Systems and methods for cooling high power density data centers

Abstract

A cooling system can include a first wall configured to be disposed in fluid communication with a first row of computer equipment and a second wall configured to be disposed in fluid communication with a second row of computer equipment, wherein the first wall and the second wall bound opposite sides of an aisle. The cooling system can include one or more heat exchangers coupled to the first wall, one or more heat exchangers coupled to the second wall, and one or more fans in fluid communication with the aisle. The cooling system can be configured to circulate air through the heat exchangers, the aisle, and the computer equipment.

Description

SYSTEMS AND METHODS FOR COOLING HIGH POWER DENSITY DATA CENTERSCROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 645,094 filed May 9, 2024, the entirety of which is incorporated herein by reference.TECHNICAL FIELD

[0002] The present disclosure relates generally to cooling systems for data centers and more specifically relates to cooling systems for high power density data centers.BACKGROUND

[0003] One of the challenges in high power density data centers is air cooling. As air cooling requirements increase, the space occupied by aisles and plenums can increase so much that overall space utilization decreases, in some cases drastically. This is directly related to increased costs, such as by requiring larger buildings, more labor intensive installations, and increased operational costs.SUMMARY

[0004] Applicant has created new and useful devices, systems and methods for cooling high power density data centers. Embodiments of the disclosure can allow aisle width to be reduced in low power density data centers and / or can help minimize the size otherwise required for proper equipment manipulation and maintenance. In addition, air velocities can be kept at reasonable and acceptable values, airflow can be evenly distributed among racks, and pressure drops due to increased airflow demands can be minimized or eliminated. Embodiments of the disclosure can result in improved efficiency, in terms of space utilization, reduced installation and operating expenses, and otherwise.

[0005] In at least one embodiment, a cooling system according to the disclosure can include a first wall disposed in fluid communication with a first row of computer equipment, a second wall spaced from the first wall, a first heat exchanger coupled to the first wall, a fan disposed in fluid communication with an aisle, or any combination thereof. In at least one embodiment, the first wall and the second wall can bound opposite sides of the aisle. In at least one embodiment, the cooling system can circulate air through the first heat exchanger, the aisle and the first row of computer equipment. In at least one embodiment, the cooling system can route airflow from the aisle, through the first heat exchanger, and to the computer equipment. In at least one embodiment, the cooling system can route airflow from the computer equipment, through the first heat exchanger, and to the aisle.

[0006] In at least one embodiment, the fan can be in the aisle. In at least one embodiment, the fan can be above the computer equipment. In at least one embodiment, the fan can induce airflow horizontally through the first row of computer equipment and / or vertically through the aisle.

[0007] In at least one embodiment, the cooling system can include a plenum disposed above the first row of computer equipment and in fluid communication with the aisle. In at least one embodiment, the plenum can route airflow between the aisle and a side of the first row of computer equipment opposite the aisle.

[0008] In at least one embodiment, the cooling system can include a second heat exchanger coupled to the second wall. In at least one embodiment, the second wall can be disposed in fluid communication with a second row of computer equipment. In at least one embodiment, the cooling system can circulate air through the second heat exchanger, the aisle, and the second row of computer equipment.

[0009] In at least one embodiment, the first heat exchanger can be or include a first plurality of air-to-liquid heat exchangers spaced along the first wall. In at least one embodiment, the second heat exchanger can be or include a second plurality of air-to-liquid heat exchangers spaced along the second wall. In at least one embodiment, the fan can be or include a plurality of fans disposed above the first plurality of air-to-liquid heat exchangers and the second plurality of air-to-liquid heat exchangers.

[0010] In at least one embodiment, the first row of computer equipment can have a first side opposite the aisle. In at least one embodiment, the second row of computer equipment can have a second side opposite the aisle. In at least one embodiment, the cooling system can route air from the first row of computer equipment, into the aisle through the first plurality of air-to-liquid heat exchangers, upwardly out of the aisle, and to the first side of the first row of computer equipment and / or route air from the second row of computer equipment, into the aisle through the second plurality of air-to-liquid heat exchangers, upwardly out of the aisle, and to the second side of the second row of computer equipment. In at least one embodiment, the cooling system can route air from the first side of the first row of computer equipment, downwardly into the aisle, out of the aisle through the first plurality of air-to-liquid heat exchangers, and to the first row of computer equipment and / or route air from the second side of the second row of computer equipment, downwardly into the aisle, out of the aisle through the second plurality of air-to-liquid heat exchangers, and to the second row of computer equipment.

[0011] In at least one embodiment, the cooling system can include one or more end walls coupled to the first wall and the second wall. In at least one embodiment, the cooling system can be a modular unit for cooling adjacent rows of computer equipment in a data center. In at least one embodiment, the coolingsystem can be a modular unit for replacing a row of computer equipment between adjacent rows of computer equipment in a data center.

[0012] In at least one embodiment, the cooling system can include a first baffle coupled to the first wall to route airflow between the first wall and the first row of computer equipment and / or a second baffle coupled to the second wall to direct airflow between the second wall and the second row of computer equipment. In at least one embodiment, the first wall can bound one side of a first hot aisle of a data center and / or the second wall can bound one side of a second hot aisle of the data center. In at least one embodiment, the first wall can bound one side of a first cold aisle of a data center and / or the second wall can bound one side of a second cold aisle of the data center. In at least one embodiment, the cooling system can include a first set of plumbing to circulate a first cooling media to and from the first heat exchanger and / or a second set of plumbing to circulate a second cooling media to and from one or more other heat exchangers. In at least one embodiment, the second set of plumbing can be routed above and / or below the first set of plumbing and / or the first heat exchanger. In at least one embodiment, such as where the second set of plumbing is routed below the first set of plumbing and / or the first heat exchanger, a false floor can be disposed above the second set of plumbing in the hot aisle and / or can provide unobstructed passage and access to the enclosure and / or the cooling system.

[0013] In at least one embodiment, a data center can include a first row of computer equipment, a second row of computer equipment adjacent to the first row of computer equipment, a cooling system disposed at least partially between the first row of computer equipment and the second row of computer equipment, or any combination thereof. In at least one embodiment, the cooling system can include a first wall disposed in fluid communication with the first row of computer equipment, a second wall disposed in fluid communication with the second row ofcomputer equipment, a first heat exchanger coupled to the first wall, a second heat exchanger coupled to the second wall, a fan disposed in fluid communication with an aisle, or any combination thereof. In at least one embodiment, the first wall and the second wall can bound opposite sides of the aisle. In at least one embodiment, the cooling system can circulate air through the first heat exchanger, the second heat exchanger, the aisle, the first row of computer equipment, the second row of computer equipment, or any combination thereof. In at least one embodiment, the first heat exchanger and / or the second heat exchanger can be air-to-liquid heat exchangers and / or can be thermally coupled to another heat exchanger for cooling a liquid circulated there through.

[0014] In at least one embodiment, the cooling system can route air from the first row of computer equipment, into the aisle through the first heat exchanger, upwardly out of the aisle, and to a side of the first row of computer equipment opposite the first wall and / or route air from the second row of computer equipment, into the aisle through the second heat exchanger, upwardly out of the aisle, and to a side of the second row of computer equipment opposite the second wall. In at least one embodiment, the cooling system can route air from a side of the first row of computer equipment opposite the first wall, downwardly into the aisle, out of the aisle through the first heat exchanger, and to the first row of computer equipment and / or route air from a side of the second row of computer equipment opposite the second wall, downwardly into the aisle, out of the aisle through the second heat exchanger, and to the second row of computer equipment.

[0015] In at least one embodiment, a cooling system according to the disclosure can be installed between a first row of computer equipment and a second row of computer equipment, such as in a data center. In at least one embodiment, a cooling system according to the disclosure can include a first wall facing the firstrow of computer equipment, a second wall facing the second row of computer equipment, a row of fans between the first wall and the second wall, or any combination thereof. In at least one embodiment, the fans can be horizontally oriented and / or they induce vertical airflow. In at least one embodiment, a cooling system according to the disclosure can include a first baffle coupled between the first wall and the first row of computer equipment to direct air flowing through the first wall to also flow through the first row of computer equipment and / or a second baffle coupled between the second wall and the second row of computer equipment to direct air flowing through the second wall to also flow through the second row of computer equipment.

[0016] In at least one embodiment, the first wall can include a first plurality of heat exchangers spaced there along and / or the second wall can include a second plurality of heat exchangers spaced there along. In at least one embodiment, the fans can induce airflow through the first plurality of heat exchangers and / or the second plurality of heat exchangers. In at least one embodiment, the first baffle coupled between the first wall and the first row of computer equipment can direct air flowing through the first plurality of heat exchangers to also flow through the first row of computer equipment. In at least one embodiment, the second baffle coupled between the second wall and the second row of computer equipment can direct air flowing through the second plurality of heat exchangers to also flow through the second row of computer equipment.

[0017] In at least one embodiment, the cooling system can be installed in a hot aisle of the data center between the first row of computer equipment and the second row of computer equipment. In at least one embodiment, the fans can draw hot air from the first row of computer equipment through the first plurality of heat exchangers and / or from the second row of computer equipment through the second plurality of heat exchangers. In at least one embodiment, the fans canexpel cool air above the cooling system, the first row of computer equipment, and the second row of computer equipment.

[0018] In at least one embodiment, the cooling system can be installed in a cold aisle of the data center between the first row of computer equipment and the second row of computer equipment. In at least one embodiment, the fans can draw hot air downwardly from the first row of computer equipment and / or the second row of computer equipment. In at least one embodiment, the fans can expel cool air from the first plurality of heat exchangers towards the first row of computer equipment and / or from the second plurality of heat exchangers towards the second row of computer equipment.

[0019] In at least one embodiment, a system according to the disclosure can include a first row of computer equipment installed in a data center, a second row of computer equipment installed in the data center and spaced apart from the first row of computer equipment, a cooling system installed in the data center between the first row of computer equipment and the second row of computer equipment, or any combination thereof. In at least one embodiment, the cooling system can include a first wall facing the first row of computer equipment, a second wall facing the second row of computer equipment, a row of fans therebetween, or any combination thereof. In at least one embodiment, the fans can be horizontally oriented and / or induce vertical airflow.

[0020] In at least one embodiment, a system according to the disclosure can include a first baffle coupled between the first wall and the first row of computer equipment to direct air flowing through the first wall to also flow through the first row of computer equipment and / or a second baffle coupled between the second wall and the second row of computer equipment to direct air flowing through the second wall to also flow through the second row of computer equipment.

[0021] In at least one embodiment, the first row of computer equipment can be or include a first plurality of columns of computer equipment housed within a first enclosure. In at least one embodiment, the first baffle can be coupled between the first wall and the first enclosure. In at least one embodiment, the second row of computer equipment can be or include a second plurality of columns of computer equipment housed within a second enclosure. In at least one embodiment, the second baffle be coupled between the second wall and the second enclosure.

[0022] In at least one embodiment, the first row of computer equipment can be or include a first column of computer equipment housed within a first enclosure and a second column of computer equipment housed within a second enclosure. In at least one embodiment, the first baffle can be coupled between the first wall and the first and second enclosures. In at least one embodiment, the second row of computer equipment can be or include a third column of computer equipment housed within a third enclosure and a fourth column of computer equipment housed within a fourth enclosure. In at least one embodiment, the second baffle can be coupled between the second wall and the third and fourth enclosures.

[0023] In at least one embodiment, the first wall can include a first plurality of heat exchangers spaced there along and / or the second wall can include a second plurality of heat exchangers spaced there along. In at least one embodiment, the fans can induce airflow through the first plurality of heat exchangers and / or the second plurality of heat exchangers. In at least one embodiment, the first baffle coupled between the first wall and the first row of computer equipment can direct air flowing through the first plurality of heat exchangers to also flow through the first row of computer equipment and / or the second baffle coupled between the second wall and the second row of computer equipment can direct air flowingthrough the second plurality of heat exchangers to also flow through the second row of computer equipment.

[0024] In at least one embodiment, the cooling system can be installed in a hot aisle of the data center between the first row of computer equipment and the second row of computer equipment. In at least one embodiment, the fans can draw hot air from the first row of computer equipment through the first plurality of heat exchangers and / or from the second row of computer equipment through the second plurality of heat exchangers. In at least one embodiment, the fans can expel cool air above the cooling system, the first row of computer equipment, and the second row of computer equipment.

[0025] In at least one embodiment, the cooling system can be installed in a cold aisle of the data center between the first row of computer equipment and / or the second row of computer equipment. In at least one embodiment, the fans can draw hot air downwardly from the first row of computer equipment and the second row of computer equipment. In at least one embodiment, the fans can expel cool air from the first plurality of heat exchangers towards the first row of computer equipment and / or from the second plurality of heat exchangers towards the second row of computer equipment.

[0026] In at least one embodiment, a system according to the disclosure can include pipework and / or other plumbing for cooperating with other cooling equipment or applications. For example, in at least one embodiment, a direct-to- chip cooling application can be installed and the plumbing can support operation thereof.

[0027] In at least one embodiment, a method according to the disclosure can include cooling a first row of computer equipment and a second row of computer equipment, such as in a data center. In at least one embodiment, a method according to the disclosure can include installing a cooling system between the firstrow of computer equipment and the second row of computer equipment with a first wall of the cooling system facing the first row of computer equipment and a second wall of the cooling system facing the second row of computer equipment, installing a first baffle between the first wall and the first row of computer equipment, installing a second baffle between the second wall and the second row of computer equipment, inducing vertical airflow along the cooling system and airflow through the first row of computer equipment and the second row of computer equipment, or any combination thereof. In at least one embodiment, installing the cooling system can include removing or relocating another row of computer equipment between the first row of computer equipment and the second row of computer equipment.

[0028] In at least one embodiment, a method according to the disclosure can include disposing a plurality of fans between the first wall and the second wall, such that the fans induce the vertical airflow between the first wall and the second wall. In at least one embodiment, inducing airflow through the first row of computer equipment can include inducing horizontal airflow between the first row of computer equipment and the first wall. In at least one embodiment, inducing airflow through the second row of computer equipment can include inducing horizontal airflow between the second row of computer equipment and the second wall.

[0029] In at least one embodiment, inducing airflow through the first row of computer equipment can include inducing airflow through the first row of computer equipment and a first plurality of heat exchangers coupled to the first wall. In at least one embodiment, inducing airflow through the second row of computer equipment can include inducing airflow through the second row of computer equipment and a second plurality of heat exchangers coupled to the second wall. In at least one embodiment, a method according to the disclosurecan include flowing chilled water through the first plurality of heat exchangers and / or the second plurality of heat exchangers.BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG. 1 is a top view of one of many embodiments of a cooling system according to the disclosure.

[0031] FIG. 2 is a top view of another of many embodiments of a cooling system according to the disclosure.

[0032] FIG. 3 is a side view of one of many embodiments of a cooling system according to the disclosure.

[0033] FIG. 4 is a side view of another of many embodiments of a cooling system according to the disclosure.

[0034] FIG. 5 is a side view of yet another of many embodiments of a cooling system according to the disclosure.

[0035] FIG. 6 is a side view of still another of many embodiments of a cooling system according to the disclosure.

[0036] FIG. 7 is a side view of yet another of many embodiments of a cooling system according to the disclosure.DETAILED DESCRIPTION

[0037] The figures described above and the written description of specific structures and functions below are not presented to limit the scope of what Applicant has invented or the scope of the appended claims. Rather, the figures and written description are provided to teach any person skilled in the art to make and use the inventions for which patent protection is sought. Those skilled in the art will appreciate that not all features of a commercial embodiment of the inventions are described or shown for the sake of clarity and understanding. Persons of skill in this art will also appreciate that the development of an actualcommercial embodiment incorporating aspects of the present inventions will require numerous implementation-specific decisions to achieve the developer's ultimate goal for the commercial embodiment. Such implementation-specific decisions may include, and likely are not limited to, compliance with system- related, business-related, government-related and other constraints, which may vary by specific implementation, location and from time to time. While a developer's efforts might be complex and time-consuming in an absolute sense, such efforts would be, nevertheless, a routine undertaking for those of skill in this art having benefit of this disclosure. It must be understood that the inventions disclosed and taught herein are susceptible to numerous and various modifications and alternative forms.

[0038] The use of a singular term, such as, but not limited to, "a," is not intended as limiting of the number of items. Also, the use of relational terms, such as, but not limited to, "top," "bottom," "left," "right," "upper," "lower," "down," "up," "side," and the like are used in the written description for clarity in specific reference to the figures and are not intended to limit the scope of the inventions or the appended claims. The terms "including" and "such as" are illustrative and not limitative. The terms "couple," "coupled," "coupling," "coupler," and like terms are used broadly herein and can include any method or device for securing, binding, bonding, fastening, attaching, joining, inserting therein, forming thereon or therein, communicating, or otherwise associating, for example, mechanically, magnetically, electrically, chemically, operably, directly or indirectly with intermediate elements, one or more pieces of members together and can further include without limitation integrally forming one functional member with another in a unity fashion. The coupling can occur in any direction, including rotationally. Further, all parts and components of the disclosure that are capable of being physically embodied inherently include imaginary and real characteristicsregardless of whether such characteristics are expressly described herein, including but not limited to characteristics such as axes, ends, inner and outer surfaces, interior spaces, tops, bottoms, sides, boundaries, dimensions (e.g., height, length, width, thickness), mass, weight, volume and density, among others.

[0039] Any process flowcharts discussed herein illustrate the operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in a flowchart may represent a module, segment, or portion of code, which can comprise one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some implementations, the function(s) noted in the block(s) might occur out of the order depicted in the figures. For example, blocks shown in succession may, in fact, be executed substantially concurrently. It will also be noted that each block of flowchart illustration can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

[0040] Applicant has created new and useful devices, systems and methods for cooling high power density data centers. Embodiments of the disclosure can allow aisle width to be reduced in low power density data centers and / or can help minimize the size otherwise required for proper equipment manipulation and maintenance. In addition, air velocities can be kept at reasonable and acceptable values, airflow can be evenly distributed among racks, and pressure drops due to increased airflow demands can be minimized or eliminated. Embodiments of the disclosure can result in improved efficiency, in terms of space utilization, reduced installation and operating expenses, and otherwise.

[0041] FIG. 1 is a top view of one of many embodiments of a cooling system according to the disclosure. FIG. 2 is a top view of another of many embodimentsof a cooling system according to the disclosure. FIG. 3 is a side view of one of many embodiments of a cooling system according to the disclosure. FIG. 4 is a side view of another of many embodiments of a cooling system according to the disclosure. FIG. 5 is a side view of yet another of many embodiments of a cooling system according to the disclosure. FIG. 6 is a side view of still another of many embodiments of a cooling system according to the disclosure. FIG. 7 is a side view of yet another of many embodiments of a cooling system according to the disclosure. FIGS. 1-7 are described in conjunction with one another.

[0042] In at least one embodiment, a cooling system 200 according to the disclosure can cool one or more rows of computer equipment 110 and can include a first wall 210 disposed in fluid communication with one or more rows of computer equipment 110, a second wall 220 spaced from the first wall 210, one or more heat exchangers 212 coupled to the first wall 210, one or more fans 230 disposed in fluid communication with one or more aisles 130, or any combination thereof. In at least one embodiment, a cooling system 200 for cooling a first row of computer equipment 110 according to the disclosure can include a first wall 210 disposed in fluid communication with the first row of computer equipment 110, a second wall 220 spaced from the first wall 210, a first heat exchanger 212 coupled to the first wall 210, a fan 230 disposed in fluid communication with an aisle 130, or any combination thereof. In at least one embodiment, the first wall 210 and the second wall 220 can be opposite sides of the aisle 130, such as beneath a ceiling 260. In at least one embodiment, the cooling system 200 can circulate air through the first heat exchanger 212, the aisle 130 and the first row of computer equipment 110. In at least one embodiment, the cooling system 200 can route airflow from the aisle 130, through the first heat exchanger 212, and to the computer equipment 110. In at least one embodiment, the cooling system 200 can routeairflow from the computer equipment 110, through the first heat exchanger 212, and to the aisle 130.

[0043] In at least one embodiment, the fan 230 can be in the aisle 130. In at least one embodiment, the fan 230 can be above the computer equipment 110, which can include, for example, being disposed in the aisle 130 at an elevation higher than that of the computer equipment 110. In at least one embodiment, the fan 230 can induce airflow horizontally through the first row of computer equipment 110 and / or vertically through the aisle 130.

[0044] In at least one embodiment, the cooling system 200 can include a plenum 214 disposed above the first row of computer equipment 110 and in fluid communication with the aisle 130. In at least one embodiment, the plenum 214 can route airflow between the aisle 130 and a side of the first row of computer equipment 110 opposite the aisle 130.

[0045] In at least one embodiment, the cooling system 200 can include a second heat exchanger 222 coupled to the second wall 220. In at least one embodiment, the second wall 220 can be in fluid communication with a second row of computer equipment 120. In at least one embodiment, the cooling system 200 can circulate air through the second heat exchanger 222, the aisle 130, and the second row of computer equipment 120.

[0046] In at least one embodiment, the first heat exchanger 212 can be or include a first plurality of air-to-liquid heat exchangers spaced along the first wall 210. In at least one embodiment, the second heat exchanger 222 can be or include a second plurality of air-to-liquid heat exchangers spaced along the second wall 220. In at least one embodiment, the fan 230 can be or include a plurality of fans disposed above the first plurality of air-to-liquid heat exchangers 212 and the second plurality of air-to-liquid heat exchangers 222.

[0047] In at least one embodiment, the first row of computer equipment 110 can have a first side opposite the aisle 130. In at least one embodiment, the second row of computer equipment 120 can have a second side opposite the aisle 130. In at least one embodiment, the cooling system 200 can route air from the first row of computer equipment 110, into the aisle 130 through the first plurality of air-to- liquid heat exchangers 212, upwardly out of the aisle 130, and to the first side of the first row of computer equipment 110 and / or route air from the second row of computer equipment 120, into the aisle 130 through the second plurality of air-to- liquid heat exchangers 222, upwardly out of the aisle 130, and to the second side of the second row of computer equipment 120. In at least one embodiment, the cooling system 200 can route air from the first side of the first row of computer equipment 110, downwardly into the aisle 130, out of the aisle 130 through the first plurality of air-to-liquid heat exchangers 212, and to the first row of computer equipment 110 and / or route air from the second side of the second row of computer equipment 120, downwardly into the aisle 130, out of the aisle 130 through the second plurality of air-to-liquid heat exchangers 222, and to the second row of computer equipment 120.

[0048] In at least one embodiment, the cooling system 200 can include one or more end walls 240 coupled to the first wall 210 and the second wall 220. In at least one embodiment, the cooling system 200 can be a modular unit for cooling adjacent rows 110, 210 of computer equipment in a data center 100. In at least one embodiment, the cooling system 200 can be a modular unit, such as for replacing a row of computer equipment between adjacent rows 110, 210 of computer equipment in a data center 100.

[0049] In at least one embodiment, the cooling system 200 can include a first baffle216 coupled to the first wall 210 to route airflow between the first wall 210 and the first row of computer equipment 110 and / or a second baffle 226 coupled tothe second wall 220 to direct airflow between the second wall 220 and the second row of computer equipment 120. In at least one embodiment, the first wall 210 can bound one side of a first hot aisle 130 of a data center 100 and / or the second wall 220 can bound one side of a second hot aisle 130 of the data center 100. In at least one embodiment, the first wall 210 can bound one side of a first cold aisle 130 of a data center 100 and / or the second wall 220 can bound one side of a second cold aisle 130 of the data center 100. In at least one embodiment, the cooling system 200 can include a first set of plumbing 218 for circulating a first cooling media to and from the first heat exchanger 212 and / or a second set of plumbing 250 for circulating a second cooling media to and from one or more other heat exchangers disposed in the first row of computer equipment 110, such as a plurality of cold plates or coolant distribution units. In at least one embodiment, the second set of plumbing 250 can be routed above and / or below the first set of plumbing 218 and / or the first heat exchanger 212. In at least one embodiment, such as where the second set of plumbing 250 is routed below the first set of plumbing 218 and / or the first heat exchanger 212, a false floor 252 can be disposed above the second set of plumbing 218 in the hot aisle and / or can provide unobstructed passage and access to the enclosure 114 and / or the cooling system 200. In at least one embodiment, the false floor 252 can be a solid floor, a perforated floor, or any combination thereof.

[0050] In at least one embodiment, a data center 100 according to the disclosure can include a plurality rows 110, 120 of computer equipment and one or more cooling systems 200 disposed at least partially between the rows 110, 210 of computer equipment. In at least one embodiment, a data center 100 can include a first row of computer equipment 110, a second row of computer equipment 120 adjacent to the first row of computer equipment, a cooling system 200 disposed at least partially between the first row of computer equipment 110 and the secondrow of computer equipment 120, or any combination thereof. In at least one embodiment, the cooling system 200 can include a first wall 210 disposed in fluid communication with the first row of computer equipment 110, a second wall 220 disposed in fluid communication with the second row of computer equipment 120, a first heat exchanger 212 coupled to the first wall 210, a second heat exchanger 222 coupled to the second wall 220, a fan 230 disposed in fluid communication with an aisle 130, or any combination thereof. In at least one embodiment, the first wall and the second wall can bound opposite sides of the aisle 130. In at least one embodiment, the cooling system 200 can circulate air through the first heat exchanger 212, the second heat exchanger 222, the aisle 130, the first row of computer equipment 110, the second row of computer equipment 120, or any combination thereof. In at least one embodiment, the first heat exchanger 212 and / or the second heat exchanger 222 can be air-to-liquid heat exchangers and / or be thermally coupled to another heat exchanger for cooling a liquid circulated through the first heat exchanger and the second heat exchanger, such as a chilled water plant, chiller, free cooling chiller, dry cooler, cooling tower, or the like.

[0051] In at least one embodiment, the cooling system 200 can route air from the first row of computer equipment 110, into the aisle 130 through the first heat exchanger 212, upwardly out of the aisle 130, and to a side of the first row of computer equipment 110 opposite the first wall 210 and / or route air from the second row of computer equipment 120, into the aisle 130 through the second heat exchanger 222, upwardly out of the aisle 130, and to a side of the second row of computer equipment 120 opposite the second wall 220. In at least one embodiment, the cooling system 200 can route air from a side of the first row of computer equipment 110 opposite the first wall 210, downwardly into the aisle 130, out of the aisle 130 through the first heat exchanger 212, and to the first row of computer equipment 110 and / or route air from a side of the second row ofcomputer equipment 120 opposite the second wall 220, downwardly into the aisle 130, out of the aisle 130 through the second heat exchanger 222, and to the second row of computer equipment 120.

[0052] In at least one embodiment, a cooling system 200 according to the disclosure can be installed between two rows of computer equipment, such as a first row 110 of computer equipment and a second row 120 of computer equipment, or other rows of computer equipment, such as in a data center 100. In at least one embodiment, a cooling system 200 according to the disclosure can include a first wall 210 facing the first row of computer equipment 110, a second wall 220 facing the second row of computer equipment 120, a row of fans 230 between the first wall 210 and the second wall 220, or any combination thereof. In at least one embodiment, the fans 230 can be horizontally oriented and / or can otherwise be disposed for inducing vertical airflow through at least a portion of the system. In at least one embodiment, a cooling system 200 according to the disclosure can include a first baffle 216 coupled between the first wall 210 and the first row of computer equipment llO to direct airflowing through the first wall 210 to also flow through the first row of computer equipment 110 and / or a second baffle 226 coupled between the second wall 220 and the second row of computer equipment 120 to direct air flowing through the second wall 220 to also flow through the second row of computer equipment 120.

[0053] In at least one embodiment, the first wall 210 can include a first plurality of heat exchangers 212 spaced there along and / or the second wall 220 can include a second plurality of heat exchangers 222 spaced there along. In at least one embodiment, the fans 130 can induce airflow through the first plurality of heat exchangers 212 and / or the second plurality of heat exchangers 222. In at least one embodiment, the first baffle 216 coupled between the first wall 210 and the first row of computer equipment 110 can direct air flowing through the first plurality ofheat exchangers 212 to also flow through the first row of computer equipment 110. In at least one embodiment, the second baffle 226 coupled between the second wall 220 and the second row of computer equipment 120 can direct air flowing through the second plurality of heat exchangers 222 to also flow through the second row of computer equipment 120.

[0054] In at least one embodiment, the cooling system 200 can be installed in a hot aisle 130 of the data center 100 between the first row of computer equipment 110 and the second row of computer equipment 120. In at least one embodiment, the fans 130 can draw hot air from the first row of computer equipment 110 through the first plurality of heat exchangers 212 and / or from the second row of computer equipment 120 through the second plurality of heat exchangers 222. In at least one embodiment, the fans 130 can expel cool air above the cooling system 200, the first row of computer equipment 110, and the second row of computer equipment 120.

[0055] In at least one embodiment, the cooling system 200 can be installed in a cold aisle 130 of the data center 100 between the first row of computer equipment 110 and the second row of computer equipment 120. In at least one embodiment, the fans 130 can draw hot air downwardly from the first row of computer equipment 110 and / or the second row of computer equipment 120. In at least one embodiment, the fans 130 can expel cool air from the first plurality of heat exchangers 212 towards the first row of computer equipment 110 and / or from the second plurality of heat exchangers 222 towards the second row of computer equipment 120.

[0056] In at least one embodiment, a system according to the disclosure can be or include a data center 100. In at least one embodiment, a system 100 according to the disclosure can include a first row of computer equipment 110 installed in a data center 100, a second row of computer equipment 120 installed in the datacenter 100 and spaced apart from the first row of computer equipment 110, a cooling system 200 installed in the data center 100 between the first row of computer equipment 110 and the second row of computer equipment 120, or any combination thereof. In at least one embodiment, the cooling system 200 can include a first wall 210 facing the first row of computer equipment 110, a second wall 220 facing the second row of computer equipment 120, a row of fans therebetween 230, or any combination thereof. In at least one embodiment, the fans 230 can be horizontally oriented and / or induce vertical airflow.

[0057] In at least one embodiment, a system 100 according to the disclosure can include a first baffle 216 coupled between the first wall 210 and the first row of computer equipment 110 to direct air flowing through the first wall 210 to also flow through the first row of computer equipment 110 and / or a second baffle 226 coupled between the second wall 220 and the second row of computer equipment 120 to direct air flowing through the second wall 220 to also flow through the second row of computer equipment 120.

[0058] In at least one embodiment, the first row of computer equipment 110 can be or include a first plurality of columns 112 of computer equipment housed within a first enclosure 114. In at least one embodiment, the first baffle 216 can be coupled between the first wall 210 and the first enclosure 114. In at least one embodiment, a first cabling rack 116, to couple with the first row of computer equipment 110 can located on a cool air side of the first baffle 216 and / or a hot air side of the first baffle 216. In at least one embodiment, the second row of computer equipment 120 can be or include a second plurality of columns 122 of computer equipment housed within a second enclosure 124. In at least one embodiment, the second baffle 226 be coupled between the second wall 220 and the second enclosure 124. In at least one embodiment, a second cabling rack 126,to couple with the second row of computer equipment 120 can located on a cool air side of the second baffle 226 and / or a hot air side of the second baffle 226.

[0059] In at least one embodiment, the first row of computer equipment 110 can be or include a first column 112 of computer equipment housed within a first enclosure 114 and a second column 112 of computer equipment housed within a second enclosure 114. In at least one embodiment, the first baffle 216 can be coupled between the first wall 210 and the first and second enclosures 124. In at least one embodiment, the second row of computer equipment 120 can be or include a third column 122 of computer equipment housed within a third enclosure 124 and a fourth column 122 of computer equipment housed within a fourth enclosure 124. In at least one embodiment, the second baffle 226 can be coupled between the second wall 220 and the third and fourth enclosures 124.

[0060] In at least one embodiment, the first wall 210 can include a first plurality of heat exchangers 212 spaced there along and / or the second wall 220 can include a second plurality of heat exchangers 222 spaced there along. In at least one embodiment, the fans 230 can induce airflow through the first plurality of heat exchangers 212 and / or the second plurality of heat exchangers 222. In at least one embodiment, the first baffle 216 coupled between the first wall 210 and the first row of computer equipment 110 can direct air flowing through the first plurality of heat exchangers 212 to also flow through the first row of computer equipment 120 and / or the second baffle 226 coupled between the second wall 220 and the second row of computer equipment 120 can direct air flowing through the second plurality of heat exchangers 222 to also flow through the second row of computer equipment 120.

[0061] In at least one embodiment, the cooling system 200 can be installed in a hot aisle 130 of the data center 100 between the first row of computer equipment 110 and the second row of computer equipment 120. In at least one embodiment, thefans 230 can draw hot air from the first row of computer equipment 110 through the first plurality of heat exchangers 212 and / or from the second row of computer equipment 120 through the second plurality of heat exchangers 222. In at least one embodiment, the fans 230 can expel cool air above the cooling system 200, the first row of computer equipment 110, and the second row of computer equipment 120.

[0062] In at least one embodiment, the cooling system 100 can be installed in a cold aisle 130 of the data center 100 between the first row of computer equipment 110 and / or the second row of computer equipment 120. In at least one embodiment, the fans 130 can draw hot air downwardly from the first row of computer equipment 110 and the second row of computer equipment 120. In at least one embodiment, the fans 130 can expel cool air from the first plurality of heat exchangers 212 towards the first row of computer equipment 110 and / or from the second plurality of heat exchangers 222 towards the second row of computer equipment 120.

[0063] In at least one embodiment, a system 100 according to the disclosure can include one or more sets of plumbing 250 (e.g., pipes or other conduits) for cooperating with other cooling equipment or applications. For example, in at least one embodiment, a direct-to-chip cooling application can be installed and the plumbing 250 can support operation thereof.

[0064] In at least one embodiment, a method according to the disclosure can provide cooling to a data center 100 having a first row of computer equipment 110 and a second row of computer equipment 120 installed therein. In at least one embodiment, a method according to the disclosure can include installing a cooling system 200 between the first row of computer equipment 110 and the second row of computer equipment 120 with a first wall 210 of the cooling system 200 facing the first row of computer equipment 110 and a second wall 220 of the coolingsystem 200 facing the second row of computer equipment 120, installing a first baffle 216 between the first wall 210 and the first row of computer equipment 110, installing a second baffle 226 between the second wall 220 and the second row of computer equipment 120, inducing vertical airflow along the cooling system 200 and airflow through the first row of computer equipment 110 and the second row of computer equipment 120, or any combination thereof. In at least one embodiment, installing the cooling system 200 can include removing a third row of computer equipment between the first row of computer equipment 110 and the second row of computer equipment 120.

[0065] In at least one embodiment, a method according to the disclosure can include coupling a plurality of fans 230 between the first wall 210 and the second wall 220, such that the fans 230 induce the vertical airflow between the first wall 210 and the second wall 220. In at least one embodiment, inducing airflow through the first row of computer equipment 110 can include inducing horizontal airflow between the first row of computer equipment 110 and the first wall 210. In at least one embodiment, inducing airflow through the second row of computer equipment 120 can include inducing horizontal airflow between the second row of computer equipment 120 and the second wall 220.

[0066] In at least one embodiment, inducing airflow through the first row of computer equipment 110 can include inducing airflow through the first row of computer equipment 110 and a first plurality of heat exchangers 212 coupled to the first wall 210. In at least one embodiment, inducing airflow through the second row of computer equipment 120 can include inducing airflow through the second row of computer equipment 120 and a second plurality of heat exchangers 222 coupled to the second wall 220. In at least one embodiment, a method according to the disclosure can include flowing chilled water through the first plurality of heat exchangers 212 and / or the second plurality of heat exchangers 222.

[0067] In at least one embodiment, a cooling system for cooling a first row of computer equipment can include a first wall disposed in fluid communication with the first row of computer equipment, a second wall spaced from the first wall, a first heat exchanger coupled to the first wall, a fan disposed in fluid communication with an aisle, or any combination thereof. In at least one embodiment, the first wall and the second wall can bound opposite sides of the aisle. In at least one embodiment, the cooling system can circulate air through the first heat exchanger, the aisle and the first row of computer equipment. In at least one embodiment, the cooling system can route airflow from the aisle, through the first heat exchanger, and to the computer equipment. In at least one embodiment, the cooling system can route airflow from the computer equipment, through the first heat exchanger, and to the aisle.

[0068] In at least one embodiment, the fan can be in the aisle. In at least one embodiment, the fan can be above the computer equipment. In at least one embodiment, the fan can induce airflow horizontally through the first row of computer equipment and / or vertically through the aisle.

[0069] In at least one embodiment, the cooling system can include a plenum disposed above the first row of computer equipment and in fluid communication with the aisle. In at least one embodiment, the plenum can route airflow between the aisle and a side of the first row of computer equipment opposite the aisle.

[0070] In at least one embodiment, the cooling system can include a second heat exchanger coupled to the second wall. In at least one embodiment, the second wall can be disposed in fluid communication with a second row of computer equipment. In at least one embodiment, the cooling system can circulate air through the second heat exchanger, the aisle, and the second row of computer equipment.

[0071] In at least one embodiment, the first heat exchanger can be or include a first plurality of air-to-liquid heat exchangers spaced along the first wall. In at least one embodiment, the second heat exchanger can be or include a second plurality of air-to-liquid heat exchangers spaced along the second wall. In at least one embodiment, the fan can be or include a plurality of fans disposed above the first plurality of air-to-liquid heat exchangers and the second plurality of air-to-liquid heat exchangers.

[0072] In at least one embodiment, the first row of computer equipment can have a first side opposite the aisle. In at least one embodiment, the second row of computer equipment can have a second side opposite the aisle. In at least one embodiment, the cooling system can route air from the first row of computer equipment, into the aisle through the first plurality of air-to-liquid heat exchangers, upwardly out of the aisle, and to the first side of the first row of computer equipment and / or route air from the second row of computer equipment, into the aisle through the second plurality of air-to-liquid heat exchangers, upwardly out of the aisle, and to the second side of the second row of computer equipment. In at least one embodiment, the cooling system can route air from the first side of the first row of computer equipment, downwardly into the aisle, out of the aisle through the first plurality of air-to-liquid heat exchangers, and to the first row of computer equipment and / or route air from the second side of the second row of computer equipment, downwardly into the aisle, out of the aisle through the second plurality of air-to-liquid heat exchangers, and to the second row of computer equipment.

[0073] In at least one embodiment, the cooling system can include one or more end walls coupled to the first wall and the second wall. In at least one embodiment, the cooling system can be a modular unit for cooling adjacent rows of computer equipment in a data center. In at least one embodiment, the coolingsystem can be a modular unit for replacing a row of computer equipment between adjacent rows of computer equipment in a data center.

[0074] In at least one embodiment, the cooling system can include a first baffle coupled to the first wall to route airflow between the first wall and the first row of computer equipment and / or a second baffle coupled to the second wall to direct airflow between the second wall and the second row of computer equipment. In at least one embodiment, the first wall can bound one side of a first hot aisle of a data center and / or the second wall can bound one side of a second hot aisle of the data center. In at least one embodiment, the first wall can bound one side of a first cold aisle of a data center and / or the second wall can bound one side of a second cold aisle of the data center. In at least one embodiment, the cooling system can include a first set of plumbing to circulate a first cooling media to and from the first heat exchanger and / or a second set of plumbing to circulate a second cooling media to and from one or more other heat exchangers disposed in the first row of computer equipment, such as a plurality of cold plates or coolant distribution units. In at least one embodiment, the second set of plumbing can be routed above and / or below the first set of plumbing and / or the first heat exchanger. In at least one embodiment, such as where the second set of plumbing is routed below the first set of plumbing and / or the first heat exchanger, a false floor can be disposed above the second set of plumbing in the hot aisle and / or can provide unobstructed passage and access to the enclosure and / or the cooling system.

[0075] In at least one embodiment, a data center can include a first row of computer equipment, a second row of computer equipment adjacent to the first row of computer equipment, a cooling system disposed at least partially between the first row of computer equipment and the second row of computer equipment, or any combination thereof. In at least one embodiment, the cooling system caninclude a first wall disposed in fluid communication with the first row of computer equipment a second wall disposed in fluid communication with the second row of computer equipment, a first heat exchanger coupled to the first wall, a second heat exchanger coupled to the second wall, a fan disposed in fluid communication with an aisle, or any combination thereof. In at least one embodiment, the first wall and the second wall can bound opposite sides of the aisle. In at least one embodiment, the cooling system can circulate air through the first heat exchanger, the second heat exchanger, the aisle, the first row of computer equipment, the second row of computer equipment, or any combination thereof. In at least one embodiment, the first heat exchanger and / or the second heat exchanger can be air-to-liquid heat exchangers and / or can be thermally coupled to another heat exchanger for cooling a liquid circulated through the first heat exchanger and the second heat exchanger, such as a chilled water plant, chiller, free cooling chiller, dry cooler, cooling tower, or the like.

[0076] In at least one embodiment, the cooling system can route air from the first row of computer equipment, into the aisle through the first heat exchanger, upwardly out of the aisle, and to a side of the first row of computer equipment opposite the first wall and / or route air from the second row of computer equipment, into the aisle through the second heat exchanger, upwardly out of the aisle, and to a side of the second row of computer equipment opposite the second wall. In at least one embodiment, the cooling system can route air from a side of the first row of computer equipment opposite the first wall, downwardly into the aisle, out of the aisle through the first heat exchanger, and to the first row of computer equipment and / or route air from a side of the second row of computer equipment opposite the second wall, downwardly into the aisle, out of the aisle through the second heat exchanger, and to the second row of computer equipment.

[0077] In at least one embodiment, a cooling system according to the disclosure can be installed between a first row of computer equipment and a second row of computer equipment, such as in a data center. In at least one embodiment, a cooling system according to the disclosure can include a first wall facing the first row of computer equipment, a second wall facing the second row of computer equipment, a row of fans between the first wall and the second wall, or any combination thereof. In at least one embodiment, the fans can be horizontally oriented and / or they induce vertical airflow. In at least one embodiment, a cooling system according to the disclosure can include a first baffle coupled between the first wall and the first row of computer equipment to direct air flowing th rough the first wall to also flow through the first row of computer equipment and / or a second baffle coupled between the second wall and the second row of computer equipment to direct air flowing through the second wall to also flow through the second row of computer equipment.

[0078] In at least one embodiment, the first wall can include a first plurality of heat exchangers spaced there along and / or the second wall can include a second plurality of heat exchangers spaced there along. In at least one embodiment, the fans can induce airflow through the first plurality of heat exchangers and / or the second plurality of heat exchangers. In at least one embodiment, the first baffle coupled between the first wall and the first row of computer equipment can direct air flowing through the first plurality of heat exchangers to also flow through the first row of computer equipment. In at least one embodiment, the second baffle coupled between the second wall and the second row of computer equipment can direct air flowing through the second plurality of heat exchangers to also flow through the second row of computer equipment.

[0079] In at least one embodiment, the cooling system can be installed in a hot aisle of the data center between the first row of computer equipment and thesecond row of computer equipment. In at least one embodiment, the fans can draw hot air from the first row of computer equipment through the first plurality of heat exchangers and / or from the second row of computer equipment through the second plurality of heat exchangers. In at least one embodiment, the fans can expel cool air above the cooling system, the first row of computer equipment, and the second row of computer equipment.

[0080] In at least one embodiment, the cooling system can be installed in a cold aisle of the data center between the first row of computer equipment and the second row of computer equipment. In at least one embodiment, the fans can draw hot air downwardly from the first row of computer equipment and / or the second row of computer equipment. In at least one embodiment, the fans can expel cool air from the first plurality of heat exchangers towards the first row of computer equipment and / or from the second plurality of heat exchangers towards the second row of computer equipment.

[0081] In at least one embodiment, a system according to the disclosure can include a first row of computer equipment installed in a data center, a second row of computer equipment installed in the data center and spaced apart from the first row of computer equipment, a cooling system installed in the data center between the first row of computer equipment and the second row of computer equipment, or any combination thereof. In at least one embodiment, the cooling system can include a first wall facing the first row of computer equipment, a second wall facing the second row of computer equipment, a row of fans therebetween, or any combination thereof. In at least one embodiment, the fans can be horizontally oriented and / or induce vertical airflow.

[0082] In at least one embodiment, a system according to the disclosure can include a first baffle coupled between the first wall and the first row of computer equipment to direct air flowing through the first wall to also flow through the firstrow of computer equipment and / or a second baffle coupled between the second wall and the second row of computer equipment to direct air flowing through the second wall to also flow through the second row of computer equipment.

[0083] In at least one embodiment, the first row of computer equipment can be or include a first plurality of columns of computer equipment housed within a first enclosure. In at least one embodiment, the first baffle can be coupled between the first wall and the first enclosure. In at least one embodiment, the second row of computer equipment can be or include a second plurality of columns of computer equipment housed within a second enclosure. In at least one embodiment, the second baffle be coupled between the second wall and the second enclosure.

[0084] In at least one embodiment, the first row of computer equipment can be or include a first column of computer equipment housed within a first enclosure and a second column of computer equipment housed within a second enclosure. In at least one embodiment, the first baffle can be coupled between the first wall and the first and second enclosures. In at least one embodiment, the second row of computer equipment can be or include a third column of computer equipment housed within a third enclosure and a fourth column of computer equipment housed within a fourth enclosure. In at least one embodiment, the second baffle can be coupled between the second wall and the third and fourth enclosures.

[0085] In at least one embodiment, the first wall can include a first plurality of heat exchangers spaced there along and / or the second wall can include a second plurality of heat exchangers spaced there along. In at least one embodiment, the fans can induce airflow through the first plurality of heat exchangers and / or the second plurality of heat exchangers. In at least one embodiment, the first baffle coupled between the first wall and the first row of computer equipment can direct air flowing through the first plurality of heat exchangers to also flow through thefirst row of computer equipment and / or the second baffle coupled between the second wall and the second row of computer equipment can direct air flowing through the second plurality of heat exchangers to also flow through the second row of computer equipment.

[0086] In at least one embodiment, the cooling system can be installed in a hot aisle of the data center between the first row of computer equipment and the second row of computer equipment. In at least one embodiment, the fans can draw hot air from the first row of computer equipment through the first plurality of heat exchangers and / or from the second row of computer equipment through the second plurality of heat exchangers. In at least one embodiment, the fans can expel cool air above the cooling system, the first row of computer equipment, and the second row of computer equipment.

[0087] In at least one embodiment, the cooling system can be installed in a cold aisle of the data center between the first row of computer equipment and / or the second row of computer equipment. In at least one embodiment, the fans can draw hot air downwardly from the first row of computer equipment and the second row of computer equipment. In at least one embodiment, the fans can expel cool air from the first plurality of heat exchangers towards the first row of computer equipment and / or from the second plurality of heat exchangers towards the second row of computer equipment.

[0088] In at least one embodiment, a system according to the disclosure can include pipework and / or other plumbing for cooperating with other cooling equipment or applications. For example, in at least one embodiment, a direct-to- chip cooling application can be installed and the plumbing can support operation thereof.

[0089] In at least one embodiment, a method according to the disclosure can provide cooling to a data center having a first row of computer equipment and asecond row of computer equipment installed therein. In at least one embodiment, a method according to the disclosure can include installing a cooling system between the first row of computer equipment and the second row of computer equipment with a first wall of the cooling system facing the first row of computer equipment and a second wall of the cooling system facing the second row of computer equipment, installing a first baffle between the first wall and the first row of computer equipment, installing a second baffle between the second wall and the second row of computer equipment, inducing vertical airflow along the cooling system and airflow through the first row of computer equipment and the second row of computer equipment, or any combination thereof. In at least one embodiment, installing the cooling system can include removing a third row of computer equipment between the first row of computer equipment and the second row of computer equipment.

[0090] In at least one embodiment, a method according to the disclosure can include coupling a plurality of fans between the first wall and the second wall, such that the fans induce the vertical airflow between the first wall and the second wall. In at least one embodiment, inducing airflow through the first row of computer equipment can include inducing horizontal airflow between the first row of computer equipment and the first wall. In at least one embodiment, inducing airflow through the second row of computer equipment can include inducing horizontal airflow between the second row of computer equipment and the second wall.

[0091] In at least one embodiment, inducing airflow through the first row of computer equipment can include inducing airflow through the first row of computer equipment and a first plurality of heat exchangers coupled to the first wall. In at least one embodiment, inducing airflow through the second row of computer equipment can include inducing airflow through the second row ofcomputer equipment and a second plurality of heat exchangers coupled to the second wall. In at least one embodiment, a method according to the disclosure can include flowing chilled water through the first plurality of heat exchangers and / or the second plurality of heat exchangers.

[0092] Other and further embodiments utilizing one or more aspects of the disclosure can be devised without departing from the spirit of Applicants disclosure. For example, the devices, systems and methods can be implemented for numerous different types and sizes in numerous different industries. Further, the various methods and embodiments of the devices, systems and methods can be included in combination with each other to produce variations of the disclosed methods and embodiments. Discussion of singular elements can include plural elements and vice versa. The order of steps can occur in a variety of sequences unless otherwise specifically limited. The various steps described herein can be combined with other steps, interlineated with the stated steps, and / or split into multiple steps. Similarly, elements have been described functionally and can be embodied as separate components or can be combined into components having multiple functions.

[0093] The inventions have been described in the context of preferred and other embodiments and not every embodiment of the inventions has been described. Obvious modifications and alterations to the described embodiments are available to those of ordinary skill in the art having the benefits of the present disclosure. The disclosed and undisclosed embodiments are not intended to limit or restrict the scope or applicability of the inventions conceived of by the Applicant, but rather, in conformity with the patent laws, Applicant intends to fully protect all such modifications and improvements that come within the scope or range of equivalents of the following claims.

Claims

What is claimed is:

1. A cooling system configured to cool a first row of computer equipment, the cooling system comprising: a first wall configured to be disposed in fluid communication with the first row of computer equipment; a second wall spaced from the first wall, wherein the first wall and the second wall bound opposite sides of an aisle; a first heat exchanger coupled to the first wall; and a fan disposed in fluid communication with the aisle; wherein the cooling system is configured to circulate air through the first heat exchanger, the aisle and the first row of computer equipment.

2. The cooling system of claim 1, wherein the fan is disposed in the aisle.

3. The cooling system of claim 2, wherein the fan is disposed above the first row of computer equipment and is configured to induce airflow horizontally through the first row of computer equipment and vertically through the aisle.

4. The cooling system of claim 3, wherein the cooling system is configured to route airflow from the aisle, through the first heat exchanger, and to the first row of computer equipment.

5. The cooling system of claim 3, wherein the cooling system is configured to route airflow from the first row of computer equipment, through the first heat exchanger, and to the aisle.

6. The cooling system of claim 1, further comprising a plenum disposed above the first row of computer equipment and in fluid communication with the aisle, wherein the plenum is configured to route airflow between the aisle and a side of the first row of computer equipment opposite the aisle.

7. The cooling system of claim 1, further comprising: a second heat exchanger coupled to the second wall; wherein the second wall is configured to be disposed in fluid communication with a second row of computer equipment; and wherein the cooling system is configured to circulate air through the second heat exchanger, the aisle and the second row of computer equipment.

8. The cooling system of claim 7, wherein the first heat exchanger comprises a first plurality of air-to-liquid heat exchangers spaced along the first wall, wherein the second heat exchanger comprises a second plurality of air-to-liquid heat exchangers spaced along the second wall, and wherein the fan comprises a plurality of fans disposed above the first plurality of air-to-liquid heat exchangers and the second plurality of air-to-liquid heat exchangers.

9. The cooling system of claim 8, wherein the first row of computer equipment has a first side opposite the aisle; wherein the second row of computer equipment has a second side opposite the aisle; and wherein the cooling system is configured to: route air from the first row of computer equipment, into the aisle through the first plurality of air-to-liquid heat exchangers, upwardly out ofthe aisle, and to the first side of the first row of computer equipment; and route air from the second row of computer equipment, into the aisle through the second plurality of air-to-liquid heat exchangers, upwardly out of the aisle, and to the second side of the second row of computer equipment.

10. The cooling system of claim 8, wherein the first row of computer equipment has a first side opposite the aisle; wherein the second row of computer equipment has a second side opposite the aisle; and wherein the cooling system is configured to: route air from the first side of the first row of computer equipment, downwardly into the aisle, out of the aisle through the first plurality of air-to-liquid heat exchangers, and to the first row of computer equipment; and route air from the second side of the second row of computer equipment, downwardly into the aisle, out of the aisle through the second plurality of air-to-liquid heat exchangers, and to the second row of computer equipment.

11. The cooling system of claim 7, further comprising at least one end wall coupled to the first wall and the second wall, and wherein the cooling system is a modular unit configured to cool adjacent rows of computer equipment in a data center.

12. The cooling system of claim 7, further comprising a first baffle coupled to the first wall and configured to route airflow between the first wall and the first row ofcomputer equipment, and a second baffle coupled to the second wall and configured to direct airflow between the second wall and the second row of computer equipment.

13. The cooling system of claim 7, wherein the first wall is configured to bound one side of a first hot aisle of a data center and the second wall is configured to bound one side of a second hot aisle of the data center.

14. The cooling system of claim 7, wherein the first wall is configured to bound one side of a first cold aisle of a data center and the second wall is configured to bound one side of a second cold aisle of the data center.

15. The cooling system of claim 1, further comprising a first set of plumbing configured to circulate a first cooling media to and from the first heat exchanger.

16. The cooling system of claim 15, further comprising a second set of plumbing configured to circulate a second cooling media to and from one or more cold plates.

17. The cooling system of claim 16, wherein the second set of plumbing is routed below the first set of plumbing.

18. The cooling system of claim 17, further comprising a false floor disposed at least partially above the second set of plumbing.

19. The cooling system of claim 16, wherein the first row of computer equipment includes one or more enclosures and wherein the one or more cold plates are disposed in the one or more enclosures.

0. The cooling system of claim 1, further comprising a second heat exchanger coupled to the second wall, wherein the first heat exchanger and the second heat exchanger are air-to-liquid heat exchangers and are thermally coupled to another heat exchanger configured to cool a liquid circulated through the first heat exchanger and the second heat exchanger.

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