Component, in particular piezoelectric multilayer component having electrical and / or mechanical contacts for a bending actuator and / or bending sensor

Abstract

The invention relates to a component having a main part (1) with at least a first and a second electrode, wherein a first electrical contact surface (4), which is electrically connected to the first electrode, and a second electrical contact surface (5), which is electrically connected to the second electrode, are provided on the lower face (2) of the main part. At least one purely mechanical contact surface (7), which is electrically floating, and / or at least one sensor contact surface (101), which is connected to a third electrode of the main part, is provided on the lower face of the main part, or one of the electrical contact surfaces (5) has a flat contact region (10) and a strip-shaped region (11) adjoining the flat contact region. The component can particularly be a ceramic piezoelectricl multilayer component for a bending actuator and / or bending sensor.

Description

[0001] Description

[0002] component

[0003] The present application relates to a component. The component may in particular be a multilayer ceramic component, for example a piezoelectric bender.

[0004] One task is to specify an improved component that, for example, experiences minimal distortion during a sintering process.

[0005] The problem is solved by the subject matter of the independent claims. Advantageous embodiments are the subject matter of the dependent claims.

[0006] In a first embodiment, the component comprises a base body with electrodes. Two electrical contact surfaces are arranged on the underside of the base body and are electrically connected to the electrodes. At least one purely mechanical contact surface, which is electrically floating, and / or at least one sensor contact surface, which is connected to an electrode of the base body, are arranged on the underside of the base body.

[0007] The electrical contact surfaces cannot completely cover the underside, as part of the underside is covered by the purely mechanical contact surface. Additionally, the underside may have sections that are free of the contact surfaces. The electrical contact surfaces can be considered as not completely or fully covering the underside if a significant portion of the underside is not covered by the contact surfaces. For example, at least 40% of the underside's surface might not be covered by the contact surfaces.

[0008] The component can be an electrical or electronic component. The component can be a multilayer component, in particular a ceramic multilayer component. The component can be a piezoelectric component, in particular a piezoelectric multilayer component. The component can be an actuator and / or a sensor. The component can be a piezoelectric bender, in particular a bimorphic piezoelectric bender.

[0009] The component can be designed to be mounted on a substrate, with the component's electrical contact surfaces being electrically connected to corresponding contact surfaces of the substrate. The purely mechanical contact surface is designed to be mechanically connected to the substrate. The purely mechanical contact surface is not intended to be electrically connected to the substrate.

[0010] The electrodes of the component can be internal electrodes. Alternatively or additionally, the electrodes of the component can include external electrodes arranged on side faces of the component that are perpendicular to the base.

[0011] The sensor contact surface is designed to be mechanically connected to the substrate. The sensor contact surface can be designed to be connected to a sensor that is either wired to or integrated into the substrate. The sensor contact surface can be designed to read a sensor signal via the sensor contact surface.

[0012] A voltage signal generated between the electrodes of the base body can be read from the contact surface.

[0013] The base body has at least one first electrode connected to the first electrical contact surface. Preferably, the base body has several first electrodes, each connected to the first electrical contact surface.

[0014] The base body has at least one second electrode connected to the second electrical contact surface. Preferably, the base body has several second electrodes, each connected to the second electrical contact surface. The base body is designed to be set into vibration by a voltage applied between the first and second electrodes. This allows a haptically perceptible signal to be generated.

[0015] The sensor contact surface is connected to a third electrode. An electrical potential generated at the third electrode can be read via the sensor contact surface. The component can be configured to determine a sensor signal as an electrical voltage between the electrical potential generated at the third electrode and a ground potential. The third electrode can be an internal electrode.

[0016] Alternatively, a second sensor contact surface can be connected to a fourth electrode of the base body. The component can be configured to detect a sensor signal as an electrical voltage between the third and fourth electrodes. The third and fourth electrodes can be internal electrodes of the base body.

[0017] The base body can contain several measuring electrodes, for example, one near the bottom, one in the middle, and one near the top. Each measuring electrode can be connected to a sensor contact surface. The component can be designed to determine sensor signals as an electrical voltage between the electrical potential generated at each measuring electrode and a ground potential. In this way, any bending of the component in different layers of the base body can be determined.

[0018] The size of the electrical contact surfaces can be limited by the addition of purely mechanical contact surfaces and / or sensor contact surfaces. Excessively large contact surfaces can lead to distortion during sintering or firing processes. This distortion can be caused by the sintering shrinkage of a metal paste from which the contact surfaces are manufactured. Conversely, if the contact surfaces are sufficiently small, the distortion can be reduced compared to larger contact surfaces.

[0019] Excessively large contact areas can be disadvantageous in a reflow soldering process, as wettability and positioning can be difficult to control. Using small electrical contact areas can avoid these disadvantages in reflow soldering. Combining these small electrical contact areas with at least one purely mechanical contact area ensures that a sufficiently large area of ​​the base body is metallized, thus providing good solderability.

[0020] The purely mechanical contact surface can be described as electrically floating if it is not electrically connected to the electrodes of the base body.

[0021] In one embodiment, at least one sensor contact surface is connected to the third electrode via a through-hole connection. Alternatively, at least one sensor contact surface can be connected to the third electrode via a reversing contact located on a side face of the component. If the reversing contacts are located on a single side face of the component, optical polarization detection can be performed via the reversing contacts in the installed state, even if the underside of the component is covered.

[0022] In a first embodiment, the component has a base body with electrodes, wherein two electrical contact surfaces are arranged on a bottom side of the base body, which are electrically connected to the electrodes, one of the electrical contact surfaces having a planar contact area and a strip-shaped area adjoining the planar area.

[0023] The flat contact area can be used for electrical purposes.

[0024] The contact is configured with contact surfaces of a substrate. The strip-shaped area can differ from the planar area of ​​the contact surface in that the strip-shaped area has a smaller width than the planar contact area. The width of the contact area can be defined as an extension of the contact surface that is perpendicular to a longitudinal direction of the component, where the longitudinal direction points from one electrical contact surface to the other. The strip-shaped area has a length and a width, each of which specifies an extension perpendicular to the surface normal of the underside. At any point of the strip-shaped area, the width and the length can be determined perpendicular to each other. The width can specify the smaller extension, and the length can specify the larger extension.

[0025] The striped area can perform a function analogous to that of the purely mechanical contact surface. By adding the striped area, it becomes possible to design the contact areas of the contact surfaces to be smaller, thereby reducing distortion during sintering or firing and avoiding the disadvantages of large contact areas during reflow soldering. At the same time, the striped area ensures that a sufficiently large portion of the underside is metallized, thus guaranteeing good solderability.

[0026] The strip-shaped contact area can be shaped such that it forms areas on the underside that are free from the contact surface and are surrounded on three sides by the strip-shaped contact area. The strip-shaped area can be meandering. The first and second embodiments can be combined. Accordingly, the component according to the first embodiment can have the strip-shaped area described above, and the component according to the second embodiment can have at least one purely mechanical contact surface and / or at least one sensor contact surface as described above.

[0027] The following are examples of both versions.

[0028] At least 40% of the underside of the base body must not be occupied by electrical contact surfaces. Preferably, at least 60% or at least 80% of the underside of the base body must not be occupied by electrical contact surfaces. The areas of the underside not occupied by electrical contact surfaces can either be free of metallization or consist of purely mechanical contact surfaces. If at least 40% of the underside of the base body is not occupied by electrical contact surfaces, it can be ensured that the electrical contact surfaces are not too large and the disadvantages of large contact surfaces described above are avoided. If 60% or 80% of the area is free of electrical contact surfaces, the disadvantages are avoided even more effectively.

[0029] Several purely mechanical contact surfaces, which are electrically floating, can be arranged on the underside of the base body. If several purely mechanical contact surfaces are used, it becomes possible to design these surfaces with a small area, so that they do not significantly contribute to distortion of the component during sintering or firing.

[0030] The purely mechanical contact surfaces can be arranged in an array between the two electrical contact surfaces. The purely mechanical contact surfaces can form at least one row extending in a longitudinal direction from one of the electrical contact surfaces to the other, with at least two purely mechanical contact surfaces arranged in the row.

[0031] Several sensor contact surfaces can be arranged on the underside.

[0032] One of the two electrical contact surfaces can be located at a first longitudinal end of the underside, and a second of the two electrical contact surfaces can have a planar contact area located more than the length of the first contact surface away from a second longitudinal end of the underside, opposite the first longitudinal end. This design ensures that if the component is accidentally mounted on a substrate in the wrong orientation, it will not be electrically in contact with the substrate, and the incorrect mounting can be quickly detected because the component will be inoperative. This increases safety and reliability.

[0033] Between the flat contact area of ​​the second

[0034] A purely mechanical contact surface can be arranged between the contact surface and the second longitudinal end. This prevents this area from being free of metallization, thus ensuring that this area also exhibits high solderability.

[0035] Each of the contact surfaces can have a metallization. Each of the contact surfaces can have tinned copper. This includes both electrical and purely mechanical contact surfaces.

[0036] A metallization can be applied to the upper surface of the component, opposite the underside. The metallization can either completely cover the upper surface or be structured, for example, replicating the structure of the contact surfaces on the underside. Metallizing the upper surface can help to counteract distortion of the component caused by the contact surfaces on the underside during sintering or firing.

[0037] The contact surfaces can be designed in such a way as to reduce distortion during the firing of the component. In particular, the component can experience less distortion during sintering or firing than a comparable component where the electrical contact surfaces cover a large area of ​​the underside.

[0038] The contact surfaces can be designed in such a way that the component exhibits high solderability. This high solderability can be ensured by metallizing a sufficiently large portion of the component's underside. Since the area of ​​the electrical contact surfaces, or rather the contact area of ​​the electrical contact surfaces, is limited, sufficient metallization can be achieved through the purely mechanical contact surface and / or the strip-shaped area.

[0039] All contact surfaces on the underside can have the same height. Therefore, the component is well-suited for gluing onto a substrate. The purely mechanical contact surface and / or the striped area ensure that there are no excessively large areas on the underside whose height is less than that of the electrical contact surfaces. Consequently, an adhesive can spread effectively between a substrate and the underside of the component.

[0040] The electrical contact surfaces can extend across one side surface each and partially cover one of the top surfaces of the base body opposite the underside. This can therefore be a so-called "edge contact".

[0041] An electrode can be arranged on both the top and bottom surfaces of the base body. This prevents the base body from having electrically inactive areas.

[0042] The component can be an actuator and / or a sensor. It can be designed to be used sequentially as both an actuator and a sensor. An electrical signal can be alternately applied to the electrodes via the electrical contact surfaces, causing the component to generate a haptically perceptible signal, while a sensor signal from the base body is received. This sensor signal is generated by applying a mechanical force to the base body, which in turn induces an electrical voltage within the base body, for example, due to the piezoelectric effect.

[0043] For many applications, it is sufficient to operate the component sequentially as a sensor and as an actuator.

[0044] Alternatively, the component can be designed to function simultaneously as an actuator and a sensor. For this purpose, an electrical signal can be applied to the electrodes via the electrical contact surfaces, causing the component to generate a haptically perceptible signal. Simultaneously, a sensor signal from the base body can be received via the sensor contact surfaces. This sensor signal can be generated by applying a mechanical force to the base body, thereby inducing an electrical voltage within it, for example, due to the piezoelectric effect.

[0045] Using the component simultaneously as a sensor and actuator allows for precise and rapid adjustment of the haptic signal generated by the component. For example, the haptic signal can be readjusted in real time based on the sensor signal.

[0046] Another aspect concerns an arrangement comprising the component described above and a substrate on which the component is mounted. The component can be attached to the substrate by soldering or by gluing. The substrate may have metallizations whose shape and arrangement correspond to a shape and arrangement of the

[0047] The contact surfaces of the component correspond to the following. The contact surfaces of the component can be arranged on the corresponding metallizations of the substrate.

[0048] The substrate may have depressions in which the electrical contact surfaces of the component are arranged.

[0049] The following are advantageous aspects. To facilitate reference, the aspects are numbered. The characteristics of the aspects are relevant not only in combination with the specific aspect to which they refer, but also when considered separately.

[0050] 1. Component comprising a base body with electrodes, wherein two electrical contact surfaces are arranged on a bottom side of the base body which are electrically connected to the electrodes, wherein at least one purely mechanical contact surface is arranged on the bottom side of the base body which is electrically floating.

[0051] 2. Component according to aspect 1, wherein one of the electrical contact surfaces has a planar contact area and a stripe-shaped area adjoining the planar contact area.

[0052] 3. Component according to aspect 2, wherein the strip-shaped area is shaped such that sections of the underside are formed which are free from the contact surfaces and which are surrounded on three sides by the strip-shaped area. Component according to aspect 2 or aspect 3, wherein the strip-shaped area is meandering. Component comprising a base body with electrodes, wherein two electrical contact surfaces are arranged on an underside of the base body which are electrically connected to the electrodes, one of the electrical contact surfaces having a planar contact area and a strip-shaped area adjoining the planar contact area. Component according to aspect 5, wherein the strip-shaped area is shaped such that sections of the underside are formed which are free from the contact surfaces and which are surrounded on three sides by the strip-shaped area.Component according to aspect 5 or aspect 6, wherein the strip-shaped area is meandering. Component according to any one of aspects 5 to 7, wherein at least one purely mechanical contact surface is arranged on the underside of the base body, which is electrically floating. Component according to any one of the preceding aspects, wherein at least 40% of the area of ​​the underside of the base body is not occupied by the electrical contact surfaces. Component according to any one of the preceding aspects, wherein several purely mechanical contact surfaces are arranged on the underside of the base body, which are electrically floating. Component according to the preceding aspect, wherein the purely mechanical contact surfaces are arranged in an array between the two electrical contact surfaces.A component according to one of aspects 10 or 11, wherein the purely mechanical contact surfaces form at least one row extending in a longitudinal direction from one of the electrical contact surfaces to the other of the electrical contact surfaces, wherein at least two purely mechanical contact surfaces are arranged in the row. A component according to one of the preceding aspects, wherein a first of the two electrical contact surfaces is arranged at a first longitudinal end of the bottom surface, and wherein a second of the two electrical contact surfaces has a planar contact area located from a second longitudinal end of the bottom surface, opposite the first longitudinal end, by more than the length of the first of the two electrical contact surfaces.Component according to the previous aspect, wherein a purely mechanical contact surface is arranged between the planar contact area of ​​the second of the two electrical contact surfaces and the second longitudinal end. Component according to one of the previous aspects, wherein each of the contact surfaces has a metallization. Component according to one of the previous aspects, wherein each of the contact surfaces has tinned copper. Component according to one of the previous aspects, wherein a metallization is applied to a top surface of the base body opposite the bottom surface. Component according to one of the previous aspects, wherein the contact surfaces are designed such that distortion during firing of the component is reduced. Component according to one of the previous aspects, wherein the contact surfaces are designed such that the component has high solderability.Component according to one of the preceding aspects, wherein all contact surfaces arranged on the underside have the same height. Component according to one of the preceding aspects, wherein the electrical contact surfaces extend over one side surface each and partially cover an upper surface of the base body opposite the underside. Component according to the preceding aspect, wherein an electrode is arranged on both the upper and underside of the base body. Component according to one of the preceding aspects, wherein it is an electrical component, and / or wherein it is a multilayer component, and / or wherein it is a ceramic multilayer component, and / or wherein it is a piezoelectric component, and / or wherein it is a piezoelectric multilayer component. Component according to one of the preceding aspects, wherein it is an actuator and / or a sensor.Component according to one of the preceding aspects, wherein it is a piezoelectric bender. Arrangement comprising a component according to one of the preceding aspects and a substrate on which the component is mounted. 27. Arrangement according to the preceding aspect, wherein the component is mounted on the substrate by soldering or by gluing.

[0053] 28. Arrangement according to one of aspects 26 or 27, wherein the substrate has metallizations whose shape and arrangement correspond to a shape and arrangement of the contact surfaces of the component.

[0054] 29. Arrangement according to one of aspects 26 to 28, wherein the substrate has depressions in which the electrical contact surfaces of the component are arranged.

[0055] Preferred examples of implementation are described below with reference to the figures.

[0056] Figures 1 to 3 show a component according to a first embodiment.

[0057] Figure 4 shows an arrangement comprising the component shown in Figures 1 to 3 and a substrate.

[0058] Figures 5 and 6 show the arrangement after the component has been attached to the substrate.

[0059] Figure 7 schematically illustrates the operating principle of the arrangement.

[0060] Figures 8 and 9 show a component according to a second embodiment. Figures 10 and 11 show the underside of a component according to a third embodiment.

[0061] Figures 12 and 13 show a component according to the fourth embodiment.

[0062] Figure 14 shows the underside 2 of a component according to a fifth embodiment.

[0063] Figure 15 shows the underside of a component according to a sixth embodiment.

[0064] Figure 16 shows the underside of a component according to a seventh embodiment.

[0065] Figure 17 shows the underside of a component according to an eighth embodiment.

[0066] Figures 18 and 19 show metallization on the top surface.

[0067] Figure 20 shows a contact surface 4 which extends over a side surface of the base body 1 and also covers part of the top surface 3 of the base body 1.

[0068] Figure 21 shows the arrangement of the component shown in Figure 20 on a substrate.

[0069] Figure 22 shows an arrangement consisting of a substrate and the component before the component is mounted on the substrate.

[0070] Figures 23 to 25 show various ways of mounting the component on the substrate. Figures 1 to 3 show a component according to a first embodiment. Figure 1 shows a perspective view of the underside of the component. Figure 2 shows a perspective view of the top side of the component, opposite the underside. Figure 3 shows a side view of the component.

[0071] The component is a multilayer piezoelectric device. Specifically, it is a piezoelectric bender. The component comprises a base body 1 in which layers of a piezoelectric material and first and second inner electrodes are arranged. In one stacking direction of the base body 1, first and second inner electrodes are arranged alternately one above the other, with a layer of the piezoelectric material positioned between each pair of adjacent inner electrodes.

[0072] On a bottom surface 2 of the base body, a first electrical contact surface 4 and a second electrical contact surface 5 are arranged. The bottom surface 2 of the base body 1 is designed to be mounted on a substrate 6, for example, a printed circuit board, in particular a PCB (printed circuit board) or an FCB (flexible circuit board). The electrical contact surfaces 4 and 5 are designed to be electrically connected to corresponding contact surfaces of the substrate 6. The electrical contact surfaces 4 and 5 are connected to the internal electrodes of the component. The first electrical contact surface 4 is connected to the first internal electrodes, and the second electrical contact surface 5 is connected to the second internal electrodes.

[0073] Internal electrodes are connected. The first electrical contact surface 4 and the second electrical contact surface 5 do not completely cover the underside 2 of the base body 1. Rather, a large area of ​​the underside 2 of the base body 1 is free from the electrical contact surfaces 4 and 5. The area of ​​the underside 2 of the base body 1 that is free from the electrical contact surfaces 4 and 5 comprises at least 40% of the area of ​​the underside 2 of the base body 1, preferably at least 60% of the area, and in particular at least 80% or at least 90% of the area of ​​the underside 2 of the base body 1. In this way, large electrical contact areas are avoided.

[0074] Large electrical contact surfaces can lead to warping of the base body 1 during a sintering or firing process. This warping can be triggered by the shrinkage of a metal paste during sintering or firing. It can also occur due to the drying of the metallic paste from which the contact surfaces are made. Furthermore, with large contact surfaces, controlling the wetting and precise positioning of the contact surfaces in reflow soldering processes can be difficult.

[0075] By using small electrical contact areas 4 , 5 these disadvantages can be avoided and a component with preferred properties can be constructed.

[0076] Furthermore, purely mechanical contact surfaces 7 are arranged on the underside 2 of the base body 1. The purely mechanical contact surfaces 7 are electrically floating and therefore not connected to the electrodes of the component. In the first embodiment shown in Figures 1 to 3, the underside 2 has several purely electrical contact surfaces 7 arranged in a row. The row extends in a longitudinal direction L of the base body, from the first electrical contact surface 4 to the second electrical contact surface 5. The purely mechanical contact surfaces 7 have a rectangular, in particular square, shape.

[0077] The first electrical contact surface 4 and the second electrical contact surface 5 differ in their geometric shape. In particular, the first electrical contact surface 4, unlike the second electrical contact surface 5, has truncated corners. The different geometric shapes of contact surfaces 4 and 5 ensure optical detection of the component's polarity.

[0078] Both the electrical contact surfaces 4, 5 and the mechanical contact surfaces 7 have the same height. All contact surfaces 4, 5, 7 are formed by metallization, in particular by tinned copper. Tinning prevents oxidation of the copper layer. Furthermore, the use of tinned copper eliminates the need for silver.

[0079] The height is defined as the extent of the contact surfaces 4, 5, 7 in the direction of the surface normal of the underside 2. If the component is glued to a substrate 6, the uniform height of the contact surfaces 4, 5, 7 ensures a stable adhesive bond along the entire length of the component. Figure 4 shows an arrangement comprising the component shown in Figures 1 to 3 and a substrate 6 onto which the component is attached. Figure 5 shows a perspective view of the arrangement after the component has been attached to the substrate 6. Figure 6 shows a side view of the arrangement.

[0080] The substrate 6 has metallizations 8 on its upper surface facing the component, the position and shape of which are adapted to the shape and position of the contact surfaces 4, 5, 7 of the component. When the component is attached to the substrate 6, each of the contact surfaces 4, 5, 7 of the component rests against one of the metallizations 8 of the substrate 6.

[0081] The substrate 6 is fixed at both of its longitudinal ends and is free-floating between the two ends, and particularly in the area where the component is attached. Accordingly, the substrate 6 can be bent if a force is exerted on the component or if the component bends due to an applied stress.

[0082] A sensor 9 is arranged on an underside of the substrate 6 that points away from the component.

[0083] Figure 7 schematically illustrates the operating principle of the arrangement shown in Figures 4 to 6. When a mechanical force is applied to the component, both the component and the substrate 6 are bent. In the simplified representation of Figure 7, a user presses their finger directly onto the component. Typically, an actuating surface, such as a button or a touch-sensitive screen, can be arranged between the component and the user's finger, through which a force applied by the user is transmitted to the component.

[0084] Figures 8 and 9 show a component according to a second embodiment. Figure 8 shows a perspective view and Figure 9 shows a top view of the underside. The second embodiment differs from the first embodiment in the design of the contact surfaces 4, 5, 7.

[0085] In the second embodiment, purely mechanical contact surfaces 7 are arranged in an array on the underside 2 of the base body 1. Specifically, the purely mechanical contact surfaces 7 are arranged in two parallel rows extending in a longitudinal direction L from the first electrical contact surface 4 to the second electrical contact surface 5. The purely mechanical contact surfaces 7 have a rectangular shape.

[0086] The second embodiment also offers the advantage that a large area of ​​the underside 2 of the base body 1 is metallized, thus ensuring good solderability of the component. At the same time, large contact surfaces can be avoided, thereby preventing the associated disadvantages of distortion during sintering and the difficulty in controlling wetting and positioning during reflow soldering. The underside is also well-designed for bonding to a substrate 6, as the contact surfaces have the same height, thus enabling stable adhesion along the entire length. Figures 10 and 11 show the underside of a component according to a third embodiment. Figure 10 shows a perspective view, and Figure 11 shows a top view of the underside.

[0087] As in the second embodiment, purely mechanical contact surfaces 7 are arranged in two rows, running parallel to each other and extending from the first electrical contact surface 4 to the second electrical contact surface 5. According to the second embodiment, each row has four purely mechanical contact surfaces 7. According to the third embodiment, each row has eight purely mechanical contact surfaces 7. The advantages described above for the second embodiment are also achieved in the third embodiment.

[0088] Figures 12 and 13 show a component according to the fourth embodiment. Figure 12 shows a perspective view of the underside and Figure 13 shows a top view of the underside.

[0089] In the fourth embodiment, several purely mechanical contact surfaces 7 are arranged in a single row extending in a longitudinal direction L from the first electrical contact surface 4 to the second electrical contact surface 5. The purely mechanical contact surfaces 7 are rectangular and have a length that is less than their width. The length indicates the extent in the longitudinal direction, and the width indicates the extent in a direction perpendicular to both the longitudinal direction and the height. Figure 14 shows the underside 2 of a component according to a fifth embodiment. The component according to the fifth embodiment does not have a purely mechanical contact surface. The second electrical contact surface 5 has a planar, rectangular contact area 10. In addition, the second electrical contact surface 5 has a strip-shaped area 11 as an extension of the contact area 10.

[0090] The striped area 11 begins at the planar contact area 10 and extends towards the first contact surface 4. The striped area 11 has a meandering shape. The striped area 11 is significantly thinner than the planar contact area 10. The striped area 11 extends almost over the entire area of ​​the underside 2 between the first contact surface 4 and the contact area 10 of the second contact surface 5.

[0091] The strip-shaped region 11 encloses sections 12 of the bottom surface 2, which are enclosed on three sides by the strip-shaped region 11 and are free of metallization. The sections 12 form interruptions in the metallization of the bottom surface 2 and ensure that distortion of the component during sintering is reduced. Even if the metal paste shrinks during a sintering or firing process, this does not cause distortion of the component because the strip-shaped region 11 does not cover a large area of ​​the bottom surface.

[0092] Furthermore, the striped area 11 ensures that there is no excessively large area of ​​the underside 2 that is free of metallization. Accordingly, the underside exhibits good solderability.

[0093] In the fifth embodiment, the strip-shaped area 11 of the second contact surface 5 thus takes over the function of the purely mechanical contact surfaces 7. The strip-shaped area 11 ensures that a sufficiently large area of ​​the underside 2 is metallized, thereby guaranteeing good solderability. Furthermore, the meandering shape and the narrow width of the strip-shaped extension ensure that the disadvantages of large contact surfaces are avoided. In particular, distortion during sintering or firing, as well as difficult-to-control wettability and positioning during a reflux soldering process, are prevented.

[0094] The component according to the fifth embodiment is also well designed to be glued onto a substrate 6, since excessively large gaps between contact surfaces 4, 5, 7 are avoided.

[0095] Figure 15 shows the underside of a component according to a sixth embodiment. In the sixth embodiment, the position of the second contact surface 5 is offset compared to the first embodiment. In particular, the second contact surface 5 is not located directly at the second end of the component. Rather, the second contact surface 5 has a planar contact area 10 that is located far enough away from the second end of the component that the distance Al between the second end of the component and the contact area 10 is greater than the length L4 of the first contact surface 4. The contact area 10 is also connected to the side surface by two contact ridges 13. The contact ridges 12 ' 3 are arranged such that they would not overlap with the first contact surface 4 if the first contact surface 4 were rotated 180° around the center of the component.

[0096] This arrangement of the second contact surface 5 represents an additional safety feature (Poka-Yoke feature). If the component were accidentally attached to the substrate 6 in the wrong orientation, the offset arrangement of the first and second contact surfaces 4, 5 relative to each other would ensure that the contact surfaces 4, 5 would not come into contact with electrical contact surfaces of the substrate 6. Rather, both the first and second contact surfaces 4, 5 of the component would be offset relative to the corresponding contact surfaces of the substrate 6, so that contact with reversed polarity of the component is impossible.

[0097] In addition, a purely mechanical contact surface 7 is arranged between the second electrical contact surface 5 and the second end of the component.

[0098] In another embodiment not shown, purely mechanical contact surfaces 7 can be formed by a ball grid array of contact surfaces. A ball grid array has round contact surfaces.

[0099] Figure 16 shows a bottom side of a component according to a seventh embodiment.

[0100] The component has the first and second electrical contact surfaces 4, 5, purely mechanical contact surfaces 7, and a sensor contact surface 101. The base body 1 has a third internal electrode. The first, second, and third internal electrodes are not connected to each other.

[0101] The sensor contact surfaces 101 are electrically contacted with the third inner electrode. For this purpose, the sensor contact surfaces 101 are connected to the third inner electrode via a re-contact 103, which extends over a side surface 104 of the base body 1. The side surface 104 is perpendicular to the underside 2 of the base body and perpendicular to the top surface 3 of the base body. The side surface 104 connects the underside 2 with the top surface 3.

[0102] Several sensor contact surfaces 101 can be connected to a single third inner electrode. Alternatively, the base body can have several third inner electrodes, each sensor contact surface 101 being connected to a different third inner electrode.

[0103] An electrical potential is generated at the third inner electrode of the base body 1 as a result of a force acting on the base body 1. This potential can be measured via the sensor contact surfaces 101. The component can be operated as an actuator via the electrical contact surfaces 4, 5. The component can also be operated as a sensor via the sensor contact surfaces 101. The component is designed to operate simultaneously as both an actuator and a sensor.

[0104] The simultaneous operation of the component as a sensor and as an actuator enables fast and precise adjustment of a generated haptic signal. All contact points 103 are arranged on the same side surface 104 of the base body 1. This allows for optical polarity marking of the component when the underside 2 is connected to a substrate 6. The contact points 103 are not completely obscured and can be easily detected from the outside, thus enabling optical inspection.

[0105] Figure 17 shows a bottom side 2 of a component according to an eighth embodiment.

[0106] The component according to the eighth embodiment has a first and a second electrical contact surface 4, 5 and sensor contact surfaces 101, which are arranged on the underside of the component. The sensor contact surfaces 101 are connected to third internal electrodes of the base body 1 via vias 105. The component has no purely mechanical contact surfaces.

[0107] In this way, as in the seventh example, it is possible to use the component simultaneously as an actuator to generate a vibration and as a sensor to detect a force exerted on the component.

[0108] The first to eighth embodiments of the component shown here can be combined with one another as desired. For example, each of the electrical contact surfaces 4, 5 of the first to fourth and the sixth to eighth embodiments could additionally have a strip-shaped extension. The component of the fifth embodiment shown in Figure 14 could additionally have one or more purely mechanical contact surfaces 7. The contact areas 10 of the contact surfaces 4, 5 of the first to fifth embodiments could be arranged offset, as shown for the sixth embodiment. In the first to sixth embodiments, sensor contact surfaces could be added, which are connected to third internal electrodes.

[0109] In the first to eighth embodiments, the upper surfaces 3 of the base body are free of metallization. In alternative embodiments, a metallization 14 can be arranged on the upper surface of the respective component.

[0110] Metallization 14 can be tinned copper. Metallization 14 can exhibit metallic structures that have the shape of the contact surfaces 4, 5, 7 on the underside 2.

[0111] Figure 18 shows a top surface of a component with a metallization having the shape of the contact surfaces 4, 5, 7 that the component according to the first embodiment has. This metallization 14 is therefore particularly suitable for the component according to the first embodiment. Analogous metallizations can also be designed for the components according to the further embodiments, in each case replicating the shape of the contact surfaces.

[0112] Figure 19 shows an alternative embodiment of the metallization 14 on the top surface 3 of the base body 1. The metallization 14 shown in Figure 19 is applied over a large area on the top surface 3. Both the metallizations 14 shown in Figure 18 and those shown in Figure 19 on the top surface are designed to further reduce the distortion of the component during firing or sintering. The metallizations 14 are each formed by metal pastes that shrink during firing or sintering in the same way as the metal pastes on the bottom surface 2 of the base body 1. The metallizations 14 on the top surface 3 generate forces that counteract the forces arising on the bottom surface 2, thus enabling an overall reduction in distortion.

[0113] Figure 20 shows a first contact surface 4, which is not only located on the underside of the component, but also extends over a side surface of the base body 1 and covers part of the top surface 3 of the base body 1. Each of the previously shown electrical contact surfaces 4, 5 can be configured in this way. The contact surface shown here is electrically contacted with the first internal electrodes of the component.

[0114] Furthermore, another electrode can be arranged on the upper surface 3 of the base body 1, which is electrically contacted with the first contact surface 4. A second electrode is arranged on the lower surface 2 of the base body 1, which is electrically contacted with the second contact surface 5. This second electrode is located at the second elongated end of the component and also extends from the lower surface 2 of the base body 1 across the side surface of the base body 1 to an upper surface 3 of the base body 1. Electrically inactive areas on the upper surface 3 and on the lower surface 2 of the base body 1 are thus avoided. Figure 21 shows the arrangement of the component shown in Figure 20 on a substrate 6. The substrate 6 has recesses 15 in the area of ​​the electrical contact surfaces 4, 5, into which the electrical contact surfaces 4, 5 of the component are received.The electrical contact surface shown in Figure 20, which extends over the side and part of the top surface, has a greater height compared to flat contact surfaces. To accommodate this greater height, corresponding recesses are incorporated into the substrate.

[0115] The recesses 15 are designed to accommodate the contact surface. Short circuits can be avoided by arranging the contact surfaces in the recesses 15.

[0116] Figure 22 shows an arrangement consisting of a substrate 6 and the component before the component is mounted on the substrate 6. Figures 23 and 24 show different ways of mounting the component on the substrate.

[0117] Figure 23 shows that the component is bonded by an adhesive layer.

[0118] The adhesive layer 16 is glued to the substrate 6. Since both the electrical and purely mechanical contact surfaces 4, 5, 7 have the same height, the underside of the component has only a few gaps into which the adhesive layer 16 penetrates. In this way, a stable bond can be achieved over the entire length.

[0119] Figure 24 shows a component that is attached to the substrate 6 by means of a soldered connection 17. The electrical contact surfaces 4, 5 of the component are soldered to corresponding electrical contact surfaces of the substrate 6. The purely mechanical contact surfaces 7 of the component are connected to corresponding purely mechanical

[0120] Contact surfaces of substrate 6 are soldered.

[0121] Figure 25 shows a component in which the electrical contact surfaces 4, 5 are connected to corresponding contact surfaces of the substrate 6 by means of connecting wires 18. The component is attached to the substrate 6 such that the underside 2 of the base body 1 faces away from the substrate 6. The top side 3 of the base body 1 is glued to the substrate 6. This type of connection has the advantage that chemical reactions can be avoided.

[0122] If a component with sensor contact surfaces 101, as shown in the seventh and eighth exemplary embodiments, is mounted on a substrate 6 which has sensors for evaluating sensor signals, the sensors can be connected to the component via the sensor contact surfaces 101 without additional effort. If the substrate 6 does not have additional sensors, the functionality of the component is not affected by the sensor contact surfaces 101.

[0123] Reference character list

[0124] 1 Basic body

[0125] 2 Underside of the base body

[0126] 3 Top side of the base body

[0127] 4 first electrical contact surface

[0128] 5 second electrical contact surface

[0129] 6 Substrat

[0130] 7 purely mechanical contact surfaces

[0131] 8 Metallization of the substrate

[0132] 9 Sensor

[0133] 10 Contact area

[0134] 11 striped area

[0135] Section 12

[0136] 13 Contact bridge

[0137] 14 Metallization of the top surface

[0138] 15 In-depth study

[0139] 16 adhesive layers

[0140] 17 Soldered connection

[0141] 18 connecting wire

[0142] 101 Sensor contact surface

[0143] 103 Re-contacting

[0144] 104 side area

[0145] 105 Through-hole plating

[0146] L Longitudinal direction

[0147] Al distance

[0148] L4 Length of the first contact area

Claims

Patent claims 1. Component comprising a base body (1) with at least one first and one second electrode, wherein a first electrical contact surface (4) which is electrically connected to the first electrode and a second electrical contact surface (5) which is electrically connected to the second electrode are arranged on a bottom surface (2) of the base body (1), wherein at least one purely mechanical contact surface (7) which is electrically floating and / or at least one sensor contact surface (101) which is connected to a third electrode of the base body (1) are arranged on the bottom surface (2) of the base body (1).

2. Component according to claim 1, wherein the at least one sensor contact surface (101) is arranged on the underside (2) of the base body (1), and wherein the sensor contact surface (101) is connected to the third electrode via a through-hole (105).

3. Component according to claim 1, wherein the at least one sensor contact surface (101) is arranged on the underside (2) of the base body (1), and wherein the sensor contact surface (101) is connected to the third electrode via a re-contacting (103) arranged on a side surface (104) of the component.

4. Component according to one of the preceding claims, wherein one of the electrical contact surfaces (5) has a planar contact area (10) and a strip-shaped area (11) adjoining the planar contact area (10).

5. Component according to claim 4, wherein the strip-shaped area (11) is shaped such that sections (12) of the underside (2) are formed which are free from the contact surfaces (4, 5) and which are surrounded on three sides by the strip-shaped area (11).

6. Component according to claim 4 or claim 5, wherein the strip-shaped area (11) is meander-shaped.

7. Component comprising a base body (1) with at least one first and one second electrode, wherein a first electrical contact surface (4) which is electrically connected to the first electrode and a second electrical contact surface (5) which is electrically connected to the second electrode are arranged on a bottom surface (2) of the base body (1), wherein the second electrical contact surface (5) has a planar contact area (10) and a strip-shaped area (11) which adjoins the planar contact area (10).

8. Component according to claim 7, wherein the strip-shaped area (11) is shaped such that sections (12) of the underside (2) are formed which are free from the contact surfaces (4, 5) and which are surrounded on three sides by the strip-shaped area (11).

9. Component according to claim 7 or claim 8, wherein the strip-shaped area (11) is meander-shaped.

10. Component according to one of claims 7 to 9, wherein at least one purely mechanical contact surface (7) is arranged on the underside (2) of the base body (1), which is electrically floating.

11. Component according to one of claims 7 to 10, wherein a sensor contact surface (101) is arranged on the underside (2) of the base body (1), which is connected to a third electrode of the base body (1).

12. Component according to claim 11, wherein the sensor contact surface (101) is connected to the third electrode via a through-hole (105) or via a re-hole (103) arranged on a side surface (104) of the component.

13. Component according to one of the preceding claims, wherein at least 40% of the surface of the underside (2) of the base body (1) is not exposed to the electrical Contact surfaces (4, 5) are occupied.

14. Component according to one of the preceding claims, wherein several purely mechanical contact surfaces (7) are arranged on the underside (2) of the base body (1), which are electrically levitated.

15. Component according to the previous claim, wherein the purely mechanical contact surfaces (7) are arranged in an array between the two electrical contact surfaces (4, 5).

16. Component according to one of claims 10 or 11, wherein the purely mechanical contact surfaces (7) form at least one row extending in a longitudinal direction (L) from one of the electrical contact surfaces (4) to the other of the electrical contact surfaces (5), wherein at least two purely mechanical contact surfaces (7) are arranged in the row.

17. Component according to one of the preceding claims, wherein several sensor contact surfaces (7) are arranged on the underside (2) of the base body (1).

18. Component according to one of the preceding claims, wherein the first electrical contact surface (4) is arranged at a first longitudinal end of the underside (2) and wherein the second electrical contact surface (5) has a planar contact area (10) which is located from a second longitudinal end of the underside (2) opposite the first longitudinal end by more than the length (L4) of the first of the two electrical contact surfaces (4).

19. Component according to the preceding claim, wherein a purely mechanical contact surface (7) is arranged between the planar contact area (10) of the second contact surface (5) and the second longitudinal end .

20. Component according to one of the preceding claims, wherein each of the contact surfaces (4, 5, 7) has a metallization.

21. Component according to one of the preceding claims, wherein each of the contact surfaces (4, 5, 7) comprises tinned copper.

22. Component according to one of the preceding claims, wherein a metallization (14) is applied to a top surface (3) of the base body (1) opposite the bottom surface (2).

23. Component according to one of the preceding claims, wherein the contact surfaces (4, 5, 7) are designed in such a way as to reduce distortion during firing of the component.

24. Component according to one of the preceding claims, wherein the contact surfaces (4, 5, 7) are designed such that the component has a high solderability.

25. Component according to one of the preceding claims, wherein all contact surfaces (4, 5, 7) arranged on the underside (2) have the same height.

26. Component according to one of the preceding claims, wherein the electrical contact surfaces (4, 5) each extend over a side surface and partially cover a top surface (3) of the base body (1) opposite the bottom surface (2).

27. Component according to the previous claim, wherein an electrode is arranged on the top (3) and on the bottom (2) of the base body (1).

28. Component according to any of the preceding claims, wherein it is an electrical component, and / or wherein it is a multilayer component, and / or wherein it is a ceramic multilayer component, and / or wherein it is a piezoelectric component, and / or wherein it is a piezoelectric multilayer component.

29. Component according to one of the preceding claims, wherein it is an actuator and / or a sensor.

30. Component according to one of the preceding claims, wherein the component is designed to be used simultaneously as an actuator and as a sensor.

31. Component according to one of the preceding claims, wherein it is a piezoelectric bender.

32. Arrangement comprising a component according to one of the preceding claims and a substrate (6) on which the component is attached.

33. Arrangement according to the preceding claim, wherein the component is attached to the substrate (6) by soldering or by adhesive bonding.

34. Arrangement according to claim 32 or 33, wherein the substrate has metallizations (8) whose shape and arrangement correspond to a shape and arrangement of the contact surfaces (4, 5, 7) of the component.

35. Arrangement according to any one of claims 32 to 34, wherein the substrate (6) has recesses (15) in which the electrical contact surfaces (4, 5) of the component are arranged.

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