Waveguide antenna, waveguide antenna assembly, radio frequency apparatus, radar, and electronic device

Abstract

Embodiments of the present application relate to the technical field of electronic devices, and provide a waveguide antenna, a waveguide antenna assembly, a radio frequency apparatus, a radar, and an electronic device, capable of achieving transmission of a signal between a waveguide antenna and a chip without an additional conversion structure, thereby greatly reducing structural complexity and production costs. The waveguide antenna comprises multiple waveguide interfaces arranged in an array, adjacent waveguide interfaces being orthogonally arranged. Each waveguide interface comprises a single ridged waveguide port, the single ridged waveguide port being used for transmitting a radio frequency signal radiated and / or received by the waveguide antenna.

Description

Waveguide antennas, waveguide antenna assemblies, radio frequency devices, radar and electronic equipment Cross-references

[0001] This application claims priority to Chinese patent applications filed on May 8, 2024, entitled "RF Module, Radar and Electronic Equipment" (application number 202420990276.8), entitled "RF Module, Radar and Electronic Equipment" (application number 202410566287.8), entitled "RF Module, Radar and Electronic Equipment" (application number 202410566287.8), entitled "Waveguide Antenna, Waveguide Antenna Assembly, RF Device, Radar and Electronic Equipment" (application number 202421243182.0), entitled "Waveguide Antenna, Waveguide Antenna Assembly, RF Device, Radar and Electronic Equipment" (application number 202410706273.1), entitled "Waveguide Antenna, Waveguide Antenna Assembly, RF Device, Radar and Electronic Equipment" (application number 202410706273.1), all of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic device technology, and in particular to a waveguide antenna, a waveguide antenna assembly, a radio frequency device, radar, and electronic equipment. Background Technology

[0003] Metal waveguide antennas offer advantages over PCB (Printed Circuit Board) antennas, including lower loss, higher gain, and lower cost. They are gradually replacing PCB antennas and becoming the mainstream in many fields (e.g., automotive millimeter-wave antennas). However, when applying metal waveguide antennas to radio frequency (RF) devices, structural modifications are typically required to enable signal transmission between the metal waveguide antenna and the RF device's chip. This undoubtedly increases structural complexity and production costs, necessitating optimization. Summary of the Invention

[0004] This application provides a waveguide antenna, a waveguide antenna assembly, a radio frequency device, a radar, and an electronic device, which can realize signal transmission between the waveguide antenna and the chip, and can significantly reduce structural complexity and production costs.

[0005] According to some embodiments of this application, a first aspect of this application provides a waveguide antenna, including a plurality of waveguide interfaces arranged in an array, with adjacent waveguide interfaces orthogonally arranged; the waveguide interface includes a single-ridge waveguide port, which is used to transmit radio frequency signals radiated and / or received by the waveguide antenna.

[0006] According to some embodiments of this application, a second aspect of this application provides a waveguide antenna assembly, including the waveguide antenna described above and a PCB board; the waveguide antenna is disposed on one side of the PCB board, and a waveguide port is provided on the side of the PCB board facing the waveguide antenna, and the waveguide port is configured to correspond one-to-one with the waveguide interface of the waveguide antenna.

[0007] According to some embodiments of this application, a third aspect of this application provides a radio frequency device, including the waveguide antenna assembly described above, and a chip package; the chip package is provided with at least one radiating portion, and the radiating portion is disposed opposite to a second single-ridge opening on the PCB board of the waveguide antenna assembly.

[0008] According to some embodiments of this application, a fourth aspect of this application provides a radar including the radio frequency device described above.

[0009] According to some embodiments of this application, a fifth aspect of this application provides an electronic device including the radar described above.

[0010] This application provides a waveguide antenna, a waveguide antenna assembly, a radio frequency device, a radar, and an electronic device. In the radio frequency device including the waveguide antenna assembly, a signal transmission channel can be formed through the waveguide interface of the waveguide antenna, the waveguide port of the PCB board, and the second single-ridge opening of the PCB board. Signal transmission between the waveguide antenna and the radiating part of the chip package can be realized without setting an additional conversion structure, thereby greatly reducing structural complexity and production cost. Attached Figure Description

[0011] One or more embodiments are illustrated by way of example with corresponding pictures in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the pictures in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this disclosure or the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 is a schematic diagram of the waveguide interface of a waveguide antenna provided in an embodiment of this application;

[0013] Figure 2 is a schematic diagram of the waveguide interface of another waveguide antenna provided in an embodiment of this application;

[0014] Figure 3 is a schematic diagram of the structure of a radio frequency device provided in an embodiment of this application;

[0015] Figure 4a is a schematic diagram of another radio frequency device provided in an embodiment of this application;

[0016] Figure 4b is a schematic diagram of another radio frequency device provided in an embodiment of this application;

[0017] Figure 5a is a schematic diagram of the waveguide interface of another waveguide antenna provided in an embodiment of this application;

[0018] Figure 5b is a schematic diagram of the waveguide interface of another waveguide antenna provided in an embodiment of this application;

[0019] Figure 6 is a schematic diagram of the waveguide port structure of a PCB board provided in an embodiment of this application;

[0020] Figure 7a is a schematic diagram of the waveguide channel of a waveguide antenna provided in an embodiment of this application;

[0021] Figure 7b is a schematic diagram of the waveguide channel of another waveguide antenna provided in an embodiment of this application;

[0022] Figures 7c1-7c3 are schematic diagrams of three stepped transition structures provided in the embodiments of this application;

[0023] Figures 7d1-7d3 are schematic diagrams of three other stepped transition structures provided in the embodiments of this application;

[0024] Figure 8a is a schematic diagram of a connection method between the feeder and the antenna unit provided in an embodiment of this application;

[0025] Figure 8b is a schematic diagram of another connection method between the feeder and the antenna unit provided in the embodiment of this application;

[0026] Figure 9a is a schematic diagram of the layout of an antenna element provided in an embodiment of this application;

[0027] Figure 9b is a schematic diagram of another layout of the antenna element provided in an embodiment of this application;

[0028] Figure 10 is a cross-sectional view of the radio frequency module in the related technology;

[0029] Figure 11 is a cross-sectional view of the connection between the substrate and the PCB board provided in an embodiment of this application;

[0030] Figure 12 is a top view of the substrate and bump connection provided in an embodiment of this application;

[0031] Figure 13 is a top view of the connection between the substrate, bumps and PCB board provided in the embodiment of this application. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In the description of the embodiments of this application, "at least one" means one or more, "multiple" means two or more, and "multiple rows" means two or more rows, unless otherwise explicitly specified.

[0034] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features.

[0035] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0036] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0037] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. For example, if the device or element in the illustration is inverted, then the element described as "below," "under," "below," or "bottom" of other elements or features will be oriented "above" or "top" of said other elements or features. Therefore, the term "below" may cover both above and below orientation depending on the context in which the term is used, which will be obvious to those skilled in the art. Materials may be oriented in other ways (e.g., rotated 90 degrees, inverted, flipped), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0038] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0039] In the description of the embodiments of this application, when a component "includes" another component, other components are not excluded unless otherwise stated, and other components may be further included. The formation or provision of a second component above or on a first component, or on the surface of a first component, or on one side of a first component, may include embodiments where the first and second components are in direct contact, and may also include embodiments where an additional component may be present between the first and second components, thereby preventing direct contact between the first and second components. For simplicity and clarity, various components may be drawn at different scales. In the drawings, some layers / components may be omitted for simplicity. Unless otherwise specified, the formation or provision of a second component on the surface of a first component refers to direct contact between the first and second components. The term "component" may refer to: layer, film, region, portion, structure, etc.

[0040] This application provides a waveguide antenna, as shown in Figures 1 and 2, which includes multiple waveguide interfaces 11 arranged in an array, with adjacent waveguide interfaces 11 arranged orthogonally.

[0041] Each waveguide interface 11 includes a single-ridge waveguide port 110, which is used to transmit radio frequency signals radiated and / or received by the waveguide antenna.

[0042] The aforementioned waveguide antenna may include multiple sub-antennas, each including a waveguide interface, with the waveguide interfaces of all sub-antennas centrally located. For example, the waveguide antenna shown in Figures 1 and 2 includes eight waveguide interfaces 11, thus it may include eight sub-antennas, such as four receiving sub-antennas and four transmitting sub-antennas. The specific structure of each sub-antenna is not limited here. For example, the sub-antenna may be a single-ridge slot waveguide antenna, which refers to a single-ridge waveguide antenna with radiating slots. It may include connected waveguide interfaces and a single-ridge slot waveguide, or it may include waveguide interfaces, a rectangular waveguide, and a single-ridge slot waveguide connected in sequence. Of course, other structures are also possible.

[0043] In the aforementioned waveguide antenna, the number of waveguide interfaces in each row of waveguide interfaces is not limited; the number of interfaces in different rows of waveguide interfaces can be different, or they can be different in number. In Figure 1, the three rows of waveguide interfaces arranged along the OA direction have 3 interfaces each in the first and second rows, and 2 interfaces in the third row; the three columns of waveguide interfaces arranged along the OB direction have 2 interfaces in the first column, and 3 interfaces each in the second and third columns.

[0044] The specific structure of the aforementioned waveguide interface is not limited. For example, the waveguide interface may include a waveguide cavity and a ridge. The waveguide cavity has a rectangular hollow channel, and the ridge is disposed on one side surface within the rectangular hollow channel, thus forming a U-shaped hollow channel, i.e., a single-ridge waveguide channel. The materials of the waveguide cavity and the ridge are not limited. For example, both the waveguide cavity and the ridge can be made of metal, or plastic with a metal-coated surface. The shape and size of the waveguide cavity are also not limited and can be selected according to the actual situation. For example, the waveguide cavity can be a rectangular waveguide cavity.

[0045] The above-mentioned orthogonal arrangement of two adjacent waveguide interfaces, that is, the perpendicular arrangement of two adjacent waveguide interfaces, ensures that the polarization directions of the two adjacent waveguide interfaces are perpendicular. Taking the adjacent waveguide interfaces a and b arranged along the OA direction as shown in Figure 1 as an example, the principle of orthogonal arrangement is explained. The polarization direction of waveguide interface a is horizontal to the right, and the polarization direction of waveguide interface b is vertically downward. Both are perpendicular to the long side of the waveguide interface. By orthogonally arranging the adjacent waveguide interfaces, the polarization directions of the adjacent waveguide interfaces are also perpendicular, thereby significantly reducing the crosstalk between the radio frequency signals transmitted in waveguide interfaces a and b, and improving the accuracy of the waveguide antenna signal transmission.

[0046] It should be noted that in this application, the waveguide interface includes a single-ridged waveguide port, within which a single-ridged waveguide channel is disposed. Compared to a rectangular waveguide channel, the single-ridged waveguide channel can enhance the field concentration, resulting in a smaller wavelength for the radio frequency signal propagating through it. This allows for a smaller size and a smaller cross-sectional area. Therefore, compared to a waveguide interface with a rectangular waveguide channel, the waveguide interface with a single-ridged waveguide channel occupies less area and can be used for denser waveguide interface arrangements. Compared to a double-ridged waveguide channel, the single-ridged waveguide channel has a lower cutoff frequency at the same manufacturing precision. Therefore, compared to a waveguide interface with a double-ridged waveguide channel, the waveguide interface with a single-ridged waveguide channel can transmit a wider range of radio frequency signals at the same manufacturing precision. In practical applications, a single-ridged waveguide port, a rectangular waveguide port, or a double-ridged waveguide port can be selected as the waveguide interface for the waveguide antenna, depending on the requirements.

[0047] The aforementioned waveguide antenna can receive or radiate radio frequency signals, which can be FMCW (Frequency-Modulated Continuous Wave) millimeter wave signals, or radio frequency signals of other bands; or, if conditions permit, it can also be applied to fields such as 5G communication.

[0048] In the waveguide antenna provided in this embodiment, each waveguide interface unit has a single-ridge waveguide channel. When applied to a radio frequency (RF) device, this waveguide antenna can be directly connected to a PCB board with waveguide ports, eliminating the need for an additional adapter structure between the PCB board and the waveguide antenna. This significantly reduces structural complexity and production costs. Furthermore, the orthogonal arrangement of adjacent waveguide interfaces greatly reduces crosstalk between them, improving signal transmission accuracy. Additionally, the small area occupied by each waveguide interface unit allows for denser waveguide interface arrangements; and with the same manufacturing precision, it exhibits a lower cutoff frequency, enabling the transmission of a wider range of RF signals.

[0049] In one or more embodiments, referring to Figures 1 and 2, a groove 10 is provided between any adjacent waveguide interfaces 11. This groove can be filled with air or other insulating media (e.g., resin), which is not limited here. Since air has a low dielectric constant and causes less signal energy loss, it is often used for filling.

[0050] In one or more embodiments, for ease of implementation and to effectively prevent signal leakage, referring to FIG1, the groove depth of the groove 10 is an odd multiple of λ / 4. For example, the groove depth can be λ / 4, 3λ / 4, or 5λ / 4, where λ is the operating wavelength of the radio frequency signal. For ease of fabrication, the grooves 10 between all adjacent waveguide interfaces 11 can be connected.

[0051] In one or more embodiments, referring to FIG1, the waveguide antenna further includes at least one protrusion 13 located in a groove 10 between two diagonally arranged waveguide interfaces 11.

[0052] Because the distance between the two diagonally positioned waveguide interfaces is relatively large, resonance is easily generated. Therefore, a protrusion is set in the groove between the two diagonally positioned waveguide interfaces to reduce resonance and reduce signal energy loss.

[0053] The shape and size of the protrusion are not limited; for example, the protrusion can be a cuboid, cylinder, or trapezoidal truncated pyramid. Figure 1 illustrates three cuboid protrusions as an example. The material of the protrusion can be metal or plastic with a metal-plated surface. The material of the protrusion can be the same as or different from the waveguide interface material; for the sake of simplifying manufacturing, the same material can be used to manufacture both the protrusion and the waveguide interface.

[0054] In one or more embodiments, to avoid affecting the connection between the waveguide interface and other waveguide ports, the protrusion is flush with the waveguide interface. Of course, the protrusion may also be slightly lower than the waveguide interface.

[0055] The following provides a structure of a waveguide antenna. Referring to Figures 1 and 3, the waveguide antenna 1 also includes a base portion 12 disposed around a waveguide interface, and the waveguide interface 11 protrudes from the surface of the base portion 12.

[0056] Other structures of the waveguide antenna can be housed within the base, such as structures of the sub-antennas excluding the waveguide interface. Since the waveguide interface protrudes from the base, a certain installation gap (e.g., 0-400 micrometers) is permissible between the waveguide interface and the PCB board along the C1C2 direction shown in Figure 3 when they are connected. This avoids collision damage caused by processing, installation, and board warping. Figure 1 is a schematic diagram of the waveguide interface of the waveguide antenna as seen along the C1C2 direction in Figure 3.

[0057] Referring to Figure 1, the aforementioned multiple waveguide interfaces 11 can be multiple independently set annular bosses. A groove 10 with a groove depth of an odd multiple of λ / 4 can be set between adjacent annular bosses. Therefore, when the waveguide interface is connected to the PCB board, it can effectively prevent signal leakage at the waveguide interface of the PCB board and the waveguide antenna. In addition, it is convenient for processing, manufacturing and installation.

[0058] The following provides another waveguide antenna structure. Referring to Figures 4a, 4b and 5a, the waveguide antenna also includes a base portion 12 and a plurality of isolation structures 14 disposed around the waveguide interface 11; the waveguide interface 11 is disposed flush with the surface of the base portion 12; the plurality of isolation structures 14 are located around the waveguide interface 11 and protrude from the base portion 12.

[0059] The size and shape of the aforementioned isolation structure are not limited. For example, the isolation structure can be a cylinder, cuboid, hexagonal prism, or trapezoidal truncated pyramid. The dimensions of the multiple isolation structures around each waveguide interface can be the same or different. For example, several thick cylinders and several thin cylinders can be set at the same time. This is not limited here.

[0060] When the waveguide interface is connected to the PCB board, the isolation structure allows for a certain installation gap (e.g., 0-400 micrometers) between the two along the C1C2 direction shown in Figure 4a, thereby avoiding collision damage caused by processing, installation, and board warping; at the same time, it can block energy escaping from the waveguide interface between the PCB board and the waveguide antenna, thereby further preventing signal leakage.

[0061] When assembling a waveguide antenna onto a PCB board, manufacturing and assembly errors inevitably result in loose surface connections, creating gaps. When radio frequency (RF) signals leak from these gaps, the transmission efficiency of the RF signal within the channel decreases. Simultaneously, the signal can couple into other channels through these gaps, causing channel crosstalk and reducing isolation, severely impacting the performance of the RF module. Therefore, this application proposes incorporating an isolation structure on the waveguide antenna to prevent signal lateral transmission along the gap surface. The isolation structure is a metal structure or a structure with a metal-plated surface. Multiple periodically arranged isolation structures can prevent the propagation of surface waves, thus preventing RF signals from leaking from the transmission channel to the outside. They can also prevent ionized RF signals in the gaps between the PCB board and the waveguide antenna from entering adjacent transmission channels, thereby achieving signal isolation within each transmission channel. In some embodiments, the waveguide antenna is connected to the PCB board using fasteners such as screws or bolts.

[0062] It should be noted that the isolation structure provided in this application embodiment does not depend on the shape of the waveguide interface of the waveguide antenna. That is, the isolation structure includes, but is not limited to, waveguide antennas applied to single-ridge waveguide interfaces, waveguide antennas applied to rectangular waveguide interfaces, or waveguide antennas applied to double-ridge waveguide interfaces.

[0063] In some embodiments, referring to Figures 5a and 5b, the isolation structure includes a plurality of first protrusions 141 and a plurality of second protrusions 142, wherein the cross-sectional area of ​​the first protrusions 141 is greater than or equal to the cross-sectional area of ​​the second protrusions 142.

[0064] Figures 5a and 5b are top views of the waveguide interface 11 on the surface of the waveguide antenna 1 near the PCB board. The perspective is from the surface of the waveguide antenna 1 near the PCB board (i.e., the fourth surface S4 in Figure 4b) looking into the interior of the waveguide antenna 1. The waveguide antenna shown in Figure 5a uses a single-ridge waveguide port, with a port shape resembling a U-shape on the surface near the PCB board. A single-ridge waveguide channel is provided within the single-ridge waveguide port. Compared to a rectangular waveguide channel, the single-ridge waveguide channel enhances the field concentration, resulting in a smaller wavelength for the radio frequency signal propagating through it. This allows for a smaller size and a smaller cross-sectional area. Therefore, compared to a waveguide interface with a rectangular waveguide channel, the waveguide interface with a single-ridge waveguide channel occupies less area and can be used for denser waveguide interface arrangements. Compared to a double-ridge waveguide channel, the single-ridge waveguide channel has a lower cutoff frequency at the same manufacturing precision. Therefore, compared to waveguide interfaces with double-ridged waveguide channels, waveguide interfaces with single-ridged waveguide channels can transmit a wider range of radio frequency signals under the same manufacturing precision.

[0065] The waveguide antenna shown in Figure 5b is a rectangular waveguide antenna, which has lower requirements for computer numerical control (CNC) or plastic injection molding and electroplating processes. The port shape on the surface closest to the PCB board is rectangular. Non-uniform raised structures can be set around the port.

[0066] When the rectangular waveguide interface of the waveguide antenna is used to connect to a PCB board with one end port being rectangular (rectangular waveguide aperture), or when the single-ridge waveguide interface of the waveguide antenna is used to connect to a PCB board with one end port being single-ridged (single-ridge waveguide aperture), the strongest signal field region is located at the midpoint of the two long sides of the rectangular or single-ridge waveguide aperture. The signal field strength gradually decreases outwards from this midpoint. Therefore, protrusion structures with different cross-sectional areas can be set in signal field regions of different intensities to achieve differentiation and isolation. In this embodiment, two types of protrusion structures are set on the surface of the waveguide antenna near the PCB board, namely the first protrusion structure 141 and the second protrusion structure 142 as shown in Figures 5a and 5b, wherein the cross-sectional area of ​​the first protrusion structure 141 is greater than or equal to the cross-sectional area of ​​the second protrusion structure 142.

[0067] In some embodiments, referring to Figures 5a and 5b, a plurality of first protrusion structures 141 are located on the centerline of the long side of the waveguide interface.

[0068] In some embodiments, referring to Figures 5a and 5b, a plurality of second protrusion structures 142 are disposed around a first protrusion structure 141.

[0069] In some embodiments, the gap between the upper surface of the first protrusion structure 141 and the second protrusion structure 142 and the lower surface of the PCB board does not exceed 400 μm.

[0070] Referring to Figures 5a and 5b, a coarse cylinder (in this example, operating in the 77GHz automotive millimeter-wave band, with a cylinder diameter and height of approximately 1mm) serving as the first protrusion structure 141 is symmetrically placed at the center of the long side of a rectangular waveguide aperture or a single-ridged waveguide aperture on the PCB board. When electromagnetic waves propagate from the PCB board to the waveguide antenna, this coarse cylinder maintains normal electromagnetic wave transmission, ensuring good matching. This embodiment allows for a certain gap between the waveguide antenna and the PCB board; this gap is the distance between the upper surface of the protrusion structure and the lower surface of the PCB board. For the automotive millimeter-wave band, this gap is approximately 0–400μm. Around the coarse cylinder are fine cylinders serving as the second protrusion structure 142, used to block minute amounts of energy escaping through the gap. The dimensions of these fine cylinders are not strictly required (the height is consistent with the coarse cylinder, and the diameter and gap with the surrounding cylinders can be within half a wavelength). The distance error between the coarse cylinder and the center of the long side of the rectangular waveguide aperture is kept within ±100um to improve the consistency between channels.

[0071] In some embodiments, the heights of the first protrusion structure and the second protrusion structure are: Where λ is the operating wavelength of the radio frequency signal. In some embodiments, the heights of the first protrusion structure and the second protrusion structure can also be... An odd multiple of.

[0072] In some embodiments, the diameter of the second protrusion structure is Where λ is the operating wavelength of the radio frequency signal.

[0073] In some embodiments, the distance between the first protrusion structure and the adjacent second protrusion structure is . Where λ is the operating wavelength of the radio frequency signal.

[0074] In one or more embodiments, the waveguide antenna further includes a base portion disposed around the waveguide interface; the base portion includes a plurality of waveguide elements, each waveguide element being connected to a corresponding waveguide interface, and the waveguide elements being provided with radiation slots for radiating and / or receiving radio frequency signals.

[0075] It should be noted that the structure of the waveguide unit is not limited here. For example, the waveguide unit can be a single-ridge waveguide with a radiating slot; or, the waveguide unit can also include a rectangular waveguide and a single-ridge waveguide with a radiating slot. Referring to Figure 7a, the waveguide channel of the waveguide antenna includes a single-ridge waveguide channel 111, a rectangular waveguide channel 121, and a waveguide channel 122 with a radiating slot 123 connected in sequence. The rectangular waveguide channel 121 is used to transmit the radio frequency signal transmitted by the single-ridge waveguide channel 111 to the waveguide channel 122 with the radiating slot 123, and / or to transmit the radio frequency signal transmitted by the waveguide channel 122 with the radiating slot 123 to the single-ridge waveguide channel 111; the waveguide channel 122 with the radiating slot 123 is used to radiate the radio frequency signal transmitted by the rectangular waveguide channel 121 to the outside, and / or to transmit the radio frequency signal received from the outside to the rectangular waveguide channel 121.

[0076] Referring to Figure 7b, the waveguide channel of the waveguide antenna may further include a first rectangular waveguide channel 112, a second rectangular waveguide channel 120, and a waveguide channel 122 with a radiation slot 123 connected in sequence. The second rectangular waveguide channel 120 is used to transmit the radio frequency signal transmitted by the first rectangular waveguide channel 112 to the waveguide channel 122 with the radiation slot 123, and / or to transmit the radio frequency signal transmitted by the waveguide channel 122 with the radiation slot 123 to the first rectangular waveguide channel 112. The waveguide channel 122 with the radiation slot 123 is used to radiate the radio frequency signal transmitted by the second rectangular waveguide channel 120 to the outside, and / or to transmit the radio frequency signal received from the outside to the second rectangular waveguide channel 120.

[0077] It should be noted that the fabrication method of the waveguide antenna described above is not limited. For example, the portion above and below the dividing line D1D2, as shown in Figures 7a and 7b, can be fabricated separately, and then fixed by welding or bonding to form the final waveguide antenna. That is, the waveguide antenna is designed as a double-layer structure, comprising two spliced ​​parts (the upper and lower halves divided along the dividing line D1D2). The splicing surface of the two parts is parallel to the surface current direction of the radio frequency signal, and the path of the surface current lies on the splicing surface. The path of the surface current parallel to the waveguide extension direction inside the rectangular waveguide channel 121 in Figure 7a and the second rectangular waveguide channel 120 in Figure 7b coincides with the dividing line. When the connection between the portion above and below the dividing line D1D2 is not tight, this segmentation method can effectively reduce energy leakage.

[0078] The aforementioned waveguide interface and waveguide element can form a sub-antenna, which can have the function of transmitting and / or receiving signals. The signal feeding method is not limited; for example, a center-fed or side-fed method can be used. The connection method between the aforementioned waveguide element and waveguide interface is not limited; for example, it can be connected to the waveguide interface through the wide side of the waveguide element (i.e., wide side out), or it can be connected to the waveguide interface through the narrow side of the waveguide element (i.e., narrow side out), depending on the arrangement of the waveguide interface.

[0079] In some embodiments, as shown in Figures 8a and 8b, the waveguide antenna further includes an antenna element 32, which is connected to the antenna element from one end or the middle of the wide side of the antenna element 32. In some embodiments, the antenna element is provided with a radiation slot for radiating and / or receiving radio frequency signals.

[0080] Referring to Figure 7a, the waveguide channel formed by the waveguide unit is a single-ridge waveguide channel 111 and a rectangular waveguide channel 121 connected in sequence, and the waveguide channel formed by the antenna unit is a waveguide channel 122 with a radiation slot 123.

[0081] Referring to Figure 7b, the waveguide channel formed by the waveguide unit is a first rectangular waveguide channel 112 and a second rectangular waveguide channel 120 connected in sequence, and the waveguide channel formed by the antenna unit is a waveguide channel 122 with a radiation slot 123.

[0082] Referring to Figures 7a and 7b, the cross-section of the waveguide cavity of the antenna element is rectangular, where the side containing the long side of the rectangle is called the long-side side, and the side containing the wide side is called the wide-side side. In Figures 8a and 8b, slots for radiating radio frequency (RF) signals are provided on the long-side side. Figure 8a shows one feeding method for the waveguide antenna, where the RF signal transmitted by the waveguide element is fed into the antenna element from one end of the wide-side side, called "side feeding." Figure 8b shows another feeding method for the waveguide antenna, where the RF signal transmitted by the waveguide element is fed into the antenna element from the middle of the wide-side side, called "center feeding."

[0083] It should be noted that the difference between Figure 7a and Figure 7b is that in the waveguide antenna shown in Figure 7a, the waveguide interface is a single-ridge waveguide port, and the channel directly connected to the single-ridge waveguide port is the single-ridge waveguide channel 111; in the waveguide antenna shown in Figure 7b, the waveguide interface is a rectangular waveguide port, and the channel directly connected to the rectangular waveguide port is the first rectangular waveguide channel 112.

[0084] Figures 9a and 9b show the layout of the feed line formed by waveguide elements and the array formed by antenna elements in a waveguide antenna.

[0085] In some embodiments, the waveguide unit includes at least two connected cavity segments, thereby forming at least two connected waveguide channels. To achieve better impedance matching and reduce electromagnetic wave reflection at bends and discontinuities, embodiments of this application provide a stepped transition structure at the connection between adjacent cavity segments.

[0086] If the waveguide interface of the waveguide antenna is a single-ridge waveguide port, referring to Figures 7c1 to 7c3, the waveguide unit includes at least a first cavity segment 371 with a single-ridge cross-section and a second cavity segment 372 with a rectangular cross-section. A stepped transition structure 38 is provided at the connection between the first cavity segment 371 and the second cavity segment 372. In Figure 7c1, from bottom to top, it includes the first cavity segment 371 and the second cavity segment 372, wherein the second cavity segment 372 extends out from the long side of the first cavity segment 371, also referred to as "long side extension"; in Figures 7c2 and 7c3, from bottom to top, it includes the first cavity segment 371 and the second cavity segment 372, wherein the second cavity segment 372 extends out from the wide side of the first cavity segment 371, also referred to as "wide side extension". A stepped transition structure is designed at the connection between the first cavity segment 371 and the second cavity segment 372, which is the "turnout position". By reasonably designing the recessed and protruding steps to form a stepped transition structure, better impedance matching can be achieved and electromagnetic wave reflection at the discontinuity of the turn can be reduced. The stepped transition structure can be a single-step structure as shown in Figures 7c1 and 7c2, or a multi-step structure as shown in Figure 7c3. In this embodiment, the number of steps in the stepped structure is not limited.

[0087] If the waveguide interface of the waveguide antenna is a rectangular waveguide port, as shown in Figures 7d1 to 7d3, the waveguide unit includes at least two cavity segments 37 with rectangular cross-sections. A stepped transition structure 38 is provided at the connection between adjacent cavity segments 37. In Figure 7d1, two cavity segments 37 are included from bottom to top, wherein the upper cavity segment 37 extends out from the long side of the lower cavity segment 37, also known as "long side extension". In Figures 7d2 and 7d3, two cavity segments 37 are included from bottom to top, wherein the upper cavity segment 37 extends out from the wide side of the lower cavity segment 37, also known as "wide side extension". A stepped transition structure 38 is designed at the connection between the adjacent cavity segments 37, that is, at the "extension position". By reasonably designing the recessed and protruding steps to form a stepped transition structure 38, better impedance matching can be achieved and electromagnetic wave reflection at the discontinuity of the bend can be reduced. The stepped transition structure 38 can be a single-step structure as shown in Figures 7d1 and 7d2, or a multi-step structure as shown in Figure 7d3. In this embodiment, the number of steps in the stepped structure is not limited.

[0088] This application also provides a waveguide antenna assembly, as shown in Figures 3, 4a and 4b, including the waveguide antenna 1 in any of the above embodiments and a PCB board 2; the waveguide antenna 1 is disposed on one side of the PCB board 2, and the side of the PCB board 2 facing the waveguide antenna 1 is provided with a plurality of waveguide ports, and the waveguide ports are configured one-to-one with the waveguide interfaces of the waveguide antenna 1.

[0089] The structure of the waveguide port is not limited here, as long as it can be matched and connected to the waveguide interface of the waveguide antenna. For example, the waveguide port can be configured with a single-ridged waveguide channel, a double-ridged waveguide channel, or a rectangular waveguide channel.

[0090] The PCB board and waveguide antenna can be directly connected without the need for an adapter structure, which can significantly reduce structural complexity and production costs.

[0091] In one or more embodiments, in order to better match the waveguide interface in the waveguide antenna and thereby improve the speed and quality of signal transmission, referring to FIG6, the waveguide port 21 includes a plurality of first single-ridge openings 22, the first single-ridge openings being used to transmit radio frequency signals radiated and / or received by the waveguide antenna.

[0092] The aforementioned waveguide ports are configured one-to-one with the waveguide interfaces in the waveguide antenna. For instructions on configuring these waveguide ports, please refer to the relevant instructions on the waveguide interfaces in the aforementioned waveguide antenna. They will not be repeated here.

[0093] In one or more embodiments, the PCB board has multiple second single-ridge openings corresponding to multiple waveguide ports on the side facing away from the waveguide antenna, and each second single-ridge opening is connected to the corresponding waveguide port. In this way, when the chip is placed on the side of the PCB board facing away from the waveguide antenna, the signal radiated by the chip can be transmitted sequentially through the multiple second single-ridge openings of the PCB board to the corresponding waveguide port, and then to the waveguide interface corresponding to the waveguide antenna. And / or, the radio frequency signal received by the waveguide antenna is transmitted to the waveguide port of the PCB board through multiple waveguide interfaces, and then to the chip through the multiple second single-ridge openings of the PCB board, thereby realizing the transmission of radio frequency signals between the chip and the waveguide antenna.

[0094] Within the first single-ridge opening of the aforementioned waveguide port, a single-ridge waveguide channel can be configured. This single-ridge waveguide channel can penetrate the PCB board, thereby connecting the second single-ridge opening to the waveguide port. Compared to conventional rectangular waveguide channels, this effectively reduces the area occupied on the PCB board. Alternatively, the PCB board can also be configured with an intermediate waveguide channel to connect the second single-ridge opening to the waveguide port. This intermediate waveguide channel can be straight or bent, and there is no limitation here.

[0095] In some embodiments, multiple first single-ridge openings are arranged in an array, with the long sides of two adjacent first single-ridge openings perpendicular to each other. Figure 6 illustrates the waveguide port layout in a 4T4R (4 sets of transmit, 4 sets of receive) RF module. The viewpoint of this figure is from the second surface S2 of the PCB board 2 shown in Figure 4b towards the third surface S3. The cross-section of the waveguide port in Figure 6 is single-ridged (i.e., forming a single-ridged waveguide), and the electric field direction of the electromagnetic wave propagating within it is mainly perpendicular to the long side where the ridge is located. The port arrangement shown in this example ensures that the polarization between adjacent ports is perpendicular, thereby reducing signal crosstalk at the ports. Simultaneously, each waveguide port can smoothly output a cable.

[0096] Based on the waveguide antenna in any of the foregoing embodiments, when the waveguide antenna is provided with a first protrusion structure and a second protrusion structure, the gap between the first protrusion structure and the second protrusion structure of the waveguide antenna near the surface of the PCB board and the surface of the PCB board near the waveguide antenna does not exceed 400μm.

[0097] In traditional packaging technology, as shown in Figure 10, the radio frequency (RF) signal is generated by the IC in chip 01 and connected to external circuits through the package. After being fanned out by the package substrate, the RF signal passes through solder balls 02 and a planar waveguide in the carrier board 03 to establish a signal path. Then, it is connected to the antenna 04 via a planar waveguide feed line on the carrier board 03. In other words, the transmission process of the RF signal from the IC to the antenna 04 is entirely completed using a planar waveguide mode, and the antenna 04 is also fixedly mounted on the surface of the PCB board 03 facing the chip 01. Because planar waveguides have significant dielectric and radiation losses, which are proportional to the length of the feed line, RF modules using planar waveguides to feed the antenna have high system losses. Furthermore, once the chip is soldered to the carrier board, the antenna cannot be replaced.

[0098] This application also provides a radio frequency device, as shown in Figures 3, 4a and 4b, including a waveguide antenna assembly and a chip package 3; the chip package 3 is provided with at least one radiating part 31, and each radiating part 31 is arranged opposite to the second single ridge opening of the PCB board 2 of the waveguide antenna assembly.

[0099] The radiating section 31 transmits a first radio frequency signal to the waveguide interface of the waveguide antenna 1 of the waveguide antenna assembly through the waveguide port of the PCB board 2 of the waveguide antenna assembly, and / or the waveguide interface of the waveguide antenna 1 of the waveguide antenna assembly transmits a second radio frequency signal to the radiating section 31 through the waveguide port of the PCB board 2 of the waveguide antenna assembly.

[0100] It should be noted that the waveguide interface shown in Figure 5a and the waveguide port shown in Figure 6 are set up accordingly. Figure 5a is a structural schematic diagram of the waveguide interface of the waveguide antenna viewed from the C2C1 direction in Figure 4a, and Figure 6 is a structural schematic diagram of the waveguide port of the PCB board viewed from the C2C1 direction in Figure 4a.

[0101] The first radio frequency (RF) signal radiated from the radiating portion of the aforementioned chip package is transmitted sequentially through the second single-ridge opening on the PCB board and the waveguide port on the PCB board to the waveguide interface of the waveguide antenna, thereby realizing the transmission of the first RF signal radiated from the chip package to the waveguide antenna; and / or, the second RF signal received by the waveguide antenna is transmitted sequentially through the waveguide interface of the waveguide antenna, the waveguide port on the PCB board, and the second single-ridge opening on the PCB board to the radiating portion of the chip package, thereby realizing the transmission of the second RF signal received by the waveguide antenna to the chip package. This RF device is based on ROP (Radiation on Package) technology, which allows the waveguide antenna to be directly connected to the chip without additional structural conversion, reducing the design load and thus significantly reducing structural complexity and production costs; compared with planar waveguides, the use of waveguide antennas can effectively reduce feeder losses, thereby improving the output performance of the RF device.

[0102] In one or more embodiments, referring to Figures 3, 4a, and 4b, the radio frequency device further includes a plurality of bumps 4. Referring to Figures 12 and 13, the plurality of bumps 4 are arranged around the second single-ridge opening of the PCB board 2; that is, multiple bumps 4 are arranged around the second single-ridge opening of each PCB board 2. One end of these bumps is connected to the chip package, and the other end is connected to the PCB board. The closed rectangular ring formed by these bumps can confine electromagnetic waves within a single signal transmission channel, thereby effectively preventing signal leakage between channels, reducing crosstalk between channels, and improving isolation. The waveguide channel surrounded by the multiple bumps maintains a substantially consistent size with the second single-ridge opening of the PCB board. Therefore, by reducing the size of the waveguide channel surrounded by the multiple bumps, the size of the chip package can be reduced.

[0103] The bumps here can be metal solder balls, made of materials such as gold, copper, copper-nickel-gold, or tin. Their arrangement is not limited; for example, multiple bumps can be arranged in a ball grid array (BGA). Multiple bumps can form a cavity structure with a circular, triangular, quadrilateral, or irregular cross-section. This cavity structure can be a hollow structure using air as the transmission medium, or a solid structure using insulating material as the transmission medium; there are no limitations. The size of the cavity structure formed by multiple bumps and the dielectric constant within the cavity structure will affect the signal frequency transmitted by that cavity structure. With other influencing factors remaining constant, the smaller the size of the cavity structure formed by multiple bumps, the higher the corresponding signal frequency; conversely, with other influencing factors remaining constant, the higher the dielectric constant of the cavity structure formed by multiple bumps, the lower the corresponding signal frequency. A comprehensive consideration of chip design size and the dielectric constant of the transmission medium is necessary to meet the chip's cutoff frequency requirements.

[0104] In some embodiments, the PCB board and the chip package are connected by multiple solder balls.

[0105] In some embodiments, the radiating portion can be a radiating patch, but it is not limited to a radiating patch; it can also be other forms of radiating structure. The shape of the radiating patch can be at least one of a rectangle, a rhombus, and a butterfly, or it can be any other arbitrary pattern shape. The radiating patch is disposed in a patterned form in a metal layer of the integrated circuit. Multiple radiating portions can be provided, and each radiating portion is surrounded by multiple bumps. The bumps can be solder balls or can be implemented using conductive adhesive or the like.

[0106] In this embodiment of the application, referring to FIG4b, the first surface S1 of the chip package 3 is provided with at least one radiating part 31, and the first surface S1 is provided with a plurality of bumps 4. The plurality of bumps 4 are arranged around the radiating part 31. Referring to FIG4b and FIG11, the space surrounded by the plurality of bumps 4 serves as a waveguide channel for radio frequency signal transmission, and is called the first waveguide channel 20.

[0107] The first surface S1 is the side of the chip package 3 facing the PCB board 2. A radiating part 31 is provided on the first surface S1, which is used to transmit and receive radio frequency signals.

[0108] In Figure 4b, the PCB board 2 has a second surface S2 and a third surface S3 that are opposite each other. The second surface S2 is connected to the first surface S1 of the chip package 3. The second waveguide channel 23 is provided at the position corresponding to the first waveguide channel 20 on the PCB board 2.

[0109] The second surface S2 and the third surface S3 are two surfaces parallel to the metal layers in the PCB board 2. The second surface S2 directly contacts the bump 4 to achieve the docking between the PCB board 2 and the chip package 3. When the bump 4 is a solder ball, the second surface S2 and the first surface S1 can be connected by the solder ball through the soldering action to achieve a stable docking. On the docked second surface S2, a second waveguide channel 23 is provided at the position corresponding to each first waveguide channel 20, penetrating through the second surface S2 and the third surface S3. The cross-section of the second waveguide channel 23 can be single-ridge type, or it can be rectangular, double-ridge type, or other structures.

[0110] Setting the cross-section of the second waveguide channel 23 to a single ridge type can effectively reduce the area occupied by the second waveguide channel 23 on the PCB board 2 compared to the conventional rectangular waveguide. Since the channel port size of the first waveguide channel 20 surrounded by the bumps 4 is consistent with that of the second waveguide channel 23, the setting of the single ridge type waveguide channel can reduce the size of the chip package 3 by reducing the size of the first waveguide channel 20.

[0111] In Figure 4b, the waveguide antenna 1 has a fourth surface S4 and a fifth surface S5 opposite to each other. The fourth surface S4 is connected to the third surface S3. At least one antenna element 32 is provided on the fifth surface S5. A third waveguide channel 33 is provided inside the waveguide antenna 1.

[0112] The fourth surface S4 is the side where the waveguide antenna 1 and the third surface S3 of the PCB board 2 are mated, and the fifth surface S5 is the side of the waveguide antenna 1 facing away from the PCB board 2 when mated. An antenna element 32 is disposed on the fifth surface S5. The antenna element 32 is used to transmit and receive radio frequency signals. Each antenna element 32 may include multiple radiating slots (waveguide slot antennas) for transmitting and / or receiving radio frequency signals. Multiple third waveguide channels 33 are disposed within the waveguide antenna 1. One end of each third waveguide channel 33 is connected to a second waveguide channel 23, and the other end is connected to an antenna element 32.

[0113] In Figure 4b, the radio frequency signal generated inside the chip package 3 is coupled to the radiating part 31 and radiated outward. It is then transmitted to the antenna unit 32 through the radio frequency signal transmission channel formed by the sequential connection of the first waveguide channel 20, the second waveguide channel 23, and the third waveguide channel 33. The antenna unit 32 then radiates it outward as a radio signal. Conversely, after receiving the radio signal, the antenna unit 32 transmits it to the radiating part 31 through the radio frequency signal transmission channel formed by the third waveguide channel 33, the second waveguide channel 23, and the first waveguide channel 20. The radiating part 31 then couples the received signal into the chip package 3 for processing.

[0114] The radio frequency signal transmission channel enables the connection and matching of the chip package 3, PCB board 2 and waveguide antenna 1. The waveguide antenna 1 can be directly connected to the chip package 3 without other conversion structures, reducing the load on the design. Compared with planar waveguides, the use of waveguide antenna 1 can effectively reduce feeder loss and improve the output performance of the radio frequency module.

[0115] In addition, the PCB board 2 is located between the chip package 3 and the waveguide antenna 1. Besides being used to connect the chip package 3 and the waveguide antenna 1, it can also carry other peripheral circuits. These peripheral circuits and the second waveguide channel 23 can be isolated from each other by setting a gap in the non-metallic area.

[0116] In some embodiments, referring to FIG4b, the chip package 3 includes at least a substrate 15 and an IC die 16. The side of the substrate 15 facing away from the IC die 16 is a first surface S1, and a feed line 17 is provided inside the substrate, through which radio frequency signals are transmitted to the radiating part 31.

[0117] The substrate 15 serves both as a carrier for the IC die 16 and as a medium for transmitting the radio frequency signals generated by the IC die 16 to the radiating section 31. By providing feed lines 17 inside the substrate, the radio frequency signals generated by the IC die 16 can be fanned out to multiple radiating sections 31 that are arranged in a relatively dispersed manner.

[0118] In some embodiments, referring to Figures 11-13, the substrate 15 includes at least a metal ground layer 151, a feed line layer 152, and a patch layer 153; a feed line 17 is disposed on the feed line layer 152, and a radiating portion 31 is disposed on the patch layer 153, wherein radio frequency signals are coupled to the radiating portion 31 through the feed line 17.

[0119] Figure 11 is a top view of the feed layer 152 and the surface mount layer 153, viewed from inside the chip package 3 shown in Figure 4b towards the outside of the chip package 3. In Figures 4b and 11, the radio frequency signal generated by the IC die 16 is transmitted to the feed layer 152 via vias 18 and coupled to the radiating portion 31 of the surface mount layer 153 at the end of the feed line 17. The feed layer 152 and the surface mount layer 153 have opposing rectangular windows 19. The two rectangular windows 19 can be the same or different in size. The feed line 17 and the radiating portion 31 are located within the rectangular windows 19 of their respective metal layers, and the outside of the rectangular windows 19 is the ground plane (GND). The gap created by the rectangular windows 19 isolates the feed line 17 and the radiating portion 31 from the external GND. Vias 18 arranged at equal intervals can also be provided near the inner side of the rectangular windows 19 near the GND. These vias 18 connect the GND of the feed layer 152 and the GND of the surface mount layer 153. Below the surface mount layer 153, there is a ring of grounded solder balls 4 which are soldered below the GND ring around the rectangular opening 19. The lower surface of the solder balls is soldered to the PCB board 2.

[0120] In Figures 12 and 13, when the radiating section 31 radiates the millimeter-wave signal obtained from the feed line 17 via coupling, the closed waveguide channel (serving as the first waveguide channel) formed by the solder balls surrounding the radiating section 31 can confine the electromagnetic wave within a single signal transmission channel, thereby reducing crosstalk between channels and improving isolation. The cavity formed by the GND of the patch layer 153 in the substrate 15, the solder balls, and the metal on the upper surface of the PCB board 2 is located between the radiating section 31 and the second single-ridge opening of the PCB board (serving as the second waveguide channel), playing a role in mode matching and impedance matching, so that the electromagnetic wave can be well converted from the planar microstrip line transmission mode to the waveguide transmission mode.

[0121] Figure 13 is a top view of the connection between the feed layer 152, the surface mount layer 153, and the PCB board 2, viewed from inside the chip package 3 towards the outside. In Figures 11 and 13, the PCB board 2 has a single-ridge window as a second waveguide channel 23, which is positioned directly opposite the radiating part 31 in the chip package. The sidewalls and upper and lower surfaces of the single-ridge window are plated with conductive metal layers, and the metal plating on the upper and lower surfaces extends outward from the edge of the single-ridge window to cover the solder ball soldering area.

[0122] In actual process design, no other metal layer may be provided on the other side of the metal ground layer 151 in the substrate 15, and the IC die 16 can be directly placed above the metal ground layer 151. The function of the metal ground layer 151 is to provide isolation between the IC die 16 and the feed layer 152. Alternatively, other metal layers may be provided on the other side of the metal ground layer 151 in the substrate 15, and the IC die 16 can be directly placed above other metal ground layers. The function of the metal ground layer 151 is to provide isolation between other metal layers and the feed layer 152. In the metal ground layer 151, feed layer 152, and surface mount layer 153, a dielectric layer is provided between each adjacent pair of layers, and connections can be achieved between the metal layers by providing vias 18.

[0123] The radio frequency device in this embodiment has the following advantages over traditional radio frequency devices:

[0124] In the packaging design of the chip package 3, the feed line 17 is fan-out inside the substrate 15 and a radiating part 31 is provided on the outside of the chip package 3; the radiating part 31 can couple the radio frequency signal from inside the chip package to the external waveguide antenna, which improves the flexibility of chip and antenna design and is more conducive to miniaturization design.

[0125] To prevent leakage between channels, the radiating part 31 is surrounded by bumps 4 to form a first waveguide channel 20. When the bumps 4 are solder balls, one end of the solder ball is connected to the chip package 3, and the other end is soldered to the PCB board 21, thereby realizing channel docking.

[0126] A single-ridge window is cut out in the area surrounded by solder balls in PCB board 2 as a second waveguide channel 23 to realize the connection between chip package 3, PCB board 21 and waveguide antenna 1 and the matching of radio frequency signals.

[0127] The waveguide antenna 1 adopts a two-layer structure for ease of fabrication. The upper layer includes antenna element 32 and part of feed line 17, while the lower layer includes part of feed line 17 and the interface of feed line 17 that connects to the first waveguide channel 20. The dividing line of the two-layer structure is parallel to the direction of the surface current inside the waveguide, effectively reducing energy leakage at the dividing line.

[0128] Using waveguide antenna 1 can reduce feeder loss and increase radar output power.

[0129] In summary, the radio frequency device provided in the above embodiments of this application reduces the chip package size and has the advantages of low cost, high power, good isolation and robustness.

[0130] This application also provides a radar, including the aforementioned radio frequency device. The operating band of this radar is not limited; for example, it can operate in the millimeter-wave band, but other bands are also possible. The application scenario of this radar is not limited; for example, it can be used on transportation electronic equipment such as cars, bicycles, motorcycles, ships, subways, or trains to detect vehicles, pedestrians, overpasses, trees, or parking spaces. It can also be used in security equipment such as cameras, or in other fields; no further limitations are imposed here.

[0131] Radar is used to transmit electromagnetic wave signals via a transmitting antenna based on a reference frequency, and to receive the echoes reflected by target objects using a receiving antenna. It then performs down-conversion processing on the transmitted radio frequency signal to generate and output an intermediate frequency (IF) signal. Radar is also used to convert the IF signal into a digital signal for further signal processing.

[0132] In some embodiments, the radio frequency (RF) signal received or radiated by the radar can be a frequency-modulated continuous wave (FM) millimeter-wave signal, enabling radar-equipped electronic devices to be applied in fields such as autonomous driving, industrial automation, smart home appliances, and security inspection. For example, the radar generates a chirp signal according to a preset continuous frequency modulation (FM) mode; it obtains an RF transmission signal through frequency doubling and feeds it to the transmitting antenna to transmit a corresponding detection signal wave. When the detection signal wave is reflected by an object, an echo signal wave is formed. The receiving antenna converts the echo signal wave into an RF received signal. The radar uses the RF transmission signal to perform down-conversion, filtering, and other processing on the RF received signal, followed by analog-to-digital conversion, outputting a baseband digital signal representing the frequency difference between the detection signal wave and the echo signal wave. Measurement information is then extracted from the baseband digital signal through signal processing, and measurement data is output. The signal processing includes digital signal processing calculations based on phase, frequency, and time domain parameters of at least one signal to be processed provided by at least one receiving antenna. The measurement data includes at least one of the following: distance data for representing the relative distance to at least one detected obstacle; velocity data for representing the relative speed of at least one detected obstacle; angle data for representing the relative angle of at least one detected obstacle, etc.

[0133] This application also provides an electronic device including the radar described above. In some embodiments, the electronic device includes: a device body; and electronic components such as the radar described above disposed on the device body. The device body is a structure that carries and is signal-connected to a radio device. The radio device transmits and / or receives radio signals processed by a phase shifter to achieve functions such as target detection and / or communication within the beam scanning range, thereby providing the device body with target detection information and / or communication information, and thus assisting or even controlling the operation of the device body.

[0134] In some embodiments, the electronic device comprising the device body and at least one of the aforementioned wireless devices can be a component or product applied in fields such as smart homes, transportation, smart homes, consumer electronics, surveillance, industrial automation, in-cabin detection, and healthcare. For example, the electronic device can be intelligent transportation equipment (e.g., automobiles, bicycles, motorcycles, ships, subways, or trains), security equipment (e.g., cameras), level / flow rate detection equipment, smart wearable devices (e.g., wristbands or glasses), smart home devices (e.g., robot vacuums, door locks, televisions, air conditioners, or smart lights), various communication devices (e.g., mobile phones or tablets), and devices such as barriers, intelligent traffic lights, intelligent signs, traffic cameras, or various industrial robotic arms (or robots). Alternatively, it can be various instruments for detecting vital signs or various devices equipped with such instruments, such as in-cabin vehicle detection, indoor occupant monitoring, smart medical devices, or consumer electronic devices.

[0135] Those skilled in the art will understand that the above embodiments are specific examples of implementing this application, and in practical applications, various changes in form and detail can be made without departing from the spirit and scope of this application. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this application; therefore, the scope of protection of this application should be determined by the scope defined in the claims.

Claims

1. A waveguide antenna, comprising an array of multiple waveguide interfaces arranged orthogonally to adjacent waveguide interfaces; each waveguide interface includes a single-ridge waveguide port for transmitting radio frequency signals radiated and / or received by the waveguide antenna.

2. The waveguide antenna according to claim 1, wherein, A groove is provided between any two adjacent waveguide interfaces.

3. The waveguide antenna according to claim 2, wherein, The groove depth is an odd multiple of λ / 4, where λ is the operating wavelength of the radio frequency signal.

4. The waveguide antenna according to claim 2, wherein, The waveguide antenna also includes at least one protrusion located in a groove between two diagonally arranged waveguide interfaces.

5. The waveguide antenna according to claim 1, wherein, The waveguide antenna further includes a base portion and multiple isolation structures disposed around the waveguide interface; the waveguide interface is flush with the surface of the base portion; wherein, the multiple isolation structures are located around the waveguide interface and protrude from the base portion.

6. The waveguide antenna according to claim 5, wherein, The plurality of isolation structures include a plurality of first protrusion structures and a plurality of second protrusion structures, wherein the cross-sectional area of ​​the first protrusion structure is greater than or equal to the cross-sectional area of ​​the second protrusion structure.

7. The waveguide antenna according to claim 6, wherein, The plurality of first protrusion structures are located on the centerline of the long side of the waveguide interface.

8. The waveguide antenna according to claim 6, wherein, The heights of the first protrusion and the second protrusion are Where λ is the operating wavelength of the radio frequency signal.

9. The waveguide antenna according to claim 6, wherein, Multiple second protrusions are arranged around the first protrusion, and both the first and second protrusions are cylinders.

10. The waveguide antenna according to claim 6, wherein, The diameter of the second protrusion structure is 11. The waveguide antenna according to claim 6, wherein, The distance between the first protrusion and the adjacent second protrusion is 12. The waveguide antenna according to claim 1, wherein, The waveguide antenna further includes a base portion disposed around the waveguide interface; the base portion includes multiple waveguide units, and the waveguide units are connected to the corresponding waveguide interfaces.

13. The waveguide antenna according to claim 12, wherein, The waveguide antenna further includes an antenna element, which is connected to the antenna element from one end of the wide side or at the middle of the wide side.

14. The waveguide antenna according to claim 13, wherein, The antenna element is provided with a radiating slot, which is used to radiate and / or receive radio frequency signals.

15. The waveguide antenna according to claim 13, wherein, The waveguide unit includes at least a first cavity segment with a single ridge cross-section and a second cavity segment with a rectangular cross-section, and a stepped transition structure is provided at the connection between the first cavity segment and the second cavity segment.

16. A waveguide antenna assembly, wherein, It includes a waveguide antenna as described in any one of claims 1-15, and a PCB board; the waveguide antenna is disposed on one side of the PCB board, and the side of the PCB board facing the waveguide antenna is provided with a plurality of waveguide ports, and the waveguide ports are configured one-to-one with the waveguide interface of the waveguide antenna.

17. The waveguide antenna assembly according to claim 16, wherein, The waveguide port includes a plurality of first single-ridge openings, which are used to transmit the radio frequency signal.

18. The waveguide antenna assembly according to claim 17, wherein, The PCB board has a plurality of second single-ridge openings on the side opposite to the waveguide antenna, which are connected to the corresponding waveguide ports.

19. The waveguide antenna assembly according to claim 17, wherein, The long sides of two adjacent first single-ridge openings are perpendicular to each other.

20. A radio frequency device comprising a waveguide antenna assembly as described in any one of claims 16-19, and a chip package; the chip package having at least one radiating portion, the radiating portion being disposed opposite to a second single-ridge opening on the PCB of the waveguide antenna assembly.

21. The radio frequency device according to claim 20, wherein, The radio frequency device also includes a plurality of bumps; the plurality of bumps are arranged around a second single-ridge opening on the PCB board.

22. The radio frequency device according to claim 20, wherein, The chip package includes at least a substrate and an IC die; the IC die is disposed on the side of the substrate away from the PCB board, and a feed line is disposed inside the substrate, through which the radio frequency signal generated by the IC die is transmitted to the radiating part.

23. The radio frequency device according to claim 22, wherein, The substrate includes at least a metal ground layer, a feed line layer, and a surface mount layer; the feed line is disposed on the feed line layer, and the radiating portion is disposed on the surface mount layer; wherein, the radio frequency signal generated by the IC die is coupled to the radiating portion through the feed line.

24. A radar comprising a radio frequency device as described in any one of claims 20-23.

25. An electronic device comprising the radar as claimed in claim 24.

Images