Display module and electronic device comprising same

Abstract

An electronic device according to one embodiment of the present disclosure may comprise: a support bracket; a display module disposed on the front side of the support bracket, the display module comprising a display panel and a flexible printed circuit board (FPCB) bent from one end of the display panel and disposed to face the display panel; a molding part formed to surround a part of the edge of the display panel and a bent portion of the flexible printed circuit board; a guide structure disposed between the display panel and the support bracket and including a surface inclined from one end of the molding part toward one surface of the display module; and a waterproof sheet extending from one surface of the molding part to the display module through the inclined surface of the guide structure.

Description

Display module and electronic device including the same

[0001] Various embodiments disclosed in this document relate to a display module and an electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions according to the programs installed on them, including home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] The display module of an electronic device is an output device that outputs visual information, and can also provide a virtual keypad that replaces a mechanical input device (e.g., a button-type input device). To ensure stable operation of the display module within the electronic device, it is necessary to minimize the impact caused by contact between the display module and other components of the electronic device (e.g., the housing) when subjected to impact, and to minimize the gap between the housings in which the display module is placed, thereby limiting the inflow of foreign substances.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] An electronic device according to one embodiment of the present disclosure may include a support bracket, a display module disposed on a front side of the support bracket, the display module including a display panel and a flexible circuit board (FPCB) formed to be bent from one end of the display panel and arranged to face the display panel, a molding part formed to surround a portion of an edge of the display panel and a bending portion (312a) of the flexible circuit board, a guide structure disposed between the display panel and the support bracket and including a surface (341) inclined from one end of the molding part toward one side of the display module, and a waterproof sheet (350) extending from one side of the molding part past the inclined surface of the guide structure to the display module.

[0007] An electronic device according to one embodiment of the present disclosure may include a front plate, a support bracket disposed under the front plate, a display module disposed between the front plate and the support bracket, a molding part disposed at least partially along an edge of the front plate and an edge of the display module, a guide structure disposed on the display module in contact with the molding part and including an inclined surface, and a waterproof sheet extending from one surface of the molding part to the display module through the inclined surface of the guide structure.

[0008] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a perspective view looking toward the front of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view looking toward the rear of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view of an electronic device viewed from the front according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view of an electronic device viewed from the rear, according to one embodiment of the present disclosure.

[0014] FIG. 6 is a perspective view illustrating components of a portion (e.g., a lower portion) of an electronic device in isolation, according to one embodiment of the present disclosure.

[0015] FIG. 7 is a perspective view showing a state in which some components of an electronic device are combined according to one embodiment of the present disclosure.

[0016] FIG. 8 is a front view of some components of an electronic device combined according to one embodiment of the present disclosure.

[0017] FIG. 9 is a cross-sectional view of a molding portion disposed between a display module and a support bracket according to one embodiment of the present disclosure.

[0018] FIG. 10 is a cross-sectional view of the combined components of FIG. 8 taken along the line AA` according to one embodiment of the present disclosure.

[0019] FIG. 11 is a perspective view of a guide structure viewed from one side according to one embodiment of the present disclosure.

[0020] FIG. 12 is a perspective view of a guide structure viewed from the other side according to one embodiment of the present disclosure.

[0021] FIG. 13 is a perspective view of a guide structure viewed from the side according to one embodiment of the present disclosure.

[0022] FIGS. 14A, 15A, and 16A are perspective projection views showing the connection between a guide structure and a molding portion according to an embodiment of the present disclosure.

[0023] FIGS. 14b, 15b, and 16b are cross-sectional projections showing the connection between the guide structure and the molding portion according to an embodiment of the present disclosure.

[0024] FIG. 17 is a perspective view before a guide structure is attached to the rear surface of a display module according to one embodiment of the present disclosure.

[0025] FIG. 18 is a perspective view of a guide structure attached to the rear surface of a display module according to one embodiment of the present disclosure.

[0026] FIG. 19 is a perspective view of the rear surface of a display module, a portion of a guide structure, and a molding portion joined together according to one embodiment of the present disclosure.

[0027] FIG. 20 is a perspective view of a display module, a guide structure, and a waterproof sheet attached to a molding portion according to one embodiment of the present disclosure.

[0028] FIG. 21 is an enlarged perspective view of an area (S1) of FIG. 17 according to one embodiment of the present disclosure.

[0029] FIG. 22 is an enlarged perspective view of an area (S2) of FIG. 18 according to one embodiment of the present disclosure.

[0030] FIGS. 23a, 23b, and 23c are drawings showing the relationship between a display module and a molding cap for forming the molding portion of FIG. 19 according to one embodiment of the present disclosure.

[0031] FIG. 24a is a drawing showing a state in which a molding cap is placed on a display module for forming the molding portion of FIG. 19 according to an embodiment of the present disclosure.

[0032] FIG. 24b is a cross-sectional view of a region of FIG. 24a according to an embodiment of the present disclosure.

[0033] FIG. 25 is a perspective view showing a state of coupling of a display module and a support bracket, viewed toward the rear of an electronic device, according to one embodiment of the present disclosure.

[0034] FIG. 26 is a perspective view showing a state of coupling of a display module and a support bracket, viewed toward the front of an electronic device, according to one embodiment of the present disclosure.

[0035] FIGS. 27a, 27b, and 27c are perspective views showing alignment between a guide structure and a support bracket according to one embodiment of the present disclosure.

[0036] FIG. 28A is a perspective view of a front side of an electronic device according to one embodiment of the present disclosure.

[0037] FIG. 28b is a plan view looking toward the rear of an electronic device according to one embodiment of the present disclosure.

[0038] FIG. 29A is a perspective view showing an unfolded state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0039] FIG. 29b is a perspective view showing an intermediate state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0040] FIG. 29c is a perspective view showing an intermediate state similar to a folded state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0041] FIG. 30 is an enlarged view of an area (P1) of the rear surface of the display module of FIG. 29b and some components coupled thereto, according to one embodiment of the present disclosure.

[0042] FIG. 31 is a perspective view of a waterproof sheet arranged in FIG. 30 according to one embodiment of the present disclosure.

[0043] FIG. 32A is a perspective view of a front view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0044] FIG. 32b is a perspective view of the rear side of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0045] FIG. 32c is a perspective view showing an electronic device in a folded state according to one embodiment of the present disclosure.

[0046] FIG. 33 is a drawing showing the rear surface of a display module and some components associated therewith, according to one embodiment of the present disclosure.

[0047] FIG. 34 is an enlarged perspective view of a portion (P2) of FIG. 33 according to one embodiment of the present disclosure.

[0048] FIG. 35A is a diagram illustrating a first state (e.g., a close state or a slide in state) of an electronic device according to one embodiment of the present disclosure.

[0049] FIG. 35b is a diagram illustrating a second state (e.g., an open state or a slide-out state) of an electronic device according to one embodiment of the present disclosure.

[0050] FIG. 36A is a perspective view showing a closed state or a slide in state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0051] FIG. 36b is a perspective view showing an open state or a slide-out state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0052] FIG. 37 is an enlarged view of the rear surface of the display module of FIG. 36a and an area (P3) where some components combined therewith are arranged, according to one embodiment of the present disclosure.

[0053] FIG. 38 is a perspective view of the waterproof sheet arranged in FIG. 37 according to one embodiment of the present disclosure.

[0054] The accompanying drawings are referenced in the following description, and specific examples of implementations are illustrated within the drawings. Furthermore, other examples may be utilized and structural changes may be made without departing from the scope of the various examples.

[0055] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0056] The embodiments and terminology used in this document are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or alternatives of the embodiments. In connection with the description of the drawings, similar reference numerals may be used to refer to similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise.

[0057] In this document, phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0060] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0061] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0062] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0063] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0064] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0065] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0066] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0067] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0068] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall-area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0069] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0070] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0071] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0072] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0073] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0074] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0075] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0076] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0077] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0078] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0079] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0080] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0081] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0082] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0083] FIG. 2 is a perspective view looking toward the front of an electronic device according to one embodiment disclosed in this document.

[0084] FIG. 3 is a perspective view looking toward the rear of an electronic device according to one embodiment disclosed in this document.

[0085] The components of the electronic device (101) of FIGS. 2 and 3 may be partially or completely identical to the components of the electronic device (101) of FIG. 1.

[0086] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).

[0087] In one embodiment, the first side (110A) may be formed by a front plate (102) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (102) and the back plate (111) and comprises a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0088] In one embodiment, the front plate (102) may include a seamlessly extending region(s) that curves toward the back plate (111) from at least a portion of an edge. For example, the front plate (102) (or the back plate (111)) may include only one of the curved extending regions toward the back plate (111) (or the front plate (102)) at one edge of the first side (110A). In one embodiment, the front plate (102) or the back plate (111) may be substantially flat, in which case it may not include a curved extending region. When the front plate (102) or the back plate (111) includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than the thickness of other portions.

[0089] According to one embodiment, the electronic device (101) may include at least one of a display (115), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (104), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (108), a second connector hole (109)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include other components.

[0090] The display (115) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (102)). In one embodiment, at least a portion of the display (115) may be visually exposed through the front plate (102) forming the first surface (110A) or through a portion of a side surface (110C). In one embodiment, the edge of the display (115) may be formed to be substantially the same as the adjacent outer shape of the front plate (102). In one embodiment (not shown), in order to expand the area in which the display (115) is visually exposed, the gap between the outer edge of the display (115) and the outer edge of the front plate (102) may be formed to be substantially the same.

[0091] According to one embodiment, a recess or opening may be formed in a part of a screen display area of ​​the display (115), and at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be included on a back surface of the screen display area of ​​the display (115). In one embodiment (not shown), the display (115) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0092] According to one embodiment, the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0093] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (104) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (115)) of the housing (110), but also the second surface (110B) or the side surface (110C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (104).

[0094] According to one embodiment, the camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (101), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (113) may emit infrared light, and the infrared light emitted by the flash (113) and reflected by the subject may be received through the third sensor module (119). The electronic device (101) or a processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (119).

[0095] According to one embodiment, the key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (115). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0096] In one embodiment, the light-emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light-emitting element (106) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0097] According to one embodiment, the connector hole (e.g., the first connector hole (108), the second connector hole (109)) may include a first connector hole (108) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (1002) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0098] FIG. 4 is an exploded perspective view of an electronic device viewed from the front according to one embodiment disclosed in this document.

[0099] FIG. 5 is an exploded perspective view of the rear of an electronic device according to one embodiment disclosed in this document.

[0100] The components of the electronic device (101) of FIGS. 4 and 5 may be partially or completely identical to the components of the electronic device (101) of FIGS. 1 to 3.

[0101] Referring to FIGS. 4 and 5 , the electronic device (101) (e.g., the electronic device (101) of FIG. 1 , 2 or 3 ) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (102) of FIG. 2 ), a display (230) (e.g., the display (115) of FIGS. 2 and 3 ), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (207) and a rear plate (280) (e.g., the rear plate (111) of FIG. 3 ).

[0102] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0103] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the side structure (210) or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0104] In one embodiment, the first support member (211) and the side structure (210) may be combined to form a front case or housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user on the exterior of the electronic device (101), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In one embodiment, the 'front or rear' of the housing (201) may mean the first side (110A) of FIG. 2 or the second side (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0105] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0106] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0107] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0108] According to one embodiment, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240) together with a portion of the first support member (211). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). In this case, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board (not shown) or the lower support member (260b) may be arranged corresponding to the audio module (e.g., the microphone hole (103) or the speaker hole (e.g., the external speaker hole (107), the call receiver hole (114))) or the connector hole (e.g., the first connector hole (108), the second connector hole (109)) of FIG. 2.

[0109] According to one embodiment, it can be positioned corresponding to the audio module (207) or connector hole (108, 109).

[0110] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0111] According to one embodiment, the electronic device (101) may further include a separate sub-circuit board (290) spaced apart from the printed circuit board (240) within the first support member (211). The sub-circuit board (290) may be electrically connected to the printed circuit board (240) via a connecting member such as a connecting flexible board or cable. The sub-circuit board (290) may be electrically connected to electrical components disposed in an end region of the electronic device (101), such as a battery (289) or a speaker, a USB connector, an antenna connector, and / or a SIM socket, to transmit signals and power.

[0112] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (210) and / or a portion or combination of the first support member (211).

[0113] In one embodiment, the camera assembly (207) may include at least one camera module. Within the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with one of the camera windows (212, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0114] FIG. 6 is a perspective view illustrating components of a portion (e.g., a lower portion) of an electronic device in isolation, according to one embodiment of the present disclosure.

[0115] According to one embodiment, the electronic device (101) may include at least one of a display module (310), a support bracket (320), a molding part (330), a guide structure (340), a waterproof sheet (350), a front plate (220), and / or a rear plate (280).

[0116] The configuration of the front plate (220), the rear plate (280), and the display module (310) of FIG. 6 may be the same as or similar to the configuration of the front plate (220), the rear plate (280), and the display (230) of FIGS. 4 and 5. The configuration of the support bracket (320) of FIG. 6 may be the same as or similar to the configuration of the first support member (210) and the side member (211) of the housing (201) of FIGS. 4 and 5. The embodiment of FIG. 6 may be optionally combined with the embodiments of FIGS. 1 to 5, and FIGS. 8 to 27c.

[0117] Referring to FIG. 6, it can be confirmed that the electronic device (101) has a structure in which a rear plate (280), a support bracket (320), a waterproof sheet (350), a molding part (330) (and a guide structure (340)), a display module (310), and a front plate (220) are sequentially stacked in the -Z-axis direction to the +Z-axis direction.

[0118] According to one embodiment, the support bracket (320) of the electronic device (101) may be a part of a housing (e.g., the housing (110) of FIG. 2) that supports and protects electrical components within the electronic device (101). The support bracket (320) may include a support portion (321) (e.g., the support member (211) of FIG. 4) and a side portion (322) (e.g., the side structure (210) of FIG. 4). The support portion (321) provides a space in which components of the electronic device (101) are mounted, and the side portion (322) forms an outer surface of the electronic device (101), and some of the side portions may function as antenna elements.

[0119] According to one embodiment, the display module (310) of the electronic device (101) is disposed on the front side of the support bracket (320), and a plurality of layers may be stacked. The display module (310) is positioned on the inner side of the front plate (220), and may display a screen to the outside through the front plate (220).

[0120] According to one embodiment, the display module (310) may include a display panel (311) and a flexible circuit board (312) extending from the display panel (311) (e.g., the flexible printed circuit board (233) of FIG. 5). The flexible circuit board (312) may be electrically connected to the display panel (311) and may be partially positioned on the rear surface of the display panel (311). For example, the flexible circuit board (312) may be extended from one end of the display panel (311) and then bent, and may be positioned facing the display panel (311). The flexible circuit board (312) may be formed to be at least partially wrapped by the molding member (330) to limit or reduce damage caused by contact with the support bracket (320).

[0121] In one embodiment, the display module (310) may include an adhesive sheet (313). The adhesive sheet (313) may be one of a plurality of layers constituting the display module (310). The adhesive sheet (313) may be arranged as the last layer of the display module (310), thereby forming a rear surface (e.g., a surface facing the -Z axis) of the display module (310). In one embodiment, the adhesive sheet (313) may be one of support films (e.g., reinforcing films) for reinforcing the display module (310) as a whole.

[0122] According to one embodiment, the adhesive sheet (313) is disposed between the display panel (311) and the support portion (321) of the support bracket (320), and a portion thereof may include a bonding area (314) for bonding the guide structure (340). The bonding area (314) may have a plurality of holes formed on one surface corresponding to the guide structure (340). An adhesive material (e.g., a bonding material) may be filled into the plurality of holes formed in the bonding area (314), thereby strengthening the bonding between the display module (310) and the guide structure (340).

[0123] According to one embodiment, the molding portion (330) of the electronic device (101) may be at least partially disposed on an edge of the display module (310) and / or an edge of the front plate (220). For example, the length of the molding portion (330) may extend along the width direction (e.g., X-axis direction) of the display module (310) and / or the front plate (220). For example, the width of the molding portion (330) may extend from one end of the front plate (220) to a portion of the display module (310) (e.g., in the length direction (e.g., Y-axis direction) of the display module (310) and / or the front plate (220). The longitudinal direction (e.g., X-axis direction) of the molding portion (330) may be the width direction (e.g., X-axis direction) of the display module (310) and / or the front plate (220), and the width direction (e.g., Y-axis direction) of the molding portion (330) may be the length direction (e.g., Y-axis direction) of the display module (310) and / or the front plate (220). According to one embodiment, the molding portion (330) may be named at least one of an injection portion, a substrate cover portion, a substrate protection portion, or an impact limiting portion.

[0124] According to one embodiment, the molding part (330) may be arranged to partially surround one side of the display module (310) and the flexible circuit board (312). According to one embodiment, after the flexible circuit board (312) extending from one end of the display module (310) is bent, the molding part (330) may be arranged on the rear side of the display module (310). The molding part (330) may be arranged to entirely surround the bending part (312a) of the flexible circuit board (312). Even when the electronic device (101) receives an external impact, the molding part (330) may limit or reduce damage caused by the impact by preventing the bending part (312a) of the flexible circuit board (312) from directly contacting the support bracket (320).

[0125] According to one embodiment, the guide structure (340) of the electronic device (101) may be placed on an edge of the display module (310). For example, the guide structure (340) may be placed on an adhesive sheet (313) of the display module (310).

[0126] According to one embodiment, the guide structure (340) may include an inclined surface (341) and a connecting portion (342). The inclined surface (341) may form one surface on which the waterproof sheet (350) is placed. The inclined surface (341) may be placed between the molding portion (330) and the display module (310), and may be formed to be inclined so that a step does not occur between the molding portion (330) and the display module (310), thereby limiting or reducing the lifting phenomenon of the waterproof sheet (350). The connecting portion (342) may be a portion connected to the molding portion (330).

[0127] According to one embodiment, the guide structure (340) may be manufactured in two pieces. For example, the two guide structures (340) may be arranged in parallel on both sides of the molding part (330). The guide structures (340) are formed at a boundary portion connecting the molding part (330) to the adhesive sheet (313) of the display module (310), and may have a slope height corresponding to the thickness of the molding part (330). According to one embodiment, the guide structure (340) may be named at least one of a slope part, an extension structure, a slope structure, an injection-molded product, or a metal product.

[0128] According to one embodiment, the waterproof sheet (350) of the electronic device (101) can waterproof a space between a portion of the display module (310) and a portion of the corresponding support bracket (320), thereby limiting the inflow of foreign substances. The waterproof sheet (350) is formed so that both sides are adhesively bonded, so that one side (e.g., a side facing the +Z axis) can contact the display module (310), the molding part (330), and the guide structure (340), and the other side (e.g., a side facing the -Z axis) can contact the support bracket (320).

[0129] According to one embodiment, the waterproof sheet (350) may extend from one side of the molding portion (330) past the inclined surface (341) of the guide structure (340) to the display module (310). The waterproof sheet (350) may extend along at least a portion of an edge of the display module (310). For example, the waterproof sheet (350) may have a closed loop shape extending along an edge of the rear surface of the display module (310). For example, the waterproof sheet (350) may have an open loop shape extending along a portion of an edge of the rear surface of the display module (310).

[0130] According to one embodiment, the waterproof sheet (350) may be named at least one of a waterproof tape, an adhesive member, a sticky member, a glue member, or a paste member.

[0131] FIG. 7 is a perspective view showing a state in which some components of an electronic device are combined according to one embodiment of the present disclosure.

[0132] FIG. 8 is a front view of some components of an electronic device combined according to one embodiment of the present disclosure.

[0133] FIG. 9 is a cross-sectional view of a molding portion disposed between a display module and a support bracket according to one embodiment of the present disclosure.

[0134] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 6) may include at least one of a display module (310), a support bracket (320), a molding portion (330), a guide structure (340), a waterproof sheet (350), and / or a front plate (220).

[0135] The configuration of the display module (310), the support bracket (320), the molding part (330), the guide structure (340), the waterproof sheet (350), and / or the front plate (220) of FIGS. 7 to 9 may be identical or similar to the configuration of the display module (310), the support bracket (320), the molding part (330), the guide structure (340), the waterproof sheet (350), and / or the front plate (220) of FIG. 6. The embodiments of FIGS. 7 to 9 may be optionally combined with the embodiments of FIGS. 1 to 6 and FIGS. 9 to 27c.

[0136] According to one embodiment, the molding portion (330) of the electronic device (101) may be at least partially disposed on an edge of the display module (310) and / or an edge of the front plate (220). For example, when looking toward the rear of the display module (310) (e.g., see FIGS. 7 and 8), the molding portion (330) may be disposed on a portion of the rear of the display module (310) (e.g., a side facing the -Z-axis direction) and / or the rear of the front plate (220) (e.g., a side facing the -Z-axis direction). For example, when looking toward the rear of the display module (310) (e.g., see FIGS. 7 and 8), the molding portion (330) may be disposed along an edge of a lower portion of the display module (310) (e.g., a side facing the -Y-axis direction) and / or a lower portion of the front plate (220) (e.g., a side facing the -Y-axis direction). Since the molding part (330) is arranged to surround the flexible circuit board (312), the molding part (330) may not be arranged in the corner area of ​​the lower part of the display module (310) where the flexible circuit board (312) is not arranged.

[0137] According to one embodiment, the molding portion (330) may include a first extension portion (334) having a first width (d1) that extends to overlap a portion of the front plate (220) and the display module (310), and a second extension portion (335) having a second width (d2) that extends from one end of the first extension portion (334) for coupling with the guide structure (340). The second extension portion (335) may be extended to overlap only a portion of the display module (310). The first width (d1) of the first extension portion (334) may be greater than the second width (d2) of the second extension portion (335).

[0138] According to one embodiment, the molding portion (330) may be arranged to extend in the width direction (e.g., the width direction (Y-axis direction) based on the molding portion (300)) from one end of the front plate (220) to a portion of the display module (310). For example, when looking toward the side cross-section of the display module (310) (e.g., see FIG. 9), the molding portion (330) may include a first molding portion (331) arranged on an edge of the front plate (220) and a second molding portion (332) arranged on an edge of the display module (310). The first molding portion (331) may have a first thickness (t1), and the second molding portion (332) may have a second thickness (t2) smaller than the first thickness (t1). A display module (310) composed of layers laminated on the back surface of a front plate (220) is arranged, and as one end of the display module (310) is arranged toward the inside of one end of the front plate (220), the edge of the display module (310) from the edge of the front plate (220) may have a stepped shape. One surface (e.g., a boundary surface) of the first and second molding portions (331, 332) of the molding portion (330) that contact the front plate (220) and the display module (310) may have a stepped shape. The other surface of the first and second molding portions (331, 332) of the molding portion (330) may form a flat surface. It can be understood that the first and second molding portions (331, 332) above define each portion of the molding portion (330) in the thickness direction (e.g., Z-axis direction), and the first and second extension portions (334, 335) define each portion of the molding portion (330) in the width direction (e.g., width direction (Y-axis direction) based on the molding portion (300)).

[0139] According to one embodiment, the molding part (330) may be arranged to surround one side of the display module (310) and the flexible circuit board (312). According to one embodiment, after the flexible circuit board (312) extending from one end of the display module (310) is bent, the molding part (330) may be arranged on the rear side of the display module (310). For example, according to the molding part (330) forming process, after a silicone cap for molding (e.g., the molding cap (410) of FIG. 24a) is arranged on the rear side of the display module (310), the molding part (330) may be formed by injecting a molten molding liquid into an injection port of the silicone cap (e.g., an injection port (411) of FIG. 23c). After the molding liquid has been cured and the silicone cap has been removed, the molding portion (330) can be formed to cover a portion of the edge of the display module (310), a bending portion (312a) of the flexible circuit board (312), and a portion of the edge of the front plate (220). Since the bending portion (312a) of the flexible circuit board (312) covered by the molding portion (330) does not come into direct contact with the support bracket (320), it can be protected from the influence of external impact.

[0140] According to one embodiment, when viewed toward a side cross-section of the display module (310) (e.g., see FIG. 9), the first molding portion (331) of the molding member (330) may be positioned between the display module (310) and the support bracket (320). For example, the support bracket (320) may include a support portion (321) facing the display module (310) and a side portion (322) forming a side surface of the electronic device (101) and extending vertically from the support portion (321). The front surface of the first molding portion (331) may be in contact with the front plate (220), and the other portion may be positioned within a space formed by the display module (310) and the support bracket (320).

[0141] According to one embodiment, when viewed from the side of the display module (310) (e.g., see FIG. 9), the second molding portion (332) of the molding member (330) may be positioned between the display module (310) and the support bracket (320). For example, the front side of the second molding portion (332) may be positioned to contact the display module (310) (e.g., the flexible circuit board (312)), and the rear side may be positioned to face the support portion (321) of the support bracket (320).

[0142] According to one embodiment, a portion of the back surface of the first molding portion (331) and the second molding portion (332) facing the support portion (321) of the support bracket (320) may be provided with an adhesive waterproof sheet (350), thereby allowing the molding portion (330) and the support bracket (320) to be adhered to each other.

[0143] According to one embodiment, the molding portion (330) may extend along the edge of the display module (310) and be connected to a guide structure (340) disposed at one or both ends. For example, a portion of the guide structure (340) (e.g., the connecting portion (342)) may be disposed to be inserted inwardly into the first molding portion (331). For example, both ends of the first molding portion (331) may be disposed to surround a portion of the guide structure (340) (e.g., the connecting portion (342)). According to the molding process of the molding portion (330), the molten molding liquid may be positioned to surround a portion of the guide structure (340) (e.g., the connecting portion (342)) and then be cured. Accordingly, the molding portion (330) and the guide structure (340) may maintain a fitting joint and maintain a strong bond as they have a large surface area in contact and adhere to each other.

[0144] In one embodiment, the molding portion (330) may include an alignment line (333) for alignment with the support bracket (320) (or a cap for molding). For example, the molding portion (330) may include an alignment line (333) for guiding engagement with the support bracket (320) (or a cap for molding) together with an alignment portion (344) of the guide structure (340). The alignment line (333) may extend from one end of the alignment portion (344) of the guide structure (340) and may have a fine shape extending inwardly of the molding portion (330). The alignment line (333) may form a portion of a side surface of the second molding portion (332). According to one embodiment, the alignment line (333) is formed on the side forming the curved surface of the second molding part (332), but is not limited thereto, and may be designed to be changed into a guide line of various shapes to facilitate combination with the support bracket (320) (or cap for molding).

[0145] According to one embodiment, the guide structure (340) of the electronic device (101) may be disposed at an edge of the display module (310). For example, when looking toward the rear side (e.g., a side facing the -Z axis) of the display module (310) (e.g., see FIGS. 7 and 8), the guide structure (340) may be disposed on a portion of the rear side of the display module (310). For example, when looking toward the rear side of the display module (310) (e.g., see FIGS. 7 and 8), the guide structure (340) may be positioned such that one side of the guide structure (340) is in contact with and / or coupled to the molding part (330) on the lower portion (e.g., a portion facing the -Y axis) of the display module (310).

[0146] According to one embodiment, the guide structure (340) is disposed between the display panel (311) and the support bracket (320), and may include a surface (341) that is inclined from one end (e.g., the first surface (330a)) of the molding part (330) toward one side (e.g., the rear side) of the display module (310). The inclined surface (341) of the guide structure (340) may include a slope shape so that a step does not occur between the first side (330a) of the molding part (330) facing the support bracket (320) and one side (e.g., the rear side) of the display module (310). The inclined surface (341) of the guide structure (340) may be arranged so that, when the waterproof sheet (350) disposed on the first surface (330a) of the molding portion (330) extends toward the edge of the display module (310), a gap is not generated between the waterproof sheet (350) and the display module (310) (and / or the molding portion (330)). Accordingly, the inflow of foreign substances (e.g., fluid) into the electronic device (101) by the waterproof sheet (350) can be restricted or reduced.

[0147] According to one embodiment, the guide structure (340) may include an inclined surface (341) and an alignment portion (344) adjacent to the inclined surface (341) for guiding the coupling between the display module (310) and the support bracket (320) (or a cap for molding). According to one embodiment, the alignment portion (344) of the guide structure (340) may be a portion exposed toward the support bracket (320) so as to enable male-female coupling with the support bracket (320). For example, when the alignment portion (344) of the guide structure (340) has an inwardly fine groove or recess shape, the support bracket (320) may have a protrusion shape corresponding to the groove or recess and capable of male-female coupling. For example, when the alignment portion (344) of the guide structure (340) has a protrusion shape that protrudes outward, the support bracket (320) may have a groove or recess shape that corresponds to the protrusion and allows for male-female coupling. For example, when the alignment portion (344) of the guide structure (340) is formed as a first line of a specific shape, the support bracket (320) may have a second line shape that corresponds to the first line shape and is reversed from the first line shape so that they can be brought into contact with each other to enable fitting and / or alignment.

[0148] In one embodiment, the guide structure (340) may be manufactured as an injection-molded product and / or a metal product. The guide structure (340) may be fixed to the rear surface of the display module (310) and then may be coupled to each other by positioning a portion of the molding part (330) to surround a portion of the guide structure (340). For example, the guide structure (340) manufactured as an injection-molded product may be molded from an injection-molded material of the same material as the molding part (330). For example, the guide structure (340) manufactured as a metal product may be subjected to an electrostatic discharge (ESD) treatment (e.g., coating) so as not to affect the display module (310). In one embodiment, the guide structure (340) and the molding part (330) may be formed integrally.

[0149] According to one embodiment, the waterproof sheet (350) of the electronic device (101) may be extended from the first surface (330a) of the molding portion (330) past the inclined surface (341) of the guide structure (340) to the display module (310). According to one embodiment, the waterproof sheet (350) may be arranged along at least a portion of an edge of the display module (310), and may be formed on both sides with an adhesive material to couple the display module (310) and the support bracket (320).

[0150] According to one embodiment, the waterproof sheet (350) may be arranged in a partially curved shape corresponding to the shape of the molding portion (330). For example, the waterproof sheet (350) may include a first sheet portion (351) having a first width (d3) that is formed to extend so as to overlap with a portion of the front plate (220) and the display module (310), and a second sheet portion (352) having a second width (d4) that is smaller than the first width (d3) that is formed to extend so as to overlap with a portion of the display module (310) for coupling with the guide structure (340) from one end of the first sheet portion (351). The waterproof sheet (350) may be arranged adjacent to the outer side of the first surface (330a) of the molding portion (330), and thus, when the waterproof sheet (350) is arranged from the second extension portion (335) of the molding portion (330) to the first extension portion (334), it may be arranged in a partially curved shape (e.g., a substantially right-angled shape). For example, when looking toward the rear of the display module (310) (e.g., see FIGS. 7 and 8), a portion of the waterproof sheet (350) arranged on the first extension portion (334) may be arranged to face the front plate (220) while being spaced apart from it, and another portion of the waterproof sheet (350) arranged on the second extension portion (335) may be arranged to face the display module (310) while being spaced apart from it. For example, when looking toward the rear of the display module (310) (e.g., see FIGS. 7 and 8), a portion of the waterproof sheet (350) adjacent to the second extension portion (335) and disposed on the first extension portion (334) may be disposed facing the front plate (220) and the display module (310) while being spaced apart from the front plate (220).

[0151] According to one embodiment, the waterproof sheet (350) of the electronic device (101) may have an inclined shape with respect to the rear surface of the display module (310) as it is arranged along the inclined surface (341) of the guide structure (340). When the waterproof sheet (350) is arranged from the first surface (330a) of the molding part (330) to the display module (310), the boundary surface may be smoothly extended without a step, so that a gap may not be formed with the display module (310). Accordingly, the effect of blocking foreign substances from entering the inside of the electronic device (101) may be improved.

[0152] FIG. 10 is a cross-sectional view of the combined components of FIG. 8 taken along the line AA` according to one embodiment of the present disclosure.

[0153] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 6) may include at least one of a display module (310), a molding portion (330), a guide structure (340), a waterproof sheet (350), and / or a front plate (220).

[0154] The configuration of the display module (310), the molding part (330), the guide structure (340), the waterproof sheet (350), and / or the front plate (220) of FIG. 10 may be identical or similar to the configuration of the display module (310), the molding part (330), the guide structure (340), the waterproof sheet (350), and / or the front plate (220) of FIGS. 6 to 9. The embodiment of FIG. 10 may be optionally combined with the embodiments of FIGS. 1 to 9 and FIGS. 11 to 27c.

[0155] Referring to FIG. 10, a display module (310) composed of multiple layers may be stacked and arranged on a front plate (220), and a molding part (330) and a guide structure (340) coupled with the molding part (330) may be arranged on the display module (310). A waterproof sheet (350) may be arranged along the molding part (330) and the guide structure (340).

[0156] According to one embodiment, the guide structure (340) may include an inclined surface (341) and a flat portion (343) extending from the inclined surface (341). The inclined surface (341) has a shape inclined at an acute angle with respect to the rear surface (e.g., the surface facing the -Z axis) of the display module (310), and a portion of the waterproof sheet (350) may be disposed along the inclined surface (341).

[0157] According to one embodiment, the guide structure (340) may include a connecting portion (342) protruding inwardly of the molding portion (330). For example, the connecting portion (342) may be inserted into the inside of the molding portion (330) and may be fit-joined with a portion of the molding portion (330). For example, the connecting portion (342) may be formed to be entirely surrounded by the molding portion (330). For example, the connecting portion (342) may have a protruding shape and may be male-female coupled with the recessed shape of the molding portion (330). However, the connecting portion (342) is not limited to the protruding shape, and may be designed in various ways, such as a recessed shape, and accordingly, the connecting portion of the molding portion (330) may also be designed in various ways.

[0158] According to one embodiment, the guide structure (340) may include a bonding surface (345) for bonding with the display module (310). The bonding surface (345) may be directly bonded to the back surface (e.g., the surface facing the -Z axis) of the display module (310). The layer of the display module (310) that bonds to the bonding surface (345) may be an adhesive sheet (313). For example, the adhesive sheet (313) may be arranged as the last layer of the display module (310) (e.g., the outermost layer based on the +Z axis to -Z axis direction) in an area corresponding to the display module (310) and may include a bonding area (314) for bonding with the guide structure (340) in a part of the lower portion (e.g., the portion facing the -Y axis direction).

[0159] According to one embodiment, the bonding area (314) of the adhesive sheet (313) may be formed entirely of an adhesive material, or a base layer (e.g., a reinforcing layer) may be coated on one side (and / or the other side) with an adhesive material (316).

[0160] According to one embodiment, the bonding area (314) of the adhesive sheet (313) may be formed with a plurality of holes (314a). For example, the plurality of holes (314a) may be formed to penetrate the adhesive sheet (313). An adhesive material (316) (e.g., a bonding material) may be filled within the plurality of holes (314a), thereby substantially increasing the average thickness of an adhesive layer (e.g., an average layer formed by the adhesive sheet (313) and / or the adhesive material (316)) that is bonded to the bonding surface (345) of the guide structure (340). The increased adhesive layer may strengthen the bonding between the guide structure (340) and the display module (310). However, the filling structure of the bonding material formed in the bonding area (314) is not limited to a plurality of holes (314a), and can be designed and changed into various shapes such as recesses and grooves that can increase the bonding surface area by filling the bonding material.

[0161] In one embodiment, the waterproof sheet (350) may extend from one side of the molding portion (330) past the guide structure (340) to the adhesive sheet (313) of the display module (310). For example, the waterproof sheet (350) may be adhered along the first side (330a) of the molding portion (330) past the inclined side (341) and the flat part (343) of the guide structure (340). For example, the waterproof sheet (350) may be adhered along one side (e.g., one side facing the -Z axis) of the flat adhesive sheet (313) past the inclined side (341) of the guide structure (340). The other side of the waterproof sheet (350) (e.g., the side facing the opposite direction of the adhesive sheet (313), the guide structure (340), and the molding portion (330)) may be adhered to a support bracket (e.g., the support bracket (320) of FIG. 9). The waterproof sheet (350) can block foreign substances from entering the electronic device (101) by being attached without lifting to the boundary between the adhesive sheet (313) and the guide structure (340) and / or the boundary between the guide structure (340) and the molding part (330).

[0162] FIG. 11 is a perspective view of a guide structure viewed from one side according to one embodiment of the present disclosure.

[0163] FIG. 12 is a perspective view of a guide structure viewed from the other side according to one embodiment of the present disclosure.

[0164] FIG. 13 is a perspective view of a guide structure viewed from the side according to one embodiment of the present disclosure.

[0165] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 6) may include at least one of a display module (e.g., a display module (310) of FIG. 7), a support bracket (e.g., a support bracket (320) of FIG. 9), a molding member (e.g., a molding member (330) of FIG. 7), a guide structure (340), and / or a waterproof sheet (e.g., a waterproof sheet (350) of FIG. 7).

[0166] The configuration of the guide structure (340) of FIGS. 11 to 13 may be identical or similar to the configuration of the guide structure (340) of FIGS. 6 to 12. The embodiments of FIGS. 11 to 13 may be optionally combined with the embodiments of FIGS. 6 to 12 and FIGS. 14 to 27c.

[0167] Below, the specific shape of the guide structure (340) is described.

[0168] According to one embodiment, the guide structure (340) may include at least one of an inclined surface (341), a planar portion (343), a connecting portion (342), an alignment portion (344), and / or a coupling surface (345).

[0169] According to one embodiment, the guide structure (340) is disposed on one surface of the display module (310), and the inclined surface (341) may form a designated angle with respect to one surface of the display module (310). For example, the designated angle may be an acute angle. For example, the designated angle may be designed in various ways to facilitate the placement of the waterproof sheet (350).

[0170] According to one embodiment, the inclined surface (341) of the guide structure (340) may have a plurality of designated angles. For example, the inclined surface (341) may include a first inclined surface extending at a first angle with respect to one surface of the display module (310), and a second inclined surface extending from the first inclined surface and having a second angle different from the first angle.

[0171] According to one embodiment, a planar portion (343) of a guide structure (340) may extend from an inclined surface (341) and include a plane parallel to one side of a display module (310). The plane may provide a path for a waterproof sheet (350) to pass through. The other end of the planar portion (343) may extend to one side of a molding portion (330), and a thickness of the planar portion (343) may be substantially the same as a thickness of the molding portion (330).

[0172] According to one embodiment, the connecting portion (342) of the guide structure (340) may have a shape protruding from the other end of the flat portion (343). The thickness of the connecting portion (342) may be smaller than the thickness of the flat portion (343). The connecting portion (342) may have a square pillar shape and may include stepped surfaces with respect to the flat portion (343). The connecting portion (342) is a portion for coupling with the molding portion (330) and may be designed to have various shapes for easy coupling with the molding portion (330).

[0173] According to one embodiment, the alignment portion (344) of the guide structure (340) may be adjacent to the inclined surface (341) and / or the flat portion (343) and formed into a specific shape. For example, the alignment portion (344) may be manufactured into a different shape from the inclined surface (341) and / or the flat portion (343) to guide the coupling between the display module (310) and the support bracket (320) (or a cap for molding, such as the molding cap (410) of FIG. 24A)).

[0174] In one embodiment, the alignment portion (344) may be a recessed or grooved shape formed inside the guide structure (340). For example, the alignment portion (344) may have a square groove shape, and some portions may extend in a stepped manner from the inclined surface (341), while others may extend in a stepped manner from the flat portion (343). For example, some portions of the alignment portion (344) may be formed to be surrounded by the inclined surface (341) and the flat portion (343), while others may be open. For example, when the guide structure (340) is viewed from above, the inclined surface (341) and the flat portion (343) may be positioned on one side, and the alignment portion (344) may be positioned on the other side. However, in addition to the recessed or grooved shape, the alignment portion (344) may be designed in various shapes, such as a protruding portion that can be easily aligned with the support bracket (320), or a specific curved line structure.

[0175] According to one embodiment, the joining surface (345) of the guide structure (340) is a surface for bonding onto the display module (310) and may be formed to face in the opposite direction of the inclined surface (341) and the plane of the flat portion (343). The joining surface (345) may be a plane parallel to the rear surface of the display module (310), or may be a concave surface that can be attached while having a large surface area with the display module (310).

[0176] FIGS. 14A, 15A, and 16A are perspective projection views showing the connection between a guide structure and a molding portion according to an embodiment of the present disclosure.

[0177] FIGS. 14b, 15b, and 16b are cross-sectional projections showing the connection between the guide structure and the molding portion according to an embodiment of the present disclosure.

[0178] According to one embodiment, an electronic device (e.g., an electronic device (101) of FIGS. 1 to 6) may include at least one of a display module (e.g., a display module (310) of FIG. 7), a support bracket (e.g., a support bracket (320) of FIG. 7), a molding portion (330), a guide structure (340, 340a, 340b), and / or a waterproof sheet (e.g., a waterproof sheet (350) of FIG. 7).

[0179] The configuration of the molding portion (330) and the guide structures (340, 340a, 340b) of FIGS. 14a to 16b may be identical or similar to the configuration of the molding portion (330) and the guide structures (340) of FIGS. 6 to 13. The embodiments of FIGS. 14a to 16b may be optionally combined with the embodiments of FIGS. 6 to 13 and 17 to 27c.

[0180] According to one embodiment, the guide structures (340, 340a, 340b) and the molding part (330) may be manufactured separately and then joined through an attachment process. For example, after the already manufactured guide structures (340, 340a, 340b) are placed on the display module (310), the molding part (330) may be molded on a portion of the display module (310) and the guide structure (340). If the guide structures (340, 340a, 340b) and the molding part (330) are manufactured through a single molding process, the portion of the guide structure formed on one side (or both sides) of the molding part (330) may be manufactured as an unformed or incompletely formed portion due to the molding liquid not properly spreading due to its relatively thinner and narrower shape than the other portions. Accordingly, the process of forming the guide structure (340, 340a, 340b) and the molding part (330) according to the present disclosure can be performed by manufacturing the guide structure (340, 340a, 340b) as a separate molded product or metal product, and then injecting a part of the molding part (330) thereon to integrally combine them.

[0181] According to one embodiment, in order to increase the bonding force between the guide structure (340, 340a, 340b) and the molding part (330), various structures can be manufactured to increase the contact surface area.

[0182] According to one embodiment, the guide structure (340) may include an inclined surface (341), a flat portion (343), a connecting portion (342), and / or an alignment portion (344). The connecting portion (342) may be a portion that is coupled with the molding portion (330).

[0183] Referring to FIGS. 14A and 14B, the connecting portion (342) of the guide structure (340) may be formed to protrude from one side of the flat portion (343) (or the inclined surface (341)) and may be arranged to be surrounded by the molding portion (330). The protruding shape of the connecting portion (342) may be a single square pillar or a hexahedron, and, except for a portion (e.g., a virtual cross-section (362)) extending from the cross-section (361) of the flat portion (343) (or the inclined surface (341)), five surfaces may be joined while making contact with the molding portion (330). Since the cross-section (361) of the flat portion (343) is formed to have a larger area than the protruding surface (3421) of the connecting portion (342), surfaces other than the virtual cross-section (362) may be joined while making contact with the molding portion (330). In this way, the multiple contact surfaces of the connecting portion (342) and the cross-section (361) of the flat portion (343) can increase the contact area with the molding portion (330) and strengthen the bond.

[0184] Referring to FIGS. 15A and 15B, the connecting portion (342a) of the guide structure (340a) may be formed to protrude from one side of the flat portion (343) (or the inclined surface (341)) and may be arranged to be surrounded by the molding portion (330). The protruding shape of the connecting portion (342a) may include a shape of a plurality of protrusions or a shape of a plurality of uneven surfaces. Each protrusion may include a square pillar or a pillar including a curved surface (e.g., a cylinder). The plurality of protrusions, together with the cross section (361) of the flat portion (343), may substantially increase the surface area in contact with the molding portion (330), thereby reinforcing the bonding between the guide structure (340a) and the molding portion (330).

[0185] Referring to FIGS. 16a and 16b, the connecting portion (342b) of the guide structure (340b) may be formed to protrude from one side of the flat portion (343) (or the inclined surface (341)) and may be arranged to be surrounded by the molding portion (330). The protruding shape of the connecting portion (342b) may include a plurality of square pillars or hexahedrons. Compared to the embodiment of the connecting portion (342) of FIGS. 14a and 14b, the connecting portion (342b) is smaller in size but includes a larger number of protruding shapes, thereby substantially increasing the area in contact with the molding portion (330), thereby strengthening the bonding between the guide structure (340b) and the molding portion (330).

[0186] The joint structure between the guide structure (340, 340a, 340b) and the molding part (330) can be designed and changed to various shapes to strengthen the joint in addition to the embodiments of FIGS. 14a to 16b.

[0187] Hereinafter, in order to protect the display module, the molding process of the molding part is specifically described through FIGS. 17 to 27c.

[0188] FIG. 17 is a perspective view before a guide structure is attached to the rear surface of a display module according to one embodiment of the present disclosure.

[0189] FIG. 18 is a perspective view of a guide structure attached to the rear surface of a display module according to one embodiment of the present disclosure.

[0190] FIG. 19 is a perspective view of the rear surface of a display module, a portion of a guide structure, and a molding portion joined together according to one embodiment of the present disclosure.

[0191] FIG. 20 is a perspective view of a display module, a guide structure, and a waterproof sheet attached to a molding portion according to one embodiment of the present disclosure.

[0192] FIG. 21 is an enlarged perspective view of an area (S1) of FIG. 17 according to one embodiment of the present disclosure.

[0193] FIG. 22 is an enlarged perspective view of an area (S2) of FIG. 18 according to one embodiment of the present disclosure.

[0194] FIGS. 23a, 23b, and 23c are drawings showing the relationship between a display module and a molding cap for forming the molding portion of FIG. 19 according to one embodiment of the present disclosure.

[0195] FIG. 24a is a drawing showing a state in which a molding cap is placed on a display module for forming the molding portion of FIG. 19 according to an embodiment of the present disclosure.

[0196] FIG. 24b is a cross-sectional view of a region of FIG. 24a according to an embodiment of the present disclosure.

[0197] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 6) may include at least one of a front plate (220), a display module (310), a molding portion (330), a guide structure (340), and / or a waterproof sheet (350).

[0198] The configuration of the front plate (220), the display module (310), the molding part (330), the guide structure (340), and / or the waterproof sheet (350) of FIGS. 17 to 24b may be identical or similar to the configuration of the front plate (220), the display module (310), the molding part (330), the guide structure (340), and / or the waterproof sheet (350) of FIGS. 6 to 14. The embodiments of FIGS. 17 to 24b may be optionally combined with the embodiments of FIGS. 1 to 16b and FIGS. 25 to 27c.

[0199] FIG. 17, FIG. 18, FIG. 19, and FIG. 20 sequentially disclose a process of forming a bending portion (312a) of a flexible circuit board (312) exposed on the side of a display module (310) by wrapping the bending portion (312a) with a molding portion (330) so that the bending portion (312a) is not damaged by contact (e.g., collision) with a support bracket (e.g., support bracket (320) of FIG. 9).

[0200] FIG. 17, FIG. 18, FIG. 19, and FIG. 20 sequentially disclose a process of bonding a waterproof sheet (350) along a display module (310), a molding part (330), and a guide structure (340) for coupling the display module (310) and a support bracket (e.g., the support bracket (320) of FIG. 9).

[0201] Referring to FIGS. 17 and 21, before the guide structure (340) is attached to the display module (310), a process of filling an adhesive material (e.g., a bonding material) into an area (e.g., a bonding area (314)) on the back of the display module (310) may be performed. The layer to which the guide structure (340) is directly attached may be an adhesive sheet (313) disposed on the outermost layer of the display module (310). According to one embodiment, the adhesive sheet (313) includes a bonding area (314), and the bonding area (314) may have a plurality of holes (314a) formed therein. For example, the plurality of holes (314a) may have a shape penetrating the adhesive sheet (313) or a groove shape. An adhesive material (e.g., a bonding material) may be filled into the plurality of holes (314a), thereby substantially increasing the average thickness of the adhesive layer bonded to the guide structure (340). The increased adhesive layer can strengthen the bonding between the guide structure (340) and the display module (310).

[0202] According to one embodiment, guide structures (340) may be respectively arranged on both sides of a flexible circuit board (312) disposed on the back side of an adhesive sheet (313), and correspondingly, bonding areas (314) of the adhesive sheet (313) for filling an adhesive material (e.g., bonding material) may also be formed on both sides of the flexible circuit board (312).

[0203] Referring to FIGS. 18 and 22, a process of attaching a guide structure (340) to a display module (310) may be performed. The bonding surface of the guide structure (340) may be attached to an adhesive sheet (313). For example, the guide structure (340) may be attached to the adhesive sheet (313) by an adhesive material filled in the bonding area (314).

[0204] According to one embodiment, the guide structure (340) may include an inclined surface (341), a flat portion (343) extending from the inclined surface (341), and a connecting portion (342) for coupling with the molding portion (330). The inclined surface (341) may be shaped to be acutely inclined with respect to the rear surface (e.g., a surface facing the -Z axis) of the display module (310), and the inclined surface (341) may have a thickness that gradually decreases toward the opposite direction of the flexible circuit board (312). According to one embodiment, the guide structure (340) may include an alignment portion (344) that is disposed adjacent to the inclined surface (341) and / or the flat portion (343) and formed to guide coupling between the display module (310) and the molding cap (410). For example, the alignment portion (344) may be manufactured in a groove or recess shape that is different from the shape of the inclined surface (341) and / or the flat portion (343).

[0205] Referring to FIG. 19, FIG. 23a, FIG. 23b, FIG. 23c, FIG. 24a, and FIG. 24b, after the molding cap (410) is coupled onto the display module (310), a process of injecting and curing a molding liquid into the molding cap (410) can be performed.

[0206] According to one embodiment, in order to align the molding cap (410) on the back of the display module (310), first, the alignment portion (344) of the guide structure (340) and the guide portion (415) of the molding cap (410) can be positioned to face each other. The guide portion (415) of the molding cap (410) can be formed to correspond to the alignment portion (344). After the alignment is completed, the molding liquid can be injected into the injection port (411) while the display module (310) and the molding cap (410) are coupled. The molding cap (410) has a recessed space (417) formed corresponding to the shape of the molding portion (330), and the molding liquid can flow to fill the recessed space (417). The outlet (412) provides air flow within the recessed space (417) to facilitate movement of the molding liquid, or can check the injected amount of the molding liquid. For example, after confirming that the molding liquid is overflowing through the outlet (412), the injection of the molding liquid can be stopped.

[0207] According to one embodiment, the molding liquid filling the recessed space (417) of the molding cap (410) is hardened, and after the molding cap (410) is removed, the molding portion (330) can be formed. Each of the two sides of the molding portion (330) is formed to surround the connecting portion (342) of the guide structure (340) so that they can be joined to each other.

[0208] Referring to FIG. 20, a waterproof sheet (350) can be adhered to the display module (310). The waterproof sheet (350) can extend from one side of the molding portion (330) through the guide structure (340) to the adhesive sheet (313) of the display module (310). For example, the waterproof sheet (350) can be adhered along one side of the molding portion (330) through the inclined side (341) and the flat part (343) of the guide structure (340).

[0209] FIG. 25 is a perspective view showing a state of coupling of a display module and a support bracket, viewed toward the rear of an electronic device, according to one embodiment of the present disclosure.

[0210] FIG. 26 is a perspective view showing a state of coupling of a display module and a support bracket, viewed toward the front of an electronic device, according to one embodiment of the present disclosure.

[0211] FIGS. 27a, 27b, and 27c are perspective views showing alignment between a guide structure and a support bracket according to one embodiment of the present disclosure.

[0212] According to one embodiment, the electronic device (101) may include at least one of a front plate (220), a rear plate (280), a display module (310), a support bracket (320), a molding portion (330), a guide structure (340), and / or a waterproof sheet (350).

[0213] The configuration of the front plate (220), the rear plate (280), the display module (310), the support bracket (320), the molding part (330), the guide structure (340), and / or the waterproof sheet (350) of FIGS. 25 to 27c may be the same as or similar to the configuration of the front plate (220), the rear plate (280), the display module (310), the support bracket (320), the molding part (330), the guide structure (340), and / or the waterproof sheet (350) of FIGS. 1 to 24b. The embodiment of FIGS. 25 to 27c may be optionally combined with the embodiment of FIGS. 1 to 24b.

[0214] Referring to FIGS. 25 and 26, a waterproof sheet (350) made of an adhesive material is placed on the display module (310), the molding part (330), and the guide structure (340), and a process of combining the waterproof sheet (350) with the support bracket (320) can be performed.

[0215] According to one embodiment, the waterproof sheet (350) may be formed of a double-sided adhesive material, and one side may be adhered to the display module (310), the molding part (330), and the guide structure (340), and the other side may be adhered to the support bracket (320). The inclined side (341) of the guide structure (340) may include a slope shape so that a step does not occur between one side of the molding part (330) facing the support bracket (320) and one side (e.g., the rear side) of the display module (310). For example, when the waterproof sheet (350) extends from one side of the molding part (330) past the inclined side (341) of the guide structure (340) to the rear side of the display module (310), the waterproof sheet (350) may be arranged in full contact with the display module (310) (and / or the molding part (330)) so that no gap occurs. According to one embodiment, the waterproof sheet (350) can be positioned without lifting at the interface between the display module (310), the molding portion (330), and the guide structure (340), thereby limiting or reducing the inflow of foreign substances (e.g., fluid) into the interior of the electronic device (101).

[0216] According to one embodiment, in order to align and couple the molding cap (410) on the back of the display module (310), the alignment portion (344) of the guide structure (340) and a portion of the guide portion (325) of the support bracket (320) can be aligned while facing each other and then fitted together.

[0217] According to one embodiment, in order to align and couple the molding cap (410) on the back surface of the display module (310), the alignment line (333) of the molding portion (330) and another portion of the guide portion (325) of the support bracket (320) may be aligned while facing each other and then fitted together. For example, the molding portion (330) may include an alignment line (333) to guide coupling with the support bracket (320) together with the alignment portion (344) of the guide structure (340). The alignment line (333) may extend from one end of the alignment portion (344) of the guide structure (340) and may have a fine shape extending inwardly of the molding portion (330).

[0218] According to one embodiment, after the alignment and bonding are completed, the display module (310) (and / or the molding portion (330) and the guide structure (340)) and the support bracket (320) can be stably bonded and bonded to each other without a gap occurring between them through the waterproof sheet (350).

[0219] FIG. 28A is a perspective view of a front side of an electronic device according to one embodiment of the present disclosure.

[0220] FIG. 28b is a plan view looking toward the rear of an electronic device according to one embodiment of the present disclosure.

[0221] Referring to FIGS. 28A and 28B , the electronic device (500) may include a first housing (510) (e.g., a first housing structure) including a first side member (513) (e.g., a side bezel) and a second housing (520) (e.g., a second housing structure) including a second side member (523) (e.g., a side bezel) that are foldably coupled to each other with respect to a folding axis (F) through at least one hinge device (540, 540-1) (e.g., a hinge module or a hinge structure). For example, the first housing (510) and the second housing (520) may be configured as a foldable housing (e.g., a housing structure). For example, the electronic device (500) may include a first display (530) (e.g., a flexible display, a foldable display, or a main display) arranged to be supported by a first housing (510) and a second housing (520). For example, the first housing (510) may include a first side (511) and a second side (512) facing in an opposite direction (e.g., in the -z-axis direction) of the first side (511). For example, the second housing (520) may include a third side (521) and a fourth side (522) facing in an opposite direction (e.g., in the -z-axis direction) of the third side (521). For example, the first housing (510) may include a first rear cover (514) coupled with a first side member (513). For example, the second housing (520) may include a second rear cover (524) coupled with a second side member (523). For example, when the electronic device (500) is in a fully unfolded first state (e.g., an unfolded state or an unfolded state), the first side (511) and the third side (521) may be operated so that they face substantially the same direction (e.g., a Z-axis direction). For example, when the electronic device (500) is in a fully folded second state (e.g., a folded state or a folded state), the first side (511) and the third side (521) may face each other or face opposite directions.For example, the electronic device (500) may be operated to maintain a third state (e.g., an intermediate state) between the first state and the second state.

[0222] According to one embodiment, the electronic device (500) may include a receiver (501), at least one sensor module (504) (e.g., an ambient light sensor), and / or at least one first camera module (505) (e.g., a UDC, under display camera) disposed on a first side (511) of the first housing (510). For example, the electronic device (500) may include at least one key (506) disposed on a first side member (513). For example, the electronic device (500) may include a second display (531) (e.g., a sub-display), at least one second camera module (508), and / or a flash (509) disposed on a second side (512) of the first housing (510) (e.g., a first rear cover (514)). For example, the second display (531) may be disposed to be visible from the outside through at least a portion of the first rear cover (514). For example, the electronic device (500) may include a speaker (502), a microphone (503), or a connector port (507) arranged on the second side member (523). At least some of the aforementioned components may be arranged in the first housing (510) and / or the second housing (520).

[0223] According to one embodiment, the first display (530) (e.g., a flexible display) may include a first region (530a) (e.g., a first planar portion) corresponding to at least a portion of the first surface (511), a second region (530b) (e.g., a second planar portion) corresponding to at least a portion of the third surface (521), and a third region (530c) (e.g., a flexible portion) connecting the first region (530a) and the second region (530b) and allowing the electronic device (500) to be deformed in a second state (e.g., a folded state) and / or a third state (e.g., an intermediate state). For example, the third region (530c) may be positioned at a position that at least partially overlaps at least one hinge device (540, 540-1) when the first display (530) is viewed from above (e.g., in the Z-axis direction). For example, the first display (530) may be arranged so that it is not visible from the outside in the second state by having the first side (511) and the third side (521) face each other (e.g., inward-fold type). For example, the first display (530) may be arranged so that it is visible from the outside in the second state by having the first side (511) and the third side (521) face each other in opposite directions (e.g., outward-fold type).

[0224] FIG. 29A is a perspective view showing an unfolded state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0225] FIG. 29b is a perspective view showing an intermediate state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0226] FIG. 29c is a perspective view showing an intermediate state similar to a folded state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0227] FIG. 30 is an enlarged view of an area (P1) of the rear surface of the display module of FIG. 29b and some components coupled thereto, according to one embodiment of the present disclosure.

[0228] FIG. 31 is a perspective view of a waterproof sheet arranged in FIG. 30 according to one embodiment of the present disclosure.

[0229] According to one embodiment, an electronic device (e.g., the electronic device (500) of FIGS. 28A and 28B) may include at least one of a display module (610), a molding portion (630), a guide structure (640), a waterproof sheet (650), and / or a front plate (622).

[0230] The configuration of the display module (610) and the front plate (622) of FIGS. 29a to 31 may be the same as or similar to the configuration of the first display (530) and the first housing (510) of FIGS. 28a and 28b, and the first surface (511) (or the third surface (521) of the second housing (520)).

[0231] The configuration of the display module (610), the support bracket, the molding part (630), the guide structure (640), the waterproof sheet (650), and / or the front plate (622) of FIGS. 29a to 31 may be identical or similar to the configuration of the display module (610), the support bracket (320), the molding part (630), the guide structure (640), the waterproof sheet (650), and / or the front plate (622) of FIGS. 6 to 10. The embodiments of FIGS. 29a to 31 may be optionally combined with the embodiments of FIGS. 1 to 27c.

[0232] According to one embodiment, the molding portion (630) of the electronic device (500) may be at least partially disposed on an edge of the display module (610) and / or an edge of the front plate (622). For example, when looking toward the rear of the display module (610), the molding portion (630) may be disposed on a portion of the rear of the display module (610) (e.g., a side facing the -Z-axis direction) and / or the rear of the front plate (622) (e.g., a side facing the -Z-axis direction). For example, when looking toward the rear of the display module (610), the molding portion (630) may be disposed along an edge of a lower portion of the display module (610) (e.g., a side facing the -Y-axis direction) and / or a lower portion of the front plate (622) (e.g., a side facing the -Y-axis direction). Since the molding part (630) is arranged to surround the flexible circuit board (612), the corner area of ​​the lower part of the display module (610) where the flexible circuit board (612) is not arranged may not have the molding part (630) arranged.

[0233] According to one embodiment, the molding part (630) may be arranged to surround one side of the display module (610) and the flexible circuit board (612). According to one embodiment, after the flexible circuit board (612) extending from one end of the display module (610) is bent, the molding part (630) may be arranged on the rear side of the display module (610). For example, according to the molding part (630) forming process, after a silicone cap for molding (e.g., the molding cap (410) of FIG. 24a) is arranged on the rear side of the display module (610), the molding part (630) may be formed by injecting a molten molding liquid into an injection port (e.g., an injection port (411) of FIG. 23c) of the silicone cap. After the molding liquid has been cured and the silicone cap has been removed, the molding portion (630) can be formed to cover a portion of the edge of the display module (610), a bending portion (612a) of the flexible circuit board (612), and a portion of the edge of the front plate (622). Since the bending portion (612a) of the flexible circuit board (612) covered by the molding portion (630) does not come into direct contact with the support bracket (320), it can be protected from the influence of external impact.

[0234] According to one embodiment, the molding portion (630) may extend along the edge of the display module (610) and be connected to guide structures (640) positioned at one or both ends. For example, a portion of the guide structure (640) (e.g., a connecting portion (not shown)) may be positioned to be inserted into the molding portion (630). For example, both ends of the molding portion (630) may be positioned to surround a portion of the guide structure (640) (e.g., a connecting portion (not shown)). According to the molding process of the molding portion (630), the molten molding liquid may be positioned to surround a portion of the guide structure (640) and then be cured. Accordingly, the molding portion (630) and the guide structure (640) may maintain a fitting joint and maintain a strong bond as they have a large surface area in contact and adhere to each other.

[0235] According to one embodiment, the guide structure (640) of the electronic device (500) may be disposed at an edge of the display module (610). For example, when looking toward the rear side of the display module (610) (e.g., a side facing the -Z axis), the guide structure (640) may be disposed on a portion of the rear side of the display module (610). For example, when looking toward the rear side of the display module (610), the guide structure (640) may be positioned on a lower portion of the display module (610) (e.g., a side facing the -Y axis) such that one side thereof contacts and / or is coupled to the molding portion (630).

[0236] According to one embodiment, the guide structure (640) is disposed between the display panel (311) and the support bracket (e.g., the first side member (513) and / or the second side member (523) of FIGS. 28A and 28B), and may include a surface (641) that is inclined from one end of the molding portion (630) (e.g., the first side (630a)) toward one side (e.g., the rear side) of the display module (610). The inclined surface (641) of the guide structure (640) may include a slope shape so that a step does not occur between the first side (630a) of the molding portion (630) facing the support bracket (513, 523) and one side (e.g., the rear side) of the display module (610). The inclined surface (641) of the guide structure (640) can be arranged so that when the waterproof sheet (650) disposed on the first surface (630a) of the molding portion (630) extends toward the edge of the display module (610), a gap does not occur between the waterproof sheet (650) and the display module (610) (and / or the molding portion (630)) due to the step.

[0237] In one embodiment, the guide structure (640) may include a flat portion (643) extending from the inclined surface (641). The flat portion (643) may increase the bonding strength with the waterproof sheet (650).

[0238] According to one embodiment, the waterproof sheet (650) of the electronic device (500) may be extended from the first surface (630a) of the molding portion (630) past the inclined surface (641) of the guide structure (640) to the display module (610). According to one embodiment, the waterproof sheet (650) may be arranged along at least a portion of an edge of the display module (610), and may be formed on both sides with an adhesive material to couple the display module (610) and the support bracket (320).

[0239] According to one embodiment, the waterproof sheet (650) of the electronic device (500) may be arranged to surround at least a portion of the flexible circuit board (612). For example, the waterproof sheet (650) may be arranged in a form (e.g., a closed loop shape) to surround at least a portion of the flexible circuit board (612) disposed on the rear surface of the display module (610) (e.g., a display panel)).

[0240] According to one embodiment, the waterproof sheet (650) of the electronic device (500) may have an inclined shape with respect to the rear surface of the display module (610) as it is arranged along the inclined surface (641) of the guide structure (640). When the waterproof sheet (650) is arranged from the first surface (630a) of the molding part (630) to the display module (610), the boundary surface may be smoothly extended without a step, so that a gap may not be formed with the display module (610). Accordingly, the waterproof sheet (650) may limit or reduce foreign substances (e.g., fluid) from entering the electronic device (500).

[0241] FIG. 32A is a perspective view of a front view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0242] FIG. 32b is a perspective view of the rear side of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0243] FIG. 32c is a perspective view showing an electronic device in a folded state according to one embodiment of the present disclosure.

[0244] The components described with reference to FIGS. 32A to 32C may be partially or entirely identical to the components described with reference to FIG. 1. As shown in FIGS. 32A and 32B , an unfolded state of the electronic device (700) may be defined as a "first state." As shown in FIG. 32C , a folded state of the electronic device (700) may be defined as a "second state."

[0245] According to one embodiment, the electronic device (700) may include a housing (701). The electronic device (700) may include a display (702). The housing (701) may define a space in which the display (702) is placed. The display (702) may be a flexible display (702). At least a portion of the display (702) may be foldable or unfoldable.

[0246] According to one embodiment, the housing (701) may include a first housing (710), a second housing (720), and a third housing (730). The first housing (710) may be disposed between the second housing (720) and the third housing (730). The second housing (720) may be rotatably coupled to the first housing (710). The third housing (730) may be rotatably coupled to the first housing (710). The display (702) may include a first display area (702a) corresponding to the first housing (710), a second display area (702b) corresponding to the second housing (720), and a third display area (702c) corresponding to the third housing (730).

[0247] In one embodiment, the electronic device (700) may include a support (740, 750, 760). The support (740, 750, 760) may be positioned between a housing (710) and a display (702). The support (740, 750, 760) may be coupled to the housing (710) and may support the display (702). The support (740, 750, 760) may be positioned to surround an edge of the display (702). The support (740, 750, 760) may extend along a perimeter of the housing (710). The supports (740, 750, 760) may include a first support (740) disposed in the first housing (710), a second support (750) disposed in the second housing (720), and a third support (760) disposed in the third housing (730). The supports (740, 750, 760) may be referred to as a body. The supports (740, 750, 760) may be referred to as at least one of a frame, a sealing member, a peripheral part, a circumferential part, a peripheral structure, or a circumferential structure.

[0248] In one embodiment, the support (740, 750, 760) may include a first support (740). The first support (740) may be disposed between the first housing (710) and the display (702). The first support (740) may be disposed along an edge of the first housing (710). The first support (740) may include a first-first support (741) and a first-second support (742). At least a portion of the display (702) may be disposed between the first-first support (741) and the first-second support (742). The first-first support (741) may be disposed at one end of the first housing (710), and the first-second support (742) may be disposed at the other end of the first housing (710). Each of the first, second and third supports (740, 750, 760) may be referred to as a “support”. The supports (740, 750, 760) may be referred to as a “deco” or a “finishing member” or a “non-conductive member”.

[0249] In one embodiment, the support (740, 750, 760) may include a second support (750). The second support (750) may be disposed between the second housing (720) and the display (702). The second support (750) may be disposed along an edge of the second housing (720). The second support (750) may include a second-first support (751), a second-second support (752), and a second-third support (753). At least a portion of the display (702) may be disposed between the second-second support (752) and the second-third support (753). The second-first support (751) may connect the second-second support (752) and the second-third support (753). The second-first support (751) may extend along an edge of the second housing (720) (e.g., edge (722) of FIG. 31B). The second-first support (751) may be positioned between the edge (722) of the second housing (720) and the display (702). The second-first support (751) may be referred to as a “support frame” or a “first support frame.” Each of the second-second support (752) and the second-third support (753) may be referred to as a “second support frame.”

[0250] In one embodiment, the supports (740, 750, 760) may include a third support (760). The third support (760) may be disposed between the third housing (730) and the display (702). The third support (760) may be disposed along an edge of the third housing (730). The third support (760) may include a third-first support (761), a third-second support (762), and a third-third support (763). At least a portion of the display (702) may be disposed between the third-second support (762) and the third-third support (763). The third-first support (761) may connect the third-second support (762) and the third-third support (763). The third-first support (761) may extend along an edge of the third housing (730) (e.g., edge (732) of FIG. 31B). The third-first support (761) may be positioned between the edge (732) of the third housing (730) and the display (702). The third-first support (761) may be referred to as a “support frame” or a “first support frame.” Each of the third-second support (762) and the third-third support (763) may be referred to as a “second support frame.”

[0251] According to one embodiment, the first housing (710) may include a first-first side portion (711) and a first-second side portion (712). The first-first side portion (711) and the first-second side portion (712) may each form opposite sides of the first housing (710). The second housing (720) may be coupled with the first-first side portion (711). The third housing (730) may be coupled with the first-second side portion (712). The first-first side portion (711) may be referred to as a “first coupling portion.” The first-second side portion (712) may be referred to as a “second coupling portion.” The first-first side portion (711) may be referred to as a “first portion.” The first-second side portion (712) may be referred to as a “second portion.”

[0252] According to one embodiment, the second housing (720) may include a second-first side portion (721) and a second-second side portion (722). The second-first side portion (721) and the second-second side portion (722) may each form opposite sides of the second housing (720). The second-first side portion (721) may be coupled to the first housing (710). The second-second side portion (722) may form a side of the housing (710). The second-second side portion (722) may be referred to as an “edge.” The second-first side portion (721) may be referred to as a “third side portion.” The second-second side portion (722) may be referred to as a “fourth side portion.”

[0253] According to one embodiment, the third housing (730) may include a third-first side portion (731) and a third-second side portion (732). The third-first side portion (731) and the third-second side portion (732) may each form opposite sides of the third housing (730). The third-first side portion (731) may be coupled to the first housing (710). The third-second side portion (732) may form a side of the housing (710). The third-second side portion (732) may be referred to as an “edge.” The third-first side portion (731) may be referred to as a “fifth side portion.” The third-second side portion (732) may be referred to as a “sixth side portion.”

[0254] According to one embodiment, the electronic device (700) may include a first hinge (770) and a second hinge (780). The first hinge (770) may be disposed between the first housing (710) and the second housing (720). The first hinge (770) may be disposed between the first-first side portion (711) and the second-first side portion (721). The first hinge (770) may rotatably connect the first housing (710) and the second housing (720). The second hinge (780) may be disposed between the first housing (710) and the third housing (730). The second hinge (780) may be disposed between the first-second side portion (712) and the third-first side portion (731). The second hinge (780) can rotatably connect the first housing (710) and the third housing (730).

[0255] In one embodiment, the second housing (720) can rotate with respect to the first housing (710). The first hinge (770) can provide a center of rotation to the second housing (720). The first hinge (770) can connect the first-first side portion (711) and the second-first side portion (721). The third housing (730) can rotate with respect to the first housing (710). The second hinge (780) can provide a center of rotation to the third housing (730). The second hinge (780) can connect the first-second side portion (712) and the third-first side portion (731).

[0256] According to one embodiment, when the electronic device (700) is folded, each of the first, second, and third housings (710, 720, and 730) may be arranged in one direction (e.g., the +Y direction). For example, the third housing (730) may be arranged on the upper side of the first housing (710), and the second housing (720) may be arranged on the upper side of the third housing (730). For example, the third housing (730) may be arranged between the first housing (710) and the second housing (720). (e.g., G-type multi-folding)

[0257] According to one embodiment, when the electronic device (700) is folded, each of the first, second, and third housings (710, 720, 730) may be arranged in one direction (e.g., +Y direction). For example, the second housing (720) may be arranged on the upper side of the first housing (710), and the third housing (730) may be arranged on the lower side of the first housing (710). For example, the first housing (710) may be arranged between the second housing (720) and the third housing (720). (e.g., Z-type multi-folding)

[0258] FIG. 33 is a drawing showing the rear surface of a display module and some components associated therewith, according to one embodiment of the present disclosure.

[0259] FIG. 34 is an enlarged perspective view of a portion (P2) of FIG. 33 according to one embodiment of the present disclosure. FIG. 34 discloses a structure in which a waterproof sheet is placed in a portion (P2) of FIG. 33.

[0260] According to one embodiment, an electronic device (e.g., the electronic device (700) of FIGS. 32A to 32C) may include at least one of a display module (810), a molding portion (830), a guide structure (840), a waterproof sheet (850), and / or a front plate (822).

[0261] The configuration of the display module (810) and the front plate (822) of FIGS. 33 and 34 may be the same as or similar to the configuration of the display (702) of FIGS. 32a to 32c.

[0262] The configuration of the display module (810), the support bracket (320), the molding part (830), the guide structure (840), the waterproof sheet (850), and / or the front plate (822) of FIGS. 33 and 34 may be identical or similar to the configuration of the display module (310), the support bracket (320), the molding part (330), the guide structure (340), the waterproof sheet (350), and / or the front plate (220) of FIGS. 6 to 10. The embodiment of FIGS. 33 and 34 may be optionally combined with the embodiment of FIGS. 1 to 27c.

[0263] According to one embodiment, the molding portion (830) of the electronic device (700) may be at least partially disposed on an edge of the display module (810) and / or an edge of the front plate (822). For example, when looking toward the rear of the display module (810), the molding portion (830) may be disposed on a portion of the rear of the display module (810) (e.g., a side facing the -Z-axis direction) and / or the rear of the front plate (822) (e.g., a side facing the -Z-axis direction). For example, when looking toward the rear of the display module (810), the molding portion (830) may be disposed along an edge of a lower portion of the display module (810) (e.g., a side facing the -Y-axis direction) and / or a lower portion of the front plate (822) (e.g., a side facing the -Y-axis direction). Since the molding part (830) is arranged to surround the flexible circuit board (812), the corner area of ​​the lower part of the display module (810) where the flexible circuit board (812) is not arranged may not have the molding part (830) arranged.

[0264] According to one embodiment, the molding part (830) may be arranged to surround one side of the display module (810) and the flexible circuit board (812). According to one embodiment, after the flexible circuit board (812) extending from one end of the display module (810) is bent, the molding part (830) may be arranged on the rear side of the display module (810). For example, according to the molding part (830) forming process, after a silicone cap for molding (e.g., the molding cap (410) of FIG. 24a) is arranged on the rear side of the display module (810), the molding part (830) may be formed by injecting a molten molding liquid into an injection port (e.g., an injection port (411) of FIG. 23c) of the silicone cap. After the molding liquid has been cured and the silicone cap has been removed, the molding portion (830) can be formed to cover a portion of the edge of the display module (810), a bending portion (812a) of the flexible circuit board (812), and a portion of the edge of the front plate (822). Since the bending portion (812a) of the flexible circuit board (812) covered by the molding portion (830) does not come into direct contact with the support bracket (320), it can be protected from the influence of external impact.

[0265] According to one embodiment, the molding portion (830) may extend along the edge of the display module (810) and be connected to a guide structure (840) disposed at one or both ends. For example, a portion of the guide structure (840) (e.g., a connecting portion (not shown)) may be disposed to be inserted into the molding portion (830). For example, both ends of the molding portion (830) may be disposed to surround a portion of the guide structure (840) (e.g., a connecting portion (not shown)). According to the molding process of the molding portion (830), the molten molding liquid may be positioned to surround a portion of the guide structure (840) and then be cured. Accordingly, the molding portion (830) and the guide structure (840) may maintain a fitting joint and maintain a strong bond as they have a large surface area in contact and adhere to each other.

[0266] According to one embodiment, the guide structure (840) of the electronic device (700) may be disposed at an edge of the display module (810). For example, when looking toward the rear side of the display module (810) (e.g., a side facing the -Z axis), the guide structure (840) may be disposed on a portion of the rear side of the display module (810). For example, when looking toward the rear side of the display module (810), the guide structure (840) may be positioned on a lower portion of the display module (810) (e.g., a side facing the -Y axis) such that one side thereof contacts and / or is coupled to the molding portion (830).

[0267] According to one embodiment, the guide structure (840) is disposed between the display panel (311) and the support bracket (e.g., the support (740, 750, 760) of FIGS. 32A to 32C) and may include a surface (841) that is inclined from one end (e.g., the first surface (830a)) of the molding portion (830) toward one side (e.g., the rear side) of the display module (810). The inclined surface (841) of the guide structure (840) may include a slope shape so that a step does not occur between the first side (830a) of the molding portion (830) facing the support bracket (740, 750, 760) and one side (e.g., the rear side) of the display module (810). The inclined surface (841) of the guide structure (840) can be arranged so that when the waterproof sheet (850) disposed on the first surface (830a) of the molding portion (830) extends toward the edge of the display module (810), a gap does not occur between the waterproof sheet (850) and the display module (810) (and / or the molding portion (830)) due to the step.

[0268] According to one embodiment, the guide structure (840) may include a flat portion (843) extending from the inclined surface (841). The flat portion (843) may increase the bonding strength with the waterproof sheet (850).

[0269] According to one embodiment, the waterproof sheet (850) of the electronic device (700) may be arranged to surround at least a portion of the flexible circuit board (812). For example, the waterproof sheet (850) may be arranged in a form (e.g., a closed loop shape) to surround at least a portion of the flexible circuit board (812) disposed on the rear surface of the display module (810) (e.g., a display panel).

[0270] According to one embodiment, the waterproof sheet (850) of the electronic device (700) may be extended from the first surface (830a) of the molding portion (830) past the inclined surface (841) of the guide structure (840) to the display module (810). According to one embodiment, the waterproof sheet (850) may be arranged along at least a portion of an edge of the display module (810), and may be formed on both sides with an adhesive material to couple the display module (810) and the support bracket (320).

[0271] According to one embodiment, the waterproof sheet (850) of the electronic device (700) may have an inclined shape with respect to the rear surface of the display module (810) as it is arranged along the inclined surface (841) of the guide structure (840). When the waterproof sheet (850) is arranged from the first surface (830a) of the molding part (830) to the display module (810), the waterproof sheet (850) may smoothly extend without a step at the interface, so that a gap may not be formed with the display module (810). Accordingly, the waterproof sheet (850) may limit or reduce foreign substances (e.g., fluid) from entering the electronic device (700).

[0272] FIG. 35A is a diagram illustrating a first state (e.g., a close state or a slide in state) of an electronic device according to one embodiment of the present disclosure.

[0273] FIG. 35b is a diagram illustrating a second state (e.g., an open state or a slide-out state) of an electronic device according to one embodiment of the present disclosure.

[0274] The state illustrated in FIG. 35a may be defined as a state in which the electronic device (900) and / or the housings (901, 902) are closed, and the state illustrated in FIG. 35b may be defined as a state in which the electronic device (900) and / or the housings (901, 902) are open. The electronic device (900) may include, for example, a portable device (e.g., a smartphone, a tablet, a portable multimedia device, a portable medical device, a camera, a wearable device), a computer device, or a home appliance device. The electronic device (900) according to the embodiment of the present document is not limited to the above-described devices.

[0275] Referring to FIGS. 35A and 35B , an electronic device (900) may include housings (901, 902) and a display (903). The housings (901, 902) may include a first housing (901) and a second housing (902) that is arranged to be relatively movable with respect to the first housing (901). According to one embodiment, the first housing (901) may be arranged to be reciprocally movable a predetermined distance with respect to the second housing (902).

[0276] In one embodiment, the first housing (901) may be referred to as a first structure, a main portion, or a main housing. The second housing (902) may be referred to as a second structure, a slide portion, or a slide housing.

[0277] According to one embodiment, the first housing (901) can include a first sidewall member (919) that surrounds at least a portion of the second housing (902). The first sidewall member (919) can include a first sidewall (919a), a second sidewall (919b), and a third sidewall (919c). According to one embodiment, the second housing (902) can include a second sidewall member (929) that surrounds at least a portion of the display (903). The second sidewall member (929) can include a fourth sidewall (929a), a fifth sidewall (929b), and a sixth sidewall (929c). According to one embodiment, the first sidewall member (919) of the first housing (901) can be formed in a shape that is open on one side to accommodate at least a portion of the second housing (902).

[0278] According to one embodiment, the display (903) may include a first display area (A1) and a second display area (A2). According to one embodiment, the first display area (A1) may be arranged to correspond to the first housing (901). The second display area (A2) may extend from the first display area (A1) and may be inserted or housed inside the first housing (901) so as not to be visible from the outside, or may be visually exposed to the outside of the first housing (901) according to the sliding movement of the second housing (902).

[0279] According to one embodiment, the electronic device (900) may include a key input device (941), a connector hole (943), an audio module (947), and / or a camera module (949a, 949b). According to one embodiment, the connector hole (943) may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device. According to one embodiment, the connector hole (943) may be omitted. According to one embodiment, the audio module (947) may include a first audio module (e.g., a speaker) for providing sound through at least one speaker hole (947a) or a second audio module (e.g., a microphone) for receiving sound through at least one microphone hole (947b). According to one embodiment, the camera module (949a, 949b) may include a first camera module (949a) (e.g., a front camera) and a second camera module (949b) (e.g., a rear camera). According to one embodiment, the first camera module (949a) may not be visually exposed to the screen display area (e.g., the first display area (A1)) and may include a hidden under-display camera (UDC). The second camera module (949b) may capture a subject from a direction opposite to the first display area (A1) of the display (903).

[0280] FIG. 36A is a perspective view showing a closed state or a slide in state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0281] FIG. 36b is a perspective view showing an open state or a slide-out state of a flexible display module combined with some components according to one embodiment of the present disclosure.

[0282] FIG. 37 is an enlarged view of the rear surface of the display module of FIG. 36a and an area (P3) where some components combined therewith are arranged, according to one embodiment of the present disclosure.

[0283] FIG. 38 is a perspective view of the waterproof sheet arranged in FIG. 37 according to one embodiment of the present disclosure.

[0284] According to one embodiment, an electronic device (e.g., the electronic device (900) of FIGS. 35A and 35B) may include at least one of a display module (1010), a molding portion (1030), a guide structure (1040), a waterproof sheet (1050), and / or a front plate (1022).

[0285] The configuration of the display module (1010) and the front plate (1022) of FIGS. 36a to 38 may be identical or similar to the configuration of the display (903) of FIGS. 35a and 35b.

[0286] The configuration of the display module (1010), the support bracket (320), the molding part (1030), the guide structure (1040), the waterproof sheet (1050), and / or the front plate (1022) of FIGS. 36a to 38 may be identical or similar to the configuration of the display module (310), the support bracket (320), the molding part (330), the guide structure (340), the waterproof sheet (350), and / or the front plate (220) of FIGS. 6 to 10. The embodiments of FIGS. 36a to 38 may be optionally combined with the embodiments of FIGS. 1 to 27c.

[0287] According to one embodiment, the molding portion (1030) of the electronic device (900) may be at least partially disposed on an edge of the display module (1010) and / or an edge of the front plate (1022). For example, when looking toward the rear of the display module (1010), the molding portion (1030) may be disposed on a portion of the rear of the display module (1010) (e.g., a side facing the -Z-axis direction) and / or the rear of the front plate (1022) (e.g., a side facing the -Z-axis direction). For example, when looking toward the rear of the display module (1010), the molding portion (1030) may be disposed along an edge of a lower portion of the display module (1010) (e.g., a side facing the -Y-axis direction) and / or a lower portion of the front plate (1022) (e.g., a side facing the -Y-axis direction). As the molding part (1030) is arranged to surround the flexible circuit board (1012), the molding part (1030) may not be arranged in the corner area of ​​the lower part of the display module (1010) where the flexible circuit board (1012) is not arranged.

[0288] According to one embodiment, the molding part (1030) may be arranged to surround one side of the display module (1010) and the flexible circuit board (1012). According to one embodiment, after the flexible circuit board (1012) extending from one end of the display module (1010) is bent, the molding part (1030) may be arranged on the rear surface of the display module (1010). For example, according to the molding part (1030) forming process, after a silicone cap for molding (e.g., the molding cap (410) of FIG. 24a) is arranged on the rear surface of the display module (1010), the molding part (1030) may be formed by injecting a molten molding liquid into an injection port of the silicone cap (e.g., an injection port (411) of FIG. 23c). After the molding liquid has been cured and the silicone cap has been removed, the molding portion (1030) can be formed to cover a portion of the edge of the display module (1010), a bending portion (1012a) of the flexible circuit board (1012), and a portion of the edge of the front plate (1022). Since the bending portion (1012a) of the flexible circuit board (1012) covered by the molding portion (1030) does not directly contact the support bracket (320), it can be protected from the influence of external impact.

[0289] According to one embodiment, the molding portion (1030) may extend along the edge of the display module (1010) and be connected to a guide structure (1040) disposed at one or both ends. For example, a portion of the guide structure (1040) (e.g., a connecting portion (not shown)) may be disposed to be inserted into the molding portion (1030). For example, both ends of the molding portion (1030) may be disposed to surround a portion of the guide structure (1040) (e.g., a connecting portion (not shown)). According to the molding process of the molding portion (1030), the molten molding liquid may be positioned to surround a portion of the guide structure (1040) and then hardened. Accordingly, the molding portion (1030) and the guide structure (1040) may maintain a fitting joint and maintain a strong bond as they have a large surface area in contact and adhere to each other.

[0290] According to one embodiment, the guide structure (1040) of the electronic device (900) may be disposed at an edge of the display module (1010). For example, when looking toward the rear side of the display module (1010) (e.g., a side facing the -Z axis), the guide structure (1040) may be disposed on a portion of the rear side of the display module (1010). For example, when looking toward the rear side of the display module (1010), the guide structure (1040) may be positioned on a lower portion of the display module (1010) (e.g., a portion facing the -Y axis direction) such that one side thereof contacts and / or is coupled with the molding portion (1030).

[0291] According to one embodiment, the guide structure (1040) is disposed between the display panel (311) and the support bracket (e.g., the first side wall member (919), the second side wall member (929) of FIGS. 35A and 35B), and may include a surface (1041) that is inclined from one end (e.g., the first surface (1030a)) of the molding portion (1030) toward one side (e.g., the rear) of the display module (1010). The inclined surface (1041) of the guide structure (1040) may include a slope shape so that a step does not occur between the first side (1030a) of the molding portion (1030) facing the support bracket (919, 929) and one side (e.g., the rear) of the display module (1010). The inclined surface (1041) of the guide structure (1040) can be arranged so that when the waterproof sheet (1050) disposed on the first surface (1030a) of the molding portion (1030) extends toward the edge of the display module (1010), a gap does not occur between the waterproof sheet (1050) and the display module (1010) (and / or the molding portion (1030)) due to the step.

[0292] In one embodiment, the guide structure (1040) may include a planar portion (1043) extending from the inclined surface (1041). The planar portion (1043) may increase the bonding strength with the waterproof sheet (1050).

[0293] According to one embodiment, the waterproof sheet (1050) of the electronic device (900) may be extended from the first surface (1030a) of the molding portion (1030) past the inclined surface (1041) of the guide structure (1040) to the display module (1010). According to one embodiment, the waterproof sheet (1050) may be arranged along at least a portion of an edge of the display module (1010), and may be formed on both sides with an adhesive material to couple the display module (1010) and the support brackets (919, 929).

[0294] According to one embodiment, the waterproof sheet (1050) of the electronic device (900) may be arranged to surround at least a portion of the flexible circuit board (10012). For example, the waterproof sheet (1050) may be arranged in a form (e.g., a closed loop shape) to surround at least a portion of the flexible circuit board (1012) disposed on the rear surface of the display module (1010) (e.g., a display panel)).

[0295] According to one embodiment, the waterproof sheet (1050) of the electronic device (900) may have an inclined shape with respect to the rear surface of the display module (1010) as it is arranged along the inclined surface (1041) of the guide structure (1040). When the waterproof sheet (1050) is arranged from the first surface (1030a) of the molding part (1030) to the display module (1010), the boundary surface may be smoothly extended without a step, so that a gap may not be formed with the display module (1010). Accordingly, the waterproof sheet (1050) may limit or reduce foreign substances (e.g., fluid) from entering the electronic device (900).

[0296] An electronic device according to one embodiment of the present disclosure may be formed such that the bending portion of the display circuit board is surrounded by a molding portion to protect the bending portion. Accordingly, impact resulting from contact between the bending portion of the display circuit board and the support bracket can be limited or reduced.

[0297] An electronic device according to one embodiment of the present disclosure can restrict foreign substances (e.g., fluid) from entering when the display module and the support bracket are coupled by placing a waterproof sheet between the display module and the support bracket.

[0298] A waterproof sheet of an electronic device according to one embodiment of the present disclosure may be arranged along a display module, a guide structure, and a molding portion. The guide structure arranged between the display module and the molding portion includes an inclined surface, thereby limiting the waterproof sheet from being lifted by a step between the display module and the molding portion.

[0299] An electronic device according to one embodiment of the present disclosure can form a plurality of holes or recesses on a layer in contact with a guide structure in a display module and fill them with an adhesive material. Accordingly, the guide structure can be strongly adhered to the display module.

[0300] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0301] An electronic device (101) according to one embodiment of the present disclosure may include a support bracket (320), a display module (310) disposed on a front side of the support bracket, the display module (310) including a display panel (311) and a flexible circuit board (FPCB) (312) formed to be bent from one end of the display panel and arranged to face the display panel, a molding part (330) formed to surround a portion of an edge of the display panel and a bending portion (312a) of the flexible circuit board, a guide structure (340) disposed between the display panel and the support bracket and including a surface (341) inclined from one end of the molding part toward one side of the display module, and a waterproof sheet (350) extending from one side of the molding part through the inclined surface of the guide structure to the display module.

[0302] According to one embodiment, the guide structure (340) may further include a connecting portion (342) that is coupled to the molding portion.

[0303] According to one embodiment, the connecting portion of the guide structure may be formed to protrude toward the opposite side of the inclined surface and be at least partially surrounded by the molding portion.

[0304] According to one embodiment, the guide structure (340) may further include an alignment portion (344) for guiding alignment and coupling between the display module and the support bracket.

[0305] According to one embodiment, the guide structure (340) may further include a flat portion (343) disposed between the inclined surface and the connecting portion.

[0306] In one embodiment, the flat portion of the guide structure may provide a surface to which the waterproof sheet extends along one surface of the molding portion is adhered.

[0307] According to one embodiment, the waterproof sheet may be arranged along an edge of the display module and may be formed on both sides with an adhesive material to combine the display module and the support bracket.

[0308] According to one embodiment, the molding portion and the guide structure are disposed on the rear surface of the display module, and when viewed toward the rear surface of the display module, the inclined surface of the guide structure can be disposed between the display module and the molding portion.

[0309] According to one embodiment, the inclined surface of the guide structure may include a slope shape so that a step does not occur between one surface of the molding portion facing the support bracket and one surface of the display module.

[0310] According to one embodiment, the display module may include an adhesive sheet (313) disposed between the display panel and the support bracket and for bonding the display panel and the guide structure.

[0311] According to one embodiment, the adhesive sheet may include a plurality of holes (314a) formed on one surface corresponding to the guide structure. An adhesive material may be filled into the plurality of holes to strengthen the bonding between the display module and the guide structure.

[0312] According to one embodiment, a plurality of guide structures may be arranged at each end of the molding portion.

[0313] According to one embodiment, the electronic device may further include a front plate (220) covering the display module. The molding portion may be arranged along an edge of the front plate and an edge of the display module.

[0314] According to one embodiment, the molding portion (300) may include a first extension portion (334) having a first width (d1) that is formed to extend to overlap with the front plate and a portion of the display module, and a second extension portion (335) having a second width (d2) that extends from one end of the first extension portion for coupling with the guide structure.

[0315] According to one embodiment, the electronic device wherein the first width of the first extension portion is greater than the second width of the second extension portion.

[0316] In one embodiment, a portion of the waterproof sheet may be disposed from the guide structure through the second extension portion of the molding portion to the first extension portion of the molding portion.

[0317] According to one embodiment, the waterproof sheet disposed on the first extension portion may be positioned over the display module, and the waterproof sheet disposed on the second extension portion may be positioned over the front plate.

[0318] According to one embodiment, the molding portion (330) may extend from the alignment portion of the guide structure and include an alignment line (333) for guiding the coupling with the support bracket together with the alignment portion.

[0319] According to one embodiment, the support bracket may include a guide portion (415) formed to correspond with an alignment portion of the guide structure and at least a portion of which is fit-fitted with the alignment portion.

[0320] An electronic device according to one embodiment of the present disclosure may include a front plate (220), a support bracket (320) disposed below the front plate, a display module (310) disposed between the front plate and the support bracket, a molding part (330) disposed at least partially along an edge of the front plate and an edge of the display module, a guide structure (340) disposed on the display module in contact with the molding part and including an inclined surface (341), and a waterproof sheet (350) extending from one surface of the molding part to the display module through the inclined surface of the guide structure.

[0321] According to one embodiment, the guide structure (340) may further include a connecting portion (342) that is coupled to the molding portion. The connecting portion may be formed to protrude toward the opposite side of the inclined surface and be at least partially surrounded by the molding portion.

[0322] According to one embodiment, the guide structure (340) may further include an alignment portion (344) for guiding alignment and coupling between the display module and the support bracket.

[0323] According to one embodiment, the waterproof sheet may be arranged along an edge of the display module and may be formed on both sides with an adhesive material to combine the display module and the support bracket.

[0324] According to one embodiment, the inclined surface of the guide structure may include a slope shape so that a step does not occur between one surface of the molding portion facing the support bracket and one surface of the display module.

Claims

1. In an electronic device (101), Support bracket (320); A display module (310) disposed on the front side of the support bracket, comprising a display panel (311) and a flexible circuit board (FPCB) (312) formed to be bent from one end of the display panel and disposed to face the display panel; A molding part (330) formed to surround a portion of the edge of the display panel and a bending portion (312a) of the flexible circuit board; A guide structure (340) disposed between the display panel and the support bracket and including a surface (341) inclined from one end of the molding portion toward one side of the display module; and An electronic device comprising a waterproof sheet (350) extending from one side of the molding portion to the inclined surface of the guide structure and to the display module.

2. In paragraph 1, The above guide structure (340) further includes a connecting portion (342) that is coupled to the molding portion, An electronic device wherein the connecting portion protrudes toward the opposite side of the inclined surface and is formed to be at least partially surrounded by the molding portion.

3. In paragraph 1 or 2, An electronic device, wherein the guide structure (340) further includes an alignment portion (344) for guiding alignment and coupling between the display module and the support bracket.

4. In paragraph 2 or paragraph 3, The above guide structure (340) further includes a flat portion (343) disposed between the inclined surface and the connecting portion, An electronic device wherein the above-mentioned flat portion provides a surface to which the waterproof sheet extending along one side of the above-mentioned molding portion is adhered.

5. In any one of paragraphs 1 to 4, An electronic device wherein the waterproof sheet is arranged along the edge of the display module and has both sides formed with an adhesive material to combine the display module and the support bracket.

6. In any one of paragraphs 1 to 5, The above molding part and the above guide structure are arranged on the rear side of the display module, An electronic device wherein, when viewed toward the rear of the display module, the inclined surface of the guide structure is disposed between the display module and the molding portion.

7. In any one of paragraphs 1 to 6, An electronic device in which the inclined surface of the guide structure has a slope shape so that no step occurs between one surface of the molding portion facing the support bracket and one surface of the display module.

8. In any one of paragraphs 1 to 7, The above display module, An electronic device comprising an adhesive sheet (313) disposed between the display panel and the support bracket and for bonding the display panel and the guide structure.

9. In paragraph 8, The above adhesive sheet includes a plurality of holes (314a) formed on one surface corresponding to the guide structure, An electronic device in which an adhesive material is filled within the plurality of holes to strengthen the bonding between the display module and the guide structure.

10. In any one of paragraphs 1 to 9, An electronic device in which a plurality of guide structures are arranged at each end of the molding portion.

11. In any one of paragraphs 1 to 10, Further comprising a front plate (220) covering the above display module, An electronic device wherein the molding portion is arranged along the edge of the front plate and the edge of the display module.

12. In paragraph 11, The molding part (300) includes a first extension portion (334) having a first width (d1) extended to overlap with a part of the front plate and the display module, and a second extension portion (335) having a second width (d2) extended from one end of the first extension portion for coupling with the guide structure. An electronic device wherein the first width of the first extension portion is greater than the second width of the second extension portion.

13. In paragraph 12, A portion of the waterproof sheet is arranged from the guide structure through the second extension portion of the molding portion to the first extension portion of the molding portion, An electronic device, wherein the waterproof sheet disposed on the first extension portion is formed to be positioned over the display module, and the waterproof sheet disposed on the second extension portion is formed to be positioned over the front plate.

14. In at least one of paragraphs 3 to 13, An electronic device in which the molding portion (330) extends from the alignment portion of the guide structure and includes an alignment line (333) for guiding the combination with the support bracket together with the alignment portion.

15. In at least one of paragraphs 3 to 14, An electronic device wherein the support bracket is formed to correspond to the alignment portion of the guide structure and includes a guide portion (415) so that at least a portion thereof is fitted into the alignment portion.

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