first vibration data, or if the parameters of the second vibration data are greater than those of the first vibration data, then the anti-phase vibration generated by the vibration generator is an invalid anti-phase vibration, and the vibration generator is marked as an invalid vibration generator and removed from the array of vibration generators.

[0089] Based on the label and coordinates of the effective vibration generator, adjust the vibration parameters of the effective vibration generator and monitor the changes in the second vibration data in real time to ensure maximum elimination of harmful vibrations.

[0090] In this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the article or device that includes said element.

[0091] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0092] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations fall within the scope of the claims of this application and their equivalents, the intent of this application also includes these modifications and variations.

Claims

1. An active vibration cancellation system for semiconductor devices, characterized in that, include: A data acquisition device for monitoring vibration and collecting vibration data; A control device for receiving, analyzing and processing the vibration data, and outputting control commands; A vibration generator used to receive control commands and generate anti-phase vibration waves.

2. The active vibration cancellation system for semiconductor devices according to claim 1, characterized in that, The data acquisition device is installed on a pre-set production equipment and / or in a production environment.

3. The active vibration cancellation system for semiconductor devices according to claim 1, characterized in that, The vibration generating device is installed on a pre-set production equipment and / or in the production environment.

4. The active vibration cancellation system for semiconductor devices according to claim 1, characterized in that, Based on the layout diagram of the preset production environment, the layout diagram is gridded to form a production environment layout coordinate diagram. Data acquisition devices are set up according to the production environment layout coordinate diagram, and the data acquisition locations are numbered and marked on the production environment layout coordinate diagram.

5. The active vibration cancellation system for semiconductor devices according to claim 4, characterized in that, The location of the vibration generator is set according to the location of the data acquisition device, and the vibration locations are numbered and marked on the production environment layout coordinate diagram.

6. The active vibration cancellation system for semiconductor devices according to claim 2, characterized in that, The data acquisition device is mounted on and / or around the carrier of the IC carrier board.

7. The active vibration cancellation system for semiconductor devices according to claim 3, characterized in that, The vibration generating device is disposed on and / or around the support device of the IC carrier plate.

8. The active vibration cancellation system for semiconductor devices according to claim 1, characterized in that, The data acquisition device is a vibration sensor array, which includes at least one vibration sensor.

9. The active vibration cancellation system for semiconductor devices according to claim 1, characterized in that, The vibration generating device is a vibration generator array, which includes at least one vibration generator, wherein the vibration generator is at least one of a vibrating diaphragm, piezoelectric vibration, or ultrasonic vibration.

10. An active vibration elimination method, characterized in that, Includes the following steps: S1. The data acquisition device collects vibration data and transmits the collected vibration data to the control device; S2. The control device receives vibration data sent by the data acquisition device, processes the vibration data, generates control commands, and sends the control commands to the vibration generating device. S3. The vibration generating device receives the control command issued by the control device and generates an anti-phase vibration wave that is opposite to the vibration data.

11. The active vibration elimination method according to claim 10, characterized in that, Step S2 involves the control device processing the vibration data, including the following steps: The vibration data transmitted by each vibration sensor is analyzed to obtain vibration data that is harmful to the IC carrier board. Based on vibration data that is harmful to the IC substrate, determine the vibration parameters of the anti-phase vibration waves that each vibration generator needs to produce.

12. The active vibration elimination method according to claim 11, characterized in that, The process of obtaining vibration data that is harmful to the IC substrate is as follows: Model the device equipped with vibration sensors and vibration generators, and label the position coordinates and numbers of each vibration sensor and vibration generator; The vibration data collected by each vibration sensor is mapped to the model of each device to obtain vibration data such as vibration frequency and vibration amplitude of each device; Vibration data of the IC carrier board is obtained based on the vibration data of the bearing device; Experimental modal analysis or finite element analysis is performed on the IC substrate to obtain its natural frequencies; The vibration data of each device is compared with the natural frequency of the IC carrier. Vibration data with a frequency close to the natural frequency of the IC carrier are considered to be harmful to the IC carrier.

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