Coaxial packaging device and optical communication module

Abstract

The present application relates to the technical field of optical communication modules, and provides a coaxial packaging device and an optical communication module. The coaxial packaging device comprises a header, a lens holder, and a lens. A first column and an optoelectronic chip for photoelectric conversion are provided on the header. The first column has a bearing surface distant from the header. The lens holder is mounted on the bearing surface. The lens is mounted on the lens holder. The lens implements optical path coupling between the optoelectronic chip and an external element. The coaxial packaging device is suitable for high-coupling-efficiency occasions where a lens is close to a laser, facilitates mounting and fixing of the lens, and facilitates the adjustment of the coupling position of the lens in a three-axis direction.

Description

Coaxial packaged devices and optical communication modules

[0001] This application claims priority to Chinese Patent Application No. 202421009998.7, filed on May 10, 2024, entitled "Coaxial Package Device and Optical Communication Module", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This utility model relates to the field of optical communication module technology, and more specifically, to a coaxial packaging device and an optical communication module. Background Technology

[0003] In applications requiring high coupling efficiency, lenses often need to be actively coupled, and the optical path itself has a high magnification. In such cases, the lens is close to the laser, and the installation space for the lens is limited, making it difficult to place the lens outside the cap. Currently, the internal socket structure of coaxial packaged devices cannot effectively support the lens, preventing the lens from achieving active coupling along the X, Y, and Z axes on the socket, which can easily lead to misalignment. Utility Model Content

[0004] The purpose of this invention is to provide a coaxial packaged device and an optical communication module that can effectively fix a lens on a socket, realize active coupling of the lens in three axial directions, and improve the coupling accuracy of the lens.

[0005] The embodiments of this utility model are implemented as follows:

[0006] In a first aspect, this utility model provides a coaxial packaged device, comprising:

[0007] A tube base, wherein a first column and a photoelectric chip for photoelectric conversion are provided on the tube base, and the first column has a bearing surface away from the tube base;

[0008] A lens transition ring, which is mounted on the bearing surface;

[0009] A lens is mounted on the lens transition ring, and the lens enables optical path coupling between the optoelectronic chip and external components.

[0010] In an optional embodiment, the tube base has a mounting surface for mounting the first column; the first column extends in a direction perpendicular to the mounting surface.

[0011] The mounting surface is circular, and the first column is continuously arranged along the circumferential direction on the mounting surface.

[0012] In an optional embodiment, a plurality of first columns are provided on the mounting surface, and the plurality of first columns are distributed at intervals along the circumferential direction on the mounting surface.

[0013] In an optional embodiment, the first column further includes an outer peripheral surface and an inner surface that are respectively connected to the bearing surface, the outer peripheral surface and the inner surface being disposed opposite to each other; both the outer peripheral surface and the inner surface are arc-shaped surfaces; the arc length of the arc formed by the projection of the outer peripheral surface onto the mounting surface is greater than half the circumference of the circle in which the projection is located; the photoelectric chip is disposed inside the arc formed by the inner surface.

[0014] In an optional embodiment, a second column is provided on the mounting surface, the second column being used to mount the optoelectronic chip; the second column is located in the middle of the mounting surface relative to the first column.

[0015] In an optional embodiment, the optoelectronic chip includes a laser, and the coaxial packaged device further includes a laser carrier plate, which is mounted on the second column, and the laser is mounted on the laser carrier plate.

[0016] In an optional embodiment, the lens transition ring has a through hole extending along its axial direction, and the lens is mounted within the through hole.

[0017] In an optional embodiment, a tube cap is also included, which covers the tube base, and the lens and the first column are disposed inside the tube cap.

[0018] In an optional embodiment, the first column and the tube base are integrally formed.

[0019] In an optional embodiment, the first column and the lens transition ring are welded or bonded together.

[0020] Secondly, this utility model provides an optical communication module, including a pigtail top and a coaxial packaging device as described in any of the foregoing embodiments, wherein the pigtail top and the coaxial packaging device are connected.

[0021] The beneficial effects of this utility model embodiment include:

[0022] The coaxial packaging device provided in this embodiment of the invention has a first post on the tube base for supporting and fixing the lens, facilitating lens installation. Furthermore, the first post provides a platform for coupling adjustment of the lens in the X and Y directions, and with the addition of a lens transition ring, coupling adjustment in the Z direction can be achieved. In this way, active coupling of the lens in three axes can be realized on the tube base, improving lens coupling accuracy.

[0023] The optical communication module provided in this embodiment includes a pigtail top and the aforementioned coaxial packaging device. The lens can be actively coupled in three axes on the mounting base, making it suitable for applications where the laser and lens are close together. This optical communication module has a compact structure and high coupling efficiency. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 is a schematic diagram of the overall structure of the coaxial packaging device provided in the embodiment of this utility model;

[0026] Figure 2 is a schematic diagram of the disassembled structure of the coaxial packaged device provided in the embodiment of this utility model;

[0027] Figure 3 is a schematic diagram of the lens mounting structure in the coaxial packaging device provided in the embodiment of this utility model;

[0028] Figure 4 is a first-view structural schematic diagram of the first type of first pillar structure and tube seat in the coaxial packaging device provided in the embodiment of this utility model;

[0029] Figure 5 is a second-view structural schematic diagram of the first type of first pillar structure and tube seat in the coaxial packaging device provided in the embodiment of this utility model;

[0030] Figure 6 is a schematic diagram of the structure of the second type of first pillar in the coaxial packaging device provided in the embodiment of this utility model;

[0031] Figure 7 is a schematic diagram of the third type of first pillar in the coaxial packaging device provided in the embodiment of this utility model;

[0032] Figure 8 is a structural schematic diagram of an optical communication module including a coaxial package device provided in an embodiment of this utility model.

[0033] Icons: 100 - Coaxial package device; 110 - Tube socket; 111 - Mounting surface; 121 - First post; 1211 - Bearing surface; 1213 - Outer peripheral surface; 1215 - Inner surface; 123 - Second post; 125 - Notch; 130 - Lens transition ring; 140 - Lens; 151 - Laser; 153 - Laser carrier plate; 155 - Photodetector; 160 - Tube cap; 171 - Pin; 173 - Glass insulator; 200 - Optical communication module; 210 - Pigtail assembly. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0038] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0039] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] In some special applications requiring high coupling efficiency, lenses often need to be actively coupled, and the optical path itself has a large magnification. In such cases, the distance between the lens and the laser is relatively short, requiring the lens to be mounted inside a cap. However, in most existing optical communication modules, the lens is mounted outside the cap. The socket structure inside commonly used coaxial packages cannot effectively support the lens, making it impossible for the lens to achieve active coupling along the X, Y, and Z axes inside the cap.

[0041] To overcome at least one deficiency in the prior art, this embodiment proposes a coaxial packaging device that facilitates the mounting of a lens on a mounting base, enabling active coupling of the lens along the X, Y, and Z axes on the mounting base, thus meeting the installation requirement of close proximity between the lens and the laser. Furthermore, this coaxial packaging device 100 has a compact structure and high coupling efficiency.

[0042] Referring to Figures 1 to 4, this embodiment provides a coaxial package device 100, including a socket 110, a lens transition ring 130, and a lens 140. The socket 110 has a first post 121 and a photoelectric chip for photoelectric conversion. The first post 121 has a bearing surface 1211 away from the socket 110. The lens transition ring 130 is mounted on the bearing surface 1211. The lens 140 is mounted on the lens transition ring 130. The lens 140 enables optical path coupling between the photoelectric chip and external components. This coaxial package device 100 is suitable for high-coupling-efficiency applications where the lens 140 is close to the laser 151, facilitating the mounting and fixing of the lens 140 on the socket, and making it easy to adjust the active coupling position of the lens 140 in the X, Y, and Z axes.

[0043] The tube base 110 has a mounting surface 111 for mounting the first post 121. The first post 121 extends along a direction perpendicular to the mounting surface 111. A lens transition ring 130 is mounted on the bearing surface 1211 of the first post 121. The mounting surface 111 is circular. The first posts 121 are continuously or intermittently arranged along the circumference on the mounting surface 111. As shown in Figures 4 and 5, the first posts 121 are continuously arranged along the circumference on the mounting surface 111. As shown in Figure 6, multiple first posts 121 are provided on the mounting surface 111. The multiple first posts 121 are intermittently distributed along the circumference on the mounting surface 111.

[0044] In this embodiment, the first post 121 is C-shaped or U-shaped. A notch 125 is formed in the circumferential direction of the first post 121. The notch 125 provides ample operating space for processes such as mounting the laser 151 and the laser carrier 153, and gold wire bonding, facilitating the mounting of the laser 151 and the laser carrier 153, and facilitating the electrical connection between the laser carrier 153 and the external pins 171. There can be one or more notches 125, and the shape, position, and number of notches 125 are not specifically limited.

[0045] The first column 121 also includes an outer peripheral surface 1213 and an inner surface 1215, which are respectively connected to the bearing surface 1211. The outer peripheral surface 1213 and the inner surface 1215 are arranged opposite to each other. Both the outer peripheral surface 1213 and the inner surface 1215 are arc-shaped surfaces. The arc length of the arc formed by the projection of the outer peripheral surface 1213 onto the mounting surface 111 is greater than half the circumference of the circle in which the projection is made. For example, the arc formed by the projection of the outer peripheral surface 1213 of the first column 121 onto the mounting surface 111 can be a 2 / 3 circle, a 3 / 4 circle, a 4 / 5 circle, etc. This can increase the contact area between the lens transition ring 130 and the first column 121, providing sufficient connection space when using laser welding or other fixing methods later, and making the support and fixing of the lens transition ring 130 and the lens 140 more reliable. Furthermore, it allows for a symmetrical design of the fixing position of the lens transition ring 130, resulting in a more stable structure that is less prone to displacement or shifting. The photoelectric chip is located inside the arc formed by the inner surface 1215.

[0046] Of course, in some embodiments, the projection of the outer peripheral surface 1213 of the first column 121 onto the mounting surface 111 may also be V-shaped, L-shaped or other shapes.

[0047] Referring to Figure 6, a second pillar 123 is also provided on the mounting surface 111. The second pillar 123 is used to mount the optoelectronic chip. The second pillar 123 is located in the middle of the mounting surface 111 relative to the first pillar 121. In the structure shown in Figure 6, the first pillar 121 adopts a three-segment design with intervals. The first pillar 121 is located near the edge of the mounting surface 111. The first pillar 121 is used to support and fix the lens transition ring 130. A second pillar 123 is provided at the center of the mounting surface 111. The second pillar 123 is used to mount the optoelectronic chip. The second pillar 123 and the first pillar 121 can be arranged alternately and independently. The second pillar 123 and the first pillar 121 can also be connected together and arranged continuously, which is not specifically limited here.

[0048] Optionally, the coaxial package device 100 also includes a laser carrier 153. The optoelectronic chip includes a laser 151. The laser carrier 153 is mounted on the second post 123. The laser 151 is mounted on the laser carrier 153. The laser 151 and the laser carrier 153 are electrically connected.

[0049] In this embodiment, the light source is located on the side. If the first column 121 adopts the structure shown in Figure 4, the laser 151 and the laser carrier plate 153 are disposed on the inner sidewall of the annular structure formed by the first column 121. The laser carrier plate 153 can be fixed to the inner sidewall 1215 of the first column 121 by means of gold soldering or silver glue bonding. This structure is suitable for the transmitting end of optical transmission.

[0050] It is easy to understand that the positions of the laser 151 and the laser carrier plate 153 on the tube base 110 depend on the position of the light source. If the light source is located on the top surface, a platform (not shown) parallel to the tube base 110 can be extended from the inner side 1215 of the first column 121. The laser carrier plate 153 is placed on the platform. The laser 151 is mounted on the laser carrier plate 153. Alternatively, the laser carrier plate 153 can be directly mounted on the mounting surface 111 of the tube base 110; no specific limitation is made here.

[0051] Referring to Figure 7, the optoelectronic chip includes a photodetector 155, which is fixed on the mounting surface 111 of the tube socket 110, approximately located in the central region of the tube socket 110. The first pillar 121 includes a plurality of spaced-apart first pillars 121 disposed around the outer periphery of the photodetector 155, which together support and fix the lens transition ring 130. This structure is suitable for the receiving end of optical transmission.

[0052] It is understandable that the bearing surfaces 1211 of the multiple first pillars 121 can have the same or different shapes. As long as the bearing surfaces 1211 of the multiple first pillars 121 are located on the same plane, they can provide stable support for the lens transition ring 130.

[0053] Optionally, the first column 121 and the tube base 110 can be integrally formed. This facilitates manufacturing and eliminates assembly steps. Of course, the first column 121 and the tube base 110 can also be manufactured independently and connected separately, such as by bonding or welding.

[0054] Optionally, the first post 121 and the lens transition ring 130 are welded or bonded. In this embodiment, the lens 140 and the lens transition ring 130 are welded using laser penetration welding. The lens transition ring 130 and the first post 121 are welded using laser lap welding.

[0055] The lens transition ring 130 has a through hole extending along its axial direction, and the lens 140 is mounted in the through hole. The lens 140 can be fixed to the wall of the through hole by means of bonding or welding.

[0056] Referring to Figure 2, the coaxial package device 100 also includes a cap 160, which covers the base 110. The cap 160 and the base 110 are welded together. The lens 140 and the first post 121 are both located inside the cap 160. The cap 160 protects the lens 140, the first post 121, the laser 151, and the laser carrier plate 153. In applications requiring airtightness, the cap 160 can be a flat-window cap 160. The flat-window glass in the flat-window cap 160 is sintered with the tubular metal component using glass solder to improve structural airtightness. If there are no special requirements for airtightness, the cap 160 can omit the flat-window glass and replace it with a metal tube with a light-transmitting hole at the top.

[0057] The tube socket 110 is also provided with a pin 171 and a glass insulator 173. The pin 171 is sintered onto the tube socket 110 at high temperature through the glass insulator 173 to ensure the airtightness of the connection between the pin 171 and the tube socket 110. The pin 171 is electrically connected to the laser carrier plate 153 through a lead wire.

[0058] In this coaxial package device 100, the lens 140 can move along the X, Y, and Z axes depending on the coupling conditions, and is fixed to the first post 121 of the tube base 110 via a lens transition ring 130, achieving effective fixation and support of the lens 140 within the tube cap 160. It can be understood that the outer diameter of the lens 140 is adapted to the aperture size of the through hole in the lens transition ring 130 to facilitate axial movement along the lens transition ring 130, achieving active coupling along the Z-axis. Because the lens 140 is mounted within the tube cap 160, the structure is more compact, making it suitable for high-coupling-efficiency applications where the laser 151 and lens 140 are close together. Furthermore, this coaxial package device 100 can be used in both optical transmission receivers and transmitters, offering a wide range of applications.

[0059] Referring to Figure 8, this embodiment of the present invention also provides an optical communication module 200, including a pigtail top 210 and a coaxial package device 100 as described above, wherein the pigtail top 210 and the coaxial package device 100 are connected.

[0060] In summary, the coaxial packaging device 100 and optical communication module 200 provided in this embodiment of the present invention have the following beneficial effects:

[0061] The coaxial packaging device 100 provided in this embodiment of the invention has a first post 121 on the tube base 110 for supporting and fixing the lens 140, facilitating the installation of the lens 140 inside the tube cap 160. The first post 121 also provides a platform for the coupling adjustment of the lens 140 in the X and Y directions. With the addition of the lens transition ring 130, the coupling adjustment of the lens 140 in the Z direction can be achieved. When the lens 140 is adjusted to a suitable position, the lens 140 and the through-hole wall of the lens transition ring 130 can be fixed together by dispensing adhesive or laser welding, and the lens transition ring 130 and the first post 121 are also fixed together. This enables active coupling of the lens 140 in three axes inside the tube cap 160, improving the coupling accuracy of the lens 140. Furthermore, the coaxial packaging device 100 has a more compact structure and higher coupling efficiency.

[0062] The optical communication module 200 provided in this embodiment includes a pigtail top 210 and the aforementioned coaxial package device 100. The lens 140 can perform active coupling in three axes within the cap 160, suitable for applications where the laser 151 and the lens 140 are close together. This optical communication module 200 has a compact structure and high coupling efficiency.

[0063] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A coaxial packaged device, characterized in that, include: The tube base (110) is provided with a first post (121) and a photoelectric chip for photoelectric conversion. The first post (121) has a bearing surface (1211) away from the tube base (110). Lens transition ring (130), the lens transition ring (130) is mounted on the bearing surface (1211); Lens (140) is mounted on the lens transition ring (130) and the lens (140) realizes the optical path coupling between the optoelectronic chip and external components.

2. The coaxial packaged device according to claim 1, characterized in that, The tube base (110) has a mounting surface (111) for mounting the first column (121); the first column (121) extends in a direction perpendicular to the mounting surface (111); The mounting surface (111) is circular, and the first column (121) is continuously arranged along the circumferential direction on the mounting surface (111).

3. The coaxial packaged device according to claim 2, characterized in that, The mounting surface (111) is provided with a plurality of first columns (121), and the plurality of first columns (121) are distributed at intervals along the circumferential direction on the mounting surface (111).

4. The coaxial packaged device according to claim 2, characterized in that, The first column (121) also includes an outer peripheral surface (1213) and an inner surface (1215) that are respectively connected to the bearing surface (1211). The outer peripheral surface (1213) and the inner surface (1215) are arranged opposite to each other. Both the outer peripheral surface (1213) and the inner surface (1215) are arc-shaped surfaces. The arc length of the arc formed by the projection of the outer peripheral surface (1213) on the mounting surface (111) is greater than half the circumference of the circle in which the projection is located. The photoelectric chip is disposed inside the arc formed by the inner surface (1215).

5. The coaxial packaged device according to claim 2, characterized in that, The mounting surface (111) is provided with a second column (123), which is used to mount the optoelectronic chip; the second column (123) is located in the middle of the mounting surface (111) relative to the first column (121).

6. The coaxial packaged device according to claim 5, characterized in that, The optoelectronic chip includes a laser (151), and the coaxial packaged device also includes a laser carrier plate (153). The laser carrier plate (153) is mounted on the second column (123), and the laser (151) is mounted on the laser carrier plate (153).

7. The coaxial packaged device according to claim 1, characterized in that, The lens transition ring (130) has a through hole extending along its axial direction, and the lens (140) is mounted in the through hole.

8. The coaxial packaged device according to claim 1, characterized in that, It also includes a cap (160), which covers the tube seat (110), and the lens (140) and the first column (121) are disposed inside the cap (160).

9. The coaxial packaged device according to claim 1, characterized in that, The first column (121) and the tube base (110) are integrally formed.

10. The coaxial packaged device according to any one of claims 1 to 9, characterized in that, The first column (121) and the lens transition ring (130) are welded or bonded together.

11. An optical communication module, characterized in that, It includes a pigtail top (210) and a coaxial package device as claimed in any one of claims 1 to 10, wherein the pigtail top (210) and the coaxial package device are connected.

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